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WO2019144564A1 - 一种电磁波屏蔽膜及其制备方法和应用 - Google Patents

一种电磁波屏蔽膜及其制备方法和应用 Download PDF

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Publication number
WO2019144564A1
WO2019144564A1 PCT/CN2018/092150 CN2018092150W WO2019144564A1 WO 2019144564 A1 WO2019144564 A1 WO 2019144564A1 CN 2018092150 W CN2018092150 W CN 2018092150W WO 2019144564 A1 WO2019144564 A1 WO 2019144564A1
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WO
WIPO (PCT)
Prior art keywords
layer
insulating layer
electromagnetic
electromagnetic wave
shielding film
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Application number
PCT/CN2018/092150
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English (en)
French (fr)
Inventor
崔清臣
李国法
宋雯娟
Original Assignee
河南国安电子材料有限公司
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Application filed by 河南国安电子材料有限公司 filed Critical 河南国安电子材料有限公司
Priority to US16/490,764 priority Critical patent/US20200084923A1/en
Priority to KR1020197007088A priority patent/KR20190104132A/ko
Priority to JP2019518046A priority patent/JP2020510985A/ja
Publication of WO2019144564A1 publication Critical patent/WO2019144564A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB

Definitions

  • the invention belongs to the technical field of insulation, and particularly relates to an electromagnetic wave shielding film and a preparation method and application thereof.
  • the core of the shielding film for the circuit board is an electromagnetic shielding layer.
  • an electromagnetic shielding layer Around the electromagnetic shielding layer, many electromagnetic shielding films of various hierarchical forms appear.
  • CN103763893A discloses an electromagnetic wave shielding film and a printed circuit board comprising the shielding film, which comprises the steps of: thermally curing the electromagnetic shielding film and the circuit board in the thickness direction, and piercing the bonding layer by using the rough surface of the electromagnetic shielding layer to achieve grounding. Or electromagnetically curing the electromagnetic shielding film and the circuit board in the thickness direction, using a conductive material to pierce the shielding film to achieve grounding, or thermally curing the electromagnetic shielding film and the circuit board in the thickness direction, forming a through hole or a blind hole in the circuit board.
  • the hole is metallized to achieve grounding.
  • the shielding film adhesive layer of the invention does not contain conductive particles, which reduces the cost, reduces the insertion loss, and satisfies the development demand of high-speed high-frequency electronic products.
  • the invention has a shielding layer.
  • the method used for roughening the surface is the copper foil roughening method of the circuit board, which needs to be roughened, solidified, and then passivated, or the method of micro-etching of the circuit board, first roughening and then passivation, and these roughening methods are
  • the reagents used may pollute the environment, and some may even contain toxic substances.
  • CN106061107A discloses a rigid-flex circuit board with electromagnetic shielding film and a rigid-flex circuit board thereof, comprising a rigid region and a flexible region, the rigid region comprising a first rigid body laminated in sequence
  • the plate, the bonding sheet, the flexible daughter board, the bonding sheet and the second rigid daughter board, the flexible region comprises an electromagnetic shielding film, a cover film, a flexible daughter board, a cover film and an electromagnetic shielding film which are sequentially laminated
  • the electromagnetic shielding film comprises The first release film, the insulating layer and the conductive adhesive layer are laminated, and the rigid-flex circuit board with the electromagnetic shielding film of the invention is used after the flexible region is exposed by the bare-flex bonding plate.
  • the specially designed auxiliary gasket enables the electromagnetic shielding film to be reliably applied to the surface of the flexible region under pressure and heat during the pressing process.
  • the conductive adhesive layer of the invention is made of copper paste or silver paste, and the cost is Higher.
  • CN104883866A discloses an electromagnetic shielding film with good thermal conductivity and a manufacturing process thereof, the electromagnetic shielding film comprising: a carrier film layer, a flexible ink layer, a thermal conductive ink layer and a conductive adhesive layer coated on the thermal conductive ink layer, The thermal conductive ink layer imparts good thermal conductivity to the electromagnetic shielding film, and the thermal conductivity can reach 2.0 W/m*k or more.
  • the flexible ink layer makes the electromagnetic shielding film have good flexibility and meets the use requirements of the flexible circuit board.
  • the manufacturing process is easy to realize in the existing industrial production, and is convenient for industrial promotion and application.
  • the shielding film of the invention has many layers and increases the manufacturing cost.
  • the basic structure of the shielding film contains a conductive adhesive layer, and the conductive adhesive layer increases the insertion loss of the circuit board, and the metal particles contained in the conductive adhesive layer reduce the bending property of the circuit board. Therefore, in order to meet the demand, it is desirable to obtain an electromagnetic shielding film containing no conductive adhesive layer by changing the formation manner, material type and hierarchical structure of the electromagnetic shielding layer and the insulating layer to avoid insertion loss and bending performance. .
  • a third object of the present invention is to provide an application of the above electromagnetic wave shielding film screen.
  • An electromagnetic wave shielding film comprising at least one electromagnetic shielding layer, one side of the electromagnetic shielding layer is an adhesive layer, and the other side is an insulating layer, at least one side of the insulating layer is rough, and the roughness is 2 ⁇ 10 ⁇ m, preferably 1 to 8 ⁇ m.
  • the material of the insulating layer is at least one of a modified polyurethane, a modified acrylate or a modified epoxy insulating ink.
  • the electromagnetic shielding layer has a thickness of 10 to 5000 nm.
  • the electromagnetic shielding layer is a copper plating layer or a silver plating layer.
  • the electromagnetic shielding layer is a copper plating layer of a metal material or a silver plating layer of a metal material.
  • the metal material is one of aluminum, titanium, zinc, iron, nickel, chromium, cobalt or copper.
  • the metal material is an alloy formed of at least two of aluminum, titanium, zinc, iron, nickel, chromium, cobalt or copper.
  • the material of the bonding layer is at least one of a modified epoxy resin, a modified polyurethane, and a modified acrylate adhesive.
  • the base film and/or protective film is a non-silicon release material.
  • the base film is a PET release film.
  • the base film is a PET heavy release film.
  • a method for preparing an electromagnetic wave shielding film comprises the following steps:
  • the roughening treatment in the step (1) is to apply a modified epoxy resin, a modified polyurethane or a modified acrylate adhesive containing inorganic particles to the outer surface of the insulating layer.
  • the inorganic particles are at least one of silver powder, copper powder, nickel powder, aluminum hydroxide, aluminum oxide, titanium oxide, and silicon dioxide.
  • the coating method described in the steps (1) and (3) is at least one of extrusion coating, blade coating, dimple printing, screen roll printing, and screen printing.
  • the protective film according to the step (4) is a release film or a micro-mucosa prepared by using a PET film, a PET film, a PEN film or a PP film as a substrate.
  • the protective film according to the step (4) is a micro-mucosa prepared by using a PET film, a PET film, a PEN film or a PP film as a substrate.
  • the present invention forms an insulating layer with a rough outer surface by coating a resin or an adhesive containing inorganic particles on the outer surface of the insulating layer, or directly adding an inorganic particle to the insulating layer material to achieve insulation.
  • the purpose of roughening the layer and the electromagnetic shielding layer joint surface significantly reduces the grounding resistance of the electromagnetic shielding film when applied;
  • the roughening treatment method provided by the invention avoids the environmental pollution that may be caused by the reagent used in the conventional metal surface roughening process, and also avoids the use of the toxic reagent, and the operation process is simple.
  • Fig. 1 is a schematic view showing the structure of an electromagnetic shielding film formed by coating a resin containing inorganic particles on the outer surface of an insulating layer.
  • the method for preparing the electromagnetic wave shielding film comprises the following steps:
  • a PET heavy-duty film 4 having a thickness of 50 ⁇ m and a width of 250 to 1500 mm, apply an insulating layer material on the side of the release surface, and form an insulating layer 2 having a thickness of 2 ⁇ m after being completely cured, and apply it on the insulating layer 2.
  • the modified epoxy resin containing inorganic particles is subjected to printing roughening treatment on the outer surface of the insulating layer, and the roughness after the roughening treatment is 2 to 10 ⁇ m;
  • the adhesive layer material was applied to the electromagnetic shielding layer formed in the step (2) to form the adhesive layer 3 having a thickness of 2 ⁇ m.
  • the protective film 6 is applied to the surface of the adhesive layer formed in the step (3).
  • the electromagnetic wave shielding film prepared as described above was applied to a flexible circuit board.
  • the method for preparing the electromagnetic wave shielding film comprises the following steps:
  • a PET heavy-duty film having a thickness of 40 ⁇ m and a width of 250 to 1500 mm is selected, and an insulating layer material to which inorganic particles are added is applied on the side of the release surface, and an insulating layer 2 having a thickness of 10 ⁇ m is formed after being completely cured.
  • the cloth insulating layer 2 simultaneously forms a rough surface 7 on the bonding surface of the insulating layer and the carrier film 4, and the outer surface 5 of the insulating layer 2 (the bonding surface of the bonding layer and the electromagnetic shielding layer 1) has a roughness of 2 to 10 ⁇ m;
  • the electromagnetic wave shielding film prepared as described above was applied to a flexible circuit board.
  • An electromagnetic wave shielding film is provided with an insulating layer on the carrier film, an electromagnetic shielding layer is disposed on the insulating layer, and a rubber film layer is disposed on the electromagnetic shielding layer, wherein the carrier film is a PET heavy-release film.
  • An electromagnetic wave shielding film is provided with an insulating layer on the carrier film, an electromagnetic shielding layer is disposed on the insulating layer, and an adhesive layer is disposed on the electromagnetic shielding layer, wherein the carrier film is a PET heavy-release film.

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  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)

Abstract

本发明提供了一种电磁波屏蔽膜，该电磁屏蔽膜至少包括一层电磁屏蔽层，电磁屏蔽层的一侧是粘接层，另一侧是绝缘层，绝缘层的至少一面是粗糙的，粗糙度为 2～10μm，绝缘层材料为改性聚氨酯、改性丙烯酸酯或改性环氧绝缘油墨，绝缘层的厚度为 1～10μm，电磁屏蔽层的厚度为10～5000nm，电磁屏蔽层的为镀铜层或镀银层，本发明还提供了电磁波屏蔽膜的制备方法，包括对绝缘层进行粗化处理，或在绝缘层材料中添加无机粒子，形成带有粗化表面的绝缘层，在处理后的粗化表面形成电磁屏蔽层，对前步骤形成的电磁屏蔽层表面形成粘接层。本发明提供的电磁波屏蔽膜，显著降低了电磁屏蔽膜应用时的接地电阻。

Description

一种电磁波屏蔽膜及其制备方法和应用 技术领域
本发明属于绝缘技术领域，具体涉及一种电磁波屏蔽膜及其制备方法和应用。
背景技术
近几年来，随着电磁波应用需求的大量增加，人们对电磁波的研究进展逐渐深入，其应用波段被开发的越来越多。为了满足远距离传输和检测的需求，雷达、卫星通讯等设备的电磁波发射功率也在逐渐增大，电磁波强度大幅提高，特别是从无线电波到微波的宽波段。目前，电磁波普遍应用在医疗保健、电视广播、移动通讯以及光学等各个领域，为生活提供了许多便利，但过多的应用电磁波造成了一定程度的电磁波污染，使得空间背景的电磁环境日趋复杂化，各个领域开始纷纷提出抗电磁干扰的要求。近些年光学技术的研究持续深入，光学系统的应用多样性要求其在满足正常使用的前提下还需将对系统产生干扰的电磁波有效屏蔽掉，尤其是在军事及航空航天等领域，应用在各种武器装备和飞行器上的光学观测和探测设备必须同时满足两方面要求：一方面能够将影响系统内电子器件正常工作和对信号接收设备产生干扰的电磁波有效屏蔽掉，另一方面还要兼具优良的透光特性，使其不影响光学系统成像质量，以满足设备探测和观测的要求。为了解决电磁屏蔽问题，开始不断研究和发展电磁品屏蔽技术。
线路板用屏蔽膜的核心是电磁屏蔽层，围绕电磁屏蔽层，出现了很多各种层级形式的电磁屏蔽膜。CN103763893A公开了一种电磁波屏蔽膜和包含屏蔽膜的印刷线路板，制作方法包括将电磁屏蔽膜与线路板在厚度方向热压固化，利用电磁屏蔽层的粗糙面将粘接层刺穿实现接地，或者将电磁屏蔽膜与线路板在厚度方向热压固化，利用导电物质刺穿屏蔽膜实现接地，或者将电磁屏蔽膜与线路板在厚度方向热压固化，在线路板上形成通孔或盲孔，将孔金属化，实现接地，该发明的屏蔽膜粘接层中不含导电粒子，降低了成本，减少了插入损耗，能满足电子产品高速高频化的发展需求，然而该发明对屏蔽层表面进行粗化所采用的方法为线路板的铜箔粗化法，需要先粗化后固化，再钝化，或者采用线路板微蚀的方法，先粗化再钝化，这些粗化方法所使用的试剂有可能会污染环境，有的实际甚至含有有毒物质。CN106061107A公开了一种具电磁屏蔽膜的刚挠结合线路板及其制备方法，该具电磁屏蔽膜的刚挠结合线路板，包括刚性区域和挠性区域，刚性区域包括依次层叠的第一刚性子板、粘结片、挠性子板、粘结片以及第二刚性子板，挠性区域包括依次层叠的电磁屏蔽膜、覆盖膜、挠性子板、覆盖膜以及电磁屏蔽膜，电磁屏蔽膜包括依次层叠设置的第一离型膜、绝缘层以及导电粘胶层，该发明的具电磁屏蔽膜的刚挠结合线路板是通过在刚挠结合板制作过程中完 成揭盖露出挠性区后，使用专门设计的辅助垫片使电磁屏蔽膜在压合过程中能很好的受到压力和热量而可靠地贴在挠性区表面，然而该发明导电粘胶层的材质为铜浆或银浆，成本较高。CN104883866A公开了一种具有良好导热性的电磁屏蔽膜及其制造工艺，该电磁屏蔽膜包括：载体膜层、柔性油墨层、导热油墨层以及涂布于导热油墨层上的导电胶黏剂层，导热油墨层赋予了电磁屏蔽膜良好的导热性能，导热系数可达2.0W/m*k以上，柔性油墨层使该电磁屏蔽膜具有良好的柔韧性，满足柔性线路板的使用需求，该发明的制造工艺在现有工业生产中容易实现，方便工业推广应用，然而，该发明屏蔽膜层次较多，增加了制造成本。
目前，屏蔽膜的基本结构中都含有导电胶层，导电胶层会增大线路板的插入损耗，同时导电胶层中含有的金属粒子会降低线路板的弯折性。因此，为满足根据需求，希望可以通过对电磁屏蔽层和绝缘层的形成方式、材质种类和层级结构进行改变，得到不含导电胶层的电磁屏蔽膜，以避免插入损耗和弯折性能的降低。
发明内容
为解决现有技术的不足，本发明的目的之一是提供一种电磁波屏蔽膜。
本发明的目的之二是提供上述电磁波屏蔽膜屏蔽膜的制备方法。
本发明的目的之三是提供上述电磁波屏蔽膜屏的应用。
为实现上述目标，本发明采用以下技术方案：
一种电磁波屏蔽膜，至少包括一层电磁屏蔽层，所述电磁屏蔽层的一侧是粘接层，另一侧是绝缘层，所述绝缘层的至少一面是粗糙的，粗糙度为2～10μm，优选1～8μm。
优选地，所述绝缘层的材料为改性聚氨酯、改性丙烯酸酯或改性环氧绝缘油墨中的至少一种。
优选地，所述绝缘层的厚度为1～10μm。
优选地，所述电磁屏蔽层的厚度为10～5000nm。
优选地，所述电磁屏蔽层为镀铜层或镀银层。
优选地，所述电磁屏蔽层为金属材料镀铜层或金属材料镀银层。
进一步优选地，所述金属材料为铝、钛、锌、铁、镍、铬、钴或铜单质中的一种。
进一步优选地，所述金属材料为铝、钛、锌、铁、镍、铬、钴或铜单质中的至少两种形成的合金。
优选地，所述粘接层的厚度为1～15μm。
优选地，所述粘接层的材料为改性环氧树脂、改性聚氨酯和改性丙烯酸酯胶黏剂中的至少一种。
优选地，所述电磁波屏蔽膜还包括基底膜和/或保护膜。
优选地，所述基底膜和/或保护膜为非硅离型材料。
进一步优选地，所述基底膜为PET离型膜。
更进一步优选地，所述基底膜为PET重离型膜。
一种电磁波屏蔽膜的制备方法，包括以下步骤：
(1)对绝缘层进行粗化处理，或在绝缘层材料中添加无机粒子，形成带有粗化表面的绝缘层；
(2)在步骤(1)处理后的粗化表面形成电磁屏蔽层；
(3)对步骤(2)形成的电磁屏蔽层表面形成粘接层。
优选地，一种电磁波屏蔽膜的制备方法，包括以下步骤：
(1)在基底膜一侧涂布形成绝缘层，对绝缘层进行粗化处理，或在绝缘层材料中添加无机粒子，形成带有粗化表面的绝缘层；
(2)在步骤(1)处理后的粗化表面通过真空蒸镀或溅镀形成电磁屏蔽层；
(3)对步骤(2)形成的电磁屏蔽层表面涂布形成粘接层；
(4)在步骤(3)形成的粘接层表面覆贴保护膜。
步骤(1)所述的粗化处理为在绝缘层外表面涂布含有无机粒子的改性环氧树脂、改性聚氨酯或改性丙烯酸酯胶黏剂。
进一步优选地，所述无机粒子为银粉、铜粉、镍粉、氢氧化铝、氧化铝、二氧化钛和二氧化硅中的至少一种。
更进一步优选地，所述无机粒子的粒径为5-15μm。
进一步优选地，步骤(1)和(3)中所述的涂布方式为挤出涂布、刮刀涂布、微凹印刷、网辊印刷和丝网印刷中的至少一种。
进一步优选地，步骤(4)所述的保护膜为PET膜、PEN膜和PP膜。
进一步优选地，步骤(4)所述的保护膜为PET膜、PET膜、PEN膜或PP膜为基材制备的离型膜、微粘膜。
进一步优选地，步骤(4)所述的保护膜为PET膜、PET膜、PEN膜或PP膜为基材制备的微粘膜。
一种包含项所述电磁波屏蔽膜的线路板。
本发明的有益效果
1、在现有技术的基础上，本发明通过对绝缘层外表面涂布含有无机粒子的树脂或胶粘剂， 或者直接在绝缘层材料中添加无机粒子，形成外表面粗糙的绝缘层，达到对绝缘层和电磁屏蔽层结合面进行粗化处理的目的，显著降低了电磁屏蔽膜应用时的接地电阻；
2、本发明采用绝缘的粘接层同样达到了用导电胶带来的导电效果，接地电阻显著降低，有利于降低线路板的电磁干扰，提高信号的传输性能，同时屏蔽膜耐热性、剥离强度未受不良影响，耐弯折性显著提升，产品使用寿命增长；
3、相比现有技术，本发明提供的粗化处理方法避免了传统金属表面粗化工艺中使用的试剂可能带来的环境污染，也避免了有毒试剂的使用，同时操作工艺简单。
附图说明
图1是在绝缘层外表面涂布含有无机粒子的树脂后形成的电磁屏蔽膜的结构示意图。
图2是直接在绝缘层材料中添加无机粒子后形成的电磁屏蔽膜的结构示意图。
具体实施方式
以下实施例旨在进一步说明本发明内容，而不是限制本发明权利要求的保护范围。
实施例1
如图1所示，一种电磁波屏蔽膜，载体膜4上设有绝缘层2，绝缘层2上设有电磁屏蔽层1，电磁屏蔽层1上设有粘接层3，其中，载体膜为含有非硅离型材料的PET膜。电磁屏蔽层1与绝缘层2的结合面5是粗糙的。
该电磁波屏蔽膜的制备方法，包括以下步骤：
(1)选取厚度50μm，宽度250～1500mm的PET重离型膜4，在其离型面一侧涂布绝缘层材料，完全固化后形成厚度为2μm的绝缘层2，在绝缘层2上涂布含有无机颗粒的改性环氧树脂对绝缘层外表面进行印刷粗化处理，粗化处理后粗糙度为2～10μm；
(2)在步骤(1)处理后的粗化表面通过真空蒸镀方式将电磁屏蔽层材料沉积在粗化表面上，沉积形成厚度为100nm的电磁屏蔽层1；
(3)在步骤(2)形成的电磁屏蔽层涂布粘接层材料形成厚度为2μm的粘接层3。
(4)在步骤(3)形成的粘接层表面覆贴保护膜6。
将上述制备得到的电磁波屏蔽膜应用到柔性电路板中。
实施例2
如图2所示，一种电磁波屏蔽膜，载体膜4上设有绝缘层2，绝缘层2上设有电磁屏蔽层1，电磁屏蔽层1上设有胶膜层3，胶膜层外表面覆贴有保护膜6，绝缘层2中含有粒径为粒径为5-15μm的无机粒子。其中，绝缘层2与载体膜4的接触面7不完全光滑，绝缘层2与电磁屏蔽层1的接触面7的粗糙度为2～10μm。载体膜4为PET重离型膜。
该电磁波屏蔽膜的制备方法，包括以下步骤：
(1)选取厚度40μm，宽度250～1500mm的PET重离型膜，在其离型面一侧涂布添加了无机粒子的绝缘层材料，完全固化后形成厚度为10μm的绝缘层2，在涂布绝缘层2的同时在绝缘层与载体膜4的结合面形成粗燥面7，绝缘层2的外表面5(结缘层与电磁屏蔽层1的结合面)的粗糙度为2～10μm；
(2)在步骤(1)处理后的粗化表面通过溅镀方式将电磁屏蔽层材料沉积在粗化表面上，沉积形成厚度为500nm的电磁屏蔽层1；
(3)在步骤(2)形成的电磁屏蔽层1表面涂布粘接层材料形成厚度为8μm的粘接层3；
(4)在步骤(3)形成的在粘接层3表面覆贴保护膜6。
将上述制备得到的电磁波屏蔽膜应用到柔性电路板中。
对比例1
一种电磁波屏蔽膜，载体膜上设有绝缘层，绝缘层上设有电磁屏蔽层，电磁屏蔽层上设有胶膜层，其中，载体膜为PET重离型膜。
该电磁波屏蔽膜的制备方法，包括以下步骤：
(1)选取厚度75μm，宽度250～1500mm的PET重离型膜，在其离型面一侧涂布绝缘层材料，完全固化后形成厚度为5μm的绝缘层；
(2)在步骤(1)固化后的绝缘层表面直接通过真空蒸镀方式将电磁屏蔽层材料沉积在粗化表面上，沉积形成厚度为200nm的电磁屏蔽层；
(3)在步骤(2)形成的电磁屏蔽层表面直接涂布胶膜层材料形成厚度为10μm的粘接层；
(4)在步骤(3)形成的粘接层表面覆贴保护膜。
对比例2
一种电磁波屏蔽膜，载体膜上设有绝缘层，绝缘层上设有电磁屏蔽层，电磁屏蔽层上设有粘接层，其中，载体膜为PET重离型膜。
该电磁波屏蔽膜的制备方法，包括以下步骤：
(1)选取厚度50μm，宽度250～1000mm的PET重离型膜，在其离型面一侧涂布绝缘层材料，完全固化后形成厚度为10μm的绝缘层；
(2)在步骤(1)固化后的绝缘层表面直接通过溅镀方式将电磁屏蔽层材料沉积在粗化表面上，沉积形成厚度为300nm的电磁屏蔽层；
(3)在步骤(2)形成的电磁屏蔽层表面直接涂布胶膜层材料形成厚度为5μm的粘接层；
(4)在步骤(3)形成的粘接层表面覆贴保护膜。
比较了实施例和对比例的电磁波屏蔽膜性能，结果列于表1。
表1 电磁波屏蔽膜性能
性能测试 实施例1 实施例2 对比例1 对比例2
接地电阻(欧姆) 0.4 0.2 1.2 0.8
剥离强度(Kgf/cm) 1.1 1.3 1.4 1.0
耐热性(300℃，浸锡) OK OK OK OK
耐弯折性(次) 15600 10800 8320 9350
层间结合面的粗糙度对电磁屏蔽膜应用时的接地性能产生显著的影响。将实施例1～2和对比例1～2进行比较，层间结合面经过粗化处理后接地电阻显著下降，这是由于表面粗化处理后在压合过程中粘接层胶面变软流动使得电磁屏蔽层与线路板的接地焊盘接触，显著降低了接地电阻。我们发现，绝缘层表面粗化处理的最优粗糙度为1～8μm，粗糙度过小，对压合段差要求较高，容易接触不良，造成接地电阻增大，过大的粗糙度会导致粘接层涂布不均。
本发明采用绝缘的粘接层仍能达到用导电胶带来的导电效果，接地电阻降低有利于降低线路板的电磁干扰，提高信号传输性能。其它性能无明显变化，说明本发明在保证电磁屏蔽和良好的导电性(低接地电阻)效果的前提下，其它性能未受不良影响。耐弯折性能显著升，有利于产品使用寿命的延长。
上述实施例为本发明较佳的实现方案，除此之外，本发明还可以其它方式实现，在不脱离本发明构思的前提下任何显而易见的替换均在本发明的保护范围之内。

Claims (10)

  1. 一种电磁波屏蔽膜，其特征在于，至少包括一层电磁屏蔽层，所述电磁屏蔽层的一侧是粘接层，另一侧是绝缘层，所述绝缘层的至少一面是粗糙的，粗糙度为2～10μm。
  2. 根据权利要求1所述的电磁波屏蔽膜，其特征在于，所述绝缘层材料为改性聚氨酯、改性丙烯酸酯或改性环氧绝缘油墨中的至少一种。
  3. 根据权利要求1所述的电磁波屏蔽膜，其特征在于，所述绝缘层的厚度为1～10μm。
  4. 根据权利要求1所述的电磁波屏蔽膜，其特征在于，所述电磁屏蔽层的厚度为10～5000nm，所述电磁屏蔽层为镀铜层或镀银层。
  5. 根据权利要求1所述的电磁波屏蔽膜，其特征在于，所述粘接层的厚度为1～15μm，
  6. 根据权利要求1所述的电磁波屏蔽膜，其特征在于，所述粘接层的材料为改性环氧树脂、改性聚氨酯和改性丙烯酸酯胶黏剂中的至少一种。
  7. 根据权利要求1所述的电磁波屏蔽膜，其特征在于，所述电磁波屏蔽膜还包括基底膜和/或保护膜。
  8. 根据权利要求1～7任一项所述电磁波屏蔽膜的制备方法，其特征在于，包括以下步骤：
    (1)对绝缘层进行粗化处理，或在绝缘层材料中添加无机粒子，形成带有粗化表面的绝缘层；
    (2)在步骤(1)处理后的粗化表面形成电磁屏蔽层；
    (3)对步骤(2)形成的电磁屏蔽层表面形成粘接层。
  9. 根据权利要求8所述的电磁波屏蔽膜的制备方法，其特征在于，步骤(1)所述的印刷粗化处理为在绝缘层外表面涂布含有无机粒子的改性环氧树脂、改性聚氨酯或改性丙烯酸酯胶黏剂中的至少一种。
  10. 一种包含如权利要求1～7任一项所述电磁波屏蔽膜的线路板。
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CN109831904A (zh) * 2019-03-07 2019-05-31 昆山雅森电子材料科技有限公司 高遮蔽性电磁干扰屏蔽膜及其制备方法
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CN111806013A (zh) * 2020-07-03 2020-10-23 河南国安电子材料有限公司 一种高频电磁屏蔽膜及其制备方法
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CN114641126B (zh) * 2021-02-09 2024-03-08 广州方邦电子股份有限公司 电磁屏蔽膜及线路板
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