WO2019061389A1

WO2019061389A1 - Printed circuit board for performing radio frequency testing for terminal, and terminal

Info

Publication number: WO2019061389A1
Application number: PCT/CN2017/104731
Authority: WO
Inventors: 张凤柳
Original assignee: 深圳传音制造有限公司
Priority date: 2017-09-30
Filing date: 2017-09-30
Publication date: 2019-04-04

Abstract

A printed circuit board (100) for performing radio frequency testing for a terminal (400), and a terminal (400). The printed circuit board comprises an outer solder pad (120) and an inner solder pad (140). The inner solder pad (140) is provided in a hollow cavity (127) formed at the outer solder pad (120). The outer solder pad (120) is grounded. The inner solder pad (140) comprises a first pad section (143) and a second pad section (141). The first pad section (143) is electrically connected to an antenna (200). The second pad section (141) is electrically connected to a radio frequency circuit (300). The above arrangement can reduce costs relating to surface mounted devices and procurement costs.

Description

Printed circuit board and terminal for terminal RF test

Technical field

[0001] The present application relates to radio frequency detection of a wireless communication device, and in particular to a printed circuit board and terminal for terminal radio frequency testing.

Background technique

[0002] In the prior art, radio frequency testing of the radio frequency circuit of the terminal is required before the terminal is installed. The RF test is to check whether the RF signal strength of the terminal meets the quality requirements. In the current PCB design, a test switch socket needs to be added to the RF circuit. The RF signal is detected in the manner in which the test head is inserted into the test socket and the circuit signal is received.

technical problem

[0003] In the prior art, by adding a test socket to the PCB, the test socket needs to be mounted on the PCB, which increases the surface mounting of the PCB, resulting in an increase in the cost of the PCB. Will increase the cost of purchasing and testing the socket.

Problem solution

Technical solution

[0004] In view of the above technical problems, the present application provides a printed circuit board and a terminal for terminal radio frequency testing, by replacing the test plug socket with the RF test pad, eliminating the need for patching, thereby saving patch cost and saving purchases. cost.

In order to solve the above technical problem, the present application provides a printed circuit board for terminal radio frequency testing, including an outer ring pad and an inner pad, and the inner pad is disposed on the outer ring pad. In the hollow cavity, the outer ring pad is grounded, the inner pad includes a first pad and a second pad, the first pad is electrically connected to the antenna, and the second pad is electrically connected to the radio frequency circuit .

[0006] Further, a gap is formed between the first pad and the second pad to isolate the first pad from the second pad.

Further, the slit has an arc shape.

[0008] Further, an area of the first pad is smaller than an area of the second pad. [0009] Further, the first pad and the second pad together form a solid inner pad.

[0010] Further, the outer ring pad includes a first ring pad and a second ring pad symmetrically disposed with the first ring pad, a center of the first ring pad and the second a center of the ring pad is concentrically disposed, and a first opening is formed between the first end of the first ring pad and the corresponding first end of the second ring pad, the first A second port is formed between the second end of the ring pad and the corresponding second end of the second ring pad.

[0011] Further, the first pad is disposed opposite to the first port, and the second pad is disposed opposite to the second port.

[0012] The present application also provides a terminal comprising a printed circuit board for terminal radio frequency testing as described above.

[0013] Further, after performing radio frequency testing on the terminal, pressing the second pad with a test head

And detecting the radio frequency signal, and the first pad is fixedly connected to the second pad after the radio frequency signal is stronger than the preset radio frequency signal.

[0014] Further, the first pad and the second pad are fixedly connected by spot welding.

Advantageous effects of the invention

Beneficial effect

[0015] The present application provides a printed circuit board and a terminal for terminal radio frequency testing, which can reduce the test by replacing the existing test switch socket by setting an RF test pad on the printed circuit board. The socket is placed on the printed circuit board to save on the cost of the placement and to save on procurement costs. Brief description of the drawing

DRAWINGS

1 is a structural block diagram of a printed circuit board for terminal radio frequency testing according to a first embodiment of the present application.

2 is a structural block diagram of the RF test pad of FIG. 1.

3 is a schematic structural view of the RF test pad of FIG. 2.

4 is a block diagram showing a connection structure between a printed circuit board and an antenna and a radio frequency circuit.

5 is a schematic structural diagram of a radio frequency test pad according to a second embodiment of the present application.

6 is a schematic structural diagram of a radio frequency test pad according to a third embodiment of the present application.

[0022] FIG. 7 is a structural block diagram of a terminal according to a fourth embodiment of the present application.

8 is a schematic flowchart of a radio frequency testing method of a terminal according to a fifth embodiment of the present disclosure. Embodiments of the invention

[0024] In order to further illustrate the technical means and efficacy of the present invention for achieving the intended purpose of the invention, the following will be described with reference to the accompanying drawings and preferred embodiments of a printed circuit board and terminal for terminal radio frequency testing according to the present invention. The detailed description, methods, steps, structures, features and functions are described in detail below.

The above and other technical features, features, and advantages of the present invention will be apparent from the following description of the preferred embodiments of the invention. The technical means and functions of the present invention for achieving the intended purpose can be more deeply and specifically understood by the description of the specific embodiments. However, the drawings are only for the purpose of reference and description, and are not intended to limit.

Please refer to FIG. 1. FIG. 1 is a schematic structural diagram of a printed circuit board 100 for terminal radio frequency testing according to a first embodiment of the present application. As shown in FIG. 1, an embodiment of the present invention provides a printed circuit board 100 for terminal radio frequency testing. Specifically, in the present embodiment, a Printed Circuit Board (PCB) 100 includes a radio frequency test pad 110. Specifically, by replacing the existing test switch socket (not shown) by providing the RF test pad 110 on the printed wiring board 100, it is possible to reduce the patching of the test switch socket on the printed wiring board 100. In other words, the surface mount technology (SMT) of the printed wiring board 100 is not required, and the patch cost can be saved.

[0027] Specifically, in an embodiment, the RF test pad 110 may be, but not limited to, a concentric circle pad. For example, in other embodiments, the RF test pad 110 may also be a square concentric pad or the like. Wait.

[0028] Please refer to FIG. 2 together. FIG. 2 is a structural block diagram of the RF test pad 110 of FIG. As shown in FIGS. 1 and 2, the RF test pad 110 includes an outer ring pad 120 and an inner pad 140.

[0029] Specifically, in the present embodiment, the outer ring pad 120 may be, but not limited to, a ring-shaped pad. The inner pad 140 is disposed within the outer ring pad 120, and the center of the inner pad 140 is the same as the center of the outer pad 120.

[0030] Please refer to FIG. 3 together. FIG. 3 is a schematic structural diagram of the RF test pad 110 of FIG. As shown in FIGS. 1 to 3, the inner pad 140 is disposed in the hollow cavity formed by the outer ring pad 120, and the center of the inner pad 140 is the same as the center of the outer ring pad 120.

[0031] Specifically, in the embodiment, the internal pad 140 may include, but is not limited to, the first pad 143 and the second pad 141. [0032] Specifically, in the embodiment, the first pad 143 is electrically connected to the antenna, and the second pad 141 is electrically connected to the radio frequency circuit.

[0033] Specifically, in the embodiment, a gap 145 is disposed between the first pad 143 and the second pad 141 to isolate the first pad 143 from the second pad 141.

Specifically, in the embodiment, the slit 145 may be, but not limited to, an arc shape. Specifically, the middle portion of the slit 145 has an arc shape, and both end portions of the slit 145 are horizontal. Specifically, in this embodiment, the central portion of the first pad ₁₄ 3 is recessed inward to form an arcuate notch (not shown), and the central portion of the second pad 141 is outwardly protruded to form an arcuate boss (not shown) ). The arcuate notch of the first pad 143 and the arcuate boss of the second pad 141 cooperate to form an arcuate slit 145.

[0035] Specifically, in the embodiment, the area of the first pad 143 may be, but is not limited to, smaller than the area of the second pad 141. For example, in other embodiments, the area of the first pad 143 may also be Set to the second pad

The area of 141 is equal.

[0036] Specifically, in the embodiment, the first pad 143 and the second pad 141 together form a solid inner pad 140, but are not limited thereto, for example, in other embodiments, the first The pad 143 and the second pad 141 may also be disposed to form a solid square internal pad 140, or the first pad 143 and the second pad 141 may be disposed to form a solid U-shaped shape. The internal pad 140, for example, the first pad 143 is a U-shaped pad pad, the second pad 141 is a U-shaped physical pad inserted in the U-ring pad, and the first pad 143 and the A U-shaped slit 145 is formed between the two pads 141, but is not limited thereto.

[0037] Specifically, in an embodiment, the outer ring pad 120 is grounded.

[0038] Specifically, in the embodiment, the outer ring pad 120 includes a first ring pad 121 and a second ring pad 124 symmetrically disposed with the first ring pad 121, and a center of the first ring pad 121 It is concentric with the center of the second ring pad 124.

[0039] Specifically, in the embodiment, the first end portion 122 of the first ring pad 121 and the corresponding second ring pad

A first port 128 is defined between the first ends 125 of the 124.

[0040] Specifically, in the present embodiment, the second end portion 123 of the first ring pad 121 and the corresponding second ring pad 12

There is a second port 129 between the second ends 126 of 4.

[0041] Specifically, in the embodiment, a cavity 127 is also formed between the first ring pad 121 and the second ring pad 124. [0042] Specifically, in the embodiment, the first port 128 and the second port 129 are respectively disposed in communication with the hollow cavity 127.

[0043] Specifically, in the embodiment, the first ring pad 121 and the second ring pad 124 are grounded, respectively.

[0044] Specifically, in the embodiment, the first pad 143 and the second pad 141 are disposed together on the first ring pad 12

1 is in the hollow cavity 127 between the second ring pad 124.

[0045] Specifically, in the embodiment, the first pad 143 may be, but not limited to, disposed opposite to the first port 128.

For example, the first pad 143 may also be disposed opposite to the second port 129. Specifically, the first pad 1

43 is set for the first port 128.

[0046] Specifically, in the embodiment, the second pad 141 may be, but not limited to, opposite to the second port 129.

For example, the second pad 141 may also be disposed opposite to the first port 128. Specifically, the second pad 1

41 is set for the second mouth 129.

Please refer to FIG. 4 together. FIG. 4 is a block diagram showing the connection structure between the printed circuit board 100 and the antenna 200 and the radio frequency circuit 300. As shown in FIGS. 1 to 4, the printed wiring board 100 is electrically connected to the antenna 200 and the radio frequency circuit 300, respectively.

[0048] Specifically, in this embodiment, one end of the antenna 200 may be electrically connected to the first pad ₁₄₃ after, but not limited to, through the first port 128.

[0049] Specifically, in this embodiment, the output end of the radio frequency circuit 300 can be, but is not limited to, the second port 1

After 29, it is electrically connected to the second pad 141.

[0050] Specifically, the printed circuit board 100 provided in this embodiment can replace the existing test switch socket by providing the RF test pad 110 on the printed circuit board 100, thereby reducing the test socket. The patch is on the printed circuit board 100 to save on the cost of the patch and to save on procurement costs.

Please refer to FIG. 5. FIG. 5 is a schematic structural diagram of a radio frequency test pad 110a according to a second embodiment of the present application.

As shown in FIG. 5, the present invention provides a radio frequency test pad 110a. Specifically, the structure of the radio frequency test pad 110a of the present embodiment is different from the structure of the radio frequency test pad 110 provided by the first embodiment only in the difference of the internal pads ₁₄ 0, 150.

[0052] Specifically, in the present embodiment, the internal pad 150 may include, but is not limited to, the first pad 153 and the second pad 151.

[0053] Specifically, in the embodiment, the first pad 153 is electrically connected to the antenna 200, and the second pad 151 is connected to the radio frequency. Circuit 300 is electrically connected.

[0054] Specifically, in the embodiment, a gap 155 is disposed between the first pad 153 and the second pad 151 to isolate the first pad 153 from the second pad 151.

Specifically, in the present embodiment, the slit 155 may be, but not limited to, an arc shape. Specifically, the middle portion of the slit 155 has an arc shape, and both end portions of the slit 155 are horizontal. Specifically, in this embodiment, the gap

The direction in which the arc of the middle portion of 155 is located is opposite to the direction in which the arc of the middle portion of the slit 155 of the radio frequency test pad 110a of the first embodiment is located.

[0056] Specifically, in the embodiment, the central portion of the first pad 153 protrudes outward to form an arcuate boss, and the central portion of the second pad 151 is recessed inward to form an arcuate notch. The arcuate projections of the first pad 153 and the arcuate notches of the second pad 151 cooperate to form an arcuate slit 155.

[0057] Specifically, in the embodiment, the area of the first pad 153 may be, but is not limited to, smaller than the area of the second pad 151. For example, in other embodiments, the area of the first pad 153 may also be Set to the second pad

The area of 151 is equal.

[0058] Specifically, in the embodiment, the first pad 153 and the second pad 151 together form a solid inner pad 150, but are not limited thereto, for example, in other embodiments, the first The pad 153 and the second pad 151 may also be disposed to form a solid square inner pad 150, or the first pad 153 and the second pad 151 may be disposed to form a solid U-shaped shape. The internal pad 150, for example, the first pad 153 is a U-shaped pad pad, the second pad 151 is a U-shaped physical pad interposed in the U-ring pad, and the first pad 153 and the A U-shaped slit 155 is formed between the two pads 151, but is not limited thereto.

[0059] Specifically, in an embodiment, the width of the first pad 153 is greater than the width of the first port 128. The width of the second pad 151 is larger than the width of the second port 129, but is not limited thereto.

[0060] Specifically, the RF test pad 110a provided in this embodiment replaces the existing test switch socket by setting the RF test pad 110a on the printed circuit board 100, thereby reducing the test socket. The patch is placed on the printed wiring board 100 to save the cost of the patch and to save the procurement cost.

Please refer to FIG. 6. FIG. 6 is a schematic structural diagram of a radio frequency test pad 110b according to a third embodiment of the present application.

As shown in FIG. 6, the present invention provides a radio frequency test pad 110b. Specifically, the structure of the radio frequency test pad 110b of the present embodiment is different from the structure of the radio frequency test pad 110 provided by the first embodiment only in the difference of the internal pads 140, 160. [0062] Specifically, in the embodiment, the internal pad 160 may include, but is not limited to, the first pad 163 and the second pad 161.

[0063] Specifically, in the present embodiment, the first pad 163 is electrically connected to the antenna 200, and the second pad 161 is electrically connected to the radio frequency circuit 300.

[0064] Specifically, in the embodiment, a gap 165 is disposed between the first pad 163 and the second pad 161 to isolate the first pad 163 from the second pad 161.

[0065] Specifically, in the embodiment, the slit 165 may be, but not limited to, a linear shape, but is not limited thereto.

For example, in other embodiments, the slit 165 may be provided in a zigzag shape or the like.

[0066] Specifically, in the embodiment, the area of the first pad 163 may be, but is not limited to, smaller than the area of the second pad 161. For example, in other embodiments, the area of the first pad 163 may also be Set to the second pad

The area of 161 is equal.

[0067] Specifically, in the present embodiment, the first pad 163 and the second pad 161 together constitute a solid inner pad 160.

[0068] Specifically, in an embodiment, the width of the first pad 163 is greater than the width of the first port 128. The width of the second pad 161 is larger than the width of the second port 129, but is not limited thereto.

[0069] Specifically, the RF test pad 110b provided in this embodiment replaces the existing test switch socket by providing the RF test pad 110b on the printed circuit board 100, thereby reducing the test socket. The patch is placed on the printed wiring board 100 to save the cost of the patch and to save the procurement cost.

Please refer to FIG. 7, FIG. 7 is a structural block diagram of a terminal 400 according to a fourth embodiment of the present application. As shown in FIG. 7, the present invention provides a terminal 400. Specifically, in the present embodiment, the terminal 400 includes a printed circuit board 100, an antenna 200, and a radio frequency circuit 300 for the terminal 400 radio frequency test. Specifically, the printed wiring board 100 is electrically connected to the antenna 200 and the radio frequency circuit 300, respectively.

[0071] Specifically, in the embodiment, the printed circuit board 100 includes an RF test pad composed of an outer ring pad and an internal pad. For the specific structure of the RF test pad, please refer to FIG. 1 to FIG. The specific structure of the RF test pad shown is not described here.

Specifically, in the embodiment, after performing radio frequency test on the terminal 400, the technician presses the second pad with the test head to detect the radio frequency signal.

[0073] Specifically, in this embodiment, the detected radio frequency signal may be displayed on the display, but is not limited thereto. In order to facilitate the technician to judge whether the detected RF signal is stronger than the preset RF signal, and the RF signal is stronger than the preset RF signal, the first pad is fixedly connected to the second pad, but is not limited thereto. For example, in other embodiments, the detected radio frequency signal may be transmitted to the processor, and the processor compares the received radio frequency signal with the preset radio frequency signal, and displays the comparison result in the display screen, or The indicator light is displayed in a red-green lighting mode to indicate whether the radio frequency signal of the terminal 400 meets the quality requirement. For example, when the indicator light is green, the radio frequency signal of the terminal 400 meets the quality requirement, so as to quickly help the radio frequency signal of the technician terminal 400 meet the quality. The first pad is fixedly connected to the second pad, and the red light indicates that the radio frequency signal of the terminal 400 does not meet the quality requirement and needs to be repaired.

[0074] Specifically, in the embodiment, the first pad and the second pad may be, but are not limited to, fixedly connected by spot welding.

Specifically, in this embodiment, the terminal 400 can be, but is not limited to, a mobile phone. For example, the terminal 400 can be another wireless communication device.

[0076] Specifically, the terminal 400 provided in this embodiment replaces the existing test switch socket by setting an RF test pad on the printed circuit board, thereby reducing the placement of the test switch socket in printing. On the board to save on placement costs and save on procurement costs.

Please refer to FIG. 8, FIG. 8 is a schematic flowchart of a radio frequency testing method for the terminal 400 according to the fifth embodiment of the present application. As shown in FIG. 8, the present invention provides a radio frequency test method for the terminal 400. Specifically, in this embodiment, the radio frequency testing method of the terminal 400 includes the following steps:

[0078] Step SI 1: RF testing the terminal using the RF test pad in the printed circuit board.

[0079] Specifically, in the present embodiment, the technician presses the second pad of the radio frequency test pad in the printed circuit board on the terminal 400 through the test head to test the radio frequency signal of the terminal 400.

[0080] Step S12: Collect radio frequency signals of the terminal.

[0081] Specifically, in this embodiment, the test head will detect the obtained RF signal for acquisition and send it to the processor in the test head.

[0082] Step S13: determining whether the radio frequency signal is stronger than the preset radio frequency signal.

[0083] Specifically, in this embodiment, the processor of the test head compares the received radio frequency signal with the preset radio frequency signal, thereby obtaining a comparison result. [0084] Specifically, in this embodiment, after the detected radio frequency signal is stronger than the preset radio frequency signal, step S14 is performed: the radio frequency test pad is spot-welded and installed. After the detected radio frequency signal is lower than or equal to the preset radio frequency signal, step S15 is performed: the radio frequency signal of the recording terminal is unsatisfactory.

Specifically, in this embodiment, the processor of the test head displays the comparison result to help the technician quickly determine whether the radio frequency signal of the terminal 400 meets the quality requirement, and the radio frequency signal of the terminal 400 meets the quality requirement.吋, the first pad in the RF test pad is fixedly connected to the second pad by spot welding. After the radio frequency signal of the terminal 400 does not meet the quality requirement, the technician records that the radio frequency signal of the terminal 400 is unsatisfactory, and the terminal 400 is repaired.

[0086] It is to be noted that the various embodiments in the present specification are described in a progressive manner, and each embodiment focuses on differences from other embodiments, and the same similar parts between the embodiments. See each other. For the terminal class embodiment, since it is basically similar to the method embodiment, the description is relatively simple, but the relevant parts can be referred to the description of the method embodiment.

Industrial applicability

[0087] The present application provides a printed circuit board and a terminal for terminal radio frequency testing, which can reduce the test by replacing the existing test switch socket by setting an RF test pad on the printed circuit board. The socket is placed on the printed circuit board to save on the cost of the placement and to save on procurement costs.

Claims

Claim

[Claim 1] A printed wiring board for terminal radio frequency testing, wherein the printed wiring board includes an outer ring pad and an inner pad, and the inner pad is disposed on the outer ring pad In the formed hollow cavity, the outer ring pad is grounded, the inner pad includes a first pad and a second pad, the first pad is electrically connected to the antenna, and the second pad and the radio frequency circuit Electrical connection

[Claim 2] The printed wiring board for terminal radio frequency testing according to claim 1, wherein

a gap is formed between the first pad and the second pad to isolate the first pad from the second pad.

[Claim 3] The printed wiring board for terminal radio frequency testing according to claim 2, wherein

The slit has an arc shape.

[Claim 4] The printed wiring board for terminal radio frequency testing according to claim 1, wherein

The area of the first pad is smaller than the area of the second pad.

[Claim 5] The printed wiring board for terminal radio frequency testing according to claim 1, wherein

The first pad and the second pad together form a solid inner pad.

[Claim 6] The printed wiring board for terminal radio frequency testing according to claim 1, wherein

The outer ring pad includes a first ring pad and a second ring pad symmetrically disposed with the first ring pad, a center of the first ring pad and a center of the second ring pad Concentrically disposed, and having a first opening between the first end of the first ring pad and the corresponding first end of the second ring pad, the first ring pad A second port is formed between the two ends and the corresponding second end of the second ring pad.

[Claim 7] A printed wiring board for terminal radio frequency testing according to claim 6, wherein

The first pad is disposed opposite to the first port, and the second pad is disposed opposite to the second port.

[Claim 8] A terminal characterized by comprising the printed wiring board for terminal radio frequency test according to any one of claims 1 to 7.

[Claim 9] The terminal according to claim 8, wherein after the terminal is subjected to radio frequency testing, the second pad is pressed by the test head to detect the radio frequency signal, and The RF signal is stronger than the preset RF signal, and the first pad is fixedly connected to the second pad.

[Claim 10] The terminal according to claim 9, wherein the first pad and the second pad are fixedly connected by spot welding.