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WO2018139506A1 - Composition de polyorganosiloxane thermo-conductrice - Google Patents

Composition de polyorganosiloxane thermo-conductrice Download PDF

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Publication number
WO2018139506A1
WO2018139506A1 PCT/JP2018/002191 JP2018002191W WO2018139506A1 WO 2018139506 A1 WO2018139506 A1 WO 2018139506A1 JP 2018002191 W JP2018002191 W JP 2018002191W WO 2018139506 A1 WO2018139506 A1 WO 2018139506A1
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Prior art keywords
group
carbon atoms
thermally conductive
general formula
integer
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PCT/JP2018/002191
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English (en)
Japanese (ja)
Inventor
大悟 平川
正則 高梨
坂本　淳
Original Assignee
モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社
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Priority claimed from JP2018006199A external-priority patent/JP6383885B2/ja
Application filed by モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 filed Critical モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社
Priority to US16/481,086 priority Critical patent/US11142644B2/en
Priority to CN201880008544.9A priority patent/CN110234711B/zh
Priority to KR1020197025119A priority patent/KR102542894B1/ko
Priority to EP18745422.8A priority patent/EP3575365B1/fr
Publication of WO2018139506A1 publication Critical patent/WO2018139506A1/fr

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    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
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    • C08G77/04—Polysiloxanes
    • C08G77/045—Polysiloxanes containing less than 25 silicon atoms
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    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
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    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
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    • C09K5/14—Solid materials, e.g. powdery or granular
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
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    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
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    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
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Definitions

  • the present invention relates to a thermally conductive polyorganosiloxane composition.
  • thermo conductive fillers such as silica powder, alumina, boron nitride, aluminum nitride, magnesium oxide are used in combination (Patent Document 1), and the thermal conductive filler is made higher. In order to fill, it is known to subject the thermally conductive filler to surface treatment (Patent Document 2).
  • JP 2002-003831 A International Publication No. 2005/030874 JP 2002-327116 A
  • An object of the present invention is to provide a thermally conductive polysiloxane composition that gives a cured product excellent in tackiness and flexibility.
  • the present invention relates to the following.
  • (D1) General formula (4): (Where R 7 is a hydrogen atom, R 8 is independently a monovalent hydrocarbon group having 1 to 12 carbon atoms that does not have an aliphatic unsaturated bond; f is 1 to 200)
  • the ratio (H D1 : H D2 ) of the number H D1 of hydrogen atoms bonded to the silicon atom of (D1) to the number of hydrogen atoms H D2 bonded to the silicon atom of ( D2 ) is 9.9: 0.
  • [5] (B) is represented by the general formula (1): (Where R 1 is a group having an alkoxysilyl group having 1 to 4 carbon atoms, R 2 is a monovalent hydrocarbon group having 6 to 18 carbon atoms or the general formula (2): (Where R 4 is independently a monovalent hydrocarbon group having 1 to 12 carbon atoms, Y is a group selected from the group consisting of a methyl group, a vinyl group, and R 1 ; d is an integer of 2 to 500)
  • a linear organosiloxy group represented by X is independently a divalent hydrocarbon group having 2 to 10 carbon atoms, a and b are each independently an integer of 1 or more; c is an integer of 0 or more, a + b + c is an integer of 4 or more, R 3 is each independently a monovalent hydrocarbon group having 1 to 6 carbon atoms or a hydrogen atom)
  • the heat conductive polysiloxane composition according to any one of [1] to [4], which is
  • thermoly conductive polysiloxane composition that gives a cured product excellent in tackiness and flexibility.
  • M unit The structural unit of the siloxane compound may be described by the following abbreviations (hereinafter, these structural units may be referred to as “M unit”, “D unit”, etc., respectively).
  • M —Si (CH 3 ) 3 O 1/2
  • MH -SiH (CH 3 ) 2 O 1/2
  • M Vi —Si (CH ⁇ CH 2 ) (CH 3 ) 2 O 1/2
  • D Si (CH 3 ) 2 O 2/2
  • DH SiH (CH 3 ) O 2/2
  • T Si (CH 3 ) O 3/2
  • Q SiO 4/2 (tetrafunctional)
  • Examples of the monovalent hydrocarbon group include an alkyl group, a cycloalkyl group, an aryl group, and an alkenyl group.
  • Examples of the monovalent hydrocarbon group having no aliphatic unsaturated bond include the monovalent hydrocarbon groups other than the alkenyl group.
  • Examples of the alkenyl group include a vinyl group, an allyl group, a 3-butenyl group, and a 5-hexenyl group.
  • alkyl group examples include methyl group, ethyl group, propyl group, butyl group, pentyl group, hexyl group, octyl group, decyl group, dodecyl group, hexadecyl group and octadecyl group.
  • cycloalkyl group examples include a cyclopentyl group and a cyclohexyl group.
  • aryl group examples include a phenyl group, a naphthyl group, a tolyl group, and a xylyl group.
  • the alkenyl group, alkyl group, cycloalkyl group and aryl group may be substituted with a halogen such as chlorine, fluorine or bromine.
  • thermally conductive filler is also referred to as “(A)”.
  • (E) platinum catalyst and the like.
  • a thermally conductive polysiloxane composition (hereinafter also simply referred to as “composition”) includes (A) a thermally conductive filler, (B) a siloxane compound having an alkoxysilyl group and a linear siloxane structure, C) a polyorganosiloxane having an alkenyl group bonded to two or more silicon atoms in one molecule, (D1) a linear polyorganohydrogensiloxane represented by the general formula (4), and (D2) a general formula (5) A polyorganohydrogensiloxane having at least three units shown in one molecule and (E) a platinum catalyst.
  • composition includes (A) a thermally conductive filler, (B) a siloxane compound having an alkoxysilyl group and a linear siloxane structure, C) a polyorganosiloxane having an alkenyl group bonded to two or more silicon atoms in one molecule, (D1) a linear polyorgano
  • the cured product of the composition is excellent in tackiness, it is extremely suppressed that the cured product of the composition is peeled off from the base material, and at the same time, it becomes easy to reattach the cured product of the composition during repair. .
  • thermally conductive filler As a heat conductive filler, generally well-known inorganic filler is illustrated, Alumina, magnesium oxide, zinc oxide, boron nitride, aluminum nitride, silica powder, silicon carbide, metal powder, diamond, water Examples include aluminum oxide and carbon. Particularly preferred are alumina, zinc oxide, aluminum nitride or silicon carbide. These inorganic fillers are not particularly limited as long as they are grades that can be used as thermally conductive fillers, and commercially available ones can be used. Moreover, as an inorganic filler, it can also be used combining multiple types which are different chemical species.
  • the thermal conductive filler is not particularly limited as long as it has an available grade, but it is preferable to use a filler having an average particle size of 300 ⁇ m or less. Among those having an average particle size in this range, when a compound having a large average particle size is blended, the filling rate cannot be increased, whereas when the average particle size is small, the viscosity tends to increase. By appropriately selecting and blending the average particle size of the conductive filler, a composition having a viscosity suitable for the purpose can be obtained.
  • a filler having a relatively large particle size and a filler having a relatively small particle size in combination with the thermally conductive filler.
  • a filler having a plurality of types of particle sizes in combination a filler having a relatively small particle size enters the gap between the fillers having a relatively large particle size, thereby enabling higher filling.
  • their blending ratio can be arbitrary.
  • the shape of the inorganic particles used for the heat conductive filler is not particularly limited.
  • any of spherical, round, and irregular shaped particles can be used, and at least two of them can be used in combination.
  • the average particle size when the shape of the inorganic particles is round or irregular is defined by a method known to those skilled in the art.
  • the average particle diameter can be obtained as a weight average value (or median diameter) or the like using, for example, a particle size distribution measuring apparatus such as a laser light diffraction method.
  • the composition contains a siloxane compound having an alkoxysilyl group and a linear siloxane structure as the surface treatment agent (A).
  • the molecular structure of (B) is not particularly limited and is linear, branched or cyclic, but is preferably cyclic.
  • general formula (1) (Wherein R 1 , R 2 , R 3 , X, a, b, and c are as defined above).
  • the unit containing R 1 , the unit containing R 2, and the unit represented by SiR 3 2 O must be arranged as shown in the general formula (1).
  • a unit represented by SiR 3 2 O may exist between a unit containing R 1 and a unit containing R 2 .
  • the siloxane compound represented by the general formula (1) can introduce a large number of hydrolyzable groups into the cyclic structure, and further, it is concentrated in position, so that the processing efficiency of the heat conductive filler is high. Therefore, it is considered that higher filling is possible.
  • the siloxane compound itself represented by the general formula (1) has high heat resistance, high heat resistance can be imparted to the composition.
  • R 1 is a hydrolyzable functional group containing an alkoxysilyl group having 1 to 4 carbon atoms, and more specifically, a group having the following structure is exemplified.
  • R 1 may be directly bonded to X with silicon, but may be bonded to a linking group such as an ester bond. More specifically, examples of R 1 include groups having the following structures.
  • R 1 is preferably a group having a structure having two or more, particularly three, alkoxysilyl groups, from the viewpoint that the processing efficiency of the heat conductive filler tends to be further improved. From the viewpoint it is easy to obtain a raw material, R 1 is preferably contains a methoxy silyl group.
  • R 2 is a monovalent hydrocarbon group having 6 to 18 carbon atoms or the general formula (2): (Wherein R 4 , Y and d are as defined above).
  • R 2 is a monovalent hydrocarbon group having 6 to 18 carbon atoms
  • an alkyl group having 6 to 18 carbon atoms is preferable, and an alkyl group having 6 to 14 carbon atoms is particularly preferable.
  • R 2 preferably has 6 or more carbon atoms in the longest carbon chain portion in the alkyl group, and in this case, it may have a branched structure as long as the total carbon number is within the above range. By making the number of carbons within this range, the effect on fluidity is enhanced and high blending is possible. Moreover, it is easy to handle and is easily dispersed uniformly.
  • R 2 is a linear triorganosiloxy group represented by the general formula (2)
  • d is the 2-500 integer, preferably an integer from 4 to 400 and more preferably from 10 to 200 integer, more preferably 10 An integer of ⁇ 100, particularly preferably an integer of 10 to 50.
  • R 4 is independently a monovalent hydrocarbon group having 1 to 12 carbon atoms, preferably an alkyl group having 1 to 12 carbon atoms or an aryl group having 6 to 12 carbon atoms. In view of easy synthesis, R 4 is particularly preferably a methyl group.
  • Y is a group selected from the group consisting of a methyl group, a vinyl group, and R 1 . Since synthesis is easy, Y is preferably a methyl group or a vinyl group.
  • R 2 is a straight chain represented by the general formula (2) because there is a tendency to obtain an excellent handling property such as increasing the affinity by lowering the viscosity of the composition by mediating the heat conductive filler and the base polymer. It is preferably an organosiloxy group.
  • X is a linking group that binds R 1 and R 2 to the cyclic siloxane portion of the siloxane represented by the general formula (1).
  • X is a divalent hydrocarbon group having 2 to 10 carbon atoms, —CH 2 CH 2 —, —CH 2 CH 2 CH 2 —, —CH 2 CH 2 CH 2 CH 2 CH 2 CH 2 —, — An alkylene group having 2 to 10 carbon atoms such as CH 2 CH (CH 3 ) — and —CH 2 CH (CH 3 ) CH 2 — is preferred. From the viewpoint of easy synthesis, X is particularly preferably —CH 2 CH 2 — or —CH 2 CH (CH 3 ) —.
  • R 3 is independently a monovalent hydrocarbon group having 1 to 6 carbon atoms or a hydrogen atom.
  • the monovalent hydrocarbon group having 1 to 6 carbon atoms is preferably an alkyl group having 1 to 6 carbon atoms.
  • R 3 is particularly preferably a methyl group or a hydrogen atom.
  • A is an integer of 1 or more, preferably 1.
  • b is an integer of 1 or more, and preferably 1 or 2.
  • c is an integer of 0 or more, preferably 0-2.
  • the sum of a + b + c is an integer of 4 or more, but is preferably 4 because synthesis is easy.
  • the siloxane compound represented by the general formula (1) is preferably a compound represented by the following structural formula.
  • (C) Polyorganosiloxane having an alkenyl group bonded to two or more silicon atoms in one molecule (C) A polyorganosiloxane having an alkenyl group bonded to two or more silicon atoms in one molecule is a base polymer. When the number of alkenyl groups bonded to the silicon atom is less than 2, the resulting composition is not sufficiently cured. Note that (C) does not have a hydrogen atom bonded to a silicon atom and an alkoxysilyl group. That is, (C) is not (B) and (D2).
  • alkenyl group examples include alkenyl groups having 2 to 6 carbon atoms, and a vinyl group is preferable from the viewpoint of easy preparation.
  • the alkenyl group may be bonded to either the end of the molecular chain or in the middle, but it is preferable to bond to both ends of the molecular chain from the viewpoint of obtaining a cured product having excellent flexibility.
  • Examples of the group bonded to the silicon atom other than the alkenyl group include monovalent hydrocarbon groups having 1 to 12 carbon atoms that do not have an aliphatic unsaturated bond.
  • hydrocarbon group having 1 to 12 carbon atoms having no aliphatic unsaturated bond an alkyl group having 1 to 12 carbon atoms, an aryl group having 6 to 12 carbon atoms, or a cycloalkyl group having 3 to 12 carbon atoms is preferable.
  • a methyl group or a phenyl group is particularly preferred.
  • (C) is linear or branched and is preferably linear.
  • R 6 has the same meaning as R 4 .
  • R 5 is preferably a vinyl group and R 6 is preferably a methyl group.
  • (C) is particularly preferably polymethylvinylsiloxane in which both ends are blocked with dimethylvinylsiloxane units and the intermediate unit is composed of dimethylsiloxane units.
  • the viscosity of (C) is 0.01 to 50 Pa ⁇ s at 23 ° C. from the viewpoint of excellent workability (viscosity and extrudability) as a composition, and a cured product excellent in flexibility. It is preferably 02 to 20 Pa ⁇ s, particularly preferably 0.05 to 10 Pa ⁇ s. It is preferable to adjust the weight average molecular weight of (C) so as to be in these viscosity ranges.
  • the viscosity is a value measured under the condition of 23 ° C. using a B-type rotational viscometer.
  • the rotor No. 1-No. 4 and the rotation speed includes 12, 30, and 60 rpm.
  • the kind and rotation speed of a rotor can be suitably selected according to the viscosity of a measuring object.
  • (D1) linear polyorganohydrogensiloxane (D1)
  • the linear polyorganohydrogensiloxane has the general formula (4): (Wherein R 7 , R 8 and f are as defined above).
  • the hydrogen atom bonded to the silicon atom of (D1) and (D2) contributes as a crosslinking agent that performs a hydrosilyl reaction with the alkenyl group in (C).
  • the number of f is in the range of 1 to 200, preferably in the range of 5 to 100, more preferably in the range of 10 to 50.
  • R 8 is a monovalent hydrocarbon group having 1 to 12 carbon atoms that does not have an aliphatic unsaturated bond, and is preferably an alkyl group having 1 to 12 carbon atoms or an aryl group having 6 to 12 carbon atoms. In view of easy synthesis, R 8 is particularly preferably a methyl group.
  • (D2) consists of R 11 2 HSiO 1/2 units (wherein R 11 is as defined above) and SiO 4/2 units, Further, polyorganohydrogensiloxane having 3 or more hydrogen atoms bonded to silicon atoms is preferable.
  • the content of hydrogen atoms bonded to silicon in (D2) is not particularly limited, but is preferably 0.1 to 1.2% by weight, particularly preferably 0.5 to 1.1% by weight. .
  • the content of the hydrogen atom bonded to silicon of (D2) is 0.1% by weight or more, even when the content of (D2) is smaller, the thermal conductivity can be further increased.
  • the molecular weight of (D2) is not particularly limited, but is preferably 330 to 50,000, particularly preferably 500 to 10,000. When the molecular weight of (D2) is 330 or more, the crosslinking density does not become too high, whereby a cured product that is superior in flexibility is obtained, and when it is 50,000 or less, the workability of the composition is excellent.
  • the molecular weight is a polystyrene-equivalent number average molecular weight measured by gel permeation chromatography.
  • the ratio of the R 11 2 HSiO 1/2 unit and the SiO 4/2 unit can be appropriately adjusted so as to obtain the content and molecular weight of the hydrogen atom bonded to silicon.
  • the platinum catalyst is a curing catalyst for obtaining a cured product by reacting the unsaturated group of (C) with the hydrogen atom bonded to silicon of (D).
  • the platinum catalyst include chloroplatinic acid, platinum olefin complex, platinum vinylsiloxane complex, platinum phosphorus complex, platinum alcohol complex, platinum black and the like.
  • the activity of the catalyst can be suppressed by adding (F) a reaction inhibitor.
  • Known reaction inhibitors for platinum catalysts include acetylene alcohols such as 2-methyl-3-butyn-2-ol and 1-ethynyl-2-cyclohexanol, and diallyl maleate.
  • composition The content of each component in the composition is as follows.
  • the content of (A) is preferably 10 to 5,000 parts by mass, and 50 to 4,000 parts by mass with respect to 100 parts by mass in total of (B), (C), (D1) and (D2). Part is more preferable, and 100 to 3,000 parts by mass is particularly preferable. By setting it as such a range, thermal conductivity increases more.
  • the content of (B) is preferably 0.01 to 20 parts by mass, particularly preferably 0.1 to 15 parts by mass with respect to 100 parts by mass of (A). By making the quantity of (B) into this range, heat conductivity can be made higher, improving the filling property of a heat conductive filler. Further, the content of (B) is preferably 0.01 parts by mass or more, and 0.1 to 500 parts by mass with respect to 100 parts by mass of (C), (D1) and (D2). Is particularly preferred. When the amount of (B) is 0.01 parts by mass or more with respect to 100 parts by mass of (C), (D1) and (D2), the surface treatment effect of the thermally conductive filler is sufficiently exerted ( A) can be blended higher. When the amount of (B) is 500 parts by mass or less with respect to 100 parts by mass of (C), (D1), and (D2), the mechanical properties and / or heat resistance after curing is improved.
  • the content of (C) can be appropriately set according to the thermal conductivity required for the composition, but (A) is preferably 1 to 30 parts by mass with respect to 100 parts by mass, and 3 to 20 parts by mass. More preferably, it is a part.
  • the content of (E) is preferably 0.1 to 1,000 ppm as platinum element with respect to the alkenyl group-containing polyorganosiloxane of (C). In such a range, the curability and the curing speed are sufficient.
  • the contents of (C), (D1) and (D2) can be appropriately set according to the thermal conductivity required for the composition, but the silicon of (D1) relative to the number of alkenyl groups Vi C of (C) the ratio of the sum in which the number of bound to atoms and the number H D1 hydrogen atoms to the number H D2 of the hydrogen atoms bonded to silicon atoms (D2) (H D1 + H D2) ((H D1 + H D2) / Vi C ) Is preferably less than 1.50.
  • (H D1 + H D2) / Vi C is less than 1.50, the elongation of the cured product becomes higher, also tackiness more excellent.
  • (H D1 + H D2 ) / Vi C is preferably 1.20 or less, more preferably 1.10 or less, still more preferably 0.90 or less, and 0.80 or less. Is particularly preferred.
  • (H D1 + H D2 ) / Vi C is not particularly limited, but is preferably 0.60 or more, more preferably 0.70 or more, and particularly preferably 0.80 or more.
  • the ratio (H D1 : H D2 ) of the number H D1 of hydrogen atoms bonded to the silicon atom (D1) to the number H D2 of hydrogen atoms bonded to the silicon atom ( D2 ) is not particularly limited. It is preferably 9: 0.1 to 1: 9, and more preferably 9: 1 to 5: 5. Within such a range, the elongation of the cured product of the composition becomes higher and the tackiness is better.
  • (B), (C), (D1) and (D2), and (A) may be prepared as they are using a kneading apparatus, or (B) After (A) is first mixed and surface-treated, it may be dispersed and prepared in (C), (D1) and (D2). Moreover, you may implement the process by a heating, pressure reduction, or another well-known method as needed. Moreover, the mixture which mix
  • a pigment, a flame retardant, an adhesion-imparting agent, a heat-imparting agent, a diluent, an organic solvent and the like known to those skilled in the art may be appropriately blended as necessary, as long as the effects of the present invention are not impaired. it can. Since the cured product of the composition has high elongation, it has excellent followability to deformation (for example, bending) of the base material when an adhesion-imparting agent is added as an optional component.
  • the composition can be cured at room temperature or by applying heat.
  • Conditions for thermosetting are known to those skilled in the art, but examples of equipment that can be used for the curing reaction by heat include apparatuses known to those skilled in the art such as a thermostatic bath.
  • the heating conditions can be appropriately adjusted according to the heat resistant temperature of the member to which the composition is applied, and the curing time can be determined. For example, heat of room temperature (23 ° C.) to 120 ° C. or less can be applied in the range of 1 minute to 5 hours.
  • the heating temperature is preferably 40 to 120 ° C., more preferably 50 to 110 ° C., and particularly preferably 60 to 100 ° C. from the viewpoint of operability.
  • the heating time is preferably 5 minutes to 72 hours, more preferably 5 minutes to 3 hours, and particularly preferably 10 minutes to 2 hours, from the viewpoint of simplicity of the curing step. Moreover, when making it harden
  • Silicone rubber obtained by curing the composition can be used as a heat radiating member for electronic parts such as electronic devices and integrated circuit elements.
  • Examples 1 to 15, Comparative Examples 1 to 3 The materials used in Examples and Comparative Examples are as follows.
  • AL43KT Polygonal alumina having an average particle size of 4.6 ⁇ m (manufactured by Showa Denko KK)
  • AL160SG-4 Easily sinterable alumina with an average particle size of 0.55 ⁇ m (manufactured by Showa Denko KK)
  • Silazane-treated silica silica obtained by treating fumed silica (AEROSIL 200: manufactured by Nippon Aerosil Co., Ltd.) with an average particle size of 200 ⁇ m with hexamethyldisilazane
  • Viscosity The viscosity of the composition is determined according to JIS K6249 using a B-type rotational viscometer (Bismetron VDH) (manufactured by Shibaura System Co., Ltd.). Using 7 rotors, measurement was performed at 10 rpm for 1 minute under the conditions at 23 ° C.
  • Second Hardness The composition was filled in a 6 mm-thick mold and cured by heating at 70 ° C. for 30 minutes. The hardness (Type E hardness) of the cured product of the composition was measured according to JIS K6249.
  • the results are shown in Tables 1 to 3.
  • the amount of platinum catalyst in the table is a platinum element equivalent amount.

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Abstract

L'invention concerne une composition de polysiloxane thermo-conductrice fournissant un article durci excellent en termes de tendance au collant et de flexibilité. Cette composition de polysiloxane thermo-conductrice contient (A) une charge thermoconductrice, (B) un composé siloxane possédant un groupe alcoxysilyle et une structure siloxane à chaîne droite, (C) un polyorganosiloxane possédant un groupe alcényle lié à deux atomes de silicium ou plus dans chaque molécule, (D1) un polyorganosiloxane à chaîne droite représenté par la formule générale (4), (D2) un polyorganohydrogénosiloxane possédant dans chaque molécule au moins trois unités représentées par la formule générale (5), et (E) un catalyseur au platine.
PCT/JP2018/002191 2017-01-27 2018-01-25 Composition de polyorganosiloxane thermo-conductrice WO2018139506A1 (fr)

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US16/481,086 US11142644B2 (en) 2017-01-27 2018-01-25 Thermally conductive polyorganosiloxane composition
CN201880008544.9A CN110234711B (zh) 2017-01-27 2018-01-25 导热性聚硅氧烷组合物
KR1020197025119A KR102542894B1 (ko) 2017-01-27 2018-01-25 열전도성 폴리오르가노실록산 조성물
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CN111393855A (zh) * 2020-03-18 2020-07-10 平湖阿莱德实业有限公司 一种具有优异耐候性的高导热凝胶组合物

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