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WO2018113709A1 - 具有高度差的阵列摄像模组和线路板组件及其制造方法和电子设备 - Google Patents

具有高度差的阵列摄像模组和线路板组件及其制造方法和电子设备 Download PDF

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Publication number
WO2018113709A1
WO2018113709A1 PCT/CN2017/117579 CN2017117579W WO2018113709A1 WO 2018113709 A1 WO2018113709 A1 WO 2018113709A1 CN 2017117579 W CN2017117579 W CN 2017117579W WO 2018113709 A1 WO2018113709 A1 WO 2018113709A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
camera module
base
array camera
photosensitive
Prior art date
Application number
PCT/CN2017/117579
Other languages
English (en)
French (fr)
Inventor
王明珠
田中武彦
陈振宇
郭楠
赵波杰
梅哲文
Original Assignee
宁波舜宇光电信息有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 宁波舜宇光电信息有限公司 filed Critical 宁波舜宇光电信息有限公司
Priority to JP2019531165A priority Critical patent/JP6968884B2/ja
Priority to CN201780078562.XA priority patent/CN110089105B/zh
Priority to KR1020217008187A priority patent/KR102321744B1/ko
Priority to US16/471,114 priority patent/US11128787B2/en
Priority to EP17883452.9A priority patent/EP3544284B1/en
Priority to EP21190707.6A priority patent/EP3985962B1/en
Priority to KR1020197020268A priority patent/KR102233311B1/ko
Publication of WO2018113709A1 publication Critical patent/WO2018113709A1/zh
Priority to US17/404,633 priority patent/US11601576B2/en

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Classifications

    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/45Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from two or more image sensors being of different type or operating in different modes, e.g. with a CMOS sensor for moving images in combination with a charge-coupled device [CCD] for still images
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00Details of cameras or camera bodies; Accessories therefor
    • G03B17/02Bodies
    • G03B17/12Bodies with means for supporting objectives, supplementary lenses, filters, masks, or turrets
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50Constructional details
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50Constructional details
    • H04N23/54Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50Constructional details
    • H04N23/55Optical parts specially adapted for electronic image sensors; Mounting thereof
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/90Arrangement of cameras or camera modules, e.g. multiple cameras in TV studios or sports stadiums
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04MTELEPHONIC COMMUNICATION
    • H04M1/00Substation equipment, e.g. for use by subscribers
    • H04M1/02Constructional features of telephone sets
    • H04M1/0202Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026Details of the structure or mounting of specific components
    • H04M1/0264Details of the structure or mounting of specific components for a camera module assembly

Definitions

  • the present invention relates to the field of camera modules, and further relates to an array camera module and a circuit board assembly having a height difference, a manufacturing method thereof and an electronic device.
  • the dual camera can capture images with the cooperation of two cameras, enabling a richer image acquisition function.
  • the existing dual cameras can be divided into two categories according to their functions: one is to use three cameras to generate stereo vision, to obtain the depth of field of the image, to use the depth of field information for background blur, 3D scanning, auxiliary focus, motion recognition, etc., or to utilize The information of the two pictures is fused; the other type is to use two different pictures on the left and right to achieve better resolution, better color, dynamic range and other better image quality or optical zoom function. .
  • the two cameras that make up the dual camera are typically two different types of cameras, such as one for imaging and one for recording depth of field.
  • the requirements of this different function usually make the size of the two cameras different, such as the height, and how to stably combine the two cameras of different heights to make it a whole, which is encountered in the development of the dual camera module. Another important issue.
  • the external needs to be kept flat, and the appearance of the two cameras is beautiful, so the outer end faces of the two cameras are also required to be uniform in height.
  • two mutually matched cameras respectively collect image information, and the accuracy of the image acquisition and the image quality are closely related to the incident light of the two cameras, and the optical axis consistency between the two cameras ensures the imaging quality of the camera module.
  • Foundation That is to say, how to improve the optical axis consistency of the two camera modules on the basis of stably and compactly fixing two cameras, or to make the error within a predetermined range, thereby improving the precision of the installation and making it more accurate Good image quality is another important issue to consider for the development of dual cameras.
  • the first two types of dual camera functions have different requirements on the hardware of the camera.
  • the former requires a larger spacing between the two cameras, so that higher depth of field precision can be obtained, so the former hardware hopes the distance between the two cameras.
  • the latter is better than the latter; the latter requires two cameras to be superimposed and combined, so in the hardware design, I hope that the two cameras are close together, so that when the two images are merged, there will be no more errors due to the difference. . That is to say, the control of the distance between the two cameras is a consideration for realizing different functions of the camera.
  • An object of the present invention is to provide an array camera module and a circuit board assembly having a height difference, a manufacturing method thereof and an electronic device, wherein the array camera module includes at least two camera module units of different heights, and two The outer end surface of the camera module unit has a high flatness, which satisfies the optical cooperation requirements of the two camera module units.
  • An object of the present invention is to provide an array camera module and a circuit board assembly having a height difference, a manufacturing method thereof and an electronic device, wherein the outer end faces of the array camera module are uniform, and the surface of the electronic device to be mounted is flat. Sexual requirements.
  • An object of the present invention is to provide an array camera module and a circuit board assembly having a height difference, a manufacturing method thereof and an electronic device, wherein the array camera module has a height difference space, which is located at the bottom of the array module The side, so that the bottom side of the array camera module has a height difference, which can provide more installation space for the camera module itself and other electronic devices.
  • An object of the present invention is to provide an array camera module and a circuit board assembly having a height difference, a manufacturing method thereof and an electronic device, wherein the array camera module includes a first pedestal, and at least two camera modules The units are connected stably and with a height difference, so that no external parts are required to supplement the height difference.
  • An object of the present invention is to provide an array camera module and a circuit board assembly having a height difference, a manufacturing method thereof and an electronic device, wherein at least two of the camera module units are camera modules of different functions.
  • An object of the present invention is to provide a camera module having a height difference and a method for manufacturing the same, wherein the first base includes a first base body and an extension, and the first base body is fixed to the first base
  • the first circuit board extends integrally from the first base body to provide a support and fixed position for a second circuit board, so that the two camera module units are fixedly connected.
  • An object of the present invention is to provide an array camera module and a circuit board assembly having a height difference, a manufacturing method thereof and an electronic device, wherein the first pedestal is manufactured by one molding, and has good surface flatness, thereby Improve the assembly accuracy of the mounting components.
  • An object of the present invention is to provide an array camera module and a circuit board assembly having a height difference, a manufacturing method thereof and an electronic device, wherein the first base provides a flat mounting plane for the second camera module unit, so that two The optical axes of the camera module units are the same.
  • An object of the present invention is to provide an array camera module and a circuit board assembly having a height difference, a manufacturing method thereof and an electronic device.
  • the second circuit board is mounted on the first base. The extension, such that the extension provides a flat mounting condition for the second circuit board.
  • An object of the present invention is to provide an array camera module and a circuit board assembly having a height difference, a manufacturing method thereof and an electronic device, wherein in some embodiments, the second circuit board is embedded in the first base Thereby reducing the height of the second camera module unit and reducing the installation process of the second circuit board.
  • An object of the present invention is to provide an array camera module and a circuit board assembly having a height difference, a manufacturing method thereof and an electronic device, wherein the first pedestal forms a first light window, which is the camera module unit A photosensitive element provides a light path.
  • An object of the present invention is to provide an array camera module and a circuit board assembly having a height difference, a manufacturing method thereof and an electronic device, wherein the array camera module includes at least one seat, and the holder is mounted on the A pedestal for mounting a filter element.
  • An object of the present invention is to provide an array camera module and a circuit board assembly having a height difference, a manufacturing method thereof and an electronic device.
  • the holder is directly mounted on the second circuit board. In order to support the mounting of the filter element directly by the support.
  • An object of the present invention is to provide an array camera module and a circuit board assembly having a height difference, a manufacturing method thereof and an electronic device, wherein the array camera module includes at least one supplementary support, and the supplementary support cooperates with the The first pedestal forms a light window that provides a light path for a photosensitive element.
  • An object of the present invention is to provide an array camera module and a circuit board assembly having a height difference, a manufacturing method thereof and an electronic device, wherein the circuit board comprises a circuit board body and at least one electronic component, the first base The electronic component is covered, thereby reducing the space occupied by the electronic component, so that the array camera module is more compact.
  • an aspect of the present invention provides an array camera module, comprising: at least two camera module units, the outer ends of the two array camera units are of uniform height, and a height difference is formed at the bottom.
  • the array camera module is a first camera module unit and a second camera module unit, wherein the first camera module unit includes at least one a first photosensitive member and at least one lens, the lens being located in a photosensitive path of the first photosensitive member, the first photosensitive assembly including an extension portion at least partially away from the photosensitive member
  • the second camera module unit is fixedly connected to the extension portion, so that the first camera module unit and the second camera module unit end are fixedly connected in a uniform manner.
  • the first photosensitive component comprises a first circuit board and a first base
  • the first base comprises a base body
  • the base body is integrated Formed on the first circuit board
  • the extension extends at least partially integrally outward from the base, and the extension has a height difference from the first circuit board.
  • the first photosensitive component comprises a first photosensitive element
  • the first base body forms a first light window
  • the first photosensitive element is disposed in the Within the first light window to facilitate light sensing.
  • the second camera module unit comprises a second circuit board, a second photosensitive element, and a first lens
  • the second photosensitive element is electrically connected to the a second circuit board
  • the second circuit board is disposed on the extension portion
  • the lens is located in a photosensitive path of the second photosensitive element.
  • the second circuit board has a lower counterbore, and the second circuit board is disposed on the sink hole and supported by the extension.
  • the second camera module unit comprises a second base, and the second base is integrally formed on the second circuit board.
  • the array camera module of some embodiments wherein the second base is integrally connected to the first base.
  • An aspect of the present invention provides an array camera module including at least two camera module units, and a bottom portion of the two camera module units forms a height difference.
  • the two camera module units are a first camera module unit and a second camera module unit, wherein the first camera module unit includes at least one first photosensitive component and at least one a lens, the first lens is located in a photosensitive path of the first photosensitive component, and the first photosensitive component includes at least one extension, the extension extending at least partially away from the first photosensitive component,
  • the second camera module unit is fixedly connected to the second extension.
  • the first photosensitive member includes a first circuit board, a first photosensitive element, and a first base, wherein the first base includes a first base body and the extension.
  • the first base body is integrally formed on the first circuit board to form a first light window, and provides a light path for the first photosensitive element, and the extension is at least partially integrated from the first base body. Extending outwardly, the extension portion forms the height difference with the first circuit board, and the first photosensitive element is electrically connected to the one circuit board.
  • the extension portion has a support surface extending away from the first camera module unit, and the second camera module includes a second photosensitive component and a second lens.
  • the second lens is located in a photosensitive path of the second photosensitive component, and the second photosensitive component is supported and fixed to the second supporting surface.
  • the second photosensitive component is mounted and fixed to the support surface.
  • the second photosensitive component comprises a second circuit board, a second photosensitive element and a second base, the second photosensitive element is electrically connected to the second circuit board, the second Forming a pedestal integrally formed on the second circuit board to form a second light window, providing a light path for the second photosensitive element, wherein the second circuit board is supported and fixed to the second support surface of the extending portion .
  • the two camera module units are a first camera module unit and a second camera module unit, wherein the first camera module unit includes at least one first photosensitive component and at least one a lens, the first lens is located in a photosensitive path of the first photosensitive component, the first photosensitive component includes at least one support plate, the support plate extends away from the first photosensitive component, the first The two camera module units are fixedly connected to the support plate.
  • the first photosensitive component comprises a first circuit board, a first photosensitive element and a first base
  • the first photosensitive element is electrically connected to the circuit board
  • the first base The seat is integrally formed on the first circuit board to form a light window, and provides a light path for the first photosensitive element, and the support plate is fixed to the first base.
  • the support plate has a through hole that communicates with the first light window to provide a light path for the photosensitive element.
  • the second photosensitive component comprises a second circuit board, a second photosensitive element and a second base
  • the second photosensitive element is electrically connected to the second circuit board
  • the second The base is integrally formed on the second circuit board to form a second light window
  • the second circuit board is supported and fixed on a top surface of the support board.
  • the first base has a first mounting slot that communicates with the first light window to provide a mounting position.
  • the first camera module unit includes a first mount, and the first mount is mounted to the first mounting slot to facilitate providing a mounting position.
  • the second base has a second mounting slot that communicates with the second light window to provide a mounting position.
  • the second camera module unit includes a second mount, and the second mount is mounted to the second mounting slot to facilitate providing a mounting position.
  • the first photosensitive element is mounted on the first wiring board, and the first pedestal is located on a periphery of the first photosensitive element.
  • the first photosensitive element is mounted on the first wiring board, and the first base is integrally formed on at least a portion of the first photosensitive element.
  • the first photosensitive element is electrically connected to the first wiring board by at least one first electrical connection element, and the first base covers the first electrical connection element.
  • the second photosensitive element is mounted on the second wiring board, and the second susceptor is located on a periphery of the second photosensitive element.
  • the second photosensitive element is mounted to the second wiring board, and the second base is integrally formed to at least a portion of the second photosensitive element.
  • the second photosensitive element is electrically connected to the second wiring board by at least one second electrical connection element, and the second base covers the second electrical connection element.
  • the first circuit board includes a first circuit board body and at least one first electronic component, the first electronic component is electrically connected to the first circuit board body, and the first base is integrated Formed on the first circuit board body to cover the first electronic component.
  • the second circuit board includes a second circuit board body and at least one second electronic component, the second electronic component is electrically connected to the second circuit board body, and the second base is integrated Formed on the second circuit board body to cover the second electronic component.
  • the second wiring board has a lower counterbore, and the second photosensitive element is disposed at the sinking hole.
  • the sinker holes communicate with both sides of the second circuit board such that the photosensitive element is directly disposed at the second extension.
  • the second wiring board has a lower counterbore, and the second photosensitive element is disposed at the sinking hole.
  • the sinker holes communicate with both sides of the second circuit board such that the photosensitive elements are directly disposed on the support plate.
  • the second photosensitive component comprises a second circuit board, a second photosensitive element and a second support, the second photosensitive element is electrically connected to the second circuit board, the second The holder is mounted to the second circuit board, and the second circuit board is supported and fixed to the second support surface of the extension.
  • the second holder has a light-passing hole and a escaping space
  • the light-passing hole provides a light path for the second photosensitive element
  • the escaping space is connected to the light-passing hole to avoid The second photosensitive element.
  • the first camera module unit includes a first supplemental base, the first base has a first gap, and the supplemental base is supplemented by the first base A gap forms a closed first light window.
  • the second camera module unit includes a second supplemental base, the second base has a second gap, and the supplemental base is supplemented by the second base Two notches form a closed second light window.
  • the first base includes a first support member for supporting the mold when the first base is formed by a mold.
  • the first support element is a glue coating or a pad.
  • the second base includes a second support member for supporting the mold when the second base is formed by a mold.
  • the second support element is a glue coating or a pad.
  • the first base body sidewall has an angle of inclination.
  • the second base sidewall has an angle of inclination.
  • the first camera module unit includes a first filter element, and the first filter element is integrally fixed to the first base.
  • the second camera module unit includes a second filter element, and the second filter element is integrally fixed to the second base.
  • the first camera module unit includes a support member and at least one lens, the lens is supported by the support member, and the lens is integrally fixed to the first base.
  • the second camera module unit includes a support member and at least one lens, the lens is supported by the support member, and the lens is integrally fixed to the second base.
  • the integrally formed manner is selected from one of molding and molding.
  • the first camera module unit includes a first filter element, and the first filter element is mounted to the first mounting slot.
  • the second camera module unit includes a second filter element, and the second filter element is mounted to the second mounting slot.
  • the first camera module unit includes a first lens support member, the first lens is mounted to the first lens support member, and the first lens support member is at least partially mounted to The first pedestal.
  • the first lens support element is a mirror base element such that the first camera module unit constitutes a fixed focus camera module.
  • the first lens supporting component is a driving component, such that the first camera module unit constitutes a moving focus camera module.
  • the second camera module unit includes a second lens support member, the second lens is mounted to the second lens support member, and the second lens support member is at least partially mounted to The second pedestal.
  • the second lens support member is a mirror mount member such that the second camera module unit constitutes a fixed focus camera module.
  • the second lens supporting component is a driving component, such that the second camera module unit constitutes a moving focus camera module.
  • an array camera module circuit board assembly including: a first circuit board; a second circuit board; and a first base, the first base including a base body and An extension portion, the base body is integrally formed on the first circuit board to form a first light window, and provides a light path for a first photosensitive element, and the extension portion is at least partially integrated from the base body
  • the outer extension forms a height difference with the first circuit board, and the second circuit board is disposed at the extension.
  • the circuit board assembly includes a second holder and a photosensitive member, the second holder and the second photosensitive member are mounted to the second circuit board, the second holder
  • the light passing hole and the escaping space provide a light path for the second photosensitive element, and the escaping space communicates with the light passing hole to avoid the second photosensitive element.
  • an array camera module circuit board assembly including:
  • first pedestal integrally formed on the first circuit board to form a first light window, providing a light path for a first photosensitive element
  • the support plate is fixed to the first base, and the support plate extends away from the first base to form a height difference from the first circuit board, the second line A plate is disposed on the support plate.
  • an array camera module circuit board assembly including:
  • the first base includes a base body and an extension
  • the base body is integrally formed on the first circuit board to form a first light window, and is provided for a first photosensitive element a light path
  • the extension portion extending at least partially integrally outward from the base body such that a bottom surface coincides with a bottom surface of the first circuit board, and the second circuit board is disposed on a top surface of the extension portion.
  • Another aspect of the present invention provides an electronic device, including:
  • the electronic device body is disposed on the electronic device body to obtain image information of the array camera module.
  • Another aspect of the present invention provides the electronic device body selected from the group consisting of: a smart phone, a wearable device, a tablet computer, a notebook computer, an electronic book, a personal digital assistant, a camera, and a monitoring device.
  • An aspect of the invention provides a circuit board assembly for an array of camera modules, including:
  • the first base includes a first base body and an extension, the first base body integrally formed on the first circuit board to form a first light window, the extension Opening a height difference from the first base body at least partially away from the first base body and forming a height difference from the bottom surface of the first circuit board, wherein the second circuit board is integrally formed and fixed to the Extension.
  • the second circuit board has at least one second electrical connection region, the second electrical connection region being exposed on the extension surface.
  • the circuit board assembly includes a second photosensitive element supported by the extension and electrically connected to the second electrical connection region of the second wiring board.
  • the circuit board assembly includes a second photosensitive element, the second photosensitive element is mounted on the second circuit board, and electrically connects the second electrical connection of the second circuit board Area.
  • the second circuit board has four sides of the second electrical connection regions, respectively disposed on opposite sides, so that four of the second electrical connection regions are electrically connected to a second photosensitive element.
  • the circuit board assembly includes a connection board electrically connecting the first circuit board and the second circuit board.
  • the first base includes an extended mounting portion extending at least partially upward from the base body to form a first limiting slot for mounting a first lens or a first lens support. element.
  • the circuit board assembly includes a second base, the second base includes a second base body and has a second light window, the second base body is integrally connected to The first pedestal and the second light window are configured to provide a light path for a second photosensitive element.
  • the second base includes a second extension mounting portion, and the extension mounting portion extends at least partially upward from the second base body to form a second limiting slot for mounting a a second lens or a second lens support member.
  • the circuit board assembly includes a first supplementary base, the first base body of the first base has a first notch, and the first supplementary base is limited to the The first gap is such that the first light window is closed.
  • the circuit board assembly includes a second supplementary base, and the second base body of the second base has a second notch, and the second supplementary base is limited to the The second gap is made such that the second light window is closed.
  • the circuit board assembly includes a second base, the second base is integrally formed with the second circuit board, and the second base is integrally connected to the first base.
  • the first base has a first mounting slot, and the mounting slot communicates with the first light window to provide a mounting position
  • the circuit board assembly includes a first mount that is mounted to the first mounting slot to facilitate providing a mounting position.
  • the second base has a second mounting slot that communicates with the second light window to provide a mounting position.
  • the circuit board assembly includes a second mount that is mounted to the second mounting slot to facilitate providing a mounting position.
  • the circuit board assembly includes a first photosensitive element that is mounted to the first wiring board, the first pedestal being located at a periphery of the first photosensitive element.
  • the circuit board assembly includes a first photosensitive element, the first photosensitive element is mounted on the first circuit board, and the first base is integrally formed on at least a portion of the first photosensitive element.
  • the first photosensitive element is electrically connected to the first wiring board by at least one first electrical connection element, and the first base covers the first electrical connection element.
  • the second pedestal is located at a periphery of the second photosensitive element.
  • the second base is integrally formed on at least a portion of the second photosensitive element.
  • the second photosensitive element is electrically connected to the second wiring board by at least one second electrical connection element, and the second base covers the second electrical connection element.
  • the first circuit board includes a first circuit board body and at least one first electronic component, the first electronic component is electrically connected to the first circuit board body, and the first base is integrated Formed on the first circuit board body to cover the first electronic component.
  • the second circuit board includes a second circuit board body and at least one second electronic component, the second electronic component is electrically connected to the second circuit board body, and the second base is integrated Formed on the second circuit board body to cover the second electronic component.
  • the second wiring board has a lower counterbore, and the second photosensitive element is disposed at the sinking hole.
  • the first base includes a first support member for supporting the mold when the first base is formed by a mold.
  • the first support element is a glue coating or a pad disposed between a portion of the first pedestal and the first circuit board.
  • the second base includes a second support member for supporting the mold when the second base is formed by a mold.
  • the second support element is a glue coating or a pad disposed between a portion of the second pedestal and the second circuit board.
  • the first base body sidewall has an angle of inclination.
  • the second base sidewall has an angle of inclination.
  • the circuit board assembly includes a first filter element, the first filter element being integrally formed and fixed to the first base.
  • the circuit board assembly includes a second filter element, the second filter element being integrally formed and fixed to the second base.
  • the circuit board assembly includes a support member and at least one lens, the lens being supported by the support member, the lens being integrally formed to the first base.
  • the circuit board assembly includes a support member and at least one lens, the lens being supported by the support member, the lens being integrally formed to the second base.
  • the integrally formed manner is selected from the group consisting of: molding, molding.
  • an array camera module circuit board assembly including:
  • the first base includes a base body and an extension
  • the base body is integrally formed on the first circuit board to form a first light window, and is provided for a first photosensitive element a light path
  • the extension portion extending at least partially integrally outwardly from the base body such that a bottom surface coincides with a bottom surface of the first circuit board, and the extension portion is integrally formed on the second circuit board.
  • Another aspect of the invention provides an array circuit board assembly that includes:
  • first pedestal integrally formed on the first circuit board to form a first light window
  • the second base is integrally formed on the second circuit board to form a second light window
  • the first base is integrally connected to the second base, such that the first circuit board and The bottom of the second circuit board has a height difference.
  • the first base has a first mounting slot adapted to mount the first filter element.
  • the second base has a second mounting slot adapted to mount the second filter element.
  • the circuit board assembly includes a first support and a first second support, the first support integrally connects the second support, the first support and the second Stands are mounted to the first base and the second base, respectively, to provide a mounting position.
  • the circuit board assembly includes a first supplementary base, the first base body of the first base has a first notch, and the first supplementary base is limited to the The first gap is such that the first light window is closed.
  • the circuit board assembly includes a second supplementary base, and the second base body of the second base has a second notch, and the second supplementary base is limited to the The second gap is made such that the second light window is closed.
  • the integrally formed manner is selected from the group consisting of: molding, molding.
  • Another aspect of the present invention provides an array camera module including
  • At least two lenses wherein the two lenses are respectively disposed at positions corresponding to the first circuit board and the second circuit board to respectively form two camera module units, and the top ends of the two camera module units Highly consistent.
  • the array camera module includes two filter elements, which are respectively disposed on the two camera module units.
  • the array camera module includes two lens support members, and the two lenses are respectively mounted to the lens support member.
  • At least one of the lens supporting elements is a mirror base element such that the corresponding camera module unit constitutes a fixed focus camera module.
  • At least one of the lens support elements is a drive element such that a corresponding focus camera module is formed corresponding to the camera module unit.
  • FIG. 1 is a schematic diagram of an array camera module in accordance with a first preferred embodiment of the present invention.
  • FIG. 2 is a schematic diagram of an array circuit board assembly in accordance with a first preferred embodiment of the present invention.
  • Figure 3 is a schematic illustration of the formation process of an array circuit board assembly in accordance with a first preferred embodiment of the present invention.
  • FIG. 4 is a schematic diagram of an array camera module in accordance with a second preferred embodiment of the present invention.
  • Figure 5 is a partial plan view of an array camera module in accordance with a second preferred embodiment of the present invention.
  • FIG. 6 is a schematic diagram of a modified embodiment of an array camera module in accordance with a second preferred embodiment of the present invention.
  • FIG. 7 is a schematic diagram of an array camera module in accordance with a third preferred embodiment of the present invention.
  • FIG. 8A is a schematic diagram of an array camera module in accordance with a fourth preferred embodiment of the present invention.
  • FIG. 8B is a schematic diagram of a modified embodiment of an array camera module according to a fourth preferred embodiment of the present invention.
  • FIG. 8C is a schematic view showing another modified embodiment of the array camera module according to the fourth embodiment of the present invention.
  • FIG. 9 is a schematic diagram of an array camera module in accordance with a fifth preferred embodiment of the present invention.
  • Figure 10 is a schematic diagram of an array camera module in accordance with a sixth preferred embodiment of the present invention.
  • 11A is a schematic diagram of an array camera module in accordance with a seventh preferred embodiment of the present invention.
  • 11B is a schematic diagram of a modified embodiment of an array camera module according to a seventh preferred embodiment of the present invention.
  • Figure 12 is a schematic diagram of an array camera module in accordance with an eighth preferred embodiment of the present invention.
  • Figure 13 is a schematic diagram of an array camera module in accordance with a ninth preferred embodiment of the present invention.
  • Figure 14 is a schematic diagram of an array camera module in accordance with a tenth preferred embodiment of the present invention.
  • Figure 15 is a schematic diagram of an array camera module in accordance with an eleventh preferred embodiment of the present invention.
  • Figure 16 is a schematic diagram of an array camera module in accordance with a twelfth preferred embodiment of the present invention.
  • 17 is a schematic diagram of an array camera module in accordance with a thirteenth preferred embodiment of the present invention.
  • Figure 18A is a schematic diagram of an array camera module in accordance with a fourteenth preferred embodiment of the present invention.
  • 18B is a schematic view showing a modified embodiment of an array camera module according to a fourteenth preferred embodiment of the present invention.
  • Figure 19 is a schematic illustration of an array circuit board assembly in accordance with a fourteenth preferred embodiment of the present invention.
  • Figure 20 is a schematic view showing the formation process of an array wiring board assembly in accordance with a fourteenth preferred embodiment of the present invention.
  • 21 is a schematic diagram of an array camera module in accordance with a fifteenth preferred embodiment of the present invention.
  • FIG. 22 is a schematic diagram of a modified embodiment of an array camera module in accordance with a fifteenth preferred embodiment of the present invention.
  • FIG. 23 is a schematic diagram of an array camera module in accordance with sixteen preferred embodiments of the present invention.
  • Figure 24 is a schematic diagram of an array camera module in accordance with a seventeenth preferred embodiment of the present invention.
  • Figure 25 is a schematic diagram of an array camera module in accordance with an eighteenth preferred embodiment of the present invention.
  • Figure 26 is a schematic diagram of an array camera module in accordance with a nineteenth preferred embodiment of the present invention.
  • Figure 27 is a schematic diagram of an array camera module in accordance with a twentieth preferred embodiment of the present invention.
  • FIG. 28 is a schematic diagram of an array camera module in accordance with a twenty-first preferred embodiment of the present invention.
  • 29 is a schematic diagram of an array camera module in accordance with a twenty-second preferred embodiment of the present invention.
  • Figure 30 is a schematic diagram of an array camera module in accordance with a twenty-third preferred embodiment of the present invention.
  • 31 is a schematic diagram of an array camera module in accordance with a twenty-fourth preferred embodiment of the present invention.
  • 32 is a schematic diagram of an array camera module in accordance with a twenty-fifth preferred embodiment of the present invention.
  • Figure 33 is a schematic diagram of an array camera module in accordance with a twenty-sixth preferred embodiment of the present invention.
  • 34A and 34B are perspective views of an array camera module according to the above embodiment of the present invention for explaining two external connection modes.
  • Figure 35 is a block diagram showing a method of fabricating an array camera module in accordance with the above-described preferred embodiment of the present invention.
  • 36 is a schematic diagram of an application of an array camera module in accordance with the above-described preferred embodiment of the present invention.
  • the multi-camera camera module is one of the important trends in the recent development of camera modules.
  • the cooperation of multiple camera modules can achieve more functions.
  • the array of multi-cameras is relatively large compared to the camera module of a single camera.
  • the aspect can obtain the function of the camera module superior to the single lens, but the implementation of these functions requires hardware support, so the existing multi-camera modules mostly stay in the theoretical stage.
  • an array camera module 100 is provided, which includes at least two camera module units, and each of the camera module units cooperates with each other to complete image collection, and the camera module units are stably performed.
  • the array camera module 100 reserves a height difference space formed by the height difference on the bottom side of the array camera module 100, so that when the array camera module 100 is mounted on an electronic device, the electronic device Components of the device may be housed in the height difference space such that the interior space is fully utilized and the exterior of the electronic device remains flat.
  • at least one pedestal may be formed by integrally forming a plurality of the array camera modules 100, and the assembly position is provided by the plurality of camera module units through the pedestal.
  • the camera module units are fixed to each other in a compact and stable manner, and the camera modules are maintained in good consistency.
  • the integrated molding method has better surface flatness and provides flat mounting conditions for other components, thereby improving the mounting precision of each component, and further ensuring the optical axis consistency between the respective camera module units.
  • the array camera module 100 may include more of the camera module units, and the invention is not limited in this regard.
  • the array camera module 100 includes at least two camera module units, and the outer end faces of the two camera module units are identical.
  • the bottom portion has a height difference H to form a height difference space 110.
  • the two camera module units are a first camera module unit 10 and a second camera module unit 20, respectively.
  • the first camera module unit 10 includes a first circuit board 11 , a first photosensitive element 13 and at least one first lens 14 .
  • the second camera module unit 20 includes a second circuit board 21 , a second photosensitive element 23 , and at least one second lens 24 .
  • the first photosensitive element 13 is electrically connected to the first circuit board 11 to transfer photosensitive information to the first circuit board 11, and the first lens 14 is located in a photosensitive path of the first photosensitive element 13. In order to allow the first photosensitive element 13 to receive light, it is photosensitive.
  • the second photosensitive element 23 is electrically connected to the second circuit board 21 to transfer photosensitive information to the second circuit board 21, and the second lens 24 is located in the photosensitive path of the second photosensitive element 23.
  • the second photosensitive element 23 is sensitized so as to receive light.
  • the first photosensitive element 13 and the second photosensitive element 23 may be respectively disposed on the first wiring board 11 and the surface by a surface mount technology SMT (Surface Mount Technology)
  • the second circuit board 21 is electrically connected to the first circuit board 11 and the second circuit board 21 through at least a first electrical connection element 133 and a second electrical connection element 233, respectively.
  • the first electrical connection element 133 and the second electrical connection element 233 are by way of example and not limitation, gold wire, silver wire, copper wire, aluminum wire, pad, pin, or the like.
  • the first camera module unit 10 includes a first base 12, and the first base 12 is fixedly connected to the first circuit board 11.
  • the first base 12 includes a first base body 123 and an extension portion 124.
  • the first base body 123 is fixedly connected to the first circuit board 11, and the extension portion 124 is from the base.
  • the body extends at least partially outwardly to facilitate providing a mounting position for the second camera module unit 20.
  • the second circuit board 21 is fixedly connected to the extending portion 124 of the first pedestal 12, so that the first camera module unit 10 and the second camera module are passed through the first pedestal 12.
  • the group unit 20 is stably connected together.
  • the extending portion 20 of the first camera module unit 10 forms a connecting portion to provide a fixed position for the second camera module unit 20, so that the first camera module unit 10 and the second camera module unit 20 are stably connected and fixed to form the array camera module.
  • the first susceptor 12 is disposed on the first circuit board 11 by integral molding, such as molding, thereby the first pedestal 12 and the first A circuit board 11 is stably fixed and reduces an additional mounting and fixing process.
  • integral molding such as molding
  • the process of reducing the glue bonding, the connection is more stable, the height of the glue connection is omitted, and the height of the camera module unit is lowered.
  • the one-piece molding method can be molded, such as a transfer molding method or a compression molding method.
  • the first pedestal 12 may be integrally formed on the first circuit board 11 by mold molding, such as molding in a circuit board, which is different from the conventional COB (Chip On Board) mode.
  • mold molding such as molding in a circuit board, which is different from the conventional COB (Chip On Board) mode.
  • COB Chip On Board
  • the molding shape and the surface flatness can be well controlled, for example, the extension portion 124 has a better flatness, thereby providing the second camera module unit 20 with a flat mounting condition.
  • the extension portion 124 has a good parallelism with the first circuit board 11 by the integral molding of the mold, thereby helping to ensure the first camera module unit 10 and the second camera module.
  • the optical axis consistency of the group unit 20 is
  • the optical axes are the same, that is, the central optical axis directions of the two camera module units are parallel, or the angle between the two central optical axes is within a predetermined error range, so that the imaging quality meets the predetermined requirements.
  • the invention is not limited in this respect.
  • the first pedestal 12 is located at the periphery of the first photosensitive element 13, and the second susceptor 22 is located at the periphery of the second photosensitive element 23. Further, the first pedestal 12 is located at the periphery of the first electrical connection element 133, and the second pedestal 22 is located at the periphery of the electrical connection element 233.
  • the extending portion 124 has a supporting surface 1241 extending away from the first camera module unit 10 such that the second camera module unit 20 is juxtaposed adjacent to the The first camera module unit 10.
  • the height of the extension portion 124 is higher than the height of the optical axis of the camera module unit, and the height of the extension portion 124 is higher than the first circuit board 11, so that the first base 12 and the first circuit board 11 form the height difference.
  • Space 110 That is, the extension portion 124 and the first circuit board 11 have a height difference, so that the second camera module unit 20 and the first camera module unit 10 are mounted on the extension portion 124. There is a height difference.
  • the height difference between the first camera module unit 10 and the second camera module unit 20 is compensated by the height difference between the extension portion 124 and the first circuit board 11 so that two The camera modules of different heights are stably assembled together, and the outer end faces are kept consistent, so that the first camera module unit 10 and the second camera module unit 20 are arranged side by side in the same direction, and The light incident surfaces are uniform, so that when the first camera module unit 10 and the second camera module unit 20 cooperate with each other to acquire image information, more accurate information can be obtained.
  • the second circuit board 21 is supported and fixed to the extending portion 124 to provide a flat mounting condition for the second camera module unit 20 through the extending portion 124. More specifically, the second circuit board 21 is fixed to the support surface 1241 of the extension portion 124 by a mounting method, such as glue fixing, the bottom surface of the first circuit board 11 and the second circuit board. The bottom surface of the 21 forms the height difference H, so that two separate and independent circuit boards can be fixedly assembled with a height difference to form an array camera module.
  • the height difference space 110 is located at the bottom of the array camera module 100.
  • the height difference space is located inside the electronic device. Thereby, the outside of the electronic device is kept relatively flat, and components of the electronic device can be disposed in the height difference space 110, thereby fully utilizing the internal space of the electronic device, which is more beneficial to the electronic device being thin and light. development of.
  • the height difference H is only used to illustrate the difference in height between the first camera module unit 10 and the second camera module unit 20, and is not limited.
  • the height difference between the first camera module unit 10 and the second camera module unit 20 is different, and when the heights of the second camera module unit 10 and the second camera module unit 20 are different
  • the relative positional relationship between the components of the first camera module unit 10 and the second camera module unit 20 also changes accordingly.
  • the top surface of the first base body 123 may extend upward, and the second base body 223
  • the first base body 223 is integrally connected to the molding.
  • the support surface 1241 of the extending portion 124 is formed by integrally molding a mold, so that better flatness can be ensured, and the direction of the extending portion 124 and the first circuit board 11 can be made uniform by mold control.
  • the direction of the extending portion 124 is parallel to the direction of the first circuit board 11, so that the directions of the first circuit board 11 and the second circuit board 21 are the same, and the first imaging mode is
  • the group unit 10 and the second camera module unit 20 provide a consistent mounting base such that the optical axes of the first camera module unit 10 and the second camera module unit 20 are identical.
  • the first pedestal 12 may be formed by injection molding, such as by injection molding to form the first pedestal 12 with the first pedestal body 123 And the extending portion 124, and then the first base 12 is adhesively fixed to the first circuit board 11, and the second circuit board 21 is further mounted to the extension of the first base 12
  • the portion 124 is configured to assemble the first camera module unit 10 and the second camera module unit 20, and the outer end portions are substantially identical and have a height difference.
  • the first circuit board 11 includes a first circuit board body 111 and at least one first electronic component 112, and the first electronic component 112 protrudes from the first circuit board.
  • the main body 111 is configured to cooperate with the operation of the first circuit board main body 111.
  • the first pedestal 12 is integrally formed on the first circuit board body 111 and covers the first electronic component 112, thereby reducing the occupied space of the first electronic component 112.
  • the first electronic component 112 is by way of example and not limitation, a resistor, a capacitor, a driver, or the like.
  • the first electronic component 112 may not be disposed or the first electronic component 112 may protrude from the first circuit board body 111, such as embedded in the first The circuit board main body 111, the present invention is not limited in this respect.
  • Each of the first electronic components 112 may be attached to an edge region of the first wiring board 11, such as outside the first photosensitive member 13, by being spaced apart from each other by, for example, an SMT process. It is worth mentioning that each of the first electronic components 112 may be located on the same side or the opposite side of the first circuit board 11, for example, in one specific example, the first photosensitive element 13 and each of the The first electronic components may be respectively located on the same side of the first circuit board 11, and the first photosensitive elements 13 are mounted on the chip mounting area of the first circuit board 11, each of the first The electronic components 112 are respectively mounted on the edge regions of the first wiring board 11 at intervals.
  • the first pedestal 12 covers each of the first electronic components 112 after molding to isolate adjacent first electronic components 112 and isolate the first electronic components by the first pedestal 12 112 and the first photosensitive element 13.
  • the manner in which each of the first electronic components 112 is covered by the first pedestal 12 after molding has many advantages.
  • the first pedestal 12 includes Each of the first electronic components 112 is covered so that a mutual interference between the adjacent first electronic components 112 does not occur, even when the distance between the adjacent first electronic components 112 is relatively close
  • the imaging quality of the camera module unit can be ensured, so that a larger number of the first electronic components 112 can be mounted on the first circuit board 11 of a small area, thereby making the camera module
  • the structure of the unit is more compact, so as to improve the imaging quality of the camera module unit based on controlling the size of the camera module unit;
  • the first base 12 covers each of the first An electronic component 112 such that no safety distance is required between the first pedestal 12 and each of the first electronic components 112, whether in the horizontal direction or in the height direction, to enable The size of the camera module unit.
  • the first pedestal 12 covers each of the first electronic components 112 so that no glue is used for connection and leveling between the first pedestal 12 and the first circuit board 11 . In order to reduce the height dimension of the camera module unit.
  • the first pedestal 12 covers each of the first electronic components 112, and in the process of subsequently transporting and assembling the camera module unit to form the array camera module 100, the first The pedestal 12 can prevent the first electronic component 112 from shaking and falling off, thereby facilitating structural stability of the array camera module 100.
  • the first pedestal 1223 covers each of the first electronic components 112, and can prevent pollutants during subsequent transportation and assembly of the camera module unit to form the array camera module 100. Each of the first electronic components 112 is contaminated to ensure image quality of the array camera module 100.
  • the first susceptor 12 can cover the electronic component and can isolate the first electronic component 112 from the air. In this manner, the oxidation rate of the metal portion of the first electronic component 112 can be slowed down. It is beneficial to improve the environmental stability of the first electronic component 112 and the array camera module 100.
  • the first pedestal 12 is integrally formed on the first circuit board 11 and covers the first electronic component 112 of the first circuit board 11 such that the first base
  • the seat 12 and the first circuit board body 111 have a large connection area, and the connection is more stable, so that the extension portion 124 can provide stable support and has better structural strength by integral molding, so The extension portion 124 can support and fix the second camera module unit 20 firmly and reliably, thereby ensuring the yield of the product.
  • the second camera module unit 20 is mounted on the extension portion 124 of the first base 12 so as to be able to pass through the extension length of the extension portion 124 and the second camera.
  • the installation position of the module unit 20 conveniently controls the distance between the first camera module unit 10 and the second camera module unit 20, thereby conveniently meeting the cooperation requirements of different types of camera module units.
  • the first susceptor 12 has a first light window 121 to facilitate providing a light path for the first photosensitive element 13.
  • the first photosensitive element 13 is located in the first light window 121, and the photosensitive path of the first photosensitive element 13 is aligned with the direction of the first light window 121.
  • the first pedestal body 123 forms the first light window 121 to provide a light path for the first photosensitive element 13.
  • the first base body 123 is a closed loop structure that accommodates the shape of the first photosensitive element 13.
  • the first pedestal 12 surrounds the periphery of the first photosensitive element 13
  • the first base 12 has a first mounting slot 122 that communicates with the first light window 121 for providing a mounting position.
  • the first camera module unit 10 includes a first filter element 16 between the first lens 14 and the first photosensitive element 13 to facilitate filtering through the The first lens 14 reaches the light of the first photosensitive element 13.
  • the first filter element 16 is mounted to the first mounting slot 122.
  • the first filter element 16 is mounted on the first mounting slot 122, that is, the first mounting slot 122 is the first Filter element 16 provides a mounting location.
  • the first mounting slot 122 may also provide a mounting position for other components, such as, but not limited to, providing a mounting position for the first lens support member 15 and the first lens 14. And components such as support 18 (subsequently proposed) provide mounting locations.
  • the second camera module unit 20 includes a second base 22, and the second base 22 is fixedly connected to the second circuit board 21.
  • the second base 22 includes a second base body 223 and has a second light window 221.
  • the second pedestal body 223 forms the second light window 221 to provide a light path for the second photosensitive element 23.
  • the second photosensitive element 23 is located in the second light window 221, and the second photosensitive element 23 and the second light window 221 are aligned in the same direction.
  • the second base body 223 is a closed loop structure that accommodates the shape of the second photosensitive element 23.
  • the second base 22 has a second mounting slot 222 communicating with the second light window 221 , and the second mounting slot is disposed on the second base body 223 .
  • the second camera module unit 20 includes a second filter element 26, and the second filter element 26 is located between the second lens 24 and the second photosensitive element 23 to facilitate filtering through the The second lens 24 reaches the light of the second photosensitive element 23.
  • the second filter element 26 is mounted to the first mounting groove 122.
  • the second filter element 26 is mounted to the second mounting slot 222, that is, the second mounting slot 222 is the second Filter element 26 provides a mounting location.
  • the second mounting groove 222 may also provide a mounting position for other components, such as, but not limited to, providing a mounting position for the second lens support member 25 and the second lens 24. And components such as support 28 (subsequently proposed) provide mounting locations.
  • the first filter element 16 and the second filter element 26 can be implemented in different types, for example, the filter element can be implemented as an infrared cut filter, a full transmissive spectrum filter, a blue glass a filter and other filters or a combination of a plurality of filters, for example, the filter element can be implemented as a combination of an infrared cut filter and a full transmissive filter, ie, the infrared cut filter
  • the sheet and the full transmissive spectral filter can be switched to be selectively located on the photosensitive path of the photosensitive element, for example, when the array camera module 100 is used in an environment with sufficient light during daylight hours,
  • the infrared cut filter is switched to the photosensitive path of the photosensitive element to filter infrared rays entering the light reflected by the object of the camera module unit by the infrared cut filter, and the light is dark at night
  • the full transmissive spectral filter can be switched to a photosensitive path of the photosensitive element to allow access to
  • the second susceptor 22 is integrally formed on the second wiring board 21, thereby stably fixing the second susceptor 22 and the second wiring board 21, and Reduce the extra installation fixing process. For example, the process of reducing the glue bonding, the connection is more stable, the height of the glue connection is omitted, and the height of the camera module unit is lowered.
  • the second circuit board 21 includes a second circuit board body 211 and at least one second electronic component 212.
  • the second electronic component 212 protrudes from the second circuit board body 211 for mating with the second The operation of the board main body 211.
  • the second pedestal 22 is integrally formed on the second circuit board body 211 and covers the second electronic component 212.
  • the second base 22 can be integrally formed in the same manner as the first base 12, and has the same advantages as the first base 12, and details are not described herein again.
  • the first camera module unit 10 includes at least one first lens support member 15, and the first lens 14 is mounted on the first lens support member 15, A lens supporting member 15 is mounted to the first base body 123 of the first base 12 such that the first lens 14 is located in a photosensitive path of the first photosensitive member 13.
  • the second camera module unit 20 includes at least one second lens support member 25, the second lens 24 is mounted to the second lens support member 25, and the second lens support member 25 is mounted on the The second base body 223 is such that the second lens 24 is located in the photosensitive path of the second photosensitive element 23.
  • first lens supporting component 15 and the second lens supporting component 25 can be implemented as a driving component or a mirror base component to form a dynamic focus camera module or a fixed focus camera module.
  • the drive element is by way of example and not limitation, a voice coil motor, a piezoelectric motor or the like.
  • both the first camera module unit 10 and the second camera module unit 20 are The moving focus camera module, that is, the array camera module 100 is composed of two moving focus camera modules.
  • the first camera module unit 10 is a dynamic focus camera module
  • the The two camera module unit 20 is a fixed focus camera module, that is, the array camera module 100 is composed of a moving focus camera module and a fixed focus camera module.
  • the first lens support component 15 is implemented as a lens mount component and the second lens 24 component is implemented as a drive component
  • the first camera module unit 10 is a fixed focus camera module
  • the The two camera module unit 20 is a dynamic focus camera module.
  • both the first camera module unit 10 and the second camera module unit 20 are Fixed focus camera module.
  • the first lens support element 15 or the second lens support element 25 when the first lens support element 15 or the second lens support element 25 is implemented as a drive element, the first lens support element 15 and the second The lens support member 25 is electrically connected to the first circuit board 11 or the second circuit board 21 to facilitate driving the first lens 14 or the second lens 24 to operate.
  • the first lens supporting member 15 and the second lens supporting member 25 may be electrically connected to the first circuit board 11 or the second circuit board 21 by providing pins, pads or leads or the like. .
  • the types of the first camera module unit 10 and the second camera module unit 20 can be configured according to requirements, so as to achieve better image acquisition effects by mutual cooperation, and the invention is not limited in this respect.
  • the first lens supporting member 15 is mounted on a top surface of the first base body 123, and the first filter element 16 is mounted.
  • the second lens supporting member 25 is mounted on the top of the second base body 223
  • the second filter element 26 is mounted on the second mounting groove 222 of the second base 22, and the first base 12 and the second base 22 can be integrally formed.
  • the first filter element 16, the second filter element 26, the first lens support element 15 and the second lens support element 25 and the like provide flat, uniform mounting conditions, thereby improving the first imaging
  • the assembly precision of the module unit 10 and the second camera module unit 20 is reduced, and the accumulation is reduced. Difference, and helps to improve the consistency of the central optical axis of the camera module unit 10 of the first and the second unit 20 of the camera module.
  • the first circuit board 11, the first photosensitive element 13, and the first base 12 constitute a first photosensitive member.
  • the second circuit board 21, the second photosensitive element 23 and the second base 22 constitute a second photosensitive member.
  • the first photosensitive member and the second photosensitive member constitute an array circuit board assembly. That is, the first wiring board 11, the first susceptor 12, the first photosensitive element 13, the second wiring board 21, the second photosensitive element 23, and the second pedestal 22 constituting the array circuit board assembly such that different types of lens or lens support members can be conveniently mounted to the first base 12 and the second base 22, respectively, to form the predetermined height difference H Array camera module 100.
  • the array camera module 100 includes at least one array circuit board assembly having a height difference and two of the lenses, and the two lenses are respectively located in two photosensitive paths of the array circuit board assembly.
  • the array circuit board assembly of the array camera module 100 may be formed by integrally forming a portion with the extension portion 124 at a predetermined position of the first circuit board 11.
  • the first pedestal 12 is disposed such that the first pedestal body 123 of the first pedestal 12 covers the first electronic component 112 on the first circuit board body 111;
  • Two circuit boards 21 are mounted to the extension portion 124 of the first pedestal 12;
  • the second susceptor 22 is integrally formed at a predetermined position of the second circuit board 21, and the second base is made
  • the seat 22 encloses the second electronic component 212 of the second circuit board 21; further, the first photosensitive element 13 and the second photosensitive element 23 are respectively mounted on the first circuit board 11 and
  • the second circuit board 21 is located in the first light window 121 of the first pedestal 12 and the second light window 221 of the second pedestal 22, respectively.
  • the first photosensitive element 13 and the second photosensitive element 23 may be first attached to the first circuit board main body 111 and the second circuit board main body, respectively. 211, and then forming the first pedestal 12 and the second pedestal 22, respectively, and it will be understood by those skilled in the art that the order in which the array circuit board assembly is formed is not a limitation of the present invention.
  • the first photosensitive element is respectively mounted on the first circuit board 11 and the second circuit board 21, respectively. 13 and the second photosensitive element 23.
  • the first photosensitive element 13 and the second photosensitive element 23 may be respectively mounted on the first circuit board 11 and/or the second circuit board 21,
  • the first first pedestal 12 and the second pedestal 22 are then formed.
  • other sequences may be used, such as first mounting the first photosensitive element 13 on the first circuit board 11, and then forming the first pedestal 12, and then at the first pedestal 12.
  • the extension portion 124 mounts the second wiring board 21, and then electrically connects the second photosensitive element 23 on the second wiring board 21, and then forms the second susceptor 22.
  • the first photosensitive element 13 is electrically connected to the first wiring board 11, and the first pedestal 12 is formed on the first wiring board 11,
  • the second circuit board 21 is disposed on the first base 12, the second photosensitive element 23 is electrically connected to the second circuit board 21, and the second base 22 is formed on the second circuit board 21.
  • FIGS. 4 and 5 are schematic views of an array camera module 100 in accordance with a second preferred embodiment of the present invention.
  • the second circuit board 21 is buried in the extension portion 124 of the first pedestal 12, thereby lowering the second circuit board 21
  • the relative height of the extension portion 124 reduces the mounting and fixing process of the second circuit board 21.
  • the second pedestal 22 is integrally connected to the first pedestal 12.
  • the second wiring board 21 is integrally molded to the extension portion 124 of the first susceptor 12.
  • the first circuit board 11 and the second circuit board 21 are respectively disposed at predetermined positions and have a predetermined height difference, and then the first circuit board 11 and the first
  • the two circuit boards 21 are integrally formed and fixed at the same time.
  • the second susceptor 22 may be formed simultaneously during the manufacturing process, or the second pedestal 22 may be formed again after the extension portion 124 is formed.
  • the second circuit board body 211 has at least one second electrical connection region 2111 to electrically connect the second photosensitive element 23.
  • the second electrical connection region 2111 is exposed on the surface of the extension portion 124 to facilitate electrical connection of the second photosensitive element 23.
  • the second electrical connection element 233 is electrically connected to the second photosensitive element 23 and the second electrical connection region 2111 by means of a gold wire, so that the second photosensitive element 23 and the second The circuit board 21 is electrically connected.
  • the manner of implementing the second electrical connection region 2111 is exemplified, but not limited to, by placing a protrusion inside the mold against the second electrical connection region 2111, so that the second circuit board body 211 is The second electrical connection region 2111 is not covered by the integrally formed material.
  • the second electrical connection region 2111 is exemplified, but not limited to, implemented as a strip pad. It is to be noted that, in FIG. 4, the second circuit board body 211 is substantially completely covered by the extension portion, and only the second electrical connection region 2111 is exposed to electrically connect the second photosensitive device.
  • the element 23, that is, the second photosensitive element 23, is supported on the surface of the extension 124. That is, in the manufacturing process, the first wiring board 11 and the second wiring board 21 are integrally molded and fixed, and then the photosensitive member 23 is electrically connected.
  • the second photosensitive element 23 may be directly attached to the second wiring board 21, and the second photosensitive element 23 may be electrically connected to the second wiring board 21
  • the second electrical connection region 2111 is then integrally formed to fix the first circuit board 11 and the second circuit board 21.
  • the second photosensitive member 23 is electrically connected to the second wiring board 21 by providing the second electrical connection member 233 on both sides.
  • the second circuit board 21 has four second electrical connection regions 2111, which are respectively disposed on opposite sides. Four of the second electrical connection regions 2111 are exposed on the surface of the extension 124.
  • the second photosensitive element 23 is electrically connected to each of the second electrical connection regions 2111 through each of the second electrical connection elements 233.
  • the manufacturing process of the array circuit board assembly may be that the first circuit board 11 and the second circuit board 21 are first disposed at a predetermined position to have a height difference; further, integrally formed The first base 12 and the second base 22 are described, and the second circuit board 21 is wrapped around the extension portion 124 of the first base 12, and the second circuit board is caused The second electrical connection region 2111 of 21 is exposed on the surface of the extension portion 124; further, the first photosensitive element 13 and the second photosensitive element 23 are electrically connected to the first circuit board 11 and The second circuit board 21.
  • the first circuit board 11 may be covered by the first base 12, and the at least one first electrical connection area of the first circuit board 11 is exposed to the outside, so as to facilitate The first photosensitive element 13 is electrically connected to the first electrical connection region.
  • the second circuit board 21 may not be completely covered by the second base 22, such as the bottom of the second circuit board 21 is embedded in the extending portion 124. The surface of the second wiring board 21 is exposed to the outside, thereby restricting the position of the second wiring board 21 by the extending portion 124, preventing displacement during mounting, and lowering the second wiring board 21 and the The relative height of the extensions 124.
  • FIG. 6 shows a variant embodiment of an array camera module 100 in accordance with a second preferred embodiment of the present invention.
  • the array circuit board assembly includes a connection board 128 connected to the first circuit board 11 and the second circuit board 21. More specifically, the connection board 128 electrically connects the first circuit board 11 and the second circuit board 21 such that the first circuit board 11 and the second circuit board 21 are in communication with each other. When the first circuit board 11 and the second circuit board 21 are electrically connected, the first circuit board and the second circuit board 21 may share one output end.
  • the web 128 is exemplified by, but not limited to, a soft board.
  • the first base 12 includes a first extending mounting portion 125 extending at least partially upward from the first base body 123 and forming a first limiting slot 126.
  • the first lens 14 or the first lens support member 15 is mounted at a limit.
  • the second base 22 includes a second extension mounting portion 225 extending at least partially upward from the second base body 223 and forming a second limiting slot 226 for limiting the mounting of the second base The lens 24 or the second lens support member 25.
  • the first lens 14 is mounted to the first limiting slot 126. That is, the shape of the first extension mounting portion 125 is adapted to the first lens 14 to be adapted to limit and mount the first lens 14 to form a certain focus camera module.
  • the second lens 24 is mounted to the second limiting slot 226. That is, the shape of the second extension mounting portion 225 is adapted to the second lens 24 to be adapted to limit and mount the second lens 24 to form a fixed focus camera module. That is to say, the two array camera module 100 units of the array camera module 100 are all fixed focus camera modules.
  • the first lens support member 15 is mounted to the first limit slot 126, and the first lens 14 is mounted to the first lens support member 15,
  • the first lens supporting element 15 is implemented as a driving element, so that the first camera module unit 10 forms a moving focus camera module.
  • the second lens support member 25 is mounted to the second limit slot 226, the second lens 24 is mounted to the second lens support member 25, and the second lens support member 25 is implemented as a Driving the component such that the second camera module unit 20 forms a dynamic focus camera module. That is to say, the two camera module units of the array camera module 100 are all dynamic focus camera modules.
  • a combination of a dynamic focus and a fixed focus may also be used, and the present invention is not limited in this regard.
  • the first camera module unit 10 includes a first mount 18 for mounting other components, such as the first filter element 16, the first lens 14 or the The first lens support member 15.
  • the first mount 18 is mounted to the first base body 123, and the first filter element 16 is mounted to the first mount 18.
  • the first mount 18 sinks within the first light window 121 of the first pedestal 12 such that the position of the first filter element 16 sinks, close to the first
  • the photosensitive element 13 reduces the back focal length of the first camera module unit 10 and reduces the required area of the first filter element 16.
  • the second camera module 20 includes a second holder 28 for mounting other components, such as the second filter element 26, the second lens 24 or the second lens support element 25.
  • the second mount 28 is mounted to the second base body 223, and the second filter element 26 is mounted to the second mount 28.
  • the second mount 28 sinks within the second light window 221 of the second pedestal 22 such that the position of the second filter element 26 sinks, near the second
  • the photosensitive element 23 reduces the back focal length of the second camera module unit 20 and reduces the required area of the second filter element 26.
  • the array camera module 100 may include only one of the supports, such as the first support 18 or the second support 28, as those skilled in the art should understand. The number of the supports is not a limitation of the present invention.
  • the first mount 18 is mounted to the first mounting slot 122 of the first base 12, and the second mount 28 is mounted to the second base 22 The second mounting slot 222.
  • the first base body 123 and the second base body 223 may be a platform structure, and the first support 18 and the second support 28 are not oriented. Sinking and being directly mounted to the platform structure of the first abutment 18 and the second abutment 28, those skilled in the art will appreciate that the mounting position and specific structure of the abutment are not Limitations of the invention.
  • the first abutment 18 and the second abutment 28 are integrally connected. That is, the portions of the first holder 18 and the second holder 28 are connected to each other so as to be mountable to the first base 12 and the second base 22 at a time, and provide relative Consistent installation conditions.
  • the first pedestal 12 and the second pedestal 22 are integrally connected. That is, the second pedestal 22 is not only integrally formed on the second circuit board 21 when molded, and is integrally formed on at least a part of the surface of the first pedestal, thereby making the first The base 12 and the second base 22 are more firmly connected.
  • the second camera module unit 20 includes a second holder 28 that is directly mounted to the second circuit board 21. That is to say, in this manner, the second camera module unit 20 does not include the second pedestal 22, and the second pedestal 28 supports the supporting function of the second pedestal 22.
  • the second holder 28 is directly attached to the top surface of the second board body 211.
  • the first support 28 is adhesively fixed to the second circuit board body.
  • the second holder 28 has a light-passing hole 281 for providing a light path for the second photosensitive element 23.
  • the second holder 28 has a escaping space 282 communicating with the light-passing hole 281 for avoiding The second electronic component 212 and the second photosensitive element 23.
  • the second lens support member 25 and/or the second lens 24 are directly mounted to the top surface of the second holder 28.
  • the first camera module unit 10 includes a first supplementary base 19, and the first supplementary base 19 is additionally mounted on the first base body 123, and cooperates with the first base body 123.
  • the first light window 121 is described. That is, in this embodiment, the first base body 123 is not a closed annular structure, but is supplemented by the first supplemental base 19 to form a closed annular structure.
  • the first base body 123 has at least one first notch 1231 communicating with the outside, and the first supplementary base 19 is at least partially supplemented by the first notch 1231.
  • the first notch 1231 limits the position of the first supplemental base 19 such that the supplement can be installed accurately and quickly.
  • the shape of the first notch 1231 and the first supplementary base 19 may be set according to requirements, such as an inverted trapezoidal structure, a triangular structure, a square structure, etc., and the invention is not limited in this respect.
  • the second camera module unit 20 includes a second supplementary base 29.
  • the second supplementary base 29 is additionally mounted on the second base body 223, and cooperates with the second base body 223.
  • the second light window 221 is described. That is, in this embodiment, the second base body 223 is not a closed annular structure, but is supplemented by the second supplemental base 29 to form a closed annular structure.
  • the second base body 223 has at least one second notch 2231 communicating with the outside, and the second supplementary base 29 is at least partially supplemented by the second notch 2231.
  • the second notch 2231 limits the position of the second supplemental support 18 such that the supplement can be installed accurately and quickly.
  • the shape of the second notch 2231 and the second supplementary base 29 may be set according to requirements, such as an inverted trapezoidal structure, a triangular structure, a square structure, etc., and the invention is not limited in this respect.
  • the array camera module 100 may include only one of the supplementary bases, such as the first supplementary base 19 or the second supplementary base 29, which is in the art.
  • the shape and number of the supplemental pedestals are not a limitation of the present invention.
  • FIG. 10 it is a schematic diagram of an array camera module 100 in accordance with a sixth preferred embodiment of the present invention.
  • the second circuit board body 211 has a second sinker hole 2112, and the second photosensitive element 23 is sunk in the second sinker hole 2112, thereby reducing the number.
  • the relative heights of the two photosensitive elements 23 and the second wiring board main body 211 are not limited to the first and the second sinker hole 2112.
  • the second sinker hole 2112 is connected to both sides of the second circuit board 21, and when the second photosensitive element 23 sinks to the second sinker hole 2112, the second photosensitive element 23
  • the bottom portion is supported by the extension 124 of the first pedestal 12. That is, the extension 124 provides a mounting plane for the second photosensitive element 23.
  • the first pedestal 12 is formed on the first circuit board 11 by integral molding, so that the extension portion 124 and the first circuit board 11 extend to have a good consistency, so that the second The photosensitive element 23 and the first circuit board 11 have better consistency, so that the first camera module unit 10 and the second camera module unit 20 have better optical axis consistency, or
  • the imaging quality of the first camera module 10 and the second camera module unit 20 is made better. That is, the imaging quality of the array camera module 100 is made better.
  • the second circuit board body 211 has a lower sinking groove, and the second photosensitive element 23 is sunk in the sinking groove, thereby reducing the second photosensitive element 23 and the The relative height of the second board main body 211 is described.
  • the sinking groove does not communicate with both sides of the second circuit board main body 211. That is, the depth of the sinking of the second wiring board main body 211 and the relative height of the second photosensitive element 23 and the second wiring board main body 211 may be controlled by controlling the depth of the sinking groove. to realise. It should be understood by those skilled in the art whether the sinking groove or the sinker hole communicates with both sides of the second circuit board main body 211 and the sinking depth of the second photosensitive element 23 is not the present invention. limits.
  • FIG. 11A is a schematic diagram of an array camera module 100 in accordance with a seventh preferred embodiment of the present invention.
  • the first base body 123 and the second base body 223 are integrally connected, and the first base body 123 is fixedly connected to the first circuit board 11, the first The second base body 223 is fixedly coupled to the second circuit board 21 to stably connect the first camera module unit 10 and the second camera module unit 20.
  • the first camera module unit 10 and the second camera module are connected by the integral connection of the second base body 223 and the first base body 123.
  • the group unit 20 is fixedly connected.
  • the first pedestal 12 and the second pedestal 22 have a height difference. That is, the second base body 223 has the same function as the extension portion 124 to fix the second wiring board 21.
  • the first circuit board 11 and the second circuit board 21 are disposed at predetermined positions with a predetermined height difference, and further, respectively, in the first circuit board 11 and the The predetermined position of the second circuit board 21 forms the first base body 123 and the second base body 223 such that the relative positions of the first circuit board 11 and the second circuit board 21 are determined and have The height difference.
  • the first photosensitive element 13 and the second photosensitive element 23 are mounted on the first wiring board 11 and the second wiring board 21.
  • other sequential manufacturing methods are also possible, and the present invention is not limited in this regard.
  • FIG. 11B is a schematic diagram of a modified embodiment of an array camera module according to a seventh preferred embodiment of the present invention.
  • the first abutment 18 and the second abutment 28 are integrally connected. That is, the portions of the first holder 18 and the second holder 28 are connected to each other so as to be mountable to the first base 12 and the second base 22 at a time, and provide relative Consistent installation conditions.
  • the first support 18 and the second support 28 are integrally connected to provide more stable support for the filter element and other components, such as the lens or the lens support element, and increase the number The structural strength of a base 12 and the second base 22 when integrally connected.
  • the array camera module 100 includes a support plate 129 .
  • the support plate 129 is fixedly connected to the first base body 123 , and the second circuit board 21 is mounted on the support plate 129 .
  • the support plate 129 has a through hole 1290 corresponding to the first light window 121 to provide a light path for the first photosensitive element 13.
  • the first pedestal 12 does not form the extension portion 124, and the first camera module unit 10 and the second camera module are fixedly connected by the support plate 129.
  • the unit 20 is configured such that the bottom of the second camera module unit 20 of the first camera module unit 10 has a height difference and the outer ends are identical.
  • the support plate 129 is by way of example but not limited to a metal plate, preferably a steel plate.
  • the second circuit board 21 of the second camera module unit 20 is supported and fixed to the top surface of the support plate 129, for example, by adhesive bonding.
  • the support plate 129 of the first camera module unit 10 forms the connection portion, and provides a position for supporting and fixing the second camera module unit 20, so that the The first camera module unit 10 and the second camera module unit 20 are stably fixed with a height difference.
  • the top surface of the support plate 129 forms the height difference H with the bottom surface of the first circuit board 11, that is, the bottom surface of the first circuit board 11 and the bottom surface of the second circuit board 21 form the height difference. H.
  • FIG. 13 is a schematic diagram of an array camera module 100 in accordance with a ninth preferred embodiment of the present invention.
  • the extension 124 of the first pedestal 12 expands downward such that the bottom of the extension 124 coincides with the bottom of the first circuit board 11. That is to say, the array camera module 100 as a whole has the same outer end portion and the bottom portion, thereby forming a relatively regular and flat structure, which is convenient for mounting on an electronic device.
  • the extending portion 124 extends at least partially outward from the base body 123 such that a bottom surface of the extending portion 124 coincides with a bottom surface of the first circuit board body 111.
  • the top surface of the extending portion 124 that is, the supporting surface 1241, forms a height difference with the first circuit board main body 111, and the second circuit board 211 is mounted on the supporting surface 1241, so that the array The top and bottom of the camera module are the same.
  • the first base 12 includes a first support member 127 for supporting the mold during manufacture to prevent the first circuit board 11 or the first photosensitive member 13 from being damage. That is, during the manufacturing process, the manufacturing mold can be abutted against the first support member 127 such that the mold does not directly contact the first wiring board 11 or the first photosensitive member 13, and is prevented. The molding material overflows to the inside.
  • first support member 127 may have an annular structure conforming to the shape of the first base body 123.
  • the first support element 127 has elasticity, such as, but not limited to, a glue coating or a pad.
  • the first supporting member 127 is disposed between a portion of the first pedestal 12 and the first wiring board 111. Specifically, the first supporting member 127 is disposed between the first base body 123 and the inner edge and the corresponding first circuit board 11.
  • the side wall of the first base body 123 has an inclination angle, thereby facilitating mold manufacturing, such as facilitating the drafting process, and reducing the occurrence of burrs at the bottom of the first base body 123.
  • the second base 22 includes a second support member 227 for supporting the mold during manufacture to prevent damage to the second wiring board 21 or the second photosensitive member 23. That is, during the manufacturing process, the manufacturing mold can be abutted against the second support member 227 such that the mold does not directly contact the first circuit board 11 or the second photosensitive element 23, And the molding material is prevented from overflowing to the inside.
  • the second support member 227 may have an annular structure conforming to the shape of the second base body 223.
  • the second support element 227 has elasticity, such as, but not limited to, a glue coating or a pad.
  • the second support member 227 is disposed between a portion of the second pedestal 22 and the second circuit board 211. Specifically, the second support member 227 is disposed between the second base body 223 and the inner edge and the corresponding second circuit board 21.
  • the sidewall of the second base body 223 has an inclination angle, thereby facilitating mold manufacturing, such as facilitating the drafting process, and reducing the occurrence of burrs at the bottom of the second base body 223.
  • the first filter element 16 is fixedly connected to the first pedestal 12, and further, the first filter element 16 is fixedly connected to the first pedestal body. 123. Specifically, the first filter element 16 is fixedly coupled to the first base body 123 by integral molding.
  • first filter element 16 is supported by the first support element 127, thereby facilitating the fixed connection of the first filter element 16 in one piece.
  • the second filter element 26 is fixedly coupled to the second pedestal 22 , and further, the second filter element 26 is fixedly coupled to the second pedestal body 223 . Specifically, the second filter element 26 is fixedly coupled to the second base body 223 by integral molding.
  • the second filter element 26 is supported by the second support member 227, thereby facilitating the fixed connection of the second filter element 26 integrally.
  • the filter elements 16, 26 may be integrally formed to each of the base bodies 123, 223 by molding.
  • the array circuit board assembly of the array camera module 100 may be formed by first setting the first on the first circuit board 11 and the second circuit board 21, respectively. a support member 127 and the second support member 227, and then the first filter member 16 is disposed on the first support member 127, and then integrally formed over the first filter member 16 to form the first a susceptor 12 for integrally fixing the first filter element 16; the second circuit board 21 is further disposed on the extending portion 124 of the first pedestal 12, further The second filter element 26 is disposed on the second support member 227, and the second base body 223 is integrally formed over the second filter element 26, thereby integrally molding the second filter element 26. Ground fixed.
  • FIG. 16 is a schematic diagram of an array camera module 100 in accordance with a twelfth preferred embodiment of the present invention.
  • the first camera module unit 10 and the second camera module unit 20 each include at least one supporting member 127, 227 and at least one lens 17, 27, respectively. Supported by the support elements 127, 227.
  • Each of the lenses 17, 27 is provided to the first base body 123 and the second base body 223, respectively.
  • the lenses 17, 27 are integrally molded to the first base body 123 and the second base body 223, respectively located at the first photosensitive element 13 and the second photosensitive element 23. Photosensitive path.
  • the arrangement of the lenses 17, 27 can reduce the optical TTL (the distance from the lens plane above the lens aperture to the photosensitive plane of the chip), thereby further sizing the camera module without affecting optical performance. The reduction meets the demand of the electronic device for mounting the small-sized array camera module 100.
  • the arrangement of the lenses 17, 27 can also reduce stain sensitivity. For example, in one embodiment, stain sensitivity of 50% can be reduced.
  • the lenses 17, 27 are embodied as a lens of thermosetting nature, i.e. the lenses 17, 27 are embodied as a thermally hardened lens such that the lens 17, 27
  • the molding process is capable of withstanding the ambient temperature during the molding process. For example, it is capable of withstanding a molding ambient temperature of 175 ° C in the molding process of an embodiment. That is, prior to the molding process, the high temperature resistant and thermally hardened lens 17 is attached to the support member 127 and placed in the mold together with the first circuit board 11, fluid The cured molding material integrally molds the first base 12 around the support member 127 and the outer surface of the lens 17, so that the first base 12 can be integrally molded to the first circuit board 11.
  • the first pedestal 12, the first wiring board 11, and the lens 17 form a unitary structure.
  • the lenses 17, 27 of the present invention may be not only thermostable lenses 17, 27, but also lenses 17, 27 of other nature, and the invention is not so limited.
  • another of the lens 27, the second pedestal 22, and the second wiring board 21 may be integrally formed into a unitary structure.
  • the lenses 17, 27 include a lens body 171, 271 and a lens perimeter 172, 272 disposed about the lens body 171, 271. Since the lenses 17, 27 are precision optical components, the edges of the lens bodies 171, 271 are relatively thin. The lens peripheral edges 172, 272 disposed at the edges of the lens bodies 171, 271 and integrally connected are thickened bracket designs capable of carrying the lens bodies 171, 271 so as not to affect the optical performance of the lens bodies 171, 271 while enabling The lens bodies 171, 271 are integrally molded to the base in a mold. That is, before the pedestal is formed, the lens perimeters 172, 272 of the lenses 17, 27 are disposed in the non-photosensitive area of the photosensitive element, the lens body of the lenses 17, 27. 171, 271 is disposed on a photosensitive path of the photosensitive member; after the susceptor is formed, the molding base covers the wiring board, a portion of the photosensitive member, and the lens 17, 27 The lens perimeter 172, 272.
  • the supporting component and the lens 17 , 27 can effectively improve the product yield of the array camera module 100 and improve the imaging quality of the array camera module 100 .
  • the support member 127, 227 includes a frame-shaped support body and has a through hole, wherein the support body is disposed on the circuit board such that a photosensitive area of the photosensitive element corresponds to the support element
  • the through hole and the lens bodies 171, 271 of the lenses 17, 27 enable the support body and the lenses 17, 27 to protect the photosensitive element during the molding process.
  • the first photosensitive element 13 and the second photosensitive element 23 are not integrally molded, and it is necessary to integrally form the first pedestal 12 and the second pedestal 22,
  • the first photosensitive element 13 and the second photosensitive element 23 are respectively disposed on the first wiring board 11 and the second wiring board 21, such as by surface mounting, to the first photosensitive element 13 and
  • the second photosensitive elements 23 are respectively disposed on the first circuit board 11 and the second circuit board 21, or the first photosensitive element 13 or the second photosensitive element 23 are respectively packaged in the first by a viscous medium.
  • a circuit board and the second circuit board 21 are packaged, for example, by glue.
  • FIG. 17 is a schematic diagram of an array camera module 100 in accordance with a thirteenth preferred embodiment of the present invention.
  • the array camera module 100 includes three camera module units, which are a first camera module unit 10, a second camera module unit 20, and a third camera module unit 30.
  • the first camera module unit 10 and the second camera module unit 20 and the third camera module unit 30 have a height difference H, and the first camera module unit 10 and the second The outer end portions of the camera module unit 20 and the third camera module unit 30 coincide with each other.
  • the heights of the first camera module unit 10 and the camera module unit are the same.
  • the first pedestal 12 includes an extending portion 124, and the third camera module unit 30 and the second camera module unit 20 are respectively disposed on the extending portion 124, thereby A camera module unit 10, the second camera module unit 20, and the third camera module unit 30 are structurally and stably connected.
  • the extension portion 124 simultaneously provides a mounting plane for the third circuit board 31 and the second circuit board 21.
  • the second pedestal 22 of the second camera module unit 20 and the third pedestal 32 of the third camera module unit 30 are integrally connected. Therefore, the optical axes of the first camera module unit 10, the second camera module unit 20, and the third camera module unit 30 are consistent.
  • the array camera module 100 includes at least two camera module units, and at least two outer end faces of the camera module unit. Consistently, at least two of the camera module units have a height difference H at the bottom thereof to form a height difference space 110.
  • the two camera module units are a first camera module unit 10 and a second camera module unit 20, respectively.
  • the first camera module unit 10 includes a first circuit board 11 , a first photosensitive element 13 , and a first lens 14 .
  • the second camera module unit 20 includes a second circuit board 21 , a second photosensitive element 23 , and at least one second lens 24 .
  • the first camera module unit 10 includes a first base 12, and the first base 12 is fixedly connected to the first circuit board 11.
  • the first base 12 includes a first base body 123 and an extension portion 124.
  • the first base body 123 is fixedly connected to the first circuit board 11, and the extension portion 124 is from the base.
  • the body extends at least partially outwardly to facilitate the second camera module unit 20 to provide a mounting position.
  • the second circuit board 21 is fixedly connected to the extending portion 124 of the first pedestal 12, so that the first camera module unit 10 and the second camera module are passed through the first pedestal 12.
  • the group unit 20 is stably connected together.
  • the first photosensitive element 13 is electrically connected to the first circuit board 11 to transfer photosensitive information to the first circuit board 11, and the first lens 14 is located in a photosensitive path of the first photosensitive element 13. In order to allow the first photosensitive element 13 to receive light, it is photosensitive.
  • the second photosensitive element 23 is electrically connected to the second circuit board 21 to transfer photosensitive information to the second circuit board 21, and the second lens 24 is located in the photosensitive path of the second photosensitive element 23.
  • the second photosensitive element 23 is sensitized so as to receive light.
  • the first photosensitive element 13 and the second photosensitive element 23 may be respectively disposed on the surface by a surface mount technology (SMT) or a COB (Chip On Board) process.
  • SMT surface mount technology
  • COB Chip On Board
  • the first circuit board 11 and the second circuit board 21 are electrically connected to the first circuit board 11 and the second circuit board by at least a first electrical connection element 133 and a second electrical connection element 233, respectively twenty one.
  • the first electrical connection element 133 and the second electrical connection element 233 are by way of example and not limitation, gold wire, silver wire, copper wire, aluminum wire, pad, pin, or the like.
  • the first susceptor 12 is disposed on the first circuit board 11 by integral molding, such as molding, thereby the first pedestal 12 and the first A circuit board 11 is stably fixed and reduces an additional mounting and fixing process. For example, the process of reducing the glue bonding, the connection is more stable, the height of the glue connection is omitted, and the height of the camera module unit is lowered.
  • the first photosensitive element 13 has a photosensitive area 131 and a non-sensitive area 132 for performing a photosensitive effect.
  • the non-photosensitive region 132 is electrically connected to the wiring board 11 through the electrical connection member 133.
  • the susceptor 12 is at least partially integrally formed in the non-photosensitive region 132 of the photosensitive member 13.
  • the first susceptor 12 integrally encapsulates the first wiring board 11 and the first photosensitive element 13.
  • the pedestal 12 encases the electrical connection element 133.
  • FIG. 18B a modified embodiment of a fourteenth preferred embodiment of the present invention, in which the photosensitive element of at least one of the camera modules is at least partially covered by the base
  • the device is integrally packaged, and at least one of the photosensitive elements of the camera module is not integrally packaged by the base.
  • at least a portion of the non-photosensitive area 132 of the first photosensitive element 13 of the first circuit board 11 of the first camera module unit 10 is integrally packaged by the first pedestal 12.
  • the second circuit board 21 of the second camera module unit 20 is integrally packaged by the second base. That is, the second photosensitive element 23 is not integrally packaged by the second base.
  • the manner in which the photosensitive elements of the embodiments of the present invention are packaged and the manner in which the photosensitive elements are mounted in other embodiments can be freely combined to form an array camera module of different structures, and the present invention is not limited in this respect. .
  • the manner in which the susceptor can be integrally molded is extended to the non-photosensitive of the photosensitive member in a manner of molding on the photosensitive member. a region, thereby increasing the connection area of the bottom of the base without affecting the normal photosensitive operation of the photosensitive member, so that the base and the wiring board and the photosensitive member can be made more stable Connected, and the top portion can be other components, such as the lens, the lens support member, etc., providing a larger mountable area.
  • the electrical connection element 133 is covered by the susceptor 12, thereby avoiding external interference with the electrical connection element 133, and preventing the electrical connection element 133 from oxidizing or contaminating dust to affect the imaging quality of the camera module unit. .
  • the first susceptor 12 may be integrally formed on the first circuit board 11 by mold molding, such as molding in a photosensitive photosensitive member, which is different from the conventional COB method.
  • mold molding such as molding in a photosensitive photosensitive member, which is different from the conventional COB method.
  • the molding shape and the surface flatness can be well controlled, for example, the extension portion 124 has a better flatness, thereby providing the second camera module unit 20 with a flat mounting condition. It helps to ensure the optical axis consistency of the first camera module unit 10 and the second camera module unit 20.
  • the optical axes are the same, that is, the central optical axis directions of the two camera module units are parallel, or the angle between the two central optical axes is within a predetermined error range, and the present invention is not limited in this respect. .
  • the extending portion 124 has a supporting surface 1241 extending away from the first camera module unit 10 such that the first camera module unit 10 is juxtaposed to the The second camera module unit 20.
  • the height of the extension portion 124 is higher than the height of the optical axis of the camera module unit, and the height of the extension portion 124 is higher than the first circuit board 11, so that the first base 12 and the first circuit board 11 form the height difference.
  • Space 110 That is, the extension portion 124 and the first circuit board 11 have a height difference, so that the second camera module unit 20 and the first camera module unit 10 are mounted on the extension portion 124.
  • the height difference between the first camera module unit 10 and the second camera module unit 20 is compensated by the height difference between the extension portion 124 and the first circuit board 11 so that two The camera modules of different heights are stably assembled together, and the outer end faces are kept consistent, so that the first camera module unit 10 and the second camera module unit 20 are arranged side by side in the same direction, and The light incident surfaces are uniform, so that when the first camera module unit 10 and the second camera module unit 20 cooperate with each other to acquire image information, more accurate information can be obtained.
  • the height difference space 110 is located at the bottom of the array camera module 100.
  • the height difference space 110 is located inside the electronic device. So that the exterior of the electronic device remains relatively flat, and components of the electronic device can be disposed in the height difference space 110, thereby making full use of the internal space of the electronic device, which is more beneficial to the electronic device being thin and light. Development.
  • the support surface 1241 of the extending portion 124 is formed by integrally molding a mold, so that better flatness can be ensured, and the direction of the extending portion 124 and the first circuit board 11 can be made uniform by mold control.
  • the direction of the extending portion 124 is parallel to the direction of the first circuit board 11, so that the directions of the first circuit board 11 and the second circuit board 21 are the same, and the first imaging mode is
  • the group unit 10 and the second camera module unit 20 provide a consistent mounting base such that the optical axes of the first camera module unit 10 and the second camera module unit 20 are identical.
  • the first circuit board 11 includes a first circuit board body 111 and at least one first electronic component 112, and the first electronic component 112 protrudes from the first circuit board.
  • the main body 111 is configured to cooperate with the operation of the first circuit board main body 111.
  • the first pedestal 12 is integrally formed on the first circuit board body 111 and covers the first electronic component 112, thereby reducing the occupied space of the first electronic component 212.
  • the first electronic component 212 is by way of example and not limitation, a resistor, a capacitor, a driver, or the like.
  • the first electronic component 112 may not be disposed or the first electronic component 112 may protrude from the first circuit board body 111, such as embedded in the first The circuit board main body 111, the present invention is not limited in this respect.
  • Each of the first electronic components 112 may be attached to an edge region of the first wiring board 11, such as outside the first photosensitive member 13, by being spaced apart from each other by, for example, an SMT process. It is worth mentioning that each of the first electronic components 112 may be located on the same side or the opposite side of the first circuit board 11, for example, in one specific example, the first photosensitive element 13 and each of the The first electronic components 112 may be respectively located on the same side of the first circuit board 11, and the first photosensitive elements 13 are mounted on the chip mounting area of the first circuit board 11, each of the first An electronic component 112 is attached to the edge region of the first wiring board 11 at a distance from each other.
  • the first pedestal 12 covers each of the first electronic components 112 after molding to isolate adjacent first electronic components 112 and isolate the first electronic components by the first pedestal 12 112 and the first photosensitive element 13.
  • the first susceptor 12 is coated with each of the first electronic component 112 and the first electrical connection component 133 after molding.
  • the first pedestal 12 envelops each of the first electronic component 112 and the first electrical connection component 133 such that between the adjacent first electronic components 112 and the first electrical connection component There is no problem of mutual interference between 133, and the imaging quality of the camera module unit can be ensured even when the distance between the adjacent first electronic component 112 and the first electrical connection component 133 is relatively close.
  • a small number of the first circuit boards 11 can be mounted with a larger number of the first electronic components 112, thereby making the structure of the camera module unit more compact, which is advantageous for control.
  • the first base 12 covers each of the first electronic component 112 and the first electrical connection component 133, thus whether in the horizontal direction In the height direction, there is no need to reserve a safety distance between the first pedestal 12 and each of the first electronic components 112 and between the first electrical connection elements 133 to enable The size of the camera module unit.
  • the first pedestal 12 covers each of the first electronic component 112 and the first electrical connection component 133 such that no between the first pedestal 12 and the first circuit board 11 Glue is required for connection and leveling to facilitate reducing the height dimension of the camera module unit.
  • the first pedestal 12 covers each of the first electronic component 112 and the first electrical connection component 133, and subsequently transports and assembles the camera module unit to form the array camera module.
  • the first pedestal 12 can prevent the first electronic component 112 and the first electrical connection component 133 from shaking and falling off, thereby facilitating structural stability of the array camera module 100.
  • the first pedestal 1223 covers each of the first electronic component 112 and the first electrical connection component 133, and subsequently transports and assembles the camera module unit to form the array camera module.
  • the first susceptor 12 can cover the electronic component to isolate the first electronic component 112 and the first electrical connection component 133 from the air. In this manner, the first The oxidation rate and the aging speed of the electronic component 112 and the first electrical connection component 133 are beneficial to improve the environmental stability of the first electronic component 112 and the first electrical connection component 133 and the array camera module 100. .
  • the first pedestal 12 is integrally formed on the first circuit board 11 and covers the first electronic component 112 of the first circuit board 11 and the first electrical connection component. 133, so that the first pedestal 12 and the first circuit board main body 111 have a larger connection area, and the connection is more stable, so that the extension portion 124 can provide stable support, and has an integral molding manner.
  • the structural strength is good, so that the extending portion 124 can firmly and reliably support and fix the second camera module unit 20, thereby ensuring the yield of the product.
  • the second camera module unit 20 is mounted on the extension portion 124 of the first base 12 so as to be able to pass through the extension length of the extension portion 124 and the second camera.
  • the installation position of the module unit 20 conveniently controls the distance between the first camera module unit 10 and the second camera module unit 20, thereby conveniently meeting the cooperation requirements of different types of camera module units.
  • the first susceptor 12 has a first light window 121 to facilitate providing a light path for the first photosensitive element 13.
  • the first photosensitive element 13 is located in the first light window 121, and the photosensitive path of the first photosensitive element 13 is aligned with the direction of the first light window 121.
  • the first pedestal body 123 forms the first light window 121 to provide a light path for the first photosensitive element 13.
  • the first base body 123 is a closed loop structure that accommodates the shape of the first photosensitive element 13.
  • the first base 12 has a first mounting slot 122 that communicates with the first light window 121.
  • the first camera module unit 10 includes a first filter element 16 between the first lens 14 and the first photosensitive element 13 to facilitate filtering through the The first lens 14 reaches the light of the first photosensitive element 13.
  • the first filter element 16 is mounted to the first mounting slot 122.
  • the second camera module unit 20 includes a second base 22, and the second base 22 is fixedly connected to the second circuit board 21.
  • the second base 22 includes a second base body 223 and has a second light window 221 .
  • the second pedestal body 223 forms the second light window 221 to provide a light path for the second photosensitive element 23.
  • the second photosensitive element 23 is located in the second light window 221, and the second photosensitive element 23 and the second light window 221 are aligned in the same direction.
  • the second base body 223 is a closed loop structure that accommodates the shape of the second photosensitive element 23.
  • the second base 22 has a second mounting slot 222 communicating with the second light window 221 , and the second mounting slot 222 is disposed on the second base body 223 .
  • the second camera module unit 20 includes a second filter element 26, and the second filter element 26 is located between the second lens 24 and the second photosensitive element 23 to facilitate filtering through the The second lens 24 reaches the light of the second photosensitive element 23.
  • the second filter element 26 is mounted to the first mounting groove 122.
  • the first filter element 16 and the second filter element 26 can be implemented in different types, for example, the filter element can be implemented as an infrared cut filter, a full transmissive spectrum filter, a blue glass a filter and other filters or a combination of a plurality of filters, for example, the filter element can be implemented as a combination of an infrared cut filter and a full transmissive filter, ie, the infrared cut filter
  • the sheet and the full transmissive spectral filter can be switched to be selectively located on the photosensitive path of the photosensitive element, for example, when the array camera module 100 is used in an environment with sufficient light during daylight hours,
  • the infrared cut filter is switched to the photosensitive path of the photosensitive element to filter infrared rays entering the light reflected by the object of the camera module unit by the infrared cut filter, and the light is dark at night
  • the full transmissive spectral filter can be switched to a photosensitive path of the photosensitive element to allow the received
  • the second photosensitive element 23 has a photosensitive area 221 and a non-sensitive area 222 for performing photosensitivity.
  • the non-photosensitive region 222 is electrically connected to the circuit board 21 through the electrical connection member 233.
  • the susceptor 22 is at least partially integrally formed in the non-photosensitive region 222 of the photosensitive element 23.
  • the first susceptor 22 integrally encapsulates the first wiring board 21 and the first photosensitive element 23.
  • the pedestal 22 encloses the electrical connection element 233.
  • the second pedestal 22 is integrally formed on the second wiring board 21 and at least a portion of the non-photosensitive area 222, thereby the second pedestal 22 and the first
  • the two wiring boards 21 and the second photosensitive member 23 are stably fixed, and an additional mounting and fixing process is reduced.
  • the process of reducing the glue bonding, the connection is more stable, the height of the glue connection is omitted, and the height of the camera module unit is lowered.
  • the second circuit board 21 includes a second circuit board body 211 and at least one second electronic component 212.
  • the second electronic component 212 protrudes from the second circuit board body 211 for mating with the second The operation of the board main body 211.
  • the second pedestal 22 is integrally formed on the second circuit board body 211 and covers the second electronic component 212 and the second electrical connection component 233.
  • the second base 22 can be integrally formed in the same manner as the first base 12, and has the same advantages as the first base 12, and details are not described herein again.
  • the first camera module unit 10 includes at least one first lens support member 15, and the first lens 14 is mounted on the first lens support member 15, A lens supporting member 15 is mounted to the first base body 123 of the first base 12 such that the first lens 14 is located in a photosensitive path of the first photosensitive member 13.
  • the second camera module unit 20 includes at least one second lens support member 25, the second lens 24 is mounted to the second lens support member 25, and the second lens support member 25 is mounted on the The second base body 223 is such that the second lens 24 is located in the photosensitive path of the second photosensitive element 23.
  • first lens supporting component 15 and the second lens supporting component 25 can be implemented as a driving component or a mirror base component to form a dynamic focus camera module or a fixed focus camera module.
  • the drive element is by way of example and not limitation, a voice coil motor, a piezoelectric motor or the like.
  • both the first camera module unit 10 and the second camera module unit 20 are The focus camera module, that is, the array camera module 100 is composed of two fixed focus camera modules.
  • the first camera module unit 10 is a dynamic focus camera module
  • the The two camera module unit 20 is a fixed focus camera module, that is, the array camera module 100 is composed of a moving focus camera module and a fixed focus camera module.
  • the first lens supporting element 15 is implemented as a lens holder element and the second lens 24 element is implemented as a lens holder element
  • the first camera module unit 10 is a fixed focus camera module
  • the second camera module unit 20 is a dynamic focus camera module.
  • both the first camera module unit 10 and the second camera module unit 20 are Fixed focus camera module.
  • the first lens support element 15 or the second lens support element 25 when the first lens support element 15 or the second lens support element 25 is implemented as a drive element, the first lens support element 15 and the second The lens support member 25 is electrically connected to the first circuit board 11 or the second circuit board 21 to facilitate driving the first lens 14 or the second lens 24 to operate.
  • the first lens supporting member 15 and the second lens supporting member 25 may be electrically connected to the first circuit board 11 or the second circuit board 21 by providing pins, pads or leads or the like. .
  • the types of the first camera module unit 10 and the second camera module unit 20 can be configured according to requirements, so as to cooperate with each other to achieve better image acquisition effects.
  • the invention is not limited in this regard.
  • the first lens supporting member 15 is mounted on a top surface of the first base body 123, and the first filter element 16 is mounted.
  • the second lens supporting member 25 is mounted on the top of the second base body 223
  • the second filter element 26 is mounted on the second mounting groove 222 of the second base 22, and the first base 12 and the second base 22 can be integrally formed.
  • the first filter element 16, the second filter element 26, the first lens support element 15 and the second lens support element 25 and the like provide flat, uniform mounting conditions, thereby improving the first imaging
  • the assembly precision of the module unit 10 and the second camera module unit 20 is reduced, and the accumulation is reduced. The error is helpful to improve the consistency of the central optical axes of the first camera module unit 10 and the second camera module unit 20.
  • the first circuit board 11, the first base 12, the first photosensitive element 13, the second circuit board 21, and the second photosensitive element 23 constitute an array circuit board assembly, which can be conveniently Different types of lenses are respectively mounted on the first pedestal 12 and the second pedestal 22 to constitute the array camera module 100 having a predetermined height difference H.
  • the array camera module 100 includes at least one array circuit board assembly having a height difference and two of the lenses, and the two lenses are respectively located in two photosensitive paths of the array circuit board assembly.
  • the array circuit board assembly of the array camera module 100 may be formed by first attaching the first photosensitive element 13 and the second photosensitive element 23 to the first a wiring board 11 and the second wiring board 21, and electrically connecting the photosensitive element and the wiring board through the electrical connection member, and further at least the first wiring board 11 and the first photosensitive element 13 Part of the non-photosensitive region 132 is integrally formed to form the first pedestal 12 with the extension portion 124, and the first pedestal body 123 of the first pedestal 12 is coated with the first The first electronic component 112 and the first electrical connection component 133 on the circuit board body 111; and then the second circuit board 21 is mounted to the extension portion 124 of the first pedestal 12; further, Forming the second pedestal 22 in the second circuit board 21 and at least a portion of the non-photosensitive area 232 of the second photosensitive element 23, and causing the second pedestal 22 to cover the The second electronic component 212 and the second electrical connection component 233 of the two circuit boards 21, and The photosensitive region 131 of the first photosensitive element 13
  • the second circuit board 21 is a schematic diagram of an array camera module 100 in accordance with a fifteenth preferred embodiment of the present invention.
  • the second circuit board 21 is buried in the extension portion 124 of the first pedestal 12, thereby lowering the second circuit board 21
  • the relative height of the extension portion 124 reduces the mounting and fixing process of the second circuit board 21.
  • the second pedestal 22 is integrally connected to the first pedestal 12.
  • the second circuit board body 211 has at least one second electrical connection region 2111 to electrically connect the second photosensitive element 23.
  • the second electrical connection element 233 is electrically connected to the second photosensitive element 23 and the second electrical connection region 2111 by means of a gold wire, so that the second photosensitive element 23 and the second The circuit board 21 is electrically connected.
  • the circuit boards 11, 21 with the photosensitive elements 13, 23 may be respectively disposed at predetermined positions, and then integrally formed to form the first base and the second base, and The extension of the first pedestal is wrapped around the bottom of the second circuit board.
  • the second electrical connection region 2111 is exemplified, but not limited to, implemented as a strip pad.
  • the second photosensitive element 23 is electrically connected to the second wiring board in such a manner that the second electrical connection element 233 is disposed on all four sides.
  • the second circuit board 21 has four second electrical connection regions 2111, which are respectively disposed on opposite sides. Four of the second electrical connection regions 2111 are exposed on the surface of the extension 124.
  • the second photosensitive element 23 is electrically connected to each of the second electrical connection regions 2111 through each of the second electrical connection elements 233.
  • the second pedestal 22 is disposed on the first pedestal 1 by a second integral molding. That is, when the array circuit board assembly is manufactured, the first circuit board 11 and the second circuit board 21 are integrally imaged to form the first base 12, and the The second electrical connection region 2111 of the second circuit board 21 is exposed to the outside, and then the second photosensitive element 23 is disposed on the second wiring board 21, and the electrical connection element 233 is electrically connected through the electrical connection element 233. The second photosensitive element 23 and the second electrical connection region 2111 of the wiring board 21 are then integrally formed on the second wiring board 21 to form the second pedestal 22.
  • the second photosensitive element 23 may be first disposed on the second circuit board 21, and the first base 11 and the second base may be formed later, and The second circuit board 21 is wrapped around the extension portion 124 of the first pedestal 11.
  • the array circuit board assembly includes a connection board 128 connected to the first circuit board 11 and the second circuit board 21. More specifically, the connecting plate 128 electrically connects the first wiring board 11 and the second wiring board 21 such that the first wiring board 11 and the second wiring board 21 are in communication with each other. When the first circuit board 11 and the second circuit board 21 are electrically connected, the first circuit board and the second circuit board 21 may share one output end.
  • the web 128 is exemplified by, but not limited to, a soft board.
  • the first base 12 includes a first extending mounting portion 125 extending at least partially upward from the first base body 123 and forming a first limiting slot 126.
  • the first lens 14 or the first lens support member 15 is mounted at a limit.
  • the second base 22 includes a second extension mounting portion 225 extending at least partially upward from the second base body 223 and forming a second limiting slot 226 for limiting the mounting of the second base The lens 24 or the second lens support member 25.
  • the first lens 14 is mounted to the first limiting slot 126. That is, the shape of the first extension mounting portion 125 is adapted to the first lens 14 to be adapted to limit and mount the first lens 14 to form a certain focus camera module.
  • the second lens 24 is mounted to the second limiting slot 226. That is, the shape of the second extension mounting portion 225 is adapted to the second lens 24 to be adapted to limit and mount the second lens 24 to form a fixed focus camera module. That is to say, the two array camera module 100 units of the array camera module 100 are all fixed focus camera modules.
  • the first lens support member 15 is mounted to the first limit slot 126, and the first lens 14 is mounted to the first lens support member 15,
  • the first lens supporting element 15 is implemented as a driving element, so that the first camera module unit 10 forms a moving focus camera module.
  • the second lens support member 25 is mounted to the second limit slot 226, the second lens 24 is mounted to the second lens support member 25, and the second lens support member 25 is implemented as a Driving the component such that the second camera module unit 20 forms a dynamic focus camera module. That is to say, the two camera module units of the array camera module 100 are all dynamic focus camera modules.
  • a combination of a dynamic focus and a fixed focus may also be used, and the present invention is not limited in this regard.
  • the first camera module unit 10 includes a first mount 18 for mounting other components, such as the first filter element 16, the first lens 14 or the The first lens support member 15.
  • the first holder 18 is mounted to the first base body 123, and the first filter element 16 is mounted to the first holder 18.
  • the first mount 18 sinks within the first light window 121 of the first pedestal 12 such that the position of the first filter element 16 sinks, close to the first
  • the photosensitive element 13 reduces the back focal length of the first camera module unit 10 and reduces the required area of the first filter element 16.
  • the second mount 28 is mounted to the second base body 223, and the second filter element 26 is mounted to the second mount 28.
  • the second mount 28 sinks within the second light window 221 of the second pedestal 22 such that the position of the second filter element 26 sinks, near the second
  • the photosensitive element 23 reduces the back focal length of the second camera module unit 20 and reduces the required area of the second filter element 26.
  • the array camera module 100 may include only one of the supports, such as the first support 18 or the second support 28, as those skilled in the art should understand. The number of the supports is not a limitation of the present invention.
  • the first mount 18 is mounted to the first mounting slot 122 of the first base 12, and the second mount 28 is mounted to the second base 22 The second mounting slot 222.
  • the first base body 123 and the second base body 223 may be a platform structure, and the first support 18 and the second support 28 are not oriented. Sinking and being directly mounted to the platform structure of the first abutment 18 and the second abutment 28, those skilled in the art will appreciate that the mounting position and specific structure of the abutment are not Limitations of the invention.
  • the first camera module unit 10 includes a first supplementary base 19, and the first supplementary base 19 is additionally mounted on the first base body 123, and cooperates with the first base body 123.
  • the first light window 121 is described. That is, in this embodiment, the first base body 123 is not a closed annular structure, but is supplemented by the first supplemental base 19 to form a closed annular structure. In other words, the first base body 123 has at least one first notch 1231 communicating with the outside, and the first supplementary base 19 is at least partially supplemented by the first notch 1231.
  • the first notch 1231 limits the position of the first supplemental base 19 such that the supplement can be installed accurately and quickly.
  • the shape of the first notch 1231 and the first supplementary base 19 may be set according to requirements, such as an inverted trapezoidal structure, a triangular structure, a directional structure, etc., and the invention is not limited in this respect.
  • the second camera module unit 20 includes a second supplementary base 29.
  • the second supplementary base 29 is additionally mounted on the second base body 223, and cooperates with the second base body 223.
  • the second light window 221 is described. That is, in this embodiment, the second base body 223 is not a closed annular structure, but is supplemented by the second supplementary base 29 to form a closed annular structure.
  • the second base body 223 has at least one second notch 2231 communicating with the outside, and the second supplementary base 29 is at least partially supplemented by the second notch 2231.
  • the second notch 2231 limits the position of the second supplemental support 18 such that the supplement can be installed accurately and quickly.
  • the shapes of the second notch 2231 and the second supplementary base 29 may be set according to requirements, such as an inverted trapezoidal structure, a triangular structure, a directional structure, etc., and the invention is not limited in this respect.
  • the array camera module 100 may include a supplementary base such as the first supplementary base 19 or the second supplementary base 29, which is technical in the art. It should be understood by those skilled in the art that the shape and number of the supplemental pedestals are not a limitation of the present invention.
  • FIG. 26 is a schematic diagram of an array camera module 100 in accordance with a nineteenth preferred embodiment of the present invention.
  • the second circuit board body 211 has a second sinker hole 2112, and the second photosensitive element 23 is sunk in the second sinker hole 2112, thereby reducing the number.
  • the relative heights of the two photosensitive elements 23 and the second wiring board main body 211 are not limited to that of the two photosensitive elements 23 and the second wiring board main body 211.
  • the second sinker hole 2112 is connected to both sides of the second circuit board 21, and when the second photosensitive element 23 sinks to the second sinker hole 2112, the second photosensitive element 23
  • the bottom portion is supported by the extension 124 of the first pedestal 12. That is, the extension 124 provides a mounting plane for the second photosensitive element 23.
  • the first pedestal 12 is formed on the first circuit board 11 by integral molding, so that the extension portion 124 and the first circuit board 11 extend to have a good consistency, so that the second The photosensitive element 23 and the first circuit board 11 have better consistency, so that the first camera module unit 10 and the second camera module unit 20 have better optical axis consistency.
  • FIG. 27 is a schematic diagram of an array camera module 100 in accordance with a twentieth preferred embodiment of the present invention.
  • the second base body 223 and the second base body 223 are integrally connected, and the first base body 123 is fixedly connected to the first circuit board 11, the first The second base body 223 is fixedly coupled to the second circuit board 21 to stably connect the first camera module unit 10 and the second camera module unit 20.
  • the first pedestal 12 does not form the extension portion 124, and the two bases 223 and the first pedestal body 123 are integrally connected by the second connection.
  • the first camera module unit 10 and the second camera module unit 20 are fixedly connected.
  • the first pedestal 12 and the second pedestal 22 have a height difference.
  • the first circuit board 11 and the second circuit board 21 are disposed at predetermined positions with a predetermined height difference, and further, respectively, in the first circuit board 11 and the The predetermined position of the second circuit board 21 forms the first base body 123 and the second base body 223 such that the relative positions of the first circuit board 11 and the second circuit board 21 are determined and have The height difference.
  • the first photosensitive element 13 and the second photosensitive element 23 are mounted on the first wiring board 11 and the second wiring board 21.
  • other sequential manufacturing methods are also possible, and the present invention is not limited in this regard.
  • the array camera module 100 includes a support plate 129 .
  • the support plate 129 is fixedly connected to the first base body 123 , and the second circuit board 21 is mounted on the support plate 129 .
  • the support plate 129 has a through hole 1290 corresponding to the first light window 121 to provide a light path for the first photosensitive element 13.
  • the first pedestal 12 does not form the extension portion 124, and the first camera module unit 10 and the second camera module are fixedly connected by the support plate 129.
  • the unit 20 is configured such that the bottom of the second camera module unit 20 of the first camera module unit 10 has a height difference and the outer ends are identical.
  • the support plate 129 is exemplified by, but not limited to, a steel plate.
  • 29 is a schematic diagram of an array camera module 100 in accordance with a twenty-second preferred embodiment of the present invention.
  • the extension 124 of the first pedestal 12 expands downward such that the bottom of the extension 124 coincides with the bottom of the first circuit board 11. That is to say, the array camera module 100 as a whole has the same outer end portion and the bottom portion, thereby forming a relatively regular and flat structure, which is convenient for mounting on an electronic device.
  • the first base 12 includes a first support member 127 for supporting the mold during manufacture to prevent the first circuit board 11 or the first photosensitive member 13 from being damage. That is, during the manufacturing process, the manufacturing mold may be abutted against the first support member 127 such that the mold does not directly contact the first wiring board 11 or the first photosensitive element 13, And the molding material is prevented from overflowing to the inside.
  • first support member 127 may have an annular structure conforming to the shape of the first base body 123.
  • the first support element 127 has elasticity, such as, but not limited to, a glue coating or a rubber pad.
  • the side wall of the first base body 123 has an inclination angle, thereby facilitating mold manufacturing, such as facilitating the drafting process, and reducing the occurrence of burrs at the bottom of the first base body 123.
  • the second base 22 includes a second support member 227 for supporting the mold during manufacture to prevent damage to the second wiring board 21 or the second photosensitive member 23. That is, during the manufacturing process, the manufacturing mold can be abutted against the second support member 227 such that the mold does not directly contact the first circuit board 11 or the second photosensitive element 23, And the molding material is prevented from overflowing to the inside.
  • the second support member 227 may have an annular structure conforming to the shape of the second base body 223.
  • the second support element 227 has elasticity, such as, but not limited to, a glue coating or a rubber pad.
  • the sidewall of the second base body 223 has an inclination angle, thereby facilitating mold manufacturing, such as facilitating the drafting process, and reducing the occurrence of burrs at the bottom of the second base body 223.
  • FIG. 31 is a schematic diagram of an array camera module 100 in accordance with a twenty-fourth preferred embodiment of the present invention.
  • the first filter element 16 is fixedly coupled to the first base body 123.
  • the first filter element 16 is fixedly coupled to the first base body 123 by integral molding.
  • first filter element 16 is supported by the first support element 127, thereby facilitating the fixed connection of the first filter element 16 in one piece.
  • the second filter element 26 is fixedly coupled to the second base body 223. Specifically, the second filter element 26 is fixedly coupled to the second base body 223 by integral molding.
  • the second filter element 26 is supported by the second support member 227, thereby facilitating the fixed connection of the second filter element 26 integrally.
  • the filter elements 16, 26 may be integrally molded to each of the base bodies 123, 223 by molding.
  • the array circuit board assembly of the array camera module 100 may be formed by first setting the first on the first circuit board 11 and the second circuit board 21, respectively. a support member 127 and the second support member 227, and then the first filter member 16 is disposed on the first support member 127, and then integrally formed over the first filter member 16 to form the first a susceptor 12 for integrally fixing the first filter element 16; the second circuit board 21 is further disposed on the extending portion 124 of the first pedestal 12, further The second filter element 26 is disposed on the second support member 227, and the second base body 223 is integrally formed over the second filter element 26, thereby integrally molding the second filter element 26. Ground fixed.
  • the first camera module unit 10 and the second camera module unit 20 each include at least one support member 127, 227 and at least one lens 17, 27, each of the lenses 17, 27
  • the first base body 123 and the second base body 223 are respectively disposed.
  • the lenses 17, 27 are integrally molded to the first base body 123 and the second base body 223, respectively located at the first photosensitive element 13 and the second photosensitive element 23. Photosensitive path.
  • the arrangement of the lenses 17, 27 can reduce the optical TTL (the distance from the lens plane above the lens aperture to the photosensitive plane of the chip), thereby further sizing the camera module without affecting optical performance. The reduction meets the demand of the electronic device for mounting the small-sized array camera module 100.
  • the arrangement of the lenses 17, 27 can also reduce stain sensitivity. For example, in one embodiment, stain sensitivity of 50% can be reduced.
  • the lenses 17, 27 are embodied as a lens of thermosetting nature, i.e. the lenses 17, 27 are embodied as a thermally hardened lens such that the lens 17, 27
  • the molding process is capable of withstanding the ambient temperature during the molding process. For example, it is capable of withstanding a molding ambient temperature of 175 ° C in the molding process of an embodiment. That is, prior to the molding process, the high temperature resistant and thermally hardened lens 17 is attached to the support member 127 and placed in the mold together with the first circuit board 11, fluid The cured molding material integrally molds the first base 12 around the support member 127 and the outer surface of the lens 17, so that the first base 12 can be integrally molded to the first circuit board 11.
  • the first pedestal 12, the first wiring board 11, and the lens 17 form a unitary structure.
  • the lenses 17, 27 of the present invention may be not only thermostable lenses 17, 27, but also lenses 17, 27 of other nature, and the invention is not so limited.
  • another of the lens 27, the second pedestal 22, and the second wiring board 21 may be integrally formed into a unitary structure.
  • the lenses 17, 27 include a lens body 171, 271 and a lens perimeter 172, 272 disposed about the lens body 171, 271. Since the lenses 17, 27 are precision optical components, the edges of the lens bodies 171, 271 are relatively thin. The lens peripheral edges 172, 272 disposed at the edges of the lens bodies 171, 271 and integrally connected are thickened bracket designs capable of carrying the lens bodies 171, 271 so as not to affect the optical performance of the lens bodies 171, 271 while enabling The lens bodies 171, 271 are integrally molded to the base in a mold. That is, before the pedestal is formed, the lens perimeters 172, 272 of the lenses 17, 27 are disposed in the non-photosensitive area of the photosensitive element, the lens body of the lenses 17, 27. 171, 271 is disposed on a photosensitive path of the photosensitive member; after the susceptor is formed, the molding base covers the wiring board, a portion of the photosensitive member, and the lens 17, 27 The lens perimeter 172, 272.
  • the supporting component and the lens 17 , 27 can effectively improve the product yield of the array camera module 100 and improve the imaging quality of the array camera module 100 .
  • the support member 127, 227 includes a frame-shaped support body and has a through hole, wherein the support body is disposed on the circuit board such that a photosensitive area of the photosensitive element corresponds to the support element
  • the through hole and the lens bodies 171, 271 of the lenses 17, 27 enable the support body and the lenses 17, 27 to protect the photosensitive element during the molding process.
  • the first photosensitive element 13 and the first second photosensitive element 23 are not integrally molded, and it is necessary to integrally form the first pedestal 12 and the second pedestal 22 Previously, the first photosensitive element 13 and the second photosensitive element 23 are respectively disposed on the first wiring board 11 and the second wiring board 21.
  • the array camera module 100 includes three camera module units, which are a first camera module unit 10, a second camera module unit 20, and a third camera module unit 30.
  • the first camera module unit 10 and the second camera module unit 20 and the third camera module unit 30 have a height difference H, and the first camera module unit 10 and the second The outer end portions of the camera module unit 20 and the third camera module unit 30 coincide with each other.
  • the heights of the first camera module unit 10 and the camera module unit are the same.
  • the first pedestal 12 includes an extending portion 124, and the first camera module unit 10 and the second camera module unit 20 are respectively disposed on the extending portion 124, thereby A camera module unit 10, the second camera module unit 20, and the third camera module unit are structurally and stably connected.
  • the extension portion 124 simultaneously provides a mounting plane for the first circuit board 11 and the second circuit board 21.
  • the second pedestal 22 of the second camera module unit 20 and the third pedestal 32 of the third camera module unit 30 are integrally connected. Therefore, the optical axes of the second camera module unit 20 and the third camera module unit 30 are consistent.
  • the array camera module includes an external connection terminal 30 for electrically connecting to an electronic device to facilitate transmitting information collected by the array camera module to the electronic device.
  • the outer connecting end 30 can be a soft connector. That is, in this embodiment of the present invention, the first camera module unit 10 and the second camera module unit 20 have the same outer connecting end 30, the first circuit board 11 and the The second circuit board 21 is electrically connected to the outer connection end 30.
  • the array camera module includes two external terminals 30 for electrically connecting to an electronic device, so as to transfer information collected by the array camera module to the electronic device.
  • the outer connecting end 30 can be a soft connector. That is, in this embodiment of the present invention, the first camera module unit 10 and the second camera module unit 20 each have the outer connecting end 30, the first circuit board 11 and the The second circuit boards 21 are electrically connected to the corresponding outer connecting ends 30, respectively.
  • the present invention provides a method 1000 of fabricating an array circuit board assembly having a height difference, the method comprising the steps of:
  • 1001 forming a first pedestal 12 with an extension 124 on a first circuit board 11;
  • a second circuit board 21 is disposed on the extension portion 124;
  • a first photosensitive element 13 and a second photosensitive element 23 are respectively disposed on the first circuit board 11 and the second circuit board.
  • the manner of formation in the step 1001 and the step 1003 may be an integrally formed manner, such as a molding method.
  • the extension portion 124 has a height difference from the first circuit board 11.
  • the extending direction of the extending portion is consistent with the first circuit board, so as to provide the second circuit board 21 with the mounting condition consistent with the first circuit board 11.
  • the step 1001 and the step 1002 may be performed simultaneously such that the second circuit board 21 is buried in the extension portion 124.
  • the step 1004 may be prior to the step 1001, such as setting the first photosensitive element 13 first, so that the first base integrally encapsulates the first circuit board 11 and at least part of the The non-photosensitive region 132 of the photosensitive member 13 is described.
  • first lens, the second lens, and the first filter element, the second filter element, and the like are respectively mounted on the array circuit board assembly, and the array camera module is assembled. .
  • the present invention further provides an electronic device 300, wherein the electronic device includes an electronic device body 200 and at least one array of camera modules 100, wherein each of the array camera modules is disposed on the electronic device body 200, respectively. Used to get an image.
  • the type of the electronic device body 200 is not limited.
  • the electronic device body 200 may be a smart phone, a wearable device, a tablet computer, a notebook computer, an e-book, a personal digital assistant, a camera, and a monitor. Any device or the like that can be configured with the camera module.
  • the electronic device body 200 is implemented as a smart phone in FIG. 36, it does not constitute a limitation on the content and scope of the present invention.
  • the ends of the array camera module are identical, so that the outer surface of the electronic device is flat.

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Abstract

具有高度差的阵列摄像模组和线路板组件及其制造方法和电子设备,所述阵列摄像模组单元包括一第一摄像模组单元和一第二摄像模组单元,其中所述第一摄像模组单元包括至少一第一感光组件和至少一第一镜头,所述第一镜头位于所述第一感光组件的感光路径,所述第一感光组件包括至少一延伸部,所述延伸部至少部分地向远离所述第一感光组件的方向延伸,所述第二摄像模组单元固定连接于所述第二延伸部,以使得两所述摄像模组单元的端部一致。

Description

具有高度差的阵列摄像模组和线路板组件及其制造方法和电子设备 技术领域
本发明涉及摄像模组领域,更进一步,涉及一具有高度差的阵列摄像模组和线路板组件及其制造方法和电子设备。
背景技术
随着智能设备的不断发展,对摄像模组的要求越来越高。比如,近两年来,智能手机的摄像头由单个变成双摄像头,而双摄像头模组的发展也成为手机摄像模组发展的一个重要趋势。
简单来说,双摄像头可以通过两个摄像头的配合采集图像,从而实现更加丰富的图像采集功能。现有的双摄像头按照功能主要可以分为两类:一类是利用双摄像头产生立体视觉,获得影像的景深,利用景深信息进行背景虚化,3D扫描,辅助对焦,动作识别等应用,或者利用两张图片的信息进行融合;另一类是利用左右两张不同的图片进行融合,以期望得到更高的分辨率,更好的色彩,动态范围等更好的图像质量或实现光学变焦的功能。
可是不管是哪一种功能的双摄像头,其都需要硬件的支撑,需要考虑最基本的一个问题,即,两个摄像头之间的组装固定问题。如何将两个摄像头稳定地、结构紧凑地组装在一起,使其成为一个整体的模组,是双摄像头模组考虑的基本问题。
进一步,构成双摄像头的两个摄像头通常是两个不同类型摄像头,比如一个用于成像,一个用于记录景深。这种不同功能的要求,通常使得两个摄像头的体积大小不同,比如高度不同,而如何将这样两个不同高度的摄像头进行稳定结合,使其成为一个整体,是双摄像头模组发展中遇到的另一个重要问题。
进一步地,对于两个需要配合摄像头如果要对同一目标进行相对准确的信息采集,需要使其光线入射面位置一致,类似于人的眼睛,处于相对一致的光线入射面,这样才能得到更加准确的信息。可是对于两个存在高度差,大小不同的摄像头来说,需要在硬件上进行特别设计,使得两个摄像头的外端面一致,以满足 两个摄像头的配合需求。
另一方面,摄像头在安装于电子设备,比如智能手机时,外部需要保持平整,两个摄像头外观保证美观,因此也要求两个摄像头的外端面高度一致。
进一步,两个相互配合的摄像头,各自采集图像信息,而图像采集的准确性以及成像质量和两个摄像头入射的光线息息相关,两个摄像头之间的光轴一致性,是保证摄像模组成像质量的基础。也就是说,如何在稳定地、结构紧凑地固定两个摄像头的基础上,提高两个摄像模组的光轴一致性,或者使其误差在预定范围内,提高安装的精度,使其具较好的成像质量,是双摄像头发展需要考虑的另一重要问题。
进一步,前面两类双摄像头功能对于摄像头的硬件有着不同的要求,前者要求两个摄像头之间有更大的间距,这样能够得到更高的景深精度,因此前者的硬件希望两个摄像头间的距离比较远才好;而后者因需要两颗摄像头的图片叠加合成,所以在硬件设计的时候希望两个摄像头离得比较近,这样在两个图像融合的时候才不会因为相差产生更多的错误。也就是说,两个摄像头之间距离的控制,是实现不同功能摄像头的一个考虑因素。
发明内容
本发明的一个目的在于提供一具有高度差的阵列摄像模组和线路板组件及其制造方法和电子设备,其中所述阵列摄像模组包括至少两个高度不同的摄像模组单元,且两个摄像模组单元的外端面平整度高,满足两个摄像模组单元的光学配合要求。
本发明的一个目的在于提供一具有高度差的阵列摄像模组和线路板组件及其制造方法和电子设备,其中所述阵列摄像模组的外端面一致,适于被安装的电子设备的表面平整性要求。
本发明的一个目的在于提供一具有高度差的阵列摄像模组和线路板组件及其制造方法和电子设备,其中所述阵列摄像模组具有一高度差空间,其位于所述阵列模组的底侧,从而使得所述阵列摄像模组底侧存在高度差,可以为该摄像模组自身以及其他电子设备提供更多的安装空间。
本发明的一个目的在于提供一具有高度差的阵列摄像模组和线路板组件及其制造方法和电子设备,其中所述阵列摄像模组包括一第一基座,其将至少两个 摄像模组单元稳定地、具有高度差地连接,从而不需要外部部件补充高度差。
本发明的一个目的在于提供一具有高度差的阵列摄像模组和线路板组件及其制造方法和电子设备,其中至少两所述摄像模组单元为不同功能的摄像模组。
本发明的一个目的在于提供一具有高度差的摄像模组及其制造发方法,其中所述第一基座包括一第一基座主体和一延伸部,所述第一基座主体固定于一第一线路板,所述延伸部自所述第一基座主体一体延伸,为一第二线路板提供支撑固定的位置,从而使得两个摄像模组单元固定连接。
本发明的一个目的在于提供一具有高度差的阵列摄像模组和线路板组件及其制造方法和电子设备,其中所述第一基座通过一次成型的方式制造,具有良好的表面平整性,从而提高安装部件的组装精度。
本发明的一个目的在于提供一具有高度差的阵列摄像模组和线路板组件及其制造方法和电子设备,其中所述第一基座为第二摄像模组单元提供平整的安装平面,使得两个摄像模组单元的光轴一致。
本发明的一个目的在于提供一具有高度差的阵列摄像模组和线路板组件及其制造方法和电子设备,在一些实施例中,所述第二线路板被贴装于所述第一基座的所述延伸部,从而使得所述延伸部为所述第二线路板提供平整的贴装条件。
本发明的一个目的在于提供一具有高度差的阵列摄像模组和线路板组件及其制造方法和电子设备,其中在一些实施例中,所述第二线路板嵌于所述第一基座内,从而降低所述第二摄像模组单元的高度,且减少所述第二线路板的安装过程。
本发明的一个目的在于提供一具有高度差的阵列摄像模组和线路板组件及其制造方法和电子设备,其中所述第一基座形成一第一光窗,为所述摄像模组单元的一感光元件提供光线通路。
本发明的一个目的在于提供一具有高度差的阵列摄像模组和线路板组件及其制造方法和电子设备,其中所述阵列摄像模组包括至少一支座,所述支座被安装于所述基座,以便于安装一滤光元件。
本发明的一个目的在于提供一具有高度差的阵列摄像模组和线路板组件及其制造方法和电子设备,在一些实施例中,所述支座被直接地安装于所述第二线路板,以便于通过所述支座直接地支撑安装所述滤光元件。
本发明的一个目的在于提供一具有高度差的阵列摄像模组和线路板组件及 其制造方法和电子设备,其中所述阵列摄像模组包括至少一补充支座,所述补充支座配合所述第一基座形成一光窗,为一感光元件提供光线通路。
本发明的一个目的在于提供一具有高度差的阵列摄像模组和线路板组件及其制造方法和电子设备,其中所述线路板包括一线路板主体和至少一电子元件,所述第一基座包覆所述电子元件,从而减少所述电子元件占用的空间,使得所述阵列摄像模组更加紧凑。
为了实现以上至少一发明目的,本发明的一方面提供一阵列摄像模组,其包括:至少两摄像模组单元,所述两阵列摄像单元的外端高度一致,底部形成一高度差。
根据一些实施例所述的阵列摄像模组,其中两所述阵列摄像模组单元分别为一第一摄像模组单元和一第二摄像模组单元,其中所述第一摄像模组单元包括至少一第一感光组件和至少一镜头,所述镜头位于所述第一感光组件的感光路径,所述第一感光组件包括一延伸部,所述延伸部至少部分地向远离所述感光组件的方向延伸,所述第二摄像模组单元固定连接于所述延伸部,从而将所述第一摄像模组单元和所述第二摄像模组单元端部一致地固定连接。
根据一些实施例所述的阵列摄像模组,其中所述第一感光组件包括第一线路板和一第一基座,其中所述第一基座包括一基座主体,所述基座主体一体成型于所述第一线路板,所述延伸部自所述基座至少部分地一体向外延伸,所述延伸部与所述第一线路板具有高度差。
根据一些实施例所述的阵列摄像模组,其中所述第一感光组件包括一第一感光元件,所述第一基座主体形成一第一光窗,所述第一感光元件被设置于所述第一光窗内,以便于进行感光。
根据一些实施例所述的阵列摄像模组,其中所述第二摄像模组单元包括一第二线路板、一第二感光元件和一第一镜头,所述第二感光元件电连接于所述第二线路板,所述第二线路板被设置于所述延伸部,所述镜头位于所述第二感光元件的感光路径。
根据一些实施例所述的阵列摄像模组,其中所述第二线路板被贴装于所述延伸部。
根据一些实施例所述的阵列摄像模组,其中所述第二线路板被埋设于所述延伸部。
根据一些实施例所述的阵列摄像模组,其中所述第二线路板具有一下沉孔,所述第二线路板被设置于所述下沉孔,且被所述延伸部支撑。
根据一些实施例所述的阵列摄像模组,其中所述第二摄像模组单元包括一第二基座,所述第二基座一体成型于所述第二线路板。
根据一些实施例所述的阵列摄像模组,其中所述第二基座一体连接于所述第一基座。
本发明的一方面提供一阵列摄像模组,其包括至少两摄像模组单元,所述两摄像模组单元的底部形成一高度差。
根据一些实施例,所述两摄像模组单元分别为一第一摄像模组单元和一第二摄像模组单元,其中所述第一摄像模组单元包括至少一第一感光组件和至少一第一镜头,所述第一镜头位于所述第一感光组件的感光路径,所述第一感光组件包括至少一延伸部,所述延伸部至少部分地向远离所述第一感光组件的方向延伸,所述第二摄像模组单元固定连接于所述第二延伸部。
根据一些实施例,所述第一感光组件包括一第一线路板、一第一感光元件和一第一基座,其中所述第一基座包括一第一基座主体和所述延伸部,所述第一基座主体一体成型于所述第一线路板形成一第一光窗,为所述第一感光元件提供光线通路,所述延伸部自所述第一基座主体至少部分地一体向外延伸,所述延伸部与所述第一线路板形成所述高度差,所述第一感光元件电连接于所述一线路板。
根据一些实施例,所述延伸部具有一支撑面,所述支撑面向远离所述第一摄像模组单元的方向延伸,所述第二摄像模组包括一第二感光组件和一第二镜头,所述第二镜头位于所述第二感光组件的感光路径,所述第二感光组件被支撑固定于所述第二支撑面。
根据一些实施例,所述第二感光组件被贴装固定于所述支撑面。
根据一些实施例,所述第二感光组件包括一第二线路板、一第二感光元件和一第二基座,所述第二感光元件电连接于所述第二线路板,所述第二基座一体成型于所述第二线路板形成一第二光窗,为所述第二感光元件提供光线通路,所述第二线路板被支撑固定于所述延伸部的所述第二支撑面。
根据一些实施例,所述两摄像模组单元分别为一第一摄像模组单元和一第二摄像模组单元,其中所述第一摄像模组单元包括至少一第一感光组件和至少一第一镜头,所述第一镜头位于所述第一感光组件的感光路径,所述第一感光组件包 括至少一支撑板,所述支撑板向远离所述第一感光组件的方向延伸,所述第二摄像模组单元固定连接于所述支撑板。
根据一些实施例,所述第一感光组件包括一第一线路板、一第一感光元件和一第一基座,所述第一感光元件电连接于所述一线路板,所述第一基座一体成型于所述第一线路板形成一光窗,为所述第一感光元件提供光线通路,所述支撑板被固定于所述第一基座。
根据一些实施例,所述支撑板具有一通孔,所述通孔连通于所述第一光窗,为所述感光元件提供光线通路。
根据一些实施例,所述第二感光组件包括一第二线路板、一第二感光元件和一第二基座,所述第二感光元件电连接于所述第二线路板,所述第二基座一体成型于所述第二线路板形成一第二光窗,所述第二线路板被支撑固定于所述支撑板的顶面。
根据一些实施例,所述第一基座具有一第一安装槽,所述安装槽连通于所述第一光窗,以提供安装位置。
根据一些实施例,所述第一摄像模组单元包括一第一支座,所述第一支座被安装于所述第一安装槽,以便于提供安装位置。
根据一些实施例,所述第二基座具有一第二安装槽,所述第二安装槽连通于所述第二光窗,以提供安装位置。
根据一些实施例,所述第二摄像模组单元包括一第二支座,所述第二支座被安装于所述第二安装槽,以便于提供安装位置。
根据一些实施例,所述第一感光元件被贴装于所述第一线路板,所述第一基座位于所述第一感光元件的外围。
根据一些实施例,所述第一感光元件被贴装于所述第一线路板,所述第一基座一体成型于至少部分所述第一感光元件。
根据一些实施例,所述第一感光元件通过至少一第一电连接元件电连接于所述第一线路板,所述第一基座包覆所述第一电连接元件。
根据一些实施例,所述第二感光元件被贴装于所述第二线路板,所述第二基座位于所述第二感光元件的外围。
根据一些实施例,所述第二感光元件被贴装于所述第二线路板,所述第二基座一体成型于至少部分所述第二感光元件。
根据一些实施例,所述第二感光元件通过至少一第二电连接元件电连接于所述第二线路板,所述第二基座包覆所述第二电连接元件。
根据一些实施例,所述第一线路板包括一第一线路板主体和至少一第一电子元件,所述第一电子元件电连接于所述第一线路板主体,所述第一基座一体成型于所述第一线路板主体,包覆所述第一电子元件。
根据一些实施例,所述第二线路板包括一第二线路板主体和至少一第二电子元件,所述第二电子元件电连接于所述第二线路板主体,所述第二基座一体成型于所述第二线路板主体,包覆所述第二电子元件。
根据一些实施例,所述第二线路板具有一下沉孔,所述第二感光元件被设置于所述下沉孔。
根据一些实施例,所述下沉孔连通于所述第二线路板的两侧,从而使得所述感光元件被直接地设置于所述第二延伸部。
根据一些实施例,所述第二线路板具有一下沉孔,所述第二感光元件被设置于所述下沉孔。
根据一些实施例,所述下沉孔连通于所述第二线路板的两侧,从而使得所述感光元件被直接地设置于所述支撑板。
根据一些实施例,所述第二感光组件包括一第二线路板、一第二感光元件和一第二支座,所述第二感光元件电连接于所述第二线路板,所述第二支座被安装于所述第二线路板,所述第二线路板被支撑固定于所述延伸部的所述第二支撑面。
根据一些实施例,所述第二支座具有一通光孔和一避让空间,所述通光孔为所述第二感光元件提供光线通路,所述避让空间连通于所述通光孔,以避让所述第二感光元件。
根据一些实施例,所述第一摄像模组单元包括一第一补充基座,所述第一基座具有一第一缺口,所述补充基座补充于所述第一基座的所述第一缺口,形成闭合的所述第一光窗。
根据一些实施例,所述第二摄像模组单元包括一第二补充基座,所述第二基座具有一第二缺口,所述补充基座补充于所述第二基座的所述第二缺口,形成闭合的所述第二光窗。
根据一些实施例,所述第一基座包括一第一支承元件,用于在通过一模具形成所述第一基座时,支撑所述模具。
根据一些实施例,所述第一支承元件是胶水涂层或胶垫。
根据一些实施例,所述第二基座包括一第二支承元件,用于在通过一模具形成所述第二基座时,支撑所述模具。
根据一些实施例,所述第二支承元件是胶水涂层或胶垫。
根据一些实施例,所述第一基座主体侧壁具有倾斜角。
根据一些实施例,所述第二基座侧壁具有倾斜角。
根据一些实施例,所述第一摄像模组单元包括一第一滤光元件,所述第一滤光元件一体成型固定于所述第一基座。
根据一些实施例,所述第二摄像模组单元包括一第二滤光元件,所述第二滤光元件一体成型固定于所述第二基座。
根据一些实施例,所述第一摄像模组单元包括一支承元件和至少一镜片,所述镜片被支承于所述支承元件,所述镜片被一体成型地固定于所述第一基座。
根据一些实施例,所述第二摄像模组单元包括一支承元件和至少一镜片,所述镜片被支承于所述支承元件,所述镜片被一体成型地固定于所述第二基座。
根据一些实施例,一体成型的方式选自:模塑、模压中的一种。
根据一些实施例,所述第一摄像模组单元包括一第一滤光元件,所述第一滤光元件被安装于所述第一安装槽。
根据一些实施例,所述第二摄像模组单元包括一第二滤光元件,所述第二滤光元件被安装于所述第二安装槽。
根据一些实施例,所述第一摄像模组单元包括一第一镜头支撑元件,所述第一镜头被安装于所述第一镜头支撑元件,所述第一镜头支撑元件至少部分地被安装于所述第一基座。
根据一些实施例,所述第一镜头支撑元件是一镜座元件,以使得所述第一摄像模组单元构成一定焦摄像模组。
根据一些实施例,所述第一镜头支撑元件是一驱动元件,以使得所述第一摄像模组单元构成一动焦摄像模组。
根据一些实施例,所述第二摄像模组单元包括一第二镜头支撑元件,所述第二镜头被安装于所述第二镜头支撑元件,所述第二镜头支撑元件至少部分地被安装于所述第二基座。
根据一些实施例,所述第二镜头支撑元件是一镜座元件,以使得所述第二摄 像模组单元构成一定焦摄像模组。
根据一些实施例,所述第二镜头支撑元件是一驱动元件,以使得所述第二摄像模组单元构成一动焦摄像模组。
本发明的另一方面提供一阵列摄像模组线路板组件,其包括:一第一线路板;一第二线路板;和一第一基座,所述第一基座包括一基座主体和一延伸部,所述基座主体一体成型于所述第一线路板形成一第一光窗,为一第一感光元件提供光线通路,所述延伸部自所述基座主体至少部分地一体向外延伸与所述第一线路板形成一高度差,所述第二线路板被设置于所述延伸部。
根据一些实施例,所述线路板组件包括一第二支座和一感光元件,所述第二支座和所述第二感光元件被安装于所述第二线路板,所述第二支座具有一通光孔和一避让空间,所述通光孔为所述第二感光元件提供光线通路,所述避让空间连通于所述通光孔,以避让所述第二感光元件。
本发明的另一方面提供一阵列摄像模组线路板组件,其包括:
一第一线路板;
一第二线路板;和
一第一基座,所述第一基座一体成型于所述第一线路板形成一第一光窗,为一第一感光元件提供光线通路;和
一支撑板,所述支撑板被固定于所述第一基座,所述支撑板向远离所述第一基座的方向延伸与所述第一线路板形成一高度差,所述第二线路板被设置于所述支撑板。
本发明的另一方面提供一阵列摄像模组线路板组件,其特征在于,包括:
一第一线路板;
一第二线路板;和
一第一基座,所述第一基座包括一基座主体和一延伸部,所述基座主体一体成型于所述第一线路板形成一第一光窗,为一第一感光元件提供光线通路,所述延伸部自所述基座主体至少部分地一体向外延伸使得底面与所述第一线路板底面一致,所述第二线路板被设置于所述延伸部的顶面。
本发明的另一方面提供一电子设备,其特征在于,包括:
一所述的阵列摄像模组;和
电子设备本体;所述阵列摄像模组被设置于所述电子设备本体,以获取所述 阵列摄像模组的图像信息。
本发明的另一方面提供所述电子设备本体选自:智能手机、可穿戴设备、平板电脑、笔记本电脑、电子书、个人数字助理、相机、监控装置中的一种。
本发明的一方面提供一线路板组件,用于一阵列摄像模组,其包括:
一第一线路板;
一第二线路板;和
一第一基座,所述第一基座包括一第一基座主体和一延伸部,所述第一基座主体一体成型于所述第一线路板形成一第一光窗,所述延伸部自所述第一基座主体至少部分地向远离所述第一基座主体的方向延伸与所述第一线路板底面形成一高度差,所述第二线路板一体成型地固定于所述延伸部。
根据一些实施例,所述第二线路板具有至少一第二电连接区,所述第二电连接区显露于所述延伸部表面。
根据一些实施例,所述线路板组件包括一第二感光元件,所述第二感光元件被支撑于所述延伸部,且电连接所述第二线路板的所述第二电连接区。
根据一些实施例,所述线路板组件包括一第二感光元件,所述第二感光元件被贴装于所述第二线路板,且电连接所述第二线路板的所述第二电连接区。
根据一些实施例,所述第二线路板具有四侧所述第二电连接区,分别设置于相对的两侧,以便于四个所述第二电连接区分别电连接一第二感光元件。
根据一些实施例,所述线路板组件包括一连接板,所述连接板电连接所述第一线路板和所述第二线路板。
根据一些实施例,所述第一基座包括一延伸安装部,自所述基座主体至少部分地向上延伸,形成一第一限位槽,以便于安装一第一镜头或一第一镜头支撑元件。
根据一些实施例,所述线路板组件包括一第二基座,所述第二基座包括一第二基座主体以及具有一第二光窗,所述第二基座主体一体成型地连接于所述第一基座,并且形成所述第二光窗,用于为一第二感光元件提供光线通路。
根据一些实施例,所述第二基座包括一第二延伸安装部,所述延伸安装部自所述第二基座主体至少部分地向上延伸,形成一第二限位槽,以便于安装一第二镜头或一第二镜头支撑元件。
根据一些实施例,所述线路板组件包括一第一补充基座,所述第一基座的所 述第一基座主体具有一第一缺口,所述第一补充基座限位补充于所述第一缺口,使得所述第一光窗闭合。
根据一些实施例,所述线路板组件包括一第二补充基座,所述第二基座的所述第二基座主体具有一第二缺口,所述第二补充基座限位补充于所述第二缺口,使得所述第二光窗闭合。
根据一些实施例,所述线路板组件包括一第二基座,所述第二基座一体成型于所述第二线路板,所述第二基座一体连接于所述第一基座。
根据一些实施例,所述第一基座具有一第一安装槽,所述安装槽连通于所述第一光窗,以提供安装位置
根据一些实施例,所述线路板组件包括一第一支座,所述第一支座被安装于所述第一安装槽,以便于提供安装位置。
根据一些实施例,所述第二基座具有一第二安装槽,所述第二安装槽连通于所述第二光窗,以提供安装位置。
根据一些实施例,所述线路板组件包括一第二支座,所述第二支座被安装于所述第二安装槽,以便于提供安装位置。
根据一些实施例,所述线路板组件包括一第一感光元件,所述第一感光元件被贴装于所述第一线路板,所述第一基座位于所述第一感光元件的外围。
根据一些实施例,所述线路板组件包括一第一感光元件,所述第一感光元件被贴装于所述第一线路板,所述第一基座一体成型于至少部分所述第一感光元件。
根据一些实施例,所述第一感光元件通过至少一第一电连接元件电连接于所述第一线路板,所述第一基座包覆所述第一电连接元件。
根据一些实施例,所述第二基座位于所述第二感光元件的外围。
根据一些实施例,所述第二基座一体成型于至少部分所述第二感光元件。
根据一些实施例,所述第二感光元件通过至少一第二电连接元件电连接于所述第二线路板,所述第二基座包覆所述第二电连接元件。
根据一些实施例,所述第一线路板包括一第一线路板主体和至少一第一电子元件,所述第一电子元件电连接于所述第一线路板主体,所述第一基座一体成型于所述第一线路板主体,包覆所述第一电子元件。
根据一些实施例,所述第二线路板包括一第二线路板主体和至少一第二电子元件,所述第二电子元件电连接于所述第二线路板主体,所述第二基座一体成型 于所述第二线路板主体,包覆所述第二电子元件。
根据一些实施例,所述第二线路板具有一下沉孔,所述第二感光元件被设置于所述下沉孔。
根据一些实施例,所述第一基座包括一第一支承元件,用于在通过一模具形成所述第一基座时,支撑所述模具。
根据一些实施例,所述第一支承元件是胶水涂层或胶垫,被设置于部分所述第一基座和所述第一线路板之间。
根据一些实施例,所述第二基座包括一第二支承元件,用于在通过一模具形成所述第二基座时,支撑所述模具。
根据一些实施例,所述第二支承元件是胶水涂层或胶垫,被设置于部分所述第二基座和所述第二线路板之间。
根据一些实施例,所述第一基座主体侧壁具有倾斜角。
根据一些实施例,所述第二基座侧壁具有倾斜角。
根据一些实施例,所述线路板组件包括一第一滤光元件,所述第一滤光元件一体成型固定于所述第一基座。
根据一些实施例,所述线路板组件包括一第二滤光元件,所述第二滤光元件一体成型固定于所述第二基座。
根据一些实施例,所述线路板组件包括一支承元件和至少一镜片,所述镜片被支承于所述支承元件,所述镜片被一体成型地固定于所述第一基座。
根据一些实施例,所述线路板组件包括一支承元件和至少一镜片,所述镜片被支承于所述支承元件,所述镜片被一体成型地固定于所述第二基座。
根据一些实施例,所述一体成型的方式选自:模塑、模压中的一种。
本发明的另一方面提供一阵列摄像模组线路板组件,其包括:
一第一线路板;
一第二线路板;和
一第一基座,所述第一基座包括一基座主体和一延伸部,所述基座主体一体成型于所述第一线路板形成一第一光窗,为一第一感光元件提供光线通路,所述延伸部自所述基座主体至少部分地一体向外延伸使得底面与所述第一线路板底面一致,所述延伸部一体成型于所述第二线路板。
本发明的另一方面提供一阵列线路板组件,其包括:
一第一的线路板;
一第二线路板;
一第一基座,所述第一基座一体成型于所述第一线路板形成一第一光窗;和
一第二基座;所述第二基座一体成型于所述第二线路板形成一第二光窗,所述第一基座一体地连接第二基座,使得所述第一线路板和所述第二线路板底部具有一高度差。
根据一些实施例,所述第一基座具有一第一安装槽,适于安装第一滤光元件。
根据一些实施例,所述第二基座具有一第二安装槽,适于安装第二滤光元件。
根据一些实施例,所述线路板组件包括一第一支座和第一第二支座,所述第一支座一体连接所述第二支座,所述第一支座和所述第二支座分别被安装于所述第一基座和所述第二基座,以提供安装位置。
根据一些实施例,所述线路板组件包括一第一补充基座,所述第一基座的所述第一基座主体具有一第一缺口,所述第一补充基座限位补充于所述第一缺口,使得所述第一光窗闭合。
根据一些实施例,所述线路板组件包括一第二补充基座,所述第二基座的所述第二基座主体具有一第二缺口,所述第二补充基座限位补充于所述第二缺口,使得所述第二光窗闭合。
根据一些实施例,所述一体成型的方式选自:模塑、模压中的一种。
本发明的另一方面提供一阵列摄像模组,其包括
一所述线路板组件;和
至少两镜头,其中两所述镜头分别被设置于所述第一线路板和所述第二线路板对应的位置,以分别构成两摄像模组单元,且两所述摄像模组单元的顶端部高度一致。
根据一些实施例,所述阵列摄像模组包括两滤光元件,分别被设置于两所述摄像模组单元。
根据一些实施例,所述阵列摄像模组包括两镜头支撑元件,两所述镜头分别被安装于镜头支撑元件。
根据一些实施例,至少一所述镜头支撑元件是一镜座元件,以使得对应的所述摄像模组单元构成一定焦摄像模组。
根据一些实施例,至少一所述镜头支撑元件是一驱动元件,以使得对应所述 摄像模组单元构成一动焦摄像模组。
附图说明
图1是根据本发明的第一个优选实施例的阵列摄像模组示意图。
图2是根据本发明的第一个优选实施例的阵列线路板组件示意图。
图3是根据本发明的第一个优选实施例阵列线路板组件形成过程示意图。
图4是根据本发明的第二个优选实施例的阵列摄像模组示意图。
图5是根据本发明的第二个优选实施例的阵列摄像模组的部分俯视图。
图6是根据本发明的第二个优选实施例的阵列摄像模组的一变形实施方式示意图。
图7是根据本发明的第三个优选实施例的阵列摄像模组示意图。
图8A是根据本发明的第四个优选实施例的阵列摄像模组示意图。
图8B是根据本发明的第四个优选实施例的阵列摄像模组的变形实施方式示意图。
图8C是根据本发明的第四个实施例的阵列摄像模组的另一变形实施方式示意图。
图9是根据本发明的第五个优选实施例的阵列摄像模组示意图。
图10是根据本发明的第六个优选实施例的阵列摄像模组示意图。
图11A是根据本发明的第七个优选实施例的阵列摄像模组示意图。
图11B是根据本发明的第七个优选实施例的阵列摄像模组的一变形实施方式示意图。
图12是根据本发明的第八个优选实施例的阵列摄像模组示意图。
图13是根据本发明的第九个优选实施例的阵列摄像模组示意图。
图14是根据本发明的第十个优选实施例的阵列摄像模组示意图。
图15是根据本发明的第十一个优选实施例的阵列摄像模组示意图。
图16是根据本发明的第十二个优选实施例的阵列摄像模组示意图。
图17是根据本发明的第十三个优选实施例的阵列摄像模组示意图。
图18A是根据本发明的第十四个优选实施例的阵列摄像模组示意图。
图18B是根据本发明的第十四个优选实施例的阵列摄像模组变形实施方式示意图。
图19是根据本发明的第十四个优选实施例的阵列线路板组件示意图。
图20是根据本发明的第十四个优选实施例阵列线路板组件形成过程示意图。
图21是根据本发明的第十五个优选实施例的阵列摄像模组示意图。
图22是根据本发明的第十五个优选实施例的阵列摄像模组的一变形实施方式示意图。
图23是根据本发明的十六个优选实施例的阵列摄像模组示意图。
图24是根据本发明的第十七个优选实施例的阵列摄像模组示意图。
图25是根据本发明的第十八个优选实施例的阵列摄像模组示意图。
图26是根据本发明的第十九个优选实施例的阵列摄像模组示意图。
图27是根据本发明的第二十个优选实施例的阵列摄像模组示意图。
图28是根据本发明的第二十一个优选实施例的阵列摄像模组示意图。
图29是根据本发明的第二十二个优选实施例的阵列摄像模组示意图。
图30是根据本发明的第二十三个优选实施例的阵列摄像模组示意图。
图31是根据本发明的第二十四个优选实施例的阵列摄像模组示意图。
图32是根据本发明的第二十五个优选实施例的阵列摄像模组示意图。
图33是根据本发明的第二十六个优选实施例的阵列摄像模组示意图。
图34A、34B是根据本发明的上述实施例的阵列摄像模组的立体示意图,用于说明两种外连接方式。
图35是跟本发明的上述优选实施例的阵列摄像模组制造方法框图。
图36是根据发明的上述优选实施例的阵列摄像模组的应用示意图。
具体实施方式
以下描述用于揭露本发明以使本领域技术人员能够实现本发明。以下描述中的优选实施例只作为举例,本领域技术人员可以想到其他显而易见的变型。在以下描述中界定的本发明的基本原理可以应用于其他实施方案、变形方案、改进方案、等同方案以及没有背离本发明的精神和范围的其他技术方案。
本领域技术人员应理解的是,在本发明的揭露中,术语“纵向”、“横向”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”“内”、“外”等指示的方位或位置关系是基于附图所示的方位或位置关系,其仅是为了便于描述本发明和简化描述,而不是指示或暗示所指的装置或元件必须具有特定的方位、以特 定的方位构造和操作,因此上述术语不能理解为对本发明的限制。
多摄像头的摄像模组是摄像模组近期发展的重要趋势之一,多个摄像模组的配合可以实现更多的功能,从理论上来说,多摄像头的阵列相对单个摄像头的摄像模组在众多方面可以获得优于单个镜头的摄像模组的功能,可是这些功能的实现需要硬件的支撑,因此现有的多摄像头的模组的大多停留在理论阶段。根据本发明的实施例,提供一阵列摄像模组100,其包括至少两摄像模组单元,各所述摄像模组单元相互配合完成图像的采集,其将各所述摄像模组单元稳定地进行结合,并且外端面保持一致,从而使得各所述摄像模组单元的光线入射面高度一致,使得各所述摄像模组单元更好地相互配合采集图像,且采集信息更加准确。进一步,所述阵列摄像模组100将高度差形成的高度差空间预留于所述阵列摄像模组100的底侧,从而当所述阵列摄像模组100被安装于电子设备时,所述电子设备的部件可以被容纳于所述高度差空间,从而使得内部空间被充分利用,且所述电子设备的外部保持平整。进一步,根据本发明的优选实施例,多个所述阵列摄像模组100之间可以通过一体成型的方式形成至少一基座,通过所述基座为多个摄像模组单元共同提供组装位置,使得各所述摄像模组单元紧凑、稳定地相互固定,且使得各摄像模组单元之间保持较好的一致性。且一体成型的方式,具有较好的表面平整性,为其他部件提供平整的安装条件,从而提高各部件的安装精度,进一步保证各所述摄像模组单元之间光轴一致性。
为了便于说明,以下以两个摄像模组单元构成的双摄阵列摄像模组100为例进行说明。在本发明的其他实施例中,所述阵列摄像模组100可以包括更多个所述摄像模组单元,本发明在这方面并不限制。
参照图1至图3,根据本发明的第一个优选实施例的阵列摄像模组100,所述阵列摄像模组100包括至少两摄像模组单元,两所述摄像模组单元外端面一致,底部具有高度差H,形成一高度差空间110。
具体地,两所述摄像模组单元分别为一第一摄像模组单元10和一第二摄像模组单元20。所述第一摄像模组单元10包括一第一线路板11、一第一感光元件13和至少一第一镜头14。所述第二摄像模组单元20包括一第二线路板21、一第二感光元件23和至少一第二镜头24。
所述第一感光元件13电连接于所述第一线路板11,以便于向所述第一线路板11传递感光信息,所述第一镜头14位于所述第一感光元件13的感光路径, 以便于所述第一感光元件13接收光线而进行感光。所述第二感光元件23电连接于所述第二线路板21,以便于向所述第二线路板21传递感光信息,所述第二镜头24位于所述第二感光元件23的感光路径,以便于所述第二感光元件23接收光线而进行感光。特别地,在一些实施方式中,所述第一感光元件13和所述第二感光元件23可以通过表面贴装工艺SMT(Surface Mount Technology)分别被设置于所述第一线路板11和所述第二线路板21,且分别通过至少一第一电连接元件133和一第二电连接元件233电连接于所述第一线路板11和所述第二线路板21。所述第一电连接元件133和所述第二电连接元件233举例地但不限于,金线、银线、铜线、铝线、焊盘、引脚等。
进一步,所述第一摄像模组单元10包括一第一基座12,所述第一基座12固定连接于所述第一线路板11。所述第一基座12包括一第一基座主体123和一延伸部124,所述第一基座主体123固定连接于所述第一线路板11,所述延伸部124自所述基座主体至少部分地向外延伸,以便于为所述第二摄像模组单元20提供安装位置。所述第二线路板21固定连接于所述第一基座12的所述延伸部124,从而通过所述第一基座12将所述第一摄像模组单元10和所述第二摄像模组单元20稳定地连接于一起。
换句话说,所述第一摄像模组单元10的所述延伸部20形成一连接部,为所述第二摄像模组单元20提供支撑固定的位置,从而使得所述第一摄像模组单元10和所述第二摄像模组单元20稳定地连接固定形成所述阵列摄像模组。
更具体地,根据本发明,所述第一基座12通过一体成型的方式设置于所述第一线路板11,比如模塑成型的方式,从而将所述第一基座12和所述第一线路板11稳定地固定,且减少额外的安装固定过程。比如减少胶水粘接的过程,连接更加稳定,省去胶水连接的高度,降低摄像模组单元的高度。所述一体成型的方式可以模塑成型,如传递模塑的方式,也可以是模压成型的方式。
举例地,所述第一基座12可以通过模具模塑一体成型的方式设置于所述第一线路板11,如模塑于线路板的方式,区别于传统的COB(Chip On Board)方式。通过模具一体成型的方式,可以较好地控制成型形状以及表面平整度,比如,使得所述延伸部124具有较好的平整度,从而为所述第二摄像模组单元20提供平整的安装条件,且通过模具一体成型的方式可以使得所述延伸部124与所述第一线路板11具有较好的平行度,有助于保证所述第一摄像模组单元10和所述第 二摄像模组单元20的光轴一致性。值得一提的是,所述光轴一致,是指两摄像模组单元的中心光轴方向平行,或者两中心光轴之间的夹角在预定误差范围内,使得成像质量符合预定要求,本发明在这方面并不限制。
在本发明的这个实施例中,所述第一基座12位于所述第一感光元件13的外围,所述第二基座22位于所述第二感光元件23的外围。进一步,所述第一基座12位于所述第一电连接元件133的外围,所述第二基座22位于所述电连接元件233的外围。
更具体地,所述延伸部124具有一支撑面1241,所述支撑面1241向远离所述第一摄像模组单元10方向延伸,使得所述第二摄像模组单元20并列地比邻于所述第一摄像模组单元10。以所述摄像模组单元光轴方向为高度方向,所述延伸部124的高度高于所述第一线路板11,从而所述第一基座12和第一线路板11形成所述高度差空间110。也就是说,所述延伸部124和所述第一线路板11存在高度差,从而使得安装于所述延伸部124的所述第二摄像模组单元20和所述第一摄像模组单元10存在高度差。由此可以看到,通过所述延伸部124和所述第一线路板11的高度差补偿所述第一摄像模组单元10和所述第二摄像模组单元20存在的高度差,使得两个不同高度的摄像模组单元稳定地组装于一起,且外端面保持一致,使得所述第一摄像模组单元10和所述第二摄像模组单元20光线入射方向一致地并列设置,并且使得光线入射面一致,从而当所述第一摄像模组单元10和所述第二摄像模组单元20相互配合采集图像信息时,可以获得更加准确的信息。
所述第二线路板21被支撑固定于所述延伸部124,以便于通过所述延伸部124为所述第二摄像模组单元20提供平整的安装条件。更具体地,所述第二线路板21通过贴装方式,如胶水固定的方式,固定于所述延伸部124的支撑面1241,所述第一线路板11的底面和所述第二线路板21的底面形成所述高度差H,从而使得两个分离、独立的线路板能够被具有高度差地固定组装构成阵列摄像模组。
进一步,所述高度差空间110位于所述阵列摄像模组100的底部,当所述阵列摄像模组100单体被安装于一电子设备时,所述高度差空间位于所述电子设备的内部,从而使得所述电子设备的外部保持相对平整,而所述电子设备的部件可以被设置于所述高度差空间110,从而充分利用所述电子设备的内部空间,更有益于所述电子设备轻薄化发展。
值得一提的是,在本发明的附图中,高度差H仅用来示意说明所述第一摄像模组单元10和所述第二摄像模组单元20之间存在高度差,并不是限制所述第一摄像模组单元10和所述第二摄像模组单元20的高度差大小,而当所述第二摄像模组单元10和所述第二摄像模组单元20的高度大小不同时,所述第一摄像模组单元10和所述第二摄像模组单元20的各部件的相对位置关系也会相应的变化。比如当所述第一摄像模组单元10和所述第二摄像模组单元20的高度相差比较小,所述第一基座主体123的顶面可以向上延伸,所述第二基座主体223成型时一体连接于所述第一基座主体223。
进一步,所述延伸部124的支撑面1241通过模具一体成型的方式形成,从而可以保证较好的平整性,且可以通过模具控制使得所述延伸部124和所述第一线路板11的方向一致,比如使得所述延伸部124的方向和所述第一线路板11的方向平行,从而使得所述第一线路板11和所述第二线路板21的方向一致,为所述第一摄像模组单元10和所述第二摄像模组单元20提供一致的安装基础,从而使得所述第一摄像模组单元10和所述第二摄像模组单元20的光轴一致。
在本发明的另一些实施方式中,所述第一基座12可以通过注塑成型的方式形成,比如通过注塑成型的方式形成所述第一基座12,带有所述第一基座主体123和所述延伸部124,而后将所述第一基座12粘接固定于所述第一线路板11,进而将所述第二线路板21安装于所述第一基座12的所述延伸部124,从而将所述第一摄像模组单元10和所述第二摄像模组单元20组装于一起,外端部基本一致,且具有高度差。
进一步,根据本发明的这个实施例,所述第一线路板11包括一第一线路板主体111和至少一第一电子元件112,所述第一电子元件112凸出于所述第一线路板主体111,用于配合所述第一线路板主体111的工作。所述第一基座12一体成型于所述第一线路板主体111,并且包覆所述第一电子元件112,从而减少所述第一电子元件112的占用空间。所述第一电子元件112举例地但不限于,电阻、电容、驱动器等。当然,在本发明的另一些实施例中,可以不设置所述第一电子元件112或者所述第一电子元件112凸出于所述第一线路板主体111,比如内埋于所述第一线路板主体111,本发明在这方面并不限制。
每个所述第一电子元件112可以通过诸如SMT工艺被相互间隔地贴装于所述第一线路板11的边缘区域,比如所述第一感光元件13外侧。值得一提的是, 每个所述第一电子元件112可以分别位于所述第一线路板11的同侧或者相反侧,例如在一个具体示例中,所述第一感光元件13和每个所述第一电子元件可以分别位于所述第一线路板11的同一侧,并且所述第一感光元件13被贴装于所述第一线路板11的芯片贴装区域,每个所述第一电子元件112分别被相互间隔地贴装于所述第一线路板11的边缘区域。所述第一基座12在成型后包覆每个所述第一电子元件112,以藉由所述第一基座12隔离相邻所述第一电子元件112和隔离所述第一电子元件112与所述第一感光元件13。
在本发明的所述摄像模组中,通过所述第一基座12在成型后包覆每个所述第一电子元件112的方式具有很多的优势,首先,所述第一基座12包覆每个所述第一电子元件112,以使相邻所述第一电子元件112之间不会出现相互干扰的不良现象,即便是相邻所述第一电子元件112的距离较近时也能够保证所述摄像模组单元的成像品质,这样,可以使小面积的所述第一线路板11上能够被贴装更多数量的所述第一电子元件112,从而使所述摄像模组单元的结构更加的紧凑,以有利于在控制所述摄像模组单元的尺寸的基础上提高所述摄像模组单元的成像品质;其次,所述第一基座12包覆每个所述第一电子元件112,从而无论是在水平方向还是在高度方向,在所述第一基座12和每个所述第一电子元件112之间都不需要预留安全距离,以能够减小所述摄像模组单元的尺寸。第三,所述第一基座12包覆每个所述第一电子元件112,从而在所述第一基座12和所述第一线路板11间不需要使用胶水进行连接和调平,以有利于降低所述摄像模组单元的高度尺寸。第四,所述第一基座12包覆每个所述第一电子元件112,在后续运输和组装所述摄像模组单元以形成所述阵列摄像模组100的过程中,所述第一基座12可以防止所述第一电子元件112晃动和脱落,从而有利于保证所述阵列摄像模组100的结构稳定性。第五,所述第一基座1223包覆每个所述第一电子元件112,在后续运输和组装所述摄像模组单元以形成所述阵列摄像模组100的过程中,能够防止污染物污染每个所述第一电子元件112,从而保证所述阵列摄像模组100的成像品质。第六,所述第一基座12包覆所述电子元件后能够将所述第一电子元件112与空气隔绝,通过这样的方式,能够减缓所述第一电子元件112的金属部分的氧化速度,有利于提高所述第一电子元件112和所述阵列摄像模组100的环境稳定性。
值得一提的是,所述第一基座12一体成型于所述第一线路板11,并且包覆 所述第一线路板11的所述第一电子元件112,从而使得所述第一基座12和所述第一线路板主体111具有较大的连接面积,连接更加稳定,从而所述延伸部124可以提供稳定的支撑,且通过一体成型的方式具有较好的结构强度,因此所述延伸部124可以牢固、可靠地支撑、固定所述第二摄像模组单元20,从而保证了产品的良率。
还值得一提的是,所述第二摄像模组单元20被安装于所述第一基座12的所述延伸部124,从而可以通过所述延伸部124的延伸长短以及所述第二摄像模组单元20的安装位置方便地控制所述第一摄像模组单元10和所述第二摄像模组单元20之间的距离,从而方便满足不同类型的摄像模组单元的配合要求。
根据本发明的这个实施例,所述第一基座12具有一第一光窗121,以便于为所述第一感光元件13提供光线通路。换句话说,所述第一感光元件13位于所述第一光窗121内,所述第一感光元件13的感光路径与所述第一光窗121方向一致。
更具体地,所述第一基座主体123形成所述第一光窗121,为所述第一感光元件13提供光线通路。在一些实施例中,所述第一基座主体123是一闭合环形结构,适应所述第一感光元件13的形状。
在本发明的这个实施例中,所述第一基座12环绕于所述第一感光元件13的外围
所述第一基座12具有一第一安装槽122,连通于所述第一光窗121,用于提供安装位置。所述第一摄像模组单元10包括一第一滤光元件16,所述第一滤光元件16位于所述第一镜头14和所述第一感光元件13之间,以便于过滤通过所述第一镜头14到达所述第一感光元件13的光线。所述第一滤光元件16被安装于所述第一安装槽122。
值得一提的是,在本发明的这个实施例中,所述第一滤光元件16被安装于所述第一安装槽122,也就是说,所述第一安装槽122为所述第一滤光元件16提供安装位置。在本发明的其他实施例中,所述第一安装槽122还可以为其他部件提供安装位置,举例地但不限于,为所述第一镜头支撑元件15、所述第一镜头14提供安装位置以及支座18(后续提出)等元件提供安装位置。
进一步,根据本发明的这个实施例,所述第二摄像模组单元20包括一第二基座22,所述第二基座22固定连接于所述第二线路板21。所述第二基座22包 括一第二基座主体223以及具有一第二光窗221。所述第二基座主体223形成所述第二光窗221,为所述第二感光元件23提供光线通路。换句话说,所述第二感光元件23位于所述第二光窗221内,所述第二感光元件23和所述第二光窗221方向一致。在一些实施例中,所述第二基座主体223是一闭合环形结构,适应所述第二感光元件23的形状。
所述第二基座22具有一第二安装槽222,连通于所述第二光窗221,所述第二安装槽被设置于所述第二基座主体223。所述第二摄像模组单元20包括一第二滤光元件26,所述第二滤光元件26位于所述第二镜头24和所述第二感光元件23之间,以便于过滤通过所述第二镜头24到达所述第二感光元件23的光线。所述第二滤光元件26被安装于所述第一安装槽122。
值得一提的是,在本发明的这个实施例中,所述第二滤光元件26被安装于所述第二安装槽222,也就是说,所述第二安装槽222为所述第二滤光元件26提供安装位置。在本发明的其他实施例中,所述第二安装槽222还可以为其他部件提供安装位置,举例地但不限于,为所述第二镜头支撑元件25、所述第二镜头24提供安装位置以及支座28(后续提出)等元件提供安装位置。
所述第一滤光元件16和所述第二滤光元件26可以被实施为不同的类型,例如所述滤光元件能够被实施为红外截止滤光片、全透光谱滤光片、蓝玻璃滤光片以及其他的滤光片或者多个滤光片的组合,例如所述滤光元件能够被实施为红外截止滤光片和全透光谱滤光片的组合,即所述红外截止滤光片和所述全透光谱滤光片能够被切换以选择性地位于所述感光元件的感光路径上,例如在白天等光线较为充足的环境下使用所述阵列摄像模组100时,可以将所述红外截止滤光片切换至所述感光元件的感光路径,以藉由所述红外截止滤光片过滤进入所述摄像模组单元的被物体反射的光线中的红外线,当夜晚等光线较暗的环境中使用所述摄像模组单元时,可以将所述全透光谱滤光片切换至所述感光元件的感光路径,以允许进入所述摄像模组单元的接收的被物体反射的光线中的红外线部分透过。
进一步,根据本发明的这个实施例,所述第二基座22一体成型于所述第二线路板21,从而将所述第二基座22和所述第二线路板21稳定地固定,且减少额外的安装固定过程。比如减少胶水粘接的过程,连接更加稳定,省去胶水连接的高度,降低摄像模组单元的高度。
所述第二线路板21包括一第二线路板主体211和至少一第二电子元件212, 所述第二电子元件212凸出于所述第二线路板主体211,用于配合所述第二线路板主体211的工作。所述第二基座22一体成型于所述第二线路板主体211,并且包覆所述第二电子元件212。所述第二基座22一体成型的方式可以与所述第一基座12相同,并且具有第一基座12相同的优势,在此不再赘述。
进一步,根据本发明的这个实施例,所述第一摄像模组单元10包括至少一第一镜头支撑元件15,所述第一镜头14被安装于所述第一镜头支撑元件15,所述第一镜头支撑元件15被安装于所述第一基座12的所述第一基座主体123,以使得所述第一镜头14位于所述第一感光元件13的感光路径。
所述第二摄像模组单元20包括至少一第二镜头支撑元件25,所述第二镜头24被安装于所述第二镜头支撑元件25,所述第二镜头支撑元件25被安装于所述第二基座主体223,以使得所述第二镜头24位于所述第二感光元件23的感光路径。
进一步,所述第一镜头支撑元件15和所述第二镜头支撑元件25可以被实施为一驱动元件或一镜座元件,从而形成一动焦摄像模组或一定焦摄像模组。所述驱动元件举例地但不限于,音圈马达,压电马达等。比如,当所述第一镜头支撑元件15和所述第二镜头支撑元件25都被实施为一驱动元件时,所述第一摄像模组单元10和所述第二摄像模组单元20都为动焦摄像模组,也就是说,所述阵列摄像模组100是由两个动焦摄像模组构成。当所述第一镜头支撑单元15被实施为驱动元件,所述第二镜头支撑元件25被实施为镜座元件时,所述第一摄像模组单元10为动焦摄像模组,所述第二摄像模组单元20是定焦摄像模组,也就是说,所述阵列摄像模组100由一动焦摄像模组和一定焦摄像模组构成。当所述第一镜头支撑元件15被实施为镜座元件,所述第二镜头24元件被实施为一驱动元件时,所述第一摄像模组单元10为定焦摄像模组,所述第二摄像模组单元20为动焦摄像模组。当所述第一镜头支撑元件15和所述第二镜头支撑元件25都被实施为所述镜座元件时,所述第一摄像模组单元10和所述第二摄像模组单元20都为定焦摄像模组。
值得一提的是,在一些实施例中,当所述第一镜头支撑元件15或所述第二镜头支撑元件25被实施为驱动元件时,所述第一镜头支撑元件15和所述第二镜头支撑元件25电连接于所述第一线路板11或所述第二线路板21,以便于驱动所述第一镜头14或所述第二镜头24工作。举例地,所述第一镜头支撑元件15 和所述第二镜头支撑元件25可以通过设置引脚、焊盘或引线等方式电连接于所述第一线路板11或所述第二线路板21。
所述第一摄像模组单元10和所述第二摄像模组单元20的类型可以根据需求配置,以便于相互配合实现更好的图像采集效果,本发明在这方面并不限制。
值得一提的是,所述第一摄像模组单元10中,所述第一镜头支撑元件15被安装于所述第一基座主体123的顶面,所述第一滤光元件16被安装于所述第一基座主体123的所述第一安装槽122;所述第二摄像模组单元20中,所述第二镜头支撑元件25被安装于所述第二基座主体223的顶面,所述第二滤光元件26被安装于所述第二基座22的第二安装槽222,而所述第一基座12和所述第二基座22都可以通过一体成型的方式分别被设置于所述第一线路板主体111和所述第二线路板主体211,从而通过所述第一基座主体123和所述第二基座主体223提供平整的安装条件,比如为所述第一滤光元件16、所述第二滤光元件26、所述第一镜头支撑元件15以及所述第二镜头支撑元件25等提供平整、一致的安装条件,从而提高所述第一摄像模组单元10和所述第二摄像模组单元20的各自组装精度,减小累积误差,且有助于提高所述第一摄像模组单元10和所述第二摄像模组单元20的中心光轴的一致性。
所述第一线路板11、所述第一感光元件13和所述第一基座12构成一第一感光组件。所述第二线路板21、所述第二感光元件23和所述第二基座22构成一第二感光组件。而所述第一感光组件和所述第二感光组件构成一阵列线路板组件。也就是说,所述第一线路板11、所述第一基座12、所述第一感光元件13、所述第二线路板21、所述第二感光元件23以及所述第二基座22构成所述阵列线路板组件,从而可以方便地将不同类型的镜头或镜头支撑元件分别安装于所述第一基座12和所述第二基座22,构成具有预定高度差H的所述阵列摄像模组100。换句话说,所述阵列摄像模组100包括至少一具有高度差的所述阵列线路板组件、两所述镜头,两所述镜头分别位于所述阵列线路板组件的两感光路径。
举例地,参照图3,所述阵列摄像模组100的所述阵列线路板组件的形成过程可以是,先在所述第一线路板11预定位置一体成型形成带有所述延伸部124的所述第一基座12,并使得所述第一基座12的所述第一基座主体123包覆所述第一线路板主体111上的所述第一电子元件112;而后将所述第二线路板21安 装于所述第一基座12的所述延伸部124;进一步,在所述第二线路板21预定位置一体成型形成所述第二基座22,并且使得所述第二基座22包覆所述第二线路板21的所述第二电子元件212;进一步,分别将所述第一感光元件13和所述第二感光元件23贴装于所述第一线路板11和所述第二线路板21,使其分别位于所述第一基座12的第一光窗121和所述第二基座22的第二光窗221内。当然,在本发明其他实施方式中,也可以先将所述第一感光元件13和所述第二感光元件23分别先贴装于所述第一线路板主体111和所述第二线路板主体211,而后分别形成所述第一基座12和所述第二基座22,本领域的技术人员可以理解的是,所述阵列线路板组件的形成顺序并不是本发明的限制。
值得一提的是,在图3中示意,在形成所述第一基座12后再分别在所述第一线路板11和所述第二线路板21上分别贴装所述第一感光元件13和所述第二感光元件23。而在本发明的其他制造方式,也可以先在所述第一线路板11和/或所述第二线路板21上分别贴装所述第一感光元件13和所述第二感光元件23,而后再形成所述第一第一基座12以及第二基座22。当然也可以是其他的顺序,比如先在所述第一线路板11上贴装所述第一感光元件13,而后形成所述第一基座12,进而在所述第一基座12的所述延伸部124安装所述第二线路板21,而后在所述第二线路板21上电连接所述第二感光元件23,而后形成所述第二基座22。也就是说,在不同的实施例中,在所述第一线路板11上电连接所述第一感光元件13、在所述第一线路板11形成所述第一基座12、在所述第一基座12上设置所述第二线路板21、在所述第二线路板21上电连接所述第二感光元件23以及在所述第二线路板21形成所述第二基座22这些步骤可以根据需要先后配置,不限于图3中示意的方式。
如图4和图5所示,是根据本发明的第二个优选实施例的阵列摄像模组100示意图。不同于上述实施例的是,在本发明的这个实施例中,所述第二线路板21被埋设于所述第一基座12的所述延伸部124,从而降低所述第二线路板21和所述延伸部124的相对高度,减少所述第二线路板21的安装固定过程。所述第二基座22一体地连接于所述第一基座12。换句话说,所述第二线路板21被一体成型地固定于所述所述第一基座12的所述延伸部124。比如,在制造的过程中,将所述第一线路板11和所述第二线路板21分别设置于预定位置,且具有预定的高度差,而后对所述第一线路板11和所述第二线路板21同时一体成型固定。 在制造的过程中,可以同时形成所述第二基座22,也可以在形成所述延伸部124后,再次形成所述第二基座22。
进一步,所述第二线路板主体211具有至少一第二电连接区2111,以便于电连接所述第二感光元件23。所述第二电连接区2111显露于所述延伸部124的表面,方便所述第二感光元件23的电连接。比如通过打金线的方式将所述第二电连接元件233电连接于所述第二感光元件23和所述第二电连接区2111,从而使得所述第二感光元件23和所述第二线路板21电连接。所述第二电连接区2111的显露方式实现方式举例地但不限于,通过在模具内部设置凸起抵靠于所述第二电连接区2111,从而使得所述第二线路板主体211的所述第二电连接区2111不被一体成型材料覆盖。所述第二电连接区2111举例地但不限于被实施为条形焊盘。值得一提的是,在附图4中,所述第二线路板主体211被基本完全包覆于所述延伸部内容,而仅显露所述第二电连接区2111来电连接所述第二感光元件23,即所述第二感光元件23被支撑于所述延伸部124的表面。也就是说,在制造的过程中,先将所述第一线路板11和所述第二线路板21一体成型固定,而后再电连接所述感光元件23。而在本发明的其他实施例中,所述第二感光元件23可以被直接地贴装于所述第二线路板21,并且将所述第二感光元件23电连接所述第二线路板21的所述第二电连接区2111,而后一体成型固定所述第一线路板11和所述第二线路板21。
参照图5,在这个实施方式中,所述第二感光元件23通过四侧都设置所述第二电连接元件233的方式电连接于所述第二线路板21。相应地,所述第二线路板21具有四所述第二电连接区2111,分别被设置于相对的两侧。四个所述第二电连接区2111显露于所述延伸部124的表面。所述第二感光元件23通过各所述第二电连接元件233分别电连接于各所述第二电连接区2111。
举例地,所述阵列线路板组件的制造过程可以是,先将所述第一线路板11和所述第二线路板21设置于预定的位置,使其具有高度差;进一步,一体成型形成所述第一基座12和所述第二基座22,并且使得所述第二线路板21被包覆于所述第一基座12的所述延伸部124,并且使得所述第二线路板21的所述第二电连接区2111显露于所述延伸部124的表面;进一步,将所述第一感光元件13和所述第二感光元件23分别电连接于所述第一线路板11和所述第二线路板21。
当然,在其他实施例中,所述第一线路板11可以被所述第一基座12包覆, 且使得所述第一线路板11的至少一第一电连接区显露于外部,以便于所述第一感光元件13电连接于所述第一电连接区。在本发明的另一实施例中,所述第二线路板21也可以不被第二基座22完全包覆,比如使得所述第二线路板21底部嵌于所述延伸部124,而所述第二线路板21的表面显露于外部,从而通过所述延伸部124限制所述第二线路板21的位置,防止在安装过程中发生位移,且降低所述第二线路板21和所述延伸部124的相对高度。
如图6所示是根据本发明的第二个优选实施例的阵列摄像模组100的一变形实施方式。不同于图5中实施方式的是,所述阵列线路板组件包括一连接板128,连接于所述第一线路板11和所述第二线路板21。更具体地,所述连接板128电连接所述第一线路板11和所述第二线路板21,从而使得所述第一线路板11和所述第二线路板21信息相通。所述第一线路板11和所述第二线路板21电连接时,所述第一线路板和所述第二线路板21可以共用一个输出端。所述连接板128举例地但不限于软板。
如图7所示,是根据本发明的第三个优选实施例的阵列摄像模组100。不同于上述实施例的是,所述第一基座12包括一第一延伸安装部125,自所述第一基座主体123至少部分地向上延伸,并且形成一第一限位槽126,用于限位安装所述第一镜头14或所述第一镜头支撑元件15。所述第二基座22包括一第二延伸安装部225,自所述第二基座主体223至少部分地向上延伸,并且形成一第二限位槽226,用于限位安装所述第二镜头24或所述第二镜头支撑元件25。
在本发明的这个实施例中,所述第一镜头14被安装于所述被安装于所述第一限位槽126。也就是说,所述第一延伸安装部125的形状与所述第一镜头14相适应,从而适于限位、安装所述第一镜头14,从而形成一定焦摄像模组。所述第二镜头24被安装于所述第二限位槽226。也就是说,所述第二延伸安装部225的形状与所述第二镜头24相适应,从而适于限位、安装所述第二镜头24,从而形成一定焦摄像模组。也就是说,所述阵列摄像模组100的两所述阵列摄像模组100单元都为定焦摄像模组。
在本发明的另一些实施例中,所述第一镜头支撑元件15被安装于所述第一限位槽126,所述第一镜头14被安装于所述第一镜头支撑元件15,所述第一镜头支撑元件15被实施为一驱动元件,从而使得所述第一摄像模组单元10形成一动焦摄像模组。所述第二镜头支撑元件25被安装于所述第二限位槽226,所述 第二镜头24被安装于所述第二镜头支撑元件25,所述第二镜头支撑元件25被实施为一驱动元件,从而使得所述第二摄像模组单元20形成一动焦摄像模组。也就是说,所述阵列摄像模组100的两所所述摄像模组单元都为动焦摄像模组。
当然,在本发明的其他实施例中,还可以是动焦和定焦两种方式的组合,本发明在这方面并不限制。
如图8A所示,是根据本发明的第四个优选实施例的阵列摄像模组100。在本发明的这个实施中,所述第一摄像模组单元10包括一第一支座18,用于安装其他部件,如所述第一滤光元件16、所述第一镜头14或所述第一镜头支撑元件15。
在本发明的这个实施例附图中,所述第一支座18被安装于所述第一基座主体123,所述第一滤光元件16被安装于所述第一支座18。特别地,所述第一支座18下沉于所述第一基座12的所述第一光窗121内,从而使得所述第一滤光元件16的位置下沉,靠近所述第一感光元件13,减小所述第一摄像模组单元10的后焦距,且减小所述第一滤光元件16的需求面积。
所述第二摄像模组20包括一第二支座28、用于安装其他部件,如所述第二滤光元件26、所述第二镜头24或所述第二镜头支撑元件25。在本发明的这个实施例中,所述第二支座28被安装于所述第二基座主体223,所述第二滤光元件26被安装于所述第二支座28。特别地,所述第二支座28下沉于所述第二基座22的所述第二光窗221内,从而使得所述第二滤光元件26的位置下沉,靠近所述第二感光元件23,减小所述第二摄像模组单元20的后焦距,且减小所述第二滤光元件26的需求面积。当然,本发明的其他实施例中,所述阵列摄像模组100可以只包括一个所述支座,比如所述第一支座18或所述第二支座28,本领域的技术人员应当理解的是,所述支座的数量并不是本发明的限制。
在这个实施例中,所述第一支座18被安装于所述第一基座12的所述第一安装槽122,所述第二支座28被安装于所述第二基座22的所述第二安装槽222。而在本发明的其他实施例中,所述第一基座主体123和所述第二基座主体223可以为平台结构,所述第一支座18和所述第二支座28并不向下沉,且被直接安装于所述第一支座18和所述第二支座28的平台结构,本领域的技术的人员应当理解的是,所述支座的安装位置和具体结构并不是本发明的限制。
如图8B所示,是根据本发明的第四个优选实施例的阵列摄像模组100的变 形实施方式。在这种实施方式中,所述第一支座18和所述第二支座28一体地连接。也就是说,所述第一支座18和所述第二支座28相邻的部分相互连接,从而能够一次安装于所述第一基座12和所述第二基座22,并且提供相对一致的安装条件。进一步,所述第一基座12和所述第二基座22一体地连接。也就是说,所述所述第二基座22在成型时,不仅一体成型于所述第二线路板21,且一体成型于所述第一基座的至少部分表面,从而使得所述第一基座12和所述第二基座22更加牢固地连接。
如图8C所示,是根据本发明的第四个优选实施例的阵列摄像模组100的另一变形实施方式。在这种实施方式中,所述第二摄像模组单元20包括一第二支座28,所述第二支座28被直接地安装于所述第二线路板21。也就是说,在这种方式中,所述第二摄像模组单元20不包括所述第二基座22,而通过所述第二支座28承担所述第二基座22的支撑功能。
更具体地,所述第二支座28被直接地贴装于所述第二线路板主体211的顶面。举例地,所述第一支座28被粘接固定于所述第二线路板主体。所述第二支座28具有一通光孔281,为所述第二感光元件23提供光线通路.所述第二支座28具有一避让空间282,连通于所述通光孔281,用于避让所述第二电子元器件212和所述第二感光元件23。
进一步地,在这种方式中,所述第二镜头支撑元件25和/或所述第二镜头24被直接地安装于所述第二支座28的顶面。
如图9所示,是根据本发明的第五个优选实施例的阵列摄像模组100示意图。所述第一摄像模组单元10包括一第一补充基座19,所述第一补充基座19补充安装于所述第一基座主体123,与所述第一基座主体123配合形成所述第一光窗121。也就是说,在这种实施方式中,所述第一基座主体123并不是一闭合的环形结构,而通过所述第一补充基座19补充后形成一个闭合环形结构。换句话说,所述第一基座主体123具有至少一第一缺口1231,连通于外部,所述第一补充基座19至少部分地补充于所述第一缺口1231。所述第一缺口1231限位所述第一补充基座19的位置,从而使得所述补充可以准确、快速地被安装。所述第一缺口1231和所述第一补充基座19的形状可以根据需求设置,比如倒梯形结构,三角形结构、方形结构等,本发明在这方面并不限制。
所述第二摄像模组单元20包括一第二补充基座29,所述第二补充基座29 补充安装于所述第二基座主体223,与所述第二基座主体223配合形成所述第二光窗221。也就是说,在这种实施方式中,所述第二基座主体223并不是一闭合的环形结构,而通过所述第二补充基座29补充后形成一个闭合环形结构。换句话说,所述第二基座主体223具有至少一第二缺口2231,连通于外部,所述第二补充基座29至少部分地补充于所述第二缺口2231。所述第二缺口2231限位所述第二补充支座18的位置,从而使得所述补充可以准确、快速地被安装。所述第二缺口2231和所述第二补充基座29的形状可以根据需求设置,比如倒梯形结构,三角形结构、方形结构等,本发明在这方面并不限制。
当然,在本发明的其他实施方式中,所述阵列摄像模组100可以仅包括一所述补充基座,如所述第一补充基座19或所述第二补充基座29,本领域的技术人员应当理解的是,所述补充基座的形状和数量并不是本发明的限制。
如图10所示,是根据本发明的第六个优选实施例的阵列摄像模组100示意图。在在这个实施例中,所述第二线路板主体211具有一第二下沉孔2112,所述第二感光元件23下沉设置于所述第二下沉孔2112内,从而降低所述第二感光元件23和所述第二线路板主体211的相对高度。
所述第二下沉孔2112连通于所述第二线路板21的两侧,当所述第二感光元件23下沉于所述第二下沉孔2112时,所述第二感光元件23的底部被所述第一基座12的所述延伸部124支撑。也就是说,所述延伸部124为所述第二感光元件23提供安装平面。所述第一基座12通过一体成型方式形成于所述第一线路板11,从而使得所述延伸部124和所述第一线路板11延伸具有较好的一致性,从而使得所述第二感光元件23和所述第一线路板11具有较好的一致性,从而使得所述第一摄像模组单元10和所述第二摄像模组单元20具有较好的光轴一致性,或者说使得所述第一摄像模组10和所述第二摄像模组单元20的成像质量更佳。即,使得所述阵列摄像模组100的成像质量更佳。
在本发明的另一实施,所述第二线路板主体211具有一下沉槽,所述第二感光元件23下沉设置于所述下沉槽内,从而降低所述第二感光元件23和所述第二线路板主体211的相对高度。不同于上述下沉孔2112的是,所述下沉槽并不连通所述第二线路板主体211的两侧。也就是说,所述第二线路板主体211的下沉深度以及所述所述第二感光元件23与所述第二线路板主体211的相对高度的大小可以通过控制所述下沉槽的深度来实现。本领域的技术人员应当理解的是,所 述下沉槽或所述下沉孔是否连通所述第二线路板主体211的两侧以及所述第二感光元件23的下沉深度并不是本发明的限制。
如图11A所示,是根据本发明的第七个优选实施例的阵列摄像模组100示意图。在这种实施例中,所述第一基座主体123和所述第二基座主体223一体地连接,所述第一基座主体123固定连接于所述第一线路板11,所述第二基座主体223固定连接于所述第二线路板21,从而将所述第一摄像模组单元10和所述第二摄像模组单元20稳定地连接。
也就是说,在这种方式中,通过所述第二基座主体223和所述第一基座主体123的一体连接方式将两所述第一摄像模组单元10和所述第二摄像模组单元20固定连接。所述第一基座12和所述第二基座22具有高度差。也就是说,所述第二基座主体223具有与所述延伸部124的相同的功能,固定所述第二线路板21。
举例地,在制造的过程中,将所述第一线路板11和所述第二线路板21设置于预定的位置,具有预定高度差,进一步,分别在所述第一线路板11和所述第二线路板21的预定位置形成所述第一基座主体123和所述第二基座主体223,使得所述第一线路板11和所述第二线路板21的相对位置确定,且具有高度差。进而在所述第一线路板11和所述第二线路板21上安装所述第一感光元件13和所述第二感光元件23。当然,在本发明的其他实施方式中,还可以是其他顺序的制造方式,本发明在这方面并不限制。
图11B是根据本发明的第七个优选实施例的阵列摄像模组的一变形实施方式示意图。在这种实施方式中,所述第一支座18和所述第二支座28一体地连接。也就是说,所述第一支座18和所述第二支座28相邻的部分相互连接,从而能够一次安装于所述第一基座12和所述第二基座22,并且提供相对一致的安装条件。且所述第一支座18和所述第二支座28一体连接可以为所述滤光元件以及其他部件,如所述镜头或所述镜头支撑元件,提供更加稳定的支撑,增加所述第一基座12和所述第二基座22一体连接时的结构强度。
如图12所示,是根据本发明的第八个优选实施例的阵列摄像模组100示意图。所述阵列摄像模组100包括一支撑板129,所述支撑板129固定连接于所述第一基座主体123,所述第二线路板21被安装于所述支撑板129。
进一步,所述支撑板129具有一通孔1290,所述通孔1290与所述第一光窗121相对应,以便于为所述第一感光元件13提供光线通路。
换句话说,在这种方式中,所述第一基座12不形成所述延伸部124,而通过所述支撑板129固定连接所述第一摄像模组单元10和所述第二摄像模组单元20,且使得所述第一摄像模组单元10的所述第二摄像模组单元20底部具有高度差,外端部一致。所述支撑板129举例地但不限于一金属板,优选为钢板。
也就是说,所述第二摄像模组单元20的所述第二线路板21至支撑固定于所述支撑板129的顶面,比如通过粘接固定的方式连接。
也就是说,在这种方式中,所述第一摄像模组单元10的所述支撑板129形成所述连接部,为所述第二摄像模组单元20提供支撑固定的位置,使得所述第一摄像模组单元10和所述第二摄像模组单元20具有高度差的稳定地固定。所述支撑板129的顶面与所述第一线路板11底面形成所述高度差H,即使得所述第一线路板11的底面与所述第二线路板21的底面形成所述高度差H。
如图13所示,是根据本发明的第九个优选实施例的阵列摄像模组100示意图。在这种实施方式中,所述第一基座12的所述延伸部124向下扩展,从而使得所述延伸部124的底部和所述第一线路板11底部一致。也就是说,所述阵列摄像模组100整体上,外端部和底部都一致,从而形成一定相对规则、平整的结构,便于安装于电子设备。
换句话说,在这个实施方式中,所述延伸部124自所述基座主体123至少部分地向外延伸,使得所述延伸部124的底面与所述第一线路板主体111的底面一致,所述延伸部124的顶面,即所述支撑面1241与所述第一线路板主体111形成一高度差,所述第二线路板211被安装于所述支撑面1241,从而使得所述阵列摄像模组的顶端和底端的都一致。
如图14所述,是根据本发明的第十个优选实施例的阵列摄像模组100示意图。在这种实施方式中,所述第一基座12包括一第一支承元件127,用于在制造的过程中支撑模具,防止对所述第一线路板11或所述第一感光元件13的损伤。也就是说,在制造的过程中,可以将制造模具抵靠于所述第一支承元件127,从而使得模具不会直接接触所述第一线路板11或所述第一感光元件13,且防止成型材料向内侧溢流。
进一步,所述第一支承元件127可以为环形结构,与所述第一基座主体123的形状一致。所述第一支承元件127具有弹性,举例地但不限于,胶水涂层或胶垫。
所述第一支承元件127被设置于部分所述第一基座12和所述第一线路板111之间。具体地,所述第一支承元件127被设置一所述第一基座主体123和内侧边缘和对应的所述第一线路板11之间。
进一步,所述第一基座主体123侧壁具有倾斜角,从而方便模具制造,比如方便拔模过程,且减少所述第一基座主体123底部出现毛刺现象。
所述第二基座22包括一第二支承元件227,用于在制造的过程中支撑模具,防止对所述第二线路板21或所述第二感光元件23的损伤。也就是说,在制造的过程中,可以将所述制造模具抵靠于所述第二支承元件227,从而使得模具不会直接接触所述第一线路板11或所述第二感光元件23,且防止成型材料向内侧溢流。
进一步,所述第二支承元件227可以为环形结构,与所述第二基座主体223的形状一致。所述第二支承元件227具有弹性,举例地但不限于,胶水涂层或胶垫。
所述第二支承元件227被设置于部分所述第二基座22和所述第二线路板211之间。具体地,所述第二支承元件227被设置于所述第二基座主体223和内侧边缘和对应的所述第二线路板21之间。
进一步,所述第二基座主体223侧壁具有倾斜角,从而方便模具制造,比如方便拔模过程,且减少所述第二基座主体223底部出现毛刺现象。
图15是根据本发明的第十一个优选实施例的阵列摄像模组100示意图。在本发明的这种实施方式中,所述第一滤光元件16固定连接于所述第一基座12,进一步地,所述第一滤光元件16固定连接于所述第一基座主体123。具体地,所述第一滤光元件16通过一体成型的方式固定连接于所述第一基座主体123。
进一步,所述第一滤光元件16被支撑于所述第一支承元件127,从而方便将所述第一滤光元件16一体成型地固定连接。
所述第二滤光元件26固定连接于所述第二基座22,进一步地,所述第二滤光元件26固定连接于所述第二基座主体223。具体地,所述第二滤光元件26通过一体成型的方式固定连接于所述第二基座主体223。
进一步,所述第二滤光元件26被支撑于所述第二支承元件227,从而方便将所述第二滤光元件26一体成型地固定连接。
举例地,在一些实施例中,所述滤光元件16、26可以通过模塑成型的方式 一体成型地连接于各所述基座主体123、223。
举例地但不限于,所述阵列摄像模组100的所述阵列线路板组件的形成过程可以是:先在所述第一线路板11和所述第二线路板21上分别设置所述第一支承元件127和所述第二支承元件227,而后将所述第一滤光元件16设置于所述第一支承元件127,而后在所述第一滤光元件16上方一体成型,形成所述第一基座12,从而将所述第一滤光元件16一体成型地固定;进而将所述第二线路板21设置于所述第一基座12的所述延伸部124,进一步,在所述第二支承元件227上设置所述第二滤光元件26,在所述第二滤光元件26上方一体成型形成所述第二基座主体223,从而将所述第二滤光元件26一体成型地固定。
如图16所示,是根据本发明的第十二个优选实施例的阵列摄像模组100示意图。在本发明的这个实施例中,所述第一摄像模组单元10和所述第二摄像模组单元20各自包括至少一支承元件127,227和至少一镜片17,27,所述镜片17,27分别被支承于所述支承元件127,227。各所述镜片17,27分别被设置于所述第一基座主体123和所述第二基座主体223。具体地,所述镜片17,27一体成型地固定于所述第一基座主体123和所述第二基座主体223,分别位于所述第一感光元件13和所述第二感光元件23的感光路径。
被物体反射的光线自所述镜头14,24以及所述镜片17,27进入所述摄像模组单元的内部,以在后续被所述第一感光元件13和所述第二感光元件23接收和进行光电转化,从而得到与物体相关联的影像。所述镜片17,27的设置能够降低光学的TTL(镜头通光孔上面的镜头平面到芯片的感光平面的距离),从而在不影响光学性能的前提下使所述摄像模组单元的尺寸进一步减小,满足电子设备对搭载小尺寸的阵列摄像模组100的需求。同时,所述镜片17,27的设置也能够降低污点敏感度。例如在一实施例中,可以降低50%的污点敏感度。
在本发明的这个优选实施例中,优选地,所述镜片17,27被实施为一热硬化性质的镜片,即所述镜片17,27被实施为一热硬化镜片,从而所述镜片17,27在进行模塑工艺能够承受住模塑工艺中的环境温度。例如,在一实施例的模塑工艺中能够承受175℃的模塑环境温度。也就是说,在模塑工艺之前,耐高温的且经过了热硬化处理的所述镜片17被连接于所述支承元件127,且和所述第一线路板11一起被放置于模具中,流体的固化模塑材料围绕所述支承元件127以及所述镜片17的外表面模塑一体成型所述第一基座12,从而所述第一基座12能够 一体地成型于所述第一线路板11,也就是说,所述第一基座12、所述第一线路板11以及所述镜片17形成一体式结构。本领域的技术人员可以理解的是,本发明的所述镜片17,27不仅仅可以是热硬化镜片17,27,还可以是其他性质的镜片17,27,本发明并不受此限制。类似地,可以将另一所述镜片27、所述第二基座22和所述第二线路板21一体成型形成一体式结构。
进一步地,所述镜片17,27包括一镜片主体171,271和设置在所述镜片主体171,271周围的一镜片周缘172,272。由于所述镜片17,27为精密的光学元件,所述镜片主体171,271的边缘较薄。而设置于所述镜片主体171,271边缘的且为一体连接的所述镜片周缘172,272为增厚式支架设计,能够承载所述镜片主体171,271,从而不影响所述镜片主体171,271的光学性能的同时能够使所述镜片主体171,271在模具中被一体模塑连接于所述基座。也就是说,在所述基座被成型之前,所述镜片17,27的所述镜片周缘172,272被设置于所述感光元件的所述非感光区域,所述镜片17,27的所述镜片主体171,271被设置于所述感光元件的感光路径;在所述基座成型之后,所述模塑基座包覆所述线路板、所述感光元件所述支承元件的一部分以及所述镜片17,27的所述镜片周缘172,272。
值得一提的是,所述支承元件和所述镜片17,27能够有效地提高所述阵列摄像模组100的产品良率,并改善所述阵列摄像模组100的成像品质。进一步地,所述支承元件127,227包括一框形的支承主体和具有一通孔,其中所述支承主体被设置于所述线路板,以使所述感光元件的一感光区域对应于所述支承元件的所述通孔以及所述镜片17,27的所述镜片主体171,271,从而在进行模塑工艺时,所述支承主体以及所述镜片17,27能够保护所述感光元件。
在这种实施例中,所述第一感光元件13和所述第二感光元件23没有被一体成型地封装,需要在一体成型所述第一基座12和所述第二基座22之前,分别将所述第一感光元件13和所述第二感光元件23设置于所述第一线路板11和所述第二线路板21比如通过表面贴装的方式将所述第一感光元件13和所述第二感光元件23分别设置于所述第一线路板11和所述第二线路板21,或者通过粘性介质将第一感光元件13或所述第二感光元件23分别封装于所述第一线路板和所述第二线路板21,比如通过胶水封装。
如图17所示,是根据本发明的第十三个优选实施例的阵列摄像模组100示意图。所述阵列摄像模组100包括三摄像模组单元,分别为一第一摄像模组单元 10、一第二摄像模组单元20和一第三摄像模组单元30。其中所述第一摄像模组单元10与所述第二摄像模组单元20以及所述第三摄像模组单元30具有高度差H,且所述第一摄像模组单元10、所述第二摄像模组单元20以及所述第三摄像模组单元30的外端部一致。所述第一摄像模组单元10和所述摄像模组单元的高度一致。
具体地,所述第一基座12包括一延伸部124,所述第三摄像模组单元30和所述第二摄像模组单元20分别被设置于所述延伸部124,从而将所述第一摄像模组单元10、所述第二摄像模组单元20和所述第三摄像模组单元30结构紧凑地稳定连接。
也就是说,所述延伸部124同时为所述第三线路板31和所述第二线路板21提供安装平面。特别地,在本发明的这个实施例中,所述第二摄像模组单元20的所述第二基座22和所述第三摄像模组单元30的所述第三基座32一体地连接,从而保证所述第一摄像模组单元10,所述第二摄像模组单元20和所述第三摄像模组单元30的光轴一致性。
参照图18至图20,根据本发明的第十四个优选实施例的阵列摄像模组100,所述阵列摄像模组100包括至少两摄像模组单元,至少两所述摄像模组单元外端面一致,至少两所述摄像模组单元底部具有高度差H,形成一高度差空间110。
具体地,两所述摄像模组单元分别为一第一摄像模组单元10和一第二摄像模组单元20。所述第一摄像模组单元10包括一第一线路板11、一第一感光元件13和一第一镜头14。所述第二摄像模组单元20包括一第二线路板21、一第二感光元件23和至少一第二镜头24。
进一步,所述第一摄像模组单元10包括一第一基座12,所述第一基座12固定连接于所述第一线路板11。所述第一基座12包括一第一基座主体123和一延伸部124,所述第一基座主体123固定连接于所述第一线路板11,所述延伸部124自所述基座主体至少部分地向外延伸,以便于所述第二摄像模组单元20提供安装位置。所述第二线路板21固定连接于所述第一基座12的所述延伸部124,从而通过所述第一基座12将所述第一摄像模组单元10和所述第二摄像模组单元20稳定地连接于一起。
所述第一感光元件13电连接于所述第一线路板11,以便于向所述第一线路板11传递感光信息,所述第一镜头14位于所述第一感光元件13的感光路径, 以便于所述第一感光元件13接收光线而进行感光。所述第二感光元件23电连接于所述第二线路板21,以便于向所述第二线路板21传递感光信息,所述第二镜头24位于所述第二感光元件23的感光路径,以便于所述第二感光元件23接收光线而进行感光。特别地,在一些实施方式中,所述第一感光元件13和所述第二感光元件23可以通过表面贴装工艺SMT(Surface Mount Technology)或COB(Chip On Board)工艺分别被设置于所述第一线路板11和所述第二线路板21,且分别通过至少一第一电连接元件133和一第二电连接元件233电连接于所述第一线路板11和所述第二线路板21。所述第一电连接元件133和所述第二电连接元件233举例地但不限于,金线、银线、铜线、铝线、焊盘、引脚等。更具体地,根据本发明,所述第一基座12通过一体成型的方式设置于所述第一线路板11,比如模塑成型的方式,从而将所述第一基座12和所述第一线路板11稳定地固定,且减少额外的安装固定过程。比如减少胶水粘接的过程,连接更加稳定,省去胶水连接的高度,降低摄像模组单元的高度。
所述第一感光元件13具有一感光区131和一非感光区132,所述感光区131用于进行感光作用。在本发明的这个实施例中,所述非感光区132通过所述电连接元件133电连接于所述线路板11。进一步,所述基座12至少部分地一体成型于所述感光元件13的所述非感光区132。换句话说,所述第一基座12一体成型地封装所述第一线路板11和所述第一感光元件13。所述基座12包覆所述电连接元件133。
参照图18B所示,是根据本发明的第十四个优选实施例的变形实施方式,在这种实施方式中,其中至少一所述摄像模组的所述感光元件被所述基座至少部分地一体封装,且至少一所述所述摄像模组的所述感光元件未被所基座一体封装。具体地,参照图18B,所述第一摄像模组单元10的所述第一线路板11所述第一感光元件13的至少部分所述非感光区132被所述第一基座12一体封装,所述第二摄像模组单元20的所述第二线路板21被所述第二基座一体封装。也就是说,所述第二感光元件23未被所述第二基座一体封装。换句话说,本发明的实施例的感光元件被封装的方式和其他实施例中的感光元件安装方式可以进行自由组合,从而形成不同结构的阵列摄像模组,本发明的在这方面并不限制。
值得一提的是说,相对于上述只成型于所述线路板的方式,模塑成型于感光元件的方式将所述基座可以进行一体成型的范围扩展至所述感光元件的所述非 感光区,从而在不影响所述感光元件的正常感光工作的情况下,增大了所述基座底部的连接面积,从而可以使得所述基座和所述线路板以及所述感光元件更加稳定地连接,且顶部可以为其他部件,如所述镜头、所述镜头支撑元件等,提供更大的可安装面积。且所述电连接元件133被所述基座12包覆,从而避免外部干扰所述电连接元件133,且防止所述电连接元件133氧化或沾染灰尘而影响所述摄像模组单元的成像质量。
举例地,所述第一基座12可以通过模具模塑一体成型的方式设置于所述第一线路板11,如模塑于感光感光元件的方式,区别于传统的COB方式。通过模具一体成型的方式,可以较好地控制成型形状以及表面平整度,比如,使得所述延伸部124具有较好的平整度,从而为所述第二摄像模组单元20提供平整的安装条件,有助于保证所述第一摄像模组单元10和所述第二摄像模组单元20的光轴一致性。值得一提的是,所述光轴一致,是指两摄像模组单元的中心光轴方向平行,或者两中心光轴之间的夹角在预定误差范围内,本发明在这方面并不限制。
更具体地,所述延伸部124具有一支撑面1241,所述支撑面1241向远离所述第一摄像模组单元10方向延伸,使得所述第一摄像模组单元10并列地比邻于所述第二摄像模组单元20。以所述摄像模组单元光轴方向为高度方向,所述延伸部124的高度高于所述第一线路板11,从而所述第一基座12和第一线路板11形成所述高度差空间110。也就是说,所述延伸部124和所述第一线路板11存在高度差,从而使得安装于所述延伸部124的所述第二摄像模组单元20和所述第一摄像模组单元10存在高度差,因此,当所述第一摄像模组单元10和所述第二摄像模组单元20的高度差H和所述延伸部124和所述第一线路板11之间高度差以及所述第二线路板21的厚度之和一致时,可以使得所述第一摄像模组单元10和所述第二摄像模组单元20的端部高度保持一致,即,所述阵列摄像模组100单元的外端平整。由此可以看到,通过所述延伸部124和所述第一线路板11的高度差补偿所述第一摄像模组单元10和所述第二摄像模组单元20存在的高度差,使得两个不同高度的摄像模组单元稳定地组装于一起,且外端面保持一致,使得所述第一摄像模组单元10和所述第二摄像模组单元20光线入射方向一致地并列设置,并且使得光线入射面一致,从而当所述第一摄像模组单元10和所述第二摄像模组单元20相互配合采集图像信息时,可以获得更加准确的信息。
进一步,所述高度差空间110位于所述阵列摄像模组100的底部,当所述阵 列摄像模组100单体被安装于一电子设备时,所述高度差空间110位于所述电子设备的内部,从而使得所述电子设备的外部保持相对平整,而所述电子设备的部件可以被设置于所述高度差空间110,从而充分利用所述电子设备的内部空间,更有益于所述电子设备轻薄化发展。
进一步,所述延伸部124的支撑面1241通过模具一体成型的方式形成,从而可以保证较好的平整性,且可以通过模具控制使得所述延伸部124和所述第一线路板11的方向一致,比如使得所述延伸部124的方向和所述第一线路板11的方向平行,从而使得所述第一线路板11和所述第二线路板21的方向一致,为所述第一摄像模组单元10和所述第二摄像模组单元20提供一致的安装基础,从而使得所述第一摄像模组单元10和所述第二摄像模组单元20的光轴一致。
进一步,根据本发明的这个实施例,所述第一线路板11包括一第一线路板主体111和至少一第一电子元件112,所述第一电子元件112凸出于所述第一线路板主体111,用于配合所述第一线路板主体111的工作。所述第一基座12一体成型于所述第一线路板主体111,并且包覆所述第一电子元件112,从而减少所述第一电子元件212的占用空间。所述第一电子元件212举例地但不限于,电阻、电容、驱动器等。当然,在本发明的另一些实施例中,可以不设置所述第一电子元件112或者所述第一电子元件112凸出于所述第一线路板主体111,比如内埋于所述第一线路板主体111,本发明在这方面并不限制。
每个所述第一电子元件112可以通过诸如SMT工艺被相互间隔地贴装于所述第一线路板11的边缘区域,比如所述第一感光元件13外侧。值得一提的是,每个所述第一电子元件112可以分别位于所述第一线路板11的同侧或者相反侧,例如在一个具体示例中,所述第一感光元件13和每个所述第一电子元件112可以分别位于所述第一线路板11的同一侧,并且所述第一感光元件13被贴装于所述第一线路板11的芯片贴装区域,每个所述第一电子元件112分别被相互间隔地贴装于所述第一线路板11的边缘区域。所述第一基座12在成型后包覆每个所述第一电子元件112,以藉由所述第一基座12隔离相邻所述第一电子元件112和隔离所述第一电子元件112与所述第一感光元件13。
在本发明的所述摄像模组中,通过所述第一基座12在成型后包覆每个所述第一电子元件112和所述第一电连接元件133的方式具有很多的优势,首先,所述第一基座12包覆每个所述第一电子元件112以及所述第一电连接元件133, 以使相邻所述第一电子元件112之间以及所述第一电连接元件133之间不会出现相互干扰的不良现象,即便是相邻所述第一电子元件112以及所述第一电连接元件133的距离较近时也能够保证所述摄像模组单元的成像品质,这样,可以使小面积的所述第一线路板11上能够被贴装更多数量的所述第一电子元件112,从而使所述摄像模组单元的结构更加的紧凑,以有利于在控制所述摄像模组单元的尺寸的基础上提高所述摄像模组单元的成像品质;其次,所述第一基座12包覆每个所述第一电子元件112以及所述第一电连接元件133,从而无论是在水平方向还是在高度方向,在所述第一基座12和每个所述第一电子元件112之间以及所述第一电连接元件133之间都不需要预留安全距离,以能够减小所述摄像模组单元的尺寸。第三,所述第一基座12包覆每个所述第一电子元件112以及所述第一电连接元件133,从而在所述第一基座12和所述第一线路板11间不需要使用胶水进行连接和调平,以有利于降低所述摄像模组单元的高度尺寸。第四,所述第一基座12包覆每个所述第一电子元件112以及所述第一电连接元件133,在后续运输和组装所述摄像模组单元以形成所述阵列摄像模组100的过程中,所述第一基座12可以防止所述第一电子元件112以及所述第一电连接元件133晃动和脱落,从而有利于保证所述阵列摄像模组100的结构稳定性。第五,所述第一基座1223包覆每个所述第一电子元件112以及所述第一电连接元件133,在后续运输和组装所述摄像模组单元以形成所述阵列摄像模组100的过程中,能够防止污染物污染每个所述第一电子元件112以及所述第一电连接元件133,从而保证所述阵列摄像模组100的成像品质。第六,所述第一基座12包覆所述电子元件后能够将所述第一电子元件112以及所述第一电连接元件133与空气隔绝,通过这样的方式,能够减缓所述第一电子元件112以及所述第一电连接元件133的氧化速度和老化速度,有利于提高所述第一电子元件112以及所述第一电连接元件133和所述阵列摄像模组100的环境稳定性。
值得一提的是,所述第一基座12一体成型于所述第一线路板11,并且包覆所述第一线路板11的所述第一电子元件112以及所述第一电连接元件133,从而使得所述第一基座12和所述第一线路板主体111具有较大的连接面积,连接更加稳定,从而所述延伸部124可以提供稳定的支撑,且通过一体成型的方式具有较好的结构强度,因此所述延伸部124可以牢固、可靠地支撑、固定所述第二摄像模组单元20,从而保证了产品的良率。
还值得一提的是,所述第二摄像模组单元20被安装于所述第一基座12的所述延伸部124,从而可以通过所述延伸部124的延伸长短以及所述第二摄像模组单元20的安装位置方便地控制所述第一摄像模组单元10和所述第二摄像模组单元20之间的距离,从而方便满足不同类型的摄像模组单元的配合要求。
根据本发明的这个实施例,所述第一基座12具有一第一光窗121,以便于为所述第一感光元件13提供光线通路。换句话说,所述第一感光元件13位于所述第一光窗121内,所述第一感光元件13的感光路径与所述第一光窗121方向一致。
更具体地,所述第一基座主体123形成所述第一光窗121,为所述第一感光元件13提供光线通路。在一些实施例中,所述第一基座主体123是一闭合环形结构,适应所述第一感光元件13的形状。
所述第一基座12具有一第一安装槽122,连通于所述第一光窗121。所述第一摄像模组单元10包括一第一滤光元件16,所述第一滤光元件16位于所述第一镜头14和所述第一感光元件13之间,以便于过滤通过所述第一镜头14到达所述第一感光元件13的光线。所述第一滤光元件16被安装于所述第一安装槽122。
进一步,根据本发明的这个实施例,所述第二摄像模组单元20包括一第二基座22,所述第二基座22固定连接于所述第二线路板21。所述第二基座22包括一第二基座主体223以及具有一第二光窗221。所述第二基座主体223形成所述第二光窗221,为所述第二感光元件23提供光线通路。换句话说,所述第二感光元件23位于所述第二光窗221内,所述第二感光元件23和所述第二光窗221方向一致。在一些实施例中,所述第二基座主体223是一闭合环形结构,适应所述第二感光元件23的形状。
所述第二基座22具有一第二安装槽222,连通于所述第二光窗221,所述第二安装槽222被设置于所述第二基座主体223。所述第二摄像模组单元20包括一第二滤光元件26,所述第二滤光元件26位于所述第二镜头24和所述第二感光元件23之间,以便于过滤通过所述第二镜头24到达所述第二感光元件23的光线。所述第二滤光元件26被安装于所述第一安装槽122。
所述第一滤光元件16和所述第二滤光元件26可以被实施为不同的类型,例如所述滤光元件能够被实施为红外截止滤光片、全透光谱滤光片、蓝玻璃滤光片 以及其他的滤光片或者多个滤光片的组合,例如所述滤光元件能够被实施为红外截止滤光片和全透光谱滤光片的组合,即所述红外截止滤光片和所述全透光谱滤光片能够被切换以选择性地位于所述感光元件的感光路径上,例如在白天等光线较为充足的环境下使用所述阵列摄像模组100时,可以将所述红外截止滤光片切换至所述感光元件的感光路径,以藉由所述红外截止滤光片过滤进入所述摄像模组单元的被物体反射的光线中的红外线,当夜晚等光线较暗的环境中使用所述摄像模组单元时,可以将所述全透光谱滤光片切换至所述感光元件的感光路径,以允许进入所述摄像模组单元的接收的被物体反射的光线中的红外线部分透过。
所述第二感光元件23具有一感光区221和一非感光区222,所述感光区221用于进行感光作用。在本发明的这个实施例中,所述非感光区222通过所述电连接元件233电连接于所述电路板21。进一步,所述基座22至少部分地一体成型于所述感光元件23的所述非感光区222。换句话说,所述第一基座22一体成型地封装所述第一线路板21和所述第一感光元件23。所述基座22包覆所述电连接元件233。
进一步,根据本发明的这个实施例,所述第二基座22一体成型于所述第二线路板21和至少部分所述非感光区222,从而将所述第二基座22和所述第二线路板21和所述第二感光元件23稳定地固定,且减少额外的安装固定过程。比如减少胶水粘接的过程,连接更加稳定,省去胶水连接的高度,降低摄像模组单元的高度。
所述第二线路板21包括一第二线路板主体211和至少一第二电子元件212,所述第二电子元件212凸出于所述第二线路板主体211,用于配合所述第二线路板主体211的工作。所述第二基座22一体成型于所述第二线路板主体211,并且包覆所述第二电子元件212和所述第二电连接元件233。所述第二基座22一体成型的方式可以与所述第一基座12相同,并且具有第一基座12相同的优势,在此不再赘述。
进一步,根据本发明的这个实施例,所述第一摄像模组单元10包括至少一第一镜头支撑元件15,所述第一镜头14被安装于所述第一镜头支撑元件15,所述第一镜头支撑元件15被安装于所述第一基座12的所述第一基座主体123,以使得所述第一镜头14位于所述第一感光元件13的感光路径。
所述第二摄像模组单元20包括至少一第二镜头支撑元件25,所述第二镜头 24被安装于所述第二镜头支撑元件25,所述第二镜头支撑元件25被安装于所述第二基座主体223,以使得所述第二镜头24位于所述第二感光元件23的感光路径。
进一步,所述第一镜头支撑元件15和所述第二镜头支撑元件25可以被实施为一驱动元件或一镜座元件,从而形成一动焦摄像模组或一定焦摄像模组。所述驱动元件举例地但不限于,音圈马达,压电马达等。比如,当所述第一镜头支撑元件15和所述第二镜头支撑元件25都被实施为一驱动元件时,所述第一摄像模组单元10和所述第二摄像模组单元20都为动焦摄像模组,也就是说,所述阵列摄像模组100是由两个定焦摄像模组构成。当所述第一镜头14支撑单元被实施为驱动元件,所述第二镜头支撑元件25被实施为镜座元件时,所述第一摄像模组单元10为动焦摄像模组,所述第二摄像模组单元20是定焦摄像模组,也就是说,所述阵列摄像模组100由一动焦摄像模组和一定焦摄像模组构成。当所述第一镜头支撑元件15被实施为镜座元件,所述第二镜头24元件被实施为一镜座元件时,所述第一摄像模组单元10为定焦摄像模组,所述第二摄像模组单元20为动焦摄像模组。当所述第一镜头支撑元件15和所述第二镜头支撑元件25都被实施为所述镜座元件时,所述第一摄像模组单元10和所述第二摄像模组单元20都为定焦摄像模组。
值得一提的是,在一些实施例中,当所述第一镜头支撑元件15或所述第二镜头支撑元件25被实施为驱动元件时,所述第一镜头支撑元件15和所述第二镜头支撑元件25电连接于所述第一线路板11或所述第二线路板21,以便于驱动所述第一镜头14或所述第二镜头24工作。举例地,所述第一镜头支撑元件15和所述第二镜头支撑元件25可以通过设置引脚、焊盘或引线等方式电连接于所述第一线路板11或所述第二线路板21。
所述第一摄像模组单元10和所述第二摄像模组单元20的类型可以根据需求配置,以便于相互配合实现更好的图像采集效果。本发明在这方面并不限制。
值得一提的是,所述第一摄像模组单元10中,所述第一镜头支撑元件15被安装于所述第一基座主体123的顶面,所述第一滤光元件16被安装于所述第一基座主体123的所述第一安装槽122;所述第二摄像模组单元20中,所述第二镜头支撑元件25被安装于所述第二基座主体223的顶面,所述第二滤光元件26被安装于所述第二基座22的第二安装槽222,而所述第一基座12和所述第二基 座22都可以通过一体成型的方式分别被设置于所述第一线路板主体111和所述第二线路板主体211,从而通过所述第一基座主体123和所述第二基座主体223提供平整的安装条件,比如为所述第一滤光元件16、所述第二滤光元件26、所述第一镜头支撑元件15以及所述第二镜头支撑元件25等提供平整、一致的安装条件,从而提高所述第一摄像模组单元10和所述第二摄像模组单元20的各自组装精度,减小累积误差,且有助于提高所述第一摄像模组单元10和所述第二摄像模组单元20的中心光轴的一致性。
所述第一线路板11、所述第一基座12、所述第一感光元件13、所述第二线路板21以及所述第二感光元件23构成一阵列线路板组件,可以方便地将不同类型的镜头分别安装于所述第一基座12和所述第二基座22,从而构成具有预定高度差H的所述阵列摄像模组100。换句话说,所述阵列摄像模组100包括至少一具有高度差的所述阵列线路板组件、两所述镜头,两所述镜头分别位于所述阵列线路板组件的两感光路径。
举例地,参照图20,所述阵列摄像模组100的所述阵列线路板组件的形成过程可以是,先将所述第一感光元件13和所述第二感光元件23贴装于所述第一线路板11和所述第二线路板21,并且通过所述电连接元件电连接所述感光元件和所述线路板,进而在所述第一线路板11和所述第一感光元件13至少部分所述非感光区132一体成型形成带有所述延伸部124的所述第一基座12,并使得所述第一基座12的所述第一基座主体123包覆所述第一线路板主体111上的所述第一电子元件112和所述第一电连接元件133;而后将所述第二线路板21安装于所述第一基座12的所述延伸部124;进一步,在所述第二线路板21和所述第二感光元件23的至少部分所述非感光区232一体成型形成所述第二基座22,并且使得所述第二基座22包覆所述第二线路板21的所述第二电子元件212和所述第二电连接元件233,并使的所述第一感光元件13的感光区131和所述第二感光元件23的感光区231对应所述第一基座12的第一光窗121和所述第二基座22的第二光窗221。当然,在本发明其他实施方式中,也可以有其他制造顺序,本领域的技术人员可以理解的是,所述阵列线路板组件的形成顺序并不是本发明的限制。
如图21所示,是根据本发明的第十五个优选实施例的阵列摄像模组100示意图。不同于上述实施例的是,在本发明的这个实施例中,所述第二线路板21 被埋设于所述第一基座12的所述延伸部124,从而降低所述第二线路板21和所述延伸部124的相对高度,减少所述第二线路板21的安装固定过程。所述第二基座22一体地连接于所述第一基座12。
进一步,所述第二线路板主体211具有至少一第二电连接区2111,以便于电连接所述第二感光元件23。比如通过打金线的方式将所述第二电连接元件233电连接于所述第二感光元件23和所述第二电连接区2111,从而使得所述第二感光元件23和所述第二线路板21电连接。举例地在制造过程中,可以将带有所述感光元件13,23的所述线路板11,21分别设置于预定位置,而后一体成型形成所述第一基座和所第二基座,并且使得第一基座的所述延伸部包覆所述第二线路板的底部。
所述第二电连接区2111举例地但不限于被实施为条形焊盘。在这个实施方式中,所述第二感光元件23通过四侧都设置所述第二电连接元件233的方式电连接于所述第二线路板。相应地,所述第二线路板21具有四所述第二电连接区2111,分别被设置于相对的两侧。四个所述第二电连接区2111显露于所述延伸部124的表面。所述第二感光元件23通过各所述第二电连接元件233分别电连接于各所述第二电连接区2111。
在本发明的一些实施方式中,第二基座22通过第二次一体成型设置于所述所述第一基座1。也就是说,在制造所述阵列线路板组件时,先在所述所述第一线路板11和所述第二线路板21上一体成像,形成所述一第一基座12,并且使得所述第二线路板21的所述第二电连接区2111显露于外部,而后在所述第二线路板21上设置所述第二感光元件23,并且通过所述电连接元件233电连接所述第二感光元件23和所述线路板21的所第二电连接区2111,而后在所述第二线路板21上一体成型形成所述第二基座22。
当然,在一些实施例中,也可以先将所述第二感光元件23设置于所述第二线路板21,而后一次成型形成所述第一基座11和所述第二基座,并使得所述第二线路板21被包覆于所述第一基座11的所述延伸部124。
如图22所示是根据本发明的第十五个优选实施例的阵列摄像模组100的一变形实施方式。不同于图21中实施方式的是,所述阵列线路板组件包括一连接板128,连接于所述第一线路板11和所述第二线路板21。更具体地,所述连接板128电连接所述第一线路板11和所述第二线路板21,从而使得所述第一线路 板11和所述第二线路板21信息相通。所述第一线路板11和所述第二线路板21电连接时,所述第一线路板和所述第二线路板21可以共用一个输出端。所述连接板128举例地但不限于软板。
如图23所示,是根据本发明的第十六个优选实施例的阵列摄像模组100。不同于上述实施例的是,所述第一基座12包括一第一延伸安装部125,自所述第一基座主体123至少部分地向上延伸,并且形成一第一限位槽126,用于限位安装所述第一镜头14或所述第一镜头支撑元件15。所述第二基座22包括一第二延伸安装部225,自所述第二基座主体223至少部分地向上延伸,并且形成一第二限位槽226,用于限位安装所述第二镜头24或所述第二镜头支撑元件25。
在本发明的这个实施例中,所述第一镜头14被安装于所述被安装于所述第一限位槽126。也就是说,所述第一延伸安装部125的形状与所述第一镜头14相适应,从而适于限位、安装所述第一镜头14,从而形成一定焦摄像模组。所述第二镜头24被安装于所述第二限位槽226。也就是说,所述第二延伸安装部225的形状与所述第二镜头24相适应,从而适于限位、安装所述第二镜头24,从而形成一定焦摄像模组。也就是说,所述阵列摄像模组100的两所述阵列摄像模组100单元都为定焦摄像模组。
在本发明的另一些实施例中,所述第一镜头支撑元件15被安装于所述第一限位槽126,所述第一镜头14被安装于所述第一镜头支撑元件15,所述第一镜头支撑元件15被实施为一驱动元件,从而使得所述第一摄像模组单元10形成一动焦摄像模组。所述第二镜头支撑元件25被安装于所述第二限位槽226,所述第二镜头24被安装于所述第二镜头支撑元件25,所述第二镜头支撑元件25被实施为一驱动元件,从而使得所述第二摄像模组单元20形成一动焦摄像模组。也就是说,所述阵列摄像模组100的两所所述摄像模组单元都为动焦摄像模组。
当然,在本发明的其他实施例中,还可以是动焦和定焦两种方式的组合,本发明在这方面并不限制。
如图24所示,是根据本发明的第十七个优选实施例的阵列摄像模组100。在本发明的这个实施中,所述第一摄像模组单元10包括一第一支座18,用于安装其他部件,如所述第一滤光元件16、所述第一镜头14或所述第一镜头支撑元件15。
在本发明的这个实施例附图中,所述第一支座18被安装于所述第一基座主 体123,所述第一滤光元件16被安装于所述第一支座18。特别地,所述第一支座18下沉于所述第一基座12的所述第一光窗121内,从而使得所述第一滤光元件16的位置下沉,靠近所述第一感光元件13,减小所述第一摄像模组单元10的后焦距,且减小所述第一滤光元件16的需求面积。
所述第二支座28被安装于所述第二基座主体223,所述第二滤光元件26被安装于所述第二支座28。特别地,所述第二支座28下沉于所述第二基座22的所述第二光窗221内,从而使得所述第二滤光元件26的位置下沉,靠近所述第二感光元件23,减小所述第二摄像模组单元20的后焦距,且减小所述第二滤光元件26的需求面积。当然,本发明的其他实施例中,所述阵列摄像模组100可以只包括一个所述支座,比如所述第一支座18或所述第二支座28,本领域的技术人员应当理解的是,所述支座的数量并不是本发明的限制。
在这个实施例中,所述第一支座18被安装于所述第一基座12的所述第一安装槽122,所述第二支座28被安装于所述第二基座22的所述第二安装槽222。而在本发明的其他实施例中,所述第一基座主体123和所述第二基座主体223可以为平台结构,所述第一支座18和所述第二支座28并不向下沉,且被直接安装于所述第一支座18和所述第二支座28的平台结构,本领域的技术的人员应当理解的是,所述支座的安装位置和具体结构并不是本发明的限制。
如图25所示,是根据本发明的第十八个优选实施例的阵列摄像模组100示意图。所述第一摄像模组单元10包括一第一补充基座19,所述第一补充基座19补充安装于所述第一基座主体123,与所述第一基座主体123配合形成所述第一光窗121。也就是说,在这种实施方式中,所述第一基座主体123并不是一闭合的环形结构,而通过所述第一补充基座19补充后形成一个闭合环形结构。换句话说,所述第一基座主体123具有至少一第一缺口1231,连通于外部,所述第一补充基座19至少部分地补充于所述第一缺口1231。所述第一缺口1231限位所述第一补充基座19的位置,从而使得所述补充可以准确、快速地被安装。所述第一缺口1231和所述第一补充基座19的形状可以根据需求设置,比如倒梯形结构,三角形结构、方向结构等,本发明在这方面并不限制。
所述第二摄像模组单元20包括一第二补充基座29,所述第二补充基座29补充安装于所述第二基座主体223,与所述第二基座主体223配合形成所述第二光窗221。也就是说,在这种实施方式中,所述第二基座主体223并不是一闭合 的环形结构,而通过所述第二补充基座29补充后形成一个闭合环形结构。换句话说,所述第二基座主体223具有至少一第二缺口2231,连通于外部,所述第二补充基座29至少部分地补充于所述第二缺口2231。所述第二缺口2231限位所述第二补充支座18的位置,从而使得所述补充可以准确、快速地被安装。所述第二缺口2231和所述第二补充基座29的形状可以根据需求设置,比如倒梯形结构,三角形结构、方向结构等,本发明在这方面并不限制。
当然,在本发明的其他实施方式中,所述阵列摄像模组100可以包括一所述补充基座,如所述第一补充基座19或所述第二补充基座29,本领域的技术人员应当理解的是,所述补充基座的形状和数量并不是本发明的限制。
如图26所示,是根据本发明的第十九个优选实施例的阵列摄像模组100示意图。在在这个实施例中,所述第二线路板主体211具有一第二下沉孔2112,所述第二感光元件23下沉设置于所述第二下沉孔2112内,从而降低所述第二感光元件23和所述第二线路板主体211的相对高度。
所述第二下沉孔2112连通于所述第二线路板21的两侧,当所述第二感光元件23下沉于所述第二下沉孔2112时,所述第二感光元件23的底部被所述第一基座12的所述延伸部124支撑。也就是说,所述延伸部124为所述第二感光元件23提供安装平面。所述第一基座12通过一体成型方式形成于所述第一线路板11,从而使得所述延伸部124和所述第一线路板11延伸具有较好的一致性,从而使得所述第二感光元件23和所述第一线路板11具有较好的一致性,从而使得所述第一摄像模组单元10和所述第二摄像模组单元20具有较好的光轴一致性。
如图27所示,是根据本发明的第二十个优选实施例的阵列摄像模组100示意图。在这种实施例中,所述第二基座主体223和所述第二基座主体223一体地连接,所述第一基座主体123固定连接于所述第一线路板11,所述第二基座主体223固定连接于所述第二线路板21,从而将所述第一摄像模组单元10和所述第二摄像模组单元20稳定地连接。
也就是说,在这种方式中,所述第一基座12不形成所述延伸部124,而通过所述第二基座主体223和所述第一基座主体123的一体连接方式将两所述第一摄像模组单元10和所述第二摄像模组单元20固定连接。所述第一基座12和所述第二基座22具有高度差。
举例地,在制造的过程中,将所述第一线路板11和所述第二线路板21设置 于预定的位置,具有预定高度差,进一步,分别在所述第一线路板11和所述第二线路板21的预定位置形成所述第一基座主体123和所述第二基座主体223,使得所述第一线路板11和所述第二线路板21的相对位置确定,且具有高度差。进而在所述第一线路板11和所述第二线路板21上安装所述第一感光元件13和所述第二感光元件23。当然,在本发明的其他实施方式中,还可以是其他顺序的制造方式,本发明在这方面并不限制。
如图28所示,是根据本发明的第二十一个优选实施例的阵列摄像模组100示意图。所述阵列摄像模组100包括一支撑板129,所述支撑板129固定连接于所述第一基座主体123,所述第二线路板21被安装于所述支撑板129。
进一步,支撑板129具有一通孔1290,所述通孔1290与所述第一光窗121相对应,以便于为所述第一感光元件13提供光线通路。
换句话说,在这种方式中,所述第一基座12不形成所述延伸部124,而通过所述支撑板129固定连接所述第一摄像模组单元10和所述第二摄像模组单元20,且使得所述第一摄像模组单元10的所述第二摄像模组单元20底部具有高度差,外端部一致。所述支撑板129举例地但不限于一钢板。
如图29所示,是根据本发明的第二十二个优选实施例的阵列摄像模组100示意图。在这种实施方式中,所述第一基座12的所述延伸部124向下扩展,从而使得所述延伸部124的底部和所述第一线路板11底部一致。也就是说,所述阵列摄像模组100整体上,外端部和底部都一致,从而形成一定相对规则、平整的结构,便于安装于电子设备。
如图30所述,是根据本发明的第二十三个优选实施例的阵列摄像模组100示意图。在这种实施方式中,所述第一基座12包括一第一支承元件127,用于在制造的过程中支撑模具,防止对所述第一线路板11或所述第一感光元件13的损伤。也就是说,在制造的过程中,可以将所述制造模具抵靠于所述第一支承元件127,从而使得模具不会直接接触所述第一线路板11或所述第一感光元件13,且防止成型材料向内侧溢流。
进一步,所述第一支承元件127可以为环形结构,与所述第一基座主体123的形状一致。所述第一支承元件127具有弹性,举例地但不限于,胶水涂层或橡胶垫。
进一步,所述第一基座主体123侧壁具有倾斜角,从而方便模具制造,比如 方便拔模过程,且减少所述第一基座主体123底部出现毛刺现象。
所述第二基座22包括一第二支承元件227,用于在制造的过程中支撑模具,防止对所述第二线路板21或所述第二感光元件23的损伤。也就是说,在制造的过程中,可以将所述制造模具抵靠于所述第二支承元件227,从而使得模具不会直接接触所述第一线路板11或所述第二感光元件23,且防止成型材料向内侧溢流。
进一步,所述第二支承元件227可以为环形结构,与所述第二基座主体223的形状一致。所述第二支承元件227具有弹性,举例地但不限于,胶水涂层或橡胶垫。
进一步,所述第二基座主体223侧壁具有倾斜角,从而方便模具制造,比如方便拔模过程,且减少所述第二基座主体223底部出现毛刺现象。
图31是根据本发明的第二十四个优选实施例的阵列摄像模组100示意图。在本发明的这种实施方式中,所述第一滤光元件16固定连接于所述第一基座主体123。具体地,所述第一滤光元件16通过一体成型的方式固定连接于所述第一基座主体123。
进一步,所述第一滤光元件16被支撑于所述第一支承元件127,从而方便将所述第一滤光元件16一体成型地固定连接。
所述第二滤光元件26固定连接于所述第二基座主体223。具体地,所述第二滤光元件26通过一体成型的方式固定连接于所述第二基座主体223。
进一步,所述第二滤光元件26被支撑于所述第二支承元件227,从而方便将所述第二滤光元件26一体成型地固定连接。
举例地,所述滤光元件16、26可以通过模塑成型的方式一体成型地连接于各所述基座主体123、223。
举例地但不限于,所述阵列摄像模组100的所述阵列线路板组件的形成过程可以是:先在所述第一线路板11和所述第二线路板21上分别设置所述第一支承元件127和所述第二支承元件227,而后将所述第一滤光元件16设置于所述第一支承元件127,而后在所述第一滤光元件16上方一体成型,形成所述第一基座12,从而将所述第一滤光元件16一体成型地固定;进而将所述第二线路板21设置于所述第一基座12的所述延伸部124,进一步,在所述第二支承元件227上设置所述第二滤光元件26,在所述第二滤光元件26上方一体成型形成所述第 二基座主体223,从而将所述第二滤光元件26一体成型地固定。
如图32所示,是根据本发明的第二十五个优选实施例的阵列摄像模组100示意图。在本发明的这个实施例中,所述第一摄像模组单元10和所述第二摄像模组单元20各自包括至少一支承元件127,227和至少一镜片17,27,各所述镜片17,27分别被设置于所述第一基座主体123和所述第二基座主体223。具体地,所述镜片17,27一体成型地固定于所述第一基座主体123和所述第二基座主体223,分别位于所述第一感光元件13和所述第二感光元件23的感光路径。
被物体反射的光线自所述镜头14,24以及所述镜片17,27进入所述摄像模组单元的内部,以在后续被所述第一感光元件13和所述第二感光元件23接收和进行光电转化,从而得到与物体相关联的影像。所述镜片17,27的设置能够降低光学的TTL(镜头通光孔上面的镜头平面到芯片的感光平面的距离),从而在不影响光学性能的前提下使所述摄像模组单元的尺寸进一步减小,满足电子设备对搭载小尺寸的阵列摄像模组100的需求。同时,所述镜片17,27的设置也能够降低污点敏感度。例如在一实施例中,可以降低50%的污点敏感度。
在本发明的这个优选实施例中,优选地,所述镜片17,27被实施为一热硬化性质的镜片,即所述镜片17,27被实施为一热硬化镜片,从而所述镜片17,27在进行模塑工艺能够承受住模塑工艺中的环境温度。例如,在一实施例的模塑工艺中能够承受175℃的模塑环境温度。也就是说,在模塑工艺之前,耐高温的且经过了热硬化处理的所述镜片17被连接于所述支承元件127,且和所述第一线路板11一起被放置于模具中,流体的固化模塑材料围绕所述支承元件127以及所述镜片17的外表面模塑一体成型所述第一基座12,从而所述第一基座12能够一体地成型于所述第一线路板11,也就是说,所述第一基座12、所述第一线路板11以及所述镜片17形成一体式结构。本领域的技术人员可以理解的是,本发明的所述镜片17,27不仅仅可以是热硬化镜片17,27,还可以是其他性质的镜片17,27,本发明并不受此限制。类似地,可以将另一所述镜片27、所述第二基座22和所述第二线路板21一体成型形成一体式结构。
进一步地,所述镜片17,27包括一镜片主体171,271和设置在所述镜片主体171,271周围的一镜片周缘172,272。由于所述镜片17,27为精密的光学元件,所述镜片主体171,271的边缘较薄。而设置于所述镜片主体171,271边缘的且为一体连接的所述镜片周缘172,272为增厚式支架设计,能够承载所述镜片主体 171,271,从而不影响所述镜片主体171,271的光学性能的同时能够使所述镜片主体171,271在模具中被一体模塑连接于所述基座。也就是说,在所述基座被成型之前,所述镜片17,27的所述镜片周缘172,272被设置于所述感光元件的所述非感光区域,所述镜片17,27的所述镜片主体171,271被设置于所述感光元件的感光路径;在所述基座成型之后,所述模塑基座包覆所述线路板、所述感光元件所述支承元件的一部分以及所述镜片17,27的所述镜片周缘172,272。
值得一提的是,所述支承元件和所述镜片17,27能够有效地提高所述阵列摄像模组100的产品良率,并改善所述阵列摄像模组100的成像品质。进一步地,所述支承元件127,227包括一框形的支承主体和具有一通孔,其中所述支承主体被设置于所述线路板,以使所述感光元件的一感光区域对应于所述支承元件的所述通孔以及所述镜片17,27的所述镜片主体171,271,从而在进行模塑工艺时,所述支承主体以及所述镜片17,27能够保护所述感光元件。
在这种实施例中,所述第一感光元件13和所述第一第二感光元件23没有被一体成型地封装,需要在一体成型所述第一基座12和所述第二基座22之前,分别将所述第一感光元件13和所述第二感光元件23设置于所述第一线路板11和所述第二线路板21。
如图33所示,是根据本发明的第二十六个优选实施例的阵列摄像模组100示意图。所述阵列摄像模组100包括三摄像模组单元,分别为一第一摄像模组单元10、一第二摄像模组单元20和一第三摄像模组单元30。其中所述第一摄像模组单元10与所述第二摄像模组单元20以及所述第三摄像模组单元30具有高度差H,且所述第一摄像模组单元10、所述第二摄像模组单元20以及所述第三摄像模组单元30的外端部一致。所述第一摄像模组单元10和所述摄像模组单元的高度一致。
具体地,所述第一基座12包括一延伸部124,所述第一摄像模组单元10和所述第二摄像模组单元20分别被设置于所述延伸部124,从而将所述第一摄像模组单元10、所述第二摄像模组单元20和所述第三摄像模组单元结构紧凑地稳定连接。
也就是说,所述延伸部124同时为所述第一线路板11和所述第二线路板21提供安装平面。特别地,在本发明的这个实施例中,所述第二摄像模组单元20的所述第二基座22和所述第三摄像模组单元30的所述第三基座32一体地连接, 从而保证所述第二摄像模组单元20和所述第三摄像模组单元30的光轴一致性。
本领域的技术人员应当的是,上述实施例中的具体特征仅作为举例,并不是限制,上述各实施例中的各个特征可以根据需求进行相互组合,从而形成新的实施方式,本发明的特征并不是限于一个实施例。
参照图34A、34B是根据本发明的上述实施例的阵列摄像模组的两立体示意图,分别用于说明不同的外连接方式。参照图34A,所述阵列摄像模组包括一外连接端30,用于电连接于一电子设备,以便于将所述阵列摄像模组采集的信息传递至所述电子设备。所述外连接端30可以是一软连接器。也就是说,在本发明的这个实施例中,所述第一摄像模组单元10和所述第二摄像模组单元20具有相同所述外连接端30,所述第一线路板11和所述第二线路板21电连接于所述外连接端30。
参照图34B,所述阵列摄像模组包括两外连接端30,分别用于电连接于一电子设备,以便于将所述阵列摄像模组采集的信息传递至所述电子设备。所述外连接端30可以是一软连接器。也就是说,在本发明的这个实施例中,所述第一摄像模组单元10和所述第二摄像模组单元20各自具有所述外连接端30,所述第一线路板11和所述第二线路板21分别电连接于对应的所述外连接端30。
参照图35,根据本发明的上述优选实施例,本发明提供一具有高度差的阵列线路板组件的制造方法1000,所述方法包括如下步骤:
1001:在一第一线路板11上形成一带有一延伸部124的第一基座12;
1002:将一第二线路板21设置于所述延伸部124;
1003:在所述第二线路板21上形成一第二基座22;和
1004:在所述第一线路板11和所述第二线路板上分别设置一第一感光元件13和一第二感光元件23。
在所述步骤1001和所述步骤1003中的形成方式可以为一体成型的方式,比如模塑成型的方式。所述延伸部124与所述第一线路板11具有高度差。
所述步骤1001中,所述延伸部的延伸方向和所述第一线路板一致,以便于为所述第二线路板21提供与所述第一线路板11一致的安装条件。
在一些实施方式中,所述步骤1001和所述步骤1002可以同时进行,从而使得所述第二线路板21埋设于所述延伸部124。
在一些实施方式中,所述步骤1004可以在所述步骤1001之前,比如先设置 所述第一感光元件13,以便于所述第一基座一体封装所述第一线路板11以及至少部分所述感光元件13的所述非感光区132。
进一步,在所述阵列线路板组件上分别安装所述第一镜头、所述第二镜头以及所述第一滤光元件、所述第二滤光元件等部件,组装得到所述阵列摄像模组。
如图36所示,是根据发明的上述优选实施例的阵列摄像模组的应用示意图。本发明进一步提供一电子设备300,其中所述电子设备包括一电子设备本体200和至少一阵列摄像模组100,其中每个所述阵列摄像模组分别被设置于所述电子设备本体200,以用于获取图像。值得一提的是,所述电子设备本体200的类型不受限制,例如所述电子设备本体200可以是智能手机、可穿戴设备、平板电脑、笔记本电脑、电子书、个人数字助理、相机、监控装置等任何能够被配置所述摄像模组的电子设备。本领域的技术人员可以理解的是,尽管附图36中以所述电子设备本体200被实施为智能手机为例,但其并不构成对本发明的内容和范围的限制。所述阵列摄像模组端部一致,从而使得所述电子设备的外表面平整。
本领域的技术人员应理解,上述描述及附图中所示的本发明的实施例只作为举例而并不限制本发明。本发明的目的已经完整并有效地实现。本发明的功能及结构原理已在实施例中展示和说明,在没有背离所述原理下,本发明的实施方式可以有任何变形或修改。

Claims (130)

  1. 一阵列摄像模组,其特征在于,包括:
    至少两摄像模组单元,所述两摄像模组单元分别为一第一摄像模组单元和一第二摄像模组单元,其中所述第一摄像模组单元包括至少一第一感光组件和至少一第一镜头,所述第一镜头位于所述第一感光组件的感光路径,所述第一感光组件包括至少一连接部,所述连接部至少部分地向远离所述第一感光组件的方向延伸形成一高度差,所述第二摄像模组单元固定支撑于所述连接部,以使得所述第一摄像模组单元和所述第二摄像模组单元被稳定地固定。
  2. 根据权利要求1所述的阵列摄像模组,其中所述第一感光组件包括一第一线路板、一第一感光元件和一第一基座,其中所述第一基座包括一第一基座主体和一延伸部,所述第一基座主体一体成型于所述第一线路板形成一第一光窗,为所述第一感光元件提供光线通路,所述延伸部自所述第一基座主体至少部分地一体向外延伸形成所述连接部,所述延伸部的顶面与所述第一线路板的底面形成所述高度差,所述第一感光元件电连接于所述第一线路板。
  3. 根据权利要求2所述的阵列摄像模组,其中所述延伸部具有一支撑面,所述支撑面向远离所述第一摄像模组单元的方向平整延伸,所述第二摄像模组包括一第二感光组件和一第二镜头,所述第二镜头位于所述第二感光组件的感光路径,所述第二感光组件被支撑固定于所述第二支撑面。
  4. 根据权利要求3所述的阵列摄像模组,其中所述第二感光组件被贴装固定于所述支撑面。
  5. 根据权利要求3所述的阵列摄像模组,其中所述第二感光组件包括一第二线路板、一第二感光元件和一第二基座,所述第二感光元件电连接于所述第二线路板,所述第二基座一体成型于所述第二线路板形成一第二光窗,为所述第二感光元件提供光线通路,所述第二线路板被支撑固定于所述延伸部的所述第二支撑面,所述第二线路板的底面与所述第一线路板的底面形成所述高度差。
  6. 根据权利要求1所述的阵列摄像模组,其中所述第一感光组件包括一第一线路板、一第一感光元件、一第一基座和一支撑板,所述第一基座一体成型于所述第一线路板形成一第一光窗,为所述第一感光元件提供光线通路,所述支撑板被设置于所述第一基座自所述第一基座至少部分地向外延伸形成所述连接部, 所述支撑板的顶面与所述第一线路板的底面形成所述高度差,所述第一感光元件电连接于所述第一线路板。
  7. 根据权利要求6所述的阵列摄像模组,其中所述第一感光组件包括一第一线路板、一第一感光元件和一第一基座,所述第一感光元件电连接于所述一线路板,所述第一基座一体成型于所述第一线路板形成一光窗,为所述第一感光元件提供光线通路,所述支撑板被固定于所述第一基座。
  8. 根据权利要求6所述的阵列摄像模组,其中所述支撑板具有一通孔,所述通孔连通于所述第一光窗,为所述感光元件提供光线通路。
  9. 根据权利要求6所述的阵列摄像模组,其中所述第二感光组件包括一第二线路板、一第二感光元件和一第二基座,所述第二感光元件电连接于所述第二线路板,所述第二基座一体成型于所述第二线路板形成一第二光窗,所述第二线路板被支撑固定于所述支撑板的顶面,所述第二线路板的底面与所述第一线路板的底面形成所述高度差。
  10. 根据权利要求6至9任一所述阵列摄像模组,其中所述支撑板是一金属板,被粘接固定于所述第一基座。
  11. 根据权利要求2至9任一所述的阵列摄像模组,其中所述第一基座具有一第一安装槽,所述安装槽连通于所述第一光窗,以提供安装位置。
  12. 根据权利要求11所述的阵列摄像模组,其中所述第一摄像模组单元包括一第一支座,所述第一支座被安装于所述第一安装槽,以便于提供安装位置。
  13. 根据权利要求6或9所述的阵列摄像模组,其中所述第二基座具有一第二安装槽,所述第二安装槽连通于所述第二光窗,以提供安装位置。
  14. 根据权利要求13所述的阵列摄像模组,其中所述第二摄像模组单元包括一第二支座,所述第二支座被安装于所述第二安装槽,以便于提供安装位置。
  15. 根据权利要求2至9任一所述的阵列摄像模组,其中所述第一感光元件被贴装于所述第一线路板,所述第一基座位于所述第一感光元件的外围。
  16. 根据权利要求2至9任一所述的阵列摄像模组,其中所述第一感光元件被贴装于所述第一线路板,所述第一基座一体成型于至少部分所述第一感光元件。
  17. 根据权利要求16所述的阵列摄像模组,其中所述第一感光元件通过至少一第一电连接元件电连接于所述第一线路板,所述第一基座包覆所述第一电连 接元件。
  18. 根据权利要求2至9任一所述的阵列摄像模组,其中所述第二感光元件被贴装于所述第二线路板,所述第二基座位于所述第二感光元件的外围。
  19. 根据权利要求2至9任一所述的阵列摄像模组,其中所述第二感光元件被贴装于所述第二线路板,所述第二基座一体成型于至少部分所述第二感光元件。
  20. 根据权利要求19所述的阵列摄像模组,其中所述第二感光元件通过至少一第二电连接元件电连接于所述第二线路板,所述第二基座包覆所述第二电连接元件。
  21. 根据权利要求2至9任一所述的阵列摄像模组,其中所述第一线路板包括一第一线路板主体和至少一第一电子元件,所述第一电子元件电连接于所述第一线路板主体,所述第一基座一体成型于所述第一线路板主体,包覆所述第一电子元件。
  22. 根据权利要求2至9任一所述的阵列摄像模组,其中所述第二线路板包括一第二线路板主体和至少一第二电子元件,所述第二电子元件电连接于所述第二线路板主体,所述第二基座一体成型于所述第二线路板主体,包覆所述第二电子元件。
  23. 根据权利要求2至7任一所述的阵列摄像模组,其中所述第二线路板具有一下沉孔,所述第二感光元件被设置于所述下沉孔。
  24. 根据权利要求23所述的阵列摄像模组,其中所述下沉孔连通于所述第二线路板的两侧,从而使得所述感光元件被直接地设置于所述第二延伸部。
  25. 根据权利要求7至9任一所述的阵列摄像模组,其中所述第二线路板具有一下沉孔,所述第二感光元件被设置于所述下沉孔。
  26. 根据权利要求25所述的阵列摄像模组,其中所述下沉孔连通于所述第二线路板的两侧,从而使得所述感光元件被直接地设置于所述支撑板。
  27. 根据权利要求2至5任一所述的阵列摄像模组,其中所述第二感光组件包括一第二线路板、一第二感光元件和一第二支座,所述第二感光元件电连接于所述第二线路板,所述第二支座被安装于所述第二线路板,所述第二线路板被支撑固定于所述延伸部的所述第二支撑面。
  28. 根据权利要求27所述的阵列摄像模组,其中所述第二支座具有一通光 孔和一避让空间,所述通光孔为所述第二感光元件提供光线通路,所述避让空间连通于所述通光孔,以避让所述第二感光元件。
  29. 根据权利要求2至5任一所述的阵列摄像模组,其中所述第一摄像模组单元包括一第一补充基座,所述第一基座具有一第一缺口,所述补充基座补充于所述第一基座的所述第一缺口,形成闭合的所述第一光窗。
  30. 根据权利要求5或9所述的阵列摄像模组,其中所述第二摄像模组单元包括一第二补充基座,所述第二基座具有一第二缺口,所述补充基座补充于所述第二基座的所述第二缺口,形成闭合的所述第二光窗。
  31. 根据权利要求2至5任一所述的阵列摄像模组,其中所述第一基座包括一第一支承元件,用于在通过一模具形成所述第一基座时,支撑所述模具。
  32. 根据权利要求31所述的阵列摄像模组,其中所述第一支承元件是胶水涂层或胶垫。
  33. 根据权利要求5或9所述的阵列摄像模组,其中所述第二基座包括一第二支承元件,用于在通过一模具形成所述第二基座时,支撑所述模具。
  34. 根据权利要求33所述的阵列摄像模组,其中所述第二支承元件是胶水涂层或胶垫。
  35. 根据权利要求2至5任一所述的阵列摄像模组,其中所述第一基座主体侧壁具有倾斜角。
  36. 根据权利要求5或9所述的阵列摄像模组,其中所述第二基座侧壁具有倾斜角。
  37. 根据权利要求2至5任一所述的阵列摄像模组,其中所述第一摄像模组单元包括一第一滤光元件,所述第一滤光元件一体成型固定于所述第一基座。
  38. 根据权利要求5或9所述的阵列摄像模组,其中所述第二摄像模组单元包括一第二滤光元件,所述第二滤光元件一体成型固定于所述第二基座。
  39. 根据权利要求2至5任一所述的阵列摄像模组,其中所述第一摄像模组单元包括一支承元件和至少一镜片,所述镜片被支承于所述支承元件,所述镜片被一体成型地固定于所述第一基座。
  40. 根据权利要求5或9所述的阵列摄像模组,其中所述第二摄像模组单元包括一支承元件和至少一镜片,所述镜片被支承于所述支承元件,所述镜片被一体成型地固定于所述第二基座。
  41. 根据权利要求2至10任一所述的阵列摄像模组,其中一体成型的方式选自:模塑、模压中的一种。
  42. 根据权利要求10所述的阵列摄像模组,其中所述第一摄像模组单元包括一第一滤光元件,所述第一滤光元件被安装于所述第一安装槽。
  43. 根据权利要求12所述的阵列摄像模组,其中所述第二摄像模组单元包括一第二滤光元件,所述第二滤光元件被安装于所述第二安装槽。
  44. 根据权利要求2-5、7-9任一所述的阵列摄像模组,其中所述第一摄像模组单元包括一第一镜头支撑元件,所述第一镜头被安装于所述第一镜头支撑元件,所述第一镜头支撑元件至少部分地被安装于所述第一基座。
  45. 根据权利要求44所述的阵列摄像模组,其中所述第一镜头支撑元件是一镜座元件,以使得所述第一摄像模组单元构成一定焦摄像模组。
  46. 根据权利要求44所述的阵列摄像模组,其中所述第一镜头支撑元件是一驱动元件,以使得所述第一摄像模组单元构成一动焦摄像模组。
  47. 根据权利要求5或9所述的阵列摄像模组,其中所述第二摄像模组单元包括一第二镜头支撑元件,所述第二镜头被安装于所述第二镜头支撑元件,所述第二镜头支撑元件至少部分地被安装于所述第二基座。
  48. 根据权利要求47所述的阵列摄像模组,其中所述第二镜头支撑元件是一镜座元件,以使得所述第二摄像模组单元构成一定焦摄像模组。
  49. 根据权利要求47所述的阵列摄像模组,其中所述第二镜头支撑元件是一驱动元件,以使得所述第二摄像模组单元构成一动焦摄像模组。
  50. 一阵列摄像模组线路板组件,其特征在于,包括:
    一第一线路板;
    一第二线路板;和
    一第一基座,所述第一基座包括一基座主体和一延伸部,所述基座主体一体成型于所述第一线路板形成一第一光窗,为一第一感光元件提供光线通路,所述延伸部自所述基座主体至少部分地一体向外延伸与所述第一线路板形成一高度差,所述第二线路板被设置于所述延伸部。
  51. 根据权利要求50所述的阵列摄像模组线路板组件,其中所述线路板组件包括一第二基座,所述第二基座一体成型于所述第二线路板。
  52. 根据权利要求50所述的阵列摄像模组线路板组件,其中所述线路板组 件包括一第一感光元件,所述第一感光元件被贴装于所述第一线路板,所述第一基座位于所述第一感光元件的外围。
  53. 根据权利要求50所述的阵列摄像模组线路板组件,其中所述线路板组件包括一第一感光元件,所述第一感光元件被贴装于所述第一线路板,所述第一基座一体成型于至少部分一体成型于所述第一感光元件。
  54. 根据权利要求53所述的阵列摄像模组线路板组件,其中所述第一感光元件通过至少一第一电连接元件电连接于所述第一线路板,所述第一基座包覆所述第一电连接元件。
  55. 根据权利要求51所述的阵列摄像模组线路板组件,其中所述第二感光元件被贴装于所述第二线路板,所述第二基座位于所述第二感光元件的外围。
  56. 根据权利要求51所述的阵列摄像模组线路板组件,其中所述第二感光元件被贴装于所述第二线路板,所述第二基座一体成型于至少部分所述第二感光元件。
  57. 根据权利要求56所述的阵列摄像模组线路板组件,其中所述第二感光元件通过至少一第二电连接元件电连接于所述第二线路板,所述第二基座包覆所述第二电连接元件。
  58. 根据权利要求50所述的阵列摄像模组线路板组件,其中所述线路板组件包括一第二支座和一感光元件,所述第二支座和所述第二感光元件被安装于所述第二线路板,所述第二支座具有一通光孔和一避让空间,所述通光孔为所述第二感光元件提供光线通路,所述避让空间连通于所述通光孔,以避让所述第二感光元件。
  59. 根据权利要求50至58任一所述的阵列摄像模组线路板组件,其中一体成型的方式选自:模塑、模压中的一种。
  60. 一阵列摄像模组线路板组件,其特征在于,包括:
    一第一线路板;
    一第二线路板;和
    一第一基座,所述第一基座一体成型于所述第一线路板形成一第一光窗,为一第一感光元件提供光线通路;和
    一支撑板,所述支撑板被固定于所述第一基座,所述支撑板向远离所述第一基座的方向延伸与所述第一线路板形成一高度差,所述第二线路板被设置于所述 支撑板。
  61. 根据权利要求59所述的阵列摄像模组线路板组件,其中所述线路板组件包括一第二基座,所述第二基座一体成型于所述第二线路板。
  62. 根据权利要求59所述的阵列摄像模组线路板组件,其中所述线路板组件包括一第一感光元件,所述第一感光元件被贴装于所述第一线路板,所述第一基座位于所述第一感光元件的外围。
  63. 根据权利要求59所述的阵列摄像模组线路板组件,其中所述线路板组件包括一第一感光元件,所述第一感光元件被贴装于所述第一线路板,所述第一基座一体成型于至少部分一体成型于所述第一感光元件。
  64. 根据权利要求62所述的阵列摄像模组线路板组件,其中所述第一感光元件通过至少一第一电连接元件电连接于所述第一线路板,所述第一基座包覆所述第一电连接元件。
  65. 根据权利要求60所述的阵列摄像模组线路板组件,其中所述第二感光元件被贴装于所述第二线路板,所述第二基座位于所述第二感光元件的外围。
  66. 根据权利要求60所述的阵列摄像模组线路板组件,其中所述第二感光元件被贴装于所述第二线路板,所述第二基座一体成型于至少部分所述第二感光元件。
  67. 根据权利要求65所述的阵列摄像模组线路板组件,其中所述第二感光元件通过至少一第二电连接元件电连接于所述第二线路板,所述第二基座包覆所述第二电连接元件。
  68. 根据权利要求59所述的阵列摄像模组线路板组件,其中所述线路板组件包括一第二支座和一感光元件,所述第二支座和所述第二感光元件被安装于所述第二线路板,所述第二支座具有一通光孔和一避让空间,所述通光孔为所述第二感光元件提供光线通路,所述避让空间连通于所述通光孔,以避让所述第二感光元件。
  69. 根据权利要求60至68任一所述的阵列摄像模组线路板组件,其中一体成型的方式选自:模塑、模压中的一种。
  70. 一阵列摄像模组线路板组件,其特征在于,包括:
    一第一线路板;
    一第二线路板;和
    一第一基座,所述第一基座包括一基座主体和一延伸部,所述基座主体一体成型于所述第一线路板形成一第一光窗,为一第一感光元件提供光线通路,所述延伸部自所述基座主体至少部分地一体向外延伸使得底面与所述第一线路板底面一致,所述第二线路板被设置于所述延伸部的顶面。
  71. 一电子设备,其特征在于,包括:
    一根据权利要求1-49任一所述的阵列摄像模组;和
    电子设备本体;所述阵列摄像模组被设置于所述电子设备本体,以获取所述阵列摄像模组的图像信息。
  72. 根据权利要求71所述的电子设备,其中所述电子设备本体选自:智能手机、可穿戴设备、平板电脑、笔记本电脑、电子书、个人数字助理、相机、监控装置中的一种。
  73. 一线路板组件,用于一阵列摄像模组,其特征在于,包括:
    一第一线路板;
    一第二线路板;和
    一第一基座,所述第一基座包括一第一基座主体和一延伸部,所述第一基座主体一体成型于所述第一线路板形成一第一光窗,所述延伸部自所述第一基座主体至少部分地向远离所述第一基座主体的方向延伸与所述第一线路板底面形成一高度差,所述延伸部一体成型于所述第二线路板。
  74. 根据权利要求73所述的线路板组件,其中所述第二线路板具有至少一第二电连接区,所述第二电连接区显露于所述延伸部表面。
  75. 根据权利要求74所述的线路板组件,其中所述线路板组件包括一第二感光元件,所述第二感光元件被支撑于所述延伸部,且电连接所述第二线路板的所述第二电连接区。
  76. 根据权利要求74所述的线路板组件,其中所述线路板组件包括一第二感光元件,所述第二感光元件被贴装于所述第二线路板,且电连接所述第二线路板的所述第二电连接区。
  77. 根据权利要求74所述的线路板组件,其中所述第二线路板具有四侧所述第二电连接区,分别设置于相对的两侧,以便于四个所述第二电连接区分别电连接一第二感光元件。
  78. 根据权利要求73所述的线路板组件,其中所述线路板组件包括一连接 板,所述连接板电连接所述第一线路板和所述第二线路板。
  79. 根据权利要求78所述的线路板组件,其中所述第一基座包括一延伸安装部,自所述基座主体至少部分地向上延伸,形成一第一限位槽,以便于安装一第一镜头或一第一镜头支撑元件。
  80. 根据权利要求73所述的线路板组件,其中所述线路板组件包括一第二基座,所述第二基座包括一第二基座主体以及具有一第二光窗,所述第二基座主体一体成型地连接于所述第一基座,并且形成所述第二光窗,用于为一第二感光元件提供光线通路。
  81. 根据权利要求80所述的线路板组件,其中所述第二基座包括一第二延伸安装部,所述延伸安装部自所述第二基座主体至少部分地向上延伸,形成一第二限位槽,以便于安装一第二镜头或一第二镜头支撑元件。
  82. 根据权利要求73所述的线路板组件,其中所述线路板组件包括一第一补充基座,所述第一基座的所述第一基座主体具有一第一缺口,所述第一补充基座限位补充于所述第一缺口,使得所述第一光窗闭合。
  83. 根据权利要求80所述的线路板组件,其中所述线路板组件包括一第二补充基座,所述第二基座的所述第二基座主体具有一第二缺口,所述第二补充基座限位补充于所述第二缺口,使得所述第二光窗闭合。
  84. 根据权利要求73所述的线路板组件,其中所述线路板组件包括一第二基座,所述第二基座一体成型于所述第二线路板,所述第二基座一体连接于所述第一基座。
  85. 根据权利要求73-84任一所述的线路板组件,其中所述第一基座具有一第一安装槽,所述安装槽连通于所述第一光窗,以提供安装位置
  86. 根据权利要求85所述的线路板组件,其中所述线路板组件包括一第一支座,所述第一支座被安装于所述第一安装槽,以便于提供安装位置。
  87. 根据权利要求80所述的线路板组件,其中所述第二基座具有一第二安装槽,所述第二安装槽连通于所述第二光窗,以提供安装位置。
  88. 根据权利要求80所述的线路板组件,其中所述线路板组件包括一第二支座,所述第二支座被安装于所述第二安装槽,以便于提供安装位置。
  89. 根据权利要求73-84任一所述的线路板组件,其中所述线路板组件包括一第一感光元件,所述第一感光元件被贴装于所述第一线路板,所述第一基座位 于所述第一感光元件的外围。
  90. 根据权利要求73-84任一所述的线路板组件,其中所述线路板组件包括一第一感光元件,所述第一感光元件被贴装于所述第一线路板,所述第一基座一体成型于至少部分所述第一感光元件。
  91. 根据权利要求90所述的线路板组件,其中所述第一感光元件通过至少一第一电连接元件电连接于所述第一线路板,所述第一基座包覆所述第一电连接元件。
  92. 根据权利要求75或76所述的线路板组件,其中所述第二基座位于所述第二感光元件的外围。
  93. 根据权利要求76所述的线路板组件,其中所述第二基座一体成型于至少部分所述第二感光元件。
  94. 根据权利要求93所述的线路板组件,其中所述第二感光元件通过至少一第二电连接元件电连接于所述第二线路板,所述第二基座包覆所述第二电连接元件。
  95. 根据权利要求73-84任一所述的线路板组件,其中所述第一线路板包括一第一线路板主体和至少一第一电子元件,所述第一电子元件电连接于所述第一线路板主体,所述第一基座一体成型于所述第一线路板主体,包覆所述第一电子元件。
  96. 根据权利要求76或93所述的线路板组件,其中所述第二线路板包括一第二线路板主体和至少一第二电子元件,所述第二电子元件电连接于所述第二线路板主体,所述第二基座一体成型于所述第二线路板主体,包覆所述第二电子元件。
  97. 根据权利要求至75或76所述的线路板组件,其中所述第二线路板具有一下沉孔,所述第二感光元件被设置于所述下沉孔。
  98. 根据权利要求73-84任一所述的线路板组件,其中所述第一基座包括一第一支承元件,用于在通过一模具形成所述第一基座时,支撑所述模具。
  99. 根据权利要求98所述的线路板组件,其中所述第一支承元件是胶水涂层或胶垫,被设置于部分所述第一基座和所述第一线路板之间。
  100. 根据权利要求80、81、84任一所述的线路板组件,其中所述第二基座包括一第二支承元件,用于在通过一模具形成所述第二基座时,支撑所述模具。
  101. 根据权利要求100所述的线路板组件,其中所述第二支承元件是胶水涂层或胶垫,被设置于部分所述第二基座和所述第二线路板之间。
  102. 根据权利要求73-84任一所述的线路板组件,其中所述第一基座主体侧壁具有倾斜角。
  103. 根据权利要求至75或76所述的线路板组件,其中所述第二基座侧壁具有倾斜角。
  104. 根据权利要求73-84任一所述的线路板组件,其中所述线路板组件包括一第一滤光元件,所述第一滤光元件一体成型固定于所述第一基座。
  105. 根据权利要求75或76所述的线路板组件,其中所述线路板组件包括一第二滤光元件,所述第二滤光元件一体成型固定于所述第二基座。
  106. 根据权利要求73-84任一所述的线路板组件,其中所述线路板组件包括一支承元件和至少一镜片,所述镜片被支承于所述支承元件,所述镜片被一体成型地固定于所述第一基座。
  107. 根据权利要求75或76所述的线路板组件,其中所述线路板组件包括一支承元件和至少一镜片,所述镜片被支承于所述支承元件,所述镜片被一体成型地固定于所述第二基座。
  108. 根据权利要求73至84任一所述的线路板组件,其中所述一体成型的方式选自:模塑、模压中的一种。
  109. 一阵列摄像模组线路板组件,其特征在于,包括:
    一第一线路板;
    一第二线路板;和
    一第一基座,所述第一基座包括一基座主体和一延伸部,所述基座主体一体成型于所述第一线路板形成一第一光窗,为一第一感光元件提供光线通路,所述延伸部自所述基座主体至少部分地一体向外延伸使得底面与所述第一线路板底面一致,所述第二线路板被一体成型地设置于所述延伸部。
  110. 一阵列线路板组件,其特征在于,包括:
    一第一的线路板;
    一第二线路板;
    一第一基座,所述第一基座一体成型于所述第一线路板形成一第一光窗;和
    一第二基座;所述第二基座一体成型于所述第二线路板形成一第二光窗,所 述第一基座一体地连接第二基座,使得所述第一线路板和所述第二线路板底部具有一高度差。
  111. 根据权利要求110所述的阵列线路板组件,其中所述线路板组件包括一第一感光元件,所述第一感光元件被贴装于所述第一线路板,所述第一基座位于所述第一感光元件的外围。
  112. 根据权利要求110所述的阵列线路板组件,其中所述线路板组件包括一第一感光元件,所述第一感光元件被贴装于所述第一线路板,所述第一基座一体成型于至少部分一体成型于所述第一感光元件。
  113. 根据权利要求112所述的阵列摄像模组线路板组件,其中所述第一感光元件通过至少一第一电连接元件电连接于所述第一线路板,所述第一基座包覆所述第一电连接元件。
  114. 根据权利要求110所述的阵列摄像模组线路板组件,其中所述第二感光元件被贴装于所述第二线路板,所述第二基座位于所述第二感光元件的外围。
  115. 根据权利要求110所述的阵列摄像模组线路板组件,其中所述第二感光元件被贴装于所述第二线路板,所述第二基座一体成型于至少部分所述第二感光元件。
  116. 根据权利要求115所述的阵列摄像模组线路板组件,其中所述第二感光元件通过至少一第二电连接元件电连接于所述第二线路板,所述第二基座包覆所述第二电连接元件。
  117. 根据权利要求110-116任一所述的阵列摄像模组,其中所述线路板组件包括一连接板,所述连接板电连接所述第一线路板和所述第二线路板。
  118. 根据权利要求110-116任一所述的阵列摄像模组,其中所述第一基座具有一第一安装槽,适于安装第一滤光元件。
  119. 根据权利要求110-116任一所述的阵列摄像模组,其中所述第二基座具有一第二安装槽,适于安装第二滤光元件。
  120. 根据权利要求110-116任一所述的阵列摄像模组,其中所述线路板组件包括一第一支座和第一第二支座,所述第一支座一体连接所述第二支座,所述第一支座和所述第二支座分别被安装于所述第一基座和所述第二基座,以提供安装位置。
  121. 根据权利要求110-116任一所述的阵列摄像模组,其中所述线路板组 件包括一第一补充基座,所述第一基座的所述第一基座主体具有一第一缺口,所述第一补充基座限位补充于所述第一缺口,使得所述第一光窗闭合。
  122. 根据权利要求110-116任一所述的线路板组件,其中所述线路板组件包括一第二补充基座,所述第二基座的所述第二基座主体具有一第二缺口,所述第二补充基座限位补充于所述第二缺口,使得所述第二光窗闭合。
  123. 根据权利要求110-116任一所述的线路板组件,其中所述一体成型的方式选自:模塑、模压中的一种。
  124. 一阵列摄像模组,其特征在于,包括
    一根据权利要求73至108任一所述线路板组件;和
    至少两镜头,其中两所述镜头分别被设置于所述第一线路板和所述第二线路板对应的位置,以分别构成两摄像模组单元,且两所述摄像模组单元的顶端部高度一致。
  125. 根据权利要求124所述的阵列摄像模组,其中所述阵列摄像模组包括两滤光元件,分别被设置于两所述摄像模组单元。
  126. 根据权利要求124所述的阵列摄像模组,其中所述阵列摄像模组包括两镜头支撑元件,两所述镜头分别被安装于镜头支撑元件。
  127. 根据权利要求126所述的阵列摄像模组,其中至少一所述镜头支撑元件是一镜座元件,以使得对应的所述摄像模组单元构成一定焦摄像模组。
  128. 根据权利要求126所述的阵列摄像模组,其中至少一所述镜头支撑元件是一驱动元件,以使得对应所述摄像模组单元构成一动焦摄像模组。
  129. 一电子设备,其特征在于,包括:
    一根据权利要求124-128任一所述的阵列摄像模组;和
    电子设备本体;所述阵列摄像模组被设置于所述电子设备本体,以获取所述阵列摄像模组的图像信息。
  130. 根据权利要求129所述的电子设备,其中所述电子设备本体选自:智能手机、可穿戴设备、平板电脑、笔记本电脑、电子书、个人数字助理、相机、监控装置中的一种。
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