WO2018021228A1

WO2018021228A1 - Electrical connection component

Info

Publication number: WO2018021228A1
Application number: PCT/JP2017/026649
Authority: WO
Inventors: 勝信山田; 正治石川
Original assignee: パナソニックＩｐマネジメント株式会社
Priority date: 2016-07-27
Filing date: 2017-07-24
Publication date: 2018-02-01
Also published as: TW201822228A

Abstract

In order to provide an electrical connection component for which contact reliability is improved and a sufficient bonding strength can be achieved, this electrical connection component (10) is provided with: a base material (101); a contact part (100) that is disposed in a first region on the outer surface of the base material (101) and is electrically connected, by contact, to another electrical circuit or another electrical contact component; and a bonding part (500) that is disposed in a second region which is different from the first region on the outer surface of the base material (101), and is connected, by bonding, to an external conductive member. The contact part (100) and the bonding part (500) are each provided with: a first plating layer (102) formed on the outer surface of the base material (101); and carbon nanomaterials (104) that are held in the first plating layer (102) and protrude from the outer surface of the first plating layer (102). The bonding part (500) is provided with a second plating layer (501) that is formed on the outer surface of the first plating layer (102) of the bonding part (500) and that covers the carbon nanomaterials (104) that protrude from the outer surface of the first plating layer (102) of the bonding part (500).

Description

Electrical connection parts

The present invention relates to an electrical connection component. More specifically, the present invention relates to electrical connection parts such as relay and switch contact parts and connector terminal parts.

Conventionally, for the purpose of improving contact reliability, an electrical connection component having a plating layer containing a carbon nanomaterial has been proposed. For example, in the electrical contact component 200 described in Patent Document 1, a plating layer 220 is provided on the surface of the base material 210 and the carbon nanomaterial 230 is held on the plating layer 220 as shown in FIG. The carbon nanomaterial 230 is a carbon nanotube or carbon black, and is exposed on the surface of the plating layer 220. Therefore, the carbon nanomaterial 230 is more likely to come into contact with other members than the plating layer 220, and the contact reliability of the electrical contact component 200 is improved.

JP, 2013-011016, A In electrical contact component 200, it joins to conductors, such as a circuit pattern, by soldering etc., but if carbon nanomaterial 230 is exposed on the surface of plating layer 220 of the joined portion, it will be plated. There has been a problem that the solder wettability on the surface of the layer 220 is lowered and it becomes difficult to obtain sufficient bonding strength.

The present invention has been made in view of the above points, and an object of the present invention is to provide an electrical connection component that improves contact reliability and provides sufficient bonding strength.

The electrical connection component according to one aspect of the present invention is
With the base material,
A contact portion disposed in a first region on the surface of the base material and electrically connected by contact with another electrical circuit or another electrical contact component;
An electrical connection component that is disposed in a second region on the surface of the base material different from the first region, and includes a joint portion that is connected to an external conductive member by joining,
Each of the contact portion and the joint portion includes a first plating layer formed on the surface of the base material, and a carbon nanomaterial that is held by the first plating layer and protrudes from the surface of the first plating layer. Prepared,
The bonding portion includes a second plating layer formed on a surface of the first plating layer in the bonding portion and covering the carbon nanomaterial protruding from the surface of the first plating layer in the bonding portion. To do.

In the present invention, since the carbon nanomaterial protrudes on the surface of the first plating layer provided in the contact portion, the carbon nanomaterial is covered with the second plating layer in the joint portion without impairing the contact reliability of the contact portion. Thereby, the fall of the adhesiveness of the junction part by a carbon nanomaterial is suppressed, and sufficient joining strength is obtained.

FIG. 1A is a schematic cross-sectional view showing a joint portion of an electrical connection component according to an embodiment of the present invention. FIG. 1B is a schematic cross-sectional view showing a contact portion of an electrical connection component according to an embodiment of the present invention. FIG. 2 is a schematic front view showing terminal parts of the connector. FIG. 3 is a schematic sectional view showing a movable contact part and a fixed contact part of the switch. FIG. 4 is a schematic cross-sectional view showing a movable contact part and a fixed contact part of the relay described above. FIG. 5 is a graph showing a temperature profile in a contact reliability test. 6 is a graph showing a change in contact load and a change in electrical resistance value in the contact reliability test of Example 1. FIG. 7A is a surface scanning electron micrograph of the contact portion of Example 1. FIG. FIG. 7B is a surface scanning electron micrograph of the joint of Example 1. FIG. 7C is a surface scanning electron micrograph of the contact portion and the joint portion of the comparative example. FIG. 8 is a graph showing the corrosion resistance evaluation of Examples 3 to 5 and Comparative Examples 2 to 6. FIG. 9A is a graph showing the results of measurement test 1 of the contact resistance value in the contact reliability test. FIG. 9B is a graph showing the results of measurement test 2 of the contact resistance value in the contact reliability test. FIG. 9C is a graph showing the results of measurement test 3 of the contact resistance value in the contact reliability test. FIG. 9D is a graph showing the results of a contact resistance value measurement test 4 in the contact reliability test. FIG. 10 is a graph showing a change in contact load and a change in electrical resistance value in the contact reliability test of samples (1) to (5). FIG. 11 is a schematic cross-sectional view showing a contact portion of a conventional electrical connection component.

Hereinafter, modes for carrying out the present invention will be described.

(Outline of electrical connection parts)
The electrical connection component of this embodiment has a contact portion that is electrically connected by contact and a joint portion that is connected by joining. Examples of such electrical connection parts include relay and switch contact parts and connector terminal parts. Examples of contact parts include fixed contact parts and movable contact parts. Examples of the terminal component include those applied to various connectors such as a plug, a jack, a receptacle, a socket, and a pin header.

¡The contact part of the electrical connection component is the part that contacts other members. Here, the “other member” means a member other than the electrical connection component, and means another electrical circuit or another electrical contact component. For example, when the electrical connection component is a fixed contact component, the movable contact component paired therewith is another member. That is, in the fixed contact part and the movable contact part, a part where they are in contact with each other is formed as a contact portion. When the electrical connection component is a terminal component of a connector, the terminal component provided in another connector is another member. That is, in the terminal component of the connector, a portion where the terminal components provided in each of the plurality of mechanically connected connectors contact each other is formed as a contact portion. When the contact portion comes into contact with another member, the electrical connection component and the other member are electrically connected.

The joint part of the electrical connection part is a part that is mechanically connected to another member by joining. Here, the “other member” means a member other than the electrical connection component and an external conductive member. Examples of joining include soldering, wire bonding (WB), welding, and caulking. For example, when the electrical connection parts are a fixed contact part and a movable contact part, a fixed spring and a movable spring to which these are attached are other members. That is, in the fixed contact component and the movable contact component, a portion that contacts and is joined to another member is formed as a joint. When the electrical connection component is a terminal component of a connector, the circuit pattern of the printed wiring board on which the connector is mounted is another member. That is, in the terminal component of the connector, a portion that is mechanically connected to another member by soldering or the like is formed as a joint portion. When the joining portion is joined to another member, the electrical connection component and the other member are electrically and mechanically connected.

The contact portion and the joint portion are both formed on the surface of the base material, but the contact portion is disposed in a first region on the surface of the base material, and the joint portion is different from the first region. Is disposed in the second region on the surface.

(Description of joint)
FIG. 1A shows a schematic diagram of a joint 500 of the electrical connection component 10. The bonding portion 500 is formed including the base material 101, the first plating layer 102, the second plating layer 501, and the carbon nanomaterial 104.

The base material 101 is a base of the electrical connection component 10 and is formed into a desired shape according to the purpose of use. The base material 101 is formed of a known metal material used for the electrical connection component 10 such as copper or a copper alloy. Copper alloys include Cu-Ti, Cu-Ti-Fe, Cu-Be, Cu-Sn-P, Cu-Zn, Cu-Ni-Zn, Cu-Ni-Si, Cu-Fe-P. Based alloys. Note that the base material 101 may have a base layer such as a Ni plating film for improving adhesion to the first plating layer 102 on the surface thereof.

The first plating layer 102 is a plating film adhering to the surface of the base material 101. The first plating layer 102 is formed of a crystalline or amorphous (amorphous) metal plating film. The material and thickness of the first plating layer 102 may be determined in consideration of the adhesion to the base material 101 and the retainability, hardness, corrosion resistance, etc. of the carbon nanomaterial 104. The material of the first plating layer 102 is preferably formed of Ni or a Ni—P alloy. The film thickness of the first plating layer 102 is preferably 5 μm or less. When the film thickness is thicker than 5 μm, the spring property of the first plating layer 102 is likely to be lost, and cracks due to stress may easily occur. The lower limit of the film thickness of the first plating layer 102 is preferably set to 0.1 μm in order to ensure the retainability of the carbon nanomaterial 104. Further, considering the improvement of the corrosion resistance of the contact part 100, the thickness of the first plating layer 102 is preferably 0.5 μm or more, and more preferably 1 μm or more.

The second plating layer 501 is a plating film adhering to the surface of the first plating layer 102. The second plating layer 501 includes a coating plating layer 502 formed on the surface of the first plating layer 102 and a protective plating layer 103 formed on the surface of the coating plating layer 502.

The coating plating layer 502 is plating that covers the carbon nanomaterial 104 protruding from the surface of the first plating layer 102. That is, the carbon nanomaterial 104 protruding from the surface of the first plating layer 102 in the bonding portion 500 is covered with the coating plating layer 502 and is not exposed on the surface of the coating plating layer 502. Thereby, a decrease in the wettability of the solder of the joint portion 500 by the carbon nanomaterial 104 is suppressed.

The coating plating layer 502 is formed of Ni or a Ni—P alloy in the same manner as the first plating layer 102 in consideration of adhesion to the first plating layer 102, solder wettability, adhesion to the protective plating layer 103, and the like. It is preferable that The thickness of the coating plating layer 502 may be thicker than the protruding length of the carbon nanomaterial 104 from the first plating layer 102, and is preferably 0.01 μm or more and 1.5 μm or less, for example, 0.03 μm or more and 1. More preferably, it is 2 μm or less.

The protective plating layer 103 is plating for suppressing corrosion of the first plating layer 102 and the coating plating layer 502 caused by the potential difference between the first plating layer 102 and the coating plating layer 502 and the carbon nanomaterial 104. In the conventional example shown in FIG. 11, corrosion was likely to occur in the plating layer 220 in a severe corrosion resistance test such as a sulfurous acid gas test. This is crevice corrosion in which the plating layer 220 and the carbon nanomaterial 230 form a local battery. That is, when a gap is generated in the portion (interface portion) covered with the plating layer 220 by the carbon nanomaterial 230 due to unevenness of the plating layer 220 or the like, the potential difference between the plating layer 220 and the carbon nanomaterial 230 is generated in the gap. Due to the local battery, crevice corrosion occurs. The protective plating layer 103 in this embodiment suppresses the occurrence of crevice corrosion.

The protective plating layer 103 preferably contains a noble metal element rather than the metal elements contained in the first plating layer 102 and the coating plating layer 502. In this case, the protective plating layer 103 has a smaller potential difference with respect to the carbon nanomaterial 104 than the first plating layer 102 and the coating plating layer 502, and the protective plating layer 103 is smaller than the first plating layer 102 and the coating plating layer 502. Corrosion is less likely to occur. As a result, the first plating layer 102 and the coating plating layer 502 are coated with the protective plating layer 103 that is unlikely to cause corrosion, and oxygen, moisture, and other corrosive components are present on the first plating layer 102 and the coating plating layer 502. It becomes difficult to act, and corrosion of the 1st plating layer 102 and covering plating layer 502 is controlled.

Specifically, when the first plating layer 102 and the coating plating layer 502 are formed by Ni plating or Ni—P alloy plating, the protective plating layer 103 is made of Cu, Sn, Au, Ag, Pd, Rh, Ru. It can be formed by plating made of one or more metal elements selected from the group. In addition, when the first plating layer 102 and the coating plating layer 502 are formed by Ni plating or Ni—P alloy plating, the protective plating layer 103 is made of Cu, Sn, Au, Ag, Pd, Rh, Ru. It can be formed of an alloy plating layer containing one or more selected metal elements. Examples of the alloy plating include Ni—Cu plating, Ni—Sn plating, Ni—Au plating, Ni—Ag plating, Ni—Pd plating, Ni—Ph plating, and Ni—Ru plating. Further, since the protective plating layer 103 only needs to have higher corrosion resistance than the first plating layer 102 and the coating plating layer 502, for example, the first plating layer 102 and the coating plating layer 502 are formed by Ni plating or Ni—P alloy plating. In this case, the protective plating layer 103 can be formed by Ni—W plating, Ni—B plating, Ni—Fe plating, or the like. Further, since the protective plating layer 103 only needs to protect the first plating layer 102 and the coating plating layer 502 from corrosion, for example, the protective plating layer 103 can be formed by Zn plating. In this case, the corrosion of the first plating layer 102 and the coating plating layer 502 is suppressed by the protective plating layer 103 by the sacrificial anticorrosive action of Zn plating. Further, the protective plating layer 103 preferably contains a metal element that forms an intermetallic compound with the coating plating layer 502, and it is also preferable that the solder plating property is excellent.

The thickness of the protective plating layer 103 is preferably 0.01 μm or more and 1.5 μm or less, and more preferably 0.05 or more and 1.0 μm or less. If the thickness of the protective plating layer 103 is within this range, corrosion of the first plating layer 102 and the coating plating layer 502 is easily suppressed by the protective plating layer 103. In the Ni alloy plating, the concentration of metal elements other than Ni is preferably 6% by mass or more and 12% by mass or less, and more preferably 8% by mass or more and 10% by mass or less. If it is this range, Ni plating layer will not be too hard, it will become difficult to generate | occur | produce a crack etc., and it will become easy to ensure corrosion resistance.

The protective plating layer 103 is provided as necessary. That is, when high corrosion resistance is required for the electrical connection component 10, it is preferable to provide the protective plating layer 103, but when high corrosion resistance is not required, the protective plating layer 103 may not be particularly provided.

The thickness of the second plating layer 501 is the sum of the thickness of the coating plating layer 502 and the thickness of the protective plating layer 103, and is preferably 0.03 μm or more and 2.0 μm or less. It becomes easy to cover the carbon nanomaterial 104 protruding on the surface. The thickness of the second plating layer 501 is more preferably 0.05 μm or more and 1.8 μm or less.

The carbon nanomaterial 104 is a nano-order size carbon material, such as carbon nanotube (CNT), carbon black (CB), fullerene, graphene, and the like. The carbon nanomaterial 104 is preferably chemically stable and excellent in electrical conductivity, slidability, and mechanical strength. The CNT preferably has a diameter of 100 nm to 200 nm and a length of 10 μm to 20 μm. More preferably, the CNT has a diameter of 120 nm to 180 nm and a length of 12 μm to 18 μm. In addition, CNT includes single-walled CNTs in which a graphite sheet is wound in a cylindrical shape and multilayered CNTs in which a graphite sheet is wound in two or more layers. Since it is excellent in mass productivity and can be obtained relatively inexpensively, it is preferable in that the cost can be suppressed. CB is in the form of particles, and the particle diameter is preferably several nm or more and 100 nm or less as measured by a laser diffraction method or the like. Further, CB is a variety having excellent electrical conductivity, and it is preferable that each particle is present in the state of an aggregate having a size of micron order in a cluster shape. CB is preferable in terms of cost reduction because it is superior to CNT in mass productivity and can be obtained relatively inexpensively.

FIG. 1A shows a case where the carbon nanomaterial 104 is CNT in the joint 500. One end of this CNT is embedded and fixed in the first plating layer 102. In this way, the CNTs are held on the first plating layer 102. The CNT protrudes from the surface of the first plating layer 102 but is buried in the coating plating layer 502.

The carbon nanomaterial 104 is formed as a composite plating with the first plating layer 102. The amount of the carbon nanomaterial 104 used is preferably 0.02% by mass or more and 2.0% by mass or less, based on the total amount of the carbon nanomaterial 104 and the first plating layer 102, and 0.05% by mass. From the above, it is more preferably 1.8% by mass or less. When the use amount of the carbon nanomaterial 104 is in the above range, the contact reliability of the contact portion 100 described later by the carbon nanomaterial 104 can be sufficiently improved, and the dispersibility of the carbon nanomaterial 104 in the plating solution can be obtained. In addition, sufficient adhesion of the first plating layer 102 to the base material 101 is easily secured.

(Description of contact part)
FIG. 1B shows a schematic view of the contact portion 100 of the electrical connection component 10. The contact part 100 includes the same base material 101, the first plating layer 102, the protective plating layer 103, and the carbon nanomaterial 104 as the joint part 500. In other words, the coating portion 502 is not formed on the contact portion 100, and the carbon nanomaterial 104 is exposed on the surface.

In the contact part 100, the base material 101 and the first plating layer 102 are formed in the same manner as in the case of the joint part 500. In the contact portion 100, a protective plating layer 103 is formed on the surface of the first plating layer 102. In this case, the protective plating layer 103 does not completely cover the carbon nanomaterial 104 protruding from the surface of the first plating layer 102. That is, the protective plating layer 103 covers only the base of the carbon nanomaterial 104 (the vicinity of the surface of the first plating layer 102). Therefore, in the contact part 100, the carbon nanomaterial 104 penetrates the protective plating layer 103, and the tip of the carbon nanomaterial 104 protrudes from the surface of the protective plating layer 103. Similarly to the above, the protective plating layer 103 is plating for suppressing corrosion of the first plating layer 102 caused by the potential difference between the first plating layer 102 and the carbon nanomaterial 104. In the contact part 100, the protruding length of CNT from the surface of the protective plating layer 103 is preferably 0.1 μm to 10 μm.

Note that the protective plating layer 103 is provided as necessary in the contact portion 100 as in the case of the joint portion 500. That is, when high corrosion resistance is required for the electrical connection component 10, it is preferable to provide the protective plating layer 103, but when high corrosion resistance is not required, the protective plating layer 103 may not be particularly provided.

(Plating process)
In forming the contact part 100 and the joint part 500 as described above, a composite plating layer composed of the carbon nanomaterial 104 and the first plating layer 102 is first formed on the entire base material 101. This composite plating layer is formed on the surface of the base material 101 by electrodeposition (electrolytic plating). In this case, a plating solution containing a metal element such as Ni and P and the carbon nanomaterial 104 is attached to the surface of the base material 101 and energized, whereby the first plating layer 102 holding the carbon nanomaterial 104 is deposited. Formed.

Here, since the carbon nanomaterial 104 is mainly intended to improve the contact property with the other members of the contact portion 100, it can be considered to be provided only in the portion where the contact portion 100 of the base material 101 is formed. In this case, a partial plating method such as a partial immersion method, a spot plating method, a sparger plating method, a mask plating method, or a resist plating method is used to partially form a composite plating layer composed of the carbon nanomaterial 104 and the first plating layer 102. However, such composite plating has strict plating conditions, and partial plating by the above method is very complicated. In particular, it is difficult to partially apply the composite plating to a hoop material in which the base material 101 is very small and a large number of base materials 101 are connected in series. Therefore, in the present embodiment, a composite plating layer composed of the carbon nanomaterial 104 and the first plating layer 102 is formed on the entire base material 101 serving as the base of the electrical connection component 10. Since it is not necessary to form partly on the base material 101, complexity is reduced, and the productivity of the electrical connection component 10 is improved.

Next, a coating plating layer 502 is formed on the surface of the first plating layer 102 at a portion where the joint portion 500 is formed. The coating plating layer 502 is formed by the partial plating method exemplified above. For example, the coating plating layer 502 can be formed by electrodeposition. That is, a plating solution containing a metal element such as Ni is attached to the surface of the first plating layer 102 and energized, whereby the coating plating layer 502 is deposited and formed. The coating plating layer 502 is a plating that does not contain a carbon nanomaterial, and is not a composite plating like the first plating layer 102. Therefore, the plating conditions are not stricter than the composite plating and do not become complicated.

Next, a protective plating layer 103 is formed as necessary. The protective plating layer 103 may be provided on both the contact part 100 and the joint part 500, may not be provided on both, or may be provided on only one side. Further, the protective plating layer 103 may be provided in a part other than the contact part 100 and the joint part 500. The protective plating layer 103 is formed on the surface of the first plating layer 102 in the portion that becomes the contact portion 100. The protective plating layer 103 is formed on the surface of the coating plating layer 502 at the portion that becomes the joint portion 500.

(Use example of electrical connection parts)
FIG. 2 shows the

terminal components

20a and 20b. These

terminal components

20a and 20b are respectively incorporated in connection components (for example, a header and a socket) that form a connector pair. The

terminal parts

20a and 20b contact the contact part 21a of one terminal part 20a and the contact part 21b of the other terminal part 20b by connecting the connection parts, whereby the terminal part 20a and the terminal part 20b are brought into contact with each other. Electrically connected. Further, the joint portion 22a of the terminal component 20a and the joint portion 22b of the terminal component 20b are respectively joined to a conductor of a circuit pattern such as a printed wiring board or a conductor of wiring by solder or the like. One or both of the

terminal components

20a and 20b can be formed as the electrical connection component 10 of the present embodiment. That is, one or both of the

contact portions

21a and 21b can have the structure shown in FIG. 1B, and one and both of the

joint portions

22a and 22b can have the structure shown in FIG. 1A.

FIG. 3 shows a schematic diagram of the switch 30. The switch 30 is provided with a push button 35 protruding from the upper surface of the case 31. The push button 35 is formed so as to be freely pressed by a lever 33. A spring 34 is provided below the push button 35 in the case 31. At the tip of the spring 34, a movable contact part 30 a is provided so as to protrude from both the upper and lower surfaces of the spring 34. In the case 31, fixed contact parts 30b are provided above and below the movable contact parts 30a. The fixed contact parts 30b and 30c are joined to the contact bases 36b and 36c, respectively. In the switch 30, when the lever 33 is operated, the push button 35 is pressed and the spring 34 operates, so that the movable contact part 30a comes into contact with the upper fixed contact part 30c and is separated from the lower fixed contact part 30b. The movable contact part 30a is separated from the upper fixed contact part 30c and is in contact with the lower fixed contact part 30b. Then, the movable contact part 30a and the fixed contact part 30b come into contact with each other to make electrical connection.

In the switch 30, one or both of the movable contact part 30a and the fixed contact part 30b can be formed as the electrical connection part 10 of the present embodiment. That is, one or both of a contact portion (a portion that contacts the fixed contact components 30b and 30c) 31a of the movable contact component 30a and a contact portion (a portion that contacts the movable contact component 30a) 31b and 31c of the fixed contact components 30b and 30c. Can be formed with the structure shown in FIG. 1B. In addition, one or both of the joint part (part joined to the spring 34) 32a of the movable contact part 30a and the joint part (part joined to the contact points 36b and 36c) 32b and 32c of the fixed contact part 30b and 30c are shown in FIG. Can be formed. In joining the movable contact part 30a to the spring 34, caulking is mainly used, but it may be joined by welding or soldering. The fixed contact parts 30b and 30c and the contact bases 36b and 36c are mainly joined by welding or soldering.

FIG. 4 shows a schematic diagram of the relay 40. The relay 40 includes an electromagnet block 44 and a contact block 45 in a space surrounded by the body 42 and the case 43. The electromagnet block 44 includes a coil wire 46, a coil bobbin 47, an iron core 48, an armature 49, and a yoke 50. A coil terminal 51 electrically connected to the coil wire 46 projects from the bottom surface of the body 42. The contact block 45 includes a movable spring 52, a movable contact part 40a, a fixed spring 53, and a fixed contact part 40b. A contact terminal 54 electrically connected to the movable contact part 40 a and the fixed contact part 40 b protrudes from the bottom surface of the body 42. The armature 49 and the movable spring 52 are connected by a card 55. In this relay 40, the armature 49 is operated by energization / non-energization of the coil wire 46, whereby the movable spring 52 is operated and the movable contact part 40 a is in contact with the fixed contact part 40 b, and the movable contact The part 40a is formed so as to be switched between a state where it is separated from the fixed contact part 40b. Then, the movable contact part 40a and the fixed contact part 40b come into contact with each other to make electrical connection.

In the relay 40, one or both of the movable contact part 40a and the fixed contact part 40b can be formed as the electrical connection part 10 of the present embodiment. That is, one or both of a contact portion (a portion that contacts the fixed contact component 40b) 41a of the movable contact component 40a and a contact portion (a portion that contacts the movable contact component 40a) 41b of the fixed contact component 40b are shown in FIG. 1B. Can be formed. In addition, one or both of a joint portion (a portion that joins the movable spring 52) 42a of the movable contact component 40a and a joint portion (a portion that joins the fixed spring 53) 42b of the fixed contact component 40b has the structure shown in FIG. 1A. Can be formed. In joining the movable contact part 40a to the movable spring 52 and joining the fixed contact part 40b to the fixed spring 53, caulking is mainly used, but welding or soldering may be used.

(Effect of this embodiment)
The electrical connection component 10 of the present embodiment includes a contact portion 100 that is electrically connected by contact, and the contact portion 100 includes the carbon nanomaterial 104. Therefore, even when the contact pressure is low, the electrical connection component 10 includes carbon. The nanomaterial 104 can ensure electrical contact without impairing contact with other members, and can easily ensure contact reliability in a low contact pressure region.

Moreover, since the carbon nanomaterial 104 is interposed between the surface of the contact part 100 and the other member that contacts the contact part 100, the electrical connection component 10 of the present embodiment has a contact between the contact part 100 and the other member. Adhesion and wear can be reduced, and the sticking resistance of the electrical connection component 10 is easily improved. Therefore, it is preferable to use the electrical connection component 10 as described above as a contact component such as a switch or a relay having a large number of opening / closing operations, because the sticking phenomenon hardly occurs and the life can be easily extended.

In addition, the electrical connection component 10 of the present embodiment includes a joint portion 500 that performs mechanical connection by joining, and the joint portion 500 covers the second carbon nanomaterial 104 that protrudes from the surface of the first plating layer 102. Since the plating layer 501 is provided, the exposure of the carbon nanomaterial 104 on the surface of the joint portion 500 can be reduced, and the adhesion between the surface of the joint portion 500 and another member is increased to increase the joint strength. be able to.

Furthermore, the electrical connection component 10 of this embodiment is a protective plating for suppressing corrosion caused by a potential difference between the first plating layer 102 and the carbon nanomaterial 104 on the surface of the first plating layer 102 holding the carbon nanomaterial 104. A layer 103 is provided. Therefore, the electrical connection component 10 of the present embodiment can suppress the corrosion of the first plating layer 102 and can improve the corrosion resistance.

Hereinafter, the present invention will be specifically described by way of examples.
Example 1
As the base material, a Cu alloy such as phosphor bronze or titanium copper formed into a shape that is applied to a copper plate or a contact part of a connector was used.

A composite plating layer including the carbon nanomaterial and the first plating layer was formed on the entire base material. Here, a Ni—P alloy plating solution containing CNT was used as the carbon nanomaterial. As CNT, VGCF made by Showa Denko Co., Ltd. was used. This CNT is a multilayer CNT. Further, the diameter (outer diameter) of the CNTs was in the range of 100 to 200 nm and the length was in the range of 10 to 20 μm. The composition of the Ni-P alloy plating solution, sulfuric acid Ni (1mol / ^dm 3), chloride Ni (0.2mol / ^dm 3), boric acid (0.5mol / ^dm 3), citric acid (0.5 mol / dm ³ ), Phosphonic acid (1.0 mol / dm ³ ), and a polycarboxylic acid having a molecular weight of 5000 (2 × 10 ⁻⁴ mol / dm ³ ) as a dispersant. In the Ni—P alloy plating solution containing CNT, the mixing amount of CNT was set to 2 g / dm ³ . Further, a Ni—P alloy plating solution containing CNT was used as a plating bath, and the plating temperature was 50 ± 10 ° C. and the current density was 1 to 15 A / dm ² . Then, a CNT-containing Ni—P alloy plating layer in which the thickness of the first plating layer as the Ni—P alloy plating layer was 1.5 μm and the CNT content was 1.0 mass% was formed.

Next, a coating plating layer was formed on the surface of the first plating layer at a portion to be a joint. The coated plating layer covered the CNT protruding on the surface of the first plating layer so as not to be exposed to the outside. The coating plating layer is a Ni plating film having a thickness of 1.5 μm, and the plating conditions are Ni sulfamic acid (450 g / l), Ni chloride (3 g / l), boric acid (30 g / l), additive (appropriate amount), Electroplating was performed for 1 minute at a pit inhibitor (appropriate amount), pH = 3.0 to 4.5, and a bath temperature of 40 to 50 ° C.

Next, a protective plating layer was formed in the part to be the contact part and the part to be the joint part. A protective plating layer was formed on the surface of the first plating layer at the portion to be the contact portion. A protective plating layer was formed on the surface of the coating plating layer at a portion to be a joint. The protective plating layer was formed by Sn plating. In this case, “PF-095S” manufactured by Ishihara Pharmaceutical Co., Ltd. was used as the plating solution, and Sn plating was formed under the conditions of a bath temperature of 35 ° C. and a current density of 3 ASD. The thickness of the protective plating layer was 0.3 μm.

In this way, electrical connection parts were formed. In the contact portion, CNT protrudes on the surface of the protective plating layer, but in the bonding portion, CNT does not protrude on the surface of the second plating layer composed of the coating plating layer and the protection plating layer.

(Example 2)
An electrical connection component was formed in the same manner as in Example 1 except that a protective plating layer having a thickness of 0.3 μm was formed by Au—Co alloy plating instead of Sn plating. In this case, “Aurobright BAR7” manufactured by Japan High Purity Chemical Co., Ltd. was used as the plating solution, and Au—Co alloy plating was formed under conditions of a bath temperature of 50 ° C. and a current density of 5 A / dm ² .

(Comparative Example 1)
The same operation as in Example 1 was performed except that the second plating layer (the coating plating layer and the protective plating layer) was not formed. In this case, CNT protrudes on the surface of the first plating layer at the portion to be the joint.

(Evaluation of contact reliability)
About each said Example and the comparative example 1, the contact resistance value after the sulfurous acid gas test in the contact part of an electrical-connection component was measured. The sulfurous acid gas test was performed by leaving each Example and Comparative Example 1 for 48 hours under conditions of a temperature of 40 ± 2 ° C., a humidity of 90 ± 3% RH, and a sulfurous acid gas concentration of 10 ± 3 ppm.

For the measurement of the contact resistance value, an electrical contact simulator (model CRS-113-AU type) manufactured by Yamazaki Seiki Laboratory Co., Ltd. was used. Since the measurement is based on the AC four-terminal method, the measured values do not include specific resistances such as lead wires and connector parts, and the contact resistance value when the contact load is changed can be measured. The contact position can be scanned with a constant load by the electric stage, and measurement assuming wiping at the switch and relay contact is also possible. The contact resistance value was measured at a contact force of 0.2N. Each Example and Comparative Example 1 were evaluated by 5 pieces (Sample Nos. 1 to 5). The results are shown in Table 1.

As is clear from this result, it can be said that each example has a smaller contact resistance value than Comparative Example 1, and has high contact reliability in a low contact pressure region.

Also, the change in electrical resistance value due to the change in contact load was measured for five of Example 1. The results are shown in FIG. As is clear from FIG. 6, the electrical connection component of this embodiment shows a stable contact resistance value even with a contact load of 0.1N.

(Evaluation of bondability)
About each Example and Comparative Example 1, the insertion / extraction test after solder mounting was done. That is, for each of the examples and comparative example 1, the joint portion of the electrical connection component is soldered to the conductor circuit pattern of the printed wiring board, and then is pulled out in a direction perpendicular to the surface of the printed wiring board with an insertion / extraction tester. Thus, a load was applied to the electrical connection component. The drawing speed was 2 mm / min. And the force (peel strength) when the electrical connection component deviated from the conductor circuit pattern was measured. The results are shown in Table 2. In addition, the solder joint of the junction part of the electrical connection component to the conductor circuit pattern was performed as follows. Using a mask screen having a thickness of 0.12 mm, a lead-free solder paste was applied to the surface of the joint so as to form a circle of Φ4.5 mm. As the solder paste, M705-221BM5-32-11.2K manufactured by Senju Metal Industry Co., Ltd. was used. The mounting conditions were reflow using the temperature profile of FIG. 5 in the atmosphere. In addition, each example and comparative example were evaluated by 5 pieces (sample Nos. 1 to 5).

From this result, each example has a higher bonding strength than Comparative Example 1, and each example has a sufficient bonding strength (standard 2N or higher).

FIG. 7A shows a surface scanning electron micrograph of the contact portion 100 of Example 1. Similarly, FIG. 7B shows a surface scanning electron micrograph of the joint portion 500 of Example 1, and FIG. 7C shows the joint portion 500 (contact portion 100) of Comparative Example 1. Although the CNT (carbon nanomaterial 104) is exposed on the surface of the contact portion 100 in both Example 1 and Comparative Example 1, no CNT is seen on the surface of the bonding portion 500 of Example 1.

(Example 3)
Next, in the same manner as in Example 1, a coating plating layer was formed on the surface of the first plating layer in a portion to be a joint portion.

Next, a protective plating layer was formed in the part to be the contact part and the part to be the joint part. A protective plating layer was formed on the surface of the first plating layer at the portion to be the contact portion. A protective plating layer was formed on the surface of the coating plating layer at a portion to be a joint. The protective plating layer was formed by Sn plating. In this case, “PF-095S” manufactured by Ishihara Pharmaceutical Co., Ltd. was used as the plating solution, and Sn plating was formed under the conditions of a bath temperature of 35 ° C. and a current density of 3 ASD. The thickness of the protective plating layer was 0.1 μm.

In this way, an electrical connection component (flat plate) was formed. In the contact portion, CNT protrudes on the surface of the protective plating layer, but in the bonding portion, CNT does not protrude on the surface of the second plating layer composed of the coating plating layer and the protection plating layer.

(Example 4)
The same procedure as in Example 3 was performed except that a CB-containing Ni—P alloy plating layer was formed using CB instead of CNT as the carbon nanomaterial. As CB, Vulcan XC-72 manufactured by Cabot was used. This CB has a diameter (particle diameter) in the range of 20 to 40 nm.

(Example 5)
Example 1 was performed except that Ni plating was formed instead of Ni—P alloy plating as the first plating layer. The composition of the Ni plating solution was Ni sulfate (1 mol / dm ³ ), Ni chloride (0.2 mol / dm ³ ), and boric acid (0.5 mol / dm ³ ). In the Ni plating solution containing CNT, the mixing amount of CNT was set to 2 g / dm ³ . Moreover, Ni plating solution containing CNT was used as a plating bath, and the plating temperature was 50 ° C. and the current density was 5 A / dm ² .

(Comparative Example 2)
The same procedure as in Example 4 was performed except that the coating plating layer and the protective plating layer were not formed.

(Comparative Example 3)
The same base material as in Example 3 was used. A Ni plating layer (containing no carbon nanomaterial) was formed on a portion that would be a contact portion of the base material. The formation conditions of the Ni plating layer were such that the composition of the Ni plating solution was 400 g / dm ³ nickel sulfamate, 40 g / dm ³ boric acid, and 5 g / dm ³ nickel chloride. The plating conditions were a bath temperature of 50 ° C. and a current density of 5 A / dm ² . The thickness of the Ni plating layer was 1.5 μm.

In this way, a flat plate (electrical connection part) was formed.

(Comparative Example 4)
Comparative Example 3 was performed except that the thickness of the Au—Co alloy plating layer was set to 0.06 μm.

(Comparative Example 5)
In Comparative Example 3, the Au—Co alloy plating layer was subjected to sealing treatment (dipped in a water-soluble sealing treatment solution and then dried at 80 ° C.).

(Comparative Example 6)
In Comparative Example 4, the Au—Co alloy plating layer was sealed. The conditions for the sealing treatment were the same as in Comparative Example 5.

(Evaluation of corrosion resistance)
The corrosion resistance of the above Examples 3 to 5 and Comparative Examples 2 to 6 was evaluated. That is, the flat plate (electrical connection part) of each example and each comparative example was immersed in a sulfuric acid aqueous solution having a concentration of 80 ppm, and then allowed to stand at a temperature of 260 ° C. for 5 minutes. Thereafter, electrochemical measurement was performed to prepare a Tafel plot. For electrochemical measurement, “HZ-7000” manufactured by Hokuto Denko Co., Ltd. was used, Ag / Ag—Cl as the reference electrode and Pt as the counter electrode, and the corrosion current / potential was measured. The results are shown in FIG.

As is apparent from FIG. 8, it can be seen that each example is noble because the corrosion potential and the corrosion current are lower than each comparative example, and corrosion is suppressed.

(Contact reliability test)
Terminal parts used for a connector “P5KS” manufactured by Panasonic Corporation were formed. This connector includes a header and a socket, and the header and the socket each have 40 terminal parts. The following (1) to (5) and current products were prepared as connector samples.

Sample (1) is a composite plating layer (Ni-P-CB composite plating layer, the thickness of the first plating layer) of CB, which is a carbon nanomaterial, and a first plating layer made of a Ni—P alloy at the contact part of the terminal component. 1.5 μm, P concentration in the plating film is 10 wt%), and the surface of the first plating layer has a Sn plating layer (thickness: 0.1 μm) as a protective plating layer.

Sample (2) is formed in the same manner as sample (1) except that the P concentration in the plating film is 5 wt%.

Sample (3) is formed in the same manner as sample (1) except that the protective plating layer is Sn—Ni alloy plating.

Sample (4) is formed in the same manner as sample (1) except that the carbon nanomaterial is CNT.

Sample (5) is formed in the same manner as sample (2) except that the carbon nanomaterial is CNT.

In the current product, the contact part of the terminal component does not have a carbon nanomaterial, the Ni plating layer as the first plating layer has a thickness of 1.5 μm, and the protective plating layer has a thickness of 0 by Au—Co alloy plating. . After forming at 2 μm, it is sealed.

Using such connectors (samples (1) to (5) and current products), the following contact resistance value measurement tests 1 to 4 were performed. Each measurement test was performed using three connectors.

(Contact resistance measurement test 1)
The contact resistance value after performing heat treatment three times in the atmosphere at a temperature of 260 ° C. assuming an atmospheric pressure reflow soldering process was measured.

(Contact resistance measurement test 2)
The contact resistance value was measured after leaving in a sulfurous acid gas having a concentration of 10 ± 3 ppm at a temperature of 40 ± 2 ° C. and a humidity of 90 ± 3% RH for 48 hours.

(Measurement test 3 of contact resistance value)
The contact resistance value after inserting and removing the head and socket 50 times was measured.

(Contact resistance measurement test 4)
The contact resistance value after 12 moisture resistance cycles was measured.

Results of measurement tests 1 to 4 are shown in FIGS. 9A to 9D. As is apparent from this result, it can be said that samples (1) to (5) have a contact resistance value comparable to or lower than that of the current product and have high contact reliability in a low contact pressure region.

In addition, with respect to samples (1) to (5), the change in electrical resistance value due to the change in contact load was measured. The results are shown in FIG. As is apparent from FIG. 10, samples (1) to (5), which are the electrical connection parts of this embodiment, show stable contact resistance values even with a contact load of 0.1N.

(Features of this embodiment)
The electrical connection component (10) of this embodiment has the following characteristics.

That is, the electrical connection component (10) is disposed in the first region on the surface of the base material (101) and the base material (101), and is electrically connected to another electrical circuit or another electrical contact component. A contact portion (100) to be connected, and a joint portion (500) disposed in a second region on the surface of the base material (101) different from the first region and connected to an external conductive member by joining Is provided. Each of the contact portion (100) and the joint portion (500) is held by the first plating layer (102) formed on the surface of the base material (101) and the first plating layer (102), and the first plating layer. Carbon nanomaterial (104) protruding from the surface of (102). A carbon nanomaterial (104) in which a joint (500) is formed on the surface of the first plating layer (102) in the joint (500) and protrudes from the surface of the first plating layer (102) in the joint (500). A second plating layer (501) is provided.

In such an electrical connection component (10), since the contact portion (100) has the carbon nanomaterial (104), the carbon nanomaterial (104) is in contact with other members even at a low contact pressure. Thus, it is possible to ensure electrical contact without impairing contact resistance, and it is easy to ensure contact reliability in a low contact pressure region. Moreover, since the junction part (500) has the 2nd plating layer (501) which covers the carbon nanomaterial (104) which protrudes from the surface of the 1st plating layer (102), in the surface of a junction part (500) The exposure of the carbon nanomaterial (104) can be reduced, and the bonding strength can be increased by improving the adhesion between the surface of the bonding portion (500) and another member.

In the electrical connection component (10), the first plating layer (102) preferably contains Ni or a Ni—P alloy, and the second plating layer (501) preferably contains at least one of Sn or Au. .

In such an electrical connection component (10), since the first plating layer (102) contains Ni, appearance change such as discoloration due to oxidation can be reduced, and the second plating layer (501) Since it contains Sn or Au, corrosion resistance can be improved.

In the electrical connection component (10), the thickness of the second plating layer (501) is preferably 0.03 μm or more and 2.0 μm or less.

Such an electrical connection component (10) can sufficiently suppress the exposure of the carbon nanomaterial (104) by the second plating layer (501).

In the electrical connection component (10), it is preferable that the contact portion (100) does not include the second plating layer (501).

In such an electrical connection component (10), the carbon nanomaterial (104) on the surface of the contact portion (100) is not covered with the second plating layer (501), and a decrease in contact reliability is suppressed.

In the electrical connection component (10), the contact portion (100) has a protective plating layer (103) for suppressing corrosion caused by a potential difference between the first plating layer (102) and the carbon nanomaterial (104). Is preferred.

Such an electrical connection component (10) has high corrosion resistance because corrosion caused by the potential difference between the first plating layer (102) and the carbon nanomaterial (104) is suppressed by the protective plating layer (103).

In the electrical connection component (10), the protective plating layer (103) preferably contains a metal element nobler than the metal element contained in the first plating layer (102).

Such an electrical connection component (10) provides a protective plating layer (103) that is highly effective in suppressing corrosion caused by the potential difference between the first plating layer (102) and the carbon nanomaterial (104), and is more corrosion resistant. Get higher.

In the electrical connection component (10), the first plating layer (102) is formed of Ni or a Ni—P alloy. It is preferable that the protective plating layer (103) contains at least one selected from the group of Sn, Cu, Ag, Au, Pd, Rh, and Ru as a metal element nobler than Ni.

Such an electrical connection component (10) is composed of Sn, Cu in which corrosion caused by a potential difference between Ni contained in the first plating layer (102) and the carbon nanomaterial (104) is contained in the protective plating layer (103). , Ag, Au, Pd, Rh, Ru are suppressed by at least one, and corrosion resistance is high.

In the electrical connection component (10), the protective plating layer (103) preferably has a thickness of 0.1 μm or more and 1.0 μm or less.

10

Electrical connection parts

100, 21a, 21b, 31a, 31b, 31c, 41a, 41b Contact part 101 Base material 102 First plating layer 103 Protective plating layer 104

Carbon nanomaterial

500, 22a, 22b, 32a, 32b, 32c, 42a , 42b Joint 501 Second plating layer

Claims

With the base material,
A contact portion disposed in a first region on the surface of the base material and electrically connected by contact with another electrical circuit or another electrical contact component;
An electrical connection component that is disposed in a second region on the surface of the base material different from the first region, and includes a joint portion that is connected to an external conductive member by joining,
Each of the contact portion and the joint portion includes a first plating layer formed on the surface of the base material, and a carbon nanomaterial that is held by the first plating layer and protrudes from the surface of the first plating layer. Prepared,
An electrical connection component comprising: a second plating layer formed on a surface of the first plating layer in the bonding portion and covering the carbon nanomaterial protruding from the surface of the first plating layer in the bonding portion.
The first plating layer contains Ni or a Ni-P alloy;
The electrical connection component according to claim 1, wherein the second plating layer contains at least one of Sn or Au.
The electrical connection component according to claim 1, wherein a thickness of the second plating layer is 0.03 μm or more and 2.0 μm or less.
The electrical connection component according to claim 1, wherein the contact portion does not include the second plating layer.
The electrical connection according to any one of claims 1 to 4, wherein the contact portion includes a protective plating layer for suppressing corrosion caused by a potential difference between the first plating layer and the carbon nanomaterial in the contact portion. parts.
The electrical connection component according to claim 5, wherein the protective plating layer contains a metal element nobler than the metal element contained in the first plating layer in the contact portion.
The first plating layer in the contact portion contains Ni or a Ni-P alloy;
The electrical connection component according to claim 5 or 6, wherein the protective plating layer contains at least one selected from the group consisting of Sn, Cu, Ag, Au, Pd, Rh, and Ru as a metal element nobler than Ni. .
The electrical connection component according to claim 5, wherein a thickness of the protective plating layer is 0.1 μm or more and 1.0 μm or less.