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WO2018006307A1 - Procédé et système de prétraitement associé à la puissance pour puce électronique - Google Patents

Procédé et système de prétraitement associé à la puissance pour puce électronique Download PDF

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Publication number
WO2018006307A1
WO2018006307A1 PCT/CN2016/089023 CN2016089023W WO2018006307A1 WO 2018006307 A1 WO2018006307 A1 WO 2018006307A1 CN 2016089023 W CN2016089023 W CN 2016089023W WO 2018006307 A1 WO2018006307 A1 WO 2018006307A1
Authority
WO
WIPO (PCT)
Prior art keywords
power
electronic chip
rate
processing
change
Prior art date
Application number
PCT/CN2016/089023
Other languages
English (en)
Chinese (zh)
Inventor
张升泽
Original Assignee
张升泽
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 张升泽 filed Critical 张升泽
Priority to PCT/CN2016/089023 priority Critical patent/WO2018006307A1/fr
Publication of WO2018006307A1 publication Critical patent/WO2018006307A1/fr

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]

Definitions

  • the present invention relates to the field of electronics and chips, and in particular, to a power pre-processing method and system for an electronic chip.
  • Chip English is Chip; Chipset is Chipset.
  • the chip generally refers to the carrier of the integrated circuit, and is also the result of the integrated circuit after being designed, manufactured, packaged, and tested. It is usually an independent whole that can be used immediately.
  • the words "chip” and "integrated circuit” are often mixed. For example, in the common discussion topic, integrated circuit design and chip design say that the chip industry, the integrated circuit industry, and the IC industry are often also meanings. . In fact, these two words are related and different.
  • Integrated circuit entities often exist in the form of chips, because narrowly defined integrated circuits emphasize the circuit itself, such as a phase-shifted oscillator that is simply connected with only five components. When it is still on the drawing, we It can also be called an integrated circuit.
  • this small integrated circuit When we want to use this small integrated circuit for application, it must be a separate piece of real object, or embedded in a larger integrated circuit, relying on the chip to play its role; Focusing on the design and layout of the circuit, the chip emphasizes the integration, production and packaging of the circuit.
  • the generalized integrated circuit when it comes to the industry (different from other industries), can also contain various meanings related to the chip.
  • the chip also has its own unique place. In a broad sense, as long as it is a semiconductor wafer manufactured by microfabrication, it can be called a chip, and there is no circuit inside.
  • a semiconductor light source chip for example, a mechanical chip such as a MEMS gyroscope; or a biochip such as a DNA chip.
  • the intersection of the chip and the integrated circuit is on the "circuit on the silicon wafer.”
  • the chipset is a series of interrelated chipsets that are interdependent and can play a bigger role, such as the processor inside the computer and the North-South Bridge chipset, the RF, baseband and power management chipset in the phone. .
  • a power pre-processing method for an electronic chip which solves the shortcomings of the prior art that the rate of change of the ventilation management power cannot be pre-processed.
  • a power preprocessing method for an electronic chip comprising the following steps:
  • the preprocessing mode of the power is adjusted according to the power change rate.
  • the method further includes:
  • the power is adjusted according to the power change rate.
  • the method further includes:
  • the power is compensated or reduced according to the rate of change of power.
  • a power pre-processing system for an electronic chip comprising:
  • a power sampling unit for sampling power data of the electronic chip
  • An analyzing unit configured to perform analysis processing on the sampled data to obtain a rate of change of the power
  • a pre-processing unit configured to adjust a pre-processing manner of the power according to the power change rate.
  • system further includes:
  • the adjusting unit is configured to adjust the power according to the power change rate.
  • system further includes:
  • a repairing unit for compensating or reducing the power according to a power change rate is provided.
  • the technical solution provided by the specific embodiment of the present invention samples the power data of the electronic chip, analyzes the sampled data to obtain a rate of change of the power, and adjusts the preprocessing mode of the power according to the power change rate, so that the power consumption is performed.
  • FIG. 1 is a flow chart of a method for preprocessing power of an electronic chip according to the present invention
  • FIG. 2 is a structural diagram of a power pre-processing system for an electronic chip according to the present invention.
  • FIG. 1 is a flowchart of a power pre-processing method for an electronic chip according to a first preferred embodiment of the present invention.
  • the method is implemented by an intelligent terminal.
  • the method is as shown in FIG. 1 and includes the following steps:
  • Step S101 sampling power data of the electronic chip
  • Step S102 performing analysis processing on the sampled data to obtain a rate of change of the power
  • Step S103 Adjust a preprocessing manner of the power according to the power change rate.
  • the technical solution provided by the specific embodiment of the present invention samples the power data of the electronic chip, analyzes the sampled data to obtain a rate of change of the power, and adjusts the preprocessing mode of the power according to the power change rate, so that the power consumption is performed.
  • the foregoing method may further include:
  • the power is adjusted according to the power change rate.
  • the foregoing method may further include:
  • the power is compensated or reduced according to the rate of change of power.
  • FIG. 2 is a power preprocessing system for an electronic chip according to a second preferred embodiment of the present invention.
  • the system includes:
  • the power sampling unit 201 is configured to sample power data of the electronic chip
  • the analyzing unit 202 is configured to perform analysis processing on the sampled data to obtain a rate of change of the power
  • the pre-processing unit 203 is configured to adjust a pre-processing manner of the power according to the power change rate.
  • the technical solution provided by the specific embodiment of the present invention samples the power data of the electronic chip, analyzes the sampled data to obtain a rate of change of the power, and adjusts the preprocessing mode of the power according to the power change rate, so that the power consumption is performed.
  • the above system may further include:
  • the adjusting unit 204 is configured to adjust the power according to the power change rate.
  • the above system may further include:
  • the repairing unit 205 is configured to compensate or reduce the power according to the power change rate.
  • Computer readable media includes both computer storage media and communication media including any medium that facilitates transfer of a computer program from one location to another.
  • a storage medium may be any available media that can be accessed by a computer.
  • the computer readable medium may include random access memory (Random) Access Memory, RAM), Read-Only Memory (ROM), Electrically Erasable Programmable Read Only Memory (Electrically Erasable Programmable Read-Only Memory, EEPROM), Compact Disc Read-Only Memory, CD-ROM, or other optical disc storage, magnetic storage medium or other magnetic storage device, or any other medium that can be used to carry or store desired program code in the form of instructions or data structures and that can be accessed by a computer. Also. Any connection may suitably be a computer readable medium.
  • a disk and a disc include a compact disc (CD), a laser disc, a compact disc, a digital versatile disc (DVD), a floppy disk, and a Blu-ray disc, wherein the disc is usually magnetically copied, and the disc is The laser is used to optically replicate the data. Combinations of the above should also be included within the scope of the computer readable media.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Evolutionary Computation (AREA)
  • Geometry (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Power Sources (AREA)

Abstract

L'invention concerne un procédé et un système de prétraitement associé à la puissance pour une puce électronique. Le procédé comprend les étapes suivantes : échantillonner des données de puissance d'une puce électronique (101) ; analyser et traiter les données d'échantillonnage pour obtenir un taux de variation de la puissance (102) ; et adapter, en fonction du taux de variation de puissance, une méthode de prétraitement (103). La solution technique de la présente invention présente l'avantage d'effectuer le prétraitement en fonction d'une puissance.
PCT/CN2016/089023 2016-07-07 2016-07-07 Procédé et système de prétraitement associé à la puissance pour puce électronique WO2018006307A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/CN2016/089023 WO2018006307A1 (fr) 2016-07-07 2016-07-07 Procédé et système de prétraitement associé à la puissance pour puce électronique

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2016/089023 WO2018006307A1 (fr) 2016-07-07 2016-07-07 Procédé et système de prétraitement associé à la puissance pour puce électronique

Publications (1)

Publication Number Publication Date
WO2018006307A1 true WO2018006307A1 (fr) 2018-01-11

Family

ID=60901485

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2016/089023 WO2018006307A1 (fr) 2016-07-07 2016-07-07 Procédé et système de prétraitement associé à la puissance pour puce électronique

Country Status (1)

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WO (1) WO2018006307A1 (fr)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201332378Y (zh) * 2008-12-30 2009-10-21 上海发电设备成套设计研究院 一种功率柜调节板
EP2402835A2 (fr) * 2010-06-30 2012-01-04 Byd Company Limited Dispositif de suivi des points d'alimentation maximum pour système de génération électrique solaire et procédé de suivi correspondant
CN102650889A (zh) * 2011-02-24 2012-08-29 珠海格力节能环保制冷技术研究中心有限公司 太阳能电池板角度控制系统
CN103713685A (zh) * 2012-10-09 2014-04-09 台达电子工业股份有限公司 功率控制电路及其所适用的电源供应系统
CN106202696A (zh) * 2016-07-07 2016-12-07 张升泽 电子芯片的功率预处理方法及系统

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201332378Y (zh) * 2008-12-30 2009-10-21 上海发电设备成套设计研究院 一种功率柜调节板
EP2402835A2 (fr) * 2010-06-30 2012-01-04 Byd Company Limited Dispositif de suivi des points d'alimentation maximum pour système de génération électrique solaire et procédé de suivi correspondant
CN102650889A (zh) * 2011-02-24 2012-08-29 珠海格力节能环保制冷技术研究中心有限公司 太阳能电池板角度控制系统
CN103713685A (zh) * 2012-10-09 2014-04-09 台达电子工业股份有限公司 功率控制电路及其所适用的电源供应系统
CN106202696A (zh) * 2016-07-07 2016-12-07 张升泽 电子芯片的功率预处理方法及系统

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