WO2017131011A1 - Inductor component and manufacturing method therefor - Google Patents

Abstract

The present invention improves the characteristics of an inductor component by lowering the resistance of an inductor electrode. An inductor component 1a comprises a resin layer 3 and an inductor electrode 6, wherein the inductor electrode 6 has upper side wiring boards 8a, 8b that have connection sites 7a, 7b, a lower side wiring board that is in contact with the upper side wiring boards 8a, 8b via the respective connection sites 7a, 7b, and metal pins 9a, 9b. The connection sites 7a, 7b are formed by bending one end section 80a, 80b of each of the upper side wiring boards 8a, 8b. Because, in this case, the inductor electrode 6 is formed from the wiring boards 8a-8c and the metal pins 9a, 9b, all of which have lower resistance values than conductive paste or plating, the resistance of the entire inductor electrode 6 can be lowered, thereby improving the characteristics of the inductor component 1a.

Description

Inductor component and manufacturing method thereof

The present invention relates to an inductor component including a resin layer and an inductor electrode and a manufacturing method thereof.

Conventionally, as shown in FIG. 19, an inductor component 100 in which a coil 102 is provided on a core substrate 101 formed of a printed board or a prepreg is known (see, for example, Patent Document 1).
In this case, an annular magnetic layer 103 is disposed inside the core substrate 101, and the coil 102 is spirally wound around the magnetic layer 103. The coil 102 is arranged along the outer periphery of the magnetic layer 103 so as to form a plurality of inner interlayer connection conductors 102a arranged along the inner periphery of the magnetic layer 103 and a plurality of pairs with these interlayer connection conductors 102a. A plurality of outer interlayer connection conductors 102b, a plurality of upper wiring patterns 102c connecting the upper ends of predetermined inner interlayer connection conductors 102a and outer interlayer connection conductors 102b, respectively, and a predetermined inner interlayer connection conductor 102a and an outer interlayer, respectively. A plurality of lower wiring patterns 102d connecting the lower ends of the connection conductors 102b. Here, each of the interlayer connection conductors 102 a and 102 b is formed of a through-hole conductor in which a conductor film is formed on the inner surface of a through hole that penetrates the core substrate 101. Further, each of the wiring patterns 102c and 102d is formed as a printed pattern using a conductive paste.

Japanese Unexamined Patent Publication No. 2000-40620 (see paragraph 0018, FIG. 1, etc.)

With the recent downsizing and higher functionality of electronic devices, it is required to reduce the size of inductor components. One measure for improving the characteristics of the inductor component is to reduce the resistance value of the inductor electrode (the coil 102 in the above-described inductor component 100). In the conventional inductor component 100, each of the interlayer connection conductors 102a and 102b constituting the coil 102 is formed of a through-hole conductor in which a conductor film is formed on the inner surface of the through hole. Since these interlayer connection conductors 102a and 102b are connected to the respective wiring patterns 102c and 102d by solder or the like, the value of the connection resistance becomes high. Here, if the through-hole is filled with a conductive paste to make a via conductor, the value of connection resistance can be lowered, but generally the conductive paste is formed by mixing a metal filler in an organic solvent or the like, High resistance compared to pure metal. Further, each wiring pattern 102c, 102d is formed by conductive paste or plating, and has a higher resistance value than that of pure metal, so it is difficult to reduce the resistance value of the entire inductor electrode.

The present invention has been made in view of the above-described problems, and an object of the present invention is to improve the characteristics of an inductor component by lowering the resistance value of the entire inductor electrode in an inductor component including a resin layer and an inductor electrode. And

In order to achieve the above-described object, an inductor component of the present invention includes a resin layer having a main surface and an inductor electrode, and the inductor electrode includes a first metal plate disposed inside the resin layer, A second metal plate having a portion overlapping with the first metal plate when viewed from a direction perpendicular to the main surface of the resin layer, and overlapping the first metal plate and the second metal plate. The portion is characterized in that it has a first connection part formed by a part of one of the two metal plates and connected to the other metal plate.

According to this configuration, since the inductor electrode is formed of a metal plate having a resistance value lower than that of the conductive paste or plating, the resistance of the entire inductor electrode can be reduced. (For example, the inductance value) can be improved. Further, since the connection portion formed by a part of the metal plate can be used as the vertical wiring of the inductor, it is possible to form a three-dimensional inductor with an inexpensive configuration. In order to reduce the resistance of the inductor electrode, a method of forming the inductor electrode using a metal plate for wiring and a metal pin is also conceivable, but in this case, impedance mismatch between the metal plate and the metal pin is considered. Therefore, there is a problem that signal loss occurs. However, according to the above-described configuration, since the inductor electrode is configured only by the metal plate, impedance mismatch can be suppressed.

Further, the first connection portion may be formed by bending an end portion of the one metal plate into an L shape when viewed from a direction parallel to the main surface of the resin layer. In this case, a specific configuration of the first connection site can be provided.

In addition, the first connection part may be formed by bending the part of the one metal plate with a concave cross-sectional shape toward the other metal plate. In this case, a specific configuration of the first connection site can be provided.

Further, the first connection part may be a part in which the one metal plate is thickened toward the other metal plate. In this case, a specific configuration of the first connection site can be provided.

Further, the first connection portion may be a recess of the part of the one metal plate. In this case, a specific configuration of the first connection site can be provided.

The circuit board further includes a wiring board whose one main surface is in contact with the main surface of the resin layer, and a component mounted on the one main surface of the wiring board and sealed by the resin layer, , Disposed inside the resin layer, having one end connected to one of the first metal plate and the second metal plate, and the other end exposed to the main surface of the resin layer. You may have further the metal pin connected to a board | substrate.

According to this configuration, for example, when an external electrode is formed on the back surface opposite to the main surface of the wiring board and the inductor component is mounted on the mother substrate, the component can be placed near the mother substrate, so the component generates heat. The heat dissipation in the case can be improved. Further, by disposing the component between the main surface of the wiring board and the inductor electrode, it is possible to reduce the size of the inductor component.

In addition, the inductor electrode is disposed at substantially the same position as the first metal plate in a direction perpendicular to the main surface of the resin layer, and has a portion overlapping the second metal plate at a location different from the overlapping portion. 3 metal plates, wherein the second metal plate and the overlapping portion of the third metal plate are formed by a part of one metal plate of the second metal plate and the third metal plate, and the other The inductor electrode may form a coil having a winding axis in a direction substantially parallel to the main surface of the resin layer.

According to this configuration, a three-dimensional coil extending in both the main surface direction and the thickness direction of the resin layer can be formed. Also, a component can be disposed between the main surface of the wiring board and the inductor electrode, and the inductor component can be easily downsized.

Further, at least one of the first metal plate and the second metal plate is such that a part of the edge reaches the periphery of the resin layer when viewed from a direction perpendicular to the one main surface of the resin layer. It may be formed.

According to this configuration, since the metal part of the inductor component increases, the heat dissipation of the inductor component can be improved. In addition, when a part of the edge of the second metal plate reaches the periphery of the resin layer, the portion of the second metal plate is exposed from the resin layer, so that heat accumulated in the resin layer is dissipated. It becomes easy.

Further, a coil core disposed between the first connection part and the second connection part and between the first metal plate and the second metal plate may be provided. According to this configuration, the inductance value of the inductor electrode can be effectively increased.

The coil core is composed of an annular portion and a rod-like portion provided so as to bisect the inner region of the annular portion when viewed from a direction perpendicular to the one main surface of the resin layer. The rod-shaped portion is disposed between the first connection portion and the second connection portion, and the axial direction of the rod-shaped portion is substantially the same as the winding axis of the coil. You may arrange | position so that it may become a parallel direction.

According to this configuration, since the coil core is disposed along the path of the magnetic flux lines generated when the inductor electrode (coil) is energized, the characteristics of the inductor electrode (for example, the inductance value) can be improved.

In addition, the method for manufacturing an inductor component according to the present invention includes a first structure in which a connection portion is formed on one surface of the first metal plate by processing the first metal plate supported by the flat frame. And connecting one surface of the second metal plate supported by the flat frame to the tip of the connecting portion, and a metal pin on the surface of the first metal plate facing the second metal plate. By connecting one end, a step of forming a second structure in which an inductor electrode having the first metal plate, the second metal plate and the metal pin is formed, and a component is mounted on one main surface By connecting the other end of the metal pin to the one main surface of the wiring board, a third structure in which components are arranged between the one main surface of the wiring board and the second metal plate Forming and sealing the third structure with a resin The step of forming the fourth structure having the third structure and the resin layer, the flat plate frame of the first metal plate, and the flat plate frame of the second metal plate are removed. And a step of processing the fourth structure.

According to this configuration, an inductor electrode having a resistance value lower than that of an inductor electrode formed by conductive paste or plating can be manufactured. Moreover, since it is not necessary to form a via in the resin layer, the manufacturing cost can be reduced. In addition, since both the first metal plate and the second metal plate are supported by the flat frame, it is necessary to use the main surface of the resin layer for the formation thereof, like a wiring pattern formed by a conventional conductive paste. Absent. Therefore, since the third structure can be formed before the resin layer is formed, the manufacturing cost of the inductor component can be reduced. In addition, since the plating or printing process is not required to form the inductor electrode as in the prior art, the manufacturing cost of the inductor component can be further reduced and the manufacturing time can be reduced. Further, by processing the fourth structure so as to remove the flat frame of the first metal plate and the flat frame of the second metal plate, when viewed from a direction perpendicular to the main surface of the resin layer Since the end edges of the first and second metal plates reach the periphery of the resin layer, an inductor component with excellent heat dissipation can be manufactured.

The inductor component according to the present invention includes a wiring board, a component mounted on one main surface of the wiring substrate, a resin layer laminated on the one main surface of the wiring substrate, and covering the component, and the resin A coil core disposed inside a layer and having a portion overlapping with the component when viewed from a direction perpendicular to the one main surface of the wiring board; and an inductor electrode around which the coil core is wound, the inductor electrode Has a first metal plate and a second metal plate arranged in the resin layer so that at least a part thereof overlaps the coil core when viewed from a direction perpendicular to the one main surface of the wiring board. The first metal plate has a first bent portion that is partly bent toward the other main surface of the wiring board and disposed inside the resin layer, and the second metal plate is Part of the wiring board A second bent portion that is bent toward the main surface and disposed inside the resin layer, and a tip portion of the first bent portion and a tip portion of the second bent portion are electrically connected; Also good.

According to this configuration, the inductor electrode (coil) can be easily formed by electrically connecting the metal plates. Moreover, since the coil diameter can be increased, the inductor characteristics are improved. Furthermore, since the tip portions of both bent portions can be exposed to the other main surface side of the mounting substrate, the heat dissipation characteristics of the coil can be improved by joining the exposed tip portions to the mother substrate.

Further, the tip portion of the first bent portion and the tip portion of the second bent portion may be connected via a wiring electrode provided on the wiring board. According to this configuration, the inductor electrode can be easily formed by using both the metal plates and the wiring electrodes provided on the wiring board.

The wiring electrode is provided inside the wiring board, the tip portion of the first bent portion and one end of the wiring electrode are connected by a first via conductor, and the tip portion of the second bent portion and the tip The other end of the wiring electrode may be connected by a second via conductor. According to this configuration, the inductor electrode can be easily formed by electrically connecting both the metal plates and the wiring board provided inside the wiring board through the vias.

Further, the tip portion of the first bent portion and the tip portion of the second bent portion may be directly connected. According to this structure, it is possible to form an inductor electrode only with a metal plate.

According to the present invention, since the inductor electrode is formed of a metal plate having a resistance value lower than that of the conductive paste or plating, the resistance value of the entire inductor electrode can be lowered. Thereby, the characteristic (for example, inductance value) of an inductor component can be improved.

It is a figure which shows the inductor components concerning 1st Embodiment of this invention. It is a top view of the wiring board in the state supported by the frame. It is a figure for demonstrating the manufacturing method of the inductor components of FIG. It is a figure which shows the modification of the wiring board of FIG. It is a figure which shows the inductor components concerning 2nd Embodiment of this invention. It is a top view of the wiring board in the state supported by the frame. It is a figure for demonstrating the manufacturing method of the inductor components of FIG. It is a figure which shows the modification of the wiring board of FIG. It is a figure which shows the inductor components concerning 3rd Embodiment of this invention. It is a figure which shows the modification of the wiring board of FIG. It is a figure which shows the inductor components concerning 4th Embodiment of this invention. It is a figure which shows the inductor components concerning 5th Embodiment of this invention. It is a figure which shows the inductor components concerning 6th Embodiment of this invention. It is a figure of the wiring board of the state supported by the frame. It is a figure for demonstrating the manufacturing method of the inductor components of FIG. It is a figure which shows the modification of the bending part of FIG. It is a figure which shows the inductor components concerning 7th Embodiment of this invention. It is a figure which shows the inductor components concerning 8th Embodiment of this invention. It is a perspective view of the conventional inductor component.

<First Embodiment>
An inductor component according to a first embodiment of the present invention will be described with reference to FIG. FIG. 1A is a view of the inductor component viewed from a direction parallel to the main surface of the wiring board, and a part of the resin layer is not shown so that the internal structure can be seen. FIG. 1B is a plan view of the inductor component showing the wiring structure of the inductor electrode.

(Configuration of inductor parts)
The inductor component 1a of this embodiment includes a wiring substrate 2, a resin layer 3 laminated on the upper surface 2a of the wiring substrate 2, a plurality of components 4 mounted on the upper surface 2a of the wiring substrate 2, and the interior of the resin layer 3. The coil core 5 and the inductor electrode 6 are mounted on a mother board of an electronic device such as a portable terminal device.

The wiring substrate 2 is, for example, a glass epoxy resin substrate or a ceramic substrate, and via conductors and various wiring electrodes are formed therein. Further, on the upper surface 2a, connection electrodes (not shown) for connecting to each component 4 and metal pins 9a and 9b described later are formed. The wiring board 2 may have either a single layer structure or a multilayer structure.

The component 4 is composed of, for example, a semiconductor element formed of Si or the like, a chip capacitor, a chip inductor, a chip resistor, or the like.

The resin layer 3 is provided so that wiring boards 8a to 8c, which will be described later, are disposed therein, and the lower surface 3a (corresponding to “the main surface of the resin layer” of the present invention) is in contact with the upper surface 2a of the wiring substrate 2. It is done. In addition, the resin layer 3 and the wiring board 2 of this embodiment are formed in a horizontally long rectangular shape when viewed from a direction perpendicular to the lower surface 3a of the resin layer 3 (hereinafter sometimes referred to as a plan view). (See FIG. 1B). The resin layer 3 can be formed of various materials generally used as a sealing resin such as an epoxy resin.

The coil core 5 is made of a magnetic material that is employed as a general coil core such as Ni-Zn ferrite. In addition, as shown in FIG. 1B, the coil core 5 of this embodiment includes an annular portion 5a and a rod-like portion 5b provided so as to divide the inner region of the annular portion 5a into two equal parts in a plan view. Have When the coil core is low in insulation like Mn—Zn ferrite, the upper and lower surfaces of the coil core may be covered with the insulating film 10.

The inductor electrode 6 has two upper wiring boards 8a and 8b, one lower wiring board 8c, and two metal pins 9a and 9b forming input / output terminals. The upper wiring boards 8a and 8b and the lower wiring board 8c are connected via the connection portions 7a and 7b formed by each part, and a coil is formed that winds around the rod-shaped portion 5b of the coil core 5. Yes. At this time, on the upper wiring boards 8a and 8b, connection portions 7a and 7b formed by bending one end portions 80a and 80b (see FIG. 2A) toward the lower wiring board 8c are formed. The lower surfaces 70a, 70b of the connection parts 7a, 7b and the lower wiring board 8c are joined by, for example, solder, so that the upper wiring board 8a, the lower wiring board 8c, and the upper wiring board 8b The side wiring boards 8c are electrically connected to each other. That is, both connection parts 7a and 7b are formed by bending the dotted line portions (see FIG. 2A) of one end portions 80a and 80b of the upper wiring boards 8a and 8b. Further, the upper ends of the two metal pins 9 a and 9 b are both connected to the upper wiring boards 8 a and 8 b, and the lower end surface (corresponding to “the other end of the metal pin” of the present invention) is the lower surface of the resin layer 3. The lower end surfaces of both metal pins 9 a and 9 b are connected to the wiring board 2. One of the metal pins 9 a and 9 b is an outer region of the annular portion 5 a of the coil core 5 and is disposed in the vicinity of one short side of the resin layer 3, and the other is an outer region of the annular portion 5 a of the coil core 5. In this case, the resin layer 3 is disposed in the vicinity of the other short side. Both metal pins 9a and 9b can be formed by, for example, shearing a wire made of a metal such as Cu, Al, or Ag.

Both upper side wiring boards 8a and 8b are formed in a line shape substantially parallel to the longitudinal direction of the horizontally long resin layer 3 as shown in FIG. 1 (b) and FIG. The right end 81a of the upper wiring board 8a is formed so as to reach the peripheral edge 30b (one short side of the horizontally long rectangular shape in plan view) of the resin layer 3. The left end 81b of the upper wiring board 8b is formed so as to reach the peripheral edge 30a of the resin layer 3 (the other short side of the horizontally long rectangular shape in plan view). Both end portions 81 a and 81 b are exposed on the side surface of the resin layer 3. Further, the left end portion 80a of the upper wiring board 8a and the right end portion 80b of the upper wiring board 8b are bent toward the lower wiring board 8c in the dotted line portion of FIG. It is formed. At this time, the connection parts 7a and 7b are L-shaped when viewed from a direction parallel to the lower surface 3a of the resin layer 3 (in other words, in at least one of the cross sections perpendicular to the lower wiring board 8c). The lower surfaces 70a and 70b are in contact with the lower wiring board 8c. Since the lower end portions of the connection parts 7a and 7b are bent and the lower surfaces 70a and 70b are in contact with the lower wiring board 8c, the connection parts and the lower wiring board 8c can be reliably brought into contact with each other. However, the lower surfaces 70a and 70b are not necessarily provided, and the connection portions 7a and 7b are formed in a straight line shape (I shape) when viewed from a direction parallel to the lower surface 3a of the resin layer 3. May be. Further, the end portions 80a and 80b of the upper wiring boards 8a and 8b are respectively provided with support portions 82a having a narrower line width than the central portions of the upper wiring boards 8a and 8b toward the peripheral edges 30a and 30b of the resin layer 3, respectively. 82b is extended and formed. The support portions 82 a and 82 b are formed integrally with the upper wiring boards 8 a and 8 b, respectively, and are exposed on the side surfaces of the resin layer 3.

The lower wiring board 8c is disposed inside the resin layer 3 so as to have portions overlapping with the upper wiring boards 8a and 8b when viewed from a direction perpendicular to the lower surface 3a of the resin layer 3. As shown in FIG. 1B, the lower wiring board 8c is formed in a line shape substantially parallel to the longitudinal direction of the horizontally-long rectangular resin layer 3, and is connected to the lower surfaces of the connection portions 7a and 7b. Further, the lower wiring board 8c is formed at both ends thereof with support portions 82c similar to the support portions 82a and 82b of the upper wiring boards 8a and 8b. Each of the support portions 82 c is formed so as to reach the peripheral edges 30 a and 30 b of the resin layer 3, and the support portions 82 c are exposed on the side surfaces of the resin layer 3. Further, like the support portions 82a and 82b of the upper wiring boards 8a and 8b, the support portion 82c has a line width narrower than that of the central portion of the lower wiring board 8c.

Also, as described above, the lower end surfaces of the two metal pins 9a and 9b are connected to connection electrodes (not shown) on the upper surface 2a of the wiring board 2. With such a connection configuration, the inductor electrode 6 that is wound around the rod-shaped portion 5b of the coil core 5 is formed using both the metal pins 9a and 9b as input / output terminals. In this case, the axial direction (length direction) of the rod-like portion 5 b is substantially parallel to the winding axis of the inductor electrode 6. Here, the two upper wiring boards 8a and 8b correspond to the “first metal plate” and the “third metal board” of the present invention, and the one lower wiring board 8c of the present invention “the second metal plate”. Is equivalent to.

By the way, when a coil pattern is formed in a plane on the upper surface 2a of the wiring board 2, the winding axis of the coil is in a direction perpendicular to the upper surface 2a of the wiring board 2. On the other hand, in the case of this embodiment, the winding structure of the coil (inductor electrode 6) is parallel to the upper surface 2a of the wiring board 2 by making the wiring structure of the inductor electrode 6 three-dimensional. With this structure, the magnetic flux lines are not blocked by the electrodes of the mounted components, and the inductor characteristics are improved.

As shown in FIG. 1A, an insulating film 10 made of an insulating material such as epoxy resin, polyimide, or silicon resin may be disposed between the coil core 5 and the wiring boards 8a to 8c. In this way, since the insulation between the coil core 5 and the inductor electrode 6 can be ensured, the characteristics of the inductor electrode 6 can be stabilized.

(Manufacturing method of inductor parts)
Next, a method for manufacturing the inductor component 1a will be described with reference to FIGS. 2 is a plan view of the wiring boards 8a to 8c supported by the frame, and FIG. 3 is a diagram for explaining a method of manufacturing the inductor component 1a.

First, each wiring board 8a to 8c is prepared. For example, the two upper wiring boards 8a and 8b can be formed by etching one metal plate made of Cu or the like. At this time, the regions of the frame 11a and the upper wiring boards 8a and 8b are left and removed by etching, and the ends 81a and 81b of the upper wiring boards 8a and 8b are supported by the frame 11a. A first etching plate 12a is formed in which the end portions 80a and 80b of the plates 8a and 8b are supported by the frame 11a via the support portions 82a and 82b. In addition, cuts are formed in the end portions 80a and 80b of the upper wiring boards 8a and 8b in order to be bent later. Similarly, the lower wiring board 8c forms the second etching plate 12b in a state where the lower wiring board 8c and the support portion 82c are supported by the frame 11b. The formation of the wiring boards 8a to 8c is not limited to etching, and various methods such as punching can be used.

Next, as shown in FIG. 3A, the end portions 80a and 80b of the upper wiring boards 8a and 8b of the first etching plate 12a are bent to form connection portions 7a and 7b. For forming the connection parts 7a and 7b, for example, both the upper wiring boards 8a and 8b are fixed with a jig or the like, and a mold material is arranged at a predetermined position of each end 80a and 80b of the both upper wiring boards 8a and 8b. There is a method of bending the end portions 80a and 80b into a predetermined shape by applying. FIG. 3A corresponds to the “first structure” of the present invention.

Next, as shown in FIG. 3B, the coil core 5 in which the insulating film 10 is disposed on the upper surface and the lower surface is disposed on the first structure. At this time, the rod-shaped part 5b of the coil core 5 is disposed between the connection parts 7a and 7b.

Next, as shown in FIG. 3C, the lower surfaces 70a and 70b of the connection portions 7a and 7b are joined to one surface of the lower wiring board 8c of the second etching plate 12b. The second etching plate and the lower surfaces 70a and 70b can be joined by, for example, solder. It is also possible to bond using a bonding material other than solder or ultrasonic waves. The surfaces of the etching plates 12a and 12b may be subjected to surface treatment with Ni / Au plating, Zn, Cr, or the like in order to facilitate bonding.

Next, as shown in FIG. 3D, the upper end surfaces of the metal pins 9a and 9b (corresponding to “one end of the metal pins” of the present invention) are formed on the first etching plate 12a ( upper wiring boards 8a and 8b). By joining, the inductor electrode 6 is formed (FIG. 3D corresponds to the “second structure” of the present invention). For this connection, a bonding material such as solder bonding, ultrasonic bonding, and conductive adhesive can be used.

Next, as shown in FIG. 3E, after each component 4 is mounted on the upper surface 2a of the wiring board 2 using a known surface mounting technique, the lower end surfaces of both metal pins 9a and 9b are mounted on the upper surface 2a. The connection is made (FIG. 3E corresponds to the “third structure” of the present invention). In this case, each component 4 is arranged between the second etching plate 12 b and the upper surface 2 a of the wiring board 2.

Next, as shown in FIG. 3F, the wiring board 2 on which each component 4 is mounted and the inductor electrode 6 are covered with an epoxy resin to form the resin layer 3. (FIG. 3F corresponds to the “fourth structure” of the present invention). For the formation of the resin layer 3, for example, a mold method or a dispense method can be used.

Next, as shown in FIG. 3G, the frame 11a of the first etching plate 12a (see FIG. 2A) and the frame 11b of the second etching plate 12b (see FIG. 2B) are removed. Thus, the inductor component 1a is completed. For example, dicing or laser processing can be used to remove the frames 11a and 11b.

Therefore, according to the above-described embodiment, the inductor electrode 6 is formed by the wiring boards 8a to 8c and the metal pins 9a and 9b each having a resistance value lower than that of the conductive paste or plating. The resistance (inductance value, for example) of the inductor component 1a can be improved.

Further, for example, it is conceivable to form the inductor electrode 6 using a metal pin in a direction perpendicular to the main surface of the resin layer 3 and a metal plate in a direction parallel to the main surface. In this case, since the resistance value of the metal pin is low, the resistance value of the inductor electrode 6 as a whole can be lowered. However, impedance mismatch occurs due to the difference in resistance value between the metal pin and the metal plate. According to the above-described embodiment, all parts except the input / output terminals formed by the metal pins 9a and 9b are formed by the wiring boards 8a to 8c, so that the metal pins are used for the connection portions 7a and 7b. In comparison, impedance mismatch can be suppressed.

Further, by adjusting the lengths of both metal pins 9a and 9b and forming a space below the lower wiring board 8c, for example, it is used as a region where the inductor electrode 6 is formed in the region on the upper surface side of the resin layer 3. Further, the degree of freedom in design inside the resin layer 3 can be improved, for example, the region on the lower surface side of the resin layer 3 can be a component placement region. Further, by disposing each component 4 between the upper surface 2a of the wiring board 2 and the lower wiring board 8c, the inductor component 1a can be reduced in size. For example, when the coil is formed only with the wiring electrode formed on the upper surface 2a of the wiring board 2, it is difficult to reduce the area of the upper surface 2a of the wiring board 2, but the inductor electrode 6 is formed in a three-dimensional manner. By forming the wiring structure, the area of the upper surface 2a of the wiring board 2 can be easily reduced. In this case, since the wiring board 2 having a heat dissipation characteristic superior to that of the resin layer 3 is disposed between each component 4 and the mother board, the inductor component 1a having an excellent heat dissipation characteristic can be provided.

In addition, since each of the wiring boards 8a to 8c is formed so that both ends thereof reach the periphery of the resin layer 3, each wiring board 8a to 8c is formed only at a portion necessary for forming the inductor electrode 6. Compared with the case where it forms, the metal part in the inductor component 1a can be increased, and thereby the heat dissipation of the inductor component 1a can be improved.

In addition, since the potential difference between the metal pins 9a and 9b forming the input / output terminals of the inductor electrode 6 increases, there is a concern about deterioration of the characteristics of the inductor electrode 6 due to stray capacitance. Then, since both the metal pins 9a and 9b are arranged apart from each other, stray capacitance can be suppressed. Because of the pin shape, the facing area between the pins can be reduced, and stray capacitance can be further suppressed.

In this embodiment, the coil core 5 has an annular portion 5a and a rod-shaped portion 5b, and the inductor electrode 6 is spirally wound along the length direction of the rod-shaped portion 5b. If it does in this way, since the coil core 5 will be arrange | positioned in the magnetic flux path through which the magnetic flux generated at the time of electricity supply of the inductor electrode 6 passes, the inductance value of the inductor electrode 6 can be increased efficiently.

By the way, when trying to manufacture the inductor component 1a of this embodiment using a pattern formed by conductive paste or plating instead of the wiring boards 8a to 8c, each component 4 is mounted on the upper surface 2a of the wiring board 2. Then, each component 4 is sealed with the first resin layer, and a portion corresponding to the city-side wiring board 8c is formed on the surface of the first resin layer with a conductive paste or plating. Thereafter, a coil core, a metal pin, and the like are disposed on the surface of the first resin layer, and after sealing them with the second resin layer, portions corresponding to the upper wiring boards 8a and 8b are formed on the surface of the second resin layer. Will do. In this case, it is necessary to form portions corresponding to the resin layer and the wiring board in two portions. On the other hand, according to this embodiment, since the inductor component 1a is manufactured using the two etching plates 12a and 12b and both the metal pins 9a and 9b, the formation of the resin layer 3 can be reduced to one time. The manufacturing cost of the inductor component 1a can be reduced. Further, since the conventional printing process and plating process for forming the wiring portion are not required, the manufacturing cost of the inductor component 1a can be further reduced.

(Modification of wiring board)
In the embodiment described above, the portion of the lower wiring board 8c where the support portion 82c is formed is thinner than the portion where the inductor electrode 6 is formed. However, as shown in FIG. The support portion 82c of 8c may have the same width as the central portion of the lower wiring board 8c. Moreover, as shown in FIG.4 (b), the upper side wiring boards 8a and 8b may have two support parts 82a, 83a, 82b, and 83b, respectively. As shown in FIG. 4C, the support portion 82c of the lower wiring board 8c is formed to have the same width as the central portion of the lower wiring board 8c, and the support portions 82a and 82b of the upper wiring boards 8a and 8b. May have the same width as the central portion of the upper wiring boards 8a, 8b. In the case of the above-described modification, the metal part in the inductor component 1a can be increased, so that the heat dissipation of the inductor component 1a can be improved. Furthermore, in this embodiment, although the example which provided the bending part in the upper side wiring board was shown, you may provide a bending part in a lower side wiring board in this invention.

Second Embodiment
An inductor component according to a second embodiment of the present invention will be described with reference to FIG. FIG. 5A is a view of the inductor component viewed from a direction parallel to the main surface of the wiring board, and a part of the resin layer is not shown so that the internal structure can be seen. FIG. 5B is a plan view of the inductor component showing the wiring structure of the inductor electrode.

The difference between the inductor component 1b of this embodiment and the inductor component 1a of the first embodiment described with reference to FIG. 1 is that the connecting portions 7a and 7b have a concave cross-sectional shape as shown in FIG. It is bent. Since other configurations are the same as those of the inductor component 1a of the first embodiment, the description thereof is omitted by giving the same reference numerals.

In this case, as shown in FIG. 5 (a), the connection sites 7a and 7b formed on the upper wiring boards 8a and 8b have a concave cross-sectional shape when viewed from a plane parallel to the main surface of the resin layer 3. (The direction perpendicular to the lower surface 3a of the resin layer 3 and the cross-section in the length direction of the upper wiring boards 8a and 8b) is bent and the lower surfaces 70a and 70b of the connection parts 7a and 7b are on the lower side. Each of the upper wiring boards 8a and 8b and the lower wiring board 8c are electrically connected by being in contact with the wiring board 8c. Further, as shown in FIG. 5B, the support portions 82a and 82b of the upper wiring boards 8a and 8b are formed so as to reach the peripheral edges 30a and 30b of the resin layer 3, respectively, and the width of the support portions 82a and 82b. Is formed with the same width as the central portion of the upper wiring boards 8a, 8b. The support portion 82c of the lower wiring board 8c is also formed with the same width as the central portion of the lower wiring board 8c.

(Manufacturing method of inductor parts)
Next, a method for manufacturing the inductor component 1b will be described with reference to FIGS. 6 is a plan view of the wiring boards 8a to 8c supported by the frame, and FIG. 7 is a diagram for explaining a method of manufacturing the inductor component 1b.

First, as shown in FIG. 6, wiring boards 8a to 8c are prepared. Each of the wiring boards 8a to 8c can be formed, for example, by etching a single metal plate made of Cu or the like, and the two upper wiring boards 8a and 8b. At this time, the regions of the frame 11a and the upper wiring boards 8a and 8b are left and removed by etching to form the first etching plate 12a. Similarly, the lower wiring board 8c forms the second etching plate 12b in a state where both ends of the lower wiring board 8c are supported by the frame 11b. At this time, since the first etching plate 12a is bent to form the connection portions 7a and 7b later, the first etching plate 12a is preferably formed larger than the second etching plate in consideration of the bent portion.

Next, as shown in FIG. 7A, bending portions are applied to predetermined positions of the upper wiring boards 8a and 8b of the first etching plate 12a and arbitrary portions of the frame portion to form connection portions 7a and 7b. . The connection parts 7a and 7b can be formed by, for example, pressing or bending the molds at predetermined positions on the upper wiring boards 8a and 8b. FIG. 7A corresponds to the “first structure” of the present invention.

Next, as shown in FIG. 7B, the coil core 5 in which the insulating film 10 is disposed on the upper surface and the lower surface is disposed on the first structure. At this time, the rod-shaped part 5b of the coil core 5 is located between the connection parts 7a and 7b.

Next, as shown in FIG. 7C, the lower surfaces 70a and 70b of the connection portions 7a and 7b are joined to one surface of the lower wiring board 8c of the second etching plate 12b. The second etching plate 12b and the lower surfaces 70a and 70b can be joined by solder. It is also possible to bond using a bonding material other than solder or ultrasonic waves. The surfaces of the etching plates 12a and 12b may be subjected to surface treatment with Ni / Au plating, Zn, Cr, or the like in order to facilitate bonding.

Next, as shown in FIG. 7 (d), upper end surfaces of both metal pins 9a and 9b (corresponding to "one end of metal pin" of the present invention) so as to be located in the outer region of the annular portion 5a of the coil core 5. Is joined to the first etching plate 12a ( upper wiring boards 8a and 8b) to form the inductor electrode 6 (FIG. 3D corresponds to the “second structure” of the present invention). For this connection, a bonding material such as solder bonding, ultrasonic bonding, and conductive adhesive can be used.

Next, as shown in FIG. 7E, after mounting each component 4 on the upper surface 2a of the wiring board 2 using a known surface mounting technique, the lower end surfaces of both metal pins 9a and 9b are mounted on the upper surface 2a. The connection is made (FIG. 7E corresponds to the “third structure” of the present invention). In this case, each component 4 is arranged between the second etching plate 12 b and the upper surface 2 a of the wiring board 2.

Next, as shown in FIG. 7F, the wiring board 2 on which each component 4 is mounted and the inductor electrode 6 are covered with an epoxy resin to form the resin layer 3. (FIG. 7F corresponds to the “fourth structure” of the present invention). For the formation of the resin layer 3, for example, a mold method or a dispense method can be used.

Next, as shown in FIG. 7G, the frame 11a of the first etching plate 12a (see FIG. 6A) and the frame 11b of the second etching plate 12b (see FIG. 6B) are removed. Thus, the inductor component 1b is completed. For example, dicing or laser processing can be used to remove the frames 11a and 11b.

According to the above-described embodiment, the same effect as that of the first embodiment can be obtained.

(Modification of wiring board)
As shown in FIG. 8, the support portions 82a and 82b of the upper wiring boards 8a and 8b and the support portion 82c of the lower wiring board 8c are narrower than the center portion (inductor electrode forming portion) of the wiring boards 8a to 8c. It may be formed.

<Third Embodiment>
An inductor component according to a third embodiment of the present invention will be described with reference to FIG. FIG. 9 is a plan view of the inductor component 1c showing the wiring structure of the inductor electrode.

The difference between the inductor component 1c of this embodiment and the inductor component 1a of the first embodiment described with reference to FIG. 1 is that the shape of the connection parts 7a and 7b is recessed as shown in FIG. That is. Since other configurations are the same as those of the inductor component 1a of the first embodiment, the description thereof is omitted by giving the same reference numerals.

In this case, as shown in FIG. 9, the connection portions 7a and 7b formed on the upper wiring boards 8a and 8b are both recessed in the direction of the lower wiring board 8c. At this time, the cross-sectional shape when viewed from a direction parallel to the lower surface 3a of the resin layer 3 is the same as that shown in FIG. The lower surfaces (not shown) of the connection parts 7a and 7b are in contact with the lower wiring board 8c, so that the upper wiring boards 8a and 8b are electrically connected to the lower wiring board 8c. The connection parts 7a and 7b can be formed, for example, by pressing a member having a mortar-shaped convex portion against a predetermined position of the upper wiring boards 8a and 8b. In addition, the hole may penetrate in the lower surface of the connection parts 7a and 7b.

Therefore, according to the above-described embodiment, the same effect as that of the first embodiment can be obtained.

(Modification of wiring board)
As shown in FIG. 10, the support portions 82a to 82c of the wiring boards 8a to 8c may be formed to have the same width as the central portion of the wiring boards 8a to 8c. In this case, since the metal part in the inductor component 1c can be increased, the heat dissipation of the inductor component 1c can be improved.

<Fourth embodiment>
An inductor component according to a third embodiment of the present invention will be described with reference to FIG. FIG. 11A is a view of the inductor component viewed from a direction parallel to the main surface of the wiring board, and a part of the resin layer is not shown so that the internal structure can be seen. FIG. 11B is a plan view of the inductor component showing the wiring structure of the inductor electrode.

The inductor component 1d of this embodiment differs from the inductor component 1a of the first embodiment described with reference to FIG. 1 in that the connection parts 7a and 7b are connected to the wiring boards 8a and 8b as shown in FIG. It is formed by thickening a part. Since other configurations are the same as those of the inductor component 1a of the first embodiment, the description thereof is omitted by giving the same reference numerals.

In this case, as shown in FIG. 11A, connection portions 7a and 7b formed thicker than the surroundings are formed at predetermined positions of the upper wiring boards 8a and 8b. The connection parts 7a and 7b can be formed by thinning the surrounding metal plate by etching. Since the lower surfaces 70a and 70b of the connection portions 7a and 7b are in contact with the lower wiring board 8c, the upper wiring boards 8a and 8b and the lower wiring board 8c are electrically connected. Further, as shown in FIG. 11B, the support portions 82a to 82c of the wiring boards 8a to 8c are formed so as to reach the peripheral edges 30a and 30b of the resin layer 3, respectively.

Therefore, according to the above-described embodiment, the same effect as that of the first embodiment can be obtained.

<Fifth Embodiment>
An inductor component according to a fifth embodiment of the present invention will be described with reference to FIG. FIG. 12A is a view of the inductor component viewed from a direction parallel to the main surface of the wiring board, and a part of the resin layer is not shown so that the internal structure can be seen. FIG. 12B is a plan view of the inductor component showing the wiring structure of the inductor electrode.

The inductor component 1e of this embodiment differs from the inductor component 1a of the first embodiment described with reference to FIG. 1 in that the arrangement of the wiring boards 8d to 8f and the metal pins 9a, The arrangement of 9b is different. Since other configurations are the same as those of the inductor component 1a of the first embodiment, the description thereof is omitted by giving the same reference numerals.

In this case, the inductor electrode 6 is formed by one upper wiring board 8d and two lower wiring boards 8e and 8f, and the one upper wiring board 8d is the lower side of the first embodiment. Formed in the same shape as the wiring board 8c (see FIG. 1B), the two lower wiring boards 8e and 8f have the same shape as the upper wiring boards 8a and 8b in the first embodiment (see FIG. 1B). See). The two metal pins 9a and 9b constituting the input / output terminals of the inductor electrode 6 connect the upper wiring boards 8a and 8b and the wiring board 2 in the first embodiment, but in this embodiment, The wiring board 2 is connected to the lower wiring boards 8e and 8f which are shorter than those of the first embodiment.

According to this configuration, since the inductor electrode 6 is formed of the metal pins 9a and 9b and the wiring boards 8d and 8f, both of which have a resistance value lower than that of the conductive paste or plating, the resistance of the entire inductor electrode 6 can be reduced. As a result, the characteristics (for example, inductance value) of the inductor component 1e can be improved. Furthermore, the distance between the mother substrate and the coil portion can be shortened, and the resistance can be reduced.

<Sixth Embodiment>
An inductor component according to a sixth embodiment of the present invention will be described with reference to FIG. FIG. 13A is a view of the inductor component as viewed from a direction parallel to the main surface of the wiring board, and a part of the resin layer is not shown so that the internal structure can be seen. FIG. 13B is a bottom view of the inductor component viewed from the lower surface side, and FIG. 13C is a plan view of the inductor component viewed from the upper surface side.

The inductor component 1f of this embodiment differs from the inductor component 1a of the first embodiment described with reference to FIG. 1 in that a wiring board 8g that is a first and second metal plate, as shown in FIG. 8h and the wiring electrode 13 provided on the wiring board 2 constitute the inductor electrode 6. Since other configurations are the same as those of the inductor component 1a of the first embodiment, the description thereof is omitted by giving the same reference numerals.

The inductor component 1 f is provided with a wiring electrode 13 on the lower surface 2 b of the wiring board 2. The inductor electrode 6 includes two wiring boards 8g and 8h, and the first bent portion 7c and the second bent portion 7d formed by a part of each of the wiring boards 8g and 8h are provided on the wiring board 2. By contacting the wiring electrode 13 provided on the lower surface 2b, a coil is formed that winds around the rod-shaped portion 5b of the coil core 5. The two bent portions 7c and 7d have L-shaped ends 80g and 80h (see FIG. 14A) of the wiring boards 8g and 8h when viewed from a direction parallel to the upper surface 2a of the wiring board 2. The bent portions 7c and 7d are electrically connected to the wiring electrode 13 on the lower surface 2b of the wiring board 2 by being bent. At this time, as shown in FIG. 13B, on the surface including the lower surface 2b of the wiring board 2 of the inductor component 1f, the wiring electrode 13 is contacted so that the tip portions 70c and 70d of both bent portions 7c and 7d overlap. Thus, an inductor electrode is formed. As shown in FIG. 13 (c), both wiring boards 8g and 8h are integrally formed with support portions 82g, 84g, 82h and 84h whose line widths are narrower than the center portions of the respective wiring boards 8g and 8h. It is exposed on the side.

(Manufacturing method of inductor parts)
Next, a method for manufacturing the inductor component 1f will be described with reference to FIGS. 14A and 14B are plan views of the wiring boards 8g and 8h supported by the frame, and FIG. 14C is a cross section of the wiring boards 8g and 8h supported by the frame. FIGS. 15A and 15B are diagrams for explaining a method of manufacturing the inductor component 1f.

First, as shown in FIG. 14A, wiring boards 8g and 8h are prepared. The wiring boards 8g and 8h can be formed by etching one metal plate made of Cu or the like. At this time, the frame 11a, the wiring boards 8g and 8h and the support portions 82g, 84g, 82h and 84h are removed by etching, and both the wiring boards 8g and 8h are supported by the support portions 82g, 84g, 82h and 84h, respectively. The etched plate 12c is formed. Further, notches for later bending are formed in the respective end portions 80g and 80h of both wiring boards 8g and 8h (dotted line portions in FIG. 14A). The formation of the wiring boards 8g and 8h is not limited to etching, and various methods such as punching can be used.

Next, as shown in FIGS. 14B and 14C, the end portions 80g and 80h of the wiring boards 8g and 8h of the etching plate 12c are bent to form both bent portions 7c and 7d. To do. For forming both the bent portions 7c and 7d, for example, the wiring boards 8g and 8h are fixed with a jig or the like, and a mold material is arranged at a predetermined position of each end portion 80g and 80h of the both wiring boards 8g and 8h. There is a method of bending the end portions 80g and 80h into a predetermined shape by applying.

Next, as shown in FIGS. 15 (a) and 15 (b), the coil core 5 having the insulating film 10 disposed on the upper surface and the lower surface is disposed on the etching plate 12c formed with both bent portions 7c and 7d. At this time, the rod-shaped portion 5b of the coil core is disposed between the two bent portions 7c and 7d. Next, as shown in FIGS. 15C and 15D, an etching plate 12c on which the coil core 5 is arranged, and a wiring board 2 in which the component 4 is mounted on the upper surface 2a and the wiring electrode 13 is provided on the lower surface 2b. And join. The etching plate 12c and the wiring board 2 can be joined by solder. At this time, the tip portions 70c and 70d of both bent portions 7c and 7d are in contact with the wiring electrode 13, and both the bent portions 7c and 7d are electrically connected via the wiring electrode 13, so that the inductor electrode 6 is Form. The surface of the etching plate 12c may be subjected to surface treatment by Ni / Au plating, Zn, Cr or the like in order to facilitate bonding.

Thereafter, as shown in FIG. 15E, the wiring board 2 and the inductor electrode 6 are covered with a resin such as an epoxy resin to form the resin layer 3. For the formation of the resin layer 3, for example, a mold method or a dispense method can be used. Thereafter, the frame 11a of the etching plate is removed, and dicer cutting or the like is performed as necessary to complete the inductor component 1f.

Therefore, according to the above-described embodiment, the inductor electrode 6 can be easily formed only by the wiring boards 8g and 8h and the wiring electrode 13. In addition, since the inductor electrode 6 having a large coil diameter can be formed, the characteristics (for example, inductance value) of the inductor component 1f can be improved. Moreover, since the front end portions 70c and 70d of both the bent portions 7c and 7d and the wiring electrode 13 are exposed, the heat dissipation characteristics can be improved by bonding to the mother substrate.

(Modified example of bent part)
In the above-described embodiment, both the bent portions 7c and 7d are formed in an L shape when viewed from a direction parallel to the upper surface 2a of the wiring board 2 by further bending the respective tip portions 70c and 70d. The inductor electrode 6 is formed by the tip portions 70c and 70d coming into contact with the lower surface 2b of the wiring board 2, but both bent portions 7c and 7d are formed on the upper surface of the wiring board 2 as shown in FIG. When viewed from a direction parallel to 2a, it may be linear (I-shaped). In this case, both the bent portions 7c and 7d pass through the inside of the wiring board 2 and come into contact with the wiring electrode 13, whereby the inductor electrode 6 is formed. In this case, since the mounting area of the wiring board 2 can be made larger than in the case of the above-described embodiment, more components can be mounted. Note that the wiring electrode 13 may be provided inside the wiring board 2 as shown in FIG.

<Seventh embodiment>
An inductor component according to a seventh embodiment of the present invention will be described with reference to FIG. FIG. 17 is a view of the inductor component viewed from a direction parallel to the main surface of the wiring board, and a part of the resin layer is not shown so that the internal structure can be seen.

The inductor component 1g of this embodiment differs from the inductor component 1a of the first embodiment described with reference to FIG. 1 in that both wiring boards 8g and 8h and the wiring board 2 are provided as shown in FIG. The wiring electrode 13 and the via conductors 14a and 14b constitute an inductor electrode. Since other configurations are the same as those of the inductor component 1a of the first embodiment, the description thereof is omitted by giving the same reference numerals.

In this case, the inductor electrode 6 is formed by electrically connecting both the wiring boards 8g and 8h and the wiring electrode 13 provided inside the wiring board 2 via the via conductors 14a and 14b. That is, on the upper surface 2 a of the wiring board 2, the tip end portion 70 c of the first bent portion 7 c and one end of the wiring electrode 13 are connected by the via conductor 14 a (corresponding to the “first via conductor” of the present invention), and the second bent portion The front end portion 70d of the portion 7d and the other end of the wiring electrode 13 are connected by a via conductor 14b (corresponding to the “second via conductor” of the present invention), so that both the wiring boards 8g and 8h and the wiring electrode 13 are electrically connected. Are connected to each other to form the inductor electrode 6.

According to this configuration, the inductor electrode 6 can be easily formed by electrically connecting the wiring boards 8g and 8h and the wiring electrode 13 via the via conductors 14a and 14b. At this time, since the inductor electrode 6 having a large coil diameter can be formed, the characteristics (for example, inductance value) of the inductor component 1g can be improved.

<Eighth Embodiment>
An inductor component according to an eighth embodiment of the present invention will be described with reference to FIG. FIG. 18A is a view of the inductor component viewed from a direction parallel to the main surface of the wiring board, and a part of the resin layer is not shown so that the internal structure can be seen. FIG. 18B is a plan view of the lower surface of the inductor component.

The inductor component 1h of this embodiment is different from the inductor component 1a of the first embodiment described with reference to FIG. 1 in that both wiring boards 8g and 8h are part of each, as shown in FIG. That is, the inductor electrode is formed only by the two bent portions 7c and 7d. Since other configurations are the same as those of the inductor component 1a of the first embodiment, the description thereof is omitted by giving the same reference numerals.

In this case, the inductor electrode 6 is bent in an L shape when both bent portions 7c and 7d are viewed from a direction parallel to the upper surface 2a of the wiring board 2 when a part of each of the wiring boards 8g and 8h is viewed. The inductor electrode 6 is formed by being formed and contacted and electrically connected in a state where the tip portions 70c and 70d of the bent portions 7c and 7d face each other.

According to this configuration, the inductor electrode 6 can be formed only by the both wiring boards 8g and 8h.

The present invention is not limited to the above-described embodiments, and various modifications other than those described above can be made without departing from the spirit of the invention. For example, in each of the above-described embodiments, the case where the inductor electrode 6 forms a coil has been described, but it may be used as long as it is used as an inductor element. Moreover, the structure without the coil core 5 may be sufficient.

Further, the number of turns of the inductor electrode 6 can be changed as appropriate. In this case, the number of metal pins and wiring boards may be changed according to the number of turns.

Further, the shape of the connection portions 7a and 7b may be, for example, a shape such as a cut-and-raised rib or an annular rib other than the above-described shape.

The present invention can be widely applied to various inductor components in which the inductor electrode includes a resin layer and an inductor electrode.

DESCRIPTION OF SYMBOLS 1a-1g Inductor components 2 Wiring board 3 Resin layer 4 Components 5 Coil core 5a Annular part 5b Bar-shaped part 6 Inductor parts 7a, 7b Connection part (1st connection part, 2nd connection part)
7c, 7d bent portion (first bent portion, second bent portion)
8a, 8b Upper wiring board (first metal plate, third metal plate)
8c Lower wiring board (second metal plate)
8g, 8h Wiring board (first metal plate, second metal plate)
9a, 9b Metal pin 13 Wiring electrode 14a, 14b Via conductor (first via conductor, second via conductor)

Claims (15)

1. A resin layer having a main surface;
   An inductor electrode,
   The inductor electrode is
   A first metal plate disposed inside the resin layer;
   A second metal plate having a portion overlapping with the first metal plate when viewed from a direction perpendicular to the main surface of the resin layer;
   The overlapping portion of the first metal plate and the second metal plate has a first connection part that is formed by a part of one of the two metal plates and connected to the other metal plate. Inductor parts characterized by
2. 2. The first connection portion is obtained by bending an end portion of the one metal plate into an L shape when viewed from a direction parallel to the main surface of the resin layer. Inductor components as described in 1.
3. 2. The inductor component according to claim 1, wherein the first connection part is formed by bending the part of the one metal plate with a concave cross-sectional shape toward the other metal plate.
4. 2. The inductor component according to claim 1, wherein the first connection part is formed by thickening the part of the one metal plate toward the other metal plate.
5. 2. The inductor component according to claim 1, wherein the first connection portion is a recess of the part of the one metal plate.
6. On the other hand, a wiring board whose main surface is in contact with the main surface of the resin layer;
   A component mounted on the one main surface of the wiring board and sealed with the resin layer;
   The inductor electrode is
   The wiring board is disposed inside the resin layer, one end is connected to one of the first metal plate and the second metal plate, and the other end is exposed on the main surface of the resin layer. The inductor component according to claim 1, further comprising a metal pin connected to.
7. The inductor electrode is
   A third metal plate further disposed at substantially the same position as the first metal plate in a direction perpendicular to the main surface of the resin layer, and having a portion overlapping the second metal plate at a location different from the overlapping portion; ,
   The second metal plate is formed by a part of one of the second metal plate and the third metal plate in the overlapping portion of the second metal plate and the third metal plate, and is in contact with the other metal plate. 7. The inductor according to claim 1, wherein the inductor electrode forms a coil having a winding axis in a direction substantially parallel to the main surface of the resin layer. parts.
8. At least one of the first metal plate and the second metal plate is formed such that a part of the edge reaches the periphery of the resin layer when viewed from a direction perpendicular to the one main surface of the resin layer. The inductor component according to claim 1, wherein the inductor component is provided.
9. The coil core disposed between the first connection portion and the second connection portion and between the first metal plate and the second metal plate, according to claim 1, further comprising: a coil core disposed between the first metal plate and the second metal plate. The inductor component according to any one of the above.
10. When the coil core is viewed from a direction perpendicular to the one main surface of the resin layer, an annular portion and a rod-like portion provided so as to bisect the inner region of the annular portion are synthesized. Has a shape like
    The rod-shaped portion is disposed between the first connection portion and the second connection portion, and is disposed so that an axial direction of the rod-shaped portion is substantially parallel to the winding axis of the coil. The inductor component according to claim 9, wherein:
11. Forming a first structure in which a connection part is formed on one surface of the first metal plate by processing the first metal plate supported by the flat frame; and
    By connecting one surface of the second metal plate supported by the flat frame to the tip of the connection portion and connecting one end of the metal pin to the surface of the first metal plate facing the second metal plate. Forming a second structure in which an inductor electrode having the first metal plate, the second metal plate and the metal pin is formed;
    By connecting the other end of the metal pin to the one main surface of the wiring substrate on which the component is mounted on the one main surface, the component is placed between the one main surface of the wiring substrate and the second metal plate. Forming a third structure that is disposed; and
    Forming a fourth structure having the third structure and a resin layer by sealing the third structure with a resin;
    And a step of processing the fourth structure so as to remove the flat plate frame of the first metal plate and the flat plate frame of the second metal plate.
12. A wiring board;
    Components mounted on one main surface of the wiring board;
    A resin layer laminated on the one main surface of the wiring board and covering the component;
    A coil core disposed inside the resin layer and having a portion overlapping the component when viewed from a direction perpendicular to the one main surface of the wiring board;
    An inductor electrode for winding the coil core;
    The inductor electrode has a first metal plate and a second metal plate arranged on the resin layer so that at least a part of the inductor electrode overlaps the coil core when viewed from a direction perpendicular to the one main surface of the wiring board. Have
    The first metal plate has a first bent portion that is partially bent toward the other main surface of the wiring board and disposed inside the resin layer, and the second metal plate is A second bent portion that is bent toward the other main surface of the wiring substrate and disposed inside the resin layer, and a tip portion of the first bent portion and a tip portion of the second bent portion are An inductor component characterized by being electrically connected.
13. 13. The inductor component according to claim 12, wherein a tip portion of the first bent portion and a tip portion of the second bent portion are connected via a wiring electrode provided on the wiring board.
14. The wiring electrode is provided inside the wiring board,
    A tip portion of the first bent portion and one end of the wiring electrode are connected by a first via conductor;
    The inductor component according to claim 13, wherein a tip end portion of the second bent portion and the other end of the wiring electrode are connected by a second via conductor.
15. The inductor component according to claim 12, wherein a tip portion of the first bent portion and a tip portion of the second bent portion are directly connected.

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