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WO2017002836A1 - Resin substrate and method for producing resin substrate - Google Patents

Resin substrate and method for producing resin substrate Download PDF

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Publication number
WO2017002836A1
WO2017002836A1 PCT/JP2016/069217 JP2016069217W WO2017002836A1 WO 2017002836 A1 WO2017002836 A1 WO 2017002836A1 JP 2016069217 W JP2016069217 W JP 2016069217W WO 2017002836 A1 WO2017002836 A1 WO 2017002836A1
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WO
WIPO (PCT)
Prior art keywords
ground conductor
resin substrate
conductor
shield tape
dielectric
Prior art date
Application number
PCT/JP2016/069217
Other languages
French (fr)
Japanese (ja)
Inventor
大坪喜人
伊藤優輝
藤本麻人
Original Assignee
株式会社村田製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Priority to JP2017526385A priority Critical patent/JP6406453B2/en
Publication of WO2017002836A1 publication Critical patent/WO2017002836A1/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details

Definitions

  • the present invention relates to a resin substrate that includes a signal conductor and a ground conductor and is used by being partially bent.
  • the flexible substrate may be bent and used because the capacity can be improved while realizing the function as a circuit board.
  • Patent Document 1 describes a flexible substrate used by being bent.
  • a metal wiring is formed on the substrate, and a conductive polymer is formed so as to cover the wiring.
  • disconnection failure does not occur even when it is bent repeatedly.
  • the conductive polymer film used in the flexible substrate described in Patent Document 1 is extremely thin. For this reason, the tolerance with respect to bending may be inadequate. In addition, the conductive polymer film has poor electromagnetic shielding properties.
  • an object of the present invention is to provide a resin substrate having high resistance to cracking during bending and excellent electromagnetic shielding properties.
  • the resin substrate of the present invention includes a dielectric body, a ground conductor, and a shield tape.
  • the dielectric body can be bent.
  • the ground conductor is formed in a dielectric body.
  • the shield tape is disposed at the bent portion of the dielectric body, has a shape connected to the ground conductor, and has electromagnetic shielding properties.
  • the resin substrate of the present invention may have the following configuration.
  • the ground conductor is divided at the bent portion.
  • a shield tape is disposed on the dielectric body where the ground conductor is divided.
  • the resin substrate of the present invention preferably has the following configuration.
  • the shield tape includes a conductive adhesive and a metal foil.
  • the back surface of the conductive adhesive is in contact with the dielectric body or the ground conductor.
  • the metal foil is disposed on the surface of the conductive adhesive.
  • the shield tape is made of the conductive adhesive and the metal foil, it is possible to more reliably realize the suppression of the division at the time of bending and the decrease in the shielding property.
  • the end of the shield tape in the width direction of the dielectric body overlaps the end of the ground conductor in the width direction of the dielectric body.
  • This configuration can more reliably suppress the breakage of the ground conductor.
  • the resin substrate of the present invention may include a signal conductor disposed at a midpoint in the thickness direction of the dielectric element body and spaced from the ground conductor.
  • This configuration realizes a transmission line with high resistance to bending.
  • the ground conductor includes a first ground conductor and a second ground conductor at a position sandwiching the signal conductor in the thickness direction of the dielectric body. Shield tapes are disposed on the first ground conductor and the second ground conductor, respectively.
  • the portion exposed to the outer surface of the dielectric body in the ground conductor and the portion not covered with the shield tape is subjected to metal plating.
  • This configuration can improve the environmental resistance of the ground conductor exposed to the outside. At this time, metal plating is applied to the part where the shield tape is not placed, and metal plating is not applied to the part where the shield tape is placed. Can be improved. Moreover, it can suppress that it becomes difficult to bend because metal plating is not given to the shield tape part.
  • the present invention is a method of manufacturing a resin substrate having a plurality of dielectric sheets stacked and provided with a bent portion, and is characterized by having the following steps.
  • the method of manufacturing a resin substrate includes a step of forming a ground conductor on a predetermined dielectric sheet, a step of laminating a plurality of dielectric sheets and press-bonding them to form a dielectric element body, and a shield at a portion that can be a bent portion.
  • a resin substrate that does not have metal plating at the bent portion, has high resistance to bending, and is excellent in electromagnetic shielding properties is manufactured in a simple process.
  • 1 is an exploded plan view of a resin substrate according to a first embodiment of the present invention. It is side surface sectional drawing of the shield tape which concerns on the 1st Embodiment of this invention. It is a flowchart which shows the manufacturing method of the resin substrate which concerns on the 1st Embodiment of this invention.
  • FIG. 1 is a partial side view of an electronic apparatus including a resin substrate according to the first embodiment of the present invention.
  • the resin substrate shows a cross-sectional view.
  • FIG. 2 is a side cross-sectional view of the resin substrate according to the first embodiment of the present invention.
  • FIG. 3 is an exploded plan view of the resin substrate according to the first embodiment of the present invention.
  • the resin substrate 10 is a long flat plate having a first direction as a length direction and a second direction as a width direction.
  • the resin substrate 10 has a bent portion 102 at an intermediate position along the length direction.
  • the resin substrate 10 has a shape in which the flat portion 101, the bent portion 102, the flat portion 101, the bent portion 102, and the flat portion 101 are connected in this order along the length direction.
  • a shield tape 60 is disposed in the bent portion 102.
  • a connector 91 is mounted on one end of the resin substrate 10 in the length direction, and a connector 92 is mounted on the other end.
  • the connector 91 is connected to the connector 911 on the circuit board 910.
  • the connector 92 is connected to the connector 921 of the circuit board 920.
  • Mounted components 912 and 913 are mounted on the circuit board 910.
  • a mounting component 922 is mounted on the circuit board 920.
  • the circuit board 910 and the circuit board 920 are spaced apart from each other with the resin substrate 10 interposed therebetween, and the respective flat plate surfaces are arranged in parallel. Even in such an arrangement mode of the circuit boards 910, 920, the circuit boards 910, 920 can be electrically connected by using the resin substrate 10 having the bent portion 102 according to the present invention.
  • the connectors 91 and 92 are not essential components, and the pad electrodes formed on the surface of the resin substrate 10 and the circuit substrates 910 and 920 may be directly connected by a method such as solder connection or ultrasonic bonding.
  • the resin substrate 10 includes a dielectric body 20, a signal conductor 30, a first ground conductor 50, a second ground conductor 40, a shield tape 60, and a protective film 80.
  • the dielectric body 20 is an elongated flat plate that is long in the first direction and short in the second direction.
  • the first direction is the length direction
  • the second direction is the width direction.
  • the dielectric body 20 is realized by laminating dielectric sheets 201, 202, and 203 along the thickness direction and press-bonding them.
  • the dielectric sheets 201, 202, 203 are made of a flexible material.
  • the dielectric sheets 201, 202, and 203 are made of a liquid crystal polymer.
  • a first ground conductor 50 is disposed on the surface of the dielectric sheet 201 (the surface opposite to the dielectric sheet 202 side).
  • the signal conductor 30 is disposed on the surface of the dielectric sheet 202 (the surface facing the dielectric sheet 201).
  • a second ground conductor 40 is disposed on the back surface of the dielectric sheet 203 (the surface opposite to the dielectric sheet 202 side).
  • the resin substrate 10 realizes a strip line in which the signal conductor 30 is sandwiched between the first ground conductor 50 and the second ground conductor 40 in the thickness direction, and the signal conductors 30 are spaced apart from each other.
  • the first ground conductor 50 and the second ground conductor 40 are connected by a plurality of interlayer connection conductors 220 extending in the thickness direction of the resin substrate 10.
  • the signal conductor 30, the first ground conductor 50, and the second ground conductor 40 are made of a material having high conductivity such as copper (Cu).
  • the signal conductor 30 is a linear conductor having a predetermined width.
  • the signal conductor 30 has a shape extending from the vicinity of one end 21 of the dielectric element body 20 to the vicinity of the other end 22.
  • the signal conductor 30 is disposed substantially at the center in the second direction (width direction) of the dielectric body 20.
  • the first ground conductor 50 includes long conductors 51 and 52 and a bridge conductor 53.
  • the long conductor 51 and the long conductor 52 have a shape extending along the first direction.
  • the long conductor 51 and the long conductor 52 are spaced apart along the second direction.
  • the bridge conductor 53 connects the long conductor 51 and the long conductor 52 at a plurality of locations spaced at intervals along the first direction.
  • the first ground conductor 50 has a structure including a plurality of openings 54 along the first direction.
  • a conductor non-forming portion 56 is formed near one end 21 in the first direction of the dielectric element body 20 in the first ground conductor 50, and a connector conductor 711 is formed in the conductor non-forming portion 56. ing.
  • the connector conductor 711 is connected to the signal conductor 30 by an interlayer connection conductor 721 that penetrates the dielectric sheet 201 in the thickness direction.
  • the first ground conductor 50 can easily adjust the characteristic impedance of the stripline to a predetermined characteristic impedance (for example, 50 ⁇ ) even if the thickness of the resin substrate 10 is reduced.
  • the first ground conductor 50 includes a conductor non-formation portion 55 at an intermediate position along the first direction, specifically, the bent portion 102 of the resin substrate 10.
  • the second ground conductor 40 is disposed over substantially the entire back surface of the dielectric sheet 203.
  • a conductor non-forming portion 46 is formed in the second ground conductor 40 near the other end 22 in the first direction of the dielectric element body 20, and a connector conductor 712 is formed in the conductor non-forming portion 46. ing.
  • the connector conductor 712 is connected to the signal conductor 30 by an interlayer connection conductor 722 that penetrates the dielectric sheets 202 and 203 in the thickness direction.
  • the second ground conductor 40 includes a conductor non-formation portion 45 at an intermediate position along the first direction, specifically, at the bent portion 102 of the resin substrate 10.
  • the shield tape 60 is arranged in a shape covering the conductor non-formation portion 55 of the first ground conductor 50 and the conductor non-formation portion 45 of the second ground conductor 40.
  • FIG. 4 is a side cross-sectional view of the shield tape according to the first embodiment of the present invention.
  • the shield tape 60 includes a conductive adhesive 61 and a metal foil 62.
  • a metal foil 62 is attached to the surface of the conductive adhesive 61.
  • a release sheet 600 is disposed on the back surface of the conductive adhesive 61, and the release sheet 600 is removed when being attached to the dielectric element body 20. Therefore, the back surface of the conductive adhesive 61 is in contact with the dielectric element body 20 in a state where the shield tape 60 is attached to the dielectric element body 20.
  • the conductive adhesive 61 has a structure in which conductive particles 612 are dispersed in an adhesive 611. Specifically, the conductive adhesive 61 is made by dispersing metal powder such as nickel powder and carbon fiber in an acrylic adhesive. A conductive acrylic or polyester-based thermoplastic heat seal may be used. Thus, the conductive adhesive 61 has flexibility together with conductivity.
  • the shield tape 60 on the second ground conductor 40 side is in contact with the second ground conductors 40 on both sides with the conductor non-forming portion 45 interposed therebetween. Thereby, the second ground conductors 40 on both sides of the conductor non-forming part 45 are electrically connected by the shield tape 60.
  • the shield tape 60 on the first ground conductor 50 side is in contact with the first ground conductors 50 on both sides with the conductor non-forming portion 55 interposed therebetween. Thereby, the first ground conductors 50 on both sides of the conductor non-forming portion 55 are conducted by the shield tape 60.
  • An insulating protective film 80 is disposed on substantially the entire front surface (surface on the first ground conductor 50 side) and substantially entire back surface (surface on the second ground conductor 40 side) of the dielectric body 20.
  • the protective film 80 can be omitted.
  • the shield tape 60 expands and contracts according to the bent shape even when the resin substrate 10 is folded and arranged.
  • the conductor formed on the dielectric sheet is affixed to the dielectric sheet by roughening the surface of the conductor. By performing such a roughening treatment, the conductor becomes brittle and easily breaks.
  • the shield tape 60 is pasted with an adhesive, it is difficult to break. Thereby, disconnection of the first ground conductor 50 and the second ground conductor 40 at the bent portion 102 can be suppressed.
  • the shield tape 60 is provided with the metal foil 62, the electromagnetic shield property is high, and the electromagnetic shield property at the bent portion 102 can be maintained high.
  • the shield tape 60 has a shape that reaches both ends of the dielectric element body 20 in the second direction.
  • the shield tape 60 on the second ground conductor 40 side is disposed so as to overlap the end portions 411 and 412 in the second direction of the second ground conductor 40.
  • the shield tape 60 on the first ground conductor 50 side is disposed so as to overlap each end of the first ground conductor 50 in the second direction.
  • the first and second ground conductors 50 and 40 may be cracked from the ends in the second direction.
  • the strength of the end portions 411, 412, 511, 512, 521, and 522 can be improved and the occurrence of cracks can be made difficult to occur.
  • the metal used as the metal foil 62 of the shield tape 60 includes copper (Cu), aluminum (Al), Zn (zinc), and tin (Sn).
  • tin (Sn) having a low elastic modulus may be selected for the metal foil 62.
  • copper (Cu) having a low resistivity may be selected as the metal foil 62.
  • the metal foil 62 can be made of nickel (Ni), iron (Fe), stainless steel (SUS), or the like.
  • the metal foil 62 is preferably a rolled foil rather than an electrolytic foil.
  • electrolytic foils are hard with small crystal grains, and piezoelectric foils are soft. Therefore, the rolled foil is preferred.
  • metal foil 62 instead of the metal foil 62, a configuration in which a conductive adhesive is attached to a mesh-like conductor film, and a configuration in which various metal coatings (application of metal paste, plating, etc.) are applied to the conductive adhesive. Also good.
  • the first ground conductor 50 and the second ground conductor 40 are not metal-plated, but may be metal-plated.
  • nickel (Ni) / gold (Au) plating is used as the metal plating.
  • the metal plating is applied to portions of the first ground conductor 50 and the second ground conductor 40 that are not covered with the shield tape 60. In other words, the surface of the shield tape 60 is not subjected to metal plating.
  • the selectivity of metal plating can be easily realized, and the first ground conductor can be realized.
  • Metal plating can be easily applied only to portions of the 50 and the second ground conductors 40 that are not covered with the shield tape 60.
  • the surface of the shield tape 60 may be metal plated. In that case, the above effect cannot be obtained, but instead, the bent portion 102 can easily maintain the folded state after the folding.
  • FIG. 5 is a flowchart showing a method for manufacturing a resin substrate according to the first embodiment of the present invention.
  • FIG. 5 shows the case where metal plating is performed.
  • Conductive patterns of the signal conductor 30, the second ground conductor 40, and the first ground conductor 50 are formed on these dielectric sheets (S101). Specifically, unnecessary copper is removed by printing a resist on the copper bonding surface of the dielectric sheet and performing etching. The resist printed on the dielectric sheet is removed. The dielectric sheet on which the conductor pattern is formed is drilled with a laser at the position where the interlayer connection conductor is formed. A conductive paste is filled in the holes formed in the dielectric sheet.
  • thermocompression bonding a plurality of dielectric sheets are laminated and thermocompression bonded (S102). During this thermocompression bonding, the conductive paste is solidified to form an interlayer connection conductor.
  • the shield tape 60 is affixed to the bent portion 102 (the portion to be bent and used at the time of installation) of the dielectric element body that is a laminated body.
  • metal plating is applied to the exposed conductor patterns, that is, the portions of the first ground conductor 50 and the second ground conductor 40 that are not covered with the shield tape 60 (S104).
  • the protective film 80 When the protective film 80 is disposed, the protective film 80 may be attached after forming the laminated body.
  • the protective film is made of the same material as the dielectric sheet, and the protective film is formed at the time of lamination and thermocompression bonding. Also good.
  • the shield tape 60 may be attached to the dielectric sheet before lamination.
  • FIG. 5 is a partial side view of an electronic apparatus including a resin substrate according to the second embodiment of the present invention.
  • the resin substrate shows a cross-sectional view.
  • FIG. 6 is a side cross-sectional view of a resin substrate according to the second embodiment of the present invention.
  • FIG. 7 is an exploded plan view of a resin substrate according to the second embodiment of the present invention.
  • the resin substrate 10A according to the present embodiment is a shield tape 60A attached to the first ground conductor 50A, the second ground conductor 40A, and the first ground conductor 50A side with respect to the resin substrate 10 according to the first embodiment.
  • the configuration differs. Other configurations are the same as those of the resin substrate 10 according to the first embodiment.
  • the first ground conductor 50A is not provided with a conductor non-forming portion, and is continuous along the first direction of the resin substrate 10A. In other words, the first ground conductor 50A is formed on all of the plurality of flat portions 101 and the plurality of bent portions 102 of the resin substrate 10A.
  • the second ground conductor 40A is not provided with a conductor non-forming portion and is continuous along the first direction of the resin substrate 10A.
  • the second ground conductor 40A is formed on all of the plurality of flat portions 101 and the plurality of bent portions 102 of the resin substrate 10A.
  • a shield tape 60A is disposed at the bent portion 102 on the first ground conductor 50A side of the dielectric body 20.
  • the shield tape 60A on the first ground conductor 50A side covers the long conductors 51 and 52 and the bridge conductor 53 of the first ground conductor 50A disposed in the bent portion 102.
  • the shield tape 60A does not cover the opening 54 of the first ground conductor 50A.
  • the shield tape 60 ⁇ / b> A has a shape that reaches both end portions 23 and 24 in the second direction (width direction) of the dielectric body 20.
  • the shield tape 60 on the second ground conductor 40A side is the same as that of the resin substrate 10 according to the first embodiment, but covers the second ground conductor 40A formed in the bent portion 102.
  • the resin substrate 10A of the present embodiment since the ground conductor and the shield tape are laminated at the bent portion 102, the strength of the bent portion 102 can be improved. Even if the first or second ground conductor is broken at the bent portion, the ground function and the shield function can be ensured by the shield tape.
  • the covered portions are subjected to metal plating. Preferably not. Accordingly, it is possible to realize a resin substrate 10A that is excellent in environmental resistance, is easy to bend, and is not easily broken.
  • FIG. 9 is a plan view showing the configuration of the surface of the resin substrate according to the third embodiment of the present invention on the first ground conductor side.
  • the resin substrate 10B according to the present embodiment is different from the resin substrate 10A according to the second embodiment in the configuration of the shield tape 60B on the first ground conductor 50B side.
  • Other configurations are the same as those of the resin substrate 10A according to the second embodiment.
  • the shield tape 60 ⁇ / b> B has a shape that covers the long conductors 51 and 52 and the bridge conductor 53 of the first ground conductor 50 ⁇ / b> B disposed in the bent portion 102.
  • the shield tape 60B does not cover the opening 54 of the first ground conductor 50B.
  • the shield tape 60B does not reach both end portions 23 and 24 in the second direction (width direction) of the dielectric body 20.
  • the shield tape 60B has a shape that reaches the end 511 of the long conductor 51 in the second direction.
  • the end portion 511 is an end portion of the long conductor 51 on the end portion 23 side of the dielectric element body 20.
  • the shield tape 60B has a shape that reaches the end 521 of the long conductor 52 in the second direction.
  • the end 521 is an end of the long conductor 52 on the end 24 side of the dielectric body 20.
  • FIG. 10 is a plan view showing the configuration of the surface on the first ground conductor side of the resin substrate according to the fourth embodiment of the present invention.
  • the resin substrate 10C according to the present embodiment is different from the resin substrate 10B according to the third embodiment in the configuration of the shield tape 60C on the first ground conductor 50C side.
  • Other configurations are the same as those of the resin substrate 10B according to the third embodiment.
  • the shield tape 60 ⁇ / b> C has a shape that covers the long conductors 51 and 52 and the bridge conductor 53 of the first ground conductor 50 ⁇ / b> C disposed in the bent portion 102.
  • the shield tape 60C also covers the opening 54 of the first ground conductor 50C.
  • FIG. 11 is a plan view showing the configuration of the surface on the first ground conductor side of the resin substrate according to the fifth embodiment of the present invention.
  • the resin substrate 10D according to the present embodiment is different from the resin substrate 10B according to the third embodiment in the configuration of the shield tape 60D on the first ground conductor 50D side.
  • Other configurations are the same as those of the resin substrate 10B according to the third embodiment.
  • the shield tape 60 ⁇ / b> D has a shape that covers the long conductors 51 and 52 of the first ground conductor 50 ⁇ / b> D disposed in the bent portion 102.
  • the shield tape 60D does not cover the bridge conductor 53 of the first ground conductor 50D disposed in the bent portion 102. That is, the shield tape 60D is disposed only in a portion where the length in the second direction of the first ground conductor 50D is shorter than the length in the first direction.
  • the resin substrate 10D is bent at a midpoint in the first direction so that a crease is formed in the second direction. Therefore, the part where the length in the second direction is shorter than the length in the first direction is likely to be divided. For this reason, by using the shield tape 60D of this embodiment, the division of the first ground conductor 50D in which the length in the second direction is shorter than the length in the first direction is suppressed, and the electrical conduction state is maintained. be able to. Moreover, the shield tape 60D can be made small by using the configuration of the present embodiment.
  • FIG. 12 is a plan view showing the configuration of the surface on the first ground conductor side of the resin substrate according to the sixth embodiment of the present invention.
  • the resin substrate 10E according to the present embodiment is different from the resin substrate 10B according to the third embodiment in the configuration of the shield tape 60E on the first ground conductor 50E side. Other configurations are the same as those of the resin substrate 10B according to the third embodiment.
  • the shield tape 60E is disposed on the surfaces of the long conductors 51 and 52 and the bridge conductor 53 of the first ground conductor 50E disposed in the bent portion 102.
  • the width of the shield tape 60 ⁇ / b> E is narrower than the widths of the long conductors 51 and 52 and the bridge conductor 53.
  • the widths of the long conductors 51 and 52 and the bridge conductor 53 mean the shorter one of the length in the first direction and the length in the second direction.
  • FIG. 13 is a plan view showing the configuration of the surface on the second ground conductor side of the resin substrate according to the seventh embodiment of the present invention.
  • the resin substrate 10F according to the present embodiment is different from the resin substrate 10A according to the second embodiment in the configuration of the shield tape 60F on the second ground conductor 40F side.
  • Other configurations are the same as those of the resin substrate 10B according to the third embodiment.
  • the shield tape 60F has a shape that covers the second ground conductor 40F disposed in the bent portion 102.
  • the shield tape 60F does not reach both end portions 23 and 24 in the second direction (width direction) of the dielectric body 20.
  • the shield tape 60F has a shape that reaches the end 411 of the second ground conductor 40F in the second direction.
  • the end portion 411 is an end portion on the end portion 23 side of the dielectric body 20 in the second ground conductor 40F.
  • the shield tape 60F has a shape that reaches the end 421 of the second ground conductor 40F in the second direction.
  • the end portion 421 is an end portion on the end portion 24 side of the dielectric body 20 in the second ground conductor 40F.
  • FIG. 14 is a plan view showing the configuration of the surface on the second ground conductor side of the resin substrate according to the eighth embodiment of the present invention.
  • the resin substrate 10G according to the present embodiment is different from the resin substrate 10F according to the sixth embodiment in the configuration of the shield tape 60G on the second ground conductor 40G side.
  • Other configurations are the same as those of the resin substrate 10F according to the sixth embodiment.
  • the shield tape 60G is disposed on the surface of the second ground conductor 40G disposed in the bent portion 102.
  • the length of the shield tape 60G in the second direction is narrower than the length of the second ground conductor 40G in the second direction.
  • the first ground conductor has the opening.
  • both the first ground conductor and the second ground conductor may have a shape having no opening.
  • the shield tape attached to the first ground conductor may be the same shape as the shield tape attached to the second ground conductor.
  • the configuration of the stripline is shown, but the configuration of a microstripline may be used.
  • the resin substrate may not be a multilayer substrate in which a plurality of dielectric sheets are laminated, but may be a single layer substrate in which a conductor pattern is formed on the front and back surfaces.
  • a signal conductor may be disposed on the front surface and a ground conductor may be disposed on the back surface.
  • the shield tape is arranged on the front surface and the back surface of the dielectric element body is shown, but the shield tape may be arranged only on the front surface or only on the back surface.
  • a shield tape may be arranged so as to be wrapped including the side surface of the dielectric element body.
  • the shield tape can also function as an interlayer connection conductor.
  • the shield tape is arranged for all the bent portions in the resin substrate.
  • the shielding tape for these portions can be omitted. That is, the resin substrate can be bent or curved at a location where the shield tape is not disposed, as long as the ground conductor is not cracked.
  • a long resin substrate is shown.
  • the above-described bending is also applied to a resin substrate that is not long, such as a resin substrate having a small difference in length in two directions perpendicular to the thickness direction.
  • the configuration of the part can be applied.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

This resin substrate (10) is provided with a dielectric element (20), first and second ground conductors (50, 40), and shield tapes (60). The dielectric element (20) has a foldable shape. The dielectric element (20) is provided with a signal conductor (30) at a halfway position in the thickness direction. The first ground conductor (50) is arranged on the front surface of the dielectric element (20), and the second ground conductor (40) is arranged on the back surface of the dielectric element (20). A folded part (102) of the first ground conductor (50) is provided with a non-conductor-formation part (500), and a folded part (102) of the second ground conductor (40) is provided with a non-conductor-formation part (400). The shield tapes (60) are arranged at the folded parts (102), and cover the non-conductor-formation parts (400, 500), respectively. The shield tapes (60) are respectively connected to the first and second ground conductors (50, 40), and have electromagnetic shielding properties.

Description

樹脂基板、樹脂基板の製造方法Resin substrate, resin substrate manufacturing method
　この発明は、信号導体とグランド導体とを備え、部分的に折り曲げて用いられる樹脂基板に関する。 The present invention relates to a resin substrate that includes a signal conductor and a ground conductor and is used by being partially bent.
　従来、携帯通信端末等の電子機器の内部には、フレキシブル性を有する回路基板が多く採用されている。特に、携帯型の電子機器等の筐体が小さな電子機器の場合、回路基板としての機能を実現しながら、収容性を向上することができるので、フレキシブル基板が折り曲げられて用いられることがある。 Conventionally, many flexible circuit boards have been employed in electronic devices such as mobile communication terminals. In particular, in the case of an electronic device having a small housing such as a portable electronic device, the flexible substrate may be bent and used because the capacity can be improved while realizing the function as a circuit board.
　特許文献１には、折り曲げて用いられるフレキシブル基板が記載されている。特許文献１に記載のフレキシブル基板は、基板上に金属の配線が形成され、当該配線を覆うように導電性高分子が形成されている。特許文献１に記載のフレキシブル基板では、繰り返し折り曲げても断線不良が起きないとされている。 Patent Document 1 describes a flexible substrate used by being bent. In the flexible substrate described in Patent Document 1, a metal wiring is formed on the substrate, and a conductive polymer is formed so as to cover the wiring. In the flexible substrate described in Patent Document 1, disconnection failure does not occur even when it is bent repeatedly.
特開２００６－１６５３４１号公報JP 2006-165341 A
　しかしながら、特許文献１に記載のフレキシブル基板に用いられている導電性高分子の膜は、極めて薄い。このため、折り曲げに対する耐性が不十分な可能性がある。また、導電性高分子膜は、電磁シールド性に乏しい。 However, the conductive polymer film used in the flexible substrate described in Patent Document 1 is extremely thin. For this reason, the tolerance with respect to bending may be inadequate. In addition, the conductive polymer film has poor electromagnetic shielding properties.
　したがって、本発明の目的は、折り曲げ時の割れに対する耐性が高く、電磁シールド性に優れる樹脂基板を提供することにある。 Therefore, an object of the present invention is to provide a resin substrate having high resistance to cracking during bending and excellent electromagnetic shielding properties.
　この発明の樹脂基板は、誘電体素体、グランド導体、および、シールドテープを備える。誘電体素体は、折り曲げ可能である。グランド導体は、誘電体素体に形成されている。シールドテープは、誘電体素体の折り曲げ部に配置され、グランド導体に接続する形状で且つ電磁シールド性を有する。 The resin substrate of the present invention includes a dielectric body, a ground conductor, and a shield tape. The dielectric body can be bent. The ground conductor is formed in a dielectric body. The shield tape is disposed at the bent portion of the dielectric body, has a shape connected to the ground conductor, and has electromagnetic shielding properties.
　この構成では、樹脂基板を折り曲げた際に、グランド導体が途中で断線し難くなり、また、グランド導体が断線しても、離間したグランド導体同士の導通状態がシールドテープによって維持される。また、折り曲げ部のシールド性の低下が抑制される。 In this configuration, when the resin substrate is bent, the ground conductor is difficult to be disconnected in the middle, and even if the ground conductor is disconnected, the conductive state between the separated ground conductors is maintained by the shield tape. Moreover, the fall of the shield property of a bending part is suppressed.
　また、この発明の樹脂基板は、次の構成であってもよい。グランド導体は、折り曲げ部において分断されている。このグランド導体が分断された部分の誘電体素体に、シールドテープが配置されている。 Further, the resin substrate of the present invention may have the following configuration. The ground conductor is divided at the bent portion. A shield tape is disposed on the dielectric body where the ground conductor is divided.
　この構成では、折り曲げ部にグランド導体が存在しないので、折り曲げが容易である。 In this configuration, since the ground conductor does not exist in the bent portion, the bending is easy.
　また、この発明の樹脂基板では、次の構成であることが好ましい。シールドテープは、導電性粘着剤と金属箔とを備える。導電性粘着剤は、裏面が誘電体素体またはグランド導体に当接している。金属箔は、導電性粘着剤の表面に配置されている。 Moreover, the resin substrate of the present invention preferably has the following configuration. The shield tape includes a conductive adhesive and a metal foil. The back surface of the conductive adhesive is in contact with the dielectric body or the ground conductor. The metal foil is disposed on the surface of the conductive adhesive.
　この構成では、シールドテープが導電性粘着剤と金属箔とからなることにより、折り曲げ時の分断の抑制と、シールド性の低下の抑制を、より確実に実現することができる。 In this configuration, since the shield tape is made of the conductive adhesive and the metal foil, it is possible to more reliably realize the suppression of the division at the time of bending and the decrease in the shielding property.
　また、この発明の樹脂基板では、誘電体素体の幅方向におけるシールドテープの端部は、誘電体素体の幅方向におけるグランド導体の端部に重なっていることが好ましい。 In the resin substrate of the present invention, it is preferable that the end of the shield tape in the width direction of the dielectric body overlaps the end of the ground conductor in the width direction of the dielectric body.
　この構成では、グランド導体の割れをより確実に抑制することができる。 This configuration can more reliably suppress the breakage of the ground conductor.
　また、この発明の樹脂基板では、誘電体素体の厚み方向の途中位置に、グランド導体に対して離間して配置された信号導体を備えていてもよい。 In addition, the resin substrate of the present invention may include a signal conductor disposed at a midpoint in the thickness direction of the dielectric element body and spaced from the ground conductor.
　この構成では、折り曲げに対する耐性が高い、伝送線路が実現される。 This configuration realizes a transmission line with high resistance to bending.
　また、この発明の樹脂基板では、次の構成であってもよい。グランド導体は、誘電体素体の厚み方向において前記信号導体を挟み込む位置に、第１グランド導体と第２グランド導体とを備える。第１グランド導体と第２グランド導体にそれぞれシールドテープが配置されている。 Further, the resin substrate of the present invention may have the following configuration. The ground conductor includes a first ground conductor and a second ground conductor at a position sandwiching the signal conductor in the thickness direction of the dielectric body. Shield tapes are disposed on the first ground conductor and the second ground conductor, respectively.
　この構成では、折り曲げに対する耐性が高く、電磁シールド性に優れるストリップラインが実現される。 In this configuration, a strip line having high resistance to bending and excellent electromagnetic shielding properties is realized.
　また、この発明の樹脂基板では、グランド導体における誘電体素体の外面に露出する部分で、且つ、シールドテープに覆われていない部分には、金属メッキが施されていることが好ましい。 Further, in the resin substrate of the present invention, it is preferable that the portion exposed to the outer surface of the dielectric body in the ground conductor and the portion not covered with the shield tape is subjected to metal plating.
　この構成では、グランド導体における外部に露出する部分の耐環境性を向上することができる。この際、シールドテープが配置されていない部分は金属メッキが施され、シールドテープが配置されている部分は金属メッキが施されていないので、必要最小限の金属メッキでグランド導体の耐環境性を向上できる。また、シールドテープ部分に金属メッキが施されていないことにより、折り曲げ難くなることを抑制することができる。 This configuration can improve the environmental resistance of the ground conductor exposed to the outside. At this time, metal plating is applied to the part where the shield tape is not placed, and metal plating is not applied to the part where the shield tape is placed. Can be improved. Moreover, it can suppress that it becomes difficult to bend because metal plating is not given to the shield tape part.
　また、この発明は、複数の誘電体シートを積層し、折り曲げ部を備える樹脂基板の製造方法であって、次の工程を有することを特徴としている。樹脂基板の製造方法は、所定の誘電体シートにグランド導体を形成する工程と、複数の誘電体シートを積層して圧着して誘電体素体を形成する工程と、折り曲げ部となり得る箇所にシールドテープを貼り付ける工程と、シールドテープが貼り付けられた誘電体素体におけるシールドテープに覆われていないグランド導体に金属メッキを行う工程と、を有する。 Further, the present invention is a method of manufacturing a resin substrate having a plurality of dielectric sheets stacked and provided with a bent portion, and is characterized by having the following steps. The method of manufacturing a resin substrate includes a step of forming a ground conductor on a predetermined dielectric sheet, a step of laminating a plurality of dielectric sheets and press-bonding them to form a dielectric element body, and a shield at a portion that can be a bent portion. A step of applying a tape, and a step of performing metal plating on a ground conductor not covered with the shield tape in the dielectric body to which the shield tape is attached.
　この方法では、折り曲げ部に金属メッキがない、折り曲げに対する耐性が高く、電磁シールド性に優れる樹脂基板が簡素な工程で製造される。 In this method, a resin substrate that does not have metal plating at the bent portion, has high resistance to bending, and is excellent in electromagnetic shielding properties is manufactured in a simple process.
　この発明によれば、折り曲げ時の割れに対する耐性が高く、電磁シールド性に優れる樹脂基板を実現することができる。 According to the present invention, it is possible to realize a resin substrate having high resistance to cracking during bending and excellent electromagnetic shielding properties.
本発明の第１の実施形態に係る樹脂基板を備える電子機器の部分側面図である。It is a partial side view of an electronic device provided with the resin substrate which concerns on the 1st Embodiment of this invention. 本発明の第１の実施形態に係る樹脂基板の側面断面図である。It is side surface sectional drawing of the resin substrate which concerns on the 1st Embodiment of this invention. 本発明の第１の実施形態に係る樹脂基板の分解平面図である。1 is an exploded plan view of a resin substrate according to a first embodiment of the present invention. 本発明の第１の実施形態に係るシールドテープの側面断面図である。It is side surface sectional drawing of the shield tape which concerns on the 1st Embodiment of this invention. 本発明の第１の実施形態に係る樹脂基板の製造方法を示すフローチャートである。It is a flowchart which shows the manufacturing method of the resin substrate which concerns on the 1st Embodiment of this invention. 本発明の第２の実施形態に係る樹脂基板を備える電子機器の部分側面図である。It is a partial side view of an electronic device provided with the resin substrate which concerns on the 2nd Embodiment of this invention. 本発明の第２の実施形態に係る樹脂基板の側面断面図である。It is side surface sectional drawing of the resin substrate which concerns on the 2nd Embodiment of this invention. 本発明の第２の実施形態に係る樹脂基板の分解平面図である。It is a decomposition | disassembly top view of the resin substrate which concerns on the 2nd Embodiment of this invention. 本発明の第３の実施形態に係る樹脂基板の第１グランド導体側の面の構成を示す平面図である。It is a top view which shows the structure of the surface at the side of the 1st ground conductor of the resin substrate which concerns on the 3rd Embodiment of this invention. 本発明の第４の実施形態に係る樹脂基板の第１グランド導体側の面の構成を示す平面図である。It is a top view which shows the structure of the surface by the side of the 1st ground conductor of the resin substrate which concerns on the 4th Embodiment of this invention. 本発明の第５の実施形態に係る樹脂基板の第１グランド導体側の面の構成を示す平面図である。It is a top view which shows the structure of the surface by the side of the 1st ground conductor of the resin substrate which concerns on the 5th Embodiment of this invention. 本発明の第６の実施形態に係る樹脂基板の第１グランド導体側の面の構成を示す平面図である。It is a top view which shows the structure of the surface at the side of the 1st ground conductor of the resin substrate which concerns on the 6th Embodiment of this invention. 本発明の第７の実施形態に係る樹脂基板の第２グランド導体側の面の構成を示す平面図である。It is a top view which shows the structure of the surface by the side of the 2nd ground conductor of the resin substrate which concerns on the 7th Embodiment of this invention. 本発明の第８の実施形態に係る樹脂基板の第２グランド導体側の面の構成を示す平面図である。It is a top view which shows the structure of the surface by the side of the 2nd ground conductor of the resin substrate which concerns on the 8th Embodiment of this invention.
　本発明の第１の実施形態に係る樹脂基板について、図を参照して説明する。図１は、本発明の第１の実施形態に係る樹脂基板を備える電子機器の部分側面図である。図１において樹脂基板は断面図を示している。図２は、本発明の第１の実施形態に係る樹脂基板の側面断面図である。図３は、本発明の第１の実施形態に係る樹脂基板の分解平面図である。 The resin substrate according to the first embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a partial side view of an electronic apparatus including a resin substrate according to the first embodiment of the present invention. In FIG. 1, the resin substrate shows a cross-sectional view. FIG. 2 is a side cross-sectional view of the resin substrate according to the first embodiment of the present invention. FIG. 3 is an exploded plan view of the resin substrate according to the first embodiment of the present invention.
　樹脂基板１０は、第１方向を長さ方向とし、第２方向を幅方向とする長尺状の平板である。樹脂基板１０は、長さ方向に沿って、途中の位置に折り曲げ部１０２を有する。図１の例であれば、樹脂基板１０は、長さ方向に沿って、平坦部１０１、折り曲げ部１０２、平坦部１０１、折り曲げ部１０２、および、平坦部１０１の順に繋がる形状である。 The resin substrate 10 is a long flat plate having a first direction as a length direction and a second direction as a width direction. The resin substrate 10 has a bent portion 102 at an intermediate position along the length direction. In the example of FIG. 1, the resin substrate 10 has a shape in which the flat portion 101, the bent portion 102, the flat portion 101, the bent portion 102, and the flat portion 101 are connected in this order along the length direction.
　樹脂基板１０の具体的な構造は後述するが、折り曲げ部１０２には、シールドテープ６０が配置されている。 Although the specific structure of the resin substrate 10 will be described later, a shield tape 60 is disposed in the bent portion 102.
　樹脂基板１０の長さ方向の一方端にはコネクタ９１が実装されており、他方端にはコネクタ９２が実装されている。コネクタ９１は、回路基板９１０のコネクタ９１１に接続されている。コネクタ９２は、回路基板９２０のコネクタ９２１に接続されている。回路基板９１０には、実装部品９１２，９１３が実装されている。回路基板９２０には、実装部品９２２が実装されている。回路基板９１０と回路基板９２０は、樹脂基板１０を間に挟んで離間しており、それぞれの平板面が平行な状態で配置されている。このような回路基板９１０，９２０の配置態様であっても、本願発明に係る折り曲げ部１０２を有する樹脂基板１０を用いることによって、回路基板９１０，９２０を電気的に接続することができる。なお、コネクタ９１，９２は必須構成ではなく、樹脂基板１０表面に形成されたパッド電極と、回路基板９１０，９２０とをはんだ接続や超音波接合等の方法により、直接接続してもよい。 A connector 91 is mounted on one end of the resin substrate 10 in the length direction, and a connector 92 is mounted on the other end. The connector 91 is connected to the connector 911 on the circuit board 910. The connector 92 is connected to the connector 921 of the circuit board 920. Mounted components 912 and 913 are mounted on the circuit board 910. A mounting component 922 is mounted on the circuit board 920. The circuit board 910 and the circuit board 920 are spaced apart from each other with the resin substrate 10 interposed therebetween, and the respective flat plate surfaces are arranged in parallel. Even in such an arrangement mode of the circuit boards 910, 920, the circuit boards 910, 920 can be electrically connected by using the resin substrate 10 having the bent portion 102 according to the present invention. The connectors 91 and 92 are not essential components, and the pad electrodes formed on the surface of the resin substrate 10 and the circuit substrates 910 and 920 may be directly connected by a method such as solder connection or ultrasonic bonding.
　樹脂基板１０は、誘電体素体２０、信号導体３０、第１グランド導体５０、第２グランド導体４０、シールドテープ６０、および、保護膜８０を備える。 The resin substrate 10 includes a dielectric body 20, a signal conductor 30, a first ground conductor 50, a second ground conductor 40, a shield tape 60, and a protective film 80.
　誘電体素体２０は、第１方向に長く、第２方向に短い長尺状の平板である。第１方向が長さ方向であり、第２方向が幅方向である。誘電体素体２０は、誘電体シート２０１，２０２，２０３を厚み方向に沿って積層して圧着することによって実現されている。誘電体シート２０１，２０２，２０３は可撓性を有する材料からなる。例えば、誘電体シート２０１，２０２，２０３は液晶ポリマからなる。 The dielectric body 20 is an elongated flat plate that is long in the first direction and short in the second direction. The first direction is the length direction, and the second direction is the width direction. The dielectric body 20 is realized by laminating dielectric sheets 201, 202, and 203 along the thickness direction and press-bonding them. The dielectric sheets 201, 202, 203 are made of a flexible material. For example, the dielectric sheets 201, 202, and 203 are made of a liquid crystal polymer.
　誘電体シート２０１の表面（誘電体シート２０２側と反対側の面）には、第１グランド導体５０が配置されている。誘電体シート２０２の表面（誘電体シート２０１側との面）には、信号導体３０が配置されている。誘電体シート２０３の裏面（誘電体シート２０２側と反対側の面）には、第２グランド導体４０が配置されている。この構成により、樹脂基板１０は、厚み方向において、信号導体３０を、第１グランド導体５０と第２グランド導体４０とによって挟み込み、それぞれが離間して配置されたストリップラインを実現している。第１グランド導体５０と第２グランド導体４０は、樹脂基板１０の厚み方向に延びる複数の層間接続導体２２０によって接続されている。信号導体３０、第１グランド導体５０、および、第２グランド導体４０は、銅（Ｃｕ）等の導電率の高い材料からなる。 A first ground conductor 50 is disposed on the surface of the dielectric sheet 201 (the surface opposite to the dielectric sheet 202 side). The signal conductor 30 is disposed on the surface of the dielectric sheet 202 (the surface facing the dielectric sheet 201). A second ground conductor 40 is disposed on the back surface of the dielectric sheet 203 (the surface opposite to the dielectric sheet 202 side). With this configuration, the resin substrate 10 realizes a strip line in which the signal conductor 30 is sandwiched between the first ground conductor 50 and the second ground conductor 40 in the thickness direction, and the signal conductors 30 are spaced apart from each other. The first ground conductor 50 and the second ground conductor 40 are connected by a plurality of interlayer connection conductors 220 extending in the thickness direction of the resin substrate 10. The signal conductor 30, the first ground conductor 50, and the second ground conductor 40 are made of a material having high conductivity such as copper (Cu).
　信号導体３０は、所定の幅を有する線状の導体である。信号導体３０は、誘電体素体２０の一方端２１の付近から他方端２２の付近まで延びる形状である。信号導体３０は、誘電体素体２０の第２方向（幅方向）の略中央に配置されている。 The signal conductor 30 is a linear conductor having a predetermined width. The signal conductor 30 has a shape extending from the vicinity of one end 21 of the dielectric element body 20 to the vicinity of the other end 22. The signal conductor 30 is disposed substantially at the center in the second direction (width direction) of the dielectric body 20.
　第１グランド導体５０は、長尺導体５１，５２とブリッジ導体５３とを備える。長尺導体５１と長尺導体５２は、第１方向に沿って延びる形状である。長尺導体５１と長尺導体５２は、第２方向に沿って離間して配置されている。ブリッジ導体５３は、第１方向に沿った間隔を空けた複数の箇所において、長尺導体５１と長尺導体５２とを接続している。これにより、第１グランド導体５０は、第１方向に沿って複数の開口部５４を備える構造となる。第１グランド導体５０における誘電体素体２０の第１方向の一方端２１の付近には、導体非形成部５６が形成されており、導体非形成部５６内にはコネクタ用導体７１１が形成されている。コネクタ用導体７１１は、誘電体シート２０１を厚み方向に貫通する層間接続導体７２１によって信号導体３０に接続されている。第１グランド導体５０は、複数の開口部５４を備えることにより、樹脂基板１０の厚みを薄くしてもストリップラインの特性インピーダンスを所定の特性インピーダンス（例えば５０Ω）に調整しやすくなる。 The first ground conductor 50 includes long conductors 51 and 52 and a bridge conductor 53. The long conductor 51 and the long conductor 52 have a shape extending along the first direction. The long conductor 51 and the long conductor 52 are spaced apart along the second direction. The bridge conductor 53 connects the long conductor 51 and the long conductor 52 at a plurality of locations spaced at intervals along the first direction. Thereby, the first ground conductor 50 has a structure including a plurality of openings 54 along the first direction. A conductor non-forming portion 56 is formed near one end 21 in the first direction of the dielectric element body 20 in the first ground conductor 50, and a connector conductor 711 is formed in the conductor non-forming portion 56. ing. The connector conductor 711 is connected to the signal conductor 30 by an interlayer connection conductor 721 that penetrates the dielectric sheet 201 in the thickness direction. By providing the plurality of openings 54, the first ground conductor 50 can easily adjust the characteristic impedance of the stripline to a predetermined characteristic impedance (for example, 50Ω) even if the thickness of the resin substrate 10 is reduced.
　第１グランド導体５０は、第１方向に沿った途中位置、具体的には樹脂基板１０における折り曲げ部１０２に、導体非形成部５５を備える。 The first ground conductor 50 includes a conductor non-formation portion 55 at an intermediate position along the first direction, specifically, the bent portion 102 of the resin substrate 10.
　第２グランド導体４０は、誘電体シート２０３の裏面の略全面に亘って配置されている。第２グランド導体４０における誘電体素体２０の第１方向の他方端２２の付近には、導体非形成部４６が形成されており、導体非形成部４６内にはコネクタ用導体７１２が形成されている。コネクタ用導体７１２は、誘電体シート２０２，２０３を厚み方向に貫通する層間接続導体７２２によって信号導体３０に接続されている。 The second ground conductor 40 is disposed over substantially the entire back surface of the dielectric sheet 203. A conductor non-forming portion 46 is formed in the second ground conductor 40 near the other end 22 in the first direction of the dielectric element body 20, and a connector conductor 712 is formed in the conductor non-forming portion 46. ing. The connector conductor 712 is connected to the signal conductor 30 by an interlayer connection conductor 722 that penetrates the dielectric sheets 202 and 203 in the thickness direction.
　第２グランド導体４０は、第１方向に沿った途中位置、具体的には樹脂基板１０における折り曲げ部１０２に、導体非形成部４５を備える。 The second ground conductor 40 includes a conductor non-formation portion 45 at an intermediate position along the first direction, specifically, at the bent portion 102 of the resin substrate 10.
　シールドテープ６０は、第１グランド導体５０の導体非形成部５５および第２グランド導体４０の導体非形成部４５を覆う形状で配置されている。図４は、本発明の第１の実施形態に係るシールドテープの側面断面図である。シールドテープ６０は、導電性粘着剤６１と金属箔６２を備える。導電性粘着剤６１の表面には金属箔６２が貼り付けられている。導電性粘着剤６１の裏面には離形シート６００が配置されており、この離形シート６００は、誘電体素体２０に貼り付けられる際には除去されている。したがって、シールドテープ６０を誘電体素体２０に貼り付けた状態では、導電性粘着剤６１の裏面は、誘電体素体２０に当接している。導電性粘着剤６１は、粘着剤６１１に導電粒子６１２が分散して配置された構造を有する。具体的には、導電性粘着剤６１は、アクリル系粘着剤にニッケル粉やカーボン繊維等の金属粉を分散してなる。なお、導電性アクリル、ポリエステル系の熱可塑性ヒートシールを用いてもよい。このように、導電性粘着剤６１は、導電性ととともに柔軟性を有する。 The shield tape 60 is arranged in a shape covering the conductor non-formation portion 55 of the first ground conductor 50 and the conductor non-formation portion 45 of the second ground conductor 40. FIG. 4 is a side cross-sectional view of the shield tape according to the first embodiment of the present invention. The shield tape 60 includes a conductive adhesive 61 and a metal foil 62. A metal foil 62 is attached to the surface of the conductive adhesive 61. A release sheet 600 is disposed on the back surface of the conductive adhesive 61, and the release sheet 600 is removed when being attached to the dielectric element body 20. Therefore, the back surface of the conductive adhesive 61 is in contact with the dielectric element body 20 in a state where the shield tape 60 is attached to the dielectric element body 20. The conductive adhesive 61 has a structure in which conductive particles 612 are dispersed in an adhesive 611. Specifically, the conductive adhesive 61 is made by dispersing metal powder such as nickel powder and carbon fiber in an acrylic adhesive. A conductive acrylic or polyester-based thermoplastic heat seal may be used. Thus, the conductive adhesive 61 has flexibility together with conductivity.
　第２グランド導体４０側のシールドテープ６０は、導体非形成部４５を挟んだ両側の第２グランド導体４０に当接している。これにより、導体非形成部４５を挟んだ両側の第２グランド導体４０は、シールドテープ６０によって導通している。 The shield tape 60 on the second ground conductor 40 side is in contact with the second ground conductors 40 on both sides with the conductor non-forming portion 45 interposed therebetween. Thereby, the second ground conductors 40 on both sides of the conductor non-forming part 45 are electrically connected by the shield tape 60.
　第１グランド導体５０側のシールドテープ６０は、導体非形成部５５を挟んだ両側の第１グランド導体５０に当接している。これにより、導体非形成部５５を挟んだ両側の第１グランド導体５０は、シールドテープ６０によって導通している。 The shield tape 60 on the first ground conductor 50 side is in contact with the first ground conductors 50 on both sides with the conductor non-forming portion 55 interposed therebetween. Thereby, the first ground conductors 50 on both sides of the conductor non-forming portion 55 are conducted by the shield tape 60.
　誘電体素体２０の表面（第１グランド導体５０側の面）の略全面および裏面（第２グランド導体４０側の面）の略全面には、絶縁性の保護膜８０が配置されている。なお、この保護膜８０は、省略することも可能である。 An insulating protective film 80 is disposed on substantially the entire front surface (surface on the first ground conductor 50 side) and substantially entire back surface (surface on the second ground conductor 40 side) of the dielectric body 20. The protective film 80 can be omitted.
　このような構成とすることによって、次の作用効果が得られる。上述のように、シールドテープ６０の導電性粘着剤６１は、金属箔単体と比較して柔軟性を有するので、樹脂基板１０を折り曲げて配置しても、シールドテープ６０が折り曲げ形状に応じて伸縮する。また、誘電体シートに形成された導体は、導体の面を粗化処理して誘電体シートに貼り付けられている。このような粗化処理が行われていることによって、導体は脆くなり、割れやすい。しかしながら、シールドテープ６０は粘着剤によって貼り付けられているので、割れにくい。これにより、折り曲げ部１０２での第１グランド導体５０および第２グランド導体４０の断線を抑制することができる。 By adopting such a configuration, the following effects can be obtained. As described above, since the conductive adhesive 61 of the shield tape 60 has flexibility compared to the metal foil alone, the shield tape 60 expands and contracts according to the bent shape even when the resin substrate 10 is folded and arranged. To do. The conductor formed on the dielectric sheet is affixed to the dielectric sheet by roughening the surface of the conductor. By performing such a roughening treatment, the conductor becomes brittle and easily breaks. However, since the shield tape 60 is pasted with an adhesive, it is difficult to break. Thereby, disconnection of the first ground conductor 50 and the second ground conductor 40 at the bent portion 102 can be suppressed.
　また、シールドテープ６０は、金属箔６２を備えていることによって、電磁シールド性が高く、折り曲げ部１０２での電磁シールド性を高く維持することができる。 Further, since the shield tape 60 is provided with the metal foil 62, the electromagnetic shield property is high, and the electromagnetic shield property at the bent portion 102 can be maintained high.
　また、本実施形態の樹脂基板１０では、シールドテープ６０は、誘電体素体２０の第２方向の両端に達する形状である。言い換えれば、第２グランド導体４０側のシールドテープ６０は、第２グランド導体４０における第２方向の各端部４１１，４１２に対して重なるように配置されている。第１グランド導体５０側のシールドテープ６０は、第１グランド導体５０における第２方向の各端部に対して重なるように配置されている。 Further, in the resin substrate 10 of the present embodiment, the shield tape 60 has a shape that reaches both ends of the dielectric element body 20 in the second direction. In other words, the shield tape 60 on the second ground conductor 40 side is disposed so as to overlap the end portions 411 and 412 in the second direction of the second ground conductor 40. The shield tape 60 on the first ground conductor 50 side is disposed so as to overlap each end of the first ground conductor 50 in the second direction.
　樹脂基板１０を折り曲げた場合、第１、第２グランド導体５０，４０の第２方向の端部から割れが生じることがある。しかしながら、本実施形態に係るシールドテープ６０の配置態様を用いることによって、端部４１１，４１２，５１１，５１２，５２１，５２２の強度を向上できて割れの発生を生じ難くすることができる。 When the resin substrate 10 is bent, the first and second ground conductors 50 and 40 may be cracked from the ends in the second direction. However, by using the arrangement mode of the shield tape 60 according to the present embodiment, the strength of the end portions 411, 412, 511, 512, 521, and 522 can be improved and the occurrence of cracks can be made difficult to occur.
　また、これらの端部４１１，４１２，５１１，５１２，５２１，５２２が割れても、この割れの進行を抑制することができる。さらには、電気的な導通状態を維持することができる。 Moreover, even if these end portions 411, 412, 511, 512, 521, 522 are cracked, the progress of the cracking can be suppressed. Furthermore, an electrical continuity state can be maintained.
　なお、シールドテープ６０の金属箔６２の材料は、必要とされる仕様の重要度に応じて適宜選択すればよい。具体的には、シールドテープ６０の金属箔６２として利用する金属は、銅（Ｃｕ）、アルミニウム（Ａｌ）、Ｚｎ（亜鉛）、錫（Ｓｎ）がある。 In addition, what is necessary is just to select the material of the metal foil 62 of the shield tape 60 suitably according to the importance of the required specification. Specifically, the metal used as the metal foil 62 of the shield tape 60 includes copper (Cu), aluminum (Al), Zn (zinc), and tin (Sn).
　これらの金属は、錫（Ｓｎ）、アルミニウム（Ａｌ）、Ｚｎ（亜鉛）、銅（Ｃｕ）の順に弾性率が低い（Ｓｎ＜Ａｌ＜Ｚｎ＜Ｃｕ）。したがって、グランド導体の保護の観点からすると、弾性率の低い錫（Ｓｎ）を金属箔６２に選択すればよい。 These metals have a low elastic modulus in the order of tin (Sn), aluminum (Al), Zn (zinc), and copper (Cu) (Sn <Al <Zn <Cu). Therefore, from the viewpoint of protecting the ground conductor, tin (Sn) having a low elastic modulus may be selected for the metal foil 62.
　また、これらの金属は、銅（Ｃｕ）、アルミニウム（Ａｌ）、Ｚｎ（亜鉛）、錫（Ｓｎ）の順に抵抗率が低い（Ｃｕ＜Ａｌ＜Ｚｎ＜Ｓｎ）。したがって、グランド導体が分断してしまったときの電磁シールド性の維持の観点からすると、抵抗率の低い銅（Ｃｕ）を金属箔６２に選択すればよい。 Moreover, these metals have low resistivity in the order of copper (Cu), aluminum (Al), Zn (zinc), and tin (Sn) (Cu <Al <Zn <Sn). Therefore, from the viewpoint of maintaining the electromagnetic shielding property when the ground conductor is divided, copper (Cu) having a low resistivity may be selected as the metal foil 62.
　なお、金属箔６２には、ニッケル（Ｎｉ）、鉄（Ｆｅ）、ステンレス鋼（ＳＵＳ）等を用いることも可能である。 The metal foil 62 can be made of nickel (Ni), iron (Fe), stainless steel (SUS), or the like.
　また、金属箔６２は、電解箔よりも圧延箔の方がよい。一般的に電解箔は、結晶粒が小さくて硬く、圧電箔は柔らかい。したがって、圧延箔である方が好ましい。 Also, the metal foil 62 is preferably a rolled foil rather than an electrolytic foil. In general, electrolytic foils are hard with small crystal grains, and piezoelectric foils are soft. Therefore, the rolled foil is preferred.
　また、金属箔６２に替えて、メッシュ状の導体膜に導電性粘着剤を貼り付けた構成、導電性粘着剤に各種の金属コーティング（金属ペーストの塗布、メッキ等）を施した構成であってもよい。 Further, instead of the metal foil 62, a configuration in which a conductive adhesive is attached to a mesh-like conductor film, and a configuration in which various metal coatings (application of metal paste, plating, etc.) are applied to the conductive adhesive. Also good.
　また、上述の構成では、第１グランド導体５０および第２グランド導体４０に金属メッキを行っていないが、金属メッキを行ってもよい。金属メッキとしては、例えばニッケル（Ｎｉ）／金（Ａｕ）メッキを用いる。金属メッキは、第１グランド導体５０および第２グランド導体４０におけるシールドテープ６０に覆われていない部分に施されている。逆に言えば、シールドテープ６０の表面には、金属メッキは施されていない。このような構成とすることによって、第１グランド導体５０および第２グランド導体４０の耐環境性を向上するとともに、折り曲げ部１０２が金属メッキによって折り曲げ難くなることを抑制することができる。例えば、第１グランド導体５０および第２グランド導体４０に銅（Ｃｕ）を用いて、シールドテープ６０にアルミニウム（Ａｌ）を用いた場合、金属メッキの選択性が容易に実現でき、第１グランド導体５０および第２グランド導体４０におけるシールドテープ６０に覆われていない部分のみに、金属メッキを容易に施すことができる。なお、シールドテープ６０の表面に金属メッキは施していてもよい。その場合、上記の効果は得られないが、代わりに、折り曲げ部１０２において折り曲げ後の折り曲げ状態を維持しやすくなる。 In the above configuration, the first ground conductor 50 and the second ground conductor 40 are not metal-plated, but may be metal-plated. For example, nickel (Ni) / gold (Au) plating is used as the metal plating. The metal plating is applied to portions of the first ground conductor 50 and the second ground conductor 40 that are not covered with the shield tape 60. In other words, the surface of the shield tape 60 is not subjected to metal plating. By adopting such a configuration, it is possible to improve the environmental resistance of the first ground conductor 50 and the second ground conductor 40 and to suppress the bending portion 102 from being difficult to bend by metal plating. For example, when copper (Cu) is used for the first ground conductor 50 and the second ground conductor 40 and aluminum (Al) is used for the shield tape 60, the selectivity of metal plating can be easily realized, and the first ground conductor can be realized. Metal plating can be easily applied only to portions of the 50 and the second ground conductors 40 that are not covered with the shield tape 60. The surface of the shield tape 60 may be metal plated. In that case, the above effect cannot be obtained, but instead, the bent portion 102 can easily maintain the folded state after the folding.
　このような構成からなる樹脂基板１０は、次に示す工程によって製造される。図５は、本発明の第１の実施形態に係る樹脂基板の製造方法を示すフローチャートである。なお、図５では、金属メッキを行う場合について示している。 The resin substrate 10 having such a configuration is manufactured by the following process. FIG. 5 is a flowchart showing a method for manufacturing a resin substrate according to the first embodiment of the present invention. FIG. 5 shows the case where metal plating is performed.
　片面銅貼りの誘電体シートを複数用意する。これらの誘電体シートに対して、信号導体３０、第２グランド導体４０、および、第１グランド導体５０の導体パターンを形成する（Ｓ１０１）。具体的には、誘電体シートの銅貼り面にレジストを印刷し、エッチングを行うことによって、不要な銅を除去する。誘電体シートに印刷されたレジストを除去する。導体パターンが形成された誘電体シートに対して、層間接続導体の形成位置にレーザによる孔空けを行う。誘電体シートに空けられた孔に導電性ペーストを充填する。 Prepare multiple dielectric sheets with copper on one side. Conductive patterns of the signal conductor 30, the second ground conductor 40, and the first ground conductor 50 are formed on these dielectric sheets (S101). Specifically, unnecessary copper is removed by printing a resist on the copper bonding surface of the dielectric sheet and performing etching. The resist printed on the dielectric sheet is removed. The dielectric sheet on which the conductor pattern is formed is drilled with a laser at the position where the interlayer connection conductor is formed. A conductive paste is filled in the holes formed in the dielectric sheet.
　次に、複数の誘電体シートを積層して、加熱圧着する（Ｓ１０２）。この加熱圧着時に、導電ペーストが固化して層間接続導体が形成される。 Next, a plurality of dielectric sheets are laminated and thermocompression bonded (S102). During this thermocompression bonding, the conductive paste is solidified to form an interlayer connection conductor.
　次に、積層体である誘電体素体の折り曲げ部１０２（設置時に折り曲げて利用する部分）にシールドテープ６０を貼り付ける。 Next, the shield tape 60 is affixed to the bent portion 102 (the portion to be bent and used at the time of installation) of the dielectric element body that is a laminated body.
　次に、露出している導体パターン、すなわち、第１グランド導体５０および第２グランド導体４０におけるシールドテープ６０に覆われていない部分に、金属メッキを施す（Ｓ１０４）。 Next, metal plating is applied to the exposed conductor patterns, that is, the portions of the first ground conductor 50 and the second ground conductor 40 that are not covered with the shield tape 60 (S104).
　このように、シールドテープ６０を貼り付けた後に金属メッキを行うことによって、第１グランド導体５０および第２グランド導体４０におけるシールドテープ６０に覆われていない部分にのみ金属メッキを、容易に施すことができる。 In this way, by performing metal plating after the shielding tape 60 is applied, only the portions of the first ground conductor 50 and the second ground conductor 40 that are not covered with the shielding tape 60 are easily subjected to metal plating. Can do.
　なお、保護膜８０を配置する場合には、積層体を形成後に保護膜８０を貼り付けてもよく、保護膜を誘電体シートと同じ素材にして、積層、加熱圧着時に保護膜を形成してもよい。この場合、シールドテープ６０は、積層する前の誘電体シートに貼り付ければよい。 When the protective film 80 is disposed, the protective film 80 may be attached after forming the laminated body. The protective film is made of the same material as the dielectric sheet, and the protective film is formed at the time of lamination and thermocompression bonding. Also good. In this case, the shield tape 60 may be attached to the dielectric sheet before lamination.
　次に、本発明の第２の実施形態に係る樹脂基板について、図を参照して説明する。図５は、本発明の第２の実施形態に係る樹脂基板を備える電子機器の部分側面図である。図５において樹脂基板は断面図を示している。図６は、本発明の第２の実施形態に係る樹脂基板の側面断面図である。図７は、本発明の第２の実施形態に係る樹脂基板の分解平面図である。 Next, a resin substrate according to a second embodiment of the present invention will be described with reference to the drawings. FIG. 5 is a partial side view of an electronic apparatus including a resin substrate according to the second embodiment of the present invention. In FIG. 5, the resin substrate shows a cross-sectional view. FIG. 6 is a side cross-sectional view of a resin substrate according to the second embodiment of the present invention. FIG. 7 is an exploded plan view of a resin substrate according to the second embodiment of the present invention.
　本実施形態に係る樹脂基板１０Ａは、第１の実施形態に係る樹脂基板１０に対して、第１グランド導体５０Ａ、第２グランド導体４０Ａ、第１グランド導体５０Ａ側に貼り付けられたシールドテープ６０Ａの構成において異なる。他の構成は、第１の実施形態に係る樹脂基板１０と同じである。 The resin substrate 10A according to the present embodiment is a shield tape 60A attached to the first ground conductor 50A, the second ground conductor 40A, and the first ground conductor 50A side with respect to the resin substrate 10 according to the first embodiment. The configuration differs. Other configurations are the same as those of the resin substrate 10 according to the first embodiment.
　第１グランド導体５０Ａは、導体非形成部を備えず、樹脂基板１０Ａの第１方向に沿って連続している。言い換えれば、第１グランド導体５０Ａは、樹脂基板１０Ａの複数の平坦部１０１、複数の折り曲げ部１０２の全てに形成されている。 The first ground conductor 50A is not provided with a conductor non-forming portion, and is continuous along the first direction of the resin substrate 10A. In other words, the first ground conductor 50A is formed on all of the plurality of flat portions 101 and the plurality of bent portions 102 of the resin substrate 10A.
　第２グランド導体４０Ａは、導体非形成部を備えず、樹脂基板１０Ａの第１方向に沿って連続している。言い換えれば、第２グランド導体４０Ａは、樹脂基板１０Ａの複数の平坦部１０１、複数の折り曲げ部１０２の全てに形成されている。 The second ground conductor 40A is not provided with a conductor non-forming portion and is continuous along the first direction of the resin substrate 10A. In other words, the second ground conductor 40A is formed on all of the plurality of flat portions 101 and the plurality of bent portions 102 of the resin substrate 10A.
　誘電体素体２０の第１グランド導体５０Ａ側で折り曲げ部１０２には、シールドテープ６０Ａが配置されている。 A shield tape 60A is disposed at the bent portion 102 on the first ground conductor 50A side of the dielectric body 20.
　第１グランド導体５０Ａ側のシールドテープ６０Ａは、折り曲げ部１０２に配置された第１グランド導体５０Ａの長尺導体５１，５２およびブリッジ導体５３を覆う形状である。シールドテープ６０Ａは、第１グランド導体５０Ａの開口部５４を覆っていない。シールドテープ６０Ａは、誘電体素体２０の第２方向（幅方向）の両端部２３，２４に達する形状である。 The shield tape 60A on the first ground conductor 50A side covers the long conductors 51 and 52 and the bridge conductor 53 of the first ground conductor 50A disposed in the bent portion 102. The shield tape 60A does not cover the opening 54 of the first ground conductor 50A. The shield tape 60 </ b> A has a shape that reaches both end portions 23 and 24 in the second direction (width direction) of the dielectric body 20.
　第２グランド導体４０Ａ側のシールドテープ６０は、第１の実施形態に係る樹脂基板１０のそれと同じであるが、折り曲げ部１０２に形成された第２グランド導体４０Ａを覆っている。 The shield tape 60 on the second ground conductor 40A side is the same as that of the resin substrate 10 according to the first embodiment, but covers the second ground conductor 40A formed in the bent portion 102.
　このような構成であっても、第１の実施形態と同様に、折り曲げ時の割れに対する耐性が高く、電磁シールド性に優れる樹脂基板１０Ａを実現することができる。さらに、本実施形態の樹脂基板１０Ａでは、折り曲げ部１０２において、グランド導体とシールドテープが積層されているので、折り曲げ部１０２の強度を向上することができる。また、第１または第２グランド導体が折り曲げ部において割れてしまったとしても、シールドテープによってグランド機能およびシールド機能を保証することができる。 Even with such a configuration, similarly to the first embodiment, it is possible to realize the resin substrate 10A having high resistance to cracking during bending and excellent electromagnetic shielding properties. Furthermore, in the resin substrate 10A of the present embodiment, since the ground conductor and the shield tape are laminated at the bent portion 102, the strength of the bent portion 102 can be improved. Even if the first or second ground conductor is broken at the bent portion, the ground function and the shield function can be ensured by the shield tape.
　なお、本実施形態において、第１グランド導体５０Ａおよび第２グランド導体４０Ａにおけるシールドテープ６０，６０Ａに覆われていない部分が金属メッキされていても、覆われている部分には、金属メッキを施さないことが好ましい。これにより、耐環境性に優れ、折り曲げ易く、割れにくい樹脂基板１０Ａを実現することができる。 In the present embodiment, even if the portions of the first ground conductor 50A and the second ground conductor 40A that are not covered with the shield tapes 60 and 60A are plated with metal, the covered portions are subjected to metal plating. Preferably not. Accordingly, it is possible to realize a resin substrate 10A that is excellent in environmental resistance, is easy to bend, and is not easily broken.
　次に、第３の実施形態に係る樹脂基板について、図を参照して説明する。図９は、本発明の第３の実施形態に係る樹脂基板の第１グランド導体側の面の構成を示す平面図である。 Next, a resin substrate according to the third embodiment will be described with reference to the drawings. FIG. 9 is a plan view showing the configuration of the surface of the resin substrate according to the third embodiment of the present invention on the first ground conductor side.
　本実施形態に係る樹脂基板１０Ｂは、第１グランド導体５０Ｂ側のシールドテープ６０Ｂの構成が、第２の実施形態に係る樹脂基板１０Ａと異なる。他の構成は、第２の実施形態に係る樹脂基板１０Ａと同じである。 The resin substrate 10B according to the present embodiment is different from the resin substrate 10A according to the second embodiment in the configuration of the shield tape 60B on the first ground conductor 50B side. Other configurations are the same as those of the resin substrate 10A according to the second embodiment.
　シールドテープ６０Ｂは、折り曲げ部１０２に配置された第１グランド導体５０Ｂの長尺導体５１，５２およびブリッジ導体５３を覆う形状である。シールドテープ６０Ｂは、第１グランド導体５０Ｂの開口部５４を覆っていない。シールドテープ６０Ｂは、誘電体素体２０の第２方向（幅方向）の両端部２３，２４に達していない。シールドテープ６０Ｂは、第２方向における長尺導体５１の端部５１１に達する形状である。端部５１１は、長尺導体５１における誘電体素体２０の端部２３側の端部である。シールドテープ６０Ｂは、第２方向における長尺導体５２の端部５２１に達する形状である。端部５２１は、長尺導体５２における誘電体素体２０の端部２４側の端部である。 The shield tape 60 </ b> B has a shape that covers the long conductors 51 and 52 and the bridge conductor 53 of the first ground conductor 50 </ b> B disposed in the bent portion 102. The shield tape 60B does not cover the opening 54 of the first ground conductor 50B. The shield tape 60B does not reach both end portions 23 and 24 in the second direction (width direction) of the dielectric body 20. The shield tape 60B has a shape that reaches the end 511 of the long conductor 51 in the second direction. The end portion 511 is an end portion of the long conductor 51 on the end portion 23 side of the dielectric element body 20. The shield tape 60B has a shape that reaches the end 521 of the long conductor 52 in the second direction. The end 521 is an end of the long conductor 52 on the end 24 side of the dielectric body 20.
　このような構成であっても、第２の実施形態と同様に、折り曲げ時の割れに対する耐性が高く、電磁シールド性に優れる樹脂基板１０Ｂを実現することができる。 Even with such a configuration, similarly to the second embodiment, it is possible to realize the resin substrate 10B having high resistance to cracking during bending and excellent electromagnetic shielding properties.
　次に、本発明の第４の実施形態に係る樹脂基板について、図を参照して説明する。図１０は、本発明の第４の実施形態に係る樹脂基板の第１グランド導体側の面の構成を示す平面図である。 Next, a resin substrate according to a fourth embodiment of the present invention will be described with reference to the drawings. FIG. 10 is a plan view showing the configuration of the surface on the first ground conductor side of the resin substrate according to the fourth embodiment of the present invention.
　本実施形態に係る樹脂基板１０Ｃは、第１グランド導体５０Ｃ側のシールドテープ６０Ｃの構成が、第３の実施形態に係る樹脂基板１０Ｂと異なる。他の構成は、第３の実施形態に係る樹脂基板１０Ｂと同じである。 The resin substrate 10C according to the present embodiment is different from the resin substrate 10B according to the third embodiment in the configuration of the shield tape 60C on the first ground conductor 50C side. Other configurations are the same as those of the resin substrate 10B according to the third embodiment.
　シールドテープ６０Ｃは、折り曲げ部１０２に配置された第１グランド導体５０Ｃの長尺導体５１，５２およびブリッジ導体５３を覆う形状である。シールドテープ６０Ｃは、第１グランド導体５０Ｃの開口部５４も覆っている。 The shield tape 60 </ b> C has a shape that covers the long conductors 51 and 52 and the bridge conductor 53 of the first ground conductor 50 </ b> C disposed in the bent portion 102. The shield tape 60C also covers the opening 54 of the first ground conductor 50C.
　このような構成であっても、第３の実施形態と同様に、折り曲げ時の割れに対する耐性が高く、電磁シールド性に優れる樹脂基板１０Ｃを実現することができる。 Even with such a configuration, similarly to the third embodiment, it is possible to realize the resin substrate 10C having high resistance to cracking during bending and excellent electromagnetic shielding properties.
　次に、本発明の第５の実施形態に係る樹脂基板について、図を参照して説明する。図１１は、本発明の第５の実施形態に係る樹脂基板の第１グランド導体側の面の構成を示す平面図である。 Next, a resin substrate according to a fifth embodiment of the present invention will be described with reference to the drawings. FIG. 11 is a plan view showing the configuration of the surface on the first ground conductor side of the resin substrate according to the fifth embodiment of the present invention.
　本実施形態に係る樹脂基板１０Ｄは、第１グランド導体５０Ｄ側のシールドテープ６０Ｄの構成が、第３の実施形態に係る樹脂基板１０Ｂと異なる。他の構成は、第３の実施形態に係る樹脂基板１０Ｂと同じである。 The resin substrate 10D according to the present embodiment is different from the resin substrate 10B according to the third embodiment in the configuration of the shield tape 60D on the first ground conductor 50D side. Other configurations are the same as those of the resin substrate 10B according to the third embodiment.
　シールドテープ６０Ｄは、折り曲げ部１０２に配置された第１グランド導体５０Ｄの長尺導体５１，５２を覆う形状である。シールドテープ６０Ｄは、折り曲げ部１０２に配置された第１グランド導体５０Ｄのブリッジ導体５３を覆っていない。すなわち、シールドテープ６０Ｄは、第１グランド導体５０Ｄにおける第２方向の長さが第１方向の長さよりも短い部分にのみ配置されている。 The shield tape 60 </ b> D has a shape that covers the long conductors 51 and 52 of the first ground conductor 50 </ b> D disposed in the bent portion 102. The shield tape 60D does not cover the bridge conductor 53 of the first ground conductor 50D disposed in the bent portion 102. That is, the shield tape 60D is disposed only in a portion where the length in the second direction of the first ground conductor 50D is shorter than the length in the first direction.
　樹脂基板１０Ｄは、図１の樹脂基板１０に示すように、第１方向の途中位置で、第２方向に折れ目ができるように折り曲げられている。したがって、第２方向の長さが第１方向の長さよりも短い部分の方が分断されやすい。このため、本実施形態のシールドテープ６０Ｄを用いることで、第１グランド導体５０Ｄにおける第２方向の長さが第１方向の長さよりも短い部分の分断を抑制、電気的な導通状態を維持することができる。また、本実施形態の構成を用いることによって、シールドテープ６０Ｄを小さくできる。 As shown in the resin substrate 10 in FIG. 1, the resin substrate 10D is bent at a midpoint in the first direction so that a crease is formed in the second direction. Therefore, the part where the length in the second direction is shorter than the length in the first direction is likely to be divided. For this reason, by using the shield tape 60D of this embodiment, the division of the first ground conductor 50D in which the length in the second direction is shorter than the length in the first direction is suppressed, and the electrical conduction state is maintained. be able to. Moreover, the shield tape 60D can be made small by using the configuration of the present embodiment.
　次に、本発明の第６の実施形態に係る樹脂基板について、図を参照して説明する。図１２は、本発明の第６の実施形態に係る樹脂基板の第１グランド導体側の面の構成を示す平面図である。 Next, a resin substrate according to a sixth embodiment of the present invention will be described with reference to the drawings. FIG. 12 is a plan view showing the configuration of the surface on the first ground conductor side of the resin substrate according to the sixth embodiment of the present invention.
　本実施形態に係る樹脂基板１０Ｅは、第１グランド導体５０Ｅ側のシールドテープ６０Ｅの構成が、第３の実施形態に係る樹脂基板１０Ｂと異なる。他の構成は、第３の実施形態に係る樹脂基板１０Ｂと同じである。 The resin substrate 10E according to the present embodiment is different from the resin substrate 10B according to the third embodiment in the configuration of the shield tape 60E on the first ground conductor 50E side. Other configurations are the same as those of the resin substrate 10B according to the third embodiment.
　シールドテープ６０Ｅは、折り曲げ部１０２に配置された第１グランド導体５０Ｅの長尺導体５１，５２およびブリッジ導体５３の表面に配置されている。シールドテープ６０Ｅの幅は、長尺導体５１，５２およびブリッジ導体５３の幅よりも狭い。なお、ここで長尺導体５１，５２およびブリッジ導体５３の幅とは、第１方向の長さと第２方向の長さにおいて短い方の長さを意味する。 The shield tape 60E is disposed on the surfaces of the long conductors 51 and 52 and the bridge conductor 53 of the first ground conductor 50E disposed in the bent portion 102. The width of the shield tape 60 </ b> E is narrower than the widths of the long conductors 51 and 52 and the bridge conductor 53. Here, the widths of the long conductors 51 and 52 and the bridge conductor 53 mean the shorter one of the length in the first direction and the length in the second direction.
　このような構成であっても、第１グランド導体５０Ｅに割れが発生しても、この割れの進行をシールドテープ６０Ｅによって抑制することができ、電気的な導通状態を維持することができる。 Even in such a configuration, even if a crack occurs in the first ground conductor 50E, the progress of the crack can be suppressed by the shield tape 60E, and the electrical conduction state can be maintained.
　次に、本発明の第７の実施形態に係る樹脂基板について、図を参照して説明する。図１３は、本発明の第７の実施形態に係る樹脂基板の第２グランド導体側の面の構成を示す平面図である。 Next, a resin substrate according to a seventh embodiment of the present invention will be described with reference to the drawings. FIG. 13 is a plan view showing the configuration of the surface on the second ground conductor side of the resin substrate according to the seventh embodiment of the present invention.
　本実施形態に係る樹脂基板１０Ｆは、第２グランド導体４０Ｆ側のシールドテープ６０Ｆの構成が、第２の実施形態に係る樹脂基板１０Ａと異なる。他の構成は、第３の実施形態に係る樹脂基板１０Ｂと同じである。 The resin substrate 10F according to the present embodiment is different from the resin substrate 10A according to the second embodiment in the configuration of the shield tape 60F on the second ground conductor 40F side. Other configurations are the same as those of the resin substrate 10B according to the third embodiment.
　シールドテープ６０Ｆは、折り曲げ部１０２に配置された第２グランド導体４０Ｆを覆う形状である。シールドテープ６０Ｆは、誘電体素体２０の第２方向（幅方向）の両端部２３，２４に達していない。シールドテープ６０Ｆは、第２方向における第２グランド導体４０Ｆの端部４１１に達する形状である。端部４１１は、第２グランド導体４０Ｆにおける誘電体素体２０の端部２３側の端部である。シールドテープ６０Ｆは、第２方向における第２グランド導体４０Ｆの端部４２１に達する形状である。端部４２１は、第２グランド導体４０Ｆにおける誘電体素体２０の端部２４側の端部である。 The shield tape 60F has a shape that covers the second ground conductor 40F disposed in the bent portion 102. The shield tape 60F does not reach both end portions 23 and 24 in the second direction (width direction) of the dielectric body 20. The shield tape 60F has a shape that reaches the end 411 of the second ground conductor 40F in the second direction. The end portion 411 is an end portion on the end portion 23 side of the dielectric body 20 in the second ground conductor 40F. The shield tape 60F has a shape that reaches the end 421 of the second ground conductor 40F in the second direction. The end portion 421 is an end portion on the end portion 24 side of the dielectric body 20 in the second ground conductor 40F.
　次に、本発明の第８の実施形態に係る樹脂基板について、図を参照して説明する。図１４は、本発明の第８の実施形態に係る樹脂基板の第２グランド導体側の面の構成を示す平面図である。 Next, a resin substrate according to an eighth embodiment of the present invention will be described with reference to the drawings. FIG. 14 is a plan view showing the configuration of the surface on the second ground conductor side of the resin substrate according to the eighth embodiment of the present invention.
　本実施形態に係る樹脂基板１０Ｇは、第２グランド導体４０Ｇ側のシールドテープ６０Ｇの構成が、第６の実施形態に係る樹脂基板１０Ｆと異なる。他の構成は、第６の実施形態に係る樹脂基板１０Ｆと同じである。 The resin substrate 10G according to the present embodiment is different from the resin substrate 10F according to the sixth embodiment in the configuration of the shield tape 60G on the second ground conductor 40G side. Other configurations are the same as those of the resin substrate 10F according to the sixth embodiment.
　シールドテープ６０Ｇは、折り曲げ部１０２に配置された第２グランド導体４０Ｇの表面に配置されている。シールドテープ６０Ｇの第２方向の長さは、第２グランド導体４０Ｇの第２方向の長さよりも狭い。 The shield tape 60G is disposed on the surface of the second ground conductor 40G disposed in the bent portion 102. The length of the shield tape 60G in the second direction is narrower than the length of the second ground conductor 40G in the second direction.
　このような構成であっても、第２グランド導体４０Ｇに割れが発生しても、この割れの進行をシールドテープ６０Ｇによって抑制することができ、電気的な導通状態を維持することができる。 Even in such a configuration, even if a crack occurs in the second ground conductor 40G, the progress of the crack can be suppressed by the shield tape 60G, and the electrical conduction state can be maintained.
　なお、上述の各実施形態の構成は、適宜組み合わせることができる。 In addition, the structure of each above-mentioned embodiment can be combined suitably.
　また、上述の各実施形態では、第１グランド導体に開口部を有する態様を示したが、第１グランド導体、第２グランド導体ともに開口を有さない形状であってもよい。この場合、第１グランド導体に貼り付けるシールドテープは、第２グランド導体に貼り付けるシールドテープを同じ形状にすればよい。 In each of the above-described embodiments, the first ground conductor has the opening. However, both the first ground conductor and the second ground conductor may have a shape having no opening. In this case, the shield tape attached to the first ground conductor may be the same shape as the shield tape attached to the second ground conductor.
　また、上述の各実施形態では、ストリップラインの構成を示したが、マイクロストリップラインの構成を用いてもよい。この場合、樹脂基板は、複数の誘電体シートを積層した多層基板ではなく、表裏面に導体パターンが形成された単層の基板であってもよい。単層の基板の場合、表面に信号導体を配置し、裏面にグランド導体を配置すればよい。 Further, in each of the above-described embodiments, the configuration of the stripline is shown, but the configuration of a microstripline may be used. In this case, the resin substrate may not be a multilayer substrate in which a plurality of dielectric sheets are laminated, but may be a single layer substrate in which a conductor pattern is formed on the front and back surfaces. In the case of a single-layer substrate, a signal conductor may be disposed on the front surface and a ground conductor may be disposed on the back surface.
　また、上述の各実施形態では、誘電体素体の表面および裏面にシールドテープを配置する例を示したが、表面のみ、または、裏面のみにシールドテープを配置してもよい。 Further, in each of the above-described embodiments, the example in which the shield tape is arranged on the front surface and the back surface of the dielectric element body is shown, but the shield tape may be arranged only on the front surface or only on the back surface.
　さらには、誘電体素体の側面を含んで巻き付けるように、シールドテープを配置してもよい。この構成では、シールドテープに層間接続導体の機能を兼用させることができる。 Furthermore, a shield tape may be arranged so as to be wrapped including the side surface of the dielectric element body. In this configuration, the shield tape can also function as an interlayer connection conductor.
　また、上述の説明では、樹脂基板における全ての折り曲げ部に対してシールドテープを配置する態様を示した。しかしながら、樹脂基板に複数の折り曲げ部や湾曲部があり、グランド導体の割れが生じない程度の折り曲げ部、湾曲部が存在する場合には、この部分に対するシールドテープを省略することも可能である。すなわち、樹脂基板は、グランド導体の割れが生じないような程度であれば、シールドテープを配置していない箇所において、折り曲げ、湾曲を施すこともできる。 Further, in the above description, the aspect in which the shield tape is arranged for all the bent portions in the resin substrate is shown. However, when the resin substrate has a plurality of bent portions and curved portions, and there are bent portions and curved portions to the extent that the ground conductor does not break, the shielding tape for these portions can be omitted. That is, the resin substrate can be bent or curved at a location where the shield tape is not disposed, as long as the ground conductor is not cracked.
　また、上述の説明では、長尺状の樹脂基板を示したが、厚み方向に直交する二方向の長さの差が少ない樹脂基板等、長尺状でない樹脂基板に対しても、上述の折り曲げ部の構成を適用することができる。 In the above description, a long resin substrate is shown. However, the above-described bending is also applied to a resin substrate that is not long, such as a resin substrate having a small difference in length in two directions perpendicular to the thickness direction. The configuration of the part can be applied.
１０，１０Ａ，１０Ｂ，１０Ｃ，１０Ｄ，１０Ｅ，１０Ｆ，１０Ｇ：樹脂基板
２０：誘電体素体
３０：信号導体
４０，４０Ａ，４０Ｆ，４０Ｇ：第２グランド導体
４５，４６：導体非形成部
５０，５０Ａ，５０Ｂ，５０Ｃ，５０Ｄ，５０Ｅ：第１グランド導体
５１，５２：長尺導体
５３：ブリッジ導体
５４：開口部
５５，５６：導体非形成部
６０，６０Ａ，６０Ｂ，６０Ｃ，６０Ｄ，６０Ｅ，６０Ｆ，６０Ｇ：シールドテープ
６１：導電性粘着剤
６２：金属箔
８０：保護膜
９１，９２：コネクタ
１０１：平坦部
１０２：折り曲げ部
２０１，２０２，２０３：誘電体シート
２２０：層間接続導体
４００，５００：導体非形成部
６００：離形シート
６１１：粘着剤
６１２：導電粒子
７１１，７１２：コネクタ用導体
７２１，７２２：層間接続導体
９１０，９２０：回路基板
９１１，９２１：コネクタ
９１２，９１３，９２２：実装部品 10, 10A, 10B, 10C, 10D, 10E, 10F, 10G: Resin substrate 20: Dielectric body 30: Signal conductors 40, 40A, 40F, 40G: Second ground conductors 45, 46: Conductor non-forming portion 50, 50A, 50B, 50C, 50D, 50E: first ground conductor 51, 52: long conductor 53: bridge conductor 54: opening 55, 56: conductor non-formation part 60, 60A, 60B, 60C, 60D, 60E, 60F 60G: Shield tape 61: Conductive adhesive 62: Metal foil 80: Protective film 91, 92: Connector 101: Flat part 102: Bent part 201, 202, 203: Dielectric sheet 220: Interlayer connection conductor 400, 500: Conductor non-forming portion 600: Release sheet 611: Adhesive 612: Conductive particles 711, 712: Connector conductors 721, 722: Interlayer connection conductor 10,920: the circuit board 911 and 921: connector 912,913,922: mount components

Claims (8)

  1. 　折り曲げ可能な誘電体素体と、
    　該誘電体素体に形成された平膜のグランド導体と、
    　前記誘電体素体の折り曲げ部に配置され、前記グランド導体に接続する形状で且つ電磁シールド性を有するシールドテープと、
    　を備える、樹脂基板。     A foldable dielectric element;
    A flat film ground conductor formed on the dielectric body;
    A shield tape that is disposed in the bent portion of the dielectric body, has a shape connected to the ground conductor, and has electromagnetic shielding properties;
    A resin substrate.
  2. 　前記グランド導体は、前記折り曲げ部において分断されており、
    　このグランド導体が分断された部分の前記誘電体素体に、前記シールドテープが配置されている、
    　請求項１に記載の樹脂基板。     The ground conductor is divided at the bent portion,
    The shield tape is disposed on the dielectric element body where the ground conductor is divided.
    The resin substrate according to claim 1.
  3. 　前記シールドテープは、
    　裏面が前記誘電体素体または前記グランド導体に当接する導電性粘着剤と、
    　前記導電性粘着剤の表面に配置された金属箔と、
    　を備える、請求項１または請求項２に記載の樹脂基板。     The shield tape is
    A conductive adhesive whose back surface is in contact with the dielectric element body or the ground conductor;
    A metal foil disposed on the surface of the conductive adhesive;
    The resin substrate of Claim 1 or Claim 2 provided with these.
  4. 　前記誘電体素体の幅方向における前記シールドテープの端部は、前記誘電体素体の幅方向における前記グランド導体の端部に重なっている、
    　請求項１乃至請求項３のいずれかに記載の樹脂基板。     The end of the shield tape in the width direction of the dielectric body overlaps the end of the ground conductor in the width direction of the dielectric body,
    The resin substrate according to any one of claims 1 to 3.
  5. 　前記誘電体素体の厚み方向の途中位置に、前記グランド導体に対して離間して配置された信号導体を備える、
    　請求項１乃至請求項４のいずれかに記載の樹脂基板。     A signal conductor disposed apart from the ground conductor at a middle position in the thickness direction of the dielectric body,
    The resin substrate according to claim 1.
  6. 　前記グランド導体は、前記誘電体素体の厚み方向において前記信号導体を挟み込む位置に、第１グランド導体と第２グランド導体とを備え、
    　前記第１グランド導体と前記第２グランド導体にそれぞれ前記シールドテープが配置されている、
    　請求項５に記載の樹脂基板。     The ground conductor includes a first ground conductor and a second ground conductor at a position sandwiching the signal conductor in a thickness direction of the dielectric body,
    The shield tape is disposed on each of the first ground conductor and the second ground conductor,
    The resin substrate according to claim 5.
  7. 　前記グランド導体における前記誘電体素体の外面に露出する部分で、且つ、前記シールドテープに覆われていない部分には、金属メッキが施されている、
    　請求項１乃至請求項６のいずれかに記載の樹脂基板。     The portion exposed to the outer surface of the dielectric element body in the ground conductor and the portion not covered with the shield tape is subjected to metal plating.
    The resin substrate according to any one of claims 1 to 6.
  8. 　複数の誘電体シートを積層し、折り曲げ部を備える樹脂基板の製造方法であって、
    　所定の誘電体シートにグランド導体を形成する工程と、
    　前記複数の誘電体シートを積層して圧着して誘電体素体を形成する工程と、
    　前記折り曲げ部となり得る箇所にシールドテープを貼り付ける工程と、
    　シールドテープが貼り付けられた前記誘電体素体におけるシールドテープに覆われていない前記グランド導体に金属メッキを行う工程と、
    　を有する樹脂基板の製造方法。     A method for producing a resin substrate comprising a plurality of dielectric sheets and a bent portion,
    Forming a ground conductor on a predetermined dielectric sheet;
    Laminating and crimping the plurality of dielectric sheets to form a dielectric body; and
    A step of attaching a shield tape to a portion that can be the bent portion;
    Performing metal plating on the ground conductor that is not covered by the shield tape in the dielectric body to which a shield tape is attached;
    The manufacturing method of the resin substrate which has.
PCT/JP2016/069217 2015-07-01 2016-06-29 Resin substrate and method for producing resin substrate WO2017002836A1 (en)

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006019336A (en) * 2004-06-30 2006-01-19 Alps Electric Co Ltd Flexible wiring board
JP2007129111A (en) * 2005-11-04 2007-05-24 Jisedai Gijutsu:Kk Solid substrate
JP2009218447A (en) * 2008-03-11 2009-09-24 Sumitomo Electric Ind Ltd Flexible printed wiring board
JP3173143U (en) * 2010-12-03 2012-01-26 株式会社村田製作所 High frequency signal line
JP2013021069A (en) * 2011-07-08 2013-01-31 Sumitomo Electric Printed Circuit Inc Flexible printed wiring board with shield, manufacturing method therefor, and electronic apparatus
US20140118969A1 (en) * 2012-10-25 2014-05-01 Samsung Display Co., Ltd. Chip on film and display device including the same

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006019336A (en) * 2004-06-30 2006-01-19 Alps Electric Co Ltd Flexible wiring board
JP2007129111A (en) * 2005-11-04 2007-05-24 Jisedai Gijutsu:Kk Solid substrate
JP2009218447A (en) * 2008-03-11 2009-09-24 Sumitomo Electric Ind Ltd Flexible printed wiring board
JP3173143U (en) * 2010-12-03 2012-01-26 株式会社村田製作所 High frequency signal line
JP2013021069A (en) * 2011-07-08 2013-01-31 Sumitomo Electric Printed Circuit Inc Flexible printed wiring board with shield, manufacturing method therefor, and electronic apparatus
US20140118969A1 (en) * 2012-10-25 2014-05-01 Samsung Display Co., Ltd. Chip on film and display device including the same

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