[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

WO2017081828A1 - Sheet coil manufacturing method - Google Patents

Sheet coil manufacturing method Download PDF

Info

Publication number
WO2017081828A1
WO2017081828A1 PCT/JP2015/082048 JP2015082048W WO2017081828A1 WO 2017081828 A1 WO2017081828 A1 WO 2017081828A1 JP 2015082048 W JP2015082048 W JP 2015082048W WO 2017081828 A1 WO2017081828 A1 WO 2017081828A1
Authority
WO
WIPO (PCT)
Prior art keywords
metal foil
resist
sheet coil
etching
coil
Prior art date
Application number
PCT/JP2015/082048
Other languages
French (fr)
Japanese (ja)
Inventor
純一 多田
Original Assignee
株式会社五十嵐電機製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社五十嵐電機製作所 filed Critical 株式会社五十嵐電機製作所
Priority to JP2016509194A priority Critical patent/JP5981680B1/en
Priority to PCT/JP2015/082048 priority patent/WO2017081828A1/en
Publication of WO2017081828A1 publication Critical patent/WO2017081828A1/en

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils

Definitions

  • the present invention relates to a sheet coil manufacturing method for forming a conductive coil on the surface of an insulating substrate.
  • a photosensitive material is applied on a base material 53 formed by laminating a conductive metal layer 52 on an insulating substrate 51.
  • a pattern mask that is, a resist 54
  • the metal layer 52 not covered with the resist 54 is removed by etching (for example, Patent Document 1).
  • the etched side surface of the recess 55 formed in the metal layer 52 by etching is not a complete vertical surface, as shown in FIG.
  • the non-uniform non-eroded portion 55a remains in the portion close to the substrate 51, and the cross-sectional shape of the concave portion 55 and thus the cross-sectional area of the portion remaining as a coil in the metal layer 52 may be non-uniform.
  • Such non-uniformity in the cross-sectional area of the coil portion due to the presence of the non-eroded portion 55a causes fluctuations in electrical elements such as frequency when using the sheet coil as an electrical element, resulting in a decrease in electrical performance. Will be invited.
  • the present invention has been made in view of the above-described problems of the prior art, and prevents non-uniform non-eroded portions from remaining when etching a conductive metal layer, thereby cutting off the coil portion. It is an object of the present invention to provide a method for manufacturing a sheet coil that can achieve uniform area.
  • the above problem is solved as follows.
  • the front and back surfaces of the conductive metal foil are the same as the front and back surfaces of the coil portion to be formed,
  • the front side resist and the back side resist having the corresponding shapes are masked at the same time or at different times, and reach the back side or the front side from either the front or back side of the metal foil or a depth shallower than the thickness of the metal foil.
  • Etching is performed to form a recess, and then etching is performed from either the front or back side of the metal foil until reaching the recess, thereby reliably removing the non-eroded portion that could not be removed by the first etching.
  • the back surface of the metal foil is adhered to the substrate in a timely manner.
  • the non-uniformly eroded portion 55a as shown in FIG. 3 (b) that remains by simply etching once from the surface of the metal foil is etched from both the front and back surfaces of the metal foil.
  • the coil portion can be reliably removed, and the cross-sectional area of the coil portion can be made uniform.
  • this sheet coil is used as an electrical element, non-uniform fluctuations in electrical elements such as frequency can be prevented, and the performance of the electrical apparatus incorporating this sheet coil can be improved.
  • the metal foil can be stably supported by the support plate or the base material during etching.
  • the front-side resist and the back-side resist can be made into the same shape with high precision and can be easily positioned on the metal foil.
  • the support plate, the metal foil, and the base material are positioned with respect to each other by positioning means.
  • the position of the support plate with respect to the metal foil and the position of the base material adhered to the metal foil can be made to coincide with each other accurately.
  • the positioning means includes positioning holes provided at positions corresponding to each other of the support plate, the metal foil, and the base material, and guide pins that can be fitted to and detached from them.
  • the support plate, the metal foil, and the base material can be easily and quickly positioned relative to each other.
  • a sheet coil manufacturing method capable of preventing a non-uniform non-eroded portion from remaining during etching of a conductive metal layer and making the cross-sectional area of the coil portion uniform. Can be provided.
  • FIG. 1 is an explanatory view schematically showing a first implementation point of the method for manufacturing a sheet coil of the present invention.
  • a conductive metal foil 2 such as a copper foil is pasted on a support plate 1 so that it can be peeled off, and then the upper surface (the back surface when a sheet coil is completed later).
  • the unexposed photosensitive resin film 3 is laminated. Since the support plate 1 is only for supporting the metal foil 2 as being peelable, any material may be used.
  • the metal foil 2 is for forming a coil, and since it needs to be a material that can be etched, it is desirable to use a copper foil.
  • the thickness is determined based on the use of the sheet coil, but considering that it is peeled from the support plate 1, it preferably has a certain thickness, and is at least 5 ⁇ , preferably 70 ⁇ .
  • the photosensitive resin film 3 is made of a photo-curing resin.
  • a dry film such as T1010 (trade name) (25 ⁇ m thickness) manufactured by DuPont, or a liquid resist such as 747 (trade name) manufactured by Kodak Company is used. Can be used.
  • the photosensitive resin film 3 is exposed by polymerizing the mask M, and developed with a developing solution to remove the unexposed portion, and the coil portion 2a described later as shown in FIG.
  • a resist 4 having through holes 4a and 4b having the same shape as the back surface is formed.
  • a portion corresponding to the through-hole 4a of the resist 4 in the unmasked portion in the metal foil 2 in which the coil portion 2a described later is masked by the resist 4 By reaching the lower surface of the metal foil 2 or etching from above to a depth shallower than the thickness of the metal foil 2, the upper surface of the metal foil 2 reaches the recess 5 penetrating the metal foil 2 and the lower surface of the metal foil 2.
  • the recessed part 6 with a bottom which is not to be formed is formed.
  • an uneroded portion 5a similar to the non-uniformly eroded portion 55a shown in FIG. 3B is formed on the lower end opening edge of the recessed portion 5 penetrating the metal foil 2 or the bottom of the bottomed recessed portion 6.
  • the non-eroded portion 6a that prevents penetration remains, but the non-eroded portions 5a and 6a are removed in a later process, and can be ignored at this point.
  • a ferric chloride solution As the etchant, a ferric chloride solution, an ammoniacal alkaline etchant, a cupric chloride solution, or the like can be used.
  • the base material 7 is a sheet coil substrate or base sheet, and is preferably a prepreg, for example, but is a substrate or base sheet made of an acrylic-based thermoplastic resin, a phenol-based thermosetting resin, or the like. It can also be.
  • the thickness of the substrate 7 is preferably 5 microns or more.
  • the unexposed photosensitive resin film 8 similar to the photosensitive resin film 3 is laminated
  • the photosensitive resin film 8 is exposed with the mask M turned upside down, and developed with a developer to remove the unexposed portion, as shown in FIG.
  • the shapes and dimensions of the through holes 9a and 9b are in principle consistent with the shapes and dimensions of the recesses 5 and 6 in the metal foil 2.
  • the resist 9 is removed, and the upper surfaces of the base material 7 and the coil portion 2a are coated with an insulating material (not shown) as necessary.
  • the sheet coil 10 thus formed has a uniform cross-sectional area of the coil portion 2a, it is possible to prevent non-uniform fluctuations in electrical elements such as frequency when used as an electrical element.
  • the performance of the electric device in which the sheet coil 10 is incorporated can be improved.
  • the base material 7 shall consist of a main-body part and the wiring part extended from this main-body part, and at the same time as forming a coil in a main-body part, a coil is formed in a wiring part. It is preferable to form the wiring extending from the metal foil 2. By doing so, it is possible to simultaneously form a wiring portion for connection to another device at the same time as forming the coil.
  • FIG. 2 is an explanatory view schematically showing a second execution point of the sheet coil manufacturing method of the present invention. Note that the same or similar members in FIG. 1 are designated by the same reference numerals, and detailed description thereof will be omitted.
  • a conductive metal foil 2 such as a copper foil, unexposed photosensitivity
  • the resin film 3 and the photosensitive resin film 8 are stuck so as to be peelable from each other and stacked one after another, and when they have a plurality of corresponding positions, for example, when they are all rectangular, positioning holes 11 and 12 are formed at their four corners. , 13 and 14, and guide pins 15 are inserted into them to position each other.
  • the positioning hole 11 provided in the support plate 1 is a bottomed hole, but may be a through hole.
  • a mask M is placed on the photosensitive resin film 8, the photosensitive resin films 8 and 3 are exposed from above, and developed with a developer to remove unexposed portions, and FIG. ), A resist 9 having through-holes 9a and 9b that will later become surface-side resists, and a resist 4 having through-holes 4a and 4b that will later become back-side resists are formed.
  • the mask M is preferably provided with a positioning hole 16 corresponding to the positioning hole 14 and passed through the guide pin 15 to position the mask M and the photosensitive resin film 8.
  • the uppermost resist 9 in FIG. 2B is peeled upward from the resist 4 immediately below it, and all the guide pins 15 are left on the metal foil 2 side, and the support plate 1 is attached to the metal foil. 2 and the guide pin 15 are peeled downward, and the resist 9 peeled upward from the resist 4 is moved in parallel in the posture, that is, without being turned upside down.
  • the positioning holes 14 of the resist 9 are positioned so as to align with the positioning holes 14 of the 9 and placed on the support plate 1, and then the positioning pins 14 of the resist 9 are integrated with the metal foil 2 and the resist 4. And it inserts in the positioning hole 11 of the support plate 1, and as shown in FIG.2 (c), the lower surface of the metal foil 2 is positioned on the resist 9, and it adheres so that peeling is possible.
  • a portion of the metal foil 2 in which a coil portion 2 a described later is masked by the resist 4 that is, a portion corresponding to the through holes 4 a and 4 b of the resist 4.
  • the concave portion 5 penetrating the metal foil 2 and the lower surface of the metal foil 2 are formed on the upper surface of the metal foil 2.
  • the bottomed concave portion 6 that does not reach is formed.
  • non-uniform non-eroded portions 5a and 6a similar to those shown in FIG. 1C remain at the opening edge of the lower end of the recess 5 penetrating the metal foil 2 and the bottom of the bottomed recess 6. However, since the non-eroded portions 5a and 6a are removed in a later step, they can be ignored at this point.
  • the uppermost resist 4 in FIG. 2 (d) is removed, and then a base material 7 is placed on the upper surface of the metal foil 2 as shown in FIG. 2 (e). Is attached to the upper surface of the metal foil 2.
  • the base material 7 is also provided with a positioning hole 17 corresponding to the positioning hole 12 of the metal foil 2, and the positioning hole 17 is passed through the guide pin 15 to position the base material 7 with respect to the metal foil 2. It is preferable to do this.
  • FIG. 2 (e) is turned upside down in this state, and the uppermost support plate 1 is peeled upward from the resist 9 immediately below it, so that FIG. In this state, the portion of the metal foil 2 not masked by the uppermost resist 9 is etched in the same manner as described above. Thereby, the non-uniform non-eroded portions 5a and 6a in the concave portions 5 and 6 shown by the two-dot chain line in FIG. 2 (f) are surely removed, and the eroded surface is flat and uniform as shown in FIG. 2 (g).
  • the concave portions 5 and 6 can be formed, and the sheet coil 10 having a uniform cross-sectional area of the coil portion 2a can be formed as shown in FIG. 1 (f).
  • the positioning hole 17 in the base material 7 and the positioning hole 12 in the metal foil 2 can be used as mounting holes for mounting the sheet coil 10 to a device using the sheet coil.
  • the two layers of the photosensitive resin films 3 and 8 superposed on each other are simultaneously exposed and developed through one mask M.
  • the resists 4 and 9 having the same shape can be formed efficiently with high accuracy.
  • the positioning means formed by the positioning holes 11, 12, 13, 14, 16, 17 and the guide pins 15 removes the uppermost resist 9 in FIG. 2B from the resist 4 immediately below it.
  • the resist 9 can be accurately and quickly positioned with respect to the metal foil 2 and the resist 4 when sandwiched between the support plate 1 and the metal foil 2.
  • resists 9 and 4 are formed on both the front and back surfaces of the metal foil 2 with the through holes 4a and 4b.
  • FIGS. 2 (a) to 2 (b) two layers of the photosensitive resin film 3 overlapped with each other, 8 is simultaneously exposed and developed through one mask M, and then the uppermost resist 9 in FIG. 2 (b) is peeled off from the resist 4 immediately below it, and FIG. 2 (c) is obtained.
  • the support plate 1 and the metal foil 2 are sandwiched, but the state shown in FIG. 2C can also be obtained by another method.
  • the photosensitive resin films 8 and 3 are attached to both the front and back surfaces of the metal foil 2, and the both sides are exposed simultaneously or at different times through the mask M having the same shape, and developed.
  • the resists 9 and 4 may be formed on both the front and back surfaces of the metal foil 2.
  • the present invention is not limited only to the above-described embodiments, and can be implemented in various modified modes as follows, for example, without departing from the scope of the claims.
  • the shapes of the through holes 4a, 4b, 9a, 9b of the resists 4, 9 are not the same as the shapes of the front and back surfaces of the coil portion 2a to be formed, and slightly more than those in anticipation of erosion due to etching. Keep it big.
  • the supporting plate 1, the metal foil 2, and the base material 7 are formed in the same shape in a plan view quadrangle, and the positioning means has an L-shape in plan view in which the inner surface is in contact with the corners of the four corners. It is assumed that it consists of four guide frames (not shown).
  • the coil portion 2a has a spiral shape, a meandering shape, a spur gear-like circular shape with irregularities, and other shapes.
  • the sheet coil manufactured by the sheet coil manufacturing method of the present invention can be suitably used for a resolver or other sheet coil use apparatus.

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)

Abstract

Provided is a sheet coil manufacturing method that makes it possible, during etching of an electrically conductive metal layer, to prevent a residue of a non-uniform un-eroded portion, and to make the cross sectional area of a coil portion uniform. A back surface of an electrically conductive metal foil 2 is masked with a resist 4 having the same shape as a back surface of a coil portion 2a to be formed, and recess portions 5, 6 are formed by performing etching from the back surface of the metal foil 2 to a front surface thereof or to a depth smaller than the thickness of the metal foil 2. Thereafter, the front surface of the metal foil 2 is masked with a resist 9 having the same shape as the resist 4, and etching is performed from the front surface of the metal foil 2 to the recess portions 5, 6 so as to reliably remove un-eroded portions 5a, 6a that have not been removed by the initial etching. The back surface of the metal foil 2 is affixed to the base material 7 as needed.

Description

シートコイルの製造方法Sheet coil manufacturing method
 本発明は、絶縁性の基材の表面に、導電性のコイルを形成するシートコイルの製造方法に関する。 The present invention relates to a sheet coil manufacturing method for forming a conductive coil on the surface of an insulating substrate.
 従来のシートコイルの製造方法は、例えば、図3(a)に示すように、絶縁性の基板51上に、導電性の金属層52を積層してなるベース材53上に、感光性材料を用いて、パターンマスクすなわちレジスト54を形成した後、図3(b)に示すように、レジスト54で被覆されていない金属層52の部分をエッチング除去することにより行われている(例えば特許文献1~3参照)。
特公平3-7127号公報 特許第2518310号公報 特開2000-358351号公報
In the conventional sheet coil manufacturing method, for example, as shown in FIG. 3A, a photosensitive material is applied on a base material 53 formed by laminating a conductive metal layer 52 on an insulating substrate 51. After forming a pattern mask, that is, a resist 54, as shown in FIG. 3B, the metal layer 52 not covered with the resist 54 is removed by etching (for example, Patent Document 1). To 3).
Japanese Patent Publication No. 3-7127 Japanese Patent No. 2518310 JP 2000-358351 A
 しかし、上記のような従来のシートコイルの製造方法によると、エッチングにより金属層52に形成された凹部55の食刻された側面は完全な垂直面ではなく、図3(b)に示すように、基板51に近い部分に、不均一な未浸食部55aが残り、凹部55の断面形状、ひいては金属層52におけるコイルとして残る部分の断面積が不均一になるおそれがある。
 このような未浸食部55aの存在によるコイル部分の断面積の不均一は、シートコイルを電気素子として使用する際に、周波数等の電気的な要素の変動を招き、電気的な性能の低下を招くことになる。
However, according to the conventional sheet coil manufacturing method as described above, the etched side surface of the recess 55 formed in the metal layer 52 by etching is not a complete vertical surface, as shown in FIG. There is a possibility that the non-uniform non-eroded portion 55a remains in the portion close to the substrate 51, and the cross-sectional shape of the concave portion 55 and thus the cross-sectional area of the portion remaining as a coil in the metal layer 52 may be non-uniform.
Such non-uniformity in the cross-sectional area of the coil portion due to the presence of the non-eroded portion 55a causes fluctuations in electrical elements such as frequency when using the sheet coil as an electrical element, resulting in a decrease in electrical performance. Will be invited.
 本発明は、従来の技術が有する上記のような問題点に鑑みてなされたもので、導電性の金属層のエッチング時に、不均一な未浸食部が残存するのを防止し、コイル部分の断面積の均一化を図ることができるようにしたシートコイルの製造方法を提供することを目的としている。 The present invention has been made in view of the above-described problems of the prior art, and prevents non-uniform non-eroded portions from remaining when etching a conductive metal layer, thereby cutting off the coil portion. It is an object of the present invention to provide a method for manufacturing a sheet coil that can achieve uniform area.
 本発明によると、上記課題は、次のようにして解決される。
(1)絶縁性の基材の表面に、導電性のコイルを形成するシートコイルの製造方法において、導電性の金属箔の表裏両面を、形成しようとするコイル部分の表面および裏面と同一か、または対応する形状をなす表面側レジストおよび裏面側レジストをもって、同時に、または異なる時期にマスキングし、前記金属箔の表裏いずれか一方から、裏面もしくは表面に達するか、または前記金属箔の厚さより浅い深さまでエッチングすることにより、凹部を形成し、その後、前記金属箔の表裏いずれか他方から、前記凹部に到達するまでエッチングすることにより、最初のエッチングにより除去できなかった未浸食部を確実に除去し、前記金属箔の裏面を、適時に前記基材に貼着する。
According to the present invention, the above problem is solved as follows.
(1) In the sheet coil manufacturing method for forming a conductive coil on the surface of an insulating base material, the front and back surfaces of the conductive metal foil are the same as the front and back surfaces of the coil portion to be formed, Alternatively, the front side resist and the back side resist having the corresponding shapes are masked at the same time or at different times, and reach the back side or the front side from either the front or back side of the metal foil or a depth shallower than the thickness of the metal foil. Etching is performed to form a recess, and then etching is performed from either the front or back side of the metal foil until reaching the recess, thereby reliably removing the non-eroded portion that could not be removed by the first etching. The back surface of the metal foil is adhered to the substrate in a timely manner.
 このような方法によると、金属箔の表面から1回エッチングするだけでは、どうしても残存する、図3(b)に示すような不均一な未浸食部55aを、金属箔の表裏両面からエッチングすることにより、確実に除去することができ、もってコイル部分の断面積の均一化を図ることができる。
 ひいては、このシートコイルを電気素子として使用する際の、周波数等の電気的な要素の不均一な変動を防止し、このシートコイルが組み込まれた電気装置の性能を高めることができる。
According to such a method, the non-uniformly eroded portion 55a as shown in FIG. 3 (b) that remains by simply etching once from the surface of the metal foil is etched from both the front and back surfaces of the metal foil. Thus, the coil portion can be reliably removed, and the cross-sectional area of the coil portion can be made uniform.
As a result, when this sheet coil is used as an electrical element, non-uniform fluctuations in electrical elements such as frequency can be prevented, and the performance of the electrical apparatus incorporating this sheet coil can be improved.
(2)上記(1)項において、いずれかのエッチング時に、前記金属箔の片面を、支持板または基材に貼着しておく。 (2) In the above item (1), at the time of any etching, one side of the metal foil is adhered to a support plate or a substrate.
 このような方法によると、エッチング時に、支持板または基材により、金属箔を安定よく支持することができる。 According to such a method, the metal foil can be stably supported by the support plate or the base material during etching.
(3)上記(1)または(2)項において、前記金属箔の表裏いずれか一方に、2層の未露光の感光性樹脂皮膜を、互いに剥離可能として重ねて貼着し、その外側からマスクを介在させて露光し、かつ現像液により現像することにより、同一形状の2枚のレジストを形成し、その外側のレジストを内側のレジストから剥離して、前記金属箔の表裏いずれか他方に、前記内側のレジストと位置合わせして貼着することにより、表面側レジストおよび裏面側レジストを形成する。 (3) In the above item (1) or (2), two layers of unexposed photosensitive resin films are laminated and pasted on either of the front and back sides of the metal foil so as to be peelable from each other, and masked from the outside. The two resists having the same shape are formed by exposing them with a developer and developing with a developing solution, and the outer resist is peeled off from the inner resist, on the other side of the metal foil, A front side resist and a back side resist are formed by aligning and adhering to the inner resist.
 このような方法によると、表面側レジストと裏面側レジストとを高精度の同一形状とすることができとともに、金属箔への位置決めも容易に行うことができる。 According to such a method, the front-side resist and the back-side resist can be made into the same shape with high precision and can be easily positioned on the metal foil.
(4)上記(2)項、または上記(2)項を引用する上記(3)項において、前記支持板と金属箔と基材とを、位置決め手段をもって互いに位置決めする。 (4) In the above item (2) or the above item (3) that refers to the above item (2), the support plate, the metal foil, and the base material are positioned with respect to each other by positioning means.
 このような方法によると、金属箔に対する支持板の位置と、金属箔に貼着する基材の位置とを正確に一致させることができる。 According to such a method, the position of the support plate with respect to the metal foil and the position of the base material adhered to the metal foil can be made to coincide with each other accurately.
(5)上記(4)項において、位置決め手段を、前記支持板と金属箔と基材との互いに対応する位置に設けた位置決め孔と、それらに嵌脱しうるガイドピンとを備えるものとする。 (5) In the above item (4), the positioning means includes positioning holes provided at positions corresponding to each other of the support plate, the metal foil, and the base material, and guide pins that can be fitted to and detached from them.
 このような方法によると、支持板と金属箔と基材との相互の位置決めを簡単にかつ迅速に行うことができる。 According to such a method, the support plate, the metal foil, and the base material can be easily and quickly positioned relative to each other.
 本発明によると、導電性の金属層のエッチング時に、不均一な未浸食部が残存するのを防止し、コイル部分の断面積の均一化を図ることができるようにしたシートコイルの製造方法を提供することができる。 According to the present invention, there is provided a sheet coil manufacturing method capable of preventing a non-uniform non-eroded portion from remaining during etching of a conductive metal layer and making the cross-sectional area of the coil portion uniform. Can be provided.
本発明のシートコイルの製造方法の第1の実施要領を模式的に示す説明図である。It is explanatory drawing which shows typically the 1st implementation point of the manufacturing method of the sheet coil of this invention. 本発明のシートコイルの製造方法の第2の実施要領を模式的に示す説明図である。It is explanatory drawing which shows typically the 2nd implementation point of the manufacturing method of the sheet coil of this invention. 従来のシートコイルの製造方法の実施要領を模式的に示す説明図である。It is explanatory drawing which shows typically the implementation point of the manufacturing method of the conventional sheet coil.
 以下、本発明のシートコイルの製造方法の実施要領を、図面に基づいて説明する。
 図1は、本発明のシートコイルの製造方法の第1の実施要領を模式的に示す説明図である。
Hereinafter, the implementation point of the manufacturing method of the sheet coil of this invention is demonstrated based on drawing.
FIG. 1 is an explanatory view schematically showing a first implementation point of the method for manufacturing a sheet coil of the present invention.
 図1(a)に示すように、まず、支持板1上に、銅箔等の導電性の金属箔2を、剥離可能なように貼着し、さらにその上面(後にシートコイル完成時の裏面となる)に、未露光の感光性樹脂皮膜3を積層する。
 支持板1は、金属箔2を剥離可能として支持するためだけのものであるので、材質はどのようなものでもよい。
 金属箔2は、コイルを形成するためのものであり、エッチングできる材質であることが必要であることから、銅箔とするのが望ましい。その厚さは、シートコイルの用途に基づいて定められるが、支持板1から剥離させることを考えると、ある程度の厚さを有することが好ましく、少なくとも5μ以上、好ましくは70μ以上とする。
 感光性樹脂皮膜3は、光硬化性樹脂よりなり、例えばデュポン社製のT1010(商品名)(25μ厚)のようなドライフィルムや、コダック社製の747(商品名)のような液体レジストを使用することができる。
As shown in FIG. 1 (a), first, a conductive metal foil 2 such as a copper foil is pasted on a support plate 1 so that it can be peeled off, and then the upper surface (the back surface when a sheet coil is completed later). The unexposed photosensitive resin film 3 is laminated.
Since the support plate 1 is only for supporting the metal foil 2 as being peelable, any material may be used.
The metal foil 2 is for forming a coil, and since it needs to be a material that can be etched, it is desirable to use a copper foil. The thickness is determined based on the use of the sheet coil, but considering that it is peeled from the support plate 1, it preferably has a certain thickness, and is at least 5μ, preferably 70μ.
The photosensitive resin film 3 is made of a photo-curing resin. For example, a dry film such as T1010 (trade name) (25 μm thickness) manufactured by DuPont, or a liquid resist such as 747 (trade name) manufactured by Kodak Company is used. Can be used.
 次に、感光性樹脂皮膜3に、マスクMを重合させて露光し、かつ現像液により現像して未露光部分を除去して、図1(b)に示すような、後述するコイル部分2aの裏面の形状と同一とした貫通孔4a、4bを有するレジスト4を形成する。 Next, the photosensitive resin film 3 is exposed by polymerizing the mask M, and developed with a developing solution to remove the unexposed portion, and the coil portion 2a described later as shown in FIG. A resist 4 having through holes 4a and 4b having the same shape as the back surface is formed.
 次に、図1(c)に示すように、レジスト4により、後述するコイル部分2aがマスキングされた金属箔2におけるマスキングされていない部分、すなわち、レジスト4の貫通孔4aに相当する部分を、金属箔2の下面に達するか、または金属箔2の厚さより浅い深さまで上方よりエッチングすることにより、金属箔2の上面に、金属箔2を貫通する凹部5や、金属箔2の下面まで達しない有底の凹部6を形成する。 Next, as shown in FIG. 1 (c), a portion corresponding to the through-hole 4a of the resist 4 in the unmasked portion in the metal foil 2 in which the coil portion 2a described later is masked by the resist 4, By reaching the lower surface of the metal foil 2 or etching from above to a depth shallower than the thickness of the metal foil 2, the upper surface of the metal foil 2 reaches the recess 5 penetrating the metal foil 2 and the lower surface of the metal foil 2. The recessed part 6 with a bottom which is not to be formed is formed.
 このとき、金属箔2を貫通する凹部5の下端開口縁部や、有底の凹部6の底部には、図3(b)に示す不均一な未浸食部55aと同様の未浸食部5aや、貫通を妨げる未浸食部6aが残存することとなるが、この未浸食部5a、6aは、後の工程で除去されるので、この時点では、無視して差し支えない。 At this time, an uneroded portion 5a similar to the non-uniformly eroded portion 55a shown in FIG. 3B is formed on the lower end opening edge of the recessed portion 5 penetrating the metal foil 2 or the bottom of the bottomed recessed portion 6. The non-eroded portion 6a that prevents penetration remains, but the non-eroded portions 5a and 6a are removed in a later process, and can be ignored at this point.
 エッチング液としては、塩化第2鉄液、アンモニア性アルカリエッチング液、塩化第2銅液等を用いることができる。 As the etchant, a ferric chloride solution, an ammoniacal alkaline etchant, a cupric chloride solution, or the like can be used.
 エッチング完了後、図1(c)に示す状態から、レジスト4を金属箔2から剥離した後、金属箔2を支持板1から剥離し、次いで上下反転させて、それまでの上面を裏面とし、この裏面を、図1(d)に示すように、絶縁性の基材7上に貼着する。
 基材7は、シートコイルの基板またはベースシートとなるもので、例えば、プリプレグとするのが好ましいが、アクリル系等の熱可塑性樹脂、フェノール系等の熱硬化性樹脂等からなる基板またはベースシートとすることもできる。
 基材7の厚さは、5ミクロン以上とするのが好ましい。
After the etching is completed, from the state shown in FIG. 1 (c), the resist 4 is peeled off from the metal foil 2, and then the metal foil 2 is peeled off from the support plate 1 and then turned upside down. As shown in FIG. 1 (d), this back surface is stuck on an insulating base material 7.
The base material 7 is a sheet coil substrate or base sheet, and is preferably a prepreg, for example, but is a substrate or base sheet made of an acrylic-based thermoplastic resin, a phenol-based thermosetting resin, or the like. It can also be.
The thickness of the substrate 7 is preferably 5 microns or more.
 次に、図1(d)に示すように、金属箔2の上面(シートコイル完成時の表面となる)に、感光性樹脂皮膜3と同様の未露光の感光性樹脂皮膜8を積層し、その感光性樹脂皮膜8に対して、上記のマスクMを上下反転させて介在させて露光し、かつ現像液により現像して、未露光部分を除去し、図1(e)に示すように、後述するコイル部分2aの表面の形状と合致する貫通孔9a、9bを有するレジスト9を形成する。この貫通孔9a、9bの形状および寸法は、原理的には、金属箔2における凹部5、6の形状および寸法と合致している。 Next, as shown in FIG.1 (d), the unexposed photosensitive resin film 8 similar to the photosensitive resin film 3 is laminated | stacked on the upper surface (it becomes the surface at the time of completion of a sheet coil) of the metal foil 2, The photosensitive resin film 8 is exposed with the mask M turned upside down, and developed with a developer to remove the unexposed portion, as shown in FIG. A resist 9 having through holes 9a and 9b that match the shape of the surface of a coil portion 2a described later is formed. The shapes and dimensions of the through holes 9a and 9b are in principle consistent with the shapes and dimensions of the recesses 5 and 6 in the metal foil 2.
 その後、レジスト9によりマスキングされていない金属箔2の部分を、上記と同様の要領でエッチングすることにより、図1(e)に2点鎖線で示す不均一な未浸食部5a、6aを除去すると、図1(f)に示すように、浸食面が平坦で均一な凹部5、6を形成することができ、もって、コイル部分2aの断面積が均一なシートコイル10を形成することができる。 Thereafter, by etching the portion of the metal foil 2 not masked by the resist 9 in the same manner as described above, the non-uniform eroded portions 5a and 6a indicated by the two-dot chain line in FIG. 1 (e) are removed. As shown in FIG. 1 (f), recesses 5 and 6 having a flat eroded surface can be formed, and thus a sheet coil 10 having a uniform cross-sectional area of the coil portion 2a can be formed.
 その後、レジスト9を除去し、必要に応じて、基材7およびコイル部分2aの上面を、絶縁材料(図示略)によりコーティングする。 Thereafter, the resist 9 is removed, and the upper surfaces of the base material 7 and the coil portion 2a are coated with an insulating material (not shown) as necessary.
 このようにして形成されたシートコイル10は、コイル部分2aの断面積が均一であるので、電気素子として使用した際の、周波数等の電気的な要素の不均一な変動を防止することができ、このシートコイル10が組み込まれた電気装置の性能を高めることができる。 Since the sheet coil 10 thus formed has a uniform cross-sectional area of the coil portion 2a, it is possible to prevent non-uniform fluctuations in electrical elements such as frequency when used as an electrical element. The performance of the electric device in which the sheet coil 10 is incorporated can be improved.
 なお、図示は省略してあるが、基材7を、本体部と、該本体部から延出する配線部とからなるものとし、本体部にコイルを形成するのと同時に、配線部に、コイルから延出する配線を、金属箔2から形成するのがよい。
 こうすることによって、コイルを形成するのと同時に、他の機器への接続用の配線部を同時に形成することができる。
In addition, although illustration is abbreviate | omitted, the base material 7 shall consist of a main-body part and the wiring part extended from this main-body part, and at the same time as forming a coil in a main-body part, a coil is formed in a wiring part. It is preferable to form the wiring extending from the metal foil 2.
By doing so, it is possible to simultaneously form a wiring portion for connection to another device at the same time as forming the coil.
 図2は、本発明のシートコイルの製造方法の第2の実施要領を模式的に示す説明図である。なお、図1におけるのと同一または類似の部材には、同一の符号を付して図示するに止め、それらについての詳細な説明は省略する。 FIG. 2 is an explanatory view schematically showing a second execution point of the sheet coil manufacturing method of the present invention. Note that the same or similar members in FIG. 1 are designated by the same reference numerals, and detailed description thereof will be omitted.
 本発明のシートコイルの製造方法の第2の実施要領においては、まず図2(a)に示すように、支持板1上に、銅箔等の導電性の金属箔2、未露光の感光性樹脂皮膜3および感光性樹脂皮膜8を、互いに剥離可能として貼着して順次積み重ね、それらの対応する複数個所、例えば、それらをすべて四角形としたときは、それらの四隅に、位置決め孔11、12、13、14を設け、それらにガイドピン15を挿入して、相互の位置決めをする。
 なお、支持板1に設けた位置決め孔11は、有底孔としてあるが、貫通孔としてもよい。
In the second embodiment of the sheet coil manufacturing method of the present invention, first, as shown in FIG. 2 (a), a conductive metal foil 2, such as a copper foil, unexposed photosensitivity, on a support plate 1. The resin film 3 and the photosensitive resin film 8 are stuck so as to be peelable from each other and stacked one after another, and when they have a plurality of corresponding positions, for example, when they are all rectangular, positioning holes 11 and 12 are formed at their four corners. , 13 and 14, and guide pins 15 are inserted into them to position each other.
The positioning hole 11 provided in the support plate 1 is a bottomed hole, but may be a through hole.
 次に、感光性樹脂皮膜8上にマスクMを載置し、その上方より感光性樹脂皮膜8、3を露光し、かつ現像液により現像して、未露光部分を除去し、図2(b)に示すような、後に表面側レジストとなる貫通孔9a、9bのあるレジスト9、および後に裏面側レジストとなる貫通孔4a、4bのあるレジスト4を形成する。
 なお、マスクMにも、位置決め孔14に対応する位置決め孔16を設け、それをガイドピン15に通して、マスクMと感光性樹脂皮膜8との位置決めを図るのが好ましい。
Next, a mask M is placed on the photosensitive resin film 8, the photosensitive resin films 8 and 3 are exposed from above, and developed with a developer to remove unexposed portions, and FIG. ), A resist 9 having through- holes 9a and 9b that will later become surface-side resists, and a resist 4 having through- holes 4a and 4b that will later become back-side resists are formed.
The mask M is preferably provided with a positioning hole 16 corresponding to the positioning hole 14 and passed through the guide pin 15 to position the mask M and the photosensitive resin film 8.
 次に、図2(b)における、最上位のレジスト9を、その直下のレジスト4から上方に剥離するとともに、すべてのガイドピン15を金属箔2側に残して、支持板1を、金属箔2およびガイドピン15から下方に剥離し、レジスト4から上方に剥離した上記レジスト9を、そのままの姿勢で、すなわち上下反転させることなく、平行移動させる形で、支持板1の位置決め孔11とレジスト9の位置決め孔14とが整合するように位置決めして、支持板1上に載置し、その後、ガイドピン15を、金属箔2およびレジスト4と一体とした状態で、レジスト9の位置決め孔14および支持板1の位置決め孔11に挿入して、図2(c)に示すように、レジスト9上に、金属箔2の下面を位置決めして、剥離可能として貼着する。 Next, the uppermost resist 9 in FIG. 2B is peeled upward from the resist 4 immediately below it, and all the guide pins 15 are left on the metal foil 2 side, and the support plate 1 is attached to the metal foil. 2 and the guide pin 15 are peeled downward, and the resist 9 peeled upward from the resist 4 is moved in parallel in the posture, that is, without being turned upside down. The positioning holes 14 of the resist 9 are positioned so as to align with the positioning holes 14 of the 9 and placed on the support plate 1, and then the positioning pins 14 of the resist 9 are integrated with the metal foil 2 and the resist 4. And it inserts in the positioning hole 11 of the support plate 1, and as shown in FIG.2 (c), the lower surface of the metal foil 2 is positioned on the resist 9, and it adheres so that peeling is possible.
 次に、図2(d)に示すように、レジスト4により、後述するコイル部分2aがマスキングされた金属箔2におけるマスキングされていない部分、すなわち、レジスト4の貫通孔4a、4bに相当する部分を、金属箔2の下面に達するか、または金属箔2の厚さより浅い深さまで上方よりエッチングすることにより、金属箔2の上面に、金属箔2を貫通する凹部5や、金属箔2の下面に達しない有底の凹部6を形成する。 Next, as shown in FIG. 2 (d), a portion of the metal foil 2 in which a coil portion 2 a described later is masked by the resist 4, that is, a portion corresponding to the through holes 4 a and 4 b of the resist 4. To the lower surface of the metal foil 2 or by etching from above to a depth shallower than the thickness of the metal foil 2, the concave portion 5 penetrating the metal foil 2 and the lower surface of the metal foil 2 are formed on the upper surface of the metal foil 2. The bottomed concave portion 6 that does not reach is formed.
 このとき、金属箔2を貫通する凹部5の下端開口縁部や、有底の凹部6の底部には、図1(c)に示すのと同様の不均一な未浸食部5a、6aが残存するが、この未浸食部5a、6aは、後の工程で除去されるので、この時点では無視しても差し支えない。 At this time, non-uniform non-eroded portions 5a and 6a similar to those shown in FIG. 1C remain at the opening edge of the lower end of the recess 5 penetrating the metal foil 2 and the bottom of the bottomed recess 6. However, since the non-eroded portions 5a and 6a are removed in a later step, they can be ignored at this point.
 最初のエッチング終了後、図2(d)における最上位のレジスト4を除去し、次いで、図2(e)に示すように、金属箔2の上面に基材7を載置して、その下面を金属箔2の上面に貼着する。
 このとき、基材7にも、金属箔2の位置決め孔12と対応する位置決め孔17を設けておき、この位置決め孔17をガイドピン15に通して、基材7を金属箔2に対して位置決めするのが好ましい。
After completion of the first etching, the uppermost resist 4 in FIG. 2 (d) is removed, and then a base material 7 is placed on the upper surface of the metal foil 2 as shown in FIG. 2 (e). Is attached to the upper surface of the metal foil 2.
At this time, the base material 7 is also provided with a positioning hole 17 corresponding to the positioning hole 12 of the metal foil 2, and the positioning hole 17 is passed through the guide pin 15 to position the base material 7 with respect to the metal foil 2. It is preferable to do this.
 次に、図2(e)に示す全体を、その状態のまま、上下反転させ、その最上位となった支持板1を、その直下のレジスト9から上方へ剥ぎ取って、図2(f)に示す状態とし、その状態で、最上位のレジスト9によりマスキングされていない金属箔2の部分を、上記と同様の要領でエッチングする。これにより、図2(f)に2点鎖線で示す凹部5、6における不均一な未浸食部5a、6aは確実に除去され、図2(g)に示すように、浸食面が平坦で均一な凹部5、6を形成することができ、もって、図1(f)に示すのと同様の、コイル部分2aの断面積が均一なシートコイル10を形成することができる。 Next, the whole shown in FIG. 2 (e) is turned upside down in this state, and the uppermost support plate 1 is peeled upward from the resist 9 immediately below it, so that FIG. In this state, the portion of the metal foil 2 not masked by the uppermost resist 9 is etched in the same manner as described above. Thereby, the non-uniform non-eroded portions 5a and 6a in the concave portions 5 and 6 shown by the two-dot chain line in FIG. 2 (f) are surely removed, and the eroded surface is flat and uniform as shown in FIG. 2 (g). The concave portions 5 and 6 can be formed, and the sheet coil 10 having a uniform cross-sectional area of the coil portion 2a can be formed as shown in FIG. 1 (f).
 基材7における位置決め孔17、および金属箔2における位置決め孔12は、シートコイル10をシートコイル使用機器に取り付けるための取付孔として使用することができる。 The positioning hole 17 in the base material 7 and the positioning hole 12 in the metal foil 2 can be used as mounting holes for mounting the sheet coil 10 to a device using the sheet coil.
 本発明のシートコイルの製造方法の第2の実施要領によると、互いに重ね合わせた2層の感光性樹脂皮膜3、8を、1枚のマスクMを介して同時に露光し、かつ現像するので、同一形状のレジスト4、9を、精度よく能率的に形成することができる。
 また、位置決め孔11、12、13、14、16、17とガイドピン15とによって形成される位置決め手段により、図2(b)における最上位のレジスト9を、その直下のレジスト4から剥離して、図2(c)に示すように、支持板1と金属箔2との間に挟み込む際に、レジスト9を、金属箔2およびレジスト4に対して正確かつ迅速に位置決めすることができる。
According to the second implementation point of the sheet coil manufacturing method of the present invention, the two layers of the photosensitive resin films 3 and 8 superposed on each other are simultaneously exposed and developed through one mask M. The resists 4 and 9 having the same shape can be formed efficiently with high accuracy.
Further, the positioning means formed by the positioning holes 11, 12, 13, 14, 16, 17 and the guide pins 15 removes the uppermost resist 9 in FIG. 2B from the resist 4 immediately below it. As shown in FIG. 2C, the resist 9 can be accurately and quickly positioned with respect to the metal foil 2 and the resist 4 when sandwiched between the support plate 1 and the metal foil 2.
 本発明のシートコイルの製造方法の第2の実施要領においては、図2(c)に示すように、金属箔2の表裏両面に、レジスト9、4を、それらの貫通孔4a、4bと貫通孔9a、9bとが互いに上下方向に整合するようにして貼着するのに、図2(a)~図2(b)に示すように、互いに重ね合わせた2層の感光性樹脂皮膜3、8を、1枚のマスクMを介して同時に露光し、かつ現像し、その後、図2(b)における最上位のレジスト9を、その直下のレジスト4から剥離して、図2(c)に示すように、支持板1と金属箔2との間に挟み込むようにしているが、別の方法によっても、図2(c)に示す状態とすることもできる。
 例えば、金属箔2の表裏両面に、感光性樹脂皮膜8、3を貼着し、その両面から、同一形状のマスクMを介して、同時か、または時期をずらして露光し、かつ現像して、金属箔2の表裏両面にレジスト9、4を形成するようにしてもよい。
In the second embodiment of the sheet coil manufacturing method of the present invention, as shown in FIG. 2 (c), resists 9 and 4 are formed on both the front and back surfaces of the metal foil 2 with the through holes 4a and 4b. In order to attach the holes 9a and 9b so as to be aligned with each other in the vertical direction, as shown in FIGS. 2 (a) to 2 (b), two layers of the photosensitive resin film 3 overlapped with each other, 8 is simultaneously exposed and developed through one mask M, and then the uppermost resist 9 in FIG. 2 (b) is peeled off from the resist 4 immediately below it, and FIG. 2 (c) is obtained. As shown, the support plate 1 and the metal foil 2 are sandwiched, but the state shown in FIG. 2C can also be obtained by another method.
For example, the photosensitive resin films 8 and 3 are attached to both the front and back surfaces of the metal foil 2, and the both sides are exposed simultaneously or at different times through the mask M having the same shape, and developed. The resists 9 and 4 may be formed on both the front and back surfaces of the metal foil 2.
 本発明は、上記実施形態のみに限定されるものではなく、特許請求の範囲を逸脱することなく、例えば、次のような幾多の変形した態様での実施が可能である。
(1) レジスト4、9の貫通孔4a、4b、9a、9bの形状を、形成しようとするコイル部分2aの表面および裏面の形状と同一ではなく、エッチングによる浸食を見越して、それらよりわずかに大としておく。
(2) 支持板1と金属箔2と基材7とを、同一形状の平面視四角形とし、位置決め手段を、それらの四隅の角部に内面が当接するようにした、平面視L字状の4個の案内枠(図示略)からなるものとする。
(3) コイル部分2aの形状を、渦巻き状、蛇行状、平歯車状の凹凸のある円形、その他の形状とする。
The present invention is not limited only to the above-described embodiments, and can be implemented in various modified modes as follows, for example, without departing from the scope of the claims.
(1) The shapes of the through holes 4a, 4b, 9a, 9b of the resists 4, 9 are not the same as the shapes of the front and back surfaces of the coil portion 2a to be formed, and slightly more than those in anticipation of erosion due to etching. Keep it big.
(2) The supporting plate 1, the metal foil 2, and the base material 7 are formed in the same shape in a plan view quadrangle, and the positioning means has an L-shape in plan view in which the inner surface is in contact with the corners of the four corners. It is assumed that it consists of four guide frames (not shown).
(3) The coil portion 2a has a spiral shape, a meandering shape, a spur gear-like circular shape with irregularities, and other shapes.
 本発明のシートコイルの製造方法により製造したシートコイルは、レゾルバその他のシートコイル使用装置に好適に使用することができる。 The sheet coil manufactured by the sheet coil manufacturing method of the present invention can be suitably used for a resolver or other sheet coil use apparatus.
 1 支持板
 2 金属箔
 2aコイル部分
 3 感光性樹脂皮膜
 4 レジスト(裏面側)
 4a、4b 貫通孔
 5、6 凹部
 5a、6a 未浸食部
 7 基材
 8 感光性樹脂皮膜
 9 レジスト(表面側)
 9a、9b 貫通孔
10 シートコイル
11、12、13、14 位置決め孔
15 ガイドピン
16、17 位置決め孔
M マスク
DESCRIPTION OF SYMBOLS 1 Support plate 2 Metal foil 2a Coil part 3 Photosensitive resin film 4 Resist (back side)
4a, 4b Through hole 5, 6 Recessed portion 5a, 6a Non-eroded portion 7 Base material 8 Photosensitive resin film 9 Resist (surface side)
9a, 9b Through hole 10 Sheet coil 11, 12, 13, 14 Positioning hole 15 Guide pin 16, 17 Positioning hole M Mask

Claims (5)

  1.  絶縁性の基材の表面に、導電性のコイルを形成するシートコイルの製造方法において、
     導電性の金属箔の表裏両面を、形成しようとするコイル部分の表面および裏面と同一か、または対応する形状をなす表面側レジストおよび裏面側レジストをもって、同時に、または異なる時期にマスキングし、前記金属箔の表裏いずれか一方から、裏面もしくは表面に達するか、または前記金属箔の厚さより浅い深さまでエッチングすることにより、凹部を形成し、その後、前記金属箔の表裏いずれか他方から、前記凹部に到達するまでエッチングすることにより、最初のエッチングにより除去できなかった未浸食部を確実に除去し、前記金属箔の裏面を、適時に前記基材に貼着することを特徴とするシートコイルの製造方法。
    In the sheet coil manufacturing method for forming a conductive coil on the surface of an insulating substrate,
    Masking the front and back surfaces of the conductive metal foil simultaneously or at different times with the front-side resist and the back-side resist having the same shape as or corresponding to the front and back surfaces of the coil portion to be formed. From either the front or back side of the foil, it reaches the back side or the front side, or is etched to a depth shallower than the thickness of the metal foil, thereby forming a recess, and then from the front or back side of the metal foil to the recess. Etching until reaching the uncorroded part that could not be removed by the first etching is reliably removed, and the back surface of the metal foil is adhered to the substrate in a timely manner. Method.
  2.  いずれかのエッチング時に、前記金属箔の片面を、支持板または基材に貼着しておくことを特徴とする請求項1記載のシートコイルの製造方法。 The method for producing a sheet coil according to claim 1, wherein one side of the metal foil is adhered to a support plate or a base material during any etching.
  3.  前記金属箔の表裏いずれか一方に、2層の未露光の感光性樹脂皮膜を、互いに剥離可能として重ねて貼着し、その外側からマスクを介在させて露光し、かつ現像液により現像することにより、同一形状の2枚のレジストを形成し、その外側のレジストを内側のレジストから剥離して、前記金属箔の表裏いずれか他方に、前記内側のレジストと位置合わせして貼着することにより、表面側レジストおよび裏面側レジストを形成することを特徴とする請求項1または2記載のシートコイルの製造方法。 Two layers of unexposed photosensitive resin films are laminated and adhered to either the front or back of the metal foil so that they can be peeled from each other, exposed from the outside through a mask, and developed with a developer. By forming two resists of the same shape, peeling the outer resist from the inner resist, and aligning and adhering to the inner resist on either the front or back of the metal foil 3. A method for manufacturing a sheet coil according to claim 1, wherein a front side resist and a back side resist are formed.
  4.  前記支持板と金属箔と基材とを、位置決め手段をもって互いに位置決めすることを特徴とする請求項2、またはそれを引用する請求項3記載のシートコイルの製造方法。 4. The sheet coil manufacturing method according to claim 2, wherein the support plate, the metal foil, and the base material are positioned with respect to each other by positioning means.
  5.  位置決め手段を、前記支持板と金属箔と基材との互いに対応する位置に設けた位置決め孔と、それらに嵌脱しうるガイドピンとを備えるものとした請求項4記載のシートコイルの製造方法。 5. The method for manufacturing a sheet coil according to claim 4, wherein the positioning means includes positioning holes provided at positions corresponding to each other of the support plate, the metal foil, and the base material, and guide pins that can be fitted to and detached from the positioning holes.
PCT/JP2015/082048 2015-11-13 2015-11-13 Sheet coil manufacturing method WO2017081828A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2016509194A JP5981680B1 (en) 2015-11-13 2015-11-13 Sheet coil manufacturing method
PCT/JP2015/082048 WO2017081828A1 (en) 2015-11-13 2015-11-13 Sheet coil manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2015/082048 WO2017081828A1 (en) 2015-11-13 2015-11-13 Sheet coil manufacturing method

Publications (1)

Publication Number Publication Date
WO2017081828A1 true WO2017081828A1 (en) 2017-05-18

Family

ID=56820090

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2015/082048 WO2017081828A1 (en) 2015-11-13 2015-11-13 Sheet coil manufacturing method

Country Status (2)

Country Link
JP (1) JP5981680B1 (en)
WO (1) WO2017081828A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7470403B2 (en) 2020-06-12 2024-04-18 積水フーラー株式会社 Moisture-curing hot melt adhesive

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61106045A (en) * 1984-10-30 1986-05-24 Canon Inc Manufacture of sheet coil
JP2004218033A (en) * 2003-01-17 2004-08-05 Toppan Printing Co Ltd Etching product and etching method
JP2005234607A (en) * 2000-01-26 2005-09-02 Miyake:Kk Communication storage medium and communication system using it

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61251006A (en) * 1985-04-30 1986-11-08 Canon Inc Manufacture of printed coil
JPS627345A (en) * 1985-07-03 1987-01-14 Canon Electronics Inc Manufacture of multilayer seat coil
JP6333055B2 (en) * 2014-05-13 2018-05-30 キヤノン株式会社 Substrate processing method and liquid discharge head substrate manufacturing method

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61106045A (en) * 1984-10-30 1986-05-24 Canon Inc Manufacture of sheet coil
JP2005234607A (en) * 2000-01-26 2005-09-02 Miyake:Kk Communication storage medium and communication system using it
JP2004218033A (en) * 2003-01-17 2004-08-05 Toppan Printing Co Ltd Etching product and etching method

Also Published As

Publication number Publication date
JP5981680B1 (en) 2016-08-31
JPWO2017081828A1 (en) 2017-11-09

Similar Documents

Publication Publication Date Title
KR100688826B1 (en) Manufacturing method of rigid flexible printed circuit board
JP2014027317A (en) Method of manufacturing printed circuit board
JP5464760B2 (en) Multilayer circuit board manufacturing method
CN105430877B (en) The preparation method of flexible PCB, terminal and flexible PCB
TW201815242A (en) Circuit board with coppercircuit and method for manufacturing same
US8377317B2 (en) Method for manufacturing printed circuit board with thick traces
US20100051324A1 (en) Dielectric substrate with holes and method of manufacture
JP5981680B1 (en) Sheet coil manufacturing method
JP2015133342A (en) Wiring board manufacturing method
JP4976766B2 (en) Circuit board manufacturing method
WO2020185261A1 (en) Folded multilayered flexible circuit board and methods of manufacturing thereof
JP2007173727A (en) Method of manufacturing wiring board
CN103717015A (en) The printed circuit board manufacturing method
JP5513637B2 (en) Method for manufacturing printed circuit board
TW201417663A (en) Method for manufacturing package board
JP2013115315A (en) Manufacturing method of wiring board
KR20130078230A (en) A method for manufacturing flexible printed circuit board
JP2006202849A (en) Method of manufacturing wiring circuit board with stiffening plate
JP7002238B2 (en) Manufacturing method of tape base material for wiring board and tape base material for wiring board
CN111279804B (en) Method for manufacturing printed circuit board and laminated structure
JP5513638B2 (en) Printed circuit board
JP2013041963A (en) Method of manufacturing printed wiring board
KR20140064329A (en) Printed circuit board and manufacturing method thereof
CN105714277B (en) The circuit manufacturing method of dry film, the method for plating metal of electric elements and circuit board
US9035191B2 (en) Printed circuit board and method for manufacturing the same

Legal Events

Date Code Title Description
ENP Entry into the national phase

Ref document number: 2016509194

Country of ref document: JP

Kind code of ref document: A

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 15908344

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 15908344

Country of ref document: EP

Kind code of ref document: A1