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WO2017080150A1 - Liquid crystal module and display device - Google Patents

Liquid crystal module and display device Download PDF

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Publication number
WO2017080150A1
WO2017080150A1 PCT/CN2016/081948 CN2016081948W WO2017080150A1 WO 2017080150 A1 WO2017080150 A1 WO 2017080150A1 CN 2016081948 W CN2016081948 W CN 2016081948W WO 2017080150 A1 WO2017080150 A1 WO 2017080150A1
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WIPO (PCT)
Prior art keywords
liquid crystal
chip
back side
circuit board
printed circuit
Prior art date
Application number
PCT/CN2016/081948
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French (fr)
Chinese (zh)
Inventor
付常佳
贾智帅
孟献雷
Original Assignee
乐视控股（北京）有限公司
乐视致新电子科技（天津）有限公司
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Publication of WO2017080150A1 publication Critical patent/WO2017080150A1/en

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/34—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters by control of light from an independent source
    • G09G3/36—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters by control of light from an independent source using liquid crystals

Definitions

  • the present invention relates to the field of display technologies, and in particular, to a liquid crystal module and a display device.
  • TFT-LCD Thin Film Transistor Liquid Crystal Display
  • a chip on film (COF) is folded from the periphery of the liquid crystal panel 2 toward the back side of the back plate 11 of the backlight module 1, and the chip 4 is packaged on the chip-on-film.
  • the printed circuit board cover 5 fixed on the back side of the back panel 11 covers the chip 4 on the side of the back side of the back panel 11.
  • the prior art is generally used for heat dissipation of the chip: the graphite sheet 6 is attached to the side of the flip chip 3 away from the back side of the back sheet 11, and the heat dissipation of the graphite is used to dissipate the chip 4.
  • a disadvantage of the prior art is that the cost of the graphite sheet is relatively high, and attaching the graphite sheet is time consuming and laborious, resulting in a relatively high manufacturing cost of the TFT-LCD.
  • the invention provides a liquid crystal module and a display device, so as to realize heat dissipation of the chip and reduce the manufacturing cost of the liquid crystal module.
  • the liquid crystal module provided by the invention comprises a backlight module, a liquid crystal panel, a flip chip, a chip and a printed circuit board cover, wherein:
  • the backlight module is disposed on a back side of the liquid crystal panel
  • the flip chip is connected to the liquid crystal panel and folded toward the back side of the back panel of the backlight module;
  • the printed circuit board cover is fixed to the back side of the backboard, and covers a portion of the flip chip that is folded toward the back side of the backboard;
  • the chip is packaged on a portion of the flip chip that is folded toward the back side of the back sheet, and is thermally connected to the printed circuit board cover and the back board.
  • the chip is exposed on a side of the flip chip adjacent to the back side of the back sheet.
  • the chip is in thermal contact with the back side of the backboard.
  • a thermal pad is disposed between the flip chip and the printed circuit board cover.
  • the thermal pad is attached to the inner side of the printed circuit board cover, or the thermal pad is attached to a side of the flip chip away from the back side of the back plate.
  • the thermal pad is a thermal silicone pad.
  • the printed circuit board cover has a recessed structure, and the recessed structure is in thermal contact with the flip chip.
  • the recessed structure comprises a rectangular recessed structure or a U-shaped recessed structure.
  • the chip is thermally connected to the printed circuit board cover plate and the back plate, thereby achieving heat dissipation, and the heat dissipation of the chip by the graphite sheet compared with the prior art can reduce the manufacturing cost of the liquid crystal module and simplify the manufacturing process. .
  • the present invention also provides a display device comprising the liquid crystal module according to any of the preceding technical solutions.
  • the display device has better heat dissipation performance and lower manufacturing cost.
  • FIG. 1 is a schematic cross-sectional structural view of a prior art liquid crystal module
  • FIG. 2 is a schematic cross-sectional structural view of a liquid crystal module according to a first embodiment of the present invention
  • FIG. 3 is a schematic cross-sectional structural view of a liquid crystal module according to a second embodiment of the present invention.
  • FIG. 4 is a schematic cross-sectional view showing a liquid crystal module according to a third embodiment of the present invention.
  • the liquid crystal module provided by the embodiment of the present invention includes a backlight module 101, a liquid crystal panel 201, a flip chip 301, a chip 401, and a printed circuit board cover 501, wherein:
  • the backlight module 101 is disposed on the back side of the liquid crystal panel 201;
  • the flip chip 301 is connected to the liquid crystal panel 201 and folded to the back side of the back plate 111 of the backlight module 101;
  • the printed circuit board cover 501 is fixed on the back side of the back plate 111 and covered with a flip chip 301 a portion to the back side of the back plate 111;
  • the chip 401 is packaged on a portion of the flip chip 301 folded toward the back side of the back plate 111, and is thermally connected to the printed circuit board cover 501 and the back plate 111.
  • the structure of the backlight module 101 generally includes a reflective member 112, a light guide plate 113, a light source 114, a film 115, a plastic frame 116, and the like in addition to the back plate 111 shown in the drawing.
  • the structure of the liquid crystal module includes a front frame (not shown) in addition to the structural member shown in the figure.
  • the liquid crystal panel 201 is assembled on the front side of the backlight module 101, and the front frame is from the front side of the liquid crystal panel 201. It is combined with the backlight module 101.
  • a solution for heat dissipation of a chip is to attach a graphite sheet on a side of the flip chip away from the back side of the back sheet, and use the thermal conductivity of the graphite to dissipate heat from the chip. Since the cost of the graphite sheet is relatively high, Moreover, the process precision of attaching the graphite sheet is high, time-consuming and laborious, and the manufacturing cost of the TFT-LCD is relatively high.
  • the back panel of the backlight module and the printed circuit board cover are usually made of a metal material.
  • the chip is thermally connected to the printed circuit board cover and the back plate, thereby achieving heat dissipation.
  • heat dissipation of the chip by the graphite sheet can reduce the manufacturing cost of the liquid crystal module and simplify the manufacturing process.
  • the chip 401 is exposed on the side of the flip chip 301 near the back side of the back plate 111.
  • the specific structural form of realizing the thermal connection between the chip and the printed circuit board cover and the backplane is not limited.
  • the chip 401 is in direct thermal contact with the back side of the back plate 111, and a thermal pad 601 is disposed between the flip chip 301 and the printed circuit board cover 501.
  • the thermal pad 601 can be made of a low cost thermal silica gel pad.
  • the thermal pad 601 may be attached to the inner side of the printed circuit board cover 501 or may be attached to the side of the flip chip 301 away from the back side of the back plate 111.
  • the thermal pad 601 has a lower precision in attaching process, is easy to attach, and has a lower cost.
  • the printed circuit board cover 501 has a recessed structure 502 that is in thermal contact with the flip chip 301.
  • the recessed structure 502 can be formed by a bending process of the printed circuit board cover 501, and the specific shape thereof is not limited.
  • the rectangular recessed structure shown in FIG. 3 is adopted, and the contact area with the flip chip 301 is large, and the heat of the chip can be used. It is quickly exported and facilitates the positioning assembly of the printed circuit board cover 501 and the back plate 111.
  • an arc-shaped recessed structure or a U-shaped recessed structure (as shown in FIG. 4) or the like may be employed.
  • the printed circuit board cover A silicone thermal pad can also be disposed between the 501 and the flip chip 301 to buffer the chip while achieving heat conduction, and can be selected as needed.
  • the embodiment of the invention further provides a display device comprising the liquid crystal module according to any of the foregoing technical solutions.
  • the display device has better heat dissipation performance and lower manufacturing cost.
  • the specific type of display device is not limited, and may be, for example, a liquid crystal display, a liquid crystal television, a tablet, a mobile phone display, or the like.

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  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Nonlinear Science (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Mathematical Physics (AREA)
  • Optics & Photonics (AREA)
  • Computer Hardware Design (AREA)
  • Theoretical Computer Science (AREA)
  • Liquid Crystal (AREA)

Abstract

A liquid crystal module and a display device. The liquid crystal module comprises a backlight module (101), a liquid crystal panel (201), a chip-on-film (301), a chip (401), and a printed circuit board cover plate (501). The backlight module (101) is disposed on the back side of the liquid crystal panel (201). The chip-on-film (301) is connected to the liquid crystal panel (201) and is bent to the back side of a back plate (111) of the backlight module (101). The printed circuit board cover plate (501) is fixed to the back side of the back plate (111), and covers a part of the chip-on-film (301) bent to the back side of the back plate (111). The chip (401) is packaged at the part of the chip-on-film (301) bent to the back side of the back plate (111), and is in thermal conduction connection with the printed circuit board cover plate (501) and the back plate (111). In the technical solution, the chip (401) is in thermal conduction connection with the printed circuit board cover plate (501) and the back plate (111) so as to dissipate heat; compared with dissipating the heat of the chip (4) by means of a graphite sheet (6), the manufacturing cost of the liquid crystal module can be reduced, and the manufacturing process can be simplified.

Description

一种液晶模组及显示装置Liquid crystal module and display device
本申请要求在2015年11月13日提交中国专利局、申请号为201520908099.5、发明名称为“一种液晶模组及显示装置”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。The present application claims priority to Chinese Patent Application No. 201520908099.5, entitled "A Liquid Crystal Module and Display Device", filed on November 13, 2015, the entire contents of in.
技术领域Technical field
本发明涉及显示技术领域，特别是涉及一种液晶模组及显示装置。The present invention relates to the field of display technologies, and in particular, to a liquid crystal module and a display device.
背景技术Background technique
在平板显示装置中，薄膜晶体管液晶显示器(Thin Film Transistor Liquid Crystal Display，简称TFT-LCD)具有体积小、功耗低、制造成本相对较低和无辐射等特点，在当前的平板显示器市场占据了主导地位。Among flat panel display devices, Thin Film Transistor Liquid Crystal Display (TFT-LCD) has the characteristics of small size, low power consumption, relatively low manufacturing cost and no radiation, and has occupied the current flat panel display market. leading position.
如图1所示，TFT-LCD中，覆晶薄膜3(Chip on Film，简称COF)从液晶面板2的周边折向背光模组1的背板11背侧，芯片4被封装在覆晶薄膜3靠近背板11背侧的一侧，背板11背侧所固定的印刷电路板盖板5对芯片4进行遮盖保护。芯片作为TFT-LCD中传输和处理信号的重要部件，对其散热设计的要求也比较高。现有技术针对芯片散热较常采用的方案是：在覆晶薄膜3远离背板11背侧的一侧贴附石墨片6，利用石墨的导热性对芯片4进行散热。As shown in FIG. 1 , in a TFT-LCD, a chip on film (COF) is folded from the periphery of the liquid crystal panel 2 toward the back side of the back plate 11 of the backlight module 1, and the chip 4 is packaged on the chip-on-film. 3 The printed circuit board cover 5 fixed on the back side of the back panel 11 covers the chip 4 on the side of the back side of the back panel 11. As an important component of the transmission and processing signals in the TFT-LCD, the chip has higher requirements for its heat dissipation design. The prior art is generally used for heat dissipation of the chip: the graphite sheet 6 is attached to the side of the flip chip 3 away from the back side of the back sheet 11, and the heat dissipation of the graphite is used to dissipate the chip 4.
现有技术存在的缺陷在于，石墨片的成本比较高，并且贴附石墨片费时费力，从而导致TFT-LCD的制造成本比较高。A disadvantage of the prior art is that the cost of the graphite sheet is relatively high, and attaching the graphite sheet is time consuming and laborious, resulting in a relatively high manufacturing cost of the TFT-LCD.
发明内容Summary of the invention
本发明提供了一种液晶模组及显示装置，以实现芯片散热，降低液晶模组的制造成本。The invention provides a liquid crystal module and a display device, so as to realize heat dissipation of the chip and reduce the manufacturing cost of the liquid crystal module.
本发明提供的液晶模组，包括背光模组、液晶面板、覆晶薄膜、芯片和印刷电路板盖板，其中：The liquid crystal module provided by the invention comprises a backlight module, a liquid crystal panel, a flip chip, a chip and a printed circuit board cover, wherein:
所述背光模组设置于所述液晶面板的背侧；The backlight module is disposed on a back side of the liquid crystal panel;
所述覆晶薄膜与所述液晶面板连接，并且折向所述背光模组的背板背侧；The flip chip is connected to the liquid crystal panel and folded toward the back side of the back panel of the backlight module;
所述印刷电路板盖板固定于所述背板背侧，并且覆盖所述覆晶薄膜折向所述背板背侧的部分； The printed circuit board cover is fixed to the back side of the backboard, and covers a portion of the flip chip that is folded toward the back side of the backboard;
所述芯片封装于所述覆晶薄膜折向所述背板背侧的部分，并且与所述印刷电路板盖板和所述背板导热连接。The chip is packaged on a portion of the flip chip that is folded toward the back side of the back sheet, and is thermally connected to the printed circuit board cover and the back board.
优选的，所述芯片裸露于所述覆晶薄膜靠近所述背板背侧的一侧。Preferably, the chip is exposed on a side of the flip chip adjacent to the back side of the back sheet.
优选的，所述芯片与所述背板背侧导热接触。Preferably, the chip is in thermal contact with the back side of the backboard.
可选的，所述覆晶薄膜与所述印刷电路板盖板之间设置有导热垫。Optionally, a thermal pad is disposed between the flip chip and the printed circuit board cover.
可选的，所述导热垫贴附于所述印刷电路板盖板的内侧，或者所述导热垫贴附于所述覆晶薄膜远离所述背板背侧的一侧。Optionally, the thermal pad is attached to the inner side of the printed circuit board cover, or the thermal pad is attached to a side of the flip chip away from the back side of the back plate.
优选的，所述导热垫为导热硅胶垫。Preferably, the thermal pad is a thermal silicone pad.
可选的，所述印刷电路板盖板具有凹陷结构，所述凹陷结构与所述覆晶薄膜导热接触。Optionally, the printed circuit board cover has a recessed structure, and the recessed structure is in thermal contact with the flip chip.
优选的，所述凹陷结构包括矩形凹陷结构或U形凹陷结构。Preferably, the recessed structure comprises a rectangular recessed structure or a U-shaped recessed structure.
在本发明技术方案中，芯片与印刷电路板盖板和背板导热连接，从而实现散热，相比现有技术通过石墨片对芯片进行散热，可以降低液晶模组的制造成本，并简化制造工艺。In the technical solution of the present invention, the chip is thermally connected to the printed circuit board cover plate and the back plate, thereby achieving heat dissipation, and the heat dissipation of the chip by the graphite sheet compared with the prior art can reduce the manufacturing cost of the liquid crystal module and simplify the manufacturing process. .
本发明还提供了一种显示装置，包括根据前述任一技术方案所述的液晶模组。该显示装置的芯片散热性能较好，并且制造成本较低。The present invention also provides a display device comprising the liquid crystal module according to any of the preceding technical solutions. The display device has better heat dissipation performance and lower manufacturing cost.
附图说明DRAWINGS
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作一简单地介绍，显而易见地，下面描述中的附图是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, a brief description of the drawings used in the embodiments or the prior art description will be briefly described below. Obviously, the drawings in the following description It is a certain embodiment of the present invention, and other drawings can be obtained from those skilled in the art without any creative work.
图1为现有技术液晶模组的截面结构示意图；1 is a schematic cross-sectional structural view of a prior art liquid crystal module;
图2为本发明第一实施例液晶模组的截面结构示意图；2 is a schematic cross-sectional structural view of a liquid crystal module according to a first embodiment of the present invention;
图3为本发明第二实施例液晶模组的截面结构示意图；3 is a schematic cross-sectional structural view of a liquid crystal module according to a second embodiment of the present invention;
图4为本发明第三实施例液晶模组的截面结构示意图。4 is a schematic cross-sectional view showing a liquid crystal module according to a third embodiment of the present invention.
附图标记：Reference mark:
现有技术部分：Existing technology section:
1-背光模组1-backlight module
2-液晶面板2-LCD panel
3-覆晶薄膜 3-clad film
4-芯片4-chip
5-印刷电路板盖板5-printed circuit board cover
6-石墨片6-graphite sheet
11-背板11-backplane
本发明实施例部分：Part of the embodiment of the invention:
101-背光模组101-backlight module
201-液晶面板201-LCD panel
301-覆晶薄膜301-clad film
401-芯片401-chip
501-印刷电路板盖板501-PCB cover
601-导热垫601-thermal pad
502-凹陷结构502-recessed structure
111-背板111-backplane
112-反射片112-reflecting sheet
113-导光板113-Light guide plate
114-光源114-light source
115-膜材115-membrane
116-胶框116- plastic frame
具体实施方式detailed description
为使本发明实施例的目的、技术方案和优点更加清楚，下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。The technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the drawings in the embodiments of the present invention. It is a partial embodiment of the invention, and not all of the embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative efforts are within the scope of the present invention.
如图2所示，本发明实施例提供的液晶模组，包括背光模组101、液晶面板201、覆晶薄膜301、芯片401和印刷电路板盖板501，其中：As shown in FIG. 2, the liquid crystal module provided by the embodiment of the present invention includes a backlight module 101, a liquid crystal panel 201, a flip chip 301, a chip 401, and a printed circuit board cover 501, wherein:
背光模组101设置于液晶面板201的背侧；The backlight module 101 is disposed on the back side of the liquid crystal panel 201;
覆晶薄膜301与液晶面板201连接，并且折向背光模组101的背板111的背侧；The flip chip 301 is connected to the liquid crystal panel 201 and folded to the back side of the back plate 111 of the backlight module 101;
印刷电路板盖板501固定于背板111的背侧，并且覆盖覆晶薄膜301折 向背板111背侧的部分；The printed circuit board cover 501 is fixed on the back side of the back plate 111 and covered with a flip chip 301 a portion to the back side of the back plate 111;
芯片401封装于覆晶薄膜301折向背板111背侧的部分，并且与印刷电路板盖板501和背板111导热连接。The chip 401 is packaged on a portion of the flip chip 301 folded toward the back side of the back plate 111, and is thermally connected to the printed circuit board cover 501 and the back plate 111.
背光模组101的结构除图中所示背板111外，通常还包括反射片112、导光板113、光源114、膜材115、胶框116等结构件。液晶模组的结构除图中所示的结构件外，还包括前框(图中未示出)，液晶面板201组配于背光模组101的前侧，前框从液晶面板201的前侧与背光模组101组配。The structure of the backlight module 101 generally includes a reflective member 112, a light guide plate 113, a light source 114, a film 115, a plastic frame 116, and the like in addition to the back plate 111 shown in the drawing. The structure of the liquid crystal module includes a front frame (not shown) in addition to the structural member shown in the figure. The liquid crystal panel 201 is assembled on the front side of the backlight module 101, and the front frame is from the front side of the liquid crystal panel 201. It is combined with the backlight module 101.
在现有技术中，针对芯片散热较常采用的方案是在覆晶薄膜远离背板背侧的一侧贴附石墨片，利用石墨的导热性对芯片进行散热，由于石墨片的成本比较高，并且贴附石墨片工艺精度要求较高，费时费力，从而导致TFT-LCD的制造成本比较高。In the prior art, a solution for heat dissipation of a chip is to attach a graphite sheet on a side of the flip chip away from the back side of the back sheet, and use the thermal conductivity of the graphite to dissipate heat from the chip. Since the cost of the graphite sheet is relatively high, Moreover, the process precision of attaching the graphite sheet is high, time-consuming and laborious, and the manufacturing cost of the TFT-LCD is relatively high.
在液晶模组中，背光模组的背板与印刷电路板盖板通常采用金属材质，采用本发明实施例的结构方案，芯片与印刷电路板盖板和背板导热连接，从而实现散热，相比现有技术通过石墨片对芯片进行散热，可以降低液晶模组的制造成本，并简化制造工艺。In the liquid crystal module, the back panel of the backlight module and the printed circuit board cover are usually made of a metal material. According to the structural scheme of the embodiment of the invention, the chip is thermally connected to the printed circuit board cover and the back plate, thereby achieving heat dissipation. Compared with the prior art, heat dissipation of the chip by the graphite sheet can reduce the manufacturing cost of the liquid crystal module and simplify the manufacturing process.
如图2所示，芯片401在封装后，裸露于覆晶薄膜301靠近背板111背侧的一侧。在本发明的实施例中，实现芯片与印刷电路板盖板和背板导热连接的具体结构形式不限。As shown in FIG. 2, after being packaged, the chip 401 is exposed on the side of the flip chip 301 near the back side of the back plate 111. In the embodiment of the present invention, the specific structural form of realizing the thermal connection between the chip and the printed circuit board cover and the backplane is not limited.
如图2所示，在该实施例中，芯片401与背板111背侧直接导热接触，覆晶薄膜301与印刷电路板盖板501之间设置有导热垫601。导热垫601可以采用成本低廉的导热硅胶垫。导热垫601可以贴附于印刷电路板盖板501的内侧，也可以贴附于覆晶薄膜301远离背板111背侧的一侧。相比现有技术的石墨片，导热垫601的贴附工艺精度要求较低，贴附简便，而且成本较低。As shown in FIG. 2, in this embodiment, the chip 401 is in direct thermal contact with the back side of the back plate 111, and a thermal pad 601 is disposed between the flip chip 301 and the printed circuit board cover 501. The thermal pad 601 can be made of a low cost thermal silica gel pad. The thermal pad 601 may be attached to the inner side of the printed circuit board cover 501 or may be attached to the side of the flip chip 301 away from the back side of the back plate 111. Compared with the prior art graphite sheet, the thermal pad 601 has a lower precision in attaching process, is easy to attach, and has a lower cost.
如图3所示，在该实施例中，印刷电路板盖板501具有凹陷结构502，凹陷结构502与覆晶薄膜301导热接触。凹陷结构502可以通过印刷电路板盖板501的折弯工艺成型，其具体形状不限，优选采用图3所示的矩形凹陷结构，与覆晶薄膜301的接触面积较大，可以将芯片的热量快速导出，并且有利于印刷电路板盖板501与背板111的定位装配。此外，也可以采用弧形凹陷结构或者U形凹陷结构(如图4所示)等等。采用该设计，印刷电路板盖板501与覆晶薄膜301之间无需设置导热垫，也无需进行导热垫的贴附工序，因此能够进一步节约液晶模组的制造成本。值得一提的是，印刷电路板盖板 501与覆晶薄膜301之间也可设置硅胶导热垫，在实现热传导的同时对芯片进行缓冲保护，可根据需要选择设置。As shown in FIG. 3, in this embodiment, the printed circuit board cover 501 has a recessed structure 502 that is in thermal contact with the flip chip 301. The recessed structure 502 can be formed by a bending process of the printed circuit board cover 501, and the specific shape thereof is not limited. Preferably, the rectangular recessed structure shown in FIG. 3 is adopted, and the contact area with the flip chip 301 is large, and the heat of the chip can be used. It is quickly exported and facilitates the positioning assembly of the printed circuit board cover 501 and the back plate 111. Further, an arc-shaped recessed structure or a U-shaped recessed structure (as shown in FIG. 4) or the like may be employed. According to this design, it is not necessary to provide a thermal pad between the printed circuit board cover 501 and the flip chip 301, and the step of attaching the thermal pad is not required, so that the manufacturing cost of the liquid crystal module can be further saved. It is worth mentioning that the printed circuit board cover A silicone thermal pad can also be disposed between the 501 and the flip chip 301 to buffer the chip while achieving heat conduction, and can be selected as needed.
本发明实施例还提供了一种显示装置，包括根据前述任一技术方案的液晶模组。该显示装置的芯片散热性能较好，并且制造成本较低。显示装置的具体类型不限，例如可以为液晶显示器、液晶电视机、平板电脑、手机显示屏等等。The embodiment of the invention further provides a display device comprising the liquid crystal module according to any of the foregoing technical solutions. The display device has better heat dissipation performance and lower manufacturing cost. The specific type of display device is not limited, and may be, for example, a liquid crystal display, a liquid crystal television, a tablet, a mobile phone display, or the like.
最后应说明的是：以上实施例仅用以说明本发明的技术方案，而非对其限制；尽管参照前述实施例对本发明进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本发明各实施例技术方案的精神和范围。 It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and are not limited thereto; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that The technical solutions described in the foregoing embodiments are modified, or the equivalents of the technical features are replaced. The modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims (9)

  1. 一种液晶模组，其特征在于，包括背光模组、液晶面板、覆晶薄膜、芯片和印刷电路板盖板，其中：A liquid crystal module comprising a backlight module, a liquid crystal panel, a flip chip, a chip and a printed circuit board cover, wherein:
    所述背光模组设置于所述液晶面板的背侧；The backlight module is disposed on a back side of the liquid crystal panel;
    所述覆晶薄膜与所述液晶面板连接，并且折向所述背光模组的背板背侧；The flip chip is connected to the liquid crystal panel and folded toward the back side of the back panel of the backlight module;
    所述印刷电路板盖板固定于所述背板背侧，并且覆盖所述覆晶薄膜折向所述背板背侧的部分；The printed circuit board cover is fixed to the back side of the backboard, and covers a portion of the flip chip that is folded toward the back side of the backboard;
    所述芯片封装于所述覆晶薄膜折向所述背板背侧的部分，并且与所述印刷电路板盖板和所述背板导热连接。The chip is packaged on a portion of the flip chip that is folded toward the back side of the back sheet, and is thermally connected to the printed circuit board cover and the back board.
  2. 根据权利要求1所述的液晶模组，其特征在于，所述芯片裸露于所述覆晶薄膜靠近所述背板背侧的一侧。The liquid crystal module according to claim 1, wherein the chip is exposed on a side of the flip chip adjacent to a back side of the back sheet.
  3. 根据权利要求2所述的液晶模组，其特征在于，所述芯片与所述背板背侧导热接触。The liquid crystal module according to claim 2, wherein the chip is in thermal contact with the back side of the backing plate.
  4. 根据权利要求2所述的液晶模组，其特征在于，所述覆晶薄膜与所述印刷电路板盖板之间设置有导热垫。The liquid crystal module according to claim 2, wherein a thermal pad is disposed between the flip chip and the printed circuit board cover.
  5. 根据权利要求4所述的液晶模组，其特征在于，所述导热垫贴附于所述印刷电路板盖板的内侧，或者所述导热垫贴附于所述覆晶薄膜远离所述背板背侧的一侧。The liquid crystal module according to claim 4, wherein the thermal pad is attached to the inner side of the printed circuit board cover, or the thermal pad is attached to the flip chip away from the back plate One side of the back side.
  6. 根据权利要求4所述的液晶模组，其特征在于，所述导热垫为导热硅胶垫。The liquid crystal module according to claim 4, wherein the thermal pad is a thermally conductive silicone pad.
  7. 根据权利要求2所述的液晶模组，其特征在于，所述印刷电路板盖板具有凹陷结构，所述凹陷结构与所述覆晶薄膜导热接触。The liquid crystal module according to claim 2, wherein the printed circuit board cover has a recessed structure, and the recessed structure is in thermal contact with the flip chip.
  8. 根据权利要求7所述的液晶模组，其特征在于，所述凹陷结构包括矩形凹陷结构或U形凹陷结构。The liquid crystal module according to claim 7, wherein the recessed structure comprises a rectangular recessed structure or a U-shaped recessed structure.
  9. 一种显示装置，其特征在于，包括根据权利要求1～8任一项所述的液晶模组。 A display device comprising the liquid crystal module according to any one of claims 1 to 8.
PCT/CN2016/081948 2015-11-13 2016-05-13 Liquid crystal module and display device WO2017080150A1 (en)

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