[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

WO2016103970A1 - Dispositif d'affichage, procédé de production de dispositif d'affichage et équipement électronique - Google Patents

Dispositif d'affichage, procédé de production de dispositif d'affichage et équipement électronique Download PDF

Info

Publication number
WO2016103970A1
WO2016103970A1 PCT/JP2015/082070 JP2015082070W WO2016103970A1 WO 2016103970 A1 WO2016103970 A1 WO 2016103970A1 JP 2015082070 W JP2015082070 W JP 2015082070W WO 2016103970 A1 WO2016103970 A1 WO 2016103970A1
Authority
WO
WIPO (PCT)
Prior art keywords
organic layer
pixel
pixels
electrode
display device
Prior art date
Application number
PCT/JP2015/082070
Other languages
English (en)
Japanese (ja)
Inventor
昭綱 高木
耕一 永澤
大智 今林
Original Assignee
ソニー株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ソニー株式会社 filed Critical ソニー株式会社
Publication of WO2016103970A1 publication Critical patent/WO2016103970A1/fr

Links

Images

Classifications

    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/302—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements characterised by the form or geometrical disposition of the individual elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/12—Light sources with substantially two-dimensional radiating surfaces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/12—Light sources with substantially two-dimensional radiating surfaces
    • H05B33/22—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of auxiliary dielectric or reflective layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/12—Light sources with substantially two-dimensional radiating surfaces
    • H05B33/26—Light sources with substantially two-dimensional radiating surfaces characterised by the composition or arrangement of the conductive material used as an electrode
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/805—Electrodes
    • H10K59/8052—Cathodes
    • H10K59/80522—Cathodes combined with auxiliary electrodes

Definitions

  • the present disclosure relates to a display device such as an organic electroluminescence device, a manufacturing method thereof, and an electronic apparatus including such a display device.
  • an organic layer including a light emitting layer and a second electrode are formed on a first electrode formed separately for each pixel.
  • an organic layer including any one of the R, G, and B light emitting layers is separately applied to each pixel.
  • Such an organic layer is formed having an end face in a region between the first electrodes.
  • the film formation temperature of the insulating layer (SiO 2 ) is high, and there is room for improvement in positional accuracy. It is desired to realize an element structure capable of improving the deposition position accuracy of the insulating layer and suppressing current leakage through the end face of the organic layer.
  • a display device includes a plurality of pixels each including a light-emitting element over a substrate, and the light-emitting elements are electrically separated and arranged for each pixel in order from the substrate side.
  • a second organic layer that covers the end face of the first organic layer and is different from the first organic layer is formed.
  • the pixel when a plurality of pixels each including a light-emitting element are formed on a substrate, the pixel is electrically separated as a light-emitting element on the substrate for each pixel.
  • the arranged first electrode, an organic layer including any one of a plurality of types of emission colors, and a second electrode are formed in this order, and two or more first adjacent ones among a plurality of pixels are formed.
  • the first organic layer is formed on the pixel and before the formation of the second electrode, the first organic layer is covered with the first organic layer in an area between the first pixels and is different from the first organic layer. Two organic layers are formed.
  • An electronic apparatus includes the display device according to the embodiment of the present disclosure.
  • the first organic layer is covered with a region different from the first organic layer in the region between the two or more adjacent first pixels. Two organic layers are formed. Thereby, generation
  • the film formation temperature is lowered and the film formation position accuracy is improved as compared with the case where an inorganic material is used.
  • the first organic layer is covered with the first organic layer in the region between the two or more adjacent first pixels and is different from the first organic layer.
  • Two organic layers are formed. Thereby, generation
  • the film formation temperature is lowered and the film formation position accuracy is improved as compared with the case where an inorganic material is used.
  • the first organic layer is covered with the first organic layer in a region between two or more adjacent first pixels.
  • a second organic layer different from the organic layer is formed.
  • FIG. 5A It is sectional drawing showing the process of following FIG. 5B. It is sectional drawing showing the process of following FIG. 5C. It is sectional drawing showing the process of following FIG. 5D.
  • FIG. 10 is a cross-sectional view illustrating a configuration of a main part of a display device according to Comparative Example 1-1.
  • FIG. 14 is a cross-sectional view illustrating a configuration of a main part of a display device according to Comparative Example 1-2.
  • FIG. 7 is a cross-sectional view illustrating a configuration of a main part of a display device according to Comparative Example 1-3.
  • FIG. 14 is a cross-sectional view illustrating a configuration of a main part of a display device according to Comparative Example 1-4.
  • FIG. It is sectional drawing showing the principal part structure of the display apparatus shown in FIG. 14 is a plan view illustrating a pixel opening and an organic layer formation region according to Modification 1-1.
  • FIG. 14 is a plan view illustrating a pixel opening and an organic layer formation region according to Modification 1-2.
  • FIG. 10 is a plan view illustrating a pixel opening and an organic layer formation region according to Modification 1-3.
  • FIG. 12 is a plan view illustrating a pixel opening and an organic layer formation region according to Modification 2-1.
  • FIG. 14 is a plan view illustrating a pixel opening and an organic layer formation region according to Modification 2-2.
  • FIG. 10 is a plan view illustrating a pixel opening and an organic layer formation region according to Modification 2-3.
  • FIG. 14 is a plan view illustrating a pixel opening and an organic layer formation region according to Modification 2-4.
  • 12 is a plan view illustrating a pixel opening and an organic layer formation region according to Modification 3-1.
  • FIG. 12 is a plan view illustrating a pixel opening and an organic layer formation region according to Modification 3-2.
  • FIG. FIG. 10 is a plan view illustrating a pixel opening and an organic layer formation region according to Modification 3-3.
  • 10 is a cross-sectional view illustrating a configuration of a main part of a display device according to a second embodiment of the present disclosure.
  • FIG. 14 is a plan view illustrating an example of a pixel opening and an organic layer formation region of the display device illustrated in FIG. 13.
  • FIG. 14 is a plan view illustrating another example of a pixel opening and an organic layer formation region of the display device illustrated in FIG. 13.
  • 12 is a cross-sectional view illustrating a configuration of a main part of a display device according to Comparative Example 2.
  • FIG. 14 is a plan view illustrating a pixel opening and an organic layer formation region according to Modification 4-1.
  • FIG. FIG. 11 is a plan view illustrating a pixel opening and an organic layer formation region according to Modification 4-2.
  • FIG. 11 is a plan view illustrating a pixel opening and an organic layer formation region according to Modification 4-3.
  • FIG. 16 is a plan view illustrating a pixel opening and an organic layer formation region according to Modification 4-4.
  • FIG. 10 is a plan view illustrating a pixel opening and an organic layer formation region according to Modification 5-1.
  • 14 is a plan view illustrating a pixel opening and an organic layer formation region according to Modification 5-2.
  • FIG. 16 is a plan view illustrating a pixel opening and an organic layer formation region according to Modification 5-3.
  • FIG. 16 is a plan view illustrating a pixel opening and an organic layer formation region according to Modification 5-4.
  • FIG. 16 is a plan view illustrating a pixel opening and an organic layer formation region according to Modification 5-5.
  • FIG. 16 is a plan view illustrating a pixel opening and an organic layer formation region according to Modification 5-6.
  • 14 is a plan view illustrating a pixel opening and an organic layer formation region according to Modification 6-1.
  • FIG. 14 is a plan view illustrating a pixel opening and an organic layer formation region according to Modification 6-2.
  • FIG. 16 is a plan view illustrating a pixel opening and an organic layer formation region according to Modification 6-3.
  • FIG. 16 is a plan view illustrating a pixel opening and an organic layer formation region according to Modification 6-4.
  • FIG. 16 is a plan view illustrating a pixel opening and an organic layer formation region according to Modification 6-5.
  • FIG. 16 is a plan view illustrating a pixel opening and an organic layer formation region according to Modification 6-6.
  • FIG. 16 is a plan view illustrating a pixel opening and an organic layer formation region according to Modification 6-7. It is a perspective view showing the composition of a smart phone. It is a perspective view showing the composition of a smart phone. It is a perspective view showing the structure of a television apparatus. It is a figure showing the structure of a mobile telephone. It is a figure showing the structure of a mobile telephone.
  • First embodiment an example of a display device in which an organic layer of a second pixel (B pixel) is formed in a region between adjacent first pixels (R pixel, G pixel)
  • Modifications 1-1 to 1-3 (Other examples of pixel aperture shape) 3.
  • Modified examples 2-1 to 2-4 (example in which an organic layer is formed using a predetermined mask) 4).
  • Modified examples 3-1 to 3-4 (example in which an organic layer is formed using another mask) 5.
  • Second embodiment an example of a display device further including an auxiliary electrode electrically connected to the second electrode 6).
  • Modified examples 4-1 to 4-4 (other examples of pixel aperture shapes) 7).
  • Modified examples 5-1 to 5-6 (example in which an organic layer is formed using a predetermined mask) 8).
  • Modified examples 6-1 to 6-7 (examples where the organic layer is formed using another mask) 9.
  • Application examples (examples of electronic devices)
  • FIG. 1 illustrates a configuration of a display device (display device 1) according to the first embodiment of the present disclosure.
  • the display device 1 is an organic EL display, for example, and has a plurality of pixels PIXC arranged in a matrix in a display area 110A on a substrate (first substrate 11).
  • Each pixel PIXC includes, for example, any of a plurality of types of organic EL elements 10 (10R, 10G, 10B) (light emitting elements) having different emission colors, and any subpixel of the R pixel, the G pixel, and the B pixel. It is equivalent to.
  • a set of R pixel, G pixel and B pixel corresponds to one pixel.
  • the organic EL element 10R is red light LR (wavelength 620 nm to 750 nm), the organic EL element 10G is green light LG (wavelength 495 nm to 570 nm), and the organic EL element 10B is blue light LB (wavelength 450 nm to 450 nm). 495 nm) respectively.
  • the organic EL element 10 will be described.
  • a signal line driving circuit 120 and a scanning line driving circuit 130 for video display, and a power supply circuit (not shown) are provided.
  • FIG. 2 shows a circuit configuration of the pixel PIXC.
  • the pixel PIXC includes, for example, an active pixel circuit, and includes a driving transistor Tr1 and a writing transistor Tr2, and a capacitor Cs disposed between the transistors Tr1 and Tr2. Between the first power supply line (Vcc) and the second power supply line (GND), the organic EL element 10 is connected in series to the transistor Tr1.
  • the signal line driver circuit 120 supplies an image signal to the source electrode of the transistor Tr2 through a plurality of signal lines 120A arranged in the column direction.
  • the scanning line driving circuit 130 sequentially supplies a scanning signal to the gate electrode of the transistor Tr2 through a plurality of scanning lines 130A arranged in the row direction.
  • FIG. 3 shows a cross-sectional configuration of the display device 1 shown in FIG. In FIG. 3, only regions corresponding to the R pixel, G pixel, and B pixel are shown.
  • the display device 1 is a so-called top emission type (top emission type) organic EL display in which light generated in, for example, organic layers (organic layers 15R, 15G, and 15B) described later is extracted from the second electrode 16 side.
  • the organic EL elements 10R, 10G, and 10B are provided between the first substrate 11 and the second substrate 18.
  • a circuit layer (not shown in FIG. 3) including the above-described transistors Tr1, Tr2, etc. is formed on the first substrate 11, and a planarizing film 12 is formed so as to cover the circuit layer.
  • a first electrode 13 as an anode (anode) is provided on the planarizing film 12.
  • the first electrode 13 is electrically connected to the transistor Tr1.
  • a first electrode 13 an organic layer including a light emitting layer (organic layers 15R, 15G, and 15B), and a second electrode 16 as a cathode, for example, are stacked in order from the first substrate 11 side. It is a thing.
  • the organic layers 15R, 15G, and 15B are separately painted for each pixel (formed separately for each pixel).
  • substrate 18 is bonded together through the sealing layer 17 containing a protective film, an adhesive layer, etc.
  • FIG. the configuration of each unit will be described.
  • the first substrate 11 is a drive substrate in which the circuit layer is formed on, for example, glass, a silicon (Si) wafer, a resin, or a conductive substrate.
  • the conductive substrate for example, a substrate whose surface is insulated with silicon oxide (SiO 2 ), resin, or the like is used.
  • the transistors Tr1 and Tr2 formed in the circuit layer are thin film transistors (TFTs) configured by, for example, MOSFETs (Metal Oxide Semiconductor Field Effect Transistors).
  • the planarization film 12 is for planarizing the surface of the first substrate 11 and forming the thickness of each layer of the organic EL element 10 uniformly.
  • the constituent material of the planarizing film 12 include organic materials such as polyimide resin, acrylic resin and novolac resin, or inorganic materials such as silicon oxide (SiO 2 ), silicon nitride (SiN x ), and silicon oxynitride (SiON). Is mentioned.
  • the first electrode 13 is disposed on the planarizing film 12 so as to be electrically separated for each pixel (arranged on the planarizing film 12 with an interval). Specifically, a plurality of first electrodes 13 are arranged at intervals, and a pixel separation film (partition wall) 14 is formed on the plurality of first electrodes 13.
  • the pixel separation film 14 has an opening facing the first electrode 13, and the first electrode 13 is in contact with any one of the organic layers 15R, 15G, and 15B in this opening.
  • the planar shape of the first electrode 13 is, for example, a rectangular shape.
  • Each first electrode 13 functions as an electrode that injects holes, for example, into any of the organic layers 15R, 15G, and 15B.
  • the first electrode 13 has light reflectivity, and it is desirable to increase the luminous efficiency to have as high a reflectance as possible.
  • the constituent material of the first electrode 13 include simple elements or alloys of metal elements such as silver (Ag) and aluminum (Al).
  • the first electrode 13 may be a single layer film including a single metal or an alloy described above, or may be a laminated film. Alternatively, indium tin oxide (ITO) or the like may be used.
  • the pixel separation film 14 is an insulating film for defining a light emitting region (pixel opening) and electrically separating the first electrode 13 for each pixel.
  • the pixel isolation film 14 is made of, for example, a silicon oxide film such as SiO 2 or polyimide.
  • Organic layers 15R, 15G, and 15B are formed in the opening of the pixel separation film 14, and the first electrode 13 is formed.
  • the organic layers 15R, 15G, and 15B include, for example, any one of a plurality of types of emission colors and a hole transport layer (HTL).
  • HTL hole transport layer
  • the organic layers 15R, 15G, and 15B may include, for example, a hole injection layer (HIL: Hole Injection Layer) and an electron transport layer (ETL: Electron Transport Layer).
  • HIL Hole Injection Layer
  • ETL Electron Transport Layer
  • FIG. 4 shows the openings (openings H1a and H1b) of the pixel isolation film 14 and the formation regions of the organic layers 15R, 15G, and 15B according to the present embodiment.
  • the configuration of the cross section taken along the line II in FIG. 4 corresponds to the configuration of FIG.
  • Each of the openings H1a and H1b in the pixel isolation film 14 has a rectangular shape. That is, in this embodiment, each of the R, G, and B pixels is formed in a rectangular region, and the set of these R, G, and B pixels forms a stripe shape.
  • an opening H1a is formed in a region corresponding to the R pixel and the G pixel
  • an opening H1b is formed in a region corresponding to the B pixel.
  • Organic layers 15R and 15G are formed facing the opening H1a
  • an organic layer 15B is formed facing the opening H1b.
  • organic layers 15R and 15G are formed in a region (region between the openings H1a) between two adjacent pixels (here, R pixel and G pixel: first pixel).
  • An organic layer (organic layer 15B1: second organic layer) made of an organic material different from the organic layers 15R and 15G is formed so as to cover each end face of the organic layer).
  • the organic layer 15B1 includes a constituent material of the organic layer 15B of the B pixel (second pixel).
  • the organic layer 15 ⁇ / b> B is formed over substantially the entire region excluding the opening H ⁇ b> 1 a of the R pixel and the G pixel in plan view.
  • a portion extending in a region between the openings H1a in the organic layer 15B corresponds to the organic layer 15B1.
  • the end portion of the organic layer 15B1 desirably has a tapered shape. This is to suppress disconnection of the second electrode 16.
  • the second electrode 16 has optical transparency and is formed over the entire surface of the display region 110A, for example, common to all pixels.
  • the second electrode 16 is made of, for example, an alkali metal such as lithium (Li) or potassium (K) having a low work function, an alkaline earth metal such as magnesium (Mg) or calcium (Ca), and these metals and silver or aluminum. It is preferably formed from a metal material such as an alloy or a mixture thereof. In order to achieve both storage stability and electron injectability at the cathode, the electrode formed of the above material may be further coated with silver, aluminum (Al), gold (Au) or the like having a high work function and high conductivity. Good.
  • the second electrode 16 may be a transparent electrode.
  • the second electrode 16 can be formed by a known method such as a vacuum deposition method, a sputtering method, or an ion plating method.
  • the sealing layer 17 includes a protective film made of, for example, silicon nitride, silicon oxide, or metal oxide, and an adhesive layer made of, for example, a thermosetting resin or an ultraviolet curable resin.
  • the second substrate 18 is made of a material such as glass that is transparent to each color light generated in the organic EL elements 10R, 10G, and 10B.
  • the display device 1 as described above can be manufactured, for example, as follows.
  • 5A to 5E are schematic views for explaining a method for manufacturing the display device 1 of the present embodiment.
  • a plurality of first electrodes 13 are formed on the first substrate 11 at predetermined intervals.
  • the film formation method for the first electrode 13 include a vacuum deposition method, a sputtering method, and an ion plating method.
  • the pixel isolation film 14 made of the above-described material is formed. At this time, by covering the end portion of the first electrode 13 with the pixel separation film 14, it is possible to alleviate an electrical failure due to a step.
  • the pixel isolation film 14 can be formed, for example, by forming the openings H1a and H1b by photolithography or the like after forming SiO 2 by CVD or the like, or after forming polyimide by coating. .
  • organic layers 15R and 15G are sequentially formed so as to cover the first electrode 13 in the opening H1a.
  • the organic layers 15R and 15G are formed in patterns separated from each other so as not to overlap.
  • These organic layers 15R and 15G can be formed by, for example, masking a discontinuous portion (a region between the R pixel and the G pixel) and depositing an organic material by, for example, a vacuum deposition method.
  • the organic layers 15R and 15G can be formed in the above pattern by an inkjet method.
  • the organic layers 15R and 15G are not limited to such a forming method, and may be formed by patterning using etching.
  • the organic layers 15R and 15G are respectively formed in a state extending continuously in the column direction, and then the organic layers 15R and 15G formed in the portion between the first electrodes 13 are selectively etched. You may make it remove. Examples of the etching technique include laser etching, dry etching using photolithography, wet etching, and the like. It is also possible to partially remove the organic layers 15R and 15G with a sharp needle. However, in these etching methods, laser etching is desirable because the organic layers 15R and 15G remaining on the first electrode 13 are not damaged.
  • FIG. 6 schematically shows a configuration example of a vapor deposition apparatus suitable for forming the organic layers 15R, 15G, and 15B as described above in a predetermined pattern.
  • the vapor deposition apparatus includes, for example, a material supply source 120, a heater 121, a vapor deposition belt 122, a vapor deposition heater 123, and a reflection plate 124.
  • the vapor deposition belt 122 is configured to be able to move cyclically between the material supply source 120 and the reflection plate 124.
  • the reflector 124 is provided with a groove 124a, and a part of the vapor deposition belt 122 is exposed to the vapor deposition substrate (first substrate 11) through the groove 124a.
  • the organic material stored in the material supply source 120 is once deposited on the deposition belt 122 by the heat of the heater 121 to form a thin film. Thereafter, the formed thin film is moved to the vicinity of the groove 124a of the reflecting plate 124. In the groove 124a of the reflection plate 124, the thin film on the vapor deposition belt 122 is heated again by the vapor deposition heater 123, whereby an organic material can be vapor-deposited on the vapor deposition substrate.
  • the deposition belt 122 by depositing the organic material stepwise through the deposition belt 122, there are the following merits. That is, in an apparatus in which an organic material is ejected from an ejection hole (deposition hole), clogging of the hole may occur. However, in the deposition apparatus using the above-described deposition belt 122, such clogging occurs. Does not occur. Moreover, since the organic material of a thin film can be vapor-deposited without worrying about redeposition or fixation, the heating temperature by the vapor deposition heater 123 can be set as low as possible. For this reason, the temperature of the mask can be reduced.
  • FIG. 7A schematically shows an arrangement relationship between the ejection holes (deposition holes 1103) and the film formation areas (film formation areas 1102) when a general vapor deposition apparatus is used as a comparative example.
  • the distance between the vapor deposition source and the deposition target substrate 1101 is large.
  • a vapor deposition hole 1103 is provided.
  • the vapor deposition apparatus shown in FIG. 6 since the mask temperature can be reduced, the distance between the vapor deposition source and the deposition target substrate (first substrate 11) can be narrowed.
  • the vapor deposition belt 122 may be disposed in a region corresponding to the area 125. Thereby, it becomes possible to arrange
  • the layout of the vapor deposition belt 122 does not have to be arranged along the vertical direction as illustrated, and can be set freely. For this reason, it is also possible to use the substrate to be deposited in a vertical state.
  • an organic layer 15B is formed.
  • the organic layer 15B is formed in a portion where the organic layers 15R and 15G are not formed so as to cover the end faces of the organic layers 15R and 15G (so that the end faces are not exposed).
  • the organic layer 15B1 is formed so as to cover the end faces of the organic layers 15R and 15G.
  • the organic EL elements 10R, 10G, and 10B can be formed by forming the second electrode 16.
  • the sealing layer 17 is formed so as to cover these organic EL elements 10R, 10G, and 10B, and the second substrate 18 is bonded to complete the display device 1 shown in FIG.
  • a scanning signal is supplied from the scanning line driving circuit 130 to the gate of the transistor Tr2 of each pixel PIXC, and a video signal is output from the signal line driving circuit 120.
  • the voltage is supplied to and held in the holding capacitor Cs via the transistor Tr2.
  • the transistor Tr1 is controlled to be turned on / off according to the signal held in the holding capacitor Cs, whereby the drive current Id is injected into the organic EL element 10 (10R, 10G, 10B) of each pixel PIXC.
  • this drive current Id is injected into the respective light emitting layers of the organic layers 15R, 15G, and 15B through the first electrode 13 and the second electrode 16, holes and electrons are recombined and light emission occurs.
  • Each color light generated from each organic EL element 10R, 10G, 10B is transmitted through the second electrode 16, the sealing layer 17, the second substrate 18 and the like, and is converted into red light LR, green light LG, blue light LB as the second light. The light exits above the substrate 18. In this way, the display device 1 performs video display by the top emission method.
  • FIG. 8A shows a configuration of a main part when the organic layer (organic layer 105) is formed as a layer common to all pixels.
  • a plurality of first electrodes 103 are arranged on the first substrate 101 via the planarizing film 102.
  • a pixel separation film 104 having an opening is formed on the plurality of first electrodes 103, and covers the entire surface of the first electrode 103 and the pixel separation film 104, and an organic layer 105 including a white light emitting layer and the like. Is formed.
  • a second electrode 106 is formed on the organic layer 105.
  • FIG. 8B shows a main part configuration in the case where the organic layer is formed separately for each pixel as Comparative Example 1-2.
  • Comparative Example 1-2 the end face e1 of the organic layer 105R and the end face e2 of the organic layer 105G are in contact with the second electrode 106.
  • current leakage (X1, X2 in the figure) occurs between the first electrode 103 and the second electrode 106 via the end faces e1, e2.
  • FIGS. 8C and 8D a structure in which the organic layer 105 is divided into the pixel separation film 104 as in Comparative Examples 1-3 and 1-4 shown in FIGS. 8C and 8D.
  • a convex portion 104a is formed on the upper surface of the pixel separation film 14, and the organic layer 105 is divided at the convex portion 104a.
  • a recess 104b is formed on the upper surface of the pixel isolation film 104, and the organic layer 105 is divided in the recess 104b.
  • disconnection X3, X4 in the drawing
  • the end faces e1 and e2 of the organic layers 15R and 15G are covered in the region between two adjacent pixels (here, R pixel and G pixel).
  • an organic layer 15B1 is formed (region A in the figure).
  • the second electrode 16 is electrically connected to the end faces e1 and e2 of the organic layers 15R and 15G, and the occurrence of a leakage current between the first electrode 13 and the second electrode 16 is also suppressed.
  • the end surfaces of the organic layers 15R and 15G are covered in a region between two or more adjacent first pixels (here, R pixels and G pixels) and these organic layers are covered.
  • An organic layer (organic layer 15B1) different from the layers 15R and 15G is formed. Thereby, generation
  • the use of the organic layer 15B1 makes it possible to lower the film formation temperature and improve the film formation position accuracy as compared with the case where an inorganic material is used. Therefore, it is possible to improve the display image quality by suppressing the occurrence of leakage current.
  • the organic layer 15B of the B pixel is used as the second organic layer covering the end face of the first organic layer (organic layers 15R and 15G). That is, the organic layer 15B1 includes the constituent material of the organic layer 15B.
  • the organic layer 15B is formed over the entire region excluding the opening H1a, and the organic layer 15B1 is a film continuous with the organic layer 15B (same film). ). That is, it is not necessary to prepare a new material and form a separate pattern as an organic layer covering the end faces of the organic layers 15R and 15G, so that the number of processes and cost do not increase.
  • the R pixel and the G pixel are described as examples of the two or more adjacent first pixels, and the B pixel is described as an example of the second pixel.
  • the second pixel is not limited to this combination. However, it is desirable that the organic layer of the second pixel has lower current leakage than the organic layer of the first pixel. The same applies to the following modifications and embodiments.
  • FIGS. 10A to 10C show pixel openings and organic layer formation regions according to the modified examples 1-1 to 1-3 of the first embodiment.
  • the shape of each pixel is not limited to a rectangular shape, Moreover, you may differ for every pixel.
  • the organic layers 15R and 15G are formed in the openings of the first pixels (R pixels and G pixels), and the openings of these first pixels (R pixels and G pixels) are formed.
  • the organic layer 15B is formed over substantially the entire area except the area.
  • the opening H2a of the first pixel has a square shape or a rectangular shape close to a square shape
  • the opening H2b of the second pixel (B pixel) has a rectangular shape. It may be.
  • two openings H2a are arranged in the column direction, and an opening H2b is formed adjacent to each of these two openings H2a.
  • each opening H2a of the first pixel (R pixel, G pixel) and the second pixel (B pixel) may be a square shape or a rectangular shape close to a square shape.
  • each opening H3 of the first pixel (R pixel, G pixel) and the second pixel (B pixel) may be circular.
  • the first pixel (R pixel, G pixel) is arranged along the outer periphery of, for example, a polygonal shape or a circular shape so as to surround the second pixel (B pixel).
  • FIGS. 11A to 11D show pixel openings and organic layer formation regions according to the modified examples 2-1 to 2-4 of the first embodiment.
  • the organic layer 15B (15B1) is formed over substantially the entire area excluding the opening of the first pixel (R pixel, G pixel), but the formation region of the organic layer 15B (15B1) is limited to this. Is not to be done. That is, if the formation region of the organic layer 15B (15B1) covers the end surfaces of the organic layers 15R and 15G in the region between the first pixels (R pixel and G pixel), the organic layer 15R, It is not necessary to cover the entire end face of 15G.
  • the organic layer 15B may be formed over substantially the entire region excluding these columnar regions.
  • Such an organic layer 15B can be formed using, for example, a mask having a slit-like opening called a shadow mask.
  • the shape of the pixel opening is not limited to a rectangular shape, and as shown in FIG. 11B, the first pixel (R pixel, G pixel) has a square opening H2a. In the formed second pixel (B pixel), a rectangular opening H2b may be formed.
  • the organic layer 15B can be formed in a region excluding each of the row region and the column region where the first pixels (R pixel and G pixel) are arranged.
  • ⁇ Modifications 3-1 to 3-3> 12A to 12C show pixel openings and organic layer formation regions according to the modified examples 3-1 to 3-3 of the first embodiment.
  • the organic layer 15B (15B1) is formed over substantially the entire area excluding the opening of the first pixel (R pixel, G pixel), but the formation region of the organic layer 15B (15B1) is limited to this. Is not to be done. That is, if the formation region of the organic layer 15B (15B1) covers the end surfaces of the organic layers 15R and 15G in the region between the first pixels (R pixel and G pixel), the organic layer 15R, It is not necessary to cover the entire end face of 15G.
  • the organic layer 15B may be formed over substantially the entire region excluding these columnar regions.
  • the non-formation region 15BL of the organic layer 15B is narrower in the region between the R pixels and the G pixel than in the modified example 2-1 (FIG. 11A).
  • Such an organic layer 15B can also be formed using, for example, a shadow mask.
  • the shape of the pixel opening is not limited to a rectangular shape, and as shown in FIG. 12B, the first pixel (R pixel, G pixel) has a square opening H2a. In the formed second pixel (B pixel), a rectangular opening H2b may be formed.
  • a circular opening H3 may be formed in the first pixel (R pixel, G pixel) and the second pixel (B pixel).
  • FIG. 13 illustrates a main configuration of the display device according to the first embodiment of the present disclosure.
  • the display device of the present embodiment is, for example, an organic EL display as in the first embodiment, and has a plurality of pixels PIXC arranged in a matrix in the display region 110A on the first substrate 11. ing.
  • Each pixel PIXC includes any of the organic EL elements 10 (10R, 10G, 10B) (light emitting elements), and corresponds to any one of the R pixel, the G pixel, and the B pixel. .
  • the organic EL elements 10R, 10G, and 10B are provided between the first substrate 11 and the second substrate 18, and sequentially from the first substrate 11 side, the first electrode 13 and the organic layers (organic layers 15R, 15G, 15B) and the second electrode 16 are laminated.
  • substrate 18 is bonded through the sealing layer 17 which is not shown in figure.
  • the end surfaces of the organic layers 15R and 15G are covered with the organic layer 15B1 in the region between the first pixels (R pixels and G pixels). .
  • production of the leakage current via the end surface of organic layer 15R, 15G can be suppressed.
  • an auxiliary electrode 19 electrically connected to the second electrode 16 is formed in a selective region on the first substrate 11 (on the planarizing film 12).
  • the organic layer 15B is not formed on the auxiliary electrode 19, but is formed in contact with the second electrode 16 (having a cathode contact portion 19C).
  • the location where the cathode contact portion 19C (or auxiliary electrode 19) is formed is not particularly limited.
  • the cathode contact portion 19C is disposed in a region between adjacent pixels in the row direction.
  • the cross-sectional configuration taken along the line II-II in FIG. 14A corresponds to the main configuration in FIG. In the example of FIG. 14A, it arrange
  • the organic layer 15B includes the opening H1a of the first pixel (R pixel, G pixel) and the cathode contact portion 19C (auxiliary electrode 19) in plan view. It is formed in the area except for.
  • FIG. 15 shows a main configuration of a display device according to a comparative example (comparative example 2) of the present embodiment.
  • the first electrode 103 and the auxiliary electrode 107 are formed on the first substrate 101 via the planarization film 102.
  • the organic layer is applied separately for each pixel (organic layers 105R and 105G are formed).
  • a common electron transport layer (charge blocking layer) 108 is formed over the entire surface of the first substrate 101.
  • the organic layer 15B is not formed on the auxiliary electrode 19 by forming the organic layer 15B using a predetermined mask. For this reason, the auxiliary electrode 19 and the 2nd electrode 16 can be electrically connected, and a favorable cathode contact is realizable.
  • FIGS. 16A to 16D show pixel openings and organic layer formation regions according to the modified examples 4-1 to 4-4 of the second embodiment.
  • the second embodiment the case where all the R, G, and B pixels are formed in a rectangular region has been exemplified.
  • the shape of each pixel (the opening shape of the pixel separation film) is limited to a rectangular shape. They may not be different for each pixel.
  • the formation position of the cathode contact portion 19C is not limited to that described above.
  • the organic layers 15R and 15G are formed in the openings of the first pixels (R pixels and G pixels), respectively, and the openings of these first pixels (R pixels and G pixels)
  • the organic layer 15B is formed over substantially the entire region excluding the cathode contact portion 19C.
  • a square opening H2a is formed in the first pixel (R pixel, G pixel), and a rectangular opening H2b is formed in the second pixel (B pixel). May be formed.
  • the cathode contact portion 19C may be formed in a region between openings H2b adjacent in the column direction (between B pixels), or as shown in FIG. 16B. In addition, it may be formed at a position adjacent to the opening H2a of the first pixel. Or you may form in the position as shown to FIG. 16C.
  • a circular opening H3 may be formed in the first pixel (R pixel, G pixel) and the second pixel (B pixel).
  • FIGS. 17A to 17F show pixel openings and organic layer formation regions according to the modified examples 5-1 to 5-6 of the second embodiment.
  • the organic layer 15B (15B1) is formed over substantially the entire area excluding the opening of the first pixel (R pixel, G pixel) and the cathode contact portion 19C.
  • the organic layer 15B (15B1) is formed.
  • the formation region is not limited to this. That is, the formation region of the organic layer 15B (15B1) may be formed so as to cover the end surfaces of the organic layers 15R and 15G in the region between the first pixels (R pixel and G pixel). It is not necessary to cover the entire end face of 15G.
  • the first pixels are arranged in a row or column (here, column) region, and the cathode contact portion 19C is formed between adjacent openings H1b.
  • the organic region is formed over substantially the entire region excluding the columnar region including the first pixel (R pixel, G pixel) and the row region including the cathode contact portion 19C.
  • Layer 15B is formed.
  • Such an organic layer 15B can be formed using, for example, a mask having a slit-like opening called a shadow mask.
  • the first pixels are arranged in row or column (here, column) regions, respectively, and the cathode contact portions 19C are arranged between adjacent openings H1a.
  • the organic layer 15B is formed in the region between the organic layers 15B, the organic layer 15B is formed over substantially the entire region excluding the columnar region including the first pixel (R pixel, G pixel).
  • the first pixel (R pixel, G pixel) has a square opening H2a
  • the second pixel (B pixel) has a rectangular opening H2b. May be formed.
  • the cathode contact portion 19C may be formed in a region between the openings H2b as shown in FIG. 17C, or is formed at a position adjacent to the opening H2a as shown in FIG. 17D. May be.
  • the organic layer 15B can be formed in a region excluding each of the row and column regions where the first pixels (R pixels and G pixels) are arranged and the cathode contact portion 19C.
  • FIGS. 18A to 18G show pixel openings and organic layer formation regions according to the modified examples 6-1 to 6-7 of the second embodiment.
  • the organic layer 15B (15B1) is formed over substantially the entire area excluding the opening of the first pixel (R pixel, G pixel) and the cathode contact portion 19C.
  • the organic layer 15B (15B1) is formed.
  • the formation region is not limited to this. That is, the formation region of the organic layer 15B (15B1) may be formed so as to cover the end surfaces of the organic layers 15R and 15G in the region between the first pixels (R pixel and G pixel). It is not necessary to cover the entire end face of 15G.
  • the first pixels are arranged in row or column (here, column) regions, respectively, and the cathode contact portion 19C is located between the openings H1b.
  • the organic layer 15B extends over substantially the entire region excluding the columnar region including the first pixels (R pixel and G pixel) and the row region including the cathode contact portion 19C. Is formed.
  • the non-formation region 15BL of the organic layer 15B is narrower in the region between the R pixels and the G pixel than in the modified example 5-1 (FIG. 17A). . Thereby, most end surfaces of the organic layers 15R and 15G can be covered with the organic layer 15B.
  • Such an organic layer 15B can also be formed using, for example, a predetermined shadow mask.
  • the first pixels (R pixels, G pixels) are respectively arranged in a row-like or column-like (column-like here) region, and the cathode contact portion 19C is located between the R pixels.
  • the organic layer 15B is formed over substantially the entire region excluding the columnar region including the first pixel (R pixel, G pixel).
  • the non-formation region 15BL of the organic layer 15B is narrow in the region between the G pixels where the cathode contact portion 19C is not formed.
  • the first pixel (R pixel, G pixel) has a square opening H2a
  • the second pixel (B pixel)
  • a rectangular opening H2b may be formed.
  • the cathode contact portion 19C may be formed in a region between the adjacent openings H2b as shown in FIG. 18C, or the opening H2a of the first pixel as shown in FIG. 18D. You may form in the adjacent position.
  • the organic layer 15B can be formed in a region excluding each of the row and column regions where the first pixels (R pixels and G pixels) are arranged and the cathode contact portion 19C.
  • a circular opening H3 may be formed in the first pixel (R pixel, G pixel) and the second pixel (B pixel).
  • various layouts and the like of the first pixel, the second pixel, the auxiliary electrode, and the organic layer of the second pixel of the present disclosure can be cited. Moreover, it is not limited to the example mentioned above.
  • various layouts can be realized by using the vapor deposition apparatus shown in FIG. 6, a vapor deposition method using a predetermined shadow mask, or a printing technique.
  • the display devices described in the above embodiments and modifications can be used for electronic devices in various fields that display a video signal input from the outside or a video signal generated inside as a video. In particular, it can be suitably used for medium-sized and small-sized electronic devices. An example is shown below.
  • FIG. 19A and 19B show the appearance of the smartphone 220.
  • the smartphone 220 includes, for example, a display unit 221 and an operation unit 222 on the front side, a camera 223 on the back side, and the display device 1 according to the above embodiment is mounted on the display unit 221.
  • FIG. 20 shows the appearance of the television apparatus 250.
  • the television apparatus 250 includes a main body 251 and a stand 252.
  • the display device 1 according to the above embodiment is mounted on the main body 251.
  • FIG. 21A and 21B show the appearance of the mobile phone 290.
  • FIG. The cellular phone 290 is formed by, for example, connecting an upper housing 291 and a lower housing 292 with a connecting portion (hinge portion) 293, and includes a display 294, a sub display 295, a picture light 296, and a camera 297. ing.
  • the display device 1 of the above embodiment is mounted on the display 294 or the sub display 295.
  • the present disclosure is not limited to the above-described embodiments and the like, and various modifications are possible.
  • the R pixel and the G pixel have been described as examples of the first pixel of the present disclosure
  • the B pixel has been described as an example of the second pixel. Is not limited to this.
  • the materials and thicknesses of the respective layers described in the above embodiments are not limited to those listed, and other materials and thicknesses may be used.
  • the display device does not have to include all the layers described above, or may include other layers in addition to the layers described above.
  • the effect demonstrated in the said embodiment etc. is an example, The effect of this indication may be other effects and may also contain other effects.
  • the present disclosure may be configured as follows.
  • the light emitting element includes, in order from the substrate side, a first electrode electrically separated for each pixel, an organic layer including a light emitting layer of any of a plurality of types of light emitting colors, and a second layer.
  • An electrode, A second organic layer that covers the end face of the first organic layer and is different from the first organic layer is formed in a region between two or more adjacent first pixels among the plurality of pixels.
  • Display device (2) The display device according to (1), wherein the second organic layer includes a constituent material of an organic layer formed in a second pixel having an emission color different from that of the first pixel.
  • the end of the second organic layer has a tapered shape
  • a pixel separation film formed on the plurality of first electrodes and having an opening for each pixel facing the first electrode;
  • the second organic layer is formed in a region excluding the first opening corresponding to the first pixel among the plurality of openings in plan view. Any one of the above (1) to (3)
  • An auxiliary electrode formed in a selective region on the substrate and electrically connected to the second electrode;
  • the plurality of first pixels are arranged in a row or column region, The display device according to (4) or (5), wherein the second organic layer is formed in a region excluding the row or column region in plan view.
  • each opening shape of the pixel separation film is a square shape, a rectangular shape, or a circular shape.
  • a plurality of pixels each including a light emitting element on a substrate includes, in order from the substrate side, a first electrode electrically separated for each pixel, an organic layer including a light emitting layer of any of a plurality of types of light emitting colors, and a second layer.
  • An electrode, A second organic layer that covers the end face of the first organic layer and is different from the first organic layer is formed in a region between two or more adjacent first pixels among the plurality of pixels.
  • An electronic device provided with a display device.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

Le dispositif d'affichage selon l'invention comprend une pluralité de pixels au-dessus d'une plaque de base, ladite pluralité de pixels contenant chacun un élément électroluminescent. Chaque élément électroluminescent a, dans l'ordre à partir du côté de la plaque de base, une première électrode disposée de sorte à être séparée électriquement de pixel en pixel, une couche organique contenant n'importe quelle couche électroluminescente parmi une pluralité de types de couleurs d'émission de lumière, et une seconde électrode. Le dispositif d'affichage comprend une seconde couche organique qui est formée dans une région entre deux premiers pixels voisins ou plus parmi la pluralité de pixels et qui couvre une surface d'extrémité de la première couche organique tout en étant différente de la première couche organique.
PCT/JP2015/082070 2014-12-26 2015-11-16 Dispositif d'affichage, procédé de production de dispositif d'affichage et équipement électronique WO2016103970A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014265276A JP2016126860A (ja) 2014-12-26 2014-12-26 表示装置、表示装置の製造方法および電子機器
JP2014-265276 2014-12-26

Publications (1)

Publication Number Publication Date
WO2016103970A1 true WO2016103970A1 (fr) 2016-06-30

Family

ID=56150004

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2015/082070 WO2016103970A1 (fr) 2014-12-26 2015-11-16 Dispositif d'affichage, procédé de production de dispositif d'affichage et équipement électronique

Country Status (2)

Country Link
JP (1) JP2016126860A (fr)
WO (1) WO2016103970A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112951893A (zh) * 2021-02-26 2021-06-11 京东方科技集团股份有限公司 阵列基板及其制备方法、显示面板和显示装置

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109427847B (zh) 2017-08-29 2020-12-11 京东方科技集团股份有限公司 发光层的制造方法、电致发光器件及显示装置
CN208157411U (zh) 2018-03-27 2018-11-27 京东方科技集团股份有限公司 发光器件和显示装置
US11957001B2 (en) * 2018-09-27 2024-04-09 Sharp Kabushiki Kaisha Display device and method of manufacturing display device
KR20210114094A (ko) 2020-03-09 2021-09-23 삼성디스플레이 주식회사 디스플레이 장치

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002151253A (ja) * 2000-08-18 2002-05-24 Semiconductor Energy Lab Co Ltd 発光装置及び表示装置
JP2007258163A (ja) * 2006-02-24 2007-10-04 Semiconductor Energy Lab Co Ltd 発光装置
JP2008159779A (ja) * 2006-12-22 2008-07-10 Sony Corp 有機電界発光素子および表示装置
WO2009038171A1 (fr) * 2007-09-21 2009-03-26 Toppan Printing Co., Ltd. Affichage électroluminescent organique et son procédé de fabrication
JP2011029542A (ja) * 2009-07-29 2011-02-10 Casio Computer Co Ltd 発光装置、発光装置の製造方法及び電子機器
WO2013038970A1 (fr) * 2011-09-12 2013-03-21 シャープ株式会社 Dispositif électroluminescent, dispositif d'affichage et dispositif d'éclairage
JP2014044938A (ja) * 2012-08-01 2014-03-13 Semiconductor Energy Lab Co Ltd 表示装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002151253A (ja) * 2000-08-18 2002-05-24 Semiconductor Energy Lab Co Ltd 発光装置及び表示装置
JP2007258163A (ja) * 2006-02-24 2007-10-04 Semiconductor Energy Lab Co Ltd 発光装置
JP2008159779A (ja) * 2006-12-22 2008-07-10 Sony Corp 有機電界発光素子および表示装置
WO2009038171A1 (fr) * 2007-09-21 2009-03-26 Toppan Printing Co., Ltd. Affichage électroluminescent organique et son procédé de fabrication
JP2011029542A (ja) * 2009-07-29 2011-02-10 Casio Computer Co Ltd 発光装置、発光装置の製造方法及び電子機器
WO2013038970A1 (fr) * 2011-09-12 2013-03-21 シャープ株式会社 Dispositif électroluminescent, dispositif d'affichage et dispositif d'éclairage
JP2014044938A (ja) * 2012-08-01 2014-03-13 Semiconductor Energy Lab Co Ltd 表示装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112951893A (zh) * 2021-02-26 2021-06-11 京东方科技集团股份有限公司 阵列基板及其制备方法、显示面板和显示装置
US20220278181A1 (en) * 2021-02-26 2022-09-01 Boe Technology Group Co., Ltd. Array substrate, method of manufacturing the same, display panel and display device
US11937461B2 (en) 2021-02-26 2024-03-19 Boe Technology Group Co., Ltd. Array substrate, method of manufacturing the same, display panel and display device

Also Published As

Publication number Publication date
JP2016126860A (ja) 2016-07-11

Similar Documents

Publication Publication Date Title
US11871611B2 (en) Display unit with reflector layer and electronic apparatus
KR102280423B1 (ko) 유기전계발광 표시장치
US9583734B2 (en) OLED micro-cavity structure and method of making
US9236419B2 (en) Organic light emitting display device having electrodes of subpixels with different thicknesses and method of manufacturing the same
US9941484B2 (en) Organic light emitting display device and method of manufacturing the same
US8766282B2 (en) Organic light emitting display with luminescent layers having varying thicknesses to improve color reproducibility
US8471275B2 (en) Organic light emitting device display and method of manufacturing the same
US8922112B2 (en) Light emitting device
KR102413938B1 (ko) 발광 표시 장치 및 그 제조 방법
JP2008135325A (ja) 有機ｅｌ表示装置とその製造方法
WO2016103970A1 (fr) Dispositif d'affichage, procédé de production de dispositif d'affichage et équipement électronique
KR101058117B1 (ko) 박막 증착용 마스크 어셈블리와, 이를 이용한 유기 발광 장치와, 이의 제조 방법
KR20190092650A (ko) 유기발광표시장치 및 그 제조방법
KR102096887B1 (ko) 유기발광 표시장치 및 그것의 제조 방법
KR102517127B1 (ko) 박막 트랜지스터 표시판 및 이를 포함하는 유기 발광 표시 장치
JP2016213052A (ja) 青色有機ｅｌ素子、有機ｅｌ表示パネル及び青色有機ｅｌ素子の製造方法
US8698177B2 (en) Organic light-emitting display device and method of manufacturing the same
JP2015076262A (ja) 表示装置および電子機器
CN104466022A (zh) 一种有机发光二极管显示器件及其制备方法
JP2013134813A (ja) 表示装置
KR101859479B1 (ko) 유기 발광 표시 장치 및 이의 제조 방법
JP2011009093A (ja) 有機ｅｌ装置及び電子機器
CN112640580B (zh) 显示设备及显示设备的制造方法
US20240074231A1 (en) Display device and manufacturing method of display device
CN107946347B (zh) 一种oled显示面板及其制备方法、显示装置

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 15872539

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 15872539

Country of ref document: EP

Kind code of ref document: A1