WO2016186307A1

WO2016186307A1 - Antenna module package and manufacturing method therefor

Info

Publication number: WO2016186307A1
Application number: PCT/KR2016/002905
Authority: WO
Inventors: 나혁휘; 황호석; 김영석; 박성범; 안상훈; 김선호
Original assignee: 주식회사 아이티엠반도체
Priority date: 2015-05-18
Filing date: 2016-03-23
Publication date: 2016-11-24
Also published as: KR20160135632A; KR101686633B1

Abstract

The present invention provides an antenna module package and a manufacturing method therefor, the antenna module package comprising: a chip antenna having a core and an antenna coil wound on at least a part of the core; and an element which is coupled to the chip antenna and can perform an illumination function, in addition to the chip antenna's function, or comprising: a chip antenna having a core and an antenna coil wound on at least a part of the core; and a sensor which is coupled to the chip antenna and recognizes a surrounding situation or is utilized to recognize the same, in addition to the chip antenna's function, or comprising: a chip antenna having a core and an antenna coil wound on at least a part of the core; and a camera module which is coupled to the chip antenna and can photograph an object, in addition to the chip antenna's function.

Description

Antenna module package and its manufacturing method

The present invention relates to an antenna module package and a method of manufacturing the same, and more particularly, to an antenna module package and a method of manufacturing the same that can perform various additional functions in addition to the antenna function.

Recently, batteries have been used in portable terminals such as smartphones and tablet PCs. As the portable terminals develop, various techniques for facilitating the charging of the battery using the above-described wireless charging techniques have been developed. Recently, mobile devices including an antenna function capable of transmitting and receiving various frequency bands including a wireless charging antenna structure have been released.

In addition, products that are directly coupled with the above-mentioned battery of the portable terminal or the main board of the portable terminal have been released. In this case, a process of combining various antenna structures separately from the battery is additionally required, thus increasing the manufacturing cost and additionally for the coupling process. This entails the problem that the space is required and the battery becomes larger for purposes other than charging.

However, when the antenna coil is installed in the portable terminal main body or the portable terminal battery case in order to reduce the thickness in the portable terminal, there is a problem in that a connection contact that is connected to the removable battery is required. In addition, although a coil may be provided on one surface of the battery of the portable terminal, the problem of thickening of the battery cannot be avoided.

The present invention has been made to solve various problems including the above problems, and an object thereof is to provide an antenna module package and a method of manufacturing the same for reducing a common space. However, these problems are exemplary, and the scope of the present invention is not limited thereby.

According to one aspect of the invention, an antenna module package is provided. The antenna module package may include a chip antenna having an antenna coil wound around at least a portion of the core; And a multi-used module coupled to the chip antenna and capable of performing additional functions in addition to the needle antenna function, wherein the additional function module is an element capable of performing an illumination function. It may include at least one of a sensor that is used to recognize or about the situation, and a camera module that can photograph the object.

In the antenna module package, the sensor may include at least one of an illuminance sensor, a heart rate sensor, a temperature sensor, a pressure sensor, a salinity sensor, and a gas sensor.

In the antenna module package, the chip antenna may perform at least one function of an NFC antenna, a wireless charging antenna and a wireless card payment antenna.

In the antenna module package, the chip antenna may include being mounted on a printed circuit board (PCB) or a conductive plate.

In the antenna module package, the lower surface of the substrate may include a pad unit, which may be electrically connected to the main board.

The antenna module package may include a molding part capable of preventing a defect of the chip antenna by sealing at least a portion of the antenna coil with an encapsulant.

In the antenna module package, the chip antenna may include a groove portion penetrating from the upper surface of the core to the lower surface, and the antenna coil may surround the outer surface of the core.

According to another aspect of the present invention, a method of manufacturing an antenna module package is provided. The method of manufacturing the antenna module package may include preparing a chip antenna having an antenna coil wound around at least a portion of a core; Sealing at least a portion of the antenna coil with a first encapsulant to protect the chip antenna; Mounting at least one of an element, a sensor, and a camera module in a groove portion penetrating from an upper surface of the core to a lower surface of the core; And sealing at least one of the device, the sensor, and the camera module with a second encapsulating material in the remaining internal space.

According to another aspect of the present invention, a method of manufacturing an antenna module package is provided. The method of manufacturing the antenna module package includes preparing a substrate; Mounting a chip antenna having an antenna coil wound around at least a portion of the core on the substrate; Sealing at least a portion of the antenna coil with a first encapsulant to protect the chip antenna; Mounting at least one of an element, a sensor, and a camera module in a groove portion penetrating from an upper surface of the core to a lower surface of the core; And sealing at least one of the device, the sensor, and the camera module with a second encapsulating material in the remaining internal space.

According to one embodiment of the present invention made as described above, an antenna module package and a method of manufacturing the same, which are advantageous for integration and miniaturization, are excellent in space utilization, and can perform various additional functions in addition to the antenna function. Of course, the scope of the present invention is not limited by these effects.

1 and 2 are perspective views schematically illustrating the structure of a chip antenna according to an embodiment of the present invention.

3 to 6 are perspective views schematically illustrating a structure of an antenna module package according to various embodiments of the present disclosure.

7 to 11 are perspective views schematically illustrating a method of manufacturing an antenna module package according to an embodiment of the present invention.

12 to 17 are perspective views schematically illustrating a method of manufacturing an antenna module package according to another embodiment of the present invention.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but can be implemented in various forms, and the following embodiments are intended to complete the disclosure of the present invention, the scope of the invention to those skilled in the art It is provided to inform you completely. In addition, the components may be exaggerated or reduced in size in the drawings for convenience of description.

Throughout the specification, when referring to one component, such as a film, region, or substrate, being positioned on, "connected", "stacked" or "coupled" to another component, said one configuration It may be interpreted that an element may be directly "on", "connected", "stacked" or "coupled" to another component, or there may be other components interposed therebetween. On the other hand, when one component is said to be located on another component "directly on", "directly connected", or "directly coupled", it is interpreted that there are no other components intervening therebetween. do. Like numbers refer to like elements. As used herein, the term "and / or" includes any and all combinations of one or more of the listed items.

Although the terms first, second, etc. are used herein to describe various members, parts, regions, layers, and / or parts, these members, parts, regions, layers, and / or parts are defined by these terms. It is obvious that not. These terms are only used to distinguish one member, part, region, layer or portion from another region, layer or portion. Thus, the first member, part, region, layer or portion, which will be discussed below, may refer to the second member, component, region, layer or portion without departing from the teachings of the present invention.

Also, relative terms such as "top" or "above" and "bottom" or "bottom" may be used herein to describe the relationship of certain elements to other elements as illustrated in the figures. It may be understood that relative terms are intended to include other directions of the device in addition to the direction depicted in the figures. For example, if the device is turned over in the figures, elements depicted as present on the face of the top of the other elements are oriented on the face of the bottom of the other elements. Thus, the exemplary term "top" may include both "bottom" and "top" directions depending on the particular direction of the figure. If the device faces in the other direction (rotated 90 degrees relative to the other direction), the relative descriptions used herein can be interpreted accordingly.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the singular forms "a", "an" and "the" may include the plural forms as well, unless the context clearly indicates otherwise. Also, as used herein, "comprise" and / or "comprising" specifies the presence of the mentioned shapes, numbers, steps, actions, members, elements and / or groups of these. It is not intended to exclude the presence or the addition of one or more other shapes, numbers, acts, members, elements and / or groups.

Embodiments of the present invention will now be described with reference to the drawings, which schematically illustrate ideal embodiments of the present invention. In the figures, for example, variations in the shape shown may be expected, depending on manufacturing techniques and / or tolerances. Accordingly, embodiments of the inventive concept should not be construed as limited to the specific shapes of the regions shown herein, but should include, for example, changes in shape resulting from manufacturing.

Referring to FIG. 1, in the chip antenna 100 according to an exemplary embodiment, a coil or a part of a wire is wound around at least a portion of an outer surface of the core 10, so that the antenna coil 20 may be wound. Can be formed. The core 10 may be, for example, a core made of nickel ferrite. In addition, the material of the core 10 may be variously changed according to the wavelength band of the frequency used. In general, the ferrite core is made by compressing iron powder to prevent eddy current loss at a high frequency, and may be electrically connected to an external device. The shape of the core can be designed in various forms. Here, the core 10 is a known technique and a detailed description thereof will be omitted.

It may include at least one antenna coil 20 of the NFC antenna coil, the wireless charging antenna coil and the wireless card payment antenna coil wound on at least a portion of the core 10 described above. If all the antenna coils are formed, each antenna coil 20 may be spaced apart from each other in the same core (10). In addition, when an antenna of another frequency band is required in addition to the antenna function, various antennas may be built according to the size of the core 10 and the arrangement of conductive wires.

More specifically, the chip antenna 1000 including an inductor capable of resonating in a predetermined frequency band may have various winding structures. For example, when the predetermined frequency band is an NFC frequency band, the NFC antenna coil 20 may be formed in a predetermined shape on the edge of the core 10. The NFC antenna coil 20 may generate a frequency band for NFC communication of 13.56 MHz by using the resonance generated in the capacitor to communicate with the NFC device.

Meanwhile, the NFC antenna coil 20 may be formed by winding at least a portion of the outer surface of the core 10 at least once. The shape in which the NFC antenna coil 20 is wound is in the form of a loop, and the loop has an arbitrary shape capable of generating inductance, and the loop is not necessarily limited to a closed loop.

In the same manner as the NFC antenna coil 20, the wireless charging antenna coil and the wireless card payment antenna coil may be formed by winding at least a portion of the outer surface of the core at least once. At this time, NFC antenna coil 20, wireless charging antenna coil and wireless card payment antenna coil may be spaced apart from each other side by side. Here, when both ends of the wireless charging antenna coil is electrically connected to the capacitor to form a closed loop, by using the resonance generated from the capacitor can generate a frequency band of 125 kHz for wireless charging communication to communicate with the wireless charging device. .

On the other hand, when both ends of the wireless card payment antenna coil is electrically connected to the capacitor, it is possible to communicate with the mobile payment system by generating a frequency band of about 250 kHz for wireless card payment using the resonance generated from the capacitor. Here, the about 250 kHz frequency band may be changed depending on whether the domestic or foreign radio transmission / reception frequency band is used.

In addition, the wireless card payment frequency band is a frequency band used for mobile payment, a frequency band that can be transmitted and received wirelessly with a separate external device to connect the information of the debit card or credit card to the smartphone app and the smartphone It means. In addition, the wireless card payment antenna function may control a security function from a control unit included in a main body such as a driver IC or a smartphone. Here, the wireless card payment antenna function may be understood as a magnetic secure transmission technology.

In addition, although not shown here, the chip antenna 100 may form a pad portion (not shown) on the top or bottom surface. The pad part may include a plurality of connection terminals, and may include a conductive pad. The pad may be electrically connected to the main board. In addition, since an insulator is formed between the pad part and the core 10, the connection terminals may be insulated from each other.

The motherboard includes a motherboard of an electronic device (for example, a smartphone, a mobile phone, a smart pad, a tablet computer) that is electrically connected to the battery pack and can be powered from the battery pack or supply power to the battery pack. can do. Hereinafter, the main board may be referred to as a main set.

Referring to FIG. 2, the chip antenna 100 has the antenna coil 20 wound around the outer surface of the core 10 as described above with reference to FIG. 1, and a detailed description thereof will be described with reference to FIG. 1. The same description as above will be omitted. On the other hand, the difference between the chip antenna 100 shown in FIG. 1 and the chip antenna 100 shown in FIG. 2 is in the inner space formed by the groove portion H penetrating from the upper surface of the core 10 to the lower surface. . By combining at least one or more multi-used modules (not shown) capable of performing additional functions in addition to the antenna function in the internal space, various additional functions may be simultaneously performed. For example, space utilization of portable electronic devices such as smartphones may be increased. Here, the additional function module (not shown) may include, for example, at least one or more of an element, a sensor, and a camera module. Detailed description thereof will be described later with reference to FIGS. 3 to 6.

Referring to FIG. 3, the antenna module package 1100 according to an embodiment of the present invention is combined with the chip antenna 100 shown in FIG. 1 or 2, and performs additional functions in addition to the chip antenna 100 function. As an additional function module (not shown), which may include an element 200 capable of performing an illumination function. Here, the device 200 may be largely classified into, for example, an LED device or a lamp device, and the LED device may include a flash LED, a general LED, a LED of a wafer level packaging (WLP), and a chip scale. Packaging), and at least one of an infrared (IR) LED. Here, in the case of the device 200, one of the above-described devices may be used. In addition, one of commercially available devices may be selected according to a desired characteristic (use), and the device 200 is a known technology. Detailed description will be omitted.

In detail, when the chip antenna 100 illustrated in FIG. 1 is used, the antenna function and the lighting function may be simultaneously performed by stacking the elements 200 on the top surface of the chip antenna 100. Detailed description of the chip antenna 100 is the same as described above with reference to Figure 1 will be omitted. In this case, since a separate molding process can be omitted, process time and cost can be reduced.

On the other hand, when the chip antenna 100 shown in FIG. 2 is used, the device 200 may be disposed in an inner space divided by the groove portion H penetrating from the top to the bottom of the core 10. If the device 200 and the chip antenna 100 having the same size are used, a much more advantageous effect can be obtained in terms of space utilization.

Referring to FIG. 4, the antenna module package 1200 according to another embodiment of the present invention, wherein the antenna module package 1200 is described above with reference to FIG. 3, the chip antenna illustrated in FIG. 1 or 2. An additional function module (not shown) coupled with the 100 and capable of performing additional functions in addition to the chip antenna 100 function, includes a sensor 300 that is used to recognize or recognize a surrounding situation. can do. Here, the sensor 300 may include, for example, at least one of an illuminance sensor, a heart rate sensor, a temperature sensor, a pressure sensor, a salinity sensor, and a gas sensor, in addition to the above functions, depending on the type of material to be detected. Various sensors can be used, and at this time, one of commercialized sensors can be selected according to desired characteristics. Each sensor 300 is a known technique and a detailed description thereof will be omitted. In addition, the method of coupling the chip antenna 100 and the sensor 300 is the same as described above with reference to FIG.

Referring to FIG. 5, as an antenna module package 1300 according to another embodiment of the present invention, the antenna module package 1300 is described above with reference to FIG. 4 in addition to the antenna module package 1100 shown in FIG. 3. One sensor 300 may further include. In this case, a chip antenna 100 larger than the size of the chip antenna 100 shown in FIG. 3 may be used. Therefore, in addition to the antenna function, an additional function module (not shown) that performs different additional functions that may simultaneously perform an illumination function and various sensor functions may be combined and mounted in an internal space of the chip antenna 100. In this case, space utilization is more advantageous. In addition, it is possible to selectively add or change devices that can perform other additional functions.

For example, the antenna module package 1300 may include a chip antenna 100. In addition, coupled to the chip antenna 100, using a flash LED device 200, which can perform an illumination function in addition to the chip antenna 100 function, and is disposed adjacent to the flash LED device 200 When the light sensor 300 is coupled to the chip antenna 100 and can operate according to the brightness of light in the vicinity of the object, the flash LED device 200 and the light sensor 300 are mutually different. It can work in conjunction. If the surrounding of the object is dark, the illuminance sensor 300 operates by operating any arbitrary switch, and as the illuminance sensor 300 detects the brightness of the surrounding, the controller (not shown) included in the electronic device is used. The flash LED device 200 may be operated to brighten the periphery of the object.

Referring to FIG. 6, as an antenna module package 1400 according to another embodiment of the present invention, the antenna module package 1400 is described with reference to FIGS. 3 to 5, as shown in FIG. 1 or FIG. 2. As an add-on module (not shown) coupled to the chip antenna 100 shown in FIG. 2 and performing additional functions in addition to the chip antenna 100 function, the camera module 400 may capture an object. can do. Here, in the case of the camera module 400, one of commercially available camera modules may be selected according to desired characteristics, and the camera module 400 is already known and a detailed description thereof will be omitted. In addition, the method of coupling the chip antenna 100 and the camera module 400 is the same as described above with reference to FIGS.

7 and 8, a method of manufacturing an antenna module package according to an embodiment of the present invention may prepare the chip antenna 100 shown in FIG. 2. The chip antenna 100 may include an inner space formed by the groove portion H penetrating from the upper surface of the core 10 to the lower surface. And it may include an antenna coil 20 surrounding the outer surface of the core 10 at least once. Thereafter, at least a part of the antenna coil 20 may be sealed with the first encapsulant 30 to protect the chip antenna 100. For example, the first encapsulant 30 may use an epoxy molding compound (EMC) or an epoxy. If the EMC is used as an encapsulant, it is advantageous to minimize the effect of electromagnetic waves on the human body due to the excellent electromagnetic wave blocking effect.

9 to 10, the device 200 and the sensor 300 may be mounted in the internal spaces shown in FIGS. 7 and 8. Afterwards, the antenna module package 1300 may be manufactured by sealing the second encapsulant 40 in the remaining internal space after the device 200 and the sensor 300 are mounted. Here, the first encapsulant 30 and the second encapsulant 40 may be molding members of the same material.

Referring to FIG. 11, a bottom surface of the antenna module package 1300 is illustrated, and the pad unit 11 of the chip antenna 100 and the pad 200 may be electrically connected to the main board.

Parts

210 and 310 may be formed, respectively.

Meanwhile, in order to add other additional functions in addition to the antenna function, at least one or more of the device 200, the sensor 300, and the camera module 400 shown in FIG. 6 are mounted, and the remaining inner space is filled with the second encapsulant 40. ) Can also be sealed. Here, the detailed description of the device 200, the sensor 300 and the camera module 400 is the same as described above with reference to Figure 6 will be omitted.

Referring to FIG. 12, in the method of manufacturing an antenna module package according to another embodiment of the present disclosure, first, a substrate 50 may be prepared. The substrate 50 may use, for example, a conductive plate such as a printed circuit board (PCB) or a lead frame.

In the case of using a printed circuit board (PCB) as the substrate 50, since a pad portion for contacting each element is already formed, the elements can be easily mounted, and when using a lead frame, a plurality of spaced apart from each other Elements may be mounted on a lead frame made of leads. In addition, in the embodiments of the present invention, the lead frame is a structure in which lead terminals are patterned on a metal frame, and may be distinguished from a printed circuit board having a metal wiring layer formed on an insulating core in structure or thickness thereof. Therefore, when using the lead frame as a substrate, the thickness is significantly reduced than when using a printed circuit board (PCB) has a great advantage in terms of space utilization. When using the lead frame as a substrate, there may be a process advantage because it only needs to go through the sealing step once.

Hereinafter, for convenience of description, an antenna module package using a printed circuit board (PCB) as the substrate 50 will be described in an embodiment of the present invention.

For example, as shown in FIG. 15, the pad unit 51 may be electrically connected to the chip antenna 100, the element 200, and the sensor 300 to be mounted on the upper surface of the prepared printed circuit board 50. It may include.

13 and 14, the chip antenna 100 illustrated in FIG. 2 may be prepared later. The chip antenna 100 may include an inner space formed by the groove portion H penetrating from the upper surface of the core 10 to the lower surface. And it may include an antenna coil 20 surrounding the outer surface of the core 10 at least once. Thereafter, at least a part of the antenna coil 20 may be sealed with the first encapsulant 30 to protect the chip antenna 100. For example, the first encapsulant 30 may use an epoxy molding compound (EMC) or an epoxy.

15 to 16, the device 200 and the sensor 300 may be mounted in the internal spaces shown in FIGS. 13 and 14. Afterwards, the antenna module package 1300 may be manufactured by sealing the second encapsulant 40 in the remaining internal space after the device 200 and the sensor 300 are mounted. Here, the first encapsulant 30 and the second encapsulant 40 may be molding members of the same material.

Referring to FIG. 17, the lower surface of the antenna module package 1300 is illustrated, and the pad units 52 may be electrically connected to the main board to electrically connect the chip antenna 100, the element 200, and the sensor 300. It may be formed.

As described above, an additional function module capable of performing a separate function may be added to a chip antenna capable of performing at least one antenna function among an NFC antenna, a wireless charging antenna, and a wireless card payment antenna, thereby reducing common space. It can contribute to the size reduction of the actual product used. The add-on module may be connected to the mainboard of the mobile device without being large in size, for example, a device capable of performing a lighting function, a sensor and a camera module used to recognize or recognize an ambient situation. All parts can be.

Further, in addition to the space utilization effect, additional devices having similar functions, for example, a bonding process or a molding process, which are separately performed by combining elements and sensors on one chip antenna or by placing them in an internal space of the chip antenna, may be used. Omitted, process time and cost reduction effect can be obtained.

Although the present invention has been described with reference to one embodiment shown in the drawings, this is merely exemplary, and those skilled in the art will understand that various modifications and equivalent other embodiments are possible therefrom. Therefore, the true technical protection scope of the present invention will be defined by the technical spirit of the appended claims.

Claims

A chip antenna having an antenna coil wound around at least part of the core; And

A multi-used module coupled to the chip antenna and capable of performing additional functions in addition to the needle antenna function;

Including,

The additional function module includes at least one of a device capable of performing an illumination function, a sensor used to recognize or recognize a surrounding situation, and a camera module capable of photographing an object.

Antenna module package.
The method of claim 1,

The sensor includes at least one of an illuminance sensor, a heart rate sensor, a temperature sensor, a pressure sensor, a salinity sensor, and a gas sensor,

Antenna module package.
The method according to claim 1 or 2,

The chip antenna may perform at least one function of an NFC antenna, a wireless charging antenna and a wireless card payment antenna,

Antenna module package.
The method according to claim 1 or 2,

The chip antenna may be mounted on a printed circuit board (PCB) or a conductive plate,

Antenna module package.
The method according to claim 1 or 2,

The lower surface of the substrate includes a pad portion, which can be electrically connected to the main board,

Antenna module package.
The method according to claim 1 or 2,

By including at least a portion of the antenna coil sealed with an encapsulant comprising a molding that can prevent the defect of the chip antenna,

Antenna module package.
The method according to claim 1 or 2,

The chip antenna includes a groove portion penetrating from the upper surface of the core to the lower surface, the antenna coil surrounds the outer surface of the core,

Antenna module package.
Preparing a chip antenna having an antenna coil wound around at least a portion of the core;

Sealing at least a portion of the antenna coil with a first encapsulant to protect the chip antenna;

Mounting at least one of an element, a sensor, and a camera module in a groove portion penetrating from an upper surface of the core to a lower surface of the core; And

Sealing at least one of the device, the sensor, and the camera module with a second encapsulation material in the remaining internal space;

Including,

Method of manufacturing an antenna module package.
Preparing a substrate;

Mounting a chip antenna having an antenna coil wound around at least a portion of the core on the substrate;

Sealing at least a portion of the antenna coil with a first encapsulant to protect the chip antenna;

Mounting at least one of an element, a sensor, and a camera module in a groove portion penetrating from an upper surface of the core to a lower surface of the core; And

Sealing at least one of the device, the sensor, and the camera module with a second encapsulation material in the remaining internal space;

Including,

Method of manufacturing an antenna module package.