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WO2016155402A1 - 拆解装置 - Google Patents

拆解装置 Download PDF

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Publication number
WO2016155402A1
WO2016155402A1 PCT/CN2016/070326 CN2016070326W WO2016155402A1 WO 2016155402 A1 WO2016155402 A1 WO 2016155402A1 CN 2016070326 W CN2016070326 W CN 2016070326W WO 2016155402 A1 WO2016155402 A1 WO 2016155402A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
adhesive
disassembling device
temperature
fixing mechanisms
Prior art date
Application number
PCT/CN2016/070326
Other languages
English (en)
French (fr)
Inventor
赵婷婷
Original Assignee
京东方科技集团股份有限公司
合肥京东方光电科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 京东方科技集团股份有限公司, 合肥京东方光电科技有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US15/106,033 priority Critical patent/US9937700B2/en
Publication of WO2016155402A1 publication Critical patent/WO2016155402A1/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B43/00—Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
    • B32B43/006—Delaminating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • B32B37/065—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method resulting in the laminate being partially bonded
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/10—Removing layers, or parts of layers, mechanically or chemically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/02—Temperature
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • B32B2457/208—Touch screens
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y10T156/1111—Using solvent during delaminating [e.g., water dissolving adhesive at bonding face during delamination, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y10T156/1153—Temperature change for delamination [e.g., heating during delaminating, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y10T156/1168—Gripping and pulling work apart during delaminating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y10T156/1911—Heating or cooling delaminating means [e.g., melting means, freezing means, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y10T156/1978—Delaminating bending means

Definitions

  • the present invention relates to the field of display technologies, and in particular, to a disassembling device for disassembling components such as a touch screen.
  • a touch screen of a touch display device generally includes a display panel and a cover attached to the display panel.
  • inadvertent products will inevitably occur.
  • the touch screen needs to be disassembled to separate the display panel from the cover.
  • the present invention provides a disassembling device for a disassembling assembly, the assembly including a first substrate and a second substrate disposed opposite to each other, and a first substrate and the second substrate are disposed between Adhesive.
  • the disassembling device includes two fixing mechanisms disposed opposite to each other, the two fixing mechanisms respectively for fixing the first substrate and the second substrate, and the two fixing mechanisms can generate relative movements close to or away from each other,
  • the disassembling device further includes a colloid processing mechanism for processing the adhesive, so that the adhesive force between the treated adhesive and the first substrate is less than that before the treatment.
  • the adhesion between the first substrates; and/or the adhesion between the treated adhesive and the second substrate is less than the adhesion between the adhesive before treatment and the second substrate.
  • the fixing mechanism includes a housing and a suction cup disposed on the housing, and the suction cup is capable of adsorbing the first substrate and the second substrate.
  • the colloid treatment mechanism is capable of freezing the adhesive to cause the adhesive to shrink in volume.
  • the colloid processing mechanism includes a coolant disposed in a cavity of the housing, and an outlet of the housing facing the first substrate or the second substrate is provided with an outlet for The assembly outputs the coolant.
  • the colloid processing mechanism includes a heating element for heating the adhesive.
  • the heating element comprises a heating wire disposed on the housing.
  • the disassembling device further comprises a temperature detector for detecting the temperature of the heating element.
  • the disassembling device further comprises a temperature regulator, the temperature regulator being respectively connected to the temperature detector and the heating element for adjusting the temperature of the heating element until the temperature detecting The temperature measured by the device reaches a preset temperature; the preset temperature is a temperature at which the adhesive gel changes from a solid state to a colloidal state and is set according to the type of the adhesive.
  • the colloid processing mechanism further includes one or more solvent containing boxes, the solvent containing box is provided with a solvent capable of dissolving the adhesive, and the solvent receiving box is provided with one or more output tubes.
  • the output tube is for outputting the solvent to the adhesive between the first substrate and the second substrate.
  • the disassembling device further comprises:
  • a power source for applying a pulling force to at least one of the fixing mechanisms to cause the two fixing mechanisms to move relative to each other;
  • a tensile force detector for detecting a tensile force received by the first substrate and/or the second substrate when a relative movement between the two fixing mechanisms is generated away from each other;
  • controller being respectively connected to the power source and the tension detector for adjusting a pulling force applied by the power source until the tensile force measured by the tension detector reaches a predetermined pulling force
  • the predetermined pulling force is a pulling force when the first substrate and the second substrate are just separated.
  • two fixing mechanisms may respectively fix the first substrate And the second substrate, and the relative movement between the two fixing mechanisms away from or close to each other can be generated.
  • the first substrate and the second substrate may be separated; and the colloid processing mechanism may treat the adhesive by using a freezing treatment, a heat treatment or a solution treatment, so that the adhesive is adhered.
  • the state of the gel is changed so that the adhesive force between the treated adhesive and the first substrate is less than the adhesive force between the adhesive before the treatment and the first substrate, and/or the adhesive after the treatment
  • the adhesive force between the glue and the second substrate is less than the adhesion between the adhesive before the treatment and the second substrate.
  • the disassembly device provided by the embodiment of the present invention can not damage the first substrate and the first substrate. In the case of the two substrates, the first substrate and the second substrate are effectively disassembled.
  • FIG. 1 is a schematic structural view of a disassembling device according to an embodiment of the present invention.
  • FIG. 2 is a view of the inside of one of the fixing mechanisms according to an embodiment of the present invention.
  • FIG. 3 is a schematic structural view of a heating member according to an embodiment of the present invention.
  • FIG. 4 is a schematic view showing the structure of a dissolution liquid chamber according to an embodiment of the present invention.
  • the present invention provides a disassembling apparatus for disassembling components such as a touch display screen.
  • the component 10 for example, a touch display screen
  • the component 10 includes a first substrate 11 and a second substrate 12 disposed opposite to each other, and an adhesive is disposed between the first substrate 11 and the second substrate 12.
  • the disassembling device includes two fixing mechanisms 20 disposed opposite to each other.
  • the two fixing mechanisms 20 are respectively used for fixing the first substrate 11 and the second substrate 12, and the two fixing mechanisms 20 can generate relative movements close to or away from each other. .
  • the disassembling device further includes a colloid processing structure for processing the adhesive to cause the treated adhesive to be bonded to the first base
  • the adhesion between the sheets 11 is less than the adhesion between the adhesive before treatment and the first substrate 11; and/or the adhesion between the treated adhesive and the second substrate 12 is less than The adhesion between the adhesive before treatment and the second substrate 12.
  • the two fixing mechanisms 20 may fix the first substrate 11 and the second substrate 12, respectively.
  • the colloid processing mechanism may process the adhesive before the two fixing mechanisms 20 are moved away from each other such that the treated adhesive is between the first substrate 11 (and/or the second substrate 12)
  • the adhesion is less than the adhesion between the pre-treatment adhesive and the first substrate 11 (and/or the second substrate 12). That is, the adhesion between the first substrate 11 and the second substrate 12 is reduced.
  • the first substrate 11 and the second substrate 12 can be more easily separated without causing damage to the first substrate 11 and the second substrate 12.
  • the disassembly of the first substrate 11 and the second substrate 12 is effectively achieved.
  • the securing mechanism 20 can include a housing 21 and a suction cup 22 disposed on the housing 21.
  • the chuck 22 is capable of adsorbing the first substrate 11 and the second substrate 12.
  • the suction cup may be a vacuum chuck.
  • an air suction passage corresponding to the vacuum chuck can be provided in the housing 21.
  • the air extraction passage is connected to an external air suction device.
  • the housing 21 can be coupled to the track and moved along the rail such that the two securing mechanisms 20 can be relatively remote or close.
  • the colloid processing mechanism can make the adhesive force between the treated adhesive and the first substrate less than that before the treatment and the first The adhesion between the substrates; and/or the adhesion between the treated adhesive and the second substrate is less than the adhesion between the adhesive before treatment and the second substrate.
  • the colloid processing mechanism is capable of freezing the adhesive to cause the adhesive to shrink in volume. It can be understood that when the adhesive is subjected to the freezing treatment, the first substrate 11 and the second substrate 12 may also be contracted by the influence of low temperature. Therefore, it is necessary to select an appropriate freezing temperature when performing the freezing process so that the frozen adhesive and the first substrate 11 (and/or the second substrate 12) The adhesive force between them is smaller than the adhesion between the adhesive before freezing and the first substrate 11 (and/or the second substrate 12), respectively, without causing damage to the first substrate 11 and the second substrate 12.
  • the colloid processing mechanism may include a coolant disposed within a cavity of the housing 21.
  • the inner side of the casing 21 i.e., the side facing the first substrate 11 or the second substrate 12
  • the outlet 23 for outputting the coolant to the assembly 10.
  • two fixing mechanisms are respectively used to fix the first substrate 11 and the second substrate 12 by the suction cup 22.
  • the coolant may be dropped or sprayed on the first substrate 11 or the second substrate 12 through the outlet 23.
  • the housing 21 may also be provided with an inlet 24 for the addition of coolant.
  • the outlet 23 on the casing 21 and the suction cup 22 are disposed separately so that there is no influence between them.
  • the specific type of the coolant is not limited in the present invention as long as the adhesive can be frozen.
  • the coolant can be liquid nitrogen.
  • the colloid processing mechanism may include a heating element for heating the adhesive.
  • the adhesive When the adhesive is heated to a certain temperature, the adhesive changes from a solid state to a colloidal state, so that the adhesive force between the gel-like adhesive and the first substrate and the second substrate is less than the solid adhesion, respectively. The adhesion between the glue and the first substrate and the second substrate.
  • the heating element may be a heating wire 30 disposed on the housing.
  • the heat generated by the heating wire 30 is transferred to the assembly 10, so that the adhesive gel changes from a solid state to a colloidal state after being heated.
  • the disassembling device may further include a temperature detector for detecting the temperature of the heating element.
  • the temperature of the heating element can be monitored in real time using a temperature detector.
  • the temperature of the heating element can cause the adhesive to change from a solid state to a colloidal state, the temperature of the heating element can be maintained.
  • the disassembling device may further include a temperature regulator connected to the temperature detector and the heating element, respectively, for adjusting the temperature of the heating element until the The temperature measured by the temperature detector reaches a preset temperature.
  • the preset temperature is a temperature at which the adhesive gel changes from a solid state to a colloidal state.
  • the The preset temperature can be determined experimentally.
  • the temperature regulator enables the heating element to continue to heat up when the temperature of the assembly does not reach the predetermined temperature until the assembly reaches the predetermined temperature. In this way, not only the disassembly efficiency can be improved, but also the first substrate and the second substrate of the assembly can be prevented from being damaged due to overheating.
  • the type of adhesive between the first substrate and the second substrate may be different for different types of components. It is easily understood that the preset temperature can be set according to the actual type of the adhesive.
  • the colloid processing mechanism may include a coolant that freezes the adhesive and a heating element that heats the adhesive.
  • the cooling treatment and the heat treatment cannot be performed simultaneously. In other words, when the adhesive is used to freeze the adhesive, the heating of the heating element is stopped, and when the adhesive is heated using the heating element, the output of the coolant is stopped.
  • the colloid processing mechanism may include one or more solvent containing tanks 41, and the solvent containing tank 41 is provided with a resin capable of dissolving the adhesive.
  • the solvent, the solvent containing tank 41 may be provided with one or more output tubes 42 for outputting the solvent to the adhesive between the first substrate 11 and the second substrate 12.
  • the solution may be ethanol, acetone or the like.
  • the output tube 42 of the solvent containing tank 41 can respectively output a solvent from the different sides of the assembly 10 to the adhesive to enable the adhesive to be dissolved by the solvent.
  • the adhesive force between the dissolved adhesive and the first substrate 11 (and/or the second substrate 12) is smaller than that of the first substrate 11 (and/or the second) before dissolving, respectively. Adhesion between the substrates 12).
  • the colloid processing mechanism may include one or more of a coolant, a heating wire, and a solvent containing case.
  • a freezing treatment using a coolant, a heat treatment of a heating wire, or a dissolution treatment of a solvent may be selected depending on the specific type of the binder.
  • it may be combined with a cooling treatment using a coolant or a heat treatment of a heating wire to dissolve the solvent with a solvent.
  • disassembling device may further include:
  • a fixing mechanism 20 can be fixed at Based on the installation.
  • a power source eg, a motor
  • a tensile force detector for detecting a tensile force received by the first substrate 11 and/or the second substrate 12 when the relative movement between the two fixing mechanisms 20 is generated away from each other;
  • controller is respectively connected to the power source and the tension detector for adjusting a pulling force applied by the power source until a tensile force measured by the tension detector reaches a predetermined pulling force.
  • first substrate 11 and the second substrate 12 are subjected to the same tensile force in the initial stage of bonding the first substrate 11 and the second substrate 12 by the adhesive.
  • the controller can control the power source to stop applying the pulling force. In this way, automatic control can be achieved and the disassembly efficiency can be improved.
  • the first substrate may be a cover of the touch screen touch display screen
  • the second substrate may be an upper substrate of the display panel that is attached to the cover plate.
  • the two fixing mechanisms can respectively fix the first substrate and the second substrate, and relative movement between the two fixing mechanisms can be generated away from or close to each other.
  • the first substrate and the second substrate may be separated; and the colloid processing mechanism may treat the adhesive by using a freezing treatment, a heat treatment or a solution treatment, so that the adhesive is adhered.
  • the state of the gel is changed so that the adhesive force between the treated adhesive and the first substrate is less than the adhesive force between the adhesive before the treatment and the first substrate, and/or the adhesive after the treatment
  • the adhesion between the glue and the second substrate is less than the adhesion between the adhesive before the treatment and the second substrate.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Solid Wastes (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

一种用于拆解例如触控显示屏等组件的拆解装置，组件（10）包括相对设置的第一基板（11）和第二基板（12），第一基板（11）和第二基板（12）之间设置有粘合胶，拆解装置包括相对设置的两个固定机构（20），两个固定机构（20）分别用于固定第一基板（11）和第二基板（12），两个固定机构（20）之间能够产生互相靠近或远离的相对移动，拆解装置还包括用于对所述粘合胶进行处理的胶体处理机构，以使得处理后的粘合胶与基板之间的粘合力小于处理前的粘合胶与基板之间的粘合力。采用该装置，可以在不破坏第一基板和第二基板的情况下，有效地对互相粘合的第一基板和第二基板进行拆解。

Description

拆解装置 技术领域
本发明涉及显示技术领域，具体涉及一种用于拆解例如触控屏等组件的拆解装置。
背景技术
随着各种电子设备的发展，触控显示装置(例如，触控电脑、触控笔记本、触控手机等)已经在人们生活中得到了广泛应用。触控显示装置的触摸屏通常包括显示面板(panel)和贴合在显示面板上的盖板(cover)。大规模生产触控屏的过程中不可避免地会出现不良产品，在分析不良产品时需要对触控屏进行拆解，以便将显示面板和盖板分离开。
因此，如何在不破坏显示面板和盖板的情况下对触控屏进行拆解成为本领域亟待解决的技术问题。
发明内容
本发明的目的在于提供一种用于拆解例如触控显示屏等组件的拆解装置。
为了实现上述目的，本发明提供一种用于拆解组件的拆解装置，所述组件包括相对设置的第一基板和第二基板，所述第一基板和所述第二基板之间设置有粘合胶。所述拆解装置包括相对设置的两个固定机构，所述两个固定机构分别用于固定第一基板和第二基板，所述两个固定机构之间能够产生互相靠近或远离的相对移动，所述拆解装置还包括用于对所述粘合胶进行处理的胶体处理机构，以使得处理后的粘合胶与所述第一基板之间的粘合力小于处理前的粘合胶与第一基板之间的粘合力；和/或处理后的粘合胶与所述第二基板之间的粘合力小于处理前的粘合胶与第二基板之间的粘合力。
优选地，所述固定机构包括壳体和设置在所述壳体上的吸盘，所述吸盘能够对所述第一基板和所述第二基板进行吸附。
优选地，所述胶体处理机构能够对所述粘合胶进行冷冻处理，以使得所述粘合胶体积收缩。
优选地，所述胶体处理机构包括设置在所述壳体的腔体内的冷却剂，所述壳体的朝向所述第一基板或所述第二基板的一侧设置有出口，用于向所述组件输出所述冷却剂。
优选地，所述胶体处理机构包括用于对所述粘合胶进行加热的加热元件。
优选地，所述加热元件包括设置在所述壳体上的加热丝。
优选地，所述拆解装置还包括用于检测所述加热元件温度的温度检测器。
优选地，所述拆解装置还包括温度调节器，所述温度调节器分别与所述温度检测器和所述加热元件相连，用于对所述加热元件的温度进行调节，直至所述温度检测器所测得的温度达到预设温度；所述预设温度为粘合胶由固体状态变为胶体状态时的温度并且根据粘合胶的类型进行设定。
优选地，所述胶体处理机构还包括一个或多个溶剂容纳箱，所述溶剂容纳箱内设置有能够溶解所述粘合胶的溶剂，所述溶剂容纳箱设置有一个或多个输出管，该输出管用于向所述第一基板和所述第二基板之间的粘合胶输出所述溶剂。
优选地，所述拆解装置还包括：
动力源，该动力源用于向至少一个所述固定机构施加拉力，以使得所述两个固定机构发生互相远离的相对移动；
拉力检测器，该所述拉力检测器用于检测在所述两个固定机构之间产生互相远离的相对移动时，所述第一基板和/或所述第二基板所受到的拉力；
控制器，该控制器分别与所述动力源和所述拉力检测器相连，用于对所述动力源所施加的拉力进行调节，直至所述拉力检测器所测得的拉力达到预定拉力，所述预定拉力是所述第一基板与所述第二基板刚好分开时的拉力。
根据本发明的实施方式，两个固定机构可以分别固定第一基板 和第二基板，并且两个固定机构之间可以产生互相远离或靠近的相对移动。当两个固定机构之间互相远离时，可以带动第一基板和第二基板分离开；并且，胶体处理机构可以采用冷冻处理、加热处理或溶解液处理的方式对粘合胶进行处理，使得粘合胶的状态发生改变，从而使得处理后的粘合胶与第一基板之间的粘合力小于处理前的粘合胶与第一基板之间的粘合力，和/或处理后的粘合胶与第二基板之间的粘合力小于处理前的粘合胶与第二基板之间的粘合力通过本发明的实施方式提供的拆解装置，可以在不破坏第一基板和第二基板的情况下，有效地将第一基板和第二基板拆解开。
附图说明
附图是用来提供对本发明的进一步理解，并且构成说明书的一部分，与下面的具体实施方式一起用于解释本发明，但并不构成对本发明的限制。在附图中：
图1是根据本发明的实施方式所提供的拆解装置的结构示意图；
图2是根据本发明的实施方式的固定机构之一的内侧的视图；
图3是根据本发明的实施方式的加热件的结构示意图；
图4是根据本发明的实施方式的溶解液腔的结构示意图。
具体实施方式
以下结合附图对本发明的具体实施方式进行详细说明。应当理解的是，此处所描述的具体实施方式仅用于说明和解释本发明，并不用于限制本发明。
本发明提供一种用于拆解例如触控显示屏等组件的拆解装置。如图1所示，组件10(例如，触控显示屏)包括相对设置的第一基板11和第二基板12，第一基板11和第二基板12之间设置有粘合胶。所述拆解装置包括相对设置的两个固定机构20，两个固定机构20分别用于固定第一基板11和第二基板12，两个固定机构20之间能够产生互相靠近或远离的相对移动。所述拆解装置还包括用于对所述粘合胶进行处理的胶体处理结构，以使得处理后的粘合胶与所述第一基 板11之间的粘合力小于处理前的粘合胶与第一基板11之间的粘合力；和/或处理后的粘合胶与所述第二基板12之间的粘合力小于处理前的粘合胶与第二基板12之间的粘合力。
在本发明中，如上文所述，两个固定机构20可以分别固定第一基板11和第二基板12。当两个固定机构20发生互相远离的相对移动时，可以带动第一基板11和第二基板12互相远离。在两个固定机构20发生互相远离的相对移动之前，所述胶体处理机构可以对粘合胶进行处理，使得处理后的粘合胶与第一基板11(和/或第二基板12)之间的粘合力小于处理前的粘合胶与第一基板11(和/或第二基板12)之间的粘合力。也就是说，使得第一基板11与第二基板12之间的粘合力减小。此时，当两个固定机构20发生互相远离的相对移动时，可以在不对第一基板11和第二基板12造成损坏的情况下更容易地使第一基板11与第二基板12分离，进而有效地实现第一基板11与第二基板12的拆解。
本发明对固定机构20的具体结构不作限定。在一个实例中，如图1和图2所示，固定机构20可以包括壳体21和设置在壳体21上的吸盘22。吸盘22能够对第一基板11和第二基板12进行吸附。这里，吸盘可以为真空吸盘。相应的是，在壳体21中可以设置有与真空吸盘相对应的抽气通道。所述抽气通道与外界抽气装置相连。壳体21可以与轨道连接并沿导轨进行移动，从而使得两个固定机构20可以相对远离或靠近。
在本发明提供的拆解装置中，如上文所述，所述胶体处理机构可以使处理后的粘合胶与所述第一基板之间的粘合力小于处理前的粘合胶与第一基板之间的粘合力；和/或处理后的粘合胶与所述第二基板之间的粘合力小于处理前的粘合胶与第二基板之间的粘合力。
作为本发明的第一种具体实施方式，所述胶体处理机构能够对所述粘合胶进行冷冻处理，以使得所述粘合胶体积收缩。可以理解的是，当对粘合胶进行冷冻处理时，第一基板11和第二基板12也可能会受到低温影响而收缩。因此，在进行冷冻处理时需要选择适当的冷冻温度，使得冷冻后的粘合胶与第一基板11(和/或第二基板12)之 间的粘合力分别小于冷冻前的粘合胶与第一基板11(和/或第二基板12)之间的粘合力，同时不会对第一基板11和第二基板12造成破坏。
具体地，所述胶体处理机构可以包括设置在壳体21的腔体内的冷却剂。如图1和图2所示，壳体21的内侧(即，朝向第一基板11或第二基板12的一侧)设置有出口23，用于向组件10输出冷却剂。如图1中所示，两个固定机构分别用于通过吸盘22固定第一基板11和第二基板12。当固定机构通过吸盘22固定第一基板11和第二基板12时，冷却剂可以通过出口23滴落或喷射在第一基板11或第二基板12上。
可以理解的是，壳体21还可以设置有用于加入冷却剂的入口24。如图1和图2所示，壳体21上的出口23和吸盘22分开设置，使得相互之间不会产生影响。本发明对所述冷却剂的具体类型不作限定，只要可以对粘合胶进行冷冻即可。例如冷却剂可以为液氮。
作为本发明的第二种具体实施方式，如图3所示，所述胶体处理机构可以包括用于对所述粘合胶进行加热的加热元件。当粘合胶受热而达到一定温度时，粘合胶由固体状态变为胶体状态，使得胶状的粘合胶与第一基板和第二基板之间的粘合力分别小于固状的粘合胶与第一基板和第二基板之间的粘合力。
具体地，如图3所示，所述加热元件可以为设置在壳体上的加热丝30。加热丝30所发出的热量传递至组件10，使得粘合胶受热后由固体状态变为胶体状态。
进一步地，所述拆解装置还可以包括用于检测所述加热元件温度的温度检测器。在实际操作中，可以利用温度检测器对所述加热元件的温度进行实时监测。当所述加热元件的温度可以使得粘合胶由固体状态变为胶体状态时，则可以保持加热元件的温度。
更进一步地，所述拆解装置还可以包括温度调节器，所述温度调节器分别与所述温度检测器和所述加热元件相连，用于对所述加热元件的温度进行调节，直至所述温度检测器所测得的温度达到预设温度。
所述预设温度为粘合胶由固体状态变为胶体状态时的温度。该 预设温度可以由实验的方法确定。当组件的温度未达到所述预设温度时，所述温度调节器使加热元件能够继续加热，直至组件达到所述预设温度。通过这种方式，不但可以提高拆解效率，还可以防止组件的第一基板和第二基板因为过热而损坏。
对于不同类型的组件，第一基板和第二基板之间的粘合胶的类型可以不同。容易理解的是，所述预设温度可以根据粘合胶的实际类型进行设定。
需要说明的是，所述胶体处理机构可以同时包括对粘合胶进行冷冻的冷却剂和对粘合胶进行加热的加热元件。但是，冷却处理和加热处理不能同时进行。换句话说，使用冷却剂对粘合胶进行冷冻时，停止对加热元件的加热，而使用加热元件对粘合胶进行加热时，停止输出冷却剂。
作为本发明的第三种具体实施方式，如图1和图4所示，所述胶体处理机构可以包括一个或多个溶剂容纳箱41，溶剂容纳箱41内设置有能够溶解所述粘合胶的溶剂，溶剂容纳箱41可以设置有一个或多个输出管42，该输出管42用于向第一基板11和第二基板12之间的粘合胶输出所述溶剂。例如，所述溶液剂可以为乙醇、丙酮等。溶剂容纳箱41的输出管42可以从组件10的不同侧分别向粘合胶输出溶剂，以使得粘合胶能够被所述溶剂溶解。根据本实施方式，溶解后的粘合胶与第一基板11(和/或第二基板12)之间的粘合力分别小于溶解前的粘合胶与第一基板11(和/或第二基板12)之间的粘合力。
在本发明的拆解装置中，所述胶体处理机构可以包括冷却剂、加热丝和溶剂容纳箱中的一者或多者。例如，在实际使用中，可以根据粘合剂的具体类型来选择使用冷却剂的冷冻处理，加热丝的加热处理或溶剂的溶解处理。在一些情况下，可以结合使用冷却剂的冷冻处理或加热丝的加热处理可以与溶剂的溶解处理
更进一步地，所述拆解装置还可以包括：
动力源(如，电机)，该动力源用于向至少一个固定机构20施加拉力，以使得两个固定机构20发生互相远离的相对移动；当动力源只向一个固定机构20施加拉力时，另一个固定机构20可以固定在 安装基础上。
拉力检测器，该拉力检测器用于检测在两个固定机构20之间产生互相远离的相对移动时，第一基板11和/或第二基板12所受到的拉力；
控制器，所述控制器分别与所述动力源和所述拉力检测器相连，用于对所述动力源所施加的拉力进行调节，直至所述拉力检测器所测得的拉力达到预定拉力。
可以理解的是，在第一基板11和第二基板12通过粘合胶相贴合的初始阶段，第一基板11与第二基板12受到相同的拉力。当拉力逐渐增大并且达到所述预定拉力时，第一基板11和第二基板12刚好分开。这时，控制器可以控制动力源停止施加拉力。这样，可以实现自动化控制，提高拆解效率。
在组件为触控显示屏的情况下，第一基板可以为触摸屏触控显示屏的盖板，第二基板可以为显示面板中的与盖板相贴合的上基板。
从以上对本发明提供的拆解装置的描述中可以看出，两个固定机构可以分别固定第一基板和第二基板，并且两个固定机构之间可以产生互相远离或靠近的相对移动。当两个固定机构之间互相远离时，可以带动第一基板和第二基板分离开；并且，胶体处理机构可以采用冷冻处理、加热处理或溶解液处理的方式对粘合胶进行处理，使得粘合胶的状态发生改变，从而使得处理后的粘合胶与第一基板之间的粘合力小于处理前的粘合胶与第一基板之间的粘合力，和/或处理后的粘合胶与第二基板之间的粘合力小于处理前的粘合胶与第二基板之间的粘合力。通过本发明的实施方式提供的拆解装置，可以在不破坏第一基板和第二基板的情况下，有效地将第一基板和第二基板拆解开。
可以理解的是，以上实施方式仅仅是为了说明本发明的原理而采用的示例性实施方式，然而本发明并不局限于此。对于本领域内的普通技术人员而言，在不脱离本发明的精神和实质的情况下，可以做出各种变型和改进，这些变型和改进也视为本发明的保护范围。

Claims (10)

  1. 一种用于拆解组件的拆解装置，所述组件包括相对设置的第一基板和第二基板，所述第一基板和所述第二基板之间设置有粘合胶，其特征在于，
    所述拆解装置包括相对设置的两个固定机构，所述两个固定机构分别用于固定第一基板和第二基板，所述两个固定机构之间能够产生互相靠近或远离的相对移动，
    所述拆解装置还包括用于对所述粘合胶进行处理的胶体处理机构，以使得处理后的粘合胶与所述第一基板之间的粘合力小于处理前的粘合胶与第一基板之间的粘合力；和/或处理后的粘合胶与所述第二基板之间的粘合力小于处理前的粘合胶与第二基板之间的粘合力。
  2. 根据权利要求1所述的拆解装置，其特征在于，
    所述固定机构包括壳体和设置在所述壳体上的吸盘，所述吸盘能够对所述第一基板和所述第二基板进行吸附。
  3. 根据权利要求2所述的拆解装置，其特征在于，
    所述胶体处理机构能够对所述粘合胶进行冷冻处理，以使得所述粘合胶体积收缩。
  4. 根据权利要求3所述的拆解装置，其特征在于，
    所述胶体处理机构包括设置在所述壳体的腔体内的冷却剂，
    所述壳体的朝向所述第一基板或所述第二基板的一侧设置有出口，用于向所述组件输出所述冷却剂。
  5. 根据权利要求2至4中任意一项所述的拆解装置，其特征在于，
    所述胶体处理机构包括用于对所述粘合胶进行加热的加热元件。
  6. 根据权利要求5所述的拆解装置，其特征在于，
    所述加热元件包括设置在所述壳体上的加热丝。
  7. 根据权利要求5所述的拆解装置，其特征在于，
    所述拆解装置还包括用于检测所述加热元件温度的温度检测器。
  8. 根据权利要求7所述的拆解装置，其特征在于，
    所述拆解装置还包括温度调节器，所述温度调节器分别与所述温度检测器和所述加热元件相连，用于对所述加热元件的温度进行调节，直至所述温度检测器所测得的温度达到预设温度；
    所述预设温度为粘合胶由固体状态变为胶体状态时的温度并且根据粘合胶的类型进行设定。
  9. 根据权利要求1至4中任意一项所述的拆解装置，其特征在于，
    所述胶体处理机构还包括一个或多个溶剂容纳箱，所述溶剂容纳箱内设置有能够溶解所述粘合胶的溶剂，所述溶剂容纳箱设置有一个或多个输出管，该输出管用于向所述第一基板和所述第二基板之间的粘合胶输出所述溶剂。
  10. 根据权利要求1至4中任意一项所述的拆解装置，其特征在于，所述拆解装置还包括：
    动力源，该动力源用于向至少一个所述固定机构施加拉力，以使得所述两个固定机构发生互相远离的相对移动；
    拉力检测器，该所述拉力检测器用于检测在所述两个固定机构之间产生互相远离的相对移动时，所述第一基板和/或所述第二基板所受到的拉力；
    控制器，该控制器分别与所述动力源和所述拉力检测器相连， 用于对所述动力源所施加的拉力进行调节，直至所述拉力检测器所测得的拉力达到预定拉力，所述预定拉力是所述第一基板与所述第二基板刚好分开时的拉力。
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