WO2016011600A1

WO2016011600A1 - Led chip encapsulated without routing, and encapsulation process

Info

Publication number: WO2016011600A1
Application number: PCT/CN2014/082719
Authority: WO
Inventors: 庞晓东; 陈浩明; 王瑞庆; 刘镇
Original assignee: 深圳市兆明芯科技控股有限公司
Priority date: 2014-07-22
Filing date: 2014-07-22
Publication date: 2016-01-28

Abstract

An LED chip encapsulated without routing, sequentially comprising from top to bottom a transparent conducting layer (1), a light emitting layer (3) and a substrate (6), and further comprising a positive electrode (11), a negative electrode (12) and an isolation region; the positive electrode (11) extends upward along the substrate (6) to the transparent conducting layer (1); and the isolation region is arranged between the positive electrode (11) and the negative electrode (12), and extends upward to the transparent conducting layer (1). Also provided is an encapsulation process, comprising the following steps: disposing the negative electrode (12) on the substrate (6); disposing the positive electrode (11) on the substrate (6), and enabling the positive electrode (11) to connect to the transparent conducting layer (1); and arranging an isolation channel (8) enabling the negative electrode (12) to be isolated from the positive electrode (11), thus solving the problem of low yield caused by routing, and improving product yield.

Description

LED chip and packaging process

Technical field

The present invention relates to the field of lighting equipment, and in particular, to an LED chip and a packaging process for wire-free packaging.

Background technique

LED chip is the core component of LED, etc. The main function is to convert electric energy into light energy. The specific structure of the traditional LED chip is shown in Figure 1. It includes transparent conductive layer 1 and first transparent layer 2 from top to bottom. , the light-emitting layer 3, the second light-transmissive layer 4, the reflective layer 5, the substrate 6, and the like. Each layer in the structure is made of a conductive material. The LED chip is connected to the negative electrode by a substrate, and is used on the transparent conductive layer. The line is connected to the positive electrode.

When the LED chip is fabricated, the substrate 6 used is an electrically conductive semiconductor structure. Although the above-mentioned vertical chip is the most direct and reasonable method, it also limits the subsequent packaging cost of the LED chip, which cannot be avoided. The yield loss and cost increase due to the wire bonding cannot overcome the problem of the decrease in the amount of light emitted by the electrode shielding.

Summary of the invention

The technical problem to be solved by the present invention is to provide an LED chip of a wire-free package with high yield and high effective light-emitting efficiency, and a packaging process.

In order to solve the above technical problem, a technical solution adopted by the present invention is to provide a wire-free packaged LED chip, which includes a transparent conductive layer, a light-emitting layer and a substrate from top to bottom, and further includes a positive electrode and a negative electrode. In the isolation region, the positive electrode extends up the substrate to a transparent conductive layer, the isolation region being disposed between the positive electrode and the negative electrode, the isolation region extending upward to the transparent conductive layer.

In order to solve the above technical problem, another technical solution adopted by the present invention is to provide a packaging process, including the following steps:

Providing a negative electrode on the substrate;

Providing a positive electrode on the substrate and connecting the positive electrode to the transparent conductive layer;

An isolated walkway that isolates the negative electrode from the positive electrode is provided.

The beneficial effects of the present invention are: different from the prior art, the present invention is provided with a positive electrode, a negative electrode and an isolation region at the bottom of the LED chip, the positive electrode is connected upward to the transparent conductive layer, and the negative electrode is disposed on the substrate and electrically connected to the substrate Connecting, the isolation region extends upward through the first light transmissive layer, so that the positive electrode and the negative electrode are isolated at the bottom and the middle of the LED. After the power is applied, the positive electrode, the layered structure and the negative electrode of the LED chip form a loop. To ensure the stable illumination of the LED chip. The invention does not need to perform wire bonding processing, and guides the positive and negative electrodes to the bottom of the LED chip, overcomes the problem of low yield rate due to the strip line, and improves the yield of the product. Secondly, since the electrode is disposed at the bottom, the light-shielding phenomenon caused by the electrode is overcome, and the light output amount and the light-emitting efficiency are further improved.

DRAWINGS

Figure 1 is a cross-sectional view of a prior art LED chip;

Figure 2 is a cross-sectional view showing the overall structure of a preferred embodiment of the present invention;

3 is a cross-sectional view showing the structure of the present invention after the isolation walkway and the electrode hole are opened;

Figure 4 is a bottom view of Figure 3;

Figure 5 is a cross-sectional view showing the structure in which the connecting electrode of the present invention is mounted;

Figure 6 is a cross-sectional view showing the structure of the present invention before mounting the connecting electrode of the present invention;

Figure 7 is a plan view of Figure 6.

Label description:

1, a transparent conductive layer; 2, a first light transmissive layer; 3, a light emitting layer; 4, a second light transmissive layer; 5, a reflective layer; 6, a substrate; 7, an electrode hole; 8, an isolated walkway; Electrode; 10, connecting channel; 11, positive electrode; 12, negative electrode; 13, insulator.

detailed description

The detailed description of the technical contents, structural features, and the objects and effects of the present invention will be described in detail below with reference to the accompanying drawings.

In the prior art, the positive electrode extends up the substrate to the transparent conductive layer, the isolation region is disposed between the positive electrode and the negative electrode, and the isolation region is disposed between the positive electrode and the negative electrode. And extending up to the transparent conductive layer. The invention guides the positive and negative electrodes to the bottom of the LED chip, overcomes the problem of low yield rate due to the strip line, and improves the yield of the product.

The LED chip of the wire-free package as shown in FIG. 2 includes a transparent conductive layer 1, a first light-transmitting layer 2, a light-emitting layer 3, a second light-transmitting layer 4, and a substrate 6 in order from top to bottom, and further includes a positive electrode. 11. The negative electrode 12 and the isolation region extend upward along the substrate 6 to the transparent conductive layer 1. The isolation region is disposed between the positive electrode 11 and the negative electrode 12, and the isolation region extends upward to the transparent conductive layer 1. Of course, in order to further increase the amount of light emitted from the LED chip and reduce the absorption of light by the substrate 6, a reflective layer 5 is further disposed between the second light-transmitting layer 4 and the substrate 6. Of course, the first light transmissive layer and the second light transmissive layer in the embodiment can significantly improve the emitted light. In other embodiments, the first and second light transmissive layers can also be other structures such as a PN section. Wait.

Referring to FIG. 3 and FIG. 4 together, the present invention provides a positive electrode 11, a negative electrode 12 and an isolation region on the substrate 6. The positive electrode 11 is connected upward to the transparent conductive layer 1, and the negative electrode 12 is disposed on the substrate 6 and lining. The bottom 6 is electrically connected, and the isolation region extends upward through the first light transmissive layer 2, so that the positive electrode 11 and the negative electrode 12 form isolation at the bottom and the middle of the LED, which is mainly to prevent the positive electrode 11 and the negative electrode 12 from being directly connected. Short circuit, and since the positive electrode 11 is connected to the transparent conductive layer 1, the positive electrode, the transparent conductive layer 1, the first light transmissive layer 2, the luminescent layer 3, the second transparent layer 4, and the reflection in the LED structure after power-on Layer 5, substrate 6 and negative electrode 12 form a loop. The invention does not need to perform wire bonding processing, and guides the positive and negative electrodes to the bottom of the LED chip, overcomes the problem of low yield rate due to the strip line, and improves the yield of the product. Secondly, since the electrode is disposed at the bottom, the light-shielding phenomenon caused by the electrode is overcome, and the light output amount and the light-emitting efficiency are further improved.

The positive electrode 11 includes an electrode hole 7 extending upward along the substrate 6 and an electric conductor filled in the electrode hole 7. The electrode hole 7 extends to the transparent conductive layer 1. In the embodiment, the electrode hole 7 is circular and spaced. A plurality of holes are provided, and a positive electrode 11 is formed by filling a conductor in the hole.

The isolation region includes an isolation via 8 extending upward along the substrate 6. The isolation via 8 is curved, and the arc-shaped isolation via 8 is disposed around the positive electrode 11. The isolation via 8 functions to completely isolate the positive electrode 11 and the negative electrode 12. Of course, in other embodiments, the style and size of the isolation walkway 8 are not limited thereto, as long as the regions of the positive and negative electrodes 12 can be separated and the optimum luminous efficiency can be achieved.

In order to further achieve better isolation, the insulator 13 is also filled in the isolation aisle 8 and between the positive electrode 11 and the negative electrode 12. The insulator 13 in the isolation channel is first to isolate the middle and lower portions of the LED structure. To ensure effective insulation, the second is to fill the insulator 13 to effectively enhance the overall mechanical strength of the LED chip.

Referring to FIG. 5, FIG. 6 and FIG. 7, when the high-power LED chip is produced, because the chip area is large, the current walking range may not cover the entire chip, and the luminous efficiency of the partial area is lowered. To improve the situation, The transparent conductive layer 1 is provided with a connection electrode 9 in the lateral direction, and the connection electrode 9 is electrically connected to the positive electrode 11 and extends in the direction in which the negative electrode 12 is located.

Further, a connection channel 10 is disposed in the transparent conductive layer 1 or on the transparent conductive layer 1. In the embodiment, the connection channel 10 is disposed on the transparent conductive layer 1, and the connection channel 10 is connected to the electrode hole 7 and is disposed to the negative electrode 12. The region direction extends, and the connection electrode 9 is disposed in the connection channel 10.

In addition, the packaging process of the above structure is also provided, including the following steps:

Providing a negative electrode 12 on the substrate 6;

a positive electrode 11 is disposed on the substrate 6, and the positive electrode 11 is connected to the transparent conductive layer 1;

An isolation region is provided which isolates the negative electrode 12 from the positive electrode 11.

Further, the fabrication of the isolation region includes the steps of: opening the isolation via 8 through the first transparent layer 2 along the substrate 6, providing an insulating layer on the surface of the substrate 6 and the isolation via 8, and leaving the negative electrode 12 In this embodiment, the isolation via 8 is etched, mainly to isolate the positive electrode 11 from the negative electrode 12.

The fabrication of the positive electrode 11 includes the steps of: extending the electrode hole 7 extending to the transparent conductive layer 1 along the substrate 6 and filling the conductive body. In the embodiment, the electrode hole 7 is a plurality of circularly spaced portions. The hole is filled with a conductor in the hole to form a positive electrode 11.

In order to further improve the luminous efficiency, the connecting channel 10 is opened in the transparent conductive layer 1 or on the transparent conductive layer 1, and an electrical conductor is disposed in the connecting channel 10.

In summary, the present invention does not require wire bonding processing to guide the positive and negative electrodes to the bottom of the LED chip, thereby overcoming the problem of low yield due to the strip line and improving the yield of the product. Secondly, since the electrode is disposed at the bottom, the light-shielding phenomenon caused by the electrode is overcome, and the light output amount and the light-emitting efficiency are further improved. On the basis of this, the insulator 13 is also filled in the isolation aisle 8 and between the positive electrode 11 and the negative electrode 12. The insulator 13 in the isolation channel is first to isolate the middle and lower portions of the LED structure to ensure effective insulation. Second, filling the insulator 13 can effectively enhance the overall mechanical strength of the LED chip. Further, in order to solve the problem that the current walking range may not cover the entire chip and the luminous efficiency of the partial region is lowered due to the large chip area, the transparent conductive layer 1 is provided with the connection electrode 9 in the lateral direction, and the connection electrode 9 and the positive electrode 11 are provided. The electrical connection and extension to the negative electrode 12 effectively improve the light extraction efficiency.

The above is only the embodiment of the present invention, and is not intended to limit the scope of the invention, and the equivalent structure or equivalent process transformation of the present invention and the contents of the drawings may be directly or indirectly applied to other related technologies. The fields are all included in the scope of patent protection of the present invention.

Claims

A wire-free packaged LED chip comprising a positive electrode, a negative electrode, a transparent conductive layer arranged in order from top to bottom, a light-emitting layer and a substrate, characterized in that it further comprises an isolation region, the positive electrode along the substrate Extending upwardly to the transparent conductive layer, the isolation region is disposed between the positive electrode and the negative electrode and extends upward to the transparent conductive layer.
The LED chip of the wire-free package according to claim 1, wherein the positive electrode comprises an electrode hole extending upward along the substrate and an electric conductor filled in the electrode hole, the electrode hole extending to a transparent conductive Floor.
The LED chip of the wire-free package according to claim 1, wherein the isolation region comprises an isolation via extending upward along the substrate, the isolation via is curved, and the isolation via surrounds the positive electrode. Set and separate the positive electrode from the negative electrode.
The LED chip of the wire-free package according to claim 3, wherein an insulator is further filled in the isolation walkway and between the positive electrode and the negative electrode.
The LED chip of the wire-free package according to any one of claims 1 to 4, wherein the transparent conductive layer is provided with a connection electrode in a lateral direction, and the connection electrode is electrically connected to the positive electrode and is negative The direction in which the electrode is located extends.
The LED chip of the wire-free package according to claim 5, wherein a connecting channel is disposed in the transparent conductive layer or on the transparent conductive layer, and the connecting channel communicates with the electrode hole and extends toward a region where the negative electrode is located. The connection electrode is disposed in the connection channel.
A packaging process, comprising the steps of:

Providing a negative electrode on the substrate;

Providing a positive electrode on the substrate and connecting the positive electrode to the transparent conductive layer;

An isolated walkway having a negative electrode separated from the positive electrode is provided.
The packaging process according to claim 7, wherein the fabricating the isolation walkway comprises the following steps:

An isolation walkway passing through the first light transmissive layer is opened upward along the substrate, an insulating layer is disposed on the surface of the substrate and the isolation walkway, and a negative electrode position is reserved.
The packaging process according to claim 7, wherein the fabrication of the positive electrode comprises the following steps:

An electrode hole extending to the transparent conductive layer is opened upward along the substrate, and the electrical conductor is filled.
The packaging process according to any one of claims 7-9, characterized in that a connecting channel is formed in the transparent conductive layer or on the transparent conductive layer, and an electrical conductor is disposed in the connecting channel.