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WO2016093669A1 - Fingerprint sensor module assembly integrated with cover window for electronic device - Google Patents

Fingerprint sensor module assembly integrated with cover window for electronic device Download PDF

Info

Publication number
WO2016093669A1
WO2016093669A1 PCT/KR2015/013626 KR2015013626W WO2016093669A1 WO 2016093669 A1 WO2016093669 A1 WO 2016093669A1 KR 2015013626 W KR2015013626 W KR 2015013626W WO 2016093669 A1 WO2016093669 A1 WO 2016093669A1
Authority
WO
WIPO (PCT)
Prior art keywords
cover window
fingerprint sensor
sensor module
electronic device
module assembly
Prior art date
Application number
PCT/KR2015/013626
Other languages
French (fr)
Korean (ko)
Inventor
김종욱
김산
최우영
Original Assignee
크루셜텍(주)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 크루셜텍(주) filed Critical 크루셜텍(주)
Priority to US15/534,901 priority Critical patent/US20170372123A1/en
Priority to CN201590001170.XU priority patent/CN208044621U/en
Priority claimed from KR1020150177271A external-priority patent/KR20160071352A/en
Publication of WO2016093669A1 publication Critical patent/WO2016093669A1/en

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Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06VIMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12Fingerprints or palmprints
    • G06V40/13Sensors therefor

Definitions

  • the present invention relates to an electronic device cover window-integrated fingerprint sensor module assembly, and more particularly, to an electronic device cover window-integrated fingerprint sensor module assembly which is simple in appearance and can enhance aesthetics in appearance and also improves waterproofness.
  • Portable electronic devices often incorporate a touch screen integrated with a display, which is a display device, as one of input devices for receiving a specific command from a user.
  • the portable electronic device may include various function keys or soft keys as input devices other than the touch screen.
  • function keys or softkeys can act as home keys, for example, to exit a running application and return to the home screen, or to return the user interface one layer back, or frequently. Can act as a menu key to call a menu to write.
  • Such a function key or soft key may be implemented in a manner of sensing a capacitance of a conductor, a method of sensing electromagnetic waves of an electromagnetic pen, or a complex method in which both methods are implemented, and may be implemented as a physical button.
  • Biometric information includes fingerprints, blood vessels on the back of the hand, voices, irises, and the like, and fingerprint sensors are widely used as biometric sensors.
  • the fingerprint sensor is a sensor that detects a human finger fingerprint.
  • the fingerprint sensor is configured to undergo user registration or authentication through a fingerprint sensor, thereby protecting data stored in the portable electronic device and preventing security accidents.
  • the fingerprint sensor may be manufactured in the form of a module including a peripheral component or a structure, and may be integrated with a physical function key so that the fingerprint sensor may be effectively mounted on various electronic devices.
  • this type of fingerprint sensor is called a Bimetric Track Pad (BTP).
  • BTP Bimetric Track Pad
  • Types of fingerprint sensors include capacitive type, optical type, ultrasonic type, heat sensing type, and non-contact type, but the capacitive type fingerprint sensor with excellent sensitivity, robust against external environmental changes and excellent matching with portable electronic devices has recently been developed. It is used a lot.
  • FIG. 1 is a diagram illustrating a conventional electronic device equipped with a fingerprint sensor module
  • Figure 2 is a cross-sectional view taken along the line A-A of FIG.
  • a button hole 21 is formed through the cover window 20 of the conventional electronic device 10, and the fingerprint sensor module 30 is installed in the button hole 21.
  • the fingerprint sensor module 30 includes a fingerprint sensor 32 having a sensing unit 31 and a substrate 33 on which the fingerprint sensor 32 is mounted, and a color layer and a protective layer on the upper surface of the fingerprint sensor 32. A layer 34 including the back is provided.
  • the fingerprint sensor module 30 coupled to the button hole 21 is mounted such that the upper surface 35 of the layer 34 is similar to the upper surface 22 of the cover window 20.
  • fingerprint sensor modules having various heights are required.
  • a method of adjusting the height of the fingerprint sensor 32 or adjusting the thickness of the substrate 33 is used, but the cost is increased to increase the height of the fingerprint sensor 32 or the thickness of the substrate 33.
  • the button hole 21 is formed to penetrate the cover window 20 so that the fingerprint sensor module 30 can be mounted, external moisture is prevented by a gap between the button hole 21 and the fingerprint sensor module 30. Or moisture in the air may penetrate. In addition, infiltration of external moisture or moisture in the air may cause a short circuit in the fingerprint sensor module 30, and may cause malfunction or damage of the fingerprint sensor 32. do. Conventionally, such external moisture or air in the air may further provide a sealing agent 40 to prevent penetration, which is a problem that leads to cost increase and process addition.
  • Such a problem may be common in a fingerprint sensor module formed through various packaging methods such as a chip on board (COB), a quad flat package (QFP), a ball grid array (BGA), and a wafer level package (WLP).
  • COB chip on board
  • QFP quad flat package
  • BGA ball grid array
  • WLP wafer level package
  • the technical problem to be achieved by the present invention is to provide an electronic device cover window-integrated fingerprint sensor module assembly that is simple in appearance and can enhance the aesthetics in design and improved waterproofness.
  • an embodiment of the present invention is provided with an electronic device and an image displayed by the display module, the cover window is formed on the lower surface facing the inside of the electronic device;
  • a fingerprint sensor having a sensing unit for sensing a fingerprint, a fingerprint sensor module including a substrate electrically connected to the fingerprint sensor, and located at the seating unit; And providing an electronic device cover window-integrated fingerprint sensor module assembly provided between the seating part and the fingerprint sensor module, the adhesive part fixing the fingerprint sensor module to the seating part.
  • the seating portion may be provided on the surface of the lower surface of the cover window.
  • the seating portion is formed in a groove shape so as to correspond to the shape of the fingerprint sensor, the fingerprint sensor may be fixed to the seating.
  • the seating portion may be formed by etching or cutting.
  • At least a portion of the sensing unit and the fingerprint sensor may be located in the seating portion.
  • At least a portion of the substrate may be further located in the seating portion.
  • the thickness of the cover window between the upper surface of the cover window and the upper surface of the sensing unit may be 200 ⁇ 300um.
  • the cover window may have a display area in which an image is displayed, and a bezel area in which a print layer is provided and the image is not displayed, and the seating part may be formed in the bezel area.
  • an intaglio or embossed pattern may be further formed in an area corresponding to the upper side of the fingerprint sensor among the top surfaces of the cover window exposed to the user.
  • an opening area having a predetermined width is formed along the edge of the seating portion on the lower surface of the cover window, and the lower side of the cover window emits light to the upper surface of the cover window through the opening area.
  • a light emitting unit for providing light may be provided.
  • the light emitting unit may be provided with one or more on the main substrate to which the substrate or the fingerprint sensor module is electrically connected.
  • the cover window may have a display area in which an image is displayed and a bezel area in which a print layer is provided and no image is displayed, and the seating part may be formed in the display area.
  • the cover window may be made of a material selected from glass, sapphire, zirconium and a transparent resin.
  • the cover window may further include a non-display portion provided independently of the cover window, the seating portion may be formed in the non-display portion.
  • the non-display portion may be made of a resin or a metal material.
  • the cover window is a first cover window, the upper surface is exposed to the user, an adhesive layer provided on the lower surface of the first cover window, and the upper surface of the first cover window by the adhesive layer It includes a second cover window bonded to the lower surface, the seating portion may be formed through the second cover window.
  • the thickness of the second cover window may correspond to the height of the fingerprint sensor.
  • the surface of the seating portion is provided with a color layer
  • the adhesive portion may be filled on the color layer
  • the fingerprint sensor is coupled to the seating portion formed on the bottom of the cover window, when viewed from the top of the cover window, a continuous surface can be formed, the appearance is simple and design aesthetics It can increase.
  • the cover window has a continuous surface without a buttonhole like the conventional cover window, the external moisture or moisture in the air can be structurally blocked from penetration, thereby Water resistance can also be improved.
  • FIG. 1 is a diagram illustrating a conventional electronic device equipped with a fingerprint sensor module.
  • FIG. 2 is a cross-sectional view taken along the line A-A of FIG.
  • Figure 3 is an exemplary view showing an electronic device having an electronic device cover window integrated fingerprint sensor module assembly according to a first embodiment of the present invention.
  • Figure 4 is a plan view showing an electronic device cover window integrated fingerprint sensor module assembly according to a first embodiment of the present invention.
  • FIG. 5 is a bottom view of the electronic device cover window integrated fingerprint sensor module assembly according to the first embodiment of the present invention.
  • FIG. 6 is an exploded perspective view of the electronic device cover window-integrated fingerprint sensor module assembly according to the first embodiment of the present invention.
  • FIG. 7 is a cross-sectional view taken along the line B-B of FIG.
  • FIG. 8 is a cross-sectional view illustrating a coupling example of a fingerprint sensor module and a seating unit in the electronic device cover window integrated fingerprint sensor module assembly according to the first embodiment of the present invention.
  • FIGS. 9 and 10 are cross-sectional view illustrating an installation example of an electronic device cover window integrated fingerprint sensor module assembly according to a first embodiment of the present invention.
  • FIG. 11 is an enlarged plan view illustrating a part of an electronic device having an electronic device cover window-integrated fingerprint sensor module assembly according to a first embodiment of the present invention.
  • FIG. 12 is a cross-sectional view illustrating an installation example of a light emitting unit along the line C-C in FIG.
  • 13 to 15 are exemplary views showing the formation of the surface of the cover window corresponding to the upper side of the fingerprint sensor in the electronic device cover window integrated fingerprint sensor module assembly according to the first embodiment of the present invention.
  • 16 is a cross-sectional view illustrating an installation example of an electronic device cover window integrated fingerprint sensor module assembly and an electronic device according to a second embodiment of the present invention.
  • 17 is a plan view showing a cover window of the electronic device cover window integrated fingerprint sensor module assembly according to a third embodiment of the present invention.
  • FIG. 18 is a plan view showing a cover window of the electronic device cover window integrated fingerprint sensor module assembly according to a fourth embodiment of the present invention.
  • FIG. 19 is a perspective view illustrating an electronic device cover window integrated fingerprint sensor module assembly according to a fifth embodiment of the present invention.
  • FIG. 20 is a perspective view illustrating a fingerprint sensor module of the electronic device cover window-integrated fingerprint sensor module assembly according to the fifth embodiment of the present invention.
  • 21 is a cross-sectional view taken along the line G-G of FIG.
  • FIG. 22 is an exploded perspective view showing the electronic device cover window-integrated fingerprint sensor module assembly according to a fifth embodiment of the present invention.
  • cover window 111 display area
  • bonding portion 180 color layer
  • non-display portion 720 base
  • Figure 3 is an exemplary view showing an electronic device having an electronic device cover window integrated fingerprint sensor module assembly according to a first embodiment of the present invention
  • Figure 4 is an electronic device cover window integrated fingerprint sensor according to a first embodiment of the present invention
  • 5 is a plan view showing a module assembly
  • FIG. 5 is a bottom view showing an integrated fingerprint sensor module assembly according to the first embodiment of the present invention
  • FIG. 6 is a cover view of the electronic device according to the first embodiment of the present invention.
  • An exploded perspective view of the integrated fingerprint sensor module assembly Figure 7 is a cross-sectional view taken along the line BB of FIG.
  • the electronic device cover window integrated fingerprint sensor module assembly 100 includes a cover window 110, a fingerprint sensor module 140, and an adhesive part 170. It may include.
  • the cover window 110 is provided on the front surface of the electronic device 200 so that the image transmitted by the display module 210 (see FIG. 9) is transmitted and displayed.
  • the cover window 110 may be made of a material selected from glass, sapphire, zirconium, and a transparent resin.
  • various glass substrates such as a soda lime glass substrate, an alkali free glass substrate, or a tempered glass substrate may be applied.
  • As the transparent resin acryl or the like may be applied.
  • the cover window 110 may have a display area 111 in which an image is displayed and a bezel area 112 in which the image is not displayed.
  • the bezel area 112 may be formed by providing the print layer 113.
  • the print layer 113 may be provided on the bottom surface 114 of the cover window 110 facing the inside of the electronic device 200 when the cover window 110 is mounted on the electronic device 200. It may be provided in the edge area of the 110.
  • the fingerprint sensor module 140 may include a fingerprint sensor 141 and a substrate 145.
  • the fingerprint sensor 141 may be applied in various kinds.
  • the fingerprint sensor 141 may be capacitive, optical, ultrasonic, thermal, non-contact, or the like.
  • the fingerprint sensor 141 will be described in a capacitive manner.
  • the fingerprint sensor 141 may have a sensing unit 142 that detects a fingerprint.
  • the sensing unit 142 may be formed in various forms.
  • the sensing unit 142 may be arranged in an array form and include sensing pixels having a sensing area.
  • the sensing unit 142 may include a plurality of line type driving electrodes and receiving electrodes.
  • the sensing unit 142 may be formed of an AREA type having a plurality of image receiving units.
  • the sensing unit 142 may find a difference in capacitance due to a height difference according to the shape of the peak and the valley of the fingerprint of the user's finger, and may generate a fingerprint image by scanning the image of the fingerprint.
  • the sensing unit 142 may generate a fingerprint image by scanning an image of the fingerprint not only when the user's finger is in contact but also when the user's finger is moved.
  • the sensing unit 142 may have a fingerprint detection function and a pointer manipulation function for detecting a fingerprint.
  • the fingerprint sensor 141 may be implemented as a biometric trackpad (BTP).
  • the sensing unit 142 may have a location tracking function of a user's finger. That is, the sensing unit 142 may sense input information or static electricity according to whether a user's finger approaches or a movement thereof, and may have a pointer manipulation function of moving a pointer such as a cursor based on the movement.
  • the fingerprint sensor 141 may be electrically connected to the substrate 145. Electrical connection between the fingerprint sensor 141 and the substrate 145 may be made in various ways. For example, the fingerprint sensor 141 may be connected by a surface mount technology (SMT).
  • SMT surface mount technology
  • the fingerprint sensor 141 may be variously packaged such as a chip on board (COB), a quad flat package (QFP), a ball grid array (BGA), a wafer level package (WLP), a through silicon via (TSV), or the like. It can be formed through the method.
  • COB chip on board
  • QFP quad flat package
  • BGA ball grid array
  • WLP wafer level package
  • TSV through silicon via
  • the substrate 145 may have a mounting portion 146 on which the fingerprint sensor 141 is mounted and an extension portion 147 extending from the mounting portion 146.
  • the substrate 145 may be a flexible printed circuit board (FPCB), and the extension 147 may be connected to a connector 230 (see FIG. 9) provided on the main board 220 (see FIG. 9) of the electronic device 200. Can be.
  • FPCB flexible printed circuit board
  • the cover window 110 may have a seating portion 115 formed on the bottom surface 114 facing the inside of the electronic device 200.
  • the seating part 115 may be formed in the bezel area 112.
  • the mounting portion 115 may be formed on the surface of the lower surface 114 of the cover window 110, or may be formed in the form of a groove in the cover window (110).
  • the seating portion 115 When the seating portion 115 is formed in the shape of a groove, the seating portion 115 may be formed to correspond to the shape of the fingerprint sensor 141.
  • the mounting portion 115 is formed in the form of a groove.
  • the seating portion 115 may be formed by a method of etching or cutting, and such a method may be appropriately selected according to the material of the cover window 110.
  • the seating portion 115 may be formed by an etching or computer numerical control (CNC) machining method.
  • CNC computer numerical control
  • the etching method dry etching or wet etching may be used, or a method in which dry etching and wet etching are alternated may be used.
  • the cover window 110 is made of a synthetic resin such as plastic
  • the seating portion 115 may be molded together when the cover window is molded.
  • the fingerprint sensor module 140 may be coupled to the seating unit 115, and an adhesive unit 170 may be provided at the seating unit 115 so that the fingerprint sensor module 140 may be firmly coupled to the seating unit 115. .
  • the color layer 180 may be provided on the surface of the seating portion 115.
  • the color layer 180 may express colors with the upper surface 116 of the cover window 110 together with the print layer 113 provided in the bezel area 112 of the cover window 110.
  • the color layer 180 may be provided only on the bottom surface 117 of the mounting portion 115, or may be further provided on the side surface 118 of the mounting portion 115. In addition, the color layer 180 may have the same color as or different from that of the printed layer 113.
  • the adhesive part 170 may be provided on the color layer 180. That is, the color layer 180 may be first provided on the seating part 115, and the adhesive part 170 may be provided on the color layer 180.
  • the adhesive unit 170 may be formed in various forms such as a film form, a liquid form, and a powder form.
  • the adhesive part 170 may be appropriately selected according to the type of the fingerprint sensor. For example, when the fingerprint sensor 141 is capacitive, the adhesive part 170 may have a high dielectric constant and high adhesive force and a low viscosity. When the fingerprint sensor 141 is an ultrasonic method, it is preferable that the fingerprint sensor 141 is non-conductive so as not to affect sound waves.
  • the adhesive part 170 is provided on the bottom surface 117 and the side surface 118 of the seating portion 115 as a whole, or first to the bottom surface 117 of the seating portion 115 to fix the position of the fingerprint sensor 141.
  • the side surface 118 of the seating portion 115 that is, the outer surface and the seating portion 115 of the seating portion 115, is provided to mold and fix the fingerprint sensor 141 seated on the seating portion 115. May be used, such as being further filled in the space between the sides 118 of.
  • At least a portion of the sensing unit 142 and the fingerprint sensor 141 may be located in the seating unit 115.
  • the thickness D1 of the cover window 110 between the upper surface 116 of the cover window 110 and the upper surface of the sensing unit 142 may be 200 to 300 um.
  • the thickness D1 is derived in consideration of the strength of the cover window 110 and the sensing sensitivity of the fingerprint sensor 141. When the thickness D1 is less than 200 ⁇ m, the cover window 110 may not provide sufficient strength. If it exceeds 300um, the sensing sensitivity of the sensing unit 142 may be reduced.
  • FIG. 8 is a cross-sectional view illustrating a coupling example of a fingerprint sensor module and a seating unit in the electronic device cover window integrated fingerprint sensor module assembly according to the first embodiment of the present invention.
  • the seating part 115 may be formed to correspond to the shape of the fingerprint sensor 141, and the fingerprint sensor 141 may be seated and fixed to the seating part 115. That is, both the sensing unit 142 and the fingerprint sensor 141 may be mounted on the mounting unit 115.
  • the mounting part 146 and the extension part 147 of the substrate 145 may be provided outside the seating part 115.
  • the substrate 145 may be further positioned in the seating portion 115a.
  • a part of the substrate 145 positioned in the seating portion 115a may be a mounting portion 146. That is, the fingerprint sensor 141 including the sensing unit 142 and the mounting unit 146 of the substrate 145 may be mounted together in the mounting unit 115a.
  • the mounting portion 146b of the substrate 145b may have a larger area than the fingerprint sensor 141. Therefore, when the fingerprint sensor 141 is all seated on the seating portion 115, a part 149 of the mounting portion 146b may extend to the outside of the fingerprint sensor 141. At this time, the length L of the mounting portion 146b extending to the outside of the fingerprint sensor 141 is not particularly limited.
  • the sensing unit 142 and the upper portion of the fingerprint sensor 141 may be positioned in the seating part 115c. That is, according to the present embodiment, at least a portion of the sensing unit 142 and the fingerprint sensor 141 may be located in the seating unit 115c.
  • the fingerprint sensor 141 is coupled to the seating portion 115 formed on the lower surface 114 of the cover window 110, the upper surface 116 of the cover window 110 is continuously formed. It is simple in appearance and can enhance aesthetics in design.
  • the cover window 110 has a continuous surface without a buttonhole like a conventional cover window, the moisture or air in the outside may be structurally blocked from penetration, thereby waterproofing Can also be improved.
  • FIGS. 9 and 10 are cross-sectional view illustrating an installation example of an electronic device cover window integrated fingerprint sensor module assembly according to a first embodiment of the present invention.
  • the fingerprint sensor 141 may be seated and fixed to the seating portion 115 of the cover window 110.
  • the mounting portion 146 of the substrate 145 may be provided to be in close contact with the bottom surface 114 of the cover window 110.
  • the display module 210 may be provided in close proximity or in close contact with the lower side of the electronic device cover window integrated fingerprint sensor module assembly 100.
  • the cover window 110 and the display module 210 may be adhered by an adhesive (not shown).
  • the display module 210 may include a touch screen panel (not shown), and the main substrate 220 of the electronic device may be provided below the display module 210.
  • the connector 230 may be provided on the main board 220.
  • the extension 147 of the substrate 145 is connected to the display module 210 while the fingerprint sensor 141 is coupled to the seating portion 115. It may extend outward and be connected to the connector 230 of the main board 220.
  • the connection method may be applied to a structure in which the touch screen panel is provided inside the display module 210 or provided on the upper side of the display module 210.
  • a portion of the fingerprint sensor 141 may protrude to the outside of the seating portion 115d, and in this case, the display module 210d may not be positioned below the fingerprint sensor 141. It may be provided to avoid.
  • the length of the display module 210d may be shorter than the length of the display module 210 described with reference to FIG. 9, whereby an overlap occurs between the display module 210d and the fingerprint sensor 141. You can't.
  • FIG. 11 is an enlarged plan view showing a part of an electronic device having an electronic device cover window-integrated fingerprint sensor module assembly according to a first embodiment of the present invention, and FIG. A cross-sectional view showing the.
  • an open area 119 having a predetermined width may be formed on the bottom surface 114 of the cover window 110 along the edge of the seating portion 115.
  • the open area 119 may be a surface on which the print layer 113 provided on the bottom surface 114 of the cover window 110 is not provided along the edge of the seating portion 115.
  • the light emission part 250 may be provided below the cover window 110.
  • At least one light emitting unit 250 may be provided on the main substrate 220 of the electronic device 200, and the light emitting unit 250 may be disposed around the fingerprint sensor 141. It may be mounted on the main substrate 220 to be positioned.
  • the light emitting unit 250 may use a light emitting diode (LED) as a light source, and may include a plurality of light sources, for example, a white LED, a red LED, and a green LED, for irradiating light of various colors. .
  • LED light emitting diode
  • the light emitting unit 250 may be a light source having an upper surface directivity for irradiating light in an upward direction or a light source having a side orientation for irradiating light in a lateral direction.
  • Light emitted from the light emitter 250 may be emitted to the upper surface 116 of the cover window 110 through the open area 119.
  • the light emitted through the open area 119 to the upper surface 116 of the cover window 110 may express the shape of the open area 119, which is an indicator indicating the position of the fingerprint sensor 141. ) Function.
  • the cover window 110 since the upper side of the fingerprint sensor 141 is covered by the cover window 110, it may be difficult for the user to recognize the position of the fingerprint sensor 141.
  • the light emitted through the open area 119 may indicate the position of the fingerprint sensor 141, and in particular, may effectively inform the position of the fingerprint sensor 141 at night.
  • the open area 119 is shown as a track shape in FIG. 11, this is for illustrative purposes, and the open area 119 is not limited to the case formed along the edge of the seating part 115, and various shapes are provided. It is possible to form.
  • the light emitter 250 may emit light of various colors by combining light sources, and may emit light of different colors according to a function so that a user may recognize a corresponding function, state, etc. by the color of light.
  • open area 119 may be used in combination with various patterns to be described later with reference to FIGS. 13 to 15.
  • At least one light emitting unit 250 may be provided on the substrate 145e.
  • the light emitting unit 250 may be provided in the mounting unit 146e of the substrate 145e.
  • the mounting unit 146e may extend to the outside of the fingerprint sensor 141.
  • one or more of the substrate 145e and the main substrate 220 may be further provided with a vibrator (not shown), and the vibrator generates a specific vibration in conjunction with the light emitting unit 250 to allow a user to It can make you aware of the function, status, etc.
  • 13 to 15 are exemplary views showing the formation of the surface of the cover window corresponding to the upper side of the fingerprint sensor in the electronic device cover window integrated fingerprint sensor module assembly according to the first embodiment of the present invention.
  • an intaglio or embossed pattern may be further formed in an area corresponding to the upper side of the fingerprint sensor 141 of the upper surface 116 of the cover window 110 exposed to the user.
  • FIG. 13A shows a plan view of a cover window
  • FIG. 13B is a cross-sectional view taken along the line D-D.
  • an intaglio pattern 120 may be formed in an area corresponding to the upper side of the fingerprint sensor 141 of the upper surface 116 of the cover window 110.
  • the intaglio pattern 120 may have a geometric shape or the like.
  • FIG. 14A is a plan view of the cover window, and FIG. 14B is a cross-sectional view taken along the line E-E.
  • the intaglio pattern 121 may be formed in a groove shape.
  • FIG. 15A is a plan view of the cover window
  • FIG. 15B is a cross-sectional view taken along the F-F line.
  • an embossed pattern 122 may be formed in an area corresponding to an upper side of the fingerprint sensor 141 of the upper surface 116 of the cover window 110.
  • the embossed pattern 122 may be formed to avoid the fingerprint sensing area.
  • 15 illustrates a ring shape protruding along the edge of the fingerprint sensor 141 by the embossed pattern 122, but the exemplary embodiment is not limited thereto.
  • the embossed pattern 122 may be made to protrude when a particular state, for example, the user's finger is touched in a state that does not normally protrude.
  • the embossed pattern 122 may be implemented by a component provided separately on the upper surface of the cover window 110, the component is composed of a polymer material that can be modified in shape to form the embossed pattern 122 It may include.
  • 16 is a cross-sectional view illustrating an installation example of an electronic device cover window integrated fingerprint sensor module assembly and an electronic device according to a second embodiment of the present invention.
  • the configuration of the cover window may be different, and the other configuration is the same as the first embodiment described above, so description thereof will be omitted.
  • the cover window 310 may include a first cover window 320, an adhesive layer 330, and a second cover window 340.
  • the top surface 321 of the first cover window 320 may be a surface exposed to the user, and the adhesive layer 330 may be provided on the bottom surface of the first cover window 320.
  • the adhesive layer 330 may be applied or formed in the form of a film.
  • an optically clear resin (OCR) or an optically clear adhesive (OCA) may be used.
  • the upper surface of the second cover window 340 may be attached to the adhesive layer 330 to be bonded to the lower surface of the first cover window 320, and the second cover window 340 and the first cover window 320 may be formed of the same material. It may be made of.
  • the seating part 341 may be formed in the second cover window 340. In this case, the seating part 341 may be formed through the second cover window 340.
  • the color layer 350 may be provided at a position corresponding to the upper portion of the fingerprint sensor 141 of the lower surface of the first cover window 320, and may also be provided on the side of the seating portion 341 of the second cover window 340. It can be arranged further.
  • the adhesive part 370 may be further provided between the side surface of the seating portion 341 of the second cover window 340 and the side surface of the fingerprint sensor 141.
  • the thickness of the second cover window 340 may correspond to the thickness of the fingerprint sensor 141.
  • the seating portion 341 may be formed to penetrate the second cover window 340. There is an advantage that the process for matching the depth of 341 can be omitted.
  • the extension part 347 of the substrate 345 on which the fingerprint sensor 141 coupled to the seating part 341 may be extended may be extended to the outside of the display module 210 to be connected to the connector 230 of the main board 220.
  • the connection method may be applied to a structure in which a touch screen panel (not shown) is provided inside the display module 210 or provided on the upper side of the display module 210.
  • 17 is a plan view showing a cover window of the electronic device cover window integrated fingerprint sensor module assembly according to a third embodiment of the present invention.
  • the cover window 510 may further include a non-display unit 550 provided independently of the cover window 510.
  • the mounting portion 551 may be formed in the non-display portion 550.
  • the non-display portion 550 may be made of a synthetic resin or metal material such as plastic.
  • the seating portion 551 may be formed through processing after the non-display portion 550 is formed, or may be formed together when the non-display portion 550 is formed.
  • the non-display unit 550 may be opaque due to the characteristics of the material forming the non-display unit 550, the printing layer 113 (refer to FIG. 7) used in the above-described first embodiment is omitted. Can be.
  • FIG. 18 is a plan view showing a cover window of the electronic device cover window integrated fingerprint sensor module assembly according to a fourth embodiment of the present invention.
  • the bezel area 611 of the cover window 610 according to the present embodiment is compared with the bezel area 112 (see FIG. 4) of the first embodiment described above.
  • the area of the bezel area 611 below the bottom of the panel) may be small. That is, based on the cover window of the same size, the display area 612 of the cover window 610 according to the present embodiment may be formed wider than the display area 111 (refer to FIG. 4) of the first embodiment. have.
  • the mounting portion 651 may be formed in the display area 612.
  • a fingerprint sensor (not shown) may be provided in the display area 612, and thus, even in both areas 613 of the fingerprint sensor. As the image may be displayed, more various screens may be produced.
  • the image of the display module 210 is displayed as the lower portion of the cover window 110 (ie, the display area 612) except for the portion where the fingerprint sensor 141 is provided. I can understand that.
  • FIG. 19 is a perspective view illustrating an electronic device cover window integrated fingerprint sensor module assembly according to a fifth embodiment of the present invention
  • FIG. 20 is a fingerprint sensor of an electronic device cover window integrated fingerprint sensor module assembly according to a fifth embodiment of the present invention.
  • 21 is a perspective view showing a module
  • Figure 21 is a cross-sectional view taken along the line GG of Figure 19
  • Figure 22 is an exploded perspective view showing an electronic device cover window integrated fingerprint sensor module assembly according to a fifth embodiment of the present invention.
  • the configuration of the fingerprint sensor module may be different, and other configurations are the same as the first embodiment described above, and thus description thereof will be omitted.
  • the fingerprint sensor module 710 of the cover window integrated fingerprint sensor module assembly 700 includes a fingerprint sensor 711, a substrate 712, a base 720, and a cover. 730 may include.
  • the fingerprint sensor 711 may be applied to all the contents related to the fingerprint sensor of the first embodiment.
  • the fingerprint sensor 711 may be mounted on the substrate 712, and in this embodiment, the substrate 712 may be a rigid PCB.
  • the base 720 may include a groove 721, a reflector 724, and a through part 725.
  • the groove 721 may be recessed in the upper surface 722 of the base 720.
  • a support 723 may be formed at the center of the groove 721, and the substrate 712 on which the fingerprint sensor 711 is mounted may be supported by the support 723.
  • the support parts 723 may be provided in pairs.
  • the light emitting part 714 may be provided on the bottom surface 713 of the substrate 712.
  • the light emitting unit 714 may be applied to all of the contents related to the light emitting unit of the first embodiment.
  • a reflection part 724 may be provided on an inner surface of the groove part 721.
  • the reflector 724 may be provided by deposition, printing, spraying and plating.
  • the reflector 724 may be formed by coating a solution having a reflective function or by coating a reflective film. Therefore, the light emitted from the light emitter 714 provided on the bottom surface 713 of the substrate 712 may be reflected by the reflector 724.
  • the reflector 724 may allow the light to be totally reflected.
  • a through part 725 may be formed in the center of the base 720, and a connector part 715 may be mounted in the center of the lower surface 713 of the substrate 712.
  • the connector 715 may be exposed to the outside of the fingerprint sensor module 710 through the through part 725, and may be electrically connected to a main substrate (not shown) provided in the electronic device.
  • the cover 730 may cover the top surface of the base 720 and fix the fingerprint sensor 711.
  • the opening 731 may be penetrated through the cover 730.
  • the fingerprint sensor 711 may be coupled to the opening 731, and the sensing unit (not shown) may be exposed through the opening 731.
  • a fixing portion 733 may protrude from the lower surface 732 of the cover 730, and the substrate 712 may be positioned and fixed inside the fixing portion 733.
  • the cover 730 may be formed of a light transmissive material, and thus, light emitted from the light emitter 714 may be transmitted through the cover 730.
  • a light blocking part 734 may be provided on an upper surface of the cover 730, and the light blocking part 734 may block light.
  • the light blocking portion 734 may not be provided in some regions of the top surface of the cover 730.
  • the partial region may be a band-shaped open region 735 spaced apart from the fingerprint sensor 711 by a predetermined interval and having a predetermined width along the edge of the fingerprint sensor 711.
  • the light shield 734 may be provided by deposition, printing, spraying, plating, or the like.
  • the light blocking unit 734 may be formed by coating a solution having a function of blocking light, or may be formed by coating a film having a function of blocking light.
  • Open area 735 may function as an indicator as described above.
  • the open area 735 may be further provided with a thin coating layer (not shown), and the coating layer may have a color.
  • the coating layer may be formed so thin that the light transmitted through the cover 730 can be emitted.
  • the color layer may express a color even when the light emitter 714 does not emit light, thereby realizing the function of an indicator even when the light emitter 714 does not emit light.
  • An adhesive 740 may be provided between the upper surface 722 of the base 720 and the lower surface 732 of the cover 730 to adhere the base 720 and the cover 730.
  • the type and shape of the adhesive 740 are not particularly limited, and for example, a double-sided adhesive tape may be used.
  • the fingerprint sensor module 710 may be coupled to the seating portion 751 of the cover window 750.
  • the seating portion 751 is formed in the shape of a groove will be described as an example. Can be.
  • an adhesive part 755 may be provided between the fingerprint sensor module 710 and the seating portion 751.
  • the adhesive part 755 may be provided in the seating part 751 as a whole, and may have a light transmissive property so that light emitted from the open area 735 of the cover 730 may flow into the cover window 750.

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Abstract

The present invention relates to a fingerprint sensor module assembly integrated with a cover window for an electronic device which has a simple appearance, can enhance the aesthetic sense of design, and has improved waterproofness. A fingerprint sensor module assembly integrated with a cover window for an electronic device, according to one embodiment of the present invention, comprises: a cover window; a fingerprint sensor module; and an adhesion part. Here, the cover window is provided to an electronic device, an image is displayed on the cover window by means of a display module, and a mounting part is formed on the lower side thereof facing the electronic device. The fingerprint module, positioned in the mounting part, comprises a fingerprint sensor having a sensing unit for sensing fingerprints; and a substrate which is electrically connected to the fingerprint sensor. Further, the adhesion part is provided between the mounting part and the fingerprint sensor module and fixes the fingerprint sensor module in the mounting part.

Description

전자기기 커버윈도우 일체형 지문센서 모듈 조립체Electronic Cover Window Integrated Fingerprint Sensor Module Assembly
본 발명은 전자기기 커버윈도우 일체형 지문센서 모듈 조립체에 관한 것으로, 더욱 상세하게는 외관상 심플하고 디자인적으로 심미감을 높일 수 있으며 방수성도 개선된 전자기기 커버윈도우 일체형 지문센서 모듈 조립체에 관한 것이다.The present invention relates to an electronic device cover window-integrated fingerprint sensor module assembly, and more particularly, to an electronic device cover window-integrated fingerprint sensor module assembly which is simple in appearance and can enhance aesthetics in appearance and also improves waterproofness.
최근 스마트폰(Smartphone)이나 태블릿 피씨(Tablet PC)를 비롯한 휴대용 전자기기에 대하여 대중의 관심이 집중되면서, 관련 기술분야에 대한 연구개발이 활발히 진행되고 있다. Recently, as public attention has focused on portable electronic devices such as smartphones or tablet PCs, research and development in related technical fields are being actively conducted.
휴대용 전자기기는, 사용자로부터 특정한 명령을 입력받기 위한 입력장치의 하나로서 표시장치인 디스플레이와 일체화된 터치스크린(Touch Screen)을 내장하는 경우가 많다. 또한 휴대용 전자기기는 터치스크린 이외의 입력장치로서 각종 기능키(Function Key)나 소프트키(Soft Key)를 구비하기도 한다.BACKGROUND OF THE INVENTION Portable electronic devices often incorporate a touch screen integrated with a display, which is a display device, as one of input devices for receiving a specific command from a user. In addition, the portable electronic device may include various function keys or soft keys as input devices other than the touch screen.
이러한 기능키나 소프트키는 홈 키로서 동작할 수 있는데, 예를 들면, 실행 중인 애플리케이션을 빠져 나와 초기 화면으로 돌아가는 기능을 수행하거나, 유저 인터페이스를 한 계층 전으로 돌아가게 하는 백(BACK)키 또는 자주 쓰는 메뉴를 호출하는 메뉴키로서 동작할 수 있다. 이러한 기능키나 소프트키는 도전체의 정전 용량을 감지하는 방식, 또는 전자기펜의 전자기파를 감지하는 방식 또는 이 두 가지 방식이 모두 구현된 복합 방식으로 구현될 수 있으며, 물리적 버튼으로 구현될 수 있다.These function keys or softkeys can act as home keys, for example, to exit a running application and return to the home screen, or to return the user interface one layer back, or frequently. Can act as a menu key to call a menu to write. Such a function key or soft key may be implemented in a manner of sensing a capacitance of a conductor, a method of sensing electromagnetic waves of an electromagnetic pen, or a complex method in which both methods are implemented, and may be implemented as a physical button.
한편, 최근 휴대용 전자기기의 용도가 보안이 필요한 서비스로 급격히 확장됨에 따라, 높은 보안성의 이유로 생체정보를 측정하는 기능을 갖는 생체인식 센서(Biometric Sensor)를 휴대용 전자기기에 장착하려는 추세가 늘고 있다.On the other hand, as the use of portable electronic devices has rapidly expanded to services requiring security, a trend toward mounting a biometric sensor having a function of measuring biometric information for high security has increased.
생체정보로는 지문, 손등의 혈관, 목소리, 홍채 등이 있으며, 생체인식 센서로는 지문센서가 많이 사용되고 있다.Biometric information includes fingerprints, blood vessels on the back of the hand, voices, irises, and the like, and fingerprint sensors are widely used as biometric sensors.
지문센서는 인간의 손가락 지문을 감지하는 센서로서, 지문센서를 통해 사용자 등록이나 인증 절차를 거치도록 함으로써, 휴대용 전자기기에 저장된 데이터를 보호하고, 보안사고를 미연에 방지할 수 있다.The fingerprint sensor is a sensor that detects a human finger fingerprint. The fingerprint sensor is configured to undergo user registration or authentication through a fingerprint sensor, thereby protecting data stored in the portable electronic device and preventing security accidents.
지문센서는 주변 부품이나 구조를 포함하는 모듈의 형태로 제조될 수 있고, 물리적인 기능키에 일체화되어 구현될 수 있기 때문에, 각종 전자기기에 효과적으로 장착될 수 있다. The fingerprint sensor may be manufactured in the form of a module including a peripheral component or a structure, and may be integrated with a physical function key so that the fingerprint sensor may be effectively mounted on various electronic devices.
최근에는, 커서와 같은 포인터의 조작을 수행하는 내비게이션 기능을 지문센서에 통합하기도 하는 등 그 활용 정도가 더욱 넓어지고 있는데, 이러한 형태의 지문센서를 바이오매트릭 트랙패드(BTP: Biometric Track Pad)라 한다. In recent years, the use of the fingerprint sensor such as the navigation function that performs the operation of a pointer, such as the integration of the fingerprint sensor is becoming more widespread, this type of fingerprint sensor is called a Bimetric Track Pad (BTP). .
지문센서의 종류에는 정전용량식, 광학식, 초음파 방식, 열감지 방식, 비접촉 방식 등이 있으나, 감도가 우수하고 외부 환경변화에 강인하며 휴대용 전자기기와의 정합성이 우수한 정전용량 방식의 지문센서가 최근 많이 사용되고 있다.Types of fingerprint sensors include capacitive type, optical type, ultrasonic type, heat sensing type, and non-contact type, but the capacitive type fingerprint sensor with excellent sensitivity, robust against external environmental changes and excellent matching with portable electronic devices has recently been developed. It is used a lot.
도 1은 종래에 지문센서 모듈이 장착된 전자기기를 나타낸 예시도이고, 도 2는 도 1의 A-A선에 따른 단면예시도이다.1 is a diagram illustrating a conventional electronic device equipped with a fingerprint sensor module, Figure 2 is a cross-sectional view taken along the line A-A of FIG.
도 1 및 도 2에서 보는 바와 같이, 종래의 전자기기(10)의 커버윈도우(20)에는 버튼 홀(21)이 관통 형성되고, 지문센서 모듈(30)은 버튼 홀(21)에 설치된다. As shown in FIG. 1 and FIG. 2, a button hole 21 is formed through the cover window 20 of the conventional electronic device 10, and the fingerprint sensor module 30 is installed in the button hole 21.
지문센서 모듈(30)은 센싱부(31)를 가지는 지문센서(32)와, 지문센서(32)가 실장되는 기판(33)을 포함하며, 지문센서(32)의 상면에는 컬러층 및 보호층 등을 포함하는 레이어(34)가 마련된다. 일반적으로, 버튼 홀(21)에 결합되는 지문센서 모듈(30)은 레이어(34)의 상면(35)이 커버윈도우(20)의 상면(22)과 비슷한 높이가 되도록 장착된다. The fingerprint sensor module 30 includes a fingerprint sensor 32 having a sensing unit 31 and a substrate 33 on which the fingerprint sensor 32 is mounted, and a color layer and a protective layer on the upper surface of the fingerprint sensor 32. A layer 34 including the back is provided. In general, the fingerprint sensor module 30 coupled to the button hole 21 is mounted such that the upper surface 35 of the layer 34 is similar to the upper surface 22 of the cover window 20.
한편, 제조사별로 다양한 두께의 전자기기가 제조됨에 따라, 이에 적합한 다양한 높이의 지문센서 모듈이 요구되고 있다. 이를 위해, 지문센서(32)의 높이를 조절하거나 기판(33)의 두께를 조절하는 방법이 사용되고 있으나, 지문센서(32)의 높이 또는 기판(33)의 두께를 증가시키기 위해서는 원가가 증가되는 부담이 있고, 다양한 두께의 기판이 존재함에 따른 관리의 어려움이 발생하게 된다. Meanwhile, as electronic devices of various thicknesses are manufactured for each manufacturer, fingerprint sensor modules having various heights are required. To this end, a method of adjusting the height of the fingerprint sensor 32 or adjusting the thickness of the substrate 33 is used, but the cost is increased to increase the height of the fingerprint sensor 32 or the thickness of the substrate 33. There is a difficulty in managing the presence of a substrate of various thickness.
또한, 커버윈도우(20)에는 지문센서 모듈(30)이 장착될 수 있도록 버튼 홀(21)이 관통 형성되기 때문에, 버튼 홀(21)과 지문센서 모듈(30)의 사이의 틈새로 외부의 습기 또는 공기 중의 수분이 침투될 수 있다. 그리고, 외부의 습기 또는 공기 중의 수분의 침투는 지문센서 모듈(30)에 전로(電路) 단락(Short Circuit)을 야기할 수 있으며, 지문센서(32)의 오동작 또는 파손을 야기할 수 있는 문제점이 된다. 종래에는 이러한 외부의 습기 또는 공기 중의 수분이 침투를 방지하기 위한 실링제(40)를 추가로 마련하기도 하는데, 이는 결국 원가 증가, 공정 추가로 이어지는 문제점이 된다. In addition, since the button hole 21 is formed to penetrate the cover window 20 so that the fingerprint sensor module 30 can be mounted, external moisture is prevented by a gap between the button hole 21 and the fingerprint sensor module 30. Or moisture in the air may penetrate. In addition, infiltration of external moisture or moisture in the air may cause a short circuit in the fingerprint sensor module 30, and may cause malfunction or damage of the fingerprint sensor 32. do. Conventionally, such external moisture or air in the air may further provide a sealing agent 40 to prevent penetration, which is a problem that leads to cost increase and process addition.
이러한 문제점은 COB(Chip On Board), QFP(Quad Flat Package), BGA(Ball Grid Array) 및 WLP(Wafer Level Package) 등의 다양한 패키징 방법을 통해 형성되는 지문센서 모듈에서 공통적으로 나타날 수 있는 것이다.Such a problem may be common in a fingerprint sensor module formed through various packaging methods such as a chip on board (COB), a quad flat package (QFP), a ball grid array (BGA), and a wafer level package (WLP).
상기와 같은 문제점을 해결하기 위하여, 본 발명이 이루고자 하는 기술적 과제는 외관상 심플하고 디자인적으로 심미감을 높일 수 있으며 방수성도 개선된 전자기기 커버윈도우 일체형 지문센서 모듈 조립체를 제공하는 것이다.In order to solve the above problems, the technical problem to be achieved by the present invention is to provide an electronic device cover window-integrated fingerprint sensor module assembly that is simple in appearance and can enhance the aesthetics in design and improved waterproofness.
상기 기술적 과제를 달성하기 위하여, 본 발명의 일실시예는 전자기기에 구비되고 디스플레이 모듈에 의한 영상이 표시되며, 상기 전자기기의 내측을 향하는 하면에 안착부가 형성되는 커버윈도우; 지문을 감지하는 센싱부를 가지는 지문센서, 상기 지문센서와 전기적으로 연결되는 기판을 포함하고, 상기 안착부에 위치되는 지문센서 모듈; 그리고 상기 안착부 및 상기 지문센서 모듈 사이에 마련되어 상기 지문센서 모듈을 상기 안착부에 고정시키는 접착부를 포함하는 전자기기 커버윈도우 일체형 지문센서 모듈 조립체를 제공한다.In order to achieve the above technical problem, an embodiment of the present invention is provided with an electronic device and an image displayed by the display module, the cover window is formed on the lower surface facing the inside of the electronic device; A fingerprint sensor having a sensing unit for sensing a fingerprint, a fingerprint sensor module including a substrate electrically connected to the fingerprint sensor, and located at the seating unit; And providing an electronic device cover window-integrated fingerprint sensor module assembly provided between the seating part and the fingerprint sensor module, the adhesive part fixing the fingerprint sensor module to the seating part.
본 발명의 일실시예에 있어서, 상기 안착부는 상기 커버 윈도우의 하면의 표면 상에 마련될 수 있다.In one embodiment of the present invention, the seating portion may be provided on the surface of the lower surface of the cover window.
본 발명의 일실시예에 있어서, 상기 안착부는 상기 지문센서의 형상에 대응되도록 홈 형상으로 형성되고, 상기 안착부에는 상기 지문센서가 안착 고정될 수 있다.In one embodiment of the present invention, the seating portion is formed in a groove shape so as to correspond to the shape of the fingerprint sensor, the fingerprint sensor may be fixed to the seating.
본 발명의 일실시예에 있어서, 상기 안착부는 에칭 또는 절삭 가공으로 형성될 수 있다.In one embodiment of the present invention, the seating portion may be formed by etching or cutting.
본 발명의 일실시예에 있어서, 상기 안착부 내에는 상기 센싱부 및 상기 지문센서의 적어도 일부가 위치될 수 있다.In one embodiment of the present invention, at least a portion of the sensing unit and the fingerprint sensor may be located in the seating portion.
본 발명의 일실시예에 있어서, 상기 안착부 내에는 상기 기판의 적어도 일부가 더 위치될 수 있다.In one embodiment of the present invention, at least a portion of the substrate may be further located in the seating portion.
본 발명의 일실시예에 있어서, 상기 커버윈도우의 상면과 상기 센싱부의 상면 사이의 상기 커버윈도우의 두께는 200~300um일 수 있다.In one embodiment of the present invention, the thickness of the cover window between the upper surface of the cover window and the upper surface of the sensing unit may be 200 ~ 300um.
본 발명의 일실시예에 있어서, 상기 커버윈도우는 영상이 표시되는 표시 영역과, 인쇄층이 마련되어 영상이 표시되지 않는 베젤 영역을 가지고, 상기 안착부는 상기 베젤 영역에 형성될 수 있다.In one embodiment of the present invention, the cover window may have a display area in which an image is displayed, and a bezel area in which a print layer is provided and the image is not displayed, and the seating part may be formed in the bezel area.
본 발명의 일실시예에 있어서, 사용자에게 노출되는 상기 커버윈도우의 상면 중 상기 지문센서의 상측에 해당되는 영역에는 음각 또는 양각의 패턴이 더 형성될 수 있다.In an embodiment of the present invention, an intaglio or embossed pattern may be further formed in an area corresponding to the upper side of the fingerprint sensor among the top surfaces of the cover window exposed to the user.
본 발명의 일실시예에 있어서, 상기 커버윈도우의 하면에는 상기 안착부의 테두리를 따라 미리 정해진 폭의 개방 영역이 형성되고, 상기 커버윈도우의 하측에는 상기 개방 영역을 통해 상기 커버윈도우의 상면으로 발광되는 광을 제공하는 발광부가 구비될 수 있다.In one embodiment of the present invention, an opening area having a predetermined width is formed along the edge of the seating portion on the lower surface of the cover window, and the lower side of the cover window emits light to the upper surface of the cover window through the opening area. A light emitting unit for providing light may be provided.
본 발명의 일실시예에 있어서, 상기 발광부는 상기 기판 또는 상기 지문센서 모듈이 전기적으로 연결되는 메인 기판에 하나 이상이 구비될 수 있다.In one embodiment of the present invention, the light emitting unit may be provided with one or more on the main substrate to which the substrate or the fingerprint sensor module is electrically connected.
본 발명의 일실시예에 있어서, 상기 커버윈도우는 영상이 표시되는 표시 영역과, 인쇄층이 마련되어 영상이 표시되지 않은 베젤 영역을 가지고, 상기 안착부는 상기 표시 영역에 형성될 수 있다.In one embodiment of the present invention, the cover window may have a display area in which an image is displayed and a bezel area in which a print layer is provided and no image is displayed, and the seating part may be formed in the display area.
본 발명의 일실시예에 있어서, 상기 커버윈도우는 유리, 사파이어, 지르코늄 및 투명 수지 중에서 선택된 재질로 이루어질 수 있다.In one embodiment of the present invention, the cover window may be made of a material selected from glass, sapphire, zirconium and a transparent resin.
본 발명의 일실시예에 있어서, 상기 커버윈도우는 상기 커버윈도우와 독립적으로 구비되는 비표시부를 더 포함하고, 상기 안착부는 상기 비표시부에 형성될 수 있다.In one embodiment of the present invention, the cover window may further include a non-display portion provided independently of the cover window, the seating portion may be formed in the non-display portion.
본 발명의 일실시예에 있어서, 상기 비표시부는 수지 또는 금속 재질로 이루어질 수 있다.In one embodiment of the present invention, the non-display portion may be made of a resin or a metal material.
본 발명의 일실시예에 있어서, 상기 커버윈도우는 상면이 사용자에게 노출되는 제1커버윈도우와, 상기 제1커버윈도우의 하면에 마련되는 접착층과, 상기 접착층에 의해 상면이 상기 제1커버윈도우의 하면과 접합되는 제2커버윈도우를 포함하고, 상기 안착부는 상기 제2커버윈도우를 관통하여 형성될 수 있다.In one embodiment of the present invention, the cover window is a first cover window, the upper surface is exposed to the user, an adhesive layer provided on the lower surface of the first cover window, and the upper surface of the first cover window by the adhesive layer It includes a second cover window bonded to the lower surface, the seating portion may be formed through the second cover window.
본 발명의 일실시예에 있어서, 상기 제2커버윈도우의 두께는 상기 지문센서의 높이에 대응될 수 있다.In one embodiment of the present invention, the thickness of the second cover window may correspond to the height of the fingerprint sensor.
본 발명의 일실시예에 있어서, 상기 안착부의 표면에는 색상층이 마련되고, 상기 접착부는 상기 색상층 상에 채워질 수 있다.In one embodiment of the present invention, the surface of the seating portion is provided with a color layer, the adhesive portion may be filled on the color layer.
본 발명의 일실시예에 따르면, 지문센서가 커버윈도우의 하면에 형성되는 안착부에 결합되기 때문에, 커버윈도우의 상면에서 보았을 때, 연속적인 표면이 형성될 수 있어 외관상 심플하고 디자인적으로 심미감을 높일 수 있다.According to one embodiment of the invention, since the fingerprint sensor is coupled to the seating portion formed on the bottom of the cover window, when viewed from the top of the cover window, a continuous surface can be formed, the appearance is simple and design aesthetics It can increase.
또한, 본 발명의 일실시예에 따르면, 커버윈도우가 종래의 커버윈도우와 같은 버튼 홀이 없어 연속적인 표면을 가지기 때문에, 외부의 습기 또는 공기 중의 수분이 침투가 구조적으로 차단될 수 있으며, 이를 통해 방수성도 개선될 수 있다.In addition, according to an embodiment of the present invention, since the cover window has a continuous surface without a buttonhole like the conventional cover window, the external moisture or moisture in the air can be structurally blocked from penetration, thereby Water resistance can also be improved.
본 발명의 효과는 상기한 효과로 한정되는 것은 아니며, 본 발명의 상세한 설명 또는 특허청구범위에 기재된 발명의 구성으로부터 추론 가능한 모든 효과를 포함하는 것으로 이해되어야 한다.The effects of the present invention are not limited to the above-described effects, but should be understood to include all the effects deduced from the configuration of the invention described in the detailed description or claims of the present invention.
도 1은 종래에 지문센서 모듈이 장착된 전자기기를 나타낸 예시도이다.1 is a diagram illustrating a conventional electronic device equipped with a fingerprint sensor module.
도 2는 도 1의 A-A선에 따른 단면예시도이다.2 is a cross-sectional view taken along the line A-A of FIG.
도 3은 본 발명의 제1실시예에 따른 전자기기 커버윈도우 일체형 지문센서 모듈 조립체를 가지는 전자기기를 나타낸 예시도이다.Figure 3 is an exemplary view showing an electronic device having an electronic device cover window integrated fingerprint sensor module assembly according to a first embodiment of the present invention.
도 4는 본 발명의 제1실시예에 따른 전자기기 커버윈도우 일체형 지문센서 모듈 조립체를 나타낸 평면도이다.Figure 4 is a plan view showing an electronic device cover window integrated fingerprint sensor module assembly according to a first embodiment of the present invention.
도 5는 본 발명의 제1실시예에 따른 전자기기 커버윈도우 일체형 지문센서 모듈 조립체를 나타낸 저면도이다.FIG. 5 is a bottom view of the electronic device cover window integrated fingerprint sensor module assembly according to the first embodiment of the present invention.
도 6은 본 발명의 제1실시예에 따른 전자기기 커버윈도우 일체형 지문센서 모듈 조립체의 분해사시도이다.6 is an exploded perspective view of the electronic device cover window-integrated fingerprint sensor module assembly according to the first embodiment of the present invention.
도 7은 도 4의 B-B선에 따른 단면예시도이다.7 is a cross-sectional view taken along the line B-B of FIG.
도 8은 본 발명의 제1실시예에 따른 전자기기 커버윈도우 일체형 지문센서 모듈 조립체에서 지문센서 모듈과 안착부의 결합예를 나타낸 단면예시도이다.8 is a cross-sectional view illustrating a coupling example of a fingerprint sensor module and a seating unit in the electronic device cover window integrated fingerprint sensor module assembly according to the first embodiment of the present invention.
도 9 및 도 10은 본 발명의 제1실시예에 따른 전자기기 커버윈도우 일체형 지문센서 모듈 조립체의 설치예를 나타낸 단면예시도이다.9 and 10 are cross-sectional view illustrating an installation example of an electronic device cover window integrated fingerprint sensor module assembly according to a first embodiment of the present invention.
도 11은 본 발명의 제1실시예에 따른 전자기기 커버윈도우 일체형 지문센서 모듈 조립체를 가지는 전자기기의 일부를 확대하여 나타낸 평면예시도이다.11 is an enlarged plan view illustrating a part of an electronic device having an electronic device cover window-integrated fingerprint sensor module assembly according to a first embodiment of the present invention.
도 12는 도 11의 C-C선에 따르는 발광부의 설치예를 나타낸 단면예시도이다.FIG. 12 is a cross-sectional view illustrating an installation example of a light emitting unit along the line C-C in FIG.
도 13 내지 도 15는 본 발명의 제1실시예에 따른 전자기기 커버윈도우 일체형 지문센서 모듈 조립체에서 지문센서의 상측에 해당되는 커버윈도우의 표면의 형성 예를 나타낸 예시도이다.13 to 15 are exemplary views showing the formation of the surface of the cover window corresponding to the upper side of the fingerprint sensor in the electronic device cover window integrated fingerprint sensor module assembly according to the first embodiment of the present invention.
도 16은 본 발명의 제2실시예에 따른 전자기기 커버윈도우 일체형 지문센서 모듈 조립체 및 전자기기에 대한 설치예를 나타낸 단면예시도이다.16 is a cross-sectional view illustrating an installation example of an electronic device cover window integrated fingerprint sensor module assembly and an electronic device according to a second embodiment of the present invention.
도 17은 본 발명의 제3실시예에 따른 전자기기 커버윈도우 일체형 지문센서 모듈 조립체의 커버윈도우를 나타낸 평면예시도이다.17 is a plan view showing a cover window of the electronic device cover window integrated fingerprint sensor module assembly according to a third embodiment of the present invention.
도 18은 본 발명의 제4실시예에 따른 전자기기 커버윈도우 일체형 지문센서 모듈 조립체의 커버윈도우를 나타낸 평면예시도이다.18 is a plan view showing a cover window of the electronic device cover window integrated fingerprint sensor module assembly according to a fourth embodiment of the present invention.
도 19는 본 발명의 제5실시예에 따른 전자기기 커버윈도우 일체형 지문센서 모듈 조립체를 나타낸 사시도이다.19 is a perspective view illustrating an electronic device cover window integrated fingerprint sensor module assembly according to a fifth embodiment of the present invention.
도 20은 본 발명의 제5실시예에 따른 전자기기 커버윈도우 일체형 지문센서 모듈 조립체의 지문센서 모듈을 나타낸 사시도이다.20 is a perspective view illustrating a fingerprint sensor module of the electronic device cover window-integrated fingerprint sensor module assembly according to the fifth embodiment of the present invention.
도 21은 도 19의 G-G선에 따른 단면예시도이다.21 is a cross-sectional view taken along the line G-G of FIG.
도 22는 본 발명의 제5실시예에 따른 전자기기 커버윈도우 일체형 지문센서 모듈 조립체를 나타낸 분해사시도이다.22 is an exploded perspective view showing the electronic device cover window-integrated fingerprint sensor module assembly according to a fifth embodiment of the present invention.
<도면의 주요 부분에 대한 부호의 설명><Explanation of symbols for the main parts of the drawings>
100,700: 전자기기 커버윈도우 일체형 지문센서 모듈 조립체100,700: electronic device cover window integrated fingerprint sensor module assembly
110,310,510,610,750: 커버윈도우 111: 표시 영역110, 310, 510, 610, 750: cover window 111: display area
112: 베젤 영역 113: 인쇄층112: bezel area 113: printed layer
115,551,651,751: 안착부 119,735: 개방 영역115,551,651,751: Mounting part 119,735: open area
120,121,122: 패턴 140,710: 지문센서 모듈120,121,122: pattern 140,710: fingerprint sensor module
141,711: 지문센서 145,712: 기판141,711: fingerprint sensor 145,712: substrate
170,755: 접착부 180: 색상층170,755: bonding portion 180: color layer
200: 전자기기 210: 디스플레이 모듈200: electronic device 210: display module
220: 메인 기판 230: 커넥터220: main board 230: connector
250: 발광부 320: 제1커버윈도우250: light emitting unit 320: first cover window
330: 접착층 340: 제2커버윈도우330: adhesive layer 340: second cover window
550: 비표시부 720: 베이스550: non-display portion 720: base
730: 커버730: cover
이하에서는 첨부한 도면을 참조하여 본 발명을 설명하기로 한다. 그러나 본 발명은 여러 가지 상이한 형태로 구현될 수 있으며, 따라서 여기에서 설명하는 실시예로 한정되는 것은 아니다. 그리고 도면에서 본 발명을 명확하게 설명하기 위해서 설명과 관계없는 부분은 생략하였으며, 명세서 전체를 통하여 유사한 부분에 대해서는 유사한 도면 부호를 붙였다.Hereinafter, with reference to the accompanying drawings will be described the present invention. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention. In the drawings, parts irrelevant to the description are omitted in order to clearly describe the present invention, and like reference numerals designate like parts throughout the specification.
명세서 전체에서, 어떤 부분이 다른 부분과 "연결"되어 있다고 할 때, 이는 "직접적으로 연결"되어 있는 경우뿐 아니라, 그 중간에 다른 부재를 사이에 두고 "간접적으로 연결"되어 있는 경우도 포함한다. 또한 어떤 부분이 어떤 구성요소를 "포함"한다고 할 때, 이는 특별히 반대되는 기재가 없는 한 다른 구성요소를 제외하는 것이 아니라 다른 구성요소를 더 구비할 수 있다는 것을 의미한다.Throughout the specification, when a part is "connected" to another part, it includes not only "directly connected" but also "indirectly connected" with another member in between. . In addition, when a part is said to "include" a certain component, this means that it may further include other components, without excluding the other components unless otherwise stated.
이하 첨부된 도면을 참고하여 본 발명의 실시예를 상세히 설명하기로 한다.Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.
도 3은 본 발명의 제1실시예에 따른 전자기기 커버윈도우 일체형 지문센서 모듈 조립체를 가지는 전자기기를 나타낸 예시도이고, 도 4는 본 발명의 제1실시예에 따른 전자기기 커버윈도우 일체형 지문센서 모듈 조립체를 나타낸 평면도이고, 도 5는 본 발명의 제1실시예에 따른 전자기기 커버윈도우 일체형 지문센서 모듈 조립체를 나타낸 저면도이고, 도 6은 본 발명의 제1실시예에 따른 전자기기 커버윈도우 일체형 지문센서 모듈 조립체의 분해사시도이고, 도 7은 도 4의 B-B선에 따른 단면예시도이다.Figure 3 is an exemplary view showing an electronic device having an electronic device cover window integrated fingerprint sensor module assembly according to a first embodiment of the present invention, Figure 4 is an electronic device cover window integrated fingerprint sensor according to a first embodiment of the present invention 5 is a plan view showing a module assembly, FIG. 5 is a bottom view showing an integrated fingerprint sensor module assembly according to the first embodiment of the present invention, and FIG. 6 is a cover view of the electronic device according to the first embodiment of the present invention. An exploded perspective view of the integrated fingerprint sensor module assembly, Figure 7 is a cross-sectional view taken along the line BB of FIG.
도 3 내지 도 7에서 보는 바와 같이, 본 발명의 제1실시예에 따른 전자기기 커버윈도우 일체형 지문센서 모듈 조립체(100)는 커버윈도우(110), 지문센서 모듈(140) 그리고 접착부(170)를 포함할 수 있다.3 to 7, the electronic device cover window integrated fingerprint sensor module assembly 100 according to the first embodiment of the present invention includes a cover window 110, a fingerprint sensor module 140, and an adhesive part 170. It may include.
여기서, 커버윈도우(110)는 전자기기(200)의 전면에 구비되고 디스플레이 모듈(210, 도 9 참조)에 의한 영상이 투과되어 표시되도록 한다. Here, the cover window 110 is provided on the front surface of the electronic device 200 so that the image transmitted by the display module 210 (see FIG. 9) is transmitted and displayed.
커버윈도우(110)는 유리, 사파이어, 지르코늄 및 투명 수지 중에서 선택된 재질로 이루어질 수 있다. 커버윈도우(110)가 유리 재질로 이루어지는 경우, 소다라임 유리기판, 무알칼리 유리기판 또는 강화유리기판 등 각종의 유리기판이 적용될 수 있다. 그리고, 투명 수지로는 아크릴 등이 적용될 수 있다. The cover window 110 may be made of a material selected from glass, sapphire, zirconium, and a transparent resin. When the cover window 110 is made of a glass material, various glass substrates such as a soda lime glass substrate, an alkali free glass substrate, or a tempered glass substrate may be applied. As the transparent resin, acryl or the like may be applied.
커버윈도우(110)는 영상이 표시되는 표시 영역(111)과, 영상이 표시되지 않는 베젤 영역(112)을 가질 수 있다. The cover window 110 may have a display area 111 in which an image is displayed and a bezel area 112 in which the image is not displayed.
베젤 영역(112)은 인쇄층(113)이 마련됨으로써 형성될 수 있다. 인쇄층(113)은 커버윈도우(110)가 전자기기(200)에 장착되었을 때, 전자기기(200)의 내측을 향하는 커버윈도우(110)의 하면(114)에 마련될 수 있으며, 커버윈도우(110)의 가장자리 영역에 마련될 수 있다.The bezel area 112 may be formed by providing the print layer 113. The print layer 113 may be provided on the bottom surface 114 of the cover window 110 facing the inside of the electronic device 200 when the cover window 110 is mounted on the electronic device 200. It may be provided in the edge area of the 110.
그리고, 지문센서 모듈(140)은 지문센서(141) 및 기판(145)을 포함할 수 있다. The fingerprint sensor module 140 may include a fingerprint sensor 141 and a substrate 145.
본 발명에 따른 지문센서(141)는 다양한 종류가 적용될 수 있다. 예를 들면, 지문센서(141)는 정전용량식, 광학식, 초음파 방식, 열감지 방식, 비접촉 방식 등이 적용될 수 있다. 이하에서는 설명의 편의상, 지문센서(141)를 정전용량식으로 설명한다.The fingerprint sensor 141 according to the present invention may be applied in various kinds. For example, the fingerprint sensor 141 may be capacitive, optical, ultrasonic, thermal, non-contact, or the like. Hereinafter, for convenience of description, the fingerprint sensor 141 will be described in a capacitive manner.
지문센서(141)는 지문을 감지하는 센싱부(142)를 가질 수 있다. 센싱부(142)는 다양한 형태로 이루어질 수 있으며, 예를 들면, 센싱부(142)는 어레이(Array) 형태로 배치되어 센싱 영역을 가지는 센싱 픽셀로 이루어질 수 있다. 또한, 센싱부(142)는 라인 타입의 복수의 구동전극 및 수신전극으로 이루어질 수도 있다. 또한, 센싱부(142)는 이미지 수신부가 복수인 AREA 타입으로 이루어질 수도 있다.The fingerprint sensor 141 may have a sensing unit 142 that detects a fingerprint. The sensing unit 142 may be formed in various forms. For example, the sensing unit 142 may be arranged in an array form and include sensing pixels having a sensing area. In addition, the sensing unit 142 may include a plurality of line type driving electrodes and receiving electrodes. In addition, the sensing unit 142 may be formed of an AREA type having a plurality of image receiving units.
그리고, 센싱부(142)는 사용자의 손가락의 지문의 산과 골의 형상에 따른 높이 차에 의한 정전용량의 차이를 찾을 수 있으며, 지문의 이미지를 스캐닝(Scanning)하여 지문 이미지를 만들어 낼 수 있다. 센싱부(142)는 사용자의 손가락이 접촉되었을 때뿐만 아니라, 사용자의 손가락이 접촉된 상태로 이동 시에도 지문의 이미지를 스캐닝하여 지문 이미지를 만들어 낼 수 있다. In addition, the sensing unit 142 may find a difference in capacitance due to a height difference according to the shape of the peak and the valley of the fingerprint of the user's finger, and may generate a fingerprint image by scanning the image of the fingerprint. The sensing unit 142 may generate a fingerprint image by scanning an image of the fingerprint not only when the user's finger is in contact but also when the user's finger is moved.
또한, 센싱부(142)는 지문을 감지하는 지문 감지 기능과 포인터 조작 기능을 가질 수 있으며, 이를 통해, 지문센서(141)는 바이오매트릭 트랙패드(BTP)로 구현될 수도 있다.In addition, the sensing unit 142 may have a fingerprint detection function and a pointer manipulation function for detecting a fingerprint. Through this, the fingerprint sensor 141 may be implemented as a biometric trackpad (BTP).
더하여, 센싱부(142)는 사용자의 손가락의 위치 추적 기능을 가질 수 있다. 즉, 센싱부(142)는 사용자의 손가락의 접근 여부나 그 움직임에 따른 입력정보나 정전기를 감지할 수 있으며, 그 움직임을 기초로 커서와 같은 포인터를 움직이는 포인터 조작 기능을 가질 수 있다.In addition, the sensing unit 142 may have a location tracking function of a user's finger. That is, the sensing unit 142 may sense input information or static electricity according to whether a user's finger approaches or a movement thereof, and may have a pointer manipulation function of moving a pointer such as a cursor based on the movement.
또한, 지문센서(141)는 기판(145)과 전기적으로 연결될 수 있다. 지문센서(141)와 기판(145)의 전기적 연결은 다양한 방법으로 이루어질 수 있는데, 예를 들면, 표면실장기술(SMT; Surface Mount Technology) 등의 방식에 의해 연결될 수 있다. In addition, the fingerprint sensor 141 may be electrically connected to the substrate 145. Electrical connection between the fingerprint sensor 141 and the substrate 145 may be made in various ways. For example, the fingerprint sensor 141 may be connected by a surface mount technology (SMT).
또한, 지문센서(141)는 COB(Chip On Board), QFP(Quad Flat Package), BGA(Ball Grid Array), WLP(Wafer Level Package), 실리콘 관통 전극(TSV: Through Silicon Via) 등의 다양한 패키징 방법을 통해 형성될 수 있다. In addition, the fingerprint sensor 141 may be variously packaged such as a chip on board (COB), a quad flat package (QFP), a ball grid array (BGA), a wafer level package (WLP), a through silicon via (TSV), or the like. It can be formed through the method.
기판(145)은 지문센서(141)가 실장되는 실장부(146)와 실장부(146)로부터 연장되는 연장부(147)를 가질 수 있다. 기판(145)은 FPCB(Flexible Printed Circuit Board)일 수 있으며, 연장부(147)는 전자기기(200)의 메인 기판(220, 도 9 참조)에 구비되는 커넥터(230, 도 9 참조)와 연결될 수 있다.The substrate 145 may have a mounting portion 146 on which the fingerprint sensor 141 is mounted and an extension portion 147 extending from the mounting portion 146. The substrate 145 may be a flexible printed circuit board (FPCB), and the extension 147 may be connected to a connector 230 (see FIG. 9) provided on the main board 220 (see FIG. 9) of the electronic device 200. Can be.
그리고, 커버윈도우(110)는 전자기기(200)의 내측을 향하는 하면(114)에 형성되는 안착부(115)를 가질 수 있다. 본 실시예에서 안착부(115)는 베젤 영역(112)에 형성될 수 있다.The cover window 110 may have a seating portion 115 formed on the bottom surface 114 facing the inside of the electronic device 200. In the present embodiment, the seating part 115 may be formed in the bezel area 112.
또한, 안착부(115)는 커버윈도우(110)의 하면(114)의 표면 상에 형성되거나, 커버윈도우(110)에 홈의 형태로 형성될 수 있다.In addition, the mounting portion 115 may be formed on the surface of the lower surface 114 of the cover window 110, or may be formed in the form of a groove in the cover window (110).
안착부(115)가 홈의 형태로 형성되는 경우, 안착부(115)는 지문센서(141)의 형상에 대응되도록 형성될 수 있다. 이하에서는 설명의 편의상, 안착부(115)가 홈의 형태로 이루어지는 경우로 하여 설명한다.When the seating portion 115 is formed in the shape of a groove, the seating portion 115 may be formed to correspond to the shape of the fingerprint sensor 141. Hereinafter, for convenience of explanation, it will be described as a case where the mounting portion 115 is formed in the form of a groove.
안착부(115)가 홈 형태로 형성되는 경우, 안착부(115)는 에칭 또는 절삭 가공의 방법 등으로 형성될 수 있으며, 이러한 방법은 커버윈도우(110)의 재질에 따라 적절히 선택될 수 있다. 예를 들어, 커버윈도우(110)가 유리 재질로 이루어지는 경우, 안착부(115)는 에칭 또는 컴퓨터 수치제어(CNC; Computer Numerical Control)가공 방법에 의해 형성될 수 있다. 에칭 방법으로는 건식 에칭(Dry Etching) 또는 습식 에칭(Wet Etching)이 각각 사용되거나, 또는 건식 에칭과 습식 에칭이 번갈아 이루어지는 방법이 사용될 수 있다. 또한, 커버윈도우(110)가 플라스틱 등과 같은 합성 수지로 이루어지는 경우에는 안착부(115)는 커버윈도우의 성형 시에 같이 성형될 수도 있다.When the seating portion 115 is formed in a groove shape, the seating portion 115 may be formed by a method of etching or cutting, and such a method may be appropriately selected according to the material of the cover window 110. For example, when the cover window 110 is made of a glass material, the seating portion 115 may be formed by an etching or computer numerical control (CNC) machining method. As the etching method, dry etching or wet etching may be used, or a method in which dry etching and wet etching are alternated may be used. In addition, when the cover window 110 is made of a synthetic resin such as plastic, the seating portion 115 may be molded together when the cover window is molded.
안착부(115)에는 지문센서 모듈(140)이 결합될 수 있으며, 지문센서 모듈(140)이 안착부(115)에 견고하게 결합되도록 안착부(115)에는 접착부(170)가 마련될 수 있다.The fingerprint sensor module 140 may be coupled to the seating unit 115, and an adhesive unit 170 may be provided at the seating unit 115 so that the fingerprint sensor module 140 may be firmly coupled to the seating unit 115. .
여기서, 안착부(115)의 표면에는 색상층(180)이 마련될 수 있다. 색상층(180)은 커버윈도우(110)의 베젤 영역(112)에 마련되는 인쇄층(113)과 함께 커버윈도우(110)의 상면(116)으로 색상을 표현할 수 있다. Here, the color layer 180 may be provided on the surface of the seating portion 115. The color layer 180 may express colors with the upper surface 116 of the cover window 110 together with the print layer 113 provided in the bezel area 112 of the cover window 110.
색상층(180)은 안착부(115)의 바닥면(117)에만 마련되거나, 안착부(115)의 측면(118)에까지 더 마련될 수 있다. 또한, 색상층(180)은 인쇄층(113)과 동일하거나 다른 색상을 가질 수 있다.The color layer 180 may be provided only on the bottom surface 117 of the mounting portion 115, or may be further provided on the side surface 118 of the mounting portion 115. In addition, the color layer 180 may have the same color as or different from that of the printed layer 113.
접착부(170)는 색상층(180) 상에 마련될 수 있다. 즉, 안착부(115)에는 색상층(180)이 먼저 마련되고, 색상층(180) 상에 접착부(170)가 마련될 수 있다.The adhesive part 170 may be provided on the color layer 180. That is, the color layer 180 may be first provided on the seating part 115, and the adhesive part 170 may be provided on the color layer 180.
접착부(170)는 필름 형태, 액체 형태, 파우더 형태 등 다양한 형태로 이루어질 수 있다. 접착부(170)는 지문센서의 종류에 따라 적절하게 선택될 수 있는데, 예를 들어, 지문센서(141)가 정전용량식인 경우, 접착부(170)는 유전율 및 접착력은 높고, 점도는 낮은 것이 바람직하며, 지문센서(141)가 초음파 방식인 경우, 음파에 영향을 미치지 않도록 비도전성인 것이 바람직하다.The adhesive unit 170 may be formed in various forms such as a film form, a liquid form, and a powder form. The adhesive part 170 may be appropriately selected according to the type of the fingerprint sensor. For example, when the fingerprint sensor 141 is capacitive, the adhesive part 170 may have a high dielectric constant and high adhesive force and a low viscosity. When the fingerprint sensor 141 is an ultrasonic method, it is preferable that the fingerprint sensor 141 is non-conductive so as not to affect sound waves.
접착부(170)는 안착부(115)의 바닥면(117) 및 측면(118)에 전체적으로 마련되거나, 또는 지문센서(141)의 위치 고정을 위해 안착부(115)의 바닥면(117)에 먼저 마련되고, 이후 안착부(115)에 안착된 지문센서(141)를 몰딩, 고정하기 위해 안착부(115)의 측면(118), 즉, 지문센서(141)의 외측면과 안착부(115)의 측면(118) 사이 공간에 추가로 채워지는 등의 방식이 사용될 수 있다.The adhesive part 170 is provided on the bottom surface 117 and the side surface 118 of the seating portion 115 as a whole, or first to the bottom surface 117 of the seating portion 115 to fix the position of the fingerprint sensor 141. The side surface 118 of the seating portion 115, that is, the outer surface and the seating portion 115 of the seating portion 115, is provided to mold and fix the fingerprint sensor 141 seated on the seating portion 115. May be used, such as being further filled in the space between the sides 118 of.
안착부(115) 내에는 센싱부(142) 및 지문센서(141)의 적어도 일부가 위치될 수 있다.At least a portion of the sensing unit 142 and the fingerprint sensor 141 may be located in the seating unit 115.
커버윈도우(110)의 상면(116)과 센싱부(142)의 상면 사이의 커버윈도우(110)의 두께(D1)는 200~300um일 수 있다. 상기 두께(D1)는 커버윈도우(110)의 강도와 지문센서(141)의 센싱 감도를 고려하여 도출된 것으로, 두께(D1)가 200um 미만이 되면 커버윈도우(110)가 충분한 강도를 제공하지 못할 수 있으며, 300um를 초과하면 센싱부(142)의 센싱 감도가 저하될 수 있다.The thickness D1 of the cover window 110 between the upper surface 116 of the cover window 110 and the upper surface of the sensing unit 142 may be 200 to 300 um. The thickness D1 is derived in consideration of the strength of the cover window 110 and the sensing sensitivity of the fingerprint sensor 141. When the thickness D1 is less than 200 μm, the cover window 110 may not provide sufficient strength. If it exceeds 300um, the sensing sensitivity of the sensing unit 142 may be reduced.
도 8은 본 발명의 제1실시예에 따른 전자기기 커버윈도우 일체형 지문센서 모듈 조립체에서 지문센서 모듈과 안착부의 결합예를 나타낸 단면예시도이다.8 is a cross-sectional view illustrating a coupling example of a fingerprint sensor module and a seating unit in the electronic device cover window integrated fingerprint sensor module assembly according to the first embodiment of the present invention.
도 8의 (a)를 참조하면, 안착부(115)는 지문센서(141)의 형상에 대응되도록 형성될 수 있으며, 안착부(115)에는 지문센서(141)가 안착되어 고정될 수 있다. 즉, 안착부(115)에는 센싱부(142) 및 지문센서(141)가 모두 안착될 수 있다. 그리고, 기판(145)의 실장부(146) 및 연장부(147)는 안착부(115)의 외측에 마련될 수 있다.Referring to FIG. 8A, the seating part 115 may be formed to correspond to the shape of the fingerprint sensor 141, and the fingerprint sensor 141 may be seated and fixed to the seating part 115. That is, both the sensing unit 142 and the fingerprint sensor 141 may be mounted on the mounting unit 115. The mounting part 146 and the extension part 147 of the substrate 145 may be provided outside the seating part 115.
한편, 도 8의 (b)를 참조하면, 안착부(115a) 내에는 기판(145)의 적어도 일부가 더 위치될 수 있다. 여기서, 안착부(115a) 내에 위치되는 기판(145)의 일부는 실장부(146)일 수 있다. 즉, 안착부(115a) 내에는 센싱부(142)를 포함하는 지문센서(141)와, 기판(145)의 실장부(146)가 함께 안착될 수 있다.Meanwhile, referring to FIG. 8B, at least a portion of the substrate 145 may be further positioned in the seating portion 115a. Here, a part of the substrate 145 positioned in the seating portion 115a may be a mounting portion 146. That is, the fingerprint sensor 141 including the sensing unit 142 and the mounting unit 146 of the substrate 145 may be mounted together in the mounting unit 115a.
그리고, 도 8의 (c)를 참조하면, 기판(145b)의 실장부(146b)는 지문센서(141)보다 넓은 면적으로 형성될 수 있다. 따라서, 지문센서(141)가 안착부(115)에 모두 안착되었을 때, 실장부(146b)의 일부(149)는 지문센서(141)의 외측으로 연장 형성될 수 있다. 이때, 지문센서(141)의 외측으로 연장되는 실장부(146b)의 길이(L)는 특정하게 한정되지는 않는다.8C, the mounting portion 146b of the substrate 145b may have a larger area than the fingerprint sensor 141. Therefore, when the fingerprint sensor 141 is all seated on the seating portion 115, a part 149 of the mounting portion 146b may extend to the outside of the fingerprint sensor 141. At this time, the length L of the mounting portion 146b extending to the outside of the fingerprint sensor 141 is not particularly limited.
또한, 도 8의 (d)를 참조하면, 안착부(115c)에는 센싱부(142) 및 지문센서(141)의 상부가 위치될 수 있다. 즉, 본 실시예에 따르면, 안착부(115c)에는 센싱부(142) 및 지문센서(141)의 적어도 일부가 위치될 수 있다.In addition, referring to FIG. 8 (d), the sensing unit 142 and the upper portion of the fingerprint sensor 141 may be positioned in the seating part 115c. That is, according to the present embodiment, at least a portion of the sensing unit 142 and the fingerprint sensor 141 may be located in the seating unit 115c.
이처럼, 본 발명에 따르면, 지문센서(141)가 커버윈도우(110)의 하면(114)에 형성되는 안착부(115)에 결합되기 때문에, 커버윈도우(110)의 상면(116)이 연속적으로 이루어질 수 있어 외관상 심플하고 디자인적으로 심미감을 높일 수 있다. 또한, 본 발명에 따르면, 커버윈도우(110)가 종래의 커버윈도우와 같은 버튼 홀이 없어 연속적인 표면을 가지기 때문에, 외부의 습기 또는 공기 중의 수분이 침투가 구조적으로 차단될 수 있으며, 이를 통해 방수성도 개선될 수 있다.As such, according to the present invention, since the fingerprint sensor 141 is coupled to the seating portion 115 formed on the lower surface 114 of the cover window 110, the upper surface 116 of the cover window 110 is continuously formed. It is simple in appearance and can enhance aesthetics in design. In addition, according to the present invention, since the cover window 110 has a continuous surface without a buttonhole like a conventional cover window, the moisture or air in the outside may be structurally blocked from penetration, thereby waterproofing Can also be improved.
도 9 및 도 10은 본 발명의 제1실시예에 따른 전자기기 커버윈도우 일체형 지문센서 모듈 조립체의 설치예를 나타낸 단면예시도이다. 9 and 10 are cross-sectional view illustrating an installation example of an electronic device cover window integrated fingerprint sensor module assembly according to a first embodiment of the present invention.
먼저, 도 9에서 보는 바와 같이, 지문센서(141)는 커버윈도우(110)의 안착부(115)에 안착, 고정될 수 있다. 그리고, 기판(145)의 실장부(146)는 커버윈도우(110)의 하면(114)에 밀착되도록 구비될 수 있다. 이때, 기판(145)의 두께는 충분히 얇게 형성될 수 있기 때문에, 전자기기 커버윈도우 일체형 지문센서 모듈 조립체(100)의 하측에는 디스플레이 모듈(210)이 근접하게 구비되거나 밀착되어 구비될 수 있다. 커버윈도우(110)와 디스플레이 모듈(210)은 접착제(미도시) 등에 의해 접착될 수 있다.First, as shown in FIG. 9, the fingerprint sensor 141 may be seated and fixed to the seating portion 115 of the cover window 110. The mounting portion 146 of the substrate 145 may be provided to be in close contact with the bottom surface 114 of the cover window 110. In this case, since the thickness of the substrate 145 may be sufficiently thin, the display module 210 may be provided in close proximity or in close contact with the lower side of the electronic device cover window integrated fingerprint sensor module assembly 100. The cover window 110 and the display module 210 may be adhered by an adhesive (not shown).
여기서, 디스플레이 모듈(210)은 터치스크린 패널(미도시)을 포함할 수 있으며, 디스플레이 모듈(210)의 하측에는 전자기기의 메인 기판(220)이 구비될 수 있다. 그리고, 메인 기판(220)에는 커넥터(230)가 마련될 수 있다. Here, the display module 210 may include a touch screen panel (not shown), and the main substrate 220 of the electronic device may be provided below the display module 210. In addition, the connector 230 may be provided on the main board 220.
본 발명의 실시예에 따른 전자기기 커버윈도우 일체형 지문센서 모듈 조립체에서는 안착부(115)에 지문센서(141)가 결합된 상태에서 기판(145)의 연장부(147)가 디스플레이 모듈(210)의 외측으로 연장되어 메인 기판(220)의 커넥터(230)에 연결될 수 있다. 이러한 연결 방식은 터치스크린 패널이 디스플레이 모듈(210)의 내측에 마련되거나, 디스플레이 모듈(210)의 상측에 마련되는 구조 등에 모두 적용이 가능할 수 있다. In the electronic device cover window integrated fingerprint sensor module assembly according to an embodiment of the present invention, the extension 147 of the substrate 145 is connected to the display module 210 while the fingerprint sensor 141 is coupled to the seating portion 115. It may extend outward and be connected to the connector 230 of the main board 220. The connection method may be applied to a structure in which the touch screen panel is provided inside the display module 210 or provided on the upper side of the display module 210.
그리고, 도 10에서 보는 바와 같이, 안착부(115d)의 외측으로 지문센서(141)의 일부가 돌출될 수 있으며, 이 경우에 디스플레이 모듈(210d)은 지문센서(141)의 하부에까지는 위치되지 않도록 구비될 수 있다. 예를 들면, 디스플레이 모듈(210d)의 길이는 도 9에서 설명한 디스플레이 모듈(210)의 길이보다 짧게 형성되도록 할 수 있으며, 이를 통해, 디스플레이 모듈(210d)과 지문센서(141) 사이에 겹침이 발생하지 않을 수 있다.As shown in FIG. 10, a portion of the fingerprint sensor 141 may protrude to the outside of the seating portion 115d, and in this case, the display module 210d may not be positioned below the fingerprint sensor 141. It may be provided to avoid. For example, the length of the display module 210d may be shorter than the length of the display module 210 described with reference to FIG. 9, whereby an overlap occurs between the display module 210d and the fingerprint sensor 141. You can't.
도 11은 본 발명의 제1실시예에 따른 전자기기 커버윈도우 일체형 지문센서 모듈 조립체를 가지는 전자기기의 일부를 확대하여 나타낸 평면예시도이고, 도 12는 도 11의 C-C선에 따르는 발광부의 설치예를 나타낸 단면예시도이다.FIG. 11 is an enlarged plan view showing a part of an electronic device having an electronic device cover window-integrated fingerprint sensor module assembly according to a first embodiment of the present invention, and FIG. A cross-sectional view showing the.
도 11 및 도 12에서 보는 바와 같이, 커버윈도우(110)의 하면(114)에는 안착부(115)의 테두리를 따라 미리 정해진 폭의 개방 영역(119)이 형성될 수 있다. 여기서, 개방 영역(119)은 커버윈도우(110)의 하면(114)에 마련되는 인쇄층(113)이 안착부(115)의 테두리를 따라 마련되지 않은 표면일 수 있다. As shown in FIGS. 11 and 12, an open area 119 having a predetermined width may be formed on the bottom surface 114 of the cover window 110 along the edge of the seating portion 115. Here, the open area 119 may be a surface on which the print layer 113 provided on the bottom surface 114 of the cover window 110 is not provided along the edge of the seating portion 115.
그리고, 커버윈도우(110)의 하측에는 발광부(250)가 구비될 수 있다.In addition, the light emission part 250 may be provided below the cover window 110.
도 12의 (a)를 참조하면, 발광부(250)는 전자기기(200)의 메인 기판(220)에 하나 이상이 구비될 수 있으며, 발광부(250)는 지문센서(141)의 주변에 위치되도록 메인 기판(220)에 실장될 수 있다. 발광부(250)는 LED(Light Emitting Diode)를 광원으로 사용할 수 있으며, 다양한 색상의 광을 조사하기 위해, 복수의 광원, 예를 들면, White LED, Red LED 및 Green LED 등을 포함할 수 있다.Referring to FIG. 12A, at least one light emitting unit 250 may be provided on the main substrate 220 of the electronic device 200, and the light emitting unit 250 may be disposed around the fingerprint sensor 141. It may be mounted on the main substrate 220 to be positioned. The light emitting unit 250 may use a light emitting diode (LED) as a light source, and may include a plurality of light sources, for example, a white LED, a red LED, and a green LED, for irradiating light of various colors. .
발광부(250)는 광을 상측 방향으로 조사하는 상면지향성을 가지는 광원 또는 광을 측면 방향으로 조사하는 측면지향성을 가지는 광원이 적절히 사용될 수 있다. The light emitting unit 250 may be a light source having an upper surface directivity for irradiating light in an upward direction or a light source having a side orientation for irradiating light in a lateral direction.
발광부(250)에서 발광되는 광은 개방 영역(119)을 통해 커버윈도우(110)의 상면(116)으로 발광될 수 있다. 개방 영역(119)을 통과하여 커버윈도우(110)의 상면(116)으로 발광되는 광은 개방 영역(119)의 형상을 표현할 수 있는데, 이러한 형상은 지문센서(141)의 위치를 알리는 인디케이터(Indicator) 기능을 할 수 있다. Light emitted from the light emitter 250 may be emitted to the upper surface 116 of the cover window 110 through the open area 119. The light emitted through the open area 119 to the upper surface 116 of the cover window 110 may express the shape of the open area 119, which is an indicator indicating the position of the fingerprint sensor 141. ) Function.
즉, 본 발명에서는 지문센서(141)의 상측이 커버윈도우(110)에 의해 덮이기 때문에, 사용자가 지문센서(141)의 위치를 인식하기가 어려울 수 있다. 개방 영역(119)을 통해 발광되는 광은 지문센서(141)의 위치를 알려줄 수 있으며, 특히, 야간에 지문센서(141)의 위치를 효과적으로 알려줄 수 있다.That is, in the present invention, since the upper side of the fingerprint sensor 141 is covered by the cover window 110, it may be difficult for the user to recognize the position of the fingerprint sensor 141. The light emitted through the open area 119 may indicate the position of the fingerprint sensor 141, and in particular, may effectively inform the position of the fingerprint sensor 141 at night.
도 11에는 개방 영역(119)이 트랙(Track) 형상인 것으로 도시되었으나, 이는 예시를 위한 것이며, 개방 영역(119)은 안착부(115)의 테두리를 따라서 형성되는 경우에 한정되지 않고, 다양한 형상으로 형성이 가능하다.Although the open area 119 is shown as a track shape in FIG. 11, this is for illustrative purposes, and the open area 119 is not limited to the case formed along the edge of the seating part 115, and various shapes are provided. It is possible to form.
또한, 발광부(250)는 광원의 조합으로 다양한 색상의 광을 발광할 수 있으며, 기능에 따라 각기 다른 색상의 광을 발광하여 사용자가 광의 색상으로 해당 기능, 상태 등을 인지하도록 할 수도 있다. In addition, the light emitter 250 may emit light of various colors by combining light sources, and may emit light of different colors according to a function so that a user may recognize a corresponding function, state, etc. by the color of light.
더하여, 개방 영역(119)은 도 13 내지 도 15를 참조하여 후술할 다양한 패턴과 복합적으로 사용될 수 있다.In addition, the open area 119 may be used in combination with various patterns to be described later with reference to FIGS. 13 to 15.
한편, 도 12의 (b)를 참조하면, 발광부(250)는 기판(145e)에 하나 이상이 구비될 수 있다. 발광부(250)는 기판(145e)의 실장부(146e)에 마련될 수 있으며, 이를 위해, 실장부(146e)는 지문센서(141)의 외측으로 연장 형성될 수 있다. Meanwhile, referring to FIG. 12B, at least one light emitting unit 250 may be provided on the substrate 145e. The light emitting unit 250 may be provided in the mounting unit 146e of the substrate 145e. For this purpose, the mounting unit 146e may extend to the outside of the fingerprint sensor 141.
더하여, 기판(145e) 및 메인 기판(220) 중 하나 이상에는 진동부(미도시)가 더 구비될 수 있으며, 상기 진동부는 발광부(250)와 함께 연동하여 특정 진동을 발생하여 사용자로 하여금 해당 기능, 상태 등을 인지하도록 할 수 있다.In addition, one or more of the substrate 145e and the main substrate 220 may be further provided with a vibrator (not shown), and the vibrator generates a specific vibration in conjunction with the light emitting unit 250 to allow a user to It can make you aware of the function, status, etc.
도 13 내지 도 15는 본 발명의 제1실시예에 따른 전자기기 커버윈도우 일체형 지문센서 모듈 조립체에서 지문센서의 상측에 해당되는 커버윈도우의 표면의 형성 예를 나타낸 예시도이다. 13 to 15 are exemplary views showing the formation of the surface of the cover window corresponding to the upper side of the fingerprint sensor in the electronic device cover window integrated fingerprint sensor module assembly according to the first embodiment of the present invention.
도 13 내지 도 15에서 보는 바와 같이, 사용자에게 노출되는 커버윈도우(110)의 상면(116) 중 지문센서(141)의 상측에 해당되는 영역에는 음각 또는 양각의 패턴이 더 형성될 수 있다. As shown in FIGS. 13 to 15, an intaglio or embossed pattern may be further formed in an area corresponding to the upper side of the fingerprint sensor 141 of the upper surface 116 of the cover window 110 exposed to the user.
먼저, 도 13의 (a)는 커버윈도우의 평면도를 나타낸 것이고, (b)는 D-D선에 따른 단면예시도이다. 도 13을 참조하면, 커버윈도우(110)의 상면(116) 중 지문센서(141)의 상측에 해당되는 영역에는 음각의 패턴(120)이 형성될 수 있다. 음각의 패턴(120)은 기하학적인 형상 등을 가질 수 있다. First, FIG. 13A shows a plan view of a cover window, and FIG. 13B is a cross-sectional view taken along the line D-D. Referring to FIG. 13, an intaglio pattern 120 may be formed in an area corresponding to the upper side of the fingerprint sensor 141 of the upper surface 116 of the cover window 110. The intaglio pattern 120 may have a geometric shape or the like.
또한, 도 14의 (a)는 커버윈도우의 평면도를 나타낸 것이고, (b)는 E-E선에 따른 단면예시도이다. 도 14를 참조하면, 음각의 패턴(121)은 홈 형상으로 형성될 수도 있다. 14A is a plan view of the cover window, and FIG. 14B is a cross-sectional view taken along the line E-E. Referring to FIG. 14, the intaglio pattern 121 may be formed in a groove shape.
그리고, 도 15의 (a)는 커버윈도우의 평면도를 나타낸 것이고, (b)는 F-F선에 따른 단면예시도이다. 도 15를 참조하면, 커버윈도우(110)의 상면(116) 중 지문센서(141)의 상측에 해당되는 영역에는 양각의 패턴(122)이 형성될 수 있다. 여기서, 양각의 패턴(122)은 지문센싱 영역을 회피하여 형성될 수 있다. 도 15에는 양각의 패턴(122)으로 지문센서(141)의 테두리를 따라 돌출 형성되는 링 형상이 도시되고 있으나 이는 예시적인 것으로 반드시 이러한 형상에 한정되는 것은 아니다.15A is a plan view of the cover window, and FIG. 15B is a cross-sectional view taken along the F-F line. Referring to FIG. 15, an embossed pattern 122 may be formed in an area corresponding to an upper side of the fingerprint sensor 141 of the upper surface 116 of the cover window 110. Here, the embossed pattern 122 may be formed to avoid the fingerprint sensing area. 15 illustrates a ring shape protruding along the edge of the fingerprint sensor 141 by the embossed pattern 122, but the exemplary embodiment is not limited thereto.
한편, 양각의 패턴(122)은 평상시에는 돌출되지 않은 상태에서 특정한 상태, 예를 들면, 사용자의 손가락이 터치되었을 때, 돌출되도록 이루어질 수 있다. 이를 위해, 양각의 패턴(122)은 커버윈도우(110)의 상면에 별도로 마련되는 구성품에 의해 구현될 수 있으며, 상기 구성품은 양각의 패턴(122)을 이루도록 형상이 변형될 수 있는 폴리머 소재의 구성을 포함할 수 있다.On the other hand, the embossed pattern 122 may be made to protrude when a particular state, for example, the user's finger is touched in a state that does not normally protrude. To this end, the embossed pattern 122 may be implemented by a component provided separately on the upper surface of the cover window 110, the component is composed of a polymer material that can be modified in shape to form the embossed pattern 122 It may include.
도 16은 본 발명의 제2실시예에 따른 전자기기 커버윈도우 일체형 지문센서 모듈 조립체 및 전자기기에 대한 설치예를 나타낸 단면예시도이다. 본 실시예서는 커버윈도우의 구성이 다를 수 있으며, 다른 구성은 전술한 제1실시예와 동일하므로 설명은 생략한다.16 is a cross-sectional view illustrating an installation example of an electronic device cover window integrated fingerprint sensor module assembly and an electronic device according to a second embodiment of the present invention. In this embodiment, the configuration of the cover window may be different, and the other configuration is the same as the first embodiment described above, so description thereof will be omitted.
도 16에서 보는 바와 같이, 커버윈도우(310)는 제1커버윈도우(320), 접착층(330) 및 제2커버윈도우(340)를 포함할 수 있다.As shown in FIG. 16, the cover window 310 may include a first cover window 320, an adhesive layer 330, and a second cover window 340.
제1커버윈도우(320)의 상면(321)은 사용자에게 노출되는 면일 수 있으며, 접착층(330)은 제1커버윈도우(320)의 하면에 마련될 수 있다.The top surface 321 of the first cover window 320 may be a surface exposed to the user, and the adhesive layer 330 may be provided on the bottom surface of the first cover window 320.
접착층(330)은 도포되거나 필름 형태로 이루어져 부착될 수 있는데, 예를 들면, 광학투명레진(OCR; Optically Clear Resin) 또는 광학투명점착제(OCA; Optically Clear Adhesive)가 사용될 수 있다.The adhesive layer 330 may be applied or formed in the form of a film. For example, an optically clear resin (OCR) or an optically clear adhesive (OCA) may be used.
제2커버윈도우(340)는 상면이 접착층(330)에 부착되어 제1커버윈도우(320)의 하면과 접합될 수 있으며, 제2커버윈도우(340)와 제1커버윈도우(320)는 동일한 소재로 이루어질 수 있다. The upper surface of the second cover window 340 may be attached to the adhesive layer 330 to be bonded to the lower surface of the first cover window 320, and the second cover window 340 and the first cover window 320 may be formed of the same material. It may be made of.
안착부(341)는 제2커버윈도우(340)에 형성될 수 있으며, 이때, 안착부(341)는 제2커버윈도우(340)를 관통하여 형성될 수 있다.The seating part 341 may be formed in the second cover window 340. In this case, the seating part 341 may be formed through the second cover window 340.
그리고, 색상층(350)은 제1커버윈도우(320)의 하면 중 지문센서(141)의 상부에 대응되는 곳에 마련될 수 있으며, 제2커버윈도우(340)의 안착부(341)의 측면에도 더 마련될 수 있다.In addition, the color layer 350 may be provided at a position corresponding to the upper portion of the fingerprint sensor 141 of the lower surface of the first cover window 320, and may also be provided on the side of the seating portion 341 of the second cover window 340. It can be arranged further.
또한, 접착부(370)는 제2커버윈도우(340)의 안착부(341)의 측면과 지문센서(141)의 측면 사이에 더 마련될 수 있다. In addition, the adhesive part 370 may be further provided between the side surface of the seating portion 341 of the second cover window 340 and the side surface of the fingerprint sensor 141.
제2커버윈도우(340)의 두께는 지문센서(141)의 두께에 대응될 수 있으며, 이 경우, 안착부(341)는 제2커버윈도우(340)를 관통하여 형성되도록 하면 되기 때문에, 안착부(341)의 깊이를 맞추기 위한 공정이 생략될 수 있는 이점이 있다.The thickness of the second cover window 340 may correspond to the thickness of the fingerprint sensor 141. In this case, the seating portion 341 may be formed to penetrate the second cover window 340. There is an advantage that the process for matching the depth of 341 can be omitted.
안착부(341)에 결합된 지문센서(141)가 실장되는 기판(345)의 연장부(347)는 디스플레이 모듈(210)의 외측으로 연장되어 메인 기판(220)의 커넥터(230)에 연결될 수 있으며, 이러한 연결 방식은 터치스크린 패널(미도시)이 디스플레이 모듈(210)의 내측에 마련되거나, 디스플레이 모듈(210)의 상측에 마련되는 구조 등에 모두 적용이 가능할 수 있다.The extension part 347 of the substrate 345 on which the fingerprint sensor 141 coupled to the seating part 341 may be extended may be extended to the outside of the display module 210 to be connected to the connector 230 of the main board 220. The connection method may be applied to a structure in which a touch screen panel (not shown) is provided inside the display module 210 or provided on the upper side of the display module 210.
도 17은 본 발명의 제3실시예에 따른 전자기기 커버윈도우 일체형 지문센서 모듈 조립체의 커버윈도우를 나타낸 평면예시도이다. 17 is a plan view showing a cover window of the electronic device cover window integrated fingerprint sensor module assembly according to a third embodiment of the present invention.
도 17에서 보는 바와 같이, 본 실시예에 따른 커버윈도우(510)는 커버윈도우(510)와 독립적으로 구비되는 비표시부(550)를 더 포함할 수 있다. 그리고, 안착부(551)는 비표시부(550)에 형성될 수 있다. As shown in FIG. 17, the cover window 510 according to the present exemplary embodiment may further include a non-display unit 550 provided independently of the cover window 510. In addition, the mounting portion 551 may be formed in the non-display portion 550.
본 실시예에서, 비표시부(550)는 플라스틱 등과 같은 합성 수지나 금속 재질로 이루어질 수 있다. In the present embodiment, the non-display portion 550 may be made of a synthetic resin or metal material such as plastic.
그리고, 안착부(551)는 비표시부(550)를 형성한 후에 가공을 통해 형성되거나, 비표시부(550)의 성형 시에 같이 형성될 수 있다. The seating portion 551 may be formed through processing after the non-display portion 550 is formed, or may be formed together when the non-display portion 550 is formed.
본 실시예에서는 비표시부(550)를 형성하는 소재의 특성 상 비표시부(550)가 불투명하게 형성될 수 있기 때문에, 전술한 제1실시예에 사용되는 인쇄층(113, 도 7 참조)은 생략될 수 있다.In the present embodiment, since the non-display unit 550 may be opaque due to the characteristics of the material forming the non-display unit 550, the printing layer 113 (refer to FIG. 7) used in the above-described first embodiment is omitted. Can be.
도 18은 본 발명의 제4실시예에 따른 전자기기 커버윈도우 일체형 지문센서 모듈 조립체의 커버윈도우를 나타낸 평면예시도이다. 18 is a plan view showing a cover window of the electronic device cover window integrated fingerprint sensor module assembly according to a fourth embodiment of the present invention.
도 18에서 보는 바와 같이, 본 실시예에 따른 커버윈도우(610)의 베젤 영역(611)은 전술한 제1실시예에의 베젤 영역(112, 도 4참조)과 비교했을 때, 커버윈도우(610)의 하측의 베젤 영역(611)의 면적이 작게 형성될 수 있다. 즉, 동일한 크기의 커버윈도우를 기준으로 했을 때, 본 실시예에 따른 커버윈도우(610)의 표시 영역(612)은 전술한 제1실시예의 표시 영역(111, 도 4참조)보다 넓게 형성될 수 있다. As shown in FIG. 18, the bezel area 611 of the cover window 610 according to the present embodiment is compared with the bezel area 112 (see FIG. 4) of the first embodiment described above. The area of the bezel area 611 below the bottom of the panel) may be small. That is, based on the cover window of the same size, the display area 612 of the cover window 610 according to the present embodiment may be formed wider than the display area 111 (refer to FIG. 4) of the first embodiment. have.
그리고, 안착부(651)는 표시 영역(612)에 형성될 수 있다. The mounting portion 651 may be formed in the display area 612.
본 실시예에서는, 안착부(651)가 표시 영역(612)에 형성되기 때문에, 지문센서(미도시)가 표시 영역(612)에 마련될 수 있으며, 따라서, 지문센서의 양측 영역(613)에서도 영상이 표시될 수 있어 더욱 다양한 화면 연출이 가능할 수 있다.In the present embodiment, since the seating portion 651 is formed in the display area 612, a fingerprint sensor (not shown) may be provided in the display area 612, and thus, even in both areas 613 of the fingerprint sensor. As the image may be displayed, more various screens may be produced.
본 실시예는 도 9를 참조할 때, 디스플레이 모듈(210)의 영상이 지문센서(141)가 마련되는 부분을 제외한 커버윈도우(110)의 하측 부분(즉, 표시영역(612))으로 표시되는 것으로 이해할 수 있다.9, the image of the display module 210 is displayed as the lower portion of the cover window 110 (ie, the display area 612) except for the portion where the fingerprint sensor 141 is provided. I can understand that.
도 19는 본 발명의 제5실시예에 따른 전자기기 커버윈도우 일체형 지문센서 모듈 조립체를 나타낸 사시도이고, 도 20은 본 발명의 제5실시예에 따른 전자기기 커버윈도우 일체형 지문센서 모듈 조립체의 지문센서 모듈을 나타낸 사시도이고, 도 21은 도 19의 G-G선에 따른 단면예시도이고, 도 22는 본 발명의 제5실시예에 따른 전자기기 커버윈도우 일체형 지문센서 모듈 조립체를 나타낸 분해사시도이다. 본 실시예에서는 지문센서 모듈의 구성이 다를 수 있으며, 다른 구성은 전술한 제1실시예와 동일하므로 설명은 생략한다.19 is a perspective view illustrating an electronic device cover window integrated fingerprint sensor module assembly according to a fifth embodiment of the present invention, and FIG. 20 is a fingerprint sensor of an electronic device cover window integrated fingerprint sensor module assembly according to a fifth embodiment of the present invention. 21 is a perspective view showing a module, Figure 21 is a cross-sectional view taken along the line GG of Figure 19, Figure 22 is an exploded perspective view showing an electronic device cover window integrated fingerprint sensor module assembly according to a fifth embodiment of the present invention. In the present embodiment, the configuration of the fingerprint sensor module may be different, and other configurations are the same as the first embodiment described above, and thus description thereof will be omitted.
도 19 내지 도 22에서 보는 바와 같이, 본 실시예에 따른 커버윈도우 일체형 지문센서 모듈 조립체(700)의 지문센서 모듈(710)은 지문센서(711), 기판(712), 베이스(720) 및 커버(730)를 포함할 수 있다.19 to 22, the fingerprint sensor module 710 of the cover window integrated fingerprint sensor module assembly 700 according to the present embodiment includes a fingerprint sensor 711, a substrate 712, a base 720, and a cover. 730 may include.
여기서, 지문센서(711)는 제1실시예의 지문센서와 관련한 내용이 모두 적용될 수 있다.Here, the fingerprint sensor 711 may be applied to all the contents related to the fingerprint sensor of the first embodiment.
지문센서(711)는 기판(712) 상에 실장될 수 있으며, 본 실시예에서 기판(712)은 리지드(Rigid) PCB일 수 있다.The fingerprint sensor 711 may be mounted on the substrate 712, and in this embodiment, the substrate 712 may be a rigid PCB.
그리고, 베이스(720)는 홈부(721), 반사부(724) 및 관통부(725)를 포함할 수 있다.The base 720 may include a groove 721, a reflector 724, and a through part 725.
홈부(721)는 베이스(720)의 상면(722)에 함몰 형성될 수 있다. 또한, 홈부(721)의 중앙에는 지지부(723)가 형성될 수 있으며, 지문센서(711)가 실장되는 기판(712)은 지지부(723)에 의해 지지될 수 있다. 기판(712)의 안정적인 지지를 위해 지지부(723)는 한 쌍으로 마련될 수 있다.The groove 721 may be recessed in the upper surface 722 of the base 720. In addition, a support 723 may be formed at the center of the groove 721, and the substrate 712 on which the fingerprint sensor 711 is mounted may be supported by the support 723. In order to stably support the substrate 712, the support parts 723 may be provided in pairs.
기판(712)의 하면(713)에는 발광부(714)가 구비될 수 있다. 발광부(714)는 전술한 제1실시예의 발광부와 관련된 내용이 모두 적용될 수 있다.The light emitting part 714 may be provided on the bottom surface 713 of the substrate 712. The light emitting unit 714 may be applied to all of the contents related to the light emitting unit of the first embodiment.
그리고, 홈부(721)의 내면에는 반사부(724)가 마련될 수 있다. 반사부(724)는 증착, 인쇄, 스프레이 및 도금 등에 의해 마련될 수 있다. 예를 들면, 반사부(724)는 반사 기능을 갖는 용액이 코팅됨으로써 형성되거나, 반사 필름이 코팅됨으로써 형성될 수 있다. 따라서, 기판(712)의 하면(713)에 구비되는 발광부(714)에서 발광되는 광은 반사부(724)에 의해 반사될 수 있다. 더하여, 반사부(724)는 광이 전반사(全反射)되도록 할 수도 있다.In addition, a reflection part 724 may be provided on an inner surface of the groove part 721. The reflector 724 may be provided by deposition, printing, spraying and plating. For example, the reflector 724 may be formed by coating a solution having a reflective function or by coating a reflective film. Therefore, the light emitted from the light emitter 714 provided on the bottom surface 713 of the substrate 712 may be reflected by the reflector 724. In addition, the reflector 724 may allow the light to be totally reflected.
또한, 베이스(720)의 중앙에는 관통부(725)가 형성될 수 있으며, 기판(712)의 하면(713) 중앙에는 커넥터부(715)가 실장될 수 있다. 커넥터부(715)는 관통부(725)를 통해 지문센서 모듈(710)의 외측으로 노출될 수 있으며, 전자기기에 구비되는 메인 기판(미도시)과 전기적으로 연결될 수 있다.In addition, a through part 725 may be formed in the center of the base 720, and a connector part 715 may be mounted in the center of the lower surface 713 of the substrate 712. The connector 715 may be exposed to the outside of the fingerprint sensor module 710 through the through part 725, and may be electrically connected to a main substrate (not shown) provided in the electronic device.
그리고, 커버(730)는 베이스(720)의 상면을 덮고 지문센서(711)를 고정할 수 있다.The cover 730 may cover the top surface of the base 720 and fix the fingerprint sensor 711.
커버(730)에는 개방부(731)가 관통 형성될 수 있다. 지문센서(711)는 개방부(731)에 결합될 수 있으며, 센싱부(미도시)는 개방부(731)를 통해 노출될 수 있다.The opening 731 may be penetrated through the cover 730. The fingerprint sensor 711 may be coupled to the opening 731, and the sensing unit (not shown) may be exposed through the opening 731.
그리고, 커버(730)의 하면(732)에는 고정부(733)가 돌출 형성될 수 있으며, 고정부(733)의 내측으로는 기판(712)이 위치되어 고정될 수 있다.In addition, a fixing portion 733 may protrude from the lower surface 732 of the cover 730, and the substrate 712 may be positioned and fixed inside the fixing portion 733.
커버(730)는 광투과 소재로 이루어질 수 있으며, 따라서, 발광부(714)에서 발광되는 광은 커버(730)를 통해 전달될 수 있다.The cover 730 may be formed of a light transmissive material, and thus, light emitted from the light emitter 714 may be transmitted through the cover 730.
한편, 커버(730)의 상면에는 차광부(734)가 마련될 수 있으며, 차광부(734)는 광을 차단할 수 있다. 차광부(734)는 커버(730)의 상면 중 일부 영역에는 마련되지 않을 수 있다. 여기서, 상기 일부 영역은 지문센서(711)와 미리 정해진 간격만큼 이격되고 지문센서(711)의 테두리를 따라 미리 정해진 폭을 가지는 띠 형상의 개방 영역(735)일 수 있다.Meanwhile, a light blocking part 734 may be provided on an upper surface of the cover 730, and the light blocking part 734 may block light. The light blocking portion 734 may not be provided in some regions of the top surface of the cover 730. The partial region may be a band-shaped open region 735 spaced apart from the fingerprint sensor 711 by a predetermined interval and having a predetermined width along the edge of the fingerprint sensor 711.
그리고, 차광부(734)는 증착, 인쇄, 스프레이 및 도금 등에 의해 마련될 수 있다. 예를 들어, 차광부(734)는 광을 차단하는 기능을 갖는 용액이 코팅됨으로써 형성되거나, 광을 차단하는 기능을 가지는 필름이 코팅됨으로써 형성될 수 있다.The light shield 734 may be provided by deposition, printing, spraying, plating, or the like. For example, the light blocking unit 734 may be formed by coating a solution having a function of blocking light, or may be formed by coating a film having a function of blocking light.
따라서, 커버(730)를 통해 이동되는 광은 커버(730)의 상면에 마련되는 개방 영역(735)을 통해서 출사될 수 있다. 개방 영역(735)은 전술한 바와 같은 인디케이터의 기능을 할 수 있다.Therefore, the light moved through the cover 730 may be emitted through the open area 735 provided on the top surface of the cover 730. Open area 735 may function as an indicator as described above.
개방 영역(735)에는 얇은 코팅층(미도시)이 더 마련될 수 있으며, 상기 코팅층은 색상을 가질 수 있다. The open area 735 may be further provided with a thin coating layer (not shown), and the coating layer may have a color.
또한, 상기 코팅층은 커버(730)를 통해 전달되는 광이 출사될 수 있을 정도로 얇게 형성될 수 있다. 상기 색상층은 발광부(714)에서 광을 발광하지 않는 경우에도 색상을 표현할 수 있으며, 이를 통해 발광부(714)에서 광을 발광하지 않는 경우에도 인디케이터의 기능을 구현할 수 있다.In addition, the coating layer may be formed so thin that the light transmitted through the cover 730 can be emitted. The color layer may express a color even when the light emitter 714 does not emit light, thereby realizing the function of an indicator even when the light emitter 714 does not emit light.
그리고, 베이스(720)의 상면(722)과 커버(730)의 하면(732)의 사이에는 베이스(720)와 커버(730)를 접착하기 위한 접착제(740)가 마련될 수 있다. 접착제(740)의 종류 및 형태 등에는 특정한 한정이 있는 것은 아니며, 예를 들면, 양면 접착테이프가 사용될 수 있다. An adhesive 740 may be provided between the upper surface 722 of the base 720 and the lower surface 732 of the cover 730 to adhere the base 720 and the cover 730. The type and shape of the adhesive 740 are not particularly limited, and for example, a double-sided adhesive tape may be used.
또한, 지문센서 모듈(710)은 커버윈도우(750)의 안착부(751)에 결합될 수 있다. 본 실시예에서는 안착부(751)가 홈의 형태로 이루어진 경우를 예로 설명하지만, 이하의 설명은 안착부(751)가 홈의 형태가 아니라 커버윈도우(750)의 하면으로 이루어지는 경우에도 동일하게 적용될 수 있다.In addition, the fingerprint sensor module 710 may be coupled to the seating portion 751 of the cover window 750. In the present embodiment, the case in which the seating portion 751 is formed in the shape of a groove will be described as an example. Can be.
지문센서 모듈(710)과 안착부(751)의 결합을 위해, 지문센서 모듈(710) 및 안착부(751)의 사이에는 접착부(755)가 마련될 수 있다. In order to couple the fingerprint sensor module 710 and the seating portion 751, an adhesive part 755 may be provided between the fingerprint sensor module 710 and the seating portion 751.
접착부(755)는 안착부(751)에 전체적으로 마련될 수 있으며, 커버(730)의 개방 영역(735)으로부터 출사되는 광이 커버윈도우(750)로 유입될 수 있도록 광투과성을 가질 수 있다.The adhesive part 755 may be provided in the seating part 751 as a whole, and may have a light transmissive property so that light emitted from the open area 735 of the cover 730 may flow into the cover window 750.
전술한 본 발명의 설명은 예시를 위한 것이며, 본 발명이 속하는 기술분야의 통상의 지식을 가진 자는 본 발명의 기술적 사상이나 필수적인 특징을 변경하지 않고서 다른 구체적인 형태로 쉽게 변형이 가능하다는 것을 이해할 수 있을 것이다. 그러므로 이상에서 기술한 실시예들은 모든 면에서 예시적인 것이며 한정적이 아닌 것으로 이해해야만 한다. 예를 들어, 단일형으로 설명되어 있는 각 구성 요소는 분산되어 실시될 수도 있으며, 마찬가지로 분산된 것으로 설명되어 있는 구성 요소들도 결합된 형태로 실시될 수 있다.The foregoing description of the present invention is intended for illustration, and it will be understood by those skilled in the art that the present invention may be easily modified in other specific forms without changing the technical spirit or essential features of the present invention. will be. Therefore, it should be understood that the embodiments described above are exemplary in all respects and not restrictive. For example, each component described as a single type may be implemented in a distributed manner, and similarly, components described as distributed may be implemented in a combined form.
본 발명의 범위는 후술하는 특허청구범위에 의하여 나타내어지며, 특허청구범위의 의미 및 범위 그리고 그 균등 개념으로부터 도출되는 모든 변경 또는 변형된 형태가 본 발명의 범위에 포함되는 것으로 해석되어야 한다.The scope of the present invention is represented by the following claims, and it should be construed that all changes or modifications derived from the meaning and scope of the claims and their equivalents are included in the scope of the present invention.

Claims (18)

  1. 전자기기에 구비되고 디스플레이 모듈에 의한 영상이 표시되며, 상기 전자기기의 내측을 향하는 하면에 안착부가 형성되는 커버윈도우; A cover window provided on the electronic device and displaying an image by the display module, and having a seating portion formed on a lower surface of the electronic device toward the inner side;
    지문을 감지하는 센싱부를 가지는 지문센서, 상기 지문센서와 전기적으로 연결되는 기판을 포함하고, 상기 안착부에 위치되는 지문센서 모듈; 그리고 A fingerprint sensor having a sensing unit for sensing a fingerprint, a fingerprint sensor module including a substrate electrically connected to the fingerprint sensor, and located at the seating unit; And
    상기 안착부 및 상기 지문센서 모듈 사이에 마련되어 상기 지문센서 모듈을 상기 안착부에 고정시키는 접착부를 포함하는 전자기기 커버윈도우 일체형 지문센서 모듈 조립체.An electronic device cover window integrated fingerprint sensor module assembly provided between the seating part and the fingerprint sensor module, the adhesive part fixing the fingerprint sensor module to the seating part.
  2. 제1항에 있어서,The method of claim 1,
    상기 안착부는 상기 커버 윈도우의 하면의 표면 상에 마련되는 것인 전자기기 커버윈도우 일체형 지문센서 모듈 조립체.The seating portion is provided on the surface of the lower surface of the cover window electronics cover window integrated fingerprint sensor module assembly.
  3. 제1항에 있어서,The method of claim 1,
    상기 안착부는 상기 지문센서의 형상에 대응되도록 홈 형상으로 형성되고, 상기 안착부에는 상기 지문센서가 안착 고정되는 것인 전자기기 커버윈도우 일체형 지문센서 모듈 조립체.The seating portion is formed in a groove shape so as to correspond to the shape of the fingerprint sensor, the fingerprint cover module integrated electronic device cover window that the fingerprint sensor is seated and fixed.
  4. 제3항에 있어서,The method of claim 3,
    상기 안착부는 에칭 또는 절삭 가공으로 형성되는 것인 전자기기 커버윈도우 일체형 지문센서 모듈 조립체.Wherein the seating portion is formed by etching or cutting the electronic cover window integrated fingerprint sensor module assembly.
  5. 제3항에 있어서,The method of claim 3,
    상기 안착부 내에는 상기 센싱부 및 상기 지문센서의 적어도 일부가 위치되는 것인 전자기기 커버윈도우 일체형 지문센서 모듈 조립체.An electronic device cover window-integrated fingerprint sensor module assembly, wherein at least a portion of the sensing unit and the fingerprint sensor are located in the seating unit.
  6. 제5항에 있어서,The method of claim 5,
    상기 안착부 내에는 상기 기판의 적어도 일부가 더 위치되는 것인 전자기기 커버윈도우 일체형 지문센서 모듈 조립체.At least a portion of the substrate is further located in the seating portion cover window integrated fingerprint sensor module assembly.
  7. 제3항에 있어서,The method of claim 3,
    상기 커버윈도우의 상면과 상기 센싱부의 상면 사이의 상기 커버윈도우의 두께는 200~300um인 것인 전자기기 커버윈도우 일체형 지문센서 모듈 조립체.The cover window between the upper surface of the cover window and the upper surface of the sensing unit has a thickness of 200 ~ 300um electronic device cover window integrated fingerprint sensor module assembly.
  8. 제1항에 있어서,The method of claim 1,
    상기 커버윈도우는 영상이 표시되는 표시 영역과, 인쇄층이 마련되어 영상이 표시되지 않는 베젤 영역을 가지고, 상기 안착부는 상기 베젤 영역에 형성되는 것인 전자기기 커버윈도우 일체형 지문센서 모듈 조립체.The cover window has a display area in which an image is displayed and a bezel area in which a print layer is provided and the image is not displayed, and the seating portion is formed in the bezel area.
  9. 제1항에 있어서,The method of claim 1,
    사용자에게 노출되는 상기 커버윈도우의 상면 중 상기 지문센서의 상측에 해당되는 영역에는 음각 또는 양각의 패턴이 더 형성되는 것인 전자기기 커버윈도우 일체형 지문센서 모듈 조립체.An electronic device cover window integrated fingerprint sensor module assembly in which an intaglio or embossed pattern is further formed in an area corresponding to the upper side of the fingerprint sensor among the upper surfaces of the cover window exposed to the user.
  10. 제1항에 있어서,The method of claim 1,
    상기 커버윈도우의 하면에는 상기 안착부의 테두리를 따라 미리 정해진 폭의 개방 영역이 형성되고, 상기 커버윈도우의 하측에는 상기 개방 영역을 통해 상기 커버윈도우의 상면으로 발광되는 광을 제공하는 발광부가 구비되는 것인 전자기기 커버윈도우 일체형 지문센서 모듈 조립체.An open area having a predetermined width is formed on a lower surface of the cover window along an edge of the seating part, and a light emitting part is provided below the cover window to provide light emitted to an upper surface of the cover window through the open area. Electronic device cover window integrated fingerprint sensor module assembly.
  11. 제10항에 있어서,The method of claim 10,
    상기 발광부는 상기 기판 또는 상기 지문센서 모듈이 전기적으로 연결되는 메인 기판에 하나 이상이 구비되는 것인 전자기기 커버윈도우 일체형 지문센서 모듈 조립체.Wherein the light emitting unit is the electronic device cover window integrated fingerprint sensor module assembly is provided with one or more on the substrate or the main substrate to which the fingerprint sensor module is electrically connected.
  12. 제1항에 있어서,The method of claim 1,
    상기 커버윈도우는 영상이 표시되는 표시 영역과, 인쇄층이 마련되어 영상이 표시되지 않은 베젤 영역을 가지고, 상기 안착부는 상기 표시 영역에 형성되는 것인 전자기기 커버윈도우 일체형 지문센서 모듈 조립체.The cover window has a display area in which an image is displayed, and a bezel area in which a print layer is provided and the image is not displayed, and the seating portion is formed in the display area.
  13. 제1항에 있어서, The method of claim 1,
    상기 커버윈도우는 유리, 사파이어, 지르코늄 및 투명 수지 중에서 선택된 재질로 이루어지는 것인 전자기기 커버윈도우 일체형 지문센서 모듈 조립체.The cover window is an electronic device cover window integrated fingerprint sensor module assembly is made of a material selected from glass, sapphire, zirconium and transparent resin.
  14. 제1항에 있어서,The method of claim 1,
    상기 커버윈도우는 상기 커버윈도우와 독립적으로 구비되는 비표시부를 더 포함하고, 상기 안착부는 상기 비표시부에 형성되는 것인 전자기기 커버윈도우 일체형 지문센서 모듈 조립체.The cover window further comprises a non-display portion provided independently of the cover window, wherein the seating portion is formed on the non-display portion electronic cover window integrated fingerprint sensor module assembly.
  15. 제14항에 있어서,The method of claim 14,
    상기 비표시부는 수지 또는 금속 재질로 이루어지는 것인 전자기기 커버윈도우 일체형 지문센서 모듈 조립체.Wherein the non-display portion is made of a resin or metal material cover window integrated fingerprint sensor module assembly.
  16. 제1항에 있어서, The method of claim 1,
    상기 커버윈도우는 The cover window
    상면이 사용자에게 노출되는 제1커버윈도우와, A first cover window having an upper surface exposed to the user;
    상기 제1커버윈도우의 하면에 마련되는 접착층과, An adhesive layer provided on a lower surface of the first cover window;
    상기 접착층에 의해 상면이 상기 제1커버윈도우의 하면과 접합되는 제2커버윈도우를 포함하고, An upper surface of the second cover window joined to the lower surface of the first cover window by the adhesive layer;
    상기 안착부는 상기 제2커버윈도우를 관통하여 형성되는 것인 전자기기 커버윈도우 일체형 지문센서 모듈 조립체.The seating portion is formed through the second cover window electronics cover window integrated fingerprint sensor module assembly.
  17. 제16항에 있어서,The method of claim 16,
    상기 제2커버윈도우의 두께는 상기 지문센서의 높이에 대응되는 것인 전자기기 커버윈도우 일체형 지문센서 모듈 조립체.The thickness of the second cover window is an electronic device cover window integrated fingerprint sensor module assembly that corresponds to the height of the fingerprint sensor.
  18. 제1항에 있어서,The method of claim 1,
    상기 안착부의 표면에는 색상층이 마련되고, 상기 접착부는 상기 색상층 상에 채워지는 것인 전자기기 커버윈도우 일체형 지문센서 모듈 조립체.The surface of the seating portion is provided with a color layer, wherein the adhesive portion is filled with the electronic device cover window integrated fingerprint sensor module assembly.
PCT/KR2015/013626 2014-12-11 2015-12-11 Fingerprint sensor module assembly integrated with cover window for electronic device WO2016093669A1 (en)

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Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106695625A (en) * 2016-12-29 2017-05-24 深圳天珑无线科技有限公司 Assembly fixture and process of electronic equipment
WO2018026135A1 (en) * 2016-08-03 2018-02-08 Samsung Electronics Co., Ltd. Electronic device having fingerprint sensor
WO2018032940A1 (en) * 2016-08-16 2018-02-22 Guangdong Oppo Mobile Telecommunications Corp., Ltd. Fingerprint sensor, method for manufacturing fingerprint sensor, and terminal
WO2018153079A1 (en) * 2017-02-23 2018-08-30 京东方科技集团股份有限公司 Touch display structure for mobile terminal and manufacturing method therefor, and mobile terminal
CN108986673A (en) * 2017-05-31 2018-12-11 群创光电股份有限公司 Display device
CN109416746A (en) * 2016-07-01 2019-03-01 华为技术有限公司 A kind of waterproof fingerprint recognition mould group and electronic equipment
CN109427853A (en) * 2017-09-05 2019-03-05 乐金显示有限公司 Display device including fingerprint scanner
WO2019153372A1 (en) * 2018-02-06 2019-08-15 武汉华星光电半导体显示技术有限公司 Display device
CN111223897A (en) * 2018-11-27 2020-06-02 三星显示有限公司 display device
CN113495600A (en) * 2020-04-02 2021-10-12 苹果公司 Portable electronic device

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090257626A1 (en) * 2005-10-18 2009-10-15 Authentec, Inc. Thinned finger sensor and associated methods
US20120242635A1 (en) * 2009-10-30 2012-09-27 Validity Sensors, Inc., a Delaware Corporation Fingerprint sensor and integratable electronic display
KR101379235B1 (en) * 2012-10-05 2014-03-28 크루셜텍 (주) Track pad and electronic equipment having the same
WO2014081203A1 (en) * 2012-11-20 2014-05-30 크루셜텍 주식회사 Fingerprint sensor module, portable electronic device including same, and method for manufacturing same
US20140285955A1 (en) * 2013-03-22 2014-09-25 Fujitsu Limited Electronic device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090257626A1 (en) * 2005-10-18 2009-10-15 Authentec, Inc. Thinned finger sensor and associated methods
US20120242635A1 (en) * 2009-10-30 2012-09-27 Validity Sensors, Inc., a Delaware Corporation Fingerprint sensor and integratable electronic display
KR101379235B1 (en) * 2012-10-05 2014-03-28 크루셜텍 (주) Track pad and electronic equipment having the same
WO2014081203A1 (en) * 2012-11-20 2014-05-30 크루셜텍 주식회사 Fingerprint sensor module, portable electronic device including same, and method for manufacturing same
US20140285955A1 (en) * 2013-03-22 2014-09-25 Fujitsu Limited Electronic device

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109416746A (en) * 2016-07-01 2019-03-01 华为技术有限公司 A kind of waterproof fingerprint recognition mould group and electronic equipment
CN109416746B (en) * 2016-07-01 2022-04-05 华为技术有限公司 Waterproof fingerprint identification module and electronic equipment
US10380396B2 (en) 2016-08-03 2019-08-13 Samsung Electronics Co., Ltd. Electronic device having fingerprint sensor
WO2018026135A1 (en) * 2016-08-03 2018-02-08 Samsung Electronics Co., Ltd. Electronic device having fingerprint sensor
KR20180015371A (en) * 2016-08-03 2018-02-13 삼성전자주식회사 Electronic device having finger print sensor
KR102622021B1 (en) 2016-08-03 2024-01-08 삼성전자 주식회사 Electronic device having finger print sensor
WO2018032940A1 (en) * 2016-08-16 2018-02-22 Guangdong Oppo Mobile Telecommunications Corp., Ltd. Fingerprint sensor, method for manufacturing fingerprint sensor, and terminal
US10380406B2 (en) 2016-08-16 2019-08-13 Guangdong Oppo Mobile Telecommunications Corp., Ltd. Fingerprint sensor, method for manufacturing fingerprint sensor, and terminal
CN106695625A (en) * 2016-12-29 2017-05-24 深圳天珑无线科技有限公司 Assembly fixture and process of electronic equipment
CN106695625B (en) * 2016-12-29 2019-04-02 四川苏格通信技术有限公司 The assembly fixture of electronic equipment and the assembly technology of electronic equipment
CN106695625B8 (en) * 2016-12-29 2019-06-11 四川苏格通讯技术有限公司 The assembly fixture of electronic equipment and the assembly technology of electronic equipment
WO2018153079A1 (en) * 2017-02-23 2018-08-30 京东方科技集团股份有限公司 Touch display structure for mobile terminal and manufacturing method therefor, and mobile terminal
US10503297B2 (en) 2017-02-23 2019-12-10 Boe Technology Group Co., Ltd. Mobile terminal touch control display structure and manufacturing method thereof, mobile terminal
CN108986673A (en) * 2017-05-31 2018-12-11 群创光电股份有限公司 Display device
CN109427853A (en) * 2017-09-05 2019-03-05 乐金显示有限公司 Display device including fingerprint scanner
CN109427853B (en) * 2017-09-05 2023-05-30 乐金显示有限公司 Display device including fingerprint scanner
WO2019153372A1 (en) * 2018-02-06 2019-08-15 武汉华星光电半导体显示技术有限公司 Display device
CN111223897A (en) * 2018-11-27 2020-06-02 三星显示有限公司 display device
CN113495600A (en) * 2020-04-02 2021-10-12 苹果公司 Portable electronic device

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