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WO2015135186A1 - 一种电子设备及屏蔽件的制作方法 - Google Patents

一种电子设备及屏蔽件的制作方法 Download PDF

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Publication number
WO2015135186A1
WO2015135186A1 PCT/CN2014/073401 CN2014073401W WO2015135186A1 WO 2015135186 A1 WO2015135186 A1 WO 2015135186A1 CN 2014073401 W CN2014073401 W CN 2014073401W WO 2015135186 A1 WO2015135186 A1 WO 2015135186A1
Authority
WO
WIPO (PCT)
Prior art keywords
electronic device
metal
shielding
circuit board
hole
Prior art date
Application number
PCT/CN2014/073401
Other languages
English (en)
French (fr)
Inventor
靳林芳
邹杰
孙浩
杨明星
Original Assignee
华为终端有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为终端有限公司 filed Critical 华为终端有限公司
Priority to PCT/CN2014/073401 priority Critical patent/WO2015135186A1/zh
Priority to EP14868704.9A priority patent/EP2943049B1/en
Priority to JP2016506762A priority patent/JP6229215B2/ja
Priority to CN201480003096.5A priority patent/CN104823532B/zh
Priority to US14/791,726 priority patent/US9807918B2/en
Publication of WO2015135186A1 publication Critical patent/WO2015135186A1/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/0049—Casings being metallic containers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1656—Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/181—Enclosures
    • G06F1/182—Enclosures with special features, e.g. for use in industrial environments; grounding or shielding against radio frequency interference [RFI] or electromagnetical interference [EMI]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
    • B29K2995/0003—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular electrical or magnetic properties, e.g. piezoelectric
    • B29K2995/0005—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3481—Housings or casings incorporating or embedding electric or electronic elements

Definitions

  • the present invention relates to the field of electronic technologies, and in particular, to an electronic device and a method of manufacturing the same. Background technique
  • Electronic equipment typically includes a circuit board on which the electronics are disposed and die-cast metal parts with holes or slots, wherein the die-cast metal parts also serve as a shielded space for the electronic device.
  • the purpose of opening the hole or groove is to reduce the weight of the die-cast metal part, or to open the hole or groove due to product structure space constraints and device layout (eg, the device is high, in order not to increase the overall thickness, it is required A partial opening or groove of a die-cast metal part is described.
  • the metal die casting can be made into different complicated shapes and structures as needed.
  • the metal member is provided with the hole or the groove through which electromagnetic waves of the electronic device can pass, thereby affecting the operation of the electronic device located on the other side of the die-cast metal member.
  • the electromagnetic waves generated by the electronic device are prevented from passing through the holes or grooves by sticking a conductive film.
  • the embodiment of the invention provides a method for manufacturing an electronic device and a shielding member, which solves the problem that in the prior art, because the thickness of the metal die-casting component itself is thick, a conductive film is attached to the hole or the groove of the die-casting metal component, and the electronic device is added.
  • the technical problem of the thickness because the thickness of the metal die-casting component itself is thick, a conductive film is attached to the hole or the groove of the die-casting metal component, and the electronic device is added.
  • a first aspect of the present invention provides an electronic device, where the electronic device includes: a metal member, a circuit board, and a shielding member, wherein the metal member is provided with a through hole or a slot, and the metal member is a metal stamping member or a metal a forging piece; the circuit board is provided with an electronic device; the shielding member comprises a shielding portion and a closing portion, the shielding portion is made of a conductive plastic material, and the closing portion is made of metal or conductive plastic The shielding portion is configured to block the through hole or the slot, the closing portion is disposed around the electronic device, and one end is electrically connected to the metal member, and the other end is connected to the circuit board The ground copper is electrically connected, the metal member, the shielding portion, the closing portion and the circuit board form a shielding space, and the electronic device is located in the shielding space.
  • the electronic device further includes an enhancement portion affixed to the metal member for enhancing the strength of the metal member.
  • the enhancement is disposed opposite the electronic device.
  • the shielding component further includes a engaging portion connected to the shielding portion The engaging portion is engaged in the through hole or the slot.
  • the shielding component further includes a fixing portion connected to the engaging portion, where the size of the fixing portion is greater than The size of the through hole or slot.
  • the aforesaid portion and the circuit board or the closed portion Conductive elastic members are disposed between the metal members.
  • the through hole or slot is disposed opposite to the electronic device.
  • the conductive plastic material is specifically an electrically conductive plastic.
  • the shielding portion is disposed on a surface opposite to the metal member Insulation.
  • the shielding portion is integrally molded with the closing portion, or the shielding portion
  • the closure portion is integrally injection molded with the metal piece.
  • a second aspect of the embodiments of the present invention provides a method for manufacturing a shield. The method includes: forming a through hole or a slot in a metal member, wherein the metal member is a metal stamping member or a metal forging member; The conductive plastic material forms a shielding portion on the metal member, and the shielding portion is configured to block the through hole or the groove;
  • the method further includes: forming, by using an injection molding method, a clamping portion and a fixing portion connected to the engaging portion in the through hole or the groove by using a plastic material
  • the size of the fixing portion is larger than the size of the through hole or the groove.
  • the closing portion is made of a conductive plastic material
  • the closing portion, the shielding portion, and the The engaging portion and the fixing portion are formed on the metal member by one injection molding.
  • the electronic device is provided with a shielding portion for shielding a through hole or a groove on the metal member and surrounding the electronic device, and one end is electrically connected to the metal member, and the other end is connected to the circuit board.
  • a closed portion of the ground copper electrical connection since the circuit board is provided with ground copper, and the closing portion is made of a conductive material, therefore, the metal member, the circuit board, the shielding portion, and the closed portion Forming a closed space for accommodating the electronic device, and electromagnetic waves generated on the metal member are guided to the ground copper of the circuit board through the closing portion to form a shield for enclosing the electronic device. Space, to reduce or avoid the electromagnetic radiation generated by the electronic device to radiate outward, to prevent the impact on the operation of other electronic devices.
  • the metal member is a metal stamping member or a metal forging member, and since the thickness of the metal stamping member or the metal forging member is smaller than the thickness of the metal die-casting member, even on the metal member After the shielding member, the sum of the thicknesses of the metal member and the shielding member is also smaller than the sum of the thicknesses of the metal die casting and the conductive film. Therefore, the above electronic device solves the prior art due to the metal die casting itself. Thicker, affixed to the hole or groove of the die-cast metal piece Electrical film, a technical problem of increasing the thickness of the electronic device. DRAWINGS
  • FIG. 1 is a schematic structural view of an electronic device according to a first preferred embodiment of the present invention.
  • FIG. 2 is a schematic structural diagram of an electronic device according to a second preferred embodiment of the present invention.
  • FIG. 3 is a schematic structural diagram of an electronic device according to a third preferred embodiment of the present invention.
  • FIG. 4 is a schematic structural diagram of an electronic device according to a fourth preferred embodiment of the present invention.
  • FIG. 5 is a schematic structural diagram of an electronic device according to a fifth preferred embodiment of the present invention.
  • FIG. 6 is a schematic structural diagram of an electronic device according to a sixth preferred embodiment of the present invention.
  • FIG. 7 is a flow chart of a method of fabricating a shield according to still another preferred embodiment of the present invention. detailed description
  • FIG. 1 is a schematic structural diagram of an electronic device 100 according to an embodiment of the present invention.
  • the electronic device can be a mobile phone, a PAD, a computer, a television, a server, or the like.
  • the electronic device 100 includes a metal member 10, a circuit board 20, and a shield member 30.
  • the metal member 10 is provided with a through hole or a groove 11, and the shape and size of the hole or groove 11 can be set as needed.
  • the opening or the slot 11 is mainly used for reducing the metal weight of the electronic device 100, or releasing the stress, or giving way to the electronic device in the electronic device 100, or fixing the metal member 10 to be fixed. Components. Therefore, the number of the through holes or the slots 11 may be one or plural as needed. As shown in FIG. 1, the number of the through holes or slots 11 is one, open The through hole or slot 11 is provided to reduce the weight of the electronic device 100. If the size of the through hole or slot 11 is larger than the electronic device 21, the purpose of opening the through hole or slot 11 may be to give way to the electronic device. As shown in FIG. 2 and FIG.
  • the element may be the shield 30.
  • the number of the through holes or slots 11 is two, and the two through holes or slots 11 are opened for fixing the metal parts required for fixing.
  • the element may be shield 30.
  • the metal member 10 may be a metal stamping or a metal forging.
  • the metal stamping part has excellent heat conduction characteristics (thermal conductivity can be more than 250 W/m-K), low manufacturing cost, and thin wall thickness (the wall thickness can be up to ⁇ 0.1 mm without strength requirement).
  • the metal stampings are better than the metal die-casting parts, but the metal stampings cannot make complex shielding cavities and partial thickening, and can only be made into structural parts with simple structural requirements and uniform wall thickness. 5 ⁇ ), but the difference in thickness is usually within 0. 2mm).
  • the heat transfer characteristics of metal die-casting parts are worse than that of stamping parts, but complex shielding cavities and local thickening can be made, so that the structural strength of metal die-casting parts is high.
  • metal die castings require CNC machining (full name: computer numerical control machine tool, computer numer ica l contro l) at the back end of die casting or powder metallurgy, so the manufacturing cost is high, and the wall thickness of the metal die casting is greater than Metal stampings (wall thickness: large area > 0. 4mm, partial > 0.3 mm), and metal die castings are difficult to weld.
  • the performance of the metal forging is between the metal die casting and the metal stamping.
  • the circuit board 20 is provided with electronic components.
  • the circuit board 20 may include an electronic device 21 and an electronic device 22.
  • the height of the electronic device 22 is greater than the height of the electronic device 21.
  • the electronic device 21 and the electronic device 22 may or may not be opposite to the through hole or the slot 11. As shown in FIG. 1, the electronic device 21 is disposed opposite a through hole or slot 11, and the electronic device 22 is not disposed opposite the through hole or slot 11. In FIGS. 3 and 4, neither the electronic device 21 nor the electronic device 22 is disposed opposite the through hole or the slot 11.
  • the size of the holes or slots 11 can be set as desired, that is, the size of the electronic device 21 can be larger than the holes or slots 11, or smaller than the holes or slots 11.
  • the hole or the groove 11 may be larger than the electronic device 21, and the electronic device 21 is partially accommodated in the hole or the groove 11 to reduce the metal member 10 and the The distance between the boards 20 reduces the overall thickness of the electronic device 100.
  • the shielding member 30 is fixed to the metal member 10 for shielding electromagnetic waves generated by the electronic device 21.
  • the shield 30 includes a shielding portion 31 and a closing portion 33.
  • the shielding member 30 may be integrally formed, or may be formed by two separate components, such as the shielding portion 31 and the closing portion 33, or may be connected to the shielding portion 31 and the closing portion through a connecting portion. 33 is formed; or the shielding portion 31 and the closing portion 33 may be two separate components.
  • the shielding portion 31 is made of a conductive plastic material
  • the closing portion 33 is made of a metal or a conductive plastic material
  • the shielding portion 31 can be integrally injection molded with the closing portion 33, or the shielding portion 31,
  • the closing portion 33 and the metal member 10 can also be integrally injection molded by metal.
  • the shielding portion 31 may be made of a conductive plastic material, and the shielding portion 31 is configured to block the through hole or the slot 11 to reduce or prevent electromagnetic waves generated by the electronic device 21 from passing through the through hole or Slot 11.
  • the number of the shielding portions 31 is determined according to the number of the through holes or the slots 11, and when the number of the shielding portions 31 is two or more, whether the shielding portions 31 are connected may be Need to set up. As shown in FIG. 1 , the number of the through holes or slots 11 is one. Therefore, the number of the shielding portions 31 may be one; in FIG. 2 and FIG. 5 , the number of the through holes or slots 11 is three.
  • the number of the shielding portions 31 is three, and one of the three shielding portions 31 is separate, not connected to the other two shielding portions 31, and due to the other two shielding portions 31
  • the strength of the metal member 10 needs to be increased or the space is sufficient. Therefore, a connection portion or a reinforcing portion 37 for connecting the two shielding portions 31 is provided between the other two shielding portions 31.
  • the number of the reinforcing portions 37 may be set to one or more as needed, and the reinforcing portions 37 may be independent or integrally formed with the shielding portion 31. Further, the thickness of each portion on each reinforcing portion 37 may be different.
  • the material of the reinforcing portion 37 is the same as the material of the shielding portion 31. In other embodiments, the reinforcing portion 37 may be made of an insulating plastic material.
  • the number of the through holes or slots 11 is two. Therefore, the number of the shielding portions 31 is two, and the two shielding portions 31 are independent, that is, the two Between the shielding parts 31 They are not connected to each other, and may be integrally connected at other portions according to the structural design, and since the strength of the portion of the metal member 10 opposite to the electronic device 21 needs to be enhanced, the metal member 10 and the electrons are
  • the opposing surface of the device 21 is provided with a reinforcing portion 37 that is connected to one of the two shielding portions 31.
  • the reinforcing portion 37 is connected to one of the shielding portions 31.
  • the reinforcing portion 37 may be independent and not connected to the blocking portion 31 or the closing portion 33.
  • the number of the through holes or slots 11 is two. Therefore, the number of the shielding portions 31 is two, and the two shielding portions 31 are independent, that is, The two shielding portions 31 are not connected to each other, and the connecting portion may be disposed at a product thickness permitting according to a structural design, such as an edge, a position of a relatively short device, or the like.
  • the shielding portion 31 can be fixed to the metal member 10 by adhesive bonding or screw-locking after injection molding, in the space of the electronic device 100.
  • the shielding portion 31 can be injection molded directly on the metal member 10, so that the thickness of the shielding portion 31 can be relatively small to reduce the thickness of the electronic device 100.
  • the shielding portion 31 may be formed on the metal member 10 by metal injection molding.
  • the conductive plastic material is specifically an electrically and thermally conductive plastic, it has better thermal conductivity. Therefore, when the shielding portion 31 is a conductive plastic material, the shielding portion 31 can directly contact the electronic device 21. In order to further improve the heat conduction efficiency between the shielding portion 31 and the electronic device 21, a thermal interface material such as a thermal pad may be added between the electronic device 21 and the shielding portion 31 to achieve less heat transfer. The thermal resistance increases the heat transfer efficiency between the shielding portion 31 and the electronic device 21.
  • an insulating layer is disposed on a surface of the shielding portion 31 opposite to the metal member 10. By providing the insulating layer, electromagnetic waves generated by the electronic device 21 can be shielded even after the shielding portion 31 is deformed.
  • the metal may be formed by injection molding or the like.
  • the structure 10 is formed on the electronic device 21 (for example, the structure may be an insulating layer) to prevent electromagnetic waves generated by the electronic device 21 from passing through the holes or slots 11 in the metal member 10.
  • the closing portion 33 is made of a metal or a conductive plastic material, and the closing portion 33 is disposed around the electronic device 21, and one end is in contact with the metal member 10 through the conductive elastic member 40, and the other end is
  • the circuit board 20 is in contact with, in particular, the other end is electrically connected to the ground copper of the circuit board 20.
  • the closing portion 33 Since the circuit board 20 is provided with ground copper, and the closing portion 33 is made of a conductive material, the The electric charge generated on the metal member 10 is conducted by the closing portion 33 to the ground copper of the circuit board 20, thereby reducing or avoiding the electromagnetic waves generated by the electronic device 21 from radiating and disturbing to the surroundings.
  • the closing portion 33 is in contact with the metal member 10 through the conductive elastic member 40. In other embodiments, the closing portion 33 may directly contact the metal member 10.
  • the number of the closing portions 33 may be set according to the number of electronic devices. As shown in FIG. 1, FIG. 2, FIG. 5 and FIG. 6, both the electronic device 21 and the electronic device 22 need to be shielded. Therefore, two shielding cavities are formed, one shielding the electronic device 21 and the other shielding device. The electronic device 22 is described.
  • the closing portion 33 surrounding the electronic device 21 is made of a metal material
  • the closing portion 33 surrounding the electronic device 22 is made of a conductive plastic material.
  • the closing portion 33 is a single component, and when the closing portion 33 is made of a metal material, it can be fixed to the circuit board 20 by soldering; when the closing portion 33 is made of a conductive material, The closing portion 33 can be fixed to the circuit board 20 by a fixing member such as a screw or the like.
  • the closing portions 33 surrounding the electronic device 21 and the electronic device 22 are each made of a metal material.
  • the closing portion 33 may be a single component or may be integrally formed with the shielding portion 31 by injection molding. A manner is formed on the metal member 10.
  • the closing portion 33 may be provided as a separate metal member. As shown in FIG. 5, the closed portion 33 surrounding the electronic device 21 is provided. As a separate metal piece. As shown in Fig. 6, the closing portions 33 surrounding the electronic device 21 and the electronic device 22 are separate metal members.
  • the metal member 10, the circuit board 20, the shielding portion 31 and the closing portion 33 Passing the metal member 10, the circuit board 20, the shielding portion 31 and the closing portion 33 such that the electronic device 21 is in a shielding space to prevent electromagnetic waves generated by the electronic device 21 from being applied to other electronic components.
  • the device has an effect.
  • the electronic device 21 When the electronic device 21 is in operation, the electronic device 21 generates The electromagnetic wave can be shielded by the shielding portion 31, the closing portion 33 and the metal member 10 to reduce or prevent the electromagnetic waves generated by the electronic device 21 from radiating outward, thereby preventing the operation of other electronic devices from being affected.
  • the metal member 10, the closing portion 33 and the circuit board form a shielding space such that the electronic device 22 is in a shielded space as shown in FIG.
  • the conductive plastic material may be a heat conductive material having a thermal conductivity k greater than lW/m-K.
  • the electronic device 100 is provided with a shielding portion 31 for shielding the through hole or the slot 11 of the metal member 10 and surrounding the electronic device 21, and one end is electrically connected to the metal member 10, and the other end is electrically connected.
  • a closed portion 33 electrically connected to the circuit board 20, since the circuit board 20 is provided with ground copper, and the closing portion 33 is made of a conductive material, therefore, the metal member 10 and the circuit board 20
  • An enclosed space in which the electronic device 21 is located is formed between the shielding portion 31 and the closing portion 33, and electromagnetic waves generated on the metal member 10 are transmitted to the circuit board 20 through the closing portion 33.
  • the ground copper is guided away to form a shielding space for enclosing the electronic device 21 to reduce or avoid external radiation of the electromagnetic waves generated by the electronic device 21, thereby preventing the operation of other electronic devices from being affected.
  • the metal member 10 may be a metal stamping member or a metal forging member, and the thickness of the metal stamping member or the metal forging member is smaller than the thickness of the metal die casting member, and therefore, even in the metal member After the shield member 30 is formed on the 10, the sum of the thicknesses of the metal member 10 and the shield member 30 is also smaller than the sum of the thicknesses of the metal die casting member and the conductive film. Therefore, the electronic device 100 solves the existing In the art, since the thickness of the metal die-casting member itself is thick, a conductive film is attached to the hole or groove of the die-cast metal member, which further increases the technical problem of the thickness of the electronic device.
  • the metal stamping member or the metal forging member is combined with the conductive plastic member, compared with the original metal forging member and the ordinary plastic, the mechanical reliability of the metal member and the plastic member is enhanced, and the conductive heat conduction is used. The cost of the plastic part is reduced relative to the cost of the conventional insulated thermally conductive plastic.
  • the conductive shielding cavity or the isolation cavity can be made by the precise injection molding of the plastic and the complex molding property, that is, the shielding portion 31 and the closing portion 33 can be formed on the metal member 10 at one time.
  • the thickness of each part of the shielding member 30 may be different with respect to the thickness of the metal member 10, and when it is required to strengthen the strength of a certain portion of the metal member 10, the metal member 10 is required.
  • the portion is overmolded with a conductive plastic, and the thickness of the conductive plastic can be set as needed; when the space in the thickness direction of the electronic device 100 is limited, the plastic can be not molded on the portion of the metal member 10 having a limited thickness. Without increasing the overall thickness of the product.
  • the shielding member 30 when the shielding portion 31 is located between the electronic device 21 and the metal member 10, in order to increase the structure between the shielding portion 31 and the metal member 10
  • the shielding member 30 further includes an engaging portion 32 connected to the shielding portion 31, and the engaging portion 32 is engaged in the through hole or the slot 11, thereby increasing the shielding portion 31 and
  • the structural bonding force between the metal members 10 increases the stability of the shielding portion 31 and reduces the possibility of the shielding portion 31 being separated from the metal member 10.
  • the shielding portion 31 and the engaging portion 32 may be integrally formed, and of course, may be two elements, and the shielding portion 31 and the engaging portion 32 are bonded together by bonding.
  • the shielding member 30 further includes a fixing portion 34 connected to the engaging portion 32.
  • the fixing portion 34 and the shielding portion 31 are respectively disposed on opposite sides of the metal member 10, and the fixing portion 34 has a size larger than a size of the through hole or the slot 11.
  • the shielding portion 31, the engaging portion 32, and the fixing portion 34 may be integrally formed.
  • the shielding portion 31, the engaging portion 32, and the fixing portion 34 may also be bonded. integrate.
  • the conductive elastic member 40 is disposed between the closing portion 33 and the circuit board 20.
  • the conductive elastic member 40 may be a conductive elastic piece or a conductive foam or the like.
  • the closing portion 33 may not be in direct contact with the ground copper of the circuit board 20, but may be in contact with the ground copper through the conductive elastic member 40.
  • the ground copper of the circuit board 20 may be a copper layer on the surface of the circuit board 20.
  • the electronic device 100 is provided with a shielding portion 31 for shielding the through hole or the slot 11 of the metal member 10 and surrounding the electronic device 21, and one end is electrically connected to the metal member 10, and the other end is electrically connected.
  • a closure portion 33 that is electrically connected to the ground copper of the circuit board 20. Because the circuit board 20 is provided The grounding copper is disposed, and the closing portion 33 is made of a conductive material. Therefore, the electronic component 10, the circuit board 20, the shielding portion 31 and the closing portion 33 form an electronic device.
  • the electromagnetic wave generated on the metal member 10 is guided to the ground copper of the circuit board 20 through the closing portion 33, thereby forming a shielding space for enclosing the electronic device 21,
  • the electromagnetic waves generated by the electronic device 21 are reduced or prevented from radiating outward, thereby preventing an influence on the operation of other electronic devices.
  • the metal member 10 may be a metal stamping member or a metal forging member, and the thickness of the metal stamping member or the metal forging member is smaller than the thickness of the metal die casting member, and therefore, even in the metal member 10 After the shielding member 30 is formed, the sum of the thicknesses of the metal member 10 and the shielding member 30 is also smaller than the sum of the thicknesses of the metal die casting and the conductive film. Therefore, the electronic device 100 solves the prior art. Since the thickness of the metal die-casting member itself is thick, the conductive film is attached to the hole or the groove of the die-cast metal member, further increasing the technical problem of the thickness of the electronic device.
  • the engaging portion 32 connected to the shielding portion 31 is formed in the through hole or the groove 11, thereby increasing the structural bonding force between the shielding portion 31 and the metal member 10, and the shielding portion 31 is added.
  • the stability of the occlusion portion 31 is reduced from the metal member 10.
  • the shield member 30 is prevented from being detached from the metal member 10, and the shielding is increased.
  • the stability of the piece 30 is increased.
  • FIG. 7 is a flowchart of a method for manufacturing a shield according to an embodiment of the present invention.
  • the method for manufacturing the shield includes the following steps:
  • Step 210 a through hole or slot 11 is formed in the metal member 10, and the metal member 10 may be a metal stamping member or a metal forging member;
  • Step 220 forming a shielding portion 31 on the metal member 10 by using a conductive plastic material, and the shielding portion 31 is used for shielding the through hole or the groove 11;
  • Step 230 forming an electronic device for enclosing the circuit board 20 by using a metal or a conductive plastic material The closure portion 33 of the piece 21.
  • the method further includes: step 240, forming an engaging portion 32 and a fixing portion 34 connected to the engaging portion 32 in the through hole or the slot 11 by using a plastic material by injection molding,
  • the fixing portion 34 and the shielding portion 31 are respectively disposed on opposite sides of the metal member 10, and the fixing portion 34 has a size larger than a size of the through hole or the groove 11.
  • the closing portion 33 is made of a conductive plastic material
  • the closing portion 33, the shielding portion 31, the engaging portion 32 and the fixing portion 34 are injection molded on the metal member by one injection molding. 10 on.
  • the method further includes: Step 250: Form an insulating plastic member on the metal member 10 by using an insulating plastic material by an injection molding method for antenna design.
  • the shielding member is formed by providing a shielding portion 31 for shielding the through hole or the groove 11 of the metal member 10 and surrounding the electronic device 21, and one end is in contact with the metal member 10 and the other end is
  • the circuit board 20 contacts the closure portion 33. Since the circuit board 20 is provided with ground copper, and the closing portion 33 is made of a conductive material, electromagnetic waves generated on the metal member 10 are transmitted to the circuit board 20 through the closing portion 33.
  • the ground copper is guided away to form a shielding space for enclosing the electronic device 21 to reduce or avoid external radiation of the electromagnetic waves generated by the electronic device 21, thereby preventing the operation of other electronic devices from being affected.
  • the thickness of the metal stamping member or the metal forging member is smaller than the thickness of the metal die casting member, and therefore, even after the shield member 30 is formed on the metal member 10, the metal member 10 And the sum of the thicknesses of the shield member 30 is also smaller than the sum of the thicknesses of the metal die-casting member and the conductive film. Therefore, in the prior art, the electronic die 100 has a thick thickness in the metal die-casting member itself, and the die-cast metal is The conductive film is attached to the hole or the groove of the piece, further increasing the technical problem of the thickness of the electronic device.

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Abstract

本发明实施例公开一种电子设备及屏蔽件的制作方法，所述电子设备包括金属件、电路板和屏蔽件，所述金属件上开设有通孔或槽，所述金属件为金属冲压件或金属锻压件；所述电路板与所述金属件相对设置，其上设置有电子器件；所述屏蔽件固定于所述金属件上，所述屏蔽件包括遮挡部和封闭部，所述遮挡部由导电塑胶材料制成，所述封闭部由金属或者导电塑胶材料制成，所述遮挡部用于遮挡所述通孔或槽，所述封闭部围设于所述电子器件的周围，且一端与所述金属件电气连接，另一端与所述电路板电气连接，所述金属件、所述遮挡部、所述封闭部和所述电路板之间形成屏蔽空间，所述电子器件位于所述屏蔽空间内。

Description

一种电子设备及屏蔽件的制作方法
技术领域
本发明涉及电子技术领域， 尤其涉及一种电子设备及屏蔽件的制作方法。 背景技术
随着科学技术的发展和社会的进步， 电子设备如手机、 电脑、 电视已成为 人们生活和工作中不可缺少的一部分。 电子设备通常包括设置电子器件的电路 板和开设有孔或者槽的压铸金属件， 其中压铸金属件也作为电子器件的屏蔽空 间。 开设所述孔或者槽的目的是为了减轻所述压铸金属件的重量， 或者由于产 品结构空间制约和器件布局需要开设所述孔或槽 （如： 器件高， 为不增加整体 厚度， 则需要所述压铸金属件局部开孔或槽）。 所述金属压铸件可以根据需要做 出不同的复杂形状和结构。
所述金属件上开设有所述孔或者槽， 所述电子器件的电磁波能够穿过所述 孔或者槽， 对位于压铸金属件的另一侧的电子器件的工作产生影响。 现有技术 中如开孔通常通过贴导电膜的方式防止所述电子器件产生的电磁波穿过所述孔 或者槽。
然而， 由于金属压铸件本身的厚度较厚， 在所述压铸金属件的孔或者槽上 贴导电膜， 进一步增加了所述电子设备的厚度。 发明内容
本发明实施例提供一种电子设备及屏蔽件的制作方法， 解决了现有技术中 由于金属压铸件本身的厚度较厚， 在所述压铸金属件的孔或者槽上贴导电膜， 增加电子设备的厚度的技术问题。
本发明实施例第一方面提供一种电子设备， 所述电子设备包括： 金属件、 电路板和屏蔽件， 所述金属件上开设有通孔或槽， 所述金属件为金属冲压件或 金属锻压件； 所述电路板， 其上设置有电子器件； 所述屏蔽件， 其包括遮挡部 和封闭部， 所述遮挡部由导电塑胶材料制成， 所述封闭部由金属或者导电塑胶 材料制成， 所述遮挡部用于遮挡所述通孔或槽， 所述封闭部围设于所述电子器 件的周围， 且一端与所述金属件电气连接， 另一端与所述电路板的地铜电气连 接， 所述金属件、 所述遮挡部、 所述封闭部和所述电路板形成屏蔽空间， 所述 电子器件位于所述屏蔽空间内。
在第一方面第一种可能的实现方式中， 所述电子设备还包括固定于所述金 属件上用于增强所述金属件的强度的增强部。
结合第一方面的第一种可能的实现方式， 在第一方面第二种可能的实现方 式中， 所述增强部与所述电子器件相对设置。
结合第一方面、 第一方面的第一种或者第二种可能的实现方式， 在第一方 面第三种可能的实现方式中， 所述屏蔽件还包括与所述遮挡部连接的卡合部， 所述卡合部卡合于所述通孔或槽内。
结合第一方面的第三种可能的实现方式， 在第一方面第四种可能的实现方 式中， 所述屏蔽件还包括与所述卡合部连接的固定部， 所述固定部的尺寸大于 所述通孔或槽的尺寸。
结合第一方面、 第一方面的第一种至第四种可能的实现方式， 在第一方面 第五种可能的实现方式中， 所述封闭部与所述电路板或者所述封闭部与所述金 属件之间设置有导电弹性件。
结合第一方面、 第一方面的第一种至第五种可能的实现方式， 在第一方面 第六种可能的实现方式中， 所述通孔或槽与所述电子器件相对设置。
结合第一方面、 第一方面的第一种至第六种可能的实现方式， 在第一方面 第七种可能的实现方式中， 所述导电塑胶材料具体为导电导热塑胶。
结合第一方面、 第一方面的第一种至第七种可能的实现方式， 在第一方面 第八种可能的实现方式中， 所述遮挡部与所述金属件相背的表面上设置有绝缘 层。
结合第一方面至第八种可能的实现方式中， 在第一方面的第九中可能的实 现方式中， 所述所述遮挡部与所述封闭部一体注塑成型， 或， 所述遮挡部、 所 述封闭部与所述金属件一体金属注塑成型。 本发明实施例第二方面提供一种屏蔽件的制作方法， 所述方法包括： 在金属件上开设通孔或槽， 所述金属件为金属冲压件或金属锻压件； 通过注塑成型方式釆用导电塑胶材料在所述金属件上形成遮挡部， 所述遮 挡部用于遮挡所述通孔或槽；
通过金属或者导电塑胶材料形成用于围设电路板上的电子器件， 且一端与 所述金属件电气连接， 另一端与所述电路板的地铜电气连接的封闭部， 以使得 所述电子器件在一个封闭的屏蔽空间内。
在第二方面第一种可能的实现方式中， 所述方法还包括： 通过注塑成型方 式釆用塑胶材料在所述通孔或槽内形成卡合部和与所述卡合部连接的固定部， 所述固定部的尺寸大于所述通孔或槽的尺寸。
结合第二方面的第一种可能的实现方式， 在第二方面第二种可能的实现方 式中， 在所述封闭部为导电塑胶材料制成时， 所述封闭部、 所述遮挡部、 所述 卡合部和所述固定部通过一次注塑成型于所述金属件上。
本发明实施例有益效果如下：
上述电子设备通过设置用于遮挡所述金属件上的通孔或槽的遮挡部和围设 于所述电子器件的周围， 且一端与所述金属件电气连接， 另一端与所述电路板 的地铜电气连接的封闭部， 由于所述电路板上设置有地铜， 而所述封闭部由导 电材料制成， 因此， 所述金属件、 所述电路板、 所述遮挡部和所述封闭部形成 一容设所述电子器件的封闭空间， 所述金属件上产生的电磁波会通过所述封闭 部传递到所述电路板的地铜上导走， 从而形成一封闭所述电子器件的屏蔽空间， 以减少或者避免所述电子器件产生的电磁波向外辐射， 防止对其它电子器件的 工作产生影响。
由于上述电子设备中， 所述金属件为金属冲压件或者金属锻压件， 由于所 述金属冲压件或者金属锻压件的厚度小于所述金属压铸件的厚度， 因此， 即便 在所述金属件上形成所述屏蔽件后， 所述金属件和所述屏蔽件的厚度之和也小 于所述金属压铸件与导电膜的厚度之和， 因此， 上述电子设备解决了现有技术 中由于金属压铸件本身的厚度较厚， 在所述压铸金属件的所述孔或者槽上贴导 电膜， 增加所述电子设备的厚度的技术问题。 附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案， 下面将对实施 例描述中所需要使用的附图作简单地介绍， 显而易见地， 下面描述中的附图仅 仅是本发明的一些实施例。
图 1为本发明第一较佳实施方式电子设备的结构示意图；
图 2为本发明第二较佳实施方式电子设备的结构示意图；
图 3为本发明第三较佳实施方式电子设备的结构示意图；
图 4为本发明第四较佳实施方式电子设备的结构示意图；
图 5为本发明第五较佳实施方式电子设备的结构示意图；
图 6为本发明第六较佳实施方式电子设备的结构示意图；
图 7为本发明又一较佳实施方式屏蔽件的制作方法的流程图。 具体实施方式
为了使本技术领域的人员更好地理解本发明方案， 下面将结合本发明实施 例中的附图， 对本发明实施例中的技术方案进行清楚、 完整地描述。 显然， 所 描述的实施例仅仅是本发明一部分的实施例， 而不是全部的实施例。
实施例一
如图 1所示， 为本发明实施方式电子设备 100的结构示意图。 所述电子设 备可以为手机、 PAD、 电脑、 电视、 服务器等设备。 所述电子设备 100包括金属 件 10、 电路板 20和屏蔽件 30。
所述金属件 10上开设有通孔或槽 11 , 所述孔或槽 11的形状和大小可以根 据需要设置。 开设所述通孔或槽 11作用主要是用于降低所述电子设备 100的金 属重量， 或者为应力释放， 或者为电子设备 100 内的电子器件让位， 或者固定 需要固定在该金属件 10上的元件。 因此， 根据需要， 所述通孔或槽 11 的数目 可以为一个， 也可以为多个。 如图 1所示， 所述通孔或槽 11的数目为 1个， 开 设所述通孔或槽 11是为了减轻所述电子设备 100的重量。如果所述通孔或槽 11 的尺寸大于所述电子器件 21 时， 则开设所述通孔或槽 11 的目的可能是为了为 所述电子器件让位。如图 2和图 5所示， 所述通孔或槽 11的数目为 3个， 其中， 部分通孔或槽 11是为了减轻所述电子设备 100的重量， 而开设另外两个通孔或 槽 11 的目的是为了固定所述需要固定在该金属件 10上的元件。 在本实施方式 中， 所述元件可以为屏蔽件 30。 而如图 3、 图 4和图 6所示， 所述通孔或槽 11 的数目为两个， 开设该两个所述通孔或槽 11的目的是为了固定所述需要固定在 该金属件 10上的元件， 在本实施方式中， 所述元件可以为屏蔽件 30。
所述金属件 10可以为金属冲压件或者金属锻压件。 其中， 金属冲压件的导 热特性优良（导热系数可至 250W/m-K以上）、 制造成本低、 壁厚薄（无强度要求 下壁厚可至〜 0. 1mm )。 另外， 金属冲压件焊接性好于金属压铸件， 但金属冲压 件无法做出复杂屏蔽腔和局部加厚， 仅能做成结构要求简单、 壁厚均匀的结构 件（配合腐蚀工艺可局部做薄， 但考虑工艺和成本， 厚度差别通常在 0. 2mm 以 内）。 金属压铸件导热特性差于冲压件， 但可做出复杂屏蔽腔和进行局部加厚， 使得金属压铸件的结构强度高。 另外， 金属压铸件在压铸或粉末冶金后端需 CNC (全称为： 计算机数字控制机床， Computer numer ica l contro l )等力口工处理， 因此， 制造成本高， 而且金属压铸件的壁厚大于金属冲压件（壁厚： 大面积 > 0. 4mm,局部 > 0. 3mm) , 且金属压铸件焊接困难。 而， 金属锻压件的性能是介于 金属压铸件和金属冲压件之间。
所述电路板 20上设置有电子器件， 请参阅图 1 , 电路板 20可以包括电子器 件 21和电子器件 22。 所述电子器件 22的高度大于所述电子器件 21的高度。 所 述电子器件 21和电子器件 22可以与所述通孔或者槽 11相对设置， 也可以不相 对设置。 如图 1所示， 所述电子器件 21与一个通孔或槽 11相对设置， 而电子 器件 22未与所述通孔或槽 11相对设置。 在图 3和图 4中， 所述电子器件 21和 所述电子器件 22均未与所述通孔或槽 11相对设置。 所述孔或者槽 11的尺寸可 以根据需要设置，也就是说，所述电子器件 21的尺寸可以大于所述孔或者槽 11 , 也可以小于所述孔或者槽 11。 如： 在所述电子器件 21相对于所述电路板 20的 厚度较大时， 所述孔或者槽 11的尺寸可以为大于所述电子器件 21 , 所述电子器 件 21部分容置于所述孔或者槽 11 内， 以减小所述金属件 10和所述电路板 20 之间的距离， 从而减小电子设备 100的整体厚度。
所述屏蔽件 30固定于所述金属件 10上， 用于屏蔽所述电子器件 21产生的 电磁波。 所述屏蔽件 30包括遮挡部 31和封闭部 33。 所述屏蔽件 30可以一体成 型， 也可以由两个单独的部件， 例如所述遮挡部 31和所述封闭部 33连接形成， 也可以通过一连接部连接所述遮挡部 31和所述封闭部 33形成； 或者所述遮挡 部 31和所述封闭部 33为独立分开的两个部件亦可。
其中， 所述遮挡部 31 由导电塑胶材料制成， 所述封闭部 33 由金属或者导 电塑胶材料制成， 所述遮挡部 31可以与封闭部 33—体注塑成型， 或所述遮挡 部 31、 所述封闭部 33与金属件 10也可以一体金属注塑成型。
具体地， 所述遮挡部 31可以由导电塑胶材料制成， 所述遮挡部 31用于遮 挡所述通孔或槽 11 ,减少或者防止所述电子器件 21产生的电磁波穿过所述通孔 或槽 11。 所述遮挡部 31的数目根据所述通孔或槽 11的个数确定， 而且在所述 的遮挡部 31 的数目为两个或者两个以上时， 所述遮挡部 31之间是否连接可以 根据需要设置。 如图 1所示， 所述通孔或槽 11的数目为一个， 因此， 所述遮挡 部 31的数目可以为一个； 在图 2和图 5中， 所述通孔或槽 11的数目为三个， 因此， 所述遮挡部 31 的数目为三个， 所述三个遮挡部 31 中的其中一个是单独 的， 未与另外两个遮挡部 31连接， 而由于另外两个遮挡部 31之间的金属件 10 的强度需要增强或者空间足够， 因此， 所述另外两个遮挡部 31之间设置有用于 连接该两个遮挡部 31的连接部或者增强部 37。 所述增强部 37的数目可以根据 需要设置为一个或者多个， 所述增强部 37可以为独立的， 也可以与所述遮挡部 31一体成型。另外，每个增强部 37上各部分的厚度可以不同。在本实施方式中， 所述增强部 37材料与所述遮挡部 31 的材料相同， 在其它实施方式中， 所述增 强部 37可以由绝缘塑胶材料制成。
如图 3所示， 所述通孔或槽 11的数目为两个， 因此， 所述遮挡部 31的数 目为两个， 所述两个遮挡部 31为独立的， 也就是说， 所述两个遮挡部 31之间 未相互连接， 也可根据结构设计需要在其它部位连接为一体， 而由于所述金属 件 10上与所述电子器件 21相对的部分的强度需要增强， 因此， 所述金属件 10 与所述电子器件 21相对的表面上设置有与两个遮挡部 31中的一个遮挡部 31连 接的增强部 37 , 在本实施方式中， 所述增强部 37与一个遮挡部 31连接， 在其 它实施方式中， 所述增强部 37可以为独立的， 不与所述遮挡部 31或者所述封 闭部 33连接。 如图 4和图 6所示， 所述通孔或槽 11的数目为两个， 因此， 所 述遮挡部 31 的数目为两个， 所述两个遮挡部 31为独立的， 也就是说， 所述两 个遮挡部 31之间未相互连接， 连接部位可根据结构设计需要设在产品厚度许可 处， 如边缘， 较矮器件位置处等。
在所述电子设备 100内的空间足够时， 所述遮挡部 31可以在注塑成型后通 过粘接的方式或者螺钉锁合的方式固定于所述金属件 10上，在所述电子设备 100 的空间有限时， 所述遮挡部 31可以直接在所述金属件 10上注塑成型， 这样所 述遮挡部 31的厚度可以做到相对较小，以减小所述电子设备 100的厚度。另夕卜， 为进一步增加所述遮挡部 31和所述金属件 10之间的结合力， 可以釆用金属注 塑成型方式将所述遮挡部 31成型于所述金属件 10上。
因为， 导电塑胶材料具体可以为导电导热塑胶， 具有较好的导热性能， 因 此， 在所述遮挡部 31为导电塑胶材料时， 所述遮挡部 31可以直接与所述电子 器件 21接触。 为了进一步提高所述遮挡部 31与所述电子器件 21之间的热传导 效率， 所述电子器件 21和所述遮挡部 31之间可以增加导热界面材料， 如导热 垫， 以实现更小的传热热阻， 增加所述遮挡部 31与所述电子器件 21之间的热 传导效率。 另外， 所述遮挡部 31与所述金属件 10相背的表面上设置有绝缘层。 通过设置所述绝缘层， 使得在所述遮挡部 31发生变形后， 同样能够屏蔽所述电 子器件 21产生的电磁波。
当所述金属件 10上的孔或者槽 11大于所述电子器件 21时， 所述电子器件 21部分容置于所述孔或者槽 11内， 此时， 可以通过注塑成型等方式在所述金属 件 10上形成一盖设于所述电子器件 21上的结构 （例如该结构可以为绝缘层 ), 以防止所述电子器件 21产生的电磁波穿过所述金属件 10上的孔或者槽 11。 所述封闭部 33 由金属或者导电塑胶材料制成， 所述封闭部 33 围设于所述 电子器件 21的周围， 且一端通过导电弹性件 40与所述金属件 10接触， 另一端 与所述电路板 20接触， 具体的， 另一端与所述电路板 20的地铜电气连接， 由 于所述电路板 20上设置有地铜， 而所述封闭部 33 由导电材料制成， 因此， 所 述金属件 10上产生的电荷会通过所述封闭部 33传递到所述电路板 20的地铜上 导走， 从而减少或者避免所述电子器件 21产生的电磁波向四周辐射和干扰。 在 本实施方式中， 所述封闭部 33通过所述导电弹性件 40与所述金属件 10接触， 在其它实施方式中， 所述封闭部 33可以直接与所述金属件 10接触。
另外， 所述封闭部 33的数目可以根据电子器件的数目设置。 如图 1、 图 2、 图 5和图 6所示， 所述电子器件 21和电子器件 22均需要屏蔽， 因此， 形成了 两个屏蔽腔体， 一个屏蔽所述电子器件 21 , 另一个屏蔽所述电子器件 22。
如图 5所示， 围设于所述电子器件 21的周围的所述封闭部 33由金属材料 制成时， 围设于所述电子器件 22的周围的所述封闭部 33由导电塑胶材料制成， 所述封闭部 33为一个单独的元件， 在所述封闭部 33 由金属材料制成时， 可以 通过焊接固定在电路板 20上； 在所述封闭部 33 由导电材料制成时， 所述封闭 部 33可以通过固定件如螺钉等固定在所述电路板 20上。 而如图 6所示， 围设 于所述电子器件 21和电子器件 22的周围的所述封闭部 33均由金属材料制成。 如图 1-图 4所示， 在所述封闭部 33由导电塑胶材料制成时， 所述封闭部 33可 以为一个单独的元件， 也可以与所述遮挡部 31—体成型， 通过注塑成型方式形 成于所述金属件 10上。
另外， 为减少电路板 20露铜面积给电路板 20上的器件更多布局空间， 封 闭部 33可以设置为单独金属件， 如图 5所示， 围设于电子器件 21周围的封闭 部 33均为单独的金属件。 如图 6所示， 围设于所述电子器件 21和电子器件 22 的封闭部 33均为单独的金属件。
通过所述金属件 10、 所述电路板 20、 所述遮挡部 31和所述封闭部 33 , 以 使得所述电子器件 21在一个屏蔽空间内， 防止所述电子器件 21产生的电磁波 对其它电子器件产生影响。 在所述电子器件 21工作时， 所述电子器件 21产生 的电磁波能够被所述遮挡部 31、 所述封闭部 33和所述金属件 10屏蔽， 以减少 或者避免所述电子器件 21产生的电磁波向外辐射， 防止对其它电子器件的工作 产生影响。 或， 所述金属件 10、 所述封闭部 33和所述电路板形成屏蔽空间， 以 使得电子器件 22在一个屏蔽空间内， 如图 1所示。
另外， 为了增加热传导效率， 所述导电塑胶材料可以选用导热系数 k 大于 lW/m-K的导热材料。
上述电子设备 100通过设置用于遮挡所述金属件 10上的通孔或槽 11的遮 挡部 31和围设于所述电子器件 21的周围， 且一端与所述金属件 10电气连接， 另一端与所述电路板 20电气连接的封闭部 33 , 由于所述电路板 20上设置有地 铜， 而所述封闭部 33由导电材料制成， 因此， 所述金属件 10、 所述电路板 20、 所述遮挡部 31和所述封闭部 33之间形成一所述电子器件 21所在的封闭空间， 所述金属件 10上产生的电磁波会通过所述封闭部 33传递到所述电路板 20的地 铜上导走， 从而形成一封闭所述电子器件 21的屏蔽空间， 以减少或者避免所述 电子器件 21产生的电磁波向外辐射， 防止对其它电子器件的工作产生影响。
由于上述电子设备 100中，所述金属件 10可以为金属冲压件或金属锻压件， 所述金属冲压件或者金属锻压件的厚度小于所述金属压铸件的厚度， 因此， 即 便在所述金属件 10上形成所述屏蔽件 30后， 所述金属件 10和所述屏蔽件 30 的厚度之和也小于所述金属压铸件与导电膜的厚度之和， 因此， 上述电子设备 100解决了现有技术中由于金属压铸件本身的厚度较厚，在所述压铸金属件的所 述孔或者槽上贴导电膜， 进一步增加了所述电子设备的厚度的技术问题。
另外， 由于所述金属冲压件或者金属锻压件与所述导电塑胶件结合， 相较 与原金属锻压件和普通塑胶结合， 不仅增强金属件与塑胶件的机械可靠性， 而 且， 釆用导电导热塑胶件的成本相对于所述普通绝缘导热塑胶的成本降低。
在具体实施方式中， 依靠塑胶的精确注塑和复杂成型性能， 可以做出导电 屏蔽腔或者隔离腔， 即， 所述遮挡部 31和所述封闭部 33 可以一次成型于所述 金属件 10上。 其中， 所述屏蔽件 30的各部分相对于所述金属件 10的厚度可以 不同， 在需要增强所述金属件 10某部分的强度时， 则需要在所述金属件 10的 该部分上注塑导电塑胶， 所述导电塑胶的厚度可以根据需要设置； 在所述电子 设备 100厚度方向的空间受到限制时， 在所述金属件 10上厚度受限的部分上可 以不注塑塑胶， 而不增加产品整体厚度。
在具体实施方式中， 请参阅图 1 , 在所述遮挡部 31位于所述电子器件 21和 所述金属件 10之间时， 为了增加所述遮挡部 31与所述金属件 10之间的结构结 合力， 所述屏蔽件 30还可包括与所述遮挡部 31连接的卡合部 32 , 所述卡合部 32卡合于所述通孔或槽 11内，从而增加所述遮挡部 31与所述金属件 10之间的 结构结合力， 增加所述遮挡部 31 的稳定性， 减少所述遮挡部 31与所述金属件 10分离的可能性。 其中， 所述遮挡部 31和所述卡合部 32可以一体成型， 当然 也可以为两个元件， 所述遮挡部 31和所述卡合部 32通过粘结的方式结合在一 起。
进一步地， 为了进一步增加所述遮挡部 31和所述卡合部 32与所述金属件 10之间的结构结合力，所述屏蔽件 30还包括与所述卡合部 32连接的固定部 34, 所述固定部 34和所述遮挡部 31分别设置于所述金属件 10的相对两侧， 所述固 定部 34的尺寸大于所述通孔或槽 11的尺寸。 其中， 所述遮挡部 31、 所述卡合 部 32和所述固定部 34可以一体成型， 当然所述遮挡部 31、 所述卡合部 32和所 述固定部 34也可以通过粘结的方式结合在一起。 通过在所述金属件 10的另一 侧设置尺寸大于所述通孔或槽 11的尺寸的所述固定部 34,从而防止所述屏蔽件 30从所述金属件 10上脱离， 增加所述屏蔽件 30的稳定性。
另外， 为增加所述封闭部 33与所述电路板 20之间的电气接触的稳定性， 具体地， 所述封闭部 33与所述电路板 20之间设置有所述导电弹性件 40。 所述 导电弹性件 40可以为导电弹片或导电泡棉等。 所述封闭部 33可以不直接与所 述电路板 20的地铜处接触， 而通过所述导电弹性件 40与所述地铜处接触。 其 中， 电路板 20的地铜可以为电路板 20表层的铜层。
上述电子设备 100通过设置用于遮挡所述金属件 10上的通孔或槽 11的遮 挡部 31和围设于所述电子器件 21的周围， 且一端与所述金属件 10电气连接， 另一端与所述电路板 20的地铜电气连接的封闭部 33。 由于所述电路板 20上设 置有地铜， 而所述封闭部 33由导电材料制成， 因此， 所述金属件 10、 所述电路 板 20、所述遮挡部 31和所述封闭部 33之间形成一所述电子器件 21所在的封闭 空间， 所述金属件 10上产生的电磁波会通过所述封闭部 33传递到所述电路板 20的地铜上导走， 从而形成一封闭所述电子器件 21的屏蔽空间， 以减少或者避 免所述电子器件 21产生的电磁波向外辐射， 防止对其它电子器件的工作产生影 响。
上述电子设备 100中， 所述金属件 10可以为金属冲压件或金属锻压件， 所 述金属冲压件或者金属锻压件的厚度小于所述金属压铸件的厚度， 因此， 即便 在所述金属件 10上形成所述屏蔽件 30后， 所述金属件 10和所述屏蔽件 30的 厚度之和也小于所述金属压铸件与导电膜的厚度之和， 因此， 上述电子设备 100 解决了现有技术中由于金属压铸件本身的厚度较厚， 在所述压铸金属件的所述 孔或者槽上贴导电膜， 进一步增加了所述电子设备的厚度的技术问题。
通过在所述通孔或槽 11 内形成与所述遮挡部 31连接的卡合部 32, 从而增 加所述遮挡部 31与所述金属件 10之间的结构结合力， 增加所述遮挡部 31的稳 定性， 减少所述遮挡部 31与所述金属件 10分离的可能性。
通过在所述金属件 10的另一侧设置尺寸大于所述通孔或槽 11 的尺寸的所 述固定部 34, 从而防止所述屏蔽件 30从所述金属件 10上脱离， 增加所述屏蔽 件 30的稳定性。
实施例二
基于同样的发明构思， 本申请还提供一种屏蔽件的制作方法， 如图 7所示， 为本发明实施方式屏蔽件的制作方法的流程图。 同时结合图 1 , 所述屏蔽件的制 作方法包括以下步骤：
步骤 210, 在金属件 10上开设通孔或槽 11 , 所述金属件 10可以为金属冲 压件或者金属锻压件；
步骤 220, 通过注塑成型方式釆用导电塑胶材料在所述金属件 10上形成遮 挡部 31 , 所述遮挡部 31用于遮挡所述通孔或槽 11 ;
步骤 230 , 通过金属或者导电塑胶材料形成用于围设电路板 20上的电子器 件 21的封闭部 33。
具体地， 所述方法还包括： 步骤 240, 通过注塑成型方式釆用塑胶材料在所 述通孔或槽 11内形成卡合部 32和与所述卡合部 32连接的固定部 34,所述固定 部 34和所述遮挡部 31分别设置于所述金属件 10的相对两侧， 所述固定部 34 的尺寸大于所述通孔或槽 11的尺寸。
进一步地， 在所述封闭部 33为导电塑胶材料制成时， 所述封闭部 33、 所述 遮挡部 31、 所述卡合部 32和所述固定部 34通过一次注塑成型于所述金属件 10 上。
具体地， 所述方法还包括： 步骤 250, 通过注塑成型方式釆用绝缘塑胶材料 在所述金属件 10上形成绝缘塑胶件， 用于天线设计。
上述屏蔽件的制作方法通过设置用于遮挡所述金属件 10 上的通孔或槽 11 的遮挡部 31和围设于所述电子器件 21的周围且一端与所述金属件 10接触另一 端与所述电路板 20接触封闭部 33。 由于所述电路板 20上设置有地铜， 而所述 封闭部 33 由导电材料制成， 因此， 所述金属件 10上产生的电磁波会通过所述 封闭部 33传递到所述电路板 20的地铜上导走， 从而形成一封闭所述电子器件 21的屏蔽空间， 以减少或者避免所述电子器件 21产生的电磁波向外辐射， 防止 对其它电子器件的工作产生影响。
由于上述电子设备 100 中， 所述金属冲压件或者金属锻压件的厚度小于所 述金属压铸件的厚度， 因此， 即便在所述金属件 10上形成所述屏蔽件 30后， 所述金属件 10和所述屏蔽件 30的厚度之和也小于所述金属压铸件与导电膜的 厚度之和， 因此， 上述电子设备 100现有技术中由于金属压铸件本身的厚度较 厚， 在所述压铸金属件的所述孔或者槽上贴导电膜， 进一步增加了所述电子设 备的厚度的技术问题。
尽管已描述了本发明的优选实施例， 但本领域内的技术人员一旦得知了基 本创造性概念， 则可对这些实施例作出另外的变更和修改。 所以， 所附权利要 求意欲解释为包括优选实施例以及落入本发明范围的所有变更和修改。 明的精神和范围。 这样， 倘若本发明的这些修改和变型属于本发明权利要求及 其等同技术的范围之内， 则本发明也意图包含这些改动和变型在内。

Claims

权 利 要 求
1、 一种电子设备， 其特征在于， 所述电子设备包括：
金属件， 所述金属件开设有通孔或槽， 所述金属件为金属冲压件或金属锻 压件；
电路板， 所述电路板上设置有电子器件；
屏蔽件， 所述屏蔽件包括遮挡部和封闭部， 所述遮挡部由导电塑胶材料制 成， 所述封闭部由金属或者导电塑胶材料制成， 所述遮挡部用于遮挡所述通孔 或槽， 所述封闭部围设于所述电子器件的周围， 且一端与所述金属件电气连接， 另一端与所述电路板的地铜电气连接；
所述金属件、 所述封闭部和所述电路板形成屏蔽空间， 所述电子器件位于 所述屏蔽空间内， 或， 所述金属件、 所述遮挡部、 所述封闭部和所述电路板形 成屏蔽空间， 所述电子器件位于所述屏蔽空间内。
2、 如权利要求 1所述的电子设备， 其特征在于， 所述电子设备还包括固定 于所述金属件上用于增强所述金属件的强度的增强部。
3、 如权利要求 2所述的电子设备， 其特征在于， 所述增强部与所述电子器 件相对设置。
4、 如权利要求 1-3中任一权利要求所述的电子设备， 其特征在于， 所述屏 蔽件还包括与所述遮挡部连接的卡合部， 所述卡合部卡合于所述通孔或槽内。
5、 如权利要求 4所述的电子设备， 其特征在于， 所述屏蔽件还包括与所述 卡合部连接的固定部， 所述固定部的尺寸大于所述通孔或槽的尺寸。
6、 如权利要求 1-5中任一权利要求所述的电子设备， 其特征在于， 所述封 闭部与所述电路板或者所述封闭部与所述金属件之间设置有导电弹性件。
7、 如权利要求 1-6中任一权利要求所述的电子设备， 其特征在于， 所述通 孔或槽与所述电子器件相对设置。
8、 如权利要求 1-7中任一权利要求所述的电子设备， 其特征在于， 所述导 电塑胶材料具体为导电导热塑胶。
9、 如权利要求 1-8中任一权利要求所述的电子设备， 其特征在于， 所述遮 挡部与所述金属件相背的表面上设置有绝缘层。
10、 如权利要求 1-9中任一权利要求所述的电子设备， 其特征在于， 所述所 述遮挡部与所述封闭部一体注塑成型， 或， 所述遮挡部、 所述封闭部与所述金 属件一体金属注塑成型。
11、 一种屏蔽件的制作方法， 其特征在于： 所述方法包括：
在金属件上开设通孔或槽， 所述金属件为金属冲压件或金属锻压件； 通过注塑成型方式釆用导电塑胶材料在所述金属件上形成遮挡部， 所述遮 挡部用于遮挡所述通孔或槽；
通过金属或者导电塑胶材料形成用于围设电路板上的电子器件， 且一端与 所述金属件电气连接， 另一端与所述电路板的地铜电气连接的封闭部， 以使得 所述电子器件在一个封闭的屏蔽空间内。
12、 如权利要求 11所述的方法， 其特征在于， 所述方法还包括： 通过注塑成型方式釆用塑胶材料在所述通孔或槽内形成卡合部和与所述卡 合部连接的固定部， 所述固定部的尺寸大于所述通孔或槽的尺寸。
13、 如权利要求 12所述的方法， 其特征在于， 在所述封闭部为导电塑胶材 料制成时， 所述封闭部、 所述遮挡部、 所述卡合部和所述固定部通过一次注塑 成型于所述金属件上。
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JP2016506762A JP6229215B2 (ja) 2014-03-13 2014-03-13 電子装置および遮蔽部材製造方法
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