WO2015111198A1

WO2015111198A1 - Optical wiring substrate, wiring method for same, and information-processing device employing same

Info

Publication number: WO2015111198A1
Application number: PCT/JP2014/051558
Authority: WO
Inventors: 松嶋　直樹; 中條　徳男; 里佳野村; 俊明高井
Original assignee: 株式会社日立製作所
Priority date: 2014-01-24
Filing date: 2014-01-24
Publication date: 2015-07-30

Abstract

　Provided is an optical wiring substrate which offers an optical wiring substrate having an improved wiring structure whereby a multitude of optical wiring sheets can be easily wired on a wiring substrate having LSI or other electronic components arranged thereon, and on which LSI or other electronic components, an optical module, and optical connectors are arranged, optical wiring of the optical modules and optical connectors being carried out using an optical wiring sheet, the optical wiring sheet being provided with a horizontal portion that is horizontal with respect to the substrate, a horizontal⇔vertical bent portion bent by 90° midway along the wiring, for transforming the wiring sheet surface from the horizontal to the vertical with respect to the substrate surface, a vertical portion that is vertical with respect to the substrate, and a vertical portion bent portion in which the wiring sheet surface is bent to the vertical with respect to the substrate surface.

Description

Optical wiring board, wiring method therefor, and information processing apparatus using the same

The present invention relates to an optical interconnect technology that uses light for data transmission within a substrate, and relates to an optical wiring substrate having an improved wiring structure of an optical wiring sheet.

In recent years, in information processing apparatuses such as servers and routers, there has been an increasing demand for high-speed data transmission within the apparatus and on the board, and the shift from conventional electrical transmission to optical transmission that enables higher-speed transmission is being made. is there.

In information processing apparatuses (servers, routers, transmission apparatuses, etc.), a plurality of circuit boards such as switch boards and interface boards mounted with LSIs such as switch LSIs, interface modules, and CPUs are attached to the backplane. A plurality of circuit boards are connected to the backplane via a backplane connector, and signal transmission between the circuit boards is performed. Also in the circuit board, signal transmission is performed between the LSI and the connector. Conventionally, electric transmission using electric wiring has been used for signal transmission in a circuit board. However, in electrical transmission, the loss of substrate wiring increases as the transmission speed increases, making it difficult to increase the speed. For this reason, use of light for signal transmission in a circuit board has been studied.

As a technique using optical interconnect technology for signal transmission in a circuit board, Patent Document 1 states “(Problem) Increasing the mounting density of an optical backplane and a circuit board. (Solution means) Provided on the circuit board. A photoelectric conversion module connected via a plurality of optical fibers, an optical connector provided at an end of the circuit board, an optical connector provided on the optical backplane and optically connected to the optical connector, The arrangement direction of the optical fibers on the end face of the photoelectric conversion module is substantially perpendicular to the main surface of the circuit board, the arrangement direction of the optical fibers on the end face of the optical connector, and the arrangement direction of the optical fibers on the end face of the optical connector, It is non-parallel to the main surface of the circuit board "(summary).

JP 2008-90232 A

In connection with the connection between the photoelectric conversion module and the optical connector on the circuit board via the optical fiber, the arrangement direction of the optical fibers on the end face of the photoelectric conversion module is substantially perpendicular to the main surface of the circuit board. It is described that the arrangement direction of the optical fibers at the end face is not parallel to the main surface of the circuit board. However, Patent Document 1 does not describe a configuration for wiring a large number of optical fibers while avoiding electronic components on a circuit board on which electronic components such as LSIs are arranged.

An object of the present invention is to provide an optical wiring board having an improved wiring structure and a wiring method therefor, in which a large number of optical wiring sheets can be easily wired on a wiring board on which electronic components such as LSIs are arranged. And

In order to achieve the above object, the present invention adopts the structure described in the claims.

The present invention includes a plurality of means for solving the above problems. To give an example of an optical wiring board, an electronic component such as an LSI, an optical module, and an optical connector are arranged, and the optical module and the optical module are arranged. An optical wiring board that performs optical wiring with a connector using an optical wiring sheet, wherein the optical wiring sheet is bent horizontally by 90 ° in the middle of the horizontal portion of the wiring and the wiring sheet surface with respect to the substrate surface. And a vertical folding portion that converts from horizontal to vertical, a vertical portion that is perpendicular to the substrate, and a vertical portion folding portion that is bent in a state in which the wiring sheet surface is perpendicular to the substrate surface.

In the optical wiring board of the present invention, the optical wiring sheet is provided with a protrusion or a gap in the lower optical wiring sheet in the vicinity of the horizontal and vertical bent portions, and an end of the upper optical wiring sheet is formed in the protrusion or the gap. It is preferable to maintain the bent state of the optical wiring sheet by the contact.

If an example of the wiring method of the optical wiring board of this invention is given, electronic components, such as LSI, an optical module, and an optical connector will be arrange | positioned, and the said optical module and the said optical connector will be optically wired with an optical wiring sheet | seat. A method for wiring an optical wiring board, comprising: preparing an optical wiring sheet in which individual optical wiring sheets each having a plurality of optical wirings arranged in parallel are laminated; ° bending, the wiring sheet surface is converted from horizontal to vertical with respect to the substrate surface, and the optical wiring sheet is bent and wired in a state where the wiring sheet surface is perpendicular to the substrate surface. .

According to the present invention, a large number of optical wiring sheets can be easily wired by bending the optical wiring sheet from horizontal to vertical in the middle of wiring.

Also, in the vicinity of the bent portion of the optical wiring sheet, the optical wiring sheet can be maintained in a bent state with a simple structure by providing a protrusion or a gap in the optical wiring sheet and fixing the upper optical wiring sheet.

It is a figure which shows the optical wiring board of Example 1 of this invention. It is a figure which shows an example of schematic structure of information processing apparatus. It is a figure (before bending) which shows the wiring method of the optical wiring board of Example 1 of this invention. It is a figure (after bending) which shows the wiring method of the optical wiring board of Example 1 of this invention. It is a figure which shows the wiring method of the optical wiring board of Example 1 of this invention (after vertical bending). It is a figure which shows the structure of an optical wiring sheet. It is a figure (before bending) which shows the wiring state of the optical wiring board of Example 1 of this invention. It is a figure (after bending) which shows the wiring state of the optical wiring board of Example 1 of this invention. It is a figure (before bending) which shows the optical wiring board of Example 2 of this invention. It is a figure (after bending) which shows the optical wiring board of Example 2 of this invention. It is a figure (before bending) which shows the modification of the optical wiring board of Example 2 of this invention. It is a figure (after bending) which shows the modification of the optical wiring board of Example 2 of this invention. It is a figure (before bending) which shows the optical wiring board of Example 3 of this invention. It is a figure (after bending) which shows the optical wiring board of Example 3 of this invention. It is a figure which shows the modification of the optical wiring board of this invention. It is a figure which shows the other modification of the optical wiring board of this invention. It is a figure which shows the optical wiring board of Example 4 of this invention. It is a figure which shows the optical wiring board of Example 5 of this invention.

FIG. 2 shows an example of an information processing apparatus to which the present invention is applied. As shown on the left side of the figure, the information processing apparatus is mounted with wiring boards such as a SW board 14 and an IF board 16 provided in the apparatus housing 10, and optical wiring and optical connectors for connecting the wiring boards. The backplane 12 is configured.

As shown in the enlarged view on the right side, a plurality of electronic components 22 such as LSIs are arranged on the optical wiring board 20. The optical module 24 and the optical connector 26 on the optical wiring board 20 are wired by a large number of optical wirings 28 such as optical fibers. Optical wiring is performed by incorporating the optical wiring board 20 into the backplane 12 and connecting the optical connector on the backplane side and the optical connector on the optical wiring board side.

Such an optical wiring board using the optical interconnect technology has the following problems.
(1) It is difficult to wire many optical fibers while avoiding electronic components on an optical wiring board.
(2) When an optical fiber passes over an electronic component such as an LSI, there are problems such as an obstacle to heat dissipation and interference with the electronic component.
(3) If the optical fiber is shaken by air-cooled wind, the transmission characteristics (jitter) may be degraded.

The present invention solves these problems, and an optical wiring board having an improved wiring structure capable of easily wiring a large number of optical wiring sheets on a wiring board on which electronic components such as LSIs are arranged. It is to provide.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. Note that components having the same function are denoted by the same names and reference numerals in the drawings for describing the embodiments, and repetitive description thereof is omitted.

FIG. 1 shows an optical wiring board according to a first embodiment of the present invention, where the left side is a top view and the right side is a side view.

In FIG. 1, a plurality of electronic components 22 such as LSIs are arranged on a wiring board 20. A plurality of optical modules 24 are arranged on the wiring board 20 and an optical connector is provided at an end of the wiring board. The optical connector 32 on the optical module side and the optical connector 31 on the backplane side are connected by an optical wiring sheet 30 in which a plurality of optical wirings such as optical fibers are bundled. As shown in the figure, a plurality of optical wiring sheets are laminated and wired.

In the present embodiment, on the optical module side, the optical wiring sheet 30 including the horizontal portion 33 that is horizontal to the substrate is bent at least 90 ° once in the middle of the wiring (horizontal ⇔ vertical bending portion 34). The sheet surface is set to be perpendicular to the substrate surface. Then, a bent portion is provided in the vertical portion 35 perpendicular to the substrate, and the optical wiring sheet 30 is disposed so as not to interfere with the electronic component 22 such as an LSI.

3A to 3C show a wiring method of the wiring sheet of the optical wiring board according to the first embodiment. FIG. 3A shows the optical wiring sheet 30 before horizontal → vertical bending. The optical wiring sheet 30 is configured by attaching an optical connector 1 (32) on the optical module side at one end and an optical connector 2 (31) on the backplane side at the other end, and laminating a plurality of optical wiring sheets. ing. As shown in the figure, the optical wiring sheet 30 is formed in a pattern bent 90 ° at the horizontal and vertical bent portions.
FIG. 3B shows the optical wiring sheet 30 after horizontal-vertical bending. The vertical portion 35 is formed by bending the optical wiring sheet 30 by 90 ° at the horizontal and vertical bent portions 34.
FIG. 3C shows the optical wiring sheet after the vertical portion is bent. On the wiring board, the optical wiring sheet is appropriately arranged by avoiding the electronic components by bending the vertical portion of the optical wiring sheet.

Fig. 4 shows various optical wiring sheets. In the optical wiring sheet of FIG. 4A, a plurality of optical wirings (optical fibers) 61 are attached in parallel with a resin 62, and sheets 63 are provided on the lower side and the upper side. The optical wiring sheet in FIG. 4B is obtained by attaching a plurality of optical wirings (optical fibers) 61 in parallel with a resin 62 on a sheet 63. In FIG. 4C, a plurality of optical wirings (optical fibers) 61 are attached in parallel with a resin 62 without using a sheet. As an optical fiber used for the optical wiring sheet, a multimode glass optical fiber can be used, and a single mode glass fiber or a plastic fiber can be used depending on the specification. As the sheet, a resin flexible sheet, for example, polyimide, PET, or the like can be used. As resin, what hardened | cured liquid resin, for example, an acrylic resin, an epoxy resin, etc. can be used.

According to this embodiment, an optical wiring sheet having a horizontal portion that is horizontal to the substrate is bent at least 90 ° in the middle of the wiring so that the wiring sheet surface is perpendicular to the substrate surface. Thus, the wiring of the optical wiring sheet can be facilitated, and the optical wiring sheet can be arranged so as not to interfere with the electronic components and not to interfere with the cooling air.

The optical wiring board according to Example 2 of the present invention is the same as the optical wiring board according to Example 1, but can maintain the bent state of the optical wiring sheet with a simple structure.

5A and 5B show the vicinity of the horizontal → vertical bent portion of the optical wiring sheet 30, FIG. 5A shows a state before bending, and FIG. 5B shows a state after bending. As shown in FIG. 5B, when a multilayer optical wiring sheet is bent, a reaction force is generated in the optical wiring sheet, that is, a force to restore is generated, and it becomes difficult to maintain the bent state.

This example solves this problem, and FIGS. 6A and 6B show an optical wiring board of Example 2. FIG. 6A shows a state before the optical wiring sheet is bent, and FIG. 6B shows a state after the bending.

As shown in FIG. 6A, a protrusion 41 is provided at the end of each optical wiring sheet 30 in the vicinity of the horizontal ⇒ vertical bent portion. When the optical wiring sheet 30 is bent, the end of the upper wiring sheet is brought into contact with the protrusion 41 of each optical wiring sheet, as shown in FIG. 6B. Then, the side opposite to the projection 41 of each optical wiring sheet is fixed at the inter-sheet fixing portion 43 by adhesion or the like. With this configuration, a force in the direction of bending acts on the vertically bent portion, and the vertically bent state can be maintained by a simple fixing method.

Note that the inter-sheet fixing portion 42 where the protrusion 41 of the wiring sheet abuts the end of the wiring sheet is also preferably fixed by adhesion. Moreover, various fixing means other than adhesion, such as using a fixing member such as a clip, can be used for fixing each optical wiring sheet of the inter-sheet fixing portion 43.

7A and 7B show a modification of the second embodiment. In this modification, the protrusion is formed by the optical wiring 48. Protrusions are formed by disposing at least one optical wiring on the upper layer or the lower layer of the optical wiring sheet 30. Then, the end of the upper wiring sheet is brought into contact with the protrusion formed by the optical wiring 48.

According to the present embodiment, the state where the optical wiring sheet is bent vertically can be maintained by a simple fixing method.

8A and 8B show an optical wiring sheet used for the optical wiring board of Example 3 of the present invention. Example 3 is a modification of the optical wiring sheet of Example 2 that maintains the bent state.

As shown in FIG. 8A, a gap 45 is provided at the end of each optical wiring sheet 30 in the vicinity of the horizontal → vertical bent portion. When the optical wiring sheet 30 is bent, as shown in FIG. 8B, the end portion of the upper wiring sheet is inserted and brought into contact with the gap 45 of each optical wiring sheet. Then, the side opposite to the gap 45 of each optical wiring sheet is fixed at the inter-sheet fixing portion 43 by adhesion or the like. With this configuration, the force in the direction of bending acts on the vertically bent portion, and the vertically bent state can be maintained by a simple fixing method.

In addition, various fixing means other than adhesion, such as using a fixing member such as a clip, can be used for fixing each wiring sheet of the inter-sheet fixing portion 43.

FIG. 9 shows another modification of the configuration for maintaining the bent state in the optical wiring sheet of the present invention. FIG. 9A shows the basic structure shown in Example 2 of FIG. In FIG. 9B, the protrusion 41 formed at the end of the optical wiring sheet has a wedge shape. By inserting the end portion of the upper optical wiring sheet into the wedge-shaped recess, the end portion can be securely held. FIG. 9C shows a U-shaped projection 41 formed at the end of the optical wiring sheet. By inserting the end portion of the upper optical wiring sheet into the U-shaped recess, the end portion can be reliably held. In FIG. 9D, a gap 45 is provided at the end of the lower optical wiring sheet, and a protrusion 41 that engages with the gap 45 is provided at the end of the upper optical wiring sheet. By inserting the protrusion 41 of the upper optical wiring sheet into the gap 45 of the lower optical wiring sheet, the end can be reliably held.
FIG. 10 shows another modification of FIG. In the modification of FIG. 10, the protrusion 48 is formed of an optical wiring, as in FIGS. 7A and 7B.

Also in this embodiment, the state where the optical wiring sheet is bent vertically can be maintained by a simple fixing method.

FIG. 11 shows an optical wiring sheet used for the optical wiring board of Example 4 of the present invention. In Example 4, the gap formation region is limited in the optical wiring board of Example 3.

In the optical wiring board of Example 3 in which the gap is formed at the end of the optical wiring sheet, the gap 45 is formed, so that it is bent vertically with a relatively simple structure as compared with the other examples in which the protrusions are formed. The state can be maintained. However, the holding of the end portion of the optical wiring sheet is gentler than in the other examples in which the protrusions are formed.

As shown in FIG. 11, the formation region 47 of the air gap 45 is limited between the horizontal and vertical

bent portions

34 and 36. With this configuration, the optical wiring sheet can be securely fixed without scattering the optical wiring.

FIG. 12 shows an optical wiring board of Example 5 of the present invention. In Example 5, a guide for bending the optical wiring sheet is provided.

Referring to FIG. 12, the horizontal ⇔ vertical bending portion 34 is provided with a ¼ cylindrical guide 51 for horizontal ⇔ vertical bending. The radius of the horizontal / vertical bending guide 51 has a value equal to or larger than the minimum bendable radius of the optical wiring. The optical wiring sheet is bent and fixed along the guide 51. The optical wiring sheet may be bonded to the guide by an adhesive.

Further, in the drawing, the vertical portion bending portion 36 is provided with a columnar guide 52 for bending the vertical portion. The radius of the guide 52 for bending the vertical portion is larger than the minimum bendable radius of the optical wiring.

According to the present embodiment, by providing the guide 51 for horizontal and vertical folding and the guide 52 for folding the vertical portion, it is possible to define the bending radius of the optical wiring sheet and ensure the characteristics and reliability of the optical wiring. it can.

DESCRIPTION OF SYMBOLS 10 Device housing | casing 12 Back plane 14 SW board 16 IF board 20 Optical wiring board 22 Electronic components 24, such as LSI Optical module 26 Optical connector 28 Optical wiring 30 Optical wiring sheet 31 Optical connector 2 (back plane side)
32 Optical connector 1 (optical module side)
33 Horizontal portion 34 Horizontal vertical folding portion 35 Vertical portion 36 Vertical bending portion 41 Projection 42 Inter-sheet fixing portion 43 Inter-sheet fixing portion 45 Air gap 47 Air gap formation area 51 Horizontal vertical vertical bending portion guide 52 Vertical portion bending portion guide 61 Optical wiring (optical fiber)
62 Resin 63 Sheet

Claims

An optical wiring board in which an electronic component such as an LSI, an optical module, and an optical connector are arranged, and the optical module and the optical connector are optically wired using an optical wiring sheet,
The optical wiring sheet has a horizontal part that is horizontal to the substrate, a 90 ° bend in the middle of the wiring, and a horizontal sheet vertical bending part that converts the wiring sheet surface from horizontal to vertical with respect to the substrate surface; An optical wiring board comprising: a vertical vertical part; and a vertical part bending part that is bent in a state where the wiring sheet surface is perpendicular to the substrate surface.
The optical wiring board according to claim 1,
The optical wiring sheet is characterized in that individual optical wiring sheets in which a plurality of optical wirings are arranged in parallel are laminated.
In the optical wiring board according to claim 1 or 2,
The optical wiring board is provided with a structure that maintains the bent state of the optical wiring sheet in the vicinity of the horizontal and vertical bent portions.
The optical wiring board according to claim 3,
The structure for maintaining the bent state of the optical wiring sheet is characterized in that a protrusion is provided on the lower optical wiring sheet, and an end of the upper optical wiring sheet is brought into contact with the protrusion.
The optical wiring board according to claim 4,
The protrusion is formed in a wedge shape.
The optical wiring board according to claim 4,
The protrusion is formed in a U-shape.
In the optical wiring board according to any one of claims 4 to 6,
An optical wiring board, wherein the protrusion is formed of an optical wiring.
The optical wiring board according to claim 3,
The structure for maintaining the bent state of the optical wiring sheet is an optical wiring board in which a gap is provided in a lower optical wiring sheet and an end portion of the upper optical wiring sheet is inserted into the gap.
The optical wiring board according to claim 8,
The gap is formed between the horizontal and vertical bent portions and the vertical bent portion.
The optical wiring board according to claim 1,
An optical wiring board characterized in that the horizontal fold vertical bending portion includes a horizontal fold vertical bending guide having a radius equal to or larger than a minimum bendable radius of the optical wiring.
The optical wiring board according to claim 1,
An optical wiring board comprising a guide for bending a vertical portion having a radius equal to or larger than a minimum bendable radius of the optical wiring in the vertical portion bending portion.
An information processing apparatus equipped with the optical wiring board according to any one of claims 1 to 11.
An optical wiring board wiring method in which an electronic component such as an LSI, an optical module, and an optical connector are arranged, and the optical module and the optical connector are optically wired with an optical wiring sheet,
Preparing an optical wiring sheet obtained by laminating individual optical wiring sheets in which a plurality of optical wirings are arranged in parallel;
Bending the optical wiring sheet by 90 ° in a horizontal and vertical bending portion, and converting the wiring sheet surface from horizontal to vertical with respect to the substrate surface;
Bending the optical wiring sheet with the wiring sheet surface perpendicular to the substrate surface and wiring;
A method for wiring an optical wiring board including:
In the wiring method of the optical wiring board according to claim 13,
The step of converting the wiring sheet surface from horizontal to vertical with respect to the substrate surface includes a step of bringing an end of the upper optical wiring sheet into contact with a protrusion provided on the lower optical wiring sheet. Wiring method for optical wiring board.
In the wiring method of the optical wiring board according to claim 13,
The step of converting the wiring sheet surface from horizontal to vertical with respect to the substrate surface includes the step of inserting an end portion of the upper optical wiring sheet into a gap provided in the lower optical wiring sheet. Wiring method for wiring board.