WO2015194463A1

WO2015194463A1 - Inkjet head, inkjet printing apparatus, and inkjet head manufacturing method

Info

Publication number: WO2015194463A1
Application number: PCT/JP2015/066963
Authority: WO
Inventors: 裕一町田
Original assignee: コニカミノルタ株式会社
Priority date: 2014-06-19
Filing date: 2015-06-12
Publication date: 2015-12-23
Also published as: JPWO2015194463A1; JP6421820B2

Abstract

Provided is an inkjet head with which the wiring spacing can be widened without enlarging the inkjet head circuit board and which is capable of stable connections when connecting the circuit board with a connection substrate using pressurization. An inkjet head, which is provided with multiple nozzles for discharging ink, multiple piezoelectric elements that serve as driving sources for discharging the ink from the nozzles, and a circuit board (50) with wiring for supplying electricity to the multiple piezoelectric elements, is characterized: in having connection terminals (501), which are provided on both surfaces of the circuit board (50) for connecting connection substrates (4) using pressurization; and in the connection terminals (501) being provided at positions that overlie each other on the front surface and back surface of the circuit board (50).

Description

Ink jet head, ink jet recording apparatus, and method of manufacturing ink jet head

The present invention relates to an inkjet head, an inkjet recording apparatus, and a method for manufacturing an inkjet head.

2. Description of the Related Art Conventionally, an ink jet recording apparatus that forms an image on a recording medium by discharging ink from a plurality of fine nozzles provided in an ink jet head is known.
In recent years, in order to meet the demand for higher accuracy of images formed by inkjet recording devices and higher printing speeds, only recording media can be transported using a line head in which a plurality of inkjet heads are arranged in a staggered pattern. There has been proposed a one-pass drawing method in which drawing is performed with the.

As a form of the ink jet head used for such a line head, for example, a method is known in which the nozzle interval is reduced in the ink jet head and the nozzles are two-dimensionally arranged with high density (Patent Document 1).

Republished patent WO2011 / 068006

However, if nozzles are arranged at a high density in the ink jet head, the number of wirings increases, resulting in a problem that the wiring interval is narrowed and the wiring reliability is lowered. In addition, as the wiring density increases, the number of connection terminals that connect the wiring board of the inkjet head and the flexible printed circuit board as the connection board to the drive unit also increases. For this reason, when the nozzles are arranged at a high density, there arises a problem that the pitch of the connection terminals becomes narrow, and further, the positioning of the connection terminals becomes difficult. In addition, when pressure is applied to the connection terminal, for example, when an anisotropic conductive film (ACF) is electrically connected by thermocompression bonding between the wiring board and the flexible printed board, the wiring board and the flexible printed board are It becomes difficult to stably connect the substrate.

The present invention has been made in view of such problems, and an object of the present invention is to perform wiring without enlarging the wiring substrate of the ink jet head even when the nozzles are arranged at high density in the ink jet head. An object is to provide an ink jet head, an ink jet recording apparatus, and a method for manufacturing the ink jet head that can be stably connected when the interval is widened and the wiring board and the connection board are connected by pressure.

In order to solve the above problems, the invention described in claim 1
A plurality of nozzles for discharging ink, a plurality of pressure generating means serving as drive sources for discharging ink from the nozzles, and a wiring board having wiring for supplying power to the plurality of pressure generating means, In the inkjet head provided,
Provided on both sides of the wiring board, having a connection part for connecting the connection board by pressure,
The connection portion is provided at a position where the front surface and the back surface of the wiring board overlap each other.

The invention according to claim 2 is the ink jet head according to claim 1,
The connection board is connected to the connection portion via an anisotropic conductive film.

The invention according to claim 3 is the inkjet head according to

claim

1 or 2,
The connection portion is provided at an end portion of the wiring board.

The invention according to claim 4 is the inkjet head according to claim 3,
The connection part is provided at both ends of the wiring board.

The invention according to claim 5 is the inkjet head according to claim 4,
The plurality of nozzles are divided and arranged in a plurality of nozzle formation areas,
For each nozzle formation area, the wiring is connected to the connection portion at the end portion closer to the nozzle formation area among the connection portions provided at both ends of the wiring board. And

The invention described in claim 6 is the inkjet head according to any one of claims 1 to 5,
In the connection part, when the pattern of the connection part provided on the front surface and the back surface of the wiring substrate is viewed in plan, it is the same pattern and overlaps.

The invention according to claim 7 is the inkjet head according to any one of claims 1 to 6,
The connection board is a flexible printed board.

The invention according to claim 8 is the inkjet head according to any one of claims 1 to 7,
The connection portion has a row of connection terminals arranged in a predetermined direction,
The connection terminal on the back surface is provided at a position overlapping the connection terminal on the front surface in the predetermined direction,
The nozzle corresponding to the connection terminal on the back surface is arranged at a position not overlapping with the nozzle corresponding to the connection terminal on the front surface in the predetermined direction.

The invention according to claim 9 is the inkjet head according to any one of claims 1 to 8,
The wiring board includes a through hole for wiring for passing the wiring through the opposite side of the wiring board.

The invention according to claim 10 is the inkjet head according to any one of claims 1 to 9,
The wiring board includes an ink channel through hole for supplying ink to the nozzle.

The invention according to claim 11 is the inkjet head according to any one of claims 1 to 10,
A nozzle substrate on which the plurality of nozzles are formed;
A pressure chamber substrate in which a plurality of pressure chambers respectively communicating with the plurality of nozzles are formed;
A diaphragm constituting a wall surface of the plurality of pressure chambers;
A common ink chamber for storing ink to be supplied to the plurality of pressure chambers;
A spacer substrate provided between the wiring board and the diaphragm;
With
The nozzle surface of the nozzle substrate is parallel to the wiring substrate,
The pressure generating means is a piezoelectric element,
The piezoelectric element is disposed at a position corresponding to the plurality of pressure chambers, and displaces the diaphragm to cause a pressure change in the pressure chambers, thereby ejecting ink from the nozzles. And

The invention according to claim 12 is the inkjet recording apparatus,
An ink jet head according to any one of claims 1 to 11 is provided.

A thirteenth aspect of the present invention is the ink jet head manufacturing method according to any one of the first to eleventh aspects,
The connection board is connected to the connection part on one side with respect to the wiring board.

According to the present invention, even when the nozzles are arranged at a high density in the inkjet head, by using both sides of the wiring board, the wiring interval can be widened without increasing the wiring board. Furthermore, the wiring board can be made smaller by providing the connecting portions at positions overlapping with both surfaces of the wiring board and connecting the wiring board and the connection board. Further, when the connection board is connected to the wiring board by pressure, the pressure applied by the overlapping of the connection portions can be made uniform, and the wiring board and the connection board can be stably connected.

1 is a perspective view illustrating a schematic configuration of an ink jet recording apparatus. It is a perspective view of an inkjet head. It is sectional drawing of the principal part of an inkjet head. It is sectional drawing of an ink discharge part provided with the penetration electrode in a laminated substrate. It is sectional drawing of the ink discharge part which is not provided with the penetration electrode in a laminated substrate. It is a schematic diagram explaining the positional relationship in the Z direction of the structure of a laminated substrate. It is a bottom view of a nozzle substrate. It is sectional drawing of the principal part of the inkjet head which shows the positional relationship of a nozzle formation area. It is a top view of the wiring board edge part which shows arrangement | positioning of the connection terminal of a wiring board. It is a bottom view of a wiring board end part showing arrangement of a connection terminal of a wiring board. It is a figure for demonstrating the connection of a wiring board and a flexible printed circuit board, and is sectional drawing of the edge part vicinity of a wiring board. It is a figure explaining the time of arrange | positioning an anisotropic conductive film in the connection method of a wiring board and a flexible printed circuit board. It is a figure explaining the time of pressing the lower surface of a wiring board in the connection method of a wiring board and a flexible printed circuit board. It is a figure explaining the time of pressing the upper surface of a wiring board in the connection method of a wiring board and a flexible printed circuit board.

[Outline of inkjet recording apparatus]
As shown in FIG. 1, the ink jet recording apparatus 100 includes a platen 101 that supports a recording medium K. A transport roller 102 for transporting the recording medium K is provided before and after the platen 101. When the transport roller 102 is driven, the recording medium K is transported from the rear to the front while being supported by the platen 2. Is done.

Above the platen 101, long line heads 103, 104, 105, 106 extending in a direction orthogonal to the transport direction are provided in parallel from the upstream side to the downstream side in the transport direction. The line heads 103, 104, 105, and 106 are provided with at least one inkjet head 1 to be described later. For example, cyan (C), magenta (M), yellow (Y), and black (K). Are discharged toward the recording medium K.

[Configuration of inkjet head]
The configuration of the inkjet head 1 will be described with reference to FIGS. 2 and 3. In the following description, a plane provided with a plurality of nozzles 11 is defined as an XY plane, and directions along the plane and orthogonal to each other are defined as an X direction and a Y direction, respectively. The direction orthogonal to the XY plane is taken as the Z direction.
The inkjet head 1 is provided with a laminated substrate 2 in which a plurality of nozzles 11 for discharging ink are arranged in the X direction and the Y direction. The multilayer substrate 2 is formed by laminating a plurality of substrates in the Z direction so that the nozzle substrate 10 located at the bottom of the multilayer substrate 2 and the wiring substrate 50 located at the top are parallel to each other. Has been placed. A common ink chamber 3 that supplies ink to the plurality of nozzles 11 is disposed on the upper surface of the multilayer substrate 2, and the multilayer substrate 2 and the common ink chamber 3 are supported by a holding plate 90. Then, ink is supplied from the common ink chamber 3 to the

ink discharge portions

7 and 8 provided on the laminated substrate 2, and the piezoelectric element 42 as the pressure generating means provided in the

ink discharge portions

7 and 8 is displaced, whereby the ink Is pressurized, and ink droplets are ejected from the nozzle 11.
In addition, a wiring board 50 for supplying power to the piezoelectric element 42 is provided on the uppermost part of the multilayer substrate 2, and a first electrode via a through electrode 55 is provided on the upper surface of the wiring board 50 corresponding to each nozzle 11. A second wiring 58 is provided on the lower surface of the wiring 57 or the wiring substrate 50. The first wiring 57 and the second wiring 58 are connected to the flexible printed circuit board 4 as a connection board at connection terminals 501 (see FIG. 9) as connection parts provided at both ends of the wiring board 50. Electricity is supplied from the drive unit 5 connected to the flexible printed circuit board 4 to the piezoelectric element 42 through the flexible printed circuit board 4 and the first wiring 57 or the second wiring 58. Here, the flexible printed circuit board 4 connected to the lower surface of the wiring board 50 is routed to the upper surface of the holding board 90 from the through hole of the holding board 90 opened near the end of the wiring board 50 in the X direction.

[Configuration of ink ejection unit]
As shown in FIGS. 4 and 5, the

ink discharge portions

7 and 8 include two ink discharge portions, an ink discharge portion 7 having a through electrode 55 on the wiring substrate 50 and an ink discharge portion 8 having no through electrode 55 on the wiring substrate 50. It has a form.
In the following description, the ink discharge unit 7 will be described in detail first, and only the differences between the ink discharge unit 8 and the ink discharge unit 8 will be described later.
For the convenience of describing the positional relationship in the Z direction of the ink discharge unit 7, FIG. 6 illustrates a pressure chamber 311 and an inlet 512, which will be described later, indicated by solid lines.

As shown in FIG. 4, the ink discharge unit 7 has a six-layer structure including a nozzle substrate 10, a bonding substrate 20, a pressure chamber substrate 30, a spacer substrate 40, a wiring substrate 50, and an adhesive layer 60 in order from the lower side in the Z direction. Has been.

The nozzle substrate 10 is a silicon substrate and is located in the lowermost layer of the ink discharge unit 7. A plurality of nozzles 11 are formed on the nozzle substrate 10, and the lower surface of the nozzle substrate 10 is a nozzle surface.

The bonding substrate 20 is a glass substrate, and is laminated and bonded to the upper surface of the nozzle substrate 10. The bonding substrate 20 is formed with a through hole 201 that communicates with the nozzle 11 of the nozzle substrate 10 and penetrates in the Z direction, which is the stacking direction.

The pressure chamber substrate 30 includes a pressure chamber layer 31 and a diaphragm 32.
The pressure chamber layer 31 is a silicon substrate and is laminated and bonded to the upper surface of the bonding substrate 20. In the pressure chamber layer 31, a pressure chamber 311 that applies ejection pressure to the ink ejected from the nozzle 11 is formed so as to penetrate the pressure chamber layer 31 in the Z direction. The pressure chamber 311 is provided above the through hole 201 and the nozzle 11 and communicates with the through hole 201 and the nozzle 11. In addition, a communication hole 312 communicating with the pressure chamber 311 is formed in the pressure chamber layer 31 so as to extend in the horizontal direction while penetrating the pressure chamber layer 31 in the Z direction (see FIG. 6).
The diaphragm 32 is laminated and bonded to the upper surface of the pressure chamber layer 31 so as to cover the opening of the pressure chamber 311. That is, the diaphragm 32 constitutes the upper wall portion of the pressure chamber 311. An oxide film is formed on the surface of the diaphragm 32. The diaphragm 32 is formed with a through hole 321 that communicates with the communication hole 312 and penetrates in the Z direction.

The spacer substrate 40 is a substrate made of 42 alloy and is a partition layer that is laminated on the upper surface of the diaphragm 32 and forms a space 41 between the diaphragm 32 and the wiring substrate 50. The space 41 is formed above the pressure chamber 311 so as to penetrate the spacer substrate 40 in the Z direction, and accommodates the piezoelectric element 42 therein.
The piezoelectric element 42 is formed in substantially the same plan view shape as the pressure chamber 311 and is provided at a position facing the pressure chamber 311 with the diaphragm 32 interposed therebetween (see FIG. 6). The piezoelectric element 42 is an actuator made of PZT (lead zirconium titanate) for deforming the diaphragm 32. The piezoelectric element 42 is provided with two

electrodes

421 and 422 on the upper surface and the lower surface, and the electrode 422 on the lower surface side is connected to the diaphragm 32.
In addition, a through hole 401 that communicates with the through hole 321 of the diaphragm 32 and penetrates in the Z direction is formed in the spacer substrate 40 independently of the space 41.

The wiring board 50 includes an interposer 51 that is a silicon substrate. The lower surface of the interposer 51 is covered with two layers of insulating

layers

52 and 53 of silicon oxide, and the upper surface is also covered with an insulating layer 54 of silicon oxide. The insulating layer 53 positioned below the insulating

layers

52 and 53 is laminated on the upper surface of the spacer substrate 40 and bonded thereto.
A through hole 511 that penetrates in the Z direction is formed in the interposer 51, and the through electrode 55 is inserted into the through hole 511. One end of a third copper wiring 56 extending in the horizontal direction is connected to the lower end of the through electrode 55, and the other end of the third wiring 56 is provided on the electrode 421 on the upper surface of the piezoelectric element 42. The stud bump 423 is connected via the solder 561 exposed in the space 41. A first wiring 57 is connected to the upper end of the through electrode 55. The first wiring 57 extends in the horizontal direction and is connected to the flexible printed board 4 (see FIG. 3). The third wiring 56 is sandwiched and protected by two insulating

layers

52 and 53 on the lower surface of the interposer 51.
Although the third wiring 56 is made of copper, the material can be appropriately changed as long as it is a conductor. For example, aluminum may be used.
The interposer 51 is formed with an inlet 512 that communicates with the through hole 401 of the spacer substrate 40 and penetrates in the Z direction. The inlet 512 is formed to have a smaller cross-sectional area than any of the communication hole 312 communicating with the inlet 512, the through holes 321 and 401, and the through hole 601 of the adhesive layer 60 described later. Note that each portion of the insulating layers 52 to 54 covering the vicinity of the inlet 512 is formed to have an opening diameter larger than that of the inlet 512.

The adhesive layer 60 is laminated and bonded to the upper surface of the insulating layer 54 of the interposer 51 while covering the first wiring 57 disposed on the upper surface of the wiring substrate 50. The adhesive layer 60 is a photosensitive resin layer that adheres the upper common ink chamber 3 to the ink discharge portion 7 and is a protective layer that protects the first wiring 57.
The adhesive layer 60 has a through hole 601 that communicates with the inlet 512 and penetrates in the Z direction.

Here, the communication hole 312, the through holes 321, 401, and 601 and the inlet 512 constitute an individual flow path 70 that communicates the common ink chamber 3 and the pressure chamber 311.

Next, the configuration of the ink discharge unit 8 will be described with reference to FIG. Since only the configuration of the wiring substrate 50 is different from the ink ejection unit 7, only the wiring substrate 50 will be described, and the other components are denoted by the same reference numerals, and the description thereof is omitted.

layers

52 and 53 is laminated on the upper surface of the spacer substrate 40 and bonded thereto.
A third wiring 56 extends horizontally on the lower surface of the interposer 51 and is sandwiched and protected by two insulating

layers

52 and 53 on the lower surface of the interposer 51. A stud bump 423 provided on the electrode 421 on the upper surface of the piezoelectric element 42 is connected to one end of the third wiring 56 via solder 561 exposed in the space 41. A second wiring is connected to the other end of the third wiring 56, and the second wiring 58 extends in the horizontal direction and is connected to the flexible printed circuit board 4 (see FIG. 3).

In the

ink ejection units

7 and 8 having the above-described configuration, the ink in the common ink chamber 3 is supplied to the pressure chamber 311 through the individual flow path 70. A voltage is applied between the

electrodes

421 and 422 through the third wiring 56 by the first wiring 57 or the second wiring 58 connected to the flexible printed circuit board 4 in accordance with a driving signal from the driving unit 5. , 422 is deformed together with the vibration plate 32, the ink in the pressure chamber 311 is pushed out and ejected from the nozzle 11.

[Nozzle arrangement]
As shown in FIG. 7, the nozzle 11 forms four parallelogram-shaped nozzle formation areas N1 to N4 on the nozzle substrate 10, and a matrix along the direction of each side of the parallelogram in each nozzle formation area. Are arranged side by side. Note that two sides of the parallelogram are parallel to the Y direction, this direction is the first direction, and the remaining two sides are non-parallel to the Y direction and are somewhat inclined with respect to the X direction. This direction will be described below as the second direction.

The nozzle formation areas N1 to N4 are long parallelograms along the Y direction, have the same direction and size, and the same number of nozzles 11 are provided in each area. The nozzle formation areas N1 to N4 are formed on the nozzle substrate 10 in the order of N1, N4, N2, and N3 in this order from the upstream side in the X direction, and N1, N1 toward the downstream side in the Y direction. N2, N3 and N4 are arranged slightly shifted in order. All the nozzles 11 provided on the nozzle substrate 10 are arranged so as to be slightly shifted with respect to the first direction (Y direction).

The number of nozzles 11 is n (for example, n = 32) in the first direction and m (for example, m = 8) in the second direction, and the nozzles 11 are arranged in the nozzle formation areas N1 to N4. They are arranged in a predetermined order along the one direction and the second direction.

[Wiring of nozzle formation area]
As shown in FIG. 8, the nozzle formation areas N1 to N4 in the inkjet head 1 are arranged so as to be N1, N4, N2, and N3 from the upstream side in the X direction. Further, each of the nozzle formation areas N1 to N4 is wired at the end of the wiring board 50 closer to each nozzle formation area. Specifically, N1 and N4 are upstream in the X direction, and N2 and N3. Are wired downstream in the X direction, connected to the flexible printed circuit board 4, and finally connected to the drive unit 5.

More specifically, the nozzle formation areas N1 and N3 are nozzle formation areas provided on both end sides of the nozzle substrate 10, and are wired from the second wiring 58 on the lower surface of the wiring substrate 50, where N1 is the right side and N3 is the right side. Wired on the left side and connected. The nozzle formation areas N2 and N4 are nozzle formation areas provided on the central portion side of the nozzle substrate 10, and are wired from the first wiring 57 on the upper surface of the wiring substrate 50 through the through electrode 55, and N4 is on the right side. , N2 are wired and connected on the left side.
For convenience of explanation, FIG. 8 shows a diagram in which only one upper portion is penetrated in the nozzle formation areas N2 and N4. The through electrodes 55 are provided one by one, and are wired through the wiring board 50 one by one corresponding to each nozzle 11.

[Placement of connection terminals]
The arrangement of the connection terminals 501 at both ends of the wiring board 50 will be described. The wiring board 50 is connected to the flexible printed board 4 by the connection terminal 501 and is connected to the driving unit 5.
As shown in FIG. 9A, the connection terminals 501 are provided along the Y direction in the direction in which the connection terminals 501,... ing. Similarly, as shown in FIG. 9B, connection terminals 501,... Are provided on the lower surface of the right end portion of the wiring board 50, and the connection terminals 501,. On the other hand, they are provided in the same pattern and in an overlapping position when viewed in plan.

Each of the connection terminals 501,... Is connected to the first wiring 57 or the second wiring 58, and is connected to the piezoelectric element 42 in the nozzle formation area N4. Specifically, the connection terminals 501,... Provided on the upper surface on the upstream side in the X direction of the wiring board 50 are connected to the piezoelectric elements 42 in the nozzle formation area N4 through the first wiring 57, respectively. Further, the connection terminals 501,... Provided on the lower surface on the upstream side in the X direction of the wiring substrate 50 are connected to the piezoelectric elements 42 in the nozzle formation area N1 through the second wiring 58, respectively.
Here, since the nozzles 11 provided on the nozzle substrate 10 are slightly shifted from each other with respect to the Y direction, one connection terminal 501 provided on the upper surface of the wiring substrate 50 on the upstream side in the X direction The connection terminals 501 on the lower surface provided at the overlapping positions are connected to the piezoelectric elements 42 corresponding to the nozzles 11 slightly shifted in the Y direction. The

piezoelectric elements

42 and 42 are wired to

connection terminals

501 and 501 arranged at positions overlapping in the Y direction on the upper surface and the lower surface of the wiring substrate 50 by the first wiring 57 and the second wiring 58.
In the above description, the upstream side in the X direction of the wiring board 50 has been described, but the downstream side in the X direction has the same configuration. Specifically, on the downstream side in the X direction, the terminals 501,... Provided on the upper surface of the wiring board 50 are connected to the piezoelectric elements 42 in the nozzle formation area N2 through the first wiring 57, respectively. Terminals 501,... Provided on the lower surface of the substrate 50 are connected to the piezoelectric elements 42 in the nozzle formation area N3 through the second wiring 58, respectively.

The number of connection terminals 501,... At both ends of the wiring board 50 is the same as the number of piezoelectric elements 42 in the nozzle formation area per unit. Specifically, for example, as described in the example of FIG. 7, when m × n nozzles 11 are provided in each nozzle formation area, the number of connection terminals 501,. .

As shown in FIG. 10, the wiring board 50 and the flexible printed circuit board 4 are provided on the connection terminals 501 provided on both surfaces of the wiring board 50 and on the upper and lower surfaces of the wiring board 50, and on the surface of the flexible printed circuit board 4. The connection terminal 401 provided is connected by thermocompression bonding with an anisotropic conductive film (ACF).

As described above, the connection terminals 501 of the wiring board 50 are provided so as to have the same interval, and the arrangement pattern of the connection terminals 501 of the wiring board 50 and the connection terminals 401 of the flexible printed circuit board 4 are provided. The arrangement pattern is the same.

[Connection method of wiring board and flexible printed circuit board]
A method for connecting the wiring board 50 and the flexible printed board 4 will be described with reference to FIG. First, the anisotropic conductive film 80 is arrange | positioned between the connection terminal 501 of the wiring board 50, and the connection terminal 401 of the flexible printed circuit board 4 (FIG. 11A). Next, on the lower surface side of the wiring substrate 50, pressure is applied from the upper side of the wiring substrate 50 and from the lower side of the flexible printed circuit board 4 to perform thermocompression bonding, and the connection terminals 501 on the lower surface of the wiring substrate 50 are connected to the flexible printed circuit board. The connection terminal 401 on the upper surface of the substrate 4 is connected (FIG. 11B). Next, on the upper surface of the wiring board 50, thermocompression bonding is performed by applying pressure from the upper side of the upper flexible printed board 4 and the lower side of the flexible printed board 4 on the lower side of the wiring board 50. The connection terminal 501 on the upper surface is connected to the connection terminal 401 on the lower surface of the flexible printed circuit board 4 (FIG. 11C). The flexible printed circuit board 4 is connected to both surfaces of the wiring board 50 through such a series of steps.

[Technical effects in this embodiment]
As described above, even when the nozzles 11 are arranged at a high density in the inkjet head 1, by using both surfaces of the wiring board 50, the wiring interval can be increased without increasing the wiring board 50. . Further, the wiring board 50 can be made smaller by providing the connection terminals 501 at positions overlapping the both surfaces of the wiring board 50 to connect the wiring board 50 and the flexible printed board 4.

Further, the connection terminals 501,... Are provided on the front and back surfaces of the wiring board 50 at positions overlapping when viewed in plan, and the connection is made when the flexible printed board 4 is pressed and connected to the wiring board 50. The pressure applied by overlapping the positions of the terminals 501 can be made uniform, and the wiring board 50 and the flexible printed board 4 can be stably connected.

Further, the nozzle 11 is divided and arranged in nozzle formation areas N1 to N4. For each nozzle formation area, the connection terminals 501 provided at both ends of the wiring board 50 are close to the respective nozzle formation areas. Since the wiring is connected to the connection terminal 501 at the other end, both surfaces of the wiring board 50 can be used efficiently, and the wiring can be simplified and the wiring interval can be widened.

Further, since the flexible printed board 4 is used as the connection board, the wiring board 50 can be bent and the wiring can be drawn out in a direction perpendicular to the wiring board 50.

[Others]
Although the arrangement of the nozzles 11 is divided into four parallelogram-shaped nozzle formation areas on the nozzle substrate 10, the shape and number of the nozzle formation areas can be changed as appropriate. For example, eight nozzle formation areas may be provided so that two are connected to both ends and both surfaces of the wiring board 50.
Further, the arrangement of the nozzles 11 can be appropriately changed. For example, the nozzles 11 may be arranged so that the first direction and the second direction are orthogonal to each other.

In addition, the same number of connection terminals 501 provided on the wiring board 50 as the number of nozzles 11 provided in each nozzle area is provided. However, if the number of connection terminals 501 provided on the wiring board 50 is larger, the number of connection terminals 501 The number can be changed as appropriate. Here, by increasing the number of connection terminals 501, it can be used as a backup when there is a defective connection terminal 501. However, if the number of the connection terminals 501 increases, the interval between the connection terminals 501 becomes narrow, and as described above, it becomes difficult to connect stably. Therefore, the number of connection terminals 501 and the corresponding number on the nozzle substrate 10 are reduced. It is desirable that the number of nozzles 11 is not greatly different.

Further, the first wiring 57 and the second wiring 58 are not particularly limited to the wiring method as long as each piezoelectric element 42 can be connected to each connection terminal 501, and can be appropriately designed. However, since the wiring substrate 50 is provided with the individual flow path 70 as the ink flow path, it is necessary to perform wiring so as to avoid the individual flow path 70.

In addition, although the flexible printed circuit board 4 is used as the connection board to the drive unit 5, a rigid board may be used. If a rigid board is used, the connection board can be thermocompression bonded more stably.

Further, although the piezoelectric element 42 is used as the pressure generating means, there is no particular limitation as long as it has a mechanism capable of ejecting ink. For example, thermal (electrothermal conversion element) may be used. .

In addition, the anisotropic conductive film is used when connecting the wiring board 50 and the flexible printed circuit board 4, but the method can be appropriately changed as long as the connection can be made by applying pressure. Alternatively, a conductive adhesive may be used.

Further, in the method of connecting the wiring board 50 and the flexible printed board 4, the thermocompression bonding is performed twice on the lower surface and the upper surface of the wiring substrate 50, but both surfaces can be simultaneously performed. However, when both of them are thermocompression bonded at the same time, positioning of the flexible printed circuit board 4 becomes difficult, and if the position is shifted, connection failure occurs. Therefore, in order to connect more stably, it is desirable to connect one side at a time. .

Furthermore, the scope of the present invention is not limited to the above, and various improvements and design changes may be made without departing from the spirit of the present invention.

The present invention can be used in an ink jet head, an ink jet recording apparatus, and a method of manufacturing an ink jet head.

1 Inkjet head 3 Common ink chamber 4 Flexible printed circuit board (connection board)
DESCRIPTION OF SYMBOLS 10 Nozzle board | substrate 11 Nozzle 30 Pressure chamber board | substrate 32 Diaphragm 40 Spacer board | substrate 42 Piezoelectric element (pressure generation means)
50 Wiring board 80 Anisotropic conductive film 100 Inkjet recording apparatus 501 Connection terminal (connection part)
511 Through hole (through hole for wiring)
601 Through hole (through hole for ink flow path)
N1 to N4 nozzle formation area

Claims

A plurality of nozzles for discharging ink, a plurality of pressure generating means serving as drive sources for discharging ink from the nozzles, and a wiring board having wiring for supplying power to the plurality of pressure generating means, In the inkjet head provided,
Provided on both sides of the wiring board, having a connection part for connecting the connection board by pressure,
The inkjet head according to claim 1, wherein the connection portion is provided at a position where the front surface and the back surface of the wiring board overlap each other.
2. The inkjet head according to claim 1, wherein the connection substrate is connected to the connection portion via an anisotropic conductive film.
3. The ink jet head according to claim 1, wherein the connecting portion is provided at an end portion of the wiring board.
4. The ink jet head according to claim 3, wherein the connection portion is provided at both ends of the wiring board.
The plurality of nozzles are divided and arranged in a plurality of nozzle formation areas,
For each nozzle formation area, the wiring is connected to the connection portion at the end portion closer to the nozzle formation area among the connection portions provided at both ends of the wiring board. The inkjet head according to claim 4.
6. The connection portion according to claim 1, wherein the connection portion patterns provided on the front surface and the back surface of the wiring board are in the same pattern and overlap when viewed in plan. The inkjet head according to one item.
The inkjet head according to any one of claims 1 to 6, wherein the connection substrate is a flexible printed circuit board.
The connection portion has a row of connection terminals arranged in a predetermined direction,
The connection terminal on the back surface is provided at a position overlapping the connection terminal on the front surface in the predetermined direction,
The nozzle corresponding to the connection terminal on the back surface is arranged at a position not overlapping with the nozzle corresponding to the connection terminal on the front surface in the predetermined direction. Inkjet head.
The inkjet head according to any one of claims 1 to 8, wherein the wiring board includes a wiring through-hole for passing the wiring through the opposite side of the wiring board.
The inkjet head according to any one of claims 1 to 9, wherein the wiring board includes an ink channel through hole for supplying ink to the nozzle.
A nozzle substrate on which the plurality of nozzles are formed;
A pressure chamber substrate in which a plurality of pressure chambers respectively communicating with the plurality of nozzles are formed;
A diaphragm constituting a wall surface of the plurality of pressure chambers;
A common ink chamber for storing ink to be supplied to the plurality of pressure chambers;
A spacer substrate provided between the wiring board and the diaphragm;
With
The nozzle surface of the nozzle substrate is parallel to the wiring substrate,
The pressure generating means is a piezoelectric element,
The piezoelectric element is disposed at a position corresponding to the plurality of pressure chambers, and displaces the diaphragm to cause a pressure change in the pressure chambers, thereby ejecting ink from the nozzles. The inkjet head according to any one of claims 1 to 10.
An ink jet recording apparatus comprising the ink jet head according to any one of claims 1 to 11.
The method of manufacturing an ink jet head according to any one of claims 1 to 11,
A method of manufacturing an ink jet head, wherein the connection substrate is connected to the connection portion one side at a time with respect to the wiring substrate.