WO2015152395A1

WO2015152395A1 - Oled substrate cutting device and oled substrate

Info

Publication number: WO2015152395A1
Application number: PCT/JP2015/060589
Authority: WO
Inventors: 長崎　充; 隆志酒井
Original assignee: コニカミノルタ株式会社
Priority date: 2014-04-04
Filing date: 2015-04-03
Publication date: 2015-10-08
Also published as: JP6551400B2; JPWO2015152395A1

Abstract

Provided is an OLED substrate cutting device which enables the reduction of cracking of a barrier layer. An OLED substrate cutting device (1) is a device for cutting an OLED substrate (2) provided with a substrate, a barrier layer provided on one surface side of the substrate, a plurality of layers provided on a portion on one surface side of the barrier layer, and an adhesive sheet provided on the other surface side of the substrate, and is provided with a base part (10) to which the adhesive sheet is affixed, and a first blade part (21) which cuts the OLED substrate from the side of the plurality of layers in a state where the adhesive sheet is affixed to the base part (10). The first blade part (21) is a linear blade longer than the width of the OLED substrate (2), and cuts the OLED substrate (2) in a state where both ends of the first blade part (21) are respectively located outside both ends of the OLED substrate (2).

Description

OLED base material cutting device and OLED base material

The present invention relates to an OLED base material cutting device and an OLED base material.

Conventionally, as a method of cutting an OLED substrate having a barrier layer and an ALPET layer on the surface side of the substrate, there is a method of cutting the OLED substrate from the substrate side (see Patent Document 1). In such a method, when the dimensions of the ALPET layer and the like are different from the outer dimensions of the product, when the OLED substrate is cut from the substrate side, the ALPET layer and the like are cut in a floating state (air cut), and the barrier layer There is a risk that the cracks of the material increase.

As a technique for preventing such cracking of the barrier layer, a technique of cutting the OLED substrate from the ALPET layer side with a cutting die (see Patent Document 2), and a technique of cutting the OLED substrate from the ALPET layer side with a straight blade (patent) Reference 3).

Japanese Patent No. 5201854 JP 2013-164935 A JP 2012-2226013 A

However, even when the OLED substrate is cut from the ALPET layer side, the barrier layer may be cracked from the corners of the punching die or both ends of the straight blade.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide an OLED base material cutting device and an OLED base material that can reduce the cracking of the barrier layer.

The present invention for solving the above-described problems has the following configuration.
1. A base material, a barrier layer provided on one side of the base material, a plurality of layers provided on a part of one side of the barrier layer, and an adhesive sheet provided on the other side of the base material An OLED base material cutting device for cutting an OLED base material, wherein the OLED base is in a state where the adhesive sheet is attached to the base part, and the adhesive sheet is attached to the base part. A first blade portion that cuts a material from the plurality of layers, and the first blade portion is a straight blade that is longer than the width of the OLED substrate, and both ends of the first blade portion. The OLED base material cutting apparatus characterized by cutting the said OLED base material in the state which a part is located in the outer side rather than the both ends of the said OLED base material.
2. 2. The OLED base material cutting device according to 1, wherein the first blade portion is an engraving blade, an etching engraving blade or a cemented carbide blade.
3. 3. The OLED substrate cutting device according to 1 or 2, wherein the blade edge of the first blade portion is an acute angle, and the blade edge angle of the first blade portion is 30 degrees or less.
4). 3. The OLED base material cutting device according to 1 or 2, wherein a blade edge of the first blade portion is an acute angle, and a blade edge angle of the first blade portion is 18 to 20 degrees.
5. Said 1st blade part is equipped with two single blades with a sharp edge, and said two single blades are arranged so that the plane sides of each other face each other. OLED base material cutting device.
6). In the state where the adhesive sheet is attached to the base part, the OLED base material includes a second blade part that cuts the OLED substrate from the plurality of layers, and the second blade part has a corner part. The OLED substrate cutting device according to any one of 1 to 5, which is a mold.
7). The base portion is movable from the upstream side to the downstream side, the first blade portion is disposed on the upstream side of the second blade portion, and the first blade portion is the first blade portion. 7. The OLED substrate cutting device according to 6, wherein the OLED substrate is cut before the second blade portion. .
8). 8. The OLED substrate cutting device according to 6 or 7, wherein the second blade portion is an engraving blade or an etching engraving blade.
9. The cutting edge angle formed by the cutting direction of the first blade portion on the opposite side of the first blade portion from the second blade portion is 9 to 10 degrees. The OLED base material cutting apparatus in any one.
10. An OLED substrate cut by the OLED substrate cutting device according to any one of 1 to 9 above.

According to the present invention, cracking of the barrier layer in the OLED substrate can be reduced.

It is a schematic diagram which shows the OLED base-material cutting apparatus which concerns on embodiment of this invention, (a) is a side view, (b) is a top view. It is a block diagram which shows the OLED base-material cutting apparatus which concerns on embodiment of this invention. It is a schematic cross section which shows the OLED base material which concerns on embodiment of this invention. (A)-(d) is a figure which shows the 1st blade part which concerns on embodiment of this invention. (A) is a top view which shows the state which the 1st blade part preceded and cut the OLED base material, (b) is a 2nd blade part OLED base material following a 1st blade part. It is a top view which shows the state which cut | disconnected.

Embodiments of the present invention will be described in detail with reference to the drawings as appropriate. In the following description, directions such as “front / back / up / down / left / right” and “upstream / downstream” are based on the base material that is moved by the OLED base material cutting device. That is, the direction in which the base material travels is “front” and “downstream”.

First, the configuration of the OLED substrate cutting device according to the embodiment of the present invention will be described. Drawing 1 is a mimetic diagram showing the OLED substrate cutting device concerning the embodiment of the present invention, (a) is a side view and (b) is a top view. FIG. 2 is a block diagram illustrating an OLED base material cutting device according to an embodiment of the present invention.

As shown in FIGS. 1 (a) and 1 (b), an OLED substrate cutting device 1 according to an embodiment of the present invention is a device for cutting an OLED (Organic Light Emitting 有機 Diode, organic EL element) substrate 2. The platform 10, the cut unit 20, and the mark detection unit 30 are provided. Furthermore, as shown in FIG. 2, the OLED base material cutting device 1 includes a base drive unit 40, a cut drive unit 50, and a control unit 60.

<OLED base material>
Here, the OLED substrate 2 will be described. As shown in FIG. 3, the OLED substrate 2 includes a transparent resin substrate 2a, a barrier layer 2b composed of a plurality of layers formed over the entire surface of the substrate 2a, and a part of the surface of the barrier layer 2b. The organic EL layer 2c, the cured resin layer 2d, the AL layer 2e, and the PET layer 2f, which are a plurality of layers, and an electrode 2g formed on the other surface of the barrier layer 2b. The OLED substrate 2 includes an adhesive sheet 2h as an adhesive layer formed over the entire back surface of the substrate 2a.
Such an OLED base material 2 is formed of the adhesive sheet 2h from the PET layer 2f side by a first blade part 21 and a second blade part 22 to be described later in a state where the adhesive sheet 2h is adhered to the base part 10. Half-cut halfway.

<Pedestal>
As shown in FIG. 1, the base part 10 is moved in the front-rear direction by the base part drive part 40 (see FIG. 2) while the OLED base material 2 is adhered to the surface of the base part 10.

<Cut part>
The cut part 20 cuts the OLED substrate 2 adhered to the base part 10, and includes a first blade part 21, a second blade part 22, and a blade part attachment part 23.

<First blade part>
The 1st blade part 21 is provided in the upstream (rear side, ie, the next product side) rather than the 2nd blade part 22, and is a linear blade which cuts the OLED base material 2 in the width direction (left-right direction). is there. The first blade portion 21 completely cuts from the surface side of the OLED base material 2, that is, the PET layer 2f side to the base material 2a, and cuts the middle of the adhesive sheet 2h. The width | variety of the 1st blade part 21 is longer than the width | variety of the OLED base material 2, and the width direction both ends of the 1st blade part 21 are each located outside the width direction both ends of the OLED base material 2, respectively.

The first blade portion 21 is preferably an engraving blade, an etching engraving blade, or a cemented carbide blade. This is because the OLED substrate 2 is suitably cut by realizing a straight blade having a sufficient cutting edge hardness. The first blade portion 21 is more preferably a cemented carbide blade. This is to realize an acute-angled straight blade having no flat portion at the blade edge as the first blade portion 21.

Further, it is desirable that the blade edge of the first blade portion 21 is an acute-angled both blade, and the blade edge angle of the first blade portion 21 is 30 degrees or less. This is because when cutting from the ALPET layers 2e, 2f to the adhesive sheet 2h via the barrier layer 2b, the first blade 21 sharply cuts into the barrier layer 2b, thereby suppressing damage to the barrier layer 2b. This is for greatly reducing the cracking of the barrier layer 2b when the ALPET layers 2e and 2f and the barrier layer 2b are simultaneously cut.

Further, it is more preferable that the cutting edge of the first blade portion 21 is a sharp double-edged blade, and the cutting edge angle of the first blade portion 21 is 18 to 20 degrees. This is to sufficiently reduce the crack of the barrier layer 2b at the time of simultaneous cutting of the ALPET layers 2e, 2f and the barrier layer 2b while sufficiently securing the strength of the blade edge of the first blade portion 21 against the impact due to the cut. It is.

<Example of the shape of the first blade portion>
As shown in FIG. 4A, the first blade portion 21 may be a double blade that has an acute angle shape with no flat portion at the tip portion. Here, the double-blade refers to having a blade edge angle on both sides with respect to the direction orthogonal to the surface of the base portion 10, that is, the cutting direction of the first blade portion 21. In the first blade portion 21, the blade edge angles are set equal on both sides with respect to the direction orthogonal to the surface of the base portion 10.

Further, as shown in FIG. 4B, the first blade portion 21 may be configured to include two single blades having an acute angle shape with no flat portion at the tip portion. Here, the single blade refers to a flat portion extending in a direction orthogonal to the surface of the table 10 while the other has a blade edge angle with respect to the direction orthogonal to the surface of the table 10. In this case, the two single blades are arranged so that the plane portions face each other.

Further, as shown in FIG. 4 (c), the first blade portion 21 may be one single blade having an acute shape with no flat portion at the tip portion. In this case, the single blade is disposed such that the flat portion is on the downstream side, that is, the next product side, and cut loss on the next product side can be reduced.

Further, as shown in FIG. 4D, the first blade portion 21 may be a double-edged blade whose height on the downstream side, that is, the next product side, is lower than that on the upstream side, that is, the current product side. Good. In this case, cut loss on the next product side can be reduced.

<Second blade>
As shown in FIGS. 1 (a) and 1 (b), the second blade portion 22 is provided on the downstream side (front side) of the first blade portion 21, and a plurality of punching the OLED substrate 2 by half-cutting. It is a punching die (four in the figure). The second blade portion 22 completely cuts from the surface side of the OLED substrate 2, that is, the PET layer 2 f side to the substrate 2 a, and cuts the middle of the adhesive sheet 2 h. The second blade portion 22 has a quadrangular shape having corners in plan view, more specifically, a quadrangular shape having R shapes at four corners, and the OLED substrate 2 has a quadrangular shape having R shapes at four corners. Cut.

The second blade 22 is preferably an engraving blade or an etching engraving blade. This is because the OLED substrate 2 is suitably cut by realizing a punching die having a sufficient cutting edge hardness. In addition, the second blade portion 22 may be either a double blade or a single blade, and when the second blade portion 22 is a single blade, it is desirable to exhibit a shape having a flat portion on the inside.

<Blade mounting part>
The blade portion attachment portion 23 is a portion to which the first blade portion 21 and the second blade portion 22 described above are attached, and is orthogonal to the surface of the base portion 10 by the cut portion driving portion 50 (see FIG. 2). Move in the direction.

Here, the cutting edge height of the first cutting edge portion 21 is set higher than the cutting edge height of the second cutting edge portion 22. For example, by setting the cutting edge height of the first cutting edge portion 21 to 5 to 20 μm higher than the cutting edge height of the second cutting edge portion 22 (see symbol h in FIG. 1A), the first cutting edge portion is set. 21 cuts the OLED substrate 2 before the second blade 22.

<Mark detection unit>
The mark detection unit 30 is an optical camera, an optical sensor, or the like that detects marks 2a provided at equal intervals in the front-rear direction on the base material 2, and outputs the detection result to the control unit 60 (see FIG. 2).

<Table drive unit>
As shown in FIG. 2, the platform drive unit 40 is a mechanism that moves the platform 10 in the front-rear direction, that is, in the longitudinal direction of the OLED substrate 2.

<Cut part drive part>
The cut unit drive unit 50 is a mechanism that moves the cut unit 20 in the vertical direction, that is, in a direction orthogonal to the surface of the platform 10.

<Control unit>
The control unit 60 cuts the OLED base material 2 attached to the base unit 10 by controlling the base unit driving unit 40 and the cut unit driving unit 50 based on the detection result of the mark detection unit 30.
More specifically, the control unit 60 controls the platform driving unit 40 to move the platform 10 from the rear side (upstream side) to the front side (downstream side), and the mark detection unit 30 detects the mark. When this happens, the platform 10 is stopped. Subsequently, the control unit 60 controls the cut unit driving unit 50 in a state where the base unit 10 is stopped, thereby lowering the blade unit attaching unit 23 and cutting the OLED substrate 2.

Here, as shown to Fig.5 (a), the 1st blade part 21 cuts the OLED base material 2 ahead of the 2nd blade part 22, and the barrier layer 2b (FIG. 3) of the OLED base material 2 In this case, the current product side and the next product side are separated.
At this time, since the both end portions of the first blade portion 21 are located outside the both end portions of the OLED base material 2, the occurrence of cracking of the barrier layer 2 b at both end portions of the first blade portion 21 is prevented. be able to.

Subsequently, as shown in FIG. 5 (b), the second blade portion 22 cuts the OLED substrate 2. Here, even if the crack of the barrier layer 2b occurs in the R portion of the corner corner portion of the second blade portion 22, the first blade portion 21 has already formed the barrier layer 2b on the current product side and the next product side. Therefore, the crack of the barrier layer 2b can be prevented from propagating to the next product side of the OLED substrate 2.

Subsequently, the control unit 60 controls the cut unit driving unit 50 to raise the blade unit mounting unit 23 and then controls the base unit driving unit 40 to move the base unit 10 from the upstream side to the downstream side. Move to. The controller 60 sequentially cuts the OLED base material 2 into a product shape by repeating these operations.

Here, the first blade portion 21 is made of a Thomson blade (double blade), a pinnacle blade (double blade), an etching engraving blade (double blade), an engraving blade (double blade), and a cemented carbide blade (double blade and single blade), and an ALPET layer And the crack of the barrier layer at the time of simultaneous cutting | disconnection of a barrier layer and the crack of the barrier layer at the time of individual cutting | disconnection of a barrier layer were measured.
Further, the second blade portion 22 is made of a Thomson blade (double blade), a pinnacle blade (double blade), an etching engraving blade (double blade), and an engraving blade (double blade), and the barrier layer at the time of cutting the corner corner of the barrier layer Cracks were measured.

As shown in Table 1, for the first blade 21, it is desirable to reduce the flat portion of the tip of the cutting edge with an etching engraving blade or engraving blade, and to make the tip of the cutting edge sharp with a cemented carbide blade. Is more desirable.
Moreover, about the 2nd blade part 22, it is desirable to make small the flat part of a blade-tip front-end | tip part with an etching engraving blade or an engraving blade.

The OLED base material cutting device 1 according to the embodiment of the present invention is a straight blade in which the first blade portion 21 is longer than the width of the OLED base material 2, and both end portions of the first blade portion 21 are respectively OLED base materials. Since the OLED base material 2 is cut in a state of being located on the outer side of the two end portions 2, it is possible to prevent the barrier layer 2 b from cracking at both end portions of the first blade portion 21.
Moreover, the OLED base material cutting device 1 realizes a straight blade having sufficient edge hardness when the first blade portion 21 is an engraving blade, an etching engraving blade, or a cemented carbide blade, thereby realizing an OLED base. The material 2 can be suitably cut. In particular, when the first blade portion 21 is a cemented carbide blade, an acute-angled straight blade having no flat portion at the blade edge can be realized as the first blade portion 21.
Moreover, the OLED base material cutting device 1 suppresses damage to the barrier layer 2b when the blade edge of the first blade portion 21 is an acute angle and the blade edge angle of the first blade portion 21 is 30 degrees or less, The crack of the barrier layer 2b at the time of simultaneous cutting of the ALPET layers 2e and 2f and the barrier layer 2b can be greatly reduced.
The OLED base material cutting device 1 is configured such that the first blade portion 21 has an acute edge and the first blade portion 21 has an edge angle of 18 to 20 degrees. While sufficiently securing the strength of the blade edge of the blade portion 21, the crack of the barrier layer 2b at the time of simultaneous cutting of the ALPET layers 2e and 2f and the barrier layer 2b can be greatly reduced.
The OLED base material cutting device 1 includes a barrier layer in the case where the first blade portion 21 includes two single blades having sharp edges and the two single blades 21 are disposed so that the plane sides thereof face each other. The damage of 2b can be suppressed and the crack of the barrier layer 2b at the time of simultaneous cutting | disconnection of the ALPE layers 2e and 2f and the barrier layer 2b can be reduced significantly.

Moreover, since the OLED base material cutting apparatus 1 includes the second blade portion 22 that is a punching die, the OLED base material is prevented from being cracked at both end portions of the first blade portion 21. 2 can be suitably cut into the product shape.
Moreover, since the OLED base-material cutting apparatus 1 cuts the OLED base material 2 ahead of the 2nd blade part 22 provided in the downstream, the 1st blade part 21 provided in the upstream is 2nd. Even if the crack of the barrier layer 2b due to the blade portion 22 occurs, the crack of the barrier layer 2b can be prevented from propagating to the next product side of the OLED substrate 2.
Moreover, when the 2nd blade part 22 is an engraving blade or an etching engraving blade, the OLED base material cutting apparatus 1 implement | achieves the OLED base material 2 by implement | achieving the cutting die which has sufficient blade edge hardness. Can be cut.
The OLED base material cutting device 1 has a blade edge angle of 9 to 10 degrees with respect to the cutting direction of the first blade portion 21 on the side opposite to the second blade portion 22 in the first blade portion 21. In this case, the loss on the next product side due to the cutting of the first blade portion 21 can be reduced while sufficiently securing the cutting performance of the first blade portion 21.

In addition, since the OLED base material 2 cut by the OLED base material cutting device 1 is manufactured while preventing the barrier layer 2b from cracking, it is possible to suppress degradation in product performance and generation of defective products.

As mentioned above, although embodiment of this invention was described, this invention is not limited to the said embodiment, In the range which does not deviate from the summary of this invention, it can change suitably. For example, the 1st blade part 21 and the 2nd blade part 22 are comprised so that a movement is possible independently, and the control part 60 cuts the OLED base material 2 by the 1st blade part 21, and continues the 1st. The structure which controls the cut part drive part 40 so that the two blade part 22 may cut the OLED base material 2 may be sufficient.

DESCRIPTION OF SYMBOLS 1 OLED base-material cutting apparatus 2 OLED base material 10 Stand part 21 1st blade part 22 2nd blade part

Claims

A base material, a barrier layer provided on one side of the base material, a plurality of layers provided on a part of one side of the barrier layer, and an adhesive sheet provided on the other side of the base material An OLED base material cutting device for cutting an OLED base material comprising:
A base to which the adhesive sheet is attached;
In a state where the adhesive sheet is attached to the base portion, a first blade portion that cuts the OLED base material from the plurality of layers, and
With
The first blade portion is a straight blade that is longer than the width of the OLED substrate, and both end portions of the first blade portion are positioned outside the both end portions of the OLED substrate. An OLED base material cutting device characterized by cutting an OLED base material.
The OLED substrate cutting device according to claim 1, wherein the first blade portion is an engraving blade, an etching engraving blade, or a cemented carbide blade.
The cutting edge of the first blade portion has an acute angle,
The OLED base material cutting device according to claim 1 or 2, wherein a blade edge angle of the first blade portion is 30 degrees or less.
The cutting edge of the first blade portion has an acute angle,
The OLED substrate cutting device according to claim 1 or 2, wherein a blade edge angle of the first blade portion is 18 to 20 degrees.
The first blade portion includes two single blades with sharp edges.
The OLED base material cutting device according to any one of claims 1 to 4, wherein the two single blades are arranged so that their planar sides face each other.
In a state where the adhesive sheet is attached to the base part, the OLED base material includes a second blade part that cuts the plurality of layers from the side,
The OLED substrate cutting device according to any one of claims 1 to 5, wherein the second blade portion is a punching die having a corner portion.
The platform is movable from the upstream side to the downstream side,
The first blade portion is disposed on the upstream side of the second blade portion,
The OLED base material cutting device according to claim 6, wherein the first blade portion cuts the OLED base material before the second blade portion.
The OLED substrate cutting device according to claim 6 or 7, wherein the second blade portion is an engraving blade or an etching engraving blade.
The blade edge angle formed with the cutting direction of the first blade portion on the opposite side of the first blade portion from the second blade portion is 9 to 10 degrees. Item 9. The OLED base material cutting device according to any one of Items 8 to 9.
An OLED substrate cut by the OLED substrate cutting device according to any one of claims 1 to 9.