WO2015021712A1 - 阵列基板及其制造方法和显示装置 - Google Patents
阵列基板及其制造方法和显示装置 Download PDFInfo
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- WO2015021712A1 WO2015021712A1 PCT/CN2013/089459 CN2013089459W WO2015021712A1 WO 2015021712 A1 WO2015021712 A1 WO 2015021712A1 CN 2013089459 W CN2013089459 W CN 2013089459W WO 2015021712 A1 WO2015021712 A1 WO 2015021712A1
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- WIPO (PCT)
- Prior art keywords
- metal layer
- array substrate
- gate
- light
- data line
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 111
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 12
- 229910052751 metal Inorganic materials 0.000 claims abstract description 96
- 239000002184 metal Substances 0.000 claims abstract description 96
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 13
- 229910052750 molybdenum Inorganic materials 0.000 claims description 13
- 239000011733 molybdenum Substances 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 10
- 229910052782 aluminium Inorganic materials 0.000 claims description 9
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 9
- 230000000694 effects Effects 0.000 abstract description 14
- 239000004973 liquid crystal related substance Substances 0.000 abstract description 8
- 230000003287 optical effect Effects 0.000 abstract description 3
- 229920002120 photoresistant polymer Polymers 0.000 description 8
- 239000011159 matrix material Substances 0.000 description 7
- 230000000903 blocking effect Effects 0.000 description 5
- 238000000151 deposition Methods 0.000 description 4
- 238000002161 passivation Methods 0.000 description 4
- 238000005530 etching Methods 0.000 description 3
- 238000000059 patterning Methods 0.000 description 3
- 230000008054 signal transmission Effects 0.000 description 3
- 230000008021 deposition Effects 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/133509—Filters, e.g. light shielding masks
- G02F1/133512—Light shielding layers, e.g. black matrix
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133388—Constructional arrangements; Manufacturing methods with constructional differences between the display region and the peripheral region
Definitions
- Embodiments of the present invention relate to an array substrate, a method of fabricating the same, and a display device provided with the array substrate. Background technique
- TFT-LCD Thin Film Transistor Liquid Crystal Display
- the TFT-LCD is mainly composed of an array substrate and a color filter substrate, wherein a color film and a black matrix are formed on the color filter substrate, a region in which the color film is formed is a light transmission region, and other regions are shielded by a black matrix to prevent light leakage from affecting the display. effect.
- the black matrix is formed on the color filter substrate by a mask patterning process by exposure, etching, etc., wherein the photoresist (Photo Resist, PR) is usually a negative photoresist, that is, illuminated when exposed. The resulting photoresist will remain.
- the photoresist Photo Resist, PR
- PR photoresist
- the photoresist contains a large amount of solvent, and the exposure is generally exposed to the photoresist, and the solvent in the photoresist is easily volatilized, so that the mask region above the color filter substrate The mask is contaminated, which causes some light that should be irradiated onto the photoresist to be blocked, which causes the black matrix of the frame area of the color filter substrate to be excessively etched, causing light leakage, thereby affecting the display effect.
- an array substrate wherein a frame region of the array substrate includes a first metal layer and a second metal layer, and is located between the first metal layer and the second metal layer.
- a method of fabricating an array substrate including: forming a gate metal layer on a base substrate, the gate metal layer including a bezel area on the base substrate a gate wiring pattern; forming a gate insulating layer on the base substrate and the gate metal layer; forming a data line metal layer on the gate insulating layer, the data line metal layer including the substrate a light-shielding pattern of the frame region of the substrate, and the light-shielding pattern blocks an area corresponding to a portion other than the gate lead pattern.
- a method of fabricating an array substrate including: forming a gate metal layer on a substrate substrate, the gate metal layer including a frame region of the substrate substrate a light-shielding pattern; a gate insulating layer is formed on the substrate substrate and the gate metal layer; a data line metal layer is formed on the gate insulating layer, and the data line metal layer includes a frame on the substrate substrate a data line lead pattern of the area, and the light blocking pattern blocks an area corresponding to a portion other than the data line lead pattern.
- a display device including a color filter substrate and the array substrate is provided.
- FIG. 1 is a schematic cross-sectional view of an array substrate according to Embodiment 1 of the present invention.
- FIG. 2 is a schematic plan view of an array substrate according to Embodiment 1 of the present invention.
- FIG. 3 is a schematic view showing a light-shielding effect of an array substrate according to Embodiment 1 of the present invention
- FIG. 4 is a schematic cross-sectional view of an array substrate according to Embodiment 2 of the present invention.
- Fig. 5 is a schematic view showing the shading effect of the array substrate according to Embodiment 2 of the present invention. detailed description
- the embodiment of the invention provides an array substrate, a manufacturing method thereof and a display device provided with the array substrate, which solves the technical problem that light leakage occurs in the frame region of the liquid crystal display in the prior art, thereby affecting the display effect.
- the frame region of the array substrate provided by the embodiment of the present invention includes a first metal layer and a second metal layer and an insulating layer between the first metal layer and the second metal layer, the first metal layer includes a lead pattern, and the second The metal layer includes a light-shielding pattern that blocks an area corresponding to a portion other than the lead pattern.
- the lead pattern located in the frame area of the array substrate has a light blocking effect
- the light shielding pattern located in the frame area of the array substrate also has a light blocking effect
- the light shielding pattern blocks the area corresponding to the portion other than the lead pattern. Therefore, the matching of the lead pattern and the shading pattern can block all the optical paths of the frame area of the array substrate. Therefore, the light of the frame area of the array substrate is blocked by the lead pattern and the light shielding pattern, and even if the black matrix of the frame area of the color filter substrate is excessively etched to generate a light leakage point, light leakage does not occur, thereby making the liquid crystal display The display effect is not affected by light leakage.
- the array substrate provided by the embodiment of the present invention, a method of manufacturing the same, and a display device provided with the array substrate will be described in detail below with reference to the embodiments 1-3.
- the first metal layer is a gate metal layer
- the lead pattern is a gate lead pattern 11
- the second metal layer is a data line metal layer
- the light shielding pattern 12 is a data line metal A layer is formed
- a gate insulating layer 13 is between the gate metal layer and the data line metal layer.
- the gate lead pattern 11 and the light-shielding pattern 12 located in the frame region of the array substrate all have a light-shielding effect, and the light-shielding pattern 12 blocks an area corresponding to a portion other than the gate lead pattern 11, so the gate lead pattern 11 cooperates with the light-shielding pattern 12 to block all the light paths of the frame area of the array substrate. Therefore, as shown in FIG. 3, the light that is emitted from the backlight 3 toward the frame region of the array substrate is blocked by the gate lead pattern 11 and the light shielding pattern 12, even if the black matrix 4 of the frame region of the color filter substrate is excessively engraved.
- the light leakage point 40 is generated by the etch, and the light leakage phenomenon does not occur, so that the display effect of the liquid crystal display is not affected by the light leakage.
- both the gate metal layer and the data line metal layer may be formed by a combination of a molybdenum layer, an aluminum layer, and a molybdenum layer in this order from top to bottom.
- the molybdenum layer on the upper and lower layers of the aluminum layer protects the aluminum layer from corrosion, and also reduces the contact resistance between the aluminum layer and the pixel electrode material, resulting in better electrical conductivity.
- the shading pattern A portion of 12 may be composed of a plurality of smaller island-like patterns, and a slit 120 exists between adjacent island-shaped patterns; the other portions may be larger-sized patterns (all of the shading patterns are not shown in FIG. 2).
- the partial light-shielding pattern 12 is formed into a plurality of smaller island-like patterns to avoid an electric field between the light-shielding pattern 12 and the gate lead pattern 11, thereby ensuring normal signal transmission.
- the light emitted from the backlight is diffracted at the slit, so that as long as the slit 120 is sufficiently small, light leakage does not occur, thereby achieving the effect of shading.
- all of the shading patterns can also be composed of island patterns for a better signal transmission environment.
- An embodiment of the present invention further provides a method for manufacturing the above array substrate, including:
- S11 forming a gate metal layer on the base substrate, the gate metal layer including a gate lead pattern on a frame region of the base substrate.
- the base substrate may generally adopt a glass substrate
- the gate metal layer may generally adopt a multilayer structure in which a molybdenum layer, an aluminum layer, and a molybdenum layer are sequentially stacked.
- a gate metal layer may be formed on the base substrate by a conventional deposition, patterning, etching process, and the gate metal layer is formed with a gate wiring pattern in the frame region of the substrate substrate.
- a layer of insulating material may be deposited on the base substrate and the gate metal layer as a gate insulating layer using a conventional deposition method.
- S13 forming a data line metal layer on the gate insulating layer, the data line metal layer includes a light shielding pattern on a frame region of the substrate substrate, and the light shielding pattern blocks an area corresponding to a portion other than the gate lead pattern.
- step S12 a data line metal layer is formed.
- the data line metal layer is usually a multilayer structure in which a molybdenum layer, an aluminum layer, and a molybdenum layer are sequentially stacked.
- the data line metal layer is formed with a light-shielding pattern in the frame region of the base substrate, and the light-shielding pattern blocks an area corresponding to a portion other than the gate lead pattern.
- Example 2 In addition to the above three steps, conventional steps of forming an active layer, a pixel electrode, a passivation layer, and the like are also included, thereby forming an array substrate provided by an embodiment of the present invention.
- Example 2
- This embodiment is basically the same as the first embodiment except that, as shown in FIG. 4, in the embodiment, the first metal layer is a data line metal layer, the lead pattern is a data line lead pattern 21, and the second metal layer is The gate metal layer, the light shielding pattern 22 is formed of a gate metal layer; and the gate insulating layer 23 is between the data line metal layer and the gate metal layer. Further, a portion of the substrate substrate 20, the polarizer 24, the passivation layer 25, and the like are further included in the array substrate.
- the data line lead pattern 21 and the light-shielding pattern 22 located in the frame region of the array substrate all have a light-shielding effect, and the light-shielding pattern 22 blocks the area corresponding to the portion other than the data line lead pattern 21, so the data line lead pattern 21, in cooperation with the light-shielding pattern 22, can block all the optical paths of the frame area of the array substrate. Therefore, as shown in FIG. 5, the light that is emitted from the backlight 3 toward the frame region of the array substrate is blocked by the data line lead pattern 21 and the light shielding pattern 22, even if the black matrix 4 of the frame region of the color filter substrate is excessively engraved.
- the light leakage point 40 is generated by the etch, and the light leakage phenomenon does not occur, so that the display effect of the liquid crystal display is not affected by the light leakage.
- An embodiment of the present invention further provides a method for manufacturing the above array substrate, including:
- S21 forming a gate metal layer on the base substrate, the gate metal layer including a light shielding pattern on a frame region of the base substrate.
- the base substrate may generally adopt a glass substrate
- the gate metal layer may generally adopt a multilayer structure in which a molybdenum layer, an aluminum layer, and a molybdenum layer are sequentially stacked.
- a gate metal layer may be formed on the base substrate by a conventional deposition, patterning, etching process, and the gate metal layer is formed with a light-shielding pattern in the frame region of the substrate.
- a layer of insulating material may be deposited on the base substrate and the gate metal layer as a gate insulating layer using a conventional deposition method.
- the data line metal layer includes a data line lead pattern on a frame region of the substrate substrate, and the light blocking pattern blocks an area corresponding to a portion other than the data line lead pattern.
- a data line metal layer is formed.
- the data line metal layer is usually a multilayer structure in which a molybdenum layer, an aluminum layer, and a molybdenum layer are sequentially stacked.
- the data line metal layer is formed with a data line lead pattern in a frame region of the base substrate, and the light blocking pattern blocks an area corresponding to a portion other than the data line lead pattern.
- conventional steps of forming an active layer, a pixel electrode, a passivation layer, and the like are also included, thereby forming an array substrate provided by an embodiment of the present invention.
- Embodiment 1 and Embodiment 2 may be combined, that is, a light shielding pattern is formed correspondingly by the data line metal layer above the gate lead pattern; Also above the data line lead pattern, the corresponding metallization pattern of the gate metal layer is used to make the array substrate have a better light leakage effect.
- Embodiments of the present invention provide a display device including a color filter substrate and the array substrate provided by the above-described embodiments of the present invention.
- the display device may be any product or component having a display function such as a liquid crystal television, a liquid crystal display, a digital camera, a mobile phone, a tablet, or the like.
- the display device provided by the embodiment of the present invention has the same technical features as the array substrate provided by the embodiment of the present invention described above, the same technical effect can be produced and the same technical problem can be solved.
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Abstract
提供了一种阵列基板及其制造方法和设有该阵列基板的显示装置。阵列基板的边框区域包括第一金属层和第二金属层,以及位于第一金属层和第二金属层之间的绝缘层(13),第一金属层包括引线图形(11、21),第二金属层包括遮光图形(12、22),遮光图形(12、22)遮挡引线图形(11、21)以外的部分所对应的区域。通过引线图形(11、21)和遮光图形(12、22)相配合,能够遮挡阵列基板的边框区域的所有光路,从而使液晶显示器的显示效果不受漏光影响。
Description
阵列基板及其制造方法和显示装置 技术领域
本发明的实施例涉及一种阵列基板及其制造方法和设有该阵列基板的显 示装置。 背景技术
随着显示技术的不断发展, 薄膜晶体管液晶显示器 (Thin Film Transistor Liquid Crystal Display, TFT-LCD)已在平板显示领域中占据了主导地位。 TFT-LCD主要由阵列基板和彩膜基板组成,其中彩膜基板上形成有彩膜和黑 矩阵, 形成有彩膜的区域为透光区, 而其他区域利用黑矩阵遮光, 以防止漏 光影响显示效果。
目前, 黑矩阵利用掩膜版构图工艺, 经曝光、 刻蚀等步骤形成在彩膜基 板上, 其中使用的光刻胶(Photo Resist, PR )通常是负性光刻胶, 即曝光时 被光照到的光刻胶会保留下来。 为了保证曝光质量, 光刻胶中都含有大量的 溶剂, 并且对光刻胶进行曝光时一般都采用接近式曝光, 而光刻胶中的溶剂 很容易挥发, 使得彩膜基板的边框区域上方的掩膜版被污染, 这会造成一些 本应照射到光刻胶上的光线被遮挡, 导致彩膜基板的边框区域的黑矩阵被过 多的刻蚀掉, 发生漏光现象, 进而影响显示效果。 发明内容
在本发明的一个实施例中, 提供一种阵列基板, 所述阵列基板的边框区 域包括第一金属层和第二金属层以及位于所述第一金属层和所述第二金属层 之间的绝缘层, 所述第一金属层包括引线图形, 所述第二金属层包括遮光图 形, 所述遮光图形遮挡所述引线图形以外的部分所对应的区域。
在本发明的另一个实施例中, 提供一种阵列基板的制造方法, 其包括: 在衬底基板上形成栅极金属层, 所述栅极金属层包括位于所述衬底基板的边 框区域的栅极引线图形;在所述衬底基板和所述栅极金属层上形成栅绝缘层; 在所述栅绝缘层上形成数据线金属层, 所述数据线金属层包括位于所述衬底
基板的边框区域的遮光图形, 且所述遮光图形遮挡所述栅极引线图形以外的 部分所对应的区域。
在本发明的又一个实施例中, 提供一种阵列基板的制造方法, 其包括: 在村底基板上形成栅极金属层, 所述栅极金属层包括位于所述村底基板的边 框区域的遮光图形; 在所述村底基板和所述栅极金属层上形成栅绝缘层; 在 所述栅绝缘层上形成数据线金属层, 所述数据线金属层包括位于所述村底基 板的边框区域的数据线引线图形, 且所述遮光图形遮挡所述数据线引线图形 以外的部分所对应的区域。
在本发明的再一个实施例中, 提供一种显示装置, 其包括彩膜基板和上 述阵列基板。 附图说明
为了更清楚地说明本发明实施例的技术方案, 下面将对实施例的附图作 筒单地介绍,显而易见地,下面描述中的附图仅仅涉及本发明的一些实施例, 而非对本发明的限制。
图 1为本发明的实施例 1所提供的阵列基板的截面示意图;
图 2为本发明的实施例 1所提供的阵列基板的平面示意图;
图 3为本发明的实施例 1所提供的阵列基板的遮光效果示意图; 图 4为本发明的实施例 2所提供的阵列基板的截面示意图;
图 5为本发明的实施例 2所提供的阵列基板的遮光效果示意图。 具体实施方式
为使本发明实施例的目的、 技术方案和优点更加清楚, 下面将结合本发 明实施例的附图,对本发明实施例的技术方案进行清楚、 完整地描述。显然, 所描述的实施例是本发明的一部分实施例, 而不是全部的实施例。 基于所描 述的本发明的实施例, 本领域普通技术人员在无需创造性劳动的前提下所获 得的所有其他实施例, 都属于本发明保护的范围。
本发明的实施例提供了一种阵列基板及其制造方法和设有该阵列基板的 显示装置, 解决了现有技术中液晶显示器的边框区域发生漏光现象, 进而影 响显示效果的技术问题。
本发明的实施例所提供的阵列基板的边框区域包括第一金属层和第二金 属层以及位于第一金属层和第二金属层之间的绝缘层, 第一金属层包括引线 图形, 第二金属层包括遮光图形, 遮光图形遮挡引线图形以外的部分所对应 的区域。
在本发明的实施例中, 位于阵列基板的边框区域的引线图形具有遮光作 用, 同时位于阵列基板的边框区域的遮光图形也具有遮光作用, 并且遮光图 形遮挡了引线图形以外的部分所对应的区域, 所以引线图形与遮光图形相配 合就能够遮挡住阵列基板的边框区域的所有光路。 因此, 阵列基板的边框区 域的光线会被引线图形和遮光图形遮挡住, 即使彩膜基板的边框区域的黑矩 阵被过多刻蚀而产生漏光点, 也不会发生漏光现象, 从而使液晶显示器的显 示效果不受漏光影响。
下面结合实施例 1-3详细描述本发明的实施例提供的阵列基板及其制造 方法和设有该阵列基板的显示装置。
实施例 1 :
如图 1和图 2所示, 本实施例中, 第一金属层为栅极金属层, 引线图形 为栅极引线图形 11 ; 第二金属层为数据线金属层, 遮光图形 12由数据线金 属层形成; 栅极金属层与数据线金属层之间为栅绝缘层 13。 此外, 阵列基板 中还包括衬底基板 10、 偏光片 14、 钝化层 15等部分。
本实施例中, 位于阵列基板的边框区域的栅极引线图形 11 和遮光图形 12都具有遮光作用,并且遮光图形 12遮挡了栅极引线图形 11以外的部分所 对应的区域, 所以栅极引线图形 11与遮光图形 12相配合就能够遮挡住阵列 基板的边框区域的所有光路。 因此, 如图 3所示, 从背光源 3射向阵列基板 的边框区域的光线会被栅极引线图形 11和遮光图形 12遮挡住, 即使彩膜基 板的边框区域的黑矩阵 4被过多刻蚀而产生漏光点 40 ,也不会发生漏光现象, 从而使液晶显示器的显示效果不受漏光影响。
在本发明的实施例中, 例如, 栅极金属层和数据线金属层都可以是从上 至下依次由钼层、 铝层、 钼层复合形成。 位于铝层上层和下层的钼层能够保 护铝层不受侵蚀, 还可以减少铝层与像素电极材料之间的接触电阻, 使导电 性能更佳。
在本发明的一些实施例中, 如图 2所示, 作为一个可选方案, 遮光图形
12的一部分可由多个较小的岛状图形组成,并且相邻的岛状图形之间存在缝 隙 120; 其他部分可以是面积较大的图形(图 2中未示出全部的遮光图形)。
因为如果遮光图形 12的面积较大,或者遮光图形 12与栅极引线图形 11 之间有较多重叠的部分, 遮光图形 12与栅极引线图形 11将会形成电场, 而 影响正常的信号传输,所以将部分遮光图形 12制成多个较小的岛状图形, 以 避免遮光图形 12与栅极引线图形 11之间形成电场, 从而保证正常的信号传 输。 此外, 虽然岛状图形之间存在缝隙 120, 但是背光源射出的光线会在缝 隙处发生衍射, 所以只要缝隙 120足够小, 就不会发生漏光现象, 从而达到 遮光的效果。
当然, 在本发明的其他实施方式中, 也可以将全部的遮光图形都用岛状 图形组成, 以得到更好的信号传输环境。
本发明的实施例还提供了上述阵列基板的制造方法, 包括:
S11 : 在衬底基板上形成栅极金属层, 该栅极金属层包括位于衬底基板 的边框区域的栅极引线图形。
具体的, 衬底基板通常可采用玻璃基板, 栅极金属层通常可采用钼层、 铝层和钼层依次堆叠的多层结构。 例如, 可以采用常规的沉积、 构图、 刻蚀 工艺在衬底基板上形成栅极金属层, 栅极金属层在衬底基板的边框区域形成 有栅极引线图形。
S12: 在衬底基板和栅极金属层上形成栅绝缘层。
在步骤 S11的基础上, 例如, 可以使用常规的沉积方法在衬底基板和栅 极金属层上沉积一层绝缘材料, 作为栅绝缘层。
S13 : 在栅绝缘层上形成数据线金属层, 数据线金属层包括位于衬底基 板的边框区域的遮光图形, 且遮光图形遮挡栅极引线图形以外的部分所对应 的区域。
具体的, 可以采用与步骤 S11相同的工艺, 在步骤 S12的基础上, 形成 数据线金属层。 数据线金属层通常可采用钼层、 铝层和钼层依次堆叠的多层 结构。 数据线金属层在衬底基板的边框区域形成有遮光图形, 并且遮光图形 遮挡栅极引线图形以外的部分所对应的区域。
当然, 除上述三个步骤之外, 还包括形成有源层、 像素电极、 钝化层等 常规步骤, 从而形成本发明的实施例所提供的阵列基板。
实施例 2:
本实施例与实施例 1基本相同, 其不同点在于: 如图 4所示, 本实施例 中, 第一金属层为数据线金属层, 引线图形为数据线引线图形 21 ; 第二金属 层为栅极金属层,遮光图形 22由栅极金属层形成;数据线金属层与栅极金属 层之间为栅绝缘层 23。 此外, 阵列基板中还包括衬底基板 20、 偏光片 24、 钝化层 25等部分。
本实施例中,位于阵列基板的边框区域的数据线引线图形 21和遮光图形 22都具有遮光作用,并且遮光图形 22遮挡了数据线引线图形 21以外的部分 所对应的区域, 所以数据线引线图形 21与遮光图形 22相配合就能够遮挡住 阵列基板的边框区域的所有光路。 因此, 如图 5所示, 从背光源 3射向阵列 基板的边框区域的光线会被数据线引线图形 21和遮光图形 22遮挡住, 即使 彩膜基板的边框区域的黑矩阵 4被过多刻蚀而产生漏光点 40,也不会发生漏 光现象, 从而使液晶显示器的显示效果不受漏光影响。
本发明的实施例还提供了上述阵列基板的制造方法, 包括:
S21 : 在衬底基板上形成栅极金属层, 该栅极金属层包括位于衬底基板 的边框区域的遮光图形。
具体的, 衬底基板通常可采用玻璃基板, 栅极金属层通常可采用钼层、 铝层和钼层依次堆叠的多层结构。 例如, 可以采用常规的沉积、 构图、 刻蚀 工艺在衬底基板上形成栅极金属层, 栅极金属层在衬底基板的边框区域形成 有遮光图形。
S22: 在衬底基板和栅极金属层上形成栅绝缘层。
在步骤 S21的基础上, 例如, 可以使用常规的沉积方法在衬底基板和栅 极金属层上沉积一层绝缘材料, 作为栅绝缘层。
S23 : 在栅绝缘层上形成数据线金属层, 数据线金属层包括位于衬底基 板的边框区域的数据线引线图形, 且遮光图形遮挡数据线引线图形以外的部 分所对应的区域。
具体的, 可以采用与步骤 S21相同的工艺, 在步骤 S22的基础上, 形成 数据线金属层。 数据线金属层通常可采用钼层、 铝层和钼层依次堆叠的多层 结构。 数据线金属层在衬底基板的边框区域形成有数据线引线图形, 并且遮 光图形遮挡数据线引线图形以外的部分所对应的区域。
当然, 除上述三个步骤之外, 还包括形成有源层、 像素电极、 钝化层等 常规步骤, 从而形成本发明的实施例所提供的阵列基板。
在本发明的一些实施例中, 作为一个可选方案, 还可以将上述实施例 1 和实施例 2相结合, 也就是在栅极引线图形上方, 利用数据线金属层相应的 形成遮光图形; 并且还在数据线引线图形上方, 利用栅极金属层相应的形成 遮光图形, 使阵列基板具有更好的放漏光效果。
实施例 3:
本发明的实施例提供了一种显示装置, 包括彩膜基板和上述本发明的实 施例所提供的阵列基板。 该显示装置可以是液晶电视、 液晶显示器、 数码相 机、 手机、 平板电脑等任何具有显示功能的产品或部件。
由于本发明的实施例提供的显示装置与上述本发明的实施例所提供的阵 列基板具有相同的技术特征, 所以也能产生相同的技术效果, 解决相同的技 术问题。
以上实施例仅用以说明本发明的技术方案, 而非对其限制; 尽管参照前 述实施例对本发明进行了详细的说明, 本领域的普通技术人员应当理解: 其 依然可以对前述各实施例所记载的技术方案进行修改, 或者对其中部分技术 特征进行等同替换; 而这些修改或者替换, 并不使相应技术方案的本质脱离 本发明各实施例技术方案的精神和范围。
Claims
1、一种阵列基板,在所述阵列基板的边框区域包括第一金属层和第二金 属层以及位于所述第一金属层和所述第二金属层之间的绝缘层, 所述第一金 属层包括引线图形, 所述第二金属层包括遮光图形, 所述遮光图形遮挡所述 引线图形以外的部分所对应的区域。
2、根据权利要求 1所述的阵列基板, 其中, 所述遮光图形的部分或全部 由多个岛状图形组成, 相邻的所述岛状图形之间存在缝隙。
3、根据权利要求 1所述的阵列基板, 其中, 所述第一金属层为栅极金属 层, 所述引线图形为栅极引线图形, 所述第二金属层为数据线金属层。
4、根据权利要求 1所述的阵列基板, 其中, 所述第一金属层为数据线金 属层, 所述引线图形为数据线引线图形, 所述第二金属层为栅极金属层。
5、根据权利要求 1所述的阵列基板, 其中, 所述第一金属层或所述第二 金属层从上至下依次由钼层、 铝层、 钼层复合形成。
6、 一种阵列基板的制造方法, 包括:
在衬底基板上形成栅极金属层, 所述栅极金属层包括位于所述衬底基板 的边框区域的栅极引线图形;
在所述衬底基板和所述栅极金属层上形成栅绝缘层;
在所述栅绝缘层上形成数据线金属层, 所述数据线金属层包括位于所述 衬底基板的边框区域的遮光图形, 且所述遮光图形遮挡所述栅极引线图形以 外的部分所对应的区域。
7、 一种阵列基板的制造方法, 包括:
在衬底基板上形成栅极金属层, 所述栅极金属层包括位于所述衬底基板 的边框区域的遮光图形;
在所述衬底基板和所述栅极金属层上形成栅绝缘层;
在所述栅绝缘层上形成数据线金属层, 所述数据线金属层包括位于所述 衬底基板的边框区域的数据线引线图形, 且所述遮光图形遮挡所述数据线引 线图形以外的部分所对应的区域。
8、一种显示装置, 包括彩膜基板和权利要求 1至 5中任一项所述的阵列 基板。
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