WO2015087714A1 - Sealant for display element - Google Patents
Sealant for display element Download PDFInfo
- Publication number
- WO2015087714A1 WO2015087714A1 PCT/JP2014/081507 JP2014081507W WO2015087714A1 WO 2015087714 A1 WO2015087714 A1 WO 2015087714A1 JP 2014081507 W JP2014081507 W JP 2014081507W WO 2015087714 A1 WO2015087714 A1 WO 2015087714A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- compound
- molecular weight
- sealant
- display element
- weight
- Prior art date
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- 239000000565 sealant Substances 0.000 title claims abstract description 51
- 150000001875 compounds Chemical class 0.000 claims abstract description 86
- -1 polyene compound Chemical class 0.000 claims abstract description 64
- 229920006295 polythiol Polymers 0.000 claims abstract description 46
- 125000003396 thiol group Chemical group [H]S* 0.000 claims abstract description 18
- 239000003999 initiator Substances 0.000 claims abstract description 15
- 239000011203 carbon fibre reinforced carbon Substances 0.000 claims abstract description 11
- 238000003860 storage Methods 0.000 claims abstract description 11
- 239000003795 chemical substances by application Substances 0.000 claims description 35
- 238000007789 sealing Methods 0.000 claims description 30
- 150000003568 thioethers Chemical class 0.000 claims description 26
- 239000000463 material Substances 0.000 claims description 15
- 230000009477 glass transition Effects 0.000 claims description 9
- 125000004122 cyclic group Chemical group 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- 239000010408 film Substances 0.000 description 26
- 239000004973 liquid crystal related substance Substances 0.000 description 24
- 239000000758 substrate Substances 0.000 description 23
- 238000006243 chemical reaction Methods 0.000 description 14
- 239000011347 resin Substances 0.000 description 13
- 229920005989 resin Polymers 0.000 description 13
- 230000000052 comparative effect Effects 0.000 description 12
- 238000005259 measurement Methods 0.000 description 11
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 11
- 229910052753 mercury Inorganic materials 0.000 description 11
- 239000000853 adhesive Substances 0.000 description 10
- 230000001070 adhesive effect Effects 0.000 description 10
- 238000002834 transmittance Methods 0.000 description 10
- 239000011248 coating agent Substances 0.000 description 9
- 238000000576 coating method Methods 0.000 description 9
- 229910010272 inorganic material Inorganic materials 0.000 description 9
- 239000011147 inorganic material Substances 0.000 description 9
- 239000000203 mixture Substances 0.000 description 9
- 239000004925 Acrylic resin Substances 0.000 description 8
- 229920000178 Acrylic resin Polymers 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- 230000002093 peripheral effect Effects 0.000 description 8
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 7
- 239000003822 epoxy resin Substances 0.000 description 7
- 230000001678 irradiating effect Effects 0.000 description 7
- 229920000647 polyepoxide Polymers 0.000 description 7
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 6
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 6
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 6
- 238000012644 addition polymerization Methods 0.000 description 6
- 238000005227 gel permeation chromatography Methods 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- 150000004291 polyenes Chemical class 0.000 description 6
- 239000003505 polymerization initiator Substances 0.000 description 6
- 230000001681 protective effect Effects 0.000 description 6
- 239000011342 resin composition Substances 0.000 description 6
- 238000012719 thermal polymerization Methods 0.000 description 6
- HEQOJEGTZCTHCF-UHFFFAOYSA-N 2-amino-1-phenylethanone Chemical group NCC(=O)C1=CC=CC=C1 HEQOJEGTZCTHCF-UHFFFAOYSA-N 0.000 description 5
- ZWVHTXAYIKBMEE-UHFFFAOYSA-N 2-hydroxyacetophenone Chemical group OCC(=O)C1=CC=CC=C1 ZWVHTXAYIKBMEE-UHFFFAOYSA-N 0.000 description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 5
- 238000001723 curing Methods 0.000 description 5
- KOMDZQSPRDYARS-UHFFFAOYSA-N cyclopenta-1,3-diene titanium Chemical group [Ti].C1C=CC=C1.C1C=CC=C1 KOMDZQSPRDYARS-UHFFFAOYSA-N 0.000 description 5
- 239000007789 gas Substances 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 238000002360 preparation method Methods 0.000 description 5
- 238000010791 quenching Methods 0.000 description 5
- 230000000171 quenching effect Effects 0.000 description 5
- 238000007740 vapor deposition Methods 0.000 description 5
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 4
- 150000002148 esters Chemical class 0.000 description 4
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- PQXKHYXIUOZZFA-UHFFFAOYSA-M lithium fluoride Chemical compound [Li+].[F-] PQXKHYXIUOZZFA-UHFFFAOYSA-M 0.000 description 4
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- IBHBKWKFFTZAHE-UHFFFAOYSA-N n-[4-[4-(n-naphthalen-1-ylanilino)phenyl]phenyl]-n-phenylnaphthalen-1-amine Chemical compound C1=CC=CC=C1N(C=1C2=CC=CC=C2C=CC=1)C1=CC=C(C=2C=CC(=CC=2)N(C=2C=CC=CC=2)C=2C3=CC=CC=C3C=CC=2)C=C1 IBHBKWKFFTZAHE-UHFFFAOYSA-N 0.000 description 4
- 238000010943 off-gassing Methods 0.000 description 4
- 150000001451 organic peroxides Chemical class 0.000 description 4
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 229920001187 thermosetting polymer Polymers 0.000 description 4
- KOMNUTZXSVSERR-UHFFFAOYSA-N 1,3,5-tris(prop-2-enyl)-1,3,5-triazinane-2,4,6-trione Chemical compound C=CCN1C(=O)N(CC=C)C(=O)N(CC=C)C1=O KOMNUTZXSVSERR-UHFFFAOYSA-N 0.000 description 3
- LOZWAPSEEHRYPG-UHFFFAOYSA-N 1,4-dithiane Chemical group C1CSCCS1 LOZWAPSEEHRYPG-UHFFFAOYSA-N 0.000 description 3
- WYGWHHGCAGTUCH-UHFFFAOYSA-N 2-[(2-cyano-4-methylpentan-2-yl)diazenyl]-2,4-dimethylpentanenitrile Chemical compound CC(C)CC(C)(C#N)N=NC(C)(C#N)CC(C)C WYGWHHGCAGTUCH-UHFFFAOYSA-N 0.000 description 3
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 3
- 239000004793 Polystyrene Substances 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000007983 Tris buffer Substances 0.000 description 3
- 150000004808 allyl alcohols Chemical class 0.000 description 3
- 125000003118 aryl group Chemical group 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 229910001873 dinitrogen Inorganic materials 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 125000001046 glycoluril group Chemical class [H]C12N(*)C(=O)N(*)C1([H])N(*)C(=O)N2* 0.000 description 3
- 229920002223 polystyrene Polymers 0.000 description 3
- 239000011541 reaction mixture Substances 0.000 description 3
- 238000007665 sagging Methods 0.000 description 3
- 239000003381 stabilizer Substances 0.000 description 3
- 150000005846 sugar alcohols Polymers 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2,2'-azo-bis-isobutyronitrile Substances N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 2
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 2
- BJELTSYBAHKXRW-UHFFFAOYSA-N 2,4,6-triallyloxy-1,3,5-triazine Chemical compound C=CCOC1=NC(OCC=C)=NC(OCC=C)=N1 BJELTSYBAHKXRW-UHFFFAOYSA-N 0.000 description 2
- PCKZAVNWRLEHIP-UHFFFAOYSA-N 2-hydroxy-1-[4-[[4-(2-hydroxy-2-methylpropanoyl)phenyl]methyl]phenyl]-2-methylpropan-1-one Chemical compound C1=CC(C(=O)C(C)(O)C)=CC=C1CC1=CC=C(C(=O)C(C)(C)O)C=C1 PCKZAVNWRLEHIP-UHFFFAOYSA-N 0.000 description 2
- LWRBVKNFOYUCNP-UHFFFAOYSA-N 2-methyl-1-(4-methylsulfanylphenyl)-2-morpholin-4-ylpropan-1-one Chemical compound C1=CC(SC)=CC=C1C(=O)C(C)(C)N1CCOCC1 LWRBVKNFOYUCNP-UHFFFAOYSA-N 0.000 description 2
- KUDUQBURMYMBIJ-UHFFFAOYSA-N 2-prop-2-enoyloxyethyl prop-2-enoate Chemical compound C=CC(=O)OCCOC(=O)C=C KUDUQBURMYMBIJ-UHFFFAOYSA-N 0.000 description 2
- DKIDEFUBRARXTE-UHFFFAOYSA-M 3-mercaptopropionate Chemical compound [O-]C(=O)CCS DKIDEFUBRARXTE-UHFFFAOYSA-M 0.000 description 2
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 239000004342 Benzoyl peroxide Substances 0.000 description 2
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 2
- 239000004641 Diallyl-phthalate Substances 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- 235000000126 Styrax benzoin Nutrition 0.000 description 2
- 244000028419 Styrax benzoin Species 0.000 description 2
- 235000008411 Sumatra benzointree Nutrition 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- RUDUCNPHDIMQCY-UHFFFAOYSA-N [3-(2-sulfanylacetyl)oxy-2,2-bis[(2-sulfanylacetyl)oxymethyl]propyl] 2-sulfanylacetate Chemical compound SCC(=O)OCC(COC(=O)CS)(COC(=O)CS)COC(=O)CS RUDUCNPHDIMQCY-UHFFFAOYSA-N 0.000 description 2
- YAAUVJUJVBJRSQ-UHFFFAOYSA-N [3-(3-sulfanylpropanoyloxy)-2-[[3-(3-sulfanylpropanoyloxy)-2,2-bis(3-sulfanylpropanoyloxymethyl)propoxy]methyl]-2-(3-sulfanylpropanoyloxymethyl)propyl] 3-sulfanylpropanoate Chemical compound SCCC(=O)OCC(COC(=O)CCS)(COC(=O)CCS)COCC(COC(=O)CCS)(COC(=O)CCS)COC(=O)CCS YAAUVJUJVBJRSQ-UHFFFAOYSA-N 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 229960002130 benzoin Drugs 0.000 description 2
- 235000019400 benzoyl peroxide Nutrition 0.000 description 2
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- 238000006482 condensation reaction Methods 0.000 description 2
- 239000007822 coupling agent Substances 0.000 description 2
- VFHVQBAGLAREND-UHFFFAOYSA-N diphenylphosphoryl-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 VFHVQBAGLAREND-UHFFFAOYSA-N 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 238000005562 fading Methods 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 235000019253 formic acid Nutrition 0.000 description 2
- 235000019382 gum benzoic Nutrition 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 230000005525 hole transport Effects 0.000 description 2
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 239000012788 optical film Substances 0.000 description 2
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 2
- 239000007870 radical polymerization initiator Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- HEKQWIORQJRILW-UHFFFAOYSA-N tetrakis(prop-2-enyl) benzene-1,2,4,5-tetracarboxylate Chemical compound C=CCOC(=O)C1=CC(C(=O)OCC=C)=C(C(=O)OCC=C)C=C1C(=O)OCC=C HEKQWIORQJRILW-UHFFFAOYSA-N 0.000 description 2
- 150000003573 thiols Chemical class 0.000 description 2
- HVLLSGMXQDNUAL-UHFFFAOYSA-N triphenyl phosphite Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)OC1=CC=CC=C1 HVLLSGMXQDNUAL-UHFFFAOYSA-N 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- 238000001771 vacuum deposition Methods 0.000 description 2
- DHBXNPKRAUYBTH-UHFFFAOYSA-N 1,1-ethanedithiol Chemical compound CC(S)S DHBXNPKRAUYBTH-UHFFFAOYSA-N 0.000 description 1
- BEQKKZICTDFVMG-UHFFFAOYSA-N 1,2,3,4,6-pentaoxepane-5,7-dione Chemical compound O=C1OOOOC(=O)O1 BEQKKZICTDFVMG-UHFFFAOYSA-N 0.000 description 1
- MYWOJODOMFBVCB-UHFFFAOYSA-N 1,2,6-trimethylphenanthrene Chemical compound CC1=CC=C2C3=CC(C)=CC=C3C=CC2=C1C MYWOJODOMFBVCB-UHFFFAOYSA-N 0.000 description 1
- MSAHTMIQULFMRG-UHFFFAOYSA-N 1,2-diphenyl-2-propan-2-yloxyethanone Chemical compound C=1C=CC=CC=1C(OC(C)C)C(=O)C1=CC=CC=C1 MSAHTMIQULFMRG-UHFFFAOYSA-N 0.000 description 1
- QWQFVUQPHUKAMY-UHFFFAOYSA-N 1,2-diphenyl-2-propoxyethanone Chemical compound C=1C=CC=CC=1C(OCCC)C(=O)C1=CC=CC=C1 QWQFVUQPHUKAMY-UHFFFAOYSA-N 0.000 description 1
- DKEGCUDAFWNSSO-UHFFFAOYSA-N 1,8-dibromooctane Chemical compound BrCCCCCCCCBr DKEGCUDAFWNSSO-UHFFFAOYSA-N 0.000 description 1
- KGRVJHAUYBGFFP-UHFFFAOYSA-N 2,2'-Methylenebis(4-methyl-6-tert-butylphenol) Chemical compound CC(C)(C)C1=CC(C)=CC(CC=2C(=C(C=C(C)C=2)C(C)(C)C)O)=C1O KGRVJHAUYBGFFP-UHFFFAOYSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- IMQFZQVZKBIPCQ-UHFFFAOYSA-N 2,2-bis(3-sulfanylpropanoyloxymethyl)butyl 3-sulfanylpropanoate Chemical compound SCCC(=O)OCC(CC)(COC(=O)CCS)COC(=O)CCS IMQFZQVZKBIPCQ-UHFFFAOYSA-N 0.000 description 1
- JHSWSKVODYPNDV-UHFFFAOYSA-N 2,2-bis(prop-2-enoxymethyl)propane-1,3-diol Chemical compound C=CCOCC(CO)(CO)COCC=C JHSWSKVODYPNDV-UHFFFAOYSA-N 0.000 description 1
- NEBBLNDVSSWJLL-UHFFFAOYSA-N 2,3-bis(2-methylprop-2-enoyloxy)propyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC(OC(=O)C(C)=C)COC(=O)C(C)=C NEBBLNDVSSWJLL-UHFFFAOYSA-N 0.000 description 1
- PUGOMSLRUSTQGV-UHFFFAOYSA-N 2,3-di(prop-2-enoyloxy)propyl prop-2-enoate Chemical compound C=CC(=O)OCC(OC(=O)C=C)COC(=O)C=C PUGOMSLRUSTQGV-UHFFFAOYSA-N 0.000 description 1
- MCZNJGGGOFBAKZ-UHFFFAOYSA-N 2-(1,4-dithian-2-yl)ethanethiol Chemical compound SCCC1CSCCS1 MCZNJGGGOFBAKZ-UHFFFAOYSA-N 0.000 description 1
- JJBFVQSGPLGDNX-UHFFFAOYSA-N 2-(2-methylprop-2-enoyloxy)propyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC(C)COC(=O)C(C)=C JJBFVQSGPLGDNX-UHFFFAOYSA-N 0.000 description 1
- GJKGAPPUXSSCFI-UHFFFAOYSA-N 2-Hydroxy-4'-(2-hydroxyethoxy)-2-methylpropiophenone Chemical compound CC(C)(O)C(=O)C1=CC=C(OCCO)C=C1 GJKGAPPUXSSCFI-UHFFFAOYSA-N 0.000 description 1
- BXYWKXBAMJYTKP-UHFFFAOYSA-N 2-[2-[2-[2-(3-sulfanylpropanoyloxy)ethoxy]ethoxy]ethoxy]ethyl 3-sulfanylpropanoate Chemical compound SCCC(=O)OCCOCCOCCOCCOC(=O)CCS BXYWKXBAMJYTKP-UHFFFAOYSA-N 0.000 description 1
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 1
- 125000000022 2-aminoethyl group Chemical group [H]C([*])([H])C([H])([H])N([H])[H] 0.000 description 1
- UHFFVFAKEGKNAQ-UHFFFAOYSA-N 2-benzyl-2-(dimethylamino)-1-(4-morpholin-4-ylphenyl)butan-1-one Chemical compound C=1C=C(N2CCOCC2)C=CC=1C(=O)C(CC)(N(C)C)CC1=CC=CC=C1 UHFFVFAKEGKNAQ-UHFFFAOYSA-N 0.000 description 1
- VIAUVTZHGKIPPJ-UHFFFAOYSA-N 2-methyl-1-(4-prop-1-en-2-ylphenyl)propan-2-ol Chemical compound CC(=C)C1=CC=C(CC(C)(C)O)C=C1 VIAUVTZHGKIPPJ-UHFFFAOYSA-N 0.000 description 1
- VFZKVQVQOMDJEG-UHFFFAOYSA-N 2-prop-2-enoyloxypropyl prop-2-enoate Chemical compound C=CC(=O)OC(C)COC(=O)C=C VFZKVQVQOMDJEG-UHFFFAOYSA-N 0.000 description 1
- PFANXOISJYKQRP-UHFFFAOYSA-N 2-tert-butyl-4-[1-(5-tert-butyl-4-hydroxy-2-methylphenyl)butyl]-5-methylphenol Chemical compound C=1C(C(C)(C)C)=C(O)C=C(C)C=1C(CCC)C1=CC(C(C)(C)C)=C(O)C=C1C PFANXOISJYKQRP-UHFFFAOYSA-N 0.000 description 1
- LZHCVNIARUXHAL-UHFFFAOYSA-N 2-tert-butyl-4-ethylphenol Chemical compound CCC1=CC=C(O)C(C(C)(C)C)=C1 LZHCVNIARUXHAL-UHFFFAOYSA-N 0.000 description 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- XOJWAAUYNWGQAU-UHFFFAOYSA-N 4-(2-methylprop-2-enoyloxy)butyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCCOC(=O)C(C)=C XOJWAAUYNWGQAU-UHFFFAOYSA-N 0.000 description 1
- DBCAQXHNJOFNGC-UHFFFAOYSA-N 4-bromo-1,1,1-trifluorobutane Chemical compound FC(F)(F)CCCBr DBCAQXHNJOFNGC-UHFFFAOYSA-N 0.000 description 1
- JHWGFJBTMHEZME-UHFFFAOYSA-N 4-prop-2-enoyloxybutyl prop-2-enoate Chemical compound C=CC(=O)OCCCCOC(=O)C=C JHWGFJBTMHEZME-UHFFFAOYSA-N 0.000 description 1
- YTZMASWNSUBTPL-UHFFFAOYSA-N 5-(2-sulfanylbutyl)-1,4-dithiane-2-thiol Chemical compound SC(CC1SCC(SC1)S)CC YTZMASWNSUBTPL-UHFFFAOYSA-N 0.000 description 1
- GUUMMYKUXHCHDG-UHFFFAOYSA-N 5-(2-sulfanylpropyl)-1,4-dithiane-2-thiol Chemical compound SC(CC1SCC(SC1)S)C GUUMMYKUXHCHDG-UHFFFAOYSA-N 0.000 description 1
- SAPGBCWOQLHKKZ-UHFFFAOYSA-N 6-(2-methylprop-2-enoyloxy)hexyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCCCCOC(=O)C(C)=C SAPGBCWOQLHKKZ-UHFFFAOYSA-N 0.000 description 1
- FIHBHSQYSYVZQE-UHFFFAOYSA-N 6-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCOC(=O)C=C FIHBHSQYSYVZQE-UHFFFAOYSA-N 0.000 description 1
- IKHGUXGNUITLKF-UHFFFAOYSA-N Acetaldehyde Chemical compound CC=O IKHGUXGNUITLKF-UHFFFAOYSA-N 0.000 description 1
- XZBMNJSXYDAWJZ-UHFFFAOYSA-N CC(C(C)(N1CC=C)N2CC=C)(N(CC=C)C1=O)N(CC=C)C2=O Chemical compound CC(C(C)(N1CC=C)N2CC=C)(N(CC=C)C1=O)N(CC=C)C2=O XZBMNJSXYDAWJZ-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- ZGFPUTOTEJOSAY-UHFFFAOYSA-N FC1=C([Ti])C(F)=CC=C1N1C=CC=C1 Chemical compound FC1=C([Ti])C(F)=CC=C1N1C=CC=C1 ZGFPUTOTEJOSAY-UHFFFAOYSA-N 0.000 description 1
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 1
- OKKRPWIIYQTPQF-UHFFFAOYSA-N Trimethylolpropane trimethacrylate Chemical compound CC(=C)C(=O)OCC(CC)(COC(=O)C(C)=C)COC(=O)C(C)=C OKKRPWIIYQTPQF-UHFFFAOYSA-N 0.000 description 1
- JUDXBRVLWDGRBC-UHFFFAOYSA-N [2-(hydroxymethyl)-3-(2-methylprop-2-enoyloxy)-2-(2-methylprop-2-enoyloxymethyl)propyl] 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC(CO)(COC(=O)C(C)=C)COC(=O)C(C)=C JUDXBRVLWDGRBC-UHFFFAOYSA-N 0.000 description 1
- HVVWZTWDBSEWIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C HVVWZTWDBSEWIH-UHFFFAOYSA-N 0.000 description 1
- JOBBTVPTPXRUBP-UHFFFAOYSA-N [3-(3-sulfanylpropanoyloxy)-2,2-bis(3-sulfanylpropanoyloxymethyl)propyl] 3-sulfanylpropanoate Chemical compound SCCC(=O)OCC(COC(=O)CCS)(COC(=O)CCS)COC(=O)CCS JOBBTVPTPXRUBP-UHFFFAOYSA-N 0.000 description 1
- COYTVZAYDAIHDK-UHFFFAOYSA-N [5-(sulfanylmethyl)-1,4-dithian-2-yl]methanethiol Chemical compound SCC1CSC(CS)CS1 COYTVZAYDAIHDK-UHFFFAOYSA-N 0.000 description 1
- GUCYFKSBFREPBC-UHFFFAOYSA-N [phenyl-(2,4,6-trimethylbenzoyl)phosphoryl]-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C(=O)C1=C(C)C=C(C)C=C1C GUCYFKSBFREPBC-UHFFFAOYSA-N 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000002318 adhesion promoter Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 125000002947 alkylene group Chemical group 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 125000000751 azo group Chemical group [*]N=N[*] 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- JQRRFDWXQOQICD-UHFFFAOYSA-N biphenylen-1-ylboronic acid Chemical compound C12=CC=CC=C2C2=C1C=CC=C2B(O)O JQRRFDWXQOQICD-UHFFFAOYSA-N 0.000 description 1
- ZPOLOEWJWXZUSP-WAYWQWQTSA-N bis(prop-2-enyl) (z)-but-2-enedioate Chemical compound C=CCOC(=O)\C=C/C(=O)OCC=C ZPOLOEWJWXZUSP-WAYWQWQTSA-N 0.000 description 1
- FPODCVUTIPDRTE-UHFFFAOYSA-N bis(prop-2-enyl) hexanedioate Chemical compound C=CCOC(=O)CCCCC(=O)OCC=C FPODCVUTIPDRTE-UHFFFAOYSA-N 0.000 description 1
- 238000005537 brownian motion Methods 0.000 description 1
- CREMABGTGYGIQB-UHFFFAOYSA-N carbon carbon Chemical compound C.C CREMABGTGYGIQB-UHFFFAOYSA-N 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000012933 diacyl peroxide Substances 0.000 description 1
- OTARVPUIYXHRRB-UHFFFAOYSA-N diethoxy-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](C)(OCC)CCCOCC1CO1 OTARVPUIYXHRRB-UHFFFAOYSA-N 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- STVZJERGLQHEKB-UHFFFAOYSA-N ethylene glycol dimethacrylate Substances CC(=C)C(=O)OCCOC(=O)C(C)=C STVZJERGLQHEKB-UHFFFAOYSA-N 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- HOXINJBQVZWYGZ-UHFFFAOYSA-N fenbutatin oxide Chemical compound C=1C=CC=CC=1C(C)(C)C[Sn](O[Sn](CC(C)(C)C=1C=CC=CC=1)(CC(C)(C)C=1C=CC=CC=1)CC(C)(C)C=1C=CC=CC=1)(CC(C)(C)C=1C=CC=CC=1)CC(C)(C)C1=CC=CC=C1 HOXINJBQVZWYGZ-UHFFFAOYSA-N 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- CDOSHBSSFJOMGT-UHFFFAOYSA-N linalool Chemical compound CC(C)=CCCC(C)(O)C=C CDOSHBSSFJOMGT-UHFFFAOYSA-N 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- 125000005641 methacryl group Chemical group 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 150000002923 oximes Chemical class 0.000 description 1
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 125000000864 peroxy group Chemical group O(O*)* 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 125000003356 phenylsulfanyl group Chemical group [*]SC1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- NCNISYUOWMIOPI-UHFFFAOYSA-N propane-1,1-dithiol Chemical compound CCC(S)S NCNISYUOWMIOPI-UHFFFAOYSA-N 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- 230000004580 weight loss Effects 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F36/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, at least one having two or more carbon-to-carbon double bonds
- C08F36/02—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, at least one having two or more carbon-to-carbon double bonds the radical having only two carbon-to-carbon double bonds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
- C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F8/00—Chemical modification by after-treatment
- C08F8/34—Introducing sulfur atoms or sulfur-containing groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G75/00—Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen, or carbon in the main chain of the macromolecule
- C08G75/02—Polythioethers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
- C08K5/37—Thiols
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
Definitions
- the present invention relates to a sealant for a display element that has high shear adhesive strength to an adherend, can suppress generation of outgas, and is excellent in transparency of a cured product.
- liquid crystal display elements In recent years, liquid crystal display elements, organic EL display elements, and the like are widely used as display elements having features such as thinness, light weight, and low power consumption.
- a photocurable resin composition is usually used for sealing a liquid crystal or a light emitting layer, bonding a substrate, an optical film, or a protective film.
- Patent Document 1 discloses a pressure-sensitive adhesive for a polarizing film made of an acrylic resin composition.
- a liquid crystal display element usually has two transparent substrates with electrodes facing each other at a predetermined interval, and the periphery thereof is sealed with a sealant to form a cell, and a liquid crystal injection port provided in a part thereof Then, the liquid crystal is injected into the cell, and the liquid crystal inlet is sealed by using a liquid crystal inlet sealing agent.
- a one-component or two-component curable epoxy resin composition As a sealing agent for liquid crystal inlets, a one-component or two-component curable epoxy resin composition, a photocurable acrylic resin composition as described in Patent Document 1, and the like have been widely used.
- the one-pack type curable epoxy resin composition generally requires a long period of heating at a high temperature, so the productivity is inferior.
- the two-pack type curable epoxy resin composition is a mixture of a main agent and a curing agent. It takes time and effort to do this, and after mixing, it must be used within the pot life (pot life).
- the photo-curable acrylic resin composition is excellent in workability and productivity, but because of its strong interaction with the liquid crystal, it contaminates the liquid crystal and causes color unevenness.
- Patent Document 2 discloses a method of forming a resin film made of an acrylic resin composition on an inorganic material film.
- Patent Document 1 and Patent Document 2 generates a large amount of outgas due to the acrylic resin remaining in the manufacturing process of the display element, and the adhesion and curing. There was a problem that the transparency of things was inferior.
- An object of the present invention is to provide a sealant for a display element that has a high shear adhesive strength to an adherend, can suppress generation of outgas, and is excellent in transparency of a cured product. To do.
- the present invention contains a polythiol compound having two or more thiol groups in one molecule, a polyene compound having two or more carbon-carbon double bonds in one molecule, and a photopolymerization initiator. It is a sealant for display elements having a storage elastic modulus at 80 ° C. of 70 to 1000 MPa. The present invention is described in detail below.
- the present inventor has developed a polythiol compound having two or more thiol groups in one molecule and a polyene compound having two or more carbon-carbon double bonds in one molecule for the purpose of suppressing generation of outgas. And the like (hereinafter also referred to as “ene-thiol resin composition”) were studied. However, when such an ene-thiol resin composition is used, there is a case where sufficient shear adhesive strength to the adherend cannot be obtained. Further, outgas may be generated not only from the resin composition in the middle of curing but also from the cured product, and the problem of outgas generation could not be completely solved.
- the present inventors have adjusted the storage elastic modulus of the ene-thiol resin composition to a specific range, thereby having high shear adhesive strength to the adherend and suppressing outgas generation. It has been found that a sealant for a display element can be obtained that is excellent in the transparency of the cured product, and the present invention has been completed.
- the sealant for display element of the present invention comprises a polythiol compound having two or more thiol groups in one molecule (hereinafter also simply referred to as “polythiol compound”) and two or more carbon-carbon dicarbons in one molecule. It contains a polyene compound having a heavy bond (hereinafter also simply referred to as “polyene compound”).
- the sealing agent for display elements of the present invention containing these components is excellent in the transparency of the cured product and can suppress the generation of outgas.
- the “carbon-carbon double bond” means an ethylenically unsaturated bond.
- polythiol compound examples include aliphatic polythiols such as ethanedithiol (molecular weight 94), propanedithiol (molecular weight 108), hexamethylenedithiol (molecular weight 150), decamethylenedithiol (molecular weight 206), and xylenedithiol (molecular weight 170).
- aliphatic polythiols such as ethanedithiol (molecular weight 94), propanedithiol (molecular weight 108), hexamethylenedithiol (molecular weight 150), decamethylenedithiol (molecular weight 206), and xylenedithiol (molecular weight 170).
- An aromatic polythiol such as the following, a cyclic sulfide compound such as a 1,4-dithiane ring-containing polythiol compound represented by the following formula (1), an ester bond-containing polythiol compound represented by the following formula (2), triglycol Examples include other polythiol compounds such as dimercaptan (molecular weight 182). These polythiol compounds may be used independently and may be used in combination of 2 or more type.
- l represents an integer of 1 to 5.
- R 1 is an alkylene group having 1 to 12 carbon atoms
- R 2 is an alkyl group having 1 to 12 carbon atoms.
- m is an integer of 0 to 2
- n is an integer of 2 to 4
- n + m 4.
- 1,4-dithiane ring-containing polythiol compound represented by the above formula (1) examples include 2,5-dimercaptomethyl-1,4-dithiane (molecular weight 212), 2,5-dithiane.
- Mercaptoethyl-1,4-dithiane molecular weight 240
- 2,5-dimercaptopropyl-1,4-dithiane molecular weight 268
- 2,5-dimercaptobutyl-1,4-dithiane molecular weight 296)
- an ester bond-containing polythiol compound represented by the above formula (2) is preferable, and m in the above formula (2) is The compound which is 0 or 1 (n is 4 or 3) is more preferable.
- ester bond-containing polythiol compound represented by the above formula (2) examples include trimethylolpropane tris (3-mercaptopropionate) (molecular weight 398), tris ((3-mercaptopropionyloxy)- Ethyl) isocyanurate (molecular weight 526), pentaerythritol tetrakisthioglycolate (molecular weight 433), pentaerythritol tetrakis (3-mercaptopropionate) (molecular weight 489), tetraethylene glycol bis (3-mercaptopropionate) (molecular weight) 372).
- the polythiol compound preferably has four or more thiol groups in one molecule because the obtained sealant for display elements has a high shear adhesive strength to the adherend.
- polythiol compound having 4 or more thiol groups in one molecule examples include dipentaerythritol hexakis (3-mercaptopropionate) (molecular weight 783), pentaerythritol tetrakisthioglycolate (molecular weight 433), pentaerythritol tetrakis. (3-mercaptopropionate) (molecular weight 489), tris [(3-mercaptopropionyloxy) -ethyl] isocyanurate (molecular weight 526) and the like. Among them, it is preferable to have 6 or more thiol groups in one molecule, and dipentaerythritol hexakis (3-mercaptopropionate) is more preferable.
- the polythiol compound preferably has a molecular weight of 400 or more. By using a polythiol compound having a molecular weight of 400 or more, outgassing can be further suppressed.
- the minimum with more preferable molecular weight of the said polythiol compound is 500, and a still more preferable minimum is 600.
- the preferred upper limit of the molecular weight of the polythiol compound is 6000. When the polythiol compound having a molecular weight exceeding 6000 is used, the obtained sealing agent for a display element may have a viscosity that is too high to be inferior in applicability.
- a more preferable upper limit of the molecular weight of the polythiol compound is 2000, and a more preferable upper limit is 1000.
- molecular weight when using an oligomer as the said polythiol compound or the said polyene compound, molecular weight may be represented using a weight average molecular weight.
- the “weight average molecular weight” is a value determined by polystyrene conversion after measurement by gel permeation chromatography (GPC). Examples of the column used when measuring the weight average molecular weight in terms of polystyrene by GPC include Shodex LF-804 (manufactured by Showa Denko).
- polyene compound examples include allyl alcohol derivatives, esters obtained by reaction of (meth) acrylic acid and polyhydric alcohol, urethane acrylate, divinylbenzene (molecular weight 130), and the like. These polyene compounds may be used alone or in combination of two or more.
- (meth) acryl means acryl or methacryl.
- allyl alcohol derivatives examples include triallyl cyanurate (molecular weight 249), triallyl isocyanurate (molecular weight 249), diallyl maleate (molecular weight 196), diallyl adipate (molecular weight 226), diallyl phthalate (molecular weight 246), triaryl Allyl trimellitate (molecular weight 330), tetraallyl pyromellitate (molecular weight 414), glyceryl diallyl ether (molecular weight 172), trimethylolpropane diallyl ether (molecular weight 214), pentaerythritol diallyl ether (molecular weight 216), pentaerythritol triallyl And ether (molecular weight 256).
- esters obtained by the reaction of the (meth) acrylic acid and the polyhydric alcohol include, for example, ethylene glycol diacrylate (molecular weight 170), ethylene glycol dimethacrylate (molecular weight 198), propylene glycol diacrylate (molecular weight 185), Propylene glycol dimethacrylate (molecular weight 212), 1,4-butanediol diacrylate (molecular weight 198), 1,4-butanediol dimethacrylate (molecular weight 226), 1,6-hexanediol diacrylate (molecular weight 226), 1, 6-hexanediol dimethacrylate (molecular weight 254), glycerol triacrylate (molecular weight 254), glycerol trimethacrylate (molecular weight 296), trimethylolpropane triacrylate (molecular weight 296) , Trimethylolpropane trimethacrylate (molecular weight 338
- the polyene compound preferably has a cyclic structure because the obtained sealant for display elements has a high shear adhesive strength to the adherend.
- the cyclic structure may be an aliphatic ring or an aromatic ring, but is preferably an aromatic ring because it is particularly excellent in the effect of improving the shear bond strength to the adherend. .
- polyene compound having a cyclic structure examples include divinylbenzene (molecular weight 130), triallyl cyanurate (molecular weight 249), triallyl isocyanurate (molecular weight 249), diallyl phthalate (molecular weight 246), and triallyl trimelli.
- Tate molecular weight 330
- tetraallyl pyromellitate molecular weight 41
- triallyl isocyanurate derivative represented by the following formula (3)
- glycoluril derivative molecular weight 330
- glycoluril derivatives represented by the following formula (4)
- glycoluril derivatives represented by the following formula (5).
- a polyene oligomer is also suitably used as the polyene compound.
- the polyene monomer derived from the polyene oligomer include allyl alcohol derivatives, esters obtained by the reaction of (meth) acrylic acid and polyhydric alcohol, urethane acrylate, divinylbenzene and the like described above as the polyene compound.
- Examples of the method for producing the polyene oligomer include a method of reacting the polyene monomer in the presence of an initiator such as benzoyl peroxide.
- the polyene compound preferably has a molecular weight of 300 or more. By using a polyene compound having a molecular weight of 300 or more, outgassing can be further suppressed.
- the more preferable lower limit of the molecular weight of the polyene compound is 350, the more preferable lower limit is 400, and the particularly preferable lower limit is 500.
- the preferred upper limit of the molecular weight of the polyene compound is 6000. When the polyene compound having a molecular weight exceeding 6000 is used, the obtained sealant for a display element may be too poor in applicability due to excessively high viscosity.
- a more preferable upper limit of the molecular weight of the polyene compound is 2000, and a more preferable upper limit is 1000.
- the preferable lower limit of the content of the polyene compound in the total 100 parts by weight of the polythiol compound and the polyene compound or the total of 100 parts by weight of the polythiol compound, the polyene compound, and the thioether oligomer described later is 10 parts by weight, and the preferable upper limit is 70 Parts by weight.
- the content of the polyene compound is less than 10 parts by weight, the obtained sealant for display element may be inferior in applicability. If the content of the polyene compound exceeds 70 parts by weight, the generation of outgas may not be sufficiently suppressed.
- a more preferable upper limit of the content of the polyene compound is 60 parts by weight, and a more preferable upper limit is 40 parts by weight.
- the preferred lower limit of the number of moles of carbon-carbon double bonds in the polyene compound is 60% and the preferred upper limit is 150% with respect to the number of moles of thiol groups in the polythiol compound. If the number of moles of carbon-carbon double bonds in the polyene compound is less than 60% or more than 150%, generation of outgas may not be sufficiently suppressed.
- the number of moles of carbon-carbon double bonds in the polyene compound is more preferably a lower limit of 70%, more preferably an upper limit of 135%, and still more preferably a lower limit of 80%, relative to the number of moles of the thiol group of the polythiol compound.
- a preferable upper limit is 120%.
- the sealing agent for display elements of this invention may contain the thioether oligomer formed by making a polythiol compound and a polyene compound react.
- the viscosity of the sealant for display elements is appropriately increased, and unevenness is less likely to occur during application.
- the thioether oligomer can be added to both ends by heating the polythiol compound and an equimolar amount or an excess amount of the polyene compound with respect to the polythiol compound in the presence of a thermal polymerization initiator to cause an addition polymerization reaction. It is obtained in the reaction mixture as a polymer having a carbon-carbon double bond of a polyene compound.
- the thioether oligomer may contain an unreacted thiol group or may not contain an unreacted thiol group.
- it may be a thioether oligomer containing no thiol group obtained by sufficiently proceeding the addition polymerization reaction between the polythiol compound and the polyene compound, or obtained by stopping the reaction in the middle of the addition polymerization reaction. It may be a thioether oligomer containing an unreacted thiol group.
- thermal polymerization initiator used in the addition polymerization reaction between the polythiol compound and the polyene compound examples include a thermal radical polymerization initiator.
- the said thermal radical polymerization initiator is not specifically limited, For example, what consists of an azo compound, an organic peroxide, etc. is mentioned.
- the organic peroxide include benzoyl peroxide, ketone peroxide, peroxyketal, hydroperoxide, dialkyl peroxide, peroxyester, diacyl peroxide, and peroxydicarbonate.
- the azo compound include 2,2′-azobis (2,4-dimethylvaleronitrile), azobisisobutyronitrile, and the like.
- the minimum with a preferable weight average molecular weight of the said thioether oligomer is 500, and a preferable upper limit is 40,000.
- the weight average molecular weight of the thioether oligomer is less than 500, the effect of preventing unevenness during application of the obtained sealant for display element may not be sufficiently exhibited.
- the weight average molecular weight of the thioether oligomer is more than 40,000, the resulting sealant for display elements may have a too high viscosity and poor applicability.
- the minimum with a more preferable weight average molecular weight of the said thioether oligomer is 1000, and a more preferable upper limit is 10,000.
- the minimum with preferable content of the said thioether oligomer in 100 weight part of total of a polythiol compound, a polyene compound, and a thioether oligomer is 20 weight part, and a preferable upper limit is 80 weight part.
- a preferable upper limit is 80 weight part.
- content of the thioether oligomer is less than 20 parts by weight, the effect of preventing unevenness during application of the obtained sealant for display element may not be sufficiently exhibited.
- the minimum with more preferable content of the said thioether oligomer is 30 weight part, and a more preferable upper limit is 60 weight part.
- the sealing agent for display elements of this invention may contain other curable resins other than the said polythiol compound and the said polyene compound.
- the other curable resin is not particularly limited as long as it is cured by light or heat, and examples thereof include (meth) acrylic resins such as epoxy (meth) acrylate and urethane (meth) acrylate, and the polyene Non-compounds (monofunctional (meth) acryloyl group), epoxy resins, partial (meth) acryl-modified epoxy resins other than the above polyene compounds (monofunctional (meth) acryloyl group), etc. Is mentioned.
- the “(meth) acrylate” means acrylate or methacrylate
- the “epoxy (meth) acrylate” means that all epoxy groups in the epoxy resin are reacted with (meth) acrylic acid.
- the “(meth) acrylic resin” means a resin having a (meth) acryloyl group
- the “(meth) acryloyl group” means an acryloyl group or a methacryloyl group.
- the “partially (meth) acryl-modified epoxy resin” is a resin having an epoxy group and an acryloyl group or a methacryloyl group in one molecule.
- the sealing agent for display elements of this invention contains a photoinitiator.
- the photopolymerization initiator preferably has a molecular weight of 220 to 1500.
- the sealant for display element of the present invention can suppress the generation of outgas. If the molecular weight of the photopolymerization initiator is less than 220, it may cause outgassing. When the molecular weight of the photopolymerization initiator exceeds 1500, it may be difficult to cure.
- the molecular weight is preferably 300 to 1000, and more preferably 350 to 700.
- Examples of the photopolymerization initiator having a molecular weight of 220 to 1500 include compounds having an acylphosphine oxide skeleton, compounds having an ⁇ -aminoacetophenone skeleton, compounds having a benzyl ketal skeleton, compounds having an ⁇ -hydroxyacetophenone skeleton, benzoin Examples thereof include a compound having a skeleton, a compound having an oxime ester skeleton, a compound having a titanocene skeleton, an organic peroxide, an azo compound, and an oligomer compound.
- a compound having an acylphosphine oxide skeleton, a compound having an ⁇ -aminoacetophenone skeleton, a compound having a benzyl ketal skeleton, a compound having an ⁇ -hydroxyacetophenone skeleton, a compound having a benzoin skeleton, and an oxime It is preferably at least one selected from the group consisting of a compound having an ester skeleton, a compound having a titanocene skeleton, and an oligomer compound.
- photopolymerization initiators may be used alone or in combination of two or more.
- the compound having an acylphosphine oxide skeleton means a compound in which a part of the acylphosphine oxide is substituted with another group.
- the compound having the ⁇ -aminoacetophenone skeleton means a compound in which a part of ⁇ -aminoacetophenone is substituted with another group.
- the compound having a benzyl ketal skeleton means a compound in which a part of ⁇ -dihydroxyacetophenone is substituted with another group.
- the compound having the ⁇ -hydroxyacetophenone skeleton means a compound in which a part other than the hydroxyl group of ⁇ -monohydroxyacetophenone is substituted with another group.
- the compound having the benzoin skeleton means a compound in which a part of benzoin is substituted with another group.
- the compound having an oxime ester skeleton means a compound in which a part of N-acetyldimethyloxime is substituted with another group.
- the compound having a titanocene skeleton means a compound in which a part of titanocene is substituted with another group.
- the organic peroxide means a compound having a peroxy group.
- the azo compound means a compound having an azo group.
- Examples of the compound having an acylphosphine oxide skeleton include 2,4,6-trimethylbenzoyldiphenylphosphine oxide (BASF Japan, “LUCILIN TPO”), bis (2,4,6-trimethylbenzoyl) phenylphosphine oxide. ("BASF Japan,” IRGACURE 819 ").
- Examples of the compound having an ⁇ -aminoacetophenone skeleton include 2-methyl-1- (4-methylthiophenyl) -2-morpholinopropan-1-one (manufactured by BASF Japan, “IRGACURE 907”), 2- Benzyl-2-dimethylamino-1- (4-morpholinophenyl) butanone (BASF manufactured by Japan, “IRGACURE 369”), 1,2- (dimethylamino) -2-((4-methylphenyl) methyl)- 1- (4- (4-morpholinyl) phenyl) -1-butanone (BASF Japan, “IRGACURE 379”) and the like.
- Examples of the compound having a benzyl ketal skeleton include 2,2-dimethoxy-1,2-diphenylethane-1-one (manufactured by BASF Japan, “IRGACURE 651”).
- Examples of the compound having an ⁇ -hydroxyacetophenone skeleton include 2-hydroxy-1- (4- (4- (2-hydroxy-2-methyl-propionyl) -benzyl) phenyl) -2-methyl-propane-1 -ON (BASF Japan, “IRGACURE 127”) and the like.
- Examples of the compound having a benzoin skeleton include benzoin n-propyl ether, benzoin isopropyl ether, and benzoin isobutyl ether.
- Examples of the compound having an oxime ester skeleton include 1,2-octanedione-1- (4- (phenylthio) -2- (O-benzoyloxime)) (manufactured by BASF Japan, “IRGACURE OXE01”), ethanone -1- (9-ethyl-6- (2-methylbenzoyl) -9H-carbazol-3-yl) -1- (0-acetyloxime) (manufactured by BASF Japan, “IRGACURE OXE02”) and the like.
- Examples of the compound having a titanocene skeleton include bis ( ⁇ 5-2,4-cyclopentadien-1-yl) -bis (2,6-difluoro-3- (1H-pyrrol-1-yl) -phenyl) titanium. (BASF Japan, “IRGACURE 784”).
- the oligomer compound preferably has a polymerization degree of 2 to 10 from the viewpoint of reducing outgassing.
- Specific examples include oligo (2-hydroxy-2-methyl-1- (4- (1-methylvinyl) phenyl) propane) (manufactured by Lamberti, “ESACURE KIP 150”, “ESCURE1”). .
- photopolymerization initiator having a molecular weight of 220 to 1500 include 1- (4- (2-hydroxyethoxy) -phenyl) -2-hydroxy-2-methyl-1-propane-1- ON (manufactured by BASF Japan, “IRGACURE 2959” (molecular weight 224)), triphenyl phosphite and the like.
- the lower limit of the content of the photopolymerization initiator is preferably 0.1 with respect to a total of 100 parts by weight of the polythiol compound and the polyene compound or a total of 100 parts by weight of the polythiol compound, the polyene compound, and the thioether oligomer. Part by weight, the preferred upper limit is 5 parts by weight.
- the content of the photopolymerization initiator is less than 0.1 parts by weight, the photopolymerization of the obtained sealant for display elements may not sufficiently proceed.
- the content of the photopolymerization initiator exceeds 5 parts by weight, the curing reaction becomes too fast, the workability is deteriorated, or the cured product of the obtained sealant for display elements is not uniform. There is.
- the minimum with more preferable content of the said photoinitiator is 0.3 weight part, and a more preferable upper limit is 3 weight part.
- the sealant for display elements of the present invention may contain a thermal polymerization initiator.
- a thermal polymerization initiator the same thermal polymerization initiator used for the addition polymerization reaction of the polythiol compound and the polyene compound can be used.
- the sealant for display elements of the present invention may contain a thermosetting agent.
- the said thermosetting agent will not be specifically limited if the hardened
- thermosetting agents examples include HN-2200, HN-2000, HN-5500, MHAC-P (all manufactured by Hitachi Chemical Co., Ltd.), Fuji Cure 7000, Fuji Cure 7001, Fuji Cure 7002, and Tomide. 410-N, tomide 215-70X, tomide 423, tomide 437, tomide TXC-636-A (all manufactured by T & K TOKA), MEH-8000H, MEH-8005 (all manufactured by Meiwa Kasei) and the like.
- the sealant for display elements of the present invention may contain an adhesion promoter.
- the adhesion-imparting agent include 3-methacryloxypropyltrimethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, N- (aminoethyl) aminopropyltrimethoxy
- silane coupling agents such as silane and mercaptopropyltrimethoxysilane, titanium coupling agents, and aluminum coupling agents. These adhesiveness imparting agents may be used alone or in combination of two or more.
- the sealing agent for display elements of the present invention may contain a stabilizer for the purpose of preventing oxidation or the like.
- the stabilizer include 2,2′-methylenebis- (4-methyl-6-tert-butylphenol), 4,4′-butylidenebis- (6-tert-butyl-3-methylphenol), 2,2 Examples include '-methylenebis- (4-ethyl-6-t-butylphenol). These stabilizers may be used independently and 2 or more types may be used together.
- the sealant for display element of the present invention further includes a filler, a curing accelerator, a plasticizer, a surfactant, a flame retardant, an antistatic agent, an antifoaming agent, and a leveling agent as long as the object of the present invention is not impaired.
- an additive such as an ultraviolet absorber or an organic solvent may be contained, but from the viewpoint of ensuring transparency, it is preferable not to contain the filler.
- the sealant for display element of the present invention for example, a polythiol compound, a polyene compound, a photopolymerization initiator, and an adhesiveness-imparting agent that is added as necessary, using a stirrer.
- a polythiol compound for example, a polythiol compound, a polyene compound, a photopolymerization initiator, and an adhesiveness-imparting agent that is added as necessary, using a stirrer.
- the method of mixing uniformly is mentioned.
- the sealing agent for display elements of the present invention has a preferred lower limit of viscosity of 0.4 Pa ⁇ s and a preferred upper limit of 40 Pa ⁇ s measured using a cone rotor viscometer under the conditions of 20 ° C. and 20 rpm.
- the viscosity is less than 0.4 Pa ⁇ s, composition unevenness occurs in the obtained sealant for display element, and the cured product may be inferior in transparency.
- the viscosity exceeds 40 Pa ⁇ s, the application may be cut off during application.
- the more preferred lower limit of the viscosity is 0.5 Pa ⁇ s
- the more preferred upper limit is 10 Pa ⁇ s
- the still more preferred lower limit is 1 Pa ⁇ s
- the still more preferred upper limit is 6 Pa ⁇ s
- the particularly preferred lower limit is 2 Pa ⁇ s
- the particularly preferred upper limit is 4 Pa. -S.
- the sealant for display elements of the present invention can be cured by light irradiation.
- Examples of the method for photocuring the sealant for display elements of the present invention include a method of irradiating light having a wavelength of 300 to 400 nm and an integrated light amount of 300 to 3000 mJ / cm 2 .
- Examples of the light source for irradiating the sealing agent for display element of the present invention with light include a low pressure mercury lamp, a medium pressure mercury lamp, a high pressure mercury lamp, an ultrahigh pressure mercury lamp, an excimer laser, a chemical lamp, a black light lamp, and a microwave excitation mercury lamp. , Metal halide lamps, sodium lamps, halogen lamps, xenon lamps, LED lamps, fluorescent lamps, sunlight, electron beam irradiation devices, and the like. These light sources may be used independently and 2 or more types may be used together.
- Examples of light irradiation means for the sealant for display elements of the present invention include simultaneous irradiation of various light sources, sequential irradiation with a time difference, combined irradiation of simultaneous irradiation and sequential irradiation, etc. Irradiation means may be used.
- the lower limit of the storage elastic modulus at 80 ° C. of the cured product is 70 MPa, and the upper limit is 1000 MPa. If the storage elastic modulus is outside this range, the shear bond strength to the adherend may be inferior, or generation of outgas due to the cured product may not be sufficiently suppressed.
- the preferable lower limit of the storage elastic modulus is 90 MPa, the preferable upper limit is 500 MPa, the more preferable lower limit is 100 MPa, the more preferable upper limit is 300 MPa, the still more preferable lower limit is 110 MPa, and the further preferable upper limit is 200 MPa.
- the said storage elastic modulus can be measured by using a viscoelasticity measuring apparatus.
- cured material which measures the said storage elastic modulus can be produced by irradiating the sealing agent for display elements with 50 mW / cm ⁇ 2 > ultraviolet-ray for 40 second.
- cured material is 50 degreeC. If the glass transition temperature is less than 50 ° C., the shear bond strength to the adherend may be inferior, or generation of outgas due to the cured product may not be sufficiently suppressed.
- the minimum with said more preferable glass transition temperature is 65 degreeC.
- the “glass transition temperature” means a temperature at which a maximum due to micro-Brownian motion appears in the maximum of loss tangent (tan ⁇ ) obtained by dynamic viscoelasticity measurement. The glass transition temperature can be measured by a conventionally known method using a viscoelasticity measuring device or the like.
- cured material which measures the said glass transition temperature can be produced by irradiating the ultraviolet ray of 50 mW / cm ⁇ 2 > for 40 second to the sealing agent for display elements.
- the preferable lower limit of the light transmittance at a wavelength of 380 to 780 nm of the cured product of the transparent sealing agent for display elements of the present invention is 85%.
- the light transmittance is less than 85%, the transparency is inferior, and it may be unsuitable for use in sealing the entire surface of the display element.
- a more preferable lower limit of the light transmittance is 95%.
- the light transmittance was obtained by producing a transmittance measurement sample by irradiating a transparent sealing agent for display element sandwiched between PET resin films with 50 mW / cm 2 of ultraviolet light for 40 seconds.
- the transmittance measurement sample can be measured using a spectrophotometer.
- the sealing agent for display elements of this invention is used in order to seal the surface of a display element, the whole surface, a front surface, a rear surface, or the circumference
- the “entire surface” does not necessarily mean 100% of the surface of the display element, but means a necessary sealing surface required for the display element.
- the “front surface” means a surface from which light is extracted, that is, a surface on the viewing side.
- the sealant for display elements of the present invention can be used, for example, as a sealant for organic EL display elements, a sealant for liquid crystal display elements, a sealant for electrochromic substrates, a sealant for electronic paper, and the like. .
- ADVANTAGE OF THE INVENTION according to this invention, it has high shear adhesive strength with respect to a to-be-adhered body, can suppress generation
- thioether oligomer A As a thermal polymerization initiator, dipentaerythritol hexakis (60 parts by weight of 3-mercaptopropionate) as a polythiol compound and 40 parts by weight of a glycoluril derivative represented by the above formula (4) as a polyene compound are heated and stirred. 0.2 part by weight of 2,2'-azobis (2,4-dimethylvaleronitrile) is gradually added, the resulting reaction mixture is poured into a poor solvent, the precipitated oligomer is collected, and the solvent is removed under vacuum. As a result, thioether oligomer A was obtained.
- the weight average molecular weight in terms of polystyrene was measured by gel permeation chromatography (GPC) using Shodex LF-804 (manufactured by Showa Denko KK) as a column.
- GPC gel permeation chromatography
- Shodex LF-804 manufactured by Showa Denko KK
- the measurement by GPC was performed under a temperature condition of 40 ° C. by flowing 50 ⁇ L of a tetrahydrofuran solution containing 0.5% by weight of thioether oligomer A at a flow rate of 1 mL / min.
- Examples 1 to 11, Comparative Examples 1 to 9 According to the mixing ratios described in Tables 1 and 2, each material was mixed using a stirrer (manufactured by Shinto Kagaku Co., Ltd., “Three-One Motor HEIDON BLH300”), whereby Examples 1 to 11 and Comparative Examples 1 to Nine display element sealants were prepared.
- a stirrer manufactured by Shinto Kagaku Co., Ltd., “Three-One Motor HEIDON BLH300”
- Each sealant for display elements obtained in Examples and Comparative Examples contains a resin spacer (Sekisui Chemical Co., Ltd., “Micropearl SP-205”) having an average particle diameter of 0 ⁇ m. After mixing to 1 wt% and applying to one of two glass plates (length 45 mm, width 25 mm), the other glass plate was stacked and bonded together, and 50 mW / cm 2 using a high pressure mercury lamp. Was irradiated for 40 seconds to prepare a sample for a shear bond strength test.
- the tensile test was done at a speed
- the shear bond strength was evaluated by assuming that the shear bond strength was 3 MPa or more as “ ⁇ ”, 2 MPa or more and less than 3 MPa as “ ⁇ ”, and less than 2 MPa as “X”.
- Display performance of display element (8-1) Display performance of liquid crystal display element (production of liquid crystal display element) Prepare two glass substrates (length 25mm, width 25mm, thickness 0.7mm) on which an ITO electrode with a thickness of 1000mm is formed on the surface and then an orientation film with a thickness of 800mm is applied on the surface by spin coating. Then, using a thermosetting epoxy resin (peripheral sealant) on one substrate, printing of a pattern in which a liquid crystal injection port was provided was performed by screen printing. Next, the substrate on which the pattern was printed was kept at 80 ° C. for 3 minutes to perform preliminary drying and fusion of the peripheral sealant to the substrate, and then returned to room temperature.
- a thermosetting epoxy resin peripheral sealant
- each substrate was bonded, and the peripheral sealant was cured by hot pressing heated to 130 ° C. for 2 hours to obtain an empty cell. .
- the obtained empty cell was vacuum-sucked, and then liquid crystal (“ZLI-479232” manufactured by Merck & Co., Inc.) was injected from the injection port.
- the injection port was sealed in each display element obtained in Examples and Comparative Examples.
- the sealing agent was cured by irradiating with 50 mW / cm 2 of ultraviolet rays for 40 seconds using a high-pressure mercury lamp. Thereafter, the liquid crystal was annealed at 120 ° C. for 1 hour to produce a liquid crystal display element.
- this substrate is fixed to the substrate folder of the vacuum deposition apparatus, and 200 mg of N, N′-di (1-naphthyl) -N, N′-diphenylbenzidine ( ⁇ -NPD) is put into an unglazed crucible and other different types.
- 200 mg of tris (8-hydroxyquinola) aluminum (Alq 3 ) was put in an unglazed crucible, and the pressure in the vacuum chamber was reduced to 1 ⁇ 10 ⁇ 4 Pa. Thereafter, the crucible containing ⁇ -NPD was heated, and ⁇ -NPD was deposited on the substrate at a deposition rate of 15 s / s to form a 600 ⁇ ⁇ hole transport layer.
- the crucible containing Alq 3 was heated to form an organic light emitting material layer having a thickness of 600 ⁇ at a deposition rate of 15 ⁇ / s. Thereafter, the substrate on which the hole transport layer and the organic light emitting material layer are formed is transferred to another vacuum vapor deposition apparatus, and 200 mg of lithium fluoride is added to a tungsten resistance heating boat in the vacuum vapor deposition apparatus, and aluminum is added to another tungsten boat. 1.0 g of wire was added.
- the inside of the vapor deposition unit of the vacuum vapor deposition apparatus is depressurized to 2 ⁇ 10 ⁇ 4 Pa to form a lithium fluoride film with a thickness of 5 mm at a deposition rate of 0.2 kg / s, and then aluminum with a film thickness of 1000 mm at a rate of 20 kg / s. did.
- the inside of the vapor deposition apparatus was returned to normal pressure with nitrogen, and the substrate on which the laminate including the organic light emitting material layer of 10 mm ⁇ 10 mm was arranged was taken out.
- a mask having an opening of 13 mm ⁇ 13 mm is installed so as to cover the entire laminate of the substrate on which the laminate including the obtained organic light emitting material layer is disposed, and the inorganic material film A is formed by plasma CVD. Formed.
- SiH 4 gas and nitrogen gas are used as source gases, the flow rates are 10 sccm and 200 sccm, RF power is 10 W (frequency: 2.45 GHz), chamber temperature is 100 ° C., and chamber pressure is 0. The test was performed at 9 Torr.
- the formed inorganic material film A had a thickness of about 0.2 ⁇ m.
- a mask having an opening of 12 mm ⁇ 12 mm is installed so as to cover the entire 11 mm ⁇ 11 mm resin protective film of the substrate on which the resin protective film is formed, and an inorganic material film B is formed by plasma CVD and displayed.
- An element organic EL display element
- SiH 4 gas and nitrogen gas are used as source gases, the flow rates of each are SiH 4 gas 10 sccm, nitrogen gas 200 sccm, RF power 10 W (frequency 2.45 GHz), chamber temperature 100 ° C., chamber The test was performed under the condition that the internal pressure was 0.9 Torr.
- the formed inorganic material film B had a thickness of about 1 ⁇ m.
- ADVANTAGE OF THE INVENTION according to this invention, it has high shear adhesive strength with respect to a to-be-adhered body, can suppress generation
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Abstract
Description
液晶表示素子は、通常、2枚の電極付き透明基板を所定の間隔をおいて対向させ、その周囲を封止剤で封着してセルを形成し、その一部に設けられた液晶注入口からセル内に液晶を注入し、この液晶注入口を、液晶注入口用封止剤を用いて封止することにより製造される。従来、液晶注入口用封止剤としては、1液型又は2液型の硬化性エポキシ樹脂組成物や、特許文献1に記載されているような光硬化型のアクリル系樹脂組成物等が広く用いられてきた。しかしながら、1液型の硬化性エポキシ樹脂組成物は、一般的に高温で長時間の加熱を要するため生産性に劣り、2液型の硬化性エポキシ樹脂組成物は、主剤と硬化剤とを混合するのに手間がかかり、また、混合後は可使時間(ポットライフ)内に使用しなければならないため、特に作業性に劣るものであった。一方、光硬化型のアクリル系樹脂組成物は、作業性や生産性には優れているものの、液晶との相互作用が強いため液晶を汚染して色むらを生じたり、表示素子の製造過程で残存するアクリル樹脂により多量のアウトガスを発生させたり、接着性や硬化物の透明性に劣るものであったりするという問題があった。
また、有機EL表示素子では、有機発光材料層や電極が外気に曝されると、その性能が急激に劣化してしまうため、有機EL表示素子の安定性や耐久性を高めるために、有機発光材料層と電極とを、無機材料膜を介して樹脂膜で被覆して封止する方法が提案されている。例えば、特許文献2には、無機材料膜の上にアクリル系の樹脂組成物からなる樹脂膜を形成する方法が開示されている。 In a liquid crystal display element, an optical film such as a polarizing film or a protective film is attached to the surface of a substrate via an adhesive. For example, Patent Document 1 discloses a pressure-sensitive adhesive for a polarizing film made of an acrylic resin composition.
A liquid crystal display element usually has two transparent substrates with electrodes facing each other at a predetermined interval, and the periphery thereof is sealed with a sealant to form a cell, and a liquid crystal injection port provided in a part thereof Then, the liquid crystal is injected into the cell, and the liquid crystal inlet is sealed by using a liquid crystal inlet sealing agent. Conventionally, as a sealing agent for liquid crystal inlets, a one-component or two-component curable epoxy resin composition, a photocurable acrylic resin composition as described in Patent Document 1, and the like have been widely used. Has been used. However, the one-pack type curable epoxy resin composition generally requires a long period of heating at a high temperature, so the productivity is inferior. The two-pack type curable epoxy resin composition is a mixture of a main agent and a curing agent. It takes time and effort to do this, and after mixing, it must be used within the pot life (pot life). On the other hand, the photo-curable acrylic resin composition is excellent in workability and productivity, but because of its strong interaction with the liquid crystal, it contaminates the liquid crystal and causes color unevenness. There existed a problem that a large amount of outgas was generated by the remaining acrylic resin, or the adhesiveness and transparency of the cured product were inferior.
In addition, in the organic EL display element, when the organic light emitting material layer and the electrode are exposed to the outside air, the performance of the organic EL display element deteriorates rapidly. Therefore, in order to increase the stability and durability of the organic EL display element, There has been proposed a method in which a material layer and an electrode are covered with a resin film via an inorganic material film and sealed. For example, Patent Document 2 discloses a method of forming a resin film made of an acrylic resin composition on an inorganic material film.
以下に本発明を詳述する。 The present invention contains a polythiol compound having two or more thiol groups in one molecule, a polyene compound having two or more carbon-carbon double bonds in one molecule, and a photopolymerization initiator. It is a sealant for display elements having a storage elastic modulus at 80 ° C. of 70 to 1000 MPa.
The present invention is described in detail below.
そこで本発明者は鋭意検討した結果、エン-チオール系樹脂組成物の貯蔵弾性率を特定の範囲に調整することにより、被着体に対して高いせん断接着強度を有し、アウトガスの発生を抑制することができ、かつ、硬化物の透明性に優れる表示素子用封止剤を得ることができることを見出し、本発明を完成させるに至った。 The present inventor has developed a polythiol compound having two or more thiol groups in one molecule and a polyene compound having two or more carbon-carbon double bonds in one molecule for the purpose of suppressing generation of outgas. And the like (hereinafter also referred to as “ene-thiol resin composition”) were studied. However, when such an ene-thiol resin composition is used, there is a case where sufficient shear adhesive strength to the adherend cannot be obtained. Further, outgas may be generated not only from the resin composition in the middle of curing but also from the cured product, and the problem of outgas generation could not be completely solved.
Therefore, as a result of intensive studies, the present inventors have adjusted the storage elastic modulus of the ene-thiol resin composition to a specific range, thereby having high shear adhesive strength to the adherend and suppressing outgas generation. It has been found that a sealant for a display element can be obtained that is excellent in the transparency of the cured product, and the present invention has been completed.
なお、本明細書において上記「炭素-炭素二重結合」は、エチレン性不飽和結合を意味する。 The sealant for display element of the present invention comprises a polythiol compound having two or more thiol groups in one molecule (hereinafter also simply referred to as “polythiol compound”) and two or more carbon-carbon dicarbons in one molecule. It contains a polyene compound having a heavy bond (hereinafter also simply referred to as “polyene compound”). The sealing agent for display elements of the present invention containing these components is excellent in the transparency of the cured product and can suppress the generation of outgas.
In the present specification, the “carbon-carbon double bond” means an ethylenically unsaturated bond.
また、上記ポリチオール化合物の分子量の好ましい上限は6000である。分子量6000を超える上記ポリチオール化合物を用いた場合、得られる表示素子用封止剤が、粘度が高くなりすぎて塗布性に劣るものとなることがある。上記ポリチオール化合物の分子量のより好ましい上限は2000、更に好ましい上限は1000である。
なお、上記ポリチオール化合物や上記ポリエン化合物としてオリゴマーを用いる場合、分子量は重量平均分子量を用いて表す場合がある。
なお、本明細書において、上記「重量平均分子量」は、ゲルパーミエーションクロマトグラフィー(GPC)で測定を行い、ポリスチレン換算により求められる値である。GPCによってポリスチレン換算による重量平均分子量を測定する際に用いるカラムとしては、例えば、Shodex LF-804(昭和電工社製)等が挙げられる。 The polythiol compound preferably has a molecular weight of 400 or more. By using a polythiol compound having a molecular weight of 400 or more, outgassing can be further suppressed. The minimum with more preferable molecular weight of the said polythiol compound is 500, and a still more preferable minimum is 600.
The preferred upper limit of the molecular weight of the polythiol compound is 6000. When the polythiol compound having a molecular weight exceeding 6000 is used, the obtained sealing agent for a display element may have a viscosity that is too high to be inferior in applicability. A more preferable upper limit of the molecular weight of the polythiol compound is 2000, and a more preferable upper limit is 1000.
In addition, when using an oligomer as the said polythiol compound or the said polyene compound, molecular weight may be represented using a weight average molecular weight.
In the present specification, the “weight average molecular weight” is a value determined by polystyrene conversion after measurement by gel permeation chromatography (GPC). Examples of the column used when measuring the weight average molecular weight in terms of polystyrene by GPC include Shodex LF-804 (manufactured by Showa Denko).
なお、本明細書において、上記「(メタ)アクリル」とは、アクリル又はメタクリルを意味する。 Examples of the polyene compound include allyl alcohol derivatives, esters obtained by reaction of (meth) acrylic acid and polyhydric alcohol, urethane acrylate, divinylbenzene (molecular weight 130), and the like. These polyene compounds may be used alone or in combination of two or more.
In the present specification, the “(meth) acryl” means acryl or methacryl.
上記環状構造は、脂肪族環であってもよいし、芳香族環であってもよいが、被着体に対するせん断接着強度を向上させる効果に特に優れることから、芳香族環であることが好ましい。 In addition, the polyene compound preferably has a cyclic structure because the obtained sealant for display elements has a high shear adhesive strength to the adherend.
The cyclic structure may be an aliphatic ring or an aromatic ring, but is preferably an aromatic ring because it is particularly excellent in the effect of improving the shear bond strength to the adherend. .
上記ポリエンオリゴマーに由来するポリエンモノマーとしては、ポリエン化合物として上述した、アリルアルコール誘導体、(メタ)アクリル酸と多価アルコールとの反応により得られるエステル類、ウレタンアクリレート、ジビニルベンゼン等が挙げられる。 Moreover, a polyene oligomer is also suitably used as the polyene compound.
Examples of the polyene monomer derived from the polyene oligomer include allyl alcohol derivatives, esters obtained by the reaction of (meth) acrylic acid and polyhydric alcohol, urethane acrylate, divinylbenzene and the like described above as the polyene compound.
また、上記ポリエン化合物の分子量の好ましい上限は6000である。分子量6000を超える上記ポリエン化合物を用いた場合、得られる表示素子用封止剤が、粘度が高くなりすぎて塗布性に劣るものとなることがある。上記ポリエン化合物の分子量のより好ましい上限は2000、更に好ましい上限は1000である。 The polyene compound preferably has a molecular weight of 300 or more. By using a polyene compound having a molecular weight of 300 or more, outgassing can be further suppressed. The more preferable lower limit of the molecular weight of the polyene compound is 350, the more preferable lower limit is 400, and the particularly preferable lower limit is 500.
The preferred upper limit of the molecular weight of the polyene compound is 6000. When the polyene compound having a molecular weight exceeding 6000 is used, the obtained sealant for a display element may be too poor in applicability due to excessively high viscosity. A more preferable upper limit of the molecular weight of the polyene compound is 2000, and a more preferable upper limit is 1000.
なお、上記チオエーテルオリゴマーは、未反応チオール基を含んでいてもよいし、未反応チオール基を含んでいなくてもよい。即ち、上記ポリチオール化合物と上記ポリエン化合物との付加重合反応を充分に進めて得られるチオール基を含まないチオエーテルオリゴマーであってもよいし、該付加重合反応の途中で反応を停止させることにより得られる未反応チオール基を含むチオエーテルオリゴマーであってもよい。 The thioether oligomer can be added to both ends by heating the polythiol compound and an equimolar amount or an excess amount of the polyene compound with respect to the polythiol compound in the presence of a thermal polymerization initiator to cause an addition polymerization reaction. It is obtained in the reaction mixture as a polymer having a carbon-carbon double bond of a polyene compound.
The thioether oligomer may contain an unreacted thiol group or may not contain an unreacted thiol group. That is, it may be a thioether oligomer containing no thiol group obtained by sufficiently proceeding the addition polymerization reaction between the polythiol compound and the polyene compound, or obtained by stopping the reaction in the middle of the addition polymerization reaction. It may be a thioether oligomer containing an unreacted thiol group.
上記熱ラジカル重合開始剤は特に限定されず、例えば、アゾ化合物、有機過酸化物等からなるものが挙げられる。
上記有機過酸化物としては、例えば、過酸化ベンゾイル、ケトンパーオキサイド、パーオキシケタール、ハイドロパーオキサイド、ジアルキルパーオキサイド、パーオキシエステル、ジアシルパーオキサイド、パーオキシジカーボネート等が挙げられる。
上記アゾ化合物としては、例えば、2,2’-アゾビス(2,4-ジメチルバレロニトリル)、アゾビスイソブチロニトリル等が挙げられる。 Examples of the thermal polymerization initiator used in the addition polymerization reaction between the polythiol compound and the polyene compound include a thermal radical polymerization initiator.
The said thermal radical polymerization initiator is not specifically limited, For example, what consists of an azo compound, an organic peroxide, etc. is mentioned.
Examples of the organic peroxide include benzoyl peroxide, ketone peroxide, peroxyketal, hydroperoxide, dialkyl peroxide, peroxyester, diacyl peroxide, and peroxydicarbonate.
Examples of the azo compound include 2,2′-azobis (2,4-dimethylvaleronitrile), azobisisobutyronitrile, and the like.
上記その他の硬化性樹脂としては、光又は熱で硬化反応するものであれば特に限定されず、例えば、エポキシ(メタ)アクリレートやウレタン(メタ)アクリレート等の(メタ)アクリル樹脂であって上記ポリエン化合物以外のもの((メタ)アクリロイル基単官能のもの)や、エポキシ樹脂や、部分(メタ)アクリル変性エポキシ樹脂であって上記ポリエン化合物以外のもの((メタ)アクリロイル基単官能のもの)等が挙げられる。
なお、本明細書において、上記「(メタ)アクリレート」は、アクリレート又はメタクリレートを意味し、上記「エポキシ(メタ)アクリレート」は、エポキシ樹脂中の全てのエポキシ基を(メタ)アクリル酸と反応させた化合物を意味し、上記「(メタ)アクリル樹脂」は、(メタ)アクリロイル基を有する樹脂を意味し、上記「(メタ)アクリロイル基」は、アクリロイル基又はメタクリロイル基を意味する。上記「部分(メタ)アクリル変性エポキシ樹脂」は、1分子中にエポキシ基とアクリロイル基又はメタクリロイル基とをそれぞれ有する樹脂である。 The sealing agent for display elements of this invention may contain other curable resins other than the said polythiol compound and the said polyene compound.
The other curable resin is not particularly limited as long as it is cured by light or heat, and examples thereof include (meth) acrylic resins such as epoxy (meth) acrylate and urethane (meth) acrylate, and the polyene Non-compounds (monofunctional (meth) acryloyl group), epoxy resins, partial (meth) acryl-modified epoxy resins other than the above polyene compounds (monofunctional (meth) acryloyl group), etc. Is mentioned.
In the present specification, the “(meth) acrylate” means acrylate or methacrylate, and the “epoxy (meth) acrylate” means that all epoxy groups in the epoxy resin are reacted with (meth) acrylic acid. The “(meth) acrylic resin” means a resin having a (meth) acryloyl group, and the “(meth) acryloyl group” means an acryloyl group or a methacryloyl group. The “partially (meth) acryl-modified epoxy resin” is a resin having an epoxy group and an acryloyl group or a methacryloyl group in one molecule.
上記光重合開始剤は、分子量が220~1500であることが好ましい。分子量が220~1500の光重合開始剤を用いることにより、本発明の表示素子用封止剤は、アウトガスの発生を抑制することができる。上記光重合開始剤の分子量が220未満であるとアウトガス発生の原因となることがある。上記光重合開始剤の分子量が1500を超えると、硬化しにくくなることがある。
なかでも、アウトガスの発生を低減する等の観点から、分子量は300~1000であることが好ましく、350~700であることがより好ましい。 The sealing agent for display elements of this invention contains a photoinitiator.
The photopolymerization initiator preferably has a molecular weight of 220 to 1500. By using a photopolymerization initiator having a molecular weight of 220 to 1500, the sealant for display element of the present invention can suppress the generation of outgas. If the molecular weight of the photopolymerization initiator is less than 220, it may cause outgassing. When the molecular weight of the photopolymerization initiator exceeds 1500, it may be difficult to cure.
Among these, from the viewpoint of reducing the generation of outgas, the molecular weight is preferably 300 to 1000, and more preferably 350 to 700.
ここで、上記アシルホスフィンオキサイド骨格を有する化合物とは、アシルホスフィンオキサイドの一部が別の基に置換した化合物を意味する。上記α-アミノアセトフェノン骨格を有する化合物とは、α-アミノアセトフェノンの一部が別の基に置換した化合物を意味する。上記ベンジルケタール骨格を有する化合物とは、α-ジヒドロキシアセトフェノンの一部が別の基に置換した化合物を意味する。上記α-ヒドロキシアセトフェノン骨格を有する化合物とは、α-モノヒドロキシアセトフェノンの水酸基以外の一部が別の基に置換した化合物を意味する。上記ベンゾイン骨格を有する化合物とは、ベンゾインの一部が別の基に置換した化合物を意味する。上記オキシムエステル骨格を有する化合物とは、N-アセチルジメチルオキシムの一部が別の基に置換した化合物を意味する。上記チタノセン骨格を有する化合物とは、チタノセンの一部が別の基に置換した化合物を意味する。上記有機過酸化物とは、ペルオキシ基を有する化合物を意味する。上記アゾ化合物とは、アゾ基を有する化合物を意味する。 Examples of the photopolymerization initiator having a molecular weight of 220 to 1500 include compounds having an acylphosphine oxide skeleton, compounds having an α-aminoacetophenone skeleton, compounds having a benzyl ketal skeleton, compounds having an α-hydroxyacetophenone skeleton, benzoin Examples thereof include a compound having a skeleton, a compound having an oxime ester skeleton, a compound having a titanocene skeleton, an organic peroxide, an azo compound, and an oligomer compound. Among them, from the viewpoint of photocurability, a compound having an acylphosphine oxide skeleton, a compound having an α-aminoacetophenone skeleton, a compound having a benzyl ketal skeleton, a compound having an α-hydroxyacetophenone skeleton, a compound having a benzoin skeleton, and an oxime It is preferably at least one selected from the group consisting of a compound having an ester skeleton, a compound having a titanocene skeleton, and an oligomer compound. These photopolymerization initiators may be used alone or in combination of two or more.
Here, the compound having an acylphosphine oxide skeleton means a compound in which a part of the acylphosphine oxide is substituted with another group. The compound having the α-aminoacetophenone skeleton means a compound in which a part of α-aminoacetophenone is substituted with another group. The compound having a benzyl ketal skeleton means a compound in which a part of α-dihydroxyacetophenone is substituted with another group. The compound having the α-hydroxyacetophenone skeleton means a compound in which a part other than the hydroxyl group of α-monohydroxyacetophenone is substituted with another group. The compound having the benzoin skeleton means a compound in which a part of benzoin is substituted with another group. The compound having an oxime ester skeleton means a compound in which a part of N-acetyldimethyloxime is substituted with another group. The compound having a titanocene skeleton means a compound in which a part of titanocene is substituted with another group. The organic peroxide means a compound having a peroxy group. The azo compound means a compound having an azo group.
具体的には例えば、オリゴ(2-ヒドロキシ-2-メチル-1-(4-(1-メチルビニル)フェニル)プロパン)(Lamberti社製、「ESACURE KIP 150」、「ESCURE1」)等が挙げられる。 The oligomer compound preferably has a polymerization degree of 2 to 10 from the viewpoint of reducing outgassing.
Specific examples include oligo (2-hydroxy-2-methyl-1- (4- (1-methylvinyl) phenyl) propane) (manufactured by Lamberti, “ESACURE KIP 150”, “ESCURE1”). .
上記熱重合開始剤としては、上記ポリチオール化合物と上記ポリエン化合物との付加重合反応に用いる熱重合開始剤と同様のものを用いることができる。 The sealant for display elements of the present invention may contain a thermal polymerization initiator.
As the thermal polymerization initiator, the same thermal polymerization initiator used for the addition polymerization reaction of the polythiol compound and the polyene compound can be used.
上記熱硬化剤は、硬化後の硬化物が透明となるものであれば特に限定されず、例えば、チオール化合物、イミダゾール誘導体、アミン化合物、多価フェノール系化合物、酸無水物等が挙げられる。 The sealant for display elements of the present invention may contain a thermosetting agent.
The said thermosetting agent will not be specifically limited if the hardened | cured material after hardening becomes transparent, For example, a thiol compound, an imidazole derivative, an amine compound, a polyhydric phenol type compound, an acid anhydride etc. are mentioned.
上記接着性付与剤としては、例えば、3-メタクリロキシプロピルトリメトキシシラン、3-グリシドキシプロピルトリメトキシシラン、3-グリシドキシプロピルメチルジエトキシシラン、N-(アミノエチル)アミノプロピルトリメトキシシラン、メルカプトプロピルトリメトキシシラン等のシランカップリング剤や、チタンカップリング剤や、アルミニウムカップリング剤等が挙げられる。これらの接着性付与剤は単独で用いられてもよいし、2種以上が併用されてもよい。 The sealant for display elements of the present invention may contain an adhesion promoter.
Examples of the adhesion-imparting agent include 3-methacryloxypropyltrimethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, N- (aminoethyl) aminopropyltrimethoxy Examples include silane coupling agents such as silane and mercaptopropyltrimethoxysilane, titanium coupling agents, and aluminum coupling agents. These adhesiveness imparting agents may be used alone or in combination of two or more.
上記安定剤としては、例えば、2,2’-メチレンビス-(4-メチル-6-t-ブチルフェノール)、4,4’-ブチリデンビス-(6-t-ブチル-3-メチルフェノール)、2,2’-メチレンビス-(4-エチル-6-t-ブチルフェノール)等が挙げられる。これらの安定剤は単独で用いられてもよいし、2種以上が併用されてもよい。 The sealing agent for display elements of the present invention may contain a stabilizer for the purpose of preventing oxidation or the like.
Examples of the stabilizer include 2,2′-methylenebis- (4-methyl-6-tert-butylphenol), 4,4′-butylidenebis- (6-tert-butyl-3-methylphenol), 2,2 Examples include '-methylenebis- (4-ethyl-6-t-butylphenol). These stabilizers may be used independently and 2 or more types may be used together.
本発明の表示素子用封止剤を光硬化させる方法としては、例えば、300~400nmの波長及び300~3000mJ/cm2の積算光量の光を照射する方法等が挙げられる。 The sealant for display elements of the present invention can be cured by light irradiation.
Examples of the method for photocuring the sealant for display elements of the present invention include a method of irradiating light having a wavelength of 300 to 400 nm and an integrated light amount of 300 to 3000 mJ / cm 2 .
なお、上記貯蔵弾性率は、粘弾性測定装置を用いることで測定できる。また、上記貯蔵弾性率を測定する硬化物は、表示素子用封止剤に50mW/cm2の紫外線を40秒照射することにより作製できる。 In the sealant for display element of the present invention, the lower limit of the storage elastic modulus at 80 ° C. of the cured product is 70 MPa, and the upper limit is 1000 MPa. If the storage elastic modulus is outside this range, the shear bond strength to the adherend may be inferior, or generation of outgas due to the cured product may not be sufficiently suppressed. The preferable lower limit of the storage elastic modulus is 90 MPa, the preferable upper limit is 500 MPa, the more preferable lower limit is 100 MPa, the more preferable upper limit is 300 MPa, the still more preferable lower limit is 110 MPa, and the further preferable upper limit is 200 MPa.
In addition, the said storage elastic modulus can be measured by using a viscoelasticity measuring apparatus. Moreover, the hardened | cured material which measures the said storage elastic modulus can be produced by irradiating the sealing agent for display elements with 50 mW / cm < 2 > ultraviolet-ray for 40 second.
なお、本明細書において上記「ガラス転移温度」とは、動的粘弾性測定により得られる損失正接(tanδ)の極大のうち、ミクロブラウン運動に起因する極大が現れる温度を意味する。上記ガラス転移温度は、粘弾性測定装置等を用いた従来公知の方法により測定することができる。また、上記ガラス転移温度を測定する硬化物は、表示素子用封止剤に50mW/cm2の紫外線を40秒照射することにより作製できる。 As for the sealing agent for display elements of this invention, the minimum with the preferable glass transition temperature of hardened | cured material is 50 degreeC. If the glass transition temperature is less than 50 ° C., the shear bond strength to the adherend may be inferior, or generation of outgas due to the cured product may not be sufficiently suppressed. The minimum with said more preferable glass transition temperature is 65 degreeC.
In the present specification, the “glass transition temperature” means a temperature at which a maximum due to micro-Brownian motion appears in the maximum of loss tangent (tan δ) obtained by dynamic viscoelasticity measurement. The glass transition temperature can be measured by a conventionally known method using a viscoelasticity measuring device or the like. Moreover, the hardened | cured material which measures the said glass transition temperature can be produced by irradiating the ultraviolet ray of 50 mW / cm < 2 > for 40 second to the sealing agent for display elements.
なお、上記光線透過率は、PET樹脂フィルムに挟んだ表示素子用透明封止剤に対して、50mW/cm2の紫外線を40秒照射することにより透過率測定用サンプルを作製し、得られた透過率測定用サンプルについて、分光光度計を用いて測定することができる。 The preferable lower limit of the light transmittance at a wavelength of 380 to 780 nm of the cured product of the transparent sealing agent for display elements of the present invention is 85%. When the light transmittance is less than 85%, the transparency is inferior, and it may be unsuitable for use in sealing the entire surface of the display element. A more preferable lower limit of the light transmittance is 95%.
The light transmittance was obtained by producing a transmittance measurement sample by irradiating a transparent sealing agent for display element sandwiched between PET resin films with 50 mW / cm 2 of ultraviolet light for 40 seconds. The transmittance measurement sample can be measured using a spectrophotometer.
ポリチオール化合物としてジペンタエリスリトールヘキサキス(3-メルカプトプロピオネート60重量部と、ポリエン化合物として上記式(4)で表されるグリコールウリル誘導体40重量部とを加熱撹拌しながら、熱重合開始剤として2,2’-アゾビス(2,4-ジメチルバレロニトリル)0.2重量部を徐々に添加し、得られた反応混合物を貧溶媒に流し、沈殿したオリゴマーを集め、溶媒を真空下で除去することにより、チオエーテルオリゴマーAを得た。
得られたチオエーテルオリゴマーAについて、カラムとしてShodex LF-804(昭和電工社製)を用いたゲルパーミエーションクロマトグラフィー(GPC)にてポリスチレン換算による重量平均分子量を測定した。その結果、チオエーテルオリゴマーAの重量平均分子量は、4000であった。
GPCによる測定は、チオエーテルオリゴマーAを0.5重量%含有するテトラヒドロフラン溶液50μLを1mL/minの流速で流し、40℃の温度条件で行った。 (Preparation of thioether oligomer A)
As a thermal polymerization initiator, dipentaerythritol hexakis (60 parts by weight of 3-mercaptopropionate) as a polythiol compound and 40 parts by weight of a glycoluril derivative represented by the above formula (4) as a polyene compound are heated and stirred. 0.2 part by weight of 2,2'-azobis (2,4-dimethylvaleronitrile) is gradually added, the resulting reaction mixture is poured into a poor solvent, the precipitated oligomer is collected, and the solvent is removed under vacuum. As a result, thioether oligomer A was obtained.
For the obtained thioether oligomer A, the weight average molecular weight in terms of polystyrene was measured by gel permeation chromatography (GPC) using Shodex LF-804 (manufactured by Showa Denko KK) as a column. As a result, the weight average molecular weight of the thioether oligomer A was 4000.
The measurement by GPC was performed under a temperature condition of 40 ° C. by flowing 50 μL of a tetrahydrofuran solution containing 0.5% by weight of thioether oligomer A at a flow rate of 1 mL / min.
2,2’-アゾビス(2,4-ジメチルバレロニトリル)の添加量を0.05重量部に変更したこと以外は、上記「(チオエーテルオリゴマーAの作製)」と同様にして、重量平均分子量2000のチオエーテルオリゴマーBを得た。 (Preparation of thioether oligomer B)
A weight average molecular weight of 2000 is the same as that of “(Preparation of thioether oligomer A)” except that the amount of 2,2′-azobis (2,4-dimethylvaleronitrile) added is changed to 0.05 parts by weight. The thioether oligomer B was obtained.
3-メルカプトプロピルトリメトキシシラン180重量部を、イオン交換水49.6重量部及び濃度95重量%のギ酸水溶液9重量部と室温で30分間撹拌混合して加水分解反応を行った後、トルエン272重量部を添加し、75℃で60分間加熱することにより縮合反応させた。反応後、減圧して残存分を留去し、1分子中に2個以上のチオール基を有する縮合物Aを得た。
得られた縮合物Aの重量平均分子量は1500、チオール当量は136g/eqであった。 (Preparation of condensate A)
After 180 parts by weight of 3-mercaptopropyltrimethoxysilane was stirred and mixed with 49.6 parts by weight of ion-exchanged water and 9 parts by weight of a formic acid aqueous solution having a concentration of 95% by weight at room temperature for 30 minutes, toluene 272 A part by weight was added and a condensation reaction was carried out by heating at 75 ° C. for 60 minutes. After the reaction, the pressure was reduced and the remaining portion was distilled off to obtain a condensate A having two or more thiol groups in one molecule.
The resulting condensate A had a weight average molecular weight of 1500 and a thiol equivalent of 136 g / eq.
3-メルカプトプロピルトリメトキシシラン190重量部を、イオン交換水52重量部及び濃度95重量%のギ酸水溶液9.5重量部と室温で30分間撹拌混合して加水分解反応を行った後、トルエン287重量部を添加し、75℃で60分間加熱することにより縮合反応させた。反応後、減圧して残存分を留去し、1分子中に2個以上のチオール基を有する縮合物Bを得た。
得られた縮合物Bの重量平均分子量は5000、チオール当量は398g/eqであった。 (Preparation of condensate B)
After 190 parts by weight of 3-mercaptopropyltrimethoxysilane was mixed with 52 parts by weight of ion-exchanged water and 9.5 parts by weight of a formic acid aqueous solution having a concentration of 95% by weight at room temperature for 30 minutes, a hydrolysis reaction was performed. A part by weight was added and a condensation reaction was carried out by heating at 75 ° C. for 60 minutes. After the reaction, the pressure was reduced and the remaining portion was distilled off to obtain a condensate B having two or more thiol groups in one molecule.
The obtained condensate B had a weight average molecular weight of 5000 and a thiol equivalent of 398 g / eq.
表1、2に記載された配合比に従い、各材料を、撹拌機(新東科学社製、「スリーワンモーター HEIDON BLH300」)を用いて混合することにより、実施例1~11及び比較例1~9の表示素子用封止剤を調製した。 (Examples 1 to 11, Comparative Examples 1 to 9)
According to the mixing ratios described in Tables 1 and 2, each material was mixed using a stirrer (manufactured by Shinto Kagaku Co., Ltd., “Three-One Motor HEIDON BLH300”), whereby Examples 1 to 11 and Comparative Examples 1 to Nine display element sealants were prepared.
実施例及び比較例で得られた各表示素子用封止剤について、以下の方法により評価を行った。結果を表1、2に示した。 <Evaluation>
About each sealing agent for display elements obtained by the Example and the comparative example, it evaluated by the following method. The results are shown in Tables 1 and 2.
実施例及び比較例で得られた各表示素子用封止剤をテフロン(登録商標)製の長さ35mm、幅3mm、厚さ1mmの型に入れ、高圧水銀灯を用いて50mW/cm2の紫外線を40秒照射して、長さ35mm、幅3mm、厚さ1mmの粘弾性測定用サンプルを作製した。得られた粘弾性測定用サンプルについて、動的粘弾性測定装置(IT計測制御社製、「DVA-200」)を用いて、0~100℃、10Hzの条件において動的粘弾性を測定し、80℃の貯蔵弾性率を測定した。 (1) Storage elastic modulus Each sealant for display elements obtained in Examples and Comparative Examples was put into a Teflon (registered trademark) length 35 mm, width 3 mm, thickness 1 mm mold, and a high pressure mercury lamp was used. A sample for viscoelasticity measurement having a length of 35 mm, a width of 3 mm, and a thickness of 1 mm was produced by irradiating with 50 mW / cm 2 of ultraviolet rays for 40 seconds. About the obtained viscoelasticity measurement sample, using a dynamic viscoelasticity measurement device (IT Measurement Control Co., Ltd., “DVA-200”), the dynamic viscoelasticity was measured under the conditions of 0 to 100 ° C. and 10 Hz, The storage elastic modulus at 80 ° C. was measured.
コーンローター式粘度計(東機産業社製、「TV-22型」)を用いて、20℃、20rpmの条件で実施例及び比較例で得られた各表示素子用封止剤の粘度を測定した。 (2) Viscosity for each display element obtained in Examples and Comparative Examples using a viscosity cone rotor viscometer (“TV-22 type” manufactured by Toki Sangyo Co., Ltd.) under the conditions of 20 ° C. and 20 rpm. The viscosity of was measured.
ディスペンサー(武蔵エンジニアリング社製、「SHOTMASTER300」)を用いて、ガラス基板上に実施例及び比較例で得られた各表示素子用封止剤を塗布した際の塗布性を評価した。ディスペンスノズルを400μm、ノズルギャップを30μm、塗出圧を300kPaに固定して塗布したとき、かすれやダレが全くなく塗布できた場合「○○」、かすれやダレがほとんどなく塗布できた場合「○」、塗布切れはないものの、はっきりとしたかすれやダレが生じた場合「△」、大きな塗布切れや塗布ムラが生じたり、全く塗布できなかったりした場合「×」として塗布性を評価した。 (3) The applicability at the time of apply | coating the sealing agent for each display element obtained by the Example and the comparative example on the glass substrate using the applicability | distribution dispenser (the Musashi engineering company make, "SHOTMASTER300") was evaluated. . When the dispense nozzle is 400 μm, the nozzle gap is 30 μm, and the coating pressure is fixed at 300 kPa, it can be applied without fading or sagging. “○○”, when it can be applied with almost no fading or sagging. The coating property was evaluated as “△” when there was no clear coating or sagging, but “×” when large coating failure or coating unevenness occurred, or when the coating could not be applied at all.
実施例1~8、10、11及び比較例1、3~7で得られた各表示素子用封止剤に、高圧水銀灯を用いて50mW/cm2の紫外線を40秒照射して、長さ35mm、幅3mm、厚さ1mmの粘弾性測定用サンプルを作製した。得られたサンプルについて、動的粘弾性測定装置(IT計測制御社製、「DVA-200」)を用いて、0~100℃、10Hzにおいて動的粘弾性を測定し、損失正接(tanδ)の極大値の温度をガラス転移温度(Tg)として求めた。 (4) Glass transition temperature Each sealant for display elements obtained in Examples 1 to 8, 10, and 11 and Comparative Examples 1 to 3 to 7 was irradiated with ultraviolet rays of 50 mW / cm 2 for 40 seconds using a high pressure mercury lamp. Irradiation was performed to prepare a sample for measuring viscoelasticity having a length of 35 mm, a width of 3 mm, and a thickness of 1 mm. For the obtained sample, the dynamic viscoelasticity was measured at 0 to 100 ° C. and 10 Hz using a dynamic viscoelasticity measuring apparatus (“DVA-200” manufactured by IT Measurement Control Co., Ltd.), and the loss tangent (tan δ) was measured. The maximum temperature was determined as the glass transition temperature (Tg).
実施例及び比較例で得られた各表示素子用封止剤を、バーコーターを用いて塗布後の厚さが100μmとなるように塗布し、高圧水銀灯を用いて50mW/cm2の紫外線を40秒照射してフィルムを形成した。
得られたフィルムを熱分析装置(Seiko Instruments社製、「TG/DTA6200」)を用いて、昇温速度10℃/minで150℃まで加熱したときの重量減少率を測定し、これをアウトガス発生量とした。 (5) Outgas generation amount Each sealant for display elements obtained in the examples and comparative examples was applied using a bar coater so that the thickness after application was 100 μm, and 50 mW / A film was formed by irradiation with ultraviolet rays of cm 2 for 40 seconds.
Using a thermal analyzer (“TG / DTA6200” manufactured by Seiko Instruments, Inc.), the resulting film was measured for weight loss rate when heated to 150 ° C. at a rate of temperature increase of 10 ° C./min, and this was generated as outgas. The amount.
実施例及び比較例で得られた各表示素子用封止剤に平均粒子径5μmの樹脂スペーサー(積水化学工業社製、「ミクロパールSP-205」)を含有量が0.1重量%となるように混合し、2枚のガラス板(長さ45mm、幅25mm)の一方に塗布した後、他方のガラス板を重ねて貼り合わせ、高圧水銀灯を用いて50mW/cm2の紫外線を40秒照射して、せん断接着強度試験用試料を作製した。得られたせん断接着強度試験用試料について、オートグラフAGS1000D(島津製作所社製)を用いて、5mm/minの速度で引張試験を行い、せん断接着強度を測定した。せん断接着強度が3MPa以上であったものを「○」、2MPa以上3MPa未満であったものを「△」、2MPa未満であったものを「×」としてせん断接着強度を評価した。 (6) Shear adhesive strength Each sealant for display elements obtained in Examples and Comparative Examples contains a resin spacer (Sekisui Chemical Co., Ltd., “Micropearl SP-205”) having an average particle diameter of 0 μm. After mixing to 1 wt% and applying to one of two glass plates (length 45 mm, width 25 mm), the other glass plate was stacked and bonded together, and 50 mW / cm 2 using a high pressure mercury lamp. Was irradiated for 40 seconds to prepare a sample for a shear bond strength test. About the obtained sample for shear bond strength tests, the tensile test was done at a speed | rate of 5 mm / min using autograph AGS1000D (made by Shimadzu Corp.), and the shear bond strength was measured. The shear bond strength was evaluated by assuming that the shear bond strength was 3 MPa or more as “◯”, 2 MPa or more and less than 3 MPa as “Δ”, and less than 2 MPa as “X”.
実施例及び比較例で得られた各表示素子用封止剤を、PET樹脂フィルムに挟み、高圧水銀灯を用いて50mW/cm2の紫外線を40秒照射して、厚さ100μmの透過率測定用サンプルを作製した。得られた透過率測定用サンプルについて、分光光度計(日立製作所社製、「U-3000」、条件300~800nm)を用いて、波長380~780nmにおける光線透過率を測定した。 (7) Transparency of cured product (light transmittance)
Each sealant for display elements obtained in Examples and Comparative Examples is sandwiched between PET resin films and irradiated with 50 mW / cm 2 ultraviolet ray for 40 seconds using a high-pressure mercury lamp, for measuring transmittance of 100 μm in thickness. A sample was made. The obtained transmittance measurement sample was measured for light transmittance at a wavelength of 380 to 780 nm using a spectrophotometer (manufactured by Hitachi, Ltd., “U-3000”, conditions 300 to 800 nm).
(8-1)液晶表示素子の表示性能
(液晶表示素子の作製)
厚さ1000ÅのITO電極を表面に成膜した後、更にスピンコートにて厚さ800Åの配向膜を表面に塗布したガラス基板(長さ25mm、幅25mm、厚さ0.7mm)を2枚用意し、一方の基板に熱硬化性エポキシ樹脂(周辺シール剤)を用いて、液晶注入口部を設けるようにしたパターンの印刷をスクリーン印刷にて行った。次に、パターンの印刷を行った基板を80℃で3分間保持することにより予備乾燥と基板への周辺シール剤の融着とを行った後、室温に戻した。次いで、もう一方の基板に5μmのスペーサーを散布した後、それぞれの基板を貼り合わせ、130℃に加熱した熱プレスで2時間の圧着を行って周辺シール剤を硬化させ、空のセルを得た。得られた空のセルを真空吸引した後、注入口より液晶(メルク社製、「ZLI-479232」)を注入し、注入口を実施例及び比較例で得られた各表示素子用封止剤を用いて封止し、高圧水銀灯を用いて50mW/cm2の紫外線を40秒照射して封止剤を硬化させた。その後、120℃で1時間液晶のアニールを行い、液晶表示素子を作製した。 (8) Display performance of display element (8-1) Display performance of liquid crystal display element (production of liquid crystal display element)
Prepare two glass substrates (length 25mm, width 25mm, thickness 0.7mm) on which an ITO electrode with a thickness of 1000mm is formed on the surface and then an orientation film with a thickness of 800mm is applied on the surface by spin coating. Then, using a thermosetting epoxy resin (peripheral sealant) on one substrate, printing of a pattern in which a liquid crystal injection port was provided was performed by screen printing. Next, the substrate on which the pattern was printed was kept at 80 ° C. for 3 minutes to perform preliminary drying and fusion of the peripheral sealant to the substrate, and then returned to room temperature. Next, after spraying a spacer of 5 μm on the other substrate, each substrate was bonded, and the peripheral sealant was cured by hot pressing heated to 130 ° C. for 2 hours to obtain an empty cell. . The obtained empty cell was vacuum-sucked, and then liquid crystal (“ZLI-479232” manufactured by Merck & Co., Inc.) was injected from the injection port. The injection port was sealed in each display element obtained in Examples and Comparative Examples. Then, the sealing agent was cured by irradiating with 50 mW / cm 2 of ultraviolet rays for 40 seconds using a high-pressure mercury lamp. Thereafter, the liquid crystal was annealed at 120 ° C. for 1 hour to produce a liquid crystal display element.
得られた液晶表示素子を、AC3.5Vの電圧にて中間調の表示状態で駆動させ、注入口近傍の液晶の配向乱れを偏光顕微鏡で観察した。配向乱れが確認されなかった場合を「○○」、0.3mm未満の僅かな配向乱れが確認された場合を「○」、1mm未満の配向乱れが確認された場合を「△」、1mm以上のはっきりとした配向乱れ(濃い色むら)があった場合を「×」として液晶表示素子の表示性能を評価した。
なお、評価が「○○」、「○」の液晶表示素子は、実用に全く問題のないレベルであり、「△」は液晶表示素子の表示設計によっては問題になる可能性があるレベルであり、「×」は実用に耐えないレベルである。 (Liquid crystal orientation disorder)
The obtained liquid crystal display element was driven in a halftone display state at a voltage of AC 3.5 V, and the alignment disorder of the liquid crystal near the inlet was observed with a polarizing microscope. "○" when no orientation disorder is confirmed, "○" when slight orientation disorder less than 0.3 mm is confirmed, "△" when less than 1 mm orientation disorder is confirmed, "1" or more The display performance of the liquid crystal display element was evaluated with “×” when there was a clear alignment disorder (dark color unevenness).
In addition, liquid crystal display elements with an evaluation of “XX” or “O” are at a level where there is no problem in practical use, and “△” is a level that may cause a problem depending on the display design of the liquid crystal display element. , “×” is a level that cannot withstand practical use.
(有機発光材料層を含む積層体が配置された基板の作製)
ガラス基板(長さ25mm、幅25mm、厚さ0.7mm)にITO電極を1000Åの厚さで成膜したものを基板とした。上記基板をアセトン、アルカリ水溶液、イオン交換水、イソプロピルアルコールにてそれぞれ15分間超音波洗浄した後、煮沸させたイソプロピルアルコールにて10分間洗浄し、更に、UV-オゾンクリーナ(日本レーザー電子社製、「NL-UV253」)にて直前処理を行った。
次に、この基板を真空蒸着装置の基板フォルダに固定し、素焼きの坩堝にN,N’-ジ(1-ナフチル)-N,N’-ジフェニルベンジジン(α-NPD)を200mg、他の異なる素焼き坩堝にトリス(8-ヒドロキシキノリラ)アルミニウム(Alq3)を200mg入れ、真空チャンバー内を、1×10-4Paまで減圧した。その後、α-NPDの入った坩堝を加熱し、α-NPDを蒸着速度15Å/sで基板に堆積させ、膜厚600Åの正孔輸送層を成膜した。次いで、Alq3の入った坩堝を加熱し、15Å/sの蒸着速度で膜厚600Åの有機発光材料層を成膜した。その後、正孔輸送層及び有機発光材料層が形成された基板を別の真空蒸着装置に移し、この真空蒸着装置内のタングステン製抵抗加熱ボートにフッ化リチウム200mgを、別のタングステン製ボートにアルミニウム線1.0gを入れた。その後、真空蒸着装置の蒸着器内を2×10-4Paまで減圧してフッ化リチウムを0.2Å/sの蒸着速度で5Å成膜した後、アルミニウムを20Å/sの速度で1000Å成膜した。窒素により蒸着器内を常圧に戻し、10mm×10mmの有機発光材料層を含む積層体が配置された基板を取り出した。 (8-2) Display performance of organic EL display device (production of a substrate on which a laminate including an organic light emitting material layer is disposed)
A glass substrate (length 25 mm, width 25 mm, thickness 0.7 mm) on which an ITO electrode was formed to a thickness of 1000 mm was used as the substrate. The substrate was ultrasonically washed with acetone, an aqueous alkali solution, ion-exchanged water, and isopropyl alcohol for 15 minutes, respectively, then washed with boiled isopropyl alcohol for 10 minutes, and a UV-ozone cleaner (manufactured by Nippon Laser Electronics Co., Ltd.). The last treatment was performed with “NL-UV253”).
Next, this substrate is fixed to the substrate folder of the vacuum deposition apparatus, and 200 mg of N, N′-di (1-naphthyl) -N, N′-diphenylbenzidine (α-NPD) is put into an unglazed crucible and other different types. 200 mg of tris (8-hydroxyquinola) aluminum (Alq 3 ) was put in an unglazed crucible, and the pressure in the vacuum chamber was reduced to 1 × 10 −4 Pa. Thereafter, the crucible containing α-NPD was heated, and α-NPD was deposited on the substrate at a deposition rate of 15 s / s to form a 600 正 孔 hole transport layer. Next, the crucible containing Alq 3 was heated to form an organic light emitting material layer having a thickness of 600 で at a deposition rate of 15 Å / s. Thereafter, the substrate on which the hole transport layer and the organic light emitting material layer are formed is transferred to another vacuum vapor deposition apparatus, and 200 mg of lithium fluoride is added to a tungsten resistance heating boat in the vacuum vapor deposition apparatus, and aluminum is added to another tungsten boat. 1.0 g of wire was added. After that, the inside of the vapor deposition unit of the vacuum vapor deposition apparatus is depressurized to 2 × 10 −4 Pa to form a lithium fluoride film with a thickness of 5 mm at a deposition rate of 0.2 kg / s, and then aluminum with a film thickness of 1000 mm at a rate of 20 kg / s. did. The inside of the vapor deposition apparatus was returned to normal pressure with nitrogen, and the substrate on which the laminate including the organic light emitting material layer of 10 mm × 10 mm was arranged was taken out.
得られた有機発光材料層を含む積層体が配置された基板の、該積層体の全体を覆うように、13mm×13mmの開口部を有するマスクを設置し、プラズマCVD法にて無機材料膜Aを形成した。
プラズマCVD法は、原料ガスとしてSiH4ガス及び窒素ガスを用い、各々の流量を10sccm及び200sccmとし、RFパワーを10W(周波数2.45GHz)、チャンバー内温度を100℃、チャンバー内圧力を0.9Torrとする条件で行った。
形成された無機材料膜Aの厚さは、約0.2μmであった。 (Coating with inorganic material film A)
A mask having an opening of 13 mm × 13 mm is installed so as to cover the entire laminate of the substrate on which the laminate including the obtained organic light emitting material layer is disposed, and the inorganic material film A is formed by plasma CVD. Formed.
In the plasma CVD method, SiH 4 gas and nitrogen gas are used as source gases, the flow rates are 10 sccm and 200 sccm, RF power is 10 W (frequency: 2.45 GHz), chamber temperature is 100 ° C., and chamber pressure is 0. The test was performed at 9 Torr.
The formed inorganic material film A had a thickness of about 0.2 μm.
真空装置内に、無機材料膜Aで被覆された積層体が配置された基板を設置し、真空装置の中に設置された加熱ボートに実施例及び比較例で得られた各表示素子用封止剤を0.5g入れ、10Paに減圧して、積層体を含む11mm×11mmの四角形の部分に、表示素子用封止剤を200℃にて加熱し、厚さが0.5μmになるように真空蒸着を行った。その後、真空環境下で高圧水銀灯を用いて50mW/cm2の紫外線を40秒照射して、表示素子用封止剤を硬化させて樹脂保護膜を形成した。 (Formation of resin protective film)
In the vacuum apparatus, a substrate on which the laminate coated with the inorganic material film A is disposed is installed, and each display element seal obtained in the examples and comparative examples is placed on a heating boat installed in the vacuum apparatus. 0.5 g of the agent is added, the pressure is reduced to 10 Pa, and the sealant for display element is heated at 200 ° C. to the 11 mm × 11 mm square portion including the laminate so that the thickness becomes 0.5 μm. Vacuum deposition was performed. Thereafter, ultraviolet rays of 50 mW / cm 2 were irradiated for 40 seconds using a high pressure mercury lamp in a vacuum environment to cure the display element sealant to form a resin protective film.
樹脂保護膜が形成された基板の11mm×11mmの樹脂保護膜の全体を覆うように、12mm×12mmの開口部を有するマスクを設置し、プラズマCVD法にて無機材料膜Bを形成して表示素子(有機EL表示素子)を得た。
プラズマCVD法は、原料ガスとしてSiH4ガス及び窒素ガスを用い、各々の流量をSiH4ガス10sccm、窒素ガス200sccmとし、RFパワーを10W(周波数2.45GHz)、チャンバー内温度を100℃、チャンバー内圧力を0.9Torrとする条件で行った。形成された無機材料膜Bの厚さは、約1μmであった。 (Coating with inorganic material film B)
A mask having an opening of 12 mm × 12 mm is installed so as to cover the entire 11 mm × 11 mm resin protective film of the substrate on which the resin protective film is formed, and an inorganic material film B is formed by plasma CVD and displayed. An element (organic EL display element) was obtained.
In the plasma CVD method, SiH 4 gas and nitrogen gas are used as source gases, the flow rates of each are SiH 4 gas 10 sccm, nitrogen gas 200 sccm, RF power 10 W (frequency 2.45 GHz), chamber temperature 100 ° C., chamber The test was performed under the condition that the internal pressure was 0.9 Torr. The formed inorganic material film B had a thickness of about 1 μm.
作製した有機EL表示素子をそれぞれ60℃、90%RHの条件下に100時間暴露した後、3Vの電圧を印加し、発光状態(発光及びダークスポット、画素周辺消光の有無)を目視で観察し、ダークスポットや周辺消光がなく均一に発光した場合を「○○」、輝度に僅かな低下が見られるが、ダークスポットや周辺消光はなく均一に発光した場合を「○」、一部にダークスポットがあったり、わずかな周辺消光があったりした場合を「△」、広範囲にダークスポットがあったり、顕著な周辺消光があったりした場合を「×」として評価した。 (Light emission state of organic EL display element)
The prepared organic EL display elements were exposed for 100 hours under conditions of 60 ° C. and 90% RH, respectively, and then a voltage of 3 V was applied, and the light emission state (light emission and dark spots, presence / absence of pixel peripheral quenching) was visually observed. , “○○” when emitting light uniformly without dark spots or peripheral quenching, a slight decrease in brightness is seen, “○” when emitting light uniformly without dark spots or peripheral quenching, partially dark The case where there was a spot or slight peripheral quenching was evaluated as “Δ”, and the case where there was a dark spot in a wide range or there was significant peripheral quenching was evaluated as “x”.
Claims (8)
- 1分子中に2個以上のチオール基を有するポリチオール化合物と、1分子中に2個以上の炭素-炭素二重結合を有するポリエン化合物と、光重合開始剤とを含有し、
硬化物の80℃における貯蔵弾性率が70~1000MPaである
ことを特徴とする表示素子用封止剤。 A polythiol compound having two or more thiol groups in one molecule, a polyene compound having two or more carbon-carbon double bonds in one molecule, and a photopolymerization initiator,
A sealant for display elements, wherein the cured product has a storage elastic modulus at 80 ° C. of 70 to 1000 MPa. - 硬化物のガラス転移温度が50℃以上であることを特徴とする請求項1記載の表示素子用封止剤。 The glass transition temperature of hardened | cured material is 50 degreeC or more, The sealing compound for display elements of Claim 1 characterized by the above-mentioned.
- ポリチオール化合物は、分子量が400以上であることを特徴とする請求項1又は2記載の表示素子用封止剤。 The sealing agent for display elements according to claim 1, wherein the polythiol compound has a molecular weight of 400 or more.
- ポリチオール化合物は、チオール基を1分子中に4個以上有することを特徴とする請求項1、2又は3記載の表示素子用封止剤。 4. The sealant for a display element according to claim 1, wherein the polythiol compound has four or more thiol groups in one molecule.
- ポリエン化合物は、分子量が300以上であることを特徴とする請求項1、2、3又は4記載の表示素子用封止剤。 The sealing agent for a display element according to claim 1, 2, 3, or 4, wherein the polyene compound has a molecular weight of 300 or more.
- ポリエン化合物は、環状構造を有することを特徴とする請求項1、2、3、4又は5記載の表示素子用封止剤。 6. The sealant for a display element according to claim 1, wherein the polyene compound has a cyclic structure.
- チオエーテルオリゴマーを含有することを特徴とする請求項1、2、3、4、5又は6記載の表示素子用封止剤。 The sealant for a display element according to claim 1, comprising a thioether oligomer.
- コーンローター式粘度計を用いて、20℃、20rpmの条件で測定した粘度が0.4~40Pa・sであることを特徴とする請求項1、2、3、4、5、6又は7記載の表示素子用封止剤。 8. The viscosity measured at 20 ° C. and 20 rpm using a cone rotor viscometer is 0.4 to 40 Pa · s, wherein the viscosity is 0.4 to 40 Pa · s. Sealant for display element.
Priority Applications (3)
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JP2014559013A JP5798259B1 (en) | 2013-12-09 | 2014-11-28 | Sealant for display element |
KR1020157034259A KR20160096538A (en) | 2013-12-09 | 2014-11-28 | Sealant for display element |
CN201480061502.3A CN105706264B (en) | 2013-12-09 | 2014-11-28 | Display element sealant |
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JP2013-254120 | 2013-12-09 | ||
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JP2013-254121 | 2013-12-09 | ||
JP2013254120 | 2013-12-09 |
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JP (2) | JP5798259B1 (en) |
KR (1) | KR20160096538A (en) |
CN (1) | CN105706264B (en) |
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Cited By (2)
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JP2017040763A (en) * | 2015-08-19 | 2017-02-23 | 積水化学工業株式会社 | Sealant for display element |
WO2017094809A1 (en) * | 2015-11-30 | 2017-06-08 | 株式会社ダイセル | Sealing composition |
Families Citing this family (3)
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WO2018034223A1 (en) * | 2016-08-17 | 2018-02-22 | シャープ株式会社 | Liquid crystal cell for scanning antenna, and method for manufacturing liquid crystal cell for scanning antenna |
JP7030436B2 (en) * | 2016-09-29 | 2022-03-07 | 日東電工株式会社 | Polarizing film with adhesive layer and image display device |
CN112599704B (en) * | 2020-12-14 | 2022-07-12 | 武汉华星光电半导体显示技术有限公司 | Display panel and manufacturing method thereof |
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Also Published As
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JP5798259B1 (en) | 2015-10-21 |
CN105706264B (en) | 2017-12-19 |
TW201527502A (en) | 2015-07-16 |
KR20160096538A (en) | 2016-08-16 |
CN105706264A (en) | 2016-06-22 |
JP2016015324A (en) | 2016-01-28 |
JPWO2015087714A1 (en) | 2017-03-16 |
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