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WO2014174991A1 - Dispositif de connecteur et système de transmission radio - Google Patents

Dispositif de connecteur et système de transmission radio Download PDF

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Publication number
WO2014174991A1
WO2014174991A1 PCT/JP2014/059176 JP2014059176W WO2014174991A1 WO 2014174991 A1 WO2014174991 A1 WO 2014174991A1 JP 2014059176 W JP2014059176 W JP 2014059176W WO 2014174991 A1 WO2014174991 A1 WO 2014174991A1
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WO
WIPO (PCT)
Prior art keywords
signal
propagation
connector
format
transmission
Prior art date
Application number
PCT/JP2014/059176
Other languages
English (en)
Japanese (ja)
Inventor
山岸　弘幸
崇宏 武田
Original Assignee
ソニー株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ソニー株式会社 filed Critical ソニー株式会社
Publication of WO2014174991A1 publication Critical patent/WO2014174991A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/16—Resonant antennas with feed intermediate between the extremities of the antenna, e.g. centre-fed dipole
    • H01Q9/28—Conical, cylindrical, cage, strip, gauze, or like elements having an extended radiating surface; Elements comprising two conical surfaces having collinear axes and adjacent apices and fed by two-conductor transmission lines
    • H01Q9/285—Planar dipole
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/02—Coupling devices of the waveguide type with invariable factor of coupling
    • H01P5/022—Transitions between lines of the same kind and shape, but with different dimensions
    • H01P5/028—Transitions between lines of the same kind and shape, but with different dimensions between strip lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
    • H01P5/10—Coupling devices of the waveguide type for linking dissimilar lines or devices for coupling balanced lines or devices with unbalanced lines or devices
    • H01P5/107—Hollow-waveguide/strip-line transitions
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J50/00—Circuit arrangements or systems for wireless supply or distribution of electric power
    • H02J50/005—Mechanical details of housing or structure aiming to accommodate the power transfer means, e.g. mechanical integration of coils, antennas or transducers into emitting or receiving devices
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J50/00—Circuit arrangements or systems for wireless supply or distribution of electric power
    • H02J50/10—Circuit arrangements or systems for wireless supply or distribution of electric power using inductive coupling
    • H02J50/12—Circuit arrangements or systems for wireless supply or distribution of electric power using inductive coupling of the resonant type
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J50/00—Circuit arrangements or systems for wireless supply or distribution of electric power
    • H02J50/70—Circuit arrangements or systems for wireless supply or distribution of electric power involving the reduction of electric, magnetic or electromagnetic leakage fields

Definitions

  • the present disclosure relates to a connector device and a wireless transmission system.
  • a waveguide is known as a medium for transmitting high-frequency signals.
  • a special structure such as a choke flange has been used for connection between waveguides in order to suppress reflection due to discontinuity of the structure (see, for example, Patent Document 1).
  • an object of the present disclosure is to provide a connector device in which the reflection and leakage of electromagnetic waves are small and, for example, waveguides can be easily attached and detached or assembled, and a wireless transmission system using the connector device.
  • the connector device for achieving the above object is as follows: Having a connector portion including wiring on a substrate for transmitting signals in the first propagation form;
  • the connector unit is configured to convert the signal propagation format from the first propagation format to the second propagation format, and to transmit the signal in the second propagation format to the transmission destination connector unit. Yes.
  • the connector device for achieving the above-described object is: Having a connector portion including wiring on a substrate for transmitting signals in the first propagation form;
  • the connector unit is configured to transmit a signal with the transmission source connector unit in the second propagation format, and to convert the signal propagation format from the second propagation format to the first propagation format. Yes.
  • the connector device for achieving the above object is A first connector including a wiring on a transmission source board for transmitting a signal in the first propagation format and converting the signal propagation format from the first propagation format to the second propagation format; A signal is transmitted to the first connector unit in the second propagation format, and the signal transmission format is converted from the second propagation format to the first propagation format to transmit the signal.
  • a wireless transmission system of the present disclosure for achieving the above object is A transmitter for transmitting a high-frequency signal; A receiving unit for receiving a high-frequency signal; A waveguide that transmits a high-frequency signal between the transmitter and the receiver; A connector device connecting at least one of the transmission unit and the reception unit and the waveguide, or connecting the waveguides; With Connector device A first connector including a wiring on a transmission source board for transmitting a signal in the first propagation format and converting the signal propagation format from the first propagation format to the second propagation format; A signal is transmitted to the first connector unit in the second propagation format, and the signal transmission format is converted from the second propagation format to the first propagation format to transmit the signal.
  • a second connector portion including wiring on the substrate; It has composition which has.
  • the signal propagation form is changed from the first propagation form to the second propagation form, that is, the first propagation form.
  • the signal is transmitted in the other format.
  • the present disclosure it is possible to realize a connector device that is less likely to reflect or leak electromagnetic waves and that is easy to detach or assemble, for example, between waveguides.
  • the effect described in this specification is an illustration to the last, Comprising: It is not limited to this, There may be an additional effect.
  • FIG. 1A is a block diagram illustrating an example of a configuration of a wireless transmission system to which the technology of the present disclosure is applied
  • FIG. 1B is a block diagram illustrating an example of a specific configuration of a transmission unit and a reception unit in the wireless transmission system.
  • FIG. 2A is a side view including a partial cross section illustrating the outline of the configuration of the connector device according to the first embodiment
  • FIG. 2B is a perspective view illustrating the outline of the configuration of the main part of the connector device according to the first embodiment.
  • 3A is a diagram for explaining the operation and effect of the connector device according to the first embodiment (part 1)
  • FIG. 3B is a diagram for explaining the operation and effect of the connector device according to the first embodiment (part 2).
  • FIG. 4A is a side view including a partial cross section showing an outline of the configuration of the connector device according to the second embodiment
  • FIG. 4B is a perspective view showing an outline of the configuration of the connector device according to the second embodiment
  • FIG. 5A is a plan view showing a structure in which four channels are coupled simultaneously
  • FIG. 5B is a side sectional view showing before and after coupling.
  • FIG. 6 is a perspective view showing a structure in which two waveguides are directly coupled.
  • FIG. 7A is a diagram showing the transmission coefficient S21 with respect to the shift amount in the X direction in a structure in which two waveguides are directly coupled
  • FIG. 7B is a diagram showing the transmission coefficient S21 with respect to the shift amount in the Y direction.
  • FIG. 7A is a diagram showing the transmission coefficient S21 with respect to the shift amount in the X direction in a structure in which two waveguides are directly coupled
  • FIG. 7B is a diagram showing the transmission coefficient S21 with respect to the shift amount in the
  • FIG. 7C is a diagram illustrating the transmission coefficient S21 with respect to the shift amount in the Z direction.
  • FIG. 8A is a perspective view illustrating a coupling structure according to Comparative Example 1 using an open ring resonator
  • FIG. 8B is a diagram illustrating coupling characteristics of the coupling structure according to Comparative Example 1.
  • 9A is a diagram showing a transmission coefficient S21 with respect to the shift amount in the X direction in the coupling structure according to Comparative Example 1
  • FIG. 9B is a diagram showing a transmission coefficient S21 with respect to the shift amount in the Y direction
  • FIG. It is a figure which shows the transmission coefficient S21 with respect to the shift amount of a Z direction.
  • FIG. 10A is a perspective view illustrating a coupling structure according to Comparative Example 2 using a loop antenna
  • FIG. 10B is a diagram illustrating coupling characteristics of the coupling structure according to Comparative Example 2.
  • 11A is a diagram illustrating a transmission coefficient S21 with respect to the shift amount in the X direction in the coupling structure according to Comparative Example 2
  • FIG. 11B is a diagram illustrating the transmission coefficient S21 with respect to the shift amount in the Y direction
  • FIG. It is a figure which shows the transmission coefficient S21 with respect to the shift amount of a Z direction.
  • Wireless transmission systems that transmit electromagnetic waves, particularly high-frequency signals such as microwaves, millimeter waves, and terahertz waves, using waveguides as media are signals between various devices such as electronic devices, information processing devices, and semiconductor devices. And transmission of signals between circuit boards in one device (equipment).
  • a waveguide that transmits a high-frequency signal has a function as a cable that connects between devices and between circuit boards, and is sometimes called a waveguide cable.
  • millimeter waves are radio waves having a frequency of 30 [GHz] to 300 [GHz] (wavelengths of 1 [mm] to 10 [mm]).
  • Gbps for example, 5 [Gbps] or more
  • signals that require high-speed signal transmission in the Gbps order include data signals such as movie images and computer images.
  • signal transmission in the millimeter wave band is excellent in interference resistance, and there is an advantage that it is not necessary to disturb other electric wiring in cable connection between devices.
  • the waveguide In a wireless transmission system that transmits a high-frequency signal, for example, a millimeter-wave band signal, the waveguide (waveguide cable) may be configured by a hollow waveguide or a dielectric waveguide.
  • the configuration may be a configuration including a waveguide filled with a dielectric in a tube (hereinafter referred to as “dielectric waveguide”).
  • dielectric waveguide it is preferable to use a dielectric waveguide that is more flexible than the hollow waveguide.
  • the electromagnetic wave propagates through the dielectric while forming an electromagnetic field according to the wavelength (frequency) or the like.
  • a wireless transmission system using a waveguide between a circuit board and a waveguide, between a waveguide and a circuit board, or between waveguides (waveguides) Are coupled via a connector device.
  • the circuit board is the transmission source
  • the waveguide is the transmission destination.
  • the waveguide is the transmission source
  • the circuit board is the transmission destination.
  • one waveguide serves as a transmission source
  • the other waveguide serves as a transmission destination.
  • the transmission-side connector device is the connector device according to the first aspect
  • the transmission-destination side connector device is the connector device according to the second aspect.
  • a connector device including a transmission-source-side connector device and a transmission-destination-side connector device is a connector device according to the third aspect.
  • the connector unit that is, the transmission source connector unit, performs signal transmission with the transmission source waveguide in the first propagation form. It can be configured.
  • the transmission destination connector can be configured to transmit signals in the first propagation form with the transmission destination waveguide. That is, regardless of the transmission source and the transmission destination, signals are transmitted in the second propagation form between the connector parts including the wiring on the substrate, and the first between the connector part and the waveguide. The signal is transmitted in the form of propagation.
  • the first propagation form and the second propagation form are different (different) propagation forms. The same shall apply hereinafter.
  • the connector portion that is, the transmission destination connector portion transmits signals in the first propagation form to the transmission destination waveguide. It can be configured. Further, the transmission source connector portion can be configured to transmit signals in the first propagation form with the transmission source waveguide. That is, regardless of the transmission destination and the transmission source, signals are transmitted in the second propagation form between the connector parts including the wiring on the substrate, and the first between the connector part and the waveguide. The signal is transmitted in the form of propagation.
  • the transmission source connector unit is configured to transmit a signal in the first propagation form with the transmission source waveguide
  • the transmission destination The connector portion can be configured to transmit a signal with the transmission destination waveguide in the first propagation form. That is, regardless of the transmission source and the transmission destination, signals are transmitted in the second propagation form between the connector parts including the wiring on the substrate, and the first between the connector part and the waveguide. Signals are transmitted in the form of propagation.
  • transmission is performed in the first propagation form and the second propagation form.
  • the signal to be used can be a high frequency signal. Further, a high frequency signal can be a millimeter wave band signal.
  • FIG. 1A is a block diagram illustrating an example of a configuration of a wireless transmission system to which the technology of the present disclosure is applied
  • FIG. 1B is a block diagram illustrating an example of a specific configuration of a transmission unit and a reception unit in the wireless transmission system. It is.
  • a wireless transmission system 1 includes a transmission unit 10 that transmits a high-frequency signal, a reception unit 20 that receives a high-frequency signal, and a transmission unit 10 and a reception unit 20. And a waveguide 30 for transmitting a high-frequency signal.
  • the waveguide 30 may be a hollow waveguide or a dielectric waveguide, but a dielectric waveguide that is more flexible than a hollow waveguide is used. Is preferred.
  • the waveguide may have a structure composed of a hollow waveguide or a structure composed of a dielectric waveguide.
  • the high-frequency signal is a millimeter-wave band signal (millimeter-wave communication)
  • the millimeter wave communication can take a wide communication band, it is easy to increase the data rate.
  • the frequency used for transmission can be separated from the frequency of other baseband signal processing, and interference between the millimeter wave and the frequency of the baseband signal hardly occurs.
  • the millimeter wave band has a short wavelength, the waveguide structure determined according to the wavelength can be made small. In addition, since the distance attenuation is large and the diffraction is small, electromagnetic shielding is easy to perform.
  • the stability of a carrier wave has strict regulations to prevent interference and the like.
  • the transmission unit 10 converts the signal to be transmitted into a millimeter-wave signal and outputs the signal to the waveguide 30.
  • the receiving unit 20 receives a millimeter wave signal transmitted through the waveguide 30 and performs a process of restoring (restoring) the original signal to be transmitted.
  • the transmission unit 10 is provided in the first communication device 100
  • the reception unit 20 is provided in the second communication device 200.
  • the waveguide 30 also transmits a high-frequency signal between the first communication device 100 and the second communication device 200.
  • the transmission unit 10 and the reception unit 20 are combined and arranged in pairs.
  • the signal transmission method between the first communication device 100 and the second communication device 200 may be a one-way (one-way) transmission method or a two-way transmission method. .
  • the transmission unit 10 (first communication device 100) and the reception unit 20 (second communication device 200) are arranged within a predetermined range.
  • the “predetermined range” is not limited as long as the high-frequency signal is a millimeter wave signal and the millimeter wave transmission range can be limited.
  • a range in which the distance is shorter than the distance between communication devices used in broadcasting or general wireless communication corresponds to the “predetermined range”.
  • the transmission unit 10 and the reception unit 20 are arranged within a predetermined range, as illustrated in FIG. 1A, separate communication devices (electronic devices), that is, the first communication device 100 and the second communication device.
  • the transmission unit 10 and the reception unit 20 may be arranged on separate circuit boards in one electronic device. In the case of this form, one circuit board corresponds to the first communication device 100 and the other circuit board corresponds to the second communication device 200.
  • the transmission unit 10 and the reception unit 20 are arranged on different semiconductor chips in one electronic device.
  • one semiconductor chip corresponds to the first communication device 100 and the other semiconductor chip corresponds to the second communication device 200.
  • positioned in the separate circuit part on the same circuit board can be considered.
  • one circuit unit corresponds to the first communication device 100 and the other circuit unit corresponds to the second communication device 200.
  • the first communication device 100 and the second communication device 200 for example, the following combinations can be considered.
  • the combinations exemplified below are only examples, and are not limited to these combinations.
  • the first communication device 100 When the second communication device 200 is a battery-powered device such as a mobile phone, a digital camera, a video camera, a game machine, or a remote controller, the first communication device 100 performs the battery charger, image processing, and the like. A combination of what is called a base station can be considered. Further, when the second communication device 200 is a device having an appearance such as a relatively thin IC card, the first communication device 100 may be a combination of card reading / writing devices. The card reading / writing device is further used in combination with an electronic device main body such as a digital recording / reproducing device, a terrestrial television receiver, a mobile phone, a game machine, or a computer. Further, in the case of application to an imaging device, for example, the first communication device 100 is on the main substrate side and the second communication device 200 is on the imaging substrate side, and signal transmission is performed within one device (device). It will be.
  • a battery-powered device such as a mobile phone, a digital camera, a video camera, a
  • the transmission unit 10 includes, for example, a signal generation unit 11 that processes a signal to be transmitted and generates a millimeter wave signal.
  • the signal generation unit 11 is a signal conversion unit that converts a signal to be transmitted into a millimeter wave signal, and includes, for example, an ASK (Amplitude Shift Keying) modulation circuit. Specifically, the signal generation unit 11 generates a millimeter-wave ASK modulation wave by multiplying the millimeter-wave signal supplied from the oscillator 111 and the transmission target signal by the multiplier 112, and passes through the buffer 113. The output configuration is adopted.
  • a connector device 40 is interposed between the transmitter 10 and the waveguide 30.
  • the receiving unit 20 includes, for example, a signal restoring unit 21 that processes a millimeter wave signal given through the waveguide 30 to restore the original transmission target signal.
  • the signal restoration unit 21 is a signal conversion unit that converts a received millimeter-wave signal into an original signal to be transmitted, and includes, for example, a square (square) detection circuit.
  • the signal restoration unit 21 employs a configuration in which a millimeter wave signal (ASK modulated wave) given through the buffer 211 is squared by the multiplier 212 to be converted into a transmission target signal and output through the buffer 213. ing.
  • a connector device 50 is interposed between the waveguide 30 and the receiving unit 20.
  • the waveguide 30 is configured with a waveguide structure that transmits millimeter waves while confining them in the waveguide, and has a characteristic of efficiently transmitting electromagnetic waves in the millimeter wave band.
  • the waveguide 30 may be a dielectric waveguide configured to include a dielectric material having a specific dielectric constant in a certain range and a dielectric loss tangent in a certain range.
  • the “certain range” may be a range in which the relative permittivity and the dielectric loss tangent of the dielectric material are within a range in which a desired effect can be obtained.
  • the characteristics of the dielectric waveguide are not determined only by the dielectric material itself, but the transmission path length and the millimeter wave frequency (wavelength) are also involved in determining the characteristics. Accordingly, the relative permittivity and dielectric loss tangent of the dielectric material are not necessarily clearly defined, but can be set as follows as an example.
  • the dielectric material In order to transmit a millimeter-wave signal at high speed in the dielectric waveguide, the dielectric material has a relative dielectric constant of about 2 to 10 (preferably 3 to 6) and a dielectric loss tangent of 0.00001 to It is desirable to set it to about 0.01 (preferably 0.00001 to 0.001).
  • the dielectric material satisfying such conditions include those made of acrylic resin, urethane resin, epoxy resin, silicone, polyimide, and cyanoacrylate resin.
  • the waveguide 30 may be configured with one waveguide, or configured with a plurality of waveguides, for example, with two waveguides 30 and 30 as shown in FIG. 1B. It can also be. In the latter case, the connector device 60 is interposed between the two waveguides 30 and 30. That is, the connector device 60 connects (couples) the waveguides 30 and 30 to each other.
  • the present embodiment the case where the connector device 60 is interposed between the two waveguides 30 and 30 is used as the connector device according to the first embodiment, and is interposed between the transmission unit 10 and the waveguide 30.
  • a case where the present invention is applied to the connector device 40 will be described as a connector device according to the second embodiment.
  • the present invention is not limited to the connector device 60 interposed between the two waveguides 30 and 30 and the connector device 40 interposed between the transmitter 10 and the waveguide 30,
  • the present invention can also be applied to the connector device 50 interposed between the receiving unit 20 and the connector device 40 in the same manner.
  • the connector device is composed of a combination of a first connector part (one of male / female) and a second connector part (the other of male / female) like a so-called male / female combination.
  • the connector device composed of this combination is the connector device according to the third aspect.
  • the connector device according to the present embodiment is not limited to the connector device according to the third aspect.
  • a connector device including only one connector portion may be used, and the connector device is the connector device according to the first aspect or the connector device according to the second aspect.
  • Example 1 Example 1 and Example 2 of the connector device according to the embodiment of the present disclosure will be described.
  • FIG. 2A is a side view including a partial cross section illustrating the outline of the configuration of the connector device according to the first embodiment
  • FIG. 2B is a perspective view illustrating the outline of the configuration of the main part of the connector device according to the first embodiment. is there.
  • the connector device 60A is a connector device that is interposed between two waveguides 30 and 30 and connects (couples) the two waveguides 30 and 30 to each other.
  • the two waveguides 30 and 30 are described as waveguides 30A and 30B.
  • a high-frequency signal for example, a millimeter-wave band signal is transmitted from one (left side in the figure) waveguide 30A to the other (right side in the figure) waveguide 30B
  • the wave tube 30A becomes the transmission source waveguide 30A
  • the other waveguide 30B becomes the transmission destination waveguide 30B.
  • a substrate 71 is provided at the end of the transmission source waveguide 30A.
  • the substrate 71 includes a coupling structure that transmits signals in the first propagation form, a wiring that transmits signals, and a coupling structure that transmits signals in the second propagation form. It is formed by vias or the like.
  • the connector part 61 including the wiring on the board 71 corresponds to the connector device according to the first aspect, and transmits signals in the first propagation form (propagation mode) to and from the transmission source waveguide 30A. Transmission is performed to convert the signal propagation form from the first propagation form to the second propagation form.
  • a substrate 72 is provided at the end of the transmission destination waveguide 30B.
  • the substrate 72 includes a coupling structure that transmits signals in the first propagation form, a wiring that transmits signals, and a coupling structure that transmits signals in the second propagation form. It is formed by vias or the like.
  • the connector part 62 including the wiring on the board 72 corresponds to the connector device according to the second aspect, and is in a second propagation form with the connector part 61 including the wiring on the board 71 of the transmission source. Signal transmission is performed, and the signal propagation format is converted from the second propagation format to the first propagation format. And the connector part 62 transmits a signal by the 1st propagation form between the waveguides 30B of a transmission destination.
  • the connector part 62 including the wiring on the transmission source board 71 and the transmission source waveguide 30A, and the connector part 62 including the wiring on the transmission destination board 72 and the transmission destination waveguide.
  • the first propagation format for transmitting a signal to and from 30B that is, the coupling structure for signal transmission does not matter.
  • a specific example of the first propagation form (signal transmission coupling structure) is shown in FIG. 2B, and a detailed description thereof will be described later.
  • a second propagation form for transmitting a signal between the connector 61 including the wiring on the transmission source board 71 and the connector 62 including the wiring on the transmission destination board 72, that is, the signal transmission
  • a known coupling structure such as capacitive coupling, electromagnetic induction coupling, electromagnetic field coupling between transmission lines, resonator coupling, and antenna can be used.
  • examples of the second propagation form include a loop antenna structure, a patch antenna structure, and an open ring resonator.
  • first propagation form signal transmission coupling structure
  • the configuration on the connector side including the transmission destination board 72 will be described, but the configuration on the connector section side including the transmission source board 71 is the same.
  • a microstrip line 722 which is a wiring is formed on the substrate 72.
  • a first pattern portion 723 ⁇ / b> A that forms an opening pattern portion 723 is provided at the front end portion (end portion) of the microstrip line 722.
  • a second pattern portion 723B is provided so as to overlap the first pattern portion 723A.
  • the second pattern portion 723B is connected to a ground line (not shown).
  • the first pattern portion 723A and the second pattern portion 723B overlap each other so that the first pattern portion 723A and the second pattern portion 723B gradually spread from the terminal end of the microstrip line 722 toward the edge of the substrate 72.
  • the opening pattern portion opens in a tapered shape. 723 is formed.
  • the shape of the opening of the opening pattern portion 723 is a tapered shape.
  • the shape is not limited to this, and may be a shape that gradually expands stepwise toward the edge of the substrate 72, for example. .
  • a coupling pattern portion 724 is provided at the rear end portion (starting end portion) of the microstrip line 722 so as to couple with the wiring on the transmission source substrate 71 in the second propagation form.
  • a loop antenna structure, a patch antenna structure, an open ring resonator, or the like is applied to the coupling pattern portion 724.
  • the opening pattern portion 723 is formed in a recess (notch portion) (not shown) formed at the end portion of the transmission destination waveguide 30B. By being inserted, it is coupled to the transmission destination waveguide 30B. Then, a signal transmitted in the second propagation form from the connector unit 61 including the wiring on the transmission source substrate 71 is received by the coupling pattern unit 724 and opened as an electromagnetic wave (electromagnetic field distribution) by the microstrip line 722. The data is transmitted to the pattern unit 723. The transmitted electromagnetic wave is enlarged in the substrate plane (horizontal plane) of the substrate 71 by the opening pattern portion 723 and radiated into the transmission destination waveguide 30B. As a result, signal transmission is performed between the connector portion including the transmission destination substrate 72 and the transmission destination waveguide 30B.
  • a signal transmitted in the second propagation form from the connector unit 61 including the wiring on the transmission source substrate 71 is received by the coupling pattern unit 724 and opened as an electromagnetic wave (electromagnetic field distribution) by the microstrip line 72
  • the signal propagation form is changed from the first propagation form to the first propagation form. 2 is converted into a different (different) format from the first propagation format, and the signal is transmitted in the other format.
  • the required accuracy with respect to the relative displacement between the transmission source and the transmission destination is not as strict as compared with, for example, direct connection between waveguides, and reflection and leakage of electromagnetic waves at the coupling portion (connector portion). Can be suppressed, and attachment / detachment or assembly is facilitated.
  • the connector device 60A for connecting (coupling) between the transmission source waveguide 30A and the transmission destination waveguide 30B has a detachable coupling structure, and the waveguide 30A and the waveguide 30B are arbitrarily connected. It is possible to connect to or disconnect the connection.
  • the term “detachable” as used herein includes the concept of “easy to attach / detach” in the sense that no effort is required for connection (attachment) or release (removal). Accordingly, attachment or removal using a screw-type fixing member such as a coaxial connector device is not included in the concept of “detachable” defined herein.
  • the transmission destination board 72 is arranged at a different angle with respect to the transmission source board 71.
  • the coupling pattern portion 724 of the transmission destination board 72 is disposed close to the coupling pattern section 724 of the transmission source board 71, preferably so as to overlap vertically.
  • the transmission direction of a high-frequency signal for example, a millimeter wave band signal, can be arbitrarily changed in addition to the linear direction.
  • FIG. 4A is a side view including a partial cross section showing an outline of the configuration of the connector device according to the second embodiment
  • FIG. 4B is a perspective view showing an outline of the configuration of the connector device according to the second embodiment.
  • the connector device 60B is, for example, a connector device that is interposed between the transmission unit 10 and the waveguide 30 and connects (couples) the circuit board 12 of the transmission unit 10 and the waveguide 30.
  • the circuit board 12 of the transmission unit 10 is a transmission source board corresponding to the board 71 of the first embodiment.
  • a semiconductor chip 13 on which the signal generator 11 and the like are integrated is mounted on the circuit board 12.
  • a coupling pattern part 724 on the board 72, which becomes the transmission destination connector part 62, and a coupling pattern part 714 coupled in the second propagation form are provided as the connector part 61.
  • the semiconductor chip 13 and the coupling pattern portion 714 are connected by a microstrip line 712.
  • the electromagnetic wave based on the millimeter waveband signal output from the semiconductor chip 13 is transmitted in the first propagation form by the microstrip line 712 that is the wiring on the board.
  • the data is transmitted to the coupling pattern portion 714.
  • the signal propagation format is converted from the first propagation format to the second propagation format, and the connector unit 62 including the coupling pattern unit 724 of the transfer destination substrate 72 is connected to the connector unit 61. Signals are transmitted in the second propagation format.
  • the signal propagation format is the first in the connector portion 61 including the coupling pattern portion 714 of the transmission source circuit board 12 and the connector portion 62 including the transmission destination board 72. Conversion from one propagation format to the second propagation format, that is, a format different from the first propagation format, and signal transmission is performed in the other format. Therefore, even in the connector device 60B according to the second embodiment, the same operations and effects as those of the connector device 60A according to the first embodiment can be obtained.
  • FIG. 5A shows a plan view of a structure in which four channels are coupled simultaneously
  • FIG. 5B shows a side sectional view before and after coupling.
  • FIG. 6 is a perspective view showing a structure in which two waveguides 30A and 30B are directly connected.
  • the waveguides 30A and 30B are dielectric waveguides, the size is 1 ⁇ 2 [mm], and the relative dielectric constant of the dielectric is 4.
  • the X direction is a signal transmission direction of the waveguides 30A and 30B
  • the Y direction is a direction orthogonal to the long-side surface of the waveguides 30A and 30B
  • the Z direction is the waveguides 30A and 30B. It is a direction orthogonal to the surface on the short side of 30B.
  • FIG. 1 A coupling structure according to Comparative Example 1 in which the coupling of the open ring resonator 80 is used as a coupling structure for signal transmission between the connector section including the substrate 71 (circuit board 12) and the connector section including the substrate 72.
  • 8A is a perspective view showing the coupling structure according to Comparative Example 1 using the open ring resonator 80
  • FIG. 8B shows the coupling characteristics of the coupling structure according to Comparative Example 1.
  • FIG. as an example, an open ring resonator 80 having a diameter of 0.6 [mm] is used.
  • 9A, 9B, and 9C show S-parameter transmission coefficients S21 with respect to the shift amounts (position shift amounts) in the X direction, the Y direction, and the Z direction in the coupling structure according to Comparative Example 1.
  • the X direction is a transmission direction
  • the Y direction is a direction orthogonal to the X direction in the substrate surface
  • the Z direction is a direction orthogonal to the substrate surface.
  • FIG. 10A is a perspective view showing the coupling structure according to Comparative Example 2 using the loop antenna 90
  • FIG. 10B shows the coupling characteristics of the coupling structure according to Comparative Example 2.
  • a loop antenna 90 having a diameter of 1.3 [mm] is used as an example.
  • 11A, 11B, and 11C show S-parameter transmission coefficients S21 with respect to the shift amounts (position shift amounts) in the X direction, the Y direction, and the Z direction in the coupling structure according to Comparative Example 2.
  • the X direction is a transmission direction
  • the Y direction is a direction orthogonal to the X direction in the substrate surface
  • the Z direction is a direction orthogonal to the substrate surface.
  • the coupling structure according to the comparative example 2 using the coupling of the loop antenna 90 as the coupling structure for signal transmission between the connector portions including the substrates 71 (12) and 72, respectively the positional deviation in the Y direction is somewhat deviated. On the other hand, it has been confirmed that there is little change in characteristics. However, the coupling loss is slightly deteriorated to about ⁇ 0.49 [dB] @ 60 [GHz].
  • this indication can also take the following structures.
  • Connector device ... first aspect Having a connector portion including wiring on a substrate for transmitting signals in the first propagation form;
  • the connector unit is a connector device that converts a signal propagation form from a first propagation form to a second propagation form, and transmits a signal in a second propagation form to a transmission destination connector part.
  • the connector device according to [A01] wherein the connector unit transmits a signal in a first propagation form with a transmission source waveguide.
  • the connector device according to any one of [A01] to [A03], wherein the signal transmitted in the first propagation format and the second propagation format is a high-frequency signal.
  • the connector device according to [A04], wherein the high-frequency signal is a millimeter-wave band signal.
  • the connector unit is a connector device that transmits a signal to and from a transmission source connector unit in a second propagation format and converts the signal propagation format from the second propagation format to the first propagation format.
  • a first connector including a wiring on a transmission source board for transmitting a signal in the first propagation format and converting the signal propagation format from the first propagation format to the second propagation format;
  • a signal is transmitted to the first connector unit in the second propagation format, and the signal transmission format is converted from the second propagation format to the first propagation format to transmit the signal.
  • a second connector portion including wiring on the substrate;
  • a connector device [C02] The connector device according to [C01], in which the first connector unit transmits a signal in a first propagation form with a transmission source waveguide.
  • Wireless transmission system A transmitter for transmitting a high-frequency signal; A receiving unit for receiving a high-frequency signal; A waveguide that transmits a high-frequency signal between the transmitter and the receiver; A connector device connecting at least one of the transmission unit and the reception unit and the waveguide, or connecting the waveguides; With Connector device A first connector including a wiring on a transmission source board for transmitting a signal in the first propagation format and converting the signal propagation format from the first propagation format to the second propagation format; A signal is transmitted to the first connector unit in the second propagation format, and the signal transmission format is converted from the second propagation format to the first propagation format to transmit the signal. A second connector portion including wiring on the substrate; A wireless transmission system. [D02] The radio transmission system according to [D01], in which the high-frequency signal is a millimeter-wave band signal.
  • SYMBOLS 1 ... Wireless transmission system, 10 ... Transmission part, 11 ... Signal generation part, 12 ... Circuit board, 13 ... Semiconductor chip, 20 ... Reception part, 21 ... Signal restoration 30, 30 A, 30 B... Waveguide, 40, 50, 60, 60 A, 60 B... Connector device, 61... Transmission source connector, 62. , 72 ... Substrate, 80 ... Open ring resonator, 90 ... Loop antenna, 100 ... First communication device, 111 ... Oscillator, 112, 212 ... Multiplier, 113, 211, 213 ... buffer, 200 ... second communication device, 712, 722 ... microstrip line, 723 ... opening pattern part, 723A ... first pattern part, 723B ... Second pattern portion 714 24 ... binding pattern part

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  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Transceivers (AREA)

Abstract

La présente invention concerne un dispositif de connecteur ayant une partie de connecteur comprenant un câblage sur une carte de circuit imprimé de source de transmission permettant de transmettre un signal dans un premier format de propagation et de convertir le format de propagation du signal du premier format de propagation à un second format de propagation, et une partie de connecteur comprenant un câblage sur une carte de circuit imprimé de destination de transmission permettant de transférer un signal dans le second format de propagation vers et depuis la partie de connecteur comprenant le câblage sur la carte de circuit imprimé de source de transmission et convertissant le format de propagation du signal du second format de propagation au premier format de propagation.
PCT/JP2014/059176 2013-04-25 2014-03-28 Dispositif de connecteur et système de transmission radio WO2014174991A1 (fr)

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JP2013-091986 2013-04-25
JP2013091986 2013-04-25

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108418400A (zh) * 2018-03-18 2018-08-17 李晨天 一种波导传能式电源变换器
CN113300104A (zh) * 2021-04-14 2021-08-24 南京聚变信息科技有限公司 集卫星通信、自组网的多波形融合装置

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5210656A (en) * 1975-06-19 1977-01-27 Matsushita Electric Ind Co Ltd Micro wave device
JPS6135403U (ja) * 1984-08-02 1986-03-04 三菱電機株式会社 超高周波半導体回路用ケ−ス
JPH11261312A (ja) * 1998-03-12 1999-09-24 Denso Corp 基板用線路・導波管変換器
JPH11308021A (ja) * 1998-04-23 1999-11-05 Nec Corp 高周波パッケージの接続構造
JP2005341443A (ja) * 2004-05-28 2005-12-08 Mitsubishi Heavy Ind Ltd 導波管スロット結合を用いた電力分配器
JP2008061236A (ja) * 2006-08-28 2008-03-13 Avago Technologies General Ip (Singapore) Private Ltd 改善されたガルバニックアイソレータ
JP2008067012A (ja) * 2006-09-06 2008-03-21 Univ Of Tokushima 高周波信号伝送装置
JP2010078430A (ja) * 2008-09-25 2010-04-08 Sony Corp ミリ波誘電体内伝送装置とその製造方法及びミリ波誘電体内伝送方法
US20110117836A1 (en) * 2009-11-17 2011-05-19 Sony Corporation Signal transmission channel

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5210656A (en) * 1975-06-19 1977-01-27 Matsushita Electric Ind Co Ltd Micro wave device
JPS6135403U (ja) * 1984-08-02 1986-03-04 三菱電機株式会社 超高周波半導体回路用ケ−ス
JPH11261312A (ja) * 1998-03-12 1999-09-24 Denso Corp 基板用線路・導波管変換器
JPH11308021A (ja) * 1998-04-23 1999-11-05 Nec Corp 高周波パッケージの接続構造
JP2005341443A (ja) * 2004-05-28 2005-12-08 Mitsubishi Heavy Ind Ltd 導波管スロット結合を用いた電力分配器
JP2008061236A (ja) * 2006-08-28 2008-03-13 Avago Technologies General Ip (Singapore) Private Ltd 改善されたガルバニックアイソレータ
JP2008067012A (ja) * 2006-09-06 2008-03-21 Univ Of Tokushima 高周波信号伝送装置
JP2010078430A (ja) * 2008-09-25 2010-04-08 Sony Corp ミリ波誘電体内伝送装置とその製造方法及びミリ波誘電体内伝送方法
US20110117836A1 (en) * 2009-11-17 2011-05-19 Sony Corporation Signal transmission channel

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108418400A (zh) * 2018-03-18 2018-08-17 李晨天 一种波导传能式电源变换器
CN113300104A (zh) * 2021-04-14 2021-08-24 南京聚变信息科技有限公司 集卫星通信、自组网的多波形融合装置
CN113300104B (zh) * 2021-04-14 2022-09-13 南京聚变信息科技有限公司 集卫星通信、自组网的多波形融合装置

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