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WO2014158339A1 - Système de dissipation thermique - Google Patents

Système de dissipation thermique Download PDF

Info

Publication number
WO2014158339A1
WO2014158339A1 PCT/US2014/013822 US2014013822W WO2014158339A1 WO 2014158339 A1 WO2014158339 A1 WO 2014158339A1 US 2014013822 W US2014013822 W US 2014013822W WO 2014158339 A1 WO2014158339 A1 WO 2014158339A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat transfer
assembly according
dissipation assembly
thermal dissipation
heat
Prior art date
Application number
PCT/US2014/013822
Other languages
English (en)
Inventor
Richard Allen BEYERLE II
Original Assignee
Graftech International Holdings Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Graftech International Holdings Inc. filed Critical Graftech International Holdings Inc.
Publication of WO2014158339A1 publication Critical patent/WO2014158339A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3736—Metallic materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • a thermal dissipation assembly includes a substrate having a heat transfer surface.
  • a plurality of heat transfer pins are formed by wrapping flexible graphite sheet at least one complete revolution. The plurality of heat transfer pins extend outwardly from said heat dissipation surface.
  • Figure 1 is an elevated view of a heat transfer pin according to the present invention
  • Figure 2 is an elevated view of an alternate heat transfer pin having a folded or crushed base
  • Figure 3 is an elevated view of a heat dissipation assembly
  • Figure 4 is an section view of a heat transfer pin mounted to a projection and taken along the cylindrical axis.
  • Figure 5 is an elevated view of an alternate heat dissipation assembly incorporating the heat transfer pins of the present invention.
  • Heat transfer pin 10 may advantageously be made of a wrapped flexible graphite sheet 12.
  • the flexible graphite sheet 12 is relatively thin, and in one embodiment, the flexible graphite sheet 12 may be less than about 1 mm thick. In other embodiments the flexible graphite sheet 12 may be less than about 0.5 mm thick. In still other embodiments, the flexible graphite sheet 12 may be less than about 0.1 mm thick. In still other embodiments, the flexible graphite sheet 12 may be less than about 0.05 mm. According to one or more embodiments, flexible graphite sheet 12 may be from between 0.01 mm to 0.1 mm.
  • the flexible graphite sheet 12 may be from between 0.01 mm to about 0.05 mm.
  • the flexible graphite sheets 12 may be, for example, a sheet of a compressed mass of exfoliated graphite particles, a sheet of graphitized polyimide or combinations thereof.
  • Heat transfer pin 10 functions to conduct heat away from a heat source so that convective and/or radiative heat transfer may occur.
  • the flexible graphite sheet 12 may have an in-plane thermal conductivity of greater than about 250 W/mK.
  • the in-plane thermal conductivity of the flexible graphite sheet 12 is at least about 400 W/mK.
  • the in-plane thermal conductivity of the flexible graphite sheet 12 may be at least about 550 W/mK.
  • the in-plane conductivity of the flexible graphite sheet 12 may be at least about 1000 W/mK.
  • the in-plane thermal conductivity may range from at least 1000 W/mK to about 1700 W/mK.
  • the in-plane thermal conductivity may range from about 250 W/mK to about 700 W/mK.
  • the flexible graphite sheet 12 is thermally anisotropic and accordingly the thru-plane conductivity is significantly less than the in-plane conductivity.
  • the anisotropic ratio of the sheet is greater than at least about 40, other examples of suitable anisotropic ratios include at least about 75, at least about 100, and at least about 150.
  • Anisotropic ratio is used herein to mean the in-plane thermal conductivity divided by the thru-plane thermal conductivity.
  • the thru-plane thermal conductivity of the flexible graphite sheet may be from between about 1 W/mK and about 20 W/mK. In this or other embodiments, the thru-plane thermal conductivity is from between about 2 W/mK and about 6 W/mK.
  • the thru-plane thermal conductivity may be less than about 20 W/mK. In further embodiments, the thru-plane thermal conductivity may be less than about 10 W/mK. Any combination of the above in-plane and thru -plane thermal conductivities may be practiced.
  • the flexible graphite sheet 12 may be resin reinforced prior to, or after the flexible graphite sheet 12 is rolled into pin form. The resin may be used, for example, to improve the rigidity of the flexible graphite sheet 12. In combination with resin reinforcement, or in the alternative, one or more flexible graphite layers may include carbon fiber and/or graphite fiber reinforcement.
  • the flexible graphite sheet 12 is a more conformable material than conventional materials used in heat sink pin fin configuration (ex. aluminum or copper).
  • Use of flexible graphite sheet offers a reduction in interfacial thermal heat transfer resistance between the heat transfer pin 10 and the thermal substrate or electric component or non-electric heat source for the transfer of heat.
  • many graphite sheet materials such as many graphitized polyimide and some compressed exfoliated graphite sheets have greater thermal conductivities than materials such as aluminum and even copper.
  • it is the conformable nature of flexible graphite sheets that allows the sheet to be rolled in accordance with the present invention.
  • the heat transfer pin 10 has a generally c-shaped cross section made of a flexible graphite sheet 12 wrapped at least a half revolution.
  • the heat transfer pin is a generally cylindrical shape and is formed by wrapping the flexible graphite sheet 12 at least one complete revolution.
  • the heat transfer pin may be formed by wrapping the flexible graphite sheet 12 in a spiral pattern multiple times to form the heat transfer pin 10.
  • the flexible graphite sheet 12 may be wrapped at least 1.5 revolutions and in further embodiments, at least 2 revolutions.
  • the pin 10 may be formed by wrapping as generally described above, and thereafter, compressed in the direction indicated by arrow A. This may create a crushed area 13 that may advantageously improve thermal contact with the mounting surface (such as the substrate to be described herein below), whether a flat surface, a raised projection or a bore hole (as will be discussed further herein below).
  • the pin 10 is compressed to less than 95 percent of the original length, in other embodiments less than 75 percent of the original length, and still further embodiments, less than 50 percent of the original length. In this or other embodiments, the pin 10 may be compressed to from between 25 percent and 95 percent of the original length.
  • the heat transfer pin 10 may be from between about 5 mm and about 25 mm in length. In other embodiments the pin 10 may be from between about 10 mm and about 20 mm in length. In still other embodiments, the pin 10 may be less than about 50 mm in length. In other embodiments, the pin 10 may be less than about 25 mm in length. In still other embodiments, the pin 10 may be less than 10 mm in length.
  • the heat transfer pin 10 diameter is advantageously from between 50 ⁇ and about 3,000 ⁇ . In further embodiments, the pin 10 diameter may be from between 100 ⁇ and about 2,000 ⁇ . In still further embodiments, the pin 10 diameter may be from between about 300 ⁇ and about 1,000 ⁇ . In these or other embodiments, the pin 10 diameter may be less than about 3,000 ⁇ . In other embodiments, the pin 10 diameter may be less than about 1,000 ⁇ . In still further embodiments, the pin 10 diameter may be less than about 500 ⁇ .
  • the flexible graphite sheet is rolled tightly so that overlapping layer(s) of flexible graphite sheet 12 form a substantially solid outer wall. In other words, advantageously, no gaps are formed between adjacent layer(s) of flexible graphite sheet 12. In this manner, an internal open volume 14 may thus be formed.
  • Pin 10 advantageously includes an average internal diameter d and an average external diameter D.
  • the ratio of d/D is from between 0.9 and about 0.4. In other embodiments, the ratio of d/D is from between about 0.8 and about 0.5. In this or other embodiments, the ratio of d/D is at least 0.4. In other embodiments, the ratio of d/D is at least about 0.6. In still further embodiments, the ratio of d/D is at least about 0.75.
  • Heat dissipation assembly 16 includes a substrate 18 which includes a heat dissipation surface 20.
  • a plurality of heat transfer pins 10 are secured to surface 20.
  • surface 20 may include a plurality of bore holes 22 arranged in a repeating pattern such as a matrix including rows and columns.
  • the plurality of bore holes 22 may be arranged in a random pattern. Bore holes 22 may advantageously extend inwardly by a depth of at least 5 percent of the length of the inserted heat transfer pin 10. In other embodiments, the bore holes 22 extend inwardly at least 10 percent of the length of the inserted heat transfer pin 10.
  • the bore holes 22 extend inwardly at least 25 percent of the length of the inserted heat transfer pin 10. Bore holes 22 are advantageously spaced a distance apart from between about 5 times the diameter D of the inserted pins 10 to about 1 times the diameter D of the inserted pins 10. In other embodiments bore holes 22 are spaced a distance apart of from between about 2 times the diameter D of the inserted pins 10 to about 1 times the diameter D of the inserted pins 10. In still further embodiments, bore holes 22 are spaced a distance apart of less than about 5 times the diameter D of the inserted pins 10. In still further embodiments, bore holes 22 are spaced a distance apart of less than about 2 times the diameter D of the inserted pins 10. It should be appreciated that the above disclosure related to spacing and arrangement of bore holes 22 is also applicable to other attachment arrangements, such as, for example, the spacing and arrangement of an outwardly extending projection (discussed later in greater detail) that receives the pin 10 thereon.
  • pin 10 may be secured in bore holes 22 or on projections 30 by friction fit, adhesive and/or other mechanical fastening techniques.
  • pin 10 may include a retaining cap 32 positioned on the end of pin 10 opposed from surface 18.
  • a fastener 34 may extend from retaining cap 32, through internal volume 14 and be secured to outwardly extending projection 30. In this manner pin 10 may be secured to substrate 20 by compression between retaining cap 32 and surface 20.
  • a heat dissipation assembly 40 includes a substrate 42 which is generally cylindrical in shape. As can be seen, substrate 42 includes a radial outer heat dissipation surface 44. A plurality of heat transfer pins 10 are secured to surface 44. As shown in Fig. 5, surface 44 may include a plurality of bore holes 46 (or alternately outwardly extending projections) arranged in a repeating or random pattern having spacing as described herein above.
  • Bore holes 46 may advantageously extend inwardly by a depth of at least 5 percent of the length of the inserted heat transfer pin 10. In other embodiments, the bore holes 46 extend inwardly at least 10 percent of the length of the inserted heat transfer pin 10. In still further embodiments, the bore holes 46 extend inwardly at least 25 percent of the length of the inserted heat transfer pin 10. Pins 10 may be secured in bore holes 46 by friction fit, adhesive or other mechanical fastening techniques. Further, though securing pins 10 in bore holes 46 is particularly advantageous, other methods of securing pins to surface 44 without the use of bore holes 46 may be employed, such as, for example, adhesives and particularly high thermal conductivity adhesives. Further, pins 10 may be secured to substrate 42 according to the pattern, spacing and arrangement described herein above.
  • Substrate 18/42 may be a thermal interface material in contact with a heat generating electronic component.
  • the interface material may be relatively high thermal conductivity metal such as aluminum or copper for example.
  • the interface material may be anisotropic graphite material.
  • the thermal interface material may be one or more layers of compressed exfoliated natural graphite.
  • the substrate 26/42 may be integral with the heat generating component and thus, the heat transfer pins 10 may be directly engaged with the heat generating component.
  • the substrate 26/42 may be a printed circuit board, a metal cladded printed circuit board, a sheet of copper, a sheet of silicon or combinations thereof.
  • Substrate 26/42 may further include the housings or exterior surfaces or heat radiating surfaces of battery-backed or powered sensors located near heat sources such as industrial equipment, testers, power generators or converters. Indeed, substrate 26/42 may include any heat-generating or warm block that permits holes drilled in its surface to a depth adequate to hold the fin or to enable the formation of a projection thereon.

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

L'invention porte sur un ensemble de dissipation thermique qui comprend un substrat avec une surface de transfert thermique. Une pluralité de broches de transfert thermique sont formées par enroulement d'une feuille de graphite flexible. Les broches de transfert thermique s'étendent vers l'extérieur depuis ladite surface de dissipation thermique où des forces par convection et/ou par rayonnement retirent la chaleur de celles-ci. Puisque les dispositifs électroniques deviennent plus denses, la dissipation de chaleur devient une contrainte de conception critique. Dans le même temps que la puissance augmente, les dispositifs eux-mêmes deviennent souvent plus petits et plus compacts.
PCT/US2014/013822 2013-03-12 2014-01-30 Système de dissipation thermique WO2014158339A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201361776824P 2013-03-12 2013-03-12
US61/776,824 2013-03-12

Publications (1)

Publication Number Publication Date
WO2014158339A1 true WO2014158339A1 (fr) 2014-10-02

Family

ID=51624993

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2014/013822 WO2014158339A1 (fr) 2013-03-12 2014-01-30 Système de dissipation thermique

Country Status (1)

Country Link
WO (1) WO2014158339A1 (fr)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6591897B1 (en) * 2002-02-20 2003-07-15 Delphi Technologies, Inc. High performance pin fin heat sink for electronics cooling
US20030221814A1 (en) * 2002-06-03 2003-12-04 International Business Machines Corporation Apparatus having forced fluid cooling and pin-fin heat sink
US20050111189A1 (en) * 2003-11-25 2005-05-26 Smalc Martin D. Thermal solution for electronic devices
US20050156013A1 (en) * 2004-01-21 2005-07-21 Bhatti Mohinder S. Method of making high performance heat sinks
US20080014444A1 (en) * 2006-07-12 2008-01-17 Reineke Leland M Expanded graphite foil heater tube assembly and method of use
WO2012107741A1 (fr) * 2011-02-10 2012-08-16 Airbus Operations Limited Capuchon pour former une cavité hermétiquement scellée autour d'une fermeture

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6591897B1 (en) * 2002-02-20 2003-07-15 Delphi Technologies, Inc. High performance pin fin heat sink for electronics cooling
US20030221814A1 (en) * 2002-06-03 2003-12-04 International Business Machines Corporation Apparatus having forced fluid cooling and pin-fin heat sink
US20050111189A1 (en) * 2003-11-25 2005-05-26 Smalc Martin D. Thermal solution for electronic devices
US20050156013A1 (en) * 2004-01-21 2005-07-21 Bhatti Mohinder S. Method of making high performance heat sinks
US20080014444A1 (en) * 2006-07-12 2008-01-17 Reineke Leland M Expanded graphite foil heater tube assembly and method of use
WO2012107741A1 (fr) * 2011-02-10 2012-08-16 Airbus Operations Limited Capuchon pour former une cavité hermétiquement scellée autour d'une fermeture

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