WO2014157147A1 - 冷却装置 - Google Patents
冷却装置 Download PDFInfo
- Publication number
- WO2014157147A1 WO2014157147A1 PCT/JP2014/058197 JP2014058197W WO2014157147A1 WO 2014157147 A1 WO2014157147 A1 WO 2014157147A1 JP 2014058197 W JP2014058197 W JP 2014058197W WO 2014157147 A1 WO2014157147 A1 WO 2014157147A1
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- WIPO (PCT)
- Prior art keywords
- wick
- container
- heat
- evaporation
- cooling device
- Prior art date
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present invention relates to a cooling device.
- the present invention relates to a liquid cooling type cooling device for cooling various parts to be cooled such as various electronic packages used in electronic devices such as electronic computers, workstations, and personal computers.
- a conventional air-cooled heat sink is composed of a heat receiving portion and a heat radiating fin, and cools the air by supplying air to the heat radiating fin.
- Some heat pipes are incorporated in the heat receiving portion and the heat radiating fins for the purpose of diffusing heat to the entire heat sink.
- a heat pipe is a sealed metal tube or other container (container) that has been vacuum degassed, in which a condensable fluid is sealed as a working fluid. The working fluid evaporated in the evaporation portion) flows to the low temperature portion (condensing portion), dissipates heat, and condenses, thereby transporting heat as latent heat of the working fluid.
- the surface area of the radiating fins is increased in order to improve the heat dissipation performance, it will occupy a huge space, and the cooling fan speed will be increased to increase the air volume and improve the heat dissipation performance. If it tried to do, the problem that the noise by ventilation would increase and the problem that power consumption increased had occurred.
- liquid cooling (water cooling) type cooling devices have been proposed as alternative means for solving the problems caused by the conventional air cooling type heat sink as described above (for example, Patent Documents 1, 2, and 3).
- a liquid cooling type cooling device provided with a cold plate and a heat sink.
- the cold plate is a heat radiating member whose temperature is controlled by taking a liquid heat transport medium mainly composed of water whose temperature is controlled by a circulation device with a temperature control function into the cold plate.
- a conventional liquid-cooling type cooling device has a structure in which one end of a heat pipe is thermally connected to a component to be cooled and the other end of the heat pipe is thermally connected to a cold plate. In this configuration, heat from the component to be cooled is transmitted to the cold plate through the heat sink.
- a space serving as a flow path for the working fluid is provided inside the heat pipe, and the working fluid contained in the space undergoes a phase change or movement such as evaporation or condensation, thereby transferring heat.
- the working liquid evaporates due to the heat generated by the parts to be cooled that have been transmitted through the material of the container constituting the heat pipe, and the vapor moves to the condensing part of the heat pipe.
- the condensing unit the vapor of the working fluid is condensed by the heat pipe wall cooled by the cold plate and returns to the liquid phase state again.
- latent heat is released.
- the hydraulic fluid thus returned to the liquid phase is moved (refluxed) again to the evaporation section by the wick that generates a capillary force provided inside the heat pipe. Heat is transferred by such phase transformation and movement of the hydraulic fluid.
- An object of the present invention is to provide a liquid cooling type cooling device having a heat pipe.
- the cooling device includes: A cooling device comprising a cold plate and a heat sink,
- the heat sink is A heat receiving member thermally connected to the component to be cooled;
- a heat dissipating member thermally connected to the heat dissipating member;
- a heat pipe having a container in which a cavity is formed, a wick that is stored in the container and generates a capillary force, and a working fluid sealed in the cavity in the container;
- the heat pipe has an evaporation portion to which the heat receiving member is attached and a condensation portion to which the heat dissipation member is attached,
- the wick in the container has a structure in which the capillary force of the evaporation part wick in the container in the evaporation part is larger than the capillary force of the condensation part wick in the container in the condensation part,
- the heat dissipation member of the heat sink and the cold plate are thermally connected.
- the capillary force of the wick in the vicinity of the condensation section and the condensation section of the heat pipe that is thermally connected to the cold plate through the heat radiating member, the working fluid in the vicinity of the evaporation section and the evaporation section is reduced. Occurrence of a depletion phenomenon (dryout) can be prevented.
- the cooling device according to the second aspect of the present invention is the above-described cooling device according to the first aspect of the present invention, wherein the wick in the container has the evaporating part wick more than the condensing part wick.
- the structure is characterized by a large amount of wicks.
- the cooling device according to the third aspect of the present invention is the cooling device according to the first aspect of the present invention described above, wherein the structure of the evaporation section wick and the structure of the condensation section wick are the same type of wick structure. If there is In the cross section perpendicular to the longitudinal direction of the container, the wick in the container has a structure in which the area of the evaporation section wick is larger than the area of the condensation section wick.
- the structure of the same kind of wick means that the structure of the evaporation section wick and the structure of the condensation section wick are both the same structure (groove structure, sintered metal, mesh metal, etc.) It means that it is the same complex that combines multiple structures.
- the cooling device is the cooling device according to the first aspect of the present invention described above, wherein the structure of the evaporation section wick and the structure of the condensation section wick are the same type of wick structure. And having a sintered or reticulated metal in the structure of the same type of wick,
- the wick in the container has a fine structure in which the evaporation portion wick is finer than the condensing portion wick in the void of the sintered metal or the mesh of the mesh metal in the cross section perpendicular to the longitudinal direction of the container. It is characterized by.
- the evaporation part of the heat pipe that is thermally connected to the component to be cooled through the heat receiving member, and the cold through the heat radiating member. Even when the temperature difference between the heat pipe and the heat pipe condensing part thermally connected to the plate is large, the capillary force due to the evaporation part wick is larger than the capillary force due to the condensing part wick.
- a cooling device is the cooling device according to any one of the first to fourth aspects of the present invention described above, wherein the wick is provided on the inner wall of the container,
- the container is characterized in that a space portion without the wick is provided at the center of the cross section of the container.
- the space formed inside the container becomes a flow path (vapor flow path) of the evaporated working fluid, and the vapor flow is quickly moved from the evaporation section of the heat pipe to the condensation section of the heat pipe.
- the maximum heat transport amount can be improved.
- a cooling device is the cooling device according to any one of the first to fifth aspects of the present invention described above, wherein the structure of the wick is a groove structure, a sintered metal, or a net-like metal. It is characterized in that it is a composite of a plurality of different structures in a groove structure, sintered metal and network metal.
- the cooling device according to the seventh aspect of the present invention is the cooling device according to the sixth aspect of the present invention described above, wherein a groove structure is provided on the inner wall of the container, Only the structure of the evaporation section wick is a composite that combines the groove structure of the inner wall of the container and a sintered metal, or a composite that combines the groove structure of the inner wall of the container and a mesh metal. It is characterized by.
- the structure of the condensing part wick becomes a groove structure with a low capillary force
- the structure of the evaporation part wick is a composite of a groove structure and a sintered metal with a high capillary force, or a groove structure and a capillary tube. It is a composite that combines high strength network metal. Accordingly, the capillary force of the evaporation unit wick is larger than the capillary force of the condensation unit wick, and the occurrence of the hydraulic fluid depletion phenomenon (dry out) due to the insufficient supply amount of the hydraulic fluid near the evaporation unit and the evaporation unit is prevented.
- the difference between the capillary force of the evaporator wick and the capillary force of the condenser wick can be ensured.
- the movement of the working fluid between the evaporation unit and the condensation unit can be performed more stably.
- the cooling device according to the eighth aspect of the present invention is the cooling device according to the sixth aspect of the present invention described above, wherein a groove structure is provided on the inner wall of the container,
- the structure of the wick except for the condensing part wick in the container is a composite in which the groove structure of the inner wall of the container and a sintered metal are combined, or the groove structure of the inner wall of the container and a net-like structure It is a composite combined with a metal.
- the structure of the condensing part wick becomes a groove structure with a low capillary force
- the structure of the wick of the part excluding the condensing part wick in the container combines the groove structure and a sintered metal with a high capillary force. It becomes a composite or a composite combining a groove structure and a network metal having a high capillary force. Accordingly, the capillary force of the evaporation unit wick is larger than the capillary force of the condensation unit wick, and the occurrence of the hydraulic fluid depletion phenomenon (dry out) due to the insufficient supply amount of the hydraulic fluid near the evaporation unit and the evaporation unit is prevented.
- the difference between the capillary force of the evaporator wick and the capillary force of the condenser wick can be ensured.
- the movement of the working fluid between the evaporation unit and the condensation unit can be performed more stably.
- a cooling device is the cooling device according to any one of the first to eighth aspects of the present invention described above, wherein the cross section of the container in the evaporation section and the condensation section of the heat pipe.
- the shape is a D-shape.
- the contact area between the evaporation part of the heat pipe and the heat receiving member and the contact area between the condensation part of the heat pipe and the heat dissipation member can be increased, and a large steam flow path in the heat pipe can be secured. can do. As a result, the maximum heat transport amount can be improved.
- the cooling device increases the capillary force of the wick (evaporation section wick) in the vicinity of the evaporation section and the evaporation section of the heat pipe that is thermally connected to the component to be cooled through the heat receiving member.
- the hydraulic fluid is likely to stagnate in the vicinity of the evaporation section. That is, the water retention of the working fluid in the evaporation part and in the vicinity of the evaporation part is increased. As a result, it is possible to prevent the occurrence of the hydraulic fluid depletion phenomenon (dry out) in the evaporation section and in the vicinity of the evaporation section.
- the capillary force of the wick in the vicinity of the condensation section and the condensation section of the heat pipe that is thermally connected to the cold plate through the heat radiating member, the working fluid in the vicinity of the evaporation section and the evaporation section is reduced. Occurrence of a depletion phenomenon (dryout) can be prevented.
- the cooling device includes a heat pipe evaporating part thermally connected to the cooled component via the heat receiving member, and a heat pipe condensing part thermally connected to the cold plate via the heat radiating member. Even if the temperature difference between them is large, the wick in the container of the heat pipe is structured so that the capillary force by the evaporation unit wick is larger than the capillary force by the condensing unit wick.
- the cooling device does not circulate a liquid heat transport medium to the immediate vicinity of a component to be cooled such as a semiconductor element arranged on a substrate in a housing of an electronic computer, a workstation, a personal computer or the like.
- the heat pipe that is thermally connected to the cold plate via the heat dissipating member is cooled by the cold plate that is disposed away from the component to be cooled, and is thermally applied to the heat pipe via the heat receiving member.
- the component to be cooled to be connected can be cooled.
- the circulation path of the liquid heat transport medium can be simplified, and the risk of water leakage can be reduced.
- FIG. 10 It is a schematic perspective view of the heat sink 10 which is an example of the heat sink with which the cooling device concerning embodiment of this invention is equipped. It is a figure for demonstrating the connection state of the heat sink 11, a to-be-cooled component, and the member for thermal radiation, (a) is a schematic perspective view of the connection state of the heat sink 11, a to-be-cooled component, and the member for thermal radiation, (B) is an exploded perspective view of the connection state of the heat sink 11, the component to be cooled, and the member for heat dissipation.
- FIG. 4C is a schematic cross-sectional view of a cross section perpendicular to the longitudinal direction along line ⁇ C
- FIG. 4D is a schematic cross-sectional view of a cross section perpendicular to the longitudinal direction along line BB of the heat pipe 11a described in FIG.
- FIG. 4D is a schematic cross-sectional view of a cross section perpendicular to the longitudinal direction along line CC of FIG. 5D
- FIG. 4D is a schematic cross-sectional view of a cross section perpendicular to the longitudinal direction of line BB of the heat pipe 11b described in FIG. is there.
- It is a schematic perspective view of the cooling device 100 which is an example of the cooling device concerning embodiment of this invention.
- FIG. 1 is a schematic perspective view of a heat sink 10 which is an example of a heat sink provided in a cooling device according to an embodiment of the present invention.
- FIG. 2 is a diagram for explaining the connection state between the heat sink 11, the component to be cooled, and the member for heat dissipation.
- FIG. 2A is a schematic perspective view of the connection state between the heat sink 11, the component to be cooled, and the member for heat dissipation.
- (B) is an exploded perspective view of the connection state of the heat sink 11, the component to be cooled, and the member for heat dissipation.
- FIG. 3 is a view for explaining the internal structure of the heat pipe 11 provided in the cooling device according to the embodiment of the present invention.
- FIG. 3A is a schematic sectional view in the longitudinal direction of the heat pipe 11a which is an example of the heat pipe. It is a figure, (b) is a schematic sectional drawing of the cross section perpendicular
- FIG. 4 is a view for explaining the internal structure of the heat pipe 11 provided in the cooling device according to the embodiment of the present invention.
- FIG. 4A is a longitudinal view of the heat pipe 11b as another example of the heat pipe.
- (B) is a schematic cross-sectional view of the cross section perpendicular to the longitudinal direction of the heat pipe 11b along the AA line of the heat pipe 11b described in (a), and
- (c) is a schematic cross-sectional view of (a). It is a schematic sectional drawing of the cross section perpendicular
- a heat sink 10 which is an example of a heat sink provided in the cooling device according to the embodiment of the present invention, includes a heat pipe 11, a heat receiving member 12, and a heat radiating member 13.
- the heat receiving member 12 is thermally connected to the evaporation portion 21 near one end of the heat pipe 11, and the heat radiating member 13 is thermally connected to the condensing portion 22 near the other end of the heat pipe 11. It is connected to the.
- the heat receiving member 12 is a member that is thermally connected to a component to be cooled 31a disposed on a substrate 31 in a housing of a computer, a workstation, a personal computer, or the like, and is formed of, for example, a metal plate or the like. .
- connection structure of the heat receiving member 12, the heat pipe 11, and the component to be cooled 31 a is such that the evaporation portion 21 of the heat pipe 11 is connected to the evaporation portion 21 of the heat pipe 11 so that the evaporation portion 21 of the heat reception member 12 and the heat pipe 11 are thermally connected.
- the part to be cooled 31a is disposed on the one surface (the upper surface in FIGS. 2A and 2B), and the cooled component 31a is connected to the other side of the heated member 12 so that the cooled component 31a is thermally connected.
- 2 is disposed on the surface (the lower surface in FIGS. 2A and 2B), and the heat generated by the component to be cooled 31 a is conducted to the evaporation part 21 of the heat pipe 11 via the heat receiving member 12. ing.
- the heat radiating member 13 is thermally applied to a heat radiating member 32 such as a cold plate whose temperature is controlled by taking in a liquid heat transport medium mainly composed of water whose temperature is controlled by a circulating device with a temperature adjusting function.
- a heat radiating member 32 such as a cold plate whose temperature is controlled by taking in a liquid heat transport medium mainly composed of water whose temperature is controlled by a circulating device with a temperature adjusting function.
- a heat radiating member 32 such as a cold plate whose temperature is controlled by taking in a liquid heat transport medium mainly composed of water whose temperature is controlled by a circulating device with a temperature adjusting function.
- a heat radiating member 32 such as a cold plate whose temperature is controlled by taking in a liquid heat transport medium mainly composed of water whose temperature is controlled by a circulating device with a temperature adjusting function.
- it is formed of a metal plate or the like.
- the connection structure of the heat radiating member 13, the heat pipe 11 and the heat radiating member 32 is such that the condensing part 22 of the heat pipe 11 is connected to the heat radiating member 13 so that the heat radiating member 13 and the condensing part 22 of the heat pipe 11 are thermally connected.
- the heat radiating member 32 is disposed on one surface (the upper surface in FIGS. 2A and 2B), and the heat radiating member 13 and the heat radiating member 32 are thermally connected to each other. 13 is disposed on the other surface (the lower surface in FIGS. 2A and 2B), and the heat radiating member 32 cools the condensing part 22 of the heat pipe 11 via the heat radiating member 13. ing.
- the heat pipe 11 (11a, 11b) provided in the cooling device according to the embodiment of the present invention has a hollow portion therein. 55, a wick 42 (42 a, 42 b, 42 c, 42 c ′) that generates a capillary force stored and disposed in the container 41, and a working fluid sealed in the cavity 55 in the container 41 (see FIG. (Not shown).
- the heat pipe 11 is formed by sealing the container 41 after sealing the wick 42 together with the working fluid in the container 41 and removing the air.
- a heat pipe 11 (11a, 11b) which is an example of a heat pipe provided in the cooling device according to the embodiment of the present invention.
- a wick 42 is arranged in the container 41.
- the wick 42 has a structure in which the capillary force of the wick (evaporator wick) 42a in the evaporator 21 and the capillary force of the wick (condenser wick) 42b in the condenser 22 are different.
- the difference between the heat pipe 11a shown in FIGS. 3A to 3D and the heat pipe 11b shown in FIGS. 4A to 4D is that the intermediate wick 42c of the heat pipe 11a and the heat pipe 11b.
- the intermediate portion wick 42c ′ has a different structure, and details will be described later.
- a portion between the evaporation unit 21 and the condensing unit 22 is referred to as an intermediate unit 23, and a wick in the intermediate unit 23 is referred to as intermediate unit wicks 42c, 42 ′.
- the evaporation unit wick 42a is a wick in the evaporation unit 21, and is a condensing unit.
- the wick 42b is described as being a wick in the condensing unit 22, but the evaporating unit wick 42a is not only from the evaporating unit 21 but also from the vicinity of the evaporating unit 21 and the vicinity of the evaporating unit 21.
- the condensing unit wick 42b may be a wick in the region including the condensing unit 22 and the vicinity of the condensing unit 22 including not only the condensing unit 22 but also the vicinity of the condensing unit 22. .
- the wick is a heat pipe provided with a wire mesh, sintered metal, metal felt or the like. Capillary action can be caused in the hydraulic fluid in contact with the wick. Thereby, the working fluid can be refluxed.
- the structure of the wick 42 may be any structure, for example, a groove structure, one structure among sintered metal and mesh metal (a mesh metal knitted with fine metal wires), or a groove. Examples thereof include composites obtained by combining a plurality of different structures in the structure, sintered metal and network metal.
- the structure of the evaporation section wick 42a and the structure of the condensation section wick 42b may be any structure in which the capillary force of the evaporation section wick 42a and the capillary force of the condensation section wick 42b are different.
- the structure of the wick 42b may be different or the same structure.
- a combination of a plurality of different structures in the groove structure, sintered metal and network metal is a composite, and a combination of the same structures in the groove structure, sintered metal and network metal is It is simply called a structure.
- a combination of a plurality of mesh metals is simply called a mesh metal.
- the case where the structure of the evaporation section wick 42a and the structure of the condensation section wick 42b are different and the capillary force is different is, for example, that the structure of the evaporation section wick 42a is a sintered metal and the structure of the condensation section wick 42b is a mesh metal. Is the case.
- the case where the structure of the evaporation section wick 42a and the structure of the condensation section wick 42b are the same and the capillary force is different is, for example, that the structure of the evaporation section wick 42a and the structure of the condensation section wick 42b are both reticulated metals.
- the area of the evaporation section wick 42a and the area of the condensation section wick 42b in the cross section perpendicular to the longitudinal direction of the container 41 are different, the fineness of the mesh of the evaporation section wick 42a and the fineness of the mesh of the condensation section wick 42b are different. Cases.
- the heat sink 10 operates in the evaporation portion 21 of the heat pipe 11 by the heat generated by the cooled component 31 a that has been thermally conducted through the heat generating member 12 of the heat sink 10.
- the liquid evaporates and the vapor moves to the condensing part 22 of the heat pipe 11.
- the working fluid vapor is condensed by the wall surface of the heat pipe 11 cooled by the heat radiating member (cold plate or the like) 32 through the heat radiating member 13 of the heat sink 11, and again enters the liquid phase state. Return.
- this hydraulic fluid is condensed, latent heat is released.
- the hydraulic fluid thus returned to the liquid phase is moved (refluxed) again to the evaporation section by the wick 42 that generates a capillary force provided inside the heat pipe 11. Heat is transferred by such phase transformation and movement of the hydraulic fluid.
- the heat sink 10 which is an example of the heat sink provided in the cooling device according to the embodiment of the present invention, is thermally connected to the component to be cooled 31 a via the heat receiving member 12 (and the evaporation portion 21 of the heat pipe 11).
- the working fluid is likely to stagnate in the evaporation section 21 (and in the vicinity of the evaporation section 21). That is, the water retention of the hydraulic fluid in the evaporator 21 (and the vicinity of the evaporator 21) is increased. As a result, it is possible to prevent the occurrence of the hydraulic fluid depletion phenomenon (dry out) in the evaporation section 21 (and the vicinity of the evaporation section 21).
- the capillary force of the condensing part wick 42b in the condensing part 22 (and the vicinity of the condensing part 22) of the heat pipe 11 that is thermally connected to the heat radiating member (cold plate or the like) 32 through the heat radiating member 13 is reduced. As a result, it is possible to prevent the occurrence of the hydraulic fluid depletion phenomenon (dry out) in the evaporation section 21 and in the vicinity of the evaporation section 21.
- the heat sink 10 which is an example of the heat sink provided in the cooling device according to the embodiment of the present invention preferably further has a configuration in which the capillary force of the evaporation unit wick 42a is larger than the capillary force of the condensing unit wick 42b.
- the heat pipe 11 thermally connected to the cooled component 31a via the heat receiving member 12 and the heat pipe 11 thermally connected to the heat radiating member (cold plate or the like) 32 via the heat radiating member 13. Even when the temperature difference with the condenser section 22 is large, the wick 42 in the container 41 of the heat pipe 11 is made to have a larger capillary force due to the evaporation section wick 42a than a capillary force due to the condenser section wick 42b.
- the heat sink 10 which is an example of the heat sink provided in the cooling device according to the embodiment of the present invention, is a wick that becomes a flow path (vapor flow path) of the evaporated working fluid in the central portion of the cross section of the container 41 of the heat pipe 11. It is preferable that a space without 42 is formed. The space formed in the container 41 can quickly move the vapor flow from the evaporation unit 21 to the condensation unit 22. That is, the maximum heat transport amount can be improved.
- An example is a structure in which only the structure of the evaporating part wick 42a is a composite of a groove structure and sintered metal, and the structure of the condensing part wick 42b as shown in FIGS. 4 (a) to 4 (d).
- a groove structure is used and the structure of the evaporation portion wick 42a and the intermediate portion wick 42c ′ is a composite in which the groove structure and a sintered metal are combined.
- the capillary force of the evaporating part wick 42a is larger than the capillary force of the condensing part wick 42b
- the evaporating part wick 42a has a larger amount of wicks than the condensing part wick 42b. It is done.
- the structure of the evaporation unit wick 42a (structure 1) and the structure of the condensation unit wick 42b Examples ((Example 1) to (Example 5)) in which (Structure 2) is a combination as shown below are included.
- Example 1 (Structure 1) and (Structure 2) both have a groove structure as a wick inside the container 41 and have a groove structure in a cross section perpendicular to the longitudinal direction of the container 41.
- the area of the portion is larger in (Structure 1) than in (Structure 2).
- Example 2 (Structure 1) and (Structure 2) both have a structure having a groove structure as a wick inside the container 41, and the groove of the groove structure in a cross section perpendicular to the longitudinal direction of the container 41 Is higher in (Structure 1) than in (Structure 2).
- Both (Structure 1) and (Structure 2) are structures having a sintered metal or a net-like metal as a wick inside the container 41, and in a cross section perpendicular to the longitudinal direction of the container 41.
- the area of the portion having the sintered metal or the net-like metal is larger in (Structure 1) than in (Structure 2).
- Both (Structure 1) and (Structure 2) are structures having a sintered metal or a net-like metal as a wick in the container 41, and in a cross section perpendicular to the longitudinal direction of the container 41.
- the voids of the sintered metal or the mesh of the mesh metal are finer in (Structure 1) than in (Structure 2).
- (Structure 1) is a structure having a sintered metal in addition to a structure having a groove structure as a wick inside the container 41
- (Structure 2) is a groove structure as a wick inside the container 41. have.
- the groove concept provided in (Structure 1) and (Structure 2) has the same shape.
- the internal structure of the heat pipe 11a which is an example of the heat pipe 11 shown in FIGS. 3A to 3D, is provided with a groove structure on the entire inner wall of the container 41 of the heat pipe 11a, and the evaporation section 21 (and evaporation).
- a sintered metal wick is provided in the groove structure portion of the inner wall of the container 41 in the vicinity of the portion 21). That is, the structure of the condensing part wick 42b and the intermediate part wick 42c is changed to a wick 51 having a groove structure with a low capillary force, and the structure of the evaporation part wick 42a is changed to a wick 51 having a groove structure and a sintered metal wick having a high capillary force. 52 is combined.
- the capillary force of the evaporation unit wick 42a becomes larger than the capillary force of the condensation unit wick 42b, and the operation is caused by a shortage of resupply amount of the working fluid in the vicinity of the evaporation unit 21 and the evaporation unit 21.
- a difference between the capillary force of the evaporating part wick 42a and the capillary force of the condensing part wick 42b sufficient to prevent the occurrence of the liquid depletion phenomenon (dry out) can be ensured. As a result, the movement of the working fluid between the evaporation unit 21 and the condensation unit 22 can be performed more stably.
- the internal structure of the heat pipe 11b which is an example of the heat pipe 11 shown in FIGS. 4A to 4D, is provided with a groove structure on the entire inner wall of the container 41 of the heat pipe 11b, and the condensing unit 22 (and the condensing unit 22).
- a sintered metal wick is provided in the groove structure portion of the inner wall of the container 41 except for the vicinity of the portion 22). That is, the structure of the condensing part wick 42b is changed to a wick 51 having a groove structure with a low capillary force, and the structure of the evaporation part wick 42a and the intermediate part wick 42c 'is made of a wick 51 having a groove structure and a sintered metal having a high capillary force.
- the evaporation section wick 42a, the condensation section wick 42b, and the intermediate section wick 42c, 42 c ′ is provided on the inner wall side of the container 41 of the heat pipe 11 a and the heat pipe 11 b, and a space without a wick serving as a flow path (vapor flow path) of the evaporated working liquid is provided in the central portion of the cross section of the container 41.
- a portion 55 is formed. Since the space part 55 becomes a flow path (vapor flow path) of the evaporated working fluid, the vapor flow can be quickly moved from the evaporation part of the heat pipe to the condensation part of the heat pipe. That is, the maximum heat transport amount can be improved.
- the structure of the wick 42 in the container 41 of the heat pipe 11a shown in FIGS. 3 (a) to 3 (d) described above is, for example, that after the wick 51 having a groove structure is provided on the entire inner wall of the container 41, the heat pipe 11a The metal powder can be sintered on the wick 51 of the groove structure of the evaporation part 21 to form a sintered metal.
- the structure of the evaporation section wick 42a is different from that of the wick 51 having a groove structure.
- it is a composite in which the wick 52 of sintered metal is combined and the structure of the condensing part wick 42b is the wick 51 of the groove structure, it is not limited to this.
- the evaporation section wick 42a is a composite in which a wick having a groove structure and a wick made of a mesh metal having a high capillary force are combined, and the structure of the condensation section wick 42b is a wick having a groove structure, the evaporation section
- the capillary force of the wick 42a becomes larger than the capillary force of the condensing unit wick 42b, and the occurrence of the hydraulic fluid depletion phenomenon (dry out) due to the insufficient supply amount of the hydraulic fluid near the evaporation unit 21 and the evaporation unit 21 is prevented. It is possible to ensure a sufficient difference in the capillary force of the evaporator wick 42a and the difference in the capillary force of the condenser wick 42b.
- the cross-sectional shape of the container 41 of 11b) is a round shape having substantially the same diameter in the longitudinal direction, but is not limited to this shape, and is a shape that is thermally connected to the heat receiving member 12 and the heat radiating member 13.
- the cross-sectional shape in the evaporation part 21 and the condensation part 22 is a D-shape in which the part which contacts the heat receiving member 12 and the heat radiating member 13 is flat.
- the contact area between the evaporating part 21 of the heat pipe 11 and the heat receiving member 12, and The contact area between the condensing part 22 of the heat pipe 11 and the heat radiating member 13 can be increased. Furthermore, a large steam flow path in the heat pipe 11 can be secured. As a result, the maximum heat transport amount can be improved.
- the container 41 of the heat pipe 11 provided in the cooling device according to the embodiment of the present invention described above is made of a heat conductive material, and preferably made of an aluminum material or a copper material. Further, as the hydraulic fluid, water, chlorofluorocarbon, or the like is preferable. For welding the end of the container, a general joining technique may be used, but laser welding, brazing welding, and diffusion joining are preferable.
- FIG. 5 is a schematic perspective view of a cooling device 100 as an example of the cooling device according to the embodiment of the present invention.
- the cooling device 100 as an example of the cooling device according to the embodiment of the present invention includes the heat sink 11 and the cold plate 32 described in FIGS.
- the cold plate 32 is thermally connected.
- the cold plate 32 is a liquid heat transport medium mainly composed of cooling water whose temperature is controlled, and the inside of the main body 63 made of a heat conductive material such as a copper block from the water inlet 61. Then, the latent heat at the time of condensation of the hydraulic fluid discharged along with the cooling of the heat pipe 11 is transferred to the liquid heat transport medium, and the liquid heat transport medium whose temperature is increased by the latent heat is transferred from the drain port 62 to the main body 63. The temperature of the main body part 63 is controlled by discharging it to the outside.
- the cooling device 100 is disposed in the housing 110, and the liquid heat transport medium of the cold plate 32 includes a water absorption nozzle 61a having one end of the water absorption port 61 of the main body 63 as shown by an arrow 71. Via the housing 110 from the outside of the housing 110. Further, the liquid heat transport medium of the cold plate 32 passes from the inside of the main body portion 63 to the outside of the housing 110 via the drain nozzle 62 a having one end of the drain port 62 of the main body portion 63 as indicated by an arrow 72. Released. Note that although the cooling device 100 has been described as being disposed in the housing 110, the cooling device 100 may be disposed outside the housing 110. The cooling device can be operated without introducing the cooling water into the housing 110, thereby reducing the possibility of damage to the system on which the component to be cooled is mounted due to leakage of the cooling water.
- the working liquid evaporates in the evaporation section 21 of the heat pipe 11 due to the heat generated by the component 31 a to be cooled which has been thermally conducted through the heat generating member 12 of the heat sink 10, and the vapor is condensed in the heat pipe 11.
- section 22 In the condensing unit 22, the working fluid vapor is condensed by the wall surface of the heat pipe 11 cooled by the cold plate 32 through the heat radiating member 13 of the heat sink 11, and returns to the liquid phase state again.
- this hydraulic fluid is condensed, latent heat is released.
- the released latent heat moves to the liquid heat transport medium in the cold plate 32 through the heat radiating member 13 and is released to the outside of the cold plate 32.
- the hydraulic fluid that has returned to the liquid phase is moved (refluxed) again to the evaporation section by the wick 42 that generates a capillary force provided inside the heat pipe 11. Heat is transferred by such phase transformation and movement of the hydraulic fluid.
- the cooling device 100 which is an example of the cooling device according to the embodiment of the present invention, circulates the liquid heat transport medium to the immediate vicinity of the component to be cooled 31 a arranged on the substrate 31 in the housing 110. Without cooling, the heat plate 11 that is thermally connected to the cold plate 32 via the heat radiating member 13 is cooled by the cold plate 32 that is disposed away from the component to be cooled 31a, and the heat receiving member 12 is The component to be cooled 31a that is thermally connected to the heat pipe 11 can be cooled. Therefore, the circulation path of the liquid heat transport medium can be simplified, and the risk due to water leakage can be reduced.
- the evaporator 21 of the heat pipe 11 that is thermally connected to the cooled component 31a via the heat receiving member 12, and the condenser 22 of the heat pipe 11 that is thermally connected to the cold plate 32 via the heat radiating member 13 Even if the temperature difference between the two is large, the wick 42 in the container 41 of the heat pipe 11 is structured so that the capillary force by the evaporation unit wick 42a is larger than the capillary force by the condensing unit wick 42b.
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Abstract
Description
本発明の第1の態様にかかる冷却装置は、
コールドプレートとヒートシンクとを備えた冷却装置であって、
前記ヒートシンクは、
被冷却部品に対して熱的に接続される受熱部材と、
放熱用の部材に対して熱的に接続される放熱部材と、
内部に空洞部を形成したコンテナと、前記コンテナ内に格納され毛細管力を発生するウィックと、前記コンテナ内の前記空洞部に封入された作動液と、を有するヒートパイプと、
を備え、
前記ヒートパイプは、前記受熱部材が取り付けられる蒸発部と前記放熱部材が取り付けられる凝縮部とを有し、
前記コンテナ内の前記ウィックは、前記蒸発部における前記コンテナ内の蒸発部ウィックの毛細管力が、前記凝縮部における前記コンテナ内の凝縮部ウィックの毛細管力よりも大きい構造になっており、
前記ヒートシンクの前記放熱部材と前記コールドプレートとが熱的に接続されていることを特徴とする。
前記コンテナ内の前記ウィックは、前記コンテナの長手方向に垂直な断面において、前記蒸発部ウィックの面積の方が、前記凝縮部ウィックの面積よりも大きい構造になっていることを特徴とする。
前記コンテナ内の前記ウィックは、前記コンテナの長手方向に垂直な断面における焼結金属の空隙または網状金属の網目が、前記凝縮部ウィックよりも前記蒸発部ウィックの方が細かい構造になっていることを特徴とする。
前記コンテナは、当該コンテナの断面中央部に、前記ウィックの無い空間部が設けられていることを特徴とする。
前記蒸発部ウィックの構造のみが、前記コンテナの内壁の前記溝構造と焼結金属とを組み合わせた複合体、または、前記コンテナの内壁の前記溝構造と網状金属とを組み合わせた複合体であることを特徴とする。
前記コンテナ内の前記凝縮部ウィックを除いた部分の前記ウィックの構造が、前記コンテナの内壁の前記溝構造と焼結金属とを組み合わせた複合体、または、前記コンテナの内壁の前記溝構造と網状金属とを組み合わせた複合体であることを特徴とする。
11,11a,11b : ヒートパイプ
12 : 受熱部材
13 : 放熱部材
21 : 蒸発部
22 : 凝縮部
23 : 中間部
31 : 基板
31a : 被冷却部品
32 : コールドプレート(放熱用の部材)
41 : コンテナ
42 : ウィック
42a : 蒸発部ウィック
42b : 凝縮部ウィック
42c,42c´ : 中間部ウィック
51 : 溝構造のウィック
52 : 焼結金属のウィック
55 : 空間部
100 : 冷却装置
Claims (9)
- コールドプレートとヒートシンクとを備えた冷却装置であって、
前記ヒートシンクは、
被冷却部品に対して熱的に接続される受熱部材と、
放熱用の部材に対して熱的に接続される放熱部材と、
内部に空洞部を形成したコンテナと、前記コンテナ内に格納され毛細管力を発生するウィックと、前記コンテナ内の前記空洞部に封入された作動液と、を有するヒートパイプと、
を備え、
前記ヒートパイプは、前記受熱部材が取り付けられる蒸発部と前記放熱部材が取り付けられる凝縮部とを有し、
前記コンテナ内の前記ウィックは、前記蒸発部における前記コンテナ内の蒸発部ウィックの毛細管力が、前記凝縮部における前記コンテナ内の凝縮部ウィックの毛細管力よりも大きい構造になっており、
前記ヒートシンクの前記放熱部材と前記コールドプレートとが熱的に接続されていることを特徴とする冷却装置。 - 前記コンテナ内の前記ウィックは、前記蒸発部ウィックの方が、前記凝縮部ウィックよりも、ウィックの量が多い構造になっていることを特徴とする請求項1に記載の冷却装置。
- 前記蒸発部ウィックの構造と前記凝縮部ウィックの構造とが同じ種類のウィックの構造である場合、
前記コンテナ内の前記ウィックは、前記コンテナの長手方向に垂直な断面において、前記蒸発部ウィックの面積の方が、前記凝縮部ウィックの面積よりも大きい構造になっていることを特徴とする請求項1に記載の冷却装置。 - 前記蒸発部ウィックの構造と前記凝縮部ウィックの構造とが同じ種類のウィックの構造であり、かつ、該同じ種類のウィックの構造の中に焼結金属または網状金属を有している場合、
前記コンテナ内の前記ウィックは、前記コンテナの長手方向に垂直な断面における焼結金属の空隙または網状金属の網目が、前記凝縮部ウィックよりも前記蒸発部ウィックの方が細かい構造になっていることを特徴とする請求項1に記載の冷却装置。 - 前記ウィックは、前記コンテナの内壁に設けられ、
前記コンテナは、当該コンテナの断面中央部に、前記ウィックの無い空間部が設けられていることを特徴とする請求項1乃至4のいずれか1項に記載の冷却装置。 - 前記ウィックの構造は、溝構造、焼結金属及び網状金属の中の1つの構造体、または、溝構造、焼結金属及び網状金属の中の異なる構造体を複数組み合わせた複合体であることを特徴とする請求項1乃至5のいずれか1項に記載の冷却装置。
- 前記コンテナの内壁に溝構造が設けられており、
前記蒸発部ウィックの構造のみが、前記コンテナの内壁の前記溝構造と焼結金属とを組み合わせた複合体、または、前記コンテナの内壁の前記溝構造と網状金属とを組み合わせた複合体であることを特徴とする請求項6に記載の冷却装置。 - 前記コンテナの内壁に溝構造が設けられており、
前記コンテナ内の前記凝縮部ウィックを除いた部分の前記ウィックの構造が、前記コンテナの内壁の前記溝構造と焼結金属とを組み合わせた複合体、または、前記コンテナの内壁の前記溝構造と網状金属とを組み合わせた複合体であることを特徴とする請求項6に記載の冷却装置。 - 前記ヒートパイプは、前記蒸発部及び前記凝縮部における前記コンテナの断面形状がD型形状であることを特徴とする請求項1乃至8のいずれか1項に記載の冷却装置。
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CN201490000539.0U CN205092233U (zh) | 2013-03-27 | 2014-03-25 | 冷却装置 |
JP2015508517A JPWO2014157147A1 (ja) | 2013-03-27 | 2014-03-25 | 冷却装置 |
US14/866,202 US20160014931A1 (en) | 2013-03-27 | 2015-09-25 | Cooling apparatus |
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US14/866,202 Continuation US20160014931A1 (en) | 2013-03-27 | 2015-09-25 | Cooling apparatus |
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JP (1) | JPWO2014157147A1 (ja) |
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JP2020076554A (ja) * | 2018-11-09 | 2020-05-21 | 古河電気工業株式会社 | ヒートパイプ |
JP7129577B1 (ja) | 2022-02-24 | 2022-09-01 | 古河電気工業株式会社 | 熱輸送装置 |
WO2023162468A1 (ja) * | 2022-02-24 | 2023-08-31 | 古河電気工業株式会社 | 熱輸送装置 |
JP2023123210A (ja) * | 2022-02-24 | 2023-09-05 | 古河電気工業株式会社 | 熱輸送装置 |
Also Published As
Publication number | Publication date |
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US20160014931A1 (en) | 2016-01-14 |
CN205092233U (zh) | 2016-03-16 |
TW201447215A (zh) | 2014-12-16 |
JPWO2014157147A1 (ja) | 2017-02-16 |
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