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WO2014030562A1 - Receptacle and optical transmission module - Google Patents

Receptacle and optical transmission module Download PDF

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Publication number
WO2014030562A1
WO2014030562A1 PCT/JP2013/071773 JP2013071773W WO2014030562A1 WO 2014030562 A1 WO2014030562 A1 WO 2014030562A1 JP 2013071773 W JP2013071773 W JP 2013071773W WO 2014030562 A1 WO2014030562 A1 WO 2014030562A1
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WO
WIPO (PCT)
Prior art keywords
axis direction
light emitting
optical
element array
plug
Prior art date
Application number
PCT/JP2013/071773
Other languages
French (fr)
Japanese (ja)
Inventor
裕史 浅井
Original Assignee
株式会社村田製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Priority to JP2014531587A priority Critical patent/JP5966201B2/en
Publication of WO2014030562A1 publication Critical patent/WO2014030562A1/en

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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4206—Optical features
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4246—Bidirectionally operating package structures
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/428—Electrical aspects containing printed circuit boards [PCB]
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4292—Coupling light guides with opto-electronic elements the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02251—Out-coupling of light using optical fibres
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02253—Out-coupling of light using lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02255—Out-coupling of light using beam deflecting elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/42—Arrays of surface emitting lasers
    • H01S5/423—Arrays of surface emitting lasers having a vertical cavity
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49111—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting two common bonding areas, e.g. Litz or braid wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/02208—Mountings; Housings characterised by the shape of the housings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
    • H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
    • H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
    • H01S5/18308—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL] having a special structure for lateral current or light confinement
    • H01S5/18311—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL] having a special structure for lateral current or light confinement using selective oxidation

Definitions

  • the present invention relates to a receptacle and an optical transmission module, and more particularly to a receptacle and an optical transmission module that convert an electrical signal into an optical signal and transmit it.
  • FIG. 17 is an exploded perspective view of the optical coupler described in Patent Document 1.
  • the optical coupler 500 includes an optical connector 510A and an optical communication module 510B as shown in FIG.
  • the optical connector 510A includes an optical fiber array 520A composed of a plurality of optical fibers 502A, an optical waveguide 504A, and a lens substrate 530A.
  • the optical communication module 510B includes a lens housing 560 for connecting the optical connector 510A, and a VCSEL 505 which is a vertical cavity surface emitting laser (hereinafter referred to as VCSEL).
  • the optical communication module 510B uses a laser array in which the same number of VCSELs 505 as the number of optical fibers 502A are combined in one element.
  • the VCSEL 505 converts the electrical signal into an optical signal.
  • the converted optical signals are emitted from the plurality of VCSELs 505 and transmitted to the optical fiber array 520A via the lens substrate 530A and the optical waveguide 504A of the optical connector 510A.
  • FIG. 18 is a cross-sectional view of a VCSEL described in Patent Document 2.
  • the schematic structure of the VCSEL 600 includes a first DBR (Multilayer Distributed Bragg Reflector) layer 614 formed on an N-type semiconductor substrate 612 having a cathode electrode 630 formed on the back surface.
  • a first spacer layer 616 is formed on the first DBR layer 614.
  • An active layer 618 having a quantum well is formed on the first spacer layer 616.
  • a second spacer layer 620 is formed on the active layer 618.
  • a second DBR layer 622 is formed on the second spacer layer 620.
  • An anode electrode 628 is formed on the second DBR layer 622. Then, when a drive signal is applied between the anode electrode 628 and the cathode electrode 630, a laser having sharp directivity in a direction perpendicular to the substrate (parallel to the stacking direction) is generated.
  • each drive signal applied to each VCSEL 600 leaks into the N-type semiconductor substrate 612. As a result, crosstalk of drive signals occurs between the VCSELs 600. Therefore, sufficient isolation cannot be obtained between the VCSELs 600.
  • an object of the present invention is to provide a receptacle and an optical transmission module that can ensure isolation between VCSELs.
  • a receptacle is a receptacle to which a plug provided at one end of an optical fiber is connected, and a light emitting element array in which a plurality of vertical cavity surface emitting lasers are integrated;
  • a positioning member that optically couples an optical fiber core and the plurality of vertical cavity surface emitting lasers, and a mounting substrate on which the light emitting element array is mounted, the light emitting element array including a base substrate;
  • a light emitting region multilayer portion including an N-type semiconductor multilayer reflective layer, an active layer having a quantum well and a P-type semiconductor multilayer reflective layer formed on the surface of the base substrate, and connected to the P-type semiconductor multilayer reflective layer
  • the portion is made of a semi-insulating semiconductor, and the cathode electrode is formed on the surface side of the base substrate, and the vertical cavity surface emitting
  • An optical transmission module further includes the receptacle and a plug provided at a tip of the optical fiber, wherein the plug exists on an optical axis of the optical fiber, and A third convex lens facing the positioning member is provided.
  • the receptacle and the optical transmission module according to the present invention it is possible to ensure isolation between the VCSELs.
  • FIG. 1 is an external perspective view of an optical transmission module according to an embodiment of the present invention. It is a disassembled perspective view of the receptacle which concerns on one Embodiment of this invention. It is an external appearance perspective view which removed the metal cap and the positioning member from the receptacle which concerns on one Embodiment of this invention. It is the figure which planarly viewed the light emitting element array which concerns on one Embodiment of this invention from the positive direction side of az axis direction.
  • FIG. 5 is a cross-sectional view taken along the line AA or BB of the light emitting element array illustrated in FIG. 4. It is an external appearance perspective view of the state which removed the metal cap from the receptacle which concerns on one Embodiment of this invention.
  • FIG. 8 is a diagram in which a mounting board and a plug according to an embodiment of the present invention are added to a cross section taken along the line CC or DD of the positioning member illustrated in FIG. 7. It is an external appearance perspective view of the metal cap which concerns on one Embodiment of this invention.
  • 1 is an external perspective view of a plug according to an embodiment of the present invention. It is the figure which planarly viewed the plug which concerns on one Embodiment of this invention from the negative direction side of az axis direction.
  • FIG. 10 is an exploded perspective view of an optical coupler described in Patent Document 1.
  • FIG. It is sectional drawing of VCSEL of patent document 2.
  • FIG. 1 is an external perspective view of an optical transmission module 10 according to an embodiment of the present invention.
  • FIG. 2 is an exploded perspective view of the receptacle 20 according to the embodiment of the present invention.
  • FIG. 3 is an external perspective view in which the metal cap 30 and the positioning member 200 are removed from the receptacle 20 according to the embodiment of the present invention.
  • the vertical direction of the light transmission module 10 is defined as the z-axis direction
  • the direction along the long side of the light transmission module 10 when viewed in plan from the z-axis direction is defined as the x-axis direction.
  • the direction along the short side of the optical transmission module 10 is defined as the y-axis direction.
  • the x axis, the y axis, and the z axis are orthogonal to each other.
  • the optical transmission module 10 includes a receptacle 20 and a plug 40 as shown in FIG.
  • the plug 40 is connected to the receptacle 20.
  • the receptacle 20 includes a metal cap 30, a light receiving element array 50, a light emitting element array 100, a positioning member 200, a mounting substrate 22, and a sealing resin 24, as shown in FIG.
  • the mounting substrate 22 has a rectangular shape when seen in a plan view from the z-axis direction, as shown in FIG. Further, when the optical transmission module 10 is mounted on the circuit board, the surface of the mounting substrate 22 on the negative side in the z-axis direction (hereinafter, the “surface on the negative direction side in the z-axis direction” is referred to as the back surface).
  • a surface mounting electrode E1 (not shown in FIG. 3) is provided in contact with the land of the circuit board.
  • the side L1 located on the negative direction side in the x-axis direction and the y-axis direction on the surface on the positive direction side in the z-axis direction of the mounting substrate 22 (hereinafter referred to as “surface on the positive direction side in the z-axis direction”)
  • surface on the positive direction side in the z-axis direction In the vicinity of an angle formed by the side L2 located on the negative direction side, a ground conductor exposed portion E2 in which a part of the ground conductor provided in the mounting substrate 22 is exposed is provided.
  • the ground conductor exposed portion E2 has a rectangular shape having a long side in the x-axis direction when viewed from the positive side in the z-axis direction.
  • the surface of the mounting substrate 22 is provided in the mounting substrate 22 in the vicinity of an angle formed by the side L ⁇ b> 1 positioned on the negative side in the x-axis direction and the side L ⁇ b> 3 positioned on the positive direction side in the y-axis direction.
  • a ground conductor exposed portion E3 in which a part of the ground conductor is exposed is provided.
  • the ground conductor exposed portion E3 has a rectangular shape having a long side in the x-axis direction when viewed from the positive side in the z-axis direction.
  • the light receiving element array 50 and the light emitting element array 100 are provided on the surface of the mounting substrate 22 on the positive side in the x-axis direction.
  • the light receiving element array 50 is an element including a plurality of photodiodes that convert an optical signal into an electric signal.
  • the light emitting element array 100 is an element including a plurality of diodes that convert an electrical signal into an optical signal.
  • the drive circuit 26 is provided on the positive direction side in the x-axis direction with respect to the light receiving element array 50 and the light emitting element array 100 in the positive direction side portion in the x-axis direction on the surface of the mounting substrate 22.
  • the drive circuit 26 is a semiconductor circuit element for driving the light receiving element array 50 and the light emitting element array 100.
  • the drive circuit 26 has a rectangular shape having a long side parallel to the y-axis direction when viewed in plan from the z-axis direction.
  • the drive circuit 26 and the light receiving element array 50 are connected through wire U by wire bonding. Further, the drive circuit 26 and the light emitting element array 100 are connected to each other by wire bonding via the wire U.
  • the electrical signal from the drive circuit 26 is transmitted to the light emitting element array 100 via the wire U, and the electrical signal from the light receiving element array 50 is transmitted to the drive circuit 26 via the wire U.
  • the sealing resin 24 includes a sealing portion 24a and leg portions 24b to 24e, and is made of a transparent resin such as an epoxy resin.
  • the sealing portion 24 a has a substantially rectangular parallelepiped shape, and is provided in a portion on the positive direction side in the x-axis direction on the surface of the mounting substrate 22.
  • the sealing portion 24 a covers the light receiving element array 50, the light emitting element array 100, and the drive circuit 26.
  • the leg portions 24b and 24c are provided at intervals so as to be arranged in this order from the negative direction side in the x-axis direction to the positive direction side.
  • the leg portions 24b and 24c are rectangular parallelepiped members that protrude toward the side L2 of the mounting substrate 22 from the negative side surface in the y-axis direction of the sealing portion 24a. Further, a space H1 into which a convex portion C3 of a metal cap 30 described later is fitted is provided between the leg portion 24b and the leg portion 24c.
  • the leg portions 24d and 24e are provided at intervals so as to be arranged in this order from the negative direction side to the positive direction side in the x-axis direction.
  • the leg portions 24d and 24e are rectangular parallelepiped members that protrude toward the side L3 of the mounting substrate 22 from the surface on the positive side in the y-axis direction of the sealing portion 24a. Further, a space H2 is provided between the leg portion 24d and the leg portion 24e in which a convex portion C6 of the metal cap 30 described later is fitted.
  • FIG. 4 is a plan view of the light emitting element array 100 according to an embodiment of the present invention as seen from the positive side in the z-axis direction.
  • FIG. 5 is a cross-sectional view taken along line AA or BB of the light emitting element array 100 shown in FIG.
  • the present embodiment only two VCSELs 100A and 100B are described, but the number of VCSELs constituting the light emitting element array 100 of the present invention is not limited to this.
  • the light emitting element array 100 includes two VCSELs 100A and 100B as shown in FIG. That is, the VCSELs 100A and 100B are integrated and arrayed, and the VCSELs 100A and 100B are driven independently. Further, a laser beam B1 is emitted from each VCSEL 100A, 100B toward the positive direction side in the z-axis direction.
  • the two VCSELs 100A and 100B are provided on the surface of a common base substrate 128 as shown in FIG.
  • the base substrate 128 is made of a semi-insulating semiconductor, specifically, a substrate made of GaAs.
  • the base substrate 128 preferably has a resistivity of 1.0 ⁇ 10 7 ⁇ ⁇ cm or more.
  • an N-type semiconductor contact layer 130 is laminated on the surface of the base substrate 128.
  • One N-type semiconductor contact layer 130 is provided for each of the VCSELs 100A and 100B.
  • the N-type semiconductor contact layer 130 of the VCSEL 100A and the N-type semiconductor contact layer 130 of the VCSEL 100B are insulated from each other.
  • the N-type semiconductor contact layer 130 is made of a compound semiconductor having N-type conductivity.
  • an N-type semiconductor multilayer reflective layer (hereinafter referred to as an N-type DBR layer) 132 is laminated. Further, the N-type DBR layer 132 is provided with an arc-shaped groove W when viewed from the positive side in the z-axis direction. The groove W has a half circumference near the center of each of the VCSELs 100A and 100B on the negative direction side in the x-axis direction. The bottom of the trench W reaches the surface of the N-type semiconductor contact layer 130.
  • the N-type DBR layer 132 is made of AlGaAs and is formed by stacking a plurality of layers having different composition ratios of Al to Ga.
  • the N-type DBR layer 132 functions as a first reflector for generating laser light having a predetermined frequency.
  • the N-type DBR layer 132 may also serve as an N-type semiconductor contact layer. That is, the N-type semiconductor contact layer is not essential.
  • an N-type semiconductor clad layer 134 is laminated on the surface of the N-type DBR layer 132.
  • the N-type semiconductor clad layer 134 is provided at the center of the VCSELs 100A and 100B when viewed in plan from the z-axis direction, and has a circular shape.
  • the N-type semiconductor clad layers 134 are insulated from each other.
  • the N-type semiconductor clad layer 134 is made of AlGaAs.
  • an active layer 136 is provided on the surface of the N-type semiconductor clad layer 134.
  • the active layer 136 is made of GaAs and AlGaAs.
  • the GaAs layer is provided between the AlGaAs layers.
  • the energy band gap of AlGaAs is larger than that of GaAs.
  • the refractive index of GaAs is larger than that of AlGaAs.
  • a P-type semiconductor clad layer 138 is provided on the surface of the active layer 136.
  • the P-type semiconductor clad layer 138 is made of AlGaAs.
  • An oxidized constricting layer 150 is provided on the surface of the P-type semiconductor clad layer 138 as shown in FIG. When the oxidized constricting layer 150 is viewed in plan from the z-axis direction, a circular hole 152 is provided in the approximate center of the oxidized constricting layer 150.
  • the oxidized constricting layer 150 is made of AlGaAs.
  • a P-type semiconductor multilayer reflective layer (hereinafter referred to as a P-type DBR layer) 140 is provided on the surface of the oxidized constricting layer 150.
  • a part of the P-type DBR layer 140 is also provided in the hole 152 provided in the oxidized constricting layer, and is in contact with the P-type semiconductor clad layer 138.
  • the P-type DBR layer 140 is made of AlGaAs and is formed by laminating a plurality of layers having different Al composition ratios to Ga. Thereby, the P-type DBR layer 140 functions as a second reflector for generating laser light having a predetermined frequency.
  • the reflectance of the P-type DBR layer 140 is slightly lower than that of the N-type DBR layer 132.
  • the semiconductor clad layer is provided so as to sandwich the active layer, but the present invention is not limited to this configuration.
  • a layer having such a thickness as to generate resonance may be provided in the active layer.
  • a P-type semiconductor contact layer 142 is laminated on the surface of the P-type DBR layer 140.
  • the P-type semiconductor contact layer 142 is made of a compound semiconductor having P-type conductivity. Note that the P-type DBR layer may also serve as a P-type semiconductor contact layer. That is, the P-type semiconductor contact layer is not essential.
  • a light emitting region multilayer section 160 is configured.
  • each layer and the composition ratio of Al to Ga are set so as to have one emission spectrum peak wavelength at the center antinode position of the optical standing wave distribution and to arrange a plurality of quantum wells. Is done.
  • the light emitting region multilayer part 160 functions as the light emitting part of the VCSELs 100A and 100B.
  • the oxide constriction layer 150 by providing the oxide constriction layer 150, current can be efficiently injected into the active layer 136, and the VCSELs 100A and 100B with low power consumption can be realized.
  • an anode ring electrode 921 is provided on the surface of the P-type semiconductor contact layer 142.
  • the anode ring electrode 921 has an annular shape when viewed in plan from the z-axis direction. Note that the anode electrode does not necessarily have to be annular, and may be, for example, a C-shape or a rectangular shape with an annular portion open.
  • a cathode electrode 911 is provided in the groove W of the N-type DBR layer 132 described above.
  • the cathode electrode 911 is in contact with the N-type semiconductor contact layer 130 as shown in FIG. Thereby, the cathode electrode 911 is electrically connected to the N-type semiconductor contact layer 130.
  • the cathode electrode 911 has an arc shape when viewed in plan from the z-axis direction. The arc is substantially concentric with the ring of the annular anode ring electrode 921.
  • the insulating film 162 is provided so as to cover the surface of the light emitting region multilayer 160 of the VCSELs 100A and 100B except for the portion where the cathode electrode 911 and the anode ring electrode 921 are provided.
  • the material of the insulating film 162 is, for example, silicon nitride.
  • an insulating layer 170 is provided on the positive side of the x-axis direction in the VCSELs 100A and 100B. Further, as shown in FIG. 5, the insulating layer 170 is provided on the insulating film 162 covering the N-type DBR layer 132. As shown in FIG. 4, the insulating layer 170 has a rectangular shape having long sides in the y-axis direction when viewed in plan from the z-axis direction. An example of the material of the insulating layer 170 is polyimide.
  • a cathode pad electrode 912 is provided on a portion of the surface of the insulating layer 170 on the negative side in the y-axis direction.
  • the cathode pad electrode 912 is connected to the cathode electrode 911 via the cathode wiring electrode 913.
  • an anode pad electrode 922 is provided on a portion on the positive side in the y-axis direction on the surface of the insulating layer 170.
  • the anode pad electrode 922 and the cathode pad electrode 912 are provided apart from each other by a predetermined distance.
  • the anode pad electrode 922 is connected to the anode ring electrode 921 through the anode wiring electrode 923.
  • the light emitting element array 100 is provided with grooves 180 for dividing the VCSELs 100A and 100B.
  • the grooves 180 are grooves provided in a lattice shape parallel to the x-axis direction and the y-axis direction when viewed in plan from the z-axis direction.
  • the trench 180 penetrates the insulating film 162, the N-type DBR layer 132, and the N-type semiconductor contact layer 130 in the stacking direction. Further, the bottom of the groove 180 reaches a predetermined depth from the surface of the base substrate 128. As a result, the VCSELs 100A and 100B can be prevented from conducting via the N-type semiconductor contact layer 130.
  • stimulated emission occurs in the active layer 136 by flowing a current (drive signal) from the anode pad electrode 922 to the cathode pad electrode 912. .
  • the light emitted from the active layer by stimulated emission is reflected by the N-type DBR layer 132 and the P-type DBR layer 140 and reciprocates through the active layer. During the reciprocation, the light is amplified by stimulated emission and is emitted as a laser beam to the positive side in the z-axis direction.
  • the N-type semiconductor contact layer 130 of the VCSEL 100A and the N-type semiconductor contact layer 130 of the VCSEL 100B are separated, the occurrence of crosstalk between the drive signal of the VCSEL 100A and the drive signal of the VCSEL 100B is suppressed. .
  • FIG. 6 is an external perspective view of the receptacle 20 according to the embodiment of the present invention (the metal cap 30 is not shown).
  • FIG. 7 is an external perspective view of a positioning member 200 according to an embodiment of the present invention.
  • FIG. 8 is a plan view of the positioning member 200 according to one embodiment of the present invention from the negative direction side in the z-axis direction.
  • FIG. 9 is a view in which the mounting substrate 22 and the plug 40 according to the embodiment of the present invention are added to the cross section taken along the line CC or DD of the positioning member 200 shown in FIG.
  • the positioning member 200 is provided across the mounting substrate 22 and the sealing resin 24 so as to cover the surface of the mounting substrate 22 and substantially the entire sealing resin 24.
  • the positioning member 200 includes a positioning member 220 for a light emitting element and a positioning member 240 for a light receiving element.
  • the positioning members 220 and 240 are provided so as to be arranged in this order from the negative direction side in the y-axis direction toward the positive direction side.
  • the positioning member 200 is made of, for example, an epoxy or nylon resin.
  • the light-emitting element positioning member 220 has a rectangular shape when viewed in plan from the z-axis direction. Further, the positioning member 220 includes a plug guide part 222 and an optical coupling part 224.
  • the plug guide portion 222 constitutes a portion of the positioning member 220 on the negative direction side of the x axis. Further, as shown in FIG. 8, the plug guide portion 222 is a plate-like member having a rectangular shape when viewed in plan from the z-axis direction. Furthermore, the end surface S1 on the positive side in the x-axis direction of the plug guide portion 222 faces the surface on the negative direction side in the x-axis direction of the sealing resin 24 as shown in FIG. Accordingly, the plug guide portion 222 is located on the negative side in the x-axis direction with respect to the sealing resin 24 on the mounting substrate 22.
  • a groove G1 for guiding a plug 40 to be described later is provided substantially parallel to the x-axis at the approximate center in the y-axis direction on the surface of the plug guide portion 222.
  • a portion on the negative direction side in the y-axis direction from the groove G1 is referred to as a flat portion F1
  • a portion on the positive direction side in the y-axis direction from the groove G1 is referred to as a flat portion F2.
  • the height h1 of the groove G1 from the mounting substrate 22 in the z-axis direction is lower than the height h2 of the sealing resin 24 in the z-axis direction.
  • the optical coupling portion 224 constitutes a portion on the positive direction side in the x-axis direction of the positioning member 220 and is placed on the sealing resin 24.
  • the optical coupling part 224 has a main body 226 and an abutting part 228 as shown in FIG.
  • the main body 226 has a rectangular parallelepiped shape.
  • the abutting portion 228 protrudes from the end surface S2 on the negative side in the x-axis direction of the main body 226 along the flat portion F1 of the plug guide portion 222 to the approximate center of the flat portion F1 in the x-axis direction.
  • the optical coupling part 224 is L-shaped when viewed in plan from the z-axis direction.
  • the end surface of the abutting portion 228 on the negative side in the x-axis direction is referred to as an end surface S3.
  • the optical coupling portion 224 is provided with a concave portion D1 and a convex lens 230.
  • the recess D1 is provided in the vicinity of the side on the positive side of the optical coupling portion 224 in the y-axis direction.
  • the recess D1 overlaps the light emitting element array 100 when viewed in plan from the z-axis direction.
  • the recess D1 overlaps with the optical axis of the optical fiber 60 connected to the plug 40 described later when viewed in plan from the x-axis direction.
  • the optical axis of the optical fiber 60 is parallel to the x-axis.
  • the recess D1 has a rectangular shape when seen in a plan view from the z-axis direction.
  • the recess D ⁇ b> 1 has a V shape when viewed in plan from the y-axis direction.
  • the inner peripheral surface on the negative side in the x-axis direction of the recess D1 is a total reflection surface R1.
  • the total reflection surface R1 is parallel to the y-axis as shown in FIG. Further, the total reflection surface R1 is inclined 45 ° counterclockwise with respect to the z-axis when viewed in plan from the negative direction side in the y-axis direction. Further, the refractive index of the positioning member 200 is sufficiently larger than that of air.
  • the laser beam B1 emitted from the light emitting element array 100 to the positive z-axis direction is incident on the optical coupling unit 224, and is totally reflected by the total reflection surface R1 to the negative x-axis side, thereby causing the plug 40 To the optical fiber 60 via
  • the angle formed by the optical axis of the laser beam B1 emitted from the light emitting element array 100 and the total reflection surface R1 is 45 °.
  • the angle formed by the optical axis of the laser beam B1 toward the total reflection surface R1 is 45 °. That is, the angle formed by the total reflection surface R1 and the optical axis of the optical fiber 60 is equal to the angle formed by the total reflection surface R1 and the light emitting element array 100.
  • the convex lens 230 (first convex lens) is provided on the surface on the negative direction side in the z-axis direction of the optical coupling portion 224, as shown in FIGS. Further, the convex lens 230 overlaps each VCSEL of the light emitting element array 100 when viewed in plan from the z-axis direction. Thereby, the convex lens 230 faces the light emitting element array 100 and is positioned on the optical path of the laser beam B1. In addition, the convex lens 230 has a semicircular shape that protrudes toward the negative direction side of the z-axis when viewed from a direction orthogonal to the z-axis. Accordingly, the laser beam B1 emitted from the light emitting element array 100 is condensed or collimated by the convex lens 230 and travels toward the total reflection surface R1.
  • the light receiving element positioning member 240 has a rectangular shape when viewed in plan from the z-axis direction. Further, the positioning member 240 includes a plug guide part 242 and an optical coupling part 244.
  • the plug guide portion 242 constitutes a portion of the positioning member 240 on the negative side of the x axis.
  • the plug guide portion 242 is a plate-like member having a rectangular shape when viewed in plan from the z-axis direction.
  • the end surface S4 on the positive direction side in the x-axis direction of the plug guide portion 242 faces the surface on the negative direction side in the x-axis direction of the sealing resin 24 as shown in FIG. Accordingly, the plug guide portion 242 is located on the negative side in the x-axis direction with respect to the sealing resin 24 on the mounting substrate 22.
  • a groove G2 for guiding a plug 40 to be described later is provided substantially parallel to the x-axis at the approximate center in the y-axis direction on the surface of the plug guide portion 242.
  • a portion on the negative side in the y-axis direction from the groove G2 is referred to as a flat portion F3
  • a portion on the positive direction side in the y-axis direction from the groove G2 is referred to as a flat portion F4.
  • the height h3 of the groove G2 in the z-axis direction is lower than the height h2 of the sealing resin 24 in the z-axis direction, as shown in FIG.
  • the optical coupling portion 244 constitutes a portion on the positive direction side in the x-axis direction of the positioning member 240 and is placed on the sealing resin 24.
  • the optical coupling part 244 has a main body 246 and an abutting part 248 as shown in FIG.
  • the main body 246 has a rectangular parallelepiped shape.
  • the abutting portion 248 protrudes from the end surface S5 on the negative side in the x-axis direction of the main body 246 to the approximate center in the x-axis direction of the flat portion F4 along the flat portion F4 of the plug guide portion 242.
  • the optical coupling unit 244 has an L shape when viewed in plan from the z-axis direction.
  • the end surface on the negative direction side in the x-axis direction of the abutting portion 248 is referred to as an end surface S6.
  • the optical coupling portion 244 is provided with a concave portion D2 and a convex lens 250.
  • the recess D2 is provided in the vicinity of the side on the negative direction side in the y-axis direction of the optical coupling portion 244.
  • the concave portion D2 overlaps the light receiving element array 50 when viewed in plan from the z-axis direction.
  • the recess D2 overlaps with the optical axis of the optical fiber 60 connected to the plug 40 described later when viewed in plan from the x-axis direction.
  • the optical axis of the optical fiber 60 is parallel to the x-axis.
  • the concave portion D2 has a rectangular shape when viewed in plan from the z-axis direction.
  • the recess D ⁇ b> 2 has a V shape when viewed in plan from the y-axis direction.
  • the inner peripheral surface on the negative direction side in the x-axis direction of the recess D2 is a total reflection surface R2.
  • the total reflection surface R2 is parallel to the y-axis as shown in FIG. Further, the total reflection surface R2 is inclined 45 ° counterclockwise with respect to the z-axis when viewed in plan from the negative direction side in the y-axis direction. Further, the refractive index of the positioning member 200 is sufficiently larger than that of air. Therefore, the laser beam B2 emitted from the optical fiber 60 to the positive direction side in the x-axis direction enters the optical coupling portion 244, and is totally reflected by the total reflection surface R2 to the negative direction side in the z-axis direction. To the light receiving element array 50.
  • the angle formed by the optical axis of the laser beam B2 emitted from the optical fiber 60 and the total reflection surface R2 is 45 °.
  • the angle formed by the optical axis of the laser beam B2 toward the total reflection surface R2 is 45 °. That is, the angle formed by the total reflection surface R2 and the optical axis of the optical fiber 60 is equal to the angle formed by the total reflection surface R2 and the light receiving element array 50.
  • the convex lens 250 is provided on the back surface of the optical coupling part 244 as shown in FIGS. Each convex lens 250 overlaps each VCSEL of the light receiving element array 50 when viewed in plan from the z-axis direction. As a result, the convex lens 250 faces the light receiving element array 50 and is positioned on the optical path of the laser beam B2. Further, the convex lens 250 has a semicircular shape that protrudes toward the negative direction side of the z-axis when viewed from a direction orthogonal to the z-axis. Accordingly, the laser beam B ⁇ b> 2 emitted from the optical fiber 60 is reflected by the total reflection surface R ⁇ b> 2, then condensed or collimated by the convex lens 250, and travels toward the light receiving element array 50.
  • FIG. 10 is an external perspective view of a metal cap 30 according to an embodiment of the present invention.
  • the metal cap 30 is manufactured by bending a single metal plate (for example, SUS301) into a U-shape. Further, as shown in FIG. 1, the metal cap 30 covers the positioning member 200 from the positive direction side in the z-axis direction, the positive direction side in the y-axis direction, and the negative direction side in the y-axis direction.
  • a single metal plate for example, SUS301
  • the metal cap 30 includes an upper surface 32 and side surfaces 34 and 36 as shown in FIG.
  • the upper surface 32 is a surface orthogonal to the z-axis and has a rectangular shape.
  • the side surface 34 is formed by bending the metal cap 30 from the long side of the upper surface 32 on the negative direction side in the y-axis direction to the negative direction side in the z-axis direction.
  • the side surface 36 is formed by bending the metal cap 30 from the long side of the upper surface 32 on the positive direction side in the y-axis direction to the negative direction side in the z-axis direction.
  • engaging portions 32 a and 32 b for fixing the plug 40 to the receptacle 20 are provided on the negative side portion of the upper surface 32 in the x-axis direction.
  • the engaging portions 32a and 32b are provided in this order from the negative direction side in the y-axis direction toward the positive direction side.
  • the engaging portions 32a and 32b are formed by making a U-shaped cut in the upper surface 32. More specifically, each of the engaging portions 32a and 32b has a U-shaped notch opening on the upper surface 32 in the positive direction of the x-axis direction, and a portion surrounded by the U-shaped notch in the z-axis direction. It is formed by bending so as to be recessed in the negative direction side. Thus, the engaging portions 32a and 32b have a V-shape that protrudes in the negative direction side in the z-axis direction when viewed in plan from the y-axis direction.
  • engaging portions 32c and 32d for fixing the plug 40 to the receptacle 20 are provided on the short side of the upper surface 32 on the negative side in the x-axis direction.
  • the engaging portions 32c and 32d are metal pieces protruding from the upper surface 32 toward the negative direction side in the x-axis direction.
  • the engaging portions 32c and 32d are bent so as to be recessed toward the negative direction side in the z-axis direction at a substantially central position in the x-axis direction in the engaging portions 32c and 32d.
  • the engaging portions 32c and 32d have a V-shape protruding in the negative direction side in the z-axis direction when viewed in plan from the y-axis direction.
  • convex portions C1 to C3 projecting toward the negative direction side in the z-axis direction are formed from the negative direction side in the x-axis direction. They are arranged in this order toward the positive direction.
  • the convex portions C1 to C3 are each fixed to the mounting substrate 22 with an adhesive.
  • the convex portion C1 is connected to the ground conductor exposed portion E2 of the mounting substrate 22.
  • the convex portion C3 is fitted into a space H1 provided between the leg portion 24b and the leg portion 24c of the sealing resin 24. Thereby, the metal cap 30 is positioned with respect to the mounting substrate 22.
  • convex portions C4 to C6 projecting toward the negative direction side in the z-axis direction are formed from the negative direction side in the x-axis direction. They are arranged in this order toward the positive direction.
  • the convex portions C4 to C6 are each fixed to the mounting substrate 22 with an adhesive.
  • the convex portion C4 is connected to the ground conductor exposed portion E3 of the mounting substrate 22.
  • the convex portion C6 is fitted into a space H2 provided between the leg portion 24d and the leg portion 24e of the sealing resin 24. Thereby, the metal cap 30 is positioned with respect to the mounting substrate 22.
  • the metal cap 30 covers the positioning member 200 from the positive direction side in the z-axis direction and from the positive direction side and the negative direction side in the y-axis direction.
  • An opening A3 into which a plug 40 described later is inserted is formed on the negative side of the receptacle 20 in the x-axis direction, as shown in FIG.
  • FIG. 11 is an external perspective view of a plug according to an embodiment of the present invention.
  • FIG. 12 is a plan view of a plug according to an embodiment of the present invention from the negative side in the z-axis direction.
  • the plug 40 is provided at one end of the optical fiber 60 as shown in FIG.
  • the plug 40 includes a transmission side plug 42 and a reception side plug 46.
  • the plug 40 is made of, for example, an epoxy or nylon resin.
  • the transmitting side plug 42 transmits the laser beam B1 from the light emitting element array 100.
  • the transmission-side plug 42 includes an optical fiber insertion portion 42a and an ear portion 42b.
  • the optical fiber insertion portion 42a constitutes a portion on the positive direction side in the y-axis direction of the transmission-side plug 42, and has a rectangular parallelepiped shape extending in the x-axis direction.
  • An opening A1 for inserting the optical fiber 60 is provided in a portion on the negative side in the x-axis direction of the optical fiber insertion portion 42a.
  • the opening A1 is formed by cutting out the upper surface S7 on the positive direction side in the z-axis direction and the end surface S8 on the negative direction side in the x-axis direction of the optical fiber insertion portion 42a. Further, a hole H7 for guiding the core of the inserted optical fiber 60 to the tip of the transmission side plug 42 is provided on the inner peripheral surface on the positive side in the x-axis direction of the opening A1. Note that the number of holes H7 corresponds to the number of optical fibers 60, and is two in this embodiment.
  • a concave portion D3 for injecting an adhesive for fixing the optical fiber 60 is provided in a portion on the positive side in the x-axis direction of the optical fiber insertion portion 42a.
  • the recess D3 is recessed from the front surface to the back surface of the optical fiber insertion portion 42a.
  • a hole H7 is provided on the inner peripheral surface on the negative direction side in the x-axis direction of the recess D3.
  • the hole H7 is connected to the inner peripheral surface of the opening A1 on the positive direction side in the x-axis direction. Accordingly, the core wire of the optical fiber 60 reaches the recess D3 from the opening A1 through the hole H7.
  • the core wire of the optical fiber 60 that has reached the recess D3 is abutted against the inner peripheral surface (abutment surface) S9 on the positive side in the x-axis direction of the recess D3.
  • the optical fiber 60 is fixed to the transmission side plug 42 by pouring an adhesive made of a transparent resin, for example, an epoxy resin into the opening A1 and the recess D3.
  • a convex lens 44 (third convex lens) is provided on the end surface S10 on the positive side in the x-axis direction of the optical fiber insertion portion 42a.
  • the convex lens 44 has a semicircular shape protruding in the positive direction side in the x-axis direction when seen in a plan view from a direction orthogonal to the x-axis direction. Accordingly, the laser beam B1 emitted from the light emitting element array 100 and reflected by the total reflection surface R1 is condensed or collimated by the convex lens 44.
  • the convex lens 44 overlaps the optical axis of the optical fiber when viewed in plan from the x-axis direction. Accordingly, the laser beam B1 collected or collimated by the convex lens 44 passes through the resin of the optical fiber insertion portion 42a. The laser beam B1 is transmitted to the core of the core of the optical fiber 60 that is abutted against the abutting surface S9.
  • a protrusion N1 that engages with the engaging portion 32a of the metal cap 30 is provided on the upper surface S7 of the optical fiber insertion portion 42a.
  • the protrusion N1 is provided between the opening A1 and the recess D3 in the x-axis direction, and extends in the y-axis direction. Further, the protrusion N1 has a triangular shape protruding in the positive direction side in the z-axis direction when viewed in plan from the y-axis direction.
  • a convex portion C7 is provided on the back surface of the optical fiber insertion portion 42a.
  • the convex portion C7 corresponds to the groove G1 of the plug guide portion 222 of the positioning member 220.
  • the convex portion C7 is provided in parallel to the x-axis from the end surface S8 toward the end surface S10.
  • the ear portion 42b protrudes from the vicinity of the end portion on the negative direction side in the x-axis direction of the optical fiber insertion portion 42a toward the negative direction side in the y-axis direction.
  • the transmission side plug 42 is L-shaped.
  • edge part 42b functions as a holding part in the case of the insertion / extraction operation
  • a substantially rectangular hollow hole is provided in the approximate center of the ear portion 42b when viewed in plan from the z-axis direction.
  • connection work between the transmission side plug 42 and the receptacle 20 is performed by pushing the convex portion C7 along the groove G1 to the positive side in the x-axis direction. At this time, the end surface S11 on the positive side in the x-axis direction of the ear portion 42b abuts against the end surface S3 of the abutting portion 228 of the positioning member 200 shown in FIG.
  • the transmission side plug 42 is placed on the positioning member 220 by the connection work between the transmission side plug 42 and the receptacle 20. Furthermore, as described above, the optical axis of the optical fiber 60 is parallel to the x-axis direction, and the direction in which the transmission side plug 42 is pushed into the receptacle 20 is the positive direction side in the x-axis direction. Therefore, the optical axis of the optical fiber 60 and the insertion direction of the transmission side plug 42 are parallel.
  • the engaging portion 32a of the metal cap 30 is engaged with the protrusion N1, and the engaging portion 32c is formed by the upper surface S7 and the end surface S8 of the transmission side plug 42.
  • the transmission side plug 42 is fixed to the receptacle 20.
  • the receiving side plug 46 transmits the laser beam B2 to the light receiving element array 50.
  • the receiving side plug 46 includes an optical fiber insertion portion 46a and an ear portion 46b.
  • the optical fiber insertion portion 46a constitutes a portion on the negative direction side in the y-axis direction of the reception side plug 46, and has a substantially rectangular parallelepiped shape.
  • An opening A2 for inserting the optical fiber 60 is provided in a portion on the negative direction side in the x-axis direction of the optical fiber insertion portion 46a.
  • the opening A2 is formed by cutting out the upper surface S12 on the positive direction side in the z-axis direction and the end surface S13 on the negative direction side in the x-axis direction of the optical fiber insertion portion 46a.
  • a hole H8 for guiding the core of the inserted optical fiber 60 to the tip of the receiving side plug 46 is provided on the inner peripheral surface on the positive side in the x-axis direction of the opening A2.
  • the number of holes H8 corresponds to the number of the optical fibers 60, and is two in this embodiment.
  • a concave portion D4 for injecting an adhesive for fixing the optical fiber 60 is provided in a portion on the positive side in the x-axis direction of the optical fiber insertion portion 46a.
  • the recess D4 is recessed from the front surface to the back surface of the optical fiber insertion portion 46a.
  • a hole H8 is provided on the inner peripheral surface on the negative direction side in the x-axis direction of the recess D4.
  • the hole H8 is connected to the inner peripheral surface on the positive direction side in the x-axis direction of the opening A2. Accordingly, the core wire of the optical fiber 60 reaches the recess D4 from the opening A2 through the hole H8.
  • the core of the optical fiber 60 that has reached the recess D4 is abutted against the inner peripheral surface (abutment surface) S14 on the positive side in the x-axis direction of the recess D4.
  • the optical fiber 60 is fixed to the receiving side plug 46 by pouring an adhesive made of a transparent resin, for example, an epoxy resin into the opening A2 and the recess D4.
  • a convex lens 48 is provided on the end surface S15 on the positive side in the x-axis direction of the optical fiber insertion portion 46a.
  • the convex lens 48 has a semicircular shape protruding in the positive direction side in the x-axis direction when seen in a plan view from a direction orthogonal to the x-axis.
  • the convex lens 48 overlaps the optical axis of the optical fiber 60 when viewed in plan from the x-axis direction. Accordingly, the laser beam B2 emitted from the optical fiber 60 is condensed or collimated by the convex lens 48 and proceeds to the total reflection surface R2. The laser beam B ⁇ b> 2 is reflected by the total reflection surface R ⁇ b> 2 and transmitted to the light receiving element array 50.
  • a protrusion N2 that engages with the engaging portion 32b of the metal cap 30 is provided on the upper surface S12 of the optical fiber insertion portion 46a.
  • the protrusion N2 is provided between the opening A2 and the recess D4 in the x-axis direction, and extends in the y-axis direction. Further, the protrusion N2 has a triangular shape protruding in the positive direction side in the z-axis direction when viewed in plan from the y-axis direction.
  • a convex portion C8 is provided on the back surface of the optical fiber insertion portion 46a.
  • the convex portion C8 corresponds to the groove G2 of the plug guide portion 242 of the positioning member 240.
  • the convex portion C8 is provided in parallel to the x-axis from the end surface S13 toward the end surface S15.
  • the ear 46b protrudes from the end on the negative direction side in the x-axis direction of the optical fiber insertion portion 46a to the positive direction side in the y-axis direction.
  • the receiving side plug 46 is L-shaped.
  • edge part 46b functions as a holding part in the case of the insertion / extraction operation
  • a substantially rectangular hollow hole is provided in the approximate center of the ear 46b when viewed in plan from the z-axis direction.
  • connection work between the receiving side plug 46 and the receptacle 20 is performed by pushing the convex portion C8 along the groove G2 to the positive side in the x-axis direction. At this time, the end surface S16 on the positive side in the x-axis direction of the ear portion 46b abuts against the end surface S6 of the abutting portion 248 of the positioning member 200 shown in FIG.
  • the receiving side plug 46 is placed on the positioning member 240 by the connection work between the receiving side plug 46 and the receptacle 20. Furthermore, as described above, the optical axis of the optical fiber 60 is parallel to the x-axis direction, and the direction in which the receiving-side plug 46 is pushed into the receptacle 20 is the positive direction side in the x-axis direction. Therefore, the optical axis of the optical fiber 60 and the insertion direction of the receiving side plug 46 are parallel.
  • the engaging portion 32b of the metal cap 30 engages with the protrusion N2, and the engaging portion 32d forms the upper surface S12 and the end surface S13 of the receiving side plug 46.
  • the receiving side plug 46 is fixed to the receptacle 20 by engaging with the corner.
  • the laser beam B ⁇ b> 1 emitted from the light emitting element array 100 toward the positive side in the z-axis direction passes through the sealing resin 24 and the positioning member 220. pass. Further, the laser beam B ⁇ b> 1 is reflected by the total reflection surface R ⁇ b> 1 on the negative side in the x-axis direction, passes through the plug 40, and is transmitted to the core of the optical fiber 60. Therefore, the positioning member 220 plays a role of optically coupling the core of the optical fiber 60 and the light emitting element array 100.
  • the laser beam B ⁇ b> 2 emitted from the optical fiber 60 toward the positive direction in the x-axis direction passes through the positioning member 240. Further, the laser beam B ⁇ b> 2 is reflected by the total reflection surface R ⁇ b> 2 to the negative direction side in the z-axis direction, passes through the sealing resin 24, and is transmitted to the light receiving element array 50. Accordingly, the positioning member 240 plays a role of optically coupling the core of the optical fiber 60 and the light receiving element array 50.
  • an N-type semiconductor contact layer 130, an N-type DBR layer 132, an N-type semiconductor clad layer 134, an active layer 136, a P-type semiconductor clad layer 138, a P-type DBR layer 140, and a P-type semiconductor contact are formed on the surface of the base substrate 128.
  • Layer 142 is stacked in this order.
  • the P-type semiconductor contact layer 142, the P-type DBR layer 140, the P-type semiconductor clad layer 138, the active layer 136, and the N-type semiconductor clad layer are excluded except for the portions constituting the light emitting region multilayer portion 160 of each VCSEL 100A, 100B 134 are sequentially etched in a predetermined pattern.
  • etching is performed up to the surface of the N-type DBR layer 132.
  • the N-type semiconductor contact layer 130 is exposed by etching a position in the region where the surface of the N-type DBR layer 132 is exposed and close to the light emitting region multilayer section 160.
  • a cathode electrode 911 is formed in a region where the N-type semiconductor contact layer 130 is exposed.
  • an anode ring electrode 921 is formed on the surface of the P-type semiconductor contact layer 142 of the light emitting region multilayer part 160 that has not been etched.
  • the insulating film 162 is formed on the surface side of the base substrate 128 except for the surfaces of the cathode electrode 911 and the anode ring electrode 921.
  • An insulating layer 170 is formed in a region close to the light emitting region multilayer portion 160 on the surface of the insulating film 162.
  • a cathode pad electrode 912 and an anode pad electrode 922 are formed on the surface of the insulating layer 170.
  • a cathode wiring electrode 913 that connects the cathode electrode 911 and the cathode pad electrode 912 is formed.
  • An anode wiring electrode 923 that connects the anode ring electrode 921 and the anode pad electrode 922 is formed.
  • the light emitting element array 100 is formed by the processes as described above.
  • FIG. 13 is a diagram of a manufacturing process of a receptacle according to an embodiment of the present invention.
  • solder is applied to the surface of a mother substrate 122 (not shown in the drawing) which is an assembly of the mounting substrates 22. More specifically, cream solder is pressed onto the mother substrate 122 on which the metal mask is placed using a squeegee. Then, the solder is printed on the mother substrate 122 by removing the metal mask from the mother substrate 122.
  • the capacitor is placed on the solder of the mother board 122. Thereafter, heat is applied to the mother substrate 122 to solder the capacitor.
  • Ag paste is applied to a predetermined position on the mother substrate 122.
  • the drive circuit 26, the light receiving element array 50, and the light emitting element array 100 are mounted on the coated Ag, and die bonding is performed. Further, the drive circuit 26 and the light receiving element array 50 are connected by wire bonding using Au wires, and the drive circuit 26 and the light emitting element array 100 are connected by wire bonding.
  • the plurality of mounting boards 22 are obtained by cutting the mother board 122 using a dicer.
  • the positioning member 220 is placed on the mounting substrate 22 and the sealing resin 24. More specifically, a UV curable adhesive is applied to the negative region in the x-axis direction on the surface of the sealing portion 24a. After applying the adhesive, as shown in FIG. 13, the position of the center T100 of the light emitting part of the light emitting element array 100 is confirmed by the position recognition camera V1.
  • the mounting machine V2 for placing the positioning member 220 on the sealing resin 24 picks up and picks up the positioning member 220. Then, as shown in FIG. 13, the position of the lens center T230 of the convex lens 230 of the positioning member 220 is confirmed by the position recognition camera V3 in a state where the mounting machine V2 sucks the positioning member 220.
  • the light emitting element array 100 From the position data of the center T100 of the light emitting part of the light emitting element array 100 confirmed by the position recognition camera V1 and the position data of the lens center T230 of the convex lens 230 of the positioning member 220 confirmed by the position recognition camera V3, the light emitting element array 100. The relative position between the light emitting part and the convex lens 230 is calculated. Based on the calculated result, the movement amount of the onboard machine V2 is determined.
  • the positioning member 220 is moved by the determined movement amount by the mounting machine V2. Thereby, the lens center T230 of the convex lens 230 and the optical axis of the light emitting element array 100 coincide.
  • the positioning member 240 is mounted on the mounting substrate 22 and the sealing resin 24. More specifically, after a UV curable adhesive is applied to the negative region in the x-axis direction on the surface of the sealing portion 24a, the center of the light receiving portion of the light receiving element array 50 is applied as shown in FIG. The position T50 is confirmed by the position recognition camera V4.
  • the mounting machine V5 for mounting the positioning member 240 on the sealing resin 24 picks up and picks up the positioning member 240. Then, as shown in FIG. 13, the position of the lens center T250 of the convex lens 250 of the positioning member 240 is confirmed by the position recognition camera V6 in a state where the mounting machine V5 sucks the positioning member 240.
  • the light receiving element array 50 From the position data of the center T50 of the light receiving unit of the light receiving element array 50 confirmed by the position recognition camera V4 and the position data of the lens center T250 of the convex lens 250 of the positioning member 240 confirmed by the position recognition camera V6, the light receiving element array 50. The relative position between the light receiving unit and the convex lens 250 is calculated. Based on the calculated result, the movement amount of the onboard machine V5 is determined.
  • the positioning member 240 is moved by the determined movement amount by the mounting machine V5. Thereby, the lens center T250 of the convex lens 250 and the optical axis of the light receiving element array 50 coincide.
  • the positioning members 220 and 240 are pressed against the mounting substrate 22 and the sealing resin 24 by the mounting machines V2 and V5.
  • the UV curable adhesive between the positioning members 220 and 240 and the sealing resin 24 is cured, the positioning members 220 and 240 are not displaced and the mounting substrate 22 and the sealing resin are sealed. It is fixed to the resin 24.
  • the metal cap 30 is attached to the mounting substrate 22 on which the positioning member 200 is placed. More specifically, on the surface of the mounting substrate 22, a space H ⁇ b> 1 between the legs 24 b and 24 c of the sealing resin 24, a space H ⁇ b> 2 between the legs 24 d and 24 e, and the metal cap 30.
  • a thermosetting adhesive such as epoxy is applied to the portion where the projections C2 and C5 come into contact.
  • a conductive paste such as Ag is applied to the ground conductor exposed portions E2 and E3 of the mounting substrate 22.
  • the convex portion C3 of the metal cap 30 is fitted into a portion sandwiched between the leg portion 24b and the leg portion 24c of the sealing resin 24 on the mounting substrate 22, that is, the space H1. Further, the convex portion C6 is fitted into a portion sandwiched between the leg portion 24d and the leg portion 24e of the sealing resin 24, that is, the space H2. Thereby, the position of the metal cap 30 with respect to the mounting substrate 22 is determined. Simultaneously with the positioning of the metal cap 30, the convex portions C1 to C6 come into contact with the adhesive and the conductive paste on the mounting substrate 22.
  • the metal cap 30 After fitting the metal cap 30, heat is applied to the mounting substrate 22 to cure the adhesive and the conductive paste. Thereby, the metal cap 30 is fixed to the mounting substrate 22. Note that, by attaching the metal cap 30 to the mounting substrate 22, the convex portions C ⁇ b> 1 and C ⁇ b> 4 of the metal cap 30 come into contact with the ground conductor exposed portions E ⁇ b> 2 and E ⁇ b> 3 of the mounting substrate 22. Thereby, the metal cap 30 is connected to the ground conductor in the mounting substrate 22 and is kept at the ground potential.
  • the receptacle 20 is completed by the process as described above.
  • the optical fiber 60 inserted into the plug 40 is cut into a predetermined length.
  • the coating near the tip of the optical fiber 60 is removed using an optical fiber stripper. After removing the coating in the vicinity of the tip, cleaving is performed to bring out the cleavage plane of the core of the optical fiber 60.
  • a transparent adhesive such as an epoxy resin for fixing the optical fiber 60 is injected into the openings A1 and A2 and the recesses D3 and D4 of the plug 40 shown in FIG. Furthermore, it pushes in until the core wire of the optical fiber 60 hits the surfaces S9 and S14 of the plug 40. Then, the optical fiber 60 is fixed to the plug 40 by curing the transparent adhesive.
  • the plug 40 is connected to the receptacle 20. As described above, the plug 40 is connected to the grooves G1 and G2 of the positioning members 220 and 240 along the protrusions C7 and C8 of the plug 40 and the opening provided between the metal cap 30 and the receptacle 20. This is performed by pushing from A3 toward the positive side in the x-axis direction.
  • the optical transmission module 10 is completed through the manufacturing process as described above.
  • the VCSELs 100A and 100B are placed on a base substrate 128 that is one substrate.
  • the base substrate 128 is a semi-insulating semiconductor substrate.
  • the drive signal sent to the VCSEL 100A is not sent to the VCSEL 100B via the base substrate 128, and the drive signal sent to the VCSEL 100B is not sent to the VCSEL 100A via the base substrate 128. Further, the N-type semiconductor contact layer 130 of the VCSEL 100A and the N-type semiconductor contact layer 130 of the VCSEL 100B are separated.
  • the drive signal sent to the VCSEL 100A is not sent to the VCSEL 100B via the N-type semiconductor contact layer 130, and the drive signal sent to the VCSEL 100B is sent to the VCSEL 100A via the N-type semiconductor contact layer 130. It is never sent. That is, according to the optical transmission module 10 and the receptacle 20, sufficient isolation can be obtained between the VCSELs 100A and 100B.
  • the optical loss of the laser beam B1 is reduced as described below. More specifically, the laser beam B1 is refracted when being emitted from a resin having a relatively high refractive index to air having a relatively low refractive index. Therefore, the laser beam B1 traveling in the air propagates while spreading more than the laser beam B1 traveling in the resin. Therefore, in the optical system path of the laser beam B1, the spread of the laser beam B1 can be suppressed by increasing the resin ratio and decreasing the air ratio. Therefore, in the receptacle 20, the laser beam B1 emitted from the light emitting element array 100 passes through the positioning member 200 made of resin.
  • the proportion of resin increases and the proportion of air decreases.
  • the spread of the laser beam B1 is suppressed. Therefore, the intensity of the laser beam B1 incident on the optical fiber 60 is increased, and the optical loss of the laser beam B1 is reduced. For the same reason, the optical loss of the laser beam B2 is also reduced.
  • the optical loss of the laser beam B1 can be further reduced.
  • the laser beam B ⁇ b> 1 emitted from the light emitting element array 100 passes through the sealing resin 24.
  • the proportion occupied by the resin increases and the proportion occupied by the air decreases.
  • the spread of the laser beam B1 is suppressed. Therefore, the intensity of the laser beam B1 incident on the optical fiber 60 is increased, and the optical loss of the laser beam B1 is reduced. For the same reason, the optical loss of the laser beam B2 is also reduced.
  • a total reflection surface R1 is provided on the optical path of the laser beam B1.
  • the angle formed by the total reflection surface R1 and the optical axis of the optical fiber 60 is 45 °, and the angle formed by the total reflection surface R1 and the light emitting element array 100 is 45 °. That is, the angle formed by the total reflection surface R1 and the optical axis of the optical fiber 60 is equal to the angle formed by the total reflection surface R1 and the light emitting element array 100.
  • the optical fiber 60 and the light emitting element array 100 are optically optical even if the optical axis of the optical fiber 60 is not the same z-axis direction as the emission direction of the laser beam B 1 from the light emitting element array 100. Can be combined.
  • a total reflection surface R2 is provided on the optical path of the laser beam B2.
  • the angle formed by the total reflection surface R2 and the optical axis of the optical fiber 60 is 45 °, and the angle formed by the total reflection surface R2 and the light receiving element array 50 is 45 °. That is, the angle formed by the total reflection surface R2 and the optical axis of the optical fiber 60 is equal to the angle formed by the total reflection surface R2 and the light receiving element array 50.
  • the optical fiber 60 and the light receiving element array 50 are optically coupled even if the optical axis of the optical fiber 60 is not the same z-axis direction as the light receiving direction of the light receiving element array 50. Can do.
  • the spread of the laser beams B1 and B2 with respect to the optical axis can be suppressed by propagating the light within the resin.
  • the convex lenses 230 and 250 and the total reflection surfaces R1 and R2 provided in the receptacle 20 can be reduced.
  • the optical transmission module 10 and the receptacle 20 can be reduced in size and reduced in height.
  • the insertion direction of the plug 40 into the receptacle 20 is the same x-axis direction as the optical axis of the optical fiber 60.
  • the surface mounting electrode E ⁇ b> 1 is provided on the back surface of the mounting substrate 22.
  • the light transmission module 10 can be surface-mounted without providing a connector for connection to the circuit board on which the light transmission module 10 is mounted. Therefore, the substantial occupied area of the light transmission module 10 on the circuit board on which the light transmission module 10 is mounted can be suppressed.
  • a convex lens 230 is provided on the back surface of the optical coupling portion 224 of the positioning member 200. Accordingly, the laser beam B 1 from the light emitting element array 100 passes through the convex lens 230. At this time, even if the position of the light emitting element array 100 is shifted from the positioning member 220, the laser beam B1 is condensed or collimated by the convex lens 230 and proceeds to the total reflection surface R1. . Therefore, according to the receptacle 20 and the optical transmission module 10, it is possible to suppress optical loss due to the positional deviation of the light emitting element array 100.
  • a convex lens 250 is provided on the back surface of the optical coupling portion 244 of the positioning member 240 as shown in FIG. Accordingly, the laser beam B ⁇ b> 2 emitted from the optical fiber 60 passes through the convex lens 250. At this time, even if the optical axis of the laser beam B 2 reflected by the total reflection surface R 2 is shifted, the laser beam B 2 is condensed or collimated by the convex lens 250 and proceeds to the light receiving element array 50. Therefore, according to the receptacle 20 and the optical transmission module 10, the optical loss due to the optical axis shift of the laser beam B2 can be suppressed.
  • a convex lens 44 is provided on the end surface S ⁇ b> 10 of the transmission side plug 42. Accordingly, the laser beam B1 reflected by the total reflection surface R1 passes through the convex lens 44. At this time, the laser beam B 1 is condensed or collimated by the convex lens 44 and travels to the optical fiber 60. Therefore, according to the optical transmission module 10, it is possible to suppress optical loss due to the optical axis shift of the laser beam B1.
  • a convex lens 48 is provided on the end surface S ⁇ b> 15 of the receiving side plug 46. Therefore, the laser beam B2 emitted from the optical fiber 60 passes through the convex lens 48. At this time, even if the position of the optical fiber 60 is misaligned with respect to the plug 40, the laser beam B2 is condensed or collimated by the convex lens 48 and proceeds to the total reflection surface R2. Therefore, according to the optical transmission module 10, it is possible to suppress optical loss due to the positional deviation of the optical fiber 60.
  • FIG. 14 is a cross-sectional view of a conventional receptacle 400 and plug 41. More specifically, when the entire positioning member 200 is provided on the surface of the sealing resin 25 as in the optical transmission module 400 illustrated in FIG. 14, the thickness of the plug 41 in the z-axis direction is reduced. Therefore, the strength of the plug 41 is reduced. Therefore, in the optical transmission module 10, as shown in FIG. 9, the positioning member 200 is provided across the mounting substrate 22 and the sealing resin 24. Further, the plug 40 is positioned on the plug guide portions 222 and 242 of the positioning member 200.
  • the heights h1 and h3 of the grooves G1 and G2 of the plug guide portions 222 and 242 are lower than the height h2 of the sealing resin 24.
  • the optical axis of the optical fiber 60 is located on the positive side in the z-axis direction with respect to the sealing resin 24.
  • the plug 40 can be enlarged in the z-axis direction, it is easier to grip than the plug 41 of the optical transmission module 400. Therefore, in the optical transmission module 10, it is easy to connect the plug 40 to the receptacle 20.
  • an opening A3 is provided between the metal cap 30 and the mounting substrate 22 in the optical transmission module 10 as shown in FIG.
  • the plug 40 is connected by inserting the plug 40 from the opening A3. Therefore, in the optical transmission module 10, it is not necessary to remove the metal cap 30 when attaching / detaching the plug 40, and the attachment / detachment work of the plug 40 is easy.
  • the metal cap 30 is provided with engaging portions 32a to 32d for fixing the plug 40. Thereby, the position shift with respect to the positioning member 200 of the plug 40 is prevented. As a result, the optical axis shift of the optical fiber 60 is prevented. Therefore, according to the optical transmission module 10, the optical axis shift of the optical fiber 60 can be prevented and the optical loss can be suppressed.
  • the positioning member 200 is attached to the mounting board 22, conventionally, a pin P1 provided on the mounting board 22 as shown in FIG. 15 has been used.
  • the positioning member 200 is fixed to the mounting substrate 22 by inserting the pin P ⁇ b> 1 provided on the mounting substrate 22 into the hole H ⁇ b> 9 provided in the positioning member 200.
  • a positional deviation occurs between the light emitting element array 100 and the convex lens 230 of the positioning member 200 due to a positional deviation when the P1 is manufactured on the mounting substrate 22 or a positional deviation when the light emitting element array 100 is mounted.
  • the positioning member 200 when the positioning member 200 is attached to the mounting substrate 22, the positional relationship between the center T100 of the light emitting part of the light emitting element array 100 and the lens center T230 of the convex lens 230 is confirmed.
  • the positioning member 200 is placed on the mounting substrate 22 while checking with the camera for use. Therefore, the light emitting element array 100 and the convex lens 230 are directly positioned without going through the pin P1.
  • the occurrence of misalignment is suppressed.
  • positional deviation between the light receiving element array 50 and the convex lens 250 is also suppressed.
  • FIG. 16 is a cross-sectional view of an optical transmission module 10 ′ and a receptacle 20 ′ according to a modification.
  • FIG. 1 is used for the external view.
  • the difference between the light transmission module 10 and the light transmission module 10 ′ is that the positioning member 200 is further provided with a convex lens. Since the other points are not different between the optical transmission module 10 and the optical transmission module 10 ', description thereof will be omitted.
  • the same components as those of the light transmission module 10 are denoted by the same reference numerals as those of the light transmission module 10.
  • a convex lens 232 is provided on the total reflection surface R ⁇ b> 1 of the positioning member 220.
  • the laser beam B 1 emitted from the light emitting element array 100 is condensed or collimated by the convex lens 232 and transmitted to the optical fiber 60. Therefore, according to the optical transmission module 10 ′, optical loss can be further suppressed as compared with the optical transmission module 10.
  • a convex lens 234 (second convex lens) is provided on the surface of the positioning member 220 facing the transmission side plug 42 as shown in FIG.
  • the laser beam B 1 reflected by the total reflection surface R 1 is collected or collimated by the convex lens 234 and transmitted to the optical fiber 60. Therefore, according to the optical transmission module 10 ′, optical loss can be further suppressed as compared with the optical transmission module 10.
  • a convex lens 252 is provided on the total reflection surface R2 of the positioning member 240.
  • the laser beam B ⁇ b> 2 emitted from the optical fiber 60 is condensed or collimated by the convex lens 252 and transmitted to the light receiving element array 50. Therefore, according to the optical transmission module 10 ′, optical loss can be further suppressed as compared with the optical transmission module 10.
  • a convex lens 254 is provided on the surface of the positioning member 240 facing the receiving side plug 46 as shown in FIG. Thereby, the laser beam B2 emitted from the optical fiber 60 is condensed or collimated by the convex lens 254 and transmitted to the total reflection surface R2. Therefore, according to the optical transmission module 10 ′, optical loss can be further suppressed as compared with the optical transmission module 10.
  • the receptacle and the optical transmission module according to the present invention are not limited to the optical transmission modules 10 and 10 'according to the above-described embodiment, and can be changed within the scope of the gist thereof.
  • the present invention is useful for receptacles and optical transmission modules, and is particularly excellent in that isolation between VCSELs can be secured.

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  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
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  • Semiconductor Lasers (AREA)

Abstract

The purpose of the present invention is to provide a receptacle and an optical transmission module using a VCSEL array capable of securing isolation between the VCSELs. A light-emitting element array (100) is formed by integrating VCSELs (100A, 100B). A positioning member optically couples the VCSELs (100A, 100B) and an optical fiber core. The light-emitting element array (100) is provided with: a base substrate (128); a light-emitting region multilayer section (160) which includes an N-type DBR layer (132), an active layer (136) having a quantum well, and a P-type DBR layer (140); an anode electrode (921) connected to the P-type DBR layer (140); and a cathode electrode (911) connected to the N-type DBR layer (132). On the side of the light-emitting region multilayer section (160), the base substrate (128) consists of a semi-insulating semiconductor. Pairs of VCSELs (100A, 100B) are formed on the base substrate (128).

Description

レセプタクル及び光伝送モジュールReceptacle and optical transmission module
　本発明は、レセプタクル及び光伝送モジュールに関し、より特定的には、電気信号を光信号に変換して伝送するレセプタクル及び光伝送モジュールに関する。 The present invention relates to a receptacle and an optical transmission module, and more particularly to a receptacle and an optical transmission module that convert an electrical signal into an optical signal and transmit it.
　従来のレセプタクルとしては、例えば、特許文献１に記載の光結合器が知られている。図１７は、特許文献１に記載の光結合器の分解斜視図である。 As a conventional receptacle, for example, an optical coupler described in Patent Document 1 is known. FIG. 17 is an exploded perspective view of the optical coupler described in Patent Document 1. FIG.
　光結合器５００は、図１７に示すように、光コネクタ５１０Ａ及び光通信モジュール５１０Ｂを備えている。また、光コネクタ５１０Ａは、複数本の光ファイバ５０２Ａからなる光ファイバアレイ５２０Ａ、光導波路５０４Ａ、レンズ基板５３０Ａを備えている。さらに、光通信モジュール５１０Ｂは、光コネクタ５１０Ａを接続するためのレンズ筐体５６０、及び垂直共振器面発光レーザ（以下、ＶＣＳＥＬと称す）であるＶＣＳＥＬ５０５を備えている。なお、光通信モジュール５１０Ｂでは、光ファイバ５０２Ａの本数と同数のＶＣＳＥＬ５０５が一つの素子内に組み合わされたレーザアレイが用いられている。 The optical coupler 500 includes an optical connector 510A and an optical communication module 510B as shown in FIG. The optical connector 510A includes an optical fiber array 520A composed of a plurality of optical fibers 502A, an optical waveguide 504A, and a lens substrate 530A. Further, the optical communication module 510B includes a lens housing 560 for connecting the optical connector 510A, and a VCSEL 505 which is a vertical cavity surface emitting laser (hereinafter referred to as VCSEL). The optical communication module 510B uses a laser array in which the same number of VCSELs 505 as the number of optical fibers 502A are combined in one element.
　光通信モジュール５１０Ｂでは、ＶＣＳＥＬ５０５により電気信号を光信号に変換する。変換された光信号は、複数のＶＣＳＥＬ５０５から出射され、光コネクタ５１０Ａのレンズ基板５３０Ａ及び光導波路５０４Ａを介して光ファイバアレイ５２０Ａに伝えられる。 In the optical communication module 510B, the VCSEL 505 converts the electrical signal into an optical signal. The converted optical signals are emitted from the plurality of VCSELs 505 and transmitted to the optical fiber array 520A via the lens substrate 530A and the optical waveguide 504A of the optical connector 510A.
　しかしながら、光結合器５００のようにＶＣＳＥＬ５０５のレーザアレイを用いた場合、各ＶＣＳＥＬ５０５間で十分にアイソレーションをとることができないという問題がある。これについて、特許文献２に記載のＶＣＳＥＬ６００を例に詳細を説明する。図１８は、特許文献２に記載のＶＣＳＥＬの断面図である。 However, when a VCSEL 505 laser array such as the optical coupler 500 is used, there is a problem that sufficient isolation cannot be obtained between the VCSELs 505. This will be described in detail using the VCSEL 600 described in Patent Document 2 as an example. FIG. 18 is a cross-sectional view of a VCSEL described in Patent Document 2.
　ＶＣＳＥＬ６００の概略的な構造は、図１８に示すように、裏面にカソード電極６３０が形成されたＮ型半導体基板６１２の上に、第１ＤＢＲ（多層分布ブラッグ反射器）層６１４が形成されている。第１ＤＢＲ層６１４の上層には第１スペーサ層６１６が形成されている。第１スペーサ層６１６の上層には、量子井戸を備える活性層６１８が形成されている。活性層６１８の上層には、第２スペーサ層６２０が形成されている。第２スペーサ層６２０の上層には、第２ＤＢＲ層６２２が形成されている。第２ＤＢＲ層６２２の上層には、アノード電極６２８が形成されている。そして、アノード電極６２８とカソード電極６３０との間に駆動信号が印加されることで、基板に垂直な（積層方向に平行な）方向へ鋭い指向性を有するレーザが発生する。 As shown in FIG. 18, the schematic structure of the VCSEL 600 includes a first DBR (Multilayer Distributed Bragg Reflector) layer 614 formed on an N-type semiconductor substrate 612 having a cathode electrode 630 formed on the back surface. A first spacer layer 616 is formed on the first DBR layer 614. An active layer 618 having a quantum well is formed on the first spacer layer 616. A second spacer layer 620 is formed on the active layer 618. A second DBR layer 622 is formed on the second spacer layer 620. An anode electrode 628 is formed on the second DBR layer 622. Then, when a drive signal is applied between the anode electrode 628 and the cathode electrode 630, a laser having sharp directivity in a direction perpendicular to the substrate (parallel to the stacking direction) is generated.
　上述した一つのＮ型半導体基板６１２上に複数のＶＣＳＥＬ６００を形成（アレイ化）すると、各ＶＣＳＥＬ６００に与える各駆動信号が、Ｎ型半導体基板６１２内に漏洩する。これにより、各ＶＣＳＥＬ６００間で駆動信号のクロストークが発生する。従って、各ＶＣＳＥＬ６００間で十分にアイソレーションをとることができない。 When a plurality of VCSELs 600 are formed (arrayed) on one N-type semiconductor substrate 612 described above, each drive signal applied to each VCSEL 600 leaks into the N-type semiconductor substrate 612. As a result, crosstalk of drive signals occurs between the VCSELs 600. Therefore, sufficient isolation cannot be obtained between the VCSELs 600.
特開２００８－１５８００１号公報JP 2008-158001 A 特表２００３－５０８９２８号公報Special table 2003-508928 gazette
　そこで、本発明の目的は、各ＶＣＳＥＬ間のアイソレーションを確保できるレセプタクル及び光伝送モジュールを提供することである。 Therefore, an object of the present invention is to provide a receptacle and an optical transmission module that can ensure isolation between VCSELs.
　本発明の一の形態に係るレセプタクルは、光ファイバーの一端に設けられたプラグが接続されるレセプタクルであって、複数の垂直共振器面発光レーザが一体化されてなる発光素子アレイと、複数の前記光ファイバーのコアと複数の前記垂直共振器面発光レーザとをそれぞれ光学的に結合させる位置決め部材と、前記発光素子アレイが実装される実装基板と、を備え、前記発光素子アレイは、ベース基板と、該ベース基板の表面に形成された、Ｎ型半導体多層膜反射層、量子井戸を備える活性層及びＰ型半導体多層膜反射層を含む発光領域多層部と、前記Ｐ型半導体多層膜反射層に接続されるアノード用電極と、前記Ｎ型半導体多層膜反射層に接続されるカソード用電極と、を備え、前記ベース基板の少なくとも前記発光領域多層部側の所定部分が、半絶縁性半導体からなり、前記カソード用電極は、前記ベース基板の表面側に形成されており、前記発光領域多層部、前記アノード用電極及び前記カソード用電極からなる垂直共振器面発光レーザの組は、前記ベース基板に複数形成されていること、を特徴とする。 A receptacle according to an aspect of the present invention is a receptacle to which a plug provided at one end of an optical fiber is connected, and a light emitting element array in which a plurality of vertical cavity surface emitting lasers are integrated; A positioning member that optically couples an optical fiber core and the plurality of vertical cavity surface emitting lasers, and a mounting substrate on which the light emitting element array is mounted, the light emitting element array including a base substrate; A light emitting region multilayer portion including an N-type semiconductor multilayer reflective layer, an active layer having a quantum well and a P-type semiconductor multilayer reflective layer formed on the surface of the base substrate, and connected to the P-type semiconductor multilayer reflective layer An anode electrode, and a cathode electrode connected to the N-type semiconductor multilayer film reflective layer, at least on the light emitting region multilayer portion side of the base substrate The portion is made of a semi-insulating semiconductor, and the cathode electrode is formed on the surface side of the base substrate, and the vertical cavity surface emitting device includes the light emitting region multilayer portion, the anode electrode, and the cathode electrode. A plurality of sets of lasers are formed on the base substrate.
　本発明の一の形態に係る光伝送モジュールは、前記レセプタクルと、前記光ファイバーの先端に設けられたプラグと、を更に備え、前記プラグには、前記光ファイバーの光軸上に存在し、かつ、前記位置決め部材と対向する第３の凸レンズが設けられていること、を特徴とする。 An optical transmission module according to an aspect of the present invention further includes the receptacle and a plug provided at a tip of the optical fiber, wherein the plug exists on an optical axis of the optical fiber, and A third convex lens facing the positioning member is provided.
　本発明に係るレセプタクル及び光伝送モジュールによれば、各ＶＣＳＥＬ間のアイソレーションを確保できる。 According to the receptacle and the optical transmission module according to the present invention, it is possible to ensure isolation between the VCSELs.
本発明の一実施形態に係る光伝送モジュールの外観斜視図である。1 is an external perspective view of an optical transmission module according to an embodiment of the present invention. 本発明の一実施形態に係るレセプタクルの分解斜視図である。It is a disassembled perspective view of the receptacle which concerns on one Embodiment of this invention. 本発明の一実施形態に係るレセプタクルから金属キャップ及び位置決め部材を除いた外観斜視図である。It is an external appearance perspective view which removed the metal cap and the positioning member from the receptacle which concerns on one Embodiment of this invention. 本発明の一実施形態に係る発光素子アレイをｚ軸方向の正方向側から平面視した図である。It is the figure which planarly viewed the light emitting element array which concerns on one Embodiment of this invention from the positive direction side of az axis direction. 図４に記載の発光素子アレイのＡ－Ａ又はＢ－Ｂにおける断面図である。FIG. 5 is a cross-sectional view taken along the line AA or BB of the light emitting element array illustrated in FIG. 4. 本発明の一実施形態に係るレセプタクルから金属キャップを除いた状態の外観斜視図である。It is an external appearance perspective view of the state which removed the metal cap from the receptacle which concerns on one Embodiment of this invention. 本発明の一実施形態に係る位置決め部材の外観斜視図である。It is an appearance perspective view of a positioning member concerning one embodiment of the present invention. 本発明の一実施形態に係る位置決め部材をｚ軸方向の負方向側から平面視した図である。It is the figure which planarly viewed the positioning member which concerns on one Embodiment of this invention from the negative direction side of az axis direction. 図７に記載の位置決め部材のＣ－Ｃ又はＤ－Ｄにおける断面に、本発明の一実施形態に係る実装基板及びプラグを追加した図である。FIG. 8 is a diagram in which a mounting board and a plug according to an embodiment of the present invention are added to a cross section taken along the line CC or DD of the positioning member illustrated in FIG. 7. 本発明の一実施形態に係る金属キャップの外観斜視図である。It is an external appearance perspective view of the metal cap which concerns on one Embodiment of this invention. 本発明の一実施形態に係るプラグの外観斜視図である。1 is an external perspective view of a plug according to an embodiment of the present invention. 本発明の一実施形態に係るプラグをｚ軸方向の負方向側から平面視した図である。It is the figure which planarly viewed the plug which concerns on one Embodiment of this invention from the negative direction side of az axis direction. 本発明の一実施形態に係るレセプタクルの製造工程の図である。It is a figure of the manufacturing process of the receptacle which concerns on one Embodiment of this invention. 従来のレセプタクル及びプラグの断面図である。It is sectional drawing of the conventional receptacle and plug. 従来のレセプタクルの製造工程の図である。It is a figure of the manufacturing process of the conventional receptacle. 本発明の一実施形態の変形例に係る位置決め部材の断面に、本発明の一実施形態に係る実装基板及びプラグを追加した図である。It is the figure which added the mounting substrate and plug which concern on one Embodiment of this invention to the cross section of the positioning member which concerns on the modification of one Embodiment of this invention. 特許文献１に記載の光結合器の分解斜視図である。10 is an exploded perspective view of an optical coupler described in Patent Document 1. FIG. 特許文献２に記載のＶＣＳＥＬの断面図である。It is sectional drawing of VCSEL of patent document 2. FIG.
　以下に、本発明の一実施形態に係るレセプタクル、光伝送モジュール及びその製造方法について説明する。 Hereinafter, a receptacle, an optical transmission module, and a manufacturing method thereof according to an embodiment of the present invention will be described.
（光伝送モジュールの構成）
　以下に、本発明の実施形態に係るレセプタクル及び光伝送モジュールの構成について、図面を参照しながら説明する。図１は、本発明の一実施形態に係る光伝送モジュール１０の外観斜視図である。図２は、本発明の一実施形態に係るレセプタクル２０の分解斜視図である。図３は、本発明の一実施形態に係るレセプタクル２０から金属キャップ３０及び位置決め部材２００を除いた外観斜視図である。なお、光伝送モジュール１０の上下方向をｚ軸方向と定義し、z軸方向から平面視したときに、光伝送モジュール１０の長辺に沿った方向をｘ軸方向と定義する。さらに、光伝送モジュール１０の短辺に沿った方向をｙ軸方向と定義する。ｘ軸、ｙ軸及びｚ軸は互いに直交している。 (Configuration of optical transmission module)
Hereinafter, configurations of a receptacle and an optical transmission module according to an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is an external perspective view of an optical transmission module 10 according to an embodiment of the present invention. FIG. 2 is an exploded perspective view of the receptacle 20 according to the embodiment of the present invention. FIG. 3 is an external perspective view in which the metal cap 30 and the positioning member 200 are removed from the receptacle 20 according to the embodiment of the present invention. Note that the vertical direction of the light transmission module 10 is defined as the z-axis direction, and the direction along the long side of the light transmission module 10 when viewed in plan from the z-axis direction is defined as the x-axis direction. Furthermore, the direction along the short side of the optical transmission module 10 is defined as the y-axis direction. The x axis, the y axis, and the z axis are orthogonal to each other.
　光伝送モジュール１０は、図１に示すように、レセプタクル２０及びプラグ４０を備えている。なお、プラグ４０は、レセプタクル２０に接続される。 The optical transmission module 10 includes a receptacle 20 and a plug 40 as shown in FIG. The plug 40 is connected to the receptacle 20.
　レセプタクル２０は、図２に示すように、金属キャップ３０、受光素子アレイ５０、発光素子アレイ１００、位置決め部材２００、実装基板２２及び封止樹脂２４を備えている。 The receptacle 20 includes a metal cap 30, a light receiving element array 50, a light emitting element array 100, a positioning member 200, a mounting substrate 22, and a sealing resin 24, as shown in FIG.
　実装基板２２は、図３に示すように、ｚ軸方向から平面視したとき、矩形状を成している。また、実装基板２２のｚ軸方向の負方向側の面（以下で「ｚ軸方向の負方向側の面」を、裏面と称す）には、光伝送モジュール１０を回路基板に実装する際に、回路基板のランドと接触する表面実装用電極Ｅ１（図３には図示せず）が設けられている。 The mounting substrate 22 has a rectangular shape when seen in a plan view from the z-axis direction, as shown in FIG. Further, when the optical transmission module 10 is mounted on the circuit board, the surface of the mounting substrate 22 on the negative side in the z-axis direction (hereinafter, the “surface on the negative direction side in the z-axis direction” is referred to as the back surface). A surface mounting electrode E1 (not shown in FIG. 3) is provided in contact with the land of the circuit board.
　実装基板２２のｚ軸方向の正方向側の面（以下「ｚ軸方向の正方向側の面」を、表面と称す）において、ｘ軸方向の負方向側に位置する辺Ｌ１とｙ軸方向の負方向側に位置する辺Ｌ２とが成す角の近傍には、実装基板２２内に設けられたグランド導体の一部が露出しているグランド導体露出部Ｅ２が設けられている。グランド導体露出部Ｅ２は、ｚ軸方向の正方向側から平面視したとき、ｘ軸方向を長辺とする長方形状を成している。 The side L1 located on the negative direction side in the x-axis direction and the y-axis direction on the surface on the positive direction side in the z-axis direction of the mounting substrate 22 (hereinafter referred to as “surface on the positive direction side in the z-axis direction”) In the vicinity of an angle formed by the side L2 located on the negative direction side, a ground conductor exposed portion E2 in which a part of the ground conductor provided in the mounting substrate 22 is exposed is provided. The ground conductor exposed portion E2 has a rectangular shape having a long side in the x-axis direction when viewed from the positive side in the z-axis direction.
　さらに、実装基板２２の表面において、ｘ軸方向の負方向側に位置する辺Ｌ１とｙ軸方向の正方向側に位置する辺Ｌ３とが成す角の近傍には、実装基板２２内に設けられたグランド導体の一部が露出しているグランド導体露出部Ｅ３が設けられている。グランド導体露出部Ｅ３は、ｚ軸方向の正方向側から平面視したとき、ｘ軸方向を長辺とする長方形状を成している。 Further, on the surface of the mounting substrate 22, the surface is provided in the mounting substrate 22 in the vicinity of an angle formed by the side L <b> 1 positioned on the negative side in the x-axis direction and the side L <b> 3 positioned on the positive direction side in the y-axis direction. A ground conductor exposed portion E3 in which a part of the ground conductor is exposed is provided. The ground conductor exposed portion E3 has a rectangular shape having a long side in the x-axis direction when viewed from the positive side in the z-axis direction.
　受光素子アレイ５０及び発光素子アレイ１００は、実装基板２２の表面におけるｘ軸方向の正方向側の部分に設けられている。受光素子アレイ５０は、光信号を電気信号に変換する複数のフォトダイオードを含んだ素子である。発光素子アレイ１００は、電気信号を光信号に変換する複数のダイオードを含んだ素子である。 The light receiving element array 50 and the light emitting element array 100 are provided on the surface of the mounting substrate 22 on the positive side in the x-axis direction. The light receiving element array 50 is an element including a plurality of photodiodes that convert an optical signal into an electric signal. The light emitting element array 100 is an element including a plurality of diodes that convert an electrical signal into an optical signal.
　また、駆動回路２６は、実装基板２２の表面におけるｘ軸方向の正方向側の部分において、受光素子アレイ５０及び発光素子アレイ１００よりもｘ軸方向の正方向側に設けられている。駆動回路２６は、受光素子アレイ５０及び発光素子アレイ１００を駆動するための半導体回路素子である。 Further, the drive circuit 26 is provided on the positive direction side in the x-axis direction with respect to the light receiving element array 50 and the light emitting element array 100 in the positive direction side portion in the x-axis direction on the surface of the mounting substrate 22. The drive circuit 26 is a semiconductor circuit element for driving the light receiving element array 50 and the light emitting element array 100.
　また、駆動回路２６は、図３に示すように、ｚ軸方向から平面視したとき、ｙ軸方向に平行な長辺を有する矩形状を成している。駆動回路２６と受光素子アレイ５０とは、ワイヤーＵを介してワイヤーボンディングにより接続されている。また、駆動回路２６と発光素子アレイ１００とは、ワイヤーＵを介してワイヤーボンディングにより接続されている。これにより、駆動回路２６からの電気信号が、ワイヤーＵを介して発光素子アレイ１００に伝送され、受光素子アレイ５０からの電気信号が、ワイヤーＵを介して駆動回路２６に伝送される Further, as shown in FIG. 3, the drive circuit 26 has a rectangular shape having a long side parallel to the y-axis direction when viewed in plan from the z-axis direction. The drive circuit 26 and the light receiving element array 50 are connected through wire U by wire bonding. Further, the drive circuit 26 and the light emitting element array 100 are connected to each other by wire bonding via the wire U. As a result, the electrical signal from the drive circuit 26 is transmitted to the light emitting element array 100 via the wire U, and the electrical signal from the light receiving element array 50 is transmitted to the drive circuit 26 via the wire U.
　封止樹脂２４は、図３に示すように、封止部２４ａ及び脚部２４ｂ～２４ｅを備えており、エポキシ樹脂などの透明な樹脂からなる。封止部２４ａは、略直方体状をなしており、実装基板２２の表面におけるｘ軸方向の正方向側の部分に設けられている。封止部２４ａは、受光素子アレイ５０、発光素子アレイ１００及び駆動回路２６を覆っている。 As shown in FIG. 3, the sealing resin 24 includes a sealing portion 24a and leg portions 24b to 24e, and is made of a transparent resin such as an epoxy resin. The sealing portion 24 a has a substantially rectangular parallelepiped shape, and is provided in a portion on the positive direction side in the x-axis direction on the surface of the mounting substrate 22. The sealing portion 24 a covers the light receiving element array 50, the light emitting element array 100, and the drive circuit 26.
　脚部２４ｂ，２４ｃは、ｘ軸方向の負方向側から正方向側にこの順に並ぶように、間隔を空けて設けられている。脚部２４ｂ，２４ｃは、封止部２４ａのｙ軸方向の負方向側の面から、実装基板２２の辺Ｌ２に向かって突出する直方体状の部材である。また、脚部２４ｂと脚部２４ｃとの間には、後述する金属キャップ３０の凸部Ｃ３が嵌め込まれる空間Ｈ１が設けられている。 The leg portions 24b and 24c are provided at intervals so as to be arranged in this order from the negative direction side in the x-axis direction to the positive direction side. The leg portions 24b and 24c are rectangular parallelepiped members that protrude toward the side L2 of the mounting substrate 22 from the negative side surface in the y-axis direction of the sealing portion 24a. Further, a space H1 into which a convex portion C3 of a metal cap 30 described later is fitted is provided between the leg portion 24b and the leg portion 24c.
　脚部２４ｄ，２４ｅは、ｘ軸方向の負方向側から正方向側にこの順に並ぶように、間隔を空けて設けられている。脚部２４ｄ，２４ｅは、封止部２４ａのｙ軸方向の正方向側の面から、実装基板２２の辺Ｌ３に向けて突出する直方体状の部材である。また、脚部２４ｄと脚部２４ｅとの間には、後述する金属キャップ３０の凸部Ｃ６が嵌めこまれる空間Ｈ２が設けられている。 The leg portions 24d and 24e are provided at intervals so as to be arranged in this order from the negative direction side to the positive direction side in the x-axis direction. The leg portions 24d and 24e are rectangular parallelepiped members that protrude toward the side L3 of the mounting substrate 22 from the surface on the positive side in the y-axis direction of the sealing portion 24a. Further, a space H2 is provided between the leg portion 24d and the leg portion 24e in which a convex portion C6 of the metal cap 30 described later is fitted.
（発光素子アレイの構成）
　次に、発光素子アレイ１００について、図面を参照しながら説明する。図４は、本発明の一実施形態に係る発光素子アレイ１００をｚ軸方向の正方向側から平面視した図である。図５は、図４に記載の発光素子アレイ１００のＡ－Ａ又はＢ－Ｂにおける断面図である。なお、本実施形態では、２つのＶＣＳＥＬ１００Ａ，１００Ｂのみが記載されているが、本願発明の発光素子アレイ１００を構成するＶＣＳＥＬの個数は、これに限るものではない。 (Configuration of light emitting element array)
Next, the light emitting element array 100 will be described with reference to the drawings. FIG. 4 is a plan view of the light emitting element array 100 according to an embodiment of the present invention as seen from the positive side in the z-axis direction. FIG. 5 is a cross-sectional view taken along line AA or BB of the light emitting element array 100 shown in FIG. In the present embodiment, only two VCSELs 100A and 100B are described, but the number of VCSELs constituting the light emitting element array 100 of the present invention is not limited to this.
　発光素子アレイ１００は、図４に示すように、２つのＶＣＳＥＬ１００Ａ，１００Ｂを備えている。すなわち、ＶＣＳＥＬ１００Ａ，１００Ｂが一体化してアレイ化されており、ＶＣＳＥＬ１００Ａ，１００Ｂはそれぞれ独立に駆動する。また、各ＶＣＳＥＬ１００Ａ，１００Ｂからは、ｚ軸方向の正方向側に向かって、レーザービームＢ１が出射される。２つのＶＣＳＥＬ１００Ａ，１００Ｂは、図５に示すように、共通のベース基板１２８の表面に設けられている。 The light emitting element array 100 includes two VCSELs 100A and 100B as shown in FIG. That is, the VCSELs 100A and 100B are integrated and arrayed, and the VCSELs 100A and 100B are driven independently. Further, a laser beam B1 is emitted from each VCSEL 100A, 100B toward the positive direction side in the z-axis direction. The two VCSELs 100A and 100B are provided on the surface of a common base substrate 128 as shown in FIG.
　ベース基板１２８は、半絶縁性半導体からなり、具体的には、ＧａＡｓを材料とする基板からなる。ベース基板１２８は、抵抗率が１．０×１０7Ω・ｃｍ以上であることが好ましい。このような抵抗率の半絶縁性半導体からなるベース基板１２８を用いることにより、ＶＣＳＥＬ１００ＡとＶＣＳＥＬ１００Ｂとの間のアイソレーションをより高く確保することができる。 The base substrate 128 is made of a semi-insulating semiconductor, specifically, a substrate made of GaAs. The base substrate 128 preferably has a resistivity of 1.0 × 10 7 Ω · cm or more. By using the base substrate 128 made of a semi-insulating semiconductor having such a resistivity, higher isolation can be ensured between the VCSEL 100A and the VCSEL 100B.
　ベース基板１２８の表面には、図５に示すように、Ｎ型半導体コンタクト層１３０が積層されている。Ｎ型半導体コンタクト層１３０は、ＶＣＳＥＬ１００Ａ，１００Ｂのそれぞれに一つずつ設けられている。そして、ＶＣＳＥＬ１００ＡのＮ型半導体コンタクト層１３０とＶＣＳＥＬ１００ＢのＮ型半導体コンタクト層１３０とは互いに絶縁されている。なお、Ｎ型半導体コンタクト層１３０は、Ｎ型の導電性を有する化合物半導体から成る。 As shown in FIG. 5, an N-type semiconductor contact layer 130 is laminated on the surface of the base substrate 128. One N-type semiconductor contact layer 130 is provided for each of the VCSELs 100A and 100B. The N-type semiconductor contact layer 130 of the VCSEL 100A and the N-type semiconductor contact layer 130 of the VCSEL 100B are insulated from each other. The N-type semiconductor contact layer 130 is made of a compound semiconductor having N-type conductivity.
　Ｎ型半導体コンタクト層１３０の表面には、図５に示すように、Ｎ型半導体多層膜反射層（以下で、Ｎ型ＤＢＲ層と称す）１３２が積層されている。また、Ｎ型ＤＢＲ層１３２には、ｚ軸方向の正方向側から平面視したとき、円弧状の溝Ｗが設けられている。溝Ｗは、ＶＣＳＥＬ１００Ａ，１００Ｂそれぞれの中央付近ｘ軸方向の負方向側において半周している。溝Ｗの底部は、Ｎ型半導体コンタクト層１３０の表面まで到達している。Ｎ型ＤＢＲ層１３２は、ＡｌＧａＡｓからなり、Ｇａに対するＡｌの組成比率が異なる層を複数積層して構成されている。これにより、Ｎ型ＤＢＲ層１３２は、所定周波数のレーザ光を発生するための第１の反射器として機能する。なお、Ｎ型ＤＢＲ層１３２は、Ｎ型半導体コンタクト層を兼ねてもよい。すなわち、Ｎ型半導体コンタクト層は必須ではない。 On the surface of the N-type semiconductor contact layer 130, as shown in FIG. 5, an N-type semiconductor multilayer reflective layer (hereinafter referred to as an N-type DBR layer) 132 is laminated. Further, the N-type DBR layer 132 is provided with an arc-shaped groove W when viewed from the positive side in the z-axis direction. The groove W has a half circumference near the center of each of the VCSELs 100A and 100B on the negative direction side in the x-axis direction. The bottom of the trench W reaches the surface of the N-type semiconductor contact layer 130. The N-type DBR layer 132 is made of AlGaAs and is formed by stacking a plurality of layers having different composition ratios of Al to Ga. Thereby, the N-type DBR layer 132 functions as a first reflector for generating laser light having a predetermined frequency. Note that the N-type DBR layer 132 may also serve as an N-type semiconductor contact layer. That is, the N-type semiconductor contact layer is not essential.
　Ｎ型ＤＢＲ層１３２の表面には、図５に示すように、Ｎ型半導体クラッド層１３４が積層されている。Ｎ型半導体クラッド層１３４は、ｚ軸方向から平面視したときに、ＶＣＳＥＬ１００Ａ，１００Ｂの中心に設けられており、円形をなしている。各Ｎ型半導体クラッド層１３４同士は、互いに絶縁されている。Ｎ型半導体クラッド層１３４は、ＡｌＧａＡｓからなる。 As shown in FIG. 5, an N-type semiconductor clad layer 134 is laminated on the surface of the N-type DBR layer 132. The N-type semiconductor clad layer 134 is provided at the center of the VCSELs 100A and 100B when viewed in plan from the z-axis direction, and has a circular shape. The N-type semiconductor clad layers 134 are insulated from each other. The N-type semiconductor clad layer 134 is made of AlGaAs.
　Ｎ型半導体クラッド層１３４の表面には、図５に示すように、活性層１３６が設けられている。また、活性層１３６は、ＧａＡｓ及びＡｌＧａＡｓからなる。また、ＧａＡｓ層は、ＡｌＧａＡｓ層に挟まれて設けられている。なお、ＡｌＧａＡｓのエネルギー禁止帯幅は、ＧａＡｓよりも大きい。また、ＧａＡｓの屈折率は、ＡｌＧａＡｓよりも大きい。 As shown in FIG. 5, an active layer 136 is provided on the surface of the N-type semiconductor clad layer 134. The active layer 136 is made of GaAs and AlGaAs. The GaAs layer is provided between the AlGaAs layers. Incidentally, the energy band gap of AlGaAs is larger than that of GaAs. Moreover, the refractive index of GaAs is larger than that of AlGaAs.
　活性層１３６の表面には、図５に示すように、Ｐ型半導体クラッド層１３８が設けられている。Ｐ型半導体クラッド層１３８は、ＡｌＧａＡｓからなる。 As shown in FIG. 5, a P-type semiconductor clad layer 138 is provided on the surface of the active layer 136. The P-type semiconductor clad layer 138 is made of AlGaAs.
　Ｐ型半導体クラッド層１３８の表面には、図５に示すように、酸化狭窄層１５０が設けられている。酸化狭窄層１５０をｚ軸方向から平面視したとき、酸化狭窄層１５０の略中央には円形の孔１５２が設けられている。酸化狭窄層１５０は、ＡｌＧａＡｓからなる。 An oxidized constricting layer 150 is provided on the surface of the P-type semiconductor clad layer 138 as shown in FIG. When the oxidized constricting layer 150 is viewed in plan from the z-axis direction, a circular hole 152 is provided in the approximate center of the oxidized constricting layer 150. The oxidized constricting layer 150 is made of AlGaAs.
　酸化狭窄層１５０の表面には、図５に示すように、Ｐ型半導体多層膜反射層（以下で、Ｐ型ＤＢＲ層と称す）１４０が設けられている。また、Ｐ型ＤＢＲ層１４０の一部は、酸化狭窄層に設けられた孔１５２内にも設けられ、Ｐ型半導体クラッド層１３８と接している。Ｐ型ＤＢＲ層１４０は、ＡｌＧａＡｓからなり、Ｇａに対するＡｌの組成比率が異なる層を複数積層してなる。これにより、Ｐ型ＤＢＲ層１４０は、所定周波数のレーザ光を発生するための第２の反射器として機能する。なお、Ｐ型ＤＢＲ層１４０の反射率は、Ｎ型ＤＢＲ層１３２よりも若干低い。ここでは、活性層を挟むように半導体クラッド層を設けたが、この構成に限るものではない。共振を発生させるような膜厚の層を活性層に設けてもよい。 As shown in FIG. 5, a P-type semiconductor multilayer reflective layer (hereinafter referred to as a P-type DBR layer) 140 is provided on the surface of the oxidized constricting layer 150. A part of the P-type DBR layer 140 is also provided in the hole 152 provided in the oxidized constricting layer, and is in contact with the P-type semiconductor clad layer 138. The P-type DBR layer 140 is made of AlGaAs and is formed by laminating a plurality of layers having different Al composition ratios to Ga. Thereby, the P-type DBR layer 140 functions as a second reflector for generating laser light having a predetermined frequency. Note that the reflectance of the P-type DBR layer 140 is slightly lower than that of the N-type DBR layer 132. Here, the semiconductor clad layer is provided so as to sandwich the active layer, but the present invention is not limited to this configuration. A layer having such a thickness as to generate resonance may be provided in the active layer.
　Ｐ型ＤＢＲ層１４０の表面には、図５に示すように、Ｐ型半導体コンタクト層１４２が積層されている。Ｐ型半導体コンタクト層１４２は、Ｐ型導電性を有する化合物半導体からなる。なお、Ｐ型ＤＢＲ層は、Ｐ型半導体コンタクト層を兼ねてもよい。すなわち、Ｐ型半導体コンタクト層は必須ではない。 As shown in FIG. 5, a P-type semiconductor contact layer 142 is laminated on the surface of the P-type DBR layer 140. The P-type semiconductor contact layer 142 is made of a compound semiconductor having P-type conductivity. Note that the P-type DBR layer may also serve as a P-type semiconductor contact layer. That is, the P-type semiconductor contact layer is not essential.
　以上で述べた、Ｎ型半導体コンタクト層１３０、Ｎ型ＤＢＲ層１３２、Ｎ型半導体クラッド層１３４、活性層１３６、Ｐ型半導体クラッド層１３８、Ｐ型ＤＢＲ層１４０、Ｐ型半導体コンタクト層１４２によって、発光領域多層部１６０が構成される。 By the N-type semiconductor contact layer 130, the N-type DBR layer 132, the N-type semiconductor clad layer 134, the active layer 136, the P-type semiconductor clad layer 138, the P-type DBR layer 140, and the P-type semiconductor contact layer 142 described above, A light emitting region multilayer section 160 is configured.
　なお、各層の厚み及びＧａに対するＡｌの組成比率は、光定在波分布の中心の腹の位置に１つの発光スペクトルピーク波長を有し、かつ、複数の量子井戸が配置されるように、設定される。これにより、発光領域多層部１６０がＶＣＳＥＬ１００Ａ，１００Ｂの発光部として機能する。さらに、図５に示すように、酸化狭窄層１５０を備えることで、電流を活性層１３６に効率よく注入でき、低消費電力のＶＣＳＥＬ１００Ａ，１００Ｂを実現できる。 The thickness of each layer and the composition ratio of Al to Ga are set so as to have one emission spectrum peak wavelength at the center antinode position of the optical standing wave distribution and to arrange a plurality of quantum wells. Is done. Thereby, the light emitting region multilayer part 160 functions as the light emitting part of the VCSELs 100A and 100B. Furthermore, as shown in FIG. 5, by providing the oxide constriction layer 150, current can be efficiently injected into the active layer 136, and the VCSELs 100A and 100B with low power consumption can be realized.
　Ｐ型半導体コンタクト層１４２の表面には、図５に示すように、アノード用リング電極９２１が設けられている。アノード用リング電極９２１は、図４に示すように、ｚ軸方向から平面視したとき、環状を成している。なお、アノード用電極は、必ずしも環状である必要はなく、例えば環状の一部が開いたＣ字状や矩形状であってもよい。 As shown in FIG. 5, an anode ring electrode 921 is provided on the surface of the P-type semiconductor contact layer 142. As shown in FIG. 4, the anode ring electrode 921 has an annular shape when viewed in plan from the z-axis direction. Note that the anode electrode does not necessarily have to be annular, and may be, for example, a C-shape or a rectangular shape with an annular portion open.
　前述のＮ型ＤＢＲ層１３２の溝Ｗには、図４及び図５に示すように、カソード用電極９１１が設けられている。なお、カソード用電極９１１は、図５に示すように、Ｎ型半導体コンタクト層１３０と接している。これにより、カソード用電極９１１は、Ｎ型半導体コンタクト層１３０と導通している。なお、カソード用電極９１１は、図４に示すように、ｚ軸方向から平面視したとき、円弧状を成している。また、この円弧は、環状のアノード用リング電極９２１の環と略同心である。 As shown in FIGS. 4 and 5, a cathode electrode 911 is provided in the groove W of the N-type DBR layer 132 described above. The cathode electrode 911 is in contact with the N-type semiconductor contact layer 130 as shown in FIG. Thereby, the cathode electrode 911 is electrically connected to the N-type semiconductor contact layer 130. As shown in FIG. 4, the cathode electrode 911 has an arc shape when viewed in plan from the z-axis direction. The arc is substantially concentric with the ring of the annular anode ring electrode 921.
　絶縁膜１６２は、カソード用電極９１１及びアノード用リング電極９２１が設けられている部分を除いて、ＶＣＳＥＬ１００Ａ，１００Ｂの発光領域多層部１６０の表面を覆うように設けられている。また、絶縁膜１６２の材料は、例えば窒化ケイ素が挙げられる。 The insulating film 162 is provided so as to cover the surface of the light emitting region multilayer 160 of the VCSELs 100A and 100B except for the portion where the cathode electrode 911 and the anode ring electrode 921 are provided. The material of the insulating film 162 is, for example, silicon nitride.
　ＶＣＳＥＬ１００Ａ，１００Ｂにおけるｘ軸方向の正方向側の部分には、図４に示すように、絶縁層１７０が設けられている。また、絶縁層１７０は、図５に示すように、Ｎ型ＤＢＲ層１３２を覆う絶縁膜１６２上に設けられている。絶縁層１７０は、図４に示すように、ｚ軸方向から平面視たとき、ｙ軸方向に長辺を有する矩形状を成している。なお、絶縁層１７０の材料としては、例えばポリイミドが挙げられる。 As shown in FIG. 4, an insulating layer 170 is provided on the positive side of the x-axis direction in the VCSELs 100A and 100B. Further, as shown in FIG. 5, the insulating layer 170 is provided on the insulating film 162 covering the N-type DBR layer 132. As shown in FIG. 4, the insulating layer 170 has a rectangular shape having long sides in the y-axis direction when viewed in plan from the z-axis direction. An example of the material of the insulating layer 170 is polyimide.
　絶縁層１７０の表面におけるｙ軸方向の負方向側の部分には、図４に示すように、カソード用パッド電極９１２が、設けられている。カソード用パッド電極９１２は、カソード用配線電極９１３を介して、カソード用電極９１１に接続されている。 As shown in FIG. 4, a cathode pad electrode 912 is provided on a portion of the surface of the insulating layer 170 on the negative side in the y-axis direction. The cathode pad electrode 912 is connected to the cathode electrode 911 via the cathode wiring electrode 913.
　絶縁層１７０の表面におけるｙ軸方向の正方向側の部分には、図４に示すように、アノード用パッド電極９２２が設けられている。なお、アノード用パッド電極９２２とカソード用パッド電極９１２とは、所定の距離だけ離されて設けられている。アノード用パッド電極９２２は、アノード用配線電極９２３を介して、アノード用リング電極９２１に接続されている。 As shown in FIG. 4, an anode pad electrode 922 is provided on a portion on the positive side in the y-axis direction on the surface of the insulating layer 170. The anode pad electrode 922 and the cathode pad electrode 912 are provided apart from each other by a predetermined distance. The anode pad electrode 922 is connected to the anode ring electrode 921 through the anode wiring electrode 923.
　また、発光素子アレイ１００には、図４及び図５に示すように、ＶＣＳＥＬ１００Ａ，１００Ｂを分割するための溝１８０が設けられている。溝１８０は、図４に示すように、ｚ軸方向から平面視したとき、ｘ軸方向及びｙ軸方向に平行な格子状に設けられた溝である。また、溝１８０は、図５に示すように、絶縁膜１６２、Ｎ型ＤＢＲ層１３２及びＮ型半導体コンタクト層１３０を積層方向に貫通している。さらに、溝１８０の底部は、ベース基板１２８の表面から所定の深さまで達している。これにより、ＶＣＳＥＬ１００Ａ，１００Ｂが、Ｎ型半導体コンタクト層１３０を介して導通することを防ぐことができる。 Further, as shown in FIGS. 4 and 5, the light emitting element array 100 is provided with grooves 180 for dividing the VCSELs 100A and 100B. As shown in FIG. 4, the grooves 180 are grooves provided in a lattice shape parallel to the x-axis direction and the y-axis direction when viewed in plan from the z-axis direction. Further, as shown in FIG. 5, the trench 180 penetrates the insulating film 162, the N-type DBR layer 132, and the N-type semiconductor contact layer 130 in the stacking direction. Further, the bottom of the groove 180 reaches a predetermined depth from the surface of the base substrate 128. As a result, the VCSELs 100A and 100B can be prevented from conducting via the N-type semiconductor contact layer 130.
　以上のように構成された発光素子アレイ１００の各ＶＣＳＥＬ１００Ａ，１００Ｂでは、アノード用パッド電極９２２からカソード用パッド電極９１２に向かって電流（駆動信号）を流すことにより、活性層１３６で誘導放出が起きる。誘導放出により活性層から放たれた光は、Ｎ型ＤＢＲ層１３２及びＰ型ＤＢＲ層１４０で反射され、活性層を往復する。往復する間に光は、誘導放出により増幅され、レーザービームとなってｚ軸方向の正方向側へと放出される。そして、ＶＣＳＥＬ１００ＡのＮ型半導体コンタクト層１３０とＶＣＳＥＬ１００ＢのＮ型半導体コンタクト層１３０とが分離されているので、ＶＣＳＥＬ１００Ａの駆動信号とＶＣＳＥＬ１００Ｂの駆動信号との間でクロストークが発生することが抑制される。 In each VCSEL 100A, 100B of the light emitting element array 100 configured as described above, stimulated emission occurs in the active layer 136 by flowing a current (drive signal) from the anode pad electrode 922 to the cathode pad electrode 912. . The light emitted from the active layer by stimulated emission is reflected by the N-type DBR layer 132 and the P-type DBR layer 140 and reciprocates through the active layer. During the reciprocation, the light is amplified by stimulated emission and is emitted as a laser beam to the positive side in the z-axis direction. Since the N-type semiconductor contact layer 130 of the VCSEL 100A and the N-type semiconductor contact layer 130 of the VCSEL 100B are separated, the occurrence of crosstalk between the drive signal of the VCSEL 100A and the drive signal of the VCSEL 100B is suppressed. .
（位置決め部材の構成）
　次に、レセプタクル２０について、図面を参照しながら説明する。図６は、本発明の一実施形態に係るレセプタクル２０の外観斜視図である（金属キャップ３０は図示せず）。図７は、本発明の一実施形態に係る位置決め部材２００の外観斜視図である。図８は、本発明の一実施形態に係る位置決め部材２００をｚ軸方向の負方向側から平面視した図である。図９は、図７に記載の位置決め部材２００のＣ－Ｃ又はＤ－Ｄにおける断面に、本発明の一実施形態に係る実装基板２２及びプラグ４０を追加した図である。 (Configuration of positioning member)
Next, the receptacle 20 will be described with reference to the drawings. FIG. 6 is an external perspective view of the receptacle 20 according to the embodiment of the present invention (the metal cap 30 is not shown). FIG. 7 is an external perspective view of a positioning member 200 according to an embodiment of the present invention. FIG. 8 is a plan view of the positioning member 200 according to one embodiment of the present invention from the negative direction side in the z-axis direction. FIG. 9 is a view in which the mounting substrate 22 and the plug 40 according to the embodiment of the present invention are added to the cross section taken along the line CC or DD of the positioning member 200 shown in FIG.
　位置決め部材２００は、図６に示すように、実装基板２２の表面及び封止樹脂２４の略全体を覆うように、実装基板２２及び封止樹脂２４に跨って設けられている。また、位置決め部材２００は、発光素子用の位置決め部材２２０と受光素子用の位置決め部材２４０とを備えている。位置決め部材２２０，２４０は、ｙ軸方向の負方向側から正方向側に向かってこの順に並ぶように設けられている。なお、位置決め部材２００は、例えばエポキシ系やナイロン系の樹脂により構成されている。 As shown in FIG. 6, the positioning member 200 is provided across the mounting substrate 22 and the sealing resin 24 so as to cover the surface of the mounting substrate 22 and substantially the entire sealing resin 24. The positioning member 200 includes a positioning member 220 for a light emitting element and a positioning member 240 for a light receiving element. The positioning members 220 and 240 are provided so as to be arranged in this order from the negative direction side in the y-axis direction toward the positive direction side. The positioning member 200 is made of, for example, an epoxy or nylon resin.
　発光素子用の位置決め部材２２０は、図７及び図８に示すように、ｚ軸方向から平面視したとき、矩形状を成している。さらに、位置決め部材２２０は、プラグガイド部２２２と光結合部２２４とを備えている。 As shown in FIGS. 7 and 8, the light-emitting element positioning member 220 has a rectangular shape when viewed in plan from the z-axis direction. Further, the positioning member 220 includes a plug guide part 222 and an optical coupling part 224.
　プラグガイド部２２２は、図７に示すように、位置決め部材２２０におけるｘ軸の負方向側の部分を構成している。また、プラグガイド部２２２は、図８に示すように、ｚ軸方向から平面視したとき、矩形状を成している板状部材である。さらに、プラグガイド部２２２のｘ軸方向の正方向側の端面Ｓ１は、図９に示すように、封止樹脂２４のｘ軸方向の負方向側の面と対向している。従って、プラグガイド部２２２は、実装基板２２上において封止樹脂２４よりもｘ軸方向の負方向側に位置している。 As shown in FIG. 7, the plug guide portion 222 constitutes a portion of the positioning member 220 on the negative direction side of the x axis. Further, as shown in FIG. 8, the plug guide portion 222 is a plate-like member having a rectangular shape when viewed in plan from the z-axis direction. Furthermore, the end surface S1 on the positive side in the x-axis direction of the plug guide portion 222 faces the surface on the negative direction side in the x-axis direction of the sealing resin 24 as shown in FIG. Accordingly, the plug guide portion 222 is located on the negative side in the x-axis direction with respect to the sealing resin 24 on the mounting substrate 22.
　また、プラグガイド部２２２の表面におけるｙ軸方向の略中央には、図７に示すように、後述するプラグ４０をガイドするための溝Ｇ１がｘ軸と略平行に設けられている。なお、プラグガイド部２２２において、溝Ｇ１よりｙ軸方向の負方向側の部分を平坦部Ｆ１と称し、溝Ｇ１よりｙ軸方向の正方向側の部分を平坦部Ｆ２と称す。溝Ｇ１のｚ軸方向における実装基板２２からの高さｈ１は、図９に示すように、封止樹脂２４のｚ軸方向の高さｈ２よりも低い。 Further, as shown in FIG. 7, a groove G1 for guiding a plug 40 to be described later is provided substantially parallel to the x-axis at the approximate center in the y-axis direction on the surface of the plug guide portion 222. In the plug guide portion 222, a portion on the negative direction side in the y-axis direction from the groove G1 is referred to as a flat portion F1, and a portion on the positive direction side in the y-axis direction from the groove G1 is referred to as a flat portion F2. As shown in FIG. 9, the height h1 of the groove G1 from the mounting substrate 22 in the z-axis direction is lower than the height h2 of the sealing resin 24 in the z-axis direction.
　光結合部２２４は、図７乃至図９に示すように、位置決め部材２２０におけるｘ軸方向の正方向側の部分を構成し、封止樹脂２４上に載置されている。 As shown in FIGS. 7 to 9, the optical coupling portion 224 constitutes a portion on the positive direction side in the x-axis direction of the positioning member 220 and is placed on the sealing resin 24.
　さらに、光結合部２２４は、図７に示すように、本体２２６及び突き当て部２２８を有している。本体２２６は直方体状を成している。突き当て部２２８は、本体２２６のｘ軸方向の負方向側の端面Ｓ２から、プラグガイド部２２２の平坦部Ｆ１に沿って、平坦部Ｆ１のｘ軸方向の略中央まで突出している。これにより、光結合部２２４は、ｚ軸方向から平面視したときにＬ字型を成している。なお、突き当て部２２８のｘ軸方向の負方向側の端面を端面Ｓ３と称す。また、光結合部２２４には、凹部Ｄ１及び凸レンズ２３０が設けられている。 Furthermore, the optical coupling part 224 has a main body 226 and an abutting part 228 as shown in FIG. The main body 226 has a rectangular parallelepiped shape. The abutting portion 228 protrudes from the end surface S2 on the negative side in the x-axis direction of the main body 226 along the flat portion F1 of the plug guide portion 222 to the approximate center of the flat portion F1 in the x-axis direction. Thereby, the optical coupling part 224 is L-shaped when viewed in plan from the z-axis direction. Note that the end surface of the abutting portion 228 on the negative side in the x-axis direction is referred to as an end surface S3. The optical coupling portion 224 is provided with a concave portion D1 and a convex lens 230.
　凹部Ｄ１は、図７に示すように、光結合部２２４のｙ軸方向の正方向側の辺近傍に設けられている。また、凹部Ｄ１は、ｚ軸方向から平面視したとき、発光素子アレイ１００と重なっている。さらに、凹部Ｄ１は、ｘ軸方向から平面視したとき、後述するプラグ４０に接続されている光ファイバー６０の光軸と重なっている。なお、光ファイバー６０の光軸は、ｘ軸と平行である。また、凹部Ｄ１は、図７に示すように、ｚ軸方向から平面視したとき、矩形状を成している。さらに、凹部Ｄ１は、図９に示すように、ｙ軸方向から平面視したときにＶ字型をなしている。 As shown in FIG. 7, the recess D1 is provided in the vicinity of the side on the positive side of the optical coupling portion 224 in the y-axis direction. In addition, the recess D1 overlaps the light emitting element array 100 when viewed in plan from the z-axis direction. Further, the recess D1 overlaps with the optical axis of the optical fiber 60 connected to the plug 40 described later when viewed in plan from the x-axis direction. Note that the optical axis of the optical fiber 60 is parallel to the x-axis. Further, as shown in FIG. 7, the recess D1 has a rectangular shape when seen in a plan view from the z-axis direction. Furthermore, as shown in FIG. 9, the recess D <b> 1 has a V shape when viewed in plan from the y-axis direction.
　凹部Ｄ１のｘ軸方向の負方向側の内周面は、全反射面Ｒ１である。全反射面Ｒ１は、図９に示すように、ｙ軸に平行である。さらに、全反射面Ｒ１は、ｙ軸方向の負方向側から平面視したとき、ｚ軸に対して反時計回りに４５°傾いている。また、位置決め部材２００の屈折率は、空気よりも十分に大きい。従って、発光素子アレイ１００からｚ軸方向の正方向側に出射されたレーザービームＢ１は、光結合部２２４に入射し、全反射面Ｒ１によりｘ軸方向の負方向側に全反射され、プラグ４０を介して光ファイバー６０へと進行する。このとき、レーザービームＢ１の光跡をｙ軸方向から平面視すると、発光素子アレイ１００から出射されたレーザービームＢ１の光軸と全反射面Ｒ１とが成す角は４５°であり、光ファイバー６０に向かうレーザービームＢ１の光軸と全反射面Ｒ１とが成す角は４５°である。すなわち、全反射面Ｒ１と光ファイバー６０の光軸とが成す角度と、全反射面Ｒ１と発光素子アレイ１００とが成す角度は等しい。 The inner peripheral surface on the negative side in the x-axis direction of the recess D1 is a total reflection surface R1. The total reflection surface R1 is parallel to the y-axis as shown in FIG. Further, the total reflection surface R1 is inclined 45 ° counterclockwise with respect to the z-axis when viewed in plan from the negative direction side in the y-axis direction. Further, the refractive index of the positioning member 200 is sufficiently larger than that of air. Therefore, the laser beam B1 emitted from the light emitting element array 100 to the positive z-axis direction is incident on the optical coupling unit 224, and is totally reflected by the total reflection surface R1 to the negative x-axis side, thereby causing the plug 40 To the optical fiber 60 via At this time, when the light trace of the laser beam B1 is viewed in plan from the y-axis direction, the angle formed by the optical axis of the laser beam B1 emitted from the light emitting element array 100 and the total reflection surface R1 is 45 °. The angle formed by the optical axis of the laser beam B1 toward the total reflection surface R1 is 45 °. That is, the angle formed by the total reflection surface R1 and the optical axis of the optical fiber 60 is equal to the angle formed by the total reflection surface R1 and the light emitting element array 100.
　凸レンズ２３０（第１の凸レンズ）は、図８及び図９に示すように、光結合部２２４のｚ軸方向の負方向側の面に設けられている。また、凸レンズ２３０は、ｚ軸方向から平面視したとき、発光素子アレイ１００の各ＶＣＳＥＬと重なっている。これにより、凸レンズ２３０は、発光素子アレイ１００と対向し、レーザービームＢ１の光路上に位置している。また、凸レンズ２３０は、ｚ軸と直交する方向から平面視したとき、ｚ軸の負方向側に向かって突出する半円状を成している。従って、発光素子アレイ１００から出射されたレーザービームＢ１は、凸レンズ２３０によって集光又はコリメートされて、全反射面Ｒ１に向かう。 The convex lens 230 (first convex lens) is provided on the surface on the negative direction side in the z-axis direction of the optical coupling portion 224, as shown in FIGS. Further, the convex lens 230 overlaps each VCSEL of the light emitting element array 100 when viewed in plan from the z-axis direction. Thereby, the convex lens 230 faces the light emitting element array 100 and is positioned on the optical path of the laser beam B1. In addition, the convex lens 230 has a semicircular shape that protrudes toward the negative direction side of the z-axis when viewed from a direction orthogonal to the z-axis. Accordingly, the laser beam B1 emitted from the light emitting element array 100 is condensed or collimated by the convex lens 230 and travels toward the total reflection surface R1.
　受光素子用の位置決め部材２４０は、図７及び図８に示すように、ｚ軸方向から平面視したとき、矩形状を成している。さらに、位置決め部材２４０は、プラグガイド部２４２と光結合部２４４とを備えている。 As shown in FIGS. 7 and 8, the light receiving element positioning member 240 has a rectangular shape when viewed in plan from the z-axis direction. Further, the positioning member 240 includes a plug guide part 242 and an optical coupling part 244.
　プラグガイド部２４２は、図７に示すように、位置決め部材２４０におけるｘ軸の負方向側の部分を構成している。また、プラグガイド部２４２は、図８に示すように、ｚ軸方向から平面視したとき、矩形状を成している板状部材である。さらに、プラグガイド部２４２のｘ軸方向の正方向側の端面Ｓ４は、図９に示すように、封止樹脂２４のｘ軸方向の負方向側の面と対向している。従って、プラグガイド部２４２は、実装基板２２上において封止樹脂２４よりもｘ軸方向の負方向側に位置している。 As shown in FIG. 7, the plug guide portion 242 constitutes a portion of the positioning member 240 on the negative side of the x axis. Further, as shown in FIG. 8, the plug guide portion 242 is a plate-like member having a rectangular shape when viewed in plan from the z-axis direction. Furthermore, the end surface S4 on the positive direction side in the x-axis direction of the plug guide portion 242 faces the surface on the negative direction side in the x-axis direction of the sealing resin 24 as shown in FIG. Accordingly, the plug guide portion 242 is located on the negative side in the x-axis direction with respect to the sealing resin 24 on the mounting substrate 22.
　また、プラグガイド部２４２の表面におけるｙ軸方向の略中央には、図７に示すように、後述するプラグ４０をガイドするための溝Ｇ２がｘ軸と略平行に設けられている。なお、プラグガイド部２４２において、溝Ｇ２よりｙ軸方向の負方向側の部分を平坦部Ｆ３と称し、溝Ｇ２よりｙ軸方向の正方向側の部分を平坦部Ｆ４と称す。なお、溝Ｇ２のｚ軸方向の高さｈ３は、図９に示すように、封止樹脂２４のｚ軸方向の高さｈ２よりも低い。 Further, as shown in FIG. 7, a groove G2 for guiding a plug 40 to be described later is provided substantially parallel to the x-axis at the approximate center in the y-axis direction on the surface of the plug guide portion 242. In the plug guide portion 242, a portion on the negative side in the y-axis direction from the groove G2 is referred to as a flat portion F3, and a portion on the positive direction side in the y-axis direction from the groove G2 is referred to as a flat portion F4. Note that the height h3 of the groove G2 in the z-axis direction is lower than the height h2 of the sealing resin 24 in the z-axis direction, as shown in FIG.
　光結合部２４４は、図７乃至図９に示すように、位置決め部材２４０におけるｘ軸方向の正方向側の部分を構成し、封止樹脂２４上に載置されている。 7 to 9, the optical coupling portion 244 constitutes a portion on the positive direction side in the x-axis direction of the positioning member 240 and is placed on the sealing resin 24.
　さらに、光結合部２４４は、図７に示すように、本体２４６及び突き当て部２４８を有している。本体２４６は直方体状を成している。突き当て部２４８は、本体２４６のｘ軸方向の負方向側の端面Ｓ５から、プラグガイド部２４２の平坦部Ｆ４に沿って、平坦部Ｆ４のｘ軸方向の略中央まで突出している。これにより、光結合部２４４は、ｚ軸方向から平面視したときにＬ字型を成している。なお、突き当て部２４８のｘ軸方向の負方向側の端面を端面Ｓ６と称す。また、光結合部２４４には、凹部Ｄ２及び凸レンズ２５０が設けられている。 Furthermore, the optical coupling part 244 has a main body 246 and an abutting part 248 as shown in FIG. The main body 246 has a rectangular parallelepiped shape. The abutting portion 248 protrudes from the end surface S5 on the negative side in the x-axis direction of the main body 246 to the approximate center in the x-axis direction of the flat portion F4 along the flat portion F4 of the plug guide portion 242. Thereby, the optical coupling unit 244 has an L shape when viewed in plan from the z-axis direction. The end surface on the negative direction side in the x-axis direction of the abutting portion 248 is referred to as an end surface S6. The optical coupling portion 244 is provided with a concave portion D2 and a convex lens 250.
　凹部Ｄ２は、図７に示すように、光結合部２４４のｙ軸方向の負方向側の辺近傍に設けられている。また、凹部Ｄ２は、ｚ軸方向から平面視したとき、受光素子アレイ５０と重なっている。さらに、凹部Ｄ２は、ｘ軸方向から平面視したとき、後述するプラグ４０に接続されている光ファイバー６０の光軸と重なっている。なお、光ファイバー６０の光軸は、ｘ軸と平行である。また、凹部Ｄ２は、図７に示すように、ｚ軸方向から平面視したとき、矩形状を成している。さらに、凹部Ｄ２は、図９に示すように、ｙ軸方向から平面視したときにＶ字型を成している。 As shown in FIG. 7, the recess D2 is provided in the vicinity of the side on the negative direction side in the y-axis direction of the optical coupling portion 244. The concave portion D2 overlaps the light receiving element array 50 when viewed in plan from the z-axis direction. Further, the recess D2 overlaps with the optical axis of the optical fiber 60 connected to the plug 40 described later when viewed in plan from the x-axis direction. Note that the optical axis of the optical fiber 60 is parallel to the x-axis. Further, as shown in FIG. 7, the concave portion D2 has a rectangular shape when viewed in plan from the z-axis direction. Furthermore, as shown in FIG. 9, the recess D <b> 2 has a V shape when viewed in plan from the y-axis direction.
　凹部Ｄ２のｘ軸方向の負方向側の内周面は、全反射面Ｒ２である。全反射面Ｒ２は、図９に示すように、ｙ軸に平行である。さらに、全反射面Ｒ２は、ｙ軸方向の負方向側から平面視したとき、ｚ軸に対して反時計回りに４５°傾いている。また、位置決め部材２００の屈折率は、空気よりも十分に大きい。従って、光ファイバー６０からｘ軸方向の正方向側に出射されたレーザービームＢ２は、光結合部２４４に入射し、全反射面Ｒ２によりｚ軸方向の負方向側に全反射され、封止樹脂２４を介して受光素子アレイ５０へと進行する。このとき、レーザービームＢ２の光跡をｙ軸方向から平面視すると、光ファイバー６０から出射されたレーザービームＢ２の光軸と全反射面Ｒ２とが成す角は４５°であり、受光素子アレイ５０に向かうレーザービームＢ２の光軸と全反射面Ｒ２とが成す角は４５°である。すなわち、全反射面Ｒ２と光ファイバー６０の光軸とが成す角度と、全反射面Ｒ２と受光素子アレイ５０とが成す角度は等しい。 The inner peripheral surface on the negative direction side in the x-axis direction of the recess D2 is a total reflection surface R2. The total reflection surface R2 is parallel to the y-axis as shown in FIG. Further, the total reflection surface R2 is inclined 45 ° counterclockwise with respect to the z-axis when viewed in plan from the negative direction side in the y-axis direction. Further, the refractive index of the positioning member 200 is sufficiently larger than that of air. Therefore, the laser beam B2 emitted from the optical fiber 60 to the positive direction side in the x-axis direction enters the optical coupling portion 244, and is totally reflected by the total reflection surface R2 to the negative direction side in the z-axis direction. To the light receiving element array 50. At this time, when the light trace of the laser beam B2 is viewed in plan from the y-axis direction, the angle formed by the optical axis of the laser beam B2 emitted from the optical fiber 60 and the total reflection surface R2 is 45 °. The angle formed by the optical axis of the laser beam B2 toward the total reflection surface R2 is 45 °. That is, the angle formed by the total reflection surface R2 and the optical axis of the optical fiber 60 is equal to the angle formed by the total reflection surface R2 and the light receiving element array 50.
　凸レンズ２５０は、図８及び図９に示すように、光結合部２４４の裏面に設けられている。また、各凸レンズ２５０は、ｚ軸方向から平面視したとき、受光素子アレイ５０の各ＶＣＳＥＬと重なっている。これにより、凸レンズ２５０は、受光素子アレイ５０と対向し、レーザービームＢ２の光路上に位置している。また、凸レンズ２５０は、ｚ軸と直交する方向から平面視したとき、ｚ軸の負方向側に向かって突出する半円状を成している。従って、光ファイバー６０から出射されたレーザービームＢ２は、全反射面Ｒ２で反射された後、凸レンズ２５０によって集光又はコリメートされて、受光素子アレイ５０に向かう。 The convex lens 250 is provided on the back surface of the optical coupling part 244 as shown in FIGS. Each convex lens 250 overlaps each VCSEL of the light receiving element array 50 when viewed in plan from the z-axis direction. As a result, the convex lens 250 faces the light receiving element array 50 and is positioned on the optical path of the laser beam B2. Further, the convex lens 250 has a semicircular shape that protrudes toward the negative direction side of the z-axis when viewed from a direction orthogonal to the z-axis. Accordingly, the laser beam B <b> 2 emitted from the optical fiber 60 is reflected by the total reflection surface R <b> 2, then condensed or collimated by the convex lens 250, and travels toward the light receiving element array 50.
（金属キャップの構成）
　次に、金属キャップ３０について、図面を参照しながら説明する。図１０は、本発明の一実施形態に係る金属キャップ３０の外観斜視図である。 (Metal cap configuration)
Next, the metal cap 30 will be described with reference to the drawings. FIG. 10 is an external perspective view of a metal cap 30 according to an embodiment of the present invention.
　金属キャップ３０は、一枚の金属板（例えば、ＳＵＳ３０１）がコ字型に折り曲げられて作製されている。また、金属キャップ３０は、図１に示すように、ｚ軸方向の正方向側、ｙ軸方向の正方向側及びｙ軸方向の負方向側から位置決め部材２００を覆っている。 The metal cap 30 is manufactured by bending a single metal plate (for example, SUS301) into a U-shape. Further, as shown in FIG. 1, the metal cap 30 covers the positioning member 200 from the positive direction side in the z-axis direction, the positive direction side in the y-axis direction, and the negative direction side in the y-axis direction.
　金属キャップ３０は、図１０に示すように、上面３２及び側面３４，３６を含んでいる。上面３２は、ｚ軸に対して直交する面であり、矩形状を成している。側面３４は、上面３２のｙ軸方向の負方向側の長辺からｚ軸方向の負方向側に金属キャップ３０が折り曲げられて形成されている。側面３６は、上面３２のｙ軸方向の正方向側の長辺からｚ軸方向の負方向側に金属キャップ３０が折り曲げられて形成されている。 The metal cap 30 includes an upper surface 32 and side surfaces 34 and 36 as shown in FIG. The upper surface 32 is a surface orthogonal to the z-axis and has a rectangular shape. The side surface 34 is formed by bending the metal cap 30 from the long side of the upper surface 32 on the negative direction side in the y-axis direction to the negative direction side in the z-axis direction. The side surface 36 is formed by bending the metal cap 30 from the long side of the upper surface 32 on the positive direction side in the y-axis direction to the negative direction side in the z-axis direction.
　上面３２のｘ軸方向の負方向側の部分には、図１０に示すように、プラグ４０をレセプタクル２０に固定するための係合部３２ａ，３２ｂが設けられている。係合部３２ａ，３２ｂは、ｙ軸方向の負方向側から正方向側に向かってこの順に並ぶように設けられている。 As shown in FIG. 10, engaging portions 32 a and 32 b for fixing the plug 40 to the receptacle 20 are provided on the negative side portion of the upper surface 32 in the x-axis direction. The engaging portions 32a and 32b are provided in this order from the negative direction side in the y-axis direction toward the positive direction side.
　係合部３２ａ，３２ｂは、上面３２にコ字型の切り込みを入れることにより形成されている。より具体的には、係合部３２ａ，３２ｂは、上面３２にｘ軸方向の正方向側に開口するコ字型の切り込みを入れ、コ字型の切り込みに囲まれた部分をｚ軸方向の負方向側に凹ませるように曲げることにより形成されている。これにより、係合部３２ａ，３２ｂは、ｙ軸方向から平面視したとき、ｚ軸方向の負方向側に突出したＶ字型の形状を成している。 The engaging portions 32a and 32b are formed by making a U-shaped cut in the upper surface 32. More specifically, each of the engaging portions 32a and 32b has a U-shaped notch opening on the upper surface 32 in the positive direction of the x-axis direction, and a portion surrounded by the U-shaped notch in the z-axis direction. It is formed by bending so as to be recessed in the negative direction side. Thus, the engaging portions 32a and 32b have a V-shape that protrudes in the negative direction side in the z-axis direction when viewed in plan from the y-axis direction.
　また、上面３２のｘ軸方向の負方向側の短辺には、図１０に示すように、プラグ４０をレセプタクル２０に固定するための係合部３２ｃ，３２ｄが設けられている。係合部３２ｃ，３２ｄは、上面３２からｘ軸方向の負方向側に突出した金属片である。係合部３２ｃ，３２ｄは、係合部３２ｃ，３２ｄにおけるｘ軸方向の略中央の位置で、ｚ軸方向の負方向側に凹ませるように曲げられている。これにより、係合部３２ｃ，３２ｄは、ｙ軸方向から平面視したとき、ｚ軸方向の負方向側に突出したＶ字型の形状を成している。 Further, as shown in FIG. 10, engaging portions 32c and 32d for fixing the plug 40 to the receptacle 20 are provided on the short side of the upper surface 32 on the negative side in the x-axis direction. The engaging portions 32c and 32d are metal pieces protruding from the upper surface 32 toward the negative direction side in the x-axis direction. The engaging portions 32c and 32d are bent so as to be recessed toward the negative direction side in the z-axis direction at a substantially central position in the x-axis direction in the engaging portions 32c and 32d. Thus, the engaging portions 32c and 32d have a V-shape protruding in the negative direction side in the z-axis direction when viewed in plan from the y-axis direction.
　側面３４のｚ軸方向の負方向側の長辺には、図１０に示すように、ｚ軸方向の負方向側に向かって突出する凸部Ｃ１～Ｃ３が、ｘ軸方向の負方向側から正方向側に向かってこの順に並ぶように設けられている。凸部Ｃ１～Ｃ３はそれぞれ、実装基板２２と接着剤により固定される。なお、凸部Ｃ１は、実装基板２２のグランド導体露出部Ｅ２と接続される。また、凸部Ｃ３は、封止樹脂２４の脚部２４ｂと脚部２４ｃとの間に設けられた空間Ｈ１に嵌め込まれる。これにより、金属キャップ３０は、実装基板２２に対して位置決めされる。 On the long side of the side surface 34 on the negative side in the z-axis direction, as shown in FIG. 10, convex portions C1 to C3 projecting toward the negative direction side in the z-axis direction are formed from the negative direction side in the x-axis direction. They are arranged in this order toward the positive direction. The convex portions C1 to C3 are each fixed to the mounting substrate 22 with an adhesive. The convex portion C1 is connected to the ground conductor exposed portion E2 of the mounting substrate 22. Further, the convex portion C3 is fitted into a space H1 provided between the leg portion 24b and the leg portion 24c of the sealing resin 24. Thereby, the metal cap 30 is positioned with respect to the mounting substrate 22.
　側面３６のｚ軸方向の負方向側の長辺には、図１０に示すように、ｚ軸方向の負方向側に向かって突出する凸部Ｃ４～Ｃ６が、ｘ軸方向の負方向側から正方向側に向かってこの順に並ぶように設けられている。凸部Ｃ４～Ｃ６はそれぞれ、実装基板２２と接着剤により固定される。なお、凸部Ｃ４は、実装基板２２のグランド導体露出部Ｅ３と接続される。また、凸部Ｃ６は、封止樹脂２４の脚部２４ｄと脚部２４ｅとの間に設けられた空間Ｈ２に嵌め込まれる。これにより、金属キャップ３０は、実装基板２２に対して位置決めされる。 On the long side of the side surface 36 on the negative direction side in the z-axis direction, as shown in FIG. 10, convex portions C4 to C6 projecting toward the negative direction side in the z-axis direction are formed from the negative direction side in the x-axis direction. They are arranged in this order toward the positive direction. The convex portions C4 to C6 are each fixed to the mounting substrate 22 with an adhesive. The convex portion C4 is connected to the ground conductor exposed portion E3 of the mounting substrate 22. Further, the convex portion C6 is fitted into a space H2 provided between the leg portion 24d and the leg portion 24e of the sealing resin 24. Thereby, the metal cap 30 is positioned with respect to the mounting substrate 22.
　また、金属キャップ３０は、図１に示すように、位置決め部材２００をｚ軸方向の正方向側並びにｙ軸方向の正方向側及び負方向側から覆っている。そして、レセプタクル２０のｘ軸方向の負方向側には、図１に示すように、後述するプラグ４０が挿入される開口部Ａ３が形成されている。 Further, as shown in FIG. 1, the metal cap 30 covers the positioning member 200 from the positive direction side in the z-axis direction and from the positive direction side and the negative direction side in the y-axis direction. An opening A3 into which a plug 40 described later is inserted is formed on the negative side of the receptacle 20 in the x-axis direction, as shown in FIG.
（プラグの構成）
　本発明の一実施形態に係るプラグ４０について、図面を参照しながら説明する。図１１は、本発明の一実施形態に係るプラグの外観斜視図である。図１２は、本発明の一実施形態に係るプラグをｚ軸方向の負方向側から平面視した図である。 (Plug configuration)
A plug 40 according to an embodiment of the present invention will be described with reference to the drawings. FIG. 11 is an external perspective view of a plug according to an embodiment of the present invention. FIG. 12 is a plan view of a plug according to an embodiment of the present invention from the negative side in the z-axis direction.
　プラグ４０は、図１１に示すように、光ファイバー６０の一端に設けられている。プラグ４０は、送信側プラグ４２及び受信側プラグ４６を備える。なお、プラグ４０は、例えばエポキシ系やナイロン系の樹脂により構成される。 The plug 40 is provided at one end of the optical fiber 60 as shown in FIG. The plug 40 includes a transmission side plug 42 and a reception side plug 46. The plug 40 is made of, for example, an epoxy or nylon resin.
　送信側プラグ４２は、発光素子アレイ１００からのレーザービームＢ１を伝送する。送信側プラグ４２は、図１１に示すように、光ファイバー挿入部４２ａ及び耳部４２ｂを備える。光ファイバー挿入部４２ａは、送信側プラグ４２のｙ軸方向の正方向側の部分を構成しており、ｘ軸方向に延在する直方体状を成している。光ファイバー挿入部４２ａのｘ軸方向の負方向側の部分には、光ファイバー６０を挿入するための開口部Ａ１が設けられている。 The transmitting side plug 42 transmits the laser beam B1 from the light emitting element array 100. As shown in FIG. 11, the transmission-side plug 42 includes an optical fiber insertion portion 42a and an ear portion 42b. The optical fiber insertion portion 42a constitutes a portion on the positive direction side in the y-axis direction of the transmission-side plug 42, and has a rectangular parallelepiped shape extending in the x-axis direction. An opening A1 for inserting the optical fiber 60 is provided in a portion on the negative side in the x-axis direction of the optical fiber insertion portion 42a.
　開口部Ａ１は、図１１に示すように、光ファイバー挿入部４２ａのｚ軸方向の正方向側の上面Ｓ７及びｘ軸方向の負方向側の端面Ｓ８を切り抜くことにより形成されている。また、開口部Ａ１のｘ軸方向の正方向側の内周面には、挿入された光ファイバー６０の芯線を送信側プラグ４２の先端まで導くための孔Ｈ７が設けられている。なお、孔Ｈ７は、光ファイバー６０の本数に対応し、本実施形態においては２つである。 As shown in FIG. 11, the opening A1 is formed by cutting out the upper surface S7 on the positive direction side in the z-axis direction and the end surface S8 on the negative direction side in the x-axis direction of the optical fiber insertion portion 42a. Further, a hole H7 for guiding the core of the inserted optical fiber 60 to the tip of the transmission side plug 42 is provided on the inner peripheral surface on the positive side in the x-axis direction of the opening A1. Note that the number of holes H7 corresponds to the number of optical fibers 60, and is two in this embodiment.
　さらに、光ファイバー挿入部４２ａにおけるｘ軸方向の正方向側の部分には、図１１に示すように、光ファイバー６０固定用の接着剤を注入するための凹部Ｄ３が設けられている。凹部Ｄ３は、光ファイバー挿入部４２ａの表面から裏面に向けて窪んでいる。凹部Ｄ３のｘ軸方向の負方向側の内周面には、孔Ｈ７が設けられている。孔Ｈ７は、開口部Ａ１のｘ軸方向の正方向側の内周面と繋がっている。従って、光ファイバー６０の芯線は、孔Ｈ７を通って、開口部Ａ１から凹部Ｄ３に到達する。凹部Ｄ３に到達した光ファイバー６０の芯線は、凹部Ｄ３のｘ軸方向の正方向側の内周面（突き当て面）Ｓ９に突き当てられる。そして、透明樹脂から成る接着剤、例えばエポキシ系の樹脂を開口部Ａ１及び凹部Ｄ３に流し込むことにより、光ファイバー６０は、送信側プラグ４２に固定される。 Furthermore, as shown in FIG. 11, a concave portion D3 for injecting an adhesive for fixing the optical fiber 60 is provided in a portion on the positive side in the x-axis direction of the optical fiber insertion portion 42a. The recess D3 is recessed from the front surface to the back surface of the optical fiber insertion portion 42a. A hole H7 is provided on the inner peripheral surface on the negative direction side in the x-axis direction of the recess D3. The hole H7 is connected to the inner peripheral surface of the opening A1 on the positive direction side in the x-axis direction. Accordingly, the core wire of the optical fiber 60 reaches the recess D3 from the opening A1 through the hole H7. The core wire of the optical fiber 60 that has reached the recess D3 is abutted against the inner peripheral surface (abutment surface) S9 on the positive side in the x-axis direction of the recess D3. The optical fiber 60 is fixed to the transmission side plug 42 by pouring an adhesive made of a transparent resin, for example, an epoxy resin into the opening A1 and the recess D3.
　光ファイバー挿入部４２ａのｘ軸方向の正方向側の端面Ｓ１０には、図９及び図１２に示すように、凸レンズ４４（第３の凸レンズ）が設けられている。凸レンズ４４は、ｘ軸方向と直交する方向から平面視したとき、ｘ軸方向の正方向側に突出する半円状を成している。これにより、発光素子アレイ１００から出射され、かつ、全反射面Ｒ１により反射されたレーザービームＢ１は、凸レンズ４４により集光又はコリメートされる。 As shown in FIGS. 9 and 12, a convex lens 44 (third convex lens) is provided on the end surface S10 on the positive side in the x-axis direction of the optical fiber insertion portion 42a. The convex lens 44 has a semicircular shape protruding in the positive direction side in the x-axis direction when seen in a plan view from a direction orthogonal to the x-axis direction. Accordingly, the laser beam B1 emitted from the light emitting element array 100 and reflected by the total reflection surface R1 is condensed or collimated by the convex lens 44.
　また、凸レンズ４４は、ｘ軸方向から平面視したとき、光ファイバーの光軸と重なっている。従って、凸レンズ４４で集光又はコリメートされたレーザービームＢ１は、光ファイバー挿入部４２ａの樹脂を通過する。そして、レーザービームＢ１は、突き当て面Ｓ９に突き当てられた光ファイバー６０の芯線のコアに伝送される。 Also, the convex lens 44 overlaps the optical axis of the optical fiber when viewed in plan from the x-axis direction. Accordingly, the laser beam B1 collected or collimated by the convex lens 44 passes through the resin of the optical fiber insertion portion 42a. The laser beam B1 is transmitted to the core of the core of the optical fiber 60 that is abutted against the abutting surface S9.
　光ファイバー挿入部４２ａの上面Ｓ７には、図１１に示すように、金属キャップ３０の係合部３２ａと係合する突起Ｎ１が設けられている。突起Ｎ１は、ｘ軸方向において開口部Ａ１と凹部Ｄ３との間に設けられ、ｙ軸方向に延在している。また、突起Ｎ１は、ｙ軸方向から平面視したとき、ｚ軸方向の正方向側に突出した三角形状を成している。 As shown in FIG. 11, a protrusion N1 that engages with the engaging portion 32a of the metal cap 30 is provided on the upper surface S7 of the optical fiber insertion portion 42a. The protrusion N1 is provided between the opening A1 and the recess D3 in the x-axis direction, and extends in the y-axis direction. Further, the protrusion N1 has a triangular shape protruding in the positive direction side in the z-axis direction when viewed in plan from the y-axis direction.
　光ファイバー挿入部４２ａの裏面には、図１１及び図１２に示すように、凸部Ｃ７が設けられている。凸部Ｃ７は、位置決め部材２２０のプラグガイド部２２２の溝Ｇ１に対応している。凸部Ｃ７は、端面Ｓ８から端面Ｓ１０に向かって、ｘ軸に平行に設けられている。 As shown in FIGS. 11 and 12, a convex portion C7 is provided on the back surface of the optical fiber insertion portion 42a. The convex portion C7 corresponds to the groove G1 of the plug guide portion 222 of the positioning member 220. The convex portion C7 is provided in parallel to the x-axis from the end surface S8 toward the end surface S10.
　耳部４２ｂは、図１１及び図１２に示すように、光ファイバー挿入部４２ａのｘ軸方向の負方向側の端部近傍からｙ軸方向の負方向側に突出している。これにより、送信側プラグ４２は、Ｌ字型を成している。なお、耳部４２ｂは、送信側プラグ４２の挿抜作業の際に、把持部として機能する。また、耳部４２ｂの略中央には、ｚ軸方向から平面視したとき、略矩形状の肉抜き穴が設けられている。 As shown in FIGS. 11 and 12, the ear portion 42b protrudes from the vicinity of the end portion on the negative direction side in the x-axis direction of the optical fiber insertion portion 42a toward the negative direction side in the y-axis direction. Thereby, the transmission side plug 42 is L-shaped. In addition, the ear | edge part 42b functions as a holding part in the case of the insertion / extraction operation | work of the transmission side plug 42. FIG. Further, a substantially rectangular hollow hole is provided in the approximate center of the ear portion 42b when viewed in plan from the z-axis direction.
　なお、送信側プラグ４２とレセプタクル２０との接続作業は、凸部Ｃ７を溝Ｇ１に沿わせて、ｘ軸方向の正方向側に押し込むことにより行われる。このとき、耳部４２ｂのｘ軸方向の正方向側の端面Ｓ１１は、図７で示される位置決め部材２００の突き当て部２２８の端面Ｓ３に突き当たる。 Note that the connection work between the transmission side plug 42 and the receptacle 20 is performed by pushing the convex portion C7 along the groove G1 to the positive side in the x-axis direction. At this time, the end surface S11 on the positive side in the x-axis direction of the ear portion 42b abuts against the end surface S3 of the abutting portion 228 of the positioning member 200 shown in FIG.
　また、送信側プラグ４２とレセプタクル２０との接続作業により、図９に示すように、送信側プラグ４２は、位置決め部材２２０上に載置される。さらに、前述のとおり光ファイバー６０の光軸は、ｘ軸方向と平行であり、送信側プラグ４２をレセプタクル２０へ押し込む方向は、ｘ軸方向の正方向側である。従って、光ファイバー６０の光軸と送信側プラグ４２の挿入方向は平行である。 Further, as shown in FIG. 9, the transmission side plug 42 is placed on the positioning member 220 by the connection work between the transmission side plug 42 and the receptacle 20. Furthermore, as described above, the optical axis of the optical fiber 60 is parallel to the x-axis direction, and the direction in which the transmission side plug 42 is pushed into the receptacle 20 is the positive direction side in the x-axis direction. Therefore, the optical axis of the optical fiber 60 and the insertion direction of the transmission side plug 42 are parallel.
　また、送信側プラグ４２とレセプタクル２０との接続する際、金属キャップ３０の係合部３２ａが突起Ｎ１と係合するとともに、係合部３２ｃが送信側プラグ４２の上面Ｓ７と端面Ｓ８とが成す角と係合することにより、送信側プラグ４２がレセプタクル２０に固定される。 Further, when the transmission side plug 42 and the receptacle 20 are connected, the engaging portion 32a of the metal cap 30 is engaged with the protrusion N1, and the engaging portion 32c is formed by the upper surface S7 and the end surface S8 of the transmission side plug 42. By engaging with the corner, the transmission side plug 42 is fixed to the receptacle 20.
　受信側プラグ４６は、受光素子アレイ５０へレーザービームＢ２を伝送する。受信側プラグ４６は、図１１に示すように、光ファイバー挿入部４６ａ及び耳部４６ｂを備える。光ファイバー挿入部４６ａは、受信側プラグ４６のｙ軸方向の負方向側の部分を構成しており、略直方体状を成している。光ファイバー挿入部４６ａのｘ軸方向の負方向側の部分には、光ファイバー６０を挿入するための開口部Ａ２が設けられている。 The receiving side plug 46 transmits the laser beam B2 to the light receiving element array 50. As shown in FIG. 11, the receiving side plug 46 includes an optical fiber insertion portion 46a and an ear portion 46b. The optical fiber insertion portion 46a constitutes a portion on the negative direction side in the y-axis direction of the reception side plug 46, and has a substantially rectangular parallelepiped shape. An opening A2 for inserting the optical fiber 60 is provided in a portion on the negative direction side in the x-axis direction of the optical fiber insertion portion 46a.
　開口部Ａ２は、図１１に示すように、光ファイバー挿入部４６ａのｚ軸方向の正方向側の上面Ｓ１２及びｘ軸方向の負方向側の端面Ｓ１３を切り抜くことにより形成されている。また、開口部Ａ２のｘ軸方向の正方向側の内周面には、挿入された光ファイバー６０の芯線を受信側プラグ４６の先端まで導くための孔Ｈ８が設けられている。なお、孔Ｈ８は、光ファイバー６０の本数に対応し、本実施形態においては２つである。 As shown in FIG. 11, the opening A2 is formed by cutting out the upper surface S12 on the positive direction side in the z-axis direction and the end surface S13 on the negative direction side in the x-axis direction of the optical fiber insertion portion 46a. A hole H8 for guiding the core of the inserted optical fiber 60 to the tip of the receiving side plug 46 is provided on the inner peripheral surface on the positive side in the x-axis direction of the opening A2. The number of holes H8 corresponds to the number of the optical fibers 60, and is two in this embodiment.
　さらに、光ファイバー挿入部４６ａにおけるｘ軸方向の正方向側の部分には、図１１に示すように、光ファイバー６０固定用の接着剤を注入するための凹部Ｄ４が設けられている。凹部Ｄ４は、光ファイバー挿入部４６ａの表面から裏面に向けて窪んでいる。凹部Ｄ４のｘ軸方向の負方向側の内周面には、孔Ｈ８が設けられている。孔Ｈ８は、開口部Ａ２のｘ軸方向の正方向側の内周面と繋がっている。従って、光ファイバー６０の芯線は、孔Ｈ８を通って、開口部Ａ２から凹部Ｄ４に到達する。凹部Ｄ４に到達した光ファイバー６０の芯線は、凹部Ｄ４のｘ軸方向の正方向側の内周面（突き当て面）Ｓ１４に突き当てられる。そして、透明樹脂から成る接着剤、例えばエポキシ系の樹脂を開口部Ａ２及び凹部Ｄ４に流し込むことにより、光ファイバー６０は、受信側プラグ４６に固定される。 Furthermore, as shown in FIG. 11, a concave portion D4 for injecting an adhesive for fixing the optical fiber 60 is provided in a portion on the positive side in the x-axis direction of the optical fiber insertion portion 46a. The recess D4 is recessed from the front surface to the back surface of the optical fiber insertion portion 46a. A hole H8 is provided on the inner peripheral surface on the negative direction side in the x-axis direction of the recess D4. The hole H8 is connected to the inner peripheral surface on the positive direction side in the x-axis direction of the opening A2. Accordingly, the core wire of the optical fiber 60 reaches the recess D4 from the opening A2 through the hole H8. The core of the optical fiber 60 that has reached the recess D4 is abutted against the inner peripheral surface (abutment surface) S14 on the positive side in the x-axis direction of the recess D4. The optical fiber 60 is fixed to the receiving side plug 46 by pouring an adhesive made of a transparent resin, for example, an epoxy resin into the opening A2 and the recess D4.
　光ファイバー挿入部４６ａのｘ軸方向の正方向側の端面Ｓ１５には、図９及び図１２に示すように、凸レンズ４８が設けられている。凸レンズ４８は、ｘ軸と直交する方向から平面視したとき、ｘ軸方向の正方向側に突出する半円状を成している。 As shown in FIGS. 9 and 12, a convex lens 48 is provided on the end surface S15 on the positive side in the x-axis direction of the optical fiber insertion portion 46a. The convex lens 48 has a semicircular shape protruding in the positive direction side in the x-axis direction when seen in a plan view from a direction orthogonal to the x-axis.
　また、凸レンズ４８は、ｘ軸方向から平面視したとき、光ファイバー６０の光軸と重なっている。従って、光ファイバー６０から出射されたレーザービームＢ２は、凸レンズ４８により集光又はコリメートされ、全反射面Ｒ２に進行する。そして、レーザービームＢ２は、全反射面Ｒ２で反射されて、受光素子アレイ５０に伝送される。 Further, the convex lens 48 overlaps the optical axis of the optical fiber 60 when viewed in plan from the x-axis direction. Accordingly, the laser beam B2 emitted from the optical fiber 60 is condensed or collimated by the convex lens 48 and proceeds to the total reflection surface R2. The laser beam B <b> 2 is reflected by the total reflection surface R <b> 2 and transmitted to the light receiving element array 50.
　光ファイバー挿入部４６ａの上面Ｓ１２には、図１１に示すように、金属キャップ３０の係合部３２ｂと係合する突起Ｎ２が設けられている。突起Ｎ２は、ｘ軸方向において開口部Ａ２と凹部Ｄ４の間に設けられ、ｙ軸方向に延在している。また、突起Ｎ２は、ｙ軸方向から平面視したとき、ｚ軸方向の正方向側に突出した三角形状を成している。 As shown in FIG. 11, a protrusion N2 that engages with the engaging portion 32b of the metal cap 30 is provided on the upper surface S12 of the optical fiber insertion portion 46a. The protrusion N2 is provided between the opening A2 and the recess D4 in the x-axis direction, and extends in the y-axis direction. Further, the protrusion N2 has a triangular shape protruding in the positive direction side in the z-axis direction when viewed in plan from the y-axis direction.
　光ファイバー挿入部４６ａの裏面には、図１１及び図１２に示すように、凸部Ｃ８が設けられている。凸部Ｃ８は、位置決め部材２４０のプラグガイド部２４２の溝Ｇ２に対応している。凸部Ｃ８は、端面Ｓ１３から端面Ｓ１５に向かって、ｘ軸に平行に設けられている。 As shown in FIGS. 11 and 12, a convex portion C8 is provided on the back surface of the optical fiber insertion portion 46a. The convex portion C8 corresponds to the groove G2 of the plug guide portion 242 of the positioning member 240. The convex portion C8 is provided in parallel to the x-axis from the end surface S13 toward the end surface S15.
　耳部４６ｂは、図１１及び図１２に示すように、光ファイバー挿入部４６ａのｘ軸方向の負方向側の端部からｙ軸方向の正方向側に突出している。これにより、受信側プラグ４６は、Ｌ字型を成している。なお、耳部４６ｂは、受信側プラグ４６の挿抜作業の際に、把持部として機能する。また、耳部４６ｂの略中央には、ｚ軸方向から平面視したとき、略矩形状の肉抜き穴が設けられている。 As shown in FIGS. 11 and 12, the ear 46b protrudes from the end on the negative direction side in the x-axis direction of the optical fiber insertion portion 46a to the positive direction side in the y-axis direction. Thereby, the receiving side plug 46 is L-shaped. In addition, the ear | edge part 46b functions as a holding part in the case of the insertion / extraction operation | work of the receiving side plug 46. FIG. Further, a substantially rectangular hollow hole is provided in the approximate center of the ear 46b when viewed in plan from the z-axis direction.
　なお、受信側プラグ４６とレセプタクル２０との接続作業は、凸部Ｃ８を溝Ｇ２に沿わせて、ｘ軸方向の正方向側に押し込むことにより行われる。このとき、耳部４６ｂのｘ軸方向の正方向側の端面Ｓ１６は、図７で示される位置決め部材２００の突き当て部２４８の端面Ｓ６に突き当たる。 Note that the connection work between the receiving side plug 46 and the receptacle 20 is performed by pushing the convex portion C8 along the groove G2 to the positive side in the x-axis direction. At this time, the end surface S16 on the positive side in the x-axis direction of the ear portion 46b abuts against the end surface S6 of the abutting portion 248 of the positioning member 200 shown in FIG.
　また、受信側プラグ４６とレセプタクル２０との接続作業により、図９に示すように、受信側プラグ４６は、位置決め部材２４０上に載置される。さらに、前述のとおり光ファイバー６０の光軸は、ｘ軸方向と平行であり、受信側プラグ４６をレセプタクル２０へ押し込む方向は、ｘ軸方向の正方向側である。従って、光ファイバー６０の光軸と受信側プラグ４６の挿入方向は平行である。 Further, as shown in FIG. 9, the receiving side plug 46 is placed on the positioning member 240 by the connection work between the receiving side plug 46 and the receptacle 20. Furthermore, as described above, the optical axis of the optical fiber 60 is parallel to the x-axis direction, and the direction in which the receiving-side plug 46 is pushed into the receptacle 20 is the positive direction side in the x-axis direction. Therefore, the optical axis of the optical fiber 60 and the insertion direction of the receiving side plug 46 are parallel.
　また、受信側プラグ４６とレセプタクル２０とを接続する際、金属キャップ３０の係合部３２ｂが突起Ｎ２と係合するとともに、係合部３２ｄが受信側プラグ４６の上面Ｓ１２と端面Ｓ１３とが成す角と係合することにより、受信側プラグ４６がレセプタクル２０に固定される。 Further, when the receiving side plug 46 and the receptacle 20 are connected, the engaging portion 32b of the metal cap 30 engages with the protrusion N2, and the engaging portion 32d forms the upper surface S12 and the end surface S13 of the receiving side plug 46. The receiving side plug 46 is fixed to the receptacle 20 by engaging with the corner.
　以上のように構成された光伝送モジュール１０では、図９に示すように、発光素子アレイ１００からｚ軸方向の正方向側に出射されたレーザービームＢ１は、封止樹脂２４及び位置決め部材２２０を通過する。さらに、レーザービームＢ１は、全反射面Ｒ１でｘ軸方向の負方向側に反射されて、プラグ４０を通過し光ファイバー６０のコアに伝送される。従って、位置決め部材２２０は、光ファイバー６０のコアと発光素子アレイ１００とを光学的に結合させる役割を担っている。 In the optical transmission module 10 configured as described above, as shown in FIG. 9, the laser beam B <b> 1 emitted from the light emitting element array 100 toward the positive side in the z-axis direction passes through the sealing resin 24 and the positioning member 220. pass. Further, the laser beam B <b> 1 is reflected by the total reflection surface R <b> 1 on the negative side in the x-axis direction, passes through the plug 40, and is transmitted to the core of the optical fiber 60. Therefore, the positioning member 220 plays a role of optically coupling the core of the optical fiber 60 and the light emitting element array 100.
　また、光伝送モジュール１０において、図９に示すように、光ファイバー６０からｘ軸方向の正方向側に出射されたレーザービームＢ２は、位置決め部材２４０を通過する。さらに、レーザービームＢ２は、全反射面Ｒ２でｚ軸方向の負方向側に反射されて、封止樹脂２４を通過し受光素子アレイ５０に伝送される。従って、位置決め部材２４０は、光ファイバー６０のコアと受光素子アレイ５０とを光学的に結合させる役割を担っている。 Further, in the optical transmission module 10, as shown in FIG. 9, the laser beam B <b> 2 emitted from the optical fiber 60 toward the positive direction in the x-axis direction passes through the positioning member 240. Further, the laser beam B <b> 2 is reflected by the total reflection surface R <b> 2 to the negative direction side in the z-axis direction, passes through the sealing resin 24, and is transmitted to the light receiving element array 50. Accordingly, the positioning member 240 plays a role of optically coupling the core of the optical fiber 60 and the light receiving element array 50.
（製造方法）
　以下に、本発明の一実施形態に係る光伝送モジュール１０の製造方法を、発光素子アレイ１００、レセプタクル２０、プラグ４０及び光伝送モジュール１０の順で説明する。 (Production method)
Below, the manufacturing method of the optical transmission module 10 which concerns on one Embodiment of this invention is demonstrated in order of the light emitting element array 100, the receptacle 20, the plug 40, and the optical transmission module 10. FIG.
（発光素子アレイの製造方法）
　まず、ベース基板１２８の表面に、Ｎ型半導体コンタクト層１３０、Ｎ型ＤＢＲ層１３２、Ｎ型半導体クラッド層１３４、活性層１３６、Ｐ型半導体クラッド層１３８、Ｐ型ＤＢＲ層１４０及びＰ型半導体コンタクト層１４２を、この順に積層する。 (Method for manufacturing light emitting element array)
First, an N-type semiconductor contact layer 130, an N-type DBR layer 132, an N-type semiconductor clad layer 134, an active layer 136, a P-type semiconductor clad layer 138, a P-type DBR layer 140, and a P-type semiconductor contact are formed on the surface of the base substrate 128. Layer 142 is stacked in this order.
　次に、それぞれのＶＣＳＥＬ１００Ａ，１００Ｂの発光領域多層部１６０を構成する部分を除き、Ｐ型半導体コンタクト層１４２、Ｐ型ＤＢＲ層１４０、Ｐ型半導体クラッド層１３８、活性層１３６、Ｎ型半導体クラッド層１３４を、順次所定のパターンでエッチングする。この工程では、Ｎ型ＤＢＲ層１３２の表面まで、エッチングを行う。これにより、Ｎ型半導体コンタクト層１３０、Ｎ型ＤＢＲ層１３２を除くＶＣＳＥＬ１００Ａ，１００Ｂの発光領域多層部１６０が所定距離だけ離間するように分離される。 Next, the P-type semiconductor contact layer 142, the P-type DBR layer 140, the P-type semiconductor clad layer 138, the active layer 136, and the N-type semiconductor clad layer are excluded except for the portions constituting the light emitting region multilayer portion 160 of each VCSEL 100A, 100B 134 are sequentially etched in a predetermined pattern. In this step, etching is performed up to the surface of the N-type DBR layer 132. Thereby, the light emitting region multilayer portions 160 of the VCSELs 100A and 100B excluding the N-type semiconductor contact layer 130 and the N-type DBR layer 132 are separated so as to be separated by a predetermined distance.
　Ｎ型ＤＢＲ層１３２の表面が露出した領域における発光領域多層部１６０に近接する位置をエッチングすることで、Ｎ型半導体コンタクト層１３０を露出させる。このＮ型半導体コンタクト層１３０を露出させた領域に、カソード用電極９１１を形成する。 The N-type semiconductor contact layer 130 is exposed by etching a position in the region where the surface of the N-type DBR layer 132 is exposed and close to the light emitting region multilayer section 160. A cathode electrode 911 is formed in a region where the N-type semiconductor contact layer 130 is exposed.
　また、エッチングしなかった発光領域多層部１６０のＰ型半導体コンタクト層１４２の表面にアノード用リング電極９２１を形成する。 Further, an anode ring electrode 921 is formed on the surface of the P-type semiconductor contact layer 142 of the light emitting region multilayer part 160 that has not been etched.
　ベース基板１２８の表面側に、カソード用電極９１１、アノード用リング電極９２１の表面を除き、絶縁膜１６２を形成する。 The insulating film 162 is formed on the surface side of the base substrate 128 except for the surfaces of the cathode electrode 911 and the anode ring electrode 921.
　絶縁膜１６２の表面の発光領域多層部１６０に近接する領域に絶縁層１７０を形成する。 An insulating layer 170 is formed in a region close to the light emitting region multilayer portion 160 on the surface of the insulating film 162.
　絶縁層１７０の表面に、カソード用パッド電極９１２とアノード用パッド電極９２２とを形成する。 A cathode pad electrode 912 and an anode pad electrode 922 are formed on the surface of the insulating layer 170.
　カソード用電極９１１とカソード用パッド電極９１２とを接続するカソード用配線電極９１３を形成する。アノード用リング電極９２１とアノード用パッド電極９２２とを接続するアノード用配線電極９２３を形成する。 A cathode wiring electrode 913 that connects the cathode electrode 911 and the cathode pad electrode 912 is formed. An anode wiring electrode 923 that connects the anode ring electrode 921 and the anode pad electrode 922 is formed.
　隣り合うＶＣＳＥＬ１００Ａ，１００Ｂの領域を分割するように、絶縁膜１６２、Ｎ型ＤＢＲ層１３２、Ｎ型半導体コンタクト層１３０を貫通し、ベース基板１２８の表面から内部へ所定の深さまで凹む形状の溝１８０を形成する。以上のような工程により、発光素子アレイ１００が形成される。 A groove 180 having a shape that penetrates the insulating film 162, the N-type DBR layer 132, and the N-type semiconductor contact layer 130 so as to divide the adjacent VCSELs 100A and 100B into a predetermined depth from the surface of the base substrate 128 to the inside. Form. The light emitting element array 100 is formed by the processes as described above.
（レセプタクルの製造方法）
　次に、レセプタクル２０の製造方法について、図面を参照しながら説明する。図１３は、本発明の一実施形態に係るレセプタクルの製造工程の図である。 (Receptacle manufacturing method)
Next, a method for manufacturing the receptacle 20 will be described with reference to the drawings. FIG. 13 is a diagram of a manufacturing process of a receptacle according to an embodiment of the present invention.
　まず、実装基板２２の集合体であるマザー基板１２２（本図面中には、図示しない）の表面にはんだを塗布する。より具体的には、メタルマスクを載せたマザー基板１２２上に、スキージを使用してクリームはんだを押し付ける。そして、メタルマスクをマザー基板１２２から取り除くことにより、はんだをマザー基板１２２に印刷する。 First, solder is applied to the surface of a mother substrate 122 (not shown in the drawing) which is an assembly of the mounting substrates 22. More specifically, cream solder is pressed onto the mother substrate 122 on which the metal mask is placed using a squeegee. Then, the solder is printed on the mother substrate 122 by removing the metal mask from the mother substrate 122.
　次に、コンデンサーをマザー基板１２２のはんだ上に載置する。その後、マザー基板１２２に熱を加えて、コンデンサーをはんだ付けする。 Next, the capacitor is placed on the solder of the mother board 122. Thereafter, heat is applied to the mother substrate 122 to solder the capacitor.
　コンデンサーをはんだ付けした後、マザー基板１２２上の所定位置にＡｇペーストを塗布する。塗布されたＡｇ上に駆動回路２６、受光素子アレイ５０及び発光素子アレイ１００を載置して、ダイボンドを行う。さらに、Ａｕワイヤーを用いて、駆動回路２６と受光素子アレイ５０とをワイヤーボンディングにより接続し、さらに、駆動回路２６と発光素子アレイ１００とをワイヤーボンディングにより接続する。 After soldering the capacitor, Ag paste is applied to a predetermined position on the mother substrate 122. The drive circuit 26, the light receiving element array 50, and the light emitting element array 100 are mounted on the coated Ag, and die bonding is performed. Further, the drive circuit 26 and the light receiving element array 50 are connected by wire bonding using Au wires, and the drive circuit 26 and the light emitting element array 100 are connected by wire bonding.
　その後、コンデンサー、駆動回路２６と、受光素子アレイ５０及び発光素子アレイ１００に対して樹脂モールドを行う。さらに、ダイサーを用いてマザー基板１２２をカットすることにより、複数の実装基板２２を得る。 Thereafter, resin molding is performed on the capacitor, the drive circuit 26, the light receiving element array 50, and the light emitting element array 100. Furthermore, the plurality of mounting boards 22 are obtained by cutting the mother board 122 using a dicer.
　次に、位置決め部材２２０を実装基板２２及び封止樹脂２４上に載置する。より具体的には、封止部２４ａの表面におけるｘ軸方向の負方向側の領域にＵＶ硬化型の接着剤を塗布する。接着剤を塗布した後、図１３に示すように、発光素子アレイ１００の発光部の中心Ｔ１００の位置を位置認識用カメラＶ１で確認する。 Next, the positioning member 220 is placed on the mounting substrate 22 and the sealing resin 24. More specifically, a UV curable adhesive is applied to the negative region in the x-axis direction on the surface of the sealing portion 24a. After applying the adhesive, as shown in FIG. 13, the position of the center T100 of the light emitting part of the light emitting element array 100 is confirmed by the position recognition camera V1.
　次に、位置決め部材２２０を封止樹脂２４上に載置するための搭載機Ｖ２が位置決め部材２２０を吸着して取り上げる。そして、図１３に示すように、搭載機Ｖ２が位置決め部材２２０を吸着した状態で、位置認識用カメラＶ３で位置決め部材２２０の凸レンズ２３０のレンズ中心Ｔ２３０の位置を確認する。 Next, the mounting machine V2 for placing the positioning member 220 on the sealing resin 24 picks up and picks up the positioning member 220. Then, as shown in FIG. 13, the position of the lens center T230 of the convex lens 230 of the positioning member 220 is confirmed by the position recognition camera V3 in a state where the mounting machine V2 sucks the positioning member 220.
　位置認識用カメラＶ１で確認した発光素子アレイ１００の発光部の中心Ｔ１００の位置データ及び、位置認識用カメラＶ３で確認した位置決め部材２２０の凸レンズ２３０のレンズ中心Ｔ２３０の位置データから、発光素子アレイ１００の発光部と凸レンズ２３０との相対的な位置を算出する。算出した結果に基づいて、搭載機Ｖ２の移動量を決定する。 From the position data of the center T100 of the light emitting part of the light emitting element array 100 confirmed by the position recognition camera V1 and the position data of the lens center T230 of the convex lens 230 of the positioning member 220 confirmed by the position recognition camera V3, the light emitting element array 100. The relative position between the light emitting part and the convex lens 230 is calculated. Based on the calculated result, the movement amount of the onboard machine V2 is determined.
　次に、搭載機Ｖ２により、決定した移動量だけ、位置決め部材２２０を移動させる。これにより、凸レンズ２３０のレンズ中心Ｔ２３０と発光素子アレイ１００の光軸とが一致する。 Next, the positioning member 220 is moved by the determined movement amount by the mounting machine V2. Thereby, the lens center T230 of the convex lens 230 and the optical axis of the light emitting element array 100 coincide.
　位置決め部材２２０の載置作業と並行して、位置決め部材２４０を実装基板２２及び封止樹脂２４上に載置する作業を行う。より具体的には、封止部２４ａの表面のｘ軸方向の負方向側の領域にＵＶ硬化型の接着剤を塗布した後、図１３に示すように、受光素子アレイ５０の受光部の中心Ｔ５０の位置を位置認識用カメラＶ４で確認する。 In parallel with the mounting operation of the positioning member 220, the positioning member 240 is mounted on the mounting substrate 22 and the sealing resin 24. More specifically, after a UV curable adhesive is applied to the negative region in the x-axis direction on the surface of the sealing portion 24a, the center of the light receiving portion of the light receiving element array 50 is applied as shown in FIG. The position T50 is confirmed by the position recognition camera V4.
　次に、位置決め部材２４０を封止樹脂２４上に載置するための搭載機Ｖ５が位置決め部材２４０を吸着して取り上げる。そして、図１３に示すように、搭載機Ｖ５が位置決め部材２４０を吸着した状態で、位置認識用カメラＶ６で位置決め部材２４０の凸レンズ２５０のレンズ中心Ｔ２５０の位置を確認する。 Next, the mounting machine V5 for mounting the positioning member 240 on the sealing resin 24 picks up and picks up the positioning member 240. Then, as shown in FIG. 13, the position of the lens center T250 of the convex lens 250 of the positioning member 240 is confirmed by the position recognition camera V6 in a state where the mounting machine V5 sucks the positioning member 240.
　位置認識用カメラＶ４で確認した受光素子アレイ５０の受光部の中心Ｔ５０の位置データ及び、位置認識用カメラＶ６で確認した位置決め部材２４０の凸レンズ２５０のレンズ中心Ｔ２５０の位置データから、受光素子アレイ５０の受光部と凸レンズ２５０との相対的な位置を算出する。算出された結果に基づいて、搭載機Ｖ５の移動量を決定する。 From the position data of the center T50 of the light receiving unit of the light receiving element array 50 confirmed by the position recognition camera V4 and the position data of the lens center T250 of the convex lens 250 of the positioning member 240 confirmed by the position recognition camera V6, the light receiving element array 50. The relative position between the light receiving unit and the convex lens 250 is calculated. Based on the calculated result, the movement amount of the onboard machine V5 is determined.
　次に、搭載機Ｖ５により、決定した移動量だけ、位置決め部材２４０を移動させる。これにより、凸レンズ２５０のレンズ中心Ｔ２５０と受光素子アレイ５０の光軸とが一致する。 Next, the positioning member 240 is moved by the determined movement amount by the mounting machine V5. Thereby, the lens center T250 of the convex lens 250 and the optical axis of the light receiving element array 50 coincide.
　配置された位置決め部材２２０，２４０に対して、紫外線を照射する。なお、紫外線照射中、位置決め部材２２０，２４０は、搭載機Ｖ２，Ｖ５により、実装基板２２及び封止樹脂２４に押しつけられた状態である。これにより、位置決め部材２２０，２４０と封止樹脂２４との間にあるＵＶ硬化型の接着剤が硬化する際に、位置決め部材２２０，２４０が、位置ズレを起こすことなく、実装基板２２及び封止樹脂２４に固定される。 Irradiate ultraviolet rays to the positioning members 220 and 240 arranged. During ultraviolet irradiation, the positioning members 220 and 240 are pressed against the mounting substrate 22 and the sealing resin 24 by the mounting machines V2 and V5. Thus, when the UV curable adhesive between the positioning members 220 and 240 and the sealing resin 24 is cured, the positioning members 220 and 240 are not displaced and the mounting substrate 22 and the sealing resin are sealed. It is fixed to the resin 24.
　次に、位置決め部材２００が載置された実装基板２２に対して、金属キャップ３０を取り付ける。より具体的には、実装基板２２の表面上であって、封止樹脂２４の脚部２４ｂと２４ｃとの間の空間Ｈ１、脚部２４ｄと２４ｅとの間の空間Ｈ２、及び、金属キャップ３０の凸部Ｃ２，Ｃ５が接触する部分にエポキシ系などの熱硬化性の接着剤を塗布する。また、実装基板２２のグランド導体露出部Ｅ２，Ｅ３には、Ａｇなどの導電性ペーストを塗布する。 Next, the metal cap 30 is attached to the mounting substrate 22 on which the positioning member 200 is placed. More specifically, on the surface of the mounting substrate 22, a space H <b> 1 between the legs 24 b and 24 c of the sealing resin 24, a space H <b> 2 between the legs 24 d and 24 e, and the metal cap 30. A thermosetting adhesive such as epoxy is applied to the portion where the projections C2 and C5 come into contact. Further, a conductive paste such as Ag is applied to the ground conductor exposed portions E2 and E3 of the mounting substrate 22.
　接着剤及び導電性ペーストを塗布後、金属キャップ３０の凸部Ｃ３を、実装基板２２上の封止樹脂２４の脚部２４ｂと脚部２４ｃとに挟まれた部分、すなわち空間Ｈ１に嵌め合わせる。さらに、凸部Ｃ６を封止樹脂２４の脚部２４ｄと脚部２４ｅとに挟まれた部分、すなわち空間Ｈ２に嵌め合わせる。これにより、金属キャップ３０の実装基板２２に対する位置が決まる。また、金属キャップ３０の位置決めと同時に、凸部Ｃ１～Ｃ６が実装基板２２上の接着剤及び導電性ペーストと接触する。 After applying the adhesive and the conductive paste, the convex portion C3 of the metal cap 30 is fitted into a portion sandwiched between the leg portion 24b and the leg portion 24c of the sealing resin 24 on the mounting substrate 22, that is, the space H1. Further, the convex portion C6 is fitted into a portion sandwiched between the leg portion 24d and the leg portion 24e of the sealing resin 24, that is, the space H2. Thereby, the position of the metal cap 30 with respect to the mounting substrate 22 is determined. Simultaneously with the positioning of the metal cap 30, the convex portions C1 to C6 come into contact with the adhesive and the conductive paste on the mounting substrate 22.
　金属キャップ３０を嵌め合わせた後、実装基板２２に熱を加え、接着剤及び導電性ペーストを硬化させる。これにより、金属キャップ３０を、実装基板２２に固定する。なお、金属キャップ３０を実装基板２２に取り付けることにより、金属キャップ３０の凸部Ｃ１，Ｃ４が、実装基板２２のグランド導体露出部Ｅ２，Ｅ３と接触する。これにより、金属キャップ３０は、実装基板２２内のグランド導体に接続され、グランド電位に保たれる。以上のような工程によりレセプタクル２０が完成する。 After fitting the metal cap 30, heat is applied to the mounting substrate 22 to cure the adhesive and the conductive paste. Thereby, the metal cap 30 is fixed to the mounting substrate 22. Note that, by attaching the metal cap 30 to the mounting substrate 22, the convex portions C <b> 1 and C <b> 4 of the metal cap 30 come into contact with the ground conductor exposed portions E <b> 2 and E <b> 3 of the mounting substrate 22. Thereby, the metal cap 30 is connected to the ground conductor in the mounting substrate 22 and is kept at the ground potential. The receptacle 20 is completed by the process as described above.
（プラグの製造方法）
　まず、プラグ４０に挿入される光ファイバー６０を、所定の長さに切断する。 (Plug manufacturing method)
First, the optical fiber 60 inserted into the plug 40 is cut into a predetermined length.
　次に、光ファイバー６０の先端付近の被覆を、光ファイバー用ストリッパーを用いて除去する。先端付近の被覆を除去した後、光ファイバー６０の芯線の劈開面を出すためにクリーブを行う。 Next, the coating near the tip of the optical fiber 60 is removed using an optical fiber stripper. After removing the coating in the vicinity of the tip, cleaving is performed to bring out the cleavage plane of the core of the optical fiber 60.
　次に、図１１に示されるプラグ４０の開口部Ａ１，Ａ２及び凹部Ｄ３，Ｄ４に、光ファイバー６０を固定するためのエポキシ樹脂などの透明接着剤を注入する。さらに、光ファイバー６０の芯線がプラグ４０の面Ｓ９，Ｓ１４に突き当たるまで押し込む。そして、透明接着剤が硬化することにより、光ファイバー６０がプラグ４０に固定される。 Next, a transparent adhesive such as an epoxy resin for fixing the optical fiber 60 is injected into the openings A1 and A2 and the recesses D3 and D4 of the plug 40 shown in FIG. Furthermore, it pushes in until the core wire of the optical fiber 60 hits the surfaces S9 and S14 of the plug 40. Then, the optical fiber 60 is fixed to the plug 40 by curing the transparent adhesive.
（光伝送モジュールの製造方法）
　レセプタクル２０にプラグ４０を接続する。プラグ４０の接続は、前述したように、位置決め部材２２０，２４０の溝Ｇ１，Ｇ２にプラグ４０の凸部Ｃ７，Ｃ８を沿わせて、金属キャップ３０とレセプタクル２０との間に設けられた開口部Ａ３から、ｘ軸方向の正方向側に向かって押し込むことにより行われる。以上のような製造工程を経て光伝送モジュール１０が完成する。 (Method for manufacturing optical transmission module)
The plug 40 is connected to the receptacle 20. As described above, the plug 40 is connected to the grooves G1 and G2 of the positioning members 220 and 240 along the protrusions C7 and C8 of the plug 40 and the opening provided between the metal cap 30 and the receptacle 20. This is performed by pushing from A3 toward the positive side in the x-axis direction. The optical transmission module 10 is completed through the manufacturing process as described above.
（効果）
　以上にように構成された光伝送モジュール１０及びレセプタクル２０によれば、ＶＣＳＥＬ１００Ａ，１００Ｂ間で十分にアイソレーションをとることができる。より詳細には、ＶＣＳＥＬ１００Ａ，１００Ｂは、一つの基板であるベース基板１２８上に載置されている。ベース基板１２８は、半絶縁性の半導体基板である。これにより、ＶＣＳＥＬ１００Ａ，１００Ｂでは、アノード用リング電極９２１から流入した電流（駆動信号）は、Ｐ型半導体コンタクト層１４２、Ｐ型ＤＢＲ層１４０、Ｐ型半導体クラッド層１３８、活性層１３６、Ｎ型半導体クラッド層１３４、Ｎ型ＤＢＲ層１３２、Ｎ型半導体コンタクト層１３０及びカソード用電極９１１の順に通過するため、ベース基板１２８を通過することはない。従って、ＶＣＳＥＬ１００Ａに送られた駆動信号が、ベース基板１２８を介してＶＣＳＥＬ１００Ｂに送られることはなく、また、ＶＣＳＥＬ１００Ｂに送られた駆動信号が、ベース基板１２８を介してＶＣＳＥＬ１００Ａに送られることもない。更に、ＶＣＳＥＬ１００ＡのＮ型半導体コンタクト層１３０とＶＣＳＥＬ１００ＢのＮ型半導体コンタクト層１３０とは分離されている。したがって、ＶＣＳＥＬ１００Ａに送られた駆動信号が、Ｎ型半導体コンタクト層１３０を介してＶＣＳＥＬ１００Ｂに送られることはなく、また、ＶＣＳＥＬ１００Ｂに送られた駆動信号が、Ｎ型半導体コンタクト層１３０を介してＶＣＳＥＬ１００Ａに送られることもない。すなわち、光伝送モジュール１０及びレセプタクル２０によれば、ＶＣＳＥＬ１００Ａ，１００Ｂ間で十分にアイソレーションをとることができる。 (effect)
According to the optical transmission module 10 and the receptacle 20 configured as described above, sufficient isolation can be obtained between the VCSELs 100A and 100B. More specifically, the VCSELs 100A and 100B are placed on a base substrate 128 that is one substrate. The base substrate 128 is a semi-insulating semiconductor substrate. Thereby, in the VCSELs 100A and 100B, the current (driving signal) flowing from the anode ring electrode 921 causes the P-type semiconductor contact layer 142, the P-type DBR layer 140, the P-type semiconductor clad layer 138, the active layer 136, and the N-type semiconductor. Since the cladding layer 134, the N-type DBR layer 132, the N-type semiconductor contact layer 130, and the cathode electrode 911 pass in this order, they do not pass through the base substrate 128. Therefore, the drive signal sent to the VCSEL 100A is not sent to the VCSEL 100B via the base substrate 128, and the drive signal sent to the VCSEL 100B is not sent to the VCSEL 100A via the base substrate 128. Further, the N-type semiconductor contact layer 130 of the VCSEL 100A and the N-type semiconductor contact layer 130 of the VCSEL 100B are separated. Therefore, the drive signal sent to the VCSEL 100A is not sent to the VCSEL 100B via the N-type semiconductor contact layer 130, and the drive signal sent to the VCSEL 100B is sent to the VCSEL 100A via the N-type semiconductor contact layer 130. It is never sent. That is, according to the optical transmission module 10 and the receptacle 20, sufficient isolation can be obtained between the VCSELs 100A and 100B.
　また、光伝送モジュール１０及びレセプタクル２０では、以下に説明するように、レーザービームＢ１の光学的な損失が低減される。より詳細には、レーザービームＢ１は、相対的に屈折率の大きな樹脂から相対的に屈折率の小さな空気に出射する際に屈折する。そのため、空気中を進行するレーザービームＢ１は、樹脂中を進行するレーザービームＢ１よりも広がりながら伝搬する。したがって、レーザービームＢ１の光学系路において、樹脂の割合を高くし、空気の割合を低くすることにより、レーザービームＢ１の広がりを抑制することができる。そこで、レセプタクル２０では、発光素子アレイ１００から発せられたレーザービームＢ１は、樹脂からなる位置決め部材２００内を通過する。これにより、レーザービームＢ１の光学経路において、樹脂が占める割合が高くなり、空気が占める割合が低くなる。その結果、レーザービームＢ１の広がりが抑制される。よって、光ファイバー６０に入射するレーザービームＢ１の強度が大きくなり、レーザービームＢ１の光学的な損失が低減される。なお、同様の理由により、レーザービームＢ２の光学的な損失も低減される。 In the optical transmission module 10 and the receptacle 20, the optical loss of the laser beam B1 is reduced as described below. More specifically, the laser beam B1 is refracted when being emitted from a resin having a relatively high refractive index to air having a relatively low refractive index. Therefore, the laser beam B1 traveling in the air propagates while spreading more than the laser beam B1 traveling in the resin. Therefore, in the optical system path of the laser beam B1, the spread of the laser beam B1 can be suppressed by increasing the resin ratio and decreasing the air ratio. Therefore, in the receptacle 20, the laser beam B1 emitted from the light emitting element array 100 passes through the positioning member 200 made of resin. As a result, in the optical path of the laser beam B1, the proportion of resin increases and the proportion of air decreases. As a result, the spread of the laser beam B1 is suppressed. Therefore, the intensity of the laser beam B1 incident on the optical fiber 60 is increased, and the optical loss of the laser beam B1 is reduced. For the same reason, the optical loss of the laser beam B2 is also reduced.
　また、光伝送モジュール１０及びレセプタクル２０では、以下に説明するように、レーザービームＢ１の光学的な損失をさらに低減することができる。レセプタクル２０では、発光素子アレイ１００から発せられたレーザービームＢ１は、封止樹脂２４内を通過する。これにより、レーザービームＢ１の光学経路において、樹脂が占める割合が大きくなり、空気が占める割合が小さくなる。その結果、レーザービームＢ１の広がりが抑制される。よって、光ファイバー６０に入射するレーザービームＢ１の強度が大きくなり、レーザービームＢ１の光学的な損失が低減される。なお、同様の理由により、レーザービームＢ２の光学的な損失も低減される。 Further, in the optical transmission module 10 and the receptacle 20, as described below, the optical loss of the laser beam B1 can be further reduced. In the receptacle 20, the laser beam B <b> 1 emitted from the light emitting element array 100 passes through the sealing resin 24. Thereby, in the optical path of the laser beam B1, the proportion occupied by the resin increases and the proportion occupied by the air decreases. As a result, the spread of the laser beam B1 is suppressed. Therefore, the intensity of the laser beam B1 incident on the optical fiber 60 is increased, and the optical loss of the laser beam B1 is reduced. For the same reason, the optical loss of the laser beam B2 is also reduced.
　光伝送モジュール１０及びレセプタクル２０では、図９に示すように、レーザービームＢ１の光路上に全反射面Ｒ１が設けられている。また、全反射面Ｒ１と光ファイバー６０の光軸とが成す角度は４５°であり、全反射面Ｒ１と発光素子アレイ１００とが成す角度は４５°である。すなわち、全反射面Ｒ１と光ファイバー６０の光軸とが成す角度と、全反射面Ｒ１と発光素子アレイ１００とが成す角度は、等しい。これにより、光伝送モジュール１０及びレセプタクル２０では、光ファイバー６０の光軸が、発光素子アレイ１００からのレーザービームＢ１の出射方向と同じｚ軸方向でなくても、光ファイバー６０と発光素子アレイ１００を光学的に結合することができる。 In the optical transmission module 10 and the receptacle 20, as shown in FIG. 9, a total reflection surface R1 is provided on the optical path of the laser beam B1. The angle formed by the total reflection surface R1 and the optical axis of the optical fiber 60 is 45 °, and the angle formed by the total reflection surface R1 and the light emitting element array 100 is 45 °. That is, the angle formed by the total reflection surface R1 and the optical axis of the optical fiber 60 is equal to the angle formed by the total reflection surface R1 and the light emitting element array 100. Thereby, in the optical transmission module 10 and the receptacle 20, the optical fiber 60 and the light emitting element array 100 are optically optical even if the optical axis of the optical fiber 60 is not the same z-axis direction as the emission direction of the laser beam B 1 from the light emitting element array 100. Can be combined.
　光伝送モジュール１０及びレセプタクル２０では、図９に示すように、レーザービームＢ２の光路上に全反射面Ｒ２が設けられている。また、全反射面Ｒ２と光ファイバー６０の光軸とが成す角度は４５°であり、全反射面Ｒ２と受光素子アレイ５０とが成す角度は４５°である。すなわち、全反射面Ｒ２と光ファイバー６０の光軸とが成す角度と、全反射面Ｒ２と受光素子アレイ５０とが成す角度は、等しい。これにより、光伝送モジュール１０及びレセプタクル２０では、光ファイバー６０の光軸が、受光素子アレイ５０の受光方向と同じｚ軸方向でなくても、光ファイバー６０と受光素子アレイ５０を光学的に結合することができる。 In the optical transmission module 10 and the receptacle 20, as shown in FIG. 9, a total reflection surface R2 is provided on the optical path of the laser beam B2. The angle formed by the total reflection surface R2 and the optical axis of the optical fiber 60 is 45 °, and the angle formed by the total reflection surface R2 and the light receiving element array 50 is 45 °. That is, the angle formed by the total reflection surface R2 and the optical axis of the optical fiber 60 is equal to the angle formed by the total reflection surface R2 and the light receiving element array 50. Thereby, in the optical transmission module 10 and the receptacle 20, the optical fiber 60 and the light receiving element array 50 are optically coupled even if the optical axis of the optical fiber 60 is not the same z-axis direction as the light receiving direction of the light receiving element array 50. Can do.
　また、光伝送モジュール１０及びレセプタクル２０では、上述のとおり、光を樹脂内で伝搬させることにより、レーザービームＢ１，Ｂ２の光軸に対する広がりを抑制することができる。これにより、レセプタクル２０に設けられた凸レンズ２３０，２５０及び全反射面Ｒ１，Ｒ２を小さくすることができる。その結果として、光伝送モジュール１０及びレセプタクル２０を小型化でき、低背化が可能となる。 Moreover, in the optical transmission module 10 and the receptacle 20, as described above, the spread of the laser beams B1 and B2 with respect to the optical axis can be suppressed by propagating the light within the resin. Thereby, the convex lenses 230 and 250 and the total reflection surfaces R1 and R2 provided in the receptacle 20 can be reduced. As a result, the optical transmission module 10 and the receptacle 20 can be reduced in size and reduced in height.
　また、図９に示すように、プラグ４０のレセプタクル２０への挿入方向は、光ファイバー６０の光軸と同じｘ軸方向である。これにより、プラグ４０のレセプタクル２０に対する装着が不十分であっても、光ファイバー６０の先端から受光素子アレイ５０又は発光素子アレイ１００までの距離が長くなるだけであり、光ファイバー６０の光軸にズレは発生しない。従って、光伝送モジュール１０によれば、プラグ４０の装着不良に伴う、光ファイバー６０と受光素子アレイ５０又は発光素子アレイ１００との光学的な損失を抑制できる。 Also, as shown in FIG. 9, the insertion direction of the plug 40 into the receptacle 20 is the same x-axis direction as the optical axis of the optical fiber 60. Thereby, even if the plug 40 is not sufficiently attached to the receptacle 20, only the distance from the tip of the optical fiber 60 to the light receiving element array 50 or the light emitting element array 100 is increased, and the optical axis of the optical fiber 60 is not displaced. Does not occur. Therefore, according to the optical transmission module 10, it is possible to suppress optical loss between the optical fiber 60 and the light receiving element array 50 or the light emitting element array 100 due to poor mounting of the plug 40.
　光伝送モジュール１０及びレセプタクル２０では、実装基板２２の裏面に表面実装用電極Ｅ１が設けられている。これにより、光伝送モジュール１０は、光伝送モジュール１０が実装される回路基板に接続用のコネクタを設けることなく表面実装を行うことができる。従って、光伝送モジュール１０を実装する回路基板上での、光伝送モジュール１０の実質的な占有面積を抑えることができる。 In the optical transmission module 10 and the receptacle 20, the surface mounting electrode E <b> 1 is provided on the back surface of the mounting substrate 22. Thereby, the light transmission module 10 can be surface-mounted without providing a connector for connection to the circuit board on which the light transmission module 10 is mounted. Therefore, the substantial occupied area of the light transmission module 10 on the circuit board on which the light transmission module 10 is mounted can be suppressed.
　光伝送モジュール１０及びレセプタクル２０では、図９に示すように、位置決め部材２００の光結合部２２４の裏面に凸レンズ２３０が設けられている。従って、発光素子アレイ１００からのレーザービームＢ１は、凸レンズ２３０を通過する。このとき、発光素子アレイ１００の位置が、位置決め部材２２０に対して位置ズレを起こしていた場合でもあっても、凸レンズ２３０によりレーザービームＢ１は、集光又はコリメートされて全反射面Ｒ１に進行する。従って、レセプタクル２０及び光伝送モジュール１０によれば、発光素子アレイ１００の位置ズレによる光学的損失を抑制することができる。 In the optical transmission module 10 and the receptacle 20, as shown in FIG. 9, a convex lens 230 is provided on the back surface of the optical coupling portion 224 of the positioning member 200. Accordingly, the laser beam B 1 from the light emitting element array 100 passes through the convex lens 230. At this time, even if the position of the light emitting element array 100 is shifted from the positioning member 220, the laser beam B1 is condensed or collimated by the convex lens 230 and proceeds to the total reflection surface R1. . Therefore, according to the receptacle 20 and the optical transmission module 10, it is possible to suppress optical loss due to the positional deviation of the light emitting element array 100.
　光伝送モジュール１０及びレセプタクル２０では、図９に示すように、位置決め部材２４０の光結合部２４４の裏面に凸レンズ２５０が設けられている。従って、光ファイバー６０から出射されたレーザービームＢ２は、凸レンズ２５０を通過する。このとき、全反射面Ｒ２で反射されたレーザービームＢ２の光軸がずれていた場合であっても、凸レンズ２５０により、レーザービームＢ２は集光又はコリメートされて受光素子アレイ５０に進行する。従って、レセプタクル２０及び光伝送モジュール１０によれば、レーザービームＢ２の光軸ズレによる光学的損失を抑制することができる。 In the optical transmission module 10 and the receptacle 20, a convex lens 250 is provided on the back surface of the optical coupling portion 244 of the positioning member 240 as shown in FIG. Accordingly, the laser beam B <b> 2 emitted from the optical fiber 60 passes through the convex lens 250. At this time, even if the optical axis of the laser beam B 2 reflected by the total reflection surface R 2 is shifted, the laser beam B 2 is condensed or collimated by the convex lens 250 and proceeds to the light receiving element array 50. Therefore, according to the receptacle 20 and the optical transmission module 10, the optical loss due to the optical axis shift of the laser beam B2 can be suppressed.
　光伝送モジュール１０では、図９に示すように、送信側プラグ４２の端面Ｓ１０に凸レンズ４４が設けられている。従って、全反射面Ｒ１で反射されたレーザービームＢ１は、凸レンズ４４を通過する。このとき、レーザービームＢ１が、凸レンズ４４により集光又はコリメートされて光ファイバー６０に進行する。従って、光伝送モジュール１０によれば、レーザービームＢ１の光軸ズレによる光学的損失を抑制することができる。 In the optical transmission module 10, as shown in FIG. 9, a convex lens 44 is provided on the end surface S <b> 10 of the transmission side plug 42. Accordingly, the laser beam B1 reflected by the total reflection surface R1 passes through the convex lens 44. At this time, the laser beam B 1 is condensed or collimated by the convex lens 44 and travels to the optical fiber 60. Therefore, according to the optical transmission module 10, it is possible to suppress optical loss due to the optical axis shift of the laser beam B1.
　光伝送モジュール１０では、図９に示すように、受信側プラグ４６の端面Ｓ１５に凸レンズ４８が設けられている。従って、光ファイバー６０から出射されたレーザービームＢ２は、凸レンズ４８を通過する。このとき、光ファイバー６０の位置が、プラグ４０に対して位置ズレを起こしていた場合でもあっても、凸レンズ４８によりレーザービームＢ２は、集光又はコリメートされて全反射面Ｒ２に進行する。従って、光伝送モジュール１０によれば、光ファイバー６０の位置ズレによる光学的損失を抑制することができる。 In the optical transmission module 10, as shown in FIG. 9, a convex lens 48 is provided on the end surface S <b> 15 of the receiving side plug 46. Therefore, the laser beam B2 emitted from the optical fiber 60 passes through the convex lens 48. At this time, even if the position of the optical fiber 60 is misaligned with respect to the plug 40, the laser beam B2 is condensed or collimated by the convex lens 48 and proceeds to the total reflection surface R2. Therefore, according to the optical transmission module 10, it is possible to suppress optical loss due to the positional deviation of the optical fiber 60.
　光伝送モジュール１０では、プラグ４０の強度の向上を図ることができる。図１４は、従来のレセプタクル４００及びプラグ４１の断面図である。より詳細には、図１４に示す光伝送モジュール４００のように、位置決め部材２００全体が封止樹脂２５の表面に設けられていると、プラグ４１のｚ軸方向の厚みが薄くなってしまう。そのため、プラグ４１の強度が低下してしまう。そこで、光伝送モジュール１０では、図９に示すように、位置決め部材２００が、実装基板２２及び封止樹脂２４に跨って設けられている。また、プラグ４０は、位置決め部材２００のプラグガイド部２２２，２４２上に位置する。さらに、プラグガイド部２２２，２４２の溝Ｇ１，Ｇ２の高さｈ１，ｈ３は、封止樹脂２４の高さｈ２よりも低い。そして、光ファイバー６０の光軸は、封止樹脂２４よりもｚ軸方向の正方向側に位置する。これにより、光伝送モジュール１０では、図１４に示す光伝送モジュール４００と比較して、プラグ４０をｚ軸方向に大きくすることができる。従って、光伝送モジュール１０では、強度の向上を図ることができる。 In the optical transmission module 10, the strength of the plug 40 can be improved. FIG. 14 is a cross-sectional view of a conventional receptacle 400 and plug 41. More specifically, when the entire positioning member 200 is provided on the surface of the sealing resin 25 as in the optical transmission module 400 illustrated in FIG. 14, the thickness of the plug 41 in the z-axis direction is reduced. Therefore, the strength of the plug 41 is reduced. Therefore, in the optical transmission module 10, as shown in FIG. 9, the positioning member 200 is provided across the mounting substrate 22 and the sealing resin 24. Further, the plug 40 is positioned on the plug guide portions 222 and 242 of the positioning member 200. Further, the heights h1 and h3 of the grooves G1 and G2 of the plug guide portions 222 and 242 are lower than the height h2 of the sealing resin 24. The optical axis of the optical fiber 60 is located on the positive side in the z-axis direction with respect to the sealing resin 24. Thereby, in the optical transmission module 10, compared with the optical transmission module 400 shown in FIG. 14, the plug 40 can be enlarged in the z-axis direction. Therefore, the optical transmission module 10 can improve the strength.
　また、光伝送モジュール１０では、プラグ４０をｚ軸方向に大きくすることが可能となったため、光伝送モジュール４００のプラグ４１よりも握りやすい。従って、光伝送モジュール１０では、プラグ４０のレセプタクル２０に対する接続作業が容易である。 Further, in the optical transmission module 10, since the plug 40 can be enlarged in the z-axis direction, it is easier to grip than the plug 41 of the optical transmission module 400. Therefore, in the optical transmission module 10, it is easy to connect the plug 40 to the receptacle 20.
　また、光伝送モジュール１０における金属キャップ３０と実装基板２２の間には、図１に示すように、開口部Ａ３が設けられている。プラグ４０の接続は、開口部Ａ３からプラグ４０を挿入することにより行われる。従って、光伝送モジュール１０では、プラグ４０を着脱する際に、金属キャップ３０を取り外す必要がなく、プラグ４０の着脱作業が容易である。 Further, an opening A3 is provided between the metal cap 30 and the mounting substrate 22 in the optical transmission module 10 as shown in FIG. The plug 40 is connected by inserting the plug 40 from the opening A3. Therefore, in the optical transmission module 10, it is not necessary to remove the metal cap 30 when attaching / detaching the plug 40, and the attachment / detachment work of the plug 40 is easy.
　また、金属キャップ３０には、プラグ４０を固定するための係合部３２ａ～３２ｄが設けられている。これにより、プラグ４０の位置決め部材２００に対する位置ズレが防止される。結果として、光ファイバー６０の光軸ズレが防止される。従って、光伝送モジュール１０によれば、光ファイバー６０の光軸ズレを防止し、光学的損失を抑制することができる。 Further, the metal cap 30 is provided with engaging portions 32a to 32d for fixing the plug 40. Thereby, the position shift with respect to the positioning member 200 of the plug 40 is prevented. As a result, the optical axis shift of the optical fiber 60 is prevented. Therefore, according to the optical transmission module 10, the optical axis shift of the optical fiber 60 can be prevented and the optical loss can be suppressed.
　光伝送モジュール１０及びレセプタクル２０の製造方法では、以下に説明するように、発光素子アレイ１００と凸レンズ２３０との間で位置ズレが発生することを抑制できる。より詳細には、位置決め部材２００が実装基板２２に取り付けられる際には、従来は、図１５に示すような、実装基板２２に設けられたピンＰ１を用いていた。実装基板２２に設けられたピンＰ１を位置決め部材２００に設けられた孔Ｈ９に差し込むことにより、位置決め部材２００が実装基板２２に固定される。この場合、実装基板２２上のＰ１の製造時の位置ズレや発光素子アレイ１００の実装時の位置ズレにより、発光素子アレイ１００と位置決め部材２００の凸レンズ２３０との間で位置ズレが生じる。 In the manufacturing method of the optical transmission module 10 and the receptacle 20, it is possible to suppress the occurrence of positional deviation between the light emitting element array 100 and the convex lens 230 as described below. More specifically, when the positioning member 200 is attached to the mounting board 22, conventionally, a pin P1 provided on the mounting board 22 as shown in FIG. 15 has been used. The positioning member 200 is fixed to the mounting substrate 22 by inserting the pin P <b> 1 provided on the mounting substrate 22 into the hole H <b> 9 provided in the positioning member 200. In this case, a positional deviation occurs between the light emitting element array 100 and the convex lens 230 of the positioning member 200 due to a positional deviation when the P1 is manufactured on the mounting substrate 22 or a positional deviation when the light emitting element array 100 is mounted.
　そこで、光伝送モジュール１０及びレセプタクル２０の製造方法では、位置決め部材２００を実装基板２２に取り付ける際に、発光素子アレイ１００の発光部の中心Ｔ１００と凸レンズ２３０のレンズ中心Ｔ２３０との位置関係を位置確認用カメラで確認しつつ、位置決め部材２００を実装基板２２に載置する。よって、発光素子アレイ１００と凸レンズ２３０とがピンＰ１を介することなく直接に位置決めされるようになる。その結果、光伝送モジュール１０及びレセプタクル２０の製造方法では、実装基板２２上におけるＰ１の位置ズレや発光素子アレイ１００の位置ズレを考慮する必要がなく、発光素子アレイ１００と凸レンズ２３０との間で位置ズレが生じることが抑制される。なお、同様の理由により、受光素子アレイ５０と凸レンズ２５０との間で位置ズレが生じることも抑制される。 Therefore, in the method for manufacturing the optical transmission module 10 and the receptacle 20, when the positioning member 200 is attached to the mounting substrate 22, the positional relationship between the center T100 of the light emitting part of the light emitting element array 100 and the lens center T230 of the convex lens 230 is confirmed. The positioning member 200 is placed on the mounting substrate 22 while checking with the camera for use. Therefore, the light emitting element array 100 and the convex lens 230 are directly positioned without going through the pin P1. As a result, in the method for manufacturing the optical transmission module 10 and the receptacle 20, it is not necessary to consider the positional deviation of P1 on the mounting substrate 22 or the positional deviation of the light emitting element array 100, and between the light emitting element array 100 and the convex lens 230. The occurrence of misalignment is suppressed. For the same reason, positional deviation between the light receiving element array 50 and the convex lens 250 is also suppressed.
（変形例）
　以下に、変形例に係る光伝送モジュール１０’の構成について説明する。図１６は、変形例に係る光伝送モジュール１０’及びレセプタクル２０’の断面図である。外観図については、図１を援用する。 (Modification)
Below, the structure of optical transmission module 10 'which concerns on a modification is demonstrated. FIG. 16 is a cross-sectional view of an optical transmission module 10 ′ and a receptacle 20 ′ according to a modification. FIG. 1 is used for the external view.
　光伝送モジュール１０と光伝送モジュール１０’との相違点は、位置決め部材２００に凸レンズが更に設けられている点である。その他の点については、光伝送モジュール１０と光伝送モジュール１０’とでは相違しないので、説明を省略する。なお、図１６において、光伝送モジュール１０と同じ構成については、光伝送モジュール１０と同じ符号を付した。 The difference between the light transmission module 10 and the light transmission module 10 ′ is that the positioning member 200 is further provided with a convex lens. Since the other points are not different between the optical transmission module 10 and the optical transmission module 10 ', description thereof will be omitted. In FIG. 16, the same components as those of the light transmission module 10 are denoted by the same reference numerals as those of the light transmission module 10.
　図１６に示すように、位置決め部材２２０の全反射面Ｒ１には、凸レンズ２３２が設けられている。これにより、発光素子アレイ１００から出射されたレーザービームＢ１は、凸レンズ２３２により集光又はコリメートされて、光ファイバー６０に伝送される。従って、光伝送モジュール１０’によれば、光伝送モジュール１０と比較して、更に光学的損失を抑制することができる。 As shown in FIG. 16, a convex lens 232 is provided on the total reflection surface R <b> 1 of the positioning member 220. Thereby, the laser beam B 1 emitted from the light emitting element array 100 is condensed or collimated by the convex lens 232 and transmitted to the optical fiber 60. Therefore, according to the optical transmission module 10 ′, optical loss can be further suppressed as compared with the optical transmission module 10.
　また、位置決め部材２２０における送信側プラグ４２と対向する面には、図１６に示すように、凸レンズ２３４（第２の凸レンズ）が設けられている。これにより、全反射面Ｒ１で反射されたレーザービームＢ１は、凸レンズ２３４により集光又はコリメートされて、光ファイバー６０に伝送される。従って、光伝送モジュール１０’によれば、光伝送モジュール１０と比較して、更に光学的損失を抑制することができる。 Further, a convex lens 234 (second convex lens) is provided on the surface of the positioning member 220 facing the transmission side plug 42 as shown in FIG. As a result, the laser beam B 1 reflected by the total reflection surface R 1 is collected or collimated by the convex lens 234 and transmitted to the optical fiber 60. Therefore, according to the optical transmission module 10 ′, optical loss can be further suppressed as compared with the optical transmission module 10.
　位置決め部材２４０の全反射面Ｒ２には、凸レンズ２５２が設けられている。これにより、光ファイバー６０から出射されたレーザービームＢ２は、凸レンズ２５２により集光又はコリメートされて、受光素子アレイ５０に伝送される。従って、光伝送モジュール１０’によれば、光伝送モジュール１０と比較して、更に光学的損失を抑制することができる。 A convex lens 252 is provided on the total reflection surface R2 of the positioning member 240. As a result, the laser beam B <b> 2 emitted from the optical fiber 60 is condensed or collimated by the convex lens 252 and transmitted to the light receiving element array 50. Therefore, according to the optical transmission module 10 ′, optical loss can be further suppressed as compared with the optical transmission module 10.
　また、位置決め部材２４０における受信側プラグ４６と対向する面には、図１６に示すように、凸レンズ２５４が設けられている。これにより、光ファイバー６０から出射されたレーザービームＢ２は、凸レンズ２５４により集光又はコリメートされて、全反射面Ｒ２に伝送される。従って、光伝送モジュール１０’によれば、光伝送モジュール１０と比較して、更に光学的損失を抑制することができる。 Further, a convex lens 254 is provided on the surface of the positioning member 240 facing the receiving side plug 46 as shown in FIG. Thereby, the laser beam B2 emitted from the optical fiber 60 is condensed or collimated by the convex lens 254 and transmitted to the total reflection surface R2. Therefore, according to the optical transmission module 10 ′, optical loss can be further suppressed as compared with the optical transmission module 10.
（その他の実施形態）
　本発明に係るレセプタクル及び光伝送モジュールは、前記実施形態に係る光伝送モジュール１０，１０’に限らずその要旨の範囲内において変更可能である。 (Other embodiments)
The receptacle and the optical transmission module according to the present invention are not limited to the optical transmission modules 10 and 10 'according to the above-described embodiment, and can be changed within the scope of the gist thereof.
　以上のように、本発明は、レセプタクル及び光伝送モジュールに対して有用であり、特に各ＶＣＳＥＬ間のアイソレーションを確保できる点において優れている。 As described above, the present invention is useful for receptacles and optical transmission modules, and is particularly excellent in that isolation between VCSELs can be secured.
　Ｅ１　表面実装用電極
　Ｒ１，Ｒ２　全反射面
　１０　光伝送モジュール
　２０　レセプタクル
　２２　実装基板
　２４　封止樹脂
　３０　金属キャップ
　３２ａ～３２ｄ　係合部
　４０　プラグ
　５０　受光素子アレイ
　６０　光ファイバー
　１００　発光素子アレイ
　１００Ａ，１００Ｂ　ＶＣＳＥＬ（垂直共振器面発光レーザ）
　１２８　ベース基板
　１６０　発光領域多層部
　２００　位置決め部材
　２３０，２３２，２３４，２５０，２５２，２５４　凸レンズ
　９１１　カソード用電極
　９２１　アノード用リング電極 E1 Surface mounting electrode R1, R2 Total reflection surface 10 Optical transmission module 20 Receptacle 22 Mounting substrate 24 Sealing resin 30 Metal cap 32a-32d Engagement part 40 Plug 50 Light receiving element array 60 Optical fiber 100 Light emitting element array 100A, 100B VCSEL ( Vertical cavity surface emitting laser)
128 Base substrate 160 Light emitting region multilayer portion 200 Positioning member 230, 232, 234, 250, 252 and 254 Convex lens 911 Cathode electrode 921 Anode ring electrode

Claims (8)

  1. 　光ファイバーの一端に設けられたプラグが接続されるレセプタクルであって、
    　複数の垂直共振器面発光レーザが一体化されてなる発光素子アレイと、
    　複数の前記光ファイバーのコアと複数の前記垂直共振器面発光レーザとをそれぞれ光学的に結合させる位置決め部材と、
    　前記発光素子アレイが実装される実装基板と、
    　を備え、
    　前記発光素子アレイは、
    　　ベース基板と、
    　　該ベース基板の表面に形成された、Ｎ型半導体多層膜反射層、量子井戸を備える活性層及びＰ型半導体多層膜反射層を含む発光領域多層部と、
    　　前記Ｐ型半導体多層膜反射層に接続されるアノード用電極と、
    　　前記Ｎ型半導体多層膜反射層に接続されるカソード用電極と、
    　　を備え、
    　前記ベース基板の少なくとも前記発光領域多層部側の所定部分が、半絶縁性半導体からなり、
    　前記カソード用電極は、前記ベース基板の表面側に形成されており、
    　前記発光領域多層部、前記アノード用電極及び前記カソード用電極からなる垂直共振器面発光レーザの組は、前記ベース基板に複数形成されていること、
    　を特徴とするレセプタクル。     A receptacle to which a plug provided at one end of an optical fiber is connected,
    A light emitting element array in which a plurality of vertical cavity surface emitting lasers are integrated;
    A positioning member for optically coupling the plurality of optical fiber cores and the plurality of vertical cavity surface emitting lasers;
    A mounting substrate on which the light emitting element array is mounted;
    With
    The light emitting element array is:
    A base substrate;
    A light emitting region multilayer portion including an N-type semiconductor multilayer reflective layer, an active layer having a quantum well, and a P-type semiconductor multilayer reflective layer formed on the surface of the base substrate;
    An anode electrode connected to the P-type semiconductor multilayer reflective layer;
    A cathode electrode connected to the N-type semiconductor multilayer reflective layer;
    With
    A predetermined portion on at least the light emitting region multilayer portion side of the base substrate is made of a semi-insulating semiconductor,
    The cathode electrode is formed on the surface side of the base substrate,
    A plurality of sets of vertical cavity surface emitting lasers composed of the light emitting region multilayer part, the anode electrode and the cathode electrode are formed on the base substrate;
    A receptacle characterized by.
  2. 　前記発光素子アレイを覆う封止樹脂
    　を更に備え、
    　前記光ファイバーと前記発光素子アレイとを結ぶ光路は、前記封止樹脂を通過すること、
    　を特徴とする請求項１に記載のレセプタクル。     A sealing resin covering the light emitting element array;
    An optical path connecting the optical fiber and the light emitting element array passes through the sealing resin;
    The receptacle according to claim 1.
  3. 　前記位置決め部材における前記発光素子アレイと対向し、かつ、前記発光素子アレイから出射されるレーザービームを集光又はコリメートする第１の凸レンズが設けられていること、
    　を特徴とする請求項１又は請求項２に記載のレセプタクル。     A first convex lens facing the light emitting element array in the positioning member and condensing or collimating a laser beam emitted from the light emitting element array;
    The receptacle according to claim 1 or 2, characterized by the above-mentioned.
  4. 　前記位置決め部材には、前記発光素子アレイから出射されるレーザービームを集光又はコリメートする第２の凸レンズが設けられ、
    　前記第２の凸レンズは、前記位置決め部材における前記光ファイバーの光軸上に存在し、前記プラグと対向すること、
    　を特徴とする請求項１乃至請求項３のいずれかに記載のレセプタクル。     The positioning member is provided with a second convex lens that condenses or collimates the laser beam emitted from the light emitting element array,
    The second convex lens is present on the optical axis of the optical fiber in the positioning member and is opposed to the plug;
    The receptacle according to any one of claims 1 to 3.
  5. 　前記基板の裏面には表面実装用電極が設けられていること、
    　を特徴とする請求項１乃至請求項４のいずれかに記載のレセプタクル。     Surface mounting electrodes are provided on the back surface of the substrate,
    The receptacle according to any one of claims 1 to 4, wherein:
  6. 　請求項１乃至請求項５のいずれかに記載のレセプタクルと、
    　前記光ファイバーの一端に設けられたプラグと、
    　を備え、
    　前記プラグには、前記光ファイバーの光軸上に存在し、かつ、前記位置決め部材と対向する第３の凸レンズが設けられていること、
    　を特徴とする光伝送モジュール。     A receptacle according to any one of claims 1 to 5;
    A plug provided at one end of the optical fiber;
    With
    The plug is provided with a third convex lens that exists on the optical axis of the optical fiber and faces the positioning member;
    An optical transmission module characterized by the above.
  7. 　請求項１乃至請求項５のいずれかに記載のレセプタクルと、
    　前記光ファイバーの一端に設けられたプラグと、
    　を備え、
    　前記光ファイバーの光軸と前記プラグの挿入方向が平行であること、
    　を特徴とする光伝送モジュール。     A receptacle according to any one of claims 1 to 5;
    A plug provided at one end of the optical fiber;
    With
    The optical axis of the optical fiber and the insertion direction of the plug are parallel,
    An optical transmission module characterized by the above.
  8. 　請求項１乃至請求項５のいずれかに記載のレセプタクルと、
    　前記光ファイバーの先端に設けられたプラグと、
    　を更に備え、
    　前記レセプタクルは、前記プラグ、前記位置決め部材及び前記発光素子アレイを覆うキャップを更に備え、
    　前記プラグ及び前記キャップには、係合手段が設けられていること、
    　を特徴とする光伝送モジュール。     A receptacle according to any one of claims 1 to 5;
    A plug provided at the tip of the optical fiber;
    Further comprising
    The receptacle further includes a cap that covers the plug, the positioning member, and the light emitting element array,
    The plug and the cap are provided with engagement means,
    An optical transmission module characterized by the above.
PCT/JP2013/071773 2012-08-23 2013-08-12 Receptacle and optical transmission module WO2014030562A1 (en)

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TW201423185A (en) 2014-06-16

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