WO2014023740A1

WO2014023740A1 - Organic light-emitting diode module and method for producing same

Info

Publication number: WO2014023740A1
Application number: PCT/EP2013/066500
Authority: WO
Inventors: Simon SCHICKTANZ; Erwin Lang
Original assignee: Osram Opto Semiconductors Gmbh
Priority date: 2012-08-09
Filing date: 2013-08-06
Publication date: 2014-02-13
Also published as: DE102012214216A1

Abstract

An organic light-emitting diode module (10) is specified, comprising: a carrier substrate (1) having a first main surface (11) and a second main surface (12), a functional layer stack (2), which is arranged on the first main surface (11) and comprises a first electrode layer (21), an organic active layer sequence (23) and a second electrode layer (22), at least one plated-through hole (41, 42) in the carrier substrate (1), electrical conductor tracks (4) arranged at the second main surface (12), wherein at least one of the conductor tracks (4) is electrically conductively connected to the functional layer stack (2) by means of the at least one plated-through hole (41, 42), and at least one electronic component (5) for driving the functional layer stack (2), said at least one electronic component being arranged at the second main surface (12) and electrical contact being made with said at least one electronic component by means of the conductor tracks (4). A method for producing the organic light-emitting diode module (10) is furthermore specified.

Description

description

Organic light emitting diode module and method for its

manufacturing

The invention relates to a light-emitting diode module which has an organic light-emitting active layer sequence.

This patent application claims the priority of German Patent Application 10 2012 214 216.9, the disclosure of which is hereby incorporated by reference.

Organic light emitting diodes (OLEDs) for lighting are typically operated at a fixed current level to achieve a constant brightness. For this purpose, a constant current driver is usually used, i. H. an electronic component or an electronic

Circuit which generates a constant current for operation of the organic light-emitting diode from a mains voltage or from a voltage delivered by a ballast.

Such constant current drivers or other electronic components for controlling organic light emitting diode modules are usually arranged on separate circuit boards and electrically connected to the organic light emitting diode module with a Kontaktierverfahren, for example by means of bonding or spring contacts.

An object to be solved is to provide an improved organic light emitting diode module, which

in particular by a compact design and a

improved protection against environmental influences. Furthermore, an advantageous method for producing the organic light emitting diode module is to be specified.

These objects are achieved by an organic light emitting diode module and a method of producing an organic light emitting diode

Light emitting diode module solved according to the independent claims. Advantageous embodiments and modifications of the invention are the subject of the dependent claims. The organic light-emitting diode module according to at least one embodiment comprises a carrier substrate which has a first

Main surface and one of the first major surface opposite second major surface. On the first main surface of the carrier substrate, a functional layer stack is arranged. The functional layer stack comprises a first electrode layer, an organic active layer sequence and a second one

Electrode layer. The organic active layer sequence has at least one organic light-emitting layer.

The organic active layer sequence is between the first electrode layer and the second electrode layer

arranged and is contacted in this way electrically. The first electrode layer can be arranged, for example, on the side of the active layer sequence facing the carrier substrate and form the anode. The second

Electrode layer, for example, on the of

Be arranged carrier substrate side facing away from the active layer sequence and form the cathode. The ones from

Carrier substrate remote second electrode layer is preferably for the of the active layer sequence

emitted radiation transparent. In particular, the organic light-emitting diode module can light into one of the carrier substrate emit the opposite direction. Such a light-emitting diode module is also referred to as a top emitter. It is also possible that the carrier substrate is transparent, so that at least a part of the emitted light through the carrier substrate

is emitted.

According to at least one embodiment is in the

Carrier substrate at least one via

formed, which forms an electrically conductive connection between the first and the second main surface of the carrier substrate. The at least one via can, in particular, pass through the carrier substrate

be extending through hole, which is filled with an electrically conductive material, in particular a metal. The carrier substrate itself advantageously has a

electrically insulating material, in particular a

Plastic, up.

On the second major surface of the carrier substrate are

arranged electrical conductor tracks, wherein at least one of the conductor tracks by means of at least one

Through connection with the functional layer stack is electrically connected. In particular, the first electrode layer of the functional layer stack can be connected by means of the through-connection to at least one conductor track on the second main surface of the carrier substrate.

Also advantageous is the second electrode layer of the

functional layer stack connected to at least one further via with another interconnect. There may be further printed conductors on the first main surface of the carrier substrate or in the interior of the carrier substrate

be arranged, for example, serve to improve the power distribution. At least one electronic component for controlling the functional layer stack is furthermore arranged on the second main surface of the carrier substrate. The electronic component is electrically conductive by means of the conductor tracks

contacted. In particular, this is at least one

electronic component for controlling the functional layer stack via the conductor track and the at least one through-connection with at least one of

Electrode layers of the functional layer stack connected. It is possible that in addition one or more electronic components are arranged on the first main surface of the carrier substrate. In the case of the organic light-emitting diode module described here, the functional layer stack and the at least one electronic component for driving the functional layer stack are advantageously on opposite sides

Main surfaces of the carrier substrate arranged. The at least one electronic component is in particular not arranged on a separate printed circuit board, so that it is advantageously possible to dispense with connecting wires between a separate printed circuit board and the carrier substrate of the functional layer stack. Rather, the electrical connection between the at least one electronic component and the functional layer stack is advantageously effected by means of the at least one through-connection through the carrier substrate. In this way is advantageous

achieved particularly compact organic light emitting diode module. Furthermore, the electrical connection between the

electronic component and the functional

Layers stack, by means of the via is realized, advantageous especially well before outer

Protected influences.

The at least one electronic component is preferably used as a constant current driver for the operation of the functional

Layer stack with a constant current

set up. The constant-current driver can also be realized by a plurality of electronic components, which are arranged on the second main surface of the carrier substrate and interconnected by means of the conductor tracks.

The fact that the constant current driver is integrated in the organic light emitting diode module, the organic

Light emitting diode module advantageously directly to a

Supply voltage, such as a mains voltage or to a voltage supplied by a power supply, be connected.

According to one embodiment, a plurality of electronic components are arranged on the second main surface of the carrier substrate. As already mentioned, in particular a constant-current driver for the functional layer stack can be realized by a circuit having a plurality of electronic components. Furthermore, it is possible that in addition to the

Constant current driver further electronic components are arranged on the second main surface of the carrier substrate. This may, for example, be a logical one

Circuit or act on an RFID chip. The plurality of electronic components on the second main surface of the carrier substrate are advantageously contacted via the conductor tracks and optionally interconnected.

The carrier substrate is preferably a printed circuit board. The carrier substrate may, for example, as a rigid circuit board be executed, for example, contains FR4 or a liquid crystalline plastic (LCP). In another advantageous embodiment, the printed circuit board is a flexible printed circuit board, which may in particular comprise a polyimide such as Kapton. Such a flexible printed circuit board is also referred to as Flex-PCB.

In an advantageous embodiment, at least the functional layer stack is provided with an encapsulation layer. Due to the encapsulation layer of the

functional layer stack advantageous

Environmental influences, in particular against the ingress of

Moisture, protected. The encapsulation layer is preferably a so-called thin-film encapsulation, which is formed from one or more thin layers. Thin-film encapsulation layers are known, for example, from the publications WO 2009/095006 Al and WO 2010/108894 Al, their respective

The disclosure hereby is hereby fully incorporated by reference. In particular, from the

cited publications suitable materials, layer thicknesses and methods for applying the encapsulation layer, which are therefore not explained in detail here.

For example, the individual layers of the thin-film encapsulation may each have a thickness between an atomic layer and about 1 μm. The total thickness of the encapsulation layer is for example less than 10 μm, less than 1 μm or even less than 100 nm. The thin-film encapsulation preferably contains one or more metal oxide layers. Preferably, all exposed surfaces of the

functional layer stack covered by the encapsulation layer, so no contact between the functional

Layer stack and the surrounding medium, in particular air, consists. The encapsulation layer is advantageously produced by means of plasma-assisted chemical vapor deposition (PE-CVD).

Atomic layer deposition (ALD),

Molecular deposition (MLD, molecular layer deposition) or thermal evaporation applied.

In an advantageous embodiment, the at least one electronic component is also provided with the encapsulation layer. In this way it is achieved that the

Encapsulation layer advantageous also the electronic

Component against environmental influences, in particular ago

Moisture, protects.

Particularly advantageous are all exposed surfaces of the carrier substrate, the functional layer stack and the at least one electronic component with the

Encapsulation layer provided. In this context, exposed surfaces are those surfaces of the carrier substrate, of the functional layer stack and of the at least one electronic component which, apart from the encapsulation layer, are not directly adjacent to further layers of the light-emitting diode module. The encapsulation layer advantageously prevents direct contact of the

exposed surfaces with the surrounding medium.

The encapsulation layer may in one embodiment

partially between the carrier substrate and the

be arranged functional layer stack. In a further advantageous embodiment, the at least one electronic component follows at the from

Carrier substrate side facing away from a protective layer for

Protection against mechanical damage after. If appropriate, the protective layer may be applied to the encapsulation layer if the at least one electronic component is advantageously provided with an encapsulation layer. The protective layer is preferably one

Silicone layer. While the encapsulation layer in particular prevents the ingress of moisture, the

Protective layer substantially for protection against mechanical damage and advantageously has a greater thickness than the encapsulation layer.

In a further advantageous embodiment, the functional layer stack has a protective layer on the side facing away from the carrier substrate for protection

mechanical damage. The protective layer for the functional layer stack serves, in particular, to protect the functional layer stack from scratching.

The protective layer for the functional layer stack is preferably a glass layer or a plastic layer. The protective layer may in particular be adhered to the functional layer stack or be laminated, for example, as a film.

In one embodiment of the organic light emitting diode module, the electrical connection contacts of the

Light emitting diode module on the first main surface of the

Carrier substrate arranged. In this embodiment, the electrical connection contacts, for example, in addition to the functional layer stack on the carrier substrate

arranged and by means of vias with the

at least one electronic component electrically conductively connected to the second main surface of the carrier substrate.

In an alternative embodiment, the electrical connection contacts of the light-emitting diode module at the second

Main surface of the carrier substrate arranged. At this

Design are the electrical connection contacts

for example, by means of the conductor tracks with the at least one electronic component and by means of

Via contacts electrically conductively connected to the functional layer stack on the first main surface of the carrier substrate.

The process for producing an organic

Light emitting diode module comprises according to at least one

Embodiment providing a carrier substrate having a first major surface and a second major surface opposite the first major surface, forming a via in the carrier substrate to form an electrically conductive connection between the first and second major surfaces of the carrier substrate, forming conductive traces at the second Main area of the

Carrier substrate, the assembly of the second main surface with at least one electronic component, and the

subsequent application of a functional layer stack to the first major surface, wherein the functional

Layer stack comprises a first electrode layer, an organic active layer sequence and a second electrode layer. In the method, the application of the functional layer stack on the first major surface of the

Carrier substrate advantageous only after the populating the second main surface with the at least one electronic component. This has the advantage that the at least one electronic component can be mounted by means of a soldering process on one of the conductor tracks, in which

comparatively high temperatures can be used. In particular, the one or more electronic components can be mounted on the second main surface of the carrier substrate by means of reflow soldering. By equipping the second main surface with the at least one electronic component before applying the functional

Layer stack will damage the functional

Layer stack prevented by high temperatures during the soldering process.

In an advantageous embodiment of the method is on exposed surfaces of the carrier substrate, the

functional layer stack and the at least one electronic component an encapsulation layer

applied. In particular, the carrier substrate, the functional layer stack and the at least one

electronic component advantageously be provided simultaneously with the encapsulation layer. In this way, the carrier substrate, the functional layer stack and the at least one electronic component are advantageously protected from environmental influences, in particular from the penetration of

Moisture, protected. The application of the

Encapsulation layer is preferably carried out by means

Atomic layer deposition or by means of plasma-assisted chemical vapor deposition. Further advantageous embodiments of the method will be apparent from the description of the

Light-emitting diode module and vice versa.

The invention will be described below with reference to two

Embodiments in connection with Figures 1 and 2 explained in more detail.

1A shows a schematic representation of a side view of an organic light-emitting diode module according to a first exemplary embodiment,

Figure 1B is a schematic representation of a plan view of the light emitting diode module according to the first

Embodiment,

Figure IC is a schematic representation of a view of

below the light emitting diode module according to the first

Embodiment,

FIG. 2A is a schematic representation of a side view of an organic light-emitting diode module according to a second exemplary embodiment,

Figure 2B is a schematic representation of a plan view of the light emitting diode module according to the second

Embodiment, and Figure 2C is a schematic representation of a view of

below the light emitting diode module according to the second embodiment. Identical or equivalent components are each provided with the same reference numerals in the figures. The

Components shown and the proportions of the components with each other are not to be regarded as true to scale.

The first exemplary embodiment of the organic light-emitting diode module 10 shown in a view from below in FIG. The

Carrier substrate 1 may in particular be a printed circuit board. Depending on the application of the organic light-emitting diode module 10, the carrier substrate 1 can be designed to be either rigid or flexible. Suitable materials for a rigid carrier substrate 1 are, for example, FR4 or a liquid crystal plastic. As a flexible carrier substrate 1, in particular a so-called flex-PCB is suitable, which contains, for example, polyimide. Alternatively, however, other materials for the carrier substrate 1 are suitable. The requirements for the material of the carrier substrate 1 are that it is the deposition of

Tracks 4 allows and sufficient

Has heat resistance to temperatures typically encountered in the organic process

Light emitting diode module 10, in particular during the coating and encapsulation occur.

The carrier substrate 1 has a first main surface 11 and a second main surface 12. On the first main surface 11 of the carrier substrate 1, a functional layer stack 2 is arranged, starting from the carrier substrate 1, a first

Electrode layer 21, an organic active layer sequence 23 and a second electrode layer 22 has. The organic active disposed between the first electrode layer 21 and the second electrode layer 22

Layer sequence 23 may comprise layers with organic polymers, organic oligomers, organic monomers, organic small, non-polymeric molecules ("small molecules") or combinations thereof

Layer sequence 23 has at least one light-emitting organic layer. The organic active layer sequence 23 can have, in addition to at least one light-emitting organic layer, further functional layers, in particular for injection, transport or blocking of holes and / or electrons. The individual layers of the organic active layer sequence 23 are not shown in detail in FIG. The structure of such

organic active layer sequences and suitable

Materials are known per se to those skilled in the art and therefore will not be explained further here.

In the illustrated embodiment, the first

Electrode layer 21 as an anode and the second

Electrode layer 22 is formed as a cathode. However, it would also be conceivable for the polarities of the electrode layers 21, 22 to be reversed. For electrically insulating the electrode layers 21, 22 from each other, at least one electrically insulating layer 24 may be provided.

The organic light emitting diode module 10 according to the

Embodiment emits light 15 in the from

Support substrate 1 facing away from the functional

Layer stack 2, ie in the side view shown in Figure 1 upwards. The second electrode layer 22 arranged in the emission direction above the organic active layer sequence 23 is a translucent electrode layer executed. This preferably contains a thin translucent metal layer or a transparent conductive oxide such as indium tin oxide (ITO). In particular, a multiple layer of at least one

translucent metal layer and at least one

transparent conductive oxide layer may be used as the electrode layer 22, for example, an ITO metal ITO

(IMI) multilayer. The first electrode layer 21 arranged between the organic active layer sequence 23 and the carrier substrate 1 is preferably designed as a reflective layer.

At the second main surface 12 of the carrier substrate 1 opposite the functional layer stack 2 are

arranged electronic components 5, which serve in particular for driving the functional layer stack 2. The electronic components 5 can in particular a

Constant current driver for the functional layer stack 2 include. Alternatively or additionally, electronic components 5 with further functions on the second

Main surface 12 may be arranged.

For electrical contact are on the second

Main surface 12 of the carrier substrate 1 printed conductors 4

arranged. The conductor tracks 4 are structured in a suitable manner in order to supply the electronic components 5 with power and, if appropriate, to each other

boarded. The electronic components 5 are

For example, soldered to the tracks 4. For equipping the second main surface 12 of the carrier substrate 1 with the electronic components 5, in particular a reflow soldering process can be used. Preferably, this is done Equipping the second main surface 12 with the electronic components 5 in the production of the organic

Light emitting diode module 10 before the functional layer stack 2 on the opposite first main surface 11 of the

Carrier substrate 1 is applied. This has the advantage that the functional layer stack 2 does not have the high

Temperatures of the soldering process is suspended.

The electrical connections 8, 9 for connecting the

Light emitting diode module 10 to an external voltage source are in the embodiment of Figure 1 at the first

Main surface 11 of the carrier substrate 1 is arranged. to

Connection of the electronic components 5 with the

electrical connection contacts 8, 9 and the

Electrode layers 21, 22 of the functional layer stack 10, vias 41, 42 are formed in the carrier substrate 1, which has an electrically conductive connection between the first main surface 11 and the second

Make main surface 12. The vias 41, 42 are, for example, through-holes, which are from the first

Main surface 11 to the second main surface 12 and are filled with an electrically conductive material, in particular a metal. By means of the plated-through holes 41, 42 is an electrically conductive connection between the conductor tracks 4 on the second main surface 12 and the

Electrode layers 21, 22 of the functional layer stack 2 realized. To increase the current-carrying capacity or to improve the current distribution of the electrically conductive connection, the electrode layers 21, 22 can each be connected to a plurality of plated-through holes 41, 42.

For example, in the exemplary embodiment, the anode electrode layer 21 is contacted by means of three plated-through holes 42. The functional layer stack 2, the carrier substrate 1 and the electronic components 5 are advantageously provided with an encapsulation layer 3, apart from an opening for the electrical connections 8, 9. The

Encapsulation layer 3 serves in particular to protect the functional layer stack 2, the interconnects 4 and the electronic components 5 from environmental influences,

especially against moisture and oxidation. The

Encapsulation layer 3 preferably contains one or more transparent oxide layers, in particular metal oxide layers, such as, for example, aluminum oxide, zinc oxide, zirconium oxide, titanium oxide, hafnium oxide or tantalum oxide. Furthermore, in particular silicon oxide layers or

Silicon nitride layers suitable. The encapsulation layer 3 can be composed of several layers, the individual layers advantageously each having a thickness between an atomic layer and about 1 μm. The

For example, encapsulation layer 3 has a total thickness of less than 10 ym, less than 1 ym, or even less than 100 nm.

The one or more layers of the encapsulation layer 3 are preferably applied by means of atomic layer deposition (ALD).

As an alternative or in addition to thin layers produced by ALD, the encapsulation layer may comprise at least one or a plurality of further layers, ie, in particular barrier layers and / or passivation layers,

have by thermal vapor deposition or by means of a plasma-assisted process, such as sputtering or

plasma-enhanced chemical vapor deposition (PECVD) becomes. Suitable materials for this may include the aforementioned materials as well as silicon nitride, silicon oxide,

Silicon oxynitride, indium tin oxide, indium zinc oxide, aluminum ^¬ doped zinc oxide, aluminum oxide and mixtures and

Alloys of the materials mentioned. The one or more further layers may, for example, each have a thickness of between 1 nm and 10 μm and preferably between 1 nm and 400 nm, the limits being included.

Preferably, all exposed surfaces of the

functional layer stack 2, the carrier substrate 1, the conductor tracks 4 and the electronic components 5 are provided with the encapsulation layer 3. In this case, those surfaces which are not directly provided with a further functional layer, such as, for example, the electrical connections 8, 9, are regarded as exposed surfaces.

On the side facing away from the carrier substrate 1 side of

electronic components 5 is advantageously a

Protective layer 6 arranged to protect against mechanical damage. The protective layer 6 can in particular be applied to the previously applied encapsulation layer 3, which serves in particular for protection against moisture and oxidation. The protective layer 6 can in particular a

Be silicone layer. Alternatively, others can

Plastics or a lacquer layer may be provided as a protective layer 6. Another protective layer 7 is to protect the functional layer stack 2 from mechanical damage

advantageously applied to the side facing away from the carrier substrate 1 side of the functional layer stack 2. The Protective layer 7 protects the functional layer stack 2 in particular against scratching. The protective layer 7 may in particular be a glass layer, a plastic layer or a lacquer layer. The protective layer 7 can for example be laminated or glued onto the side of the previously applied encapsulation layer 3 facing away from the carrier substrate 1. This can be done between the

Protective layer 7 and the underlying layers, a connection layer 71, in particular an adhesive layer may be arranged.

The organic light emitting diode module 10 is characterized

in particular by its compact design and good protection against external influences.

FIG. 2A schematically shows a side view, FIG. 2B shows a top view, and FIG. 2C shows a bottom view of a second exemplary embodiment of the invention

Light emitting diode module 10 differs from the first

Embodiment in that the two electrical

Terminals 8, 9, which are provided for connecting the light-emitting diode module 10 with an external voltage source, are arranged on the second main surface 12 of the carrier substrate 1. The electrical connection to the electrode layers 21, 22 of the functional layer stack 2 takes place by means of the plated-through holes 41, 42 in the carrier substrate 1.

For further details and more advantageous

Otherwise, the second exemplary embodiment corresponds to the first exemplary embodiment.

In the two embodiments described above, embodiments are shown in which either both Terminals 8, 9 are located on the first main surface 11 or on the second main surface 12 of the carrier substrate.

Alternatively, it is also possible that an electrical connection to the first main surface 11 and a further electrical connection to the second main surface 12 of the carrier substrate is arranged.

The invention is not limited by the description with reference to the embodiments. Rather, the includes

Invention every new feature as well as every combination of

Features, which includes in particular any combination of features in the claims, even if this feature or this combination itself is not explicitly in the

Claims or embodiments is given.

Claims

claims

An organic light emitting diode module (10) comprising:

a carrier substrate (1) having a first major surface (11) and a second major surface opposite the first major surface

Having major surface (12),

a functional layer stack (2) which is arranged on the first main surface (11) and which has a first

Electrode layer (21), an organic active

Layer sequence (23) and a second electrode layer

(22),

- At least one via (41, 42) in the carrier substrate (1) having an electrically conductive

Connection between the first and the second

Main surface of the carrier substrate (1) is formed,

- Electrical conductor tracks (4), at the second

Main surface (12) are arranged, wherein at least one of the conductor tracks (4) by means of at least one

Through-connection (41, 42) with the functional

Layer stack (2) is electrically connected, and

- At least one electronic component (5) for

Actuation of the functional layer stack (2), which is arranged on the second main surface (12) and electrically contacted by the conductor tracks (4).

2. Organic light emitting diode module according to claim 1,

wherein the at least one electronic component (5) is designed as a constant-current driver for operating the functional layer stack (2) with a constant current intensity.

3. Organic light-emitting diode module according to one of

previous claims, wherein on the second main surface (12) a plurality of electronic components (5) are arranged.

4. Organic light-emitting diode module according to one of

previous claims,

wherein the carrier substrate (1) is a printed circuit board.

5. Organic light-emitting diode module according to one of

previous claims,

wherein at least the functional layer stack (2) is provided with an encapsulation layer (3).

6. Organic light-emitting diode module according to claim 5,

wherein the at least one electronic component (5) is provided with the encapsulation layer (3).

7. Organic light-emitting diode module according to claim 6,

wherein exposed surfaces of the supporting substrate (1), the functional layer stack (2) and the at least one electronic component (5) are connected to the

Encapsulation layer (3) are provided.

8. Organic light-emitting diode module according to one of

previous claims,

wherein the at least one electronic component (5) on the side facing away from the carrier substrate (1) side, a protective layer (6) for protection against mechanical

Damage follows.

9. Organic light-emitting diode module according to claim 8,

wherein the protective layer (6) for the at least one electronic component (5) is a silicone layer. Organic light emitting diode module according to one of

previous claims,

wherein the functional layer stack (2)

on the side facing away from the carrier substrate (1) a protective layer (7) for protection against mechanical

Damage follows.

Organic light emitting diode module according to claim 10,

wherein the protective layer (7) for the functional

Layer stack (2) a glass layer or a

Plastic layer is.

Organic light emitting diode module according to one of

previous claims,

wherein electrical connection contacts (8, 9) of the

Light-emitting diode module (10) on the first main surface (11) of the carrier substrate (1) are arranged.

Organic light emitting diode module according to one of

previous claims,

wherein electrical connection contacts (8, 9) of the

Light-emitting diode module (10) on the second main surface (12) of the carrier substrate (1) are arranged.

Process for producing an organic

Light emitting diode module comprising the steps:

- Providing a carrier substrate (1) having a first major surface (11) and one of the first major surface

opposite second major surface (12),

Producing at least one through-connection (41, 42) in the carrier substrate (1) in order to form an electrically conductive connection between the first and the second main surfaces of the carrier substrate (1), - Producing conductor tracks (4) on the second

Main surface (12) of the carrier substrate (1),

- Equipping the second main surface (12) with at least one electronic component (5), and

- subsequent application of a functional

Layer stack (2) on the first main surface (11), wherein the functional layer stack (2) has a first electrode layer (21), an organic active

Layer sequence (23) and a second electrode layer (22).

Method according to claim 14,

in which an encapsulation layer (3) is applied to exposed surfaces of the carrier substrate (1), the functional layer stack (2) and the at least one electronic component (5).