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WO2014013713A1 - Module optique et procédé pour sa production - Google Patents

Module optique et procédé pour sa production Download PDF

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Publication number
WO2014013713A1
WO2014013713A1 PCT/JP2013/004325 JP2013004325W WO2014013713A1 WO 2014013713 A1 WO2014013713 A1 WO 2014013713A1 JP 2013004325 W JP2013004325 W JP 2013004325W WO 2014013713 A1 WO2014013713 A1 WO 2014013713A1
Authority
WO
WIPO (PCT)
Prior art keywords
connector
optical
optical element
substrate
optical module
Prior art date
Application number
PCT/JP2013/004325
Other languages
English (en)
Japanese (ja)
Inventor
杉本　宝
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Publication of WO2014013713A1 publication Critical patent/WO2014013713A1/fr

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
    • G02B6/425—Optical features
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4256—Details of housings
    • G02B6/426—Details of housings mounting, engaging or coupling of the package to a board, a frame or a panel
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4292—Coupling light guides with opto-electronic elements the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4206—Optical features

Definitions

  • the present invention relates to an optical module and a manufacturing method thereof.
  • optical interconnection technology is widely used for inter-node connections and routers of computers.
  • an optical module used for optical interconnection is generally a parallel optical module using a plurality of optical elements and a plurality of optical fibers. In such a parallel optical module, it is necessary to prevent variations in coupling efficiency of individual channels.
  • Patent Document 1 discloses a technique for realizing this.
  • FIG. 19 is a perspective view showing an optical module of this technology.
  • An optical LSI package 102 is mounted on the wiring board 101.
  • the optical LSI package 102 contains an optical element 103.
  • a connector 104 is superimposed on the optical LSI package 102. Both are configured to be detachably fixed by a clamp 105.
  • the connector 104 holds the optical fiber array 106.
  • the optical fiber array 106 is a bundle of optical fibers bundled in a tape shape. Although the detailed structure is left to Patent Document 1, the optical fiber array 106 is accurately positioned with respect to the connector 104.
  • a mirror 107 is provided at the tip of the optical fiber array 106 at an angle of about 45 degrees with respect to the optical axis of the optical fiber array 106.
  • the optical fiber array 106 and the optical element 103 are optically coupled by the action of the mirror.
  • the lower surface of the connector 104 is flat.
  • a positioning hole 108 is formed on the lower surface.
  • the upper surface of the optical LSI package 102 is flat. Above the optical element 103 on the top surface is a window 109 that transmits light. A positioning pin 110 is formed on the upper surface. A clamp claw recess 111 is formed on the side surface.
  • the clamp 105 is an elastic body having a recess at the center and has claws at both ends.
  • the positioning pins 110 are fitted into the positioning holes 108, and the horizontal positioning is performed. Further, when the lower surface of the connector 104 and the upper surface of the optical LSI package 102 are in close contact with each other, positioning in the height direction is performed. As described above, since the optical fiber array 106 is accurately positioned with respect to the connector 104, the optical axis adjustment of the optical system including the optical fiber array 106, the mirror 107, and the optical element 103 is completed by this mounting. Will do.
  • the connector 104 is fixed by attaching the clamp 105 from above.
  • the claw provided at the end portion fits into the clamp claw recess 111 on the side surface of the optical LSI package 102.
  • the concave portion of the clamp 105 pushes the connector 104 downward, the close contact between the connector 104 and the optical LSI package 102 is maintained.
  • Patent Document 2 discloses another technique.
  • FIG. 20 is a perspective view showing an optical module of this technology.
  • This optical module includes an upper structure 203 in which an optical fiber array 201 is held by a holding member 202, an optical element mounting board 205 on which an optical element 204 is mounted, an anisotropic conductive sheet 206, a wiring board 207, a wiring board, and the like. And a fitting member 208 fixed on 207.
  • the holding member 202 corresponds to the connector 104 of Patent Document 1.
  • a tapered shoulder 202 a is provided at the end of the holding member 202.
  • a positioning hole 209 is provided on the lower surface.
  • the optical fiber array 201 is bent into an arc shape by an arc portion 210 inside the holding member 202, and its tip is exposed on the lower surface of the holding member 202.
  • the fitting member 208 is a receptacle for holding the holding member 202 (connector).
  • the fitting member 208 is formed of a member having rigidity and elasticity such as metal.
  • An opening 211 is provided at the bottom, where the wiring of the wiring board 207 is exposed.
  • side plates 212 extending in the vertical direction of the substrate are provided from the four sides of the opening 211, and the tip thereof is a protruding ridge 213 having elasticity.
  • the optical element mounting substrate 205 is a substrate on which the optical element 204 and LSI and other electronic circuits are mounted. Positioning pins 214 are provided on the upper surface.
  • the positioning pins 214 are fitted into the positioning holes 209.
  • the holding member 202 and the optical element mounting substrate 205 are positioned in the horizontal direction. Further, when the flat portion on the outer periphery of the optical element mounting substrate 205 and the lower surface of the holding member 202 are in contact with each other, positioning in the height direction is performed. In this way, alignment of the tip of the optical fiber array 201 and the optical element 204 is performed.
  • the procedure for mounting the upper structure 203 with this optical module is as follows. 1) First, the anisotropic conductive sheet 206 is disposed in the opening 209 of the fitting member 208. 2) The optical element mounting substrate 205 is disposed thereon. 3) The upper structure 203 is vertically fitted from above. At this time, the positioning pin 214 and the positioning hole 209 are fitted. 4) When the upper structure 203 is attached to the fitting member 208, the shoulder portion 202a of the holding member 202 is pressed inward and downward by the protrusion 213. By this pressure, the upper structure 203 is fixed, and the optical element mounting substrate 205 and the wiring substrate 207 are electrically connected via the anisotropic conductive sheet 206.
  • the optical fiber array 201 and the optical element 204 can be aligned and optically connected.
  • the optical element mounting substrate 205 and the wiring substrate 207 can be aligned and electrically connected.
  • the clamp 105 applies pressure to a part of the connector 104 from above. This pressure acts to distort the connector 104 and also applies strain to the optical fiber array 106. For this reason, the reliability of the optical module was lowered, and the lifetime was shortened.
  • Patent Document 2 has a problem that the electrical connection between the wiring of the wiring substrate 207 and the back electrode of the optical element mounting substrate 205 is unstable.
  • An anisotropic conductive sheet 206 is used for connection between the two, but the anisotropic conductive sheet 206 becomes conductive when pressure is applied. For this reason, normally, a sufficiently high pressure is applied, but in the present technology, the shoulder 102a of the holding member 202 (connector) is connected to the protrusion 213 (spring) at the tip of the fitting member 208 (receiver). It just pushes diagonally downward. Therefore, there was a place where the pressure applied below was weak and sufficient pressure was not applied. In such a place, the connection resistance is high, and the connection is unstable as a whole.
  • the present invention has been made in view of the above problems, and an object thereof is to provide an optical module in which the electrical connection between the optical element and the wiring board is stable and the optical fiber array is not stressed. That is.
  • an optical module having a substrate, an optical element connected to the substrate by a conductive adhesive layer, and a receiver provided on the substrate and positioned above the optical element.
  • the receptacle has holding means for holding the connector from the side.
  • the effect of the present invention is that an optical module having stable electrical connection between the optical element and the wiring board and having high reliability can be obtained.
  • FIG. 1 is a perspective view showing a first embodiment of the present invention.
  • a wiring 2 is formed on the optical element mounting substrate 1, and an optical element 4 is connected to the wiring 2 through a conductive adhesive layer 3.
  • the optical element mounting substrate 1 is provided with a back electrode connected to the wiring 2.
  • a receptacle 5 is provided above the optical element 4 and is bonded to the optical element mounting substrate 1 through an adhesive layer 6.
  • the receptacle 5 is a receptacle for fitting the connector 8 holding the optical fiber 7 and optically coupling the optical fiber 7 and the optical element 4.
  • the receptacle 5 is provided with a flat reference surface 9, and a guide 10 extending in a direction perpendicular to the reference surface is provided at the end.
  • the guide 10 is provided with a projection 11 for locking the side surface of the connector 8, and the reference surface 9 is provided with a window 12 for transmitting light and a positioning pin 13 for positioning the connector 8 in the horizontal direction. ing.
  • a space for housing the optical element 4 and other components is provided on the lower surface of the receptacle 5.
  • an LSI 14 that exchanges electrical signals with the optical element 4 may be mounted on the optical element mounting substrate 1.
  • the optical fiber 7 is a tape-shaped optical fiber array composed of a plurality of fibers
  • the optical element 4 is generally an optical element array in which a plurality of elements are arranged in an array.
  • FIG. 1 also shows a configuration for connecting the optical module to the outside.
  • the optical element mounting substrate 1 is connected to an external electronic circuit via the wiring substrate 15.
  • the back electrode (not shown) of the optical element mounting substrate 1 and the external wiring 16 on the wiring substrate 15 are connected.
  • sockets such as LGA (Land Grid Array) and PGA (Pin Grid Array) can also be used for connection.
  • the connector 8 accurately positions and holds the optical fiber 7 and has an optical path changing means inside, so that the path of light entering from the horizontal direction of the optical element mounting substrate 1 can be changed downward.
  • a positioning hole 17 is provided on the lower surface of the connector 8.
  • the positioning pins 13 and the positioning holes 17 are fitted, and the horizontal positioning is performed.
  • the relationship between the positioning pin 13 and the positioning hole 17 may be reversed.
  • a flat surface (not shown) is provided on the lower surface of the connector 8, and the flat surface is brought into close contact with the reference surface 9, whereby positioning in the height direction is performed.
  • a groove 18 that fits into the protrusion 11 is provided on the side surface of the connector 8.
  • FIG. 2 is a plan view showing the optical module of the present embodiment. On the optical element mounting substrate 1, the receptacle 5 and the connector 8 are fitted.
  • FIG. 3 is a cross-sectional view taken along the line A-A ′ of FIG.
  • the optical element 4 has a pad 19 and is connected to the wiring 2 by the conductive adhesive layer 3.
  • a paste or solder containing a conductor such as Ag, Ni, or C can be used.
  • the electrical connection with the wiring 2 is ensured by baking the paste or reflowing the solder.
  • the receptacle 5 is bonded to the optical element mounting substrate 1 by an adhesive layer 6 provided on the wiring 2.
  • the adhesive layer 6 a resin having heat resistance, a double-sided tape, solder or the like can be used.
  • the receptacle 5 is placed on the wiring 2 for accurate positioning, and other marks may be used instead of the wiring 2. If the structure using the same pad 19 and conductive adhesive layer 3 as the optical element 4 is used, the number of steps can be reduced.
  • a lens 20 is bonded to the window 12 of the receptacle 5.
  • a connector 8 is fitted and connected above the receptacle 5.
  • a part of the lower surface of the connector 4 is a recess.
  • the optical fiber 7 is disposed in the recess and is sandwiched between the flat plate 21 and the connector 4.
  • a mirror 22 having an angle with respect to the optical fiber 7 is provided at the end of the recess. The tip of the optical fiber 7 is exposed toward the mirror 22, and the light emitted from the optical fiber 7 is reflected by the mirror 22 so that the path can be changed in the direction of the optical element 4.
  • the lens 20 condenses the light reflected by the mirror 22 on the optical element 4. Further, the light emitted from the optical element 4 is condensed on the end face of the optical fiber 7.
  • the optical system is configured so that the optical fiber 7 and the optical element 4 respectively correspond to the lens 20 as an array.
  • the optical element 4 is a light source such as a VCSEL (vertical cavity surface emitting laser), and a light receiving element such as a PD (photodiode). A plurality of these can be combined.
  • the optical element 4 is not limited to these, and elements having various optical functions can be used.
  • FIG. 4 is a cross-sectional view taken along the line B-B ′ of FIG.
  • a protrusion 11 provided on the guide 10 is fitted in a groove 18 provided on a side surface of the connector 8.
  • Positioning pins 13 are fitted into the positioning holes 17 so that the connector 8 and the receptacle 5 are positioned.
  • a separation groove 23 dug below the reference surface 7 is formed between the reference surface 9 at the center of the receptacle 5 and the guide 10. Due to the separation groove 23, even if the guide 10 bends when the connector 8 is attached or detached, the deformation does not affect the reference surface 9.
  • a material having both rigidity and elasticity is used as the material of the receptacle 2.
  • heat-resistant resins such as PEEK (polyether ether ketone), PPS (polyphenylene sulfide), and liquid crystal polymer.
  • Metals such as aluminum and copper can also be used.
  • FIG. 5 is a cross-sectional view showing a state in which the optical fiber 7 is attached to the connector 8 in the present embodiment.
  • a V-shaped groove 24 is formed in the concave portion for housing the optical fiber 7 of the connector 8.
  • One optical fiber 7 is disposed in each groove of the V-shaped groove 24.
  • a flat plate 21 is provided so as to sandwich the optical fiber 7 and holds the optical fiber 7 in a positioned state.
  • a resin such as PET or ABS can be used.
  • glass or ceramic having high hardness and good flatness can be used.
  • a similar material can be used for the flat plate 21.
  • FIG. 6 is a cross-sectional view of the connector 4 in the length direction of the optical fiber 7.
  • a stopper 25 is provided at the end of the V-shaped groove 21, and positioning in the length direction is performed when the tip of the optical fiber 7 abuts against the stopper 25.
  • a slope is formed at the tip of the stopper 22, and a mirror 18 is formed on the slope.
  • FIG. 7 is an enlarged sectional view of the vicinity of the stopper 25.
  • the stopper 25 is in contact with the clad 7b of the optical fiber 7 and is formed so as not to hang on the extension line of the core 7c.
  • the light emitted from the optical fiber 7 is reflected by the mirror 22 and is directed downward in the figure, that is, toward the optical element 4.
  • the mirror 22 is preferably a metal film such as Au, Ag, or Al.
  • the optical element 4 and the receptacle 5 are mounted on the optical element mounting substrate 1 while being accurately positioned.
  • a connector 8 is attached to this from above the receptacle 5.
  • the position of the connector 8 in the horizontal direction is regulated by the guide 10, and the positioning pins 13 and the positioning holes 17 are fitted to position the connector 8 in the horizontal direction.
  • the reference surface 9 of the receptacle 5 and the flat plate 21 on the lower surface of the connector 8 are brought into close contact with each other, thereby positioning in the height direction.
  • the protrusion 11 provided on the guide 10 is fitted into the groove 18 provided on the side surface of the connector 8.
  • the connector 8 is fixed to the receptacle 5 in a state where the optical elements such as the optical fiber 7, the mirror 22, the lens 20, and the optical element 4 are aligned.
  • the fixing pressure is applied to the side surface of the connector 8, no stress is applied to the optical fiber 7.
  • the optical element 4 receives an optical signal
  • the light emitted from the tip of the optical fiber 7 is reflected by the mirror 22, condensed by the lens 20, and enters the optical element 4 (light receiving element).
  • the light receiving element converts light into electricity, and signal processing is performed by the LSI 14 or the like connected by the optical element mounting substrate 1.
  • an electrical signal is sent from the LSI 14 or the like to the optical element 4 (light emitting element).
  • the light emitting element converts an electrical signal into an optical signal and emits light.
  • the light is collected by the lens 20, then reflected by the mirror 22, and then enters the fiber 7.
  • transmission / reception of optical signals and signal processing are performed.
  • FIG. 8 is a cross-sectional view showing a method for manufacturing an optical module in the present embodiment.
  • the wiring 2 is formed on the optical element mounting substrate 1.
  • the optical element mounting substrate 1 one having a high dimensional accuracy and a low coefficient of thermal expansion is suitable. Ceramic, glass ceramic, glass epoxy, glass polyimide, fluororesin, liquid crystal polymer, or the like can be used.
  • a material of the wiring 2 Cu, Ag, Au, Al, an alloy thereof, or the like can be used. Plating with Ni, Au or the like is desirable to prevent corrosion and improve bondability.
  • the conductive adhesive layer 3 is formed on the portion where the wiring 2 and the optical element 4 and other components are connected by screen printing, dispensing method or the like. Alternatively, solder balls may be placed. As described above, the conductive adhesive layer 3 is a paste or solder containing a conductor such as Ag, Ni, or C.
  • the optical element 4 is mounted as shown in FIG. 8C.
  • a treatment such as heating and UV irradiation is performed to cure the conductive adhesive layer 3.
  • an adhesive layer 6 is formed on the wiring 2 on which the receptacle 5 is mounted using screen printing, a dispensing method, or the like.
  • a mark different from the wiring 2 is used.
  • the receptacle 5 on which the lens 20 is mounted is mounted.
  • the adhesive layer 6 is cured by heat treatment, UV irradiation, or the like, and an optical module including the receptacle 5 is completed.
  • FIG. 9 is a cross-sectional view showing another manufacturing method.
  • a pad 26 similar to that of the optical element 4 is provided on the lower surface of the receptacle 5.
  • the wiring 2 is formed on the optical element mounting substrate 1 as shown in FIG. 9A.
  • a conductive adhesive layer 3 is formed on the wiring 2 as shown in FIG. 9B.
  • components such as the optical element 4, the receptacle 5, and the LSI 14 are mounted.
  • the conductive adhesive layer 3 is cured by heat treatment or the like.
  • the optical element 4 and the receptacle 5 are bonded simultaneously, the number of processes can be reduced. Further, when solder is used as the conductive adhesive layer 3, the whole can be baked by reflow, so that productivity is improved.
  • FIG. 10 is a schematic sectional view showing a method for manufacturing the connector 8 holding the optical fiber 7.
  • a concave portion is formed on the lower surface of the connector 8, and a V-shaped groove 24 is formed so that the optical fibers 7 can be accommodated one by one.
  • a stopper 25 is formed at the end of the V-shaped groove 24 so that the clad 7a at the tip of the optical fiber 7 abuts.
  • a mirror 22 is formed on the slope.
  • the mirror 22 can be produced by forming a metal film such as Al or Ag by vapor deposition or sputtering, for example. Alternatively, a reflective member may be attached.
  • the optical fiber 7 is inserted into the V-shaped groove 24, and the tip is abutted against the stopper 25.
  • the flat plate 21 is bonded to the connector 8, and the optical fiber 7 is fixed in a positioned state.
  • the electrical connection between the optical element 4 and the optical element mounting substrate 1 can be firmly established. Further, since the optical element 4, the lens 20, the mirror 22, and the optical fiber 7 are aligned, the optical axis alignment is completed simply by attaching the connector 8 to the receptacle 5.
  • FIG. 11 is a cross-sectional view showing a second embodiment of the present invention.
  • a screw 27 is used as a locking means for the connector 8.
  • the connector 8 is attached, the screw 27 is first removed.
  • the connector 8 is fitted to the receptacle 5.
  • a screw is passed through the screw hole of the guide 10, and the tip is brought into contact with the groove 18 on the side surface of the connector 8 and fixed.
  • the groove 18 may be a hole or a screw hole. According to the present embodiment, since the connector 8 can be fixed without bending the guide 10, the life of the receptacle 5 can be extended.
  • FIG. 12 is a sectional view showing a third embodiment of the present invention.
  • the guide 10 is provided with a through hole.
  • An elastic body 29 that holds the pin 28 is fixed to the side surface of the receptacle 5.
  • the pin 29 is slidable through the through hole.
  • the elastic body 29 is expanded and the tip of the pin 28 is retracted from the inner surface of the guide 10, and the connector 8 is inserted.
  • the pressure applied to the elastic body 29 is released.
  • the pin 28 fits into the groove 18 and the connector 8 is fixed.
  • the groove 18 may be a hole.
  • the elastic body 29 can be fixed to the receptacle 5 by various methods such as adhesion, double-sided tape, and screwing.
  • FIG. 13 is a cross-sectional view showing a second embodiment of the present invention, and is an enlarged view of a fitting portion between a protrusion 11 provided on a guide 8 and a groove 14 provided on a side surface of a connector 4. It is.
  • the tip of the protrusion 11 is disposed below the bottom of the groove 14. With this configuration, even if the position of the groove 12 is shifted due to component tolerances, a downward biasing force acts on the connector 4 and is pressed against the reference surface 7. By this action, the connector 4 can be brought into contact with the reference surface 7 without looseness.
  • the same method can be applied to any of the first, second, and third embodiments.
  • FIG. 14 shows a configuration in which the groove 10 is provided in the guide 10 and the projection 11 is provided in the connector 8.
  • the tip of the protrusion 11 is positioned higher than the bottom of the groove 14.
  • FIG. 15 is a sectional view showing a fifth embodiment of the present invention.
  • a spring 30 that covers from above is provided with the connector 8 mounted on the receptacle 5. Since the guide 10 is pushed inward by the action of the spring 30, the connector 8 and the receptacle 5 are more securely fixed. Further, if the spring 30 completely covers the upper surface of the receptacle 2, it is possible to prevent dust and moisture from entering from the gap between the fitting portions.
  • FIG. 16 is a side view showing a sixth embodiment of the present invention.
  • a base 31 that is directly mounted on the optical element mounting substrate 1 is provided.
  • the receptacle 5 and the lens array 20 are mounted on a pedestal 27.
  • the positioning pin 10 is provided integrally with the pedestal 31.
  • the guide 10 in the present embodiment is provided apart from the positioning pin 10. For this reason, even if the guide 10 is deformed when the connector 8 is attached or detached, no stress is applied to the positioning pin 13. Therefore, positioning can be performed more accurately. In addition, the mechanical life against repeated attachment and detachment can be extended.
  • FIG. 17 is a side view showing a seventh embodiment of the present invention.
  • a pedestal 31 that is directly mounted on the optical element mounting substrate 1 is provided as in the sixth embodiment.
  • the difference is that the positioning pin 10 is provided in the receptacle 2. With this configuration, the optical module can be reduced in size.
  • FIG. 18 is a cross-sectional view showing a seventh embodiment of the present invention.
  • the positioning pin 10 is provided on the connector 4 side, and the positioning hole 13 is provided in the receptacle 2. According to the present embodiment, it becomes easy to arrange the positioning pins 10 in a direction perpendicular to the longitudinal direction of the window. In this case, the width of the connector 4 or the receptacle 2 can be made narrower than when the positioning pins 10 are provided in the longitudinal direction of the window. As a result, the entire optical module can be reduced in size.
  • An optical module comprising: a substrate; an optical element connected to the substrate by a conductive adhesive layer; and a receiver provided on the substrate and positioned above the optical element, wherein the receiver includes the connector
  • An optical module having a holding means for holding from a side surface
  • the optical module according to appendix 1 wherein the receiver has a side plate portion, and has a locking means for locking the side plate portion and a side surface of the connector.
  • the optical module according to appendix 2 The optical module according to appendix 2, wherein the locking means is a convex portion or a concave portion connected to the side plate portion.
  • Appendix 4 4.
  • the apparatus further comprising a positioning unit that positions the optical element with respect to the substrate and a positioning unit that positions the receiver with respect to the substrate. 5.
  • the optical module as described in. (Appendix 5) 5.
  • Appendix 9 The optical module according to any one of appendices 1 to 8, wherein the substrate has a back electrode, and the back electrode is connected to a wiring substrate.
  • Appendix 10 A step of applying a conductive adhesive to a predetermined position of a substrate; a step of mounting an optical element on the conductive adhesive; a step of applying an adhesive to a predetermined position of the substrate; and a connector on the adhesive
  • a method of manufacturing an optical module comprising: mounting a receiver having a holding means for holding the substrate from a side; curing the conductive adhesive; and curing the adhesive.
  • Appendix 15 15. The optical module according to claim 1, further comprising an elastic body that urges the side plate portion from the outside toward the inside.
  • Appendix 16 The optical module according to appendix 15, wherein the elastic body covers an upper surface of the receiver.
  • Appendix 17 The optical module according to any one of appendices 1 to 16, further comprising an LSI electrically connected to the optical element on the substrate.
  • (Appendix 18) Forming a conductive adhesive layer on a predetermined position of a substrate on which wiring is formed; mounting an optical element on the conductive adhesive layer; applying an adhesive on a predetermined position of the substrate;
  • An optical module comprising a step of mounting a receiver having a holding means for holding a connector from the side on an adhesive, a step of curing the conductive adhesive, and a step of curing the adhesive.
  • Manufacturing method (Appendix 19) A step of forming a conductive adhesive layer at a predetermined position of a substrate on which wiring is formed; a step of mounting an optical element on the conductive adhesive layer and a receiver having a holding means for holding the connector from the side surface; And a step of curing the conductive adhesive layer.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)

Abstract

La présente invention porte sur un module optique qui comporte : un substrat ; un élément optique qui est relié au substrat au moyen d'une couche adhésive conductrice ; et un récepteur qui est disposé sur le substrat de manière à être positionné au-dessus de l'élément optique. Le récepteur comprend un moyen de maintien qui maintient un connecteur depuis les côtés.
PCT/JP2013/004325 2012-07-20 2013-07-16 Module optique et procédé pour sa production WO2014013713A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012-161162 2012-07-20
JP2012161162 2012-07-20

Publications (1)

Publication Number Publication Date
WO2014013713A1 true WO2014013713A1 (fr) 2014-01-23

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0662561U (ja) * 1993-01-31 1994-09-02 第一電子工業株式会社 光半導体モジュール
JP2008191349A (ja) * 2007-02-05 2008-08-21 Yazaki Corp 光通信モジュールの製造方法
JP2008250350A (ja) * 2008-07-07 2008-10-16 Fujikura Ltd 光コネクタ
JP2009103998A (ja) * 2007-10-24 2009-05-14 Fujikura Ltd 光コネクタ
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