WO2014059654A1 - Cyanate ester resin composition, and prepreg, laminate, and metal-clad laminate that are fabricated by using the same - Google Patents
Cyanate ester resin composition, and prepreg, laminate, and metal-clad laminate that are fabricated by using the same Download PDFInfo
- Publication number
- WO2014059654A1 WO2014059654A1 PCT/CN2012/083186 CN2012083186W WO2014059654A1 WO 2014059654 A1 WO2014059654 A1 WO 2014059654A1 CN 2012083186 W CN2012083186 W CN 2012083186W WO 2014059654 A1 WO2014059654 A1 WO 2014059654A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- cyanate ester
- ester resin
- resin composition
- prepreg
- weight
- Prior art date
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- 239000011342 resin composition Substances 0.000 title claims abstract description 54
- 239000004643 cyanate ester Substances 0.000 title claims abstract 24
- 229920005989 resin Polymers 0.000 claims abstract description 89
- 239000011347 resin Substances 0.000 claims abstract description 89
- 239000003822 epoxy resin Substances 0.000 claims abstract description 74
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 74
- -1 phosphorus compound Chemical class 0.000 claims abstract description 36
- 125000003118 aryl group Chemical group 0.000 claims abstract description 25
- 125000003710 aryl alkyl group Chemical group 0.000 claims abstract description 21
- 239000000463 material Substances 0.000 claims abstract description 21
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims abstract description 16
- 239000011256 inorganic filler Substances 0.000 claims abstract description 16
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 16
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 15
- 229910052751 metal Inorganic materials 0.000 claims description 31
- 239000002184 metal Substances 0.000 claims description 31
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 21
- 239000011888 foil Substances 0.000 claims description 13
- 229910001593 boehmite Inorganic materials 0.000 claims description 9
- FAHBNUUHRFUEAI-UHFFFAOYSA-M hydroxidooxidoaluminium Chemical compound O[Al]=O FAHBNUUHRFUEAI-UHFFFAOYSA-M 0.000 claims description 9
- 239000000203 mixture Substances 0.000 claims description 9
- 239000000377 silicon dioxide Substances 0.000 claims description 6
- 239000002648 laminated material Substances 0.000 claims description 4
- 238000003475 lamination Methods 0.000 claims description 4
- 238000010030 laminating Methods 0.000 claims description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims 1
- 238000005253 cladding Methods 0.000 claims 1
- 239000001301 oxygen Substances 0.000 claims 1
- 229910052760 oxygen Inorganic materials 0.000 claims 1
- 238000007711 solidification Methods 0.000 claims 1
- 230000008023 solidification Effects 0.000 claims 1
- 239000000758 substrate Substances 0.000 abstract description 20
- 239000003063 flame retardant Substances 0.000 abstract description 11
- 239000004065 semiconductor Substances 0.000 abstract description 7
- 229910052698 phosphorus Inorganic materials 0.000 abstract description 6
- 239000011574 phosphorus Substances 0.000 abstract description 6
- 150000002366 halogen compounds Chemical class 0.000 abstract description 2
- XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate Chemical compound [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 description 107
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 21
- KJCVRFUGPWSIIH-UHFFFAOYSA-N 1-naphthol Chemical compound C1=CC=C2C(O)=CC=CC2=C1 KJCVRFUGPWSIIH-UHFFFAOYSA-N 0.000 description 14
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 14
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 12
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 12
- 150000001875 compounds Chemical class 0.000 description 12
- 229920003986 novolac Polymers 0.000 description 11
- 239000006087 Silane Coupling Agent Substances 0.000 description 10
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 10
- 238000012360 testing method Methods 0.000 description 10
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 9
- 230000015572 biosynthetic process Effects 0.000 description 9
- 238000003786 synthesis reaction Methods 0.000 description 9
- 239000011521 glass Substances 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 239000004305 biphenyl Substances 0.000 description 7
- 235000010290 biphenyl Nutrition 0.000 description 7
- 239000002270 dispersing agent Substances 0.000 description 7
- YNSSPVZNXLACMW-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)-3-ethyl-5-methylphenyl]methyl]-2-ethyl-6-methylphenyl]pyrrole-2,5-dione Chemical compound C=1C(C)=C(N2C(C=CC2=O)=O)C(CC)=CC=1CC(C=C1CC)=CC(C)=C1N1C(=O)C=CC1=O YNSSPVZNXLACMW-UHFFFAOYSA-N 0.000 description 6
- 239000004593 Epoxy Substances 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 239000004744 fabric Substances 0.000 description 6
- 239000005350 fused silica glass Substances 0.000 description 6
- 239000003365 glass fiber Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000000843 powder Substances 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 5
- 238000010521 absorption reaction Methods 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 239000003292 glue Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 238000004806 packaging method and process Methods 0.000 description 5
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 5
- 229920001296 polysiloxane Polymers 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 4
- 125000005439 maleimidyl group Chemical group C1(C=CC(N1*)=O)=O 0.000 description 4
- 239000011159 matrix material Substances 0.000 description 4
- 125000001624 naphthyl group Chemical group 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 239000000047 product Substances 0.000 description 4
- CHJMFFKHPHCQIJ-UHFFFAOYSA-L zinc;octanoate Chemical compound [Zn+2].CCCCCCCC([O-])=O.CCCCCCCC([O-])=O CHJMFFKHPHCQIJ-UHFFFAOYSA-L 0.000 description 4
- ARNKHYQYAZLEEP-UHFFFAOYSA-N 1-naphthalen-1-yloxynaphthalene Chemical compound C1=CC=C2C(OC=3C4=CC=CC=C4C=CC=3)=CC=CC2=C1 ARNKHYQYAZLEEP-UHFFFAOYSA-N 0.000 description 3
- DABOOAVTBIRGHP-UHFFFAOYSA-N 1-phenoxynaphthalene Chemical compound C=1C=CC2=CC=CC=C2C=1OC1=CC=CC=C1 DABOOAVTBIRGHP-UHFFFAOYSA-N 0.000 description 3
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 3
- MXRIRQGCELJRSN-UHFFFAOYSA-N O.O.O.[Al] Chemical compound O.O.O.[Al] MXRIRQGCELJRSN-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 239000000835 fiber Substances 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 239000004843 novolac epoxy resin Substances 0.000 description 3
- 229920001568 phenolic resin Polymers 0.000 description 3
- 239000005011 phenolic resin Substances 0.000 description 3
- 150000003018 phosphorus compounds Chemical class 0.000 description 3
- 230000000704 physical effect Effects 0.000 description 3
- 239000012779 reinforcing material Substances 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 239000012756 surface treatment agent Substances 0.000 description 3
- 238000009736 wetting Methods 0.000 description 3
- 239000000080 wetting agent Substances 0.000 description 3
- XAZPKEBWNIUCKF-UHFFFAOYSA-N 1-[4-[4-[2-[4-[4-(2,5-dioxopyrrol-1-yl)phenoxy]phenyl]propan-2-yl]phenoxy]phenyl]pyrrole-2,5-dione Chemical compound C=1C=C(OC=2C=CC(=CC=2)N2C(C=CC2=O)=O)C=CC=1C(C)(C)C(C=C1)=CC=C1OC(C=C1)=CC=C1N1C(=O)C=CC1=O XAZPKEBWNIUCKF-UHFFFAOYSA-N 0.000 description 2
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- 0 CC(*)(*)C(*)/C(/C/C=C(\C=CC=C1)/C1=C1)=C/C1N=C=O Chemical compound CC(*)(*)C(*)/C(/C/C=C(\C=CC=C1)/C1=C1)=C/C1N=C=O 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 229920000106 Liquid crystal polymer Polymers 0.000 description 2
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 2
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 description 2
- ORILYTVJVMAKLC-UHFFFAOYSA-N adamantane Chemical compound C1C(C2)CC3CC1CC2C3 ORILYTVJVMAKLC-UHFFFAOYSA-N 0.000 description 2
- 150000008378 aryl ethers Chemical class 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 2
- 229910002113 barium titanate Inorganic materials 0.000 description 2
- 125000006267 biphenyl group Chemical group 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 239000007822 coupling agent Substances 0.000 description 2
- 229930003836 cresol Natural products 0.000 description 2
- QPJDMGCKMHUXFD-UHFFFAOYSA-N cyanogen chloride Chemical compound ClC#N QPJDMGCKMHUXFD-UHFFFAOYSA-N 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- NIHNNTQXNPWCJQ-UHFFFAOYSA-N fluorene Chemical compound C1=CC=C2CC3=CC=CC=C3C2=C1 NIHNNTQXNPWCJQ-UHFFFAOYSA-N 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000005470 impregnation Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- KJFMBFZCATUALV-UHFFFAOYSA-N phenolphthalein Chemical compound C1=CC(O)=CC=C1C1(C=2C=CC(O)=CC=2)C2=CC=CC=C2C(=O)O1 KJFMBFZCATUALV-UHFFFAOYSA-N 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910052938 sodium sulfate Inorganic materials 0.000 description 2
- 235000011152 sodium sulphate Nutrition 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 230000002194 synthesizing effect Effects 0.000 description 2
- JRQJLSWAMYZFGP-UHFFFAOYSA-N 1,1'-biphenyl;phenol Chemical group OC1=CC=CC=C1.C1=CC=CC=C1C1=CC=CC=C1 JRQJLSWAMYZFGP-UHFFFAOYSA-N 0.000 description 1
- HCNHNBLSNVSJTJ-UHFFFAOYSA-N 1,1-Bis(4-hydroxyphenyl)ethane Chemical compound C=1C=C(O)C=CC=1C(C)C1=CC=C(O)C=C1 HCNHNBLSNVSJTJ-UHFFFAOYSA-N 0.000 description 1
- YJTKZCDBKVTVBY-UHFFFAOYSA-N 1,3-Diphenylbenzene Chemical group C1=CC=CC=C1C1=CC=CC(C=2C=CC=CC=2)=C1 YJTKZCDBKVTVBY-UHFFFAOYSA-N 0.000 description 1
- VMDQUQBEIFMAIC-UHFFFAOYSA-N 1-(2,6-dimethylphenyl)pyrrole-2,5-dione Chemical compound CC1=CC=CC(C)=C1N1C(=O)C=CC1=O VMDQUQBEIFMAIC-UHFFFAOYSA-N 0.000 description 1
- QYOJZFBQEAZNEW-UHFFFAOYSA-N 1-(2-methylphenyl)pyrrole-2,5-dione Chemical compound CC1=CC=CC=C1N1C(=O)C=CC1=O QYOJZFBQEAZNEW-UHFFFAOYSA-N 0.000 description 1
- NHWYMYDMYCNUKI-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)-3,5-diethylphenyl]methyl]-2,6-diethylphenyl]pyrrole-2,5-dione Chemical compound C=1C(CC)=C(N2C(C=CC2=O)=O)C(CC)=CC=1CC(C=C1CC)=CC(CC)=C1N1C(=O)C=CC1=O NHWYMYDMYCNUKI-UHFFFAOYSA-N 0.000 description 1
- RUORVEVRVBXRIO-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)-3,5-dimethylphenyl]methyl]-2,6-dimethylphenyl]pyrrole-2,5-dione Chemical compound C=1C(C)=C(N2C(C=CC2=O)=O)C(C)=CC=1CC(C=C1C)=CC(C)=C1N1C(=O)C=CC1=O RUORVEVRVBXRIO-UHFFFAOYSA-N 0.000 description 1
- HIDBROSJWZYGSZ-UHFFFAOYSA-N 1-phenylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=CC=C1 HIDBROSJWZYGSZ-UHFFFAOYSA-N 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- PVFQHGDIOXNKIC-UHFFFAOYSA-N 4-[2-[3-[2-(4-hydroxyphenyl)propan-2-yl]phenyl]propan-2-yl]phenol Chemical compound C=1C=CC(C(C)(C)C=2C=CC(O)=CC=2)=CC=1C(C)(C)C1=CC=C(O)C=C1 PVFQHGDIOXNKIC-UHFFFAOYSA-N 0.000 description 1
- ZYUVGYBAPZYKSA-UHFFFAOYSA-N 5-(3-hydroxybutan-2-yl)-4-methylbenzene-1,3-diol Chemical compound CC(O)C(C)C1=CC(O)=CC(O)=C1C ZYUVGYBAPZYKSA-UHFFFAOYSA-N 0.000 description 1
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- 229910052582 BN Inorganic materials 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- 238000004566 IR spectroscopy Methods 0.000 description 1
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- HRZRIFULQXOKBS-UHFFFAOYSA-N O=C=NC1C=C(C=CC=C2)C2=CCC=C1 Chemical compound O=C=NC1C=C(C=CC=C2)C2=CCC=C1 HRZRIFULQXOKBS-UHFFFAOYSA-N 0.000 description 1
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- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
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- 239000000654 additive Substances 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 150000001335 aliphatic alkanes Chemical class 0.000 description 1
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- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000011572 manganese Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- SAWKFRBJGLMMES-UHFFFAOYSA-N methylphosphine Chemical compound PC SAWKFRBJGLMMES-UHFFFAOYSA-N 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 229910000476 molybdenum oxide Inorganic materials 0.000 description 1
- 230000006855 networking Effects 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- JFNLZVQOOSMTJK-KNVOCYPGSA-N norbornene Chemical compound C1[C@@H]2CC[C@H]1C=C2 JFNLZVQOOSMTJK-KNVOCYPGSA-N 0.000 description 1
- 239000012766 organic filler Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- PQQKPALAQIIWST-UHFFFAOYSA-N oxomolybdenum Chemical compound [Mo]=O PQQKPALAQIIWST-UHFFFAOYSA-N 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 description 1
- 229910000073 phosphorus hydride Inorganic materials 0.000 description 1
- 231100000614 poison Toxicity 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 102000004169 proteins and genes Human genes 0.000 description 1
- 108090000623 proteins and genes Proteins 0.000 description 1
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- TXDNPSYEJHXKMK-UHFFFAOYSA-N sulfanylsilane Chemical compound S[SiH3] TXDNPSYEJHXKMK-UHFFFAOYSA-N 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000010189 synthetic method Methods 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 239000002341 toxic gas Substances 0.000 description 1
- 239000003440 toxic substance Substances 0.000 description 1
- 231100000419 toxicity Toxicity 0.000 description 1
- 230000001988 toxicity Effects 0.000 description 1
- BIKXLKXABVUSMH-UHFFFAOYSA-N trizinc;diborate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]B([O-])[O-].[O-]B([O-])[O-] BIKXLKXABVUSMH-UHFFFAOYSA-N 0.000 description 1
- UKRDPEFKFJNXQM-UHFFFAOYSA-N vinylsilane Chemical compound [SiH3]C=C UKRDPEFKFJNXQM-UHFFFAOYSA-N 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- XAEWLETZEZXLHR-UHFFFAOYSA-N zinc;dioxido(dioxo)molybdenum Chemical compound [Zn+2].[O-][Mo]([O-])(=O)=O XAEWLETZEZXLHR-UHFFFAOYSA-N 0.000 description 1
- BNEMLSQAJOPTGK-UHFFFAOYSA-N zinc;dioxido(oxo)tin Chemical compound [Zn+2].[O-][Sn]([O-])=O BNEMLSQAJOPTGK-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
- C08L75/04—Polyurethanes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
- B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4014—Nitrogen containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
- B32B2264/10—Inorganic particles
- B32B2264/102—Oxide or hydroxide
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/306—Resistant to heat
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/306—Resistant to heat
- B32B2307/3065—Flame resistant or retardant, fire resistant or retardant
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/012—Flame-retardant; Preventing of inflammation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
Definitions
- the present invention relates to a resin composition, and more particularly to a cyanate resin composition and a prepreg, a laminate and a metal foil-clad laminate produced using the same. Background technique
- Cyanate resin has excellent dielectric properties, heat resistance, mechanical properties and processability, and is a commonly used matrix resin in the production of metal foil laminates for high-end printed wiring boards.
- prepregs and laminates prepared using a resin containing a bisphenol A type cyanate resin and a maleimide compound (commonly referred to as a BT resin) have been widely used for high performance in semiconductor packaging.
- a BT resin a maleimide compound
- the bisphenol A type cyanate resin composition has excellent heat resistance, chemical resistance, adhesion, etc., but the cured product has a problem of high water absorption, insufficient heat and humidity resistance, and mechanical properties such as elastic modulus. Performance does not meet the performance requirements of high-end substrates.
- the dicyclopentadiene type cyanate resin composition has excellent dielectric properties, heat resistance, heat and humidity resistance, and good mechanical properties, and is widely used in high-frequency circuit substrates, high-performance composite materials, and the like, and can be used to make up for double
- the problem that the phenol A type cyanate resin is insufficient in moist heat resistance.
- its flame retardancy is poor and it cannot meet the performance requirements of high-end substrates.
- the resin composition for producing a metal foil-clad laminate is generally required to have flame retardancy, and therefore it is generally required to simultaneously use a bromine-containing flame retardant to achieve flame retardancy.
- a compound-containing compound due to the increased attention to environmental issues in recent years, it is necessary to use a compound-containing compound to achieve flame retardancy.
- phosphorus compounds are frequently used as flame retardants, but various intermediates and production processes of the tablet compounds have certain toxicity. Phosphorus compounds may generate toxic gases (such as methylphosphine) and toxic substances (such as triphenyl) during combustion. Phosphine, etc.), its waste may pose a potential hazard to the aquatic environment.
- U.S. Patent (US7655871) uses a phenolic cyanate resin, a biphenyl epoxy resin, a phenolic resin as a matrix resin, a large amount of silicon micropowder as a filler, a glass fiber cloth as a reinforcing material, and a heat resistance. Excellent, achieved no! 3 ⁇ 4 flame retardant.
- the phenolic cyanate resin is cured under the general process conditions, the cured product has a large water absorption rate and poor heat and humidity resistance.
- the phenolic cyanate resin composition itself has poor flame retardancy, and in order to meet the demand for halogen-free and phosphorus-free flame retardant, it is necessary to add a larger amount of inorganic filler to achieve flame retardancy, which in turn leads to a decrease in workability.
- U.S. Patent No. US20060084787 discloses a biphenyl type cyanate resin which has a low water absorption, excellent heat resistance, moist heat resistance and flame retardancy.
- Cid patent (CN200810008694.8) uses naphthol aralkyl cyanate resin, halogen-free epoxy resin as matrix resin, boehmite, silicone resin powder as filler, glass fiber cloth as reinforcing material layer Pressure material;
- Chinese patent (CN200810132333.4) uses naphthol aralkyl type cyanate resin, epoxy resin as matrix resin, fused silica, silicone rubber powder as filler, glass fiber cloth as reinforcing material Made of laminate. Since the naphthol aralkyl type cyanate resin composition has good flame retardancy, it can be realized without adding a large amount of inorganic filler! 3 ⁇ 4 non-phosphorus flame retardant, can solve the problems of heat resistance, poor flame retardancy and processability of the above bisphenol A type, dicyclopentadiene type and phenolic type cyanate resin.
- the biphenyl type cyanate resin and the naphthol aralkyl type cyanate resin have a lower crosslinking density due to the presence of a biphenyl group or an aralkyl group, thereby lowering the mechanical properties of the cyanate resin cured product and Heat resistance, etc. Therefore, there is a need for a non-phosphorus-free flame-retardant cyanate resin composition having excellent heat resistance, flame retardancy and mechanical properties, and a prepreg, a laminate material and a metal foil-clad laminate produced using the same.
- An object of the present invention is to provide a cyanate resin composition which has good mechanical properties, heat resistance and flame retardancy and can be used for producing a printed wiring board material.
- Another object of the present invention is to provide a prepreg, a laminate, and a metal foil-clad laminate produced using the above cyanate resin composition, a laminate and a metal foil-coated layer produced using the prepreg
- the pressure material also has good flame retardancy, low X, Y direction thermal expansion coefficient, good mechanical properties, and is suitable for high reliability semiconductor packaging without using a compound or a phosphorus compound as a flame retardant.
- Substrate material is preferred.
- the present invention provides a cyanate resin composition
- a cyanate resin composition comprising a cyanate resin, an epoxy-free epoxy resin, and an inorganic filler material, and the structural formula of the cyanate resin is as follows:
- R is a hydrogen atom, an alkyl group, an aryl group or an aralkyl group, and n is an integer of from 1 to 50. Further, n is an integer of 1 to 10, and when n is in this range, the cyanate resin has a good wettability to the substrate.
- the cyanate resin of the present invention is not particularly limited, and is a cyanate resin or a prepolymer thereof having at least two cyanate groups per molecule and as shown in Formula I.
- the cyanate resin may be used singly or as a mixture of at least two cyanate resins as needed.
- the amount of the cyanate resin to be used is not particularly limited, and it preferably accounts for the cyanate resin in the cyanate resin composition and is not present! 10 to 90% by weight, more preferably 20 to 80% by weight, particularly preferably 30 to 70% by weight, based on the total amount of the epoxy resin.
- the epoxy resin according to the present invention is an epoxy resin containing at least two epoxy groups per molecule and having no halogen atom in the molecular structure.
- 3 ⁇ 4 epoxy resin is preferably as shown in the formula II! 3 ⁇ 4 epoxy resin:
- R is an O—or
- R 2 is an aryl group, such as phenyl, naphthyl, biphenyl, etc.
- R 3 , R 4 are a hydrogen atom, an alkane a group, an aryl group, an aralkyl group or a group represented by the formula:
- R 5 , R 6 are a hydrogen atom, an alkyl group, an aryl group or an aralkyl group, m is an integer of 0 to 5, and c is 1 to 5
- An integer, n is an integer from 1 to 50.
- R 7 is an aryl group, a group of _0—or —C—
- R 9 is a hydrogen atom, an alkyl group, an aryl group or an aralkyl group, i is 0 or 1, and j is 1 or 2.
- the epoxy resin is further preferably an aralkyl novolac type epoxy resin or an aryl ether type novolac epoxy resin having a structure represented by Formula V:
- R, R 2 are aryl, such as phenyl, naphthyl, biphenyl, etc.
- R 3 , R 5 , R 6 are a hydrogen atom, an alkyl group, an aryl group or an aralkyl group, and m is 1 ⁇ An integer of 5, c is an integer of 1 to 5, and n is an integer of 1 to 50.
- the 126-free epoxy resin may be used singly or in combination of plural kinds as needed.
- the amount of the halogen-free epoxy resin to be used is not particularly limited, and it is preferably 10 to 90% by weight, more preferably 20% by weight based on the total of the cyanate resin and the epoxy resin in the cyanate resin composition. It is -80% by weight, particularly preferably 30 to 70% by weight.
- the inorganic filler according to the present invention is not particularly limited. Among them, fused silica has a low coefficient of thermal expansion and is excellent in flame retardancy and heat resistance of boehmite.
- the amount of the inorganic filler to be used in the present invention is not particularly limited, and the cyanate resin is not contained in the cyanate resin composition!
- the amount of the corresponding inorganic filler is preferably 10 to 300 parts by weight, more preferably 30 to 200 parts by weight, particularly preferably 50 to 150 parts by weight.
- the cyanate resin composition of the present invention may further comprise a maleimide compound.
- the maleimide compound is not particularly limited and is a compound containing at least one maleimide group per molecule.
- the maleimide compound is further preferably a compound containing at least two maleimide groups per molecule.
- the amount of the maleimide compound to be used in the present invention is not particularly limited, and it is preferably 5 to 80% by weight based on the total amount of the cyanate resin and the maleimide compound in the cyanate resin composition. It is particularly preferably 10 to 70% by weight.
- the present invention also provides a prepreg produced using the above cyanate resin composition, the prepreg comprising a substrate and a cyanate resin composition adhered to the substrate by impregnation and drying.
- the present invention further provides a laminate and a metal foil-clad laminate produced using the above prepreg.
- the laminate comprises at least one prepreg, which is laminated and cured to obtain a laminate;
- the metal foil laminate comprises at least one prepreg, and a metal foil is coated on one or both sides of the prepreg , the laminate is cured to obtain a metal foil laminate.
- the cyanate resin composition provided by the present invention has good mechanical properties, heat resistance and flame retardancy.
- the laminate prepared by using the prepreg obtained from the cyanate resin composition and the metal foil-clad laminate have good flame retardancy without using a compound or a phosphorus compound as a flame retardant. Low X, Y direction thermal expansion coefficient, good mechanical properties.
- the prepreg, the laminate, and the metal foil-clad laminate are suitable for producing a highly reliable substrate material for semiconductor packaging because of the above-described excellent overall performance. detailed description
- the present invention provides a cyanate resin composition
- a cyanate resin composition comprising a cyanate resin, an epoxy-free resin, and an inorganic filler, and the structural formula of the cyanate resin is as follows:
- R is a hydrogen atom, an alkyl group, an aryl group or an aralkyl group, and n is an integer of from 1 to 50. Further, n is an integer of 1 to 10, and when n is in this range, the cyanate resin has a good wettability to the substrate.
- the cyanate resin of the present invention is not particularly limited, and is a cyanate resin or a prepolymer thereof having at least two cyanate groups per molecule and as shown in Formula I.
- the cyanate resin may be used singly or as a mixture of at least two cyanate resins as needed.
- the amount of the cyanate resin to be used is not particularly limited, and it preferably accounts for the cyanate resin in the cyanate resin composition and is not present! 10 to 90% by weight, more preferably 20 to 80% by weight, particularly preferably 30 to 70% by weight, based on the total amount of the epoxy resin.
- the method for synthesizing the cyanate resin is not particularly limited, and it may be selected from a synthetic method of a usual cyanate resin.
- the method for synthesizing the cyanate resin is as follows: in the presence of a basic compound, an ⁇ -naphthol phenolic resin or a ⁇ -naphthol phenolic acid resin having a structure represented by the following formula IV is reacted with a cyanogen halide. The reaction is carried out in an inert organic solvent to obtain a cyanate resin.
- R is a hydrogen atom, an alkyl group, an aryl group or an aralkyl group, and n is an integer of from 1 to 50.
- the epoxy resin according to the present invention is an epoxy resin containing at least two epoxy groups per molecule and having no protein atoms in the molecular structure.
- the epoxy-free epoxy resin is bisphenol A epoxy resin, bisphenol F epoxy resin, phenolic epoxy resin, cresol novolac epoxy resin, bisphenol A phenolic epoxy resin, trifunctional phenol Epoxy resin, tetrafunctional phenol epoxy resin, naphthalene epoxy resin, naphthol epoxy resin, fluorene epoxy resin, phenoxy epoxy resin, norbornene epoxy resin, adamantane Epoxy resin, bismuth epoxy resin, biphenyl epoxy resin, dicyclopentadiene epoxy resin, aralkyl epoxy resin, aralkyl phenolic epoxy resin, aromatic a compound obtained by epoxidation of a double bond such as a phenolic epoxy resin, an alicyclic epoxy resin, a polyol epoxy resin, a silicon-containing epoxy resin, a nitrogen-containing epoxy resin, or a butadiene, and a shrinkage Glyceramine epoxy resin, glycidyl ester epoxy resin, and the like.
- the epoxy resin is preferably an epoxy resin having a structure as shown in the formula II:
- R is an O- or a group
- R 2 is an aryl group such as a phenyl group, a naphthyl group, a biphenyl group, etc.
- R 3 and R 4 are a hydrogen atom, an alkyl group, an aryl group, an aralkyl group or a formula
- the group represented by ⁇ , R 5 and R 6 are a hydrogen atom, an alkyl group, an aryl group or an aralkyl group
- m is an integer of 0 to 5
- c is an integer of 1 to 5
- n is an integer of 1 to 50.
- R 7 is an aryl group
- R 8 is a _O_ or -C- group
- R 9 is a hydrogen atom, an alkyl group, an aryl group or an aralkyl group
- i is 0 or 1
- j is 1 or 2 t.
- the epoxy resin is further preferably an aralkyl phenolic epoxy tree having a structure represented by Formula V Fatty, aryl ether type phenolic epoxy resin:
- R is an O- or R 6 group
- R 2 is an aryl group such as phenyl, naphthyl, biphenyl, etc.
- R 3 , R 5 , R 6 are a hydrogen atom, an alkyl group, an aryl group Or an aralkyl group
- m is an integer of 1 to 5
- c is an integer of 1 to 5
- n is an integer of 1 to 50.
- phenol phenyl aralkyl type epoxy resin a phenol biphenyl aralkyl type epoxy resin, a phenol naphthyl aralkyl type epoxy resin, a naphthol phenyl aralkyl type epoxy resin.
- naphthol biphenyl aralkyl type epoxy resin naphthol naphthyl aralkyl type epoxy resin
- phenol phenyl ether type epoxy resin phenol biphenyl ether type epoxy resin
- phenol naphthyl ether type Epoxy resin naphthol phenyl ether type epoxy resin, naphthol phenyl ether type epoxy resin, and naphthol naphthyl ether type epoxy resin.
- the above-mentioned epoxy resin may be used singly or in combination of plural kinds as needed.
- the amount of the halogen-free epoxy resin to be used is not particularly limited, and it is preferably 10 to 90% by weight, more preferably 20% by weight based on the total of the cyanate resin and the epoxy resin in the cyanate resin composition. It is -80% by weight, particularly preferably 30 to 70% by weight.
- the inorganic filler according to the present invention is not particularly limited, and is specifically silica (for example, crystalline silica, fused silica, amorphous silica, spherical silica, hollow silica, etc.), Metal hydrates (such as aluminum hydroxide, boehmite, magnesium hydroxide, etc.), molybdenum oxide, zinc molybdate, titanium oxide, barium titanate, barium titanate, barium sulfate, boron nitride, aluminum nitride, silicon carbide , alumina, zinc borate, zinc stannate, clay, kaolin, talc, mica, short glass fibers and hollow glass.
- silica for example, crystalline silica, fused silica, amorphous silica, spherical silica, hollow silica, etc.
- Metal hydrates such as aluminum hydroxide, boehmite, magnesium hydroxide, etc.
- fused silica has a low coefficient of thermal expansion and is excellent in flame retardancy and heat resistance of boehmite.
- the average particle diameter (d50) of the inorganic filler is not particularly limited, but the average particle diameter U50 is preferably from 0.1 to 10 ⁇ m, more preferably from 0.2 to 5 ⁇ m from the viewpoint of dispersibility.
- the inorganic filler materials of different types, different particle size distributions or different average particle diameters may be used alone or in combination of plural kinds as needed.
- the amount of the inorganic filler to be used in the present invention is not particularly limited, and the cyanate resin in the cyanate resin composition is not included!
- the amount of the corresponding inorganic filler is preferably 10 to 300 parts by weight, more preferably 30 to 200 parts by weight, particularly preferably 50 to 150 parts by weight.
- the surface treatment agent is not particularly limited and is selected from surface treatment agents commonly used for inorganic treatment. Specific examples thereof include a tetraethyl orthosilicate compound, an organic acid compound, an aluminate compound, a titanate compound, a silicone oligomer, a macromolecular treatment agent, and a silane coupling agent.
- the silane coupling agent is not particularly limited, and is selected from a silane coupling agent commonly used for surface treatment of inorganic materials, and is specifically an aminosilane coupling agent, an epoxy silane coupling agent, a vinyl silane coupling agent, and a phenyl group.
- the wetting and dispersing agent are not particularly limited and are selected from the group consisting of wetting and dispersing agents commonly used in coatings. The present invention may be used alone or in appropriate combination according to the needs of different types of surface treatment agents or wetting and dispersing agents.
- the cyanate resin composition of the present invention may further comprise a maleimide compound.
- the maleimide compound is not particularly limited and is a compound containing at least one maleimide group per molecule.
- the maleimide compound is further preferably a compound containing at least two maleimide groups per molecule.
- the maleimide compound is not particularly limited, and is specifically N-phenylmaleimide, N-(2-methylphenyl)maleimide, N-(4-methylphenyl group).
- Maleimide N-(2,6-dimethylphenyl)maleimide, bis(4-maleimidophenyl)methane, 2,2-di(4-( 4-maleimidophenoxy)-phenyl)propane, bis(3,5-dimethyl-4-maleimidophenyl)methane, bis(3-ethyl-5- Methyl-4-maleimidophenyl)methane, bis(3,5-diethyl-4-maleimidophenyl)methane, etc., polyphenylmethane maleimide, A prepolymer of the above maleimide compound or a prepolymer of a maleimide compound and an amine compound.
- the maleimide compound is preferably bis(4-maleimidophenyl)methane, 2,2-bis(4-(4-maleimidophenoxy)-phenyl)propane, Bis(3-ethyl-5-methyl-4-maleimidophenyl)methane.
- the maleimide compound can be used singly or in combination of plural kinds as needed.
- the amount of the maleimide compound to be used in the present invention is not particularly limited, and it is preferably 5 to 80% by weight based on the total amount of the cyanate resin and the maleimide compound in the cyanate resin composition. It is particularly preferably 10 to 70% by weight.
- the cyanate resin composition of the present invention may also be used in combination with a cyanate resin other than the cyanate resin represented by Formula I as long as it does not impair the inherent properties of the cyanate resin composition. It may be selected from bisphenol A type cyanate resin, bisphenol F type cyanate resin, bisphenol M type cyanate resin, bisphenol S type cyanate resin, bisphenol E type cyanate resin, bisphenol P-type cyanate Resin, novolac type cyanate resin, cresol novolac type cyanate resin, dicyclopentadiene type cyanate resin, tetramethylbisphenol F type cyanate resin, phenolphthalein type cyanate resin, naphthalene A prepolymer of the above-mentioned cyanate resin, such as a phenolic cyanate resin or an aralkyl type cyanate resin. These cyanate resins may be used singly or in combination of plural kinds as needed.
- the cyanate resin composition of the present invention can also be used in combination with various high polymer and organic filler materials as long as it does not impair the inherent properties of the cyanate resin composition.
- it is a different liquid crystal polymer, a thermosetting resin, a thermoplastic resin and oligomers and rubber bodies thereof, different flame retardant compounds or additives, and the like. They can be used singly or in combination of plural kinds as needed. Silicone powders are preferred because they have good flame retardant properties.
- the cyanate resin composition of the present invention can also be used in combination with a curing accelerator as needed to control the curing reaction rate.
- the curing accelerator is not particularly limited, and may be selected from curing accelerators commonly used for promoting curing of cyanate resins, epoxy resins or epoxy-free epoxy resins, specifically copper, zinc, cobalt, nickel, manganese.
- Organic salts of metals such as imidazole and its derivatives, tertiary amines, and the like.
- the present invention further provides a prepreg, a laminate, and a metal foil-clad laminate produced using the above cyanate resin composition.
- the prepreg includes a substrate and a cyanate resin composition adhered thereto by impregnation and drying.
- the laminate comprises at least one prepreg which is laminated and cured to provide a laminate.
- the metal-clad laminate comprises at least one prepreg, and a metal foil is coated on one or both sides of the prepreg, and the metal foil laminate is cured by lamination.
- the laminate and the metal foil-clad laminate prepared by using the prepreg have good heat resistance, low X, Y direction thermal expansion coefficient, good mechanical properties, and do not use a halogen compound or a phosphorus compound as a resistance.
- a fuel it also has good flame retardancy, and is therefore suitable for producing a highly reliable substrate material for semiconductor packaging.
- the substrate of the present invention is not particularly limited and may be selected from known substrates for producing various printed wiring board materials. Specifically, it is inorganic fiber (for example, E glass, D glass, M glass, S glass, T glass, NE glass, quartz glass fiber, etc.), organic fiber (such as polyimide, polyamide, polyester, liquid crystal polymer, etc.) .
- the form of the substrate is usually a woven fabric, a nonwoven fabric, a roving, a staple fiber, a fiber paper or the like.
- the substrate of the present invention is preferably a glass cloth.
- the prepreg according to the present invention is produced by combining a cyanate resin composition with a substrate, and the laminate of the present invention can be obtained by laminating and curing using the above prepreg.
- the metal foil-clad laminate of the present invention is prepared by: placing one of the above prepregs or stacking two or more prepregs, as needed in the prepreg or stacking prepreg A metal foil is placed on one or both surfaces and laminated to obtain a metal foil laminate.
- Metal foil There is no particular limitation, and it may be selected from metal foils for printed wiring board materials.
- the lamination conditions can be selected from the general lamination conditions of laminates for printed wiring boards and multilayer boards.
- a metal foil-clad laminate made of the cyanate resin composition of the present invention is tested for
- test results are further illustrated and described in the following examples.
- the naphthol phenolic acid resin (provided by Minghe Chemical Co., Ltd., as shown in the following formula) having a hydroxyl group content of 0.50 mol was used instead of 67 g (hydroxyl content 0.50 mol) of naphthol phenolic acid resin used in Synthesis Example 1, and other synthesis and synthesis were carried out.
- Example 1 A naphthol novolac type cyanate resin was obtained in the same manner, and the structural formula is shown in the following formula IX. Xinjiang
- Butanone and mix well then add 125 parts by weight of boehmite (APYRAL AOH 30 from Nabaltec), 25 parts by weight of spherical fused silica (SC2050, supplied by Admatechs), and 5 parts by weight of silicone powder (KMP-605) , supplied by Shin-Etsu Chemical), 1 part by weight of an epoxy silane coupling agent (Z-6040, supplied by Dow Corning), 1 part by weight of a dispersant (BYK-W903, supplied by BYK), and adjusted to a suitable viscosity with methyl ethyl ketone, Stir well and mix well to make a glue.
- AOL 30 boehmite
- SC2050 spherical fused silica
- silicone powder KMP-605
- Z-6040 supplied by Dow Corning
- BYK-W903 supplied by BYK
- the prepreg was prepared by dipping the above glue with a 1078, 2116 glass fiber cloth, and then drying the solvent to remove the solvent.
- the above prepregs of 2 x 1078, 4 x 2116, and 8 x 2116 were laminated, and 18 ⁇ m thick electrolytic copper foil was pressed on both sides thereof, and solidified in a press for 2 hours, and the curing pressure was 45.
- Kg/cm 2 curing temperature was 220 ° C, and copper clad laminates having thicknesses of 0.1, 0.4, and 0.8 mm were obtained, respectively.
- a naphthol novolac type cyanate resin obtained in Synthesis Example 1 30 parts by weight of a phenol biphenyl aralkyl type epoxy resin (NC-3000-FH, supplied by Nippon Kayaku Co., Ltd.), 35 A part by weight of naphthol naphthyl ether type epoxy resin (EXA-7311, supplied by DIC Corporation), 0.02 parts by weight of zinc octoate dissolved in methyl ethyl ketone and mixed, and then added 80 parts by weight of boehmite (APYRAL AOH 30, Provided by Nabaltec), 1 part by weight of epoxy silane coupling agent (Z- 6040, supplied by Dow Corning), 1 part by weight of dispersant (BYK-W903, supplied by BYK), adjusted to a suitable viscosity with methyl ethyl ketone, stirred and mixed Evenly, the glue is made. According to the same manufacturing process as in Example 1, a copper-clad laminate having a thickness
- Example 2 35 parts by weight of a bisphenol A type cyanate resin prepolymer (BA-3000, supplied by LONZA) was used instead of 35 parts by weight of a naphthol novolac type cyanate resin used in Example 2, and the others were the same as in Example 1.
- the method obtained a copper clad laminate having a thickness of 0.1, 0.4, and 0.8 mm.
- Example 3 40 parts by weight of a naphthol novolac type cyanate resin used in Example 3 was replaced with 40 parts by weight of a dicyclopentadiene type cyanate resin (DT-4000, supplied by LONZA), and the same method as in Example 3 was carried out.
- DT-4000 dicyclopentadiene type cyanate resin
- Dip resistance A 50 x 50 mm sample was immersed in a 288 °C tin furnace, and the stratified foaming was observed and the corresponding time was recorded.
- Test sample thickness 0.4 mm.
- Flame retardancy Judging according to the UL94 vertical burning test standard. Test sample thickness: 0.4 mm.
- X, Y-CTE Y direction along the direction of the warp of the fiberglass cloth, X direction of the weft direction; Test equipment and conditions: TMA, the temperature rise from room temperature 25 °C to 300 °C at a heating rate of 10 °C / min, determination Thermal expansion coefficient (CTE) in the plane direction from 50 ° C to 150 ° C. Test sample thickness: 0.1 mm.
- Flexural modulus Test equipment and conditions: DMA, the temperature was raised from room temperature 25 °C to 300 °C at a heating rate of 10 °C/min, and the flexural modulus at 50 °C was measured and recorded. Test sample thickness: 0.8 mm.
- the examples Compared with the comparative examples, the examples have a flame retardancy of V-0 and a lower X, Y direction thermal expansion coefficient and a good flexural modulus.
- the cyanate resin composition of the present invention has good mechanical properties, heat resistance, flame retardancy, and a laminate made of the prepreg obtained by using the cyanate resin composition.
- metal foil-clad laminates which also have good flame retardancy, low X, Y-direction thermal expansion coefficient, good mechanical properties, and are suitable for high production without using compounds or phosphorus compounds as flame retardants.
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Citations (4)
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CN1803916A (en) * | 2005-01-13 | 2006-07-19 | 三菱瓦斯化学株式会社 | Resin composite and prepreg and laminate materials used thereof |
CN101240111A (en) * | 2007-02-07 | 2008-08-13 | 三菱瓦斯化学株式会社 | Prepreg and laminate |
WO2012029690A1 (en) * | 2010-08-31 | 2012-03-08 | 三菱瓦斯化学株式会社 | Resin composition, prepreg, and laminate |
CN102558759A (en) * | 2010-12-24 | 2012-07-11 | 广东生益科技股份有限公司 | Cyanate ester resin composition and prepreg and laminated material manufactured by using same |
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CN1803916A (en) * | 2005-01-13 | 2006-07-19 | 三菱瓦斯化学株式会社 | Resin composite and prepreg and laminate materials used thereof |
CN101240111A (en) * | 2007-02-07 | 2008-08-13 | 三菱瓦斯化学株式会社 | Prepreg and laminate |
WO2012029690A1 (en) * | 2010-08-31 | 2012-03-08 | 三菱瓦斯化学株式会社 | Resin composition, prepreg, and laminate |
CN102558759A (en) * | 2010-12-24 | 2012-07-11 | 广东生益科技股份有限公司 | Cyanate ester resin composition and prepreg and laminated material manufactured by using same |
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