WO2013132854A1 - 基板処理装置の消費エネルギー監視システム及び基板処理装置の消費エネルギー監視方法 - Google Patents
基板処理装置の消費エネルギー監視システム及び基板処理装置の消費エネルギー監視方法 Download PDFInfo
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- WO2013132854A1 WO2013132854A1 PCT/JP2013/001427 JP2013001427W WO2013132854A1 WO 2013132854 A1 WO2013132854 A1 WO 2013132854A1 JP 2013001427 W JP2013001427 W JP 2013001427W WO 2013132854 A1 WO2013132854 A1 WO 2013132854A1
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- 239000000758 substrate Substances 0.000 title claims abstract description 93
- 238000005265 energy consumption Methods 0.000 title claims abstract description 72
- 238000012544 monitoring process Methods 0.000 title claims abstract description 40
- 238000000034 method Methods 0.000 title claims abstract description 29
- 230000008569 process Effects 0.000 claims abstract description 21
- 238000003860 storage Methods 0.000 claims abstract description 15
- 238000012545 processing Methods 0.000 claims description 96
- 238000004140 cleaning Methods 0.000 claims description 9
- 238000005530 etching Methods 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 5
- 238000005259 measurement Methods 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 229920002120 photoresistant polymer Polymers 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 description 16
- 238000004519 manufacturing process Methods 0.000 description 7
- 239000000126 substance Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 238000004364 calculation method Methods 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
Definitions
- the present invention relates to a consumption energy monitoring system for a substrate processing apparatus and a consumption energy monitoring method for a substrate processing apparatus.
- substrate processing apparatuses have been used in the manufacture of semiconductor devices, flat panel display substrates, solar cell panels, and the like.
- various substrate processing apparatuses such as a semiconductor wafer cleaning apparatus, a coating and developing apparatus, an etching apparatus, a film forming apparatus, and a heat treatment apparatus are used (for example, see Patent Document 1).
- Such a substrate processing apparatus requires a lot of energy in the substrate processing process. For this reason, the substrate processing apparatus is required to save energy from the viewpoint of reducing the environmental load and reducing the substrate processing cost, and is required to grasp the energy consumption.
- a sensor When trying to display energy consumption in a substrate processing apparatus, a sensor is installed to measure the amount of power actually used, and a data collector is installed to collect measurement data from the sensor. The energy consumption is displayed based on the value measured by the sensor.
- the present invention has been made in response to the above-described conventional circumstances, and includes a consumption energy monitoring system for a substrate processing apparatus and a substrate processing apparatus capable of monitoring consumption energy while suppressing an increase in manufacturing cost of the apparatus. It aims at providing the consumption energy monitoring method.
- One aspect of a consumption energy monitoring system for a substrate processing apparatus is a consumption energy monitoring system for a substrate processing apparatus that monitors consumption energy of a substrate processing apparatus that performs a predetermined process on a substrate to be processed.
- Storage means for storing energy consumption data indicating a relationship between an event accompanied by consumption of energy and the amount of energy consumed by the occurrence of the event, and process processing data is collected from the substrate processing apparatus.
- One aspect of the consumption energy monitoring method for a substrate processing apparatus is a consumption energy monitoring method for a substrate processing apparatus for monitoring the consumption energy of a substrate processing apparatus that performs a predetermined process on a substrate to be processed. Storing energy consumption data indicating a relationship between an event involving consumption of energy in the processing in the process and an amount of energy consumed by the occurrence of the event in a storage unit, and collecting process processing data from the substrate processing apparatus Detecting the occurrence of an event accompanied by energy consumption, and integrating and calculating the amount of energy consumption from the duration of the event and the energy consumption data of the event stored in the storage means It is characterized by.
- the present invention it is possible to provide a substrate processing apparatus consumption energy monitoring system and a substrate processing apparatus consumption energy monitoring method capable of monitoring consumption energy while suppressing an increase in manufacturing cost.
- FIG. 1 is a diagram schematically showing a configuration of an energy consumption monitoring system for a substrate processing apparatus according to an embodiment of the present invention.
- reference numeral 100 is a consumption energy monitoring system of a substrate processing apparatus
- 110 is a substrate processing apparatus, which is a semiconductor wafer cleaning apparatus in this embodiment.
- a substrate processing apparatus (semiconductor wafer cleaning apparatus) 110 is a spin chuck that is made rotatable by sucking and holding a semiconductor wafer, and a cleaning chemical solution or a pure rinsing surface on the surface of the semiconductor wafer held on the spin chuck. It has a configuration of a known cleaning device such as a plurality of nozzles for supplying water and the like, and a cup disposed so as to surround the periphery of the semiconductor wafer held on the spin chuck.
- a chemical solution for cleaning and pure water for rinsing are supplied from a plurality of nozzles to the semiconductor wafer held on the spin chuck, and the chemical solution and pure water for rinsing are rotated by rotating the semiconductor wafer.
- the semiconductor wafer is configured to be washed and dried by shaking it off.
- the substrate processing apparatus 110 in addition to a cleaning apparatus, for example, a coating / developing apparatus for applying and developing a photoresist on a semiconductor wafer (substrate to be processed), an etching apparatus for etching a semiconductor wafer (substrate to be processed),
- the present invention can be applied to a film formation apparatus that forms a film on a semiconductor wafer (substrate to be processed), a heat treatment apparatus that performs heat treatment on a semiconductor wafer (substrate to be processed), and the like.
- the substrate processing apparatus energy consumption monitoring system 100 includes a data collector 101, a trace data database 102, a virtual engine 103, a monitor 104, and a monitor database 105.
- process processing data 112 related to the process processing executed on the basis of each recipe in the substrate processing apparatus 110 is output.
- the process processing data 112 from the substrate processing apparatus 110 is input to the data collector 101 of the energy consumption monitoring system 100 of the substrate processing apparatus and stored in the trace data database 102.
- the virtual engine 103 includes storage means for storing energy consumption data indicating a relationship between an event that involves consumption of energy in the processing in the substrate processing apparatus 110 and the amount of energy consumed by the occurrence of the event, and the substrate processing apparatus 110. From the process processing data input to the data collector 101 and stored in the trace data database 102, the occurrence of an event accompanied by consumption of energy is detected, and the duration of the event and the consumption of the event stored in the storage means Means for integrating and calculating the amount of energy consumption from the energy data.
- the virtual engine 103 detects an event executed in the process processing and its duration every predetermined time, in this embodiment every second, based on the process processing data 112 stored in the trace data database 102. . It is consumed while the event continues by integrating the amount of energy consumed from the amount of energy consumed per unit time (energy consumption data) registered in advance for each event in the storage means and the duration of the event. Calculate the amount of energy consumed.
- the monitor 104 aggregates the energy consumption calculated by the virtual engine 103 and stores it in the monitor database 105, and displays the stored data.
- the energy consumption amount in the virtual engine 103 for example, as shown in FIG. 2, it is detected whether or not an event (sensor event shown in FIG. 2) executed in the process processing has occurred and the sensor event is on.
- the energy consumption as virtual data is integrated.
- the date and time are shown on the left end portion, and the device status is shown on the right side thereof.
- the device status shown in FIG. 2 is “processing”, but as shown in the portion of the energy consumption registration example shown on the right side in FIG. 2, the device status indicates that the process is being executed.
- startup indicating that the system is being started
- idle indicating that the system is idling
- the energy consumption per unit time consumed when the sensor event is turned on is registered in advance as energy consumption data.
- the energy consumption amount is calculated by converting into the energy amount per second as will be described later.
- FIG. 2 also shows actual data, but in the case of actual data, there is no designation of event conditions, so the measured values for all periods will be integrated.
- the unit of the actual data is L / min, so that the amount of energy consumption is calculated by converting into the amount of energy per second as in the case of the virtual data described above. .
- FIG. 3 shows an example of a registration screen for energy consumption in the virtual engine 103.
- a target is specified by a unit name, an item name, or the like.
- an expression, a numerical value, and the like used for converting the above-described flow rate into the consumed energy amount are registered based on the conversion pattern, the conversion factor, and the like.
- the registered contents are stored in the storage means in the virtual engine 103, and are called up and used when calculating the energy consumption.
- the conversion pattern is Quantity ⁇ Factor / 1000
- the conversion factor is 0.2600 (kwh / m 3 ) It is.
- the variable X is 1.0000 and the variable Y is 1.0000.
- the substrate processing apparatus 110 is provided with various sensors for measuring energy consumption and a data collector for collecting measurement data from these sensors. Instead, by inputting the process processing data 112 related to the process processing executed based on each recipe in the substrate processing apparatus 110, the energy consumption amount of the substrate processing apparatus 110 can be virtually calculated and displayed.
- the above-described energy consumption monitoring system 100 of the substrate processing apparatus is configured to virtually calculate and display the energy consumption amount without using various sensors for measuring the energy consumption. For this reason, there is a possibility that the calculated amount of consumed energy may deviate from the actually measured value of consumed energy. For this reason, it is preferable that calibration is performed at an arbitrary timing and correction is performed so that the actually measured value of the consumed energy amount and the virtually calculated consumed energy amount coincide with each other with high accuracy.
- a sensor for measuring the amount of energy consumption is installed in each part of the substrate processing apparatus 110 at a timing when maintenance work of the substrate processing apparatus 110 is performed. Then, the energy consumption amount is calculated by the virtual engine 103 so that the energy consumption amount measured by these sensors coincides with the energy consumption amount virtually calculated by the energy consumption monitoring system 100 of the substrate processing apparatus. Change the parameters etc. As a result, the energy consumption virtually calculated by the energy consumption monitoring system 100 of the substrate processing apparatus can be matched with the energy consumption actually measured with high accuracy.
- this invention is not limited to embodiment mentioned above, Of course, various deformation
- the substrate processing apparatus consumption energy monitoring system 100 is provided separately from the substrate processing apparatus 110 has been described.
- the substrate processing apparatus consumption energy monitoring system 100 is disposed in the substrate processing apparatus 110. It is also possible to arrange it by installing it.
- the functions of the trace data database 102, the virtual engine 103, the monitor 104, and the monitor database 105 can be provided in a control computer for controlling the operation of the substrate processing apparatus 110.
- model for calculating the energy consumption amount in the virtual engine 103 is not limited to the above-described model, and may be another model.
- the energy consumption monitoring system for a substrate processing apparatus of the present invention can be used in the field of manufacturing semiconductor devices, flat panel display substrates, solar cell panels, and the like. Therefore, it has industrial applicability.
- DESCRIPTION OF SYMBOLS 100 Energy consumption monitoring system of substrate processing apparatus, 101 ... Data collector, 102 ... Trace data database, 103 ... Virtual engine, 104 ... Monitor, 105 ... Monitor database, 110 ... Substrate processing apparatus, 111... I / O port, 112... Process processing data.
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing And Monitoring For Control Systems (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
Description
本発明は、上記従来の事情に対処してなされたものであり、装置の製造コストの上昇を抑制しつつ消費エネルギーの監視を行うことのできる基板処理装置の消費エネルギー監視システム及び基板処理装置の消費エネルギー監視方法を提供することを目的とする。
Quantity×Factor/1000
であり、コンバージョンファクターは
0.2600(kwh/m3)
である。また、変数Xは1.0000、変数Yは1.0000である。
Claims (5)
- 被処理基板に所定の処理を施す基板処理装置の消費エネルギーを監視する基板処理装置の消費エネルギー監視システムであって、
前記基板処理装置における処理のうちエネルギーの消費を伴うイベントと、当該イベントの発生によって消費されるエネルギー量との関係を示す消費エネルギーデータを格納する記憶手段と、
前記基板処理装置からプロセス処理データを収集し、エネルギーの消費を伴うイベントの発生を検出し、当該イベントの継続時間と、前記記憶手段に記憶された当該イベントの消費エネルギーデータとから消費エネルギー量を積算して算出する手段と
を具備したことを特徴とする基板処理装置の消費エネルギー監視システム。 - 請求項1記載の基板処理装置の消費エネルギー監視システムであって、
前記基板処理装置における処理のうちエネルギーの消費を伴うイベントと、当該イベントの発生によって消費されるエネルギー量との関係を示す消費エネルギーデータを登録する手段
を具備したことを特徴とする基板処理装置の消費エネルギー監視システム。 - 請求項1又は2記載の基板処理装置の消費エネルギー監視システムであって、
前記基板処理装置で消費される消費エネルギーの実測値に基づいて、前記記憶手段に記憶された消費エネルギーデータを修正する手段を具備した
ことを特徴とする基板処理装置の消費エネルギー監視システム。 - 請求項1~3いずれか1項記載の基板処理装置の消費エネルギー監視システムであって、
前記基板処理装置が、被処理基板を洗浄する基板洗浄装置、被処理基板にフォトレジストの塗布及び現像を行う塗布現像装置、被処理基板のエッチングを行うエッチング装置、被処理基板に成膜する成膜装置、被処理基板に熱処理を施す熱処理装置のいずれかである
ことを特徴とする基板処理装置の消費エネルギー監視システム。 - 被処理基板に所定の処理を施す基板処理装置の消費エネルギーを監視する基板処理装置の消費エネルギー監視方法であって、
前記基板処理装置における処理のうちエネルギーの消費を伴うイベントと、当該イベントの発生によって消費されるエネルギー量との関係を示す消費エネルギーデータを記憶手段に格納する工程と、
前記基板処理装置からプロセス処理データを収集し、エネルギーの消費を伴うイベントの発生を検出し、当該イベントの継続時間と、前記記憶手段に記憶された当該イベントの消費エネルギーデータとから消費エネルギー量を積算して算出する工程と
を具備したことを特徴とする基板処理装置の消費エネルギー監視方法。
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KR1020147024481A KR102058763B1 (ko) | 2012-03-09 | 2013-03-07 | 기판 처리 장치의 소비 에너지 감시 시스템 및 기판 처리 장치의 소비 에너지 감시 방법 |
JP2014503492A JP5992994B2 (ja) | 2012-03-09 | 2013-03-07 | 基板処理装置の消費エネルギー監視システム及び基板処理装置の消費エネルギー監視方法 |
US14/481,010 US20150032246A1 (en) | 2012-03-09 | 2014-09-09 | Energy-consumption monitoring system for substrate processing apparatus and energy-consumption monitoring method for substrate processing apparatus |
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- 2013-03-07 KR KR1020147024481A patent/KR102058763B1/ko active IP Right Grant
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JP2003100576A (ja) * | 2001-09-20 | 2003-04-04 | Dainippon Screen Mfg Co Ltd | 基板処理装置のスケジュール作成方法及びそのプログラム |
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JP5992994B2 (ja) | 2016-09-14 |
US20150032246A1 (en) | 2015-01-29 |
KR102058763B1 (ko) | 2019-12-23 |
TWI567781B (zh) | 2017-01-21 |
TW201351477A (zh) | 2013-12-16 |
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