[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

WO2013104623A1 - Led module with improved cooling unit - Google Patents

Led module with improved cooling unit Download PDF

Info

Publication number
WO2013104623A1
WO2013104623A1 PCT/EP2013/050220 EP2013050220W WO2013104623A1 WO 2013104623 A1 WO2013104623 A1 WO 2013104623A1 EP 2013050220 W EP2013050220 W EP 2013050220W WO 2013104623 A1 WO2013104623 A1 WO 2013104623A1
Authority
WO
WIPO (PCT)
Prior art keywords
led module
module according
heat
led
side surfaces
Prior art date
Application number
PCT/EP2013/050220
Other languages
German (de)
French (fr)
Inventor
Maximilian KROENER
Andreas Kloss
Original Assignee
Osram Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Gmbh filed Critical Osram Gmbh
Publication of WO2013104623A1 publication Critical patent/WO2013104623A1/en

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/60—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air
    • F21V29/67—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by the arrangement of fans
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/507—Cooling arrangements characterised by the adaptation for cooling of specific components of means for protecting lighting devices from damage, e.g. housings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2101/00—Point-like light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the invention relates to an LED module with improved cooling according to the preamble of claim 1. It is in particular a so-called. LED light engine.
  • PRIOR ART WO 2006/016324 discloses a light engine which is cooled by a liquid.
  • WO 2005/043619 discloses a slotted body of graphite foam as a heat sink for electronic Gerä ⁇ te. It is used for passive cooling.
  • the size and performance of forced convection heat sinks is determined by the amount of moving air and the efficiency of the heat exchange from the heat sink itself to the air. In traditional designs where a fan blows on heat sinks, only 20 to 40% of the possible heat is transferred to the air and dissipated. A correspondingly large air flow in turn generates disturbing noises.
  • the heat sink consists of a block, preferably slotted at least two sides, of open-pored graphite foam or has this predominantly on.
  • the heat is preferably passed through a steam chamber on end faces of the graphite block.
  • the block itself is blown flat by a fan.
  • the air flowing through is swirled and passed on such a large area that the outgoing air has about the same temperature as the graphite foam.
  • This fully exploits the physical possibilities of convection.
  • the high heat conduction of the graphite or other material with high heat conduction leads to the fullest possible use of the foam volume.
  • the slots increase the area flowed through and reduce the flow resistance, which together with the selected fan element determines the resulting air flow.
  • the heat is entered into the faces of the graphite block, to a heat-spreading element such as a steam chamber or a thermal bridge made of metal is recommended.
  • an open-pored graphite foam is used as a heat exchanger, which releases the heat from the actual heat sink, which can be understood as a thermal bridge, to the air blown through. This is the actual bottleneck on the thermal path for the cooling of LEDs.
  • forced or active cooling ie for example the use of a fan, used and used.
  • the graphite foam is also slit in a certain way from the opposite sides.
  • the slots are arranged offset from one another on both sides.
  • Essential features of the invention in the form of a nume ⁇ tured list are: 1. LED module having at least one LED and a housing surrounding the LED, wherein the housing is cooled, characterized in that the housing is connected to a heat ⁇ me Hampshire, wherein the thermal bridge is in thermal contact with a heat exchanger, wherein the heat exchanger is exposed to active cooling by means for active cooling.
  • LED module according to claim 1 characterized in that the thermal bridge is designed as a cooling plate. 3. LED module according to claim 1, characterized in that the thermal bridge is additionally equipped with a means for heat spreading.
  • LED module according to claim 1 characterized in that the means for spreading heat is a Dampfkammmer.
  • LED module according to claim 1 characterized in that the heat exchanger is a body made of open-pored graphite foam.
  • LED module according to claim 1 characterized in that the body is a cuboid with side surfaces, in particular narrow sides and broad sides.
  • LED module according to claim 1 characterized in that said first side surfaces with the heat bridge in contact with each ther ⁇ mixers. 8. LED module according to claim 1, characterized in that second side surfaces are provided with slots. 9. LED module according to claim 1, characterized in that the LED module is a light engine.
  • LED module according to claim 1 characterized in that the slots on the second side surfaces are offset from each other.
  • Fig. 1 is a schematic representation of a light engine with active cooling in front view; Fig. 2, the light engine with active cooling in side view.
  • FIG. 1 shows a structural unit 1 with an LED module 2, in particular a light engine, whose concrete structure for the invention does not matter.
  • the LED module has a cylindrical housing 3, with a lower end face 5 and an upper end face 4.
  • a heat ⁇ bridge 6 is contacted to the lower end face 5 attached. It is a U-shaped bent sheet of Kup ⁇ fer o. a.
  • a cavity is arranged which forms a steam chamber 7. It contains a vapor, such as water vapor.
  • the thermal bridge is laterally drawschlos ⁇ sen, in order not to let the steam escape. In the cold Condition at room temperature, the steam chamber is filled with water at low pressure.
  • a block 15 made of open-pored graphite foam is arranged between the two legs. He is cuboid or otherwise appropriately designed.
  • the broad sides 22 and 23 are also manufactureds ⁇ tattet with slots 25, symbolized by lines 26 and 27, which extend from two sides alternately in the cuboid, but are not continuous.
  • a fan element 30 is set, which causes an active Küh ⁇ ment of acting as a heat exchanger cuboid.
  • Figure 2 shows schematically the same assembly as seen from the side. Characterized the position of the Lüf ⁇ processing elements 30 is relatively square and clearly its first broad side 22 for a. Second, the position of the slots 26, 27 in the graphite foam is apparent, the slits extend alternately from the first broad side 22 and from the second broad side 23 of the body of graphite ⁇ foam.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The invention relates to an LED module (2) which is equipped with an active cooling unit, said cooling unit providing a thermal bridge (6), a heat exchanger in the form of an open-pore graphite foam (15), and an active cooling element, in particular a ventilation element (30).

Description

LED-Modul mit verbesserter Kühlung  LED module with improved cooling
Technisches Gebiet Technical area
Die Erfindung geht aus von einem LED-Modul mit verbesserter Kühlung gemäß dem Oberbegriff des Anspruchs 1. Es handelt sich dabei insbesondere um eine sog. LED light engine . The invention relates to an LED module with improved cooling according to the preamble of claim 1. It is in particular a so-called. LED light engine.
Stand der Technik Die WO 2006/016324 offenbart eine light engine, die durch eine Flüssigkeit gekühlt wird. PRIOR ART WO 2006/016324 discloses a light engine which is cooled by a liquid.
Die WO 2005/043619 offenbart einen geschlitzten Körper aus Graphitschaum als Wärmesenke für elektronische Gerä¬ te. Er wird für eine passive Kühlung verwendet. WO 2005/043619 discloses a slotted body of graphite foam as a heat sink for electronic Gerä ¬ te. It is used for passive cooling.
Darstellung der Erfindung Es ist Aufgabe der vorliegenden Erfindung, eine verbes¬ serte Kühlung für LED-Module, insbesondere eine light en¬ gine auf Basis von LEDs, bereitzustellen. SUMMARY OF THE INVENTION It is an object of the present invention to provide a verbes ¬ serte cooling for LED modules, in particular a light ¬ en gine to provide on the basis of LEDs.
Diese Aufgabe wird durch die kennzeichnenden Merkmale des Anspruchs 1 gelöst. Besonders vorteilhafte Ausgestaltun- gen finden sich in den abhängigen Ansprüchen. This object is solved by the characterizing features of claim 1. Particularly advantageous embodiments can be found in the dependent claims.
Beim Betrieb von LEDs werden 70-80 % der eingespeisten elektrischen Energie als Wärme freigesetzt. Dies führt zur Aufheizung des Chips, kriitshc ist ihrer insbesondere die Junction-Temperatur des Chips, die dabei ansteigt. Da die Effizienz und die Lebensdauer von LEDs mit steigender Junction-Temperatur dramatisch abnimmt, ist eine gute Wärmeabfuhr für den problemlosen Betrieb von LEDs in großen, konzentrierten Leistungspaketen entscheidend. Abwärme wird durch Kühlkörper an die Umgebungsluft abgeführt. Der Austausch der Luft geschieht durch natürliche Konvektion mittels Unterstützung durch Kühlkörper (passive Kühlung) oder durch erzwungene Konvektion mit einem Lüfter-Element (aktive Kühlung) . Natürliche Konvektion erfordert mit zunehmender Leistung immer größere Kühlkörper. So lassen sich mit einem Kühlkörper in der Größe einer 100 W Glühlampe maximal etwa 15 W wegkühlen. Die Größe und Leistungsfähigkeit von Kühlkörpern mit erzwungener Konvektion wird durch die Menge der bewegten Luft und von der Effizienz des Wärmeaustauschs vom Kühlkörper selbst an die Luft bestimmt. Bei traditionellen Konstruktionen, wobei ein Lüfter auf Kühlkörper bläst, werden lediglich 20 bis 40 % der möglichen Wärme an die Luft übertragen und abgeführt. Ein dementsprechend großer Luftstrom erzeugt wiederum störende Geräusche. When operating LEDs, 70-80% of the electrical energy supplied is released as heat. This leads to the heating of the chip, kriitshc their particular is the junction temperature of the chip, which increases. As the efficiency and lifetime of LEDs decrease dramatically as the junction temperature increases, good heat dissipation is crucial for trouble-free operation of LEDs in large, concentrated power packages. Waste heat is dissipated by heat sink to the ambient air. The exchange of air happens by natural convection by means of heat sinks (passive cooling) or by forced convection with a fan element (active cooling). Natural convection requires larger and larger heat sinks as power increases. Thus, with a heat sink the size of a 100 W incandescent lamp, a maximum of about 15 W can cool down. The size and performance of forced convection heat sinks is determined by the amount of moving air and the efficiency of the heat exchange from the heat sink itself to the air. In traditional designs where a fan blows on heat sinks, only 20 to 40% of the possible heat is transferred to the air and dissipated. A correspondingly large air flow in turn generates disturbing noises.
Da der Übergang der Wärme auf die vorbeiströmende Luft entscheidend für die Leistungsfähigkeit eines Kühlsystem ist, wird erfindungsgemäß eine Konstruktion vorgeschlagen, die einen offenporigen Graphitschaum für eine aktive Kühlung zu Hilfe nimmt. Since the transfer of heat to the passing air is crucial for the performance of a cooling system, a construction is proposed according to the invention, which takes an open-pored graphite foam for active cooling to help.
Der Kühlkörper besteht aus einem Block, bevorzugt mindestens zweiseitig geschlitzt, aus offenporigem Graphitschaum oder weist diesen überwiegend auf. Die Wärme wird bevorzugt durch eine Dampfkammer auf Stirnseiten des Graphitblocks geführt. Der Block selbst wird flächig von einem Lüfter durchblasen. The heat sink consists of a block, preferably slotted at least two sides, of open-pored graphite foam or has this predominantly on. The heat is preferably passed through a steam chamber on end faces of the graphite block. The block itself is blown flat by a fan.
Durch den offenporigen Schaum, beispielsweise von ORNS angeboten, wird die durchströmende Luft verwirbelt und an einer so großen Fläche vorbeigeführt, daß die ausströmende Luft etwa die gleiche Temperatur hat wie der Graphitschaum. Dadurch werden die physikalischen Möglichkeiten der Konvektion voll genutzt. Die hohe Wärmeleitung des Graphits oder eines anderen Materials mit hoher Wärmeleitung führt zu einer möglichst vollständigen Nutzung des Schaum-Volumens. Die Schlitze vergrößern die durchströmte Fläche und verringern den Strömungswiderstand, der zusammen mit dem gewählten Lüfter-Element den resultierenden Luftstrom bestimmt. Die Wärme wird in die Stirnflächen des Graphitschaumblocks eingetragen, dazu empfiehlt sich ein wärmespreizendes Element wie z.B. eine Dampfkammer oder eine Wärmebrücke aus Metall. Through the open-pore foam, for example, offered by ORNS, the air flowing through is swirled and passed on such a large area that the outgoing air has about the same temperature as the graphite foam. This fully exploits the physical possibilities of convection. The high heat conduction of the graphite or other material with high heat conduction leads to the fullest possible use of the foam volume. The slots increase the area flowed through and reduce the flow resistance, which together with the selected fan element determines the resulting air flow. The heat is entered into the faces of the graphite block, to a heat-spreading element such as a steam chamber or a thermal bridge made of metal is recommended.
Das Wesen der Erfindungsmeldung besteht darin, dass ein offenporiger Graphitschaum als Wärmetauscher verwendet wird, der die Wärme vom eigentlichen Kühlkörper, die als Wärmebrücke verstanden werden kann, an die durchgeblasene Luft abgibt. Dies ist nämlich die eigentliche Engstelle auf dem thermischen Pfad für die Kühlung von LEDs. Um das zu erreichen wird sowohl die Offenporigkeit als auch die extrem gute Wärmeleitfähigkeit des Schaums im Zusammen¬ hang mit erzwungener oder aktiver Kühlung, d.h. der Benutzung z.B. eines Lüfters, gebraucht und verwendet. The essence of the disclosure of the invention is that an open-pored graphite foam is used as a heat exchanger, which releases the heat from the actual heat sink, which can be understood as a thermal bridge, to the air blown through. This is the actual bottleneck on the thermal path for the cooling of LEDs. In order to achieve that is both open porosity and the extremely good thermal conductivity of the foam in combination ¬ hang with forced or active cooling, ie for example the use of a fan, used and used.
Um dieses Zusammenspiel der beiden Effekte zu nutzen, wird der Graphitschaum auch in einer bestimmten Weise von den entgegengesetzten Seiten aus geschlitzt. Bevorzugt sind die Schlitze auf beiden Seiten versetzt zueinander angeordnet . In order to use this interaction of the two effects, the graphite foam is also slit in a certain way from the opposite sides. Preferably, the slots are arranged offset from one another on both sides.
Wesentliche Merkmale der Erfindung in Form einer nume¬ rierten Aufzählung sind: 1. LED-Modul mit mindestens einer LED und einem Gehäuse, das die LED umgibt, wobei das Gehäuse gekühlt wird, dadurch gekennzeichnet, dass das Gehäuse an eine Wär¬ mebrücke angeschlossen ist, wobei die Wärmebrücke mit einem Wärmetauscher thermisch in Kontakt steht, wobei der Wärmetauscher einer aktiven Kühlung durch ein Mittel zur aktiven Kühlung ausgesetzt ist. Essential features of the invention in the form of a nume ¬ tured list are: 1. LED module having at least one LED and a housing surrounding the LED, wherein the housing is cooled, characterized in that the housing is connected to a heat ¬ mebrücke, wherein the thermal bridge is in thermal contact with a heat exchanger, wherein the heat exchanger is exposed to active cooling by means for active cooling.
2. LED-Modul nach Anspruch 1, dadurch gekennzeichnet, dass die Wärmebrücke als Kühlblech gestaltet ist. 3. LED-Modul nach Anspruch 1, dadurch gekennzeichnet, dass die Wärmebrücke zusätzlich mit einem Mittel zur Wärmespreizung ausgestattet ist. 2. LED module according to claim 1, characterized in that the thermal bridge is designed as a cooling plate. 3. LED module according to claim 1, characterized in that the thermal bridge is additionally equipped with a means for heat spreading.
4. LED-Modul nach Anspruch 1, dadurch gekennzeichnet, dass das Mittel zur Wärmespreizung eine Dampfkammmer ist. 4. LED module according to claim 1, characterized in that the means for spreading heat is a Dampfkammmer.
5. LED-Modul nach Anspruch 1, dadurch gekennzeichnet, dass der Wärmetauscher ein Körper aus offenporigem Graphitschaum ist. 5. LED module according to claim 1, characterized in that the heat exchanger is a body made of open-pored graphite foam.
6. LED-Modul nach Anspruch 1, dadurch gekennzeichnet, dass der Körper ein Quader mit Seitenflächen ist, insbesondere Schmalseiten und Breitseiten. 6. LED module according to claim 1, characterized in that the body is a cuboid with side surfaces, in particular narrow sides and broad sides.
7. LED-Modul nach Anspruch 1, dadurch gekennzeichnet, dass erste Seitenflächen mit der Wärmebrücke in ther¬ mischem Kontakt stehen. 8. LED-Modul nach Anspruch 1, dadurch gekennzeichnet, dass zweite Seitenflächen mit Schlitzen versehen sind. 9. LED-Modul nach Anspruch 1, dadurch gekennzeichnet, dass das LED-Modul eine light engine ist. 7. LED module according to claim 1, characterized in that said first side surfaces with the heat bridge in contact with each ther ¬ mixers. 8. LED module according to claim 1, characterized in that second side surfaces are provided with slots. 9. LED module according to claim 1, characterized in that the LED module is a light engine.
10. LED-Modul nach Anspruch 1, dadurch gekennzeichnet, dass die Schlitze auf den zweiten Seitenflächen gegen- einander versetzt sind. 10. LED module according to claim 1, characterized in that the slots on the second side surfaces are offset from each other.
Figuren characters
Im folgenden soll die Erfindung anhand mehrerer Ausführungsbeispiele näher erläutert werden. Es zeigen: In the following the invention will be explained in more detail with reference to several embodiments. Show it:
Fig. 1 eine Prinzipdarstellung einer light engine mit aktiver Kühlung in Frontansicht; Fig. 2 die light engine mit aktiver Kühlung in Seitenansicht . Fig. 1 is a schematic representation of a light engine with active cooling in front view; Fig. 2, the light engine with active cooling in side view.
Beschreibung der Figuren Description of the figures
Figur 1 zeigt eine Baueinheit 1 mit einem LED-Modul 2, insbesondere eine light engine, deren konkreter Aufbau für die Erfindung keine Rolle spielt. Hier hat der LED- Modul ein zylindrisches Gehäuse 3, mit einer unteren Stirnfläche 5 und einer oberen Stirnfläche 4. Eine Wärme¬ brücke 6 ist kontaktierend an die untere Stirnfläche 5 angesetzt. Sie ist ein U-förmig gebogenes Blech aus Kup¬ fer o . ä . Im Bereich der Basis des U-förmig gebogenen Blechs ist ist ein Hohlraum angeordnet, der eine Dampfkammer 7 bildet. In ihr ist ein Dampf, beispielsweise Wasserdampf, enthalten. Die Wärmebrücke ist hier seitlich abgeschlos¬ sen, um den Dampf nicht entweichen zu lassen. Im kalten Zustand bei Zimmertemperatur ist die Dampfkammer mit Wasser bei Unterdruck gefüllt. Figure 1 shows a structural unit 1 with an LED module 2, in particular a light engine, whose concrete structure for the invention does not matter. Here, the LED module has a cylindrical housing 3, with a lower end face 5 and an upper end face 4. A heat ¬ bridge 6 is contacted to the lower end face 5 attached. It is a U-shaped bent sheet of Kup ¬ fer o. a. In the area of the base of the U-shaped bent sheet, a cavity is arranged which forms a steam chamber 7. It contains a vapor, such as water vapor. The thermal bridge is laterally abgeschlos ¬ sen, in order not to let the steam escape. In the cold Condition at room temperature, the steam chamber is filled with water at low pressure.
Im Bereich der freien Schenkel 10, 11 der Wärmebrücke ist zwischen den beiden Schenkeln ein Block 15 aus offenpori- gern Graphitschaum angeordnet. Er ist quaderförmig oder anderweitig zweckmäßig gestaltet. In the area of the free legs 10, 11 of the thermal bridge, a block 15 made of open-pored graphite foam is arranged between the two legs. He is cuboid or otherwise appropriately designed.
Als Quader hat er Schmalseiten 20 und 21, die mit der Wärmebrücke, insbesondere deren freien Schenkeln, in Kontakt stehen. Außerdem hat er Breitseiten 22 und 23, die quer dazu stehen. As a cuboid he has narrow sides 20 and 21, which are in contact with the thermal bridge, in particular their free legs. He also has broadsides 22 and 23, which are transverse to it.
Die Breitseiten 22 und 23 sind mit Schlitzen 25 ausges¬ tattet, symbolisiert durch Striche 26 und 27, die von zwei Seiten her abwechselnd in den Quader hineinreichen, aber nicht durchgängig sind. Vor der ersten Breitseite 22 ist ein Lüfter-Element 30 gesetzt, das eine aktive Küh¬ lung des als Wärmetauscher fungierenden Quaders bewirkt. The broad sides 22 and 23 are ausges ¬ tattet with slots 25, symbolized by lines 26 and 27, which extend from two sides alternately in the cuboid, but are not continuous. Before the first broadside 22, a fan element 30 is set, which causes an active Küh ¬ ment of acting as a heat exchanger cuboid.
Figur 2 zeigt schematisch dieselbe Baueinheit von der Seite gesehen. Dadurch wird zum einen die Lage des Lüf¬ tungselements 30 relativ zum Quader und seiner ersten Breitseite 22 deutlich. Zum andern wird die Lage der Schlitze 26, 27 im Graphitschaum deutlicher, wobei die Schlitze abwechselnd von der ersten Breitseite 22 und von der zweiten Breitseite 23 aus in den Körper aus Graphit¬ schaum hineinreichen. Figure 2 shows schematically the same assembly as seen from the side. Characterized the position of the Lüf ¬ processing elements 30 is relatively square and clearly its first broad side 22 for a. Second, the position of the slots 26, 27 in the graphite foam is apparent, the slits extend alternately from the first broad side 22 and from the second broad side 23 of the body of graphite ¬ foam.

Claims

Ansprüche claims
1. LED-Modul mit mindestens einer LED und einem Gehäuse, das die LED umgibt, wobei das Gehäuse gekühlt wird, dadurch gekennzeichnet, dass das Gehäuse an eine Wär¬ mebrücke angeschlossen ist, wobei die Wärmebrücke mit einem Wärmetauscher thermisch in Kontakt steht, wobei der Wärmetauscher einer aktiven Kühlung durch ein Mittel zur aktiven Kühlung ausgesetzt ist. 1. LED module having at least one LED and a housing surrounding the LED, wherein the housing is cooled, characterized in that the housing is connected to a heat ¬ mebrücke, wherein the thermal bridge is in thermal contact with a heat exchanger, wherein the heat exchanger is exposed to active cooling by means for active cooling.
2. LED-Modul nach Anspruch 1, dadurch gekennzeichnet, dass die Wärmebrücke als Kühlblech gestaltet ist. 2. LED module according to claim 1, characterized in that the thermal bridge is designed as a cooling plate.
3. LED-Modul nach Anspruch 1, dadurch gekennzeichnet, dass die Wärmebrücke zusätzlich mit einem Mittel zur Wärmespreizung ausgestattet ist. 3. LED module according to claim 1, characterized in that the thermal bridge is additionally equipped with a means for heat spreading.
4. LED-Modul nach Anspruch 1, dadurch gekennzeichnet, dass das Mittel zur Wärmespreizung eine Dampfkammmer ist. 4. LED module according to claim 1, characterized in that the means for spreading heat is a Dampfkammmer.
5. LED-Modul nach Anspruch 1, dadurch gekennzeichnet, dass der Wärmetauscher ein Körper aus offenporigem Graphitschaum ist. 5. LED module according to claim 1, characterized in that the heat exchanger is a body made of open-pored graphite foam.
6 LED-Modul nach Anspruch 1 , dadurch gekennzeichnet, dass der Körper ein Quader mit Seitenflächen ist, ins- besondere Schmalseiten und Breitseiten . 6 LED module according to claim 1, characterized in that the body is a cuboid with side surfaces, in particular narrow sides and broadsides.
7. LED-Modul nach Anspruch 1, dadurch gekennzeichnet, dass erste Seitenflächen mit der Wärmebrücke in ther¬ mischem Kontakt stehen. 7. LED module according to claim 1, characterized in that said first side surfaces with the heat bridge in contact with each ther ¬ mixers.
8. LED-Modul nach Anspruch 1, dadurch gekennzeichnet, dass zweite Seitenflächen mit Schlitzen versehen sind. 8. LED module according to claim 1, characterized in that second side surfaces are provided with slots.
9. LED-Modul nach Anspruch 1, dadurch gekennzeichnet, dass das LED-Modul eine light engine ist. 9. LED module according to claim 1, characterized in that the LED module is a light engine.
10. LED-Modul nach Anspruch 1, dadurch gekennzeichnet, dass die Schlitze auf den zweiten Seitenflächen gegeneinander versetzt sind. 10. LED module according to claim 1, characterized in that the slots are offset from each other on the second side surfaces.
PCT/EP2013/050220 2012-01-13 2013-01-08 Led module with improved cooling unit WO2013104623A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE202012000325U DE202012000325U1 (en) 2012-01-13 2012-01-13 LED module with improved cooling
DE202012000325.9 2012-01-13

Publications (1)

Publication Number Publication Date
WO2013104623A1 true WO2013104623A1 (en) 2013-07-18

Family

ID=45923697

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2013/050220 WO2013104623A1 (en) 2012-01-13 2013-01-08 Led module with improved cooling unit

Country Status (2)

Country Link
DE (1) DE202012000325U1 (en)
WO (1) WO2013104623A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202013005254U1 (en) 2013-06-10 2013-07-01 Anh Minh Do LED spotlight with water cooling system

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020108743A1 (en) * 2000-12-11 2002-08-15 Wirtz Richard A. Porous media heat sink apparatus
GB2404009A (en) * 2003-07-17 2005-01-19 Enfis Ltd Vapour Cooling of an Electronic Component
WO2005043619A1 (en) 2003-10-22 2005-05-12 Intel Corporation (A Delaware Corporation) Variable denisty graphite foam heat sink
WO2006016324A1 (en) 2004-08-06 2006-02-16 Koninklijke Philips Electronics N. V. Light engine
CN101509654A (en) * 2009-03-26 2009-08-19 深圳市东维丰电子科技股份有限公司 Nano-radiator carbon nano-material heat radiator
US20100038051A1 (en) * 2006-11-02 2010-02-18 The Boeing Company Combined thermal protection and surface temperature control system
KR20110041630A (en) * 2009-10-16 2011-04-22 엘지전자 주식회사 Heat-dissipating apparatus for led illumination module
DE202011100659U1 (en) * 2011-05-10 2011-07-11 Asia Vital Components Co., Ltd. Cooling structure for light-emitting diode lamp

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7684187B1 (en) 2008-09-17 2010-03-23 Celsia Technologies Taiwan, Inc. Heat dissipation device
US7875900B2 (en) 2008-12-01 2011-01-25 Celsia Technologies Taiwan, Inc. Thermally conductive structure of LED and manufacturing method thereof

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020108743A1 (en) * 2000-12-11 2002-08-15 Wirtz Richard A. Porous media heat sink apparatus
GB2404009A (en) * 2003-07-17 2005-01-19 Enfis Ltd Vapour Cooling of an Electronic Component
WO2005043619A1 (en) 2003-10-22 2005-05-12 Intel Corporation (A Delaware Corporation) Variable denisty graphite foam heat sink
WO2006016324A1 (en) 2004-08-06 2006-02-16 Koninklijke Philips Electronics N. V. Light engine
US20100038051A1 (en) * 2006-11-02 2010-02-18 The Boeing Company Combined thermal protection and surface temperature control system
CN101509654A (en) * 2009-03-26 2009-08-19 深圳市东维丰电子科技股份有限公司 Nano-radiator carbon nano-material heat radiator
KR20110041630A (en) * 2009-10-16 2011-04-22 엘지전자 주식회사 Heat-dissipating apparatus for led illumination module
DE202011100659U1 (en) * 2011-05-10 2011-07-11 Asia Vital Components Co., Ltd. Cooling structure for light-emitting diode lamp

Also Published As

Publication number Publication date
DE202012000325U1 (en) 2012-03-05

Similar Documents

Publication Publication Date Title
DE60315095T2 (en) Thermosyphon for electronic devices for cooling with a non-uniform air flow
DE60004269T2 (en) ELECTRONIC ASSEMBLY WITH HIGH COOLING CAPACITY
DE102008060777B4 (en) Arrangement for cooling heat-generating computer components
EP1892810B1 (en) Cooling device for electrical installation
DE19950402A1 (en) Stencil heat pipe for cooling electronic components, has heat transfer block and cavities formed by joining inner walls of endogenic surface and heat releasing surface of container
DE2647758B2 (en) Cooling module for electrical components
DE69922838T2 (en) COOLING BODY FOR AN ELECTRONIC COMPONENT, DEVICE AND METHOD FOR THE PRODUCTION THEREOF
DE2640000A1 (en) COOLING CAN FOR LIQUID-COOLED POWER SEMI-CONDUCTOR COMPONENTS AND METHOD FOR MANUFACTURING THE SAME
DE202006021052U1 (en) Heat Pipe Cooler
WO2016138979A1 (en) Drive system comprising at least one heat pipe, and the use of same in a drive system
EP3723123A1 (en) Heat transfer device and component
DE102011079508B4 (en) Cooling structure for a semiconductor element
EP2991466B1 (en) Tempering device for controlling the temperature in a room and electrical cabinet having such a tempering device
DE112009005359T5 (en) Heatsink, heat sink assembly, semiconductor module and semiconductor device with a cooling device
DE202011000830U1 (en) convection heat
WO2013104623A1 (en) Led module with improved cooling unit
DD301817B5 (en) SELF-CONTROLLING ELECTRIC HEATING DEVICE WITH PTC HEATING ELEMENTS
DE10310568A1 (en) Heat-sink arrangement for electronic component esp. high-power microprocessor, has thermal tube joined via evaporation zone in cooling-medium tight fashion to contact
WO2005011349A2 (en) Cooling device for leading dissipated heat away from an electrical or electronic component or assembly groups
EP3192477B1 (en) Medical temperature conditioning apparatus
DE102018127928A1 (en) Heat transport unit
DE102004004440B4 (en) Cooling device for an electronic component, in particular for a microprocessor
DE102005013457B4 (en) Electronic device, for example computer with a cooling system
DE29714730U1 (en) Heatsinks, in particular for electronic components
DE20316199U1 (en) Cooling of electronic devices, using an internal primary cooler coupled to a secondary external cooler

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 13700513

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 13700513

Country of ref document: EP

Kind code of ref document: A1