WO2013185305A1

WO2013185305A1 - Connector and server

Info

Publication number: WO2013185305A1
Application number: PCT/CN2012/076833
Authority: WO
Inventors: 姚益民; 张小华
Original assignee: 华为技术有限公司
Priority date: 2012-06-13
Filing date: 2012-06-13
Publication date: 2013-12-19
Also published as: CN102906943A; CN102906943B

Abstract

The present invention provides a connector and a server. The connector comprises a housing and conductive terminals. The housing is a hexahedron. The conductive terminals are distributed on at least three of the six surfaces of the housing, and are used for connecting two or more service boards on the different surfaces, and transmitting signals in the service boards to a target board. The target board is connected to the service boards through the conductive terminals that are distributed on the different surfaces of the connector. The connector can reduce the technical problems of excessively high attenuation, discontinuous impedance, crosstalk and the like during high-speed signal transmission in the prior art.

Description

The present invention relates to the field of information technologies, and in particular, to a connector and a server. Background technique

As the server's business capacity continues to increase, so does the server's input/output port (I/O) bandwidth. Take the current Unified Computing System (UCS) of Cisco as an example. Currently, the bandwidth per slot has reached 80 Gbps, and the current bandwidth can reach 200 Gbps. The current physical link rate of the backplane reaches 10 Gbps, and can be upgraded to 25 Gbps in the future. This requires a high level of signal integrity (Single Integrality, SI for short). At the same time, due to the rich demand of server I/O types, and requirements are optional according to user requirements, such as Ethernet, Fibre Channel (FC), Infiniband (Infiniband), PCI Express (PC). For example, PCIe), etc., most users use the shackle to achieve the option. However, high-speed signals pass through the connector, causing signal degradation, and multiple passes through the connector can result in failure to support higher rates.

Existing servers typically use all of the signals to achieve high-speed, flexible I/O requirements from the backplane or backplane of the backplane connector using a separate connector backplane.

However, the high-speed signal of the NIC chip on the gusset plate passes through the primary connector and then the upper backplane increases the primary loss. The NIC chip on the gusset adopts the independent connector directly on the backplane and the mounting accuracy of the gusset plate. High requirements are raised and the project implementation is very complicated.

In another type of server, the gusset plate above the bottom plate is not directly connected to the backboard, but is first connected to the backplane through the connector, and then connected to the backplane from the connector of the backplane, and finally connected to the chip on the target board. . However, when the signal rate of the upper backplane is continuously increased, reaching 8 Gbps, 10 Gbps, and above, the high-speed signal is taken out from the conductive terminals of the gusset, such as the needle, and then passes through the third or more connectors to reach the target board. chip. The above-mentioned excessive number of connectors may introduce technical problems such as loss loss, return loss, impedance discontinuity, crosstalk, etc., so that high-speed signals in the physical link have the defects of Signal Integrality (SI). Summary of the invention

In view of this, the embodiments of the present invention provide a connector and a server for solving the problems of excessive attenuation, impedance discontinuity, and crosstalk caused by excessive connection times in the high-speed signal transmission process in the prior art.

The connector provided by the embodiment of the invention includes:

And a conductive terminal disposed on at least three sides of the outer casing, configured to connect two or more service boards on different sides, and perform signals between the service board and the target board And transmitting, the target board and the service board are connected by the conductive terminals distributed on different sides of the connector.

Further, the material of the outer casing is an insulating material. The outer casing is a hexahedron, for example, the outer casing has a rectangular parallelepiped structure or a rectangular parallelepiped structure.

Further, the conductive terminal protrudes from the outside of the outer casing or inside the outer casing.

Further, the conductive terminals are distributed on the upper, lower and right sides of the outer casing. The conductive terminals on the outer casing and the conductive terminals on the right side of the outer casing are in communication inside the outer casing;

A conductive terminal under the outer casing and a conductive terminal on the right side of the outer casing are in communication with each other inside the outer casing.

Further, the conductive terminals are distributed on the upper surface, the lower surface, the right surface and the front surface of the outer casing. a conductive terminal on the outer casing and a conductive terminal on the right side of the outer casing are in communication inside the outer casing;

a conductive terminal under the outer casing and a conductive terminal on the right side of the outer casing are in communication inside the outer casing;

The conductive terminals on the front of the housing and the conductive terminals on the right side of the housing are in communication with the interior of the housing.

The server provided by the embodiment of the present invention includes: a bottom plate, a gusset plate and a back plate, and further includes a connector according to any one of the present invention, wherein the connector is configured to transmit signals on the bottom plate and the gusset to the back plate.

According to the above technical solution, the connector and the server of the embodiment of the present invention realize that two or more industries are connected on different faces by distributing the conductive terminals on at least three faces of the outer casing. The service board performs signal transmission between the service board and the target board, which improves the transmission rate of the high-level signal on the service board, and solves the attenuation caused by the excessive number of connections in the high-speed signal transmission process in the prior art. Problems such as excessive, impedance discontinuities, and crosstalk, and reduced connector design complexity. BRIEF DESCRIPTION OF THE DRAWINGS In order to more clearly illustrate the technical solution of the present invention, a brief description of the drawings to be used in the embodiments will be briefly described below. It is obvious that the following drawings are only drawings of some embodiments of the present invention, Those skilled in the art can obtain other drawings which can also implement the technical solutions of the present invention according to the drawings without any creative labor.

1 and 2 are schematic diagrams showing the flow direction of a high speed signal in an existing server;

3A is a structural diagram of a connector according to an embodiment of the present invention;

FIG. 3B is a structural diagram of a connector according to another embodiment of the present invention; FIG.

Figure 4 is a scene view of the connector shown in Figure 3A;

FIG. 5 is a structural diagram of a connector according to another embodiment of the present invention; FIG.

6 is a structural diagram of a connector according to another embodiment of the present invention;

FIG. 7 is a structural diagram of a connector according to another embodiment of the present invention; FIG.

FIG. 8 is a structural diagram of a connector according to another embodiment of the present invention; FIG.

9 to FIG. 15 are application scenarios of a connector according to another embodiment of the present invention. The technical solutions of the present invention will be clearly and completely described in the following with reference to the accompanying drawings in the embodiments of the present invention. It will be apparent that the various embodiments described below are merely exemplary embodiments of the invention. Based on the following various embodiments of the present invention, those skilled in the art can obtain other technical features that can solve the technical problems of the present invention and achieve the technical effects of the present invention by equivalently transforming some or even all of the technical features without creative work. The various embodiments of the invention are apparent from the scope of the invention as disclosed.

As shown in FIG. 1 , the signal on the gusset 10 of the prior art is connected to the bottom plate 9 through the first connector 11 , and the bottom plate 9 is connected to the back plate 8 through the second connector 12 , resulting in high-speed signal from the gusset plate. After the conductive terminals on the 10 are taken out from the needle, after a plurality of connectors (such as the first connector 1 1 , the second connector 12 and the third connector 13 in FIG. 1 ), the target board 14 can be reached. Too many connectors introduce errors, return loss, and impedance discontinuities, crosstalk, etc., making other physical links in the server unable to support such high-speed signals.

As shown in FIG. 2, the structure shown in FIG. 2 overcomes the problems of the plurality of connectors in FIG. 1 above, such as the high-speed signal from the conductive terminals of the gusset 10 of the NIC 10 directly passing through the first connector 1 1 and the back plate 8 The connection no longer passes through the bottom plate 9, and the high speed signal or other signal on the bottom plate 9 is directly connected to the backboard 8 through the second connector 12, and finally flows to the target single board 14 at the opposite end.

In Fig. 2, since the number of times the high-speed signal passes through the connector is reduced once, the SI characteristic of the high-speed signal in the physical link can be improved, and the stability of the high-speed signal is ensured. However, in practice, it is required to meet the connection requirements between the gusset 10, the bottom plate 9, and the back plate 8, so that the fixing between the gusset 10 and the bottom plate 9 is complicated. Further, the high-speed signal has a high structural coupling relationship between the gusset 10 and the bottom plate 9 and the back plate 8, the gusset 10, the bottom plate 9 and the back plate 8. The first connector 1 used by the gusset 10 There is a precision control requirement between the second connector 12 used in the bottom plate 9, and further high requirements are placed on the preparation of the first connector 1 1 and the second connector 12.

The following embodiments are mainly for a connector that supports multiple directions in a frame type electronic device such as a blade server, a switch, or a router, which improves the signal rate of the upper backplane and reduces the design complexity of the connector structure, and is effective. Achieve high-density business of framed electronic devices.

The connector in this embodiment includes: a housing and a conductive terminal, wherein the conductive terminals are distributed on at least three sides of the housing, and are used for connecting two or more service boards on different sides, in the service board and the target Signal transmission is performed between the boards, and the target boards are connected to the service boards through conductive terminals distributed on different sides of the connector.

In a practical application scenario, the outer casing can be a hexahedron, as shown in Figures 3A through 15 below. The outer casing of the connector exemplified in the embodiment of the present invention has a hexahedral structure, but the structure of the connector is not limited in the present invention. For example, the outer casing of the connector may be an octahedron, a dodecahedron or the like.

3A, FIG. 3B and FIG. 4, FIG. 3A and FIG. 3B respectively show a structural view of a connector according to an embodiment of the present invention, and FIG. 4 shows a connector used in the embodiment of the present invention. Scene map.

As shown in FIG. 3A, the connector 20 in this embodiment includes a housing 21 and a conductive terminal 22; wherein the conductive terminal 22 protrudes from the outside of the housing 21 to form a needle for use with the business list. The hole heads on the board or target board cooperate to transmit high-speed signals.

The outer casing 21 shown in FIG. 3A may be a hexahedron, an octahedron, a dodecahedron or the like. At this time, the conductive terminals 22 shown in FIG. 3A may be distributed on at least three faces of the outer casing 21 for connecting on different faces. Two or more service cards transmit signals between the service board and the target board. In FIG. 3A, the target board and the service board are connected by conductive terminals 22 distributed on different faces of the connector 20.

In FIG. 3B, the connector 20 includes a housing 21 and a conductive terminal 22; wherein the conductive terminal is located inside the housing 21, and the conductive terminal 22 can form a hole head on the surface of the housing 21 (ie, a socket similar to the socket) Structure), used to match the needle on the service board or the target board to transmit high-speed signals.

The outer casing shown in FIG. 3B is a hexahedron structure, such as a square body, and the conductive terminals 22 may be distributed on at least three of the six faces of the outer casing 21, as shown in FIG. 3B on the left side, the upper side, and the right side. A signal is transmitted between the service board and the target board. The target board and the service board are connected by conductive terminals distributed on different sides of the connector.

In practical applications, the material of the outer casing in the above embodiment may be an insulating material such as a polymer insulating material. The conductive terminals are prepared from existing conductive materials.

The structure of the outer casing shown in Fig. 3B may be a rectangular parallelepiped structure or a rectangular parallelepiped structure. In other embodiments, the shape of the outer casing may also be an irregular shape or the like, and the shape of the outer casing is not limited in this embodiment.

As shown in Fig. 4, the conductive terminals 22 may be distributed on the upper, lower and right sides of the outer casing. The conductive terminal 22 transmits a high speed signal on the gusset 10 above the connector 20 to the back plate hole 81 of the backing plate 8, and the conductive terminal 22 transmits a high speed signal from the bottom plate 9 under the connector 20 to the back. On the backplane hole 81 of the board 8, signals in two service boards (such as the bottom board 9, the gusset 10) on different sides of the connector are transmitted to the target board (such as the back board 8). That is, the target board and the service board are connected by conductive terminals distributed on different sides of the connector 20.

In practical applications, the conductive terminals 22 on the outer casing 21 and the conductive terminals on the right side of the outer casing 21

22 is interconnected inside the outer casing 21, for example, as shown in Fig. 3B, the conductive terminal 22 on the outer casing 21 and the conductive terminal 22 on the right side of the outer casing 21 are communicated by a hatching portion;

The conductive terminals 22 under the outer casing 21 and the conductive terminals 22 on the right side of the outer casing 21 are in communication inside the outer casing; thus, the outer casing of the connector is capable of transmitting high speed signals.

Preferably, the conductive terminal 22 on the outer casing 21 and the conductive terminal 22 on the right side of the outer casing 21 may be The integrally formed structure, the conductive terminal 22 under the outer casing 21 and the conductive terminal 22 on the right side of the outer casing 21 may be integrally formed.

It can be seen from the above embodiments that the connector of the embodiment is configured to connect two or more service boards on different planes by distributing the conductive terminals on at least three sides of the outer casing, and further on the service boards and targets. The signal transmission between the boards improves the transmission rate of the high-level signals on the service board, and solves the problems of excessive attenuation, impedance discontinuity and crosstalk caused by too many connection times in the high-speed signal transmission process in the prior art. And reduce the design complexity of the connector.

As shown in FIG. 5 and FIG. 6 , FIG. 5 is a schematic structural diagram of a connector provided by another embodiment, and FIG. 6 is a schematic structural diagram of a connector provided in another embodiment. The high-speed signals on the first service board and the second service board are transmitted to the target board.

In FIG. 5, the first service board is located on the upper side of the connector 20, the second service board is located on the left side of the connector 20, and the target board is located on the right side of the connector 20.

In Fig. 5, the structure of the upper and left conductive terminals 22 of the outer casing 21 of the connector 20 is a needle structure; the conductive terminal 22 on the right side of the outer casing 21 of the connector 20 has a hole-head structure as shown in Fig. 5.

Correspondingly, the conductive terminal 22 of the needle structure on the outer casing 21 and the conductive terminal 22 of the right face structure of the outer casing 21 are in communication inside the outer casing 21, and the conductive terminal 22 of the left needle structure of the outer casing 21 and the outer surface of the outer casing 21 are electrically conductive. The terminal 22 is connected to the inside of the casing. The connecting line of the shaded portion in FIG. 5 connects the conductive terminal 22 of the needle structure and the conductive terminal 22 of the hole-head structure to realize the first service board and the second service order. High-speed signals on the board are transmitted to the target board.

It should be noted that, in this embodiment, the conductive terminal 22 of the outer surface of the connector 20 may be a needle structure or a hole head structure, and the specific structure may be set according to actual needs.

Correspondingly, in FIG. 6, the first service board is located on the left side of the connector 20, the second service board is located below the connector 20, and the target board is located on the right side of the connector 20.

The outer casing 21 shown in FIG. 6 has a rectangular parallelepiped structure. At this time, the conductive terminals 22 are distributed on the left side, the lower side, and the right side of the outer casing 21, and are used to connect two service boards on different sides, and are in the business board and the target sheet. Signal transmission between boards.

Wherein, the conductive terminal on the left side of the outer casing 21 and the conductive terminal 22 on the right side of the outer casing 21 are in communication inside the outer casing, and the conductive terminal under the outer casing 21 and the conductive terminal 22 on the right side of the outer casing 21 are in the outer casing. The internal connection is connected. The connecting line in the shaded part of FIG. 6 connects the conductive terminals on the two different sides in the outer casing to transmit the high-speed signal on the first service board and the second service board to the target list. In the board. The conductive terminals of the connector shown in Figure 6 can be of a needle configuration.

7 and FIG. 8, FIG. 7 is a schematic structural view of a connector provided by another embodiment, and FIG. 8 is a schematic structural view of a connector provided in another embodiment;

In Figure 7, the first service board and the third service board are located on the connector 20, the second service board is located under the connector 20, and the target board is located on the right side of the connector 20.

Further, the conductive terminals 22 of the connector 20 are distributed on the lower surface, the upper surface and the right side of the outer casing 21, wherein the conductive terminals 22 on the outer casing 21 and the conductive terminals 22 on the right side of the outer casing 21 are in communication inside the outer casing 21, and the conductive terminals under the outer casing 21 22 and the conductive terminal 22 on the right side of the outer casing 21 are connected to the inside of the outer casing 21, and the high-speed signals of the first service board, the second service board, and the third service board on different sides of the connector are transmitted to the target board. in.

In Figure 8, the first service board is located on the top of the connector, the second service board is located below the connector, the third service board is located on the left side of the connector, and the target board is located on the right side of the connector.

Among them, the conductive terminals 22 of the connector 20 shown in Fig. 8 are distributed on the upper, lower, left and right sides of the casing 21.

The conductive terminals 22 on the outer casing 21 and the conductive terminals 22 on the right side of the outer casing 21 are connected inside the outer casing;

The conductive terminal 22 under the outer casing 21 and the conductive terminal 22 on the right side of the outer casing 21 are connected inside the outer casing;

The conductive terminals 22 on the left side of the casing 21 and the conductive terminals 22 on the right side of the casing 21 are in communication inside the casing.

The above-mentioned conductive terminals 22 can transmit signals in the three service boards (such as the first service board, the second service board, and the third service board) connected to different planes of the connector to the target list. On the board, the target board and the service board are connected by conductive terminals distributed on different sides of the connector.

Therefore, the above-mentioned connector realizes high-speed signal transmission between the first service board, the second service board, the third service board, and the target board.

9 to FIG. 15, FIG. 9 to FIG. 15 are respectively a scene view of a connector according to another embodiment of the present invention; in FIG. 9, the gusset 10 is located at the rear of the connector 20, and the bottom plate 9 is located at the connection. Under the connector 20, the back plate 8 is located on the right side of the connector 20. At this time, the conductive terminals of the connector 20 are distributed on the rear, lower and right sides of the outer casing, and are used for connecting the gussets located at the rear of the connector. The bottom plate under the device transmits signals from the gusset and the bottom plate to the back plate 8 on the right side of the connector.

In Fig. 10, the gusset 10 is located at the front of the connector 20, the bottom plate 9 is located under the connector 20, and the back plate 8 is located at the right side of the connector 20. At this time, the conductive terminals of the connector 20 are distributed at the front, the lower side of the outer casing and The right side is just for connecting the gusset 10 on the front of the connector, the bottom plate 9 under the connector, and transmitting the signals in the gusset 10 and the bottom plate 9 to the backing plate 8 on the right side of the connector.

In Fig. 1, the gusset 10 is located on the upper side of the connector 20, the bottom plate 9 is located under the connector, and the back plate 8 is located on the right side of the connector 20. At this time, the conductive terminals of the connector 20 are distributed on the upper surface of the outer casing, below and The right side can be used to connect the gusset 10 on the connector, the bottom plate 9 under the connector, and transmit the signals in the gusset 10 and the bottom plate 9 to the back plate 8 on the right side of the connector.

In Fig. 12, the gusset 10 is located on the left side of the connector 20, the bottom plate 9 is located under the connector 20, and the back plate 8 is located on the right side of the connector 20. At this time, the conductive terminals of the connector 20 are distributed on the left side, the lower side of the case, and The right side is just for connecting the gusset 10 on the left side of the connector, the bottom plate 9 under the connector, and transmitting the signals in the gusset 10 and the bottom plate 9 to the backing plate 8 on the right side of the connector.

Two gussets 10 are shown in Fig. 13, the first gusset is located behind the connector 20, the second gusset is located above the connector 20, the bottom plate 9 is located below the connector 20, and the backing plate 8 is located at the connector 20. On the right side, the conductive terminals of the connector 20 at this time are distributed on the rear, upper, lower and right sides of the outer casing for connecting the first gusset located at the rear of the connector, the second gusset located above the connector, The bottom plate 9 under the connector transmits signals from the first gusset, the second gusset and the bottom plate 9 to the backing plate 8 on the right side of the connector.

Two gussets 10 are shown in Fig. 14, the first gusset and the second gusset are located on the upper side of the connector, the bottom plate 9 is located under the connector 20, and the back plate 8 is located on the right side of the connector 20, at this time The conductive terminals of the connector 20 are distributed on the upper surface, the lower surface and the right side of the outer casing, and are used for connecting the first gusset plate, the second gusset plate and the bottom plate 9 located under the connector, and the first gusset plate The signals in the second and bottom plates 9 are transmitted to the backing plate 8 on the right side of the connector.

In Fig. 15, three gussets 10 are shown, the first gusset is located at the rear of the connector, the second gusset is located above the connector 20, the third gusset is located at the front of the connector 20, and the bottom plate is located at the connector 20. Next, the back plate 8 is located on the right side of the connector, and the conductive terminals of the connector 20 are distributed in the outer casing at this time. The rear, front, top, bottom and right sides of the connector are used to connect the first gusset on the back of the connector, the second gusset on the connector, the third gusset on the front of the connector, under the connector The bottom plate 9 transmits signals in the first gusset plate, the second gusset plate, the third gusset plate and the bottom plate 9 to the back plate 8 on the right side of the connector.

The gusset plate described in any of the above embodiments may be equivalent to the NIC card in the existing server. The connector in the above embodiments can be applied to a frame type electronic device for enabling a high-density service capability of the frame type electronic device, such as increasing the signal rate of the upper backplane. In this embodiment, there is not much complicated requirement for the structural design of the connector and the like, and the design difficulty is lowered.

According to another aspect of the present invention, the present invention provides a server, comprising: a bottom plate, a gusset plate and a back plate; and the server further comprising: the connector according to any embodiment of the present invention;

The connector is configured to transmit signals from the backplane and the buckle to the backplane. Therefore, the problem of excessive attenuation, impedance discontinuity and crosstalk caused by too many connection times in the high-speed signal transmission process is solved, and the design difficulty of the connector, the backboard and the gusset plate is reduced.

It should be noted that the above embodiments are merely illustrative of the technical solutions of the present invention, and are not intended to be limiting; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art The technical solutions described in the foregoing embodiments may be modified, or some or all of the technical features may be equivalently replaced; and the modifications or substitutions do not deviate from the technical solutions of the embodiments of the present invention. range.

Claims

claims

1. A connector, characterized in that the connector includes:

Housing and conductive terminals, the conductive terminals are distributed on at least three sides of the housing, used to connect two or more service boards on different surfaces, and conduct signals between the service board and the target board For transmission, the target single board and the service single board are connected through the conductive terminals distributed on different sides of the connector.

2. The connector according to claim 1, wherein the housing is a hexahedron.

3. The connector according to claim 1 or 2, characterized in that the material of the housing is an insulating material.

4. The connector according to any one of claims 1 to 3, characterized in that the structure of the housing is a cuboid structure or a cube structure.

5. The connector according to any one of claims 1 to 4, characterized in that the conductive terminal protrudes from the outside of the housing or is inside the housing.

6. The connector according to any one of claims 1 to 5, characterized in that the conductive terminals are distributed on the top, bottom and right side of the housing.

7. The connector according to claim 6, wherein the conductive terminals on the upper side of the housing and the conductive terminals on the right side of the housing are connected inside the housing;

The conductive terminals on the bottom of the housing and the conductive terminals on the right side of the housing are connected inside the housing.

8. The connector according to any one of claims 1 to 5, characterized in that the conductive terminals are distributed on the top, bottom, right and front of the housing.

9. The connector according to claim 8, wherein the conductive terminals on the upper side of the housing and the conductive terminals on the right side of the housing are connected inside the housing;

The conductive terminals below the housing and the conductive terminals on the right side of the housing are connected inside the housing;

The conductive terminals on the front of the housing and the conductive terminals on the right side of the housing are connected inside the housing.

10. A server, including a base plate, a gusset plate and a backplane; characterized in that the server further includes: the connector as described in any one of claims 1 to 9, the connector being used to connect the base plate and the gusset plate to The signal is transmitted to the backplane.