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WO2013179527A1 - Electronic component having shield case - Google Patents

Electronic component having shield case Download PDF

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Publication number
WO2013179527A1
WO2013179527A1 PCT/JP2013/000376 JP2013000376W WO2013179527A1 WO 2013179527 A1 WO2013179527 A1 WO 2013179527A1 JP 2013000376 W JP2013000376 W JP 2013000376W WO 2013179527 A1 WO2013179527 A1 WO 2013179527A1
Authority
WO
WIPO (PCT)
Prior art keywords
wiring board
pair
lands
side plates
end surface
Prior art date
Application number
PCT/JP2013/000376
Other languages
French (fr)
Japanese (ja)
Inventor
健介 三上
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP2014518227A priority Critical patent/JPWO2013179527A1/en
Publication of WO2013179527A1 publication Critical patent/WO2013179527A1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0032—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L24/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector

Definitions

  • the present invention relates to an electronic component having a shield case.
  • Patent Document 1 discloses an electronic component having a printed wiring board having end face electrodes formed on side surfaces and a shield case covering an area where an electronic circuit is mounted.
  • the shield case has a pair of opposing side walls. And it is supposed that the mechanical stability of an electronic component will improve because a pair of side wall which opposes pinches a printed wiring board.
  • the shield case can be easily grounded by electrically connecting the pair of side walls of the shield case to the end face electrodes of the printed wiring board by solder or the like.
  • a gap is formed between the pair of side walls of the shield case and the printed wiring board in consideration of assembly workability when the pair of side walls of the shield case sandwiches the printed wiring board.
  • the amount of solder required to fill this gap is the amount of solder that the screen printing machine can supply.
  • the soldering work by the screen printer and the reflow process may be hindered.
  • a soldering operation using a screen printing machine and a reflow process cannot be employed, and instead a manual soldering operation has been employed. Needless to say, manual soldering work has led to high costs, poor yields, and an obstacle to miniaturization of electronic components.
  • An object of the present invention is to provide a technique for reducing the amount of solder required when fixing a shield case to a printed wiring board.
  • a wiring board having a wiring board main body, an end surface land provided on an end face of the wiring board main body, and a functional component mounting surface that is a surface on which functional components of the wiring board are mounted.
  • a shield case having a plurality of side plates surrounding a space between the functional component mounting surface and the top plate, and the side plates sandwich the end surface of the wiring board.
  • the side plate has a contact portion that contacts the end surface land, and the distance between the contact portions is determined by removing the shield case from the wiring board. In this state, an electronic component is provided that is smaller than the width dimension of the wiring board including the pair of end face lands.
  • the amount of solder required when fixing the shield case to the printed wiring board can be suppressed.
  • FIG. 1 is a perspective view of an electronic component.
  • FIG. 2A is a perspective view of a shield.
  • FIG. 2B is a perspective view of the frame.
  • FIG. 2C is a perspective view of a printed wiring board on which an IC chip is mounted.
  • First embodiment) 3 is a cross-sectional view taken along line III-III in FIG.
  • FIG. 4 is a cross-sectional view of the frame.
  • FIG. 5 is a cross-sectional view of a printed wiring board on which an IC chip is mounted.
  • FIG. 6 is a cross-sectional view showing a state in which the frame faces the printed wiring board on which the IC chip is mounted.
  • FIG. 1 is a perspective view of an electronic component.
  • FIG. 2A is a perspective view of a shield.
  • FIG. 2B is a perspective view of the frame.
  • FIG. 2C is a perspective view of a printed wiring board on which an IC chip is mounted.
  • First embodiment 3
  • FIG. 7 is a cross-sectional view showing a state where the frame is brought into contact with the printed wiring board on which the IC chip is mounted.
  • FIG. 8 is a cross-sectional view showing a state in which the frame is pushed into the printed wiring board on which the IC chip is mounted.
  • FIG. 9 is a cross-sectional view showing a state in which the frame is positioned with respect to the printed wiring board on which the IC chip is mounted.
  • FIG. 10 is a cross-sectional view showing a state in which cream solder is supplied to a printed wiring board on which an IC chip is mounted.
  • FIG. 10 is a cross-sectional view showing a state in which cream solder is supplied to a printed wiring board on which an IC chip is mounted.
  • FIG. 11 is a cross-sectional view showing a state in which the frame is fixed to the printed wiring board on which the IC chip is mounted by reflow processing.
  • FIG. 12 is a perspective view of a printed wiring board on which an IC chip is mounted.
  • FIG. 13 is an enlarged view of a portion A in FIG.
  • FIG. 14 is a cross-sectional view showing a state in which the frame is fixed to the printed wiring board on which the IC chip is mounted by reflow processing.
  • FIG. 15 is an enlarged view of a portion A in FIG. (Third embodiment)
  • the electronic component 1 includes a printed wiring board 2 (wiring board), a shield case 3, and an IC chip 4 (functional component). .
  • the printed wiring board 2 is configured by forming various lands on a paper phenol board or a glass epoxy board.
  • the shield case 3 includes a frame 5 and a shield 6 in this embodiment.
  • the frame 5 and the shield 6 are made of stainless alloy, aluminum alloy, magnesium alloy, nickel alloy, copper, or the like.
  • the IC chip 4 is a semiconductor package such as a CSP (Chip Scale Package) or a QFP (Quad Flat Package).
  • the printed wiring board 2 includes a printed wiring board main body 7 (wiring board main body) made of a paper phenol substrate or a glass epoxy substrate, and various lands 8.
  • the printed wiring board body 7 includes a first IC chip mounting surface 7a (functional component mounting surface, first functional component mounting surface) on which the IC chip 4 is mounted, and a second IC chip mounting surface which is the back surface of the first IC chip mounting surface 7a. 7b (second functional component mounting surface) and a pair of end surfaces 7c.
  • the first IC chip mounting surface 7a and the second IC chip mounting surface 7b are parallel to each other.
  • the end surface 7c is orthogonal to the first IC chip mounting surface 7a and the second IC chip mounting surface 7b.
  • the lands 8 include a plurality of IC chip lands 8a for the IC chip 4, two positioning lands 8b, two fixing end lands 8c (end lands), two internal lands 8d (fillet lands), 2 And two external lands 8e.
  • the plurality of IC chip lands 8 a are lands for mounting the IC chip 4 on the printed wiring board body 7.
  • the plurality of IC chip lands 8a are formed on the first IC chip mounting surface 7a.
  • the two positioning lands 8 b are lands for positioning the shield 6 of the shield case 3 with respect to the printed wiring board 2.
  • the two positioning lands 8b are formed on the first IC chip mounting surface 7a and are arranged so as to sandwich the plurality of IC chip lands 8a.
  • the two fixing end faces lands 8 c are lands for fixing the shield 6 of the shield case 3 to the printed wiring board 2.
  • the two fixing end face lands 8c are formed on the end face 7c, and are arranged so as to sandwich the printed wiring board main body 7.
  • the two internal lands 8d are formed on the first IC chip mounting surface 7a.
  • the two internal lands 8d are connected to the two fixing end face lands 8c, respectively.
  • the two external lands 8e are formed on the second IC chip mounting surface 7b.
  • the two external lands 8e are connected to the two fixing end face lands 8c, respectively. Accordingly, the fixing end face land 8c, the inner land 8d, and the outer land 8e are formed in a substantially U-shaped cross section.
  • the frame 5 includes a pair of inner side plates 9, a pair of outer side plates 10, and a connecting portion 11.
  • the pair of inner side plates 9 are side plates arranged so as to sandwich the IC chip 4 therebetween.
  • the pair of outer side plates 10 is a side plate disposed on the opposite side across the IC chip 4 and the pair of inner side plates 9. That is, the pair of outer side plates 10 is disposed further outside the pair of inner side plates 9.
  • the connecting portion 11 is a portion for connecting the pair of inner side plates 9 and the pair of outer side plates 10.
  • Each outer side plate 10 includes an inner side plate facing portion 10a, a contact portion 10b, and an inclined guide portion 10c (end portion).
  • the inner side plate facing portion 10a, the contact portion 10b, and the inclined guide portion 10c are formed side by side in this order.
  • the inner side plate facing portion 10 a is a portion facing the inner side plate 9.
  • the contact portion 10b is a portion that connects to the inner side plate facing portion 10a and mechanically contacts the fixing end surface land 8c.
  • the contact portion 10b is substantially parallel to the fixing end face land 8c.
  • the inclined guide portion 10c is a portion that is connected to the contact portion 10b and faces the fixing end surface land 8c.
  • the inclined guide portion 10c is configured to be inclined so as to be separated from the fixing end surface land 8c as it is separated from the contact portion 10b. In other words, the pair of inclined guide portions 10c are formed to be bent away from each other.
  • the contact portion 10b and the inclined guide portion 10c of the outer side plate 10 and the fixing end surface land 8c are coupled to each other by solder s.
  • FIG. 4 shows the shield 6 removed from the printed wiring board 2.
  • the distance between the pair of contact portions 10b is a distance A
  • the distance between the tips of the pair of inclined guide portions 10c is a distance B.
  • the width dimension of the printed wiring board 2 including the pair of fixing end face lands 8c is defined as a width dimension C.
  • the distance A is smaller than the width dimension C.
  • the distance B is larger than the width dimension C. That is, A ⁇ C ⁇ B is established.
  • the shield 6 has a top plate 12 and side plates 13.
  • the top plate 12 is a portion facing the first IC chip mounting surface 7 a of the printed wiring board body 7.
  • the side plate 13 is a portion arranged so as to overlap with the inner side plate facing portion 10 a of the outer side plate 10.
  • an appropriate amount of cream solder cs is supplied onto the IC chip land 8a and the positioning land 8b by using a screen printing machine installed in an SMT (Surface Mount Technology) facility.
  • the chip 4 is mounted on the first IC chip mounting surface 7a.
  • the shield 6 is opposed to the printed wiring board 2.
  • the pair of inner side plates 9 are fixed to the positioning lands 8b, and at the same time, the IC chip 4 is fixed to the IC chip lands 8a.
  • the shield 6 is positioned with respect to the printed circuit board 2 by fixing the pair of inner side plates 9 to the positioning lands 8b.
  • the printed wiring board 2 and the shield 6 in the state of FIG. 9 are turned over as shown in FIG. 10, and an appropriate amount of cream solder cs is supplied onto the external land 8e using a screen printing machine. At this time, the cream solder cs is supplied so that a part of the cream solder cs protrudes outside the external land 8e.
  • the cream solder cs supplied onto the external land 8e flows between the contact portion 10b and the inclined guide portion 10c, and the fixing end surface land 8c, Solidify.
  • the shield 6 is strongly fixed to the printed wiring board 2.
  • the frame 5 is put on the shield 6 as shown in FIG. 3, and the frame 5 is fixed to the shield 6 by connecting means such as solder welding. Thereby, the shield space G partitioned by the top plate 12, the side plate 13, and the printed wiring board 2 is formed.
  • the electronic component 1 includes a printed wiring board main body 7 and a pair of fixing end face lands 8c provided on both end faces 7c of the printed wiring board main body 7 so as to sandwich the printed wiring board main body 7.
  • the board 2 the top plate 12 facing the first IC chip mounting surface 7a on which the IC chip 4 of the printed wiring board 2 is mounted, and the space between the first IC chip mounting surface 7a and the top plate 12
  • a shield case 3 having a plurality of outer side plates 10 surrounding the shield space G.
  • the pair of opposed outer side plates 10 are fixed to the pair of fixing end surface lands 8c by solder so as to sandwich the printed wiring board 2 therebetween.
  • the pair of outer side plates 10 have contact portions 10b that mechanically contact the pair of fixing end surface lands 8c.
  • the distance A between the pair of contact portions 10b is smaller than the width dimension C of the printed wiring board 2 including the pair of fixing end face lands 8c in a state where the shield case 3 is detached from the printed wiring board 2. According to the above configuration, the amount of solder necessary for fixing the shield case 3 to the printed wiring board 2 can be suppressed.
  • a plurality of grooves 14 extending in a direction orthogonal to the first IC chip mounting surface 7a are formed in the fixing end surface land 8c.
  • the plurality of grooves 14 are formed at equal intervals.
  • the cross-sectional shape of each groove 14 is rectangular.
  • the depth of each groove 14 is approximately 5 to 15 micrometers.
  • solder flows in the plurality of grooves 14 to reach the inside of the shield space G, and a solder fillet f is formed between the pair of inner lands 8d (fillet lands) and the pair of inner side plate facing portions 10a. Accordingly, the frame 5 is more strongly fixed to the printed wiring board 2. Further, the presence of the plurality of grooves 14 ensures a large solder joint area.
  • the second embodiment of the present invention has been described above, the second embodiment has the following features.
  • the printed wiring board 2 further includes an internal land 8d (fillet land) formed on the first IC chip mounting surface 7a while being connected to the pair of fixing end surface lands 8c.
  • a plurality of grooves 14 extending in a direction orthogonal to the first IC chip mounting surface 7a are formed in the pair of fixing end surface lands 8c.
  • each groove 14 is a rectangle in the second embodiment.
  • the cross-sectional shape of each groove 14 may be semicircular.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

An electronic component (1) comprising: a wiring substrate (2) having a wiring substrate main body (7) and a pair of end lands for fixing (8c) provided at the end surfaces (7c) of the wiring substrate main body (7), respectively, so as to sandwich the wiring substrate main body (7); and a shield case (3) having a top plate (12) facing a first IC chip-mounting surface (7a) being a surface upon which an IC chip (4) for the wiring substrate (2) is mounted, and a plurality of outside side plates (10) that surround a shield space (G) being a space between the first IC chip-mounting surface (7a) and the top plate (12). The distance (A) between a pair of contact sections (10b) is smaller than the width dimension (c) of the wiring substrate (2) including the pair of end lands for fixing (8c), in a state in which the shield case (3) is removed from the wiring substrate (2).

Description

シールドケースを有する電子部品Electronic component with shield case
　本発明は、シールドケースを有する電子部品に関する。 The present invention relates to an electronic component having a shield case.
　この種の技術として、特許文献１は、側面に端面電極が形成されたプリント配線基板と、電子回路が搭載された領域を覆うシールドケースと、を有する電子部品を開示している。シールドケースは、対向する一対の側壁を有している。そして、対向する一対の側壁がプリント配線基板を挟持することで、電子部品の機械的安定度が向上するとしている。 As this kind of technology, Patent Document 1 discloses an electronic component having a printed wiring board having end face electrodes formed on side surfaces and a shield case covering an area where an electronic circuit is mounted. The shield case has a pair of opposing side walls. And it is supposed that the mechanical stability of an electronic component will improve because a pair of side wall which opposes pinches a printed wiring board.
　なお、シールドケースの一対の側壁をプリント配線基板の端面電極に対してハンダ等により電気的に接続することで、シールドケースを容易に接地することができるとしている。 It should be noted that the shield case can be easily grounded by electrically connecting the pair of side walls of the shield case to the end face electrodes of the printed wiring board by solder or the like.
特許第4316319号公報Japanese Patent No. 4316319
　上記特許文献１の構成では、シールドケースの一対の側壁がプリント配線基板を挟持する際の組立作業性を考慮して、シールドケースの一対の側壁とプリント配線基板との間には隙間ができるように設計されている。そして、公差の影響やシールドケースとプリント配線基板との位置ズレの影響で上記の隙間が大きくなると、この隙間を埋めるために必要となるハンダの量が、スクリーン印刷機が供給できるハンダの量を上回り、スクリーン印刷機とリフロー処理によるハンダ付け作業に支障が出る場合がある。このため、従来は、スクリーン印刷機とリフロー処理によるハンダ付け作業を採用できず、代わりに、手作業によるハンダ付け作業を採用してきた。言うまでもなく、手作業によるハンダ付け作業は、高コスト化を招き、歩留まりが悪く、電子部品の小型化の足かせにもなっていた。 In the configuration of Patent Document 1, a gap is formed between the pair of side walls of the shield case and the printed wiring board in consideration of assembly workability when the pair of side walls of the shield case sandwiches the printed wiring board. Designed to. When the above gap becomes large due to the influence of tolerance or the positional deviation between the shield case and the printed wiring board, the amount of solder required to fill this gap is the amount of solder that the screen printing machine can supply. In some cases, the soldering work by the screen printer and the reflow process may be hindered. For this reason, conventionally, a soldering operation using a screen printing machine and a reflow process cannot be employed, and instead a manual soldering operation has been employed. Needless to say, manual soldering work has led to high costs, poor yields, and an obstacle to miniaturization of electronic components.
　本願発明の目的は、シールドケースをプリント配線基板に固定する際に必要となるハンダの量を抑える技術を提供することにある。 An object of the present invention is to provide a technique for reducing the amount of solder required when fixing a shield case to a printed wiring board.
　本願発明の観点によれば、配線基板本体と、前記配線基板本体の端面に設けられる端面ランドと、を有する配線基板と、前記配線基板の機能部品が搭載される面である機能部品搭載面に対して対向する天板と、前記機能部品搭載面と前記天板との間の空間を取り囲む複数の側板と、を有するシールドケースと、を備え、前記側板は、前記配線基板の前記端面を挟み込むように、前記端面ランドにハンダにより固定されており、前記側板は、前記端面ランドに対して接触する接触部を有し、前記接触部間の距離は、前記シールドケースを前記配線基板から取り外した状態で、前記一対の端面ランドを含む前記配線基板の幅寸法よりも小さい、電子部品が提供される。 According to an aspect of the present invention, a wiring board having a wiring board main body, an end surface land provided on an end face of the wiring board main body, and a functional component mounting surface that is a surface on which functional components of the wiring board are mounted. And a shield case having a plurality of side plates surrounding a space between the functional component mounting surface and the top plate, and the side plates sandwich the end surface of the wiring board. The side plate has a contact portion that contacts the end surface land, and the distance between the contact portions is determined by removing the shield case from the wiring board. In this state, an electronic component is provided that is smaller than the width dimension of the wiring board including the pair of end face lands.
　本願発明によれば、前記シールドケースを前記プリント配線基板に固定する際に必要となるハンダの量が抑えられる。 According to the present invention, the amount of solder required when fixing the shield case to the printed wiring board can be suppressed.
図1は、電子部品の斜視図である。（第１実施形態）FIG. 1 is a perspective view of an electronic component. (First embodiment) 図2Aは、シールドの斜視図である。（第１実施形態）FIG. 2A is a perspective view of a shield. (First embodiment) 図2Bは、フレームの斜視図である。（第１実施形態）FIG. 2B is a perspective view of the frame. (First embodiment) 図2Cは、ICチップが搭載されたプリント配線基板の斜視図である。（第１実施形態）FIG. 2C is a perspective view of a printed wiring board on which an IC chip is mounted. (First embodiment) 図3は、図１のIII-III線断面図である。（第１実施形態）3 is a cross-sectional view taken along line III-III in FIG. (First embodiment) 図4は、フレームの断面図である。（第１実施形態）FIG. 4 is a cross-sectional view of the frame. (First embodiment) 図5は、ICチップが搭載されたプリント配線基板の断面図である。（第１実施形態）FIG. 5 is a cross-sectional view of a printed wiring board on which an IC chip is mounted. (First embodiment) 図6は、ICチップが搭載されたプリント配線基板に対してフレームを対向させた状態を示す断面図である。（第１実施形態）FIG. 6 is a cross-sectional view showing a state in which the frame faces the printed wiring board on which the IC chip is mounted. (First embodiment) 図7は、ICチップが搭載されたプリント配線基板に対してフレームを接触させた状態を示す断面図である。（第１実施形態）FIG. 7 is a cross-sectional view showing a state where the frame is brought into contact with the printed wiring board on which the IC chip is mounted. (First embodiment) 図8は、ICチップが搭載されたプリント配線基板に対してフレームを押し込んだ状態を示す断面図である。（第１実施形態）FIG. 8 is a cross-sectional view showing a state in which the frame is pushed into the printed wiring board on which the IC chip is mounted. (First embodiment) 図9は、ICチップが搭載されたプリント配線基板に対してフレームを位置決めした状態を示す断面図である。（第１実施形態）FIG. 9 is a cross-sectional view showing a state in which the frame is positioned with respect to the printed wiring board on which the IC chip is mounted. (First embodiment) 図10は、ICチップが搭載されたプリント配線基板にクリームハンダを供給した状態を示す断面図である。（第１実施形態）FIG. 10 is a cross-sectional view showing a state in which cream solder is supplied to a printed wiring board on which an IC chip is mounted. (First embodiment) 図11は、リフロー処理により、ICチップが搭載されたプリント配線基板に対してフレームを固定した状態を示す断面図である。（第１実施形態）FIG. 11 is a cross-sectional view showing a state in which the frame is fixed to the printed wiring board on which the IC chip is mounted by reflow processing. (First embodiment) 図12は、ICチップが搭載されたプリント配線基板の斜視図である。（第２実施形態）FIG. 12 is a perspective view of a printed wiring board on which an IC chip is mounted. (Second Embodiment) 図13は、図１２のA部拡大図である。（第２実施形態）FIG. 13 is an enlarged view of a portion A in FIG. (Second Embodiment) 図14は、リフロー処理により、ICチップが搭載されたプリント配線基板に対してフレームを固定した状態を示す断面図である。（第２実施形態）FIG. 14 is a cross-sectional view showing a state in which the frame is fixed to the printed wiring board on which the IC chip is mounted by reflow processing. (Second Embodiment) 図15は、図１２のA部拡大図である。（第３実施形態）FIG. 15 is an enlarged view of a portion A in FIG. (Third embodiment)
（第１実施形態）
　以下、図１～図１１を参照して、本願発明の第１実施形態を説明する。 (First embodiment)
Hereinafter, a first embodiment of the present invention will be described with reference to FIGS.
　図１及び図２Cに示すように、本実施形態において電子部品１は、プリント配線基板２（配線基板）と、シールドケース３と、ICチップ４（機能部品）と、を備えて構成されている。 As shown in FIGS. 1 and 2C, in the present embodiment, the electronic component 1 includes a printed wiring board 2 (wiring board), a shield case 3, and an IC chip 4 (functional component). .
　プリント配線基板２は、紙フェノール基板やガラスエポキシ基板に各種のランドを形成して構成されている。 The printed wiring board 2 is configured by forming various lands on a paper phenol board or a glass epoxy board.
　シールドケース３は、図２A及び図２Bに示すように、本実施形態においてフレーム５とシールド６によって構成されている。フレーム５及びシールド６は、ステンレス合金やアルミニウム合金、マグネシウム合金、ニッケル合金、銅などによって形成されている。 As shown in FIGS. 2A and 2B, the shield case 3 includes a frame 5 and a shield 6 in this embodiment. The frame 5 and the shield 6 are made of stainless alloy, aluminum alloy, magnesium alloy, nickel alloy, copper, or the like.
　ICチップ４は、例えばCSP（Chip Scale Package）やQFP（Quad Flad Package）などの半導体パッケージである。 The IC chip 4 is a semiconductor package such as a CSP (Chip Scale Package) or a QFP (Quad Flat Package).
　次に、図３を参照して、電子部品１の構成を詳細に説明する。 Next, the configuration of the electronic component 1 will be described in detail with reference to FIG.
（プリント配線基板２）
　プリント配線基板２は、紙フェノール基板やガラスエポキシ基板から成るプリント配線基板本体７（配線基板本体）と、各種のランド８と、によって構成されている。プリント配線基板本体７は、ICチップ４が搭載される第１ICチップ搭載面７ａ（機能部品搭載面、第１機能部品搭載面）と、第１ICチップ搭載面７ａの裏面である第２ICチップ搭載面７ｂ（第２機能部品搭載面）と、一対の端面７ｃと、を有している。第１ICチップ搭載面７ａと第２ICチップ搭載面７ｂは互いに平行である。端面７ｃは、第１ICチップ搭載面７ａ及び第２ICチップ搭載面７ｂに対して直交している。 (Printed circuit board 2)
The printed wiring board 2 includes a printed wiring board main body 7 (wiring board main body) made of a paper phenol substrate or a glass epoxy substrate, and various lands 8. The printed wiring board body 7 includes a first IC chip mounting surface 7a (functional component mounting surface, first functional component mounting surface) on which the IC chip 4 is mounted, and a second IC chip mounting surface which is the back surface of the first IC chip mounting surface 7a. 7b (second functional component mounting surface) and a pair of end surfaces 7c. The first IC chip mounting surface 7a and the second IC chip mounting surface 7b are parallel to each other. The end surface 7c is orthogonal to the first IC chip mounting surface 7a and the second IC chip mounting surface 7b.
　ランド８は、ICチップ４用の複数のICチップランド８ａと、２つの位置決め用ランド８ｂと、２つの固定用端面ランド８ｃ（端面ランド）と、２つの内部ランド８ｄ（フィレットランド）と、２つの外部ランド８ｅと、を含んで構成されている。複数のICチップランド８ａは、ICチップ４をプリント配線基板本体７に搭載するためのランドである。複数のICチップランド８ａは、第１ICチップ搭載面７ａ上に形成されている。２つの位置決め用ランド８ｂは、シールドケース３のシールド６をプリント配線基板２に対して位置決めするためのランドである。２つの位置決め用ランド８ｂは、第１ICチップ搭載面７ａ上に形成されており、複数のICチップランド８ａを挟むように配置されている。２つの固定用端面ランド８ｃは、シールドケース３のシールド６をプリント配線基板２に対して固定するためのランドである。２つの固定用端面ランド８ｃは、端面７ｃ上に形成されており、プリント配線基板本体７を挟むように配置されている。２つの内部ランド８ｄは、第１ICチップ搭載面７ａ上に形成されている。２つの内部ランド８ｄは、２つの固定用端面ランド８ｃと夫々接続している。２つの外部ランド８ｅは、第２ICチップ搭載面７ｂ上に形成されている。２つの外部ランド８ｅは、２つの固定用端面ランド８ｃと夫々接続している。従って、固定用端面ランド８ｃと内部ランド８ｄ、外部ランド８ｅは、断面略U字状に形成されている。 The lands 8 include a plurality of IC chip lands 8a for the IC chip 4, two positioning lands 8b, two fixing end lands 8c (end lands), two internal lands 8d (fillet lands), 2 And two external lands 8e. The plurality of IC chip lands 8 a are lands for mounting the IC chip 4 on the printed wiring board body 7. The plurality of IC chip lands 8a are formed on the first IC chip mounting surface 7a. The two positioning lands 8 b are lands for positioning the shield 6 of the shield case 3 with respect to the printed wiring board 2. The two positioning lands 8b are formed on the first IC chip mounting surface 7a and are arranged so as to sandwich the plurality of IC chip lands 8a. The two fixing end faces lands 8 c are lands for fixing the shield 6 of the shield case 3 to the printed wiring board 2. The two fixing end face lands 8c are formed on the end face 7c, and are arranged so as to sandwich the printed wiring board main body 7. The two internal lands 8d are formed on the first IC chip mounting surface 7a. The two internal lands 8d are connected to the two fixing end face lands 8c, respectively. The two external lands 8e are formed on the second IC chip mounting surface 7b. The two external lands 8e are connected to the two fixing end face lands 8c, respectively. Accordingly, the fixing end face land 8c, the inner land 8d, and the outer land 8e are formed in a substantially U-shaped cross section.
（フレーム５）
　本実施形態においてフレーム５は、一対の内側側板９と、一対の外側側板１０と、連結部１１と、を有して構成されている。 (Frame 5)
In the present embodiment, the frame 5 includes a pair of inner side plates 9, a pair of outer side plates 10, and a connecting portion 11.
　一対の内側側板９は、ICチップ４を挟むように配置される側板である。一対の外側側板１０は、ICチップ４と一対の内側側板９を挟んで反対側に配置される側板である。即ち、一対の外側側板１０は、一対の内側側板９の更に外側に配置されている。連結部１１は、一対の内側側板９と、一対の外側側板１０と、を連結するための部分である。 The pair of inner side plates 9 are side plates arranged so as to sandwich the IC chip 4 therebetween. The pair of outer side plates 10 is a side plate disposed on the opposite side across the IC chip 4 and the pair of inner side plates 9. That is, the pair of outer side plates 10 is disposed further outside the pair of inner side plates 9. The connecting portion 11 is a portion for connecting the pair of inner side plates 9 and the pair of outer side plates 10.
　各外側側板１０は、内側側板対向部１０ａと、接触部１０ｂと、傾斜ガイド部１０ｃ（端部）と、によって構成されている。内側側板対向部１０ａと接触部１０ｂ、傾斜ガイド部１０ｃはこの順に並んで形成されている。内側側板対向部１０ａは、内側側板９に対向する部分である。接触部１０ｂは、内側側板対向部１０ａに接続すると共に、固定用端面ランド８ｃに対して機械的に接触する部分である。接触部１０ｂは、固定用端面ランド８ｃに対して実質的に平行である。傾斜ガイド部１０ｃは、接触部１０ｂに接続すると共に、固定用端面ランド８ｃに対向する部分である。傾斜ガイド部１０ｃは、接触部１０ｂから離れるにつれて固定用端面ランド８ｃから離れるように傾斜して構成されている。換言すれば、一対の傾斜ガイド部１０ｃは、互いに遠ざかるように折り曲げて形成されている。 Each outer side plate 10 includes an inner side plate facing portion 10a, a contact portion 10b, and an inclined guide portion 10c (end portion). The inner side plate facing portion 10a, the contact portion 10b, and the inclined guide portion 10c are formed side by side in this order. The inner side plate facing portion 10 a is a portion facing the inner side plate 9. The contact portion 10b is a portion that connects to the inner side plate facing portion 10a and mechanically contacts the fixing end surface land 8c. The contact portion 10b is substantially parallel to the fixing end face land 8c. The inclined guide portion 10c is a portion that is connected to the contact portion 10b and faces the fixing end surface land 8c. The inclined guide portion 10c is configured to be inclined so as to be separated from the fixing end surface land 8c as it is separated from the contact portion 10b. In other words, the pair of inclined guide portions 10c are formed to be bent away from each other.
　そして、外側側板１０の接触部１０ｂ及び傾斜ガイド部１０ｃと、固定用端面ランド８ｃは、ハンダｓにより相互に結合している。 The contact portion 10b and the inclined guide portion 10c of the outer side plate 10 and the fixing end surface land 8c are coupled to each other by solder s.
　図４には、プリント配線基板２から取り外した状態のシールド６を示している。図４に示すように、一対の接触部１０ｂ間の距離を距離Aとし、一対の傾斜ガイド部１０ｃの先端間の距離を距離Bとする。また、図５に示すように、一対の固定用端面ランド８ｃを含むプリント配線基板２の幅寸法を幅寸法Cとする。本実施形態では、距離Aは、幅寸法Cよりも小さい。距離Bは、幅寸法Cよりも大きい。即ち、A＜C＜Bが成立している。 FIG. 4 shows the shield 6 removed from the printed wiring board 2. As shown in FIG. 4, the distance between the pair of contact portions 10b is a distance A, and the distance between the tips of the pair of inclined guide portions 10c is a distance B. Further, as shown in FIG. 5, the width dimension of the printed wiring board 2 including the pair of fixing end face lands 8c is defined as a width dimension C. In the present embodiment, the distance A is smaller than the width dimension C. The distance B is larger than the width dimension C. That is, A <C <B is established.
（シールド６）
　図３に示すように、シールド６は、天板１２と側板１３を有して構成されている。天板１２は、プリント配線基板本体７の第１ICチップ搭載面７ａに対して対向する部分である。側板１３は、外側側板１０の内側側板対向部１０ａと重複するように配置される部分である。 (Shield 6)
As shown in FIG. 3, the shield 6 has a top plate 12 and side plates 13. The top plate 12 is a portion facing the first IC chip mounting surface 7 a of the printed wiring board body 7. The side plate 13 is a portion arranged so as to overlap with the inner side plate facing portion 10 a of the outer side plate 10.
（作動）
　次に、図６～図１１を参照して、電子部品１の組立手順について説明する。 (Operation)
Next, an assembly procedure of the electronic component 1 will be described with reference to FIGS.
　先ず、図６に示すように、SMT（Surface Mount Technology）設備に導入されているスクリーン印刷機を用いて、適量のクリームハンダcsをICチップランド８ａ及び位置決め用ランド８ｂ上に供給すると共に、ICチップ４を第１ICチップ搭載面７ａ上に搭載する。次に、図６に示すように、シールド６をプリント配線基板２に対して対向させる。 First, as shown in FIG. 6, an appropriate amount of cream solder cs is supplied onto the IC chip land 8a and the positioning land 8b by using a screen printing machine installed in an SMT (Surface Mount Technology) facility. The chip 4 is mounted on the first IC chip mounting surface 7a. Next, as shown in FIG. 6, the shield 6 is opposed to the printed wiring board 2.
　図６の状態で、シールド６をプリント配線基板２へ向かって接近させると、図７に示すように、一対の外側側板１０の傾斜ガイド部１０ｃがプリント配線基板２の固定用端面ランド８ｃの上端に接触する。この状態で、シールド６をプリント配線基板２へ向かって押し込むと、傾斜ガイド部１０ｃの存在により一対の外側側板１０が外側に押し広げられ、この結果、図８に示すように、接触部１０ｂが固定用端面ランド８ｃに対して対向し、接触する状態となる。このとき、傾斜ガイド部１０ｃも固定用端面ランド８ｃに対して対向している。この状態で、リフロー処理を施すことにより、図９に示すように、一対の内側側板９が位置決め用ランド８ｂに固定され、それと同時に、ICチップ４がICチップランド８ａに固定される。一対の内側側板９が位置決め用ランド８ｂに固定されることで、シールド６がプリント配線基板２に対して位置決めされる。 In the state of FIG. 6, when the shield 6 is moved closer to the printed wiring board 2, the inclined guide portions 10 c of the pair of outer side plates 10 become the upper ends of the fixing end lands 8 c of the printed wiring board 2 as shown in FIG. 7. To touch. When the shield 6 is pushed toward the printed circuit board 2 in this state, the pair of outer side plates 10 are pushed outward due to the presence of the inclined guide portion 10c. As a result, as shown in FIG. It will be in the state which opposes and contacts the end surface land 8c for fixation. At this time, the inclined guide portion 10c is also opposed to the fixing end surface land 8c. By performing a reflow process in this state, as shown in FIG. 9, the pair of inner side plates 9 are fixed to the positioning lands 8b, and at the same time, the IC chip 4 is fixed to the IC chip lands 8a. The shield 6 is positioned with respect to the printed circuit board 2 by fixing the pair of inner side plates 9 to the positioning lands 8b.
　次に、図９の状態のプリント配線基板２及びシールド６を図１０に示すようにひっくり返し、スクリーン印刷機を用いて、適量のクリームハンダcsを外部ランド８ｅ上に供給する。このとき、クリームハンダcsの一部が外部ランド８ｅよりも外側にはみ出るように、クリームハンダcsを供給しておく。 Next, the printed wiring board 2 and the shield 6 in the state of FIG. 9 are turned over as shown in FIG. 10, and an appropriate amount of cream solder cs is supplied onto the external land 8e using a screen printing machine. At this time, the cream solder cs is supplied so that a part of the cream solder cs protrudes outside the external land 8e.
　そして、図１０の状態でリフロー処理を施すことにより、外部ランド８ｅ上に供給されたクリームハンダcsは、接触部１０ｂ及び傾斜ガイド部１０ｃと、固定用端面ランド８ｃと、の間に流入し、固化する。これにより、シールド６はプリント配線基板２に対して強力に固定されることになる。 And by performing the reflow process in the state of FIG. 10, the cream solder cs supplied onto the external land 8e flows between the contact portion 10b and the inclined guide portion 10c, and the fixing end surface land 8c, Solidify. As a result, the shield 6 is strongly fixed to the printed wiring board 2.
　最後に、図３に示すようにフレーム５をシールド６に被せて、例えばハンダ溶接などの連結手段によってフレーム５をシールド６に固定させる。これにより、天板１２及び側板１３、プリント配線基板２に区画されるシールド空間Gが形成されることになる。 Finally, the frame 5 is put on the shield 6 as shown in FIG. 3, and the frame 5 is fixed to the shield 6 by connecting means such as solder welding. Thereby, the shield space G partitioned by the top plate 12, the side plate 13, and the printed wiring board 2 is formed.
　以上に本願発明の第１実施形態を説明したが、上記第１実施形態の特長は以下の通りである。 Although the first embodiment of the present invention has been described above, the features of the first embodiment are as follows.
（１）電子部品１は、プリント配線基板本体７と、プリント配線基板本体７を挟むようにプリント配線基板本体７の両端面７ｃに夫々設けられる一対の固定用端面ランド８ｃと、を有するプリント配線基板２と、プリント配線基板２のICチップ４が搭載される面である第１ICチップ搭載面７ａに対して対向する天板１２と、第１ICチップ搭載面７ａと天板１２との間の空間としてのシールド空間Gを取り囲む複数の外側側板１０と、を有するシールドケース３と、を備える。一対の対向する外側側板１０は、プリント配線基板２を挟み込むように、一対の固定用端面ランド８ｃにハンダにより固定されている。一対の外側側板１０は、一対の固定用端面ランド８ｃに対して機械的に接触する接触部１０ｂを夫々有する。一対の接触部１０ｂ間の距離Aは、シールドケース３をプリント配線基板２から取り外した状態で、一対の固定用端面ランド８ｃを含むプリント配線基板２の幅寸法Cよりも小さい。以上の構成によれば、シールドケース３をプリント配線基板２に固定する際に必要となるハンダの量が抑えられる。 (1) The electronic component 1 includes a printed wiring board main body 7 and a pair of fixing end face lands 8c provided on both end faces 7c of the printed wiring board main body 7 so as to sandwich the printed wiring board main body 7. The board 2, the top plate 12 facing the first IC chip mounting surface 7a on which the IC chip 4 of the printed wiring board 2 is mounted, and the space between the first IC chip mounting surface 7a and the top plate 12 A shield case 3 having a plurality of outer side plates 10 surrounding the shield space G. The pair of opposed outer side plates 10 are fixed to the pair of fixing end surface lands 8c by solder so as to sandwich the printed wiring board 2 therebetween. The pair of outer side plates 10 have contact portions 10b that mechanically contact the pair of fixing end surface lands 8c. The distance A between the pair of contact portions 10b is smaller than the width dimension C of the printed wiring board 2 including the pair of fixing end face lands 8c in a state where the shield case 3 is detached from the printed wiring board 2. According to the above configuration, the amount of solder necessary for fixing the shield case 3 to the printed wiring board 2 can be suppressed.
（２）一対の外側側板１０の、接触部１０ｂを挟んで天板１２と反対側の端部は、互いに遠ざかるように折り曲げられて傾斜ガイド部１０ｃを構成する。一対の外側側板１０の傾斜ガイド部１０ｃの先端間の距離Bは、シールドケース３をプリント配線基板２から取り外した状態で、プリント配線基板２の幅寸法Cよりも大きい。以上の構成によれば、シールドケース３をプリント配線基板２に取り付けるに際し、一対の外側側板１０が傾斜ガイド部１０ｃの存在により互いに遠ざかるように自動的に弾性変形するので、一対の接触部１０ｂがプリント配線基板２を挟み込む位置関係が容易に達成される。 (2) The ends of the pair of outer side plates 10 opposite to the top plate 12 across the contact portion 10b are bent away from each other to form the inclined guide portion 10c. The distance B between the tips of the inclined guide portions 10c of the pair of outer side plates 10 is larger than the width dimension C of the printed wiring board 2 with the shield case 3 removed from the printed wiring board 2. According to the above configuration, when the shield case 3 is attached to the printed wiring board 2, the pair of outer side plates 10 are automatically elastically deformed so as to move away from each other due to the presence of the inclined guide portion 10c. The positional relationship for sandwiching the printed wiring board 2 is easily achieved.
（第２実施形態）
　次に、図１２～図１４を参照しつつ、本願発明の第２実施形態を説明する。ここでは、本実施形態が上記第１実施形態と異なる点を中心に説明し、重複する説明は適宜省略する。また、上記第１実施形態の各構成要素に対応する構成要素には原則として同一の符号を付すこととする。 (Second Embodiment)
Next, a second embodiment of the present invention will be described with reference to FIGS. Here, the present embodiment will be described with a focus on differences from the first embodiment, and overlapping descriptions will be omitted as appropriate. In addition, in principle, the same reference numerals are assigned to components corresponding to the respective components of the first embodiment.
　本実施形態において固定用端面ランド８ｃには、第１ICチップ搭載面７ａに対して直交する方向に延びる複数の溝１４が形成されている。複数の溝１４は等間隔に並んで形成されている。各溝１４の断面形状は矩形である。各溝１４の深さは、概ね５～１５マイクロメートルである。以上の構成によれば、一対の外側側板１０を一対の固定用端面ランド８ｃに固定するのに必要となるハンダをリフロー処理によりシールド空間Gの外部から供給した際、図１４に示すように、そのハンダが複数の溝１４内を流動することでシールド空間Gの内部に達し、一対の内部ランド８ｄ（フィレットランド）と一対の内側側板対向部１０ａ間で、ハンダフィレットｆが夫々形成される。従って、フレーム５がプリント配線基板２に対して一層強力に固定されることになる。また、複数の溝１４の存在により、はんだ接合面積が大きく確保される。 In the present embodiment, a plurality of grooves 14 extending in a direction orthogonal to the first IC chip mounting surface 7a are formed in the fixing end surface land 8c. The plurality of grooves 14 are formed at equal intervals. The cross-sectional shape of each groove 14 is rectangular. The depth of each groove 14 is approximately 5 to 15 micrometers. According to the above configuration, when the solder necessary to fix the pair of outer side plates 10 to the pair of fixing end lands 8c is supplied from the outside of the shield space G by the reflow process, as shown in FIG. The solder flows in the plurality of grooves 14 to reach the inside of the shield space G, and a solder fillet f is formed between the pair of inner lands 8d (fillet lands) and the pair of inner side plate facing portions 10a. Accordingly, the frame 5 is more strongly fixed to the printed wiring board 2. Further, the presence of the plurality of grooves 14 ensures a large solder joint area.
　以上に本願発明の第２実施形態を説明したが、上記第２実施形態は以下の特長を有している。 Although the second embodiment of the present invention has been described above, the second embodiment has the following features.
（３）プリント配線基板２は、一対の固定用端面ランド８ｃに接続しつつ、第１ICチップ搭載面７ａ上に形成される内部ランド８ｄ（フィレットランド）を更に有する。一対の固定用端面ランド８ｃには、第１ICチップ搭載面７ａに対して直交する方向に延びる複数の溝１４が形成されている。以上の構成によれば、一対の外側側板１０を一対の固定用端面ランド８ｃに固定するのに必要となるハンダをシールド空間Gの外部から供給した際、そのハンダが複数の溝１４内を流動することでシールド空間Gの内部に達し、一対の内部ランド８ｄと一対の内側側板対向部１０ａ間で、ハンダフィレットｆが夫々形成される。 (3) The printed wiring board 2 further includes an internal land 8d (fillet land) formed on the first IC chip mounting surface 7a while being connected to the pair of fixing end surface lands 8c. A plurality of grooves 14 extending in a direction orthogonal to the first IC chip mounting surface 7a are formed in the pair of fixing end surface lands 8c. According to the above configuration, when the solder necessary for fixing the pair of outer side plates 10 to the pair of fixing end surface lands 8c is supplied from the outside of the shield space G, the solder flows in the plurality of grooves 14. As a result, the solder fillet f is formed between the pair of internal lands 8d and the pair of inner side plate facing portions 10a.
（第３実施形態）
　次に、図１５を参照しつつ、本願発明の第３実施形態を説明する。ここでは、本実施形態が上記第２実施形態と異なる点を中心に説明し、重複する説明は適宜省略する。また、上記第２実施形態の各構成要素に対応する構成要素には原則として同一の符号を付すこととする。 (Third embodiment)
Next, a third embodiment of the present invention will be described with reference to FIG. Here, the present embodiment will be described with a focus on differences from the second embodiment, and a duplicate description will be omitted as appropriate. In addition, in principle, the same reference numerals are assigned to components corresponding to the components of the second embodiment.
　図１３に示すように、上記第２実施形態において各溝１４の断面形状は矩形であるとした。しかし、これに代えて、図１５に示すように、各溝１４の断面形状は半円形としてもよい。 As shown in FIG. 13, the cross-sectional shape of each groove 14 is a rectangle in the second embodiment. However, instead of this, as shown in FIG. 15, the cross-sectional shape of each groove 14 may be semicircular.
　以上、実施の形態を参照して本願発明を説明したが、本願発明は上記によって限定されるものではない。本願発明の構成や詳細には、発明のスコープ内で当業者が理解し得る様々な変更をすることができる。 The present invention has been described above with reference to the embodiment, but the present invention is not limited to the above. Various changes that can be understood by those skilled in the art can be made to the configuration and details of the present invention within the scope of the invention.
　この出願は、2012年6月1日に出願された日本出願特願2012-126559を基礎とする優先権を主張し、その開示の全てをここに取り込む。 This application claims priority based on Japanese Patent Application No. 2012-126559 filed on June 1, 2012, the entire disclosure of which is incorporated herein.
１　電子部品
２　プリント配線基板（配線基板）
３　シールドケース
４　ICチップ（機能部品）
５　フレーム
６　シールド
７　プリント配線基板本体（配線基板本体）
７ａ　第１ICチップ搭載面（機能部品搭載面）
１０ｂ　接触部
１０ｃ　傾斜ガイド部
ｓ　ハンダ
ｃｓ　クリームハンダ 1 Electronic component 2 Printed wiring board (wiring board)
3 Shield case 4 IC chip (functional parts)
5 Frame 6 Shield 7 Printed circuit board body (wiring board body)
7a First IC chip mounting surface (functional component mounting surface)
10b Contact portion 10c Inclined guide portion s Solder cs Cream solder

Claims (5)

  1. 配線基板本体と、前記配線基板本体の端面に設けられる端面ランドと、を有する配線基板と、
    前記配線基板の機能部品が搭載される面である機能部品搭載面に対して対向する天板と、前記機能部品搭載面と前記天板との間の空間を取り囲む複数の側板と、を有するシールドケースと、
    を備え、
    前記側板は、前記配線基板の前記端面を挟み込むように、前記端面ランドにハンダにより固定されており、
    前記側板は、前記端面ランドに対して接触する接触部を有し、
    前記接触部間の距離は、前記シールドケースを前記配線基板から取り外した状態で、前記一対の端面ランドを含む前記配線基板の幅寸法よりも小さい、
    電子部品。     A wiring board having a wiring board main body, and an end face land provided on an end face of the wiring board main body,
    A shield having a top plate facing a functional component mounting surface, which is a surface on which the functional components of the wiring board are mounted, and a plurality of side plates surrounding a space between the functional component mounting surface and the top plate. Case and
    With
    The side plate is fixed to the end surface land with solder so as to sandwich the end surface of the wiring board,
    The side plate has a contact portion that comes into contact with the end face land,
    The distance between the contact portions is smaller than the width dimension of the wiring board including the pair of end surface lands in a state where the shield case is removed from the wiring board.
    Electronic components.
  2. 配線基板本体と、前記配線基板本体を挟むように前記配線基板本体の両端面に夫々設けられる一対の端面ランドと、を有する配線基板と、
    前記配線基板の機能部品が搭載される面である機能部品搭載面に対して対向する天板と、前記機能部品搭載面と前記天板との間の空間を取り囲む複数の側板と、を有するシールドケースと、
    を備え、
    前記側板のうち一対の対向する側板は、前記配線基板を挟み込むように、前記一対の端面ランドにハンダにより固定されており、
    前記一対の側板は、前記一対の端面ランドに対して機械的に接触する接触部を夫々有し、
    前記一対の接触部間の距離は、前記シールドケースを前記配線基板から取り外した状態で、前記一対の端面ランドを含む前記配線基板の幅寸法よりも小さい、
    電子部品。     A wiring board having a wiring board body and a pair of end surface lands provided on both end faces of the wiring board body so as to sandwich the wiring board body;
    A shield having a top plate facing a functional component mounting surface, which is a surface on which the functional components of the wiring board are mounted, and a plurality of side plates surrounding a space between the functional component mounting surface and the top plate. Case and
    With
    A pair of opposing side plates of the side plates are fixed to the pair of end surface lands by solder so as to sandwich the wiring board,
    Each of the pair of side plates has a contact portion that mechanically contacts the pair of end surface lands,
    The distance between the pair of contact portions is smaller than the width dimension of the wiring board including the pair of end surface lands in a state where the shield case is removed from the wiring board.
    Electronic components.
  3. 請求項２に記載の電子部品であって、
    前記一対の側板の、前記接触部を挟んで前記天板と反対側の端部は、互いに遠ざかるように折り曲げられて傾斜ガイド部を構成し、
    前記一対の側板の前記傾斜ガイド部の先端間の距離は、前記シールドケースを前記配線基板から取り外した状態で、前記配線基板の前記幅寸法よりも大きい、
    電子部品。     The electronic component according to claim 2,
    The ends of the pair of side plates opposite to the top plate across the contact portion are bent away from each other to form an inclined guide portion,
    The distance between the tips of the inclined guide portions of the pair of side plates is larger than the width dimension of the wiring board in a state where the shield case is removed from the wiring board.
    Electronic components.
  4. 請求項２又は３に記載の電子部品であって、
    前記配線基板は、前記一対の端面ランドに接続しつつ、前記機能部品搭載面上に形成されるフィレットランドを更に有し、
    前記一対の端面ランドには、前記機能部品搭載面に対して直交する方向に延びる複数の溝が形成されている、
    電子部品。     The electronic component according to claim 2 or 3,
    The wiring board further includes a fillet land formed on the functional component mounting surface while being connected to the pair of end surface lands.
    A plurality of grooves extending in a direction orthogonal to the functional component mounting surface are formed in the pair of end surface lands.
    Electronic components.
  5. 請求項２又は３に記載の電子部品であって、
    前記配線基板は、前記一対の端面ランドに接続しつつ、前記機能部品搭載面上に形成されるフィレットランドを更に有し、
    前記一対のフィレットランドと前記一対の側板間で、ハンダフィレットが夫々形成されている、
    電子部品。     The electronic component according to claim 2 or 3,
    The wiring board further includes a fillet land formed on the functional component mounting surface while being connected to the pair of end surface lands.
    Solder fillets are respectively formed between the pair of fillet lands and the pair of side plates.
    Electronic components.
PCT/JP2013/000376 2012-06-01 2013-01-25 Electronic component having shield case WO2013179527A1 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114521100A (en) * 2020-11-18 2022-05-20 株式会社村田制作所 Component mounted on wiring board

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JPH09321445A (en) * 1996-05-24 1997-12-12 Toyo Commun Equip Co Ltd Electronic component package structure
JP2003078243A (en) * 2001-06-18 2003-03-14 Murata Mfg Co Ltd Electronic component and method of manufacturing the same
JP2004179562A (en) * 2002-11-28 2004-06-24 Kyocera Corp Electronic equipment
JP2006237137A (en) * 2005-02-23 2006-09-07 Alps Electric Co Ltd Electronic circuit unit
JP2007250732A (en) * 2006-03-15 2007-09-27 Fdk Corp Electronic component and manufacturing method thereof
JP2010205995A (en) * 2009-03-04 2010-09-16 Hitachi Kokusai Electric Inc Printed board

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09321445A (en) * 1996-05-24 1997-12-12 Toyo Commun Equip Co Ltd Electronic component package structure
JP2003078243A (en) * 2001-06-18 2003-03-14 Murata Mfg Co Ltd Electronic component and method of manufacturing the same
JP2004179562A (en) * 2002-11-28 2004-06-24 Kyocera Corp Electronic equipment
JP2006237137A (en) * 2005-02-23 2006-09-07 Alps Electric Co Ltd Electronic circuit unit
JP2007250732A (en) * 2006-03-15 2007-09-27 Fdk Corp Electronic component and manufacturing method thereof
JP2010205995A (en) * 2009-03-04 2010-09-16 Hitachi Kokusai Electric Inc Printed board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114521100A (en) * 2020-11-18 2022-05-20 株式会社村田制作所 Component mounted on wiring board

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