WO2013176148A1

WO2013176148A1 - Device for evaluating visibility of transparent substrate, device for positioning laminate, determination device, position detection device, device for evaluating surface state of metal foil, program, recording medium, method for manufacturing printed wiring board, method for evaluating visibility of transparent substrate, method for positioning laminate, determination method, and position detection method

Info

Publication number: WO2013176148A1
Application number: PCT/JP2013/064122
Authority: WO
Inventors: 新井　英太; 敦史三木; 康修新井; 嘉一郎中室
Original assignee: Jx日鉱日石金属株式会社
Priority date: 2012-05-21
Filing date: 2013-05-21
Publication date: 2013-11-28
Also published as: JP5824147B2; TW201411112A; JPWO2013176148A1

Abstract

Through the present invention, the visibility of a transparent substrate is efficiently and precisely evaluated. The device of the present invention for evaluating the visibility of a transparent substrate is provided with: an image taking means for taking an image, through a transparent substrate, of a mark which is present under the transparent substrate; an observation point/brightness graph creating means for measuring, for an image obtained by the image taking, the brightness of each observation point along a direction intersecting the direction in which the observed mark extends, and creating an observation point/brightness graph; and a visibility evaluation means for evaluating the visibility of the transparent substrate on the basis of the slope of a brightness curve occurring from an end part of the mark to a portion in which the mark is not present in the observation point/brightness graph.

Description

Visibility evaluation device for transparent substrate, positioning device for laminated body, determination device, position detection device, evaluation device for surface condition of metal foil, program, recording medium, method for producing printed wiring board, visibility evaluation of transparent substrate Method, Laminate Positioning Method, Judgment Method, Position Detection Method

The present invention relates to a visibility evaluation device for a transparent substrate, a positioning device for a laminate, a determination device, a position detection device, an evaluation device for the surface state of a metal foil, a program, a recording medium, a printed wiring board manufacturing method, and a transparent substrate. It is related with the visibility evaluation method of this, the positioning method of a laminated body, the determination method, and a position detection method.

For small electronic devices such as smartphones and tablet PCs, flexible printed wiring boards (hereinafter referred to as FPCs) are employed because of their ease of wiring and light weight. In recent years, with the enhancement of functions of these electronic devices, the signal transmission speed has been increased, and impedance matching has become an important factor in FPC. As a measure for impedance matching with respect to an increase in signal capacity, a resin insulation layer (for example, polyimide) serving as a base of an FPC has been increased in thickness. On the other hand, processing such as bonding to a liquid crystal substrate and mounting of an IC chip is performed on the FPC, but the alignment at this time is the resin insulation remaining after etching the copper foil in the laminate of the copper foil and the resin insulating layer The visibility of the resin insulation layer is important because it is performed through a positioning pattern that is visible through the layer.

As a method for evaluating the visibility of such a resin insulating layer, in Patent Document 1, an image taken through a resin insulating layer with a CCD camera is observed and evaluated. In Patent Document 2, it is evaluated whether or not a test pattern is distorted in an image taken by a CCD camera from an angle of 30 ° with respect to the horizontal plane of the resin insulating layer to be evaluated.

JP 2003-309336 A JP 2006-001056 A

However, in the case of simply observing an image by observing with a CCD camera as in Patent Document 1, there is a limit to the accuracy of the visibility evaluation. In reality, it is impossible to determine whether or not the provided mark can be visually recognized through the transparent base material, which is problematic in terms of manufacturing cost. The same applies to a method of evaluating whether or not a test pattern is distorted in the image as in Patent Document 2.
The present invention relates to a visibility evaluation apparatus for a transparent base material that can efficiently and accurately evaluate the visibility of a transparent base material, a visibility evaluation program for a transparent base material, and a computer-readable recording medium on which the program is recorded. provide. The present invention also relates to a laminate positioning apparatus capable of efficiently and accurately positioning the laminate, a laminate positioning program, a computer-readable recording medium on which the laminate is recorded, and a printed wiring board. Provide a method. The present invention also relates to a copper foil surface state evaluation apparatus, a copper foil surface state evaluation program, and a computer-readable recording medium on which the copper foil surface state evaluation program is recorded. And the evaluation method of the surface state of copper foil is provided. Moreover, this invention provides the visibility evaluation method of the transparent base material which can evaluate the visibility of a transparent base material efficiently and correctly. In addition, the present invention provides a method for efficiently and accurately positioning a laminated body, a method for efficiently and accurately determining whether or not a mark exists, and a method for efficiently and accurately detecting the position of a mark.

As a result of extensive research, the present inventors have provided a mark under the transparent base material, photographed through the transparent base material with photographing means, and a mark drawn on the observation point-lightness graph obtained from the image of the mark portion. Paying attention to the slope of the brightness curve near the edge and evaluating the slope of the brightness curve, the visibility of the transparent substrate can be efficiently improved without being affected by the type of transparent substrate and the thickness of the transparent substrate. It was found that it can be evaluated accurately.

The present invention completed on the basis of the above knowledge is, in one aspect, observed with respect to an imaging means for imaging a mark existing under a transparent substrate through the transparent substrate, and an image obtained by the imaging. In the observation point-lightness graph creating means for measuring the lightness of each observation point along the direction intersecting with the direction in which the mark extends to create an observation point-lightness graph, and in the observation point-lightness graph, the end of the mark It is the visibility evaluation apparatus of the transparent base material provided with the visibility evaluation means which evaluates the visibility of the said transparent base material based on the inclination of the brightness curve produced from the part to the part which does not have the said mark.

In another aspect, the present invention is a program for causing a computer to function as the visibility evaluation device for a transparent substrate of the present invention.

In yet another aspect, the present invention is a computer-readable recording medium on which a program for causing the transparent base material visibility evaluation apparatus of the present invention to function is recorded.

In another aspect of the present invention, there is provided a positioning device for a laminate for positioning a laminate of a metal and a resin, wherein the mark is included in the laminate of the metal and the resin having a mark. An imaging means for imaging through the resin and an observation for measuring the brightness at each observation point along the direction intersecting the direction in which the observed mark extends with respect to the image obtained by the imaging to produce an observation point-lightness graph A laminate comprising: a spot-lightness graph preparation means; and a positioning means for determining a position of the laminate according to a slope of a brightness curve generated from an end portion of the mark to a portion without the mark in the observation spot-lightness graph. It is a positioning device.

In another aspect of the present invention, there is provided a program for causing a computer to function as the laminated body positioning device of the present invention.

In yet another aspect, the present invention is a computer-readable recording medium on which a program for causing a computer to function as the laminated body positioning device of the present invention is recorded.

According to another aspect of the present invention, there is provided a printed wiring board manufacturing method including a step of positioning a printed wiring board using the positioning device of the present invention and mounting a component on the positioned printed wiring board. .

In another aspect of the present invention, after the surface-treated surface side of the surface-treated metal foil is bonded to at least one surface of the transparent substrate, the surface-treated copper foil is removed by etching, The imaging means for imaging the mark existing under the transparent base material after the foil is removed by etching through the transparent base material, and the image obtained by the imaging crosses the direction in which the observed mark extends. An observation point-lightness graph creating means for measuring the lightness of each observation point along the direction to create an observation point-lightness graph, and from the end of the mark to a portion where the mark is not present in the observation point-lightness graph Metal foil table that evaluates the visibility of the transparent substrate based on the slope of the resulting brightness curve, and evaluates the surface state of the metal foil based on the visibility evaluation result An evaluation device for the surface condition of the metal foil and a condition evaluation unit.

In yet another aspect of the present invention, there is provided a program for causing a computer to function as the metal foil surface state evaluation apparatus of the present invention.

In yet another aspect, the present invention is a computer-readable recording medium on which a program for causing a computer to function as the metal foil surface state evaluation apparatus of the present invention is recorded.

According to another aspect of the present invention, after the surface-treated surface side of the surface-treated metal foil is bonded to at least one surface of the transparent substrate, the surface-treated metal foil is removed by etching, and the surface-treated metal foil The mark existing under the transparent base material after removing the foil by etching is photographed through the transparent base material, and the image obtained by the photographing is along the direction intersecting with the direction in which the observed mark extends. The brightness at each observation point is measured to produce an observation point-lightness graph. In the observation point-lightness graph, the inclination of the lightness curve that occurs from the end of the mark to the portion without the mark is based on the angle. It is the evaluation method of the surface state of the metal foil which evaluates the visibility of the transparent substrate and evaluates the surface state of the metal foil based on the evaluation result of the visibility.

In another aspect of the present invention, a mark and a transparent substrate provided on the mark are prepared, the mark is photographed with a CCD camera through the transparent substrate, and an image obtained by the photographing is observed. An observation point-lightness graph is created by measuring the lightness of each observation point along the direction crossing the mark, and the lightness generated from the end of the mark to the portion without the mark in the observation point-lightness graph This is a method for evaluating the visibility of the transparent substrate based on the slope of a curve.

In another aspect of the present invention, there is provided a method of positioning a laminate of metal and resin, wherein the laminate of metal and resin has a mark, and the mark is photographed with a CCD camera through the resin. Then, with respect to the image obtained by the photographing, the brightness at each observation point is measured along a direction crossing the observed mark to create an observation point-lightness graph. In the observation point-lightness graph, the mark This is a method of positioning the laminate of metal and resin based on the slope of the brightness curve generated from the end of the metal to the portion where the mark is not present.

In another aspect of the present invention, there is provided a printed wiring board manufacturing method including a step of positioning a printed wiring board using the positioning method of the present invention and mounting a component on the positioned printed wiring board. .

According to another aspect of the present invention, there is provided a method for determining whether or not there is a mark included in a laminate of a metal and a transparent substrate, the laminate of the metal and the transparent substrate having a mark. On the other hand, the mark is photographed through the transparent base material, and the brightness of each observation point is measured along the direction intersecting the direction in which the observed mark extends in the image obtained by the photographing. A method of creating a brightness graph and determining whether or not a mark included in the laminate exists based on a slope of a brightness curve generated from an end portion of the mark to a portion without the mark in the observation point-lightness graph It is.

According to another aspect of the present invention, there is provided an apparatus for determining whether or not there is a mark included in a laminate of a metal and a transparent substrate, the laminate including the metal and the transparent substrate having a mark. On the other hand, with respect to the imaging means for imaging the mark through the transparent substrate and the image obtained by the imaging, the brightness at each observation point is measured along the direction intersecting with the direction in which the observed mark extends. In the observation point-lightness graph preparation means for preparing the point-lightness graph, and in the observation point-lightness graph, whether the mark exists on the basis of the slope of the lightness curve generated from the end of the mark to the portion without the mark An apparatus for determining whether or not a mark included in a laminate of a metal and a transparent substrate exists.

In another aspect of the present invention, there is provided a program for causing a computer to function as an apparatus for determining whether or not a mark included in a laminate of a metal and a transparent substrate of the present invention is present.

In yet another aspect of the present invention, a computer-readable program having recorded thereon a program for causing a computer to function as a device for determining whether or not the mark of the laminate of the metal and the transparent substrate of the present invention exists is recorded. Recording medium.

According to still another aspect of the present invention, there is provided a method for detecting a position of a mark included in a laminate of a metal and a transparent substrate, the mark including the metal and the transparent substrate, Photograph the mark through the transparent base material, and create an observation point-lightness graph by measuring the brightness at each observation point along the direction where the observed mark extends with respect to the image obtained by the photographing. In the observation point-lightness graph, the position of the mark is detected based on the slope of the lightness curve generated from the end of the mark to the portion where the mark is not present.

According to another aspect of the present invention, there is provided an apparatus for detecting a position of a mark included in a laminate of a metal and a transparent substrate, wherein the mark is included in the laminate of the metal and the transparent substrate. An observation point-lightness graph by measuring the lightness at each observation point along the direction intersecting with the direction in which the observed mark extends with respect to the image obtained by photographing through the transparent base material and the image obtained by the photographing Observation point-brightness graph preparation means for creating the position, and position detection means for detecting the position of the mark based on the slope of the lightness curve generated from the end of the mark to the portion without the mark in the observation point-lightness graph The apparatus which detects the position of the mark which the laminated body of a metal and a transparent base material provided with.

In yet another aspect, the present invention is a program for causing a computer to function as an apparatus for detecting the position of a mark included in a laminate of a metal and a transparent substrate of the present invention.

In another aspect of the present invention, there is provided a computer-readable recording medium on which a program for causing a computer to function as a device for detecting a position of a mark included in a laminate of a metal and a transparent substrate of the present invention is recorded. is there.

According to the present invention, the visibility of a transparent substrate can be evaluated efficiently and accurately. Moreover, according to this invention, positioning of a laminated body can be performed efficiently and correctly. Moreover, according to this invention, the surface state of metal foil can be evaluated efficiently and correctly. Further, according to the present invention, it is possible to efficiently and accurately determine whether or not a mark exists. Further, according to the present invention, the position of the mark can be detected efficiently and accurately.

It is a schematic diagram of the visibility evaluation apparatus of the transparent base material which concerns on embodiment of this invention. It is a flowchart of the visibility evaluation method of the transparent base material which concerns on embodiment of this invention. It is a schematic diagram which defines Bt and Bb in case a mark width is about 1.3 mm. It is a schematic diagram which defines Bt and Bb in case a mark width is about 0.3 mm. It is a schematic diagram which defines k1 and k2. It is a schematic diagram of the positioning apparatus of the laminated body which concerns on embodiment of this invention. It is a flowchart of the positioning method of the laminated body which concerns on embodiment of this invention. FIG. 5 is a schematic diagram showing a configuration of a photographing unit and a method for measuring the inclination of a lightness curve when evaluating the inclination of the lightness curve when the mark width is 0.1 to 0.4 mm. FIG. 6 is a schematic diagram showing the configuration of the photographing means and the method of measuring the inclination of the brightness curve when evaluating the inclination of the brightness curve when the mark width is 1.0 to 2.0 mm. It is a schematic diagram of the evaluation apparatus of the surface state of the copper foil which concerns on embodiment of this invention. It is a flowchart of the evaluation method of the surface state of the copper foil which concerns on embodiment of this invention.

(Visibility evaluation apparatus for transparent substrate, visibility evaluation method, visibility evaluation program, and recording medium)
FIG. 1 is a schematic diagram of a visibility evaluation apparatus 10 for a transparent substrate according to an embodiment of the present invention. The transparent substrate visibility evaluation apparatus 10 according to the embodiment of the present invention includes a photographing unit 11 that photographs the mark 16 existing under the transparent substrate 17 provided on the stage 15 through the transparent substrate 17. , A computer 12 that performs various processes based on image signals from the imaging means 11, a display means 13 that displays predetermined images and the like based on various signals from the computer 12, a transparent substrate 17 on the stage, and a mark 16 is provided with illumination means 14 for irradiating light. The transparent substrate 17 to be evaluated in the present invention is not particularly limited, and may be a resin substrate such as glass or polyimide as long as it is transparent. In the present invention, the term “transparent” includes light transparency. The mark in the present invention may be a mark printed on a printed matter such as paper, or may be a copper wiring, and may take any form as long as it is a mark serving as a mark. The mark may be a printed material, a metal, an inorganic material, an organic material, or any mark. If the mark is a line, it is easy to create an observation point-lightness graph by measuring the lightness of each observation point along the direction crossing the observed mark in the image obtained by photographing. .

The flexible printed wiring board (FPC) is subjected to processing such as bonding to a liquid crystal substrate and mounting of an IC chip. The alignment at this time is the resin insulation layer that remains after etching the copper foil of the copper-clad laminate. The visibility of the resin insulating layer is important because it is performed through a positioning pattern that is visible through the screen. In order to efficiently and accurately evaluate the visibility of such a resin insulating layer, in the present invention, the transparent substrate is roughened with a surface-treated metal foil on which at least one surface has been subjected to a surface treatment such as a roughening treatment. The metal foil may be removed by etching after bonding to at least one surface of the transparent substrate from the surface side subjected to surface treatment such as treatment. In addition, the transparent base material is obtained by attaching the surface-treated metal foil to both surfaces of the transparent base material from the surface side subjected to surface treatment such as roughening treatment, and then performing etching to remove the metal foil on both sides. It may be produced. Although the said metal foil is not specifically limited, Copper foil, aluminum foil, nickel foil, copper alloy foil, nickel alloy foil, aluminum alloy foil, stainless steel foil, iron foil, iron alloy foil, etc. can be used.

The imaging means 11 includes an imaging device, an image processing unit configured with an image processing circuit to which an output of the imaging device is input, a control unit configured with a control circuit that controls the image processing unit, a lens, and the like. Equipped with an optical system. As the photographing means 11, for example, a CCD camera or the like can be used. The photographing means 11 photographs the mark 16 existing under the transparent base material 17 provided on the stage 15 through the transparent base material 17 and acquires an image.

The computer 12 performs various processes based on the image signal from the imaging means 11. The computer 12 measures the lightness at each observation point along the direction intersecting the direction in which the observed mark 16 extends with respect to the image signal from the image pickup means 11, and creates an observation point-lightness graph. And a visibility evaluation means for evaluating the visibility of the transparent substrate 17 based on the slope of the brightness curve generated from the end of the mark 16 to the portion without the mark 16 in the observation point-lightness graph. The observation point-lightness graph creating means may create the observation point-lightness graph by measuring the lightness of each observation point along the direction perpendicular to the direction in which the observed mark 16 extends.

The computer 12 further includes smoothing processing means for reducing variation in brightness of an image obtained by photographing by the photographing means 11, and the observation point-lightness graph creating means uses the lightness after the smoothing processing to observe point-lightness. A graph may be created.

Further, the mark 16 existing under the transparent base material 17 is a line-shaped mark 16 printed on a printed material laid under the transparent base material 17, and the observation point-lightness graph preparation means is obtained by photographing. For the obtained image, the brightness at each observation point may be measured along a direction perpendicular to the direction in which the observed line-shaped mark 16 extends to create an observation point-lightness graph.

The computer 12 includes a memory as a storage means. In this memory, the digitized image from the imaging means 11, the observation point-lightness graph creation formula, the visibility evaluation formula, the evaluation value at each stage, and the like are recorded (so-called stored) so as to be readable by a computer.

The display means 13 displays a predetermined image such as an observation point-lightness graph and a visibility evaluation result, a numerical value, and the like based on various signals from the computer 12.

Next, a visibility evaluation method using the transparent substrate visibility evaluation apparatus 10 according to the above embodiment will be described with reference to a flowchart shown in FIG. The flowchart shown in FIG. 2 is an embodiment of a visibility evaluation method using the transparent substrate visibility evaluation apparatus 10 according to the present invention, and an evaluation method that can be realized by the visibility evaluation apparatus 10 of the present invention is as follows. The present invention is not limited to that shown in the flowchart of FIG. In particular, the smoothing process is performed before creating the observation point-lightness graph for the image obtained by shooting in FIG. 2. However, the present invention is not limited to this, for example, after creating the observation point-lightness graph. You may go.
In the visibility evaluation method using the visibility evaluation apparatus 10 for a transparent substrate, first, the mark 16 existing under the transparent substrate 17 is photographed by the photographing means 11 through the transparent substrate 17. The signal of the image photographed by the photographing means 11 is sent to the computer 12. The observation point-lightness graph creating means of the computer 12 measures the lightness of each observation point along the direction perpendicular to the direction in which the observed mark 16 extends with respect to the image signal from the image pickup means 11 and observes it. Is made. The visibility evaluation means of the computer 12 evaluates the visibility of the transparent substrate 17 based on the slope of the brightness curve generated from the end of the mark 16 to the portion where the mark 16 is not present in the observation point-lightness graph. Conventionally, unless actually produced on the production line, it was impossible to determine whether or not the marks provided for alignment etc. could be seen through the transparent base material, and there was a problem in terms of production cost . However, if the visibility evaluation apparatus 10 of the transparent base material which concerns on this invention is used, it will become possible to evaluate the visibility of the transparent base material 17 easily and efficiently easily only by a laboratory with the said structure.

When a polyimide substrate is used as the transparent base material 17 to be evaluated in the present invention, the polyimide substrate has a thickness of 50 μm, and the mark 16 extends from the end of the mark 16 on the polyimide substrate before being bonded to a metal foil. The difference ΔB (PI) [ΔB (PI) = Bt−Bb] between the top average value Bt and the bottom average value Bb of the brightness curve generated over the portion where there is no difference may be 20 or more and 33 or less. Moreover, when using a polyimide substrate as the transparent base material 17 to be evaluated in the present invention, the polyimide substrate has a thickness of 50 μm and from the end of the mark 16 on the polyimide substrate before being bonded to the metal foil. The difference ΔB (PI) [ΔB (PI) = Bt−Bb] between the top average value Bt and the bottom average value Bb of the lightness curve generated over the portion without the mark 16 may be 50 or more and 65 or less.

The visibility evaluation unit of the computer 12 removes the metal foil by etching after bonding the surface-treated metal foil to at least one surface of the polyimide substrate from the surface-treated surface side subjected to surface treatment such as roughening treatment. The difference ΔB (ΔB = Bt−Bb) between the top average value Bt and the bottom average value Bb of the brightness curve generated from the end portion of the mark 16 to the portion where the mark 16 does not exist for the polyimide substrate manufactured in this manner, and ΔB / ΔB Visibility can be evaluated using a ratio composed of (PI) and an inclination k1 represented by an angle of the brightness curve in a predetermined depth range based on Bt.
Further, the visibility evaluation means of the computer 12 is such that the difference ΔB (ΔB = Bt−Bb) between the top average value Bt and the bottom average value Bb of the brightness curve generated from the end portion of the mark 16 to the portion without the mark 16 is 20 or more. 33 or less, the ratio of ΔB / ΔB (PI) is 0.7 or more, and the slope k1 expressed by the angle of the lightness curve in the depth range of 0.4ΔB to 0.6ΔB with respect to Bt is 65. A case where the angle is greater than or equal to ° may be determined as good, and a case where the angle is equal to or lower than 87 ° may be determined as better.
Further, the visibility evaluation unit of the computer 12 may further use the inclination k2 expressed by the angle of the lightness curve in the depth range from the intersection of the lightness curve and Bt to 0.1 ΔB with reference to Bt for further evaluation. . Furthermore, it may be determined that the case where k2 is 30 ° or more is even better.
According to such an evaluation apparatus, it becomes possible to evaluate the visibility of the transparent substrate efficiently and more accurately.

The computer 12 further includes smoothing processing means for reducing variation in brightness of an image obtained by photographing by the photographing means 11, and the observation point-lightness graph creating means uses the lightness after the smoothing processing to observe point-lightness. It is preferable to create a graph. Since smoothing processing by the smoothing processing means is performed on the data (original waveform) including lightness noise obtained from the image obtained by the photographing by the photographing means 11, the variation in the lightness is reduced. The visibility of the material 17 can be more accurately evaluated. The smoothing processing by the smoothing processing means can be performed by various smoothing programs. For example, smoothing processing by a second-third order polynomial fitting method, smoothing processing by Fourier transform, or smoothing processing by a moving average method is used. be able to. The smoothing process may be performed using various known smoothing programs. Further, the smoothing process of the brightness data may be performed for both the portion with the mark 16 and the portion without the mark 16, may be performed for the portion with the mark 16, may be performed on the portion without the mark 16, or may be performed partially. May be.

Note that an observation point-lightness graph of data (original waveform) including noise of the lightness may be prepared in advance before performing the lightness smoothing process on the image obtained by the photographing by the photographing means 11.

Here, “top average value Bt of the lightness curve”, “bottom average value Bb of the lightness curve”, “slope k1 represented by the angle of the lightness curve”, and “slope represented by the angle of the lightness curve described later” “k2” will be described with reference to the drawings. For the “bottom average value Bb of the brightness curve”, the width of the mark 16 is increased (for example, the width of the mark 16 is 0.7 mm or more, for example, 0.8 mm or more, for example, 5 mm or less, 4 mm or less, for example, about 1. And the width of the mark 16 is reduced (for example, the width of the mark 16 is 0.01 mm or more, 0.05 mm or more, 0.1 mm or more, 0.8 mm or less, 0.7 mm). In the following, since the specification is different from that of 0.6 mm or less, for example, 0.3 mm, each case will be described.

FIG. 3 is a schematic diagram for defining Bt and Bb when the width of the mark 16 is increased (about 1.3 mm). A “mark” in FIG. 3 indicates a line-shaped mark 16 (width of about 1.3 mm) of the printed matter observed in an image obtained by photographing with the CCD camera. A curve drawn so as to overlap the mark 16 shows a brightness curve generated from the end of the mark 16 to a portion where the mark 16 is not present in the observation point-lightness graph. As shown in FIG. 3, the “top average value Bt of the lightness curve” is the lightness when measured at 5 points (at a total of 10 points on both sides) at 30 μm intervals from a position 100 μm away from the end positions on both sides of the mark 16. Average values are shown. The “bottom average value Bb of the lightness curve” indicates an average value of lightness when 11 positions are measured at 100 μm intervals from a position entering 100 μm inside from the end position of the mark 16. Note that the interval between observation points for measuring the average value of brightness can be appropriately selected within the range of 1 μm to 500 μm depending on the shape of the brightness curve. In order to avoid the bias of the observation points, it is preferable that the intervals between the observation points are substantially equal or equal. Note that the intervals between the observation points do not have to be substantially equal and may not be equal. Further, it is considered that the wider the measurement interval, the more the influence of a specific observation point can be eliminated and the error due to the observation point can be reduced.

4A and 4B are schematic diagrams for defining Bt and Bb when the width of the mark 16 is about 0.3 mm. When the width of the mark 16 is about 0.3 mm, a V-shaped brightness curve as shown in FIG. 4A and a case of about 1.3 mm as shown in FIG. It may be a lightness curve with a bottom. In any case, the “top average value Bt of the lightness curve” is 5 at intervals of 30 μm as in the case where the width of the mark 16 is about 1.3 mm from a position 50 μm away from the end positions on both sides of the mark 16. The average value of the brightness when measured at a place (a total of 10 places on both sides) is shown. On the other hand, the “bottom average value Bb of the lightness curve” indicates the minimum value of lightness at the tip of the V-shaped valley when the lightness curve is V-shaped as shown in FIG. When it has the bottom of (b), the value of the center part of about 0.3 mm is shown. Note that the interval between observation points for measuring the average value of brightness can be appropriately selected within the range of 1 μm to 500 μm depending on the shape of the brightness curve. In order to avoid the bias of the observation points, it is preferable that the intervals between the observation points are substantially equal or equal. Note that the intervals between the observation points may not be substantially equal, and may not be equal. Further, it is considered that the wider the measurement interval, the more the influence of a specific observation point can be eliminated and the error due to the observation point can be reduced.

FIG. 5 shows a schematic diagram defining k1 and k2. The “slope k1 expressed by the angle of the lightness curve” is 0.4ΔB to 0.6ΔB based on Bt [ΔB is the difference between the top average value Bt and the bottom average value Bb of the lightness curve (ΔB = Bt−Bb )] Indicates the slope of the brightness curve in the depth range (k1 (°) = tan ⁻¹ (b (gradation) / a (pixel))). One pixel on the horizontal axis corresponds to a length of 10 μm. Then, the ratio of the length of one pixel to one gradation in the lightness curve graph is 3.5: 5 (the length of one pixel in the lightness curve graph: the length of one gradation in the lightness curve graph = 3. The value of k1 (°) was calculated in the lightness curve graph of 5: 5). Further, k1 is measured on both sides of the mark 16, and a value having a small inclination expressed by an angle is adopted. The “slope k2 expressed by the angle of the lightness curve” indicates the slope expressed by the angle of the lightness curve in the depth range from the intersection of the lightness curve and Bt to 0.1 ΔB with reference to Bt (k2 (° ) = Tan ⁻¹ (d (gradation) / c (pixel))). One pixel on the horizontal axis corresponds to a length of 10 μm. Then, the ratio of the length of one pixel to one gradation in the lightness curve graph is 3.5: 5 (the length of one pixel in the lightness curve graph: the length of one gradation in the lightness curve graph = 3. The value of k1 (°) was calculated in the lightness curve graph of 5: 5). Further, k2 is measured on both sides of the mark 16, and a value having a small inclination expressed by an angle is adopted. Further, when the shape of the lightness curve is unstable and there are a plurality of the “intersections between the lightness curve and Bt”, the intersection closest to the mark 16 is adopted.

ΔB (PI) indicates the difference between the top average value Bt and the bottom average value Bb of the lightness curve for the polyimide before being bonded to a metal foil such as a copper foil.
In the image taken with the CCD camera, the brightness is high in the portion where the mark 16 is not attached, but the brightness decreases as soon as the end of the mark 16 is reached. If the visibility of the polyimide substrate is good, such a lowered state of brightness is clearly observed. On the other hand, if the visibility of the polyimide substrate is poor, the brightness is not suddenly lowered from “high” to “low” at the end of the mark 16 at a stretch, but the state of decline is moderate and the state of decline in brightness is not good. It becomes clear.

The present invention is based on such knowledge, the polyimide substrate from which the metal foil such as the surface-treated copper foil is bonded and removed, the printed matter with the mark 16 placed on the bottom, and photographed with a CCD camera over the polyimide substrate. The inclination represented by the angle of the lightness curve near the end of the mark 16 drawn in the observation point-lightness graph obtained from the image of the mark part, more specifically, the top average value Bt and bottom average value Bb of the lightness curve A ratio ΔB (ΔB = Bt−Bb), a ratio of ΔB / ΔB (PI), and a slope k1 expressed by an angle of a lightness curve in a depth range of 0.4ΔB to 0.6ΔB with respect to Bt as a whole. Evaluation makes it possible to accurately evaluate the visibility of the transparent substrate. k1 is preferably 65 ° or more, and more preferably 87 ° or less. The upper limit of k1 is preferably 87 ° or less, more preferably 85 ° or less, and even more preferably 83 ° or less. When k1 exceeds 87 °, the peel strength may be reduced. The upper limit of ΔB / ΔB (PI) need not be specified, but is, for example, 1.70 or less, or 1.50 or less, or 1.40 or less.

Further, in the observation point-lightness graph prepared by the observation point-lightness graph preparation means of the computer 12 from the image obtained by the photographing means 11, the depth from the intersection of the lightness curve and Bt to 0.1 ΔB on the basis of Bt. You may evaluate that the visibility in which the inclination k2 represented by the angle of the lightness curve in a range becomes 30 degrees or more is further favorable. According to such a configuration, the boundary between the mark 16 and the portion that is not the mark 16 becomes clearer, the positioning accuracy is improved, the error due to the mark image recognition is reduced, and the alignment can be performed more accurately. Become. k2 is more preferably 35 ° or more, and more preferably 40 ° or more. The upper limit of k2 is not particularly limited, but is, for example, 87 ° or less, alternatively 82 ° or less, alternatively 77 ° or less, or 72 ° or less.

In the present invention, the roughening treatment means, for example, physical polishing or treatment (mechanical polishing, buffing, sandblasting, etc.) or chemical polishing or treatment (pickling, roughening plating ( It refers to a treatment for increasing the irregularities on the surface of the metal foil by performing plating or the like for electrodeposition of roughened particles)). In the present invention, the surface treatment means a physical or chemical treatment on the surface of the metal foil such as roughening treatment, wet plating treatment, dry plating treatment (including sputtering treatment and vapor deposition treatment), chemical polishing treatment, mechanical polishing treatment, etc. A process that performs processing.

Also, the visibility of the transparent substrate can be efficiently and accurately evaluated by causing the computer to execute the processing procedure as described above as a program.

Furthermore, by using this program recorded on a recording medium such as an optical or magnetic disk so that it can be read by a computer, this program can be realized on other computers, and the same effects as the above-described processing procedure can be obtained. .

(Laminate Positioning Device, Laminate Positioning Method, Laminate Positioning Program, and Recording Medium)
FIG. 6 is a schematic diagram of a positioning device 20 for a laminate according to an embodiment of the present invention. The laminated body positioning device 20 according to the embodiment of the present invention includes an imaging unit 21 that images a mark 26 existing in a laminated body 27 of metal and resin provided on a stage 25 through a resin, and an imaging unit. Computer 22 that performs various processes based on image signals from 21, display means 23 that displays predetermined images and the like based on various signals from computer 22, and illumination that irradiates light on laminated body 27 on the stage Means 24.

The form of the laminate 27 of metal and resin is not particularly limited as long as it is configured by bonding a metal to a resin. As a specific example of the laminate 27 of metal and resin in the present invention, copper or the like is used on at least one surface of a resin such as polyimide, which is used to electrically connect the main body substrate and the attached circuit board. In an electronic device composed of a flexible printed circuit board on which a metal wiring is formed, a laminate is produced by accurately positioning the flexible printed circuit board and crimping the flexible printed circuit board to the wiring ends of the main circuit board and the attached circuit board. Can be mentioned. That is, in this case, the laminate 27 is a laminate in which the wiring end portions of the flexible printed circuit board and the main body substrate are bonded together by pressure bonding, or the wiring edge portions of the flexible printed circuit board and the circuit board are bonded together by pressure bonding. The resulting laminate is obtained. The laminate 27 has a part of the metal wiring and a mark formed of a separate material. The position of the mark is not particularly limited as long as it can be photographed by the photographing means 21 such as a CCD camera through the resin constituting the laminated body 27.

The photographing means 21 includes an imaging device, an image processing unit configured with an image processing circuit to which an output of the imaging device is input, a control unit configured with a control circuit that controls the image processing unit, a lens, and the like. Equipped with an optical system. As the photographing means 21, for example, a CCD camera or the like can be used. The photographing means 21 obtains an image by photographing the mark 26 present in the laminated body 27 provided on the stage 25 through the resin of the laminated body.

The computer 22 performs various processes based on the image signal from the imaging means 21. The computer 22 measures the lightness of each observation point along the direction intersecting the direction in which the observed mark 26 extends with respect to the image signal from the imaging means 21, and creates an observation point-lightness graph. And positioning means for determining the position of the laminated body 27 by the inclination of the brightness curve generated from the end of the mark 26 to the portion where the mark 26 is not present in the observation point-lightness graph. The observation point-lightness graph creating means may measure the lightness of each observation point along the direction perpendicular to the direction in which the observed mark 26 extends to create the observation point-lightness graph.

The computer 22 further includes smoothing processing means for reducing variations in lightness of the image obtained by photographing by the photographing means 21, and the observation point-lightness graph creating means uses the lightness after the smoothing processing to observe point-lightness. A graph may be created.

The computer 22 includes a memory as a storage means. In this memory, the digitized image from the imaging means 21, the observation point-lightness graph creation formula, the positioning formula, the evaluation value at each stage, and the like are recorded (so-called stored) so as to be readable by a computer.

The display means 23 displays a predetermined image such as an observation point-lightness graph, a position evaluation result, a numerical value, and the like based on various signals from the computer 22.

Next, a positioning method using the laminated body positioning apparatus 20 according to the above embodiment will be described with reference to a flowchart shown in FIG. 7 is an embodiment of a positioning method using the laminate positioning device 20 according to the present invention, and an evaluation method that can be realized by the positioning device 20 of the present invention is shown in the flowchart of FIG. It is not limited to things. In particular, the smoothing process is performed before creating the observation point-lightness graph for the image obtained by shooting in FIG. 7, but the present invention is not limited to this. For example, after the observation point-lightness graph is created, smoothing processing is performed. You may go.
In the positioning method using the laminated body positioning device 20, the image 26 is photographed by the photographing means 21 over the mark 26 existing in the laminated body 27 of metal and resin provided on the stage 25. The signal of the image photographed by the photographing means 21 is sent to the computer 22. The observation point-lightness graph preparation means of the computer 22 measures the lightness of each observation point along the direction perpendicular to the direction in which the observed mark 26 extends with respect to the image signal from the image pickup means 21, thereby observing point-lightness graph. Is made. The positioning means of the computer 22 evaluates the position of the laminated body 27 based on the slope of the brightness curve generated from the end of the mark 26 to the portion where the mark 26 is not present in the observation point-lightness graph.

The positioning means of the computer 22 is produced by attaching the surface-treated metal foil to at least one surface of the polyimide substrate from the surface side subjected to surface treatment such as roughening treatment, and then removing the metal foil by etching. The difference ΔB (ΔB = Bt−Bb) between the top average value Bt and the bottom average value Bb of the brightness curve generated from the end portion of the mark 26 to the portion where the mark 26 is not provided on the polyimide substrate, and ΔB / ΔB (PI) Positioning can be performed using the following ratio and the slope k1 represented by the angle of the brightness curve in a predetermined depth range with reference to Bt. Further, the visibility evaluation means of the computer 22 may further use the inclination k2 expressed by the angle of the lightness curve in the depth range from the intersection of the lightness curve and Bt to 0.1 ΔB with reference to Bt for evaluation. . With such a configuration, the position of the mark 26 can be detected, and the laminate 27 of metal and resin can be positioned based on the detected position of the mark 26.
The definition of Bt, Bb, k1, and k2 is as described in the visibility evaluation of the transparent base material, and according to such a positioning method, the boundary between the mark 26 and the part that is not the mark 26 is clearer. Therefore, positioning accuracy is improved, errors due to mark image recognition are reduced, and more accurate alignment can be performed. For example, when the value of ΔB (PI), ΔB / ΔB (PI), k1, or k2 is within a predetermined range, the position detecting device can determine that the mark 26 exists at the position. . Specifically, for example, ΔB (PI) is 20 or more and 33 or less, the ratio of ΔB / ΔB (PI) is 0.7 or more, k1 is 65 ° or more, further 87 ° or less, or k2 is 30 °. In such a case, the determination that the mark 26 exists at the position can be made by a device that detects the position.

The computer 22 further includes smoothing processing means for reducing variations in lightness of the image obtained by photographing by the photographing means 21, and the observation point-lightness graph creating means uses the lightness after the smoothing processing to observe point-lightness. It is preferable to create a graph. By performing smoothing processing by the smoothing processing means on the data (original waveform) including lightness noise obtained from the image obtained by photographing by the photographing means 21, the brightness variation is reduced, so that the laminate It becomes possible to evaluate the position of 27 more correctly. The smoothing processing by the smoothing processing means can be performed by various smoothing programs. For example, smoothing processing by a second-third order polynomial fitting method, smoothing processing by Fourier transform, or smoothing processing by a moving average method is used. be able to.

It should be noted that, for the image obtained by the photographing by the photographing means 21, an observation point-lightness graph of data (original waveform) including the lightness noise may be prepared in advance before performing the lightness smoothing process.

The laminated body positioning device 20 may further include an alignment means (not shown) for aligning the laminated body (including a copper-resin laminated body and a printed wiring board) whose position has been determined. Examples of the positioning means include a moving device and a moving means that can move the stacked body. As a moving device or moving means, for example, a conveyor such as a belt conveyor or a chain conveyor, a moving device or moving means equipped with an arm mechanism, a moving device or moving means that moves by suspending a laminate using gas, a substantially cylindrical shape Moving devices and moving means (including rollers and bearings) that move the laminate by rotating objects such as, moving devices and moving means that use hydraulic pressure as a power source, moving devices and moving means that use air pressure as a power source, Using a moving device or moving means having a stage such as a moving device or moving means using a motor as a power source, a gantry moving linear guide stage, a gantry moving air guide stage, a stack type linear guide stage, or a linear motor drive stage Also good. Moreover, you may use a well-known moving apparatus and a moving means as a moving apparatus or a moving means.

Note that the positioning device 20 according to the embodiment of the present invention may have a surface mounting machine, or the positioning device according to the embodiment of the present invention may be installed in the surface mounting machine.

Further, in the positioning device 20 according to the embodiment of the present invention, the printed wiring having a resin plate and a circuit provided on the resin plate, the laminate of the metal and the resin positioned by the positioning device. It may be a plate. In that case, the mark may be the circuit.

Also, the positioning of the laminate can be efficiently and accurately evaluated by causing the computer to execute the processing procedure as described above as a program.

In the present invention, “positioning” includes “detecting the position of a mark or an object”. In the present invention, “alignment” includes “after detecting the position of a mark or object, moving the mark or object to a predetermined position based on the detected position”.

The printed wiring board may be manufactured by positioning the printed wiring board with the printed wiring board positioning device of the present invention and mounting the components on the positioned printed wiring board. Further, the printed wiring board positioning device of the present invention positions the printed wiring board, aligns the positioned printed wiring board, and mounts the components on the aligned printed wiring board. May be manufactured. Thereby, components, such as an electronic component, can be mounted | worn in the exact position of a printed wiring board.

Further, the printed wiring board may be manufactured by positioning the printed wiring board with the printed wiring board positioning device of the present invention and connecting another printed wiring board to the positioned printed wiring board. Further, the printed wiring board positioning device of the present invention positions the printed wiring board, aligns the positioned printed wiring board, and connects another printed wiring board to the aligned printed wiring board. A printed wiring board may be manufactured. Thereby, another printed wiring board can be connected to an accurate position on the printed wiring board to be connected. Here, the “connection” may be an electrical connection (for example, soldering), or may be a connection using an adhesive or the like, which is not an electrical connection.
In the present invention, the “printed wiring board” includes a printed wiring board and a printed board on which components are mounted.

If the printed wiring board is positioned using the program or positioning device according to the embodiment of the present invention, the printed wiring board can be positioned more accurately. Therefore, when one printed wiring board is connected to another printed wiring board or when a component is mounted on one printed wiring board, it is considered that the connection failure is reduced and the yield is improved. Note that positioning of the printed wiring board using this program requires soldering, connection through an anisotropic conductive film (Anisotropic Conductive Film, ACF), anisotropic conductive paste (Anisotropic Conductive Paste, ACP). When connecting one printed wiring board and another printed wiring board or mounting a component on one printed wiring board in a known connection method such as connection via an adhesive or conductive adhesive Can also be applied.

(Copper foil surface state evaluation device, copper foil surface state evaluation method, copper foil surface state evaluation program, and recording medium)
FIG. 10 is a schematic diagram of an evaluation apparatus 10 ′ for the surface state of a copper foil according to an embodiment of the present invention. The copper foil surface state evaluation apparatus 10 ′ according to the embodiment of the present invention photographs the mark 16 ′ existing under the transparent base material 17 ′ provided on the stage 15 ′ through the transparent base material 17 ′. Photographing means 11 ', a computer 12' that performs various processes based on image signals from the imaging means 11 ', and a display means 13' that displays predetermined images and the like based on various signals from the computer 12 '. And an illuminating means 14 ′ for irradiating light onto the transparent substrate 17 ′ and the mark 16 ′ on the stage. The transparent substrate 17 ′ to be evaluated in the present invention is not particularly limited, and may be a resin substrate such as glass or polyimide as long as it is transparent. In the present invention, the term “transparent” includes light transparency. The mark in the present invention may be a mark printed on a printed matter such as paper, or may be a copper wiring, and may take any form as long as it is a mark serving as a mark. The mark may be a printed material, a metal, an inorganic material, an organic material, or any mark. If the mark is a line, it is easy to create an observation point-lightness graph by measuring the lightness of each observation point along the direction crossing the observed mark in the image obtained by photographing. .

The flexible printed wiring board (FPC) is subjected to processing such as bonding to a liquid crystal substrate and mounting of an IC chip. The alignment at this time is the resin insulation layer that remains after etching the copper foil of the copper-clad laminate. The visibility of the resin insulating layer is important because it is performed through a positioning pattern that is visible through the screen. And evaluation of the surface state of the copper foil which affects the visibility of such a resin insulation layer is needed. In the present invention, for the efficient and accurate visibility evaluation of such a resin insulating layer and the evaluation of the surface state of the copper foil, in the present invention, at least one surface is subjected to a surface treatment such as a roughening treatment. After the surface-treated metal foil is bonded to at least one surface of the transparent substrate from the surface side subjected to the surface treatment such as the roughening treatment, the metal foil is removed by etching. Although the said metal foil is not specifically limited, Copper foil, aluminum foil, nickel foil, copper alloy foil, nickel alloy foil, aluminum alloy foil, stainless steel foil, iron foil, iron alloy foil, etc. can be used.

The photographing means 11 ′ is composed of an imaging device, an image processing circuit configured with an image processing circuit to which an output of the imaging device is input, a control unit configured with a control circuit that controls the image processing unit, etc., a lens, and the like. Provided with an optical system. For example, a CCD camera or the like can be used as the photographing unit 11 '. The photographing unit 11 ′ photographs the mark 16 ′ existing under the transparent base material 17 ′ provided on the stage 15 ′ through the transparent base material 17 ′ to obtain an image.

The computer 12 'performs various processes based on the image signal from the imaging means 11'. The computer 12 ′ measures the lightness of each observation point along the direction intersecting the direction in which the observed mark 16 ′ extends with respect to the image signal from the imaging means 11 ′, and creates an observation point—lightness graph— In the lightness graph preparation means and the observation point-lightness graph, the visibility of the transparent base material 17 ′ is evaluated by the inclination of the lightness curve generated from the end of the mark 16 ′ to the portion where the mark 16 ′ is not present, and the visibility is evaluated. And a copper foil surface state evaluating means for evaluating the surface state of the copper foil based on the result. The observation point-lightness graph creating means may measure the lightness of each observation point along the direction perpendicular to the direction in which the observed mark 16 ′ extends to create the observation point-lightness graph.

The computer 12 ′ further includes smoothing processing means for reducing variations in brightness of an image obtained by photographing by the photographing means 11 ′, and the observation point-lightness graph creating means uses the lightness after the smoothing processing to observe the observation point. -A brightness graph may be produced.

Further, the mark 16 ′ existing under the transparent substrate 17 ′ is a line-shaped mark 16 ′ printed on a printed material laid under the transparent substrate 17 ′. For an image obtained by photographing, the brightness at each observation point may be measured along a direction perpendicular to the direction in which the observed line-shaped mark 16 ′ extends, to create an observation point-lightness graph.

The computer 12 'includes a memory as storage means. In this memory, the digitized image from the imaging means 11 ′, observation point-brightness graph preparation formula, visibility evaluation formula, copper foil surface condition evaluation formula, evaluation value at each stage, etc. can be read by a computer. It is recorded (so-called storage).

The display means 13 'displays a predetermined image such as an observation point-brightness graph, a visibility evaluation result, and a copper foil surface state evaluation result, numerical values, and the like based on various signals from the computer 12'.

Next, a copper foil surface state evaluation method using the copper foil surface state evaluation apparatus 10 ′ according to the above embodiment will be described with reference to the flowchart shown in FIG. 11. In addition, the flowchart shown in FIG. 11 is one Embodiment of the evaluation method of the surface state of the copper foil using the evaluation apparatus 10 'for the surface state of the copper foil according to the present invention, and the evaluation of the surface state of the copper foil of the present invention. The evaluation method that can be realized by the apparatus 10 ′ is not limited to that shown in the flowchart of FIG. In particular, in FIG. 11, the smoothing process is performed before the observation point-lightness graph is created for the image obtained by photographing. However, the present invention is not limited to this, and for example, after the observation point-lightness graph is created. You may go.

In the copper foil surface state evaluation method using the copper foil surface state evaluation apparatus 10 ', first, a surface-treated metal foil having at least one surface subjected to a surface treatment such as a roughening treatment is subjected to a roughening treatment or the like. A transparent base material 17 ′ prepared by removing the metal foil by etching after being attached to at least one surface of the transparent base material from the surface side subjected to the surface treatment is prepared. Next, the mark 16 'existing under the transparent base material 17 is photographed by the photographing means 11' through the transparent base material 17 '. The signal of the image photographed by the photographing means 11 'is sent to the computer 12'. The observation point-lightness graph creating means of the computer 12 ′ measures the lightness of each observation point along the direction perpendicular to the direction in which the observed mark 16 ′ extends with respect to the image signal from the image pickup means 11 ′. -Create a brightness graph. The surface condition evaluation means for the copper foil of the computer 12 ′ evaluates the visibility of the transparent base material 17 ′ by the inclination of the brightness curve generated from the end of the mark 16 ′ to the portion without the mark 16 in the observation point-lightness graph. Then, based on the visibility evaluation result, the surface state of the surface-treated metal foil bonded to the transparent substrate 17 ′ is evaluated. Conventionally, unless actually produced on the production line, it was impossible to determine whether or not the marks provided for alignment etc. could be seen through the transparent base material, and there was a problem in terms of production cost . However, by using the copper foil surface state evaluation apparatus 10 ′ according to the present invention, the above-described configuration easily and efficiently evaluates the visibility of the transparent substrate 17 ′ even in the laboratory alone, thereby efficiently. It becomes possible to accurately evaluate the surface state of the copper foil. For example, when the visibility evaluation result of the transparent base material 17 ′ is good, it can be evaluated that the surface state of the copper foil is good as it is.

When a polyimide substrate is used as the transparent substrate 17 ′ to be evaluated in the present invention, the polyimide substrate has a thickness of 50 μm, and from the end of the mark 16 ′ on the polyimide substrate before being bonded to the metal foil. The difference ΔB (PI) [ΔB (PI) = Bt−Bb] between the top average value Bt and the bottom average value Bb of the brightness curve generated over the portion without the mark 16 ′ may be 20 or more and 33 or less. . When a polyimide substrate is used as the transparent base material 17 ′ to be evaluated in the present invention, the polyimide substrate has a thickness of 50 μm and the end of the mark 16 ′ on the polyimide substrate before being bonded to the metal foil. The difference ΔB (PI) [ΔB (PI) = Bt−Bb] between the top average value Bt and the bottom average value Bb of the brightness curve generated from the part to the part without the mark 16 ′ is 50 to 65 Also good.

The surface condition evaluation means for the copper foil of the computer 12 ′ is obtained by bonding the surface-treated metal foil to at least one surface of the polyimide substrate from the surface-treated surface side subjected to surface treatment such as roughening treatment, and then etching. The difference ΔB (ΔB = Bt−Bb) between the top average value Bt and the bottom average value Bb of the brightness curve generated from the end of the mark 16 ′ to the portion without the mark 16 ′ for the polyimide substrate manufactured by removing the metal foil ), A ratio of ΔB / ΔB (PI), and a slope k1 represented by an angle of the brightness curve in a predetermined depth range with reference to Bt.

Further, the surface condition evaluating means for the copper foil of the computer 12 ′ is the difference ΔB (ΔB = Bt) between the top average value Bt and the bottom average value Bb of the brightness curve generated from the end of the mark 16 ′ to the portion where the mark 16 ′ is not present. -Bb) is 20 or more and 33 or less, the ratio of ΔB / ΔB (PI) is 0.7 or more, and is represented by the angle of the brightness curve in the depth range of 0.4ΔB to 0.6ΔB with respect to Bt. The case where the tilt k1 is 65 ° or more is determined to be good, the case where it is 87 ° or less is determined to be better, and the surface condition of the copper foil is good when the visibility evaluation is good You may determine that there is.

Further, the surface condition evaluation means for the copper foil of the computer 12 ′ further evaluates the inclination k2 expressed by the angle of the lightness curve in the depth range from the intersection of the lightness curve and Bt to 0.1ΔB with reference to Bt. It may be used. Furthermore, it may be determined that the case where k2 is 30 ° or more is further favorable, and the case where the visibility evaluation is good is determined that the surface state of the copper foil is good.
According to such an evaluation apparatus, the surface state of the copper foil can be evaluated efficiently and more accurately.

The computer 12 ′ further includes smoothing processing means for reducing variations in brightness of an image obtained by photographing by the photographing means 11 ′, and the observation point-lightness graph creating means uses the lightness after the smoothing processing to observe the observation point. -It is preferable to produce a lightness graph. Since the smoothing processing by the smoothing processing means is performed on the data (original waveform) including brightness noise obtained from the image obtained by the photographing by the photographing means 11 ′, the variation in the brightness is reduced. The visibility of the base material 17 ′ can be more accurately evaluated, and thereby the surface state of the copper foil can be more accurately evaluated. The smoothing processing by the smoothing processing means can be performed by various smoothing programs. For example, smoothing processing by a second-third order polynomial fitting method, smoothing processing by Fourier transform, or smoothing processing by a moving average method is used. be able to. The smoothing process may be performed using various known smoothing programs. Further, the smoothing process of the brightness data may be performed for both the portion having the mark 16 ′ and the portion without the mark 16 ′, or may be performed on the portion having the mark 16 ′, or may be performed on the portion without the mark 16 ′. It may be done automatically.
Note that an observation point-lightness graph of data (original waveform) including lightness noise may be prepared in advance before performing the lightness smoothing process on the image obtained by the photographing by the photographing unit 11 ′. .

Here, “top average value Bt of the lightness curve”, “bottom average value Bb of the lightness curve”, “slope k1 represented by the angle of the lightness curve”, “slope k2 represented by the angle of the lightness curve”, “ The definitions of “ΔB” and “ΔB (PI)” are the same as those shown in the above-described transparent substrate visibility evaluation apparatus and visibility evaluation method.

In the present invention, the polyimide substrate from which the metal foil such as the surface-treated copper foil is pasted and removed is placed on the printed material with the mark 16 ′, and the image of the mark portion taken by the CCD camera through the polyimide substrate is used. The slope represented by the angle of the brightness curve near the end of the mark 16 ′ drawn in the obtained observation point-lightness graph, more specifically, the difference ΔB (ΔB between the top average value Bt and the bottom average value Bb of the brightness curve = Bt−Bb), the ratio of ΔB / ΔB (PI), and the slope k1 expressed by the angle of the lightness curve in the depth range of 0.4ΔB to 0.6ΔB with reference to Bt, is comprehensively evaluated. Therefore, it is possible to accurately evaluate the visibility of the transparent substrate, thereby enabling accurate evaluation of the surface state of the copper foil. k1 is preferably 65 ° or more, more preferably 87 ° or less. The upper limit of k1 is preferably 87 ° or less, more preferably 85 ° or less, and even more preferably 83 ° or less. When k1 exceeds 87 °, the peel strength may be reduced. The upper limit of ΔB / ΔB (PI) need not be specified, but is, for example, 1.70 or less, or 1.50 or less, or 1.40 or less. When the values of k1 and ΔB / ΔB (PI) are within the above-mentioned range, it is determined that the surface state of the copper foil is good from the viewpoint of ensuring the visibility of the resin laminated on the copper foil. May be.

Further, in the observation point-lightness graph prepared by the observation point-lightness graph preparation means of the computer 12 'from the image obtained by the photographing means 11', from the intersection of the lightness curve and Bt to 0.1 ΔB on the basis of Bt. If the slope k2 expressed by the angle of the lightness curve in the depth range is 30 ° or more, it may be further evaluated that the visibility is good, and thereby the surface state of the copper foil may be evaluated as good. . According to such a configuration, the boundary between the mark 16 ′ and the portion that is not the mark 16 ′ becomes clearer, the positioning accuracy is improved, the error due to the mark image recognition is reduced, and the alignment can be performed more accurately. It becomes like this. k2 is more preferably 35 ° or more, and more preferably 40 ° or more. The upper limit of k2 is not particularly limited, but is, for example, 87 ° or less, alternatively 82 ° or less, alternatively 77 ° or less, or 72 ° or less. When the value of k2 is within the above-mentioned range, it may be determined that the surface state of the copper foil is good from the viewpoint of ensuring the visibility of the resin laminated on the copper foil.

In the present embodiment, the evaluation of the surface state of the copper foil has been described. However, the present invention is not limited to this, and the same evaluation can be made even if the surface state of the metal foil is used. Although the said metal foil is not specifically limited, Copper foil, aluminum foil, nickel foil, copper alloy foil, nickel alloy foil, aluminum alloy foil, stainless steel foil, iron foil, iron alloy foil, etc. can be used.

(Transparent substrate visibility evaluation method)
The transparent substrate visibility evaluation method of the present invention is to prepare a mark and a transparent substrate provided on the mark, photograph the mark with a CCD camera over the transparent substrate, and observe an image obtained by photographing. The brightness at each observation point is measured along the direction crossing the marked mark, and an observation point-lightness graph is created. In the observation point-lightness graph, the slope of the lightness curve that occurs from the end of the mark to the part without the mark This is a method for evaluating the visibility of a transparent substrate.
Conventionally, unless actually produced on the production line, it was impossible to determine whether or not the marks provided for alignment etc. could be seen through the transparent base material, and there was a problem in terms of production cost . However, in the present invention, with such a configuration, it is possible to easily and efficiently evaluate the visibility of the transparent substrate easily and efficiently even in the laboratory alone. In the observation point-lightness graph, when the slope of the lightness curve generated from the end of the mark to the portion without the mark is expressed as an angle, and the visibility of the transparent substrate is evaluated by the angle, the visibility of the transparent substrate is more efficiently observed. It is possible to accurately evaluate the property, which is preferable.

The shape of the mark is not particularly limited, but if it is a line-shaped mark, the brightness of each observation point is measured along the direction crossing the observed mark, and an observation point-lightness graph is obtained. It is easy to create and is preferable.

The flexible printed wiring board (FPC) is subjected to processing such as bonding to a liquid crystal substrate and mounting of an IC chip. The alignment at this time is the resin insulation layer that remains after etching the copper foil of the copper-clad laminate. The visibility of the resin insulating layer is important because it is performed through a positioning pattern that is visible through the screen. For efficient and accurate visibility evaluation of such a resin insulation layer, in the present invention, the transparent base material is a surface-treated metal foil having at least one surface roughened before being provided on the mark. After bonding to at least one surface of the transparent base material from the surface of the roughening treatment, the metal foil may be removed by etching. Moreover, the transparent base material may be produced by attaching the surface-treated metal foil to both surfaces of the transparent base material from the roughened surface side and then performing etching to remove the metal foil on both surfaces.

The metal foil used in the present invention is not particularly limited, and copper foil, aluminum foil, nickel foil, copper alloy foil, nickel alloy foil, aluminum alloy foil, stainless steel foil, iron foil, iron alloy foil and the like can be used.

The transparent substrate to be evaluated in the present invention is not particularly limited, and may be a glass or resin substrate as long as it is transparent. In the present invention, the term “transparent” includes light transparency. Here, a polyimide substrate will be described as an example of the transparent base material.

When a polyimide substrate is used as the transparent base material to be evaluated in the present invention, the polyimide substrate has a thickness of 50 μm, and the mark from the end of the mark on the polyimide substrate before being bonded to the metal foil. It is preferable to use a lightness curve having a difference ΔB (PI) [ΔB (PI) = Bt−Bb] of 20 or more and 33 or less between the top average value Bt and the bottom average value Bb of the brightness curve generated over the portion where there is no mark. And after bonding together the surface-treated copper foil in which the roughening particle was formed by the roughening process on at least one surface from the roughening process surface side on both surfaces of the said polyimide substrate, the copper foil of both surfaces is removed by an etching. . Next, with respect to the line-shaped mark and the polyimide substrate provided on the mark, the mark is photographed with a CCD camera through the polyimide substrate, and the observed line-shaped mark extends in the image obtained by the photographing. The brightness at each observation point is measured along the direction perpendicular to the observation point, and the observation point-lightness graph is created. In the observation point-lightness graph, the lightness curve generated from the end of the mark to the part without the mark is represented by the angle. The visibility of the polyimide can be evaluated by the tilt.

The method for evaluating the visibility of polyimide by the inclination represented by the angle of the brightness curve is based on the difference ΔB (ΔB) between the top average value Bt and the bottom average value Bb of the brightness curve generated from the end of the mark to the portion without the mark. = Bt−Bb), a ratio of ΔB / ΔB (PI), and a slope k1 expressed by an angle of a lightness curve in a predetermined depth range with reference to Bt.

Further, the method for evaluating the visibility of polyimide based on the inclination of the brightness curve described above is based on the difference ΔB (ΔB = Bt− Bb) is 20 or more and 33 or less, the ratio of ΔB / ΔB (PI) is 0.7 or more, and the slope k1 of the brightness curve in the depth range of 0.4ΔB to 0.6ΔB with respect to Bt is You may determine with the case where it becomes 65 degrees or more being favorable. Moreover, you may determine with the case where the inclination k1 of the said lightness curve is 87 degrees or less further.

Further, in an observation point-lightness graph created from an image obtained by photographing, an inclination k2 expressed by an angle of the lightness curve in a depth range from the intersection of the lightness curve and Bt to 0.1 ΔB with respect to Bt is used. Furthermore, you may use for evaluation.
Furthermore, you may determine with the case where k2 becomes 30 degrees or more still better.
According to such an evaluation method, it becomes possible to efficiently and more accurately evaluate the visibility of the transparent substrate.

It is preferable to further perform a smoothing process for reducing variations in brightness on the image obtained by the photographing, and create an observation point-brightness graph using the brightness after the smoothing process. By performing smoothing processing on the data (original waveform) containing lightness noise obtained from the image obtained by shooting, the lightness variation is alleviated, so the visibility of the transparent substrate is accurately evaluated. It becomes possible to do. The smoothing process can be performed by various smoothing programs. For example, a smoothing process using a second-third-order polynomial fitting method, a smoothing process using Fourier transform, a smoothing process using a moving average method, or the like can be used.
Note that an observation point-lightness graph of data (original waveform) including noise of the lightness may be generated in advance before performing the lightness smoothing process on the image obtained by photographing.

(Positioning method of metal / resin laminate)
A method for positioning the laminate of the metal and resin of the present invention will be described. First, a laminate of metal and resin is prepared. The form of the laminate of the metal and the resin is not particularly limited as long as it is configured by bonding the metal to the resin. As a specific example of the laminate of the metal and resin of the present invention, copper or the like is used on at least one surface of a resin such as polyimide, which is used to electrically connect the main body substrate and the attached circuit board, and the circuit board. In an electronic device composed of a flexible printed circuit board on which metal wiring is formed, there is a laminate produced by accurately positioning the flexible printed circuit board and crimping it to the wiring ends of the main circuit board and the attached circuit board. It is done. That is, in this case, the laminate is a laminate in which the wiring end portions of the flexible printed circuit board and the main body substrate are bonded together by pressure bonding, or the wiring edge portions of the flexible printed circuit board and the circuit board are bonded together by pressure bonding. It becomes a laminated body. The laminate has a mark formed of a part of the metal wiring and a separate material. The position of the mark is not particularly limited as long as it can be photographed with a CCD camera through the resin constituting the laminate.

In the layered body thus prepared, the above-mentioned mark is photographed with a CCD camera through the resin of the layered body, and for the image obtained by photographing, the brightness at each observation point along the direction crossing the observed mark Is measured to create an observation point-lightness graph, and the metal / resin laminate is positioned based on the slope of the lightness curve generated from the end of the mark to the portion without the mark. Further, when the inclination of the lightness curve is represented by an angle and the laminate of the metal and the resin is positioned by the angle, the laminate can be positioned more accurately. The angle representing the slope of the lightness curve used here is the difference ΔB (PI), ΔB / ΔB between the top average value Bt and the bottom average value Bb of the lightness curve, as in the above-described visibility evaluation method of the transparent substrate. A ratio composed of (PI), a slope k1 expressed by the angle of the lightness curve in a predetermined depth range based on Bt, and a depth range from the intersection of the lightness curve and Bt to 0.1 ΔB based on Bt The slope k2 expressed by the angle of the brightness curve at can be used. According to such a positioning method, the boundary between the mark and the non-mark portion becomes clearer, the positioning accuracy is improved, the error due to the mark image recognition is reduced, and the alignment can be performed more accurately. . For example, when the value of ΔB (PI) is within a predetermined range, the device that detects the position can determine that the mark exists at the position. Specifically, for example, when the resin constituting the laminate is a polyimide substrate with a thickness of 50 μm, the top of the lightness curve generated from the end of the mark to the portion without the mark on the polyimide substrate before being bonded to the metal foil When the difference ΔB (PI) [ΔB (PI) = Bt−Bb] between the average value Bt and the bottom average value Bb is 20 or more and 33 or less, the determination that the mark is present at the position is detected. The device can do it. As described above, if the apparatus and method perform up to the determination whether or not the mark exists at the position, the apparatus and method include an apparatus and a method for determining whether or not the mark included in the stacked body exists. I can say that. At this time, the apparatus for determining whether or not the mark included in the laminate is present is based on the inclination of the brightness curve generated from the end of the mark to the part where there is no mark in the observation point-lightness graph. A determination means for determining whether or not is provided. In addition, in this way, if the apparatus and method perform up to the step of detecting the position of the mark, the apparatus and method can be said to be an apparatus and method for detecting the position of the mark included in the stacked body. At this time, the apparatus for detecting the position of the mark included in the stack includes detection means for detecting the position of the mark based on the inclination of the brightness curve generated from the end of the mark to the portion without the mark in the observation point-lightness graph. Prepare.

It is preferable to further perform a smoothing process for reducing variations in brightness on the image obtained by the photographing, and create an observation point-brightness graph using the brightness after the smoothing process. To accurately evaluate the positioning of the stack because the variation in brightness is reduced by performing smoothing processing on the data (original waveform) containing brightness noise obtained from the image obtained by shooting. Is possible. The smoothing process can be performed by various smoothing programs. For example, a smoothing process using a second-third-order polynomial fitting method, a smoothing process using Fourier transform, a smoothing process using a moving average method, or the like can be used.
Note that an observation point-lightness graph of data (original waveform) including noise of the lightness may be generated in advance before performing the lightness smoothing process on the image obtained by photographing.

When the printed wiring board is positioned using the positioning method according to the embodiment of the present invention, the printed wiring board can be positioned more accurately. Therefore, when one printed wiring board is connected to another printed wiring board or when a component is mounted on one printed wiring board, it is considered that the connection failure is reduced and the yield is improved. In addition, positioning of this printed wiring board can be performed by soldering, connection via an anisotropic conductive film (Anisotropic Conductive Film, ACF), connection via an anisotropic conductive paste (Anisotropic Conductive Paste, ACP) or Applicable when connecting one printed wiring board and another printed wiring board or mounting parts on one printed wiring board in a known connection method such as connection via conductive adhesive. Can do.

In addition, the positioning method of the laminated body which concerns on embodiment of this invention moves the laminated body (including the laminated body of copper and resin, and a printed wiring board) which moved the position, and performs alignment of a laminated body Good. As the alignment means, for example, a conveyor such as a belt conveyor or a chain conveyor may be used, a moving device provided with an arm mechanism may be used, a moving device that moves the laminate by floating using gas, Moving means may be used, moving devices and moving means (including rollers and bearings) that move the laminate by rotating an object such as a substantially cylindrical shape, moving devices and moving means that use hydraulic power as a power source, air pressure Stages such as moving devices and moving means powered by motors, moving devices and moving means powered by motors, gantry moving linear guide stages, gantry moving air guide stages, stacked linear guide stages, linear motor drive stages, etc. A moving device, a moving means, or the like may be used. Moreover, you may use a well-known moving means.

The positioning method according to the embodiment of the present invention may use a surface mounter or a chip mounter.
Further, in the positioning method according to the embodiment of the present invention, the laminate of the metal and the transparent substrate includes a transparent substrate plate and a circuit provided on the transparent substrate plate. It may be. In that case, the mark may be the circuit.

The printed wiring board may be manufactured by positioning the printed wiring board by the positioning method of the present invention, and mounting the components on the positioned printed wiring board. Further, the printed wiring board is positioned by the printed wiring board positioning method of the present invention, the positioned printed wiring board is aligned, and a component is mounted on the aligned printed wiring board. May be manufactured. Thereby, components, such as an electronic component, can be mounted | worn in the exact position of a printed wiring board.

Further, the printed wiring board may be manufactured by positioning the printed wiring board by the positioning method of the present invention and connecting another printed wiring board to the positioned printed wiring board. Further, the printed wiring board is positioned by the printed wiring board positioning method of the present invention, the positioned printed wiring board is aligned, and another printed wiring board is connected to the aligned printed wiring board. A printed wiring board may be manufactured. Thereby, another printed wiring board can be connected to an accurate position on the printed wiring board to be connected. Here, the “connection” may be an electrical connection (for example, soldering), or may be a connection using an adhesive or the like, which is not an electrical connection.
In the present invention, the “printed wiring board” includes a printed wiring board and a printed board on which components are mounted.

Further, the laminate of the metal and the transparent base material positioned in the present invention may be a printed wiring board having a transparent base plate and a circuit provided on the transparent base plate. In that case, the mark may be the circuit. The circuit also includes wiring.

As examples A1 to A23, examples B1 to B13, examples a1 to a23, and examples b1 to b13, various copper foils were prepared, and one surface was subjected to the conditions described in Table 1 as a roughening treatment. The plating process was performed.

After performing the above-described rough plating treatment, Example A1 to Example A13, Example A15 to Example A20, Example A22 to Example A23, Example B2, Example B4, Example B7 to Example B10, Example a1 to Example a13, Example a15 to Example a20, Example a22 to Example a23, Example b2, Example b4, and Example b7 to Example b10 were subjected to the following plating treatment for forming a heat resistant layer and a rust preventive layer.
The conditions for forming the heat-resistant layer 1 are shown below.
Liquid composition: Nickel 5-20 g / L, Cobalt 1-8 g / L
pH: 2-3
Liquid temperature: 40-60 ° C
Current density: 5 to 20 A / dm ²
Coulomb amount: 10-20 As / dm ²
A heat-resistant layer 2 was formed on the copper foil provided with the heat-resistant layer 1. About Example B3, Example B5, Example B6, Example b3, Example b5, and Example b6, the roughening plating process was not performed but this heat-resistant layer 2 was directly formed on the prepared copper foil. The conditions for forming the heat-resistant layer 2 are shown below.
Liquid composition: Nickel 2-30 g / L, Zinc 2-30 g / L
pH: 3-4
Liquid temperature: 30-50 ° C
Current density: 1 to 2 A / dm ²
Coulomb amount: 1 to ^{2 As} / dm ²

On the copper foil which gave the said heat-resistant layers 1 and 2, the antirust layer was further formed. The conditions for forming the rust preventive layer are shown below.
Liquid composition: potassium dichromate 1-10 g / L, zinc 0-5 g / L
pH: 3-4
Liquid temperature: 50-60 ° C
Current density: 0-2A / dm ² (for immersion chromate treatment)
Coulomb amount: 0 to ^{2 As} / dm ² (for immersion chromate treatment)

On the copper foil which gave the said heat-resistant layers 1 and 2 and a rust prevention layer, the weathering layer was further formed. The formation conditions are shown below.
As a silane coupling agent having an amino group, N-2- (aminoethyl) -3-aminopropyltrimethoxysilane (Example A17, Example a17), N-2- (aminoethyl) -3-aminopropyltriethoxysilane (Example A1 to Example A13, Example A15, Example A16, Example a1 to Example a13, Example a15, Example a16), N-2- (aminoethyl) -3-aminopropylmethyldimethoxysilane (Example A18, Example a18), 3-aminopropyltrimethoxysilane (Example A19, Example a19), 3-aminopropyltriethoxysilane (Example A20, Example a20), 3-triethoxysilyl-N- (1,3-dimethyl-butylidene) propylamine ( Example A22, Example a22), N-phenyl-3-aminopropyltrimethoxysilane (Example A23, Example a23), coated and dried Performed to form a weather-resistant layer. These silane coupling agents can be used in combination of two or more.

In addition, the rolled copper foil was manufactured as follows. A copper ingot having the composition shown in Table 2 or 6 was manufactured, and after hot rolling, annealing and cold rolling of a continuous annealing line at 300 to 800 ° C. were repeated to obtain a rolled sheet having a thickness of 1 to 2 mm. This rolled sheet was annealed in a continuous annealing line at 300 to 800 ° C. and recrystallized, and finally cold-rolled to the thickness shown in Table 2 or 6 to obtain a copper foil. “Tough pitch copper” in the “type” column of Table 2 or 6 indicates tough pitch copper standardized in JIS H3100 C1100, and “oxygen-free copper” indicates oxygen-free copper standardized in JIS H3100 C1020. “Tough pitch copper + Ag: 100 ppm” means that 100 mass ppm of Ag is added to tough pitch copper.

The electrolytic copper foil used was an electrolytic copper foil HLP foil manufactured by JX Nippon Mining & Metals. When electrolytic polishing or chemical polishing was performed, the plate thickness after electrolytic polishing or chemical polishing was described.
In Table 2 or 6, “high gloss rolling” means that the final cold rolling (cold rolling after the final recrystallization annealing) was performed at the value of the oil film equivalent. “Normal rolling” means that the final cold rolling (cold rolling after the final recrystallization annealing) was performed at the oil film equivalent value described. “Chemical polishing” and “electropolishing” mean the following conditions.
“Chemical polishing” was performed using an etching solution of 1 to 3% by mass of H ₂ SO ₄ , 0.05 to 0.15% by mass of H ₂ O ₂ , and the remaining water, and the polishing time was 1 hour.
“Electropolishing” is a condition of phosphoric acid 67% + sulfuric acid 10% + water 23%, voltage 10 V / cm ² , and the time shown in Table 2 or 6 (when 10 seconds of electropolishing is performed, the polishing amount is 1 to 2 μm).

For each sample of the example produced as described above, various evaluations were performed as follows using a visibility evaluation apparatus having the same configuration as that shown in FIG.

(1) Inclination of lightness curve Polyimide film with thermosetting adhesive for laminating copper foil (Example A1 to Example A23 and Example B1 to Example B13: Upilex thickness 50 μm, examples a1 to a23 and examples b1 to examples made by Ube Industries) (b13: Kaneka thickness 50 μm) and the copper foil was removed by etching (ferric chloride aqueous solution) to prepare a sample film. Subsequently, a printed material on which a line-shaped black mark was printed was laid under the sample film, and the printed material was photographed with a CCD camera through the sample film. The width of the mark used here was 0.1 to 0.4 mm. Next, in an observation point-lightness graph prepared by measuring the lightness of each observation point along a direction perpendicular to the direction in which the observed line-shaped mark extends for an image obtained by photographing with a computer, The inclination (angle) of the brightness curve generated from the end of the mark to the portion without the mark was measured. FIG. 8 is a schematic diagram showing the configuration of the photographing apparatus used at this time and the method of measuring the slope of the brightness curve. ΔB and slopes k1 and k2 were measured as shown in FIG. One pixel on the horizontal axis corresponds to a length of 10 μm. Then, the ratio of the length of one pixel to one gradation in the lightness curve graph is 3.5: 5 (the length of one pixel in the lightness curve graph: the length of one gradation in the lightness curve graph = 3. The values of k1 and k2 (°) were calculated in a lightness curve graph with 5 (mm): 5 (mm)).

The photographing means includes a CCD camera, a stage (white) on which a polyimide substrate is placed with a marked paper underneath, an illumination power source for irradiating light onto the photographing portion of the polyimide substrate, and a paper with a mark to be photographed. A transporter (not shown) for transporting the evaluation polyimide substrate placed below onto the stage is provided. The main specifications of the photographing means are as follows:
・ Photographing means: Nireco Corporation sheet inspection device Mujken
CCD camera: 8192 pixels (160 MHz), 1024 gradation digital (10 bits)
・ Power supply for lighting: High-frequency lighting power supply (power supply unit x 2)
・ Lighting: Fluorescent lamp (30W)

For the lightness shown in FIG. 8, 0 means “black”, lightness 255 means “white”, and the gray level from “black” to “white” (black and white shading, gray scale) Is divided into 256 gradations for display.
Since the mark used has a small width of 0.1 to 0.4 mm, the brightness curve produced has a V shape as shown in FIG. 4 (a) or a bottom as shown in FIG. 4 (b). It became V type which has.

(2) Evaluation of visibility (resin transparency) and surface condition of copper foil;
Copper foil laminated polyimide film with thermosetting adhesive (Example A1 to Example A23 and Example B1 to Example B13: Ube Industries Upilex thickness 50 μm, Example a1 to Example a23 and Example b1 to Example b13: Kaneka thickness 50 μm) Then, the copper foil was removed by etching (ferric chloride aqueous solution) to prepare a sample film. A printed material (black circle with a diameter of 6 cm) was attached to one surface of the obtained resin layer, and the visibility of the printed material was judged from the opposite surface through the resin layer. “◎” indicates that the outline of the black circle of the printed material is clear when the length is 90% or more of the circumference, and “Clear” indicates that the outline of the black circle is clear when the length is 80% or more and less than 90% of the circumference. “O” (passed above), a black circle with a clear outline of 0 to less than 80% of the circumference and a broken outline were evaluated as “x” (failed). And the evaluation of the said visibility was made into evaluation of the copper foil surface state as it is.

(3) Yield Polyimide film with thermosetting adhesive for laminating copper foil (Example A1 to Example A23 and Example B1 to Example B13: Ube Industries Upilex thickness 50 μm, Example a1 to Example a23 and Example b1 to Example b13: Kaneka The copper foil was etched (ferric chloride aqueous solution) to form a FPC having a circuit width of L / S of 30 μm / 30 μm. After that, an attempt was made to detect a 20 μm × 20 μm square mark with a CCD camera through polyimide. “◎” if 9 or more out of 10 times can be detected, “○” if 7 to 8 times can be detected, “△” if 6 times can be detected, or if 5 times or less can be detected. Is “×”.
The conditions and evaluation of each test are shown in Tables 1-9.

(Evaluation results)
Each of the polyimide substrates of Examples A1 to A23 and B1 to B13, Example a1 to Example a23, and Example b1 to Example b13 can be easily and accurately at the laboratory level without actually being manufactured on the production line. It was possible to evaluate the visibility.
In addition, when a mark having a width as large as 1.0 to 2.0 mm was used instead of the above example, the same test as in the above example was performed, and a diagram with a bottom as shown in FIG. 3 was obtained as a lightness curve. FIG. 9 is a schematic diagram showing the configuration of the photographing means and the method of measuring the slope of the brightness curve when evaluating the slope of the brightness curve when the mark width is 1.0 to 2.0 mm. In this case as well, the same results as in the above example were obtained, and as in the above example, the visibility of the polyimide base material was evaluated easily and accurately at the laboratory level without actually manufacturing it on the manufacturing line. We were able to. The copper foil surface condition is evaluated by applying the visibility evaluations “◎”, “O” (passed above), and “×” (failed) as they are in the table. Could be easily and accurately evaluated.
In addition, when a mark having a width as large as 1.0 to 2.0 mm was used instead of the above example, the same test as in the above example was performed, and a diagram with a bottom as shown in FIG. 3 was obtained as a lightness curve. FIG. 7 is a schematic diagram showing the configuration of the photographing means and the method of measuring the slope of the brightness curve when evaluating the slope of the brightness curve when the mark width is 1.0 to 2.0 mm. In this case as well, the same results as in the above example were obtained, and as in the above example, the visibility of the polyimide substrate was evaluated easily and accurately at the laboratory level without actually producing it on the production line. In addition, the surface condition of the copper foil could be evaluated.

DESCRIPTION OF SYMBOLS 10 Visibility evaluation apparatus of transparent base material 11 Imaging | photography means 12 Computer (observation point-lightness graph preparation means, visibility evaluation means, smoothing processing means)
DESCRIPTION OF SYMBOLS 13 Display means 14 Illumination means 15 Stage 16 Mark 17 Transparent base material 20 Laminate positioning device 21 Imaging means 22 Computer (observation spot-lightness graph preparation means, positioning means, smoothing processing means)
DESCRIPTION OF SYMBOLS 23 Display means 24 Illumination means 25 Stage 26 Mark 27 Laminate 10 'Copper foil surface state evaluation apparatus 11' Image | photographing means 12 'Computer (observation point-lightness graph preparation means, copper foil surface state evaluation means, smoothing processing means )
13 'display means 14' illumination means 15 'stage 16' mark 17 'transparent substrate

Claims

Photographing means for photographing the mark existing under the transparent substrate through the transparent substrate;
Observation point-lightness graph creating means for measuring the brightness of each observation point along the direction intersecting the direction in which the observed mark extends with respect to the image obtained by the photographing, and creating an observation point-lightness graph;
In the observation point-lightness graph, visibility evaluation means for evaluating the visibility of the transparent substrate based on a slope of a lightness curve generated from an end of the mark to a portion without the mark;
The visibility evaluation apparatus of the transparent base material provided with.
2. The transparent substrate according to claim 1, wherein the observation point-lightness graph creating means prepares an observation point-lightness graph by measuring the lightness of each observation point along a direction perpendicular to a direction in which the mark is observed. Visibility evaluation device.
The visibility evaluation unit represents an inclination of a brightness curve generated from an end portion of the mark to a portion without the mark in the observation point-lightness graph, and evaluates the visibility of the transparent substrate by the angle. The visibility evaluation apparatus of the transparent base material of Claim 1 or 2.
For an image obtained by photographing by the photographing means, further comprising a smoothing processing means for reducing variations in brightness,
The visibility evaluation device for a transparent substrate according to any one of claims 1 to 3, wherein the observation point-lightness graph preparation means prepares an observation point-lightness graph using the lightness after the smoothing process.
The mark present under the transparent substrate is a line-shaped mark printed on a printed material laid under the transparent substrate,
The observation point-lightness graph preparation means measures the lightness of each observation point along the direction perpendicular to the direction in which the observed line-shaped mark extends from the image obtained by the photographing, and the observation point-lightness The visibility evaluation device for a transparent substrate according to any one of claims 1 to 4, which produces a graph.
The transparent substrate is bonded to at least one surface of the transparent substrate from the surface-treated surface side of the surface-treated metal foil having at least one surface treated, and then etched to form the metal foil. The visibility evaluation device for a transparent substrate according to any one of claims 1 to 5, which is prepared by removing the transparent substrate.
The visibility evaluation apparatus for a transparent substrate according to any one of claims 1 to 6, wherein the transparent substrate is a polyimide substrate.
The top average value Bt and bottom average of the brightness curve generated from the end of the mark to the non-marked portion of the transparent substrate before being bonded to the metal foil, the thickness of the transparent substrate being 50 μm The transparent substrate visibility evaluation apparatus according to claim 7, wherein a difference ΔB (PI) [ΔB (PI) = Bt−Bb] from the value Bb is 20 or more and 33 or less.
The top average value Bt and bottom average of the brightness curve generated from the end of the mark to the non-marked portion of the transparent substrate before being bonded to the metal foil, the thickness of the transparent substrate being 50 μm 8. The transparent substrate visibility evaluation apparatus according to claim 7, wherein a difference ΔB (PI) [ΔB (PI) = Bt−Bb] from the value Bb is 50 or more and 65 or less.
Visibility evaluation of the transparent substrate by the inclination represented by the angle of the brightness curve,
The mark on the transparent base material produced by attaching the surface-treated metal foil from the surface-treated surface side to at least one surface of the transparent base material and then removing the metal foil by etching. A difference ΔB (ΔB = Bt−Bb) between the top average value Bt and the bottom average value Bb of the brightness curve generated from the end of the mark to the portion where the mark is not present,
A ratio of ΔB / ΔB (PI);
An inclination represented by an angle of the brightness curve in a predetermined depth range based on Bt;
The transparent substrate visibility evaluation apparatus according to any one of claims 7 to 9, which is performed using
The slope represented by the angle of the brightness curve in the predetermined depth range with reference to Bt is the slope k1 represented by the angle of the brightness curve in the depth range of 0.4ΔB to 0.6ΔB with reference to Bt. The visibility evaluation apparatus for a transparent substrate according to claim 10.
Visibility evaluation of the transparent substrate by the inclination represented by the angle of the brightness curve,
The difference ΔB (ΔB = Bt−Bb) between the top average value Bt and the bottom average value Bb of the lightness curve generated from the end of the mark to the portion without the mark for the transparent substrate is 20 or more and 33 or less, or 50 or more and 65 or less,
The ratio of ΔB / ΔB (PI) is 0.7 or more,
12. The visual recognition of the transparent substrate according to claim 11, wherein it is determined that the inclination k1 expressed by the angle of the brightness curve in the depth range of 0.4ΔB to 0.6ΔB with respect to Bt is 65 ° or more is good. Sex evaluation device.
13. The transparent substrate according to claim 12, wherein it is further determined that the slope k1 expressed by the angle of the brightness curve in the depth range of 0.4ΔB to 0.6ΔB with respect to Bt is 87 ° or less. Visibility evaluation device.
The slope k2 expressed by the angle of the lightness curve in a depth range from the intersection of the lightness curve and Bt to 0.1 ΔB with reference to Bt is further used for evaluation. The visibility evaluation device for transparent substrates.
The transparent substrate visibility evaluation apparatus according to claim 14, wherein the case where the k2 is 30 ° or more is determined to be further favorable.
A program for causing a computer to function as the visibility evaluation device for a transparent substrate according to any one of claims 1 to 15.
A computer-readable recording medium on which the program according to claim 16 is recorded.
A laminated body positioning device for positioning a laminated body of metal and resin,
An imaging means for imaging the mark through the resin with respect to the metal-resin laminate having the mark;
Observation point-lightness graph creating means for measuring the brightness of each observation point along the direction intersecting the direction in which the observed mark extends with respect to the image obtained by the photographing, and creating an observation point-lightness graph;
In the observation point-lightness graph, positioning means for determining a position of the stacked body by an inclination of a lightness curve generated from an end portion of the mark to a portion without the mark;
Laminate positioning apparatus comprising:
19. The laminate according to claim 18, wherein the observation point-lightness graph preparation means prepares an observation point-lightness graph by measuring the lightness of each observation point along a direction perpendicular to a direction in which the observed mark extends. Positioning device.
20. The laminate positioning apparatus according to claim 19, further comprising an alignment means for aligning the laminate with the position determined.
The laminate positioning apparatus according to any one of claims 18 to 20, wherein the laminate of the metal and the resin is a printed wiring board having a resin plate and a circuit provided on the resin plate.
The stack positioning apparatus according to claim 21, wherein the mark is the circuit.
A program for causing a computer to function as the laminated body positioning device according to any one of claims 18 to 22.
A computer-readable recording medium on which the program according to claim 23 is recorded.
23. A printed wiring board manufacturing method including a step of positioning a printed wiring board using the positioning device according to claim 21 or 22, and mounting a component on the positioned printed wiring board.
A step of positioning a printed wiring board using the positioning device according to claim 21, aligning the positioned printed wiring board, and mounting a component on the aligned printed wiring board. A method for manufacturing a printed wiring board.
23. A printed wiring board manufacturing method including a step of positioning a printed wiring board using the positioning device according to claim 21 or 22 and connecting another printed wiring board to the positioned printed wiring board.
23. A printed wiring board is positioned using the positioning device according to claim 21 or 22, the positioned printed wiring board is aligned, and another printed wiring board is aligned with the aligned printed wiring board. The manufacturing method of a printed wiring board including the process of connecting.
After bonding the metal foil to at least one surface of the transparent substrate, the metal foil is removed by etching, and the mark present under the transparent substrate after the metal foil is removed by etching is marked with the transparent substrate. Photography means to shoot over,
Observation point-lightness graph creating means for measuring the brightness of each observation point along the direction intersecting the direction in which the observed mark extends with respect to the image obtained by the photographing, and creating an observation point-lightness graph;
In the observation point-lightness graph, the visibility of the transparent substrate is evaluated based on the slope of the brightness curve generated from the end of the mark to the portion where the mark is not present, and the metal foil is based on the visibility evaluation result. Metal foil surface state evaluation means for evaluating the surface state of,
An apparatus for evaluating the surface state of a metal foil comprising:
The observation point-lightness graph creating means measures the lightness of each observation point along the direction perpendicular to the direction in which the observed mark extends from the image obtained by the photographing, and creates an observation point-lightness graph The apparatus for evaluating a surface state of a metal foil according to claim 29.
The metal foil surface state evaluation apparatus according to claim 29 or 30, wherein the metal foil is a copper foil.
After bonding the surface-treated surface side of the surface-treated metal foil to at least one surface of the transparent substrate, the surface-treated metal foil is removed by etching, and the surface-treated metal foil is removed by etching. Photographing means for photographing the mark existing under the material through the transparent substrate;
Observation point-lightness graph creating means for measuring the brightness at each observation point along the direction perpendicular to the direction in which the observed mark extends for the image obtained by the photographing, and creating an observation point-lightness graph;
In the observation point-lightness graph, the visibility of the transparent substrate is evaluated based on the slope of the brightness curve generated from the end of the mark to the portion where the mark is not present, and the metal foil is based on the visibility evaluation result. Metal foil surface state evaluation means for evaluating the surface state of,
An apparatus for evaluating the surface state of a metal foil comprising:
The metal foil surface state evaluation means represents an inclination of a lightness curve generated from an end of the mark to a portion without the mark in the observation point-lightness graph, and the visibility of the transparent substrate is represented by the angle. The apparatus for evaluating a surface state of a metal foil according to claim 32, which evaluates and evaluates the surface state of the metal foil based on the evaluation result of the visibility.
For an image obtained by photographing by the photographing means, further comprising a smoothing processing means for reducing variations in brightness,
34. The apparatus for evaluating a surface state of a metal foil according to claim 32 or 33, wherein the observation point-lightness graph preparation means prepares an observation point-lightness graph using the lightness after the smoothing process.
The mark present under the transparent substrate is a line-shaped mark printed on a printed material laid under the transparent substrate,
The observation point-lightness graph preparation means measures the lightness of each observation point along the direction perpendicular to the direction in which the observed line-shaped mark extends from the image obtained by the photographing, and the observation point-lightness The apparatus for evaluating a surface state of a metal foil according to any one of claims 32 to 34, which produces a graph.
The apparatus for evaluating the surface state of a metal foil according to any one of claims 32 to 35, wherein the transparent substrate is a polyimide substrate.
The top average value Bt and bottom average of the brightness curve generated from the end of the mark to the non-marked portion of the transparent substrate before being bonded to the metal foil, the thickness of the transparent substrate being 50 μm 37. The apparatus for evaluating a surface state of a metal foil according to claim 36, wherein a difference ΔB (PI) [ΔB (PI) = Bt−Bb] from the value Bb is 20 or more and 33 or less.
The top average value Bt and bottom average of the brightness curve generated from the end of the mark to the non-marked portion of the transparent substrate before being bonded to the metal foil, the thickness of the transparent substrate being 50 μm 37. The apparatus for evaluating a surface state of a metal foil according to claim 36, wherein a difference ΔB (PI) [ΔB (PI) = Bt−Bb] from the value Bb is 50 or more and 65 or less.
Visibility evaluation of the transparent substrate by the inclination represented by the angle of the brightness curve,
The mark on the transparent base material produced by attaching the surface-treated metal foil from the surface-treated surface side to at least one surface of the transparent base material and then removing the metal foil by etching. A difference ΔB (ΔB = Bt−Bb) between the top average value Bt and the bottom average value Bb of the brightness curve generated from the end of the mark to the portion where the mark is not present,
A ratio of ΔB / ΔB (PI);
An inclination represented by an angle of the brightness curve in a predetermined depth range based on Bt;
The apparatus for evaluating the surface state of a metal foil according to any one of claims 36 to 38, wherein
The slope represented by the angle of the brightness curve in the predetermined depth range with reference to Bt is the slope k1 represented by the angle of the brightness curve in the depth range of 0.4ΔB to 0.6ΔB with reference to Bt. 40. The apparatus for evaluating a surface state of a metal foil according to claim 39.
Visibility evaluation of the transparent substrate by the inclination represented by the angle of the brightness curve,
The difference ΔB (ΔB = Bt−Bb) between the top average value Bt and the bottom average value Bb of the lightness curve generated from the end of the mark to the portion without the mark for the transparent substrate is 20 or more and 33 or less, or 50 or more and 65 or less,
The ratio of ΔB / ΔB (PI) is 0.7 or more,
The surface state of the metal foil according to claim 40, wherein it is determined that the case where the slope k1 expressed by the angle of the brightness curve in the depth range of 0.4ΔB to 0.6ΔB with respect to Bt is 65 ° or more is good. Evaluation device.
The metal foil according to claim 41, wherein it is further determined that the slope k1 represented by the angle of the brightness curve in the depth range of 0.4ΔB to 0.6ΔB with respect to Bt is 87 ° or less. Surface condition evaluation device.
The slope k2 expressed by the angle of the lightness curve in a depth range from the intersection of the lightness curve and Bt to 0.1ΔB with reference to Bt is further used for evaluation. For evaluating the surface condition of metal foil.
44. The apparatus for evaluating a surface state of a metal foil according to claim 43, wherein the case where the k2 is 30 [deg.] Or more is determined to be better.
The apparatus for evaluating a surface state of a metal foil according to any one of claims 32 to 44, wherein the metal foil is a copper foil.
A program for causing a computer to function as the evaluation apparatus for the surface condition of the metal foil according to any one of claims 32 to 45.
A computer-readable recording medium on which the program according to claim 46 is recorded.
After bonding the surface-treated surface side of the surface-treated metal foil to at least one surface of the transparent substrate, the surface-treated metal foil is removed by etching, and the surface-treated metal foil is removed by etching. Photograph the mark that exists under the material through the transparent substrate,
For the image obtained by the photographing, the brightness at each observation point is measured along the direction perpendicular to the direction in which the observed mark extends, and an observation point-lightness graph is created.
In the observation point-brightness graph, the visibility of the transparent substrate is evaluated based on the angle of the brightness curve that occurs from the end of the mark to the portion without the mark, and based on the evaluation result of the visibility. The evaluation method of the surface state of metal foil which evaluates the surface state of metal foil.
The method for evaluating a surface state of a metal foil according to claim 48, wherein the surface-treated metal foil is a surface-treated copper foil.
50. The observation point-lightness graph is prepared by measuring the lightness of each observation point along a direction perpendicular to a direction in which the observed mark extends with respect to an image obtained by the photographing. Method for evaluating the surface state of a metal foil.
In the observation point-lightness graph, the slope of the lightness curve that occurs from the end of the mark to the portion without the mark is expressed as an angle, and the visibility of the transparent substrate is evaluated by the angle, and the visibility evaluation result The method for evaluating the surface state of a metal foil according to any one of claims 48 to 50, wherein the surface state of the metal is evaluated based on the above.
Preparing a mark and a transparent substrate provided on the mark, photographing the mark with a CCD camera through the transparent substrate,
For the image obtained by the shooting, the brightness at each observation point is measured along the direction crossing the observed mark to create an observation point-lightness graph,
A method of evaluating the visibility of the transparent substrate based on the slope of a brightness curve generated from an end portion of the mark to a portion without the mark in the observation point-lightness graph.
53. The evaluation according to claim 52, wherein, in the observation point-lightness graph, an inclination of a lightness curve generated from an end portion of the mark to a portion without the mark is represented by an angle, and the visibility of the transparent substrate is evaluated by the angle. Method.
54. The evaluation method according to claim 52 or 53, wherein for an image obtained by the photographing, variation in brightness is reduced by a smoothing process, and an observation point-brightness graph is created using the brightness after the smoothing process.
The mark is a line-shaped mark,
53. The observation point-lightness graph is created by measuring the lightness of each observation point along a direction perpendicular to a direction in which the observed line-shaped mark extends with respect to an image obtained by the photographing. 55. The evaluation method according to any one of -54.
Before the transparent base material is provided on the mark, a surface-treated metal foil having at least one surface roughened is bonded to at least one surface of the transparent base material from the roughened surface side. The evaluation method according to any one of claims 52 to 55, wherein the metal foil is subsequently removed by etching.
Before the transparent base material is provided on the mark, the surface-treated metal foil having at least one surface roughened is bonded to both surfaces of the transparent base material from the roughened surface side, and then etched. The evaluation method according to claim 56, wherein the metal foil on both sides is removed.
The evaluation method according to claim 56 or 57, wherein the roughening treatment is a treatment of forming roughened particles on the surface of the metal foil.
The evaluation method according to any one of claims 55 to 57, wherein the metal foil is a copper foil.
The evaluation method according to any one of claims 52 to 59, wherein the transparent base material is a polyimide substrate.
The transparent substrate has a thickness of 50 μm, and a top average value Bt and a bottom average of a brightness curve generated from an end portion of the mark to a portion where the mark is not present on the transparent substrate before being bonded to the metal foil. 61. The evaluation method according to claim 60, wherein the difference ΔB (PI) [ΔB (PI) = Bt−Bb] from the value Bb is 20 or more and 33 or less.
A method for evaluating the visibility of the transparent substrate is to remove the metal foil by etching after the surface-treated metal foil is bonded to at least one surface of the transparent substrate from the roughened surface side. A difference ΔB (ΔB = Bt−Bb) between a top average value Bt and a bottom average value Bb of a brightness curve generated from an end of the mark to a portion without the mark for the transparent substrate produced in the above-described manner,
A ratio of ΔB / ΔB (PI);
An inclination represented by an angle of the brightness curve in a predetermined depth range based on Bt;
62. The evaluation method according to claim 61, which is performed using
The slope represented by the angle of the brightness curve in the predetermined depth range with reference to Bt is the slope k1 represented by the angle of the brightness curve in the depth range of 0.4ΔB to 0.6ΔB with reference to Bt. The evaluation method according to claim 62.
A method for evaluating the visibility of the transparent substrate is that a difference ΔB (ΔB = Bt−Bb) between a top average value Bt and a bottom average value Bb of a brightness curve generated from an end portion of the mark to a portion where the mark is absent. 20 or more and 33 or less,
The ratio of ΔB / ΔB (PI) is 0.7 or more,
The evaluation method according to claim 63, wherein the case where the slope k1 represented by the angle of the brightness curve in the depth range of 0.4ΔB to 0.6ΔB with respect to Bt is 65 ° or more is determined to be good.
The evaluation method according to claim 64, wherein the case where the k1 is 87 ° or less is determined to be further favorable.
In the observation point-brightness graph created from the image obtained by the photographing, an inclination k2 expressed by an angle of the lightness curve in a depth range from the intersection of the lightness curve and Bt to 0.1 ΔB with reference to Bt. The evaluation method according to any one of claims 61 to 65, further used for evaluation.
The evaluation method according to claim 66, wherein the case where the k2 is 30 ° or more is determined to be better.
A method for positioning a laminate of metal and resin,
The metal and resin laminate has a mark,
The mark is photographed with a CCD camera through the resin,
For the image obtained by the shooting, the brightness at each observation point is measured along the direction crossing the observed mark to create an observation point-lightness graph,
A method of positioning a laminate of a metal and a resin on the basis of an inclination of a lightness curve generated from an end portion of the mark to a portion without the mark in the observation point-lightness graph.
In the observation point-lightness graph, the slope of the lightness curve that occurs from the end of the mark to the portion without the mark is expressed as an angle. 69. The positioning method according to claim 68, wherein the positioning of the laminate of metal and resin is performed.
70. A method for manufacturing a printed wiring board, comprising the steps of positioning the printed wiring board using the positioning method according to claim 68 or 69 and mounting a component on the positioned printed wiring board.
70. A step of positioning a printed wiring board using the positioning method according to claim 68 or 69, aligning the positioned printed wiring board, and mounting a component on the aligned printed wiring board. A method for manufacturing a printed wiring board.
70. A method for manufacturing a printed wiring board, comprising the steps of positioning a printed wiring board using the positioning method according to claim 68 or 69 and connecting another printed wiring board to the positioned printed wiring board.
A printed wiring board is positioned using the positioning method according to claim 68 or 69, the positioned printed wiring board is aligned, and another printed wiring board is aligned with the aligned printed wiring board. The manufacturing method of a printed wiring board including the process of connecting.
A method for determining whether or not there is a mark of a laminate of a metal and a transparent substrate,
For the laminate of the metal and the transparent substrate having a mark, the mark is photographed through the transparent substrate,
For the image obtained by the photographing, an observation point-brightness graph is created by measuring the brightness for each observation point along the direction intersecting the direction in which the observed mark extends,
In the observation point-lightness graph, a method for determining whether or not a mark included in the stacked body exists based on an inclination of a lightness curve generated from an end portion of the mark to a portion without the mark.
The mark according to claim 74, wherein the observation point-lightness graph is created by measuring the lightness of each observation point along a direction perpendicular to a direction in which the observed mark extends with respect to an image obtained by the photographing. To determine whether or not there exists.
In the observation point-lightness graph, the slope of the lightness curve that occurs from the end of the mark to the portion without the mark is expressed as an angle, and when the angle is equal to or greater than a predetermined value, there is a mark that the laminate has A method for determining whether or not the mark according to claim 74 or 75 is present.
The method for determining whether or not the mark according to any one of claims 74 to 76 is present, wherein the mark is a circuit provided on the transparent base plate and the transparent base plate. .
An apparatus for determining whether or not a mark included in a laminate of a metal and a transparent substrate exists,
An imaging means for photographing the mark through the transparent substrate with respect to a laminate of the metal and the transparent substrate having a mark;
Observation point-lightness graph creating means for measuring the brightness of each observation point along the direction intersecting the direction in which the observed mark extends with respect to the image obtained by the photographing, and creating an observation point-lightness graph;
In the observation point-lightness graph, determination means for determining whether or not the mark exists based on a slope of a lightness curve generated from an end portion of the mark to a portion without the mark;
The apparatus which determines whether the mark which the laminated body of a metal and a transparent base material provided with has exists.
The observation point-lightness graph preparation means measures the lightness of each observation point along the direction perpendicular to the direction in which the observed mark extends for the image obtained by the photographing, and displays the observation point-lightness graph. The apparatus which determines whether the mark which the laminated body of the metal and transparent base material of Claim 78 to produce exists exists.
The determining means for determining whether or not the mark exists indicates an inclination of a lightness curve generated from an end portion of the mark to a portion without the mark in the observation point-lightness graph, and the angle is a predetermined value. 80. The apparatus for determining whether or not there is a mark included in a laminate of a metal and a transparent substrate according to claim 78 or 79, wherein it is determined that a mark included in the laminate exists when the value is greater than or equal to a value.
The laminate of a metal and a transparent substrate according to any one of claims 78 to 80, wherein the mark is a circuit provided on the transparent substrate plate and the transparent substrate plate. A device that determines whether or not a mark exists.
A program for causing a computer to function as the determination device according to any one of claims 78 to 81.
A computer-readable recording medium on which the program according to claim 82 is recorded.
A method for detecting the position of a mark of a laminate of a metal and a transparent substrate,
For the laminate of the metal and the transparent substrate having a mark, the mark is photographed through the transparent substrate,
For the image obtained by the photographing, an observation point-brightness graph is created by measuring the brightness for each observation point along the direction intersecting the direction in which the observed mark extends,
A method of detecting the position of the mark based on an inclination of a lightness curve generated from an end portion of the mark to a portion without the mark in the observation point-lightness graph.
85. An observation point-lightness graph is created by measuring the lightness of each observation point along a direction perpendicular to a direction in which the observed mark extends for an image obtained by the photographing. How to detect the position.
In the observation point-lightness graph, the slope of the lightness curve that occurs from the end of the mark to the portion without the mark is expressed as an angle. The method for detecting the position of the mark according to claim 84 or 85, wherein the position of the mark is detected.
The method for detecting a position of a mark according to any one of claims 84 to 86, wherein the mark is a plate provided on the transparent base plate and the transparent base plate.
An apparatus for detecting the position of a mark of a laminate of a metal and a transparent substrate,
An imaging means for photographing the mark through the transparent substrate with respect to a laminate of the metal and the transparent substrate having a mark;
Observation point-lightness graph creating means for measuring the lightness of each observation point along the direction intersecting the direction in which the observed mark extends with respect to the image obtained by the photographing, and creating an observation point-lightness graph;
In the observation point-lightness graph, position detecting means for detecting the position of the mark based on a slope of a lightness curve generated from an end of the mark to a portion where the mark is not present;
The apparatus which detects the position of the mark which the laminated body of a metal and a transparent base material provided with.
The observation spot-lightness graph creating means creates an observation spot-lightness graph by measuring the brightness of each observation spot along a direction perpendicular to the direction in which the observed mark extends from the image obtained by the photographing. The apparatus which detects the position of the mark which the laminated body of the metal and transparent base material of Claim 88 to do has.
In the observation point-lightness graph, the slope of the lightness curve that occurs from the end of the mark to the portion without the mark is expressed as an angle. 90. The apparatus for detecting a position of a mark included in a laminate of a metal and a transparent substrate according to claim 88 or 89, wherein the position of the mark is detected.
The metal and transparent substrate laminate according to any one of claims 88 to 90, wherein the mark is a circuit provided on the transparent substrate plate and the transparent substrate plate. A device that detects the position of a mark.
A program for causing a computer to function as the detection device according to any one of claims 88 to 91.
A computer-readable recording medium on which the program according to claim 92 is recorded.