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WO2013143677A1 - Unité de maniement pour plaquettes ainsi que procédé de préhension d'une plaquette - Google Patents

Unité de maniement pour plaquettes ainsi que procédé de préhension d'une plaquette Download PDF

Info

Publication number
WO2013143677A1
WO2013143677A1 PCT/EP2013/000884 EP2013000884W WO2013143677A1 WO 2013143677 A1 WO2013143677 A1 WO 2013143677A1 EP 2013000884 W EP2013000884 W EP 2013000884W WO 2013143677 A1 WO2013143677 A1 WO 2013143677A1
Authority
WO
WIPO (PCT)
Prior art keywords
wafer
optical sensors
disk
carrier
movement
Prior art date
Application number
PCT/EP2013/000884
Other languages
German (de)
English (en)
Inventor
Andreas Behr
Original Assignee
Innolas Semiconductor GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Innolas Semiconductor GmbH filed Critical Innolas Semiconductor GmbH
Publication of WO2013143677A1 publication Critical patent/WO2013143677A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

Definitions

  • Wafer wafer handling unit and method for picking up a wafer Wafer wafer handling unit and method for picking up a wafer
  • the invention relates to a handling unit for picking up
  • the wafer carrier has a
  • Wafer disk receiving area which is associated with a support plane, and provides at least two the wafer wafer receiving area laterally locally limiting holding means, to which at least the peripheral edge of a on the
  • Wafer disk carrier resting wafer wafer self-centering adjacent. Further, a method for picking up a wafer wafer on a
  • Wafer wafer carrier explained.
  • Handling units of the above type are used for the transport and positioning of semiconductor material, thin slices, preferably of silicon, circular wafer slices, which serve as a basic substrate for the production of chips with integrated circuits.
  • the processing of such wafer slices requires a secure handling of individual wafer slices, which applies between various storage and distribution systems Eisenlager potentialnissen and processing stations, for example.
  • process chambers to transport In the form of process chambers to transport.
  • the wafer slices For storing the wafer slices is typically a variety of
  • a typical handling unit provides a mostly plate-like or finger-shaped wafer carrier which abuts one by at least three
  • the wafer disk carrier is formed as flat as possible, so as to contact-free between two in a vertical stack
  • a generic handling unit for picking up, transporting and depositing a wafer slice can be found in DE 11 2004 001 162 T5, which has two support tines attached to a base member as wafer wafer carriers, on those for the marginal contacting of a wafer wafer to be picked up
  • Support members are attached, which are formed knob-like or as obliquely to a predetermined by the flat tine shape supporting plane for the wafer slice gate elements.
  • Both the base member and the two, attached to the base member receiving prongs have a maximum profile height of less than 12 mm, so that the base member and trunnion existing end effector is moved by means of a handling robot into tight spaces between a stack of wafer slices.
  • a cylinder-piston pushing device is provided, the piston of which can be brought radially into contact with the peripheral edge of a wafer disk resting on the support members.
  • the wafer disk is pressed against stop members provided on the edges at the edges in addition to the support members and centered relative to the tine assembly.
  • An additionally provided on the base part of the light sensor detects the presence or absence of a resting on the support teeth wafer wafer.
  • the light path of the light sensor is oriented parallel to the support plane of the wafer wafer.
  • Storage cassette is available for removal, it is the movement and
  • Wafer disk for example, within a storage cassette, a specially trained test disk, each with two orthogonal to the disk plane
  • Adjustment templates which are attached to the manipulator arm for positioning purposes, can be found in the following publications: JP 2005011966 A, JP
  • US2007 / 0140826 A1 discloses a Waferiminpositioniersystem, which has a Waferimindoi that for receiving a in a
  • Workstation located wafer wheel robotically supported positionable. For localization of a wafer wafer and positioning of the wafer wafer carrier relative to the wafer wafer, optical sensors are mounted on the wafer wafer carrier, which detect the spatial area above the wafer carrier by means of optical reflection measurement. At each workstation is for purposes of a
  • Reflection pattern generated when driving through the optical sensors which is used as the basis for further navigation of Waferimions.
  • the invention has for its object to provide a handling unit for
  • Wafer disk carrier at one at least three spatial axes
  • a handling unit designed in accordance with the invention for receiving,
  • Wafer disk carrier at one at least three spatial axes
  • Wafersscalement Scheme has to which a support plane can be assigned, and at least two the Waferiminam Scheme at least laterally locally limiting holding means, to which the peripheral edge of a on the
  • At least two optical sensors each having an orthogonal oriented to the support plane and the Waferusionngiving Scheme facing sensor viewing direction are arranged such that the optical
  • Sensors each having a light source and a light receiver so that light emitted by the light source in the case of Waferiminüberdeckung by reflection on the wafer at least partially hits the light receiver and thereby generates sensor signals is formed in that the light source has a main emission direction and the light receiver has a main receiving direction which include an angle ⁇ , for which applies: 45 ° ⁇ ⁇ 60 °, and that an evaluation and control unit is provided which generates control signals for positioning the manipulator arm based on sensor signals generated exclusively by reflections on the wafer wafer. Is for purposes of Waferiminam the Waferimi in a parallel to the male wafer slice oriented, horizontal
  • Moving plane moves below the wafer wafer, so the at least two arranged on different areas of the Waferiminins, optical sensors whose Sensorblickraum each vertical upward, i. of the
  • the two optical sensors are able to accurately detect the event in which the optical sensors, with the horizontal direction of movement of the wafer disk carrier remaining the same, emerge again on the opposite side of the wafer disk below the peripheral edge, i. in a vertical projection on the wafer disk of the
  • Wafer disk are no longer covered.
  • the sensor signals generated by the optical sensors which are caused exclusively by reflection events on the underside of the wafer wafer to be recorded, are transmitted for further evaluation by wire or wireless to an evaluation and control unit, on the basis of which control signals for positioning the manipulator arm are generated.
  • the handling unit thus enables a non-contact, optical position measurement of a wafer wafer to be picked up, so that the wafer wafer carrier is navigated exactly centrically to the wafer wafer in a plane below the wafer wafer to be picked up, before the wafer
  • Wafer disk carrier is raised vertically for purposes of Waferiminfact.
  • positional tolerances with which individual wafer disks are deposited can be exactly recorded and taken into account correspondingly when each wafer wafer is picked up.
  • an exact pre-positioning of Waferiminins relative to a male wafer disc can be any tilting or
  • the wafer-wafer carrier has at least two, preferably three or four, raised edges over the support plane of the wafer-wafer carrier along the peripheral edge of a wafer wafer to be picked up
  • Holding means which preferably have a centered receiving the wafer wafer obliquely to the support plane inclined Zentrierflanken.
  • Fiber composite material manufactured plate-shaped support member, which is as rigid as possible and has a small plate thickness.
  • plate-shaped support member has for weight reasons a possible reduced surface plate shape, but which should make it possible that at least two, preferably three or four holding means along the peripheral edge of a male
  • Wafer disk are arranged.
  • a preferred plate shape is, for example, rectangular or trapezoidal with a narrow side dimensioned smaller than half the Waferimin matmessers, and a longitudinal side, the
  • Wafer disk diameter corresponds to or slightly surmounted.
  • the plate-shaped wafer carrier is one-sided with the
  • Manipulator connected to a robot unit and has a
  • Manipulator arm opposite, freely ending support plate area on, on at least two holding means are mounted on the edge, on which at least the peripheral edge of a wafer wafer can be deposited in a self-centering manner.
  • the holding means are thus exactly along the circular peripheral edge of a wafer to be applied to the wafer wafer.
  • the at least third holding means is attached to the plate-shaped Waferiminong in close proximity to the manipulator arm and clamped with the at least two edges provided
  • Holding means serving for the wafer slice support level.
  • the edge-mounted holding means at least two spaced along the peripheral edge of the wafer wafer arranged optical sensors are mounted, the sensor viewing direction in each case orthogonal to
  • the individual optical sensors are each arranged directly next to the edge-mounted holding means, preferably outside of a support region defined by the holding means for the wafer wafer.
  • the at least two optical sensors arranged on the wafer carrier each have a light source and a light receiver which are matched to one another such that light reflection events which occur at a defined distance above a sensor plane that can be assigned to the optical sensors are detected with increased sensitivity.
  • the optical sensors are according to the solution in such a way
  • the light source as well as the light receiver of an optical sensor are matched to one another, so that the main emission direction of the light source and the main receiving direction of the light receiver include an angle ß, which typically measures between 45 ° and 60 °.
  • Wafer disk carrier by means of the robot-guided manipulator arm outside of an area, which by a vertical projection on a male
  • Wafer slice is limited, along the vertical axis z below a
  • the wafer wafer carrier is preferably oriented relative to the wafer wafer to be picked up, so that the edge region of the wafer wafer carrier facing away from the manipulator arm, on which the at least two optical sensors are mounted, is the end face of the wafer wafer carrier
  • Wafer disk carrier is preferably aligned centrally to the wafer disk.
  • the central alignment is not exact, but only rough.
  • the Waferiminy is guided horizontally under the wafer wafer, preferably along a linear movement, so that the at least two edge-mounted on Waferiminongy optical sensors are covered by the wafer disc.
  • the linear movement of the wafer carrier carried out along a horizontal x-y plane is terminated as soon as the at least two optical sensors emerge again in the direction of movement under the wafer disk on the opposite peripheral edge.
  • the wafer carrier is at a distance of 1 mm or a few millimeters largely completely below the male
  • the optical sensors are capable of the event of emergence beneath the wafer slice due to the changing nature of the wafer
  • Wafer slice along the wafer peripheral edge emerge.
  • two tangent points along the wafer-peripheral edge is a
  • Wafer disk carrier provided holding means comes to rest.
  • those x-y coordinates which correspond to those points of the peripheral edge of the wafer are additionally used for the exact position determination of the wafer wafer to be picked up
  • Wafer disk correspond, at which the optical sensors are initially covered on the wafer wafer.
  • four peripheral edge points are available for the exact position determination of the wafer disk, with which an exact position determination relative to the horizontal x-y plane is possible, along which the wafer disk carrier can be aligned centrically relative to the wafer disk.
  • FIG. 1a, b side view and top view of a robot-assisted
  • FIG. 2a, b detailed representations of a wafer wafer carrier attached
  • a handling unit for receiving
  • the handling unit has a wafer disk carrier 1 which is attached to a manipulator arm 2 of a robot unit R that can be positioned by at least three spatial axes, namely a vertical axis z and two orthogonal horizontal axes x, y.
  • the wafer disk carrier 1 is plate-shaped and has in the illustrated in Fig. 1 b embodiment, a trapezoidal basic shape, whose broader trapezoidal side with the manipulator arm 2 and the narrower trapezoidal side of the manipulator arm 2 is arranged opposite lying freely ending.
  • each individual holding means 3, 3 'opposite Surface of the wafer carrier 1 raised and has a first upper inclined sliding surface 31, along which the peripheral edge U a
  • Wafer disk carrier 1 to be reached which is peripherally bounded by the vertical edges 32 of the holding means 3, 3 ', see the detailed illustration in Figure 1 b.
  • Section 31 ' through which the wafer wafer with respect to the surface of the
  • Wafer disc carrier 1 can be stored spaced, i. the support plane 5 for the underside of a wafer wafer to be recorded is spaced from the surface of the wafer carrier 1 in order to reduce contact between the wafer wafer and the wafer carrier 1 for reasons of possible contamination.
  • the wafer wafer carrier 1 has two optical sensors 7, 8, which are mounted outside the support area 6 and are arranged at a distance from each other along a parallel circle 9 extending parallel to the peripheral edge U of the wafer wafer 4 to be received.
  • the optical sensors 7, 8 can be integrated within the plate-shaped Waferimin heres, as can be seen from a cross-sectional view of FIG. 2a, or be applied to the surface of Waferimin sos 1.
  • the optical sensors 7, 8 are preferably designed such that reflection events, the light emitted from the light source L on the underside of a wafer wafer 4 at a predetermined vertical distance Ah, for example. Between 3 mm and 8 mm
  • Sensor level S experiences can be detected with particularly high sensitivity.
  • Another possibility for setting the sensitivity of the optical sensors with respect to reflection events that take place at a distance Ah from the sensor plane S, is the use of an emitted light focusing optics O, the focal point at a distance Ah from the
  • Sensor plane S images.
  • the optical sensors 7, 8 it is possible, with suitable movement of the wafer carrier 1, to detect, parallel to a wafer wafer to be picked up, those circumferential points on the wafer wafer at which the optical sensors are covered by the wafer wafer 4 and released from it again. It is precisely these reflection events, which can be detected in the form of sensor signals, that are fed to a control and evaluation unit 10 which generates control signals exactly below the wafer wafer to be picked up, which are fed to the robot unit R for further motion control, under the guidance of a target function for centering the wafer disk carrier.
  • FIG. 2b shows an alternative arrangement of the optical sensors 7, 8 within the wafer carrier 1.
  • the light source L has a light-emitting surface L f , the light receiver E via a light entry surface Ef. Both surfaces Lf and Ef are inclined toward each other so that the main emission direction of the light source L and the main receiving direction of the light receiver E intersect at a point P that is a distance Ah from the surface of the light source
  • Wafer disk carrier 1 has. If the underside of the wafer disk 4 is at this distance Ah, the reception amplitude of the light receiver is maximal. If, however, the distance Ah is exceeded over a predefinable tolerance range, for example if Ah> 10 mm, then these distant reflection events can not cause any sensor signals in the light receiver E.
  • Illustrate wafer slice 4 Illustrate wafer slice 4.
  • a side view is shown in the left-hand image representation and a top view of the individual movement steps is shown in the right-hand image representation.
  • the wafer carrier 1 shown in a rectangular manner in the sequence images has four holding means 3, 3 ', which are mounted on the wafer carrier 1 along the peripheral edge of the wafer wafer 4 to be picked up.
  • the optical sensors 7, 8 are arranged.
  • Manipulator 2 has been omitted in the sequence image representations.
  • the empty Waferimin 1 along the vertical axis z with a vertical distance Ah below the male wafer 4 and outside of a range which is limited by vertical projection on the wafer to be recorded, positioned.
  • FIG. 3a In the plan view of FIG. 3a is to explain the following
  • Wafer disk carrier 1 moves within the horizontal x-y plane along a linear axis LR, the empty wafer disk carrier 1 moves together with the optical sensors 7, 8 under the wafer wafer 4.
  • the optical sensors 7, 8 arrive at respectively two different locations along the peripheral edge U of the wafer disk 4 under the wafer disk, the event of the initial coverage of the respective optical sensors 7, 8 detected in a spatially resolved exact location due to the reflection ratios changing as a result of the overlapping can be.
  • Wafer disk carrier 1 is stopped as soon as both optical sensors 7, 8 have emerged below the peripheral edge of the wafer disk 4. This is in the
  • Sequence image representation illustrated in FIG. 3c which also highlights the determination of four along the peripheral edge U of the wafer wafer 4 located points P1 to P4.
  • P1, P2, P3, P4 along the peripheral edge of the wafer disk 4 can be calculated using an evaluation and control unit correction information, based on the
  • Wafer disk carrier 1 relative to the position of the wafer 4 to align exactly.
  • the wafer disk carrier 1 is moved from the position illustrated in FIG. 3 c directly into a position centered below the wafer disk 4, relative to the wafer wafer 4 to be picked up, in accordance with FIG. 3 c
  • the wafer carrier 1 moves back opposite to the initial direction of movement LR, so that both optical sensors 7, 8 are covered again by the wafer 4, see sequence image representation according to FIG. 3d.
  • correction movements K are made such that the
  • Wafer disk carrier 1 is aligned exactly centered below the wafer disk 4. Again, the wafer carrier 1 is linearly parallel to the initial
  • Moving direction LR moves so that now both optical sensors 7, 8 emerge simultaneously below the peripheral edge of the wafer 4.
  • an exact spatial orientation of the wafer carrier 1 is ensured relative to the wafer 4. If both optical sensors do not emerge exactly at the same time under the peripheral edge of the wafer disk 4, then it is true that Repeat in the sequence image representation of FIG. 3d illustrated correction step, if necessary, until the case illustrated in Fig. 3e occurs that both optical sensors emerge exactly at the same time below the peripheral edge of the wafer 4. Finally, according to the sequence image representation in FIG. 3f, the empty wafer disk carrier 1 is lifted vertically to receive the wafer disk 4.
  • Position correction information as is done in the illustrated step 3c, a check is made whether at least the detected x-y coordinates P3 and P4 along a known by one of the wafer wafer to be recorded, associated
  • Circular wafer wafers have a notch, which is provided on the circumference of the wafer edge, for marking their crystal direction, the so-called notch, which typically has a groove size of 1 to 3 mm. If the case occurs that an optical sensor (7, 8) for position detection is just passed under the notch, a small but nevertheless considerable error would occur in the determination of the position correction information, which should be avoided. That's why the extra helps
  • Wafer disk carrier (1) to move in opposite to the initial direction of movement, so that both optical sensors (7, 8) in vertical projection on the wafer wafer (4) from the wafer wafer (4) are covered again (this

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

La présente invention concerne une unité de maniement destinée à prendre, transporter et déposer une plaquette, comportant un porte-plaquette, qui est placé sur un bras manipulateur susceptible d'être positionné autour d'au moins trois axes spatiaux. Le porte-plaquette dispose d'une zone de préhension de plaquette à laquelle est affecté un plan d'appui et comporte en outre au moins deux moyens de soutien limitant localement et latéralement la zone de préhension de la plaquette, auxquels est contigu de façon autocentrée au moins le bord périphérique d'une plaquette reposant sur le porte-plaquette. En outre, l'invention concerne un procédé permettant de prendre une plaquette. L'invention se caractérise par le fait que sur le porte-plaquette sont disposés au moins deux capteurs optiques présentant respectivement une direction de visée orientée à l'orthogonale par rapport au plan d'appui et tournés vers la zone de préhension de plaquette, qui génèrent des signaux de capteur et qu'une unité d'analyse et de commande est prévue, qui génère sur la base des signaux de capteur des signaux de commande pour le positionnement du bras manipulateur.
PCT/EP2013/000884 2012-03-30 2013-03-22 Unité de maniement pour plaquettes ainsi que procédé de préhension d'une plaquette WO2013143677A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE201210006521 DE102012006521A1 (de) 2012-03-30 2012-03-30 Handhabungseinheit für Waferscheiben sowie Verfahren zum Aufnehmen einer Waferscheibe
DE102012006521.3 2012-03-30

Publications (1)

Publication Number Publication Date
WO2013143677A1 true WO2013143677A1 (fr) 2013-10-03

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Application Number Title Priority Date Filing Date
PCT/EP2013/000884 WO2013143677A1 (fr) 2012-03-30 2013-03-22 Unité de maniement pour plaquettes ainsi que procédé de préhension d'une plaquette

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DE (1) DE102012006521A1 (fr)
WO (1) WO2013143677A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109421003A (zh) * 2017-08-24 2019-03-05 艾塔尔公司 框架结构中的定位装置
CN111341712A (zh) * 2018-12-19 2020-06-26 北京北方华创微电子装备有限公司 一种晶片位置校准装置及方法
CN113263490A (zh) * 2020-06-12 2021-08-17 台湾积体电路制造股份有限公司 机械手、机械手的刀片及其操作方法

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US6270619B1 (en) * 1998-01-13 2001-08-07 Kabushiki Kaisha Toshiba Treatment device, laser annealing device, manufacturing apparatus, and manufacturing apparatus for flat display device
JP2005193303A (ja) * 2003-12-26 2005-07-21 Mitsubishi Heavy Ind Ltd 基板搬送装置
US20050265814A1 (en) * 2003-09-10 2005-12-01 Coady Matthew W Substrate handling system for aligning and orienting substrates during a transfer operation

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JP2005011966A (ja) 2003-06-18 2005-01-13 Dainippon Screen Mfg Co Ltd 基板搬送装置、基板処理装置および搬送基準位置教示方法、ならびにこれらに用いるセンサ治具
US7654596B2 (en) 2003-06-27 2010-02-02 Mattson Technology, Inc. Endeffectors for handling semiconductor wafers
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US6270619B1 (en) * 1998-01-13 2001-08-07 Kabushiki Kaisha Toshiba Treatment device, laser annealing device, manufacturing apparatus, and manufacturing apparatus for flat display device
US20050265814A1 (en) * 2003-09-10 2005-12-01 Coady Matthew W Substrate handling system for aligning and orienting substrates during a transfer operation
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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109421003A (zh) * 2017-08-24 2019-03-05 艾塔尔公司 框架结构中的定位装置
KR20190022318A (ko) * 2017-08-24 2019-03-06 에텔 쏘시에떼 아노님 갠트리 타입의 위치 결정 장치
US11408554B2 (en) * 2017-08-24 2022-08-09 Etel S.A. Gantry-type positioning device
KR102649529B1 (ko) 2017-08-24 2024-03-21 에텔 쏘시에떼 아노님 갠트리 타입의 위치 결정 장치
CN111341712A (zh) * 2018-12-19 2020-06-26 北京北方华创微电子装备有限公司 一种晶片位置校准装置及方法
CN111341712B (zh) * 2018-12-19 2023-05-16 北京北方华创微电子装备有限公司 一种晶片位置校准装置及方法
CN113263490A (zh) * 2020-06-12 2021-08-17 台湾积体电路制造股份有限公司 机械手、机械手的刀片及其操作方法

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