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WO2013051877A3 - 챔버간 역압 방지수단을 구비한 진공 처리장치 - Google Patents

챔버간 역압 방지수단을 구비한 진공 처리장치 Download PDF

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Publication number
WO2013051877A3
WO2013051877A3 PCT/KR2012/008067 KR2012008067W WO2013051877A3 WO 2013051877 A3 WO2013051877 A3 WO 2013051877A3 KR 2012008067 W KR2012008067 W KR 2012008067W WO 2013051877 A3 WO2013051877 A3 WO 2013051877A3
Authority
WO
WIPO (PCT)
Prior art keywords
pressure
chamber
vacuum
chambers
processing apparatus
Prior art date
Application number
PCT/KR2012/008067
Other languages
English (en)
French (fr)
Other versions
WO2013051877A2 (ko
Inventor
임광욱
Original Assignee
(주)선린
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by (주)선린 filed Critical (주)선린
Priority to JP2014534476A priority Critical patent/JP2015513338A/ja
Priority to US14/348,056 priority patent/US9180445B2/en
Priority to CN201280046795.9A priority patent/CN103858207B/zh
Publication of WO2013051877A2 publication Critical patent/WO2013051877A2/ko
Publication of WO2013051877A3 publication Critical patent/WO2013051877A3/ko

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L1/00—Enclosures; Chambers
    • B01L1/02—Air-pressure chambers; Air-locks therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/8593—Systems
    • Y10T137/86292—System with plural openings, one a gas vent or access opening
    • Y10T137/8634—With vented outlet

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Clinical Laboratory Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physical Vapour Deposition (AREA)
  • Liquid Crystal (AREA)

Abstract

본 발명은 LCD, OLED, SOLAR 등의 기판을 처리하기 위한 다수의 챔버로 일어진 진공 처리장치에 관한 것으로, 더욱 상세하게는 서로 이웃하는 챔버 간에 역압을 방지하기 위한 수단이 구비된 진공 처리 장치에 관한 것이다. 이를 위해 챔버 간에 사이에 구비되어 기판의 출입되는 슬릿을 개폐하는 슬릿밸브의 동작을 제공하는 공간을 제공하는 카세트 챔버의 압력을 벤트(대기상태)가 이루어지는 챔버의 압력과 동일하게 정압이 이루어지도록 하여 진공이 이루어지는 챔버(진공 챔버)측의 슬릿을 밀폐하고 있는 슬릿밸브의 밸브플레이트를 진공 챔버측으로 더욱 가압 밀착시킴으로써 벤트 챔버와 진공 챔버의 압력 차이에 의한 인터리크를 발생하는 것을 방지하여 기판의 불량을 줄일 수 있도록 한 것이다.
PCT/KR2012/008067 2011-10-05 2012-10-05 챔버간 역압 방지수단을 구비한 진공 처리장치 WO2013051877A2 (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2014534476A JP2015513338A (ja) 2011-10-05 2012-10-05 チャンバ間逆圧防止手段を備えた真空処理装置
US14/348,056 US9180445B2 (en) 2011-10-05 2012-10-05 Vacuum processing apparatus having a means for preventing counter-pressure between chambers
CN201280046795.9A CN103858207B (zh) 2011-10-05 2012-10-05 腔室之间具备反压防止机构的真空处理装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020110101299A KR101171990B1 (ko) 2011-10-05 2011-10-05 챔버간 역압 방지수단을 구비한 진공 처리장치.
KR10-2011-0101299 2011-10-05

Publications (2)

Publication Number Publication Date
WO2013051877A2 WO2013051877A2 (ko) 2013-04-11
WO2013051877A3 true WO2013051877A3 (ko) 2013-05-30

Family

ID=46887120

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2012/008067 WO2013051877A2 (ko) 2011-10-05 2012-10-05 챔버간 역압 방지수단을 구비한 진공 처리장치

Country Status (4)

Country Link
US (1) US9180445B2 (ko)
JP (1) JP2015513338A (ko)
KR (1) KR101171990B1 (ko)
WO (1) WO2013051877A2 (ko)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2876341B1 (de) 2013-11-21 2015-10-21 VAT Holding AG Verfahren zum Betrieb eines Ventils
US9947561B2 (en) * 2016-03-07 2018-04-17 Asm Technology Singapore Pte Ltd Semiconductor encapsulation system comprising a vacuum pump and a reservoir pump
KR101840940B1 (ko) 2016-09-12 2018-03-21 에스케이실트론 주식회사 고온 상압 기상성장장치에 마련되는 챔버 간의 개폐 장치
CN114939445B (zh) * 2022-03-29 2023-12-22 合肥通用机械研究院有限公司 一种大型真空度变化试验装置及应用该装置的试验方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11186363A (ja) * 1997-12-24 1999-07-09 Shin Etsu Handotai Co Ltd 半導体製造装置
JP2006310561A (ja) * 2005-04-28 2006-11-09 Nec Electronics Corp 真空処理装置および真空処理方法
KR20090118088A (ko) * 2007-03-01 2009-11-17 어플라이드 머티어리얼스, 인코포레이티드 슬릿 도어 밀봉 압력의 제어 장치 및 방법

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6267545B1 (en) * 1999-03-29 2001-07-31 Lam Research Corporation Semiconductor processing platform architecture having processing module isolation capabilities
US6843883B2 (en) * 2001-08-31 2005-01-18 Tdk Corporation Vacuum processing apparatus and method for producing an object to be processed
JP2011054928A (ja) * 2009-08-04 2011-03-17 Tokyo Electron Ltd ゲートバルブ及びそれを用いた基板処理システム
US20120247564A1 (en) * 2011-03-30 2012-10-04 Kho Jeffrey A Shockless slit valve control
JP2013011289A (ja) * 2011-06-28 2013-01-17 Tokyo Electron Ltd ゲートバルブ及びそれを用いた基板処理システム
US9301345B2 (en) * 2012-03-14 2016-03-29 Microwave Materials Technologies, Inc. Determination of a heating profile for a large-scale microwave heating system

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11186363A (ja) * 1997-12-24 1999-07-09 Shin Etsu Handotai Co Ltd 半導体製造装置
JP2006310561A (ja) * 2005-04-28 2006-11-09 Nec Electronics Corp 真空処理装置および真空処理方法
KR20090118088A (ko) * 2007-03-01 2009-11-17 어플라이드 머티어리얼스, 인코포레이티드 슬릿 도어 밀봉 압력의 제어 장치 및 방법

Also Published As

Publication number Publication date
WO2013051877A2 (ko) 2013-04-11
KR101171990B1 (ko) 2012-08-07
US9180445B2 (en) 2015-11-10
JP2015513338A (ja) 2015-05-07
CN103858207A (zh) 2014-06-11
US20140230930A1 (en) 2014-08-21

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