WO2012136166A2

WO2012136166A2 - Chip pad glue feeder apparatus

Info

Publication number: WO2012136166A2
Application number: PCT/CN2012/077056
Authority: WO
Inventors: 成英华; 孙睿; 王风平; 丁海幸
Original assignee: 华为终端有限公司
Priority date: 2011-10-31
Filing date: 2012-06-18
Publication date: 2012-10-11
Also published as: CN202277943U; WO2012136166A3

Abstract

Embodiments of the present invention relate to a chip pad glue feeder apparatus. The chip pad glue feeder apparatus comprises: a substrate, and grooves of different depths provided on the substrate. The grooves of different depths are for use in providing different gluing depths. The chip pad is glued in the groove having a same depth as the gluing depth of the chip pad. The grooves of different depths are in communication with each other. In the chip pad glue feeder apparatus provided in the embodiments of the present invention, by laying out the grooves of different depths on the substrate, and having the grooves of different depths in communication with each other, a same glue feeder apparatus is allowed to provide different gluing depths, thus satisfying the need for various different gluing depths during surface-mounting process, at the same time, by allowing gluing agent to flow between the grooves of different depths, update rate of the gluing agent is improved greatly, thus effectively solving the problem of the gluing agent being prone to volatilization and drying off.

Description

Chip bumping device

Technical field

The present invention relates to the field of electronic product surface mount technology, and more particularly to a chip coating device for chip bumps.

Background technique

Electronic products have entered the era of SMT (Surface Mount Technology), where the printing press is responsible for printing flux onto the PCB (Prinected Circuit Board), and the placement machine is responsible for mounting components on the PCB. And then reflow soldering. At present, with the development of electronic products in the direction of portable and miniaturization, the outward dimension of the mounted components is gradually miniaturized, and the package pitch of the mounted components is developed to a finer pitch, so that the requirements for the printed flux are higher and higher, especially 0. 3 The appearance of mounting components such as BGA (Ba ll Gr id Array) and CSP (Chip Sca le Package) with a pitch of 0.3 mm or less, printing flux becomes very difficult or It is impossible to achieve at this time. It is necessary to apply the flux or solder paste to coat the bumps of the chip. The bumps of the chip are the connection points of the chip and the PCB, for example, solder balls or bumps. The bump of the chip is immersed in a groove containing a flux, the bump of the chip is coated with a flux, and then the chip is mounted on the PCB for reflow soldering. At present, the industry generally adds a coating device to the chip to complete the function of the bump coating of the chip. The coating device needs to provide a certain depth of flux to the bump of the chip, and the depth of the coating is the key. Process parameters.

At present, the commonly used sputum coating device places a smear paint through a groove, and the depth of the smear is controlled by the depth of the groove itself. 1 is a schematic view of a prior art smear coating device. As shown in FIG. 1, in the prior art, a sputum coating device has a groove 10, that is, a smear depth is provided in the same smear feeding device. The sputum coating device usually occupies multiple stations of the placement machine. For the case where multiple smear depths are required, a plurality of sputum coating devices are usually provided, so that multiple smear feeding devices greatly reduce the placement machine. The space for accommodating materials, there is a problem that the space utilization rate of the material contained in the placement machine is not high; in addition, the renewing rate of the smear agent in the plurality of sputum coating devices is low, and the smear agent is easy to volatilize and dry, which is not conducive to the process. control.

Summary of the invention

The embodiment of the invention relates to a smear coating feeding device for chip bumps, which solves the problem that the space utilization rate of the material contained in the placement machine is not high, and at the same time, can solve the low update rate of the smear coating agent in the plurality of smear coating devices. The coating agent is easy to volatilize and dry, which is not conducive to the problem of process control. An embodiment of the present invention provides a chip coating device for a chip bump, wherein the chip coating device of the chip bump includes: a substrate having grooves of different depths on the substrate, wherein the grooves of different depths For providing different smear depths, the chip bumps are smeared in grooves having the same depth as the smear depth of the chip bumps; the grooves of different depths are electrically connected.

The squeegee feeding device of the chip bump proposed by the embodiment of the invention provides different 蘸 by the same 蘸 coating feeding device by designing grooves of different depths on the substrate and conducting the grooves between the different depths. The coating depth does not require the placement of the material in the placement machine to place the coating device with different coating depths, which solves the problem that the space utilization rate of the material contained in the placement machine is not high, and the coating agent between the grooves of different depths It can flow to each other, greatly improve the renewal rate of the enamel paint agent, and effectively solve the problem that the enamel paint agent is easy to volatilize and dry.

DRAWINGS

1 is a schematic view of a sputum coating device in the prior art;

2 is a schematic diagram of a device for feeding a chip bump according to an embodiment of the present invention;

3 is a second schematic view of a chip coating device for a chip bump according to an embodiment of the present invention;

4 is a third schematic view of a chip coating device for a chip bump according to an embodiment of the present invention;

5 is a cross-sectional view showing a smear coating device of a chip bump of an embodiment of the present invention;

6 is a fourth schematic view of a chip coating device for a chip bump according to an embodiment of the present invention;

FIG. 5 is a schematic diagram of a sputum coating device of a chip bump according to an embodiment of the present invention;

FIG. 8 is a sixth schematic diagram of a die coating device for a chip bump according to an embodiment of the present invention. detailed description

The technical solution of the present invention will be further described in detail below through the accompanying drawings and embodiments.

The embodiment of the invention provides a squeegee feeding device for chip bumps, wherein the smear coating agent in the groove has different smear depths by providing grooves of different depths on the substrate, and the device does not need to hold the material in the placement machine. The sputum coating feeding device with different smearing depths is placed in the space, which solves the problem that the space utilization rate of the material contained in the placement machine is not high. At the same time, a plurality of grooves are mutually conductive, and the coating agents between the plurality of grooves can flow with each other, the utilization rate of the coating agent is remarkably improved, and the updating speed is accelerated, thereby solving the problem that the coating agent is easy to use during use. The problem of volatilization and drying. Embodiment 1 of the present invention 2 is a schematic diagram of a chip coating device for a chip bump according to an embodiment of the present invention. As shown in FIG. 2, the chip coating device of the chip bump of the first embodiment of the present invention provides grooves of different depths on the substrate 23. 21 and the groove 22, the groove 21 and the groove 11 are directly connected (direct conduction is to directly remove the isolation surface between the grooves). 3 is a second schematic view of a die-feeding device for a chip bump according to an embodiment of the present invention. The meaning of direct conduction between the groove 21 and the groove 22 can be more clearly understood by FIG. 3, that is, the bottom of each groove and each The connecting portions between the grooves are connected in a stepped shape. As shown in FIG. 3, the substrate 23 is provided with grooves 21 and grooves 22 of different depths, and the direct connection between the grooves 21 and the grooves 22 is to remove the separation surface 24 between the grooves 21 and the grooves 22. Therefore, there is no space between the grooves, which greatly saves the space occupied by the squeegee feeding device and the space for accommodating the placement machine.

4 is a third schematic view of a chip coating device for a chip bump according to an embodiment of the present invention. As shown in FIG. 4, when the sputum coating device is filled with a smear agent, the groove 21 and the groove 22 have different depths. Thus, the grooves 21 and grooves 11 can provide different smear depths.

It should be noted that the smear feeding device can be provided with a plurality of grooves having different depths, and the number of the grooves can be determined according to actual needs, and is not specifically limited in the embodiment of the present invention, and generally 2-4 different types can be set. Depth groove (preferably 2-3); if the number of grooves is set too small, it may not meet the needs of different smearing depths. If too many settings are used, the tamping depth is not high, but the patch is caused. The space of the station is wasted.

The depth of the groove is generally in the range of 4mi 1 to 12mi 1 , and the height difference of the groove is between 0. 5mi 1 and 4mi 1 , which can be determined according to actual needs. For example, the height difference between the grooves can be designed as 0. 5mi l, Imi 0. 1 hidden, etc., in the embodiment of the present invention, preferably lmi l.

The smear agent is a flux or solder paste or other smear liquid.

Specifically, as shown in Fig. 4, in order to exemplify the process of adding the smear coating agent 25 to the sputum coating device, a smear coating hopper 26 is added to the schematic drawing device of Fig. 4. The smear coating dosing tank 26 is provided with a smear coating agent 25, the bottom of the smear coating dosing tank 26 is open and the bottom of the smear coating dosing trough 26 is in close contact with the substrate 23, and the smear coating dosing tank 26 can be on the substrate 23 The upper surface slides freely in the horizontal direction. Grooves 21 and grooves 22 having different depths are disposed on the substrate 23. The coating agent dosing tank 26 containing the coating agent 25 is slowly slid from one end of the substrate 23 to the other end of the substrate 23, and the coating agent 25 gradually fills the groove 21 during the sliding of the coating agent dosing groove 26. And the groove 22, the upper surface of the smear agent 25 in the final groove 21 and the groove 22 is flush with the upper surface of the substrate 23, at this time, since the groove 21 and the groove 22 have different depths, the groove 21 and the concave Two different smearing depths can be formed in the groove 22, that is, the connecting portions between the bottom of each groove and each groove are connected in a stepped shape. During the dip coating process, the chip bumps may be selected to be smeared by grooves having the same depth as the smear depth of the chip bumps, depending on the desired smear depth.

5 is a cross-sectional view of a smear coating device of a chip bump according to an embodiment of the present invention, as shown in the drawing, a groove 21 The groove 22 is filled with the smear agent 25, and the groove 21 and the groove 22 are different in depth, so that the groove 21 and the groove 22 are different in coating depth. The chip 41 has a bump 42 thereon, and the other chip 43 includes a bump 44. The size of the chip 41 and the chip 43 are different, and the depth of the coating required during the mounting process is different, depending on the needs of the two chips. , respectively, the chip is placed in two grooves with different smear depths for smearing.

The squeegee feeding device of the chip bump of the first embodiment of the present invention is provided with two grooves 21 and grooves 22 having different depths on the substrate, and the grooves 21 and the grooves 22 are directly connected, so that the same 蘸 can be The coating feeder simultaneously provides two different smear depths, and there is no space between the grooves, which greatly saves the space occupied by the squeegee feeder and the space of the placement machine; and the groove 21 and The groove 22 is directly conductive, and the coating agent in the groove 21 and the coating agent in the groove 22 can flow to each other, which greatly improves the rate of renewal of the coating agent in the groove, and is effective. The problem that the enamel paint is easy to volatilize and dry is avoided, and the control of the smear coating process is facilitated. Embodiment 2 of the present invention

FIG. 6 is a fourth schematic view of a squeegee feeding device for a chip bump according to an embodiment of the present invention. As shown in FIG. 6, the squeegee feeding device of the chip bump of the second embodiment of the present invention respectively provides a groove 61 and a groove 62. The groove 63, the groove 61, the groove 62, and the groove 63 have different depths. When the groove 61, the groove 62, and the groove 63 are filled with the coating agent 25, the grooves formed by the grooves of different depths are formed. The depth is different, that is, the depth of the coating agent corresponding to the groove 61 is different from the depth of the coating agent corresponding to the groove 62 and the depth of the coating agent corresponding to the groove 63, that is, between the bottom of each groove and each groove The connecting portions are connected in a stepped shape. At this time, the grooves 61, the grooves 62, and the grooves 63 can provide three different coating depths. The specific smear coating method is the same as that of the first embodiment, and details are not described herein again.

The second embodiment of the present invention is the same as the principle of the first embodiment of the present invention, that is, a plurality of grooves having different depths are disposed on the substrate, and the grooves having different depths are directly connected, so that the same time point can be simultaneously provided. A variety of different coating depths; at the same time, the coating agent in the groove can flow to each other, which greatly improves the rate of renewal of the coating agent in the groove, effectively avoiding the phenomenon that the coating agent is easy to volatilize and dry. Embodiment 3 of the present invention

FIG. 7 is a fifth schematic diagram of a chip coating device for a chip bump according to an embodiment of the present invention. As shown in FIG. 7, the chip coating device of the chip bump of the third embodiment of the present invention has grooves of different depths on the substrate 70. 71. The upper portion of the groove 72, the groove 73, the groove 71, the groove 72, and the groove 73 are electrically connected to each other. Specifically, when the grooves are filled with the smear agent, since the depths of the grooves 71, 72, and 73 are different, that is, the connecting portions between the bottoms of the grooves and the grooves are connected to each other to make a mouth-like shape, so that The depth of the coating of the coating agent in the groove 71, the groove 72, and the groove 73 is different. When the different chip bumps need different coating depths, the corresponding grooves may be selected according to actual needs for the smear coating. The specific smear coating method is the same as that of the first embodiment, and details are not described herein again. At the same time, since the grooves 71, the grooves 72, and the grooves 73 are electrically connected to each other, the liquids in the three grooves can flow to each other, and the force is faster than the rate of renewal of the liquid in the grooves.

The principle of the third embodiment of the present invention is essentially to provide a plurality of grooves having different depths on the substrate, and the upper portions of the plurality of grooves having different depths are turned on, so that a plurality of different coating depths can be simultaneously provided in the same sputum coating device. . The third embodiment of the present invention uses the principle of the upper portion between the grooves at different depths, and the first embodiment of the present invention uses the principle of direct conduction between the grooves at different depths, and the essence thereof is The different coating depths are provided, and the coating agents in the grooves can flow to each other, which greatly improves the renewal rate of the coating agent in the grooves, and effectively avoids the phenomenon that the coating agent is easily volatilized and dried. Embodiment 4 of the present invention

FIG. 8 is a sixth schematic diagram of a chip coating device for a chip bump according to an embodiment of the present invention. As shown in FIG. 8, the chip coating device of the chip bump of the fourth embodiment of the present invention provides grooves having different depths on the substrate 80. 81. The grooves 82, the grooves 83, the grooves 81, the grooves 82, and the bottoms of the grooves 83 are electrically connected to each other. Specifically, when the grooves are filled with the smear agent, since the depths of the grooves 81, the grooves 82, and the grooves 83 are different, that is, the connecting portions between the bottoms of the grooves and the grooves are connected to each other to make a mouth-like shape, so that The depth of the coating of the coating agent in the groove 81, the groove 82 and the groove 83 is different. When different chip bumps need different coating depths, the corresponding grooves may be selected according to actual needs for coating. The specific smear coating method is the same as that of the first embodiment, and details are not described herein again. At the same time, since the grooves 81, the grooves 82, and the grooves 83 are electrically connected to each other, the liquids in the three grooves can flow to each other, and the force is faster than the renewal rate of the liquid in the grooves.

The principle of the fourth embodiment of the present invention is essentially to provide a plurality of grooves having different depths on the substrate, and the bottoms of the plurality of grooves having different depths are turned on, so that a plurality of different smear depths can be simultaneously provided at the same time point. In the fourth embodiment of the present invention, the principle of the bottom conduction between the grooves of different depths is used, and the first embodiment of the present invention uses the principle of direct conduction between the grooves of different depths, and the essence thereof is The different coating depths are provided, and the coating agents in the grooves can flow to each other, which greatly improves the renewal rate of the coating agent in the grooves, and effectively avoids the phenomenon that the coating agent is easily volatilized and dried.

In the squeegee feeding device of the chip bump in the embodiment of the present invention, a plurality of grooves having different depths are disposed on the substrate, so that a plurality of smearing depths can be simultaneously provided in the same sputum coating device. At the same time, a plurality of grooves are electrically connected to each other, and the coating agents can flow between the plurality of grooves, and the utilization rate of the coating agent is remarkably improved, and the renewal speed is increased. Speed up.

The squeegee feeding device of the chip bump proposed by the embodiment of the invention overcomes the shortcoming that the conventional smear coating device can only provide one smear depth in a sputum coating device, and satisfies the need for the electronic device in the smear coating process. The depth of the coating is greatly reduced, and the space occupied by the coating device is greatly reduced, which provides more space for the placement machine to accommodate the material; at the same time, the coatings of various coating depths can circulate between each other. The utilization rate of the enamel paint agent is remarkably improved, the renewal speed of the enamel paint agent is accelerated, the problems of volatilization agent drying and drying are effectively avoided, and the process control is facilitated.

The above described embodiments of the present invention are further described in detail, and the embodiments of the present invention are intended to be illustrative only. The scope of the protection, any modifications, equivalents, improvements, etc., made within the spirit and scope of the invention are intended to be included within the scope of the invention.

Claims

Claim

A chip coating device for a chip bump, wherein the chip bump coating device comprises:

a substrate having grooves of different depths on the substrate, wherein the grooves of different depths are used to provide different coating depths, and the chip bumps are concave at the same depth as the coating depth of the chip bumps The coating is performed in the groove; the grooves of different depths are electrically connected.

2. The chip coating device for a chip bump according to claim 1, wherein the grooves of different depths are directly turned on.

3. The die-casting device for a chip bump according to claim 1, wherein the grooves of different depths are electrically connected at an upper portion or a bottom portion.

The chip coating device for a chip bump according to any one of claims 1 to 3, wherein the number of the grooves is 2-4.

The chip coating device for a chip bump according to any one of claims 1 to 4, wherein the groove has a depth of 4 mU to 12 mil.

5mi l-4mi L The height difference of the groove is 0. 5mi l-4mi L, the height difference of the groove is 0. 5mi l-4mi L

The chip coating device for a chip bump according to any one of claims 1 to 6, wherein the smear agent is a flux or a solder paste.