WO2012101691A1 - 光源装置 - Google Patents
光源装置 Download PDFInfo
- Publication number
- WO2012101691A1 WO2012101691A1 PCT/JP2011/005484 JP2011005484W WO2012101691A1 WO 2012101691 A1 WO2012101691 A1 WO 2012101691A1 JP 2011005484 W JP2011005484 W JP 2011005484W WO 2012101691 A1 WO2012101691 A1 WO 2012101691A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- heat
- circuit unit
- cylindrical portion
- emitting module
- case
- Prior art date
Links
- 230000017525 heat dissipation Effects 0.000 claims description 16
- 230000005855 radiation Effects 0.000 claims description 13
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 description 15
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- 230000002093 peripheral effect Effects 0.000 description 14
- 239000000463 material Substances 0.000 description 13
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- 210000000078 claw Anatomy 0.000 description 7
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- 238000003780 insertion Methods 0.000 description 6
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- 239000000758 substrate Substances 0.000 description 6
- 230000004048 modification Effects 0.000 description 5
- 238000012986 modification Methods 0.000 description 5
- 229920001707 polybutylene terephthalate Polymers 0.000 description 5
- 229920003002 synthetic resin Polymers 0.000 description 5
- 239000000057 synthetic resin Substances 0.000 description 5
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 4
- 229910052736 halogen Inorganic materials 0.000 description 4
- 150000002367 halogens Chemical class 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 239000004417 polycarbonate Substances 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 238000010079 rubber tapping Methods 0.000 description 2
- 239000003566 sealing material Substances 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 208000019901 Anxiety disease Diseases 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
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- 230000007423 decrease Effects 0.000 description 1
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- 238000010292 electrical insulation Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
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- 238000007789 sealing Methods 0.000 description 1
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Images
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/15—Thermal insulation
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V3/00—Globes; Bowls; Cover glasses
- F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
- F21V3/06—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material
- F21V3/062—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material the material being plastics
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V5/00—Refractors for light sources
- F21V5/04—Refractors for light sources of lens shape
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
- F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
- F21V23/006—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate being distinct from the light source holder
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/02—Arrangement of electric circuit elements in or on lighting devices the elements being transformers, impedances or power supply units, e.g. a transformer with a rectifier
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
- F21V29/507—Cooling arrangements characterised by the adaptation for cooling of specific components of means for protecting lighting devices from damage, e.g. housings
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V3/00—Globes; Bowls; Cover glasses
- F21V3/02—Globes; Bowls; Cover glasses characterised by the shape
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Definitions
- the present invention relates to a light source device, and more particularly to a light source device having a light emitting element such as an LED and incorporating a circuit unit for lighting the light emitting element.
- a solid light emitting element such as an LED
- the higher the temperature during light emission the lower the light emission efficiency and the shorter the life.
- electronic components constituting a circuit unit for lighting the same, which are broken or have a reduced life under the influence of heat.
- Patent Document 1 discloses a light source device having a casing having a configuration in which a hollow portion of a cylindrical body formed of a good heat conductive material such as aluminum is partitioned by a plate material made of the same material. The edge of the plate material is folded back with a fixed width, and the plate material is fixed to the cylinder in a state in which the outer peripheral surface of the folded portion is in close contact with the inner peripheral surface of the cylinder.
- An LED module which is a light emitting module consisting of a printed circuit board and an LED mounted thereon, is mounted on one side of a plate, and a circuit unit is accommodated in the hollow portion on the other side of the plate. .
- the heat generated by the LED module during lighting is dissipated through the plate and the cylinder.
- heat generated in the circuit unit is also transmitted to the cylindrical body by radiation, convection in the hollow portion, or the like, and is radiated from the outer surface of the cylindrical body.
- the following problems may occur because the cylinder functioning as the heat dissipation member is shared by the LED module and the circuit unit.
- the heat transferred from the circuit unit to the cylinder is mostly transmitted beyond the fixed position of the plate material, which causes The heat dissipation of the heat from the LED module in the cylinder decreases.
- the present invention provides a light source device capable of ensuring the heat dissipation of a light emitting module and a circuit unit by excluding the thermal influence between the light emitting module and the circuit unit as much as possible. With the goal.
- a light source device includes a light emitting module, a first heat radiating member to which the light emitting module is attached, a circuit unit for lighting the light emitting module, and the circuit unit. And a second heat radiation member to be accommodated, wherein a heat insulating member is interposed between the first heat radiation member and the second heat radiation member.
- the first heat radiation member has a bowl shape having a flat bottom
- the second heat radiation member has a cylindrical portion
- the heat insulation member has a plate shape
- the light emission The module is attached to the inner bottom of the first heat radiating member, and the circuit unit is housed in the cylindrical portion of the second heat radiating member, and the outer bottom of the first heat radiating member and the outer bottom of the first heat radiating member
- the heat insulating member is interposed between one end of the second heat radiating member and the one end of the cylindrical portion.
- the cylindrical portion may be cylindrical, and the heat insulating member may be circular.
- the second heat radiation member is extended from the other end of the cylindrical portion, and has a small cylindrical portion smaller in diameter than the cylindrical portion, and the small cylindrical portion includes the circuit unit It is characterized in that an electrically connected base is attached.
- the heat insulating member has at least one through hole penetrating in the thickness direction, and the first heat radiating member and the second heat radiating member are fastened by a fastening member inserted into the through hole. It is characterized by being.
- the heat generated in the light emitting module during lighting is conducted to the first heat radiating member attached thereto, and is conducted in the first heat radiating member to be transmitted.
- the heat is dissipated from the surface of the heat dissipation member 1.
- the heat generated in the circuit unit is conducted to the second heat dissipation member by radiation or convection in the storage space, and is transmitted through the inside of the second heat dissipation member to the surrounding space from the outer peripheral surface of the second heat dissipation member. Heat is dissipated.
- the heat insulating member is interposed between the first heat radiating member and the second heat radiating member, the heat from the light emitting module is conducted to the second heat radiating member, or from the circuit unit Since the heat of the first heat dissipation member is suppressed as much as possible, the thermal influence between the light emitting module and the circuit unit is eliminated as much as possible, and the light emitting module and the circuit unit are respectively The heat dissipation is secured by the first and second heat dissipation members provided correspondingly.
- FIG. 1 is a perspective view of an LED lamp 10 shown as an example of a light source device
- FIG. 2 is an exploded perspective view thereof
- FIG. 3 is a longitudinal sectional view thereof.
- the scale among the members is not uniform. Further, some members in FIG. 3 are shown without being cut.
- a dashed dotted line indicates the lamp axis J, and the direction indicated by the arrow X parallel to the lamp axis J is the front of the light source device and is also the illumination direction.
- the LED lamp 10 is an alternative light source of a halogen lamp with a reflector. That is, as shown in FIG. 1, the external appearance is made similar to a halogen bulb with a reflecting mirror, and a base 26 is provided, and the circuit unit 22 is built in (FIG. 2, FIG. 3) It can be used by attaching it to a lamp for a light bulb.
- the LED lamp 10 includes a body 12, a light emitting module 14, an optical member 16, a front cover 18, a heat insulating member 20, a circuit unit 22, a case 24, and a base 26.
- the body 12 has a bowl shape having a cylindrical portion 28 whose diameter gradually increases from the rear to the front, and a disk-like (flat) bottom portion 30 closing the rear of the cylindrical portion 28.
- the body 12 is in the form of a bowl having a flat bottom 30.
- the shape of the cylindrical portion 28 cut in a plane orthogonal to the lamp axis J is circular, and the axial center of the cylindrical portion 28 (also the axial center of the body 12) coincides with the lamp axis J.
- the shape of the bottom part 30 is not restricted to disk shape.
- it may be an oval plate shape, a square plate shape, or a polygonal plate shape.
- the light emitting module 14 is attached to the inner bottom portion 30 a of the body 12.
- the body 12 is formed of a metal having good thermal conductivity, such as aluminum, and plays a role as a heat dissipation member (first heat dissipation member) of heat generated in the light emitting module 14 exclusively.
- the body 12 may be made of resin or ceramic having good thermal conductivity.
- an optical member 16 is accommodated in the body 12. If a light transmitting material is used for the body 12, it is possible to light the body 12 itself and to irradiate it backward, and the appearance performance at the time of use can be improved.
- An annular flange portion 32 is provided extending in the direction orthogonal to the lamp axis J from the open end of the cylindrical portion 28.
- the front cover 18 is attached to the body 12 by locking the claws 34 to the flanges 32. Furthermore, on the rear surface of the flange portion 32, a plurality of protrusions 36 are provided at intervals along the circumferential direction of the flange portion.
- the projection 36 suppresses idle rotation of the front cover 18 relative to the body 12. That is, when the front cover 18 is rotated about the lamp axis J, the claws 34 abut on the projections 36 and the front cover 18 does not rotate further with respect to the body 12. Note that the number of protrusions 36 is arbitrary.
- the light emitting module 14 includes a module substrate 38 and an LED unit 40 mounted substantially at the center of the module substrate 38, and is mounted at a substantially central position of the inner bottom portion 30 a of the body 12.
- the LED unit 40 includes, for example, a unit substrate 42, an LED chip 44 mounted on the unit substrate 42, a phosphor mounted on the LED chip 44, and a hemispherical sealing material for sealing the LED chip 44. And 46.
- the LED chip 44 for example, one emitting InGaN-based blue light is used, and a yellow-green phosphor is used as the phosphor. As a result, a part of the blue light from the LED chip 44 is converted to yellow-green light by the phosphor, and the converted yellow-green light and the blue light not converted are mixed, and white light is emitted.
- the optical member 16 is made of, for example, a translucent material such as a transparent acrylic resin, and has a lens portion 48 substantially in the shape of a truncated cone, and an outer edge portion 50 substantially in the shape of a ring plate extended on the peripheral surface of the lens portion 48.
- the lens portion 48 and the outer edge portion 50 are integrally formed.
- the lens portion 48 is located approximately at the center of the inside of the body 12 and in front of the light emitting module 14.
- the lens portion 48 has a substantially cylindrical recess 52 at the rear end, and the optical member 16 is positioned with respect to the LED unit 40 by fitting the sealing material 46 of the LED unit 40 in the recess 52. There is.
- the light emitted from the light emitting module 14 mainly enters the lens unit 48 from the recess 52, passes through the lens unit 48, and is extracted from the front surface of the lens unit 48 to the outside of the body 12.
- the light emitted from the light emitting module 14 passes through the lens unit 48, its path is changed. Specifically, the emitted light is focused by the lens unit 48 and becomes spot light of a light distribution characteristic similar to a halogen lamp with a reflecting mirror. Note that, on the front surface of the lens unit 48, for example, a light diffusion process in which a plurality of asperities for diffusing outgoing light is provided is performed.
- the outer edge portion 50 is located on the rear side of the front cover 18 so as to close the opening of the body 12, and the front surface of the outer edge portion 50 faces the rear surface of the front cover 18 in surface contact. Since the outer edge portion 50 and the front cover 18 are in surface contact, the heat of the optical member 16 is easily conducted to the front cover 18. Therefore, the heat generated by the LED unit 40 can be efficiently dissipated from the front cover 18 to the outside through the optical member 16. When the front cover 18 is translucent, light slightly leaked from the optical member 16 can be transmitted, and the entire front surface of the lamp can be illuminated.
- the front cover 18 includes, for example, a flat annular main body 56 having a substantially circular light emission window 54, and a short cylindrical peripheral wall 58 extending rearward from the outer peripheral edge of the main body 56. .
- the shape of the front cover 18 is not limited to the above, and may be any shape in accordance with the shape of the opening 11 of the body 12.
- the front cover 18 is formed of an opaque resin such as white PBT (polybutylene terephthalate). PBT is suitable as the material of the front cover 18 because it has high heat resistance, moderate elasticity, and excellent weather resistance.
- the resin constituting the front cover 18 is not limited to PBT, and may be acrylic, PC (polycarbonate) or the like. Further, the color of the front cover 18 is not limited to white and is arbitrary. It may be transparent or translucent.
- the peripheral wall portion 58 is provided with a plurality of claw portions 34 at intervals along the circumferential direction.
- a plurality of the claws 34 are arranged at equal intervals along the circumferential direction of the peripheral wall 58 near the rear end edge of the inner peripheral surface of the peripheral wall 58, and each claw 34 is on the lamp axis J side Protruding towards.
- the number of claws 34 is arbitrary.
- the body portion 56 is provided with holes 62 at positions corresponding to the claws 34. Since such a hole 62 is provided, it is possible to form a complex shaped front cover 18 with resin molding using a simple mold having a small number of components.
- the front cover 18 urges the optical member 16 rearward, whereby the front cover 18 and the outer edge portion 50 are in surface contact, and the lens portion 48 is in contact with the light emitting module 14. Thereby, the movement of the optical member 16 in the front-rear direction is restricted, and the positional deviation and rattling of the optical member 16 are prevented.
- the heat insulating member 20 has a disk shape substantially the same size as the bottom portion 30 of the body 12, and literally has heat insulating properties.
- the thermal conductivity is less than 10 [W / mK]
- the thermal conductivity is 10 [W / mK] or more
- the heat insulating member 20 is formed of a material having a thermal conductivity of less than 10 [W / mK]
- the body portion 12 which is the first heat radiating member and the case which is the second heat radiating member described in detail later.
- Each of 24 is formed of a material having a thermal conductivity of 10 [W / mK] or more.
- the heat insulating member 20 is formed of, for example, PBT, PET, PC, PPS, or other synthetic resin.
- the heat insulating member 20 is interposed between the body portion 12 and the case 24 in order to thermally insulate the body 12 which is the first heat radiating member and the case 24 which is the second heat radiating member described later in detail. ing.
- the heat insulating member 20 also functions to electrically insulate the circuit unit 22 from the body 12.
- the heat insulating member 20 has substantially the same size as the bottom portion 30 of the body 12. That is, although the diameter of the heat insulating member 20 is substantially the same as the diameter of the bottom 30, the diameter of the heat insulating member 20 is larger than the diameter of the bottom 30, and the periphery of the heat insulating member 20 is from the bottom 30 You may make it project. Alternatively, conversely, the diameter of the heat insulating member 20 may be smaller than the diameter of the bottom portion 30 so that the periphery of the heat insulating member 20 is completely inside the periphery of the bottom portion 30.
- the shape of the heat insulating member 20 may be an elliptical plate, a square plate, or a polygonal plate according to this. I do not care.
- the circuit unit 22 includes, for example, a rectifier circuit that rectifies AC power supplied from a commercial power source into DC power, and a lighting circuit including a voltage adjustment circuit that adjusts the voltage value of DC power rectified by the rectifier circuit.
- the circuit unit 22 is electrically connected to the base 26 and the LED unit 40, receives power from a lighting fixture (not shown) via the base 26, and causes the LED chip 44 of the LED unit 40 to emit light.
- the circuit unit 22 includes a circuit board 64 and a plurality of electronic components 66 mounted on the circuit board 64, and is housed in the case 24.
- the case 24 is made of a material having electrical insulation and thermal conductivity.
- the case 24 is made of, for example, a resin to which a heat conductive filler is added or a ceramic having a high heat conductivity, and functions as a heat radiating member (second heat radiating member) of the circuit unit 22 housed in the case 24.
- the case 24 has a large cylindrical portion 68, a small cylindrical portion 70 smaller in diameter than the large cylindrical portion 68, and a tapered cylindrical portion 72 connecting the large cylindrical portion 68 and the small cylindrical portion 70.
- the large cylindrical portion 68 has a flange portion 68a whose open end portion extends in the radial direction.
- the case 24 is provided with three bulging portions 74 protruding in a semi-cylindrical shape along the axial center direction and the inner wall, and at three positions having a thickness from the bulging portion 74 to the collar portion 68 a ,
- the screw hole 76 (FIG. 2) is opened.
- the large cylindrical portion 68 is not limited to a cylindrical shape, but may have a cylindrical shape other than this.
- the large cylindrical portion 68 is an elliptical cylinder, a square cylinder, a polygonal cylinder according to this. It does not matter as a form.
- the base 26 is a member for receiving power from a socket (not shown) of the lighting apparatus when the LED lamp 10 is attached to the lighting apparatus and turned on.
- the type of the base 26 is not particularly limited, but in the present embodiment, an E11 base which is an Edison type is used.
- the base 26 has a substantially cylindrical shape and has a shell portion 78 and an eyelet portion 80 whose outer peripheral surfaces are male threads, and is attached to the small cylindrical portion 70 of the case 24 in an externally fitted state.
- the case 24 in which the circuit unit 22 is housed, the heat insulating member 20, the body 12, and the light emitting module 14 are assembled by being fastened with a plurality of (in this example, three) screws 82.
- the screw 82 is a tapping screw.
- the number of screws 82 may be one.
- the number of notches 38a, insertion holes 30c, insertion holes 20a, and pilot holes 76, which will be described later, is also adjusted in accordance with the number of screws 82.
- the bottom portion 30 of the body 12 is provided with a plurality of insertion holes 30 c for screwing and wiring holes (not shown) for wiring.
- the heat insulating member 20 is also provided with a plurality of insertion holes 20 a and wiring holes 20 b.
- a plurality of U-shaped notches 38a are formed in the module substrate 38 of the light emitting module 14. Screws 82 are inserted in the mentioned order into the notch 38 a of the module substrate 38, the insertion hole 30 c of the body 12, and the insertion hole 20 a of the heat insulating member 20 and screwed into the lower hole 76 of the case 24.
- An internal thread is formed in the hole 76, and the body 12, the light emitting module 14, the heat insulating member 20 and the case 24 are assembled integrally.
- the wiring (not shown) of the light emitting module 14 is led out to the inside of the case 24 through the wiring hole (not shown) formed in the bottom portion 30 of the body 12 and the wiring hole 20 b of the heat insulating member 20. And are electrically connected.
- a recess 68c communicating with the wiring hole 20b is formed on the inner peripheral surface of the flange portion 68a of the case 24, and the recess 68c also communicates with the internal space of the case 24.
- the wiring is positioned at a predetermined position in the case 24 by passing through the recess 68c.
- the screw 82 is not limited to a tapping screw, and a general small screw may be used. When a small screw is used, it is replaced with the pilot hole 76 to form a female screw to be screwed with the small screw. deep.
- the heat generated in the light emitting module 14 during the lighting is conducted to the body 12 which is the first heat radiation member attached thereto and is dissipated from the surface of the body 12 Become.
- the heat generated in the circuit unit 22 is conducted to the case 24 which is the second heat radiating member by radiation or convection in the case 24, and the LED lamp is transmitted from the outer peripheral surface of the case 24 to the surrounding space or through the base 26. The heat is dissipated to the luminaire on which 10 is mounted.
- FIG. 4 is a cross-sectional view of a case 90 which is one of the components of the LED lamp according to the modification.
- the LED lamp according to the modification has the same configuration as the LED lamp 10 except that the structure of the case is different. Therefore, the explanation other than the case is omitted.
- case 90 has the same configuration as the case 24 except that a metal cylinder 94 described later is added to the case 24 (FIG. 3). Therefore, in the case 90 shown in FIG. 4, the components substantially the same as the case 24 are denoted by the same reference numerals, and the description thereof is omitted.
- the case 90 has a main body 92 made of a synthetic resin and a metal cylinder 94.
- the case for housing the circuit unit is formed of a synthetic resin
- the circuit unit When the case for housing the circuit unit is formed of a synthetic resin, if the circuit unit generates heat abnormally due to some trouble, this may cause part of the case to be melted and the holes to be opened. Since this state is visually recognized in appearance, it gives the user anxiety.
- a case 90 for housing the circuit unit 22 is made of a synthetic resin, and a main body portion 92 having a cylindrical portion, and a part thereof is embedded in the main body portion 92 by insert molding to closely contact the outer peripheral surface of the cylindrical portion. And a metal cylinder 94 having a cylindrical portion to be covered.
- the metal cylinder 94 and the outer periphery of the main body portion 92 are in close contact with each other and the gap is eliminated. It can be suppressed as long as possible.
- the metal cylinder 94 since a part of the metal cylinder 94 (a part bent inward from one end and the other end of the cylindrical part) is embedded in the main body 92, the metal cylinder 94 may come off from the main body 92. It can prevent.
- the metal cylinder 94 is integrated with the main body 92 during injection molding of the main body 92, for example, labor can be saved as compared with the case where the metal cylinder is joined to the main body with an adhesive or the like.
- the metal tube 94 is preferably a metal having excellent thermal conductivity from the viewpoint of securing heat dissipation, and is formed of, for example, aluminum or the like.
- the light source device according to the present invention can be suitably used, for example, as an alternative light source of a halogen lamp with a reflecting mirror.
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
Description
LEDランプ10は、反射鏡付きハロゲン電球の代替光源となるものである。すなわち、図1に示すように、外観を反射鏡付きハロゲン電球に近似させており、また、口金26を有し、回路ユニット22を内蔵していて(図2、図3)、反射鏡付きハロゲン電球用の照明器具に装着して使用できるものである。
ボディ12は、後方から前方に向かって漸次拡径した筒部28と、筒部28の後方を閉塞する円板状(平板状)の底部30とを有する椀状をしている。換言すると、ボディ12は、底部30が平坦な碗状をしている。筒部28をランプ軸Jと直交する平面で切断した形状は円形をしており、筒部28の軸心(ボディ12の軸心でもある)は、ランプ軸Jと一致している。
発光モジュール14は、モジュール基板38とモジュール基板38の略中央に実装されたLEDユニット40とを有しており、ボディ12の内底部30aの略中央位置に搭載されている。LEDユニット40は、例えば、ユニット基板42と、ユニット基板42に実装されたLEDチップ44と、LEDチップ44上に設置された蛍光体と、LEDチップ44を封止する半球状をした封止材46とを有する。LEDチップ44は、例えば、InGaN系の青色発光するものが用いられ、蛍光体には、黄緑色蛍光体が用いられる。これにより、LEDチップ44からの青色光の一部が蛍光体によって黄緑色光に変換され、変換された黄緑色光と変換されなかった青色光とが混色されて、白色光が出射される。
光学部材16は、例えば、透明アクリル樹脂などの透光性材料からなり、略円錐台形状のレンズ部48と、レンズ部48の周面に延設された略円環板状の外縁部50とを有し、レンズ部48と外縁部50とが一体に成形されている。
前面カバー18は、例えば、略円形状の光出射窓54を有する平板円環状の本体部56と、本体部56の外周縁から後方に向けて延出する短筒状の周壁部58とを備える。なお、前面カバー18の形状は上記に限定されず、ボディ12の開口11の形状に合わせてどのような形状であっても良い。
断熱部材20は、ボディ12の底部30と略同じ大きさの円板状をしており、文字通り、断熱性を有するものである。ここで、熱伝導率が10[W/mK]未満であれば断熱性を有する材料であるとし、熱伝導率が10[W/mK]以上であれば熱伝導性を有する材料であるとする。よって、断熱部材20は、熱伝導率が10[W/mK]未満の材料で形成されており、第1の放熱部材であるボディ部12と後で詳述する第2の放熱部材であるケース24とは、いずれも、熱伝導率が10[W/mK]以上の材料で形成されている。
回路ユニット22は、例えば、商用電源から供給された交流電力を直流電力に整流する整流回路、整流回路により整流された直流電力の電圧値を調整する電圧調整回路などからなる点灯回路を含む。回路ユニット22は、口金26およびLEDユニット40と電気的に接続されており、口金26を介して照明器具(不図示)から受電し、LEDユニット40のLEDチップ44を発光させる。
ケース24は、電気絶縁性および熱伝導性を有する材料からなる。ケース24は、例えば、熱伝導フィラーが添加された樹脂や熱伝導率の高いセラミックからなり、ケース24に収納される回路ユニット22の放熱部材(第2の放熱部材)として機能する。
口金26は、LEDランプ10が照明器具に取り付けられ点灯された際に、照明器具のソケット(不図示)から電力を受けるための部材である。口金26の種類は、特に限定されるものではないが、本実施の形態ではエジソンタイプであるE11口金が使用されている。口金26は、略円筒形状であって外周面が雄ネジとなったシェル部78とアイレット部80とを有し、ケース24の小円筒部70に外嵌状態で取り付けられている。
回路ユニット22が収納されたケース24、断熱部材20、ボディ12、および発光モジュール14は、複数本(本例では3本)のねじ82で締結されて組み立てられる。ねじ82は、タッピングねじである。なお、ねじ82の本数は、1本でも構わない。なお、ねじ82の本数に合わせて、後述する切欠き38a、挿通孔30c、挿通孔20a、下穴76の個数も調整される。
[変形例]
図4は、変形例に係るLEDランプの構成部材の一つであるケース90の断面図である。変形例に係るLEDランプは、ケースの構造が異なる以外は、LEDランプ10と同様の構成である。よって、ケース以外の説明については省略する。
によって両者を合体させることとしている。
12 ボディ
14 発光モジュール
20 断熱部材
22 回路ユニット
24 ケース
Claims (5)
- 発光モジュールと、
前記発光モジュールが取り付けられた第1の放熱部材と、
前記発光モジュールを点灯させるための回路ユニットと、
前記回路ユニットを収納する第2の放熱部材と、
を有し、
前記第1の放熱部材と前記第2の放熱部材との間に断熱部材が介挿されていることを特徴とする光源装置。 - 前記第1の放熱部材は、底部が平坦な碗状をしており、
前記第2の放熱部材は、筒状部を有し、
前記断熱部材は、板状をしていて、
前記発光モジュールは、前記第1の放熱部材の内底部に取り付けられており、前記回路ユニットは前記第2の放熱部材の前記筒状部に収納されていて、前記第1の放熱部材の外底部と前記第2の放熱部材の前記筒状部の一端部との間に前記断熱部材が介挿されていることを特徴とする請求項1に記載の光源装置。 - 前記筒状部は、円筒状をしており、
前記断熱部材は、円板状をしていることを特徴とする請求項2に記載の光源装置。 - 前記第2の放熱部材は、前記筒状部の他端部から延長され、当該筒状部よりも径の小さい小円筒状部を有し、
前記小円筒状部に、前記回路ユニットと電気的に接続された口金が取り付けられていることを特徴とする請求項3に記載の光源装置。 - 前記断熱部材は、その厚み方向に貫通する少なくとも1つの貫通孔を有し、
前記第1の放熱部材と前記第2の放熱部材とが、前記貫通孔に挿入された締結部材によって、締結されていることを特徴とする請求項2に記載の光源装置。
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US13/390,318 US8523410B2 (en) | 2011-01-27 | 2011-09-28 | Light source device with thermal dissipating members |
JP2012506243A JP5015357B1 (ja) | 2011-01-27 | 2011-09-28 | 光源装置 |
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