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WO2012165125A1 - Led lamp and cooker equipped with same - Google Patents

Led lamp and cooker equipped with same Download PDF

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Publication number
WO2012165125A1
WO2012165125A1 PCT/JP2012/062220 JP2012062220W WO2012165125A1 WO 2012165125 A1 WO2012165125 A1 WO 2012165125A1 JP 2012062220 W JP2012062220 W JP 2012062220W WO 2012165125 A1 WO2012165125 A1 WO 2012165125A1
Authority
WO
WIPO (PCT)
Prior art keywords
led lamp
heating chamber
substrate
emitting diode
heat sink
Prior art date
Application number
PCT/JP2012/062220
Other languages
French (fr)
Japanese (ja)
Inventor
直紀 杉村
Original Assignee
シャープ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2011125419A external-priority patent/JP2012253232A/en
Priority claimed from JP2011125426A external-priority patent/JP2012251738A/en
Application filed by シャープ株式会社 filed Critical シャープ株式会社
Publication of WO2012165125A1 publication Critical patent/WO2012165125A1/en

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24C—DOMESTIC STOVES OR RANGES ; DETAILS OF DOMESTIC STOVES OR RANGES, OF GENERAL APPLICATION
    • F24C15/00—Details
    • F24C15/008—Illumination for oven cavities
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B6/00—Heating by electric, magnetic or electromagnetic fields
    • H05B6/64—Heating using microwaves
    • H05B6/6444—Aspects relating to lighting devices in the microwave cavity
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
    • F21W2131/00—Use or application of lighting devices or systems not provided for in codes F21W2102/00-F21W2121/00
    • F21W2131/30—Lighting for domestic or personal use
    • F21W2131/307—Lighting for domestic or personal use for ovens
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements

Definitions

  • the present invention relates to an LED (light emitting diode) lamp and a cooking device provided with the same.
  • JP 2010-56059 A Patent Document 1
  • This LED lamp includes a substrate on which a light emitting diode element is mounted, and a heat sink on which the substrate is mounted.
  • the upper surface of the substrate and the heat sink, that is, the substrate side is covered with a substantially hemispherical transparent member, and the space between the transparent member and the heat sink is sealed.
  • a connection terminal is attached to the lower surface of the heat sink, that is, the side opposite to the substrate side via an insulating portion made of synthetic resin.
  • the heat sink has a shape in which the upper surface is a flat surface, the lower surface is a concave surface, the contour of the side surface is a part of a rotating hyperboloid, and the heat radiation fins project radially.
  • an insertion hole is provided in the center of the heat sink, and the light emitting diode element and the connection terminal are electrically connected by a wiring inserted through the insertion hole.
  • heat generated from the light emitting diode element is radiated into the air from the radial heat radiation fins of the heat sink.
  • an object of the present invention is to provide an LED lamp that can be sufficiently cooled even in a high-temperature atmosphere and has a long life, and a cooking device equipped with the LED lamp.
  • the present inventors pay attention to the presence of metal plates such as housings and cases in devices that generate high-temperature atmospheres such as heating cookers, video equipment, welding devices, heat treatment devices, and furnaces. We have intensively studied whether it can be used effectively for heat dissipation without interfering with the lamp illumination ability.
  • the inventor of the present invention invented an LED lamp that can use the metal plate very effectively for heat dissipation without impeding the illumination capability.
  • the LED lamp of the present invention is A substrate, A light-emitting diode element mounted on the first surface of the substrate; A transparent or translucent member covering the light emitting diode element and the first surface side of the substrate; A heat sink having a flat adhesion plane in close contact with the second surface opposite to the first surface of the substrate, and a flat heat radiation plane provided on the opposite side of the adhesion plane;
  • the heat sink includes an extension direction of the heat radiation plane of the heat sink or an oblique direction with respect to the extension direction and a connection terminal electrically connected to the light emitting diode element.
  • the heat generated from the light emitting diode element is transmitted to the first surface of the substrate, and is transmitted from the second surface of the substrate to the adhesion plane of the heat sink.
  • the contact flat surface of the heat sink is a flat surface in close contact with the second surface of the substrate, the contact area between the second surface of the substrate and the contact flat surface of the heat sink can be increased. Therefore, the heat of the light emitting diode element can be efficiently transmitted to the heat sink through the substrate.
  • the heat dissipation plane of the heat sink is flat, and thus the high temperature atmosphere is generated.
  • the heat sink flat surface of the heat sink can be easily brought into close contact with the surface of the metal plate of the device, and the heat sink is a simple flat plate on the second surface side, that is, the back surface side of the substrate and on the light emitting diode element emission side. Therefore, the contact area between the heat radiation flat surface of the heat sink and the surface of the metal plate can be increased with a simple and compact structure without impeding the illumination capability.
  • the heat sink can efficiently dissipate heat from the light emitting diode element by heat conduction to the metal plate that directly contacts the heat sink.
  • the metal plate is, for example, a casing or a housing, and can greatly increase the heat radiation area and can greatly increase the cooling effect. Therefore, this LED lamp can be used in a high temperature atmosphere and has a long life.
  • connection terminal since the connection terminal extends in the extending direction of the heat radiation plane of the heat sink or in an oblique direction with respect to the extension direction, the connection terminal should not be interposed between the surface of the metal plate and the heat radiation plane of the heat sink. it can.
  • the connecting terminal extends in an oblique direction with respect to the extending direction of the heat radiation plane of the heat sink where the connecting terminal is in close contact with the metal plate or the extending direction, the connecting terminal is not easily detached by a reaction force from the metal plate.
  • the LED lamp of the present invention has a simple, inexpensive, and compact structure, does not lower the illumination capability, can sufficiently cool the light emitting diode element even in a high temperature atmosphere, and can extend the life.
  • a thickness which is a dimension between the adhesion plane of the heat sink and the heat radiation plane, is smaller than the vertical and horizontal dimensions of the heat sink.
  • the “vertical dimension” refers to the long side of the outline with the outline of the heat radiation plane being substantially rectangular, and the “lateral dimension” refers to the short side of the outline.
  • the heat radiation plane and the contact plane are parallel because the structure becomes simple.
  • the contact plane 1021 and the heat radiation plane may not be parallel to 1022 but may be inclined.
  • the thickness dimension between the contact plane 1021 and the heat radiation plane 1022 refers to the dimension D between the central points in the tilt direction.
  • the inclination angle of the contact flat surface 1021 is exaggerated and increased.
  • the thickness which is the dimension between the adhesion plane and the heat radiation plane of the heat sink, is smaller than the vertical and horizontal dimensions of the heat sink, the heat radiation path between the adhesion plane and the heat radiation plane is Shorter. Therefore, the heat sink can quickly dissipate heat by quickly transferring heat from the light emitting diode element to the heat radiation plane.
  • the light emitting diode element and the connection terminal are connected by wiring on the substrate that passes outside without passing through the inside of the heat sink.
  • the light emitting diode element and the connection terminal are connected by the wiring on the substrate that passes outside without passing through the inside of the heat sink, it is possible to prevent the heat dissipation path of the heat sink from being reduced. it can.
  • the heat sink is provided with an insertion hole as in the conventional example, and the light emitting diode element and the connection terminal are electrically connected by the wiring inserted through the insertion hole, the heat dissipation path of the heat sink is equivalent to the insertion hole. It will be less.
  • the LED lamp of one embodiment is An attachment member insulated from the connection terminal is provided.
  • the LED lamp can be fixed by the mounting member so that the heat radiation plane is in close contact with the metal plate.
  • the attachment destination of the attachment member is a metal
  • the attachment member is insulated from the connection terminal, it is possible to prevent adverse effects on the conduction of the connection terminal.
  • the mounting member is a mounting plate that extends in a direction intersecting the extending direction of the connection terminal in the vicinity of the connection terminal and has a mounting hole.
  • the mounting plate when, for example, a screw inserted into the mounting hole of the mounting plate is tightened and the mounting plate is mounted to the mounting destination, the mounting plate intersects the direction in which the connection terminal extends in the vicinity of the connection terminal.
  • the connection terminal is fixed to the connection destination by tightening a screw
  • the LED lamp is fixed in two directions, that is, the fixing direction by the connection terminal and the fixing direction by the mounting plate. It has the advantage of being difficult.
  • the heating cooker of the present invention is A casing, A heating chamber provided in the casing and containing an object to be heated;
  • the LED lamp of the present invention that is disposed between the casing and the heating chamber and illuminates the heating chamber,
  • the heat radiation plane of the heat sink of the LED lamp is in close contact with a metal plate.
  • the cooking device of the present invention is A casing, A heating chamber provided in the casing and containing an object to be heated; An LED lamp disposed between the casing and the heating chamber and illuminating the heating chamber; A metal attached portion to which the LED lamp is attached;
  • the LED lamp is A substrate having a first surface on the heating chamber side and a flat second surface on the opposite side of the heating chamber;
  • a light emitting diode element mounted on the first surface of the substrate;
  • a transparent or translucent member covering the light emitting diode element and the first surface side of the substrate;
  • the attached portion has a flat contact plane that is in close contact with the second surface of the substrate.
  • the heat generated from the light emitting diode element is transmitted to the first surface of the substrate, and is transmitted from the second surface of the substrate to the contact flat surface of the mounted portion.
  • the contact flat surface of the attached portion is a flat surface that is in close contact with the second surface of the substrate, the contact area between the second surface of the substrate and the contact flat surface of the attached portion can be increased. Therefore, the heat of the light emitting diode element can be efficiently transmitted to the mounted portion through the substrate.
  • the mounted portion is on the second surface side, that is, the back surface side of the substrate, and not on the light emitting diode element emission side. Therefore, the illumination capability of the LED lamp does not decrease.
  • the LED lamp does not have a reduced illumination capability, can sufficiently cool the light emitting diode element even in a high temperature atmosphere, and can extend the life.
  • the life of the LED lamp can be extended, the number of replacement of the LED lamp is reduced, and the running cost can be reduced.
  • connection terminal extends in the extending direction of the second surface of the substrate or in an oblique direction with respect to the extending direction, the connection terminal does not enter between the second surface of the substrate and the contact flat surface of the attached portion.
  • the substrate receives a reaction force in a direction perpendicular to the extending direction of the second surface from the mounted portion, but the connection terminal is inclined with respect to the extending direction of the second surface of the substrate or the extending direction thereof. Therefore, the connection terminal is difficult to come off due to the reaction force.
  • the LED lamp includes a mounting member that is insulated from the connection terminal.
  • the LED lamp since the LED lamp includes an attachment member, the LED lamp can be attached to the attachment portion so that the second surface of the substrate is in close contact with the contact flat surface of the attachment portion.
  • the attachment destination of the attachment member is a metal
  • the attachment member is insulated from the connection terminal, it is possible to prevent adverse effects on the conduction of the connection terminal.
  • the attachment member is an attachment plate extending in the extending direction of the second surface of the substrate and having an attachment hole.
  • the second surface of the substrate extends in the extending direction. Can be pressed against the mounted portion. Therefore, the adhesion force between the second surface of the substrate and the adhesion plane of the attached portion can be increased.
  • the mounting plate is a part of the substrate.
  • the mounting member is a part of the substrate, the number of parts can be reduced.
  • the mounted portion is a part of the mounting bracket of the LED lamp.
  • the mounted portion is a part of the mounting bracket of the LED lamp, the surface area of the mounting bracket is large, and the cooling capacity of the LED lamp can be increased.
  • the attached portion is a part of the casing.
  • the attached portion is a part of the casing, the surface area of the casing is further increased, and the cooling capacity of the LED lamp can be increased.
  • the light emitting diode element can be sufficiently cooled, and an LED lamp having a long life, simple, inexpensive and compact structure can be provided.
  • the cooking device of the present invention includes the LED lamp of the present invention, so that the number of replacement of the LED lamp is reduced, so that the running cost can be reduced.
  • the present invention it is possible to provide a cooking device equipped with an LED lamp that can be sufficiently cooled even in a high-temperature atmosphere and has a long life.
  • FIG. 1 is a schematic side view of an LED lamp according to a first embodiment of the present invention.
  • FIG. 2 is a schematic view seen from the direction of the arrow in FIG.
  • FIG. 3 is a schematic diagram for explaining the mounting state of the LED lamp of the first embodiment.
  • FIG. 4 is the perspective view seen from the front diagonally upper direction of the heating cooker of 2nd Embodiment of this invention.
  • FIG. 5 is a schematic diagram of a longitudinal section viewed from the front of the heating cooker.
  • FIG. 6 is a schematic diagram of a longitudinal section viewed from the right side of the cooking device.
  • FIG. 7 is a control block diagram of the cooking device.
  • FIG. 8 is a perspective view of the heating cooker with the door and the casing removed, as viewed from the rear and diagonally above.
  • FIG. 9 is a perspective view of the heating cooker with the door and casing removed, as viewed from the front and diagonally above.
  • FIG. 10 is a schematic view of an upper portion of the front panel and a portion in the vicinity thereof as viewed obliquely from above.
  • FIG. 11 is a schematic diagram of a longitudinal section viewed from the line XI-XI in FIG.
  • FIG. 12 is a schematic diagram of a main part of an LED lamp according to an embodiment of the present invention.
  • FIG. 13 is a schematic side view of an LED lamp according to a third embodiment of the present invention.
  • FIG. 14 is the perspective view seen from the front diagonally upper direction of the heating cooker of the said 3rd Embodiment.
  • FIG. 15 is a schematic diagram of a longitudinal section viewed from the front of the heating cooker according to the third embodiment.
  • FIG. 16 is a schematic diagram of a longitudinal section viewed from the right side of the heating cooker according to the third embodiment.
  • FIG. 17 is a control block diagram of the cooking device.
  • FIG. 18 is a perspective view of the heating cooker with the door and casing removed, as viewed from the upper rear side.
  • FIG. 19 is a perspective view of the heating cooker with the door and casing removed, as seen from the front and obliquely above.
  • FIG. 20 is a schematic view of the upper portion of the front panel and a portion in the vicinity thereof as viewed obliquely from above.
  • FIG. 21 is a schematic view taken along line XXI-XXI in FIG. FIG.
  • FIG. 22 is a schematic view of the LED lamp attached to the frame as viewed from the connection terminal side.
  • FIG. 24 is a schematic diagram of a longitudinal section viewed from the line XXIV-XXIV in FIG.
  • FIG. 1 is a schematic view of an LED lamp 1 according to a first embodiment of the present invention as viewed from the side.
  • the LED lamp 1 includes a substantially rectangular aluminum heat sink 2 as an example of a heat sink, a glass epoxy substrate 3 as an example of a substrate, and two light emitting diode elements 4 (only one is visible in FIG. 1). ) Of substantially rectangular plate-like connection terminals 5, 5, a substantially rectangular plate-like attachment plate 6 as an example of an attachment member, a cover glass 7 as an example of a transparent or translucent member, and a metal base 8. And.
  • the aluminum heat sink 2 has a flat adhesion plane 21 and a flat heat radiation plane 22 on the opposite side of the adhesion plane 21.
  • the thickness of the aluminum heat sink 2 (the dimension between the contact plane 21 and the heat radiation plane 22) is smaller than the vertical and horizontal dimensions of the aluminum heat sink 2.
  • the heat radiation plane 22 and the four side surfaces of the aluminum heat sink 2 are not covered with the cover glass 7 and are exposed. Further, the contact plane 21 and the heat radiation plane 22 are substantially parallel to each other.
  • the vertical dimension of the aluminum heat sink 2 corresponds to the horizontal dimension in FIG.
  • the horizontal dimension of the aluminum heat sink 2 corresponds to a dimension in a direction perpendicular to the paper surface of FIG.
  • the light emitting diode element 4 is mounted on the first surface 31 of the glass epoxy substrate 3.
  • the flat contact surface 21 of the heat sink 2 is in close contact with the second surface 32 opposite to the first surface 31 of the glass epoxy substrate 3.
  • the glass epoxy substrate 3 is provided with wiring 33 for supplying current from the connection terminals 5 and 5 to the light emitting diode element 4. That is, the light emitting diode element 4 and the connection terminals 5 and 5 are connected by the wiring 33 on the glass epoxy substrate 3 that passes outside without passing through the inside of the aluminum heat sink 2. Further, the connection terminal 5, 5 side portion of the glass epoxy substrate 3 is inserted into the base 8. The remaining part of the glass epoxy substrate 3 is covered with a cover glass 7.
  • the light emitting diode element 4 is attached to the first surface 31 of the glass epoxy substrate 3.
  • the light emitting diode element 4 is hermetically sealed with a phosphor 9. This phosphor 9 converts the wavelength of the light emitted from the light emitting diode element 4.
  • the cover glass 7 covers the light emitting diode element 4 and a part of the first surface 31 side of the glass epoxy substrate 3.
  • the space in the cover glass 7 is a sealed space so that outside gas does not enter the cover glass 7.
  • the cover glass 7 is made of a material that transmits the light whose wavelength is converted by the phosphor 9.
  • connection terminals 5 and 5 are provided behind the aluminum heat sink 2 and extend in the extending direction of the heat radiation plane 22.
  • a through hole 13 is provided at the tip of each of the connection terminals 5 and 5.
  • the base 8 is provided between the cover glass 7 and the connection terminals 5 and 5. A space between the base 8 and the connection terminals 5 and 5 is sealed with a heat-resistant sealing resin 10.
  • FIG. 2 is a schematic view seen from the direction of the arrow in FIG.
  • the mounting plate 6 is insulated from the connection terminals 5 and 5 by the sealing resin 10. Further, the mounting plate 6 extends in a direction intersecting the extending direction of the connection terminals 5 and 5 in the vicinity of the connection terminals 5 and 5. The extending direction of the mounting plate 6 is substantially parallel to the heat radiation plane 22. Further, a mounting hole 14 penetrating the mounting plate 6 is provided at the tip of the mounting plate 6, and a screw (not shown) for fixing the position of the LED lamp 1 is inserted into the mounting hole 14.
  • the heat generated from the light emitting diode element 4 is transmitted to the first surface 31 of the glass epoxy substrate 3, and the adhesion plane of the aluminum heat sink 2 from the second surface 32 of the glass epoxy substrate 3. It is transmitted to 21.
  • the contact flat surface 21 of the aluminum heat sink 2 is a flat surface that is in close contact with the second surface 32 of the glass epoxy substrate 3, the second surface 32 of the glass epoxy substrate 3 and the contact flat surface 21 of the aluminum heat sink 2 are The contact area can be increased. Therefore, the heat of the light emitting diode element 4 can be efficiently transferred to the aluminum heat sink 2 through the glass epoxy substrate 3.
  • the heat radiation plane 22 of the aluminum heat sink 2 is flat as shown in FIG. 22 can be easily adhered, and the aluminum heat sink 2 has a simple flat plate shape on the second surface 32 side, that is, the back surface side of the glass epoxy substrate 3, and is not on the light emission side of the light emitting diode element 4.
  • the contact area between the heat radiation plane 22 of the aluminum heat sink 2 and the surface 51 of the metal plate 15 can be increased with a simple and compact structure without impeding the ability. Therefore, the aluminum heat sink 2 can efficiently release the heat from the light emitting diode element 4 to the metal plate 15 in direct contact with the aluminum heat sink 2 by heat conduction.
  • the metal plate 15 is, for example, a casing or a housing of the video equipment, and can greatly increase the heat radiation area and can greatly increase the cooling effect. Therefore, the LED lamp 1 can be used in a high temperature atmosphere and has a long life.
  • connection terminals 5 and 5 extend in the extending direction of the heat radiation plane 22 of the aluminum heat sink 2, the connection terminals 5 and 5 are interposed between the surface 51 of the metal plate 15 and the heat radiation plane 22 of the aluminum heat sink 2. You can avoid it.
  • connection terminals 5, 5 extend in the extending direction of the heat radiation plane 22 of the aluminum heat sink 2 that is in close contact with the metal plate 15. , 5 can be prevented from coming off.
  • the LED lamp 1 has a simple, inexpensive, and compact structure, does not lower the illumination capability, can sufficiently cool the light emitting diode element 4 even in a high temperature atmosphere of the video equipment, and can extend the life. .
  • the aluminum heat sink 2 has a smaller dimension between the contact plane 21 and the heat radiation plane 22 than the vertical and horizontal dimensions, the heat radiation path between the contact plane 21 and the heat radiation plane 22 is shortened. Therefore, the aluminum heat sink 2 can quickly dissipate heat by quickly transferring the heat from the light emitting diode element 4 to the heat radiation plane 22.
  • the light emitting diode element 4 and the connection terminals 5 and 5 are connected by the wiring 33 on the glass epoxy substrate 3 that passes through the outside without passing through the inside of the aluminum heat sink 2, the heat dissipation path of the aluminum heat sink 2 is It can be prevented from becoming less.
  • the aluminum heat sink 2 is provided with an insertion hole and the light emitting diode element 4 and the connection terminals 5 and 5 are electrically connected by the wiring inserted into the insertion hole as in the conventional example, The heat radiation path is reduced by the amount of the insertion hole.
  • the LED lamp 1 when attaching the heat radiation plane 22 of the aluminum heat sink 2 to the metal plate 15, the LED lamp 1 can be fixed in a state where the heat radiation plane 22 of the aluminum heat sink 2 is in close contact with the metal plate 15.
  • connection terminals 5 and 5 can be pressed against the connection destination by tightening the screws. Therefore, it is possible to make it difficult for the connection terminals 5 and 5 to be disconnected from the connection destination.
  • the LED lamp 1 when, for example, a screw inserted through the mounting hole of the mounting plate 6 is tightened and the mounting plate 6 is mounted to the mounting destination, the mounting plate 6 extends in the vicinity of the connection terminals 5 and 5 in the direction in which the connection terminals 5 and 5 extend.
  • the LED lamp 1 has two directions: a fixing direction by the connection terminals 5 and 5 and a fixing direction by the mounting plate 6. Fixed to. Therefore, the LED lamp 1 has an advantage that it is difficult to drop off.
  • the mounting plate 6 is insulated from the connection terminals 5 and 5, so that adverse effects on the energization of the connection terminals 5 and 5 can be prevented. Can do.
  • the cover glass 7 transmits the light whose wavelength is converted by the phosphor 9, the light can be taken out from the cover glass 7.
  • the heat radiation plane 22 and the four side surfaces of the aluminum heat sink 2 are not covered with the cover glass 7 and are exposed, it is possible to prevent the heat radiation performance of the aluminum heat sink 2 from being deteriorated.
  • the base 8 is provided between the cover glass 7 and the connection terminals 5 and 5, the mechanical strength can be increased.
  • the metal plate 15 may be a metal plate such as a housing or a case of a device that generates a high-temperature atmosphere such as a heating cooker, a washing / drying machine, a welding device, a heat treatment device, and a furnace.
  • a heat sink made of a metal other than aluminum for example, copper
  • a heat sink made of a material may be used.
  • the said material has a heat resistant thing.
  • connection terminals 5 and 5 extend in the extending direction of the heat radiation plane 22 of the aluminum heat sink 2.
  • connection terminals 5 and 5 extend in the extending direction of the heat dissipation plane 22 of the aluminum heat sink 2. May extend in an oblique direction.
  • the contact plane 21 is substantially parallel to the heat dissipation plane 22, but the contact plane 21 may be an inclined surface that is inclined with respect to the heat dissipation plane 22.
  • the glass epoxy substrate 3 may be in direct contact with the adhesion plane 21 of the aluminum heat sink 2 or the glass epoxy substrate 3 may be in indirect contact with the adhesion plane 21 of the aluminum heat sink 2.
  • the glass epoxy substrate 3 may be attached to the adhesion flat surface 21 of the aluminum heat sink 2 via a thin adhesive film.
  • the rear end portion of the mounting plate 6 may be thermally connected to both the aluminum heat sink 2 and the glass epoxy substrate 3 or may be thermally connected only to the aluminum heat sink 2. Alternatively, it may be thermally connected only to the glass epoxy substrate 3.
  • a semiconductor substrate for example, a semiconductor substrate, a ceramic substrate, a metal substrate, or the like may be used instead of the glass epoxy substrate 3 of the first embodiment.
  • FIG. 4 is the figure which looked at the front of the heating cooker of 2nd Embodiment of this invention from diagonally upward.
  • the said heating cooker is provided with the LED lamp 1 of the said 1st Embodiment
  • “left” indicates the left when the cooking device is viewed from the front (door 102) side
  • “right” indicates the right when the cooking device is viewed from the front (door 102) side. Point to.
  • a door 102 is attached to the front surface of the rectangular parallelepiped casing 101 so as to rotate about the lower end side.
  • a handle 103 is attached to the upper part of the door 102, and a heat resistant glass 104 is attached to the approximate center of the door 102.
  • An operation panel 105 is provided on the right side of the door 102.
  • the operation panel 105 includes a liquid crystal display unit 106 and an operation button group 107 operated by a user.
  • An exhaust port cover 108 having an exhaust port 108a is provided on the upper side of the casing 101 and on the right rear side.
  • a dew receiving device 109 is detachably attached to a lower portion of the front surface of the casing 101 (a portion below the door 102).
  • FIG. 5 is a schematic diagram of a longitudinal section viewed from the front of the heating cooker.
  • FIG. 6 is a schematic diagram of a longitudinal section viewed from the right side of the cooking device.
  • a heating chamber 110 in which the object to be heated 123 can be accommodated together with the tray 190.
  • a water supply tank 111 that is detachably inserted from the front side is disposed on the right side of the heating chamber 110.
  • a steam generator 112 connected to the water supply tank 111 is disposed on the rear surface side of the water supply tank 111.
  • One end of a steam supply passage 113 is connected to the steam generator 112, and the other end of the steam supply passage 113 is connected to the circulation unit 114.
  • the steam generator 112 has a heater (not shown), and the water supplied from the water supply tank 111 is heated by the heater to generate saturated steam.
  • the saturated steam generated by the steam generator 112 is supplied from the steam supply port 113 a to the downstream side of the suction port 128 in the circulation unit 114 through the steam supply passage 113.
  • the steam supply port 113 a of the steam supply passage 113 is disposed in the vicinity of the suction port 128 in the circulation unit 114. Further, a circulation fan 118 is disposed in the circulation unit 114 so as to face the suction port 128. The circulation fan 118 is driven by a circulation fan motor 119.
  • a steam duct 180 bent in an L shape is attached to the upper and left sides of the heating chamber 110.
  • the steam duct 180 is fixed to the first duct portion 181 fixed to the upper wall of the heating chamber 110, the bent portion 182 bent from the left side to the lower side of the first duct portion 181, and the left wall of the heating chamber 110.
  • a second duct portion 183 connected to the first duct portion 181 through the bent portion 182.
  • a heater 121 made of a sheathed heater or the like is housed in the first duct portion 181 of the steam duct 180.
  • the first duct portion 181 and the heater 121 constitute a superheated steam generator.
  • the superheated steam generator may be provided separately from the steam duct.
  • a steam supply port 114 a provided on the upper portion of the circulation unit 114 is connected to the right end of the first duct portion 181, and the inside of the first duct portion 181 communicates with the circulation unit 114.
  • a plurality of first steam outlets 124 are provided on the top surface of the heating chamber 110, and the space in the first duct portion 181 of the steam duct 180 is inside the heating chamber 110 via the first steam outlet 124.
  • the second duct portion 183 of the steam duct 180 communicates with the inside of the heating chamber 110 via a plurality of second steam outlets 125 provided on the left side surface of the heating chamber 110.
  • the gap between the heating chamber 110 and the steam duct 180 is sealed with a heat resistant resin or the like.
  • the heating chamber 110 and the steam duct 180 are covered with a heat insulating material except for the front opening of the heating chamber 110.
  • the circulation path of the heat medium is formed by the circulation unit 114, the steam duct 180, the heating chamber 110, and the connection member connecting them. Then, saturated steam generated by the steam generator 112 is supplied to the boundary portion of the circulation unit 114 with the heating chamber 110 in this circulation path.
  • the heating medium may be heated air, may be heated air containing water vapor, may be air containing superheated steam heated to 100 ° C. or higher, and The main component may be superheated steam heated to 100 ° C. or higher.
  • a magnetron 120 is disposed in the space below the heating chamber 110.
  • the microwave generated in the magnetron 120 is guided to the lower center of the heating chamber 110 by a waveguide (not shown), and radiates upward in the heating chamber 110 while being stirred by a rotating antenna (not shown).
  • a rotating antenna not shown.
  • the article to be heated 123 is heated.
  • the article to be heated 123 is placed on the bottom of the heating chamber 110.
  • a suction port 128 is provided in the center of the right side wall of the heating chamber 110.
  • the right side wall of the heating chamber 110 is provided with an air supply port 133 (shown in FIG. 9) located on the front side of the suction port 128 and a first exhaust port 136 located on the rear side of the suction port 128. ing.
  • the air supply port 133 is located in the vicinity of the door 102, and the outside air blown into the heating chamber 110 from the air supply port 133 flows along the door 102.
  • a second exhaust port 137 having an opening area smaller than that of the first exhaust port 136 is provided on the lower right side of the rear side wall surface of the heating chamber 110.
  • a circulation fan motor 119 for driving the circulation fan 118 is attached to the circulation unit 114 disposed on the right side surface of the heating chamber 110. Steam and air in the heating chamber 110 are sucked from the suction port 128 by the circulation fan 118 and blown into the heating chamber 110 from the first and second steam outlets 124 and 125 through the steam duct 180. Further, an indoor temperature sensor 129 for detecting the temperature of the heat medium (air containing steam) in the heating chamber 110 is disposed in the vicinity of the suction port 128 of the circulation unit 114.
  • the object 123 to be heated in the heating chamber 110 is heated by the radiant heat of the heater 121 disposed in the first duct portion 181 of the steam duct 180. Moreover, the heating medium (air containing steam) passing through the steam duct 180 is heated by the heater 121, and the heated heating medium is blown out from the first and second steam outlets 124 and 125. Thereby, the heat medium in the heating chamber 110 is maintained at a predetermined temperature. Further, the steam to be supplied to the heating chamber 110 can be further heated by the heater 121 to generate superheated steam at 100 ° C. or higher.
  • the cooling fan part 122, the electrical component 117, and the magnetron 120 are disposed below the casing 101.
  • an air duct 131 is disposed on the right side of the heating chamber 110 in the casing 101.
  • the blower duct 131 houses therein a dilution fan 130 and a dilution fan motor 138 that drives the dilution fan 130.
  • the cooling fan unit 122 includes a cooling fan 115 and a cooling fan motor 116 that drives the cooling fan 115.
  • the electrical component 117 has a drive circuit that drives each part of the cooking device, a control circuit that controls the drive circuit, and the like.
  • the cooling fan 115 takes outside air into the casing 101 and cools the electrical component 117 and the magnetron 120 that generate heat. A part of the outside air that has flowed into the casing 101 by the cooling fan 115 is guided into the air duct 131 by the dilution fan 130, and the remaining outside air is an opening (not shown) formed on the back surface of the casing 101 and the like. ) To the outside.
  • a first exhaust duct 134 connected to the right side wall of the heating chamber 110 from a first exhaust port 136 via an exhaust damper (not shown) is disposed.
  • the first exhaust duct 134 has a lateral passage 134a extending in the lateral direction and a longitudinal passage 134b bent upward from the lateral passage 134a.
  • An exhaust port cover 108 is detachably attached to the upper end of the vertical passage 134b.
  • a suction port (not shown) for sucking outside air through a suction duct 127 is provided on the back side of the lateral passage 134a of the first exhaust duct 134.
  • the exhaust damper is controlled so that either one of the suction port or the first exhaust port 136 is alternatively selected and connected to the first exhaust duct 134.
  • the exhaust damper is driven by an exhaust damper motor 160 (shown in FIG. 7).
  • the vertical passage 134b of the first exhaust duct 134 is connected to the exhaust port cover 108 with the flow passage area enlarged toward the upper side.
  • An exhaust port 108 a that opens forward is formed in the upper portion of the exhaust port cover 108.
  • the lower end of the second exhaust duct 135 is connected to the second exhaust port 137, and the upper end of the second exhaust duct 135 is connected to the lower side of the vertical passage 134b of the first exhaust duct 134.
  • the distribution area of the second exhaust duct 135 is smaller than that of the first exhaust duct 134.
  • the exhaust from the second exhaust port 137 flows into the first exhaust duct 134 via the second exhaust duct 135 and is discharged to the outside from the exhaust port 108 a of the exhaust port cover 108.
  • the air duct 131 on the side of the heating chamber 110 includes a dilution fan housing part 131a, a vertical passage 131b extending upward from the dilution fan 130, a horizontal passage 131c bent from the vertical passage 131b to the rear side, and a horizontal passage 131b.
  • the nozzle portion 131d is bent upward from the passage 131c.
  • the lateral passage 131c and the nozzle portion 131d are inserted into the first exhaust duct 134.
  • An opening 131e is provided at the upper end of the nozzle portion 131d of the air duct 131.
  • an ejector is formed in the first exhaust duct 134, and the dilution fan 130 generates an air flow from the first exhaust port 136 toward the exhaust port 108a.
  • a recess is formed in the horizontal passage 131c of the blower duct 131 so as to be recessed below the lower end of the connection portion with the vertical passage 131b, and a sub nozzle portion that opens into the first exhaust duct 134 at one end of the recess. 131f is formed.
  • one end of the air supply passage 132 is connected to the upper part of the vertical passage 131b of the air duct 131, and the other end of the air supply passage 132 is connected to the air supply damper 140.
  • the air supply passage 132 and the air supply damper 140 are part of an air supply mechanism for supplying air to the heating chamber 110 via the air supply port 133 by the dilution fan 130.
  • a thawing sensor 150 is disposed near and below the air inlet 133 of the heating chamber 110.
  • the air supply damper 140 has a heat-resistant resin damper body 141 for opening and closing the air supply port 133 and a heat-resistant resin housing 142 covering the damper body 141.
  • FIG. 7 is a control block diagram of the heating cooker.
  • the heating cooker includes a control unit 200 including a microcomputer and an input / output circuit in the electrical component 17 (shown in FIGS. 5 and 6).
  • the control unit 200 includes a heater 121, a circulation fan motor 119, a cooling fan motor 116, a dilution fan motor 138, an air supply damper motor 144, an exhaust damper motor 160, an operation panel 105, an indoor temperature sensor 129, and thawing.
  • the sensor 150, the feed water pump 170, the steam generator 112, and the magnetron 120 are connected.
  • the control unit 200 includes a heater 121, a circulation fan motor 119, a cooling fan motor 116, a dilution fan motor 138, It controls the air damper motor 144, the exhaust damper motor 160, the operation panel 105, the water supply pump 170, the steam generator 112, the magnetron 120, and the like.
  • FIG. 8 is a perspective view of the rear surface of the cooking device in a state where the door 102 and the casing 101 are removed as viewed obliquely from above.
  • FIG. 9 is the perspective view which looked at the front of the heating cooker in the state which removed the said door 102 and the casing 101 from diagonally upward.
  • a front panel 126 is provided on the front side of the heating chamber 110.
  • the front panel 126 has an insertion port 126a for inserting a water supply tank 111 (shown in FIG. 6) on the right side.
  • upper tray receiving portions 151 a and 151 b, middle tray receiving portions 152 a, 152 b and 152 c and a lower tray receiving portion 153 are provided on the inner surface of the right side wall of the heating chamber 110.
  • a sensor unit 150a of the thawing sensor 150 is disposed between the middle tray receiving units 152a and 152b.
  • FIG. 10 is a schematic view of the upper portion of the front panel 126 and a portion in the vicinity thereof as viewed obliquely from above.
  • a frame body 16 formed of a steel plate is disposed between the first duct part 181 of the steam duct 180 and the upper part of the front panel 126.
  • a mounted portion 17 is provided on the right side of the frame body 16, and the mounting plate 6 of the LED lamp 1 is fixed to the mounted portion 17 with screws 19.
  • the flange portions 18 and 18 provided at the lower portion of the frame body 16 are fixed to the upper wall of the heating chamber 110 with screws (not shown).
  • FIG. 11 is a schematic view taken along line XI-XI in FIG.
  • the heat radiation plane 22 of the aluminum heat sink 2 of the LED lamp 1 is in close contact with the upper portion of the frame body 16. Further, a plurality of punching holes 20, 20,... Facing the LED lamp 1 are provided on the upper wall of the heating chamber 110. The light emitted from the LED lamp 1 enters the heating chamber 110 through a plurality of punching holes 20, 20,. Moreover, the glass plate 24 is arrange
  • the heating cooker having the above configuration heats the article to be heated 123 with superheated steam
  • superheated steam at 100 ° C. or higher generated by the heater 121 is heated from the plurality of first steam outlets 124 and second steam outlets 125. 110 is supplied. Therefore, the ambient temperature of the first duct portion 181 that houses the heater 121 is 80 ° C. to 100 ° C.
  • the LED lamp 1 is arranged in such a high temperature environment, the heat of the light emitting diode element 4 can be released to the frame body 16 through the aluminum heat sink 2 with very high efficiency. Can be suppressed. Therefore, since the lifetime of the light emitting diode element 4 can be extended, it is not necessary to frequently replace the LED lamp 1. As a result, the running cost of the cooking device can be reduced.
  • a frame made of Cu, Mo, W, or Al may be used instead of the steel frame 16 of the second embodiment.
  • Examples of the cooking device of the present invention include not only an oven range using superheated steam but also an oven using superheated steam, an oven range not using superheated steam, and an oven not using superheated steam.
  • healthy cooking can be performed by using superheated steam or saturated steam in a microwave oven or the like.
  • superheated steam or saturated steam having a temperature of 100 ° C. or higher is supplied to the food surface, and the superheated steam or saturated steam adhered to the food surface is condensed to give a large amount of condensation latent heat to the food. So it can efficiently transfer heat to food.
  • the heating chamber is filled with superheated steam or saturated steam to be in a low oxygen state, thereby enabling cooking while suppressing food oxidation.
  • the low oxygen state refers to a state in which the volume% of oxygen is 10% or less (for example, 0.5 to 3%) in the heating chamber.
  • FIG. 13 is the schematic diagram which looked at the LED lamp 2001 with which the heating cooker of 3rd Embodiment of this invention is provided from the side.
  • the LED lamp 2001 includes a glass epoxy substrate 2002 as an example of a substrate, a light emitting diode element 2003, two (only one is visible in FIG. 13) connection terminals 2004 and 2004, and a transparent terminal.
  • a cover glass 2005 as an example of a translucent member and a metal base 2006 are provided.
  • the glass epoxy substrate 2002 has a first surface 2021 directed to the heating chamber 2110 described later, and a flat second surface 2022 directed to the opposite side of the heating chamber 2110, and the vertical dimension is horizontal. It is longer than the dimensions. Further, the thickness of the glass epoxy substrate 2002 (the dimension between the first surface 2021 and the second surface 2022) is substantially constant, and is smaller than the vertical and horizontal dimensions of the glass epoxy substrate 2002.
  • the glass epoxy substrate 2002 is provided with wiring 2023 for supplying current from the connection terminals 2004 and 2004 to the light emitting diode element 2003. That is, the light emitting diode element 2003 and the connection terminals 2004 and 2004 are connected via the wiring 2023 on the glass epoxy substrate 2002.
  • a part of the glass epoxy board 2002 on the side of the connection terminals 2004 and 2004 is inserted into the base 2006. On the other hand, most of the remaining part of the glass epoxy substrate 2002 is covered with a cover glass 2005. Note that the vertical dimension of the glass epoxy substrate 2002 corresponds to the horizontal dimension in FIG. Further, the horizontal dimension of the glass epoxy substrate 2002 corresponds to a dimension in a direction perpendicular to the paper surface of FIG.
  • a part of the glass epoxy substrate 2002 opposite to the base 2006 is a mounting portion 2024 having a substantially rectangular plate shape as an example of a mounting plate.
  • the attachment portion 2024 protrudes from the cover glass 2005 and extends in the extending direction of the second surface 2022 of the glass epoxy substrate 2002.
  • the mounting portion 2024 is provided with a mounting hole 2025 through which a screw 2010 (shown in FIG. 21) is inserted. Further, the mounting portion 2024 is insulated from the connection terminals 2004 and 2004.
  • the light emitting diode element 2003 is attached to the first surface 2021 of the glass epoxy substrate 2002.
  • the light emitting diode element 2003 is hermetically sealed with a phosphor 2007.
  • the phosphor 2007 is for converting the wavelength of light emitted from the light emitting diode element 2003.
  • the cover glass 2005 covers a part of the first surface 2021 side of the glass epoxy substrate 2002 and the light emitting diode element 2003.
  • the space in the cover glass 2005 is a sealed space so that external gas does not enter the cover glass 2005.
  • the cover glass 2005 transmits light whose wavelength has been converted by the phosphor 2007.
  • connection terminals 2004 and 2004 are provided behind the glass epoxy substrate 2002 and extend in the extending direction of the heat radiation plane 2022.
  • a through hole 2041 is provided at the tip of each of the connection terminals 2004 and 2004.
  • the base 2006 is provided between the cover glass 2005 and the connection terminals 2004 and 2004. A space between the base 2006 and the connection terminals 2004 and 2004 is sealed with a heat-resistant sealing resin 8.
  • FIG. 14 is a view of the front surface of the heating cooker as viewed obliquely from above.
  • “left” indicates the left when the cooking device is viewed from the front (door 2102) side
  • “right” indicates the right when the cooking device is viewed from the front (door 2102). Point to.
  • the heating cooker has a rectangular parallelepiped shape, and a door 2102 that rotates about the lower end side is attached to the front surface of a casing 2101 made of metal such as iron.
  • a handle 2103 is attached to the upper part of the door 2102, and a heat resistant glass 104 is attached to the approximate center of the door 2102.
  • An operation panel 2105 is provided on the right side of the door 2102.
  • the operation panel 2105 includes a liquid crystal display unit 106 and an operation button group 2107 operated by the user.
  • an exhaust port cover 2108 having an exhaust port 2108a is provided on the upper side of the casing 2101 and on the right rear side.
  • a dew receptacle 2109 is detachably attached to a lower part of the front surface of the casing 2101 (a part below the door 2102).
  • FIG. 15 is a schematic diagram of a longitudinal section viewed from the front of the cooking device.
  • FIG. 16 is a schematic diagram of a longitudinal section viewed from the right side of the cooking device.
  • a heating chamber 2110 that can accommodate the object to be heated 2123 together with the tray 190.
  • This heating chamber 2110 has an opening on the front side, and the side, bottom and top surfaces are made of stainless steel plates.
  • a water supply tank 2111 is detachably inserted from the front side.
  • a steam generator 2112 connected to the water supply tank 2111 is disposed on the rear surface side of the water supply tank 2111.
  • One end of a steam supply passage 2113 is connected to the steam generator 2112, and the other end of the steam supply passage 2113 is connected to the circulation unit 2114.
  • the steam generator 2112 has a heater (not shown), and heats the water supplied from the water supply tank 2111 with the heater to generate saturated steam.
  • the saturated steam generated by the steam generator 2112 is supplied from the steam supply port 2113a to the downstream side of the suction port 2128 in the circulation unit 2114 via the steam supply passage 2113.
  • the steam supply port 2113 a of the steam supply passage 2113 is disposed in the vicinity of the suction port 2128 in the circulation unit 2114. Further, a circulation fan 2118 is disposed in the circulation unit 2114 so as to face the suction port 2128.
  • a steam duct 2180 bent in an L shape is attached to the upper surface and the left side surface of the heating chamber 2110.
  • the steam duct 2180 is fixed to the first duct portion 2181 fixed to the upper wall of the heating chamber 2110, the bent portion 182 bent from the left side of the first duct portion 2181 to the lower side, and the left wall of the heating chamber 2110.
  • a second duct portion 2183 connected to the first duct portion 2181 via the bent portion 182.
  • a heater 2121 made of a sheathed heater or the like is housed in the first duct portion 2181 of the steam duct 2180.
  • the first duct portion 2181 and the heater 2121 constitute a superheated steam generator.
  • the superheated steam generator may be provided separately from the steam duct.
  • a steam supply port 2114 a provided at the upper portion of the circulation unit 2114 is connected to the right end of the first duct portion 2181, and the inside of the first duct portion 2181 communicates with the circulation unit 2114.
  • a plurality of first steam outlets 2124 are provided on the top surface of the heating chamber 2110, and the space in the first duct portion 2181 of the steam duct 2180 is inside the heating chamber 2110 via the first steam outlet 2124.
  • the second duct portion 2183 of the steam duct 2180 communicates with the inside of the heating chamber 2110 through a plurality of second steam outlets 2125 provided on the left side surface of the heating chamber 2110.
  • the gap between the heating chamber 2110 and the steam duct 2180 is sealed with a heat resistant resin or the like.
  • the heating chamber 2110 and the steam duct 2180 are covered with a heat insulating material except for the opening on the front side of the heating chamber 2110.
  • the circulation path of the heat medium is formed by the circulation unit 2114, the steam duct 2180, the heating chamber 2110, and the connecting member that connects them. Then, saturated steam generated by the steam generator 2112 is supplied to a boundary portion of the circulation unit 2114 with the heating chamber 2110 in this circulation path.
  • the heating medium may be heated air, may be heated air containing water vapor, may be air containing superheated steam heated to 100 ° C. or higher, and The main component may be superheated steam heated to 100 ° C. or higher.
  • a magnetron 2120 is disposed in the space below the heating chamber 2110.
  • the microwave generated by the magnetron 2120 is guided to the lower center of the heating chamber 2110 by a waveguide (not shown), and radiates upward in the heating chamber 2110 while being stirred by a rotating antenna (not shown).
  • a rotating antenna not shown
  • the article to be heated 2123 is heated.
  • the object to be heated 2123 is placed on the bottom in the heating chamber 2110.
  • a suction port 2128 is provided at the center of the right side wall of the heating chamber 2110.
  • the right side wall of the heating chamber 2110 is provided with an air supply port 2133 (shown in FIG. 19) located on the front side of the suction port 2128 and a first exhaust port 2136 located on the rear side of the suction port 2128. ing.
  • the air supply port 2133 is located in the vicinity of the door 2102, and outside air blown out from the air supply port 2133 into the heating chamber 2110 flows along the door 2102.
  • a second exhaust port 2137 having an opening area smaller than that of the first exhaust port 2136 is provided on the lower right side of the rear side wall surface of the heating chamber 2110.
  • a circulation fan motor 2119 for driving the circulation fan 2118 is attached to the circulation unit 2114 disposed on the right side surface of the heating chamber 2110. Steam or air in the heating chamber 2110 is sucked from the suction port 2128 by the circulation fan 2118 and blown out from the first and second steam outlets 2124 and 2125 into the heating chamber 2110 via the steam duct 2180.
  • an indoor temperature sensor 2129 that detects the temperature of the heat medium (air containing steam) in the heating chamber 2110 is disposed in the vicinity of the suction port 2128 of the circulation unit 2114.
  • the object to be heated 2123 in the heating chamber 2110 is heated by the radiant heat of the heater 2121 disposed in the first duct portion 2181 of the steam duct 2180. Further, the heating medium (air containing steam) passing through the steam duct 2180 is heated by the heater 2121, and the heated heating medium is blown out from the first and second steam outlets 2124 and 2125. Thereby, the heat medium in the heating chamber 2110 is maintained at a predetermined temperature. Further, the steam to be supplied to the heating chamber 2110 can be further heated by the heater 2121 to generate superheated steam at 100 ° C. or higher.
  • the cooling fan portion 2122, the electrical component 2117, and the magnetron 2120 are disposed on the lower side of the casing 2101. Further, an air duct 2131 is disposed on the right side of the heating chamber 2110 in the casing 2101. The air duct 2131 houses therein a dilution fan 2130 and a dilution fan motor 2138 that drives the dilution fan 2130.
  • the cooling fan unit 2122 includes a cooling fan 2115 and a cooling fan motor 2116 that drives the cooling fan 2115.
  • the electrical component 2117 has a drive circuit that drives each part of the cooking device, a control circuit that controls the drive circuit, and the like. Further, the cooling fan 2115 takes outside air into the casing 2101 and cools the electrical component 2117 and the magnetron 2120 that generate heat. Further, a part of the outside air flowing into the casing 2101 by the cooling fan 2115 is guided into the air duct 2131 by the dilution fan 2130, and the remaining outside air is an opening (not shown) formed on the back surface of the casing 2101 or the like. ) To the outside.
  • a first exhaust duct 2134 connected to the right side wall of the heating chamber 2110 from the first exhaust port 2136 via an exhaust damper (not shown) is disposed.
  • the first exhaust duct 2134 has a lateral passage 2134a extending in the lateral direction and a longitudinal passage 2134b bent upward from the lateral passage 2134a.
  • An exhaust port cover 2108 is detachably attached to the upper end of the vertical passage 2134b.
  • a suction port (not shown) for sucking outside air through a suction duct 2127 is provided on the back side of the lateral passage 2134a of the first exhaust duct 2134.
  • the exhaust damper is controlled so that either one of the suction port or the first exhaust port 2136 is alternatively selected and connected to the first exhaust duct 2134.
  • the exhaust damper is driven by an exhaust damper motor 2160 (shown in FIG. 17).
  • the vertical passage 2134b of the first exhaust duct 2134 is connected to the exhaust port cover 2108 with the flow passage area enlarged toward the upper side.
  • An exhaust port 2108 a that opens forward is formed in the upper portion of the exhaust port cover 2108.
  • the lower end of the second exhaust duct 2135 is connected to the second exhaust port 2137, and the upper end of the second exhaust duct 2135 is connected to the lower side of the vertical passage 2134b of the first exhaust duct 2134.
  • the distribution area of the second exhaust duct 2135 is smaller than that of the first exhaust duct 2134.
  • the exhaust from the second exhaust port 2137 flows into the first exhaust duct 2134 via the second exhaust duct 2135 and is discharged to the outside from the exhaust port 2108a of the exhaust port cover 2108.
  • the air duct 2131 on the side of the heating chamber 2110 includes a dilution fan housing part 131a, a vertical passage 2131b extending upward from the dilution fan 2130, a horizontal passage 2131c bent from the vertical passage 2131b to the rear side, and a horizontal passage.
  • the nozzle portion 2131d is bent upward from the passage 2131c.
  • the lateral passage 2131c and the nozzle portion 2131d are inserted into the first exhaust duct 2134.
  • An opening 2131e is provided at the upper end of the nozzle portion 2131d of the air duct 2131.
  • an ejector is formed in the first exhaust duct 2134, and an air flow from the first exhaust port 2136 toward the exhaust port 2108 a is generated by the dilution fan 2130.
  • a concave portion is formed in the horizontal passage 2131c of the air duct 2131 so as to be recessed below the lower end of the connecting portion with the vertical passage 2131b, and a sub nozzle portion that opens into the first exhaust duct 2134 at one end of the concave portion. 2131f is formed.
  • one end of the air supply passage 2132 is connected to the upper part of the vertical passage 2131b of the air duct 2131, and the other end of the air supply passage 2132 is connected to the air supply damper 2140.
  • the air supply passage 2132 and the air supply damper 2140 are part of an air supply mechanism for supplying air to the heating chamber 2110 via the air supply port 2133 by the dilution fan 2130.
  • a thawing sensor 2150 is disposed near and below the air inlet 2133 of the heating chamber 2110.
  • the air supply damper 2140 includes a heat-resistant resin damper body 2141 for opening and closing the air supply opening 2133 and a heat-resistant resin housing 2142 for covering the damper body 2141.
  • FIG. 17 is a control block diagram of the heating cooker.
  • the heating cooker includes a control unit 2200 including a microcomputer and an input / output circuit in an electrical component 2117 (shown in FIGS. 15 and 16).
  • the control unit 2200 includes a heater 2121, a circulation fan motor 2119, a cooling fan motor 2116, a dilution fan motor 2138, a supply damper motor 2144, an exhaust damper motor 2160, an operation panel 2105, an indoor temperature sensor 2129, and thawing.
  • a sensor 2150, a feed water pump 2170, a steam generator 2112 and a magnetron 2120 are connected.
  • control unit 2200 Based on signals from operation panel 2105 and detection signals from room temperature sensor 2129 and thawing sensor 2150, control unit 2200 includes heater 2121, circulation fan motor 2119, cooling fan motor 2119, dilution fan motor 2138, It controls an air damper motor 2144, an exhaust damper motor 2160, an operation panel 2105, a water supply pump 2170, a steam generator 2112, a magnetron 2120, and the like.
  • FIG. 18 is a perspective view of the rear surface of the cooking device with the door 2102 and the casing 2101 removed as viewed obliquely from above.
  • FIG. 19 is a perspective view of the front surface of the cooking device with the door 2102 and the casing 2101 removed as viewed obliquely from above.
  • a front panel 2126 is provided on the front side of the heating chamber 2110.
  • the front panel 2126 has an insertion port 2126a for inserting a water supply tank 2111 (shown in FIG. 16) on the right side.
  • upper tray receiving portions 2151 a and 2151 b, middle tray receiving portions 2152 a, 2152 b and 2152 c, and a lower tray receiving portion 2153 are provided on the inner surface of the right side wall of the heating chamber 2110.
  • a sensor unit 2150a of the thawing sensor 2150 is disposed between the middle tray receiving units 2152a and 2152b.
  • FIG. 20 is a schematic view of the upper part of the front panel 2126 and the vicinity thereof as seen obliquely from above.
  • a steel frame 2009 as an example of a mounting bracket is disposed between the first duct portion 2181 of the steam duct 2180 and the upper part of the front panel 2126.
  • a thick part 2091 that is thicker than the other parts is provided as an example of an attached part on the upper part of the frame 2009.
  • flange portions 2092 and 2092 are provided in the lower portion of the frame body 2009.
  • the heating chamber 2110 has a gap between the thick portion 2091 and the upper wall of the heating chamber 2110 and is positioned above the plurality of punching holes 20111, 2011, ... and the glass plate 2012.
  • Flange portions 2092 and 2092 are fixed to the upper wall with screws (not shown).
  • FIG. 21 is a schematic diagram of a longitudinal section viewed from the XXI-XXI line of FIG.
  • FIG. 22 is a schematic view of the LED lamp 2001 attached to the frame 2009 as viewed from the connection terminals 2004 and 2004 side.
  • the LED lamp 2001 is attached to a frame 2009 as shown in FIGS. More specifically, the thick portion 2091 of the frame 2009 has a flat contact plane 2093 on the heating chamber 2110 side, and the flat second surface 2022 of the glass epoxy substrate 2002 is in close contact with the flat contact plane 2093. . Further, the LED lamp 2001 is fixed to the frame body 2009 by tightening a screw 2010 inserted into the mounting hole 2025 of the mounting portion 2024. In addition, you may apply
  • a plurality of punching holes 2011, 2011,... Facing the LED lamp 2001 are provided on the upper wall of the heating chamber 2110. Thereby, the light emitted from the LED lamp 2001 enters the heating chamber 2110 through the plurality of punching holes 20111, 2011,.
  • the glass plate 2012 is arrange
  • the light emitting diode element 2003 when the inside of the heating chamber 2110 is illuminated with the LED lamp 2001, the light emitting diode element 2003 generates heat.
  • the heat generated by the light emitting diode element 2003 is transmitted to the first surface 2021 of the glass epoxy substrate 2002, and is transmitted from the second surface 2022 of the glass epoxy substrate 2002 to the adhesion plane 2093 of the thick portion 2091 of the frame body 2009.
  • the second surface 2022 and the contact flat surface 2093 are both flat surfaces and are in close contact with each other, the contact area of the second surface 2022 with the contact flat surface 2093 is large. Therefore, the heat generated by the light emitting diode element 2003 can be efficiently transmitted to the thick portion 2091 of the frame body 2009 through the glass epoxy substrate 2002.
  • the thick portion 2091 of the frame body 2009 is positioned on the LED lamp 2001. Then, since there is no space between the LED lamp 2001 and the upper wall of the heating chamber 2110, the light emitted from the LED lamp 2001 is not blocked by a part of the thick portion 2091 of the frame body 2009. That is, both high heat dissipation and high luminance of the LED lamp 2001 can be achieved.
  • the light emitting diode element 2003 can be sufficiently cooled even in a high temperature atmosphere.
  • the life of the LED lamp 2001 can be extended, the number of replacements of the LED lamp 2001 is reduced, and the running cost can be reduced.
  • connection terminals 2004 and 2004 extend in the extending direction of the second surface 2022 of the glass epoxy substrate 2002, the connection terminals 2004 and 2004 can be prevented from being interposed between the second surface 2022 and the contact plane 2093.
  • the glass epoxy substrate 2002 receives a reaction force in the direction perpendicular to the extending direction of the second surface 2022 from the thick portion 2091, but the connection terminals 2004 and 2004 extend from the second surface 2022 of the glass epoxy substrate 2002. Since it extends in the present direction, the connection terminals 2004 and 2004 are not easily detached by the reaction force.
  • the LED lamp 2001 includes the mounting portion 2024, the LED lamp 2001 is thickened so that the second surface 2022 of the glass epoxy substrate 2002 is in close contact with the contact flat surface 2093 of the thick portion 2091 of the frame body 2009. It can be attached to the part 2091.
  • the thick portion 2091 is made of steel
  • the attachment portion 2024 is insulated from the connection terminals 2004 and 2004, so that the energization of the connection terminals 2004 and 2004 is not adversely affected.
  • the glass epoxy substrate 2002 can be pressed against the thick portion 2091 of the frame body 2009, so that the second surface 2022 of the glass epoxy substrate 2002 and The adhesion force between the thick portion 2091 of the frame 2009 and the adhesion plane 2093 can be increased.
  • the mounting portion 2024 is a part of the glass epoxy substrate 2002, the number of parts can be reduced.
  • the thick portion 2091 is a part of the frame body 2009, the thick portion 2091 can release heat using a wide surface of the frame body 2009. Therefore, the cooling capacity of the light emitting diode element can be increased.
  • the LED lamp 2001 includes the connection terminals 2004 and 2004 extending in the extending direction of the second surface 2022 of the glass epoxy substrate 2002, but the extension of the second surface 2022 of the glass epoxy substrate 2002.
  • a connection terminal extending obliquely with respect to the direction may be provided.
  • the LED lamp 2001 includes the glass epoxy substrate 2002.
  • a metal substrate such as an aluminum substrate, a semiconductor substrate, or a ceramic substrate may be included.
  • a frame made of Cu, Mo, W, or Al may be used instead of the steel frame 2009 of the third embodiment.
  • one attachment portion 2024 is provided on the glass epoxy substrate 2002, but a plurality of attachment portions may be provided.
  • FIG. 23 is the schematic diagram which looked at the front of the principal part of the heating cooker of 4th Embodiment of this invention from diagonally upward.
  • the same reference numerals as those of the third embodiment are assigned to the same components as those of the third embodiment.
  • “left” refers to the left when the cooking device is viewed from the front side
  • “right” is when the cooking device is viewed from the front side. Point to the right.
  • the heating cooker includes a casing 2301 made of metal such as iron, a heating chamber 2310 provided in the casing 2301, and an LED lamp 2201 that illuminates the heating chamber 2310.
  • a steam generator, electrical components, a magnetron, a heater, a cooling fan unit, an air duct, and the like are installed in the casing 2301 as in the third embodiment.
  • the air blown out by the cooling fan portion flows between the right side portion of the casing 2301 and the right wall of the heating chamber 2310.
  • FIG. 24 is a schematic diagram of a longitudinal section viewed from the line XXIV-XXIV in FIG.
  • a concave portion 2302 as an example of a mounted portion is provided on the right side surface of the casing 2301.
  • the concave portion 2302 includes a bottom portion 2321 substantially parallel to the extending direction of the right wall of the heating chamber 2310, and four peripheral walls provided around the bottom portion 2321 and inclined with respect to the extending direction of the right wall of the heating chamber 2310. It consists of parts 2322, 2323, 2324. Further, the bottom portion 2321 is located on the side of the plurality of punching holes 2211, 2111,... And the glass plate 2212.
  • the LED lamp 2201 is attached to the recess 2302 of the casing 2301. More specifically, the bottom 2321 of the recess 2302 has a flat contact plane 2325 on the heating chamber 2310 side, and the flat second surface 2022 of the glass epoxy substrate 2002 is in close contact with the flat contact plane 2325. Further, the LED lamp 2001 is fixed to the casing 2301 by tightening a screw 2010 inserted into the mounting hole 2025 of the mounting portion 2024. In addition, you may apply
  • the LED lamp 2201 includes a metal base 306 having a shape different from that of the base 2006 of the LED lamp 2001 lamp 2001 of the third embodiment.
  • An inclined surface 2261 having an inclination angle substantially the same as the inclination angle of the peripheral wall 2323 of the recess 2302 is provided on the recess 2302 side of the base 306. Further, the inclined surface 2261 is designed so that the second surface 2022 of the glass epoxy substrate 2002 contacts the contact flat surface 2325 of the bottom portion 2321 when the inclined surface 2261 is brought into contact with the peripheral wall portion 2323 of the concave portion 2302.
  • a plurality of punching holes 2211, 2111,... Facing the LED lamp 2001 are provided on the right wall of the heating chamber 2110. Thereby, the light emitted from the LED lamp 2201 enters the heating chamber 2310 through the plurality of punching holes 2211, 2111,. Further, the punching holes 2211, 2111,... Are covered with a glass plate 2212 so that steam in the heating chamber 2310 does not leak out of the heating chamber 2310 from the punching holes 2211, 2111,.
  • the flat second surface 2022 of the glass epoxy substrate 2002 is in close contact with the flat close contact plane 325 of the bottom 2321 of the recess 2302, so the second surface 2022 with respect to the close contact flat surface 2325 The contact area is increased. Therefore, the heat generated by the light emitting diode element 2003 can be efficiently transmitted to the bottom 2321 of the recess 2302 through the glass epoxy substrate 2002.
  • the bottom 2321 of the recess 2302 is not on the light emission side of the LED lamp 2201. It is possible to prevent the illumination capability of the LED lamp 2201 from being lowered.
  • the light emitting diode element 2003 can be sufficiently cooled even in a high temperature atmosphere.
  • the heat radiation area is larger than that of the third embodiment, and the light emitting diode element 2003 can be made high.
  • the LED lamp 2201 can be air-cooled.
  • the LED lamp 2201 includes the connection terminals 2004 and 2004 extending in the extending direction of the second surface 2022 of the glass epoxy substrate 2002, but the extension of the second surface 2022 of the glass epoxy substrate 2002.
  • a connection terminal extending obliquely with respect to the direction may be provided.
  • the LED lamp 2201 includes the glass epoxy substrate 2002.
  • an aluminum substrate may be included.
  • Examples of the cooking device of the present invention include not only an oven range using superheated steam but also an oven using superheated steam, an oven range not using superheated steam, and an oven not using superheated steam.
  • healthy cooking can be performed by using superheated steam or saturated steam in a microwave oven or the like.
  • superheated steam or saturated steam having a temperature of 100 ° C. or higher is supplied to the food surface, and the superheated steam or saturated steam adhered to the food surface is condensed to give a large amount of condensation latent heat to the food. So it can efficiently transfer heat to food.
  • the heating chamber is filled with superheated steam or saturated steam to be in a low oxygen state, thereby enabling cooking while suppressing food oxidation.
  • the low oxygen state refers to a state in which the volume% of oxygen is 10% or less (for example, 0.5 to 3%) in the heating chamber.
  • Glass plate 2021 ... First surface 2022 ... Second surface 2034 ... Mounting portion 2035 ... Mounting hole 2091 ... Thick part 2092 ... Flange part 093,2325 ... contact plane 2101,2301 ... casing 2110,2310 ... heating chamber 2302 ... recess 2321 ... bottom 2322,2323,2324 ... wall portion 2123 ... object to be heated

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Abstract

An LED lamp (1) equipped with a glass epoxy substrate (3), a light-emitting diode element (4) mounted on a first face (31) of the glass epoxy substrate (3), a cover glass (7) covering the light-emitting diode element (4) and the glass epoxy substrate (3) from the first face (31) side thereof, an aluminum heat sink (2), and a connection terminal (5) electrically connected to the light-emitting diode element (4). The aluminum heat sink (2) has a flat adhering planar face (11) that adheres to a second face (32) on the opposite side of the first face (31) of the glass epoxy substrate (3), and a flat, heat dissipation planar face (22) furnished on the opposite side from the adhering planar face (11). The connection terminal (5) extends in the direction of extension of the heat dissipation planar face (22) of the aluminum heat sink (2).

Description

ＬＥＤランプおよびそれを備えた加熱調理器LED lamp and cooking device provided with the same
　本発明は、ＬＥＤ（発光ダイオード）ランプおよびそれを備えた加熱調理器に関する。 The present invention relates to an LED (light emitting diode) lamp and a cooking device provided with the same.
　従来、ＬＥＤランプとしては、特開２０１０－５６０５９号公報（特許文献１）に開示されたものがある。このＬＥＤランプは、発光ダイオード素子が実装された基板と、この基板を上面に搭載したヒートシンクとを備えている。上記基板とヒートシンクの上面つまり基板側とは略半球状の透明部材で覆って、この透明部材とヒートシンクとの間の空間を密閉している。また、上記ヒートシンクの下面つまり基板側とは反対側には合成樹脂製の絶縁部を介して接続端子を取り付けている。 Conventionally, as an LED lamp, there is one disclosed in JP 2010-56059 A (Patent Document 1). This LED lamp includes a substrate on which a light emitting diode element is mounted, and a heat sink on which the substrate is mounted. The upper surface of the substrate and the heat sink, that is, the substrate side is covered with a substantially hemispherical transparent member, and the space between the transparent member and the heat sink is sealed. Further, a connection terminal is attached to the lower surface of the heat sink, that is, the side opposite to the substrate side via an insulating portion made of synthetic resin.
　上記ヒートシンクは、上面が平面であり、下面が凹面であり、側面の輪郭が回転双曲面の一部であり、放射状に突出する放熱フィンを有する形態である。 The heat sink has a shape in which the upper surface is a flat surface, the lower surface is a concave surface, the contour of the side surface is a part of a rotating hyperboloid, and the heat radiation fins project radially.
　さらに、上記ヒートシンクの中心には挿通孔を設けて、この挿通孔に挿通した配線によって発光ダイオード素子と接続端子との間を電気接続している。 Furthermore, an insertion hole is provided in the center of the heat sink, and the light emitting diode element and the connection terminal are electrically connected by a wiring inserted through the insertion hole.
　そして、上記ＬＥＤランプでは、発光ダイオード素子から発生した熱は、ヒートシンクの放射状の放熱フィンから空気中に放熱される。 In the LED lamp, heat generated from the light emitting diode element is radiated into the air from the radial heat radiation fins of the heat sink.
特開２０１０－５６０５９号公報JP 2010-56059 A
　しかしながら、上記従来のＬＥＤランプでは、発光ダイオード素子からの熱は、放熱フィンを介して熱伝導性の悪い空気中に放出するだけであるため、発光ダイオード素子の冷却が不充分であった。特に、このＬＥＤランプを、加熱調理器、映像機器、溶接装置、熱処理装置および炉などの高温雰囲気で使用すると、発光ダイオード素子の冷却が全く不充分であり、寿命が著しく短くなるという問題があった。 However, in the above conventional LED lamp, the heat from the light emitting diode element is only released into the air having poor thermal conductivity through the heat radiation fin, so that the light emitting diode element is not sufficiently cooled. In particular, when this LED lamp is used in a high-temperature atmosphere such as a heating cooker, video equipment, welding apparatus, heat treatment apparatus and furnace, there is a problem that the cooling of the light-emitting diode element is quite inadequate and the life is remarkably shortened. It was.
　そこで、本発明の課題は、高温雰囲気でも充分に冷却できて寿命が長いＬＥＤランプおよびそれを備えた加熱調理器を提供することにある。 Therefore, an object of the present invention is to provide an LED lamp that can be sufficiently cooled even in a high-temperature atmosphere and has a long life, and a cooking device equipped with the LED lamp.
　本発明者は、加熱調理器、映像機器、溶接装置、熱処理装置および炉などの高温雰囲気を生じる装置において、ハウジングやケースなどの金属板が存在することに着目して、これらの金属板をＬＥＤランプの照明能力を妨げることなく放熱に有効に利用できないかと鋭意研究を行った。 The present inventors pay attention to the presence of metal plates such as housings and cases in devices that generate high-temperature atmospheres such as heating cookers, video equipment, welding devices, heat treatment devices, and furnaces. We have intensively studied whether it can be used effectively for heat dissipation without interfering with the lamp illumination ability.
　その結果、本発明者は、上記金属板を、照明能力を妨げることなく、放熱に極めて有効に利用できるＬＥＤランプを発明した。 As a result, the inventor of the present invention invented an LED lamp that can use the metal plate very effectively for heat dissipation without impeding the illumination capability.
　すなわち、本発明のＬＥＤランプは、
　基板と、
　この基板の第１面に搭載された発光ダイオード素子と、
　上記発光ダイオード素子と上記基板の第１面側とを覆う透明または半透明な部材と、
　上記基板の第１面とは反対側の第２面と密着する平坦な密着平面と、この密着平面とは反対側に設けられた平坦な放熱平面とを有するヒートシンクと、
　上記ヒートシンクの放熱平面の延在方向またはその延在方向に対して斜め方向に延びると共に、上記発光ダイオード素子に電気接続される接続端子と
を備えることを特徴としている。 That is, the LED lamp of the present invention is
A substrate,
A light-emitting diode element mounted on the first surface of the substrate;
A transparent or translucent member covering the light emitting diode element and the first surface side of the substrate;
A heat sink having a flat adhesion plane in close contact with the second surface opposite to the first surface of the substrate, and a flat heat radiation plane provided on the opposite side of the adhesion plane;
The heat sink includes an extension direction of the heat radiation plane of the heat sink or an oblique direction with respect to the extension direction and a connection terminal electrically connected to the light emitting diode element.
　上記構成によれば、上記発光ダイオード素子から発生した熱は、基板の第１面に伝わって、基板の第２面からヒートシンクの密着平面に伝わる。このとき、上記ヒートシンクの密着平面が基板の第２面に密着する平坦な面であるので、基板の第２面とヒートシンクの密着平面との接触面積を大きくとることができる。したがって、上記発光ダイオード素子の熱を基板を介してヒートシンクに効率良く伝えることができる。 According to the above configuration, the heat generated from the light emitting diode element is transmitted to the first surface of the substrate, and is transmitted from the second surface of the substrate to the adhesion plane of the heat sink. At this time, since the contact flat surface of the heat sink is a flat surface in close contact with the second surface of the substrate, the contact area between the second surface of the substrate and the contact flat surface of the heat sink can be increased. Therefore, the heat of the light emitting diode element can be efficiently transmitted to the heat sink through the substrate.
　さらに、例えば、加熱調理器、映像機器、溶接装置、熱処理装置および炉などの高温雰囲気を生じる装置に上記ＬＥＤランプを使用する場合、上記ヒートシンクの放熱平面が平坦であるので、上記高温雰囲気を生じる装置の金属板の表面にヒートシンクの放熱平面を容易に密着させることができ、しかも、ヒートシンクが、単なる平板状で、基板の第２面側つまり裏面側にあって、発光ダイオード素子の出射側にないから照明能力を妨げることなく、簡単、コンパクトな構造で、ヒートシンクの放熱平面と金属板の表面との接触面積を大きくとることができる。したがって、上記ヒートシンクは発光ダイオード素子からの熱をヒートシンクに直接接触する上記金属板に熱伝導により効率良く放出することができる。この金属板は、例えばケーシングやハウジングであって、放熱面積を極めて大きくすることができ、冷却効果を極めて大きくすることができる。したがって、このＬＥＤランプは高温雰囲気で使用でき、寿命が長い。 Furthermore, for example, when the LED lamp is used in a device that generates a high temperature atmosphere such as a heating cooker, a video device, a welding device, a heat treatment device, and a furnace, the heat dissipation plane of the heat sink is flat, and thus the high temperature atmosphere is generated. The heat sink flat surface of the heat sink can be easily brought into close contact with the surface of the metal plate of the device, and the heat sink is a simple flat plate on the second surface side, that is, the back surface side of the substrate and on the light emitting diode element emission side. Therefore, the contact area between the heat radiation flat surface of the heat sink and the surface of the metal plate can be increased with a simple and compact structure without impeding the illumination capability. Therefore, the heat sink can efficiently dissipate heat from the light emitting diode element by heat conduction to the metal plate that directly contacts the heat sink. The metal plate is, for example, a casing or a housing, and can greatly increase the heat radiation area and can greatly increase the cooling effect. Therefore, this LED lamp can be used in a high temperature atmosphere and has a long life.
　また、上記接続端子がヒートシンクの放熱平面の延在方向またはその延在方向に対して斜め方向に延びるので、上記金属板の表面とヒートシンクの放熱平面との間には接続端子が介在しないようにできる。 Further, since the connection terminal extends in the extending direction of the heat radiation plane of the heat sink or in an oblique direction with respect to the extension direction, the connection terminal should not be interposed between the surface of the metal plate and the heat radiation plane of the heat sink. it can.
　さらに、上記接続端子が金属板に密着しているヒートシンクの放熱平面の延在方向またはその延在方向に対して斜め方向に延びるので、接続端子は金属板からの反力で外れ難い。 Furthermore, since the connecting terminal extends in an oblique direction with respect to the extending direction of the heat radiation plane of the heat sink where the connecting terminal is in close contact with the metal plate or the extending direction, the connecting terminal is not easily detached by a reaction force from the metal plate.
　このように、本発明のＬＥＤランプは、簡単、安価、コンパクトな構造で、照明能力を下げることがなく、発光ダイオード素子を高温雰囲気でも充分に冷却でき、寿命を長くすることができる。 As described above, the LED lamp of the present invention has a simple, inexpensive, and compact structure, does not lower the illumination capability, can sufficiently cool the light emitting diode element even in a high temperature atmosphere, and can extend the life.
　一実施形態のＬＥＤランプでは、
　上記ヒートシンクの上記密着平面と上記放熱平面との間の寸法である厚さが、上記ヒートシンクの縦および横の寸法よりも小さい。 In one embodiment of the LED lamp,
A thickness, which is a dimension between the adhesion plane of the heat sink and the heat radiation plane, is smaller than the vertical and horizontal dimensions of the heat sink.
　ここで、「縦の寸法」とは、上記放熱平面の輪郭が略矩形として、この輪郭の長辺を指し、また、「横の寸法」とは、上記輪郭の短辺を指す。 Here, the “vertical dimension” refers to the long side of the outline with the outline of the heat radiation plane being substantially rectangular, and the “lateral dimension” refers to the short side of the outline.
　なお、上記放熱平面と上記密着平面とは平行であると構造が簡単になるので好ましい。尤も、図１２に示すように、ＬＥＤランプが斜め方向に光を照射する場合（発光ダイオード素子１００４の出射光が向かう方向が放熱平面１０２２に対して傾斜する場合）は、密着平面１０２１と放熱平面１０２２とは平行でなくて傾斜していてもよい。この場合、上記密着平面１０２１と放熱平面１０２２の間の厚さの寸法とは、傾斜方向の中央の点の間の寸法Ｄを言う。また、図１２では密着平面１０２１の傾斜角は誇張して大きくしている。 In addition, it is preferable that the heat radiation plane and the contact plane are parallel because the structure becomes simple. However, as shown in FIG. 12, when the LED lamp irradiates light in an oblique direction (when the direction in which the light emitted from the light emitting diode element 1004 travels is inclined with respect to the heat radiation plane 1022), the contact plane 1021 and the heat radiation plane It may not be parallel to 1022 but may be inclined. In this case, the thickness dimension between the contact plane 1021 and the heat radiation plane 1022 refers to the dimension D between the central points in the tilt direction. In FIG. 12, the inclination angle of the contact flat surface 1021 is exaggerated and increased.
　上記実施形態によれば、上記ヒートシンクの密着平面と放熱平面との間の寸法である厚さが、ヒートシンクの縦および横の寸法よりも小さいので、密着平面と放熱平面との間の放熱経路が短くなる。したがって、上記ヒートシンクは発光ダイオード素子からの熱を放熱平面にも迅速に伝えて効果的に放熱できる。 According to the embodiment, since the thickness, which is the dimension between the adhesion plane and the heat radiation plane of the heat sink, is smaller than the vertical and horizontal dimensions of the heat sink, the heat radiation path between the adhesion plane and the heat radiation plane is Shorter. Therefore, the heat sink can quickly dissipate heat by quickly transferring heat from the light emitting diode element to the heat radiation plane.
　一実施形態のＬＥＤランプでは、
　上記発光ダイオード素子と上記接続端子とは、上記ヒートシンクの内部を通らないで外側を通る上記基板上の配線によって接続されている。 In one embodiment of the LED lamp,
The light emitting diode element and the connection terminal are connected by wiring on the substrate that passes outside without passing through the inside of the heat sink.
　上記実施形態によれば、上記発光ダイオード素子と接続端子とは、ヒートシンクの内部を通らないで外側を通る基板上の配線によって接続されているので、ヒートシンクの放熱経路が少なくなるのを防ぐことができる。 According to the above embodiment, since the light emitting diode element and the connection terminal are connected by the wiring on the substrate that passes outside without passing through the inside of the heat sink, it is possible to prevent the heat dissipation path of the heat sink from being reduced. it can.
　仮に、従来例のように、上記ヒートシンクに挿通孔を設けて、その挿通孔に挿通した配線によって発光ダイオード素子と接続端子との間を電気接続したなら、ヒートシンクの放熱経路が挿通孔の分だけ少なくなってしまうのである。 If the heat sink is provided with an insertion hole as in the conventional example, and the light emitting diode element and the connection terminal are electrically connected by the wiring inserted through the insertion hole, the heat dissipation path of the heat sink is equivalent to the insertion hole. It will be less.
　一実施形態のＬＥＤランプは、
　上記接続端子から絶縁された取付部材を備える。 The LED lamp of one embodiment is
An attachment member insulated from the connection terminal is provided.
　上記実施形態によれば、例えば、加熱調理器、映像機器、溶接装置、熱処理装置および炉などの高温雰囲気を生じる装置の金属板にヒートシンクの放熱平面を取り付ける場合、取付部材があるので、ヒートシンクの放熱平面が金属板に密着するように、取付部材でＬＥＤランプを固定できる。 According to the above embodiment, for example, when attaching a heat sink plane of a heat sink to a metal plate of a device that generates a high temperature atmosphere such as a heating cooker, a video device, a welding device, a heat treatment device, and a furnace, since there is an attachment member, The LED lamp can be fixed by the mounting member so that the heat radiation plane is in close contact with the metal plate.
　また、仮に、上記取付部材の取付先が金属であったとしても、取付部材は接続端子から絶縁されているので、接続端子の通電に悪影響が及ぶのを防ぐことができる。 Further, even if the attachment destination of the attachment member is a metal, since the attachment member is insulated from the connection terminal, it is possible to prevent adverse effects on the conduction of the connection terminal.
　一実施形態のＬＥＤランプでは、
　上記取付部材は、上記接続端子の近傍において上記接続端子の延在する方向に交差する方向に延びると共に、取付穴を有する取付板である。 In one embodiment of the LED lamp,
The mounting member is a mounting plate that extends in a direction intersecting the extending direction of the connection terminal in the vicinity of the connection terminal and has a mounting hole.
　上記実施形態によれば、上記取付板の取付穴に挿通した例えばビスを締め付けて、取付板を取付先に取り付ける場合、取付板は接続端子の近傍において接続端子の延在する方向に交差する方向に延びているので、ビスの締め付けで、接続端子を接続先に固定すると、ＬＥＤランプは上記接続端子による固定方向と上記取付板による固定方向の二方向に固定されるので、ＬＥＤランプは脱落し難いという利点を有する。 According to the embodiment, when, for example, a screw inserted into the mounting hole of the mounting plate is tightened and the mounting plate is mounted to the mounting destination, the mounting plate intersects the direction in which the connection terminal extends in the vicinity of the connection terminal. When the connection terminal is fixed to the connection destination by tightening a screw, the LED lamp is fixed in two directions, that is, the fixing direction by the connection terminal and the fixing direction by the mounting plate. It has the advantage of being difficult.
　本発明の加熱調理器は、
　ケーシングと、
　上記ケーシング内に設けられ、被加熱物を収容する加熱室と、
　上記ケーシングと上記加熱室との間に配置されて、上記加熱室内を照らす本発明のＬＥＤランプと
を備え、
　上記ＬＥＤランプの上記ヒートシンクの上記放熱平面は金属板に密着されていることを特徴としている。 The heating cooker of the present invention is
A casing,
A heating chamber provided in the casing and containing an object to be heated;
The LED lamp of the present invention that is disposed between the casing and the heating chamber and illuminates the heating chamber,
The heat radiation plane of the heat sink of the LED lamp is in close contact with a metal plate.
　上記構成によれば、上記ＬＥＤランプを備えることによって、ＬＥＤランプの交換回数が少なくなるので、ランニングコストを低減できる。 According to the above configuration, since the number of replacements of the LED lamp is reduced by providing the LED lamp, the running cost can be reduced.
　また、本発明の加熱調理器は、
　ケーシングと、
　上記ケーシング内に設けられ、被加熱物を収容する加熱室と、
　上記ケーシングと上記加熱室との間に配置され、上記加熱室内を照らすＬＥＤランプと、
　上記ＬＥＤランプが取り付けられる金属製の被取付部と
を備え、
　上記ＬＥＤランプは、
　上記加熱室側に第１面を有すると共に、上記加熱室とは反対側に平坦な第２面を有する基板と、
　上記基板の第１面に搭載された発光ダイオード素子と、
　上記発光ダイオード素子と上記基板の第１面側とを覆う透明または半透明な部材と、
　上記基板の第２面の延在方向またはその延在方向に対して斜め方向に延びると共に、上記発光ダイオード素子に電気接続される接続端子と
を備え、
　上記被取付部は、上記基板の第２面と密着する平坦な密着平面を有することを特徴としている。 Moreover, the cooking device of the present invention is
A casing,
A heating chamber provided in the casing and containing an object to be heated;
An LED lamp disposed between the casing and the heating chamber and illuminating the heating chamber;
A metal attached portion to which the LED lamp is attached;
The LED lamp is
A substrate having a first surface on the heating chamber side and a flat second surface on the opposite side of the heating chamber;
A light emitting diode element mounted on the first surface of the substrate;
A transparent or translucent member covering the light emitting diode element and the first surface side of the substrate;
The extending direction of the second surface of the substrate or an oblique direction with respect to the extending direction, and a connection terminal electrically connected to the light emitting diode element,
The attached portion has a flat contact plane that is in close contact with the second surface of the substrate.
　上記構成によれば、上記発光ダイオード素子から発生した熱は、基板の第１面に伝わって、基板の第２面から被取付部の密着平面に伝わる。このとき、上記被取付部の密着平面が基板の第２面に密着する平坦な面であるので、基板の第２面と被取付部の密着平面との接触面積を大きくとることができる。したがって、上記発光ダイオード素子の熱を基板を介して被取付部に効率良く伝えることができる。 According to the above configuration, the heat generated from the light emitting diode element is transmitted to the first surface of the substrate, and is transmitted from the second surface of the substrate to the contact flat surface of the mounted portion. At this time, since the contact flat surface of the attached portion is a flat surface that is in close contact with the second surface of the substrate, the contact area between the second surface of the substrate and the contact flat surface of the attached portion can be increased. Therefore, the heat of the light emitting diode element can be efficiently transmitted to the mounted portion through the substrate.
　さらに、上記基板の第２面と被取付部の密着平面との接触面積を大きくしても、被取付部が基板の第２面側つまり裏面側にあって、発光ダイオード素子の出射側にないから、ＬＥＤランプの照明能力は低下しない。 Furthermore, even if the contact area between the second surface of the substrate and the contact flat surface of the mounted portion is increased, the mounted portion is on the second surface side, that is, the back surface side of the substrate, and not on the light emitting diode element emission side. Therefore, the illumination capability of the LED lamp does not decrease.
　したがって、上記ＬＥＤランプは、照明能力が低下せず、発光ダイオード素子を高温雰囲気でも充分に冷却でき、寿命を長くすることができる。 Therefore, the LED lamp does not have a reduced illumination capability, can sufficiently cool the light emitting diode element even in a high temperature atmosphere, and can extend the life.
　また、上記ＬＥＤランプの寿命を長くすることができるので、ＬＥＤランプの交換回数が少なくなり、ランニングコストを低減できる。 Also, since the life of the LED lamp can be extended, the number of replacement of the LED lamp is reduced, and the running cost can be reduced.
　また、上記接続端子が基板の第２面の延在方向またはその延在方向に対して斜め方向に延びるので、基板の第２面と被取付部の密着平面との間に接続端子が入らないようにできる。 Further, since the connection terminal extends in the extending direction of the second surface of the substrate or in an oblique direction with respect to the extending direction, the connection terminal does not enter between the second surface of the substrate and the contact flat surface of the attached portion. You can
　さらに、上記基板は第２面の延在方向に対して垂直方向の反力を被取付部から受けるが、接続端子が基板の第２面の延在方向またはその延在方向に対して斜め方向に延びるので、接続端子は上記反力で外れ難い。 Further, the substrate receives a reaction force in a direction perpendicular to the extending direction of the second surface from the mounted portion, but the connection terminal is inclined with respect to the extending direction of the second surface of the substrate or the extending direction thereof. Therefore, the connection terminal is difficult to come off due to the reaction force.
　一実施形態の加熱調理器では、
　上記ＬＥＤランプは上記接続端子から絶縁された取付部材を備える。 In the heating cooker of one embodiment,
The LED lamp includes a mounting member that is insulated from the connection terminal.
　上記実施形態によれば、上記ＬＥＤランプは取付部材を備えるので、基板の第２面が被取付部の密着平面に密着するように、ＬＥＤランプを被取付部に取り付けることができる。 According to the above embodiment, since the LED lamp includes an attachment member, the LED lamp can be attached to the attachment portion so that the second surface of the substrate is in close contact with the contact flat surface of the attachment portion.
　また、仮に、上記取付部材の取付先が金属であったとしても、取付部材は接続端子から絶縁されているので、接続端子の通電に悪影響が及ぶのを防ぐことができる。 Further, even if the attachment destination of the attachment member is a metal, since the attachment member is insulated from the connection terminal, it is possible to prevent adverse effects on the conduction of the connection terminal.
　一実施形態の加熱調理器では、
　上記取付部材は、上記基板の第２面の延在方向に延びると共に、取付穴を有する取付板である。 In the heating cooker of one embodiment,
The attachment member is an attachment plate extending in the extending direction of the second surface of the substrate and having an attachment hole.
　上記実施形態によれば、上記取付板の取付穴に挿通した例えばビスを締め付けて、取付板を取付先に取り付ける場合、基板の第２面の延在方向に延びるので、ビスの締め付けで、基板を被取付部に押し付けることができる。したがって、上記基板の第２面と被取付部の密着平面との密着力を高くすることができる。 According to the above-described embodiment, for example, when a screw inserted through the mounting hole of the mounting plate is tightened and the mounting plate is mounted to the mounting destination, the second surface of the substrate extends in the extending direction. Can be pressed against the mounted portion. Therefore, the adhesion force between the second surface of the substrate and the adhesion plane of the attached portion can be increased.
　一実施形態の加熱調理器では、
　上記取付板は上記基板の一部である。 In the heating cooker of one embodiment,
The mounting plate is a part of the substrate.
　上記実施形態によれば、上記取付部材は基板の一部であるから、部品点数を少なくすることができる。 According to the above embodiment, since the mounting member is a part of the substrate, the number of parts can be reduced.
　一実施形態の加熱調理器では、
　上記被取付部は上記ＬＥＤランプの取付金具の一部である。 In the heating cooker of one embodiment,
The mounted portion is a part of the mounting bracket of the LED lamp.
　上記実施形態によれば、上記被取付部はＬＥＤランプの取付金具の一部であるから、この取付金具の表面積が大きくて、ＬＥＤランプの冷却能力を高めることができる。 According to the above embodiment, since the mounted portion is a part of the mounting bracket of the LED lamp, the surface area of the mounting bracket is large, and the cooling capacity of the LED lamp can be increased.
　一実施形態の加熱調理器では、
　上記被取付部は上記ケーシングの一部である。 In the heating cooker of one embodiment,
The attached portion is a part of the casing.
　上記実施形態によれば、上記被取付部はケーシングの一部であるから、ケーシングの表面積がさらに大きくて、ＬＥＤランプの冷却能力を高めることができる。 According to the above embodiment, since the attached portion is a part of the casing, the surface area of the casing is further increased, and the cooling capacity of the LED lamp can be increased.
　本発明によれば、高温雰囲気で使用しても、発光ダイオード素子を充分に冷却できて、寿命の長く、かつ、簡単、安価、コンパクトな構造のＬＥＤランプを提供できる。 According to the present invention, even when used in a high temperature atmosphere, the light emitting diode element can be sufficiently cooled, and an LED lamp having a long life, simple, inexpensive and compact structure can be provided.
　本発明の加熱調理器は、本発明のＬＥＤランプを備えることによって、ＬＥＤランプの交換回数が少なくなるので、ランニングコストを低減できる。 The cooking device of the present invention includes the LED lamp of the present invention, so that the number of replacement of the LED lamp is reduced, so that the running cost can be reduced.
　本発明によれば、高温雰囲気でも充分に冷却できて寿命が長いＬＥＤランプを備えた加熱調理器を提供できる。 According to the present invention, it is possible to provide a cooking device equipped with an LED lamp that can be sufficiently cooled even in a high-temperature atmosphere and has a long life.
図１は本発明の第１実施形態のＬＥＤランプの模式側面図である。FIG. 1 is a schematic side view of an LED lamp according to a first embodiment of the present invention. 図２は図１の矢印方向から見た模式図である。FIG. 2 is a schematic view seen from the direction of the arrow in FIG. 図３は上記第１実施形態のＬＥＤランプの取付状態を説明するための模式図である。FIG. 3 is a schematic diagram for explaining the mounting state of the LED lamp of the first embodiment. 図４は本発明の第２実施形態の加熱調理器の正面斜め上方から見た斜視図である。FIG. 4: is the perspective view seen from the front diagonally upper direction of the heating cooker of 2nd Embodiment of this invention. 図５は上記加熱調理器の正面から見た縦断面の模式図である。FIG. 5 is a schematic diagram of a longitudinal section viewed from the front of the heating cooker. 図６は上記加熱調理器の右側方から見た縦断面の模式図である。FIG. 6 is a schematic diagram of a longitudinal section viewed from the right side of the cooking device. 図７は上記加熱調理器の制御ブロック図である。FIG. 7 is a control block diagram of the cooking device. 図８は扉とケーシングを取り外した状態の加熱調理器の後面斜め上方から見た斜視図である。FIG. 8 is a perspective view of the heating cooker with the door and the casing removed, as viewed from the rear and diagonally above. 図９は扉とケーシングを取り外した状態の加熱調理器の正面斜め上方から見た斜視図である。FIG. 9 is a perspective view of the heating cooker with the door and casing removed, as viewed from the front and diagonally above. 図１０は前面パネルの上部およびその近傍の部分を斜め上方から見た模式図である。FIG. 10 is a schematic view of an upper portion of the front panel and a portion in the vicinity thereof as viewed obliquely from above. 図１１は図１０のＸＩ－ＸＩ線から見た縦断面の模式図である。FIG. 11 is a schematic diagram of a longitudinal section viewed from the line XI-XI in FIG. 図１２は本発明の一実施形態のＬＥＤランプの要部の模式図である。FIG. 12 is a schematic diagram of a main part of an LED lamp according to an embodiment of the present invention. 図１３は本発明の第３実施形態のＬＥＤランプの模式側面図である。FIG. 13 is a schematic side view of an LED lamp according to a third embodiment of the present invention. 図１４は上記第３実施形態の加熱調理器の正面斜め上方から見た斜視図である。FIG. 14: is the perspective view seen from the front diagonally upper direction of the heating cooker of the said 3rd Embodiment. 図１５は上記第３実施形態の加熱調理器の正面から見た縦断面の模式図である。FIG. 15 is a schematic diagram of a longitudinal section viewed from the front of the heating cooker according to the third embodiment. 図１６は上記第３実施形態の加熱調理器の右側方から見た縦断面の模式図である。FIG. 16 is a schematic diagram of a longitudinal section viewed from the right side of the heating cooker according to the third embodiment. 図１７は上記加熱調理器の制御ブロック図である。FIG. 17 is a control block diagram of the cooking device. 図１８は扉とケーシングを取り外した状態の加熱調理器の後面斜め上方から見た斜視図である。FIG. 18 is a perspective view of the heating cooker with the door and casing removed, as viewed from the upper rear side. 図１９は扉とケーシングを取り外した状態の加熱調理器の正面斜め上方から見た斜視図である。FIG. 19 is a perspective view of the heating cooker with the door and casing removed, as seen from the front and obliquely above. 図２０は前面パネルの上部およびその近傍の部分を斜め上方から見た模式図である。FIG. 20 is a schematic view of the upper portion of the front panel and a portion in the vicinity thereof as viewed obliquely from above. 図２１は図２０のXXI－XXI線から見た模式図である。FIG. 21 is a schematic view taken along line XXI-XXI in FIG. 図２２は枠体に取り付けられたＬＥＤランプを接続端子側から見た模式図である。FIG. 22 is a schematic view of the LED lamp attached to the frame as viewed from the connection terminal side. 図２３は本発明の第４実施形態の加熱調理器の要部の正面を斜め上方からみた模式図である。FIG. 23: is the schematic diagram which looked at the front of the principal part of the heating cooker of 4th Embodiment of this invention from diagonally upward. 図２４は図２３のXXIV－XXIV線から見た縦断面の模式図である。FIG. 24 is a schematic diagram of a longitudinal section viewed from the line XXIV-XXIV in FIG.
　以下、本発明のＬＥＤランプおよび加熱調理器を図示の実施の形態により詳細に説明する。 Hereinafter, the LED lamp and the heating cooker of the present invention will be described in detail with reference to the illustrated embodiments.
　〔第１実施形態〕
　図１は、本発明の第１実施形態のＬＥＤランプ１を側方から見た模式図である。 [First Embodiment]
FIG. 1 is a schematic view of an LED lamp 1 according to a first embodiment of the present invention as viewed from the side.
　上記ＬＥＤランプ１は、ヒートシンクの一例としての略矩形板状のアルミヒートシンク２と、基板の一例としてのガラスエポキシ基板３と、発光ダイオード素子４と、２本（図１では１本のみ見えている）の略矩形板状の接続端子５，５と、取付部材の一例としての略矩形板状の取付板６と、透明または半透明な部材の一例としてのカバーガラス７と、金属製の口金８とを備えている。 The LED lamp 1 includes a substantially rectangular aluminum heat sink 2 as an example of a heat sink, a glass epoxy substrate 3 as an example of a substrate, and two light emitting diode elements 4 (only one is visible in FIG. 1). ) Of substantially rectangular plate- like connection terminals 5, 5, a substantially rectangular plate-like attachment plate 6 as an example of an attachment member, a cover glass 7 as an example of a transparent or translucent member, and a metal base 8. And.
　上記アルミヒートシンク２は、平坦な密着平面２１と、この密着平面２１とは反対側に平坦な放熱平面２２とを有している。また、上記アルミヒートシンク２の厚さ（密着平面２１と放熱平面２２との間の寸法）は、アルミヒートシンク２の縦および横の寸法に比べてよりも小さくなっている。また、上記アルミヒートシンク２の放熱平面２２および４つの側面は、カバーガラス７で覆われていなくて露出している。また、上記密着平面２１と放熱平面２２は互いに略平行になっている。なお、上記アルミヒートシンク２の縦の寸法とは、図１中の左右方向の寸法に相当する。また、上記アルミヒートシンク２の横の寸法とは、図１の紙面に対して垂直な方向の寸法に相当する。 The aluminum heat sink 2 has a flat adhesion plane 21 and a flat heat radiation plane 22 on the opposite side of the adhesion plane 21. The thickness of the aluminum heat sink 2 (the dimension between the contact plane 21 and the heat radiation plane 22) is smaller than the vertical and horizontal dimensions of the aluminum heat sink 2. The heat radiation plane 22 and the four side surfaces of the aluminum heat sink 2 are not covered with the cover glass 7 and are exposed. Further, the contact plane 21 and the heat radiation plane 22 are substantially parallel to each other. The vertical dimension of the aluminum heat sink 2 corresponds to the horizontal dimension in FIG. The horizontal dimension of the aluminum heat sink 2 corresponds to a dimension in a direction perpendicular to the paper surface of FIG.
　上記ガラスエポキシ基板３の第１面３１には発光ダイオード素子４が搭載されている。一方、上記ガラスエポキシ基板３の第１面３１とは反対側の第２面３２には、ヒートシンク２の平坦な密着平面２１が密着している。また、上記ガラスエポキシ基板３には、接続端子５，５からの電流を発光ダイオード素子４に供給するための配線３３が設けられている。すなわち、上記発光ダイオード素子４と接続端子５，５とは、アルミヒートシンク２の内部を通らないで外側を通るガラスエポキシ基板３上の配線３３によって接続されている。また、上記ガラスエポキシ基板３の接続端子５，５側の部分は口金８内に挿入されている。また、上記ガラスエポキシ基板３の残りの部分はカバーガラス７で覆われている。 The light emitting diode element 4 is mounted on the first surface 31 of the glass epoxy substrate 3. On the other hand, the flat contact surface 21 of the heat sink 2 is in close contact with the second surface 32 opposite to the first surface 31 of the glass epoxy substrate 3. The glass epoxy substrate 3 is provided with wiring 33 for supplying current from the connection terminals 5 and 5 to the light emitting diode element 4. That is, the light emitting diode element 4 and the connection terminals 5 and 5 are connected by the wiring 33 on the glass epoxy substrate 3 that passes outside without passing through the inside of the aluminum heat sink 2. Further, the connection terminal 5, 5 side portion of the glass epoxy substrate 3 is inserted into the base 8. The remaining part of the glass epoxy substrate 3 is covered with a cover glass 7.
　上記発光ダイオード素子４は、ガラスエポキシ基板３の第１面３１に取り付けられている。また、上記発光ダイオード素子４は蛍光体９で気密封止されている。この蛍光体９は、発光ダイオード素子４から出射された光の波長を変換するものである。 The light emitting diode element 4 is attached to the first surface 31 of the glass epoxy substrate 3. The light emitting diode element 4 is hermetically sealed with a phosphor 9. This phosphor 9 converts the wavelength of the light emitted from the light emitting diode element 4.
　上記カバーガラス７は、発光ダイオード素子４とガラスエポキシ基板３の一部の第１面３１側とを覆っている。このカバーガラス７内の空間は密閉空間であり、外部の気体がカバーガラス７内に入らないようになっている。また、上記カバーガラス７は蛍光体９で波長が変換された光を透過する材料から成っている。 The cover glass 7 covers the light emitting diode element 4 and a part of the first surface 31 side of the glass epoxy substrate 3. The space in the cover glass 7 is a sealed space so that outside gas does not enter the cover glass 7. The cover glass 7 is made of a material that transmits the light whose wavelength is converted by the phosphor 9.
　上記接続端子５，５は、アルミヒートシンク２の後方に設けられて、放熱平面２２の延在方向に延びている。この接続端子５，５のそれぞれの先端部には貫通穴１３を設けている。これにより、上記接続端子５，５を差し込み口（図示せず）に挿入したとき、差し込み口に設けられた突起が貫通穴１３に嵌合して、接続端子５，５の挿入が充分になったことを感触で判るようになっている。 The connection terminals 5 and 5 are provided behind the aluminum heat sink 2 and extend in the extending direction of the heat radiation plane 22. A through hole 13 is provided at the tip of each of the connection terminals 5 and 5. As a result, when the connection terminals 5 and 5 are inserted into the insertion holes (not shown), the protrusions provided in the insertion holes are fitted into the through holes 13 so that the connection terminals 5 and 5 are sufficiently inserted. You can understand that by touch.
　上記口金８はカバーガラス７と接続端子５，５との間に設けられている。この口金８と接続端子５，５との間は耐熱性の封止樹脂１０で封止されている。 The base 8 is provided between the cover glass 7 and the connection terminals 5 and 5. A space between the base 8 and the connection terminals 5 and 5 is sealed with a heat-resistant sealing resin 10.
　図２は、図１の矢印方向から見た模式図である。 FIG. 2 is a schematic view seen from the direction of the arrow in FIG.
　上記取付板６は、封止樹脂１０によって接続端子５，５から絶縁されている。また、上記取付板６は、接続端子５，５の近傍において接続端子５，５の延在する方向に交差する方向に延びている。この取付板６の延在方向は放熱平面２２と略平行である。また、上記取付板６の先端部には、取付板６を貫通する取付穴１４が設けられており、ＬＥＤランプ１の位置を固定するめのビス（図示せず）を取付穴１４に挿通する。 The mounting plate 6 is insulated from the connection terminals 5 and 5 by the sealing resin 10. Further, the mounting plate 6 extends in a direction intersecting the extending direction of the connection terminals 5 and 5 in the vicinity of the connection terminals 5 and 5. The extending direction of the mounting plate 6 is substantially parallel to the heat radiation plane 22. Further, a mounting hole 14 penetrating the mounting plate 6 is provided at the tip of the mounting plate 6, and a screw (not shown) for fixing the position of the LED lamp 1 is inserted into the mounting hole 14.
　上記構成のＬＥＤランプ１によれば、上記発光ダイオード素子４から発生した熱は、ガラスエポキシ基板３の第１面３１に伝わって、ガラスエポキシ基板３の第２面３２からアルミヒートシンク２の密着平面２１に伝わる。このとき、上記アルミヒートシンク２の密着平面２１がガラスエポキシ基板３の第２面３２に密着する平坦な面であるので、ガラスエポキシ基板３の第２面３２とアルミヒートシンク２の密着平面２１との接触面積を大きくとることができる。したがって、上記発光ダイオード素子４の熱をガラスエポキシ基板３を介してアルミヒートシンク２に効率良く伝えることができる。 According to the LED lamp 1 having the above configuration, the heat generated from the light emitting diode element 4 is transmitted to the first surface 31 of the glass epoxy substrate 3, and the adhesion plane of the aluminum heat sink 2 from the second surface 32 of the glass epoxy substrate 3. It is transmitted to 21. At this time, since the contact flat surface 21 of the aluminum heat sink 2 is a flat surface that is in close contact with the second surface 32 of the glass epoxy substrate 3, the second surface 32 of the glass epoxy substrate 3 and the contact flat surface 21 of the aluminum heat sink 2 are The contact area can be increased. Therefore, the heat of the light emitting diode element 4 can be efficiently transferred to the aluminum heat sink 2 through the glass epoxy substrate 3.
　さらに、例えば映像機器にＬＥＤランプ１を使用する場合、図３に示すように、アルミヒートシンク２の放熱平面２２が平坦であるので、映像機器の金属板１５の表面５１にアルミヒートシンク２の放熱平面２２を容易に密着させることができ、しかも、アルミヒートシンク２が、単なる平板状で、ガラスエポキシ基板３の第２面３２側つまり裏面側にあって、発光ダイオード素子４の出射側にないから照明能力を妨げることなく、簡単、コンパクトな構造で、アルミヒートシンク２の放熱平面２２と金属板１５の表面５１との接触面積を大きくとることができる。したがって、上記アルミヒートシンク２は発光ダイオード素子４からの熱をアルミヒートシンク２に直接接触する金属板１５に熱伝導により効率良く放出することができる。この金属板１５は、映像機器の例えばケーシングやハウジングであって、放熱面積を極めて大きくすることができ、冷却効果を極めて大きくすることができる。したがって、上記ＬＥＤランプ１は高温雰囲気で使用でき、寿命が長い。 Further, for example, when the LED lamp 1 is used in a video equipment, the heat radiation plane 22 of the aluminum heat sink 2 is flat as shown in FIG. 22 can be easily adhered, and the aluminum heat sink 2 has a simple flat plate shape on the second surface 32 side, that is, the back surface side of the glass epoxy substrate 3, and is not on the light emission side of the light emitting diode element 4. The contact area between the heat radiation plane 22 of the aluminum heat sink 2 and the surface 51 of the metal plate 15 can be increased with a simple and compact structure without impeding the ability. Therefore, the aluminum heat sink 2 can efficiently release the heat from the light emitting diode element 4 to the metal plate 15 in direct contact with the aluminum heat sink 2 by heat conduction. The metal plate 15 is, for example, a casing or a housing of the video equipment, and can greatly increase the heat radiation area and can greatly increase the cooling effect. Therefore, the LED lamp 1 can be used in a high temperature atmosphere and has a long life.
　また、上記接続端子５，５がアルミヒートシンク２の放熱平面２２の延在方向に延びるので、金属板１５の表面５１とアルミヒートシンク２の放熱平面２２との間には接続端子５，５が介在しないようにできる。 Further, since the connection terminals 5 and 5 extend in the extending direction of the heat radiation plane 22 of the aluminum heat sink 2, the connection terminals 5 and 5 are interposed between the surface 51 of the metal plate 15 and the heat radiation plane 22 of the aluminum heat sink 2. You can avoid it.
　さらに、上記ＬＥＤランプ１が金属板１５から反力を受けても、接続端子５，５が金属板１５に密着しているアルミヒートシンク２の放熱平面２２の延在方向に延びるので、接続端子５，５が外れるのを防ぐことができる。 Furthermore, even if the LED lamp 1 receives a reaction force from the metal plate 15, the connection terminals 5, 5 extend in the extending direction of the heat radiation plane 22 of the aluminum heat sink 2 that is in close contact with the metal plate 15. , 5 can be prevented from coming off.
　このように、上記ＬＥＤランプ１は、簡単、安価、コンパクトな構造で、照明能力を下げることがなく、発光ダイオード素子４を映像機器の高温雰囲気でも充分に冷却でき、寿命を長くすることができる。 As described above, the LED lamp 1 has a simple, inexpensive, and compact structure, does not lower the illumination capability, can sufficiently cool the light emitting diode element 4 even in a high temperature atmosphere of the video equipment, and can extend the life. .
　なお、図３の矢印は熱が伝導する方向を示している。 Note that the arrows in FIG. 3 indicate the direction in which heat is conducted.
　また、上記アルミヒートシンク２は、縦および横の寸法をよりも、密着平面２１と放熱平面２２との間の寸法が小さいので、密着平面２１と放熱平面２２との間の放熱経路が短くなる。したがって、上記アルミヒートシンク２は発光ダイオード素子４からの熱を放熱平面２２に迅速に伝えて効果的に放熱できる。 Further, since the aluminum heat sink 2 has a smaller dimension between the contact plane 21 and the heat radiation plane 22 than the vertical and horizontal dimensions, the heat radiation path between the contact plane 21 and the heat radiation plane 22 is shortened. Therefore, the aluminum heat sink 2 can quickly dissipate heat by quickly transferring the heat from the light emitting diode element 4 to the heat radiation plane 22.
　また、上記発光ダイオード素子４と接続端子５，５とは、アルミヒートシンク２の内部を通らないで外側を通るガラスエポキシ基板３上の配線３３によって接続されているので、アルミヒートシンク２の放熱経路が少なくなるのを防ぐことができる。 Further, since the light emitting diode element 4 and the connection terminals 5 and 5 are connected by the wiring 33 on the glass epoxy substrate 3 that passes through the outside without passing through the inside of the aluminum heat sink 2, the heat dissipation path of the aluminum heat sink 2 is It can be prevented from becoming less.
　仮に、従来例のように、上記アルミヒートシンク２に挿通孔を設けて、その挿通孔に挿通した配線によって発光ダイオード素子４と接続端子５，５との間を電気接続したなら、アルミヒートシンク２の放熱経路が挿通孔の分だけ少なくなってしまうのである。 If the aluminum heat sink 2 is provided with an insertion hole and the light emitting diode element 4 and the connection terminals 5 and 5 are electrically connected by the wiring inserted into the insertion hole as in the conventional example, The heat radiation path is reduced by the amount of the insertion hole.
　また、上記金属板１５にアルミヒートシンク２の放熱平面２２を取り付ける場合、取付板６があるので、アルミヒートシンク２の放熱平面２２が金属板１５に密着する状態で、ＬＥＤランプ１を固定できる。 Further, when attaching the heat radiation plane 22 of the aluminum heat sink 2 to the metal plate 15, the LED lamp 1 can be fixed in a state where the heat radiation plane 22 of the aluminum heat sink 2 is in close contact with the metal plate 15.
　また、上記取付板６の取付穴１４に挿通した例えばビスを締め付けて、取付板６を取付先に取り付ける場合、取付板６は接続端子５，５の近傍において接続端子５，５の延在する方向に交差する方向に延びるので、上記ビスの締め付けで、接続端子５，５を接続先に押し付けることができる。したがって、上記接続端子５，５が接続先から抜け難くすることができる。 Further, when, for example, a screw inserted into the mounting hole 14 of the mounting plate 6 is tightened to attach the mounting plate 6 to the mounting destination, the mounting plate 6 extends in the vicinity of the connection terminals 5 and 5. Since it extends in a direction crossing the direction, the connection terminals 5 and 5 can be pressed against the connection destination by tightening the screws. Therefore, it is possible to make it difficult for the connection terminals 5 and 5 to be disconnected from the connection destination.
　また、上記取付板６の取付穴に挿通した例えばビスを締め付けて、取付板６を取付先に取り付けるとき、取付板６は接続端子５，５の近傍において接続端子５，５の延在する方向に交差する方向に延びているので、そのビスの締め付けで、接続端子５，５を接続先に固定すると、ＬＥＤランプ１は接続端子５，５による固定方向と取付板６による固定方向の二方向に固定される。したがって、上記ＬＥＤランプ１は脱落し難いという利点を有する。 Further, when, for example, a screw inserted through the mounting hole of the mounting plate 6 is tightened and the mounting plate 6 is mounted to the mounting destination, the mounting plate 6 extends in the vicinity of the connection terminals 5 and 5 in the direction in which the connection terminals 5 and 5 extend. When the connection terminals 5 and 5 are fixed to the connection destination by tightening the screws, the LED lamp 1 has two directions: a fixing direction by the connection terminals 5 and 5 and a fixing direction by the mounting plate 6. Fixed to. Therefore, the LED lamp 1 has an advantage that it is difficult to drop off.
　また、仮に、上記取付板６の取付先が金属であったとしても、取付板６は接続端子５，５から絶縁されているので、接続端子５，５の通電に悪影響が及ぶのを防ぐことができる。 Further, even if the mounting destination of the mounting plate 6 is a metal, the mounting plate 6 is insulated from the connection terminals 5 and 5, so that adverse effects on the energization of the connection terminals 5 and 5 can be prevented. Can do.
　また、上記カバーガラス７は蛍光体９で波長が変換された光を透過するので、その光をカバーガラス７から取り出すことができる。 Further, since the cover glass 7 transmits the light whose wavelength is converted by the phosphor 9, the light can be taken out from the cover glass 7.
　また、上記アルミヒートシンク２の放熱平面２２および４つの側面は、カバーガラス７で覆われていなくて露出しているので、アルミヒートシンク２の放熱性能が低下するのを防ぐことができる。 Further, since the heat radiation plane 22 and the four side surfaces of the aluminum heat sink 2 are not covered with the cover glass 7 and are exposed, it is possible to prevent the heat radiation performance of the aluminum heat sink 2 from being deteriorated.
　また、上記カバーガラス７と接続端子５，５との間に口金８を設けているので、機械的な強度を上げることができる。 Also, since the base 8 is provided between the cover glass 7 and the connection terminals 5 and 5, the mechanical strength can be increased.
　上記第１実施形態において、金属板１５は、加熱調理器、洗濯乾燥機、溶接装置、熱処理装置および炉などの高温雰囲気を生じる装置のハウジングやケースなどの金属板であってもよい。 In the first embodiment, the metal plate 15 may be a metal plate such as a housing or a case of a device that generates a high-temperature atmosphere such as a heating cooker, a washing / drying machine, a welding device, a heat treatment device, and a furnace.
　上記第１実施形態のアルミヒートシンク２に換えて、アルミ以外の金属（例えば銅）からなるヒートシンクを用いてもよいし、あるいは、金属以外であっても、放熱性の良い材料であれば、その材料からなるヒートシンクを用いてもよい。また、上記材料は耐熱性があるものが好ましい。 In place of the aluminum heat sink 2 of the first embodiment, a heat sink made of a metal other than aluminum (for example, copper) may be used. A heat sink made of a material may be used. Moreover, the said material has a heat resistant thing.
　上記第１実施形態において、接続端子５，５がアルミヒートシンク２の放熱平面２２の延在方向延びるようにしていたが、接続端子５，５がアルミヒートシンク２の放熱平面２２の延在方向に対して斜め方向に延びるようにしてもよい。 In the first embodiment, the connection terminals 5 and 5 extend in the extending direction of the heat radiation plane 22 of the aluminum heat sink 2. However, the connection terminals 5 and 5 extend in the extending direction of the heat dissipation plane 22 of the aluminum heat sink 2. May extend in an oblique direction.
　上記第１実施形態において、密着平面２１は放熱平面２２と略平行になっていたが、密着平面２１を放熱平面２２に対して傾斜する傾斜面としてもよい。 In the first embodiment, the contact plane 21 is substantially parallel to the heat dissipation plane 22, but the contact plane 21 may be an inclined surface that is inclined with respect to the heat dissipation plane 22.
　上記第１実施形態において、アルミヒートシンク２の密着平面２１にガラスエポキシ基板３を直接接触させてもよし、あるいは、アルミヒートシンク２の密着平面２１にガラスエポキシ基板３を間接に接触させてもよい。例えば、上記アルミヒートシンク２の密着平面２１に薄い接着膜を介してガラスエポキシ基板３を取り付けてもよい。 In the first embodiment, the glass epoxy substrate 3 may be in direct contact with the adhesion plane 21 of the aluminum heat sink 2 or the glass epoxy substrate 3 may be in indirect contact with the adhesion plane 21 of the aluminum heat sink 2. For example, the glass epoxy substrate 3 may be attached to the adhesion flat surface 21 of the aluminum heat sink 2 via a thin adhesive film.
　上記第１実施形態において、取付板６の後端部をアルミヒートシンク２およびガラスエポキシ基板３の両方に熱的に接続させてもよいし、あるいは、アルミヒートシンク２のみに熱的に接続してもよいし、あるいは、ガラスエポキシ基板３のみに熱的に接続してもよい。 In the first embodiment, the rear end portion of the mounting plate 6 may be thermally connected to both the aluminum heat sink 2 and the glass epoxy substrate 3 or may be thermally connected only to the aluminum heat sink 2. Alternatively, it may be thermally connected only to the glass epoxy substrate 3.
　上記第１実施形態のガラスエポキシ基板３に換えて、例えば、半導体基板、セラミック基板、金属基板等を用いてもよい。 For example, a semiconductor substrate, a ceramic substrate, a metal substrate, or the like may be used instead of the glass epoxy substrate 3 of the first embodiment.
　〔第２実施形態〕
　図４は、本発明の第２実施形態の加熱調理器の正面を斜め上方からみた図である。なお、上記加熱調理器は上記第１実施形態のＬＥＤランプ１を備えているので、上記第１実施形態の構成部と同一構成部は上記第１実施形態の構成部と同一参照番号を付して説明を行う。また、以下の説明において、「左」は加熱調理器を正面（扉１０２）側から見たときの左を指し、「右」は加熱調理器を正面（扉１０２）側から見たときの右を指す。 [Second Embodiment]
FIG. 4: is the figure which looked at the front of the heating cooker of 2nd Embodiment of this invention from diagonally upward. In addition, since the said heating cooker is provided with the LED lamp 1 of the said 1st Embodiment, the component same as the component of the said 1st Embodiment attaches | subjects the same reference number as the component of the said 1st Embodiment. To explain. In the following description, “left” indicates the left when the cooking device is viewed from the front (door 102) side, and “right” indicates the right when the cooking device is viewed from the front (door 102) side. Point to.
　上記加熱調理器は、直方体形状のケーシング１０１の正面に、下端側の辺を略中心に回動する扉１０２が取り付けられている。この扉１０２の上部にハンドル１０３を取り付けると共に、扉１０２の略中央に耐熱ガラス１０４を取り付けている。また、扉１０２の右側には操作パネル１０５を設けている。この操作パネル１０５は、液晶表示部１０６と、ユーザが操作する操作ボタン群１０７とを有している。また、ケーシング１０１の上側かつ右側後方には、排気口１０８ａを有する排気口カバー１０８を設けている。さらに、ケーシング１０１の前面の下部（扉１０２の下方の部分）には、露受容器１０９を着脱自在に取り付けている。 In the cooking device, a door 102 is attached to the front surface of the rectangular parallelepiped casing 101 so as to rotate about the lower end side. A handle 103 is attached to the upper part of the door 102, and a heat resistant glass 104 is attached to the approximate center of the door 102. An operation panel 105 is provided on the right side of the door 102. The operation panel 105 includes a liquid crystal display unit 106 and an operation button group 107 operated by a user. An exhaust port cover 108 having an exhaust port 108a is provided on the upper side of the casing 101 and on the right rear side. Further, a dew receiving device 109 is detachably attached to a lower portion of the front surface of the casing 101 (a portion below the door 102).
　図５は、上記加熱調理器の正面から見た縦断面の模式図である。また、図６は、上記加熱調理器の右側方から見た縦断面の模式図である。 FIG. 5 is a schematic diagram of a longitudinal section viewed from the front of the heating cooker. FIG. 6 is a schematic diagram of a longitudinal section viewed from the right side of the cooking device.
　上記ケーシング１０１内には、図５に示すように、被加熱物１２３をトレイ１９０と共に収容可能な加熱室１１０を設けている。この加熱室１１０の右側方には、図６に示すように、前面側から着脱自在に挿入された給水タンク１１１を配置している。また、図５，図６に示すように、給水タンク１１１の後面側には、給水タンク１１１に接続された蒸気発生装置１１２を配置している。この蒸気発生装置１１２には蒸気供給通路１１３の一端を接続し、循環ユニット１１４には蒸気供給通路１１３の他端を接続している。 In the casing 101, as shown in FIG. 5, there is provided a heating chamber 110 in which the object to be heated 123 can be accommodated together with the tray 190. As shown in FIG. 6, a water supply tank 111 that is detachably inserted from the front side is disposed on the right side of the heating chamber 110. As shown in FIGS. 5 and 6, a steam generator 112 connected to the water supply tank 111 is disposed on the rear surface side of the water supply tank 111. One end of a steam supply passage 113 is connected to the steam generator 112, and the other end of the steam supply passage 113 is connected to the circulation unit 114.
　上記蒸気発生装置１１２は、ヒータ(図示せず)を有しており、給水タンク１１１から供給された水を上記ヒータで加熱して、飽和水蒸気を生成する。この蒸気発生装置１１２で生成された飽和水蒸気は、蒸気供給通路１１３を介して蒸気供給口１１３ａから循環ユニット１１４内の吸込口１２８の下流側に供給される。 The steam generator 112 has a heater (not shown), and the water supplied from the water supply tank 111 is heated by the heater to generate saturated steam. The saturated steam generated by the steam generator 112 is supplied from the steam supply port 113 a to the downstream side of the suction port 128 in the circulation unit 114 through the steam supply passage 113.
　上記蒸気供給通路１１３の蒸気供給口１１３ａは、循環ユニット１１４内の吸込口１２８の近傍に配置されている。また、循環ユニット１１４内には、吸込口１２８に対向するように循環ファン１１８が配置されている。この循環ファン１１８は、循環ファン用モータ１１９によって駆動される。 The steam supply port 113 a of the steam supply passage 113 is disposed in the vicinity of the suction port 128 in the circulation unit 114. Further, a circulation fan 118 is disposed in the circulation unit 114 so as to face the suction port 128. The circulation fan 118 is driven by a circulation fan motor 119.
　上記加熱室１１０の上面および左側面に、Ｌ字状に屈曲した蒸気ダクト１８０を取り付けている。この蒸気ダクト１８０は、加熱室１１０の上壁に固定された第１ダクト部１８１と、第１ダクト部１８１の左側方から下側に屈曲する屈曲部１８２と、加熱室１１０の左側壁に固定され、屈曲部１８２を介して第１ダクト部１８１に連なる第２ダクト部１８３とを有している。 A steam duct 180 bent in an L shape is attached to the upper and left sides of the heating chamber 110. The steam duct 180 is fixed to the first duct portion 181 fixed to the upper wall of the heating chamber 110, the bent portion 182 bent from the left side to the lower side of the first duct portion 181, and the left wall of the heating chamber 110. And a second duct portion 183 connected to the first duct portion 181 through the bent portion 182.
　上記蒸気ダクト１８０の第１ダクト部１８１内に、シーズヒータなどからなる加熱ヒータ１２１を収納している。この第１ダクト部１８１および加熱ヒータ１２１が過熱蒸気生成装置を構成している。なお、過熱蒸気生成装置は蒸気ダクトとは別に設けてもよい。 A heater 121 made of a sheathed heater or the like is housed in the first duct portion 181 of the steam duct 180. The first duct portion 181 and the heater 121 constitute a superheated steam generator. The superheated steam generator may be provided separately from the steam duct.
　また、上記第１ダクト部１８１の右側の端部には、循環ユニット１１４の上部に設けられた蒸気供給口１１４ａが接続されており、第１ダクト部１８１内は循環ユニット１１４内に連通している。そして、加熱室１１０の天面には複数の第１蒸気吹出口１２４が設けられており、蒸気ダクト１８０の第１ダクト部１８１内の空間は第１蒸気吹出口１２４を介して加熱室１１０内に連通している。一方、蒸気ダクト１８０の第２ダクト部１８３は、加熱室１１０の左側面に設けられた複数の第２蒸気吹出口１２５を介して加熱室１１０内に連通している。 In addition, a steam supply port 114 a provided on the upper portion of the circulation unit 114 is connected to the right end of the first duct portion 181, and the inside of the first duct portion 181 communicates with the circulation unit 114. Yes. A plurality of first steam outlets 124 are provided on the top surface of the heating chamber 110, and the space in the first duct portion 181 of the steam duct 180 is inside the heating chamber 110 via the first steam outlet 124. Communicating with On the other hand, the second duct portion 183 of the steam duct 180 communicates with the inside of the heating chamber 110 via a plurality of second steam outlets 125 provided on the left side surface of the heating chamber 110.
　上記加熱室１１０と蒸気ダクト１８０との隙間は、耐熱樹脂などによりシールされている。また、加熱室１１０および蒸気ダクト１８０は、加熱室１１０の前面開口を除いて断熱材により覆われている。 The gap between the heating chamber 110 and the steam duct 180 is sealed with a heat resistant resin or the like. The heating chamber 110 and the steam duct 180 are covered with a heat insulating material except for the front opening of the heating chamber 110.
　上記循環ユニット１１４と蒸気ダクト１８０と加熱室１１０とそれらを接続する接続部材とによって、熱媒体の循環経路が形成されている。そして、この循環経路における循環ユニット１１４の加熱室１１０との境界部に、蒸気発生装置１１２で生成された飽和水蒸気が供給される。 The circulation path of the heat medium is formed by the circulation unit 114, the steam duct 180, the heating chamber 110, and the connection member connecting them. Then, saturated steam generated by the steam generator 112 is supplied to the boundary portion of the circulation unit 114 with the heating chamber 110 in this circulation path.
　ここで、熱媒体は、加熱された空気であってもよいし、水蒸気を含む加熱された空気であってもよく、１００℃以上に加熱された過熱水蒸気を含む空気であってもよく、さらに、１００℃以上に加熱された過熱水蒸気を主とするものであってもよい。 Here, the heating medium may be heated air, may be heated air containing water vapor, may be air containing superheated steam heated to 100 ° C. or higher, and The main component may be superheated steam heated to 100 ° C. or higher.
　また、上記加熱室１１０の下側の空間にはマグネトロン１２０を配置している。このマグネトロン１２０で発生したマイクロ波は、導波管(図示せず)によって加熱室１１０の下部中央に導かれ、回転アンテナ(図示せず)によって攪拌されながら加熱室１１０内の上方に向かって放射されて被加熱物１２３を加熱する。この場合、被加熱物１２３は加熱室１１０内の底部に載置される。 Also, a magnetron 120 is disposed in the space below the heating chamber 110. The microwave generated in the magnetron 120 is guided to the lower center of the heating chamber 110 by a waveguide (not shown), and radiates upward in the heating chamber 110 while being stirred by a rotating antenna (not shown). Thus, the article to be heated 123 is heated. In this case, the article to be heated 123 is placed on the bottom of the heating chamber 110.
　また、上記加熱室１１０の右側壁の中央部には吸込口１２８を設けを設けている。そして、加熱室１１０の右側壁には、吸込口１２８の前面側に位置する給気口１３３(図９に示す)を設けると共に、吸込口１２８の後面側に位置する第１排気口１３６を設けている。給気口１３３は扉１０２近傍に位置し、給気口１３３から加熱室１１０内に吹き出される外気が扉１０２に沿って流れる。また、加熱室１１０の後面側壁面の右下側に、第１排気口１３６よりも開口面積が小さい第２排気口１３７を設けている。 In addition, a suction port 128 is provided in the center of the right side wall of the heating chamber 110. The right side wall of the heating chamber 110 is provided with an air supply port 133 (shown in FIG. 9) located on the front side of the suction port 128 and a first exhaust port 136 located on the rear side of the suction port 128. ing. The air supply port 133 is located in the vicinity of the door 102, and the outside air blown into the heating chamber 110 from the air supply port 133 flows along the door 102. A second exhaust port 137 having an opening area smaller than that of the first exhaust port 136 is provided on the lower right side of the rear side wall surface of the heating chamber 110.
　上記加熱室１１０の右側面に配置された循環ユニット１１４に、循環ファン１１８を駆動する循環ファン用モータ１１９を取り付けている。この循環ファン１１８によって加熱室１１０内の蒸気や空気は、吸込口１２８から吸い込まれて蒸気ダクト１８０を介して第１，第２蒸気吹出口１２４，１２５から加熱室１１０内に吹き出す。また、循環ユニット１１４の吸込口１２８近傍には、加熱室１１０内の熱媒体(蒸気を含む空気)の温度を検出する室内温度センサ１２９を配置している。 A circulation fan motor 119 for driving the circulation fan 118 is attached to the circulation unit 114 disposed on the right side surface of the heating chamber 110. Steam and air in the heating chamber 110 are sucked from the suction port 128 by the circulation fan 118 and blown into the heating chamber 110 from the first and second steam outlets 124 and 125 through the steam duct 180. Further, an indoor temperature sensor 129 for detecting the temperature of the heat medium (air containing steam) in the heating chamber 110 is disposed in the vicinity of the suction port 128 of the circulation unit 114.
　上記加熱室１１０内の被加熱物１２３は、蒸気ダクト１８０の第１ダクト部１８１内に配置された加熱ヒータ１２１の輻射熱によって加熱される。また、加熱ヒータ１２１によって蒸気ダクト１８０を通過する熱媒体(蒸気を含む空気)が加熱され、加熱された熱媒体が第１，第２蒸気吹出口１２４，１２５から吹き出される。これにより、加熱室１１０内の熱媒体が所定温度に維持される。また、加熱室１１０に供給すべき蒸気を加熱ヒータ１２１によりさらに昇温して１００℃以上の過熱蒸気を生成することができる。 The object 123 to be heated in the heating chamber 110 is heated by the radiant heat of the heater 121 disposed in the first duct portion 181 of the steam duct 180. Moreover, the heating medium (air containing steam) passing through the steam duct 180 is heated by the heater 121, and the heated heating medium is blown out from the first and second steam outlets 124 and 125. Thereby, the heat medium in the heating chamber 110 is maintained at a predetermined temperature. Further, the steam to be supplied to the heating chamber 110 can be further heated by the heater 121 to generate superheated steam at 100 ° C. or higher.
　上記ケーシング１０１内の下側には、冷却ファン部１２２、電装部品１１７およびマグネトロン１２０を配置している。また、ケーシング１０１内の加熱室１１０の右側方に送風ダクト１３１を配置している。この送風ダクト１３１は、希釈ファン１３０と、この希釈ファン１３０を駆動する希釈ファン用モータ１３８とを内部に収納している。冷却ファン部１２２は、冷却ファン１１５と、その冷却ファン１１５を駆動する冷却ファン用モータ１１６とを有する。 The cooling fan part 122, the electrical component 117, and the magnetron 120 are disposed below the casing 101. In addition, an air duct 131 is disposed on the right side of the heating chamber 110 in the casing 101. The blower duct 131 houses therein a dilution fan 130 and a dilution fan motor 138 that drives the dilution fan 130. The cooling fan unit 122 includes a cooling fan 115 and a cooling fan motor 116 that drives the cooling fan 115.
　上記電装部品１１７は、加熱調理器の各部を駆動する駆動回路やこの駆動回路を制御する制御回路等を有している。また、冷却ファン１１５は、ケーシング１０１内に外気を取り込み、発熱する電装部品１１７やマグネトロン１２０を冷却する。また、冷却ファン１１５によってケーシング１０１内に流入した外気の一部は、希釈ファン１３０により送風ダクト１３１内に導かれると共に、残りの外気は、ケーシング１０１の背面等に形成された開口(図示せず)から外部に排出される。 The electrical component 117 has a drive circuit that drives each part of the cooking device, a control circuit that controls the drive circuit, and the like. In addition, the cooling fan 115 takes outside air into the casing 101 and cools the electrical component 117 and the magnetron 120 that generate heat. A part of the outside air that has flowed into the casing 101 by the cooling fan 115 is guided into the air duct 131 by the dilution fan 130, and the remaining outside air is an opening (not shown) formed on the back surface of the casing 101 and the like. ) To the outside.
　図６に示すように、加熱室１１０の右側壁に第１排気口１３６から排気ダンパ(図示せず)を介して接続された第１排気ダクト１３４を配置している。この第１排気ダクト１３４は、横方向に延びる横通路１３４ａと、その横通路１３４ａから上方に屈曲する縦通路１３４ｂとを有している。縦通路１３４ｂの上端に排気口カバー１０８を着脱可能に取り付けている。 As shown in FIG. 6, a first exhaust duct 134 connected to the right side wall of the heating chamber 110 from a first exhaust port 136 via an exhaust damper (not shown) is disposed. The first exhaust duct 134 has a lateral passage 134a extending in the lateral direction and a longitudinal passage 134b bent upward from the lateral passage 134a. An exhaust port cover 108 is detachably attached to the upper end of the vertical passage 134b.
　上記第１排気ダクト１３４の横通路１３４ａの背面側に、吸込ダクト１２７を介して外気を吸い込む吸込口(図示せず)を設けている。この吸込口または第１排気口１３６のいずれか一方を択一的に選択して第１排気ダクト１３４に接続するように排気ダンパを制御する。上記排気ダンパは、排気ダンパ用モータ１６０(図７に示す)より駆動される。 A suction port (not shown) for sucking outside air through a suction duct 127 is provided on the back side of the lateral passage 134a of the first exhaust duct 134. The exhaust damper is controlled so that either one of the suction port or the first exhaust port 136 is alternatively selected and connected to the first exhaust duct 134. The exhaust damper is driven by an exhaust damper motor 160 (shown in FIG. 7).
　上記第１排気ダクト１３４の縦通路１３４ｂは、上側に向かって流路面積が拡大されて排気口カバー１０８に連結される。排気口カバー１０８の上部には、前方に向かって開口した排気口１０８ａが形成されている。 The vertical passage 134b of the first exhaust duct 134 is connected to the exhaust port cover 108 with the flow passage area enlarged toward the upper side. An exhaust port 108 a that opens forward is formed in the upper portion of the exhaust port cover 108.
　一方、上記第２排気口１３７に第２排気ダクト１３５の下端を接続し、その第２排気ダクト１３５の上端を第１排気ダクト１３４の縦通路１３４ｂの下側に接続している。 On the other hand, the lower end of the second exhaust duct 135 is connected to the second exhaust port 137, and the upper end of the second exhaust duct 135 is connected to the lower side of the vertical passage 134b of the first exhaust duct 134.
　上記第２排気ダクト１３５は、第１排気ダクト１３４よりも流通面積が小さい。この第２排気口１３７からの排気は、第２排気ダクト１３５を介して第１排気ダクト１３４に流入し、排気口カバー１０８の排気口１０８ａから外部に排出される。 The distribution area of the second exhaust duct 135 is smaller than that of the first exhaust duct 134. The exhaust from the second exhaust port 137 flows into the first exhaust duct 134 via the second exhaust duct 135 and is discharged to the outside from the exhaust port 108 a of the exhaust port cover 108.
　また、上記加熱室１１０の側方の送風ダクト１３１は、希釈ファン収納部１３１ａと、希釈ファン１３０から上方に延びた縦通路１３１ｂと、縦通路１３１ｂから後面側に屈曲する横通路１３１ｃと、横通路１３１ｃから上方に屈曲するノズル部１３１ｄを有している。横通路１３１ｃとノズル部１３１ｄとが第１排気ダクト１３４内に挿入されている。 The air duct 131 on the side of the heating chamber 110 includes a dilution fan housing part 131a, a vertical passage 131b extending upward from the dilution fan 130, a horizontal passage 131c bent from the vertical passage 131b to the rear side, and a horizontal passage 131b. The nozzle portion 131d is bent upward from the passage 131c. The lateral passage 131c and the nozzle portion 131d are inserted into the first exhaust duct 134.
　上記送風ダクト１３１のノズル部１３１ｄの上端に開口部１３１ｅを設けている。これにより、第１排気ダクト１３４内にエジェクタが形成され、希釈ファン１３０によって第１排気口１３６から排気口１０８ａに向かう気流を発生させる。 An opening 131e is provided at the upper end of the nozzle portion 131d of the air duct 131. As a result, an ejector is formed in the first exhaust duct 134, and the dilution fan 130 generates an air flow from the first exhaust port 136 toward the exhaust port 108a.
　また、上記送風ダクト１３１の横通路１３１ｃに、縦通路１３１ｂとの接続部の下端よりも下方に凹設される凹部が形成され、その凹部の一端に第１排気ダクト１３４内に開口するサブノズル部１３１ｆが形成される。 In addition, a recess is formed in the horizontal passage 131c of the blower duct 131 so as to be recessed below the lower end of the connection portion with the vertical passage 131b, and a sub nozzle portion that opens into the first exhaust duct 134 at one end of the recess. 131f is formed.
　さらに、上記送風ダクト１３１の縦通路１３１ｂの上部に給気通路１３２の一端を接続し、その給気通路１３２の他端を給気ダンパ１４０に接続している。給気通路１３２および給気ダンパ１４０は、希釈ファン１３０により給気口１３３を介して加熱室１１０に給気するための給気機構の一部である。この加熱室１１０の給気口１３３近傍かつ下側には、解凍センサ１５０を配置している。 Furthermore, one end of the air supply passage 132 is connected to the upper part of the vertical passage 131b of the air duct 131, and the other end of the air supply passage 132 is connected to the air supply damper 140. The air supply passage 132 and the air supply damper 140 are part of an air supply mechanism for supplying air to the heating chamber 110 via the air supply port 133 by the dilution fan 130. A thawing sensor 150 is disposed near and below the air inlet 133 of the heating chamber 110.
　上記給気ダンパ１４０は、給気口１３３を開閉するための耐熱樹脂製のダンパ本体１４１と、そのダンパ本体１４１を覆う耐熱樹脂製のハウジング１４２とを有している。 The air supply damper 140 has a heat-resistant resin damper body 141 for opening and closing the air supply port 133 and a heat-resistant resin housing 142 covering the damper body 141.
　図７は上記加熱調理器の制御ブロック図である。 FIG. 7 is a control block diagram of the heating cooker.
　上記加熱調理器は、マイクロコンピュータと入出力回路などからなる制御部２００を電装部品１７(図５，図６に示す)内に備えている。制御部２００は、加熱ヒータ１２１，循環ファン用モータ１１９，冷却ファン用モータ１１６，希釈ファン用モータ１３８，給気ダンパ用モータ１４４，排気ダンパ用モータ１６０，操作パネル１０５，室内温度センサ１２９，解凍センサ１５０，給水ポンプ１７０，蒸気発生装置１１２およびマグネトロン１２０が接続されている。操作パネル１０５からの信号および室内温度センサ１２９，解凍センサ１５０からの検出信号に基づいて、制御部２００は、加熱ヒータ１２１，循環ファン用モータ１１９，冷却ファン用モータ１１６，希釈ファン用モータ１３８，給気ダンパ用モータ１４４，排気ダンパ用モータ１６０，操作パネル１０５，給水ポンプ１７０，蒸気発生装置１１２およびマグネトロン１２０などを制御する。 The heating cooker includes a control unit 200 including a microcomputer and an input / output circuit in the electrical component 17 (shown in FIGS. 5 and 6). The control unit 200 includes a heater 121, a circulation fan motor 119, a cooling fan motor 116, a dilution fan motor 138, an air supply damper motor 144, an exhaust damper motor 160, an operation panel 105, an indoor temperature sensor 129, and thawing. The sensor 150, the feed water pump 170, the steam generator 112, and the magnetron 120 are connected. Based on the signal from the operation panel 105 and the detection signals from the indoor temperature sensor 129 and the thawing sensor 150, the control unit 200 includes a heater 121, a circulation fan motor 119, a cooling fan motor 116, a dilution fan motor 138, It controls the air damper motor 144, the exhaust damper motor 160, the operation panel 105, the water supply pump 170, the steam generator 112, the magnetron 120, and the like.
　図８は、上記扉１０２とケーシング１０１を取り外した状態の加熱調理器の後面を斜め上方から見た斜視図である。また、図９は、上記扉１０２とケーシング１０１を取り外した状態の加熱調理器の正面を斜め上方から見た斜視図である。 FIG. 8 is a perspective view of the rear surface of the cooking device in a state where the door 102 and the casing 101 are removed as viewed obliquely from above. Moreover, FIG. 9 is the perspective view which looked at the front of the heating cooker in the state which removed the said door 102 and the casing 101 from diagonally upward.
　上記加熱室１１０の前側には前面パネル１２６を設けている。この前面パネル１２６は、給水タンク１１１(図６に示す)を挿入するための挿入口１２６ａを右側部に有している。また、加熱室１１０の右側壁の内面には、上段トレイ受部１５１ａ，１５１ｂと、中段トレイ受部１５２ａ，１５２ｂ，１５２ｃと、下段トレイ受部１５３とを設けている。中段トレイ受部１５２ａ，１５２ｂ間には解凍センサ１５０のセンサ部１５０ａを配置している。 A front panel 126 is provided on the front side of the heating chamber 110. The front panel 126 has an insertion port 126a for inserting a water supply tank 111 (shown in FIG. 6) on the right side. Further, upper tray receiving portions 151 a and 151 b, middle tray receiving portions 152 a, 152 b and 152 c and a lower tray receiving portion 153 are provided on the inner surface of the right side wall of the heating chamber 110. A sensor unit 150a of the thawing sensor 150 is disposed between the middle tray receiving units 152a and 152b.
　図１０は、上記前面パネル１２６の上部およびその近傍の部分を斜め上方から見た模式図である。 FIG. 10 is a schematic view of the upper portion of the front panel 126 and a portion in the vicinity thereof as viewed obliquely from above.
　上記蒸気ダクト１８０の第１ダクト部１８１と前面パネル１２６の上部との間には、鋼板で形成された枠体１６を配置している。この枠体１６の右側部には被取付部１７を設けており、この被取付部１７にＬＥＤランプ１の取付板６をビス１９で固定している。また、枠体１６の下部に設けられたフランジ部１８，１８は、加熱室１１０の上壁にビス(図示せず)で固定されている。 Between the first duct part 181 of the steam duct 180 and the upper part of the front panel 126, a frame body 16 formed of a steel plate is disposed. A mounted portion 17 is provided on the right side of the frame body 16, and the mounting plate 6 of the LED lamp 1 is fixed to the mounted portion 17 with screws 19. Further, the flange portions 18 and 18 provided at the lower portion of the frame body 16 are fixed to the upper wall of the heating chamber 110 with screws (not shown).
　図１１は、図１０のＸＩ－ＸＩ線から見た模式図である。 FIG. 11 is a schematic view taken along line XI-XI in FIG.
　上記ＬＥＤランプ１のアルミヒートシンク２の放熱平面２２は枠体１６の上部に密着している。また、加熱室１１０の上壁には、ＬＥＤランプ１に対向する複数のパンチング穴２０，２０，…を設けている。ＬＥＤランプ１から出射された光が複数のパンチング穴２０，２０，…を通って加熱室１１０内に入るようになっている。また、加熱室１１０内の蒸気などがパンチング穴２０，２０，…から加熱室１１０外に漏れないように、パンチング穴２０，２０，…上にガラス板２４を配置している。 The heat radiation plane 22 of the aluminum heat sink 2 of the LED lamp 1 is in close contact with the upper portion of the frame body 16. Further, a plurality of punching holes 20, 20,... Facing the LED lamp 1 are provided on the upper wall of the heating chamber 110. The light emitted from the LED lamp 1 enters the heating chamber 110 through a plurality of punching holes 20, 20,. Moreover, the glass plate 24 is arrange | positioned on the punching holes 20, 20, ... so that the vapor | steam etc. in the heating chamber 110 may not leak out of the heating chamber 110 from the punching holes 20,20, ....
　上記構成の加熱調理器が過熱水蒸気で被加熱物１２３を加熱する場合、加熱ヒータ１２１で生成した１００℃以上の過熱蒸気を複数の第１蒸気吹出口１２４，第２蒸気吹出口１２５から加熱室１１０内に供給する。このため、加熱ヒータ１２１を収納する第１ダクト部１８１の周辺温度は８０℃～１００℃にもなる。このような高温環境にＬＥＤランプ１を配置しているが、発光ダイオード素子４の熱をアルミヒートシンク２を介して枠体１６に非常に高い効率で放出できるので、発光ダイオード素子４の温度上昇を抑制することができる。したがって、発光ダイオード素子４の寿命を延ばすことができるので、ＬＥＤランプ１を頻繁に取り換えなくて済む。その結果、上記加熱調理器のランニングコストを低減することができる。 When the heating cooker having the above configuration heats the article to be heated 123 with superheated steam, superheated steam at 100 ° C. or higher generated by the heater 121 is heated from the plurality of first steam outlets 124 and second steam outlets 125. 110 is supplied. Therefore, the ambient temperature of the first duct portion 181 that houses the heater 121 is 80 ° C. to 100 ° C. Although the LED lamp 1 is arranged in such a high temperature environment, the heat of the light emitting diode element 4 can be released to the frame body 16 through the aluminum heat sink 2 with very high efficiency. Can be suppressed. Therefore, since the lifetime of the light emitting diode element 4 can be extended, it is not necessary to frequently replace the LED lamp 1. As a result, the running cost of the cooking device can be reduced.
　上記第２実施形態の鋼製の枠体１６に換えて、例えば、Ｃｕ、Ｍｏ、ＷまたはＡｌから成る枠体を用いてもよい。 For example, a frame made of Cu, Mo, W, or Al may be used instead of the steel frame 16 of the second embodiment.
　本発明の加熱調理器としては、例えば、過熱水蒸気を使用するオーブンレンジのみならず、過熱水蒸気を使用するオーブン、過熱水蒸気を使用しないオーブンレンジ、過熱水蒸気を使用しないオーブンなどがある。 Examples of the cooking device of the present invention include not only an oven range using superheated steam but also an oven using superheated steam, an oven range not using superheated steam, and an oven not using superheated steam.
　本発明の加熱調理器では、オーブンレンジなどにおいて、過熱水蒸気または飽和水蒸気を用いることによって、ヘルシーな調理を行うことができる。例えば、本発明の加熱調理器では、温度が１００℃以上の過熱水蒸気または飽和水蒸気を食品表面に供給し、食品表面に付着した過熱水蒸気または飽和水蒸気が凝縮して大量の凝縮潜熱を食品に与えるので、食品に熱を効率よく伝えることができる。また、凝縮水が食品表面に付着して塩分や油分が凝縮水と共に滴下することにより、食品中の塩分や油分を低減できる。さらに、加熱室内は過熱水蒸気または飽和水蒸気が充満して低酸素状態となることにより、食品の酸化を抑制した調理が可能となる。ここで、低酸素状態とは、加熱室内において酸素の体積％が１０％以下(例えば０．５～３％)である状態を指す。 In the cooking device of the present invention, healthy cooking can be performed by using superheated steam or saturated steam in a microwave oven or the like. For example, in the cooking device of the present invention, superheated steam or saturated steam having a temperature of 100 ° C. or higher is supplied to the food surface, and the superheated steam or saturated steam adhered to the food surface is condensed to give a large amount of condensation latent heat to the food. So it can efficiently transfer heat to food. Moreover, when condensed water adheres to the food surface and salt and oil are dropped together with condensed water, salt and oil in the food can be reduced. Further, the heating chamber is filled with superheated steam or saturated steam to be in a low oxygen state, thereby enabling cooking while suppressing food oxidation. Here, the low oxygen state refers to a state in which the volume% of oxygen is 10% or less (for example, 0.5 to 3%) in the heating chamber.
　本発明の具体的な実施形態について説明したが、本発明は上記第１，第２実施形態に限定されるものではなく、本発明の範囲内で種々変更して実施することができる。 Although specific embodiments of the present invention have been described, the present invention is not limited to the first and second embodiments, and can be implemented with various modifications within the scope of the present invention.
　〔第３実施形態〕
　図１３は、本発明の第３実施形態の加熱調理器が備えるＬＥＤランプ２００１を側方から見た模式図である。 [Third Embodiment]
FIG. 13: is the schematic diagram which looked at the LED lamp 2001 with which the heating cooker of 3rd Embodiment of this invention is provided from the side.
　上記ＬＥＤランプ２００１は、基板の一例としてのガラスエポキシ基板２００２と、発光ダイオード素子２００３と、２本（図１３では１本のみ見えている）の略矩形板状の接続端子２００４，２００４と、透明または半透明な部材の一例としてのカバーガラス２００５と、金属製の口金２００６とを備えている。 The LED lamp 2001 includes a glass epoxy substrate 2002 as an example of a substrate, a light emitting diode element 2003, two (only one is visible in FIG. 13) connection terminals 2004 and 2004, and a transparent terminal. Alternatively, a cover glass 2005 as an example of a translucent member and a metal base 2006 are provided.
　上記ガラスエポキシ基板２００２は、後述する加熱室２１１０側に向けられる第１面２０２１と、加熱室２１１０とは反対側に向けられる平坦な第２面２０２２とを有して、縦の寸法が横の寸法よりも長くなっている。また、ガラスエポキシ基板２００２の厚さ（第１面２０２１と第２面２０２２との間の寸法）は略一定であり、ガラスエポキシ基板２００２の縦および横の寸法より小さくなっている。このガラスエポキシ基板２００２には、接続端子２００４，２００４からの電流を発光ダイオード素子２００３に供給するための配線２０２３を設けている。すなわち、発光ダイオード素子２００３と接続端子２００４，２００４を、ガラスエポキシ基板２００２上の配線２０２３を介して接続している。また、ガラスエポキシ基板２００２の接続端子２００４，２００４側の一部は口金２００６内に挿入されている。一方、ガラスエポキシ基板２００２の残りの大部分はカバーガラス２００５で覆われている。なお、ガラスエポキシ基板２００２の縦の寸法とは、図１３中の左右方向の寸法に相当する。また、ガラスエポキシ基板２００２の横の寸法とは、図１３の紙面に対して垂直な方向の寸法に相当する。 The glass epoxy substrate 2002 has a first surface 2021 directed to the heating chamber 2110 described later, and a flat second surface 2022 directed to the opposite side of the heating chamber 2110, and the vertical dimension is horizontal. It is longer than the dimensions. Further, the thickness of the glass epoxy substrate 2002 (the dimension between the first surface 2021 and the second surface 2022) is substantially constant, and is smaller than the vertical and horizontal dimensions of the glass epoxy substrate 2002. The glass epoxy substrate 2002 is provided with wiring 2023 for supplying current from the connection terminals 2004 and 2004 to the light emitting diode element 2003. That is, the light emitting diode element 2003 and the connection terminals 2004 and 2004 are connected via the wiring 2023 on the glass epoxy substrate 2002. A part of the glass epoxy board 2002 on the side of the connection terminals 2004 and 2004 is inserted into the base 2006. On the other hand, most of the remaining part of the glass epoxy substrate 2002 is covered with a cover glass 2005. Note that the vertical dimension of the glass epoxy substrate 2002 corresponds to the horizontal dimension in FIG. Further, the horizontal dimension of the glass epoxy substrate 2002 corresponds to a dimension in a direction perpendicular to the paper surface of FIG.
　また、上記ガラスエポキシ基板２００２の口金２００６とは反対側の一部は、取付板の一例としての略矩形板形状の取付部２０２４となっている。この取付部２０２４は、カバーガラス２００５から突出して、ガラスエポキシ基板２００２の第２面２０２２の延在方向に延びている。そして、取付部２０２４には、ビス２０１０（図２１に示す）が挿通される取付穴２０２５が設けられている。また、取付部２０２４は接続端子２００４，２００４から絶縁している。 Further, a part of the glass epoxy substrate 2002 opposite to the base 2006 is a mounting portion 2024 having a substantially rectangular plate shape as an example of a mounting plate. The attachment portion 2024 protrudes from the cover glass 2005 and extends in the extending direction of the second surface 2022 of the glass epoxy substrate 2002. The mounting portion 2024 is provided with a mounting hole 2025 through which a screw 2010 (shown in FIG. 21) is inserted. Further, the mounting portion 2024 is insulated from the connection terminals 2004 and 2004.
　上記発光ダイオード素子２００３は、ガラスエポキシ基板２００２の第１面２０２１に取り付けられている。また、発光ダイオード素子２００３は蛍光体２００７で気密封止されている。この蛍光体２００７は、発光ダイオード素子２００３から出射された光の波長を変換するものである。 The light emitting diode element 2003 is attached to the first surface 2021 of the glass epoxy substrate 2002. The light emitting diode element 2003 is hermetically sealed with a phosphor 2007. The phosphor 2007 is for converting the wavelength of light emitted from the light emitting diode element 2003.
　上記カバーガラス２００５は、ガラスエポキシ基板２００２の一部の第１面２０２１側と、発光ダイオード素子２００３とを覆っている。このカバーガラス２００５内の空間は密閉空間であり、外部の気体がカバーガラス２００５内に入らないようになっている。また、カバーガラス２００５は蛍光体２００７で波長が変換された光を透過する。 The cover glass 2005 covers a part of the first surface 2021 side of the glass epoxy substrate 2002 and the light emitting diode element 2003. The space in the cover glass 2005 is a sealed space so that external gas does not enter the cover glass 2005. The cover glass 2005 transmits light whose wavelength has been converted by the phosphor 2007.
　上記接続端子２００４，２００４は、ガラスエポキシ基板２００２の後方に設けられて、放熱平面２０２２の延在方向に延びている。この接続端子２００４，２００４のそれぞれの先端部には貫通穴２０４１を設けている。これにより、接続端子２００４，２００４を差し込み口（図示せず）に挿入したとき、差し込み口に設けられた突起が貫通穴２０４１に嵌合して、接続端子２００４，２００４の挿入が充分になったことを感触で判るようになっている。 The connection terminals 2004 and 2004 are provided behind the glass epoxy substrate 2002 and extend in the extending direction of the heat radiation plane 2022. A through hole 2041 is provided at the tip of each of the connection terminals 2004 and 2004. As a result, when the connection terminals 2004 and 2004 are inserted into the insertion port (not shown), the protrusions provided in the insertion port are fitted into the through holes 2041 and the connection terminals 2004 and 2004 are sufficiently inserted. You can understand this by touch.
　上記口金２００６はカバーガラス２００５と接続端子２００４，２００４との間に設けられている。この口金２００６と接続端子２００４，２００４との間は耐熱性の封止樹脂８で封止されている。 The base 2006 is provided between the cover glass 2005 and the connection terminals 2004 and 2004. A space between the base 2006 and the connection terminals 2004 and 2004 is sealed with a heat-resistant sealing resin 8.
　図１４は、上記加熱調理器の正面を斜め上方からみた図である。なお、以下の説明において、「左」は加熱調理器を正面（扉２１０２）側から見たときの左を指し、「右」は加熱調理器を正面（扉２１０２）側から見たときの右を指す。 FIG. 14 is a view of the front surface of the heating cooker as viewed obliquely from above. In the following description, “left” indicates the left when the cooking device is viewed from the front (door 2102) side, and “right” indicates the right when the cooking device is viewed from the front (door 2102). Point to.
　上記加熱調理器は、直方体形状であって鉄などの金属製のケーシング２１０１の正面に、下端側の辺を略中心に回動する扉２１０２が取り付けられている。この扉２１０２の上部にハンドル２１０３を取り付けると共に、扉２１０２の略中央に耐熱ガラス１０４を取り付けている。また、扉２１０２の右側には操作パネル２１０５を設けている。この操作パネル２１０５は、液晶表示部１０６と、ユーザが操作する操作ボタン群２１０７とを有している。また、ケーシング２１０１の上側かつ右側後方には、排気口２１０８ａを有する排気口カバー２１０８を設けている。さらに、ケーシング２１０１の前面の下部（扉２１０２の下方の部分）には、露受容器２１０９を着脱自在に取り付けている。 The heating cooker has a rectangular parallelepiped shape, and a door 2102 that rotates about the lower end side is attached to the front surface of a casing 2101 made of metal such as iron. A handle 2103 is attached to the upper part of the door 2102, and a heat resistant glass 104 is attached to the approximate center of the door 2102. An operation panel 2105 is provided on the right side of the door 2102. The operation panel 2105 includes a liquid crystal display unit 106 and an operation button group 2107 operated by the user. Further, an exhaust port cover 2108 having an exhaust port 2108a is provided on the upper side of the casing 2101 and on the right rear side. Further, a dew receptacle 2109 is detachably attached to a lower part of the front surface of the casing 2101 (a part below the door 2102).
　図１５は、上記加熱調理器の正面から見た縦断面の模式図である。また、図１６は、上記加熱調理器の右側方から見た縦断面の模式図である。 FIG. 15 is a schematic diagram of a longitudinal section viewed from the front of the cooking device. FIG. 16 is a schematic diagram of a longitudinal section viewed from the right side of the cooking device.
　上記ケーシング２１０１内には、図１５に示すように、被加熱物２１２３をトレイ１９０と共に収容可能な加熱室２１１０を設けている。この加熱室２１１０は、正面側に開口を有し、側面、底面および天面がステンレス鋼板からなっている。また、加熱室２１１０の右側方には、図１６に示すように、正面側から着脱自在に挿入された給水タンク２１１１を配置している。また、図１５，図１６に示すように、給水タンク２１１１の後面側には、給水タンク２１１１に接続された蒸気発生装置２１１２を配置している。この蒸気発生装置２１１２には蒸気供給通路２１１３の一端を接続し、循環ユニット２１１４には蒸気供給通路２１１３の他端を接続している。 In the casing 2101, as shown in FIG. 15, there is provided a heating chamber 2110 that can accommodate the object to be heated 2123 together with the tray 190. This heating chamber 2110 has an opening on the front side, and the side, bottom and top surfaces are made of stainless steel plates. Further, on the right side of the heating chamber 2110, as shown in FIG. 16, a water supply tank 2111 is detachably inserted from the front side. As shown in FIGS. 15 and 16, a steam generator 2112 connected to the water supply tank 2111 is disposed on the rear surface side of the water supply tank 2111. One end of a steam supply passage 2113 is connected to the steam generator 2112, and the other end of the steam supply passage 2113 is connected to the circulation unit 2114.
　上記蒸気発生装置２１１２は、ヒータ(図示せず)を有しており、給水タンク２１１１から供給された水を上記ヒータで加熱して、飽和水蒸気を生成する。この蒸気発生装置２１１２で生成された飽和水蒸気は、蒸気供給通路２１１３を介して蒸気供給口２１１３ａから循環ユニット２１１４内の吸込口２１２８の下流側に供給される。 The steam generator 2112 has a heater (not shown), and heats the water supplied from the water supply tank 2111 with the heater to generate saturated steam. The saturated steam generated by the steam generator 2112 is supplied from the steam supply port 2113a to the downstream side of the suction port 2128 in the circulation unit 2114 via the steam supply passage 2113.
　上記蒸気供給通路２１１３の蒸気供給口２１１３ａは、循環ユニット２１１４内の吸込口２１２８の近傍に配置されている。また、循環ユニット２１１４内には、吸込口２１２８に対向するように循環ファン２１１８が配置されている。 The steam supply port 2113 a of the steam supply passage 2113 is disposed in the vicinity of the suction port 2128 in the circulation unit 2114. Further, a circulation fan 2118 is disposed in the circulation unit 2114 so as to face the suction port 2128.
　上記加熱室２１１０の上面および左側面に、Ｌ字状に屈曲した蒸気ダクト２１８０を取り付けている。この蒸気ダクト２１８０は、加熱室２１１０の上壁に固定された第１ダクト部２１８１と、第１ダクト部２１８１の左側方から下側に屈曲する屈曲部１８２と、加熱室２１１０の左側壁に固定され、屈曲部１８２を介して第１ダクト部２１８１に連なる第２ダクト部２１８３とを有している。 A steam duct 2180 bent in an L shape is attached to the upper surface and the left side surface of the heating chamber 2110. The steam duct 2180 is fixed to the first duct portion 2181 fixed to the upper wall of the heating chamber 2110, the bent portion 182 bent from the left side of the first duct portion 2181 to the lower side, and the left wall of the heating chamber 2110. And a second duct portion 2183 connected to the first duct portion 2181 via the bent portion 182.
　上記蒸気ダクト２１８０の第１ダクト部２１８１内に、シーズヒータなどからなる加熱ヒータ２１２１を収納している。この第１ダクト部２１８１および加熱ヒータ２１２１が過熱蒸気生成装置を構成している。なお、過熱蒸気生成装置は蒸気ダクトとは別に設けてもよい。 A heater 2121 made of a sheathed heater or the like is housed in the first duct portion 2181 of the steam duct 2180. The first duct portion 2181 and the heater 2121 constitute a superheated steam generator. The superheated steam generator may be provided separately from the steam duct.
　また、上記第１ダクト部２１８１の右側の端部には、循環ユニット２１１４の上部に設けられた蒸気供給口２１１４ａが接続されており、第１ダクト部２１８１内は循環ユニット２１１４内に連通している。そして、加熱室２１１０の天面には複数の第１蒸気吹出口２１２４が設けられており、蒸気ダクト２１８０の第１ダクト部２１８１内の空間は第１蒸気吹出口２１２４を介して加熱室２１１０内に連通している。一方、蒸気ダクト２１８０の第２ダクト部２１８３は、加熱室２１１０の左側面に設けられた複数の第２蒸気吹出口２１２５を介して加熱室２１１０内に連通している。 In addition, a steam supply port 2114 a provided at the upper portion of the circulation unit 2114 is connected to the right end of the first duct portion 2181, and the inside of the first duct portion 2181 communicates with the circulation unit 2114. Yes. A plurality of first steam outlets 2124 are provided on the top surface of the heating chamber 2110, and the space in the first duct portion 2181 of the steam duct 2180 is inside the heating chamber 2110 via the first steam outlet 2124. Communicating with On the other hand, the second duct portion 2183 of the steam duct 2180 communicates with the inside of the heating chamber 2110 through a plurality of second steam outlets 2125 provided on the left side surface of the heating chamber 2110.
　上記加熱室２１１０と蒸気ダクト２１８０との隙間は、耐熱樹脂などによりシールされている。また、加熱室２１１０および蒸気ダクト２１８０は、加熱室２１１０の正面側の開口を除いて断熱材により覆われている。 The gap between the heating chamber 2110 and the steam duct 2180 is sealed with a heat resistant resin or the like. The heating chamber 2110 and the steam duct 2180 are covered with a heat insulating material except for the opening on the front side of the heating chamber 2110.
　上記循環ユニット２１１４と蒸気ダクト２１８０と加熱室２１１０とそれらを接続する接続部材とによって、熱媒体の循環経路が形成されている。そして、この循環経路における循環ユニット２１１４の加熱室２１１０との境界部に、蒸気発生装置２１１２で生成された飽和水蒸気が供給される。 The circulation path of the heat medium is formed by the circulation unit 2114, the steam duct 2180, the heating chamber 2110, and the connecting member that connects them. Then, saturated steam generated by the steam generator 2112 is supplied to a boundary portion of the circulation unit 2114 with the heating chamber 2110 in this circulation path.
　ここで、熱媒体は、加熱された空気であってもよいし、水蒸気を含む加熱された空気であってもよく、１００℃以上に加熱された過熱水蒸気を含む空気であってもよく、さらに、１００℃以上に加熱された過熱水蒸気を主とするものであってもよい。 Here, the heating medium may be heated air, may be heated air containing water vapor, may be air containing superheated steam heated to 100 ° C. or higher, and The main component may be superheated steam heated to 100 ° C. or higher.
　また、上記加熱室２１１０の下側の空間にはマグネトロン２１２０を配置している。このマグネトロン２１２０で発生したマイクロ波は、導波管(図示せず)によって加熱室２１１０の下部中央に導かれ、回転アンテナ(図示せず)によって攪拌されながら加熱室２１１０内の上方に向かって放射されて被加熱物２１２３を加熱する。この場合、被加熱物２１２３は加熱室２１１０内の底部に載置される。 Further, a magnetron 2120 is disposed in the space below the heating chamber 2110. The microwave generated by the magnetron 2120 is guided to the lower center of the heating chamber 2110 by a waveguide (not shown), and radiates upward in the heating chamber 2110 while being stirred by a rotating antenna (not shown). Thus, the article to be heated 2123 is heated. In this case, the object to be heated 2123 is placed on the bottom in the heating chamber 2110.
　また、上記加熱室２１１０の右側壁の中央部には吸込口２１２８を設けを設けている。そして、加熱室２１１０の右側壁には、吸込口２１２８の正面側に位置する給気口２１３３(図１９に示す)を設けると共に、吸込口２１２８の後面側に位置する第１排気口２１３６を設けている。給気口２１３３は扉２１０２近傍に位置し、給気口２１３３から加熱室２１１０内に吹き出される外気が扉２１０２に沿って流れる。また、加熱室２１１０の後面側壁面の右下側に、第１排気口２１３６よりも開口面積が小さい第２排気口２１３７を設けている。 Also, a suction port 2128 is provided at the center of the right side wall of the heating chamber 2110. The right side wall of the heating chamber 2110 is provided with an air supply port 2133 (shown in FIG. 19) located on the front side of the suction port 2128 and a first exhaust port 2136 located on the rear side of the suction port 2128. ing. The air supply port 2133 is located in the vicinity of the door 2102, and outside air blown out from the air supply port 2133 into the heating chamber 2110 flows along the door 2102. A second exhaust port 2137 having an opening area smaller than that of the first exhaust port 2136 is provided on the lower right side of the rear side wall surface of the heating chamber 2110.
　上記加熱室２１１０の右側面に配置された循環ユニット２１１４に、循環ファン２１１８を駆動する循環ファン用モータ２１１９を取り付けている。この循環ファン２１１８によって加熱室２１１０内の蒸気や空気は、吸込口２１２８から吸い込まれて蒸気ダクト２１８０を介して第１，第２蒸気吹出口２１２４，２１２５から加熱室２１１０内に吹き出す。また、循環ユニット２１１４の吸込口２１２８近傍には、加熱室２１１０内の熱媒体(蒸気を含む空気)の温度を検出する室内温度センサ２１２９を配置している。 A circulation fan motor 2119 for driving the circulation fan 2118 is attached to the circulation unit 2114 disposed on the right side surface of the heating chamber 2110. Steam or air in the heating chamber 2110 is sucked from the suction port 2128 by the circulation fan 2118 and blown out from the first and second steam outlets 2124 and 2125 into the heating chamber 2110 via the steam duct 2180. In addition, an indoor temperature sensor 2129 that detects the temperature of the heat medium (air containing steam) in the heating chamber 2110 is disposed in the vicinity of the suction port 2128 of the circulation unit 2114.
　上記加熱室２１１０内の被加熱物２１２３は、蒸気ダクト２１８０の第１ダクト部２１８１内に配置された加熱ヒータ２１２１の輻射熱によって加熱される。また、加熱ヒータ２１２１によって蒸気ダクト２１８０を通過する熱媒体(蒸気を含む空気)が加熱され、加熱された熱媒体が第１，第２蒸気吹出口２１２４，２１２５から吹き出される。これにより、加熱室２１１０内の熱媒体が所定温度に維持される。また、加熱室２１１０に供給すべき蒸気を加熱ヒータ２１２１によりさらに昇温して１００℃以上の過熱蒸気を生成することができる。 The object to be heated 2123 in the heating chamber 2110 is heated by the radiant heat of the heater 2121 disposed in the first duct portion 2181 of the steam duct 2180. Further, the heating medium (air containing steam) passing through the steam duct 2180 is heated by the heater 2121, and the heated heating medium is blown out from the first and second steam outlets 2124 and 2125. Thereby, the heat medium in the heating chamber 2110 is maintained at a predetermined temperature. Further, the steam to be supplied to the heating chamber 2110 can be further heated by the heater 2121 to generate superheated steam at 100 ° C. or higher.
　上記ケーシング２１０１内の下側には、冷却ファン部２１２２、電装部品２１１７およびマグネトロン２１２０を配置している。また、ケーシング２１０１内の加熱室２１１０の右側方に送風ダクト２１３１を配置している。この送風ダクト２１３１は、希釈ファン２１３０と、この希釈ファン２１３０を駆動する希釈ファン用モータ２１３８とを内部に収納している。冷却ファン部２１２２は、冷却ファン２１１５と、その冷却ファン２１１５を駆動する冷却ファン用モータ２１１６とを有する。 The cooling fan portion 2122, the electrical component 2117, and the magnetron 2120 are disposed on the lower side of the casing 2101. Further, an air duct 2131 is disposed on the right side of the heating chamber 2110 in the casing 2101. The air duct 2131 houses therein a dilution fan 2130 and a dilution fan motor 2138 that drives the dilution fan 2130. The cooling fan unit 2122 includes a cooling fan 2115 and a cooling fan motor 2116 that drives the cooling fan 2115.
　上記電装部品２１１７は、加熱調理器の各部を駆動する駆動回路やこの駆動回路を制御する制御回路等を有している。また、冷却ファン２１１５は、ケーシング２１０１内に外気を取り込み、発熱する電装部品２１１７やマグネトロン２１２０を冷却する。また、冷却ファン２１１５によってケーシング２１０１内に流入した外気の一部は、希釈ファン２１３０により送風ダクト２１３１内に導かれると共に、残りの外気は、ケーシング２１０１の背面等に形成された開口(図示せず)から外部に排出される。 The electrical component 2117 has a drive circuit that drives each part of the cooking device, a control circuit that controls the drive circuit, and the like. Further, the cooling fan 2115 takes outside air into the casing 2101 and cools the electrical component 2117 and the magnetron 2120 that generate heat. Further, a part of the outside air flowing into the casing 2101 by the cooling fan 2115 is guided into the air duct 2131 by the dilution fan 2130, and the remaining outside air is an opening (not shown) formed on the back surface of the casing 2101 or the like. ) To the outside.
　図１６に示すように、加熱室２１１０の右側壁に第１排気口２１３６から排気ダンパ(図示せず)を介して接続された第１排気ダクト２１３４を配置している。この第１排気ダクト２１３４は、横方向に延びる横通路２１３４ａと、その横通路２１３４ａから上方に屈曲する縦通路２１３４ｂとを有している。縦通路２１３４ｂの上端に排気口カバー２１０８を着脱可能に取り付けている。 As shown in FIG. 16, a first exhaust duct 2134 connected to the right side wall of the heating chamber 2110 from the first exhaust port 2136 via an exhaust damper (not shown) is disposed. The first exhaust duct 2134 has a lateral passage 2134a extending in the lateral direction and a longitudinal passage 2134b bent upward from the lateral passage 2134a. An exhaust port cover 2108 is detachably attached to the upper end of the vertical passage 2134b.
　上記第１排気ダクト２１３４の横通路２１３４ａの背面側に、吸込ダクト２１２７を介して外気を吸い込む吸込口(図示せず)を設けている。この吸込口または第１排気口２１３６のいずれか一方を択一的に選択して第１排気ダクト２１３４に接続するように排気ダンパを制御する。上記排気ダンパは、排気ダンパ用モータ２１６０(図１７に示す)より駆動される。 A suction port (not shown) for sucking outside air through a suction duct 2127 is provided on the back side of the lateral passage 2134a of the first exhaust duct 2134. The exhaust damper is controlled so that either one of the suction port or the first exhaust port 2136 is alternatively selected and connected to the first exhaust duct 2134. The exhaust damper is driven by an exhaust damper motor 2160 (shown in FIG. 17).
　上記第１排気ダクト２１３４の縦通路２１３４ｂは、上側に向かって流路面積が拡大されて排気口カバー２１０８に連結される。排気口カバー２１０８の上部には、前方に向かって開口した排気口２１０８ａが形成されている。 The vertical passage 2134b of the first exhaust duct 2134 is connected to the exhaust port cover 2108 with the flow passage area enlarged toward the upper side. An exhaust port 2108 a that opens forward is formed in the upper portion of the exhaust port cover 2108.
　一方、上記第２排気口２１３７に第２排気ダクト２１３５の下端を接続し、その第２排気ダクト２１３５の上端を第１排気ダクト２１３４の縦通路２１３４ｂの下側に接続している。 On the other hand, the lower end of the second exhaust duct 2135 is connected to the second exhaust port 2137, and the upper end of the second exhaust duct 2135 is connected to the lower side of the vertical passage 2134b of the first exhaust duct 2134.
　上記第２排気ダクト２１３５は、第１排気ダクト２１３４よりも流通面積が小さい。この第２排気口２１３７からの排気は、第２排気ダクト２１３５を介して第１排気ダクト２１３４に流入し、排気口カバー２１０８の排気口２１０８ａから外部に排出される。 The distribution area of the second exhaust duct 2135 is smaller than that of the first exhaust duct 2134. The exhaust from the second exhaust port 2137 flows into the first exhaust duct 2134 via the second exhaust duct 2135 and is discharged to the outside from the exhaust port 2108a of the exhaust port cover 2108.
　また、上記加熱室２１１０の側方の送風ダクト２１３１は、希釈ファン収納部１３１ａと、希釈ファン２１３０から上方に延びた縦通路２１３１ｂと、縦通路２１３１ｂから後面側に屈曲する横通路２１３１ｃと、横通路２１３１ｃから上方に屈曲するノズル部２１３１ｄを有している。横通路２１３１ｃとノズル部２１３１ｄとが第１排気ダクト２１３４内に挿入されている。 The air duct 2131 on the side of the heating chamber 2110 includes a dilution fan housing part 131a, a vertical passage 2131b extending upward from the dilution fan 2130, a horizontal passage 2131c bent from the vertical passage 2131b to the rear side, and a horizontal passage. The nozzle portion 2131d is bent upward from the passage 2131c. The lateral passage 2131c and the nozzle portion 2131d are inserted into the first exhaust duct 2134.
　上記送風ダクト２１３１のノズル部２１３１ｄの上端に開口部２１３１ｅを設けている。これにより、第１排気ダクト２１３４内にエジェクタが形成され、希釈ファン２１３０によって第１排気口２１３６から排気口２１０８ａに向かう気流を発生させる。 An opening 2131e is provided at the upper end of the nozzle portion 2131d of the air duct 2131. As a result, an ejector is formed in the first exhaust duct 2134, and an air flow from the first exhaust port 2136 toward the exhaust port 2108 a is generated by the dilution fan 2130.
　また、上記送風ダクト２１３１の横通路２１３１ｃに、縦通路２１３１ｂとの接続部の下端よりも下方に凹設される凹部が形成され、その凹部の一端に第１排気ダクト２１３４内に開口するサブノズル部２１３１ｆが形成される。 Further, a concave portion is formed in the horizontal passage 2131c of the air duct 2131 so as to be recessed below the lower end of the connecting portion with the vertical passage 2131b, and a sub nozzle portion that opens into the first exhaust duct 2134 at one end of the concave portion. 2131f is formed.
　さらに、上記送風ダクト２１３１の縦通路２１３１ｂの上部に給気通路２１３２の一端を接続し、その給気通路２１３２の他端を給気ダンパ２１４０に接続している。給気通路２１３２および給気ダンパ２１４０は、希釈ファン２１３０により給気口２１３３を介して加熱室２１１０に給気するための給気機構の一部である。この加熱室２１１０の給気口２１３３近傍かつ下側には、解凍センサ２１５０を配置している。 Furthermore, one end of the air supply passage 2132 is connected to the upper part of the vertical passage 2131b of the air duct 2131, and the other end of the air supply passage 2132 is connected to the air supply damper 2140. The air supply passage 2132 and the air supply damper 2140 are part of an air supply mechanism for supplying air to the heating chamber 2110 via the air supply port 2133 by the dilution fan 2130. A thawing sensor 2150 is disposed near and below the air inlet 2133 of the heating chamber 2110.
　上記給気ダンパ２１４０は、給気口２１３３を開閉するための耐熱樹脂製のダンパ本体２１４１と、そのダンパ本体２１４１を覆う耐熱樹脂製のハウジング２１４２とを有している。 The air supply damper 2140 includes a heat-resistant resin damper body 2141 for opening and closing the air supply opening 2133 and a heat-resistant resin housing 2142 for covering the damper body 2141.
　図１７は上記加熱調理器の制御ブロック図である。 FIG. 17 is a control block diagram of the heating cooker.
　上記加熱調理器は、マイクロコンピュータと入出力回路などからなる制御部２２００を電装部品２１１７(図１５，図１６に示す)内に備えている。制御部２２００は、加熱ヒータ２１２１，循環ファン用モータ２１１９，冷却ファン用モータ２１１６，希釈ファン用モータ２１３８，給気ダンパ用モータ２１４４，排気ダンパ用モータ２１６０，操作パネル２１０５，室内温度センサ２１２９，解凍センサ２１５０，給水ポンプ２１７０，蒸気発生装置２１１２およびマグネトロン２１２０が接続されている。操作パネル２１０５からの信号および室内温度センサ２１２９，解凍センサ２１５０からの検出信号に基づいて、制御部２２００は、加熱ヒータ２１２１，循環ファン用モータ２１１９，冷却ファン用モータ２１１６，希釈ファン用モータ２１３８，給気ダンパ用モータ２１４４，排気ダンパ用モータ２１６０，操作パネル２１０５，給水ポンプ２１７０，蒸気発生装置２１１２およびマグネトロン２１２０などを制御する。 The heating cooker includes a control unit 2200 including a microcomputer and an input / output circuit in an electrical component 2117 (shown in FIGS. 15 and 16). The control unit 2200 includes a heater 2121, a circulation fan motor 2119, a cooling fan motor 2116, a dilution fan motor 2138, a supply damper motor 2144, an exhaust damper motor 2160, an operation panel 2105, an indoor temperature sensor 2129, and thawing. A sensor 2150, a feed water pump 2170, a steam generator 2112 and a magnetron 2120 are connected. Based on signals from operation panel 2105 and detection signals from room temperature sensor 2129 and thawing sensor 2150, control unit 2200 includes heater 2121, circulation fan motor 2119, cooling fan motor 2119, dilution fan motor 2138, It controls an air damper motor 2144, an exhaust damper motor 2160, an operation panel 2105, a water supply pump 2170, a steam generator 2112, a magnetron 2120, and the like.
　図１８は、上記扉２１０２とケーシング２１０１を取り外した状態の加熱調理器の後面を斜め上方から見た斜視図である。また、図１９は、上記扉２１０２とケーシング２１０１を取り外した状態の加熱調理器の前面を斜め上方から見た斜視図である。 FIG. 18 is a perspective view of the rear surface of the cooking device with the door 2102 and the casing 2101 removed as viewed obliquely from above. FIG. 19 is a perspective view of the front surface of the cooking device with the door 2102 and the casing 2101 removed as viewed obliquely from above.
　上記加熱室２１１０の前側には前面パネル２１２６を設けている。この前面パネル２１２６は、給水タンク２１１１(図１６に示す)を挿入するための挿入口２１２６ａを右側部に有している。また、加熱室２１１０の右側壁の内面には、上段トレイ受部２１５１ａ，２１５１ｂと、中段トレイ受部２１５２ａ，２１５２ｂ，２１５２ｃと、下段トレイ受部２１５３とを設けている。中段トレイ受部２１５２ａ，２１５２ｂ間には解凍センサ２１５０のセンサ部２１５０ａを配置している。 A front panel 2126 is provided on the front side of the heating chamber 2110. The front panel 2126 has an insertion port 2126a for inserting a water supply tank 2111 (shown in FIG. 16) on the right side. Further, upper tray receiving portions 2151 a and 2151 b, middle tray receiving portions 2152 a, 2152 b and 2152 c, and a lower tray receiving portion 2153 are provided on the inner surface of the right side wall of the heating chamber 2110. A sensor unit 2150a of the thawing sensor 2150 is disposed between the middle tray receiving units 2152a and 2152b.
　図２０は、上記前面パネル２１２６の上部およびその近傍の部分を斜め上方から見た模式図である。 FIG. 20 is a schematic view of the upper part of the front panel 2126 and the vicinity thereof as seen obliquely from above.
　上記蒸気ダクト２１８０の第１ダクト部２１８１と前面パネル２１２６の上部との間には、取付金具の一例としての鋼製の枠体２００９を配置している。この枠体２００９の上部には、他の部分よりも厚い肉厚部２０９１を被取付部の一例として設けている。一方、枠体２００９の下部にはフランジ部２０９２，２０９２を設けている。また、上記肉厚部２０９１が、加熱室２１１０の上壁との間に隙間を有して、複数のパンチング穴２０１１，２０１１，…とガラス板２０１２との上方に位置するように、加熱室２１１０の上壁にフランジ部２０９２，２０９２をビス(図示せず)で固定している。 Between the first duct portion 2181 of the steam duct 2180 and the upper part of the front panel 2126, a steel frame 2009 as an example of a mounting bracket is disposed. A thick part 2091 that is thicker than the other parts is provided as an example of an attached part on the upper part of the frame 2009. On the other hand, flange portions 2092 and 2092 are provided in the lower portion of the frame body 2009. Further, the heating chamber 2110 has a gap between the thick portion 2091 and the upper wall of the heating chamber 2110 and is positioned above the plurality of punching holes 20111, 2011, ... and the glass plate 2012. Flange portions 2092 and 2092 are fixed to the upper wall with screws (not shown).
　図２１は、図２０のXXI－XXI線から見た縦断面の模式図である。また、図２２は、上記枠体２００９に取り付けられたＬＥＤランプ２００１を接続端子２００４，２００４側から見た模式図である。 FIG. 21 is a schematic diagram of a longitudinal section viewed from the XXI-XXI line of FIG. FIG. 22 is a schematic view of the LED lamp 2001 attached to the frame 2009 as viewed from the connection terminals 2004 and 2004 side.
　上記ＬＥＤランプ２００１は、図２１，図２２に示すように、枠体２００９に取り付けられている。より詳しくは、枠体２００９の肉厚部２０９１は加熱室２１１０側に平坦な密着平面２０９３を有し、この平坦な密着平面２０９３にガラスエポキシ基板２００２の平坦な第２面２０２２を密着させている。また、上記取付部２０２４の取付穴２０２５に挿通したビス２０１０を締め付けることにより、ＬＥＤランプ２００１を枠体２００９に固定している。なお、口金２００６における肉厚部２０９１との接触箇所に接着剤を塗布してもよい。 The LED lamp 2001 is attached to a frame 2009 as shown in FIGS. More specifically, the thick portion 2091 of the frame 2009 has a flat contact plane 2093 on the heating chamber 2110 side, and the flat second surface 2022 of the glass epoxy substrate 2002 is in close contact with the flat contact plane 2093. . Further, the LED lamp 2001 is fixed to the frame body 2009 by tightening a screw 2010 inserted into the mounting hole 2025 of the mounting portion 2024. In addition, you may apply | coat an adhesive agent to the contact location with the thick part 2091 in the nozzle | cap | die 2006. FIG.
　また、上記加熱室２１１０の上壁には、ＬＥＤランプ２００１に対向する複数のパンチング穴２０１１，２０１１，…を設けている。これにより、ＬＥＤランプ２００１から出射された光は複数のパンチング穴２０１１，２０１１，…を通って加熱室２１１０内に入るようになっている。また、加熱室２１１０内の蒸気などがパンチング穴２０１１，２０１１，…から加熱室２１１０外に漏れないように、パンチング穴２０１１，２０１１，…上にガラス板２０１２を配置している。 Further, a plurality of punching holes 2011, 2011,... Facing the LED lamp 2001 are provided on the upper wall of the heating chamber 2110. Thereby, the light emitted from the LED lamp 2001 enters the heating chamber 2110 through the plurality of punching holes 20111, 2011,. Moreover, the glass plate 2012 is arrange | positioned on the punching holes 2011, 2011, ... so that the vapor | steam etc. in the heating chamber 2110 may not leak outside the heating chamber 2110 from the punching holes 2011, 2011, ....
　上記加熱調理器の構成によれば、加熱室２１１０内をＬＥＤランプ２００１で照らすとき、発光ダイオード素子２００３が発熱する。この発光ダイオード素子２００３が発した熱は、ガラスエポキシ基板２００２の第１面２０２１に伝わって、ガラスエポキシ基板２００２の第２面２０２２から枠体２００９の肉厚部２０９１の密着平面２０９３に伝わる。このとき、第２面２０２２および密着平面２０９３は共に平坦な面であって互いに密着しているので、密着平面２０９３に対する第２面２０２２の接触面積が大きくなっている。したがって、発光ダイオード素子２００３が発した熱をガラスエポキシ基板２００２を介して枠体２００９の肉厚部２０９１に効率良く伝えることができる。 According to the configuration of the cooking device, when the inside of the heating chamber 2110 is illuminated with the LED lamp 2001, the light emitting diode element 2003 generates heat. The heat generated by the light emitting diode element 2003 is transmitted to the first surface 2021 of the glass epoxy substrate 2002, and is transmitted from the second surface 2022 of the glass epoxy substrate 2002 to the adhesion plane 2093 of the thick portion 2091 of the frame body 2009. At this time, since the second surface 2022 and the contact flat surface 2093 are both flat surfaces and are in close contact with each other, the contact area of the second surface 2022 with the contact flat surface 2093 is large. Therefore, the heat generated by the light emitting diode element 2003 can be efficiently transmitted to the thick portion 2091 of the frame body 2009 through the glass epoxy substrate 2002.
　さらに、上記ガラスエポキシ基板２００２の第２面２０２２と枠体２００９の肉厚部２０９１の密着平面２０９３との接触面積を大きくしても、枠体２００９の肉厚部２０９１はＬＥＤランプ２００１上に位置してＬＥＤランプ２００１と加熱室２１１０の上壁との間に無いから、ＬＥＤランプ２００１から出射された光が枠体２００９の肉厚部２０９１の一部で遮られることがない。すなわち、ＬＥＤランプ２００１の高放熱，高輝度の両立を図ることができる。 Further, even if the contact area between the second surface 2022 of the glass epoxy substrate 2002 and the contact flat surface 2093 of the thick portion 2091 of the frame body 2009 is increased, the thick portion 2091 of the frame body 2009 is positioned on the LED lamp 2001. Then, since there is no space between the LED lamp 2001 and the upper wall of the heating chamber 2110, the light emitted from the LED lamp 2001 is not blocked by a part of the thick portion 2091 of the frame body 2009. That is, both high heat dissipation and high luminance of the LED lamp 2001 can be achieved.
　このように、上記ＬＥＤランプ２００１の放熱性能は非常に高いので、発光ダイオード素子２００３を高温雰囲気でも充分に冷却できる。 Thus, since the heat dissipation performance of the LED lamp 2001 is very high, the light emitting diode element 2003 can be sufficiently cooled even in a high temperature atmosphere.
　また、上記被加熱物２１２３を過熱水蒸気で加熱する場合、加熱ヒータ２１２１で生成した１００℃以上の過熱蒸気を複数の第１蒸気吹出口２１２４，第２蒸気吹出口２１２５から加熱室２１１０内に供給する。このため、加熱ヒータ２１２１を収納する第１ダクト部２１８１の周辺温度は８０℃～１００℃にもなる。このような高温環境にＬＥＤランプ２００１を配置していても、発光ダイオード素子２００３を充分に冷却できるので、ＬＥＤランプ２００１は、照明能力が低下せず、寿命を長くすることができる。 In addition, when heating the object to be heated 2123 with superheated steam, superheated steam of 100 ° C. or higher generated by the heater 2121 is supplied into the heating chamber 2110 from the plurality of first steam outlets 2124 and second steam outlets 2125. To do. For this reason, the ambient temperature of the first duct portion 2181 that houses the heater 2121 becomes 80 ° C. to 100 ° C. Even if the LED lamp 2001 is arranged in such a high temperature environment, the light emitting diode element 2003 can be sufficiently cooled. Therefore, the LED lamp 2001 does not have a reduced illumination capability and can have a long life.
　また、上記ＬＥＤランプ２００１の寿命を長くすることができるので、ＬＥＤランプ２００１の交換回数が少なくなり、ランニングコストを低減できる。 Also, since the life of the LED lamp 2001 can be extended, the number of replacements of the LED lamp 2001 is reduced, and the running cost can be reduced.
　また、上記接続端子２００４，２００４がガラスエポキシ基板２００２の第２面２０２２の延在方向に延びるので、第２面２０２２と密着平面２０９３の間には接続端子２００４，２００４が介在しないようにできる。 Further, since the connection terminals 2004 and 2004 extend in the extending direction of the second surface 2022 of the glass epoxy substrate 2002, the connection terminals 2004 and 2004 can be prevented from being interposed between the second surface 2022 and the contact plane 2093.
　さらに、上記ガラスエポキシ基板２００２は第２面２０２２の延在方向に対して垂直方向の反力を肉厚部２０９１から受けるが、接続端子２００４，２００４がガラスエポキシ基板２００２の第２面２０２２の延在方向に延びるので、接続端子２００４，２００４は上記反力で外れ難い。 Further, the glass epoxy substrate 2002 receives a reaction force in the direction perpendicular to the extending direction of the second surface 2022 from the thick portion 2091, but the connection terminals 2004 and 2004 extend from the second surface 2022 of the glass epoxy substrate 2002. Since it extends in the present direction, the connection terminals 2004 and 2004 are not easily detached by the reaction force.
　また、上記ＬＥＤランプ２００１は取付部２０２４を備えているので、ガラスエポキシ基板２００２の第２面２０２２が枠体２００９の肉厚部２０９１の密着平面２０９３に密着するように、ＬＥＤランプ２００１を肉厚部２０９１に取り付けることができる。 Further, since the LED lamp 2001 includes the mounting portion 2024, the LED lamp 2001 is thickened so that the second surface 2022 of the glass epoxy substrate 2002 is in close contact with the contact flat surface 2093 of the thick portion 2091 of the frame body 2009. It can be attached to the part 2091.
　また、上記肉厚部２０９１が鋼から成るが、取付部２０２４は接続端子２００４，２００４から絶縁されているので、接続端子２００４，２００４の通電に悪影響は及ばない。 In addition, although the thick portion 2091 is made of steel, the attachment portion 2024 is insulated from the connection terminals 2004 and 2004, so that the energization of the connection terminals 2004 and 2004 is not adversely affected.
　また、上記取付部２０２４の取付穴２０２５に挿通したビス２０１０を締め付けることによって、ガラスエポキシ基板２００２を枠体２００９の肉厚部２０９１に押し付けることができるので、ガラスエポキシ基板２００２の第２面２０２２と枠体２００９の肉厚部２０９１の密着平面２０９３との密着力を高くすることができる。 Further, by tightening the screw 2010 inserted through the mounting hole 2025 of the mounting portion 2024, the glass epoxy substrate 2002 can be pressed against the thick portion 2091 of the frame body 2009, so that the second surface 2022 of the glass epoxy substrate 2002 and The adhesion force between the thick portion 2091 of the frame 2009 and the adhesion plane 2093 can be increased.
　また、上記取付部２０２４はガラスエポキシ基板２００２の一部であるから、部品点数を少なくすることができる。 Further, since the mounting portion 2024 is a part of the glass epoxy substrate 2002, the number of parts can be reduced.
　また、上記肉厚部２０９１は枠体２００９の一部であるから、肉厚部２０９１は枠体２００９の広い表面を使って熱を放出することができる。したがって、上記発光ダイオード素子の冷却能力を高めることができる。 Further, since the thick portion 2091 is a part of the frame body 2009, the thick portion 2091 can release heat using a wide surface of the frame body 2009. Therefore, the cooling capacity of the light emitting diode element can be increased.
　上記第３実施形態では、ＬＥＤランプ２００１は、ガラスエポキシ基板２００２の第２面２０２２の延在方向に延びる接続端子２００４，２００４を備えていたが、ガラスエポキシ基板２００２の第２面２０２２の延在方向に対して斜め方向に延びる接続端子を備えてもよい。 In the third embodiment, the LED lamp 2001 includes the connection terminals 2004 and 2004 extending in the extending direction of the second surface 2022 of the glass epoxy substrate 2002, but the extension of the second surface 2022 of the glass epoxy substrate 2002. A connection terminal extending obliquely with respect to the direction may be provided.
　上記第３実施形態では、ＬＥＤランプ２００１はガラスエポキシ基板２００２を備えていたが、ガラスエポキシ基板２００２に換えて、例えば、アルミ基板等の金属基板、半導体基板、セラミック基板を備えてもよい。 In the third embodiment, the LED lamp 2001 includes the glass epoxy substrate 2002. However, instead of the glass epoxy substrate 2002, for example, a metal substrate such as an aluminum substrate, a semiconductor substrate, or a ceramic substrate may be included.
　上記第３実施形態の鋼製の枠体２００９に換えて、例えば、Ｃｕ、Ｍｏ、ＷまたはＡｌから成る枠体を用いてもよい。 For example, a frame made of Cu, Mo, W, or Al may be used instead of the steel frame 2009 of the third embodiment.
　上記第３実施形態では、ガラスエポキシ基板２００２に、１つの取付部２０２４を設けていたが、複数の取付部を設けるようにしてもよい。 In the third embodiment, one attachment portion 2024 is provided on the glass epoxy substrate 2002, but a plurality of attachment portions may be provided.
　〔第４実施形態〕
　図２３は、本発明の第４実施形態の加熱調理器の要部の正面を斜め上方からみた模式図である。また、図２３では、上記第３実施形態と同一構成部に上記第３実施形態の構成部と同一参照番号を付している。なお、以下の説明では、上記第３実施形態と同様に、「左」は加熱調理器を正面側から見たときの左を指し、「右」は加熱調理器を正面側から見たときの右を指す。 [Fourth Embodiment]
FIG. 23: is the schematic diagram which looked at the front of the principal part of the heating cooker of 4th Embodiment of this invention from diagonally upward. In FIG. 23, the same reference numerals as those of the third embodiment are assigned to the same components as those of the third embodiment. In the following description, as in the third embodiment, “left” refers to the left when the cooking device is viewed from the front side, and “right” is when the cooking device is viewed from the front side. Point to the right.
　上記加熱調理器は、鉄などの金属製のケーシング２３０１と、このケーシング２３０１内に設けられた加熱室２３１０と、この加熱室２３１０内を照らすＬＥＤランプ２２０１とを備えている。また、図示しないが、ケーシング２３０１内には、上記第３実施形態と同様に、蒸気発生装置、電装部品、マグネトロン、加熱ヒータ、冷却ファン部および送風ダクト等を設置している。この冷却ファン部が吹き出した空気はケーシング２３０１の右側部と加熱室２３１０の右壁との間を流れるようになっている。 The heating cooker includes a casing 2301 made of metal such as iron, a heating chamber 2310 provided in the casing 2301, and an LED lamp 2201 that illuminates the heating chamber 2310. Although not shown, a steam generator, electrical components, a magnetron, a heater, a cooling fan unit, an air duct, and the like are installed in the casing 2301 as in the third embodiment. The air blown out by the cooling fan portion flows between the right side portion of the casing 2301 and the right wall of the heating chamber 2310.
　図２４は、図２３のXXIV－XXIV線から見た縦断面の模式図である。 FIG. 24 is a schematic diagram of a longitudinal section viewed from the line XXIV-XXIV in FIG.
　上記ケーシング２３０１の右側面には、被取付部の一例としての凹部２３０２を設けている。この凹部２３０２は、加熱室２３１０の右壁の延在方向に略平行な底部２３２１と、この底部２３２１の周囲に設けられ、加熱室２３１０の右壁の延在方向に対して傾斜する４つの周壁部２３２２，２３２３，２３２４とから成っている。また、底部２３２１は複数のパンチング穴２２１１，２２１１，…とガラス板２２１２との側方に位置している。 A concave portion 2302 as an example of a mounted portion is provided on the right side surface of the casing 2301. The concave portion 2302 includes a bottom portion 2321 substantially parallel to the extending direction of the right wall of the heating chamber 2310, and four peripheral walls provided around the bottom portion 2321 and inclined with respect to the extending direction of the right wall of the heating chamber 2310. It consists of parts 2322, 2323, 2324. Further, the bottom portion 2321 is located on the side of the plurality of punching holes 2211, 2111,... And the glass plate 2212.
　上記ＬＥＤランプ２２０１は、ケーシング２３０１の凹部２３０２に取り付けられている。より詳しくは、凹部２３０２の底部２３２１は加熱室２３１０側に平坦な密着平面２３２５を有し、この平坦な密着平面２３２５にガラスエポキシ基板２００２の平坦な第２面２０２２を密着させている。また、上記取付部２０２４の取付穴２０２５に挿通したビス２０１０を締め付けることにより、ＬＥＤランプ２００１をケーシング２３０１に固定している。なお、口金２２０６における周壁部２３２３との接触箇所に接着剤を塗布してもよい。 The LED lamp 2201 is attached to the recess 2302 of the casing 2301. More specifically, the bottom 2321 of the recess 2302 has a flat contact plane 2325 on the heating chamber 2310 side, and the flat second surface 2022 of the glass epoxy substrate 2002 is in close contact with the flat contact plane 2325. Further, the LED lamp 2001 is fixed to the casing 2301 by tightening a screw 2010 inserted into the mounting hole 2025 of the mounting portion 2024. In addition, you may apply | coat an adhesive agent to the contact location with the surrounding wall part 2323 in the nozzle | cap | die 2206. FIG.
　また、上記ＬＥＤランプ２２０１は、上記第３実施形態のＬＥＤランプ２００１ランプ２００１の口金２００６とは異なる形状を有する金属製の口金３０６を備えている。この口金３０６の凹部２３０２側には、凹部２３０２の周壁部２３２３の傾斜角と略同じ傾斜角を有する傾斜面２２６１を設けている。また、傾斜面２２６１を凹部２３０２の周壁部２３２３に当接させると、ガラスエポキシ基板２００２の第２面２０２２が底部２３２１の密着平面２３２５に接触するように、傾斜面２２６１を設計している。 The LED lamp 2201 includes a metal base 306 having a shape different from that of the base 2006 of the LED lamp 2001 lamp 2001 of the third embodiment. An inclined surface 2261 having an inclination angle substantially the same as the inclination angle of the peripheral wall 2323 of the recess 2302 is provided on the recess 2302 side of the base 306. Further, the inclined surface 2261 is designed so that the second surface 2022 of the glass epoxy substrate 2002 contacts the contact flat surface 2325 of the bottom portion 2321 when the inclined surface 2261 is brought into contact with the peripheral wall portion 2323 of the concave portion 2302.
　上記加熱室２１１０の右壁には、ＬＥＤランプ２００１に対向する複数のパンチング穴２２１１，２２１１，…を設けている。これにより、ＬＥＤランプ２２０１から出射された光は複数のパンチング穴２２１１，２２１１，…を通って加熱室２３１０内に入るようになっている。また、加熱室２３１０内の蒸気などがパンチング穴２２１１，２２１１，…から加熱室２３１０外に漏れないように、パンチング穴２２１１，２２１１，…をガラス板２２１２で覆っている。 A plurality of punching holes 2211, 2111,... Facing the LED lamp 2001 are provided on the right wall of the heating chamber 2110. Thereby, the light emitted from the LED lamp 2201 enters the heating chamber 2310 through the plurality of punching holes 2211, 2111,. Further, the punching holes 2211, 2111,... Are covered with a glass plate 2212 so that steam in the heating chamber 2310 does not leak out of the heating chamber 2310 from the punching holes 2211, 2111,.
　上記構成の加熱調理器によれば、ガラスエポキシ基板２００２の平坦な第２面２０２２が凹部２３０２の底部２３２１の平坦な密着平面と３２５に密着しているので、密着平面２３２５に対する第２面２０２２の接触面積を大きくなっている。したがって、発光ダイオード素子２００３が発した熱をガラスエポキシ基板２００２を介して凹部２３０２の底部２３２１に効率良く伝えることができる。 According to the heating cooker having the above configuration, the flat second surface 2022 of the glass epoxy substrate 2002 is in close contact with the flat close contact plane 325 of the bottom 2321 of the recess 2302, so the second surface 2022 with respect to the close contact flat surface 2325 The contact area is increased. Therefore, the heat generated by the light emitting diode element 2003 can be efficiently transmitted to the bottom 2321 of the recess 2302 through the glass epoxy substrate 2002.
　さらに、上記ガラスエポキシ基板２００２の第２面２０２２と凹部２３０２の底部２３２１の密着平面２３２５との接触面積を大きくしても、凹部２３０２の底部２３２１はＬＥＤランプ２２０１の光の出射側に無いから、ＬＥＤランプ２２０１の照明能力の低下を防ぐことができる。 Furthermore, even if the contact area between the second surface 2022 of the glass epoxy substrate 2002 and the contact flat surface 2325 of the bottom 2321 of the recess 2302 is increased, the bottom 2321 of the recess 2302 is not on the light emission side of the LED lamp 2201. It is possible to prevent the illumination capability of the LED lamp 2201 from being lowered.
　このように、上記ＬＥＤランプ２２０１の放熱性能は非常に高いので、発光ダイオード素子２００３を高温雰囲気でも充分に冷却できる。 Thus, since the heat dissipation performance of the LED lamp 2201 is very high, the light emitting diode element 2003 can be sufficiently cooled even in a high temperature atmosphere.
　また、上記凹部２３０２はケーシング２３０１の一部であるから、上記第３実施形態よりも放熱面積が大きくて発光ダイオード素子２００３を高くできる。 Further, since the recess 2302 is a part of the casing 2301, the heat radiation area is larger than that of the third embodiment, and the light emitting diode element 2003 can be made high.
　また、上記ＬＥＤランプ２２０１の配置箇所には冷却ファン部からの空気が流れるので、ＬＥＤランプ２２０１を空冷できる。 In addition, since the air from the cooling fan portion flows through the arrangement place of the LED lamp 2201, the LED lamp 2201 can be air-cooled.
　上記第４実施形態では、ＬＥＤランプ２２０１は、ガラスエポキシ基板２００２の第２面２０２２の延在方向に延びる接続端子２００４，２００４を備えていたが、ガラスエポキシ基板２００２の第２面２０２２の延在方向に対して斜め方向に延びる接続端子を備えてもよい。 In the fourth embodiment, the LED lamp 2201 includes the connection terminals 2004 and 2004 extending in the extending direction of the second surface 2022 of the glass epoxy substrate 2002, but the extension of the second surface 2022 of the glass epoxy substrate 2002. A connection terminal extending obliquely with respect to the direction may be provided.
　上記第４実施形態では、ＬＥＤランプ２２０１はガラスエポキシ基板２００２を備えていたが、ガラスエポキシ基板２００２に換えて例えばアルミ基板を備えてもよい。 In the fourth embodiment, the LED lamp 2201 includes the glass epoxy substrate 2002. However, instead of the glass epoxy substrate 2002, for example, an aluminum substrate may be included.
　本発明の加熱調理器としては、例えば、過熱水蒸気を使用するオーブンレンジのみならず、過熱水蒸気を使用するオーブン、過熱水蒸気を使用しないオーブンレンジ、過熱水蒸気を使用しないオーブンなどがある。 Examples of the cooking device of the present invention include not only an oven range using superheated steam but also an oven using superheated steam, an oven range not using superheated steam, and an oven not using superheated steam.
　本発明の加熱調理器では、オーブンレンジなどにおいて、過熱水蒸気または飽和水蒸気を用いることによって、ヘルシーな調理を行うことができる。例えば、本発明の加熱調理器では、温度が１００℃以上の過熱水蒸気または飽和水蒸気を食品表面に供給し、食品表面に付着した過熱水蒸気または飽和水蒸気が凝縮して大量の凝縮潜熱を食品に与えるので、食品に熱を効率よく伝えることができる。また、凝縮水が食品表面に付着して塩分や油分が凝縮水と共に滴下することにより、食品中の塩分や油分を低減できる。さらに、加熱室内は過熱水蒸気または飽和水蒸気が充満して低酸素状態となることにより、食品の酸化を抑制した調理が可能となる。ここで、低酸素状態とは、加熱室内において酸素の体積％が１０％以下(例えば０．５～３％)である状態を指す。 In the cooking device of the present invention, healthy cooking can be performed by using superheated steam or saturated steam in a microwave oven or the like. For example, in the cooking device of the present invention, superheated steam or saturated steam having a temperature of 100 ° C. or higher is supplied to the food surface, and the superheated steam or saturated steam adhered to the food surface is condensed to give a large amount of condensation latent heat to the food. So it can efficiently transfer heat to food. Moreover, when condensed water adheres to the food surface and salt and oil are dropped together with condensed water, salt and oil in the food can be reduced. Further, the heating chamber is filled with superheated steam or saturated steam to be in a low oxygen state, thereby enabling cooking while suppressing food oxidation. Here, the low oxygen state refers to a state in which the volume% of oxygen is 10% or less (for example, 0.5 to 3%) in the heating chamber.
　本発明の具体的な実施形態について説明したが、本発明は上記第３，第４実施形態に限定されるものではなく、本発明の範囲内で種々変更して実施することができる。 Although specific embodiments of the present invention have been described, the present invention is not limited to the third and fourth embodiments described above, and various modifications can be made within the scope of the present invention.
　また、上記第１～第４実施形態を適宜組み合わせたものを本発明の一実施形態としてもよい。 Also, a combination of the first to fourth embodiments as appropriate may be an embodiment of the present invention.
　１…ＬＥＤランプ
　２…アルミヒートシンク
　３…ガラスエポキシ基板
　４，１００４…発光ダイオード素子
　５…接続端子
　６…取付板
　７…カバーガラス
　８…口金
　９…蛍光体
　１４…取付穴
　１５…金属板
　２１，１０２１…密着平面
　２２，１０２２…放熱平面
　３１…第１面
　３２…第２面
　３３…配線
　１０１…ケーシング
　１１０…加熱室
　１２３…被加熱物
　２００１，２２０１…ＬＥＤランプ
　２００２…ガラスエポキシ基板
　２００３…発光ダイオード素子
　２００４…接続端子
　２００５…カバーガラス
　２００６，２２０６…口金
　２００９…枠体
　２０１０…ビス
　２０１１，２２１１…パンチング穴
　２０１２，２２１２…ガラス板
　２０２１…第１面
　２０２２…第２面
　２０３４…取付部
　２０３５…取付穴
　２０９１…肉厚部
　２０９２…フランジ部
　２０９３，２３２５…密着平面
　２１０１，２３０１…ケーシング
　２１１０，２３１０…加熱室
　２３０２…凹部
　２３２１…底部
　２３２２，２３２３，２３２４…周壁部
　２１２３…被加熱物 DESCRIPTION OF SYMBOLS 1 ... LED lamp 2 ... Aluminum heat sink 3 ... Glass epoxy board 4,1004 ... Light emitting diode element 5 ... Connection terminal 6 ... Mounting plate 7 ... Cover glass 8 ... Base 9 ... Phosphor 14 ... Mounting hole 15 ... Metal plate 21,1021 ... adhesion plane 22,1022 ... heat radiation plane 31 ... first surface 32 ... second surface 33 ... wiring 101 ... casing 110 ... heating chamber 123 ... heated object 2001, 201 ... LED lamp 2002 ... glass epoxy substrate 2003 ... light emitting diode element 2004 ... Connection terminal 2005 ... Cover glass 2006, 2206 ... Base 2009 ... Frame 2010 ... Screw 2011, 2111, ... Punching hole 2012, 2212 ... Glass plate 2021 ... First surface 2022 ... Second surface 2034 ... Mounting portion 2035 ... Mounting hole 2091 ... Thick part 2092 ... Flange part 093,2325 ... contact plane 2101,2301 ... casing 2110,2310 ... heating chamber 2302 ... recess 2321 ... bottom 2322,2323,2324 ... wall portion 2123 ... object to be heated

Claims (12)

  1. 　基板(３)と、
    　この基板(３)の第１面(３１)に搭載された発光ダイオード素子(４)と、
    　上記発光ダイオード素子(４)と上記基板(３)の第１面(３１)側とを覆う透明または半透明な部材と、
    　上記基板(３)の第１面(３１)とは反対側の第２面(３２)と密着する平坦な密着平面(２１，１０２１)と、この密着平面(２１，１０２１)とは反対側に設けられた平坦な放熱平面(２２，１０２２)とを有するヒートシンク(２)と、
    　上記ヒートシンク(２)の放熱平面(２２，１０２２)の延在方向またはその延在方向に対して斜め方向に延びると共に、上記発光ダイオード素子(４)に電気接続される接続端子(５)と
    を備えることを特徴とするＬＥＤランプ(１)。     A substrate (3);
    A light emitting diode element (4) mounted on the first surface (31) of the substrate (3);
    A transparent or translucent member covering the light emitting diode element (4) and the first surface (31) side of the substrate (3);
    A flat contact plane (21, 1021) in close contact with the second surface (32) opposite to the first surface (31) of the substrate (3), and the opposite side of the contact plane (21, 1021). A heat sink (2) having a flat heat dissipation plane (22, 1022) provided;
    A connection terminal (5) extending in an oblique direction with respect to the extending direction of the heat radiation plane (22, 1022) of the heat sink (2) or the extending direction and electrically connected to the light emitting diode element (4), An LED lamp (1) characterized by comprising.
  2. 　請求項１に記載のＬＥＤランプ(１)において、
    　上記ヒートシンク(２)の上記密着平面(２１，１０２１)と上記放熱平面(２２，１０２２)との間の寸法である厚さ(Ｄ)が、上記ヒートシンク(２)の縦および横の寸法よりも小さいことを特徴とするＬＥＤランプ(１)。     LED lamp (1) according to claim 1,
    The thickness (D), which is the dimension between the contact plane (21, 1021) of the heat sink (2) and the heat dissipation plane (22, 1022), is larger than the vertical and horizontal dimensions of the heat sink (2). LED lamp (1) characterized by being small.
  3. 　請求項１または２に記載のＬＥＤランプ(１)において、
    　上記発光ダイオード素子(４)と上記接続端子(５)とは、上記ヒートシンク(２)の内部を通らないで外側を通る上記基板(３)上の配線(３３)によって接続されていることを特徴とするＬＥＤランプ(１)。     LED lamp (1) according to claim 1 or 2,
    The light emitting diode element (4) and the connection terminal (5) are connected to each other by a wiring (33) on the substrate (3) passing through the outside without passing through the inside of the heat sink (2). LED lamp (1).
  4. 　請求項１から３までのいずれか一項に記載のＬＥＤランプ(１)において、
    　上記接続端子(５)から絶縁された取付部材(６)を備えることを特徴とするＬＥＤランプ(１)。     LED lamp (1) according to any one of claims 1 to 3,
    An LED lamp (1) comprising a mounting member (6) insulated from the connection terminal (5).
  5. 　請求項４に記載のＬＥＤランプ(１)において、
    　上記取付部材(６)は、上記接続端子(５)の近傍において上記接続端子(５)の延在する方向に交差する方向に延びると共に、取付穴(１４)を有する取付板(６)であることを特徴とするＬＥＤランプ(１)。     LED lamp (1) according to claim 4,
    The mounting member (6) is a mounting plate (6) extending in a direction intersecting the extending direction of the connection terminal (5) in the vicinity of the connection terminal (5) and having a mounting hole (14). LED lamp (1) characterized by the above.
  6. 　ケーシング(１０１)と、
    　上記ケーシング(１０１)内に設けられ、被加熱物(１２３)を収容する加熱室(１１０)と、
    　上記ケーシング(１０１)と上記加熱室(１１０)との間に配置されて、上記加熱室(１１０)内を照らす請求項１から５までのいずれか一項に記載のＬＥＤランプ(１)と
    を備え、
    　上記ＬＥＤランプ(１)の上記ヒートシンク(２)の上記放熱平面(２２，１０２２)は金属板(１６)に密着されていることを特徴とする加熱調理器。     A casing (101);
    A heating chamber (110) that is provided in the casing (101) and accommodates an object to be heated (123);
    The LED lamp (1) according to any one of claims 1 to 5, which is arranged between the casing (101) and the heating chamber (110) and illuminates the inside of the heating chamber (110). Prepared,
    The heating cooker characterized in that the heat radiation plane (22, 1022) of the heat sink (2) of the LED lamp (1) is in close contact with the metal plate (16).
  7. 　ケーシング(２１０１，２３０１)と、
    　上記ケーシング(２１０１，２３０１)内に設けられ、被加熱物(２１２３)を収容する加熱室(２１１０，２３１０)と、
    　上記ケーシング(２１０１，２３０１)と上記加熱室(２１１０，２３１０)との間に配置され、上記加熱室(２１１０，２３１０)内を照らすＬＥＤランプ(２００１)と、
    　上記ＬＥＤランプ(２００１)が取り付けられる金属製の被取付部(２０９１，２３０２)と
    を備え、
    　上記ＬＥＤランプ(２００１，２２０１)は、
    　上記加熱室(２１１０，２３１０)側に第１面(２０２１)を有すると共に、上記加熱室(２１１０，２３１０)とは反対側に平坦な第２面(２０２２)を有する基板(２００２)と、
    　上記基板(２００２)の第１面(２０２１)に搭載された発光ダイオード素子(２００３)と、
    　上記発光ダイオード素子(２００３)と上記基板(２００２)の第１面(２０２１)側とを覆う透明または半透明な部材(２００５)と、
    　上記基板(２００２)の第２面(２０２２)の延在方向またはその延在方向に対して斜め方向に延びると共に、上記発光ダイオード素子(２００３)に電気接続される接続端子(２００４)と
    を備え、
    　上記被取付部(２０９１，２３０２)は、上記基板(２００２)の第２面(２０２２)と密着する平坦な密着平面(２０９３，２３２５)を有することを特徴とする加熱調理器。     Casings (2101, 2301);
    A heating chamber (2110, 2310) which is provided in the casing (2101, 301) and accommodates an object to be heated (2123);
    An LED lamp (2001) that is disposed between the casing (2101, 301) and the heating chamber (2110, 2310) and illuminates the inside of the heating chamber (2110, 2310);
    A metal attached portion (2091, 302) to which the LED lamp (2001) is attached;
    The LED lamps (2001, 2011)
    A substrate (2002) having a first surface (2021) on the heating chamber (2110, 2310) side and a flat second surface (2022) on the opposite side of the heating chamber (2110, 2310);
    A light emitting diode element (2003) mounted on the first surface (2021) of the substrate (2002);
    A transparent or translucent member (2005) covering the light emitting diode element (2003) and the first surface (2021) side of the substrate (2002);
    A connection terminal (2004) extending in a direction oblique to the extending direction of the second surface (2022) of the substrate (2002) or the extending direction thereof and electrically connected to the light emitting diode element (2003). ,
    The cooker characterized in that the attached parts (2091, 3022) have flat contact planes (2093, 2325) that are in close contact with the second surface (2022) of the substrate (2002).
  8. 　請求項７に記載の加熱調理器において、
    　上記ＬＥＤランプ(２００１，２２０１)は上記接続端子(２００４)から絶縁された取付部材(２０２４)を備えることを特徴とする加熱調理器。     The heating cooker according to claim 7, wherein
    The LED cooker (2001, 201) includes a mounting member (2024) insulated from the connection terminal (2004).
  9. 　請求項８に記載の加熱調理器において、
    　上記取付部材(２０２４)は、上記基板(２００２)の第２面(２０２２)の延在方向に延びると共に、取付穴(２０２５)を有する取付板(２０２４)であることを特徴とする加熱調理器。     The cooking device according to claim 8,
    The attachment member (2024) is an attachment plate (2024) extending in the extending direction of the second surface (2022) of the substrate (2002) and having an attachment hole (2025). .
  10. 　請求項９に記載の加熱調理器において、
    　上記取付板(２０２４)は上記基板(２００２)の一部であることを特徴とする加熱調理器。     The cooking device according to claim 9,
    The cooking device according to claim 1, wherein the mounting plate (2024) is a part of the substrate (2002).
  11. 　請求項７から１０までのいずれか一項に記載の加熱調理器において、
    　上記被取付部(２０９１)は上記ＬＥＤランプ(２００１)の取付金具(２００９)の一部であることを特徴とする加熱調理器。     In the heating cooker according to any one of claims 7 to 10,
    The cooking device according to claim 1, wherein the mounted portion (2091) is a part of a mounting bracket (2009) of the LED lamp (2001).
  12. 　請求項７から１０までのいずれか一項に記載の加熱調理器において、
    　上記被取付部(２３０２)は上記ケーシング(２３０１)の一部であることを特徴とする加熱調理器。     In the heating cooker according to any one of claims 7 to 10,
    The cooker characterized in that the attached portion (2302) is a part of the casing (2301).
PCT/JP2012/062220 2011-06-03 2012-05-11 Led lamp and cooker equipped with same WO2012165125A1 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2011125419A JP2012253232A (en) 2011-06-03 2011-06-03 Heating cooker
JP2011-125426 2011-06-03
JP2011125426A JP2012251738A (en) 2011-06-03 2011-06-03 Heating cooker
JP2011-125419 2011-06-03

Publications (1)

Publication Number Publication Date
WO2012165125A1 true WO2012165125A1 (en) 2012-12-06

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Application Number Title Priority Date Filing Date
PCT/JP2012/062220 WO2012165125A1 (en) 2011-06-03 2012-05-11 Led lamp and cooker equipped with same

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CN (1) CN202691769U (en)
WO (1) WO2012165125A1 (en)

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CN108095567B (en) * 2017-12-08 2020-01-31 广东美的厨房电器制造有限公司 Cooking utensil
JP7029706B2 (en) * 2018-02-28 2022-03-04 パナソニックＩｐマネジメント株式会社 Cooker

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