WO2012039106A1

WO2012039106A1 - Laser processing apparatus

Info

Publication number: WO2012039106A1
Application number: PCT/JP2011/005072
Authority: WO
Inventors: 義典佐々木; 杉山　勤; 学西原; 櫻井　通雄; 一知小寺
Original assignee: パナソニック株式会社
Priority date: 2010-09-24
Filing date: 2011-09-09
Publication date: 2012-03-29
Also published as: JPWO2012039106A1; CN102596484A; TWI581887B; TW201213032A; CN102596484B; JP5500248B2

Abstract

A laser processing apparatus (100) of the present invention is provided with: a processing head section (109), which laser-processes a subject to be processed; a placing section, which includes an outer circumferential placing section (114) having suction ports formed therein, and a plurality of movable placing sections (112) having suction ports formed therein, said movable placing sections moving up and down, and which holds the subject to be processed; XY tables (131, 133), which drive the placing section in the X axis direction and the Y axis direction; and a work holding section (121), which is disposed on the outer circumferential placing section, and which holds, among the sides of the subject to be processed, at least one side parallel to the longitudinal direction of the movable placing section, said one side being on the processing start point side.

Description

Laser processing equipment

The present invention relates to a laser processing apparatus that performs processing by irradiating a laser, and in particular, laser processing that provides both blind hole processing (non-through hole processing) and through hole processing (through hole processing) with a single processing apparatus. Relates to the device.

In recent years, with the downsizing, high integration, and composite modularization of parts, the drilling of the base material of those parts has also been reduced in diameter, and it has become difficult to cope with this downsizing with conventional processing methods. . In order to solve these problems, drilling using a laser is increasing. There are two types of hole drilling in a workpiece by laser. There are two types of drilling: a through-hole machining for making a through hole in the workpiece and a blind hole machining for making a non-through hole in the workpiece. .

FIG. 9 is a side view seen from a cross-section showing the configuration of the mounting portion for mounting the workpiece of the first example of the laser processing apparatus according to the prior art.

As shown in FIG. 9, the movable mounting unit 812 and the outer peripheral mounting unit 816 divided up and down are provided as mounting units. Here, the placement portion is shown in a side view seen from a cross section in which the structures of the movable placement portion 812 and the outer periphery placement portion 816 are understood. An outer peripheral suction hole 814 is formed in the outer peripheral placement portion 816, and a placement portion suction hole 813 is formed in the divided movable placement portion 812. The workpiece 811 is placed on the upper part of the divided movable placing part 812 and outer circumference placing part 816 and is sucked and held. The divided movable mounting portions 812 have a structure that can be individually moved in the vertical direction, and are moved in the vertical direction by a lift drive unit such as an air cylinder.

During the blind hole processing, the movable mounting portion 812 is in a state where all the suction portions are raised. Then, the workpiece 811 is sucked and fixed using the entire surface of the mounting portion, and processing is performed. At the time of through-hole processing, as shown in FIG. 9, laser processing is performed in a state where only the divided movable mounting portion 812 corresponding to the lower portion of the portion to be processed of the workpiece 811 is lowered.

By configuring as described above, damage to the mounting portion due to laser during through-hole processing is prevented while maintaining the flatness of the workpiece 811 (see, for example, Patent Document 1).

In recent years, for more precise processing and higher integration, the thickness of the plate-like workpiece 811 has become thinner and the diameter of the drilled holes has also become smaller. For example, a resin film having a thickness of about 40 μm to 120 μm and a metal foil having a thickness of several tens of μm are objects to be processed.

In the configuration of the laser processing apparatus according to the above-described prior art, during the through hole processing, the laser processing is performed in a state where the suction portion corresponding to the lower portion of the portion to be processed of the workpiece 811 is lowered. Nevertheless, the workpiece is not held flat.

Therefore, although the mounting portion is not damaged by the laser, in the case of the thin sheet-like or foil-like workpiece 811 as described above, the deflection occurs so that the corresponding portion hangs down by its own weight. To do. As a result, the flatness of the processed portion is deteriorated. The deterioration of the flatness causes a shift in the focal point of the laser and a shift in the processing position, and prevents the laser from being narrowed down to the minimum diameter, thereby hindering precise processing.

Generally, the processing is performed from the processing area at one end of the workpiece 811 and sequentially moved to the adjacent processing area. At the time of laser processing of the first processing area, the first movable mounting portion 812 at the end is lowered. If it does so, it will be hold | maintained by the adsorption | suction force by only the outer periphery adsorption | suction hole 814 of the outer periphery mounting part 816 in the edge | side of the starting point side of the process of the to-be-processed object 811. For this reason, the holding force of the workpiece 811 is small on the starting side. The reverse direction is sufficiently held by the mounting portion suction holes 813 of all the remaining movable mounting portions 812 other than the outer peripheral suction holes 814 described above.

Therefore, when deflection occurs in the workpiece 811, not only the vertical displacement but also the starting side is pulled in the sliding direction, causing a horizontal displacement.

When the second movable placement portion 812 adjacent to the first movable placement portion 812 is lowered, the processing start point side is formed by the outer peripheral suction hole 814 and the placement portion suction hole 813 of the first movable placement portion 812. It will be held by adsorption. However, in the processing area corresponding to the position of the first movable mounting portion 812, since laser processing has already been completed, there are a large number of through holes, and the suction force by vacuuming is weak. As a result, in addition to the deflection due to the own weight, the deflection due to the deviation of the initial position is added, and the deviation of the position in the horizontal direction is caused from the side on the processing start point side. The same applies to the case where the third movable mounting portion 812 adjacent to the second movable mounting portion 812 is lowered.

As described above, the movable mounting portion 812 adjacent to the movable mounting portion 812 that has been processed is lowered in accordance with the progress of the processing, but the deflection of the workpiece 811 is also propagated sequentially in accordance with that. Increase. Furthermore, the horizontal deviation increases as it propagates. When these deflections and deviations overlap and a positional deviation occurs on the order of several tens of μm, the precision of precision processing becomes poor. Therefore, there is a problem that it is difficult to realize precise drilling and high-precision laser machining cannot be performed.

International Publication No. 2009/001497

The present invention provides a laser processing apparatus that realizes precise drilling and can perform highly accurate laser processing.

The laser processing apparatus of the present invention includes a processing head unit for laser processing a workpiece, an outer periphery mounting unit in which suction holes are formed, and a plurality of movable mounting units in which suction holes are formed and moved up and down. , A placement unit that holds the workpiece, an XY table that drives the placement unit in the X-axis direction and the Y-axis direction, and the outer circumferential placement unit, and at least one of the sides of the workpiece A work presser part that is parallel to the longitudinal direction of the movable mounting part and presses one side of the starting point side of the processing.

With this configuration, even when a through-hole process is performed on a workpiece having a divided movable mounting portion, the deflection of the workpiece that propagates and increases sequentially as the machining progresses Misalignment can be prevented. Therefore, even a sheet-like workpiece having a very thin thickness can be subjected to highly accurate laser processing, reducing processing defects due to inaccuracy and realizing precise hole processing. .

FIG. 1 is a front view showing a schematic configuration of a laser processing apparatus according to an embodiment of the present invention. FIG. 2 is a perspective view showing a detailed configuration around the mounting portion of the laser processing apparatus according to the embodiment of the present invention. FIG. 3 is a side view showing a detailed configuration of the work pressing portion of the laser processing apparatus according to the embodiment of the present invention as seen from the cross section along line 3-3 in FIG. FIG. 4 is a side view showing a detailed configuration and movement of the work pressing portion of the laser processing apparatus according to the embodiment of the present invention, as seen from the section taken along line 3-3 in FIG. FIG. 5 is a perspective view showing an example of the processing area order of the workpiece according to the embodiment of the present invention. FIG. 6 is a side view seen from a cross section taken along line 3-3 showing a first operation state of the mounting portion according to the embodiment of the present invention. FIG. 7 is a side view seen from a cross section taken along line 3-3 showing a second operation state of the mounting portion according to the embodiment of the present invention. FIG. 8 is a side view seen from a cross section taken along line 3-3 showing a third operation state of the mounting portion according to the embodiment of the present invention. FIG. 9: is the side view seen from the cross section which shows the structure of the mounting part of the laser processing apparatus based on a prior art.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following drawings, the same components are denoted by the same reference numerals, and the description thereof may be omitted. Further, the X axis, the Y axis, and the Z axis shown in the drawings are directions orthogonal to each other. Here, the Z axis is the vertical direction corresponding to the top and bottom, and the coordinate axes in each figure are drawn so as to correspond to the directions of the respective fields of view.

(Embodiment)
FIG. 1 is a schematic configuration diagram of a laser processing apparatus 100 according to an example of an embodiment of the present invention. In FIG. 1, a laser oscillator 102 emits a laser beam 103 by emitting a laser inside. The direction of the emitted laser beam 103 is changed by the optical system 104, and adjustment of the laser density and beam diameter, shaping of the beam shape, and the like are performed.

The laser beam 103 that has passed through the optical system 104 is scanned and positioned by a galvano scanner 105 including an X mirror 106 for scanning in the X-axis direction and a Y mirror 107 for scanning in the Y-axis direction. Further, the laser processing apparatus 100 is configured such that the laser beam 103 positioned by the galvano scanner 105 is condensed by the fθ lens 108 and irradiated to the processing point of the workpiece 111.

The galvano scanner 105 including the X mirror 106 and the Y mirror 107 and the fθ lens 108 are provided in the processing head unit 109, and the processing head unit 109 is installed in the apparatus main body so as to be movable in the Z-axis direction.

A plurality of workpieces 111 are placed on a plurality of movable placement portions 112 and an outer periphery placement portion 114. Furthermore, two sides parallel to the longitudinal direction (Y-axis direction) of the movable mounting portion 112 among the one side of the workpiece 111 are pressed by the pair of work pressing portions 121. The movable mounting parts 112 are each supported by a pair of cylinders (not shown), and the cylinders are controlled by air pressure, and the individual movable mounting parts 112 can be moved up and down independently.

The machining table consists of two large blocks, an X table 131 and a Y table 133. The X table 131 is configured to mount the movable mounting portion 112, the outer peripheral mounting portion 114, and a set of configurations associated therewith, and to move in the X-axis direction. For the movement in the X-axis direction, the X table driving unit 132 is driven to rotate the ball screw, and the X table 131 is slid along with the entire set mounted on the ball screw.

The Y table 133 is configured to further mount the X table 131 and a set of components mounted thereon and move in the Y-axis direction. For the movement in the Y axis direction, the Y table driving unit 134 is driven to rotate the ball screw, and the Y table 133 is slid along with the entire set mounted thereon.

Further, the laser oscillator 102, the galvano scanner 105, a cylinder for moving up and down the movable mounting unit 112, an X table driving unit 132, a Y table driving unit 134, and the like are provided.

A more detailed partial configuration of the laser processing apparatus 100 will be described with reference to FIG. FIG. 2 is a perspective view showing a detailed configuration around the mounting portion of the laser processing apparatus according to the embodiment of the present invention.

First, as shown in FIG. 2, a placement portion on which a workpiece (not shown) is placed and held is constituted by a plurality of movable placement portions 112 and an outer periphery placement portion 114. . The movable mounting portion 112 is provided with a plurality of mounting portion suction holes 113, and the outer peripheral mounting portion 114 is also provided with an outer peripheral suction hole 115. The workpiece is sucked and held by evacuating from the placement portion suction hole 113 and the outer periphery suction hole 115.

A pair of work presser portions 121 are installed on two sides parallel to the longitudinal direction (Y-axis direction) of the movable mounting portion 112. The work presser 121 is attached so as to be rotatable by a fulcrum 124 provided on a member installed on the outer periphery mounting part 114, and is opened and closed by a presser part drive cylinder 123.

The work pressing part 121 is formed of a long plate-like metal body due to dimensional constraints in the Z-axis direction, and a clamp member 122 is provided on the surface of the work pressing part 121 facing the workpiece. The clamp member 122 is formed of an organic elastic body such as urethane rubber or silicon rubber. Thereby, when it contacts with a workpiece, a pressing force is generated without being damaged, and displacement due to slippage of the workpiece can be prevented.

In addition, the shape of the clamp member 122 may be continuously swelled linearly as shown in the figure, or may be formed in the shape of dots that are discrete at predetermined intervals. If it is linear, it can be uniformly pressed against the side of the workpiece, and if it is dotted, it can be concentrated and pressed. For example, if the positions formed in the form of dots are arranged in the vicinity of the central portion of the adjacent outer periphery suction holes 115 in relation to the outer periphery suction holes 115, the holding force by suction and pressing can be effectively distributed.

In the present embodiment, the butterfly portion 126 is provided at the center of the long plate-like workpiece pressing portion 121. The hinge portion 126 serves as a fulcrum for the rotation of the opening / closing operation of the work holding portion 121, and the holding portion drive cylinder 123 is provided at both long ends, so that the center portion of the work holding portion 121 is prevented from floating and the pressing force is more uniform. To play a role.

The operation of the laser processing apparatus 100 configured as described above will be described.

FIG. 3 is a side view seen from the cross section (taken along the line 3-3) showing the state of the placing part and the work holding part 121 when the workpiece 111 is mounted, as seen from the Y-axis direction. FIG. 4 is a side view showing a detailed configuration and movement of the work pressing portion of the laser processing apparatus according to the embodiment of the present invention, as seen from the section taken along line 3-3 in FIG.

In mounting the workpiece 111 on the apparatus, the mounting table is moved to the mounting position of the workpiece 111 by moving the processing table. Here, the mounting portion suction hole 113 and the outer peripheral suction hole 115 are evacuated. It stops and is not adsorbed, and all the movable mounting parts 112 are raised.

Further, the work presser part 121 is opened by the presser part drive cylinder 123. By the two fulcrums 124 and the presser part drive link 125, the vertical movement of the presser part drive cylinder 123 is converted into a rotational action of the work presser part 121 as indicated by an arrow.

After the workpiece 111 is mounted on the mounting portion, the mounting portion suction hole 113 and the outer peripheral suction hole 115 are evacuated to start sucking and holding the lower surface of the workpiece 111.

Then, the work holding unit 121 is driven from the open state shown in FIG. 3 to the closed state by the holding unit driving cylinder 123. Such a state is shown in FIG. As shown in FIG. 4, the workpiece is placed on the outer periphery mounting portion 114 in which the suction holes 115 are formed and the plurality of movable mounting portions 112 (112a, 112b, 112c, 112d) in which the suction holes 113 are formed. 111 is held. A side parallel to the longitudinal direction (Y-axis direction) of the movable mounting portion 112 among the sides of the workpiece 111 is pressed by the work pressing portion 121.

A clamp member 122 is provided at a portion in contact with the work piece 111 to generate a pressing force on the work piece 111 and prevent a slippage of the work piece 111.

¡After holding the workpiece 111, the following operations are performed. The movement of the machining table is started so as to move the placement unit holding the workpiece 111 to the first machining area. The movement of the machining head at the origin position to the focal position is started. Only the movable mounting portion 112 on the lower surface of the first processing area is switched to blow (positive pressure) for evacuating the mounting portion suction hole 113 provided in the movable mounting portion 112, and the workpiece at the corresponding portion 111 The suction holding of the lower surface is stopped, and the movable mounting portion 112 is lowered. These operations are performed in parallel.

An example of this processing area is shown in FIG. FIG. 5 is a perspective view showing an example of the processing area order of the workpiece according to the embodiment of the present invention. In FIG. 5, an area where numbers 1 to 48 are assigned to the workpiece 111 is a processing area 140. Each processing area 140 is set within the scan range of the galvano scanner 105, and positioning of laser processing in the area is performed by controlling the galvano scanner 105. Note that the illustrated area is merely an example, and is not limited to this figure.

After the above-described operation is completed and the first processing area 141 of the workpiece 111 arrives below the position where the processing head unit 109 is located, drilling of the first processing area 141 is started by the laser beam 103. Note that one side of the workpiece 111 denoted by reference numeral 142 in the drawing corresponds to the one side 142 parallel to the longitudinal direction of the movable mounting portion and on the machining start side.

FIG. 6 is a side view of a state in which holes are drilled in the first processing area 141 as seen from a cross section taken along line 3-3. Hole machining is performed by irradiating the laser beam 103 with the movable mounting portion 112a at a position corresponding to the first machining area 141 lowered. One side (not shown) of the workpiece 111 that is parallel to the longitudinal direction of the movable mounting portion and that is on the processing start point side is sucked and held by the outer peripheral suction hole 115 provided in the outer peripheral mounting portion 114. At the same time, one side of the starting point side is pressed by a work pressing portion 121 provided with a clamp member 122. This prevents the workpiece 111 from being bent and misaligned.

When the predetermined laser irradiation is completed and all holes in the first processing area 141 are completed, the processing table is moved in the Y direction in this embodiment to move to the second processing area. Let The state of laser hole machining in the second machining area (for example, machining area 143) is also as shown in FIG. In this manner, the same operation is repeated until laser processing is completed for all areas where the movable mounting portion 112a is lowered (from the first processing area to the sixth processing area in FIG. 5). In addition, the movable mounting part 112a holds the first processing area to the sixth processing area in FIG.

When the laser processing of all the areas where one movable mounting portion 112a is lowered is completed, the following operation is started.

First, in order to move the mounting portion to the next processing area, the processing table starts to move in the X direction. The movable mounting portion 112a is raised while stopping the blow (positive pressure) of the movable mounting portion 112a that has already been lowered. When the ascent is completed, the placement portion suction hole 113 provided in the movable placement portion 112a is evacuated to suck and hold the workpiece 111 again. The evacuation of the mounting portion suction hole 113 provided in the movable mounting portion 112b at the position corresponding to the next processing area (seventh processing area in FIG. 5) is switched to blow. When the lower surface of the workpiece 111 at that location is no longer held, the movable mounting portion 112b at that location is lowered. These operations are performed in parallel.

As described above, after the preparation in the processing area is completed, the galvano scanner 105 is controlled to start irradiation with the laser beam 103 at the hole processing position. FIG. 7 is a side view seen from a cross section taken along line 3-3 showing a second operation state of the mounting portion according to the embodiment of the present invention. FIG. 7 is a partial cross-sectional view of the state in which the processing area is laser drilled as viewed from the Y-axis direction. Hole machining is performed by irradiating the laser beam 103 with the movable mounting portion 112b at a position corresponding to the machining area lowered. One side of the workpiece 111 that is parallel to the longitudinal direction of the movable mounting portion and that is on the side of the starting point of processing is sucked and held by the outer peripheral suction hole 115 provided in the outer peripheral mounting portion 114 and provided with a clamp member 122. The workpiece is held by the workpiece presser 121. The suction by the movable mounting portion 112a is not strong compared with the suction of other movable mounting portions because the workpiece is drilled, but the deflection and misalignment of the workpiece are due to the configuration of the present invention. It is prevented.

When all the areas where the movable mounting portion 112b is lowered (from the seventh processing area to the twelfth processing area in FIG. 5) are moved to the next processing area in the same manner. The state is shown in FIG.

Here, similarly, the laser beam 103 is irradiated in a state where the movable mounting portion 112c at the position corresponding to the processing area is lowered to perform the hole processing. One side of the workpiece 111 that is parallel to the longitudinal direction of the movable mounting portion and that is on the processing start side is adsorbed and held by the outer peripheral suction hole 115 provided in the outer peripheral mounting portion 114 and provided with a clamp member 122. The workpiece holding part 121 holds the workpiece 111 to prevent the workpiece 111 from being bent and displaced.

The above operation is repeated to process all the predetermined areas of the workpiece 111. When all the processing of the predetermined area is completed, the following operation is started.

First, the movement of the machining table is started in order to start the movement to the workpiece removal position. The movement of the machining head 109 to the origin is started. While stopping the blowing of the movable mounting part 112 that has already been lowered, the movable mounting part 112 is raised, and when the raising is completed, the mounting part suction hole 113 provided in the movable mounting part 112 is evacuated. Then, the workpiece 111 is held again by suction. These operations are performed in parallel.

When all the operations described above are completed and the processing table has been moved to the workpiece 111 take-out position, the presser unit drive cylinder 123 is operated to open the work presser unit 121, and all the mounting units are moved. Vacuum suction of the suction holes 113 and all the outer peripheral suction holes 115 is stopped. Then, it is confirmed that the workpiece 111 is no longer held by suction, and the workpiece 111 take-out device (not shown) removes the workpiece 111 from the mounting portion and completes the laser hole machining of the workpiece. To do.

As described above, the laser processing apparatus 100 of the present invention is configured to include the processing head unit 109, the mounting unit, the XY table, and the work pressing unit 121. Here, the processing head unit 109 performs laser processing on the workpiece 111. The mounting portion includes an outer peripheral mounting portion 114 in which the suction hole 115 is formed and a plurality of movable mounting portions 112 in which the suction hole 113 is formed and moves up and down, and holds the workpiece 111. The XY table drives the placement unit in the X-axis direction and the Y-axis direction. The work holding unit 121 is installed on the outer periphery mounting unit 114 and presses at least one side 142 of one side of the workpiece 111 that is parallel to at least the longitudinal direction of the movable mounting unit 112 and that is on the machining start side.

With this configuration, even when the movable mounting portion 112 sequentially descends and rises from the machining start point side as the machining progresses, the deflection of the workpiece 111 that propagates and increases in accordance with that is increased. It is possible to prevent displacement. As a result, it is possible to perform highly accurate laser processing even for a sheet-shaped workpiece 111 having a very thin thickness, to reduce processing defects due to inaccuracy and to realize precise hole processing. Can do.

Alternatively, a configuration may be provided that includes a pair of work pressing portions 121 that are installed on the outer periphery mounting portion 114 and press at least two sides parallel to the longitudinal direction of the movable mounting portion 112 out of one side of the workpiece 111.

With this configuration, it is possible to prevent deflection and misalignment of the workpiece that sequentially propagates and increases with the progress of machining from the machining start side. In particular, the workpiece 111 from the opposite side at the end of machining is prevented. Deflection and misalignment can be prevented, and the effect becomes higher. As a result, it is possible to perform highly accurate laser processing even for a sheet-shaped workpiece 111 having a very thin thickness, to reduce processing defects due to inaccuracy and to realize precise hole processing. Can do.

Moreover, it is good also as a structure which installed the organic-material elastic body, for example, a clamp member, in the surface of the workpiece holding part 121 facing the to-be-processed object 111. FIG.

With this configuration, it is possible to generate a pressing force without being damaged when contacting the workpiece 111, and to prevent displacement due to slippage of the workpiece 111.

Alternatively, the organic elastic body may be formed in a linear shape. With this configuration, it is possible to uniformly press the side of the workpiece, and the holding force by suction and pressing can be effectively distributed.

Alternatively, the organic elastic body may be formed in the form of dots that are dispersed at predetermined intervals. With this configuration, it is possible to concentrate and press on the dot-like portion, and to effectively distribute the holding force due to suction and pressing.

Further, a configuration may be provided in which a central portion of the work holding portion 121 includes a butterfly portion 126 serving as an opening / closing fulcrum 124 and a pressing portion that presses both ends of the work holding portion 121 toward the workpiece 111.

This configuration suppresses the floating of the center portion of the work pressing portion 121 and makes the pressing force more uniform.

As described above, a specific side of the workpiece 111 is further pressed by the work pressing portion 121 against the laser processing apparatus 100 that holds the workpiece 111 by suction of the plurality of movable mounting portions 112 that are moved up and down. The idea of the invention to do is not easily conceivable. The workpiece 111 is very thin and requires high accuracy for the processing. As the processing progresses, the movable mounting portion 112 sequentially descends and rises from the processing start side. It can be conceived only when there is a recognition that the deflection and misalignment of the work piece propagates and increases sequentially.

In the present embodiment, the description has been given using the example in which eight movable mounting portions 112 are installed and the processing area 140 of the workpiece 111 is set to 48 areas. The number of processing areas 140 may be determined by design requirements such as the size of the laser processing apparatus 100 and the shape of the workpiece, and is not limited to this example.

The laser processing apparatus according to the present invention can realize high processing accuracy by preventing deflection and misalignment of the workpiece in the hole drilling by the laser of the workpiece held by the mounting unit that is divided and moved up and down. It is useful in a laser processing apparatus that performs through-hole processing.

DESCRIPTION OF SYMBOLS 100 Laser processing apparatus 101 Processing control part 102 Laser oscillator 103 Laser beam 104 Optical system 105 Galvano scanner 106 X mirror 107 Y mirror 108 f (theta) lens 109 Processing head part 111 Workpiece 112,112a, 112b, 112c, 112d Movable mounting part 113 Placement part suction hole 114 Outer circumference placement part 115 Outer circumference suction hole 121 Workpiece holding part 122 Clamp member 123 Presser part drive cylinder 124 Support point 125 Presser part drive link 126 Hinge part 131 X table 132 X table drive part 133 Y table 134 Y Table drive unit 140 Processing area 141 First processing area 142 One side 143 of starting point side Second processing area

Claims

A machining head for laser machining the workpiece;
An outer periphery mounting portion in which an adsorption hole is formed; and a plurality of movable mounting portions in which the adsorption hole is formed and moved up and down; a mounting portion for holding the workpiece;
An XY table for driving the mounting portion in the X-axis direction and the Y-axis direction;
A laser processing apparatus, comprising: a workpiece pressing unit that is installed on the outer periphery mounting unit and that presses at least one side of the workpiece parallel to the longitudinal direction of the movable mounting unit on the processing start side.
2. The laser processing apparatus according to claim 1, further comprising a pair of work pressing portions that are installed on the outer periphery mounting portion and hold at least two sides parallel to a longitudinal direction of the movable mounting portion among one side of the workpiece. .
The laser processing apparatus of any one of Claim 1 or 2 which installed the organic substance elastic body in the surface of the said workpiece holding part facing the said to-be-processed object.
The laser processing apparatus according to claim 3, wherein the organic elastic body is formed in a linear shape.
The laser processing apparatus according to claim 3, wherein the organic elastic body is formed in a dot shape that is discrete at a predetermined interval.
2. The laser processing apparatus according to claim 1, further comprising: a butterfly portion serving as a fulcrum for opening and closing at a center portion of the workpiece pressing portion; and a pressing portion that presses both ends of the workpiece pressing portion toward the workpiece.