WO2012034332A1

WO2012034332A1 - Led integral structure with cooling equipment

Info

Publication number: WO2012034332A1
Application number: PCT/CN2010/079718
Authority: WO
Inventors: 杨东佐
Original assignee: Yang Dongzuo
Priority date: 2010-09-15
Filing date: 2010-12-13
Publication date: 2012-03-22
Also published as: CN201820758U

Abstract

An LED integral structure with a cooling equipment comprises a heat-dissipating base board (3), an LED chip (4) fixed on the heat-dissipating base board (3); the cooling equipment which comprises a heat-dissipating liquid box disposed on a side of the heat dissipating base board (3) away from the LED chip (4) and liquid cooling medium sealed in the box; the heat dissipating base board (3) isolating the LED chip (4) from the liquid cooling medium and covering the back side of the LED chip (4) completely; the surface of the heat dissipating base board (3) that away from the LED chip (4) contacting the liquid cooling medium directly and sealing the liquid cooling medium. Such structure is simple and has good cooling effect.

Description

LED integrated structure with cooling device

The utility model relates to an LED integrated structure with a cooling device for illumination, a backlight module, a television set, an LED dot matrix display screen, a projection device, etc., in particular to a cooling of a high-power LED integrated structure. Device.

Background technique

LED light source, especially high-power LED light source, the heat is concentrated when the light is emitted. If the heat generated by the LED chip is not released in time, the temperature of the LED light source is too high, which will lead to the LED light reduction and low life, so how to The heat generated by the LED chip is quickly and effectively dissipated and becomes a bottleneck for popularizing LED light sources. How to improve the light efficiency of LED light sources and how to improve the heat dissipation performance of LED light sources to prolong the service life is an important technical problem in the industry. The existing solution to the problem of heat dissipation of the LED light source is to improve the integrated structure of the LED, so that the heat generated by the LED light source is more easily emitted, and the other solution is to increase the cooling structure.

Existing high-power LED integrated structures are usually re-integrated by a single individual LED light-emitting tube packaged by a bracket.

In the invention patent of the application No. 200810135621. 5, an LED package device, a heat sink base and an electrode holder combination and a method thereof are disclosed. The LED package device comprises: an LED die and a high thermal conductivity material. And a heat dissipation base for the die contact, an electrode holder, a positioning unit and a covering body. The heat sink base is made of a highly thermally conductive material such as metal or ceramic, and includes a recessed portion of the chassis, the body, and the top surface of the body. The crystal grains are placed on the bottom surface of the depressed portion. The electrode holder is punched out from a metal material, and includes a substrate and a positioning wall extending axially from the periphery of the hollow portion of the substrate and defining an accommodation space. The positioning unit is disposed on at least one of the heat dissipation base and the electrode holder, so that the heat dissipation base is embedded and fixed in the accommodating space of the electrode holder. The positioning unit may be at least one card-bump bump protruding from the inner wall surface of the positioning wall of the electrode holder, or It includes a flange that projects radially outward from the top surface of the heat sink base. The covering body is formed by injection molding, and the heat-dissipating base fixed to each other is combined with the electrode holder portion.

The existing LED package device, heat sink base and electrode holder combination and method thereof have the following defects and deficiencies:

1) The die passes through the stepped column-shaped heat sink base as the first heat sink. Since the columnar heat sink base does not directly contact the air to dissipate heat, and has a certain solid metal length, it requires a long metal conduction heat dissipation distance. The heat is emitted to the air, and the contact area of the heat dissipation base with the air is small, so the heat generated when the crystal grains emit light has a heat accumulation effect. In order to improve the heat dissipation performance, the heat dissipation base generally needs to design other heat dissipation materials such as metal or ceramics that are in direct thermal conduction contact with the heat dissipation base, and finally dissipate heat through the heat dissipation member. On the one hand, this method increases the distance of heat conduction and heat dissipation. On the other hand, since the heat dissipation base and the heat sink are divided into two parts, the two are bonded together with the thermal conductive glue, and there is still a huge thermal resistance. Basically, the temperature of the heat sink base is kept high, and the temperature of the heat sink is similar to the ambient temperature. The heat on the heat sink base is not quickly dissipated, and the heat dissipation effect is poor.

2) Since there are more columnar heat-dissipating pedestals and electrode holders, and the heat-dissipating parts are different parts, the parts have many complicated structures and thick thickness, which is not conducive to assembly and high cost; LED and layout circuit conductive layer The electrical connection needs to pass through the electrode holder, the structure is complicated, and the thermal resistance of the intermediate link is much, which reduces the luminous efficiency and heat dissipation efficiency of the LED chip.

Application No. 200720172030 discloses a package structure of a pin-type high-power LED device, including an LED chip, a lens, a printed PCB board, a metal heat sink body, a gold wire and a lead; the metal heat sink body includes a base and the base a boss on the seat, and the upper surface area of the base is at least twice the area of the upper surface of the boss; the printed PCB board is glued to the base; and the through hole is disposed on the base below the printed PCB board. The through-hole pin is electrically connected to the printed PCB board; the lens cover LED chip and the printed PCB board are adhered to the printed PCB board by a potting process. This high-power pin-type high-power LED device, although increasing the base area of the metal heat sink body, has a poor heat dissipation effect, even if a heat sink is additionally disposed, the heat on the LED chip must be conducted due to heat dissipation. The bump and the base are transferred to the metal heat sink body, and then transferred to the heat sink by the metal heat sink body. Since the heat transfer increases the intermediate link and the very long heat transfer path corresponding to the thick metal heat transfer body, the thermal resistance is high and the heat conduction effect is poor. There is also a lens to be attached to the printed PCB board by the cover, and then it is difficult to achieve the glue by the glue, because the lens is difficult to position accurately when the cover is pressed on the printed PCB, and the glue will be The lens is displaced and the lens position cannot be accurately defined. The pin is electrically connected to the layout circuit above the printed PCB board and passes through the printed PCB board and the metal heat sink body. The processing is complicated and the process is difficult. The electrical connection between the LED chip and the layout circuit on the printed PCB needs to pass through the electrode. The bracket has a complicated structure and many thermal resistances in the middle part.

In order to solve the heat dissipation problem of the integrated structure of the existing high-power LED, the COB (Chip on Board) package design of the LED integrated structure is proposed in the prior art. Compared with the existing bracket type LED integrated structure, since the invention directly fixes the chip on the substrate by silver glue or eutectic solder or the like, the thermal resistance of the intermediate portion can be minimized, thereby reducing the pn junction of the LED chip to the outside. The thermal resistance of the environment improves heat dissipation efficiency and luminous efficiency. The advantage of this COB (Chip on Board) package design is that the electrodes of each LED chip form an ohmic contact directly with the metal pad through the bonding electrode leads, and the formation of the multi-channel LED chip array is through the heat dissipation substrate and the LED chip. By connecting the devices electrically, the series and parallel connection of the LED chips can be realized, and the reliability and the pass rate of the products can be improved. Moreover, the outer shape is small, the thickness is thin, and the assembly is easy, and it can be used for occasions where the size of the light source assembly is high, such as illumination, display, and the like. There are several ways to design this package:

The invention patent of the application No. 200920112089. 5 discloses a device for a high-power LED street lamp of a C0B package, including a lens, a silicone, a gold wire, a chip, a heat sink, etc., and 5 to 50 convexities are arranged on the heat dissipation plate. The chip is directly fixed on the boss of the heat sink, and then radiated through the heat sink and the heat sink on the heat sink. The high-power LED street lamp of this structure has better heat dissipation effect. However, since there is no plastic lens for locating the lens or forming the lens, the positioning of the lens is not accurate, and the silicon dioxide is pre-pointed in the lens to encapsulate the chip. On the one hand, the amount of the silicone is large. In particular, with this packaging method, bubbles are generated after the curing of the packaged silica gel, which seriously affects the light-emitting quality of the LED chip, which causes the emitted light to have spots, shadows and other optical defects, which is not conducive to the optical secondary optimization development of the LED light source. In the invention patent No. 200820214808. X, a high-power LED package structure with high-efficiency heat-dissipating illumination is disclosed, which comprises a lens, a substrate and an LED light-emitting chip. The lens is fixed on the upper surface of the substrate, and the lower surface of the lens is provided with an upward convex surface. The recess is mounted, the LED light-emitting chip is placed on the upper surface of the substrate and the recessed cover is mounted, and the upper and lower negative-emitting electrodes are disposed on the upper surface of the substrate that is fastened by the mounting recess, and the light-emitting electrode and the LED light-emitting chip are connected by a metal wire, and the upper surface of the substrate The positive and negative connecting electrodes connected to the illuminating electrode are disposed, and the lower surface of the lens outside the mounting recess and the upper surface of the substrate are bonded by an annular adhesive layer, and the inner hole and the mounting recess formed in the adhesive layer are formed. The cavity is filled with silica gel, and a glue injection channel is formed on the substrate to communicate with the inner hole of the adhesive layer and the cavity formed by the mounting recess, and the lens and the substrate are both made of crystal crystal. The high-power LED package structure of this structure has the disadvantage that the fixing of the lens and the substrate is adhered by the adhesive layer, and the bonding is not firmly fixed; the second disadvantage is that the positioning mechanism of the positioning lens is not positioned when the lens is bonded to the substrate. The positioning is not accurate, and the position of the lens is easily deviated during the filling; the third disadvantage is that the lens is fixed on the substrate through the adhesive layer, the adhesive layer is easy to block the injection passage, affecting the injection of the silica gel; the disadvantage is that the LED is electrically connected to the LED light-emitting chip. The metal wire is electrically connected to the light-emitting electrode fixed on the substrate and disposed in the mounting recess of the lens, and the light-emitting electrode is electrically connected to the connecting electrode, and the connecting electrode is electrically connected to the conductive layer of the layout circuit, and the intermediate link is More thermal resistance, affecting heat dissipation efficiency and luminous efficiency.

In the invention patent No. 2004201 12507. 8, a high-power LED light-emitting diode is disclosed, which comprises an aluminum substrate, a silver paste, a wafer, a gold wire, and a reflective cover. The aluminum substrate has a convex-concave cup shape, that is, at the center thereof. The bottom surface has a circular groove, and a corresponding cup-shaped boss is arranged on the upper surface thereof, the plastic frame is arranged on the boss, the plastic frame is circular, the center is provided with a circular hole, and two grooves are concentrically opened with the circular hole. The inner and outer parts are composed of two high and low convex edges. The bottom surface is symmetrically provided with two cylindrical legs, and is installed in the circular holes on both sides of the cup-shaped boss. The curved surface of the reflective cover is smaller than the flat cover, and the lower edge is coated with glue. Glue water, packed in the groove of the plastic frame. The bottom of the plastic frame is coated with adhesive glue filled with glue. The distance between the illuminant wafer and the bottom surface of the reflective cover is small. The aluminum substrate may be in the shape of a plum or a circle. The assembly procedure of the patent is to first place the silver glue into the boss cup of the aluminum substrate, fix the wafer on the silver paste, and bake it in the oven for 145 C ° for 1 hour, then solder the gold wire to fix the lens. The negative electrode is respectively soldered on the positive and negative electrodes of the aluminum substrate with gold wire, and the plastic frame is The bottom surface is coated with adhesive glue, inserted into the positioning hole of the aluminum substrate, the glue is filled into the plastic frame for baking, and then the reflective cover is coated with adhesive glue, and can be used by being inserted into the groove of the plastic frame. One of the shortcomings of this patent is that the plastic frame and the aluminum substrate need to be fixed by adhesive glue, which is not resistant to high temperature in the subsequent packaging process, and the reliability of the fixing under high temperature conditions is greatly affected; There is no glue filling channel on the plastic frame. Fill the glue before filling the reflector. If the mold is not used, the shape of the glue cannot be controlled. If the mold is used to fill the glue, the cost is high. The third disadvantage is that the glue will be filled. The reflective cover is coated with adhesive glue and fixed in the groove of the plastic frame. On the one hand, the fixing is unreliable, the positional relationship is fixed inaccurately, and there is a gap between the reflective cover and the glue, and there is air in the gap, that is, reflection. There will be air inside the cover, which greatly affects the luminous effect of the LED. In addition, the aluminum substrate in the invention patent has a cup shape, and has only one boss on the upper surface, and the gold wire is electrically connected to the positive and negative electrodes of the aluminum substrate, and the positive and negative electrodes of the aluminum substrate are viewed from the text and the contents disclosed in the figure. It is not a conductive layer of the layout circuit, but a light-emitting electrode or a bracket type pin as disclosed in the 200820214808.

The existing heat dissipation problem of the LED integrated structure is improved by adding a cooling device, and it is common to use a cooling flow path to dissipate heat. In the utility model patent of the patent No. 200820134860. 4, a heat dissipation structure and an LED lamp having the heat dissipation structure are disclosed. The heat dissipation structure of the utility model comprises a cavity, a cooling solution is accommodated therebetween, and is provided with An even number of baffles are formed to form a channel, the channels being connected in an S-shape and having at least one row of hot zones, at least one heated zone, and at least one buffer zone. Although the utility model is provided with a cooling flow channel, neither the liquid cooling medium flow device is driven to make the liquid cooling medium in the flow channel exchange heat and cold quickly, and the heat removal zone is placed on both sides of the cavity, and the cooling flow channel contacts the light emitting diode. The flow channels on one side are not connected into one piece, so the liquid cooling medium in the flow channel is also difficult to use the different specific gravity of the liquid cooling medium to exchange the hot and cold liquid cooling medium. The cold heat exchange of the liquid cooling medium is mostly based on The heat conduction of the liquid cooling medium is exchanged, and the heat dissipation area of the heat-dissipating area disposed on both sides of the cavity is small. When the heat generated by the LED chip is dissipated into the liquid cooling medium, the heat of the liquid cooling medium itself is hard to be emitted. The cold and heat exchange of the liquid cooling medium is slow, so the cooling effect on the LED chip is not good. Utility model content

In order to solve the problem that the cooling device of the existing LED integrated structure has poor cooling effect and is uneconomical to use, the technical problem to be solved by the utility model is to provide a liquid cooling medium whose flow depends on different specific gravity and cooling of the cooling liquid of the hot and cold liquid. The medium does not need to be exchanged with the outside, the heat exchange is fast, the cooling efficiency is high, the cooling effect is good, and the structure is simple, and the LED integrated structure with the cooling device.

An LED integrated structure with a cooling device, comprising a heat dissipating substrate, an LED chip, and an LED chip fixed to the heat dissipating substrate, wherein the cooling device comprises a heat dissipating liquid receiving box disposed on a side of the heat dissipating substrate facing away from the LED chip, and sealed in the heat dissipating liquid a liquid cooling medium in the tank; the heat dissipating substrate isolates the LED chip from the liquid cooling medium and the back side of the LED chip is completely covered by the liquid cooling medium; the side of the heat dissipating substrate facing away from the LED chip is in direct contact with the liquid cooling medium and is sealed with the liquid cooling medium The liquid cooling medium contacting the heat dissipation substrate is connected in one piece.

As a first improvement of the first aspect, the cooling device further includes a refrigerating device, the heat dissipating liquid receiving box is disposed at an inclined or vertical horizontal plane, and the heat absorbing end of the refrigerating device is disposed at the top of the heat dissipating liquid receiving box.

As a second improvement of the first solution, a heat dissipating protrusion is disposed on an outer surface of the heat dissipating liquid receiving box, and a concave hole communicating with the heat dissipating liquid receiving box is disposed in the heat dissipating protrusion, and filling in the recessed hole There is a liquid cooling medium; the outer surface of the heat dissipating liquid receiving box and the outer surface of the heat dissipating protrusion are in contact with the air.

As an improvement of the third embodiment, the recessed holes in the heat dissipating protrusion are inclined or vertically horizontal, and the LED chip is placed under the heat dissipating liquid receiving box.

As an improvement of the third or fourth embodiment, the LED integrated structure further comprises a lens, a positioning lens or a plastic part of the molded lens, a conductive layer electrically connecting the wires of the LED chip electrode and the layout circuit of the electrical connection wire, wherein: the positioning lens Or a plastic element of the molded lens is provided with one or more first through holes, a fixing post is extended on an end surface of the plastic part of the positioning lens or the molding lens, and a second matching with the fixing column is arranged on the heat dissipation substrate. a through hole, the fixing post passes through the second through hole of the heat dissipation substrate, and a resisting portion is disposed at an end of the fixing post; the plastic piece of the positioning lens or the forming lens is fixed to the heat dissipating substrate through the fixing post and the resisting portion; the LED chip passes through the solid crystal The process is directly fixed on the heat dissipation substrate and placed in the corresponding first through hole; the conductive layer of the layout circuit extends into the sidewall of the first through hole and the LED Between the chips, the wire is placed in the first through hole, and one end of the wire is electrically connected to the electrode of the LED chip, and the other end of the wire is electrically connected to the conductive layer of the layout circuit between the first through hole and the LED chip.

As a first improvement of the fifth scheme, one or more bosses integrally formed with the heat dissipation substrate are disposed on the heat dissipation substrate, and the LED chip is directly fixed on the end surface of the boss by a die bonding process; the boss is placed correspondingly Inside the first through hole.

As a second improvement of the fifth scheme, the LED integrated structure further includes a PCB board, and the conductive layer of the layout circuit is directly disposed on the PCB board, and the third through hole that cooperates with the fixing post is disposed on the PCB board, and the fixing column passes through a third through hole on the PCB board and a fourth through hole on the heat dissipation substrate, and then the heat dissipation substrate and the PCB board are placed in a mold of the plastic part forming the positioning lens or the molding lens by heat, in forming the positioning lens or the molding lens The plastic part is formed with a resisting portion.

As a third improvement of the fifth scheme, the LED integrated structure further comprises an encapsulant for encapsulating the LED chip and the wire; the lens is fixed to the plastic of the positioning lens or the forming lens by tightly fitting with the first through hole or by a crimper. On the plastic part of the positioning lens or the molded lens, a glue injection channel for injecting the package colloid is disposed at a position corresponding to the first through hole, and the plastic port of the glue injection channel is placed on the positioning lens or the plastic part of the molding lens is away from the resisting portion. On the side end surface, the glue port and the glue injection channel communicate with the inner side wall of the first through hole; after the encapsulant is injected, the encapsulant further fixes the lens; and the mold is placed on the plastic part of the molded positioning lens or the molded lens by placing the heat dissipating substrate The resisting portion of the end of the fixing column is formed when the positioning lens or the plastic piece of the molded lens is formed.

As a fourth improvement of the fifth scheme, the lens is an encapsulation colloid for encapsulating the LED chip and the wire; and is formed by fixing the heat dissipating substrate into the mold of the plastic part forming the positioning lens or the molding lens when forming the positioning lens or the plastic part of the molding lens The abutment of the end of the column.

As a fifth improvement of the fifth scheme, the plastic component of the positioning lens or the molding lens is a plastic ring, and two or more independent plastic rings are fixed on the heat dissipation substrate.

As a sixth improvement of the fifth scheme, the plastic part of the positioning lens or the forming lens comprises a plastic ring and a connecting rib formed by injection molding together with a plastic ring connecting the set number of plastic rings, and a plastic for positioning the lens or the forming lens. The piece includes two or more plastic rings.

As a seventh improvement of the fifth scheme, the plastic part of the positioning lens or the forming lens is plate-shaped, Two or more first through holes are provided on the plastic member of the positioning lens or the molding lens. Compared with the prior art, the beneficial effects of the present invention are:

1. The heat dissipating liquid accommodating box can accommodate a large amount of liquid cooling medium in the heat dissipating liquid accommodating box, and the liquid cooling medium can meet the cooling requirement without exchanging with the external liquid cooling medium; the liquid cooling medium contacting the heat dissipating substrate The cooling medium contacting the heat-dissipating substrate is not separated, and the flow between the hot and cold liquids can be completed only by the different specific gravity of the hot and cold liquid, without any driving liquid flow device, and the structure is simple; the LED chip generates The heat is transferred to the heat dissipating substrate, and the liquid cooling medium absorbs the heat of the heat dissipating substrate to generate heat exchange flow through the heat transfer and the different specific gravity of the hot and cold liquid, so that the heat of the heat dissipating substrate is quickly taken away, so the heat exchange is faster, and the heat can be taken away more quickly. The heat generated by the LED chip is therefore in direct contact with the air than the heat sink substrate, and the cooling effect is better.

2. The heat dissipating liquid container is arranged at an inclined or vertical horizontal plane, and the heat absorbing end of the refrigerating device is placed at the top of the heat dissipating liquid accommodating box, so that the cold liquid cooling medium is always placed on the top layer of the heat dissipating liquid accommodating box, because cold The specific gravity of the cooling medium is greater than the specific gravity of the hot cooling medium, so that the liquid cooling medium in the heat dissipating liquid receiving box automatically and rapidly exchanges the hot and cold medium, so that the structure of the cooling device is simple, and there is no need to drive the cooling medium flowing device. This structure can be used primarily on LED backlights or other LED sources where the heat sink substrate is tilted or vertically horizontal.

3. The heat-dissipating protrusion increases the contact area with the air, and the liquid cooling medium is filled in the recessed hole of the heat-dissipating protrusion to increase the contact area between the liquid cooling medium and the heat-dissipating liquid container and the heat-dissipating protrusion. The liquid cooling medium in the heat dissipating liquid receiving box exchanges heat with the outside world faster, and the heat dissipating effect is better.

4. The temperature of the liquid cooling medium near the position of the LED chip is always higher than the temperature of the other liquid cooling medium. The LED chip is placed under the heat dissipating liquid container, so the high temperature cooling medium is always placed on the bottom layer of the liquid cooling box. The liquid cooling medium in the recessed hole of the heat dissipating portion has a very large contact area with the air due to the convex portion, and the heat dissipation is fast, so the temperature is always lower than the temperature of the liquid cooling medium at other positions. The concave hole in the heat dissipating protrusion is not parallel to the horizontal plane, because the specific gravity of the cold cooling medium is greater than the specific gravity of the hot cooling medium, so the liquid cooling medium in the heat dissipating liquid receiving box The exchange of the cooling medium is automatically and quickly generated, so that the structure of the cooling device is simple, and it is not necessary to drive the cooling medium flow device.

5. The LED chip is directly fixed on the heat dissipation substrate by the die bonding process, and the side of the heat dissipation substrate facing away from the LED chip is in direct contact with the heat dissipation gas or the heat dissipation liquid. The heat dissipation substrate of the structure is a thin plate, and the thickness of the heat dissipation substrate is generally in the range of 0. 2mm to 5mm. The COB (Chip on Board) package design of the LED integrated structure with cooling device is compared with the existing LED integrated structure with cooling device, because the LED chip is directly fixed by silver glue or eutectic solder or the like. On the heat-dissipating substrate, the heat generated by the operation of the LED chip passes through the thin heat-conducting layer of the heat-dissipating substrate to directly contact the heat-dissipating gas such as air or the heat-dissipating liquid, and the heat contacting the heat-dissipating substrate is rapidly flowed due to the difference in density of the hot-cold gas or liquid. Being taken away, thereby taking away the heat of the substrate, can minimize the thermal resistance of the intermediate link, and greatly reduce the heat transfer path distance of the pn junction heating portion of the LED chip to the external air environment or the heat dissipating liquid, thereby greatly reducing the thermal resistance.

6. Since the plastic parts are provided with positioning lenses or molding lenses, the conductive layer of the layout circuit can be inserted into the plastic parts of the positioning lens or the molding lens, and on the one hand, the wires can be directly connected to the conductive layer of the layout circuit, and no longer need The conductive wire is connected to the conductive layer of the layout circuit through the conductive metal bracket or through the wiring substrate from the heat dissipation substrate facing away from the LED chip and connected to the conductive layer of the layout circuit, thereby simplifying the structure and minimizing the thermal resistance of the intermediate link, and the heat dissipation effect On the other hand, it is no longer necessary to solder the metal bracket or the wiring pin to the electrical connection of the conductive layer of the layout circuit, and no reflow or wave soldering is required. Therefore, the encapsulant can be made of resin or silica gel; and the LED chip and the electrical connection can be ensured. The wire and its two soldered ends are not exposed to the air, which is beneficial for long life. When reflow soldering or wave soldering is required, since the temperature of reflow soldering or wave soldering is generally 250C or 280C, the encapsulant cannot be used. Since the price of silica gel is much higher than that of resin, the light transmittance is inferior to that of the resin, so that the cost can be further improved and the optical performance of the LED chip can be improved. The advantage of this COB package design is that the electrodes of each LED chip 2 directly form an ohmic contact with the conductive layer of the layout circuit through the bonding wires, and the formation of the multi-channel LED chip array is realized by the electrical connection device between the heat dissipation substrate and the LED chip. Electrical interconnection can realize series and parallel connection of LED chips, and can improve product reliability and production yield. 7. A plurality of chip fixing bosses integrally formed with the heat dissipation substrate are disposed on the heat dissipation substrate, and the area of the heat dissipation substrate is substantially larger than the area of the top of the chip fixing boss, and the LED chip is directly fixed on the chip fixing boss by the die bonding method. . In this way, the heat generated by the LED chip is greatly reduced in the intermediate path distance of the heat dissipating gas, that is, in the air or the heat dissipating liquid, and the contact area with the heat dissipating liquid and the dissipating gas is greatly increased, the heat accumulation effect is greatly reduced, and the heat dissipation can be greatly improved. Efficiency and keeping the chip at the proper operating temperature maintains long life and efficient luminous efficiency of the chip. The chip fixing boss and the heat dissipation substrate are integrally formed, so the heat generated by the chip is directly emitted into the air through the heat dissipation substrate, so the heat resistance is small, the heat dissipation speed is fast, and the heat dissipation is not required by the other heat sink, and the heat dissipation effect is quite good. Due to the chip fixing boss, the resistance of the electrical connection wire to the light emitted by the LED chip is minimized, which facilitates optical secondary optimization! The existing LED bracket is omitted, that is, the heat dissipation metal in the LED bracket is omitted. The multi-layer intermediate part, such as the metal foot of the electrode, avoids the high thermal resistance generated between the heat dissipating metal parts and the two parts of the heat dissipating substrate, so the thermal resistance is small, the heat conduction is fast, the heat dissipation effect is good, the structure is simple and reliable, especially the chip The integral forming of the fixing boss and the heat dissipating substrate is more advantageous for the design and assembly process of the light source, and the cost is saved. Therefore, the structure is simple and reliable, has few parts, is thin, and is easy to assemble, and is particularly suitable for occasions requiring high power for the light source.

8. When the conductive layer of the layout circuit is disposed on the PCB board, the plastic part of the positioning lens or the molding lens can fix the heat dissipation substrate and the PCB board together. The use of a PCB board facilitates the layout design of the circuit of the conductive layer of the layout circuit, eliminating the complicated manufacturing process of the original circuit layout over the heat dissipation substrate, and using a very mature PCB board, which greatly saves cost, The process is simplified and the reliability and design flexibility of the conductive layer of the layout circuit are improved. At the same time, the PCB board has a heat insulating effect, which is more favorable for the heat on the heat dissipation substrate to be radiated along the side in contact with the air.

9. The glue port of the glue injection channel is placed on the end surface of the plastic lens positioning member away from the resisting portion, and the glue injection channel communicates with the inner side wall of the plastic lens positioning member to facilitate the injection; since the plastic lens positioning member is a plastic piece, The glue and glue injection channels are easy to form. Before injecting the encapsulant, the lens is tightly fitted or fixed by the plastic lens positioning member, so that the lens is first fixed and repackaged, and the lens is not displaced when the LED chip is packaged, which is beneficial to the filling and curing process, especially Some are much more reliable by fixing the lens only by the adhesion of silicone or the like. When packaging the LED chip, first pass the chip through the solid The crystal method is fixed on the heat sink substrate fixing boss, and then the electrical connection wire is soldered, and then the lens is mounted, and the glue is injected through the glue injection port on the plastic lens positioning member in the vacuum environment, so the plastic lens positioning member can be realized. Precise mounting of the lens position during packaging, and curing of the lens, LED chip, electrical connection wire and its two soldering ends, the heat dissipating substrate and its chip fixing boss by vacuuming and injection molding, especially when packaging The structure can realize the bubble-free generation when the encapsulant colloid is cured in a vacuum environment, and plays an important role in ensuring the light-emitting quality of the LED chip, and does not cause the emitted light to have spots, shadows and other optical congenital defects; The optical congenital defects of the LED chip's luminous quality are more conducive to the optical secondary optimization development of the LED light source. The plastic lens positioning member makes the lens easy to install and realizes the lens mounting position to be accurately fixed and fixed reliably, and the light effect is concentrated to facilitate the optical Secondary optimization, finally achieving good optical effects, while plastic lens positioning parts and Mirror and the filling time of dispensing a small amount of silica gel, cost can be reduced.

10. The plastic part of the positioning lens or the forming lens fixes and fixes the heat dissipating substrate by placing the heat dissipating substrate in the mold of the plastic part forming the positioning lens or the molding lens to form the positioning lens or the plastic part of the molding lens, and the fixing is reliable. In the subsequent packaging process, it can withstand high temperatures, and the reliability of its fixation will not be affected under high temperature conditions. The plastic part of the positioning lens or the forming lens is fixed to the heat dissipating substrate by injection molding the positioning lens or the plastic part of the molding lens, thereby eliminating the installation process of mounting the positioning lens or the plastic part of the molding lens on the heat dissipation substrate. In the case where a plurality of positioning lenses or molded plastic parts are provided on one heat dissipating substrate, the production cost is greatly saved. On the other hand, the plastic parts of the positioning lens or the molding lens and the heat dissipating substrate do not exist in the axial direction and the radial direction. Gap, even the liquid cooling medium can directly contact the heat sink substrate, improve the cooling effect, and the fixing is very reliable. The positional relationship between the heat dissipating substrate and the positioning lens or the plastic part of the forming lens can be very precise, positioning lens or molding lens The lens mounting position on the plastic part can be very precise in size, thereby improving the optical effect of the LED integrated structure with the cooling device.

11. The chip is placed in a single plastic lens positioning ring. When forming a positioning lens or molding a plastic part of the lens, the amount of plastic is greatly reduced, and the cost is reduced. The lens is fixed on the plastic part of the positioning lens or the molding lens by tight fitting or hot pressing, so that the lens is first fixed and then packaged, and the LED is packaged. In the case of a chip, the lens does not shift, which is advantageous for the potting and curing process, and is particularly reliable than fixing the lens only by the adhesion of the silicone or the like.

12. All the plastic positioning rings on a heat dissipating substrate can be connected into an integral positioning lens or a molded plastic piece through a connecting rib during injection molding; or a part of the lens positioning ring on a heat dissipating substrate can be connected as a whole. A plastic part for positioning a lens or a molded lens at the time of injection molding, and two or more such positioning lenses or plastic parts for forming a lens are provided on one heat dissipating substrate. A chip fixing boss corresponds to a plastic lens positioning ring, and the plastic molding amount is small when the plastic lens positioning ring is formed, and the cost is low. The plastic lens positioning ring is connected as a whole through the connecting rib. The first is that when the plastic part of the positioning lens or the molding lens is injection molded, the mold gate can be disposed on the plastic lens positioning ring or the connecting rib to facilitate the mold gate. The arrangement is more favorable for the plastic filling balance in the mold during injection molding, and the plastic flow between the different plastic lens positioning rings is realized by the connecting ribs, which can reduce the number of mold gates and facilitate the design of the mold flow path, and a mold can be used. Two or more plastic lens positioning rings are formed by gates. For example, when the number of plastic lens positioning rings is small, only one plastic spline can be directly designed to form a plurality of plastic lens positioning rings. The second is Reducing the number of fixed columns does not require two or more fixing posts on each plastic positioning ring, which can reduce the manufacturing cost of the mold on the one hand, and can be used to form a positioning lens or a molded lens on the other hand. The plastic parts reduce the amount of plastic; the third is the same size of the plastic lens positioning ring, the fixed column can be designed The position of the contact point of the glue lens and the connecting ribs can increase the cross section of the fixing column. The fourth is for the plastic lens positioning ring of the same size, because the cavity of the cavity forming the adjacent lens positioning ring is connected to form a connection. The cavity of the rib, so that more plastic lens positioning rings can be arranged in a unit area, and the service life of the mold is longer; Fifth, the positional relationship between the plastic lens positioning ring and the plastic lens positioning ring is more precise and more reliable. , thereby making the positional relationship between the lenses more precise and improving the optical effect.

13. A heat-dissipating substrate may be provided with only one plate-shaped positioning lens or a plastic lens for forming a lens; or two or more plate-shaped positioning lenses or plastic parts for forming a lens may be provided on one heat-dissipating substrate. . The plastic part of the positioning lens or the forming lens is plate-shaped. The first is that when the positioning lens or the plastic part of the forming lens is injection molded, the mold gate design is more flexible, and the mold gate is convenient. The arrangement is more favorable for the plastic filling balance in the mold during injection molding; the second is to reduce the number of fixed columns and increase the cross section of the fixed column; the third is to install more lenses per unit area; The positional relationship between the lenses is more precise, improving the optical effect.

DRAWINGS

BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a perspective exploded view of Embodiment 1 of the present invention.

Figure 2 is a perspective exploded view of Embodiment 2 of the present invention.

3 is a perspective exploded view showing only a partial structure of Embodiment 3 of the present invention.

Fig. 4 is an enlarged view of a portion I of Fig. 3.

Fig. 5 is a perspective exploded view showing only a partial structure of Embodiment 4 of the present invention.

Figure 6 is a perspective exploded view showing only a partial structure of Embodiment 5 of the present invention.

Figure 7 is a perspective exploded view of Embodiment 6 of the present invention.

Figure 8 is a perspective exploded view showing only a partial structure of Embodiment 6 of the present invention.

Figure 9 is a perspective exploded view of Embodiment 7 of the present invention.

Example 1

As shown in FIG. 1 , an LED integrated structure with a cooling device includes a cover plate 1 , a reflector 2 , a heat dissipation substrate 3 , an LED chip 4 , a lens 5 , a lens positioning ring 6 , and an electrode electrically connected to the LED chip 4 . The gold wire 7 and the patterned circuit conductive layer 8 electrically connecting the gold wire 7 and the encapsulant 9 for encapsulating the LED chip 4 and the gold wire 7.

The cooling device includes a heat dissipating member 10 provided on the side of the heat dissipating substrate 3 facing away from the LED chip, and a liquid-sealed heat dissipating liquid container formed by the liquid accommodating space 11 of the heat dissipating member 10 and the heat dissipating substrate 3, A liquid cooling medium sealed in a heat dissipating liquid container. The heat dissipation substrate 3 isolates the LED chip from the liquid cooling medium and the back surface of the LED chip is completely covered by the liquid cooling medium, and the liquid cooling medium contacting the heat dissipation substrate 3 is connected in one piece. The side of the heat-dissipating substrate 3 facing away from the LED chip is in direct contact with the liquid cooling medium and is hermetically sealed with the liquid cooling medium. A heat dissipating projection 12 is formed on the outer surface of the heat dissipating member 10, and a recessed hole 23 communicating with the liquid accommodating space 11 is provided in the heat dissipating projection 12, and the liquid cooling medium is filled in the recessed hole 23. The outer surface of the heat sink 10 and the outer surface of the heat dissipation projection 12 are in contact with air. The recessed hole 23 in the heat radiating projection 12 is suspended Straight water level, the LED chip is placed under the heat sink 10.

The reflection plate 2 is placed on the heat dissipation substrate 3, the cover plate 1 is placed on the reflection plate 2, and the heat dissipation substrate 3 is placed on the heat dissipation member 10. A through hole 13 corresponding to the lens 5 is provided on the reflecting plate 2, and a reflecting cover 14 corresponding to the lens 5 is mounted on the cover 1. The heat sink 10 is a heat conductive heat sink.

The lens positioning ring 6 is made of high temperature resistant PPA plastic. A positioning lens 5 and a first through hole 15 covering the encapsulating body 9 are disposed on the lens positioning ring 6. The fixing post 16 is extended on the lens positioning ring 6, and the heat dissipating substrate 3 is placed at the end of the fixing post 16. The mold portion of the molded lens positioning ring 6 is formed with a resisting portion 17 when the plastic positioning ring is formed, and the fixing post 16 and the heat dissipating substrate 3 are fluidly sealed. A glue injection channel 18 for injecting the encapsulant 9 is disposed on the lens positioning ring 6. The glue port 19 of the glue injection channel 18 is placed on the end surface of the lens positioning ring 6 away from the resisting portion, and the glue port 19 and the glue injection channel 18 are The side walls of the first through holes 15 are in communication.

The heat dissipating substrate 3 is stamped from a sheet metal or a metal alloy of a high thermal conductivity material, and may be made of stainless steel, copper, tungsten, aluminum, aluminum nitride, chromium or the like or an alloy thereof. The heat dissipating substrate 3 includes a flat bottom plate, and a plurality of chip fixing bosses 20 protruding from the heat dissipating substrate 3, and corresponding to each of the chip fixing bosses 20, a second through hole that is matched with the fixing post 16 twenty one. The chip fixing boss 20 has a circular cross section, and the cross-sectional area of the bottom plate is much larger than the cross-sectional area of the chip fixing boss 20, at least three times or three times the area of the cross section of the chip fixing boss 20. the above. On the top of the chip fixing boss 20, a recess portion 22 for arranging the LED chip 4 concentrically with the chip fixing boss 20 is provided, and the bottom surface of the recess portion 22 is a plane on which the LED chip 4 is placed. On the side of the heat dissipation substrate 3 facing away from the chip fixing boss 20, a heat dissipation blind hole (not shown) disposed in the chip fixing boss 20 concentric with the chip fixing boss 20 is provided. The side of the heat dissipation substrate 3 facing away from the chip fixing boss 20 is in direct contact with the cooling water.

The fixing post 16 of the lens positioning ring 6 passes through the second through hole 21 of the heat dissipation substrate 3, and is fixed by the heat dissipation substrate 3 through the abutting portion 17 of the end of the fixing post 16, so that the heat dissipation substrate 3 and the lens positioning ring 6 are fixed together. The chip fixing boss 20 is disposed in the first through hole 15 of the corresponding lens positioning ring 6, and the conductive layer 8 of the layout circuit is directly disposed on the side of the heat dissipation substrate 3 facing the boss 20, and the conductive layer 8 of the layout circuit extends into the first Between the inner side wall of a through hole 15 and the outer side wall of the chip fixing boss 20, the LED chip 4 is directly fixed on the end surface of the chip fixing boss 20 by a die bonding process, the gold wire 7 is placed in the lens positioning ring 6, the gold wire 7-end is electrically connected with the electrode of the LED chip 4, and the other end of the gold wire 7 is extended. The patterned circuit conductive layer 8 in the lens positioning ring 6 is electrically connected; the lens 5 is mounted on the lens positioning ring 6 and is tightly coupled to the lens positioning ring 6. The lens 5 is further fixed by the encapsulant 9 injected through the glue port 19 and the glue injection channel 18.

Example 2

As shown in Fig. 2, unlike Embodiment 1, an LED integrated structure with a cooling device further includes a PCB board 60. The lens positioning ring 61 is made of high temperature resistant PP0+GF plastic. The heat dissipation substrate 66 is die-cast from a ceramic of high thermal conductivity. The patterned circuit conductive layer 62 is disposed directly on the PCB board 60, and the patterned circuit conductive layers 62 are distributed on the same plane. Each of the chip fixing bosses 63 on the PCB board 60 is provided with a fourth through hole 64 that cooperates with the chip fixing boss 63 and a third through hole 65 that cooperates with the fixing post 68. The PCB board 60 is disposed on the heat dissipation substrate 66. One side of the chip fixing boss 63 is in direct contact with the heat dissipation substrate 66, and the PCB board 60 is provided with a contact surface on which the conductive layer 62 of the layout circuit faces away from the contact heat dissipation substrate 66.

The chip fixing boss 63 of the heat dissipation substrate 66 passes through the fourth through hole 64 of the PCB board 60. The fixing post 68 of the lens positioning ring 61 passes through the third through hole 65 of the PCB board 60 and the second through hole of the heat dissipation substrate 66. 67 is liquid-tightly sealed with the second through hole 67, and the resist portion 69 is formed by the end portion of the heat-fusible fixing post 68 and fixed to the PCB board 60 and the heat dissipation substrate 66.

Example 3

As shown in FIGS. 3 and 4, unlike the second embodiment, the plastic lens positioning ring 101 is integrally connected by the connecting ribs 102. An R color LED chip 108, a G color LED chip 109, and a B color LED chip 110 are fixed in the top recess portion 104 of the chip fixing boss 103 by a die bonding process. When the heat dissipation substrate 100, the PCB board 123 and the plastic lens positioning ring 101 are fixed together, the chip fixing boss 103 is placed in the first through hole 124 corresponding to the plastic lens positioning ring 101, and the layout circuit is disposed on the PCB board 123. The conductive layers 112, 114, 116, 118, 120, 122 extend between the inner sidewall of the first via 124 and the outer sidewall of the chip mounting boss 103 and are independent of each other, the gold wires 1 11 , 113 , 115 , 117 , 119, 121 are placed in the first through hole 124. The positive pole of the R color LED chip 108 The gold-plated wire 111 is electrically connected to the first patterned circuit conductive layer 112 extending between the inner side wall of the first through hole 124 and the outer side wall of the chip fixing boss 103, and the negative electrode of the R-colored LED chip 108 passes through the gold wire 113. The patterned circuit conductive layer 114 is electrically connected to the inner side wall of the first through hole 124 and the outer side wall of the chip fixing boss 103. The positive electrode of the G-color LED chip 109 is electrically connected to the patterned circuit conductive layer 116 extending between the inner side wall of the first through hole 124 and the outer side wall of the chip fixing boss 103 through the gold wire 115. The G color LED chip 109 The negative electrode is electrically connected to the patterned circuit conductive layer 118 between the inner side wall of the first through hole 124 and the outer side wall of the chip fixing boss 103 through the gold wire 117. The positive electrode of the B color LED chip 110 is electrically connected to the patterned circuit conductive layer 120 between the inner sidewall of the first through hole 124 and the outer sidewall of the chip fixing boss 103 through the gold wire 119, and the B color LED chip 110 The negative electrode is electrically connected to the patterned circuit conductive layer 122 between the inner side wall of the first through hole 124 and the outer side wall of the chip fixing boss 103 through the gold wire 121.

Example 4

As shown in FIG. 5, unlike the second embodiment, the plastic lens positioning member is a lens positioning plastic plate 150, and the number of the lens positioning plastic plates 150 is one. On the lens positioning plastic plate 150, six chip fixing bosses 152 for the heat dissipating substrate 151 are provided with a first through hole 153 for positioning the lens 154 and covering the encapsulant 158. The lens 154 is fixed in the first through hole 153 by a tight fit. A fixing post 155 is extended on the end surface of the lens positioning plastic plate 150. When the heat dissipating substrate 351 and the PCB board 156 are placed in the mold of the molding lens positioning plastic plate 150 at the end of the fixing post 155, the plastic lens 150 is positioned by the molding lens. A resisting portion 157 is formed. The lens positioning plastic plate 150 is provided with a glue injection channel 159 for injecting the encapsulant 158. The glue port 160 of the glue injection channel 159 is placed on the end surface of the lens positioning plastic plate 150 away from the resisting portion, the glue port 160 and the glue injection channel. 159 is in communication with the sidewall of the first through hole 153.

Example 5

As shown in FIG. 6, different from Embodiment 1, an LED integrated structure with a cooling device includes a heat dissipation substrate 200, an LED chip 201, a lens 202, a plastic lens molding ring 203, and a wire 204 electrically connecting the electrodes of the LED chip 201. And a patterned circuit conductive layer 205 that electrically connects the wires 204. The heat dissipation substrate 200 is die-cast from a ceramic of high thermal conductivity. The heat dissipation substrate 200 includes a flat plate shape The bottom plate 21 1 and the plurality of bosses 212 of the protruding bottom plate 21 1 formed integrally with the heat dissipation substrate 200 are provided with a second through hole 213 corresponding to the fixing post 207 corresponding to each of the bosses 212 . The patterned circuit conductive layer 205 is disposed directly on the heat dissipation substrate 200, and the patterned circuit conductive layers 205 are distributed on the same plane. The lens 202 is placed in the through hole 206 of the plastic lens forming ring and fixed to the plastic lens forming ring, and the lens 202 encapsulates the LED chip 201 and the wire 204.

Example 6

As shown in FIGS. 7 and 8, unlike the fifth embodiment, the heat dissipation substrate 250 is not provided with a chip fixing boss, and the heat dissipation substrate 250 is a flat plate, and the LED chip 254 is directly fixed on the heat dissipation substrate 250.

The cooling device includes a heat dissipating member 251 disposed on the side of the heat dissipating substrate 250 facing away from the LED chip 254, a liquid accommodating space of the heat dissipating member 251, and a liquid-sealed heat dissipating liquid accommodating box formed by the heat dissipating substrate 250 (not Shown), a liquid cooling medium sealed in the heat dissipating liquid receiving box, a refrigerating device 252, and a heat sink 253. The heat sink substrate 250 isolates the LED chip 254 from the liquid cooling medium and the back side of the LED chip 254 is completely covered by the liquid cooling medium, and the liquid cooling medium contacting the heat sink substrate 250 is connected in one piece. The side of the heat sink substrate 250 facing away from the LED chip 254 is in direct contact with the liquid cooling medium and is liquid-tight with the liquid cooling medium. The heat dissipating liquid container is vertically arranged, and the heat absorbing end of the refrigerating device 252 is placed on the top of the heat dissipating liquid receiving box, and the heat generating end is attached to the heat sink 253.

Example 7

As shown in FIG. 9, an LED integrated structure with a cooling device includes a heat dissipation substrate, an LED chip (not shown), and the LED chip is fixed to the heat dissipation substrate 301. The cooling device includes a heat dissipating member 303 disposed on the side of the heat dissipating substrate 301 facing away from the LED chip, and a liquid accommodating space 302 formed by the liquid accommodating space 302 of the heat dissipating member 303 and the heat dissipating substrate 301. A liquid cooling medium sealed in a heat dissipating liquid container. The heat dissipation substrate 301 isolates the LED chip from the liquid cooling medium and the back surface of the LED chip is completely covered by the liquid cooling medium, and the liquid cooling medium contacting the heat dissipation substrate 301 is connected in one piece. The side of the heat dissipation substrate 301 facing away from the LED chip is in direct contact with the liquid cooling medium and is liquid-tightly sealed with the liquid cooling medium. The outer surface of the heat sink 303 is empty Gas contact.

The invention is not limited to the above embodiments. The shape of the heat dissipating substrate of the utility model can be designed according to the needs of various shapes, and can even be designed as a product appearance piece. The utility model only shows a schematic illustration of a part of the LED chip unit. The number of chip fixing bosses in the utility model can be from one to many, and the utility model only exemplifies several LED integrated structural units with cooling devices. The conductive layer of the layout circuit in the present invention is only illustrative. On one chip fixing boss, one LED chip can be fixed, or two different color LED chips can be fixed, three R, G, B different color chips, or more than three chips. When the number of chips is different, the design of the conductive layer of the layout circuit is modified accordingly, which belongs to the prior art, and the present invention will not be described in detail. The PCB board may also be provided with a conductive layer of the layout circuit on both sides, as long as the surface of the conductive layer on the side in contact with the heat dissipation substrate is insulated from the heat dissipation substrate. The LED chip can be directly fixed on the heat dissipation substrate, or fixed in a recess formed integrally with the heat dissipation substrate, or fixed on the heat dissipation substrate by other means, that is, the cooling device of the present invention is applicable to all LED integration. The structure only needs to be sealed by the heat-dissipating substrate liquid. Since it is not a utility model of the present invention, it will not be discussed in detail in the present invention.

Claims

Claim

An LED integrated structure with a cooling device, comprising a heat dissipating substrate, an LED chip, and an LED chip fixed to the heat dissipating substrate, wherein: the cooling device comprises a heat dissipating liquid receiving box disposed on a side of the heat dissipating substrate facing away from the LED chip, a liquid cooling medium sealed in the heat dissipating liquid receiving box; the heat dissipating substrate isolates the LED chip from the liquid cooling medium and the back surface of the LED chip is completely covered by the liquid cooling medium; the side of the heat dissipating substrate facing away from the LED chip is in direct contact with the liquid cooling medium The liquid cooling medium is sealed with the liquid cooling medium, and the liquid cooling medium contacting the heat dissipation substrate is connected into one piece.

2. The LED integrated structure with a cooling device according to claim 1, wherein: the cooling device further comprises a refrigerating device, wherein the heat dissipating liquid receiving box is arranged in an inclined or vertical horizontal plane, and the heat absorbing end of the refrigerating device is placed The heat sink is placed on top of the box.

3. The LED integrated structure with a cooling device according to claim 1, wherein: a heat dissipating protrusion is extended on an outer surface of the heat dissipating liquid receiving box, and is disposed in the heat dissipating protrusion. The recessed hole communicating with the heat dissipating liquid receiving box is filled with the liquid cooling medium in the recessed hole; the outer surface of the heat dissipating liquid receiving box and the outer surface of the heat dissipating protrusion are in contact with the air.

4. The LED integrated structure with a cooling device according to claim 3, wherein: the recessed holes in the heat dissipating protrusion are inclined or vertically horizontal, and the LED chip is placed under the heat dissipating liquid receiving box.

5. The LED integrated structure with a cooling device according to claim 3 or 4, wherein the LED integrated structure further comprises a lens, a positioning lens or a plastic part of the molded lens, and a wire and a wire electrically connecting the electrodes of the LED chip. a conductive layer of a patterned circuit connecting the wires, wherein: one or more first through holes are formed in the plastic part of the positioning lens or the molded lens, and extending on an end surface of the plastic part of the positioning lens or the molded lens a fixing post, a second through hole that is matched with the fixing post on the heat dissipating substrate, the fixing post passes through the second through hole of the heat dissipating substrate, and a resisting portion is disposed at an end of the fixing post; the plastic piece for positioning the lens or the forming lens The fixing chip and the resisting portion are fixed to the heat dissipating substrate; the LED chip is directly fixed on the heat dissipating substrate by the die bonding process, and is placed in the corresponding first through hole; the conductive layer of the layout circuit extends into the sidewall of the first through hole and Between the LED chips, the wire is placed first In the through hole, one end of the wire is electrically connected to the electrode of the LED chip, and the other end of the wire is electrically connected to the conductive layer of the layout circuit between the first through hole and the LED chip.

6. The LED integrated structure with a cooling device according to claim 5, wherein: one or more bosses integrally formed with the heat dissipation substrate are disposed on the heat dissipation substrate, and the LED chip passes through a die bonding process. Directly fixed on the end surface of the boss; the boss is placed in the corresponding first through hole.

7. The LED integrated structure with a cooling device according to claim 5, wherein: the LED integrated structure further comprises a PCB board, and the conductive layer of the layout circuit is directly disposed on the PCB board, and is disposed on the PCB board. a third through hole that cooperates with the fixing post, the fixing post sequentially passes through the third through hole on the PCB board and the fourth through hole on the heat dissipation substrate, and then the heat dissipation substrate and the PCB board are placed in the forming positioning lens or the molding lens by heat In the mold of the plastic part, a resisting portion is formed when forming the positioning lens or the plastic part of the molded lens.

8. The LED integrated structure with a cooling device according to claim 5, wherein: the LED integrated structure further comprises an encapsulant for encapsulating the LED chip and the wire; and the lens is tightly matched with the first through hole or It is fixed by hot pressing on the plastic part of the positioning lens or the forming lens by the edger; the plastic injection part of the positioning lens or the molded lens is provided with a glue injection channel for injecting the encapsulation colloid, and the glue of the glue injection channel. The mouth is placed on the end face of the positioning lens or the molded lens away from the resisting portion, and the glue port and the glue injection channel communicate with the inner side wall of the first through hole; after the encapsulant is injected, the encapsulant further fixes the lens; The heat dissipating substrate is placed in a mold of the plastic part forming the positioning lens or the molding lens to form a resisting portion at the end of the fixing post when forming the positioning lens or the plastic part forming the lens.

9. The LED integrated structure with a cooling device according to claim 5, wherein: the lens is an encapsulant for encapsulating the LED chip and the wire; and the plastic member is placed on the positioning lens or the molded lens by placing the heat dissipating substrate The mold is formed by forming a positioning lens or a plastic part of the molded lens to form a resisting portion at the end of the fixing column.

10. The LED integrated structure with a cooling device according to claim 5, wherein: the plastic part of the positioning lens or the forming lens is a plastic ring, and two or more of them are fixed on the heat dissipating substrate. The plastic ring described.

11. The LED integrated structure with a cooling device according to claim 5, wherein: the plastic part of the positioning lens or the forming lens comprises a plastic ring and a plastic connecting the set number of plastic rings. The plastic joints of the ring injection molded joint, the positioning lens or the molded lens include two or more plastic rings.

12. The LED integrated structure with a cooling device according to claim 5, wherein: the plastic part of the positioning lens or the forming lens is in the shape of a plate, and two of the plastic parts of the positioning lens or the forming lens are provided. Or two or more first through holes.