WO2012091252A1

WO2012091252A1 - Front and back surface field solar cell and a production method therefor

Info

Publication number: WO2012091252A1
Application number: PCT/KR2011/007253
Authority: WO
Inventors: 이준성; 양수미; 송석현; 정상윤; 안수범; 이경원; 주상민
Original assignee: 현대중공업 주식회사
Priority date: 2010-12-31
Filing date: 2011-09-30
Publication date: 2012-07-05

Abstract

The front and back surface field solar cell according to the present invention comprises: a p-type silicon substrate; an emitter provided on the upper stratum of the substrate; a floating contact layer provided on part of the area formed by the emitter; a reflection-preventing film provided on the emitter and floating contact layer upper stratum; and a front surface electrode which makes contact with the emitter; wherein the floating contact layer does not make contact with the front surface electrode.

Description

Front and back side field solar cell and manufacturing method thereof

The present invention relates to a front-side front-side solar cell and a method for manufacturing the same, and more particularly, by forming a floating junction layer in the emitter and the back-field layer, it is possible to reduce the recombination loss of the photo-generated transporter and increase the collection efficiency It is an object of the present invention to provide a front-side and back-side solar cell and a method of manufacturing the same.

A solar cell is a key element of photovoltaic power generation that converts sunlight directly into electricity, and is basically a diode composed of a p-n junction. In the process of converting sunlight into electricity by solar cells, when solar light enters into the silicon substrate of the solar cell, electron-hole pairs are generated, and electrons move to n layers and holes move to p layers by the electric field. Thus, photovoltaic power is generated between the pn junctions, and when a load or a system is connected to both ends of the solar cell, current flows to generate power.

The light-receiving surface of the conventional solar cell forms an n + type emitter and forms a p-n junction with a p-type silicon substrate. Photogenerated carriers inside the silicon substrate are separated by p-n junctions, so that the electrons, the minority carriers, move to the front with n + -type emitters, and the holes, the majority carriers, move to the backside with p + backfields. Since the n + -type emitter is formed by the diffusion of phosphorus from the surface in the depth direction, the concentration of phosphorus on the surface is high and the conduction band of the energy band is lowered toward the surface, so that few carrier electrons move to the surface.

Since the surface is a region with a high density of defects in which a large number of crystal defects and impurities exist, the probability of recombination is very high. The surface recombination rate of minority carriers is governed by the surface passivation properties of the dielectric layer thin film, such as PECVD SiNx. In general, even when a dielectric layer thin film is formed on the rear surface or a structure in which a p + backside electric field is combined, holes of many carriers move to the rear surface, and thus, the recombination rate of the rear surface needs to be lowered depending on the passivation characteristics through the deposition of the dielectric layer thin film.

As the doping concentration in the doping layer increases toward the surface, the minority carrier electrons moving to the n + type emitter or the multiple carrier holes moving to the p + type backfield move to the respective surfaces due to the energy band structure. And since the photogenerated carriers must move along the surface with a high density of defects until they are collected at the electrode, the probability of extinction by recombination increases. In order to suppress surface recombination of photogenerated transporters to the surface, the dielectric layer thin film is deposited on the surface to reduce defect density or to reduce the recombination rate as a field effect due to fixed charge in the dielectric layer film. Done.

1 is a cross-sectional view of a conventional solar cell. Referring to FIG. 1, in the conventional solar cell structure, a p-n junction is formed on a light receiving surface. In general, due to the higher doping concentration toward the surface and the lower energy level on the surface side, the electron band must move to the surface due to the energy bandgap structure, and must face a surface with a high density of defects, and can be greatly influenced by the front passivation characteristics. There is nothing else. On the other hand, the holes moved to the rear side pass through the defect where silicon / metal interface is many.

The p + region (rear field region), which is a region where p-type impurity ions are implanted in the rear surface of the p-type silicon substrate, and the n + region (emitter region), which is an region where n-type impurity ions are implanted by thermal diffusion in the front surface of the substrate do. In addition, a metal electrode is formed on the entire surface of the p + region of the silicon substrate. At this time, electrons as majority carriers move to the emitter region by diffusion, and holes as minority carriers move to the backfield region along the p + region.

However, this structure has no difference in the doping concentration of each part in the doping layer of the front and back field and the emitter, and the heat diffusion in the high-temperature electric furnace takes a high temperature process and a long time, many carriers in the back field and the emitter There is a need to facilitate the collection of phosphorus electrons, to induce smooth movement of holes, which are minority carriers, and to further reduce recombination between the electrons and holes.

The present invention has been made to solve the above problems, and in forming a back field layer at an upper layer of an emitter and a lower layer of a substrate, a floating junction layer having different doping concentrations in each emitter region and a back field region. It is an object of the present invention to provide a front-side and back-side solar cell and a method for manufacturing the same.

In accordance with an embodiment of the present invention, a front-side surface field solar cell includes a p-type silicon substrate, an emitter (n ++) provided at an upper portion of the substrate, and an area where the emitter (n ++) is formed. It includes a floating bonding layer (p +) provided in a part, an antireflection film provided in the upper portion of the emitter (n + +) and the floating bonding layer (p +), and the front electrode in contact with the emitter (n + +), The floating bonding layer p + is not in contact with the front electrode.

The anti-reflection film may be an Al ₂ O ₃ dielectric layer thin film.

The anti-reflection film may be an AlN dielectric layer thin film.

According to another embodiment of the present invention, a front-side front-side solar cell includes a p-type silicon substrate, a back side electric field layer (p +) provided at a lower portion of the substrate, and a floating portion provided in a part of the region in which the backside field layer (p +) is formed. And a back electrode in contact with the junction layer (n +) and the back field layer (p +), wherein the floating junction layer (n +) is not in contact with the back electrode.

The front-side and back-side solar cell further includes a selective back-field layer (p ++) that is heavily doped in the back-field layer (p +), and the selective back-field layer (p ++) is in contact with the back electrode. can do.

According to still another aspect of the present invention, there is provided a front and rear surface field solar cell including a p-type silicon substrate, a first emitter (n ++) provided on an upper portion of the substrate, and a part of a region in which the emitter (n ++) is formed. The anti-reflection film provided on the floating junction layer (p +), the upper layer of the emitter (n ++) and the first floating junction layer (p +), the front electrode in contact with the emitter (n ++), and the lower substrate It includes a back field layer (p +), a second floating junction layer (n +) provided in a part of the region formed with the back field layer (p +), and a back electrode in contact with the back field layer (p +) and The first floating bonding layer p + is not in contact with the front electrode, and the second floating bonding layer n + is not in contact with the back electrode.

The anti-reflection film may be an Al ₂ O ₃ dielectric layer thin film.

The anti-reflection film may be an AlN dielectric layer thin film.

According to an embodiment of the present invention, there is provided a method of manufacturing a front-back front-side solar cell, in which a emitter (n ++) is provided at an upper layer of a p-type silicon substrate. Forming a floating junction layer (p +) on a portion of the formed region, forming an antireflection film on the emitter (n ++) and the floating junction layer (p +), and contacting the emitter (n ++) with the front surface And forming an electrode, wherein the floating bonding layer p + is not in contact with the front electrode.

According to another aspect of the present invention, there is provided a method of manufacturing a front and back surface field solar cell, wherein the back surface field layer (p +) is provided in the method of manufacturing a front and back surface field solar cell having a back surface layer (p +) disposed under a p-type silicon substrate. Forming a floating junction layer (n +) on a portion of the formed region, forming a rear passivation layer on the rear field layer (p +) and the floating junction layer (n +), and on the rear passivation layer And forming a rear electrode so as to contact the rear electric field layer p +, wherein the floating junction layer n + is not in contact with the rear electrode.

In another embodiment of the present invention, there is provided a method of manufacturing a front-back front-side solar cell, in which the back-side front layer solar cell (p +) is provided at a lower layer of a p-type silicon substrate. forming a floating junction layer (n +) in a portion of the region where p + is formed, and forming a selective backfield layer (p ++) that is heavily doped in a portion of the region in which the region is formed; Forming a back passivation layer on the back field layer (p +) and the floating junction layer (n +), and forming a back electrode on the back passivation layer to contact the optional back field layer (p ++). The floating junction layer n + is not in contact with the back electrode.

According to another embodiment of the present invention, a method of manufacturing a front-back front-side solar cell includes an emitter (n ++) at an upper layer of a p-type silicon substrate, and a front-rear surface having a rear electric field layer (p +) at a lower layer of the substrate. In the method of manufacturing an electric field solar cell, the step of forming a first floating junction layer (p +) in a part of the region where the emitter (n + +) is formed, the emitter (n + +) and the first floating junction layer (p +) Forming an anti-reflection film on the substrate, forming a front electrode to be in contact with the emitter (n ++), and forming a second floating junction layer (n +) in a portion of the region in which the back field layer (p +) is formed Forming a back passivation layer on the back field layer (p +) and a second floating junction layer (n +), and a back electrode on the back passivation layer to contact the back field layer (p +). And forming the first floating junction layer p +. Without contacting the front electrode, the second rich bonding layer (n +) is characterized in that which is not in contact with the back contact.

According to another embodiment of the present invention, a method of manufacturing a front-back front-side solar cell includes an emitter (n ++) at an upper layer of a p-type silicon substrate, and a front-rear surface having a rear electric field layer (p +) at a lower layer of the substrate. In the method of manufacturing an electric field solar cell, the step of forming a first floating junction layer (p +) in a part of the region where the emitter (n + +) is formed, the emitter (n + +) and the first floating junction layer (p +) Forming an anti-reflection film on the substrate, forming a front electrode to be in contact with the emitter (n ++), and forming a second floating junction layer (n +) in a portion of the region in which the back field layer (p +) is formed And forming a highly doped selective backside field layer (p ++) in a portion of the region where the backside field layer (p +) is formed, and the backside field layer (p +) and the second floating junction layer (n +). Forming a back passivation layer on the back surface, and the selection on the back passivation layer And forming a rear electrode so as to contact the rear electric field layer p ++, wherein the first floating junction layer p + is not in contact with the front electrode, and the second floating junction layer n + is formed on the back electrode. It is characterized in that it does not contact the back electrode.

In order to achieve the above object, a front and back surface field solar cell according to another exemplary embodiment of the present invention is deposited on a p-type silicon substrate, an emitter (n +) provided at an upper portion of the substrate, and the emitter (n +). And a floating junction layer (p +) having a pattern structure, an antireflection film provided on the floating junction layer (p +), and a front electrode contacting the emitter (n +). (p +) is not in contact with the front electrode.

The floating bonding layer p + may be an amorphous silicon (a-Si) thin film layer.

The floating bonding layer p + may have a thickness of less than 30 nm.

The emitter (n +) is 80 to 150 Ω / sq. It can be characterized by having a sheet resistance of.

The emitter (n +) may have a thickness of 0.3 μm or less.

The anti-reflection film may be an Al ₂ O ₃ dielectric layer thin film.

The anti-reflection film may be an AlN dielectric layer thin film.

In accordance with still another aspect of the present invention, there is provided a front and back surface field solar cell including a p-type silicon substrate, an emitter (n +) provided at an upper portion of the substrate, and a pattern structure formed by being deposited on the emitter (n +). 1 an anti-reflection film provided on the floating bonding layer (p +) and the first floating bonding layer (p +). A front electrode in contact with the emitter (n +), a back field layer (p ++) provided on the lower layer of the substrate, and a second floating junction layer (n +) having a pattern structure deposited and provided on the back field layer (p ++) ) And a back electrode in contact with the backside electric field layer (p ++), wherein the first floating junction layer (p +) does not contact the front electrode, and the second floating junction layer (n +) is It is characterized in that it does not contact the back electrode.

The backside field layer p ++ may be a local high concentration doping layer disposed at a point corresponding to the backside electrode.

The front and rear surface field solar cells may further include a low concentration back surface field layer (p +) at a lower layer of the substrate.

The first floating junction layer p + and the second floating junction layer n + may be an amorphous silicon (a-Si) thin film layer.

The first floating bonding layer p + may have a thickness of less than 30 nm.

The emitter (n +) may have a thickness of 0.3 μm or less.

The anti-reflection film may be an Al ₂ O ₃ dielectric layer thin film.

The anti-reflection film may be an AlN dielectric layer thin film.

On the other hand, according to another embodiment of the present invention, the manufacturing method of the front and back surface field solar cell is a method of manufacturing a front and back surface field solar cell having an emitter (n +) in the upper layer of the p-type silicon substrate, depositing and patterning a p + type amorphous silicon thin film layer on n + to form a floating junction layer (p +), and forming an anti-reflection film on the emitter (n +) and the patterned floating junction layer (p +) And forming a front electrode to contact the emitter (n +), wherein the floating junction layer (p +) is not in contact with the front electrode.

According to another embodiment of the present invention, a method of manufacturing a front-back front-side solar cell includes an emitter (n +) at an upper layer of a p-type silicon substrate, and a front-rear surface having a rear electric field layer (p ++) at a lower layer of the substrate. A method of manufacturing an electric field solar cell, comprising depositing and patterning a p + type amorphous silicon thin film layer on the emitter (n +) to form a first floating junction layer (p +), and the emitter (n +) and the pattern Forming an anti-reflection film on the first floating junction layer p +, and forming a front electrode to be in contact with the emitter n +, and forming a rear electric field layer p ++ below the substrate. And depositing and patterning an n + type amorphous silicon thin film layer on the backside field layer (p ++) to form a second floating junction layer (n +), and the backside field layer (p ++) and the second floating junction layer. forming a back passivation layer on (n +), and said back passivation And forming a rear electrode on the shunt layer to contact the rear electric field layer (p ++), wherein the first floating junction layer (p +) does not contact the front electrode, and the second floating junction layer ( n +) is not in contact with the back electrode.

The method may further include forming a low concentration back surface field layer p + on the lower layer of the substrate.

In accordance with still another aspect of the present invention, there is provided a front and back surface field solar cell according to an embodiment of the present invention, wherein the first conductive silicon substrate, the second conductive emitter provided at the upper layer of the substrate, A first floating junction layer of a first conductivity type provided in a part of the formed region, a first antireflection film provided at an upper portion of the emitter and the first floating junction layer, a front electrode in contact with the emitter, and the substrate A rear conductive layer of a first conductivity type provided in the lower layer portion, a second floating junction layer of a second conductivity type provided in a portion of the region in which the rear electric field layer is formed, and an upper layer portion of the rear electric field layer and the second floating junction layer. And a second anti-reflection film provided thereon, and a back electrode in contact with the back field layer, wherein the first floating junction layer is spaced apart from the front electrode, and the second floating junction layer is disposed on the rear electrode. Spaced apart And that is characterized.

The silicon substrate may be p-type, and the first and second anti-reflection films may be an Al ₂ O ₃ dielectric layer thin film.

The silicon substrate may be p-type, and the first and second anti-reflection films may be AlN dielectric layer thin films.

According to another embodiment of the present invention, a front and back surface field solar cell includes a silicon substrate of a first conductivity type, an emitter of a second conductivity type provided in an upper portion of the substrate, and a part of a region where the emitter is formed. A first floating junction layer of a first conductivity type, a first antireflection film provided on the emitter and the first floating junction layer, a front electrode in contact with the emitter, and a first conductive layer provided on the substrate underlayer Type low-concentration back-field layer, a second floating junction layer of a second conductivity type provided in a portion of the region where the low-concentration back-field layer is formed, and a first conductivity type provided in a portion of the region in which the low-concentration back field layer is formed A second anti-reflection film provided at an upper layer of the local high concentration back field layer, the low concentration back field layer, a local high concentration back field layer and a second floating junction layer, and a back electrode contacting the local high concentration back field layer; Is done by also, the first rich bonding layer is disposed are spaced apart from the front electrode, the second rich bonding layer is characterized in that spaced apart and the back electrode.

According to another embodiment of the present invention, a method of manufacturing a front-back front-side solar cell includes a second conductive emitter at an upper layer of a first conductive silicon substrate, and a rear surface of the first conductive type at a lower layer of the substrate. A method for manufacturing a front-side and backside field solar cell having an electric field layer, the method comprising: forming a first floating junction layer of a first conductivity type in a part of an area where the emitter is formed, and the emitter and the first floating junction layer; Forming a first anti-reflection film on the substrate, forming a front electrode in contact with the emitter, and forming a second floating junction layer of a second conductivity type in a portion of the region in which the back field layer is formed; And forming a second anti-reflection film on the backside field layer and the second floating junction layer, and forming a backside electrode to contact the backside field layer. The front battle And it is spaced apart from, the second rich bonding layer may be formed is spaced apart from the rear electrode.

According to another embodiment of the present invention, a method of manufacturing a front-back front-side solar cell includes a second conductive emitter at an upper layer of a first conductive silicon substrate, and a rear surface of the first conductive type at a lower layer of the substrate. A method for manufacturing a front-side and backside field solar cell having an electric field layer, the method comprising: forming a first floating junction layer of a first conductivity type in a part of an area where the emitter is formed, and the emitter and the first floating junction layer; Forming a first anti-reflection film on the substrate, forming a front electrode in contact with the emitter, forming a low concentration back surface field layer of a first conductivity type on the lower layer of the substrate, and Forming a second floating junction layer of a second conductivity type in a portion of the region where the layer is formed, forming a local high concentration back surface layer of the first conductivity type in a portion of the region where the low concentration backside field layer is formed; Prize Forming a second anti-reflection film on the low concentration backside layer, the local high concentration backside layer and the second floating junction layer, and forming a back electrode to contact the local high concentration backside layer; The first floating junction layer is formed to be spaced apart from the front electrode, and the second floating junction layer is formed to be spaced apart from the rear electrode.

In accordance with still another aspect of the present invention, there is provided a front and back surface field solar cell including a first conductive silicon substrate, a second conductive emitter provided at an upper portion of the substrate, and an emitter image. A first floating junction layer of a first conductivity type having a pattern structure deposited and deposited on the first conductive layer, a first antireflection film provided on the emitter and the first floating junction layer, a front electrode in contact with the emitter, and A first conductive type backside electric field layer provided on the substrate lower layer, a second floating type bonding layer of a second conductivity type having a pattern structure deposited and provided on the backside field layer, and the backside field layer and the second floating bonding layer And a second anti-reflection film provided on the substrate, and a rear electrode contacting the rear electric field layer, wherein the first floating junction layer is spaced apart from the front electrode, and the second floating junction layer is formed on the rear surface. Spaced apart from the electrode It is characterized by.

The first floating junction layer and the second floating junction layer may be characterized in that the amorphous silicon (a-Si) thin film layer.

According to still another aspect of the present invention, there is provided a front and back surface field solar cell including a first conductive silicon substrate, a second conductive emitter provided at an upper portion of the substrate, and a pattern structure deposited on the emitter. A first floating junction layer of a first conductivity type, a first anti-reflection film provided on the emitter and the first floating junction layer, a front electrode in contact with the emitter, and a first lower portion provided on the substrate A low concentration backside field layer of a conductivity type, a second floating junction layer of a second conductivity type of a pattern structure that is deposited on the low concentration backside field layer, and a first portion provided in a portion of the region where the low concentration backside field layer is formed A conductive high local backside layer, a second antireflection film provided on the low concentration backside layer, a local high concentration backside layer and a second floating junction layer, and a rear electrode in contact with the local high concentration backside layer The first floating junction layer is spaced apart from the front electrode, and the second floating junction layer is spaced apart from the rear electrode.

According to another embodiment of the present invention, a method of manufacturing a front-back front-side solar cell includes a second conductive emitter at an upper layer of a first conductive silicon substrate, and a rear surface of the first conductive type at a lower layer of the substrate. In the manufacturing method of the front and back surface field solar cell having an electric field layer, the method comprising: depositing and patterning a first conductive amorphous silicon thin film layer on the emitter to form a first floating junction layer of a first conductive type; Forming a first anti-reflection film on the first floating junction layer patterned with the emitter, forming a front electrode in contact with the emitter, and forming a second conductivity type on the back field layer. Depositing and patterning an amorphous silicon thin film layer to form a second floating junction layer of a second conductivity type, forming a second anti-reflection film on the backside field layer and the patterned second floating junction layer, and The rear field layer and And forming a rear electrode so as to contact the first electrode, wherein the first floating junction layer is spaced apart from the front electrode, and the second floating junction layer is spaced apart from the rear electrode.

According to another embodiment of the present invention, a method of manufacturing a front-back front-side solar cell includes a second conductive emitter at an upper layer of a first conductive silicon substrate, and a rear surface of the first conductive type at a lower layer of the substrate. In the manufacturing method of the front and back surface field solar cell having an electric field layer, the method comprising: depositing and patterning a first conductive amorphous silicon thin film layer on the emitter to form a first floating junction layer of a first conductive type; Forming a first antireflection film on the first floating junction layer patterned with the emitter, forming a front electrode in contact with the emitter, and having a low concentration of a first conductivity type in the lower layer of the substrate Forming a backside field layer; depositing and patterning a second conductive amorphous silicon thin film layer on the low concentration backside field layer to form a second floating junction layer of a second conductivity type; Forming a first highly conductive backside field layer of a first conductivity type on the substrate, forming a second antireflection film on the low concentration backside field layer, a locally high concentration backside field layer, and a second floating junction layer, and the locally high concentration layer And forming a rear electrode so as to be in contact with the rear field layer, wherein the first floating junction layer is spaced apart from the front electrode, and the second floating junction layer is formed spaced apart from the rear electrode. It features.

Emitter solar cell according to an embodiment of the present invention for achieving the above object is a first conductivity type silicon substrate, a high conductivity emitter of the second conductivity type provided in the upper layer and the high concentration emitter phase A low conductivity emitter of a second conductivity type, an anti-reflection film provided on the low concentration emitter, a front electrode in contact with the high concentration emitter, and a back conductivity layer of a first conductivity type provided under the substrate And, it characterized in that it comprises a back electrode provided on the back field layer.

The silicon substrate may be n-type, and the anti-reflection film may be an Al ₂ O ₃ dielectric layer thin film.

The silicon substrate may be n-type, and the anti-reflection film may be an AlN dielectric layer thin film.

Meanwhile, the method of manufacturing an emitter solar cell according to an embodiment of the present invention includes forming a high concentration emitter and a low concentration emitter of a second conductivity type on an upper layer of a first conductivity type silicon substrate, and on the low concentration emitter. Forming an anti-reflection film, forming a front electrode in contact with the high concentration emitter, forming a first conductivity type rear electric field layer under the substrate, and forming a rear electrode on the rear electric field layer Characterized in that it comprises a step of forming.

Forming a high concentration emitter and a low concentration emitter of the second conductivity type on the upper layer of the first conductivity type silicon substrate, after forming a low concentration emitter on the upper layer of the substrate, high energy in a predetermined depth region of the low concentration emitter It can be characterized by forming a high concentration emitter by ion implantation in a high concentration doping impurity atoms.

Forming a high concentration emitter and a low concentration emitter of the second conductivity type on the upper layer of the first conductivity type silicon substrate, after forming a high concentration emitter on the upper layer of the high concentration emitter, the solubility different from the substrate on the upper layer of the high concentration emitter And forming a film having a diffusion coefficient, thereby diffusing the impurity atoms present on the surface of the substrate to the outside, thereby forming a low concentration emitter.

Forming a high concentration emitter and a low concentration emitter of the second conductivity type on the upper layer of the first conductivity type silicon substrate, after forming a high concentration emitter on the upper layer of the high concentration emitter, the semiconductor different from the substrate By injecting a small amount of secondary impurity atoms forming a type can be characterized in that to offset the existing impurity atoms to form a low concentration emitter.

In the case of the front surface (light-receiving surface), a p + type floating junction layer is formed on the doped n + type emitter to prevent electrons, which are minority carriers, from the front surface field moving to the surface with high density of defects. It is possible to increase the import efficiency by forming an electric field inside a silicon substrate having a low density of defects and moving to the electrode without recombination loss of a few carrier electrons.

In addition, by inserting the n + type floating junction layer in the p + back field to suppress the movement of the hole of a large number of carriers to the surface with a high density of defects, it is possible to minimize the recombination loss to increase the collection efficiency to the back electrode.

That is, since the doped layer is inserted into the emitter and the backside field by floating bonding, the photo-generated transporter can be prevented from moving to the surface, and thus, the surface recombination rate can be reduced.

On the other hand, the effects of the application of the double-sided light receiving solar cell structure is as follows.

Since light can be received from both sides, the amount of sunlight can be absorbed, the sun can be received from the front, and the light reflected from the surface can be received. Thus, the amount of photogenerated transporter is increased to increase short circuit current and to increase efficiency.

In addition, since both sides have the same structure, bowing after the high temperature process is reduced, so that breakage during the manufacturing process can be reduced.

Since the electrode is not coated on the entire back side, the electrode usage is reduced and cost can be reduced.

When the process of simultaneously depositing both sides of the dielectric layer thin film is applied, the number of processes can be reduced, thereby reducing the cost. It also improves aesthetics.

In addition, since the surface concentration of the silicon substrate is relatively low and the impurity concentration is highest in a certain depth region inside the substrate, the emitter flows along the emitter layer inside the heavily doped substrate and is collected at the front electrode, so that the recombination loss is low and the contact resistance is low. Is lowered and the collection efficiency is increased.

1 is a schematic view showing the structure of a conventional front and back solar field solar cell.

Figure 2 is a schematic diagram showing the structure of the front and back front field solar cell is applied to the floating structure is a floating junction layer according to an embodiment of the present invention.

Figure 3 is a schematic diagram showing the structure of the front-side and back-side field solar cell is applied to the floating structure is a floating junction layer according to another embodiment of the present invention.

Figure 4 is a schematic diagram showing the structure of a front-side and back-side solar cell having a floating junction layer according to another embodiment of the present invention is applied to the rear structure and having an optional rear field layer (high concentration back field layer (p + +)).

Figure 5 is a schematic diagram showing the structure of the front-side and back-side electric field solar cells applied to the front and rear structure of the floating bonding layer according to another embodiment of the present invention.

FIG. 6 is a schematic diagram illustrating a structure of a front and back surface field solar cell in which a floating junction layer according to another embodiment of the present invention is applied to a front and back structure and has an optional back field layer (high concentration back field layer (p ++)). .

7 is a process flowchart illustrating a method of manufacturing a front and back front-side solar cell according to an embodiment of the present invention.

8 is a process flowchart illustrating a method of manufacturing a front and back surface field solar cell according to another embodiment of the present invention.

9 is a process flowchart illustrating a method of manufacturing a front and back front-side solar cell according to another embodiment of the present invention.

FIG. 10 is a process flowchart illustrating a method of manufacturing a front-back and back-side solar cell according to another embodiment of the present invention.

FIG. 11 is a flowchart illustrating a method of manufacturing a front-back and back-side solar cell according to another embodiment of the present invention.

12 is a schematic diagram showing a structure of a front and back front field solar cell in which a floating junction layer according to another embodiment of the present invention is applied to a front structure.

FIG. 13 is a schematic diagram illustrating a structure of a front and back side field solar cell in which a floating junction layer according to another embodiment of the present invention is applied to front and rear structures. FIG.

14 is a structure of a front-side and back-side field solar cell having a floating high-concentration backside layer (p ++) applied to the front and rear structures and disposed at a point corresponding to the rear electrode according to another embodiment of the present invention. It is a schematic diagram showing.

FIG. 15 illustrates a local high concentration backplane layer (p ++) in which a floating junction layer is applied to front and rear structures and disposed at a point corresponding to a rear electrode and a low concentration backplane layer in a lower layer of a substrate according to another embodiment of the present invention. It is a schematic diagram which shows the structure of the front-back surface field solar cell further equipped with (p +).

FIG. 16 is a flowchart illustrating a method of manufacturing a front-back and back-side solar cell according to another embodiment of the present invention.

FIG. 17 is a flowchart illustrating a method of manufacturing a front-back and back-side solar cell according to another embodiment of the present invention.

18 is a schematic view showing the structure of a double-sided light receiving type front and rear front-field solar cell in which the floating bonding layer according to another embodiment of the present invention is applied to the front-rear structure.

19 is a schematic diagram illustrating a structure of a double-sided light receiving type front and back side field solar cell having a floating junction layer applied to front and rear structures and having an optional backside field layer (highly concentrated backside field layer) according to another embodiment of the present invention. .

20 is a flowchart illustrating a method of manufacturing a double-sided light-receiving front-rear surface field solar cell according to still another embodiment of the present invention.

FIG. 21 is a process flowchart illustrating a method of manufacturing a double-sided light receiving type front-rear surface field solar cell according to still another embodiment of the present invention.

22 is a schematic view showing the structure of a double-sided light receiving type front and rear front-side solar cell in which the floating bonding layer according to another embodiment of the present invention is applied to the front-rear structure.

FIG. 23 is a schematic diagram illustrating a structure of a double-sided light receiving front and back side field solar cell having a floating junction layer applied to front and rear structures and having an optional backside layer (highly concentrated backside layer) according to another embodiment of the present invention. .

24 is a flowchart illustrating a method of manufacturing a double-sided light-receiving front-rear surface field solar cell according to still another embodiment of the present invention.

25 is a process flowchart illustrating a method of manufacturing a double-sided light receiving type front-rear surface field solar cell according to still another embodiment of the present invention.

26 is a schematic diagram showing the structure of an emitter solar cell having a high concentration emitter and a low concentration emitter according to an embodiment of the present invention.

27 is a flowchart illustrating a method of manufacturing an emitter solar cell according to an embodiment of the present invention.

28A to 28F are cross-sectional views illustrating a method of manufacturing an emitter solar cell according to an embodiment of the present invention.

Hereinafter, a structure and a manufacturing method of a front and back surface field solar cell according to an exemplary embodiment of the present invention will be described in detail with reference to the accompanying drawings. Hereinafter, a solar cell manufactured by applying a p-type silicon substrate as a base will be described. When the n-type silicon substrate is used instead of the p-type silicon substrate, the structure of the doped layer may be reversed. In addition, the texture structure of the substrate surface is omitted to simplify the structure of the solar cell.

Figure 2 is a schematic diagram showing the structure of the front and back front field solar cell is applied to the floating structure is a floating junction layer according to an embodiment of the present invention. Referring to Figure 2, the floating junction layer (p +) 203 according to an embodiment of the present invention shows a structure of a solar cell applied to the front structure. An emitter (n ++) 202 is provided on an upper layer of the p-type silicon substrate 201, and a floating bonding layer (p +) 203 is formed in a part of the region where the emitter (n ++) 202 is formed. The floating bonding layer (p +) 203 may be alternately disposed on the upper layer portion in the emitter (n ++) 202. An anti-reflection film 204 is provided at an upper portion of the emitter (n ++) 202 and the floating bonding layer (p +) 203. The front electrode 205 is formed to penetrate the anti-reflection film 204 and contact the emitter (n ++) 202. In addition, the floating bonding layer (p +) 203 does not contact the front electrode 205. As such, by forming the p + type doped floating bonding layer (p +) 203 in the n ++ type doped emitter (n ++) 202 in the light-receiving portion, the electrons, which are the minority carriers that are generated and moved to the front, are defective. Recombination loss can be reduced by moving along the inner n ++ doped emitter layer (n ++) 202 with relatively low defect density without moving to a dense silicon surface. The doped layer (p +) 203 forming the floating junction should not be in contact with the electrode 205.

The anti-reflection film 205 may be an Al ₂ O ₃ dielectric layer thin film or an AlN dielectric layer thin film. In the case of using a conventional p-type silicon substrate, whereas the surface of the n-type emitter becomes a light receiving portion, in the present invention, the p + type floating junction doping layer (p +) of the same type as the p-type silicon substrate 201 ( 203) Since the surface becomes a light receiving portion, a dielectric layer suitable for this should be used. As the dielectric layer for passivation of the p + doped layer, a dielectric layer having a fixed negative charge is preferable, such as Al ₂ O ₃ , AlN, or the like.

Figure 3 is a schematic diagram showing the structure of the front-side and back-side field solar cell is applied to the floating structure is a floating junction layer according to another embodiment of the present invention. Referring to FIG. 3, a backside field layer (p ++) 302 is provided under a p-type silicon substrate 301, and a floating junction layer (n +) (a) is formed in a portion of the region where the backside field layer (p ++) 302 is formed. 303) is formed. The floating bonding layer (n +) 303 may be alternately disposed at a lower layer of the backside field layer (p ++) 302. The back electrode 305 is formed to be in contact with the back electric field layer (p ++) 302. The floating junction layer (n +) 303 does not contact the back electrode 305. By forming a back passivation film 304 on the back field layer (p ++) 302 and a floating junction layer (n +) 303 and a back electrode 305 on the back passivation film 304, The back electrode 305 may be formed to contact the back electric field layer (p ++) 302. As such, by forming an n + type doped floating junction layer (n +) 303 in a backside field layer (p ++) 302 doped with a p ++ type on the rear surface, holes generated as light carriers and moved to the rear surface are transferred. Recombination losses can be reduced by moving along the inner p ++ backfield (p ++) 302 with relatively low defect density without moving to a high defect density silicon surface.

Figure 4 is a schematic diagram showing the structure of a front-side and back-side solar cell having a floating junction layer according to another embodiment of the present invention is applied to the rear structure and has an optional rear field layer (high concentration back field layer (p + +)). Referring to FIG. 4, in the structure of the front-side front-side solar cell of FIG. 3, the back-side field layer (p +) 402 is further provided with a highly doped selective back-field layer (p ++) 406 and the selective rear surface. The electric field layer (p ++) 406 is in contact with the back electrode 405. By forming a back passivation film 404 on the back field layer (p +) 402 and a floating junction layer (n +) 403 and a back electrode 405 on the back passivation film 404, The back electrode 405 may be formed to contact the optional back electric field layer (p ++) 406. Due to the shape penetrated into the p-type silicon substrate 401, the movement path of the holes to the back field layer (p +) 402 is shortened so that holes can be absorbed to the back field layer (p +) 402 more quickly. This can further reduce recombination losses.

Figure 5 is a schematic diagram showing the structure of the front-side and back-side electric field solar cells applied to the front and rear structure of the floating bonding layer according to another embodiment of the present invention. Referring to FIG. 5, as a solar cell structure in which the FIGS. 2 and 3 are combined, an emitter (n ++) 502 is provided on an upper layer of a p-type silicon substrate 501 and the emitter (n ++) region 502 is formed. A portion of the first floating junction layer (p +) 503 is provided. An antireflection film 504 is provided on the emitter (n ++) 502 and the first floating bonding layer (p +) 503, and the emitter (n ++) 502 is in contact with the front electrode 505. . By forming a back passivation film 508 on the back field layer (p ++) 506 and a second floating junction layer (n +) 507 and forming a back electrode 509 on the back passivation film 508. The back electrode 509 may be formed to be in contact with the back electric field layer (p ++) 506. Here, the first floating junction layer (p +) 503 does not contact the front electrode 505, and the second floating junction layer (n +) 507 does not contact the rear electrode 509.

The passivation layer 508 on the back side may be applied to various stacking structures by SiN _x , SiO _2, or Al ₂ O ₃ , depending on the doping layer on the front or back side. In addition, when the n-type substrate is used instead of the p-type substrate in the above structure, the structure of the doped layer may be formed in reverse.

FIG. 6 is a schematic diagram illustrating a structure of a front and back surface field solar cell in which a floating junction layer according to another embodiment of the present invention is applied to a front and back structure and has an optional back field layer (high concentration back field layer (p ++)). . Referring to FIG. 6, a solar cell structure having a combination of FIGS. 2 and 4 may further include an optional rear field layer (p ++) 610 that is heavily doped in the rear field layer (p +) 606. An optional backside field layer (p ++) 610 is in contact with the backside electrode 609. By forming a back passivation film 608 on the back field layer (p +) 606 and a second floating junction layer (n +) 607 and forming a back electrode 609 on the back passivation film 608. The back electrode 609 may be formed to contact the back field layer (p +) 606. Due to the shape penetrated into the p-type silicon substrate 601, the movement path of holes to the back field layer (p +) 606 is shortened so that holes can be absorbed to the back field layer (p +) 606 more quickly. This can further reduce recombination losses.

7 is a process flowchart illustrating a method of manufacturing a front and back front-side solar cell according to an embodiment of the present invention. Referring to FIG. 7, in the method of manufacturing a front and back surface field solar cell in which an emitter (n ++) is provided on an upper layer of a p-type silicon substrate, a floating junction layer (p +) is formed in a part of a region where the emitter (n ++) is formed. Forming an anti-reflection film on the emitter (n ++) and the floating bonding layer (p +) (S702), and forming a front electrode to contact the emitter (n ++). (S703), and the floating bonding layer p + is not in contact with the front electrode.

8 is a process flowchart illustrating a method of manufacturing a front and back surface field solar cell according to another embodiment of the present invention. Referring to FIG. 8, in the method of manufacturing a front-side back-side field solar cell having a back-side layer p ++ provided under the p-type silicon substrate, a floating junction layer may be formed in a portion of the region in which the back-field layer p ++ is formed. forming a back passivation layer on the back field layer (p ++) and the floating junction layer (n +) (S802), and forming a back passivation layer on the back passivation layer (S801). and forming a back electrode to be in contact with the p ++) (S803), wherein the floating bonding layer (n +) is not in contact with the back electrode.

9 is a process flowchart illustrating a method of manufacturing a front and back front-side solar cell according to another embodiment of the present invention. Referring to FIG. 9, in the method of manufacturing a front-side back-side field solar cell, in which a back-side layer p + is provided at a lower layer of a p-type silicon substrate, a floating junction layer ( forming an n +) (S901), forming a highly doped selective backfield layer (p ++) in a portion of the region in which the backfield layer (p +) is formed (S902), and the backfield layer (p +) And forming a back passivation layer on the floating junction layer (n +) (S903), and forming a back electrode on the back passivation layer to contact the selective back field layer (p ++) (S904). The floating junction layer n + is not in contact with the back electrode.

In order to manufacture the high concentration selective back-field layer, there is a method of controlling the doping concentration by surface coating or doping liquid supply using a thermal reaction of the laser to locally heat the surface of the silicon substrate with heat diffusion. This method applies a liquid or paste containing a doping source to the surface of a silicon substrate and then locally heats the surface of the silicon substrate using a laser, whereby doping atoms diffuse into the silicon substrate by a thermal reaction of the laser, and a locally heavily doped layer. Can be formed. In addition, in some special-purpose laser equipment, a laser may be irradiated onto the surface of a silicon substrate together with a liquid containing a doping source to form a locally highly doped layer.

In order to fabricate the high concentration selective back-field layer, a layer of phosphor-silicate glass (PSG) or boro-silicate glass (PSG) is applied to the surface of the silicon substrate using atmospheric chemical vapor deposition (APCVD), and then resist or photo etching is performed. By partially etching and removing the applied PSG or BSG layer using a method such as the above, the layer containing the doping source can be patterned and then heat-treated in an electric furnace so that the doping atoms can diffuse into the silicon substrate to form a locally high concentration doping layer. .

FIG. 10 is a process flowchart illustrating a method of manufacturing a front-back and back-side solar cell according to another embodiment of the present invention. Referring to FIG. 10, an emitter (n ++) is provided in an upper layer of a p-type silicon substrate, and a back field layer (p ++) is provided in a lower layer of the substrate. forming a first floating junction layer (p +) in a portion of the region where (n ++) is formed (S1001), and forming an anti-reflection film on the emitter (n ++) and the first floating junction layer (p +) ( S1002, forming a front electrode so as to contact the emitter n ++, and forming a second floating junction layer n + in a portion of the region in which the back field layer p ++ is formed ( S1004), forming a back passivation layer on the back field layer (p ++) and a second floating junction layer (n +) (S1005), and contacting the back field layer (p ++) on the back passivation layer. And forming a back electrode (S1006), wherein the first floating bonding layer p + is in contact with the front electrode. It not, without the second rich bonding layer (n +) is characterized in that which is not in contact with the back contact.

FIG. 11 is a flowchart illustrating a method of manufacturing a front-back and back-side solar cell according to another embodiment of the present invention. Referring to FIG. 11, the emitter (n ++) is provided in an upper layer of a p-type silicon substrate, and a back field layer (p +) is provided in a lower layer of the substrate. forming a first floating junction layer p + in a portion of the region where (n ++) is formed (S1101), and forming an anti-reflection film on the emitter n ++ and the first floating junction layer p + ( S1102, forming a front electrode so as to contact the emitter n ++, and forming a second floating junction layer n + in a portion of the region in which the back field layer p + is formed ( S1104 and forming a selective backside field layer p ++ that is heavily doped in a portion of the region where the backside field layer p + is formed (S1105), and the backside field layer p + and the second floating junction layer. forming a back passivation layer on (n +) (S1106), and the optional back field layer (p ++) on the back passivation layer; And forming a rear electrode so as to be in contact (S1107), wherein the first floating junction layer p + is not in contact with the front electrode, and the second floating junction layer n + is in contact with the rear electrode. It is characterized by not.

The front and back surface field solar cell structure of the present invention manufactured by the above method has a high-low junction at the light-receiving surface, so that electrons, which are minority carriers, are prevented from moving inside the crystal with low defect density. The doping layer moves below the electrode. In addition, in the rear surface, holes are restricted from moving to the rear surface by the n + floating junction layer present in the backside field layer, and the surface is moved to the p + doping layer and minimizes the disappearance by recombination to the surface in contact with the metal and is easy to move. . Thus, solar cell efficiency is improved by reducing the rate of front recombination of photogenerated charges and providing an advantageous path for collection.

12 is a schematic diagram showing a structure of a front and back front field solar cell in which a floating junction layer according to another embodiment of the present invention is applied to a front structure. 12, the floating bonding layer (p +) 203 according to another embodiment of the present invention shows a structure of a solar cell applied to the front structure. An emitter (n +) 202 is provided on an upper layer of the p-type silicon substrate 201, and a floating junction layer (p +) 203 having a pattern structure is deposited on the emitter (n +) 202. The floating bonding layer (p +) 203 is a pattern structure that is alternately arranged in the upper layer portion in the emitter (n +) 202. An antireflection film 204 is provided on the emitter (n +) 202 and the floating bonding layer (p +) 203. The front electrode 205 is formed to penetrate the anti-reflection film 204 and contact the emitter (n +) 202. In addition, the floating bonding layer (p +) 203 does not contact the front electrode 205. As such, by forming the p + type doped floating junction layer (p +) 203 on the n + doped emitter (n +) 202 on the light receiving portion, electrons that are minority carriers that are photogenerated and moved to the front side are formed. Recombination losses can be reduced by moving along a relatively low defect density n + doped emitter layer (n +) 202 without moving to a high defect density silicon surface. The doped layer (p +) 203 forming the floating junction should not be in contact with the electrode 205.

Meanwhile, the floating junction layer (p +) 203 may be an amorphous silicon (a-Si) thin film layer and may have a thickness of less than 30 nm. And, the emitter (n +) 202 is 80 to 150 Ω / sq. It may have a sheet resistance of, and may have a thickness of 0.3 μm or less.

The anti-reflection film 204 may be an Al ₂ O ₃ dielectric layer thin film or an AlN dielectric layer thin film. In the case of using a conventional p-type silicon substrate, whereas the surface of the n-type emitter becomes a light receiving portion, in the present invention, the p + type floating junction doping layer (p +) of the same type as the p-type silicon substrate 201 ( 203) Since the surface becomes a light receiving portion, a dielectric layer suitable for this should be used. As the dielectric layer for passivation of the p + doped layer, a dielectric layer having a fixed negative charge is preferable, such as Al ₂ O ₃ , AlN, or the like.

FIG. 13 is a schematic diagram illustrating a structure of a front and back side field solar cell in which a floating junction layer is applied to front and rear structures according to another embodiment of the present invention. Referring to FIG. 13, an emitter (n +) 302 is provided on an upper layer of a p-type silicon substrate 301, and a first floating junction layer (p +) 303 having a pattern structure on the emitter (n +) 302. ) Is deposited and provided. An antireflection film 304 is provided on the emitter (n +) 302 and the first floating bonding layer (p +) 303, and the emitter (n +) 302 is in contact with the front electrode 305. . A backside field layer (p ++) 306 is provided under the substrate 301, and a second floating junction layer (n +) 307 having a pattern structure is deposited on the backside field layer (p ++) 306. do. The back field layer (p ++) 306 is in contact with the back electrode. By forming a back passivation layer 308 on the back field layer (p ++) 306 and a second floating junction layer (n +) 307 and forming a back electrode 309 on the back passivation layer 308. The back electrode 509 may be formed to be in contact with the back electric field layer (p ++) 306. Here, the first floating junction layer (p +) 303 does not contact the front electrode 305, and the second floating junction layer (n +) 307 does not contact the rear electrode 309.

The passivation layer 308 on the back side may be applied to various stacking structures by SiN _x , SiO _2, or Al ₂ O ₃ , depending on the doping layer on the front or back side. In addition, when the n-type substrate is used instead of the p-type substrate in the above structure, the structure of the doped layer may be formed in reverse.

Meanwhile, the first floating junction layer (p +) 303 and the second floating junction layer (n +) 307 may be an amorphous silicon (a-Si) thin film layer, and the first floating junction layer (p +) 303 ) May have a thickness of less than 30 nm.

The emitter (n +) 302 is 80 to 150 Ω / sq. It may have a sheet resistance of, and may have a thickness of 0.3 μm or less.

The anti-reflection film 304 may be an Al ₂ O ₃ dielectric layer thin film or an AlN dielectric layer thin film.

14 is a structure of a front-side and back-side field solar cell having a floating high-concentration backside layer (p ++) applied to the front and rear structures and disposed at a point corresponding to the rear electrode according to another embodiment of the present invention. It is a schematic diagram showing. Referring to FIG. 14, the back field layer (p ++) 406 is the same as the structure of the front and back field solar cell of FIG. 13 except that the backside layer 4406 is a local high concentration doping layer disposed at a point corresponding to the back electrode 409. .

That is, an emitter (n +) 402 is provided on an upper layer of the p-type silicon substrate 401, and a first floating junction layer (p +) 403 having a pattern structure is deposited on the emitter (n +) 402. It is provided. An antireflection film 404 is provided on the emitter (n +) 402 and the first floating bonding layer (p +) 403, and the emitter (n +) 402 is in contact with the front electrode 405. . A local high concentration backside field layer (p ++) 406 is provided at a point corresponding to the backside electrode 409 under the substrate 401, and a second floating structure having a pattern structure on the backside layer (p ++) 406 is provided. A bonding layer (n +) 407 is deposited and provided. The local high concentration back surface layer (p ++) 406 and the back electrode 409 are in contact with each other. By forming a back passivation layer 408 on the back field layer (p ++) 406 and a second floating junction layer (n +) 407 and forming a back electrode 409 on the back passivation layer 408. The back electrode 409 may be formed to contact the back electric field layer (p ++) 406. Here, the first floating junction layer (p +) 403 does not contact the front electrode 405, and the second floating junction layer (n +) 407 does not contact the rear electrode 409. Due to the shape of the backside field layer (p ++) 406 penetrating into the p-type silicon substrate 401, the hole path to the backside field layer (p ++) 406 is shortened, so that the hole is made faster. The recombination loss can be further reduced because it can be absorbed into the electric field (p ++) 406.

Meanwhile, the first floating junction layer (p +) 403 and the second floating junction layer (n +) 407 may be an amorphous silicon (a-Si) thin film layer, and the first floating junction layer (p +) 403 ) May have a thickness of less than 30 nm.

The emitter (n +) 402 is 80 to 150 Ω / sq. It may have a sheet resistance of, and may have a thickness of 0.3 μm or less.

The antireflection film 404 may be an Al ₂ O ₃ dielectric layer thin film or an AlN dielectric layer thin film.

FIG. 15 illustrates a local high concentration backplane layer (p ++) in which a floating junction layer is applied to front and rear structures and disposed at a point corresponding to a rear electrode and a low concentration backplane layer in a lower layer of a substrate according to another embodiment of the present invention. It is a schematic diagram which shows the structure of the front-back surface field solar cell further equipped with (p +). Referring to FIG. 15, the structure of the front and rear surface field solar cells of FIG. 14 is the same except that a lower concentration of the rear field layer (p +) 510 is further provided on the lower layer of the substrate 501.

That is, an emitter (n +) 502 is provided on an upper layer of the p-type silicon substrate 501, and a first floating junction layer (p +) 503 having a pattern structure is deposited on the emitter (n +) 502. It is provided. An anti-reflection film 504 is provided on the emitter (n +) 502 and the first floating bonding layer (p +) 503, and the emitter (n +) 502 is in contact with the front electrode 505. . A local high concentration back field layer (p ++) 506 is provided at a point corresponding to the back electrode 509 under the substrate 501, and a second floating structure of a pattern structure is formed on the back field layer p + 510. The bonding layer (n +) is deposited and provided. The local high concentration backside field layer (p ++) 506 is in contact with the backside electrode 509. A low concentration back surface field layer 510 is further provided below the p + type silicon substrate 501. By forming a back passivation layer 508 on the back field layer (p ++) 506 and a second floating junction layer (n +) 507 and forming a back electrode 509 on the back passivation layer 508. The back electrode 509 may be formed to be in contact with the back electric field layer (p ++) 506. Here, the first floating junction layer (p +) 503 does not contact the front electrode 505, and the second floating junction layer (n +) 507 does not contact the rear electrode 509. Due to the shape penetrating into the p-type silicon substrate 601 of the backside field layer (p ++) 506, the path of movement of holes into the backside field layer (p ++) 506 is shortened, so that the holes are made faster. The recombination loss can be further reduced because it can be absorbed into the field layer (p ++) 506.

Meanwhile, the first floating junction layer (p +) 503 and the second floating junction layer (n +) 507 may be an amorphous silicon (a-Si) thin film layer, and the first floating junction layer (p +) 503 ) May have a thickness of less than 30 nm.

The emitter (n +) 502 is 80 to 150 Ω / sq. It may have a sheet resistance of, and may have a thickness of 0.3 μm or less.

The anti-reflection film 504 may be an Al ₂ O ₃ dielectric layer thin film or an AlN dielectric layer thin film.

FIG. 16 is a flowchart illustrating a method of manufacturing a front-back and back-side solar cell according to another embodiment of the present invention. Referring to FIG. 16, in the method of manufacturing a front-side surface field solar cell having an emitter (n +) provided on an upper layer of a p-type silicon substrate, a p + type amorphous silicon thin film layer is deposited and patterned on the emitter (n +). By forming a floating bonding layer (p +) (S601). Thereafter, an anti-reflection film is formed on the emitter n + and the patterned floating junction layer p + (S602). In operation S603, a front electrode is formed to contact the emitter n +. Here, the floating bonding layer p + is not in contact with the front electrode.

FIG. 17 is a flowchart illustrating a method of manufacturing a front-back and back-side solar cell according to another embodiment of the present invention. Referring to FIG. 17, the emitter (n ++) is provided in the upper layer of the p-type silicon substrate, and the back surface field layer (p ++) is provided in the lower layer of the substrate. A p + type amorphous silicon thin film layer is deposited and patterned on (n +) to form a first floating junction layer p + (S701). Thereafter, an anti-reflection film is formed on the emitter n + and the first floating bonding layer p + patterned (S702). In addition, a front electrode is formed to contact the emitter n + (S703). A backside field layer (p ++) is formed below the substrate, and an n + type amorphous silicon thin film layer is deposited on the backside layer (p ++) and patterned to form a second floating junction layer (n +) (S704). A back passivation layer is formed on the back surface field layer p ++ and the second floating junction layer n + (S705). In addition, a rear electrode is formed on the rear passivation layer so as to contact the rear electric field layer p ++ (S706). The first floating junction layer p + is not in contact with the front electrode, and the second floating junction layer n + is not in contact with the back electrode.

In this case, the backside field layer p ++ may be a local high concentration doping layer disposed at a point corresponding to the backside electrode.

On the other hand, the manufacturing method of the front and rear surface field solar cell according to another embodiment of the present invention may further comprise the step of forming a low concentration back surface field layer (p +) in the lower layer of the substrate.

In order to prepare the local high concentration backside field layer (p ++), a method of controlling the doping concentration by surface coating or liquid supplying a doping source using a thermal reaction of a laser to locally heat the surface of the silicon substrate together with thermal diffusion. There is this. This method applies a liquid or paste containing a doping source to the surface of a silicon substrate and then locally heats the surface of the silicon substrate using a laser, whereby doping atoms diffuse into the silicon substrate by a thermal reaction of the laser, and a locally heavily doped layer. Can be formed. In addition, in some special-purpose laser equipment, a laser may be irradiated onto the surface of a silicon substrate together with a liquid containing a doping source to form a locally highly doped layer.

18 is a schematic view showing the structure of a double-sided light receiving type front and rear front-field solar cell in which the floating bonding layer according to another embodiment of the present invention is applied to the front-rear structure. Referring to FIG. 18, an emitter (n ++) 202 is provided on an upper layer of a p-type silicon substrate 201, and a part of the region in which the emitter (n ++) 202 is formed is a first floating junction layer p + ( 203 is formed. The first floating bonding layer (p +) 203 may be alternately disposed on the upper layer portion in the emitter (n ++) 202. The first anti-reflection film 204 is provided at an upper portion of the emitter (n ++) 202 and the first floating bonding layer (p +) 203. The front electrode 205 is formed to penetrate the first anti-reflection film 204 and contact the emitter (n ++) 202. In addition, the first floating junction layer (p +) 203 is formed to be spaced apart from the front electrode 205. Meanwhile, a rear surface field layer (p ++) 206 is provided under the substrate 201. A second floating junction layer (n +) 207 is formed in a portion of the region in which the backside field layer (p ++) 206 is formed. The second floating junction layer (n +) 207 may be alternately disposed on an upper layer portion of the backside field layer (p ++) 206. A second anti-reflection film 208 is provided on the upper portion of the back surface field layer (p ++) 206 and the second floating junction layer (n +) 207. The back electrode 209 is formed to penetrate the second anti-reflection film 208 and contact the back electric field layer (p ++) 206. The second floating junction layer (n +) 207 is formed to be spaced apart from the back electrode 209.

As such, a p + type doped floating junction layer (p +) 203 is formed in the emitter (n ++) 202 doped with n ++ type in the front light receiving part, and the back field layer doped in p ++ type with the rear light receiving part ( By forming p ++) 206, the electrons, the minority carriers that are photogenerated and moved to the front, do not move to the silicon surface with high defect density and the n ++ doped emitter layer (n ++) 202 having a relatively low defect density. Thus, the holes moved to the front electrode and the rear hole move to the rear electrode 209 along the p ++ doped back field layer (p ++) 206, thereby reducing the recombination loss.

Doped layers

203 and 207 that form a floating junction should not contact the

electrodes

205 and 209.

Meanwhile, when the silicon substrate 201 is p-type, the first and second

anti-reflection films

204 and 208 may be Al ₂ O ₃ dielectric layer thin films or AlN dielectric layer thin films. In the case of using a conventional p-type silicon substrate, whereas the surface of the n-type emitter becomes a light receiving portion, in the present invention, the p + type floating junction doping layer (p +) of the same type as the p-type silicon substrate 201 ( 203) Since the surface becomes a light receiving portion, a dielectric layer suitable for this should be used. As the dielectric layer for passivation of the p + doped layer, a dielectric layer having a fixed negative charge is preferable, such as Al ₂ O ₃ , AlN, or the like.

FIG. 19 illustrates a structure of a double-sided light receiving front and back side field solar cell in which a floating junction layer according to another embodiment of the present invention is applied to front and rear structures and has an optional backside field layer (high concentration backside field layer (p ++)). It is a schematic diagram showing. Referring to FIG. 19, the front and back surface field solar cells of FIG. 18 have the same front structure, and the back surface layer structure of the rear surface is different from the low concentration and high concentration back surface layer. That is, the emitter (n ++) 302 is provided on the upper layer of the p-type silicon substrate 301, and the first floating bonding layer (p +) 303 is formed in a part of the region where the emitter (n ++) 302 is formed. Formed. The first floating junction layer (p +) 303 may be alternately disposed in the upper layer portion in the emitter (n + +) 302. The first anti-reflection film 304 is provided on the upper layer of the emitter (n ++) 302 and the first floating bonding layer (p +) 303. The front electrode 305 is formed to penetrate the first anti-reflection film 304 and contact the emitter (n ++) 302. In addition, the first floating junction layer (p +) 303 is formed to be spaced apart from the front electrode 305. Meanwhile, a low concentration back surface field layer (p +) 306 is provided under the substrate 301. A second floating junction layer (n +) 307 is formed in a portion of the region where the low concentration backside field layer (p +) 306 is formed. The second floating junction layer (n +) 307 may be alternately disposed on an upper layer of the low concentration backside field layer (p +) 306. A portion of the region where the low concentration back surface field layer (p +) 306 is formed is provided with a local high concentration back surface layer (p ++) 310. In addition, a second anti-reflection film 308 is provided on the low concentration backside field layer (p +) 306, the local high concentration backside field layer (p ++) 310, and the second floating junction layer (n +) 307. A back electrode 309 is formed to penetrate the second anti-reflection film 308 to be in contact with the local high concentration back surface layer 310 (p ++) 310. The second floating junction layer (n +) 307 is formed to be spaced apart from the back electrode 309. In the present embodiment, as in the embodiment of FIG. 18, when the silicon substrate is p-type, the first and second

anti-reflection films

304 and 308 may be Al ₂ O ₃ dielectric layer thin film or AlN dielectric layer thin film. Can be.

Due to the intrusive shape of the local high concentration backside field layer (p ++) 310 into the p-type silicon substrate 301, the movement path of the hole is shortened, so that the hole is faster and the local high concentration backside field layer (p ++) 310 is formed. Can be absorbed, which can further reduce recombination losses.

20 is a process flowchart illustrating a method of manufacturing a front and back front-side solar cell according to another embodiment of the present invention. Referring to FIG. 20, an emitter (n ++) is provided in an upper layer of a p-type silicon substrate, and a back field layer (p ++) is provided in a lower layer of the substrate. forming a first floating junction layer p + in a portion of the region where (n ++) is formed (S401), and forming an anti-reflection film on the emitter n ++ and the first floating junction layer p + ( (S402), forming a front electrode to contact the emitter (n ++) (S403), and forming a second floating junction layer (n +) in a portion of the region in which the back field layer (p ++) is formed ( S404, forming a second anti-reflection film on the back surface layer p ++ and the second floating junction layer n + (S405), and forming a back electrode to contact the back surface layer pp ++. Including the step (S406), the first floating junction layer (p +) is formed spaced apart from the front electrode, the second floating junction layer (n +) Is spaced apart from the back electrode.

FIG. 21 is a process flowchart illustrating a method of manufacturing a double-sided light receiving type front-rear surface field solar cell according to still another embodiment of the present invention. Referring to FIG. 21, the emitter (n ++) is provided in an upper layer of a p-type silicon substrate, and a back field layer (p ++) is provided in a lower layer of the substrate. forming a first floating junction layer p + on a portion of the region where (n ++) is formed (S501), and forming a first anti-reflection film on the emitter n ++ and the first floating junction layer p +. Step S502, forming a front electrode to contact the emitter n ++, forming a low concentration backside field layer p + at a lower layer of the substrate at step S504, and the low concentration backside Forming a second floating junction layer (n +) in a portion of the region in which the electric field layer (p +) is formed (S505), and in a portion of the region in which the low concentration backside field layer (p +) is formed, a local high concentration backside layer (p ++) Forming a step (S506), the low concentration backplane layer (p +), a local high concentration backplane layer (p ++) and a second floating junction layer ( forming a second anti-reflection film on n +, and forming a back electrode to contact the local high concentration back surface layer p ++ (S507), wherein the first floating junction layer is formed. (p +) is formed spaced apart from the front electrode, and the second floating bonding layer (n +) is characterized in that it is formed spaced apart from the back electrode.

In order to manufacture the high concentration back-field layer 310, a method of controlling the doping concentration by surface coating or doping liquid supply using a thermal reaction of the laser to locally heat the surface of the silicon substrate with heat diffusion. have. This method applies a liquid or paste containing a doping source to the surface of a silicon substrate and then locally heats the surface of the silicon substrate using a laser, whereby doping atoms diffuse into the silicon substrate by a thermal reaction of the laser, and a locally heavily doped layer. Can be formed. In addition, in some special-purpose laser equipment, a laser may be irradiated onto the surface of a silicon substrate together with a liquid containing a doping source to form a locally highly doped layer.

The front and back surface field solar cell structure of the present invention manufactured by the above method has a high-low junction at the light-receiving surface, so that electrons, which are minority carriers, are prevented from moving inside the crystal with low defect density. The doping layer is moved under the front electrode. In addition, in the rear surface, holes are restricted from moving to the rear surface by the n + floating junction layer existing in the rear electric field layer, and the surface is moved to the p ++ doping layer and minimizes the disappearance due to recombination to the surface in contact with the metal and is easy to move. do. Thus, solar cell efficiency is improved by reducing the rate of front recombination of photogenerated charges and providing an advantageous path for collection.

22 is a schematic view showing the structure of a double-sided light receiving type front and rear front-side solar cell in which the floating bonding layer according to another embodiment of the present invention is applied to the front-rear structure. Referring to FIG. 22, an emitter (n +) 202 is provided on an upper layer of a p-type silicon substrate 201, and a first floating bonding layer (p +) 203 is provided on the emitter (n +) 202. do. The first floating junction layer (p +) 203 is formed in a pattern structure through a deposition process. The first floating bonding layer (p +) 203 may be alternately disposed on the emitter (n +) 202. A first antireflection film 204 is provided on the emitter (n +) 202 and the first floating bonding layer (p +) 203. The front electrode 205 is formed to penetrate the first anti-reflection film 204 and contact the emitter (n +) 202. The first floating junction layer (p +) 203 is spaced apart from the front electrode 205.

On the other hand, a rear field layer (p +) 206 is provided under the substrate 201. A second floating junction layer (n +) 207 is formed on the back surface field layer (p +) 206. The second floating junction layer (n +) 207 is formed in a pattern structure through a deposition process. The second floating junction layer (n +) 207 may be alternately disposed on the backside field layer (p ++) 206. A second anti-reflection film 208 is provided on the back surface field layer (p +) 206 and the second floating junction layer (n +) 207. The back electrode 209 is formed to penetrate the second anti-reflection film 208 and contact the back electric field layer (p +) 206. The second floating junction layer (n +) 207 is spaced apart from the back electrode 209.

As such, a p + type doped floating junction layer (p +) 203 is formed on the n + doped emitter (n +) 202 in the front light receiving part, and the back field layer doped in p + type in the rear light receiving part. By forming (p +) 206, the electrons, the minority carriers that are photogenerated and moved to the front, do not move to the silicon surface with high defect density and the n + doped emitter layer (n +) (202) having a relatively low defect density. ) Moves to the front electrode and back hole moves to the rear electrode 209 along the p + doped back field layer (p + 206) to reduce the recombination loss.

Doped layers

203 and 207 that form a floating junction should not contact the

electrodes

205 and 209.

Meanwhile, the first floating junction layer (p +) 203 and the second floating junction layer (n +) 207 may be an amorphous silicon (a-Si) thin film layer.

The first and second

anti-reflection films

FIG. 23 illustrates a structure of a double-sided light receiving front and back side field solar cell in which a floating junction layer is applied to front and rear structures and has an optional backside layer (p ++) according to another embodiment of the present invention. It is a schematic diagram showing. Referring to FIG. 23, the front and back surface field solar cells of FIG. 22 have the same front structure, and the back surface layer structure of the rear surface is different from the low concentration and high concentration back surface layer. That is, an emitter (n +) 302 is provided on an upper layer of the p-type silicon substrate 301, and a first floating junction layer (p +) 303 is formed on the emitter (n +) 302. The first floating junction layer (p +) 303 is formed in a pattern structure on the emitter (n +) 302 through a deposition process. The first floating bonding layer (p +) 303 may be alternately disposed on the emitter (n +) 302. A first antireflection film 304 is provided on the emitter (n +) 302 and the first floating bonding layer (p +) 303. The front electrode 305 is formed to penetrate the first anti-reflection film 304 and contact the emitter (n +) 302. The first floating junction layer (p +) 303 is spaced apart from the front electrode 305.

Meanwhile, a low concentration back surface field layer (p +) 306 is provided under the substrate 301. A second floating junction layer (n +) 307 is formed on the low concentration back surface field layer (p +) 306. The second floating junction layer (n +) 307 is formed in a pattern structure on the low concentration backside field layer (p +) 306 through a deposition process. The second floating junction layer (n +) 307 may be alternately disposed on an upper layer of the low concentration backside field layer (p +) 306. A portion of the region where the low concentration back surface field layer (p +) 306 is formed is provided with a local high concentration back surface layer (p ++) 310. A second anti-reflection film 308 is provided on the low concentration backside field layer (p +) 306, the local high concentration backside field layer (p ++) 310, and the second floating junction layer (n +) 307. A back electrode 309 is formed to penetrate the second anti-reflection film 308 to be in contact with the local high concentration back surface layer 310 (p ++) 310. The second floating junction layer (n +) 307 is spaced apart from the back electrode 309.

Meanwhile, in the present embodiment, as in the embodiment of FIG. 22, the first floating junction layer (p +) 303 and the second floating junction layer (n +) 307 may be an amorphous silicon (a-Si) thin film layer. have. The first and second

anti-reflection films

304 and 308 may be Al ₂ O ₃ dielectric layer thin films or AlN dielectric layer thin films.

24 is a process flowchart illustrating a method of manufacturing a front-side and back-side solar cell according to another embodiment of the present invention. Referring to FIG. 24, the emitter (n +) is provided in an upper layer of a p-type silicon substrate, and a back field layer (p +) is provided in a lower layer of the substrate. depositing and patterning a p + type amorphous silicon thin film layer on (n +) to form a first floating junction layer (p +) (S401), and the emitter (n +) patterned first floating junction layer (p +) (S402), forming a front electrode to be in contact with the emitter (n +), and forming an n + type amorphous silicon thin film layer on the back field layer (p +). Depositing and patterning to form a second floating junction layer (n +) (S404), and forming a second anti-reflection film on the backside field layer (p +) and the patterned second floating junction layer (n +). And a step (S406) of forming a back electrode to be in contact with the back field layer (p +). 1 rich bonding layer (p +) is characterized in that is formed is spaced apart from the front electrode, the second rich bonding layer (n +) is formed to be spaced apart from the rear electrode.

25 is a process flowchart illustrating a method of manufacturing a double-sided light receiving type front-rear surface field solar cell according to still another embodiment of the present invention. Referring to FIG. 25, in the method of manufacturing a front-side and back-side solar cell, in which an emitter (n +) is provided at an upper layer of a p-type silicon substrate, and a rear field layer (p +) is provided at a lower layer of the substrate,

Depositing and patterning a p + type amorphous silicon thin film layer on the emitter (n +) to form a first floating junction layer (p +) (S501), and the first floating junction patterned with the emitter (n +) Forming a first anti-reflection film on the layer p +, forming a front electrode in contact with the emitter n +, and forming a low concentration backside electric field layer p + under the substrate; Forming a second floating junction layer (n +) by depositing and patterning an n + type amorphous silicon thin film layer on the low concentration backside field layer (p +) (S505), and the low concentration. Forming a local high concentration backside layer (p ++) on the backside layer (p +) (S506), the low concentration backside layer (p +), the local high concentration backside layer (p ++) and the second floating junction layer (n +) Forming a second anti-reflection film on (), and forming a rear electrode so as to be in contact with the local high concentration back surface layer (p ++). And a step (S507), wherein the first floating junction layer (p +) is formed spaced apart from the front electrode, and the second floating junction layer (n +) is formed spaced apart from the rear electrode. It features.

The front and back surface field solar cell structure of the present invention manufactured by the above method has a high-low junction at the light-receiving surface, so that electrons, which are minority carriers, are prevented from moving inside the crystal with low defect density. It moves to the doping layer under the front electrode. In addition, in the rear surface, holes are restricted from moving to the rear surface by the n + floating junction layer existing in the rear electric field layer, and the surface is moved to the p ++ doping layer and minimizes the disappearance due to recombination to the surface in contact with the metal and is easy to move. do. Thus, solar cell efficiency is improved by reducing the rate of front recombination of photogenerated charges and providing an advantageous path for collection.

26 is a schematic diagram showing the structure of an emitter solar cell having a high concentration emitter and a low concentration emitter according to an embodiment of the present invention. Referring to FIG. 26, a high concentration emitter (n ++) 202 is provided on an upper layer of a p-type silicon substrate 201, and a low concentration emitter (n +) is provided on the high concentration emitter (n +) 202. An anti-reflection film 204 is provided on the low concentration emitter (n +) 202. The front electrode 205 is provided to contact the high concentration emitter (n ++) 202 through the anti-reflection film 204 and the low concentration emitter (n +).

On the other hand, a rear field layer (p +) 206 is provided under the substrate 201. The back electrode 209 is formed on the front surface of the back field layer (p +) 206.

As such, the doping concentration distribution of the impurity atoms in the emitter is the highest in the region having a constant depth inside the silicon substrate and the relatively low doping concentration on the surface, so that the electrons generated by the photogeneration are generated via the high concentration emitter. It may be collected by the front electrode provided to contact this. Due to the low doping concentration of the silicon substrate, the recombination loss can be reduced and the efficiency can be increased because the probability of recombination of photogenerated transporters on the surface side when the sunlight is incident is reduced.

That is, since the emitter of the light-receiving part on the surface of the silicon substrate has a low doping concentration, the sheet resistance is high, and the inside of the substrate has a high doping concentration, so the sheet resistance is low. It is easy to move along the emitter layer. Inside the silicon substrate, the defect density is low compared to the surface, preventing recombination losses. As the front electrode penetrates deeper than the low concentration doping layer (high surface resistance) and contacts the high concentration doping layer (low surface resistance), the phototransmitted minority carrier electrons move to the high resistance doping layer having low resistance, Collected at the site.

On the other hand, when the silicon substrate is n-type, the anti-reflection film may be characterized in that the Al ₂ O ₃ dielectric layer thin film or AlN dielectric layer thin film.

Since the n-type silicon substrate 201 and the other type of p + type low concentration emitter (p +) surface becomes the light receiving portion, a dielectric layer suitable for this should be used. As the dielectric layer for passivation of the p + doped layer, a dielectric layer having a fixed negative charge is preferable, such as Al ₂ O ₃ , AlN, or the like.

FIG. 27 is a process flowchart illustrating a method of manufacturing an emitter solar cell according to an embodiment of the present invention, and FIGS. 28A to 28F illustrate a method of manufacturing an emitter solar cell according to an embodiment of the present invention. It is a process cross section.

Referring to FIGS. 27 and 28A to 28F, a p-type silicon substrate is prepared (FIG. 28A), and a high concentration emitter (n ++) and a low concentration emitter (n +) are formed on an upper layer of the p-type silicon substrate (FIG. 28B). Thereafter, an antireflection film is formed on the low concentration emitter (n +) (FIG. 28C), and a front electrode is formed to contact the high concentration emitter (n ++) (FIG. 28D). Then, after forming the rear field layer p + on the lower layer of the substrate (FIG. 28E), a rear electrode is formed on the rear field layer p + (FIG. 28F).

On the other hand, although not shown, it may further include a local high concentration backside layer (n + +) formed in the backside layer area in order to facilitate the collection of photogenerated holes to the back electrode.

Meanwhile, in the forming of the high concentration emitter (n ++) and the low concentration emitter (n +) on the upper layer of the p-type silicon substrate, after forming the low concentration emitter (n +) on the upper layer of the substrate, the low concentration emitter (n +) A high concentration emitter (n ++) can be formed by ion implantation with a high energy in a predetermined depth region and high concentration doping of impurity atoms.

In addition, by forming a high concentration emitter (n + +) on the upper layer of the substrate, and then forming a film having a solubility and diffusion coefficient different from the substrate on the high emitter (n + +) upper layer to diffuse the impurity atoms present on the substrate surface to the outside The low concentration emitter (n +) can be formed.

After forming a high concentration emitter (n ++) on the upper layer of the substrate, a small amount of secondary impurity atoms forming a semiconductor type different from the substrate is formed in the upper concentration emitter (n ++) to cancel the existing impurity atoms. It is also possible to form low concentration emitters (n +).

The emitter solar cell structure of the present invention manufactured by the above method has a high-low junction at the light-receiving surface, so that electrons, which are minority carriers, are prevented from moving inside the crystal with low defect density. It moves to the high emitter layer below the electrode. Therefore, it is easy to minimize the disappearance by recombination at the surface and to move. Thus, solar cell efficiency is improved by reducing the rate of front recombination of photogenerated charges and providing an advantageous path for collection.

Although described above with reference to the embodiments, those skilled in the art can be variously modified and changed within the scope of the invention without departing from the spirit and scope of the invention described in the claims below. I can understand.

Claims

p-type silicon substrate;

An emitter (n ++) provided in an upper portion of the substrate;

A floating bonding layer (p +) provided in a part of the region where the emitter (n ++) is formed;

An anti-reflection film provided on an upper portion of the emitter (n ++) and the floating bonding layer (p +); And

It comprises a front electrode in contact with the emitter (n + +),

And the floating junction layer (p +) is not in contact with the front electrode.
The method of claim 1,

The anti-reflection film is a front and back surface field solar cell, characterized in that the Al 2 O 3 dielectric layer thin film.
The method of claim 1,

The anti-reflection film is a front and back field solar cell, characterized in that the AlN dielectric layer thin film.
p-type silicon substrate;

A backside electric field layer (p +) provided in the lower layer of the substrate;

A floating junction layer (n +) provided in a portion of the region in which the backside electric field layer (p +) is formed; And

It comprises a back electrode in contact with the back field layer (p +),

The floating junction layer (n +) is a front and back surface field solar cell, characterized in that not in contact with the back electrode.
The method of claim 4, wherein

And a back dopant layer (p ++) doped at a high concentration inside the backplate layer (p +), wherein the backsheet layer (p ++) is in contact with the back electrode.
p-type silicon substrate;

An emitter (n ++) provided in an upper portion of the substrate;

A first floating junction layer (p +) provided in a portion of the region where the emitter (n ++) is formed;

An anti-reflection film provided on an upper portion of the emitter (n ++) and the first floating bonding layer (p +);

A front electrode in contact with the emitter (n ++);

A backside electric field layer (p +) provided in the lower layer of the substrate;

A second floating junction layer (n +) provided in a portion of the region in which the backside electric field layer (p +) is formed; And

It comprises a back electrode in contact with the back field layer (p +),

And the first floating junction layer (p +) does not contact the front electrode and the second floating junction layer (n +) does not contact the rear electrode.
The method of claim 6,

And a back dopant layer (p ++) doped at a high concentration inside the backplate layer (p +), wherein the backsheet layer (p ++) is in contact with the back electrode.
The method of claim 6,

The anti-reflection film is a front and back surface field solar cell, characterized in that the Al 2 O 3 dielectric layer thin film.
The method of claim 6,

The anti-reflection film is a front and back field solar cell, characterized in that the AlN dielectric layer thin film.
In the manufacturing method of the front and rear surface field solar cell, wherein the emitter (n ++) is provided on the upper layer of the p-type silicon substrate,

Forming a floating junction layer (p +) in a portion of the region where the emitter (n ++) is formed;

Forming an anti-reflection film on the emitter (n ++) and the floating bonding layer (p +); And

And forming a front electrode to be in contact with the emitter (n ++),

And the floating junction layer (p +) is not in contact with the front electrode.
In the manufacturing method of the front-side and back-side solar cell provided with a rear field layer (p ++) in the lower layer of the p-type silicon substrate,

Forming a floating junction layer (n +) in a portion of the region in which the backside field layer (p ++) is formed;

Forming a back passivation layer on the back surface field layer (p ++) and the floating junction layer (n +); And

And forming a rear electrode on the rear passivation layer so as to contact the rear electric field layer (p ++).

And the floating junction layer (n +) is not in contact with the back electrode.
In the manufacturing method of the front and rear surface field solar cell, wherein the backside field layer (p +) is provided on the lower layer of the p-type silicon substrate,

Forming a floating junction layer (n +) in a portion of the region in which the backside field layer (p +) is formed;

Forming a selective backside field layer (p ++) highly doped in a portion of the region where the backside field layer (p +) is formed;

Forming a back passivation layer on the back surface field layer (p +) and the floating junction layer (n +); And

And forming a rear electrode on the rear passivation layer so as to contact the selective rear electric field layer (p ++).

And the floating junction layer (n +) is not in contact with the back electrode.
In the manufacturing method of the front-side and back-side solar cell, wherein the emitter (n + +) is provided in the upper layer of the p-type silicon substrate, and the rear field layer (p + +) is provided in the lower layer of the substrate,

Forming a first floating junction layer (p +) in a portion of the region where the emitter (n ++) is formed;

Forming an anti-reflection film on the emitter (n ++) and the first floating junction layer (p +);

Forming a front electrode in contact with the emitter (n ++);

Forming a second floating junction layer (n +) in a portion of the region in which the backside field layer (p ++) is formed;

Forming a back passivation layer on the back field layer (p ++) and the second floating junction layer (n +); And

And forming a rear electrode on the rear passivation layer so as to contact the rear electric field layer (p ++).

And the first floating junction layer (p +) does not contact the front electrode, and the second floating junction layer (n +) does not contact the rear electrode.
In the manufacturing method of the front and rear surface field solar cell, wherein the emitter (n + +) is provided in the upper layer of the p-type silicon substrate, the rear field layer (p +) is provided in the lower layer of the substrate,

Forming a first floating junction layer (p +) in a portion of the region where the emitter (n ++) is formed;

Forming an anti-reflection film on the emitter (n ++) and the first floating junction layer (p +);

Forming a front electrode in contact with the emitter (n ++);

Forming a second floating junction layer (n +) in a portion of the region in which the backside field layer (p +) is formed;

Forming a selective backside field layer (p ++) highly doped in a portion of the region where the backside field layer (p +) is formed;

Forming a back passivation layer on the back field layer (p +) and the second floating junction layer (n +); And

And forming a rear electrode on the rear passivation layer so as to contact the selective rear electric field layer (p ++).

And the first floating junction layer (p +) does not contact the front electrode, and the second floating junction layer (n +) does not contact the rear electrode.
p-type silicon substrate;

An emitter (n +) provided in an upper portion of the substrate;

A floating junction layer (p +) having a pattern structure that is deposited on the emitter (n +)

An anti-reflection film provided on the floating bonding layer p +; And

It comprises a front electrode in contact with the emitter (n +),

And the floating junction layer (p +) is not in contact with the front electrode.
The method of claim 15,

The floating junction layer (p +) is a front and back surface field solar cell, characterized in that the amorphous silicon (a-Si) thin film layer.
The method of claim 15,

The floating junction layer (p +) is a front and back surface field solar cell, characterized in that having a thickness of less than 30nm.
The method of claim 15,

The emitter (n +) is 80 to 150 Ω / sq. Front and back surface field solar cell, characterized in that it has a sheet resistance.
The method of claim 15,

The emitter (n +) is a front and back field solar cell, characterized in that having a thickness of 0.3㎛ or less.
The method of claim 15,

The anti-reflection film is a front and back surface field solar cell, characterized in that the Al 2 O 3 dielectric layer thin film.
The method of claim 15,

The anti-reflection film is a front and back surface field solar cell, characterized in that the AlN dielectric layer thin film.
p-type silicon substrate;

An emitter (n +) provided in an upper portion of the substrate;

A first floating junction layer (p +) having a pattern structure deposited on the emitter (n +);

An anti-reflection film provided on the first floating bonding layer p +;

A front electrode in contact with the emitter (n +);

A backside field layer (p ++) provided on the lower layer of the substrate;

A second floating junction layer (n +) having a pattern structure deposited and provided on the backside field layer (p ++); And

It comprises a back electrode in contact with the back field layer (p ++),

And the first floating junction layer (p +) does not contact the front electrode and the second floating junction layer (n +) does not contact the rear electrode.
The method of claim 22,

And the backside field layer (p ++) is a local high concentration doping layer disposed at a point corresponding to the backside electrode.
The method of claim 23, wherein

A front and back surface field solar cell, further comprising a low concentration backside field layer (p +) in the lower layer of the substrate.
The method of claim 22,

And the first floating junction layer (p +) and the second floating junction layer (n +) are amorphous silicon (a-Si) thin film layers.
The method of claim 22,

The first floating junction layer (p +) is a front and back surface field solar cell, characterized in that having a thickness of less than 30nm.
The method of claim 22,

The emitter (n +) is 80 to 150 Ω / sq. Front and back surface field solar cell, characterized in that it has a sheet resistance.
The method of claim 22,

The emitter (n +) is a front and back field solar cell, characterized in that having a thickness of 0.3㎛ or less.
The method of claim 22,

The anti-reflection film is a front and back surface field solar cell, characterized in that the Al 2 O 3 dielectric layer thin film.
The method of claim 22,

The anti-reflection film is a front and back surface field solar cell, characterized in that the AlN dielectric layer thin film.
In the manufacturing method of the front and rear surface field solar cell, wherein the emitter (n +) is provided on the upper layer of the p-type silicon substrate,

Depositing and patterning a p + type amorphous silicon thin film layer on the emitter (n +) to form a floating junction layer (p +);

Forming an anti-reflection film on the emitter (n +) and the patterned floating junction layer (p +); And

And forming a front electrode to contact the emitter (n +),

And the floating junction layer (p +) is not in contact with the front electrode.
In the manufacturing method of the front-side and back-side solar cell, the emitter (n +) is provided in the upper layer of the p-type silicon substrate, the rear field layer (p ++) is provided in the lower layer of the substrate

Depositing and patterning a p + type amorphous silicon thin film layer on the emitter (n +) to form a first floating junction layer (p +);

Forming an anti-reflection film on the emitter (n +) and the patterned first floating junction layer (p +);

Forming a front electrode in contact with the emitter (n +);

Forming a rear electric field layer (p ++) on the lower layer of the substrate;

Depositing and patterning an n + type amorphous silicon thin film layer on the backside field layer (p ++) to form a second floating junction layer (n +);

Forming a back passivation layer on the back field layer (p ++) and the second floating junction layer (n +); And

And forming a rear electrode on the rear passivation layer so as to contact the rear electric field layer (p ++).

And the first floating junction layer (p +) does not contact the front electrode, and the second floating junction layer (n +) does not contact the rear electrode.
33. The method of claim 32,

And the backside field layer (p ++) is a local high concentration doping layer disposed at a point corresponding to the backside electrode.
The method of claim 33, wherein

And forming a low concentration backside field layer (p +) in the lower layer of the substrate.
A silicon substrate of a first conductivity type;

An emitter of a second conductivity type provided in an upper portion of the substrate;

A first floating bonding layer of a first conductivity type provided in a part of the region where the emitter is formed;

A first anti-reflection film provided on the emitter and the first floating bonding layer;

A front electrode in contact with the emitter;

A first conductivity type backside field layer provided on the substrate underlayer;

A second floating junction layer of a second conductivity type provided in a portion of the region in which the backside field layer is formed;

A second anti-reflection film provided on the rear field layer and the second floating junction layer; And

It comprises a back electrode in contact with the back field layer,

And the first floating junction layer is spaced apart from the front electrode, and the second floating junction layer is spaced apart from the rear electrode.
36. The method of claim 35 wherein

The silicon substrate is a p-type, and the first and second anti-reflection film is a front and back surface field solar cell, characterized in that the Al 2 O 3 dielectric layer thin film.
36. The method of claim 35 wherein

And the silicon substrate is p-type, and the first and second anti-reflection films are AlN dielectric layer thin films.
A silicon substrate of a first conductivity type;

An emitter of a second conductivity type provided in an upper portion of the substrate;

A first floating bonding layer of a first conductivity type provided in a part of the region where the emitter is formed;

A first anti-reflection film provided on the emitter and the first floating bonding layer;

A front electrode in contact with the emitter;

A low concentration back surface field layer of a first conductivity type provided in the lower layer of the substrate;

A second floating junction layer of a second conductivity type provided in a portion of the region where the low concentration backside field layer is formed;

A localized high concentration back surface layer of a first conductivity type provided in a portion of the region where the low concentration back surface field layer is formed;

A second anti-reflection film provided on the low concentration back surface layer, the local high concentration back surface layer, and the second floating junction layer; And

It comprises a back electrode in contact with the local high concentration back field layer,

And the first floating junction layer is spaced apart from the front electrode, and the second floating junction layer is spaced apart from the rear electrode.
The method of claim 38,

The silicon substrate is a p-type, and the first and second anti-reflection film is a front and back surface field solar cell, characterized in that the Al 2 O 3 dielectric layer thin film.
The method of claim 38,

And the silicon substrate is p-type, and the first and second anti-reflection films are AlN dielectric layer thin films.
In the manufacturing method of the front and rear surface field solar cell, wherein the emitter of the second conductivity type is provided in the upper layer of the first conductive silicon substrate, and the rear field layer of the first conductivity type is provided in the lower layer of the substrate.

Forming a first floating junction layer of a first conductivity type in a portion of the region where the emitter is formed;

Forming a first anti-reflection film on the emitter and the first floating junction layer;

Forming a front electrode in contact with the emitter;

Forming a second floating junction layer of a second conductivity type in a portion of the region in which the backside field layer is formed;

Forming a second anti-reflection film on the back surface field layer and the second floating junction layer; And

And forming a rear electrode to be in contact with the rear electric field layer.

And the first floating junction layer is spaced apart from the front electrode, and the second floating junction layer is formed spaced apart from the rear electrode.
In the manufacturing method of the front and rear surface field solar cell, wherein the emitter of the second conductivity type is provided in the upper layer of the first conductive silicon substrate, and the rear field layer of the first conductivity type is provided in the lower layer of the substrate.

Forming a first floating junction layer of a first conductivity type in a portion of the region where the emitter is formed;

Forming a first anti-reflection film on the emitter and the first floating junction layer;

Forming a front electrode in contact with the emitter;

Forming a low concentration back surface field layer of a first conductivity type on a lower layer of the substrate;

Forming a second floating junction layer of a second conductivity type in a portion of the region where the low concentration backside field layer is formed;

Forming a localized high concentration backside field layer of a first conductivity type in a portion of the region where the low concentration backside field layer is formed;

Forming a second anti-reflection film on the low concentration back surface layer, the local high concentration back surface layer, and the second floating junction layer; And

And forming a back electrode in contact with the local high concentration back field layer,

And the first floating junction layer is spaced apart from the front electrode, and the second floating junction layer is formed spaced apart from the rear electrode.
A silicon substrate of a first conductivity type;

An emitter of a second conductivity type provided in an upper portion of the substrate;

A first floating junction layer of a first conductivity type having a pattern structure deposited on the emitter;

A first anti-reflection film provided on the emitter and the first floating bonding layer;

A front electrode in contact with the emitter;

A first conductivity type backside field layer provided on the substrate underlayer;

A second floating junction layer of a second conductive type having a pattern structure which is deposited on the backside field layer;

A second anti-reflection film provided on the back surface field layer and the second floating junction layer; And

It comprises a back electrode in contact with the back field layer,

And the first floating junction layer is spaced apart from the front electrode, and the second floating junction layer is spaced apart from the rear electrode.
The method of claim 43,

The first floating junction layer and the second floating junction layer is a front-side surface field solar cell, characterized in that the amorphous silicon (a-Si) thin film layer.
The method of claim 43,

The silicon substrate is a p-type, and the first and second anti-reflection film is a front and back surface field solar cell, characterized in that the Al 2 O 3 dielectric layer thin film.
The method of claim 43,

The silicon substrate is a p-type, the first and second anti-reflection film is a front and back surface field solar cell, characterized in that the AlN dielectric layer thin film.
A silicon substrate of a first conductivity type;

An emitter of a second conductivity type provided in an upper portion of the substrate;

A first floating junction layer of a first conductivity type having a pattern structure deposited on the emitter;

A first anti-reflection film provided on the emitter and the first floating bonding layer;

A front electrode in contact with the emitter;

A low concentration back surface field layer of a first conductivity type provided in the lower layer of the substrate;

A second floating junction layer of a second conductive type having a pattern structure that is deposited on the low concentration backside field layer;

A localized high concentration back surface layer of a first conductivity type provided in a portion of the region where the low concentration back surface field layer is formed;

A second anti-reflection film provided on the low concentration back surface layer, the local high concentration back surface layer, and the second floating junction layer; And

It comprises a back electrode in contact with the local high concentration back field layer,

And the first floating junction layer is spaced apart from the front electrode, and the second floating junction layer is spaced apart from the rear electrode.
The method of claim 43,

The first floating junction layer and the second floating junction layer is a front-side surface field solar cell, characterized in that the amorphous silicon (a-Si) thin film layer.
The method of claim 43,

The silicon substrate is a p-type, and the first and second anti-reflection film is a front and back surface field solar cell, characterized in that the Al 2 O 3 dielectric layer thin film.
The method of claim 43,

The silicon substrate is a p-type, the first and second anti-reflection film is a front and back surface field solar cell, characterized in that the AlN dielectric layer thin film.
In the manufacturing method of the front and rear surface field solar cell, wherein the emitter of the second conductivity type is provided in the upper layer of the first conductive silicon substrate, and the rear field layer of the first conductivity type is provided in the lower layer of the substrate.

Depositing and patterning a first conductive amorphous silicon thin film layer on the emitter to form a first floating junction layer of a first conductive type;

Forming a first anti-reflection film on the emitter and the first floating junction layer patterned;

Forming a front electrode in contact with the emitter;

Depositing and patterning a second conductive amorphous silicon thin film layer on the backside field layer to form a second floating junction layer of a second conductive type;

Forming a second anti-reflection film on the backside field layer and the second floating junction layer patterned; And

And forming a rear electrode to be in contact with the rear electric field layer.

And the first floating junction layer is spaced apart from the front electrode, and the second floating junction layer is formed spaced apart from the rear electrode.
In the manufacturing method of the front and rear surface field solar cell, wherein the emitter of the second conductivity type is provided in the upper layer of the first conductive silicon substrate, and the rear field layer of the first conductivity type is provided in the lower layer of the substrate.

Depositing and patterning a first conductive amorphous silicon thin film layer on the emitter to form a first floating junction layer of a first conductive type;

Forming a first anti-reflection film on the emitter and the first floating junction layer patterned;

Forming a front electrode in contact with the emitter;

Forming a low concentration back surface field layer of a first conductivity type on a lower layer of the substrate;

Depositing and patterning a second conductive amorphous silicon thin film layer on the low concentration backside field layer to form a second floating junction layer of a second conductive type;

Forming a local high concentration backside field layer of a first conductivity type on the low concentration backside field layer;

Forming a second anti-reflection film on the low concentration back surface layer, the local high concentration back surface layer, and the second floating junction layer; And

And forming a rear electrode to be in contact with the local high concentration rear field layer,

And the first floating junction layer is spaced apart from the front electrode, and the second floating junction layer is formed spaced apart from the rear electrode.
A silicon substrate of a first conductivity type;

A high concentration emitter of a second conductivity type provided in the upper portion of the substrate;

A low concentration emitter of a second conductivity type provided on the high concentration emitter;

An anti-reflection film provided on the low concentration emitter;

A front electrode in contact with the high concentration emitter;

A first conductivity type backside field layer provided on the substrate underlayer; And

Emitter solar cell comprising a back electrode provided on the back field layer.
The method of claim 53,

The silicon substrate is n-type, the anti-reflection film is an emitter solar cell, characterized in that the Al 2 O 3 dielectric layer thin film.
The method of claim 53,

The silicon substrate is n-type, and the anti-reflection film is an AlN dielectric layer thin film, characterized in that the solar cell.
Forming a high concentration emitter and a low concentration emitter of a second conductivity type on an upper layer of the first conductivity type silicon substrate;

Forming an anti-reflection film on the low concentration emitter;

Forming a front electrode in contact with the high concentration emitter;

Forming a first conductivity type backside field layer under the substrate; And

Emitter solar cell manufacturing method comprising the step of forming a back electrode on the back field layer.
The method of claim 56, wherein

Forming a high concentration emitter and a low concentration emitter of the second conductivity type on the upper layer of the first conductivity type silicon substrate,

And forming a high concentration emitter by forming a low concentration emitter on the upper portion of the substrate, and then implanting a high concentration of the impurity atoms by ion implantation with high energy into a predetermined depth region of the low concentration emitter.
The method of claim 56, wherein

Forming a high concentration emitter and a low concentration emitter of the second conductivity type on the upper layer of the first conductivity type silicon substrate,

Forming a low concentration emitter by forming a high concentration emitter on the upper layer of the substrate and then diffusing the impurity atoms present on the surface of the substrate to the outside by forming a film having a solubility and a diffusion coefficient different from that of the substrate on the high concentration emitter. Emitter solar cell manufacturing method characterized in that.
The method of claim 56, wherein

Forming a high concentration emitter and a low concentration emitter of the second conductivity type on the upper layer of the first conductivity type silicon substrate,

After forming a high concentration emitter in the upper layer of the substrate, a small amount of secondary impurity atoms to form a semiconductor type different from the substrate in the upper portion of the high concentration emitter to offset the existing impurity atoms to form a low concentration emitter, characterized in that Emitter solar cell manufacturing method.