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WO2012081605A1 - Substrate storage device - Google Patents

Substrate storage device Download PDF

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Publication number
WO2012081605A1
WO2012081605A1 PCT/JP2011/078876 JP2011078876W WO2012081605A1 WO 2012081605 A1 WO2012081605 A1 WO 2012081605A1 JP 2011078876 W JP2011078876 W JP 2011078876W WO 2012081605 A1 WO2012081605 A1 WO 2012081605A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
window
roller
container
rollers
Prior art date
Application number
PCT/JP2011/078876
Other languages
French (fr)
Japanese (ja)
Inventor
浜田　智秀
徹 木内
鈴木　智也
Original Assignee
株式会社ニコン
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社ニコン filed Critical 株式会社ニコン
Priority to CN2011800598185A priority Critical patent/CN103261066A/en
Priority to JP2012548803A priority patent/JPWO2012081605A1/en
Priority to KR1020137016405A priority patent/KR20140004663A/en
Publication of WO2012081605A1 publication Critical patent/WO2012081605A1/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H75/00—Storing webs, tapes, or filamentary material, e.g. on reels
    • B65H75/02—Cores, formers, supports, or holders for coiled, wound, or folded material, e.g. reels, spindles, bobbins, cop tubes, cans, mandrels or chucks
    • B65H75/34—Cores, formers, supports, or holders for coiled, wound, or folded material, e.g. reels, spindles, bobbins, cop tubes, cans, mandrels or chucks specially adapted or mounted for storing and repeatedly paying-out and re-storing lengths of material provided for particular purposes, e.g. anchored hoses, power cables
    • B65H75/38—Cores, formers, supports, or holders for coiled, wound, or folded material, e.g. reels, spindles, bobbins, cop tubes, cans, mandrels or chucks specially adapted or mounted for storing and repeatedly paying-out and re-storing lengths of material provided for particular purposes, e.g. anchored hoses, power cables involving the use of a core or former internal to, and supporting, a stored package of material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H75/00—Storing webs, tapes, or filamentary material, e.g. on reels
    • B65H75/02—Cores, formers, supports, or holders for coiled, wound, or folded material, e.g. reels, spindles, bobbins, cop tubes, cans, mandrels or chucks
    • B65H75/34—Cores, formers, supports, or holders for coiled, wound, or folded material, e.g. reels, spindles, bobbins, cop tubes, cans, mandrels or chucks specially adapted or mounted for storing and repeatedly paying-out and re-storing lengths of material provided for particular purposes, e.g. anchored hoses, power cables
    • B65H75/36—Cores, formers, supports, or holders for coiled, wound, or folded material, e.g. reels, spindles, bobbins, cop tubes, cans, mandrels or chucks specially adapted or mounted for storing and repeatedly paying-out and re-storing lengths of material provided for particular purposes, e.g. anchored hoses, power cables without essentially involving the use of a core or former internal to a stored package of material, e.g. with stored material housed within casing or container, or intermittently engaging a plurality of supports as in sinuous or serpentine fashion
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means

Definitions

  • the present invention relates to a substrate storage device.
  • a display element constituting a display device such as a display device
  • a liquid crystal display element and an organic electroluminescence (organic EL) element are known.
  • organic EL organic electroluminescence
  • active elements active devices that form thin film transistors (TFTs) on the substrate surface corresponding to each pixel have become mainstream.
  • a technique for forming a display element on a sheet-like substrate for example, a film member
  • a technique called a roll-to-roll system for example, a technique called a roll-to-roll system (hereinafter simply referred to as “roll system”) is known (see, for example, Patent Document 1).
  • roll system a technique called a roll-to-roll system
  • one sheet-like substrate for example, a belt-like film member
  • the fed substrate is wound around the substrate collection side recovery roller
  • the substrate is subjected to desired processing by a processing apparatus installed between the supply roller and the collection roller.
  • the substrate is transported using, for example, a plurality of transport rollers, etc., and a gate electrode, a gate insulating film, a semiconductor constituting a TFT using a plurality of processing devices (units)
  • a film, source / drain electrodes, and the like are formed, and components of the display element are sequentially formed on the surface to be processed of the substrate.
  • a light emitting layer, an anode, a cathode, an electric circuit, and the like are sequentially formed on a substrate.
  • the processed substrate is stored in a substrate storage device in a wound state, for example.
  • An object of an aspect of the present invention is to provide a substrate storage device that can suppress adhesion of foreign matter to a substrate.
  • a container having a storage chamber for storing a flexible substrate, a window provided in the container, and a part of the substrate stored in the storage chamber are opposed to the window.
  • a substrate storage device including a substrate transport unit that transports a substrate.
  • FIG. 1 is a diagram showing an internal configuration of a substrate storage apparatus according to the first embodiment of the present invention.
  • the substrate storage device STR includes a container CT that accommodates a flexible substrate S formed in a strip shape, and a substrate transport unit CV on which the substrate S is placed.
  • the substrate storage device STR stores the substrate S in a container CT placed on the floor and stores the substrate S in a state of being hung on the substrate transport unit CV.
  • the substrate S is formed in an endless shape in the longitudinal direction.
  • the substrate S for example, a foil such as a resin film or stainless steel can be used.
  • the resin film is made of polyethylene resin, polypropylene resin, polyester resin, ethylene vinyl copolymer resin, polyvinyl chloride resin, cellulose resin, polyamide resin, polyimide resin, polycarbonate resin, polystyrene resin, vinyl acetate resin, etc. Can be used.
  • the dimension in the short direction of the substrate S is, for example, about 50 cm to 2 m
  • the dimension in the long direction is, for example, 10 m or more.
  • this dimension is only an example and is not limited thereto.
  • the dimension in the Y direction of the substrate S may be 50 cm or less, or 2 m or more. In the present embodiment, even the substrate S having a dimension in the Y direction exceeding 2 m is preferably used.
  • the dimension in the X direction of the substrate S (the dimension in the longitudinal direction, the dimension of one round) may be 10 m or less.
  • the substrate S has a thickness of 1 mm or less, for example, and is formed to have flexibility.
  • the term “flexibility” refers to the property that the substrate can be bent without being broken or broken even when a predetermined force of at least its own weight is applied to the substrate. Further, for example, the property of bending by the predetermined force is also included in the flexibility. Further, the flexibility varies depending on the material, size, thickness, or environment such as temperature of the substrate.
  • a single strip-shaped substrate may be used, but a configuration in which a plurality of unit substrates are connected and formed in a strip shape may be used.
  • the substrate S preferably has a smaller coefficient of thermal expansion so that the dimensions do not change even when subjected to heat of about 200 ° C., for example.
  • an inorganic filler can be mixed with a resin film to reduce the thermal expansion coefficient.
  • the inorganic filler include titanium oxide, zinc oxide, alumina, silicon oxide and the like.
  • the floor surface of the XYZ orthogonal coordinate system is the XY plane.
  • the short direction of the substrate S is defined as the Y-axis direction
  • the direction orthogonal to the Y-axis direction is defined as the X direction.
  • a direction perpendicular to the floor surface (XY plane) is taken as a Z-axis direction.
  • the container CT has a substantially rectangular parallelepiped shape, for example.
  • the ⁇ X side wall portion CTa of the container CT has a shape in which the + Z side end portion is inclined, for example, to the + X side.
  • the + X side end portion CTb of the container CT has a shape in which the + Z side end portion protrudes to the + X side, for example.
  • a storage chamber RM surrounded by wall portions (including the wall portions CTa and CTb) constituting the container CT is formed inside the container CT.
  • the container CT has a window portion W on the wall portion CTa.
  • the window portion W is an opening formed through the wall portion CTa so as to communicate the outside of the container CT with the storage chamber RM.
  • the window part W is arrange
  • a connecting portion J is provided in the wall portion CTa.
  • the connection part J is a part connected to the apparatus side connection parts 90 and 91 provided in external apparatuses, such as processing apparatus PA, for example.
  • the window W is provided with a door member to be described later. The door member is opened when the processing apparatus PA is connected, and is closed when the connection of the processing apparatus PA is released. That is, in a state where the processing apparatus PA is not connected, the door member can prevent foreign matters such as dust and dirt from entering the container CT.
  • connection portion J can connect the processing apparatus PA and the container CT so as to suppress the relative position between the processing apparatus PA and the container CT from shifting.
  • the apparatus side connection parts 90 and 91 are connected to the edge part of the window part W among wall part CTa of the container CT.
  • the connection portion J is provided at the edge of the window portion W so as to correspond to the connection position of the device side connection portions 90 and 91.
  • the connection part J is provided in the same wall part CTa as the wall part CTa in which the window part W was provided, and is arrange
  • the processing apparatus PA is provided with nip rollers 92 and 93, a processing section 95 and the like in addition to the apparatus side connection sections 90 and 91.
  • the nip rollers 92 and 93 are disposed at positions that sandwich the processing unit 95 in the Z direction.
  • the + X side end point of the nip roller 92 and the + X side end point of the nip roller 93 are both in contact with a plane parallel to the YZ plane.
  • the processing unit 95 is formed to perform a predetermined process on the processing surface 95a indicated by a broken line in FIG.
  • the processing surface 95a is set parallel to the YZ plane, and is set on a plane including the + X side end points of the nip rollers 92 and 93, for example.
  • Examples of the predetermined process include a coating process, a film forming process, an exposure process, a developing process, a heating process, and a cooling process. Of course, it may be configured to perform other processing.
  • the substrate transport unit CV includes a plurality of rollers R that fold back the substrate S in the accommodation chamber RM.
  • rollers 11 to 66 When distinguishing a plurality of rollers R, they are expressed as rollers 11 to 66.
  • Each roller R has a shaft portion Ra parallel to the Y direction.
  • Each roller R is rotatably supported by the shaft portion Ra on, for example, the + Y side and ⁇ Y side wall portions of the container CT.
  • a cylindrical outer peripheral portion Rb around which the accommodated substrate S is hung is provided around the shaft portion Ra of each roller R.
  • the plurality of rollers R are sequentially arranged on the transport path of the substrate S in the accommodation chamber RM.
  • the plurality of rollers R are arranged separately in the vertical direction with respect to the central portion of the storage chamber RM.
  • the plurality of rollers R includes a first portion RM1 on the ⁇ Z side with respect to the central portion in the Z direction of the storage chamber RM, and a + Z side of the central portion in the Z direction of the storage chamber RM.
  • the second part RM2 is arranged separately.
  • the first portion RM1 of the accommodation chamber RM is provided with three rows of rollers R arranged in the X direction in the Z direction.
  • the diameters of the rollers R constituting one row are the same. Further, the diameter of the roller R decreases as the distance from the ⁇ Z side toward the + Z side approaches the central portion in the Z direction of the storage chamber RM.
  • a roller 12 and a roller 13 that change the direction of the substrate S are provided.
  • they when distinguishing the rows of the rollers R of the first portion RM1, they are expressed as a first row L1 to a third row L3 in order from the ⁇ Z side to the + Z side of the storage chamber RM.
  • the rollers 29, 33, 65 arranged on the most ⁇ X side among the rollers R of the first row L1, the second row L2, and the third row L3 are fixed by the roller support member 67.
  • the roller support member 67 is provided so as to be movable along the guide portion 68 in the Z direction.
  • the roller support member 67 is connected to the drive mechanism 69, for example.
  • the drive mechanism 69 is configured to be able to slide the roller support member 67 in the Z direction.
  • the amount and timing of movement of the roller support member 67 by the drive mechanism 69 are controlled by, for example, the control device CONT.
  • the second part RM2 is provided with a roller 11, a roller 31, and a roller 49 that change the direction of the substrate S in addition to the row of the rollers R described above.
  • roller 11 disposed in the second portion RM2 and the roller 12 disposed in the first portion RM1 are disposed at positions sandwiching the window portion W in the Z direction.
  • the rollers R of the second portion RM2 they are expressed as the fourth row L4 to the sixth row L6 in order from the ⁇ Z side to the + Z side of the storage chamber RM.
  • the substrate S is placed on the rollers 11 to 66 in order, so that the transport path of the storage chamber RM is guided.
  • the transfer path is a path that circulates through the storage chamber RM.
  • the transport path of the substrate S will be described with the roller 11 as a starting point and the clockwise direction as the forward direction.
  • the substrate S hung on the roller 11 is hung on the roller 12 disposed on the ⁇ Z side of the roller 11 and is folded back to the + X side.
  • the downstream side of the roller 12 in the substrate S is folded back to the + Z side by the roller 13 disposed in the vicinity of the corner on the ⁇ Z side and the + X side of the storage chamber RM.
  • the downstream side of the roller 13 in the substrate S is hung on the roller 14 disposed on the most + X side in the fourth row L4 of the roller R and folded back to the ⁇ Z side.
  • the downstream side of the roller 14 in the substrate S is hung on the roller 15 disposed on the most + X side in the first row L1 of the roller R and folded back to the + Z side.
  • the downstream side of the roller 15 in the substrate S is hung on the roller 16 disposed adjacent to the ⁇ X side of the roller 14 in the fourth row L4 and folded back to the ⁇ Z side.
  • the downstream side of the roller 16 in the substrate S is hung on the roller 17 disposed adjacent to the ⁇ X side of the roller 15 in the first row L1 and is folded back to the + Z side.
  • roller R rollers 18, 20, 22, 24, 26, 28, and 30
  • roller R rollers 19, 21, 23, 25, 27, and 29
  • the downstream side of the substrate S hung on the most ⁇ X side roller 30 in the fourth row L4 is folded back to the ⁇ X side and hung on the direction changing roller 31.
  • the downstream side of the roller 31 in the substrate S is hung on a roller 32 disposed adjacent to the + Z side of the roller 30 and is folded back to the ⁇ Z side.
  • the substrate S includes rollers R (rollers 33, 35, 37, 39, 41, 43, 45, and 47) in the second row L2 and rollers R (rollers 34, 36, 38, 40, and 42) in the fifth row R5. , 44, 46 and 48) are alternately applied in the + X direction.
  • the downstream side of the substrate S hung on the most + X side roller 48 in the fifth row L5 is folded back to the + X side and hung on the direction changing roller 49.
  • the downstream side of the roller 49 in the substrate S is hung on the roller 50 disposed adjacent to the + Z side of the roller 48 and is folded back to the ⁇ Z side.
  • the substrate S includes rollers R (rollers 51, 53, 55, 57, 59, 61, 63, and 65) in the third row L3 and rollers R (rollers 52, 54, 56, 58, and 60) in the fifth row R5. , 62, 64 and 66) are alternately applied in the ⁇ X direction.
  • the downstream side of the substrate S hung on the most -X side roller 66 of the sixth row L6 is folded back to the -Z side and hung on the roller 11 described above.
  • the roller 11 and the roller 12 are arrange
  • substrate conveyance part CV has the board
  • the substrate support part SP is provided at a position where the substrate S is sandwiched between the window part W of the container CT.
  • the substrate support portion SP is provided between the roller 11 and the roller 12 in the Z direction.
  • the substrate support SP includes a support plate 71 that supports the first surface Sa of the substrate S, a pair of support rollers 72 and 73, and a support member 74 that supports the support plate 71 and the support rollers 72 and 73. is doing.
  • the support plate 71 has a support surface 71a formed on the -X side.
  • the support surface 71a is formed flat.
  • the support plate 71 is disposed so that the support surface 71a is parallel to the YZ plane. In this state, the support surface 71a is disposed to face the first surface Sa of the substrate S.
  • Support rollers 72 and 73 are provided at positions that sandwich the support plate 71 in the Z direction.
  • the support rollers 72 and 73 are formed in a cylindrical shape or a columnar shape.
  • the support rollers 72 and 73 are arranged so that the central axis is parallel to the Y direction.
  • the dimensions of the support rollers 72 and 73 in the Y direction are larger than the dimension of the substrate S in the Y direction.
  • the support rollers 72 and 73 are supported by a support member 74 so as to be rotatable in the circumferential direction.
  • the support member 74 is integrally fixed so that the support plate 71 and the support rollers 72 and 73 do not move independently in the X direction, the Y direction, and the Z direction.
  • the ⁇ X side ends (points supporting the substrate S) of the support rollers 72 and 73 and the support surface 71a are arranged on the same plane. Accordingly, the substrate S is supported by the support surface 71a and the two support rollers 72 and 73 disposed on the same plane as the support surface 71a.
  • the support member 74 is provided so as to be movable in the X direction.
  • the substrate transport unit CV has a drive mechanism 75 that moves the support member 74 in the X direction.
  • the control device CONT can adjust the amount of movement of the support member 74 in the X direction, the timing of movement, and the like by controlling the drive mechanism 75.
  • guide rollers 81 and 82 rotatably supported on the side wall parallel to the XZ plane of the container CT are provided. ing.
  • the guide rollers 81 and 82 prevent the substrate S from coming into contact with the edge of the window portion W when the support member 74 (the support rollers 72 and 73 and the support plate 71) moves in the ⁇ X direction.
  • FIG. 2 is a diagram illustrating an example of the operation of the substrate storage device STR.
  • the apparatus side connection portions 90 and 91 of the external processing apparatus PA are connected to the connection portion J of the substrate storage device STR. Connect to.
  • control apparatus CONT controls the drive mechanism 75 to move the support member 74 in the ⁇ X direction.
  • the support rollers 72 and 73 come into contact with the first surface Sa of the substrate S, and the first surface Sa is pulled out to the ⁇ X side.
  • the control device CONT moves the support member 74 to a position where the substrate S is sandwiched between the support rollers 72 and 73 and the nip rollers 92 and 93.
  • the portion Sc between the portion sandwiched between the support roller 72 and the nip roller 92 and the portion sandwiched between the support roller 73 and the nip roller 93 in the substrate S is moved from the window portion W to the accommodation chamber RM. It is pulled out and exposed to the processing unit 95 of the processing apparatus PA.
  • the exposed portion Sc is supported by the support surface 71a of the support plate 71, and is disposed parallel to the YZ plane following the support surface 71a. Further, the exposed portion Sc is disposed on the processing surface 95a by the processing unit 95 of the processing apparatus PA by being disposed following the support surface 71a.
  • the transport path of the substrate S changes from the state of FIG. Specifically, since the exposed portion Sc is drawn out of the substrate storage device STR from the window portion W, the transport path along the wall portion CTa on the ⁇ X side of the substrate storage device STR becomes longer.
  • the substrate S stored in the substrate storage device STR is formed in an endless shape and has a constant length. For this reason, it is necessary to adjust the tension of the substrate S so that an excessive tension is not applied to the substrate S.
  • control device CONT controls the drive mechanism 69 to move the roller support member 67 to the + Z side.
  • the rollers 29, 33, and 65 together with the roller support member 67 move along the guide portion 68 to the + Z side. For this reason, the conveyance path
  • control device CONT supports the support member so that the change amount of the transport path of the substrate S that is changed by the movement of the support member 74 is equal to the change amount of the transport path that is changed by the movement of the roller support member 67. At least one of the movement amount of 74 and the movement amount of the roller support member 67 is adjusted. By this operation, the length of the transport path of the substrate S is maintained to be constant, so that excessive tension is not applied to the substrate S.
  • the processing unit 95 performs processing on the second surface Sb of the substrate S.
  • the control device CONT controls the drive mechanism 69 and the drive mechanism 75 to return the roller support member 67 and the support member 74 to their original positions while keeping the transport path length of the substrate S constant.
  • the apparatus side connection units 90 and 91 are removed from the connection unit J, and the processing apparatus PA is retracted from the substrate storage apparatus STR. In this way, the processing for the substrate S is performed.
  • the container CT having the storage chamber RM for storing the flexible and endless substrate S, the window W provided in the container CT, and the storage Since the substrate transport section CV transports the substrate S so that a part Sc of the substrate S accommodated in the chamber RM faces the window portion W, the substrate S is exposed to the outside of the accommodation chamber RM in the window portion W. At the same time, the remaining portion of the substrate S can be prevented from being exposed. Thereby, since the exposure range of the board
  • the processing apparatus PA since the processing apparatus PA is connected to the substrate storage device STR in a state where the substrate S is accommodated in the accommodation chamber RM, the substrate S is processed. Processing can be performed in an environment where it is difficult to adhere. Thereby, it can prevent that a foreign material adheres to the board
  • FIG. 3 is a diagram showing a configuration of the substrate storage device STR2 according to the present embodiment.
  • the configuration of the container CT in the vicinity of the window portion W is different from that of the first embodiment, and thus this difference will be mainly described.
  • the substrate storage device STR2 has drawers 170 and 171 for extracting the substrate S from the window W to the outside.
  • the drawer portions 170 and 171 have arm portions 174 and 175 attached to the inner peripheral portion of the window portion W.
  • the arm portion 174 is attached to the inner peripheral surface of the window portion W on the + Z side.
  • the arm portion 175 is attached to the ⁇ Z side surface of the window portion W.
  • the arm portions 174 and 175 are provided so as to be rotatable in the ⁇ Y direction around the mounting position. Arm portions 174 and 175 are connected to arm drive portions 176 and 177, respectively.
  • the arm drive units 176 and 177 have a motor mechanism (not shown), for example.
  • the control device CONT can control the drive amount and drive timing of the arm drive units 176 and 177.
  • Guide rollers 172 and 173 are attached to the tip portions of the arm portions 174 and 175.
  • the guide rollers 172 and 173 are formed in a cylindrical shape, and are arranged so that the central axis is parallel to the Y axis.
  • the guide rollers 172 and 173 are rotatably provided in the circumferential direction ( ⁇ Y direction).
  • a mounting portion 178 for mounting an external processing apparatus PA is formed in the container CT. Instead of the mounting portion 178, an opening for arranging the external processing apparatus PA may be formed.
  • the control device CONT controls the arm driving units 176 and 177, and the arm unit 174 is rotated counterclockwise in the drawing and the arm unit 175 is rotated clockwise in the drawing. Rotate each.
  • the guide rollers 172 and 173 attached to the respective distal ends of the arm part 174 and arm part 175 are hung on the substrate S, and the substrate S is pulled out of the window part W. It is.
  • FIG. 4 is a diagram illustrating a state in which the substrate S is pulled out from the window portion W to the outside of the storage chamber RM by the drawer portions 170 and 171. As shown in FIG. 4, in a state where the substrate S is pulled out, the arms 174 and 175 are arranged so that the tips of the arms 174 and 175 face the ⁇ X side.
  • the substrate S is exposed to the outside of the window portion W while being hung on the guide rollers 172 and 173.
  • the support surface 179a of the substrate support member 179 is pressed against the second surface Sb of the exposed portion Sc between the guide rollers 172 and 173 in the substrate S.
  • the support surface 179a is a curved surface formed to be convex toward the + X side, for example.
  • the exposed portion Sc is arranged to be curved to the + X side following the support surface 179a.
  • the substrate support member 179 is a rotating drum, for example.
  • the control device CONT controls the drive mechanism 69 to move the roller support member 67 to the + Z side along the guide portion 68 and adjust the path length of the transport path of the substrate S.
  • the structure which can move the roller support member 67 in the Z direction in a wide range compared with said 1st embodiment may be sufficient. Thereby, the adjustment amount of the path length of the transport path of the substrate S is increased.
  • the processing apparatus PA After the substrate S is pulled out of the storage chamber RM, the processing apparatus PA is disposed in the mounting portion 178 of the container CT. In a state where the processing device PA is mounted on the mounting unit 178, the processing unit 195 is directed to the ⁇ X side of the window W. For this reason, the exposed portion Sc is disposed at a position facing the processing unit 195 when viewed in the X direction. In this state, the processing unit 195 performs processing on the first surface Sa of the substrate S.
  • the processing device PA is removed from the mounting unit 178.
  • the control device CONT accommodates the arm portions 174 and 175 in the accommodation chamber RM of the container CT and simultaneously moves the roller support member 67 to the ⁇ Z side. By this operation, the substrate S is accommodated in the accommodation chamber RM together with the arm portions 174 and 175 while keeping the length of the transport path of the substrate S constant.
  • the substrate S is largely pulled out from the window W using the arms 174 and 175, and an external device such as the processing apparatus PA is provided between the exposed portion Sc of the substrate S and the container CT. Therefore, the first surface Sa of the substrate S can be processed.
  • the substrate support member for example, the rotating drum
  • the shape is in accordance with the shape of the support surface 179a.
  • the substrate S can be disposed at a position facing the processing unit 195. For example, if the support surface 179a is a flat surface, the substrate S is placed at a position facing the processing unit 195 in a flat state.
  • the window portion W is arranged on the wall portion CTa.
  • the present invention is not limited to this.
  • the configuration may be arranged on the wall.
  • the window part W is in several places of the container CT. It may be provided. In this case, a configuration in which a plurality of window portions W are disposed on one wall portion may be employed, or a configuration in which one or a plurality of window portions W are provided on a plurality of wall portions may be employed.
  • the door member may be a slide member SL that opens and closes the window W in FIG.
  • the slide member SL is connected to the slide drive unit 200.
  • the slide drive unit 200 is configured such that the drive amount and the drive timing are controlled by the control of the control device CONT.
  • the control device CONT may open and close the window portion W according to the connection state with the external processing device.
  • the control device CONT moves the slide member SL to the ⁇ Z side so that the window portion W is opened.
  • the control device CONT moves the slide member SL to the + Z side so that the window portion W is closed.
  • the configuration may be such that it is in contact with the first surface Sa of the substrate S and not in contact with the second surface Sb.
  • the substrate transport section CV has two transport sections CV1 and CV2.
  • the substrate S is folded inward in a spiral shape (+ X side in the drawing) by a plurality of rollers R so as to contact only the first surface Sa, and then guided by the roller R1. It is folded back toward the member 201.
  • the downstream side of the roller R1 of the substrate S is folded at one side 201a of the guide member 201.
  • the downstream side of one side 201 a of the substrate S is folded at an angle of 45 ° with the oblique side 201 b of the guide member 201.
  • the downstream side of the oblique side 201 b of the substrate S is turned back at the other side 201 c of the guide member 201 and then directed to the guide member 202.
  • the first surface Sa of the substrate S is wound around the guide member 201.
  • the portion of the substrate S directed to the guide member 202 is folded back at one side 202a of the guide member 202, and is folded back along the oblique side 202b and the other side 202c in the same manner as in the case of the guide member 201.
  • the downstream side of the other side 202c is directed to the roller R2. In this way, the first surface Sa of the substrate S is wound around the guide member 202.
  • the downstream side of the roller R2 is turned outward in a spiral shape by the plurality of rollers R, and then directed to the ⁇ X side transport unit CV2 in the drawing.
  • the transport unit CV2 has the same configuration as the transport unit CV1. In other words, the substrate S is folded in a spiral shape while contacting only the first surface Sa of the substrate S, and the roller R1, the guide members 201 and 202, and the roller R2 are provided at the center.
  • the first surface Sa is in contact with the rollers R, R1, R2 and the guide members 201, 202, and the second surface Sb is not in contact with these rollers and the guide member. S is folded.
  • substrate conveyance part CV can convey the board
  • the configuration of the guide members 201 and 202 is not limited to the configuration formed in the right isosceles triangle shape as described above.
  • a cylindrical roller is arranged on each side of the right angle isosceles triangle. It doesn't matter.
  • the configuration shown in FIG. 7 may be superposed in the Y direction.
  • conveyance units CV3 and CV4 are provided on the + Y side of the conveyance units CV1 and CV2.
  • the transport unit CV1 and the transport unit CV3 have the same configuration
  • the transport unit CV2 and the transport unit CV4 have the same configuration.
  • Direction changing rollers 301 to 304 are arranged between the conveyance units CV1 and CV2 and the conveyance units CV3 and CV4.
  • the direction is changed by the direction changing rollers 301 and 302 and hung on the transport parts CV3 and CV4.
  • the substrate S is hung on the conveyance units CV3 and CV4, then the direction is changed by the direction changing rollers 303 and 304, and is again hung on the conveyance unit CV1 and the conveyance unit CV2. It is always the first surface Sa of the substrate S that is hung on the direction changing rollers 301 to 304. In this way, the substrate S is hung so as to circulate between the transport unit CV1 to the transport unit CV4.
  • the substrates S are accommodated double in the Y direction.
  • the configuration may be such that the windows W1 and W2 are provided side by side in the Y direction. Since processing can be performed for each of the substrates S that are doubled in the Y direction, the processing efficiency can be increased.
  • a plurality of the configurations shown in FIG. 7 may be arranged in the X direction and the Z direction.
  • conveyance units CV3 and CV4 are provided on the ⁇ Z side of the conveyance units CV1 and CV2.
  • the transport unit CV1 and the transport unit CV3 have the same configuration
  • the transport unit CV2 and the transport unit CV4 have the same configuration.
  • each of the transport units CV1 to CV4 may have a configuration in which windows W1 to W4 are provided. Thereby, since processing can be performed at a plurality of locations, processing efficiency can be improved.
  • a processing unit may be provided in the storage chamber RM of the substrate storage device STR.
  • a processing unit that performs each process such as a plating process, a cleaning process, a drying process, and a heat treatment can be arranged on the substrate.
  • a processing unit PA2 that performs processing on the second surface Sb is provided in the storage chamber RM. It doesn't matter.
  • the storage device that stores the endless substrate in the longitudinal direction has been described.
  • the present invention is not limited to this configuration.
  • a supply roller, a recovery roller, a plurality of rollers for transporting the substrate wound around the supply roller to the window W1, and a substrate via the window W1 are recovered.
  • a plurality of rollers that send the substrate to the collection roller may be disposed, and the substrate conveyed in a roll-to-roll manner may be stored.
  • the said embodiment although demonstrated taking the example of the structure by which the roller R was arrange
  • the present invention can be applied even when the roller R is arranged so that the central axis is parallel to the X direction or the Z direction.
  • a mechanism for adjusting the conveyance path to be short may be adopted as employed in the first embodiment and the second embodiment.
  • the transport path is shortened by moving the roller, and the path length of the substrate transport path is adjusted to be constant. You may employ
  • Substrate storage device S ... Substrate Sa ... First side of substrate S Sb ... Second side of substrate S SP ... Substrate support part CT ... Container CV ... Substrate transport part CTa, CTb ... Wall part RM ... Containment chamber W , W1, W2 ... window portion J ... connection portion PA ... processing device R ... roller 67 ... roller support member 68 ... guide portion 69, 75 ... drive mechanism 71a ... support surface 90, 91 ... device side connection portion 92, 93 ... nip Roller 95 ... Processing unit 95a ... Processing surface 172, 173 ... Guiding rollers 174, 175 ... Arm unit 176, 177 ... Arm drive unit 178 ... Mounting unit 179 ... Substrate support member 179a ... Support surface 195 ... Processing unit 200 ... Slide drive unit 201, 202 ... guide members

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Abstract

A substrate storage device (STR) is provided with: a container (CT) having a chamber (RM) containing a flexible substrate (S) such as resin film; a window (W) provided to the container (CT); and a substrate conveyor (CV) that conveys the substrate in such a manner that part of the substrate (S) faces the window (W). The container (CT) has a junction (J) which connects to a processing apparatus (PA). The endless substrate (S) is contained in the chamber (RM) by being wrapped along rollers (11-66). Some of the rollers (29, 33, 65) are able to move in the Z direction, and the tension of the substrate (S) is adjusted by moving these rollers. A portion (Sc) of the substrate (S) is drawn outside from the window, and that portion (Sc) is processed by a processing unit (95) of the processing apparatus (PA). The window (W) can be covered by a slide member (SL). The adhesion of foreign particles on the substrate (S) can be minimized.

Description

基板保管装置Substrate storage device
　本発明は、基板保管装置に関する。
　　本願は、２０１０年１２月１５日に出願された米国特許仮出願６１／４２３，１９８号に基づき優先権を主張し、その内容をここに援用する。 The present invention relates to a substrate storage device.
This application claims priority based on US Provisional Application No. 61 / 423,198, filed Dec. 15, 2010, the contents of which are incorporated herein by reference.
　ディスプレイ装置などの表示装置を構成する表示素子として、例えば液晶表示素子、有機エレクトロルミネッセンス（有機ＥＬ）素子が知られている。現在、これらの表示素子では、各画素に対応して基板表面に薄膜トランジスタ（Thin Film Transistor：ＴＦＴ）を形成する能動的素子（アクティブデバイス）が主流となってきている。 As a display element constituting a display device such as a display device, for example, a liquid crystal display element and an organic electroluminescence (organic EL) element are known. Currently, in these display elements, active elements (active devices) that form thin film transistors (TFTs) on the substrate surface corresponding to each pixel have become mainstream.
　近年では、シート状の基板（例えばフィルム部材など）上に表示素子を形成する技術が提案されている。このような技術として、例えばロール・トゥ・ロール方式（以下、単に「ロール方式」と表記する）と呼ばれる手法が知られている（例えば、特許文献１参照）。ロール方式は、基板供給側の供給用ローラーに巻かれた１枚のシート状の基板（例えば、帯状のフィルム部材）を送り出すと共に送り出された基板を基板回収側の回収用ローラーで巻き取りながら、供給用ローラーと回収用ローラーとの間に設置された処理装置により基板に所望の加工を施していくものである。 Recently, a technique for forming a display element on a sheet-like substrate (for example, a film member) has been proposed. As such a technique, for example, a technique called a roll-to-roll system (hereinafter simply referred to as “roll system”) is known (see, for example, Patent Document 1). In the roll method, one sheet-like substrate (for example, a belt-like film member) wound around a substrate supply side supply roller is sent out, and the fed substrate is wound around the substrate collection side recovery roller, The substrate is subjected to desired processing by a processing apparatus installed between the supply roller and the collection roller.
　基板が送り出されてから巻き取られるまでの間に、例えば複数の搬送ローラー等を用いて基板が搬送され、複数の処理装置(ユニット)を用いてＴＦＴを構成するゲート電極、ゲート絶縁膜、半導体膜、ソース・ドレイン電極等を形成し、基板の被処理面上に表示素子の構成要素を順次形成する。例えば、有機ＥＬの素子を形成する場合には、発光層、陽極、陰極、電気回路等を基板上に順次形成する。処理が施された基板は、例えば巻かれた状態で基板保管装置に保管される。 Between the time when the substrate is delivered and the time it is wound up, the substrate is transported using, for example, a plurality of transport rollers, etc., and a gate electrode, a gate insulating film, a semiconductor constituting a TFT using a plurality of processing devices (units) A film, source / drain electrodes, and the like are formed, and components of the display element are sequentially formed on the surface to be processed of the substrate. For example, in the case of forming an organic EL element, a light emitting layer, an anode, a cathode, an electric circuit, and the like are sequentially formed on a substrate. The processed substrate is stored in a substrate storage device in a wound state, for example.
国際公開第２００６／１００８６８号International Publication No. 2006/100868
　しかしながら、ロール・トゥ・ロール方式では、基板を送り出してから、基板を回収するまでの間、基板の表面は、大半が基板保管装置の外部に露出されることになるため、基板に対して埃などの異物が付着するおそれがある。 However, in the roll-to-roll method, since most of the surface of the substrate is exposed to the outside of the substrate storage device between the time when the substrate is sent out and the time when the substrate is recovered, dust is applied to the substrate. There is a risk that foreign matter such as
　本発明の態様は、基板に対する異物の付着を抑えることができる基板保管装置を提供することを目的とする。 An object of an aspect of the present invention is to provide a substrate storage device that can suppress adhesion of foreign matter to a substrate.
　本発明の態様に従えば、可撓性を有する基板を収容する収容室を有する容器と、容器に設けられる窓部と、収容室に収容された基板の一部が窓部に対向するように基板を搬送する基板搬送部とを備える基板保管装置が提供される。 According to the aspect of the present invention, a container having a storage chamber for storing a flexible substrate, a window provided in the container, and a part of the substrate stored in the storage chamber are opposed to the window. There is provided a substrate storage device including a substrate transport unit that transports a substrate.
　本発明の態様によれば、基板に対する異物の付着を抑えることができる基板保管装置を提供できる。 According to the aspect of the present invention, it is possible to provide a substrate storage device that can suppress adhesion of foreign matters to a substrate.
本発明の第一実施形態に係る基板保管装置の内部構成を示す断面図である。It is sectional drawing which shows the internal structure of the board | substrate storage apparatus which concerns on 1st embodiment of this invention. 本発明の第一実施形態に係る基板保管装置の動作の一例を示す断面図である。It is sectional drawing which shows an example of operation | movement of the board | substrate storage apparatus which concerns on 1st embodiment of this invention. 本発明の第二実施形態に係る基板保管装置の構成を示す断面図である。It is sectional drawing which shows the structure of the board | substrate storage apparatus which concerns on 2nd embodiment of this invention. 本発明の第二実施形態に係る基板保管装置の動作の一例を示す断面図である。It is sectional drawing which shows an example of operation | movement of the board | substrate storage apparatus which concerns on 2nd embodiment of this invention. 本発明に係る基板保管装置の他の例を示す図である。It is a figure which shows the other example of the board | substrate storage apparatus which concerns on this invention. 本発明に係る基板保管装置の他の例を示す図である。It is a figure which shows the other example of the board | substrate storage apparatus which concerns on this invention. 本発明に係る基板保管装置の他の例を示す図である。It is a figure which shows the other example of the board | substrate storage apparatus which concerns on this invention. 本発明に係る基板保管装置の他の例を示す図である。It is a figure which shows the other example of the board | substrate storage apparatus which concerns on this invention. 本発明に係る基板保管装置の他の例を示す図である。It is a figure which shows the other example of the board | substrate storage apparatus which concerns on this invention.
　以下、図面を参照して、本発明の実施の形態を説明する。　
　［第一実施形態］　
　図１は、本発明の第一実施形態に係る基板保管装置の内部構成を示す図である。　
　図１に示すように、基板保管装置ＳＴＲは、帯状に形成され可撓性を有する基板Ｓを収容する容器ＣＴと、基板Ｓが掛けられる基板搬送部ＣＶとを有する。基板保管装置ＳＴＲは、例えば床面に載置された容器ＣＴに基板Ｓを収容すると共に基板搬送部ＣＶに掛けた状態で保管する。基板Ｓは、長尺方向が無端状に形成されている。　 Embodiments of the present invention will be described below with reference to the drawings.
[First embodiment]
FIG. 1 is a diagram showing an internal configuration of a substrate storage apparatus according to the first embodiment of the present invention.
As shown in FIG. 1, the substrate storage device STR includes a container CT that accommodates a flexible substrate S formed in a strip shape, and a substrate transport unit CV on which the substrate S is placed. For example, the substrate storage device STR stores the substrate S in a container CT placed on the floor and stores the substrate S in a state of being hung on the substrate transport unit CV. The substrate S is formed in an endless shape in the longitudinal direction.
　基板Ｓとしては、例えば樹脂フィルムやステンレス鋼などの箔（フォイル）を用いることができる。例えば、樹脂フィルムは、ポリエチレン樹脂、ポリプロピレン樹脂、ポリエステル樹脂、エチレンビニル共重合体樹脂、ポリ塩化ビニル樹脂、セルロース樹脂、ポリアミド樹脂、ポリイミド樹脂、ポリカーボネート樹脂、ポリスチレン樹脂、酢酸ビニル樹脂、などの材料を用いることができる。 As the substrate S, for example, a foil such as a resin film or stainless steel can be used. For example, the resin film is made of polyethylene resin, polypropylene resin, polyester resin, ethylene vinyl copolymer resin, polyvinyl chloride resin, cellulose resin, polyamide resin, polyimide resin, polycarbonate resin, polystyrene resin, vinyl acetate resin, etc. Can be used.
　基板Ｓの短尺方向の寸法は例えば５０ｃｍ～２ｍ程度に形成されており、長尺方向の寸法（１周の寸法）は例えば１０ｍ以上に形成されている。勿論、この寸法は一例に過ぎず、これに限られることは無い。例えば基板ＳのＹ方向の寸法が５０ｃｍ以下であっても構わないし、２ｍ以上であっても構わない。本実施形態においては、Ｙ方向の寸法が２ｍを超える基板Ｓであっても好適に用いられる。また、基板ＳのＸ方向の寸法（長尺方向の寸法、１周の寸法）が１０ｍ以下であっても構わない。 The dimension in the short direction of the substrate S is, for example, about 50 cm to 2 m, and the dimension in the long direction (dimension of one round) is, for example, 10 m or more. Of course, this dimension is only an example and is not limited thereto. For example, the dimension in the Y direction of the substrate S may be 50 cm or less, or 2 m or more. In the present embodiment, even the substrate S having a dimension in the Y direction exceeding 2 m is preferably used. Further, the dimension in the X direction of the substrate S (the dimension in the longitudinal direction, the dimension of one round) may be 10 m or less.
　基板Ｓは、例えば、１ｍｍ以下の厚みを有し、可撓性を有するように形成されている。ここで可撓性とは、例えば基板に少なくとも自重程度の所定の力を加えても線断したり破断したりすることはなく、この基板を撓めることが可能な性質をいう。また、例えば上記所定の力によって屈曲する性質も可撓性に含まれる。また、上記可撓性は、前記基板の材質、大きさ、厚さ、又は温度などの環境、等に応じて変わる。なお、基板Ｓとしては、１枚の帯状の基板を用いても構わないが、複数の単位基板を接続して帯状に形成される構成としても構わない。
　基板Ｓは、例えば２００℃程度の熱を受けても寸法が変わらないように熱膨張係数が小さい方が好ましい。例えば、無機フィラーを樹脂フィルムに混合して熱膨張係数を小さくすることができる。無機フィラーの例としては、酸化チタン、酸化亜鉛、アルミナ、酸化ケイ素などが挙げられる。 The substrate S has a thickness of 1 mm or less, for example, and is formed to have flexibility. Here, the term “flexibility” refers to the property that the substrate can be bent without being broken or broken even when a predetermined force of at least its own weight is applied to the substrate. Further, for example, the property of bending by the predetermined force is also included in the flexibility. Further, the flexibility varies depending on the material, size, thickness, or environment such as temperature of the substrate. As the substrate S, a single strip-shaped substrate may be used, but a configuration in which a plurality of unit substrates are connected and formed in a strip shape may be used.
The substrate S preferably has a smaller coefficient of thermal expansion so that the dimensions do not change even when subjected to heat of about 200 ° C., for example. For example, an inorganic filler can be mixed with a resin film to reduce the thermal expansion coefficient. Examples of the inorganic filler include titanium oxide, zinc oxide, alumina, silicon oxide and the like.
　以下、基板保管装置ＳＴＲの説明においては、ＸＹＺ直交座標系を設定し、このＸＹＺ直交座標系を参照しつつ各部材の位置関係について説明する。以下の図においては、ＸＹＺ直交座標系のうち床面をＸＹ平面としている。ＸＹ平面のうち基板Ｓの短手方向をＹ軸方向とし、Ｙ軸方向に直交する方向をＸ方向としている。また、床面（ＸＹ平面）に垂直な方向をＺ軸方向としている。 Hereinafter, in the description of the substrate storage device STR, an XYZ orthogonal coordinate system is set, and the positional relationship of each member will be described with reference to the XYZ orthogonal coordinate system. In the following drawings, the floor surface of the XYZ orthogonal coordinate system is the XY plane. In the XY plane, the short direction of the substrate S is defined as the Y-axis direction, and the direction orthogonal to the Y-axis direction is defined as the X direction. A direction perpendicular to the floor surface (XY plane) is taken as a Z-axis direction.
　容器ＣＴは、例えば外形がほぼ直方体に形成されている。なお、容器ＣＴの－Ｘ側の壁部ＣＴａは、＋Ｚ側端部が例えば＋Ｘ側に傾斜した形状になっている。また、容器ＣＴの＋Ｘ側端部ＣＴｂは、＋Ｚ側端部が例えば＋Ｘ側に突出した形状になっている。容器ＣＴの内部には、容器ＣＴを構成する壁部（壁部ＣＴａ及びＣＴｂを含む）で囲まれた収容室ＲＭが形成されている。 The container CT has a substantially rectangular parallelepiped shape, for example. Note that the −X side wall portion CTa of the container CT has a shape in which the + Z side end portion is inclined, for example, to the + X side. Further, the + X side end portion CTb of the container CT has a shape in which the + Z side end portion protrudes to the + X side, for example. Inside the container CT, a storage chamber RM surrounded by wall portions (including the wall portions CTa and CTb) constituting the container CT is formed.
　容器ＣＴは、壁部ＣＴａに窓部Ｗを有している。窓部Ｗは、容器ＣＴの外部と収容室ＲＭとを連通するように壁部ＣＴａを貫通して形成された開口部である。窓部Ｗは、壁部ＣＴａのＺ方向のほぼ中央に配置されている。壁部ＣＴａには、接続部Ｊが設けられている。接続部Ｊは、例えば処理装置ＰＡなどの外部装置に設けられる装置側接続部９０及び９１に接続させる部分である。
　なお、窓部Ｗには、後述する扉部材が設けられており、この扉部材は、処理装置ＰＡが接続されることによって開き、処理装置ＰＡの接続が解除されることによって閉じる。すなわち、処理装置ＰＡが接続されていない状態において、この扉部材は、容器ＣＴ内に対する塵や埃等の異物の侵入を防ぐことができる。 The container CT has a window portion W on the wall portion CTa. The window portion W is an opening formed through the wall portion CTa so as to communicate the outside of the container CT with the storage chamber RM. The window part W is arrange | positioned in the approximate center of the Z direction of wall part CTa. A connecting portion J is provided in the wall portion CTa. The connection part J is a part connected to the apparatus side connection parts 90 and 91 provided in external apparatuses, such as processing apparatus PA, for example.
The window W is provided with a door member to be described later. The door member is opened when the processing apparatus PA is connected, and is closed when the connection of the processing apparatus PA is released. That is, in a state where the processing apparatus PA is not connected, the door member can prevent foreign matters such as dust and dirt from entering the container CT.
　接続部Ｊは、処理装置ＰＡと容器ＣＴとの相対位置がずれるのを抑制するように処理装置ＰＡと容器ＣＴとを接続可能である。装置側接続部９０及び９１は、容器ＣＴの壁部ＣＴａのうち窓部Ｗの縁部に接続されるようになっている。この場合、接続部Ｊは、装置側接続部９０及び９１の接続位置に対応するように、窓部Ｗの縁部に設けられている。このように、接続部Ｊは、窓部Ｗが設けられた壁部ＣＴａと同一の壁部ＣＴａに設けられており、窓部Ｗの周囲に配置されている。 The connection portion J can connect the processing apparatus PA and the container CT so as to suppress the relative position between the processing apparatus PA and the container CT from shifting. The apparatus side connection parts 90 and 91 are connected to the edge part of the window part W among wall part CTa of the container CT. In this case, the connection portion J is provided at the edge of the window portion W so as to correspond to the connection position of the device side connection portions 90 and 91. Thus, the connection part J is provided in the same wall part CTa as the wall part CTa in which the window part W was provided, and is arrange | positioned around the window part W. FIG.
　前記処理装置ＰＡには装置側接続部９０及び９１の他、ニップローラー９２及び９３や、処理部９５などが設けられている。ニップローラー９２及び９３は、Ｚ方向において処理部９５を挟む位置に配置されている。ニップローラー９２の＋Ｘ側端点及びニップローラー９３の＋Ｘ側端点は、ともにＹＺ平面に平行な平面に接している。 The processing apparatus PA is provided with nip rollers 92 and 93, a processing section 95 and the like in addition to the apparatus side connection sections 90 and 91. The nip rollers 92 and 93 are disposed at positions that sandwich the processing unit 95 in the Z direction. The + X side end point of the nip roller 92 and the + X side end point of the nip roller 93 are both in contact with a plane parallel to the YZ plane.
　処理部９５は、図１に破線で示す処理面９５ａに対して所定の処理を行うように形成されている。処理面９５ａは、ＹＺ平面に平行に設定されており、例えばニップローラー９２及び９３の＋Ｘ側の端点を含む平面上に設定されている。前記所定の処理としては、例えば、塗布処理、膜形成処理、露光処理、現像処理、加熱処理、冷却処理などが挙げられる。勿論、他の処理を行う構成であっても構わない。 The processing unit 95 is formed to perform a predetermined process on the processing surface 95a indicated by a broken line in FIG. The processing surface 95a is set parallel to the YZ plane, and is set on a plane including the + X side end points of the nip rollers 92 and 93, for example. Examples of the predetermined process include a coating process, a film forming process, an exposure process, a developing process, a heating process, and a cooling process. Of course, it may be configured to perform other processing.
　基板搬送部ＣＶは、収容室ＲＭにおいて基板Ｓを折り返す複数個のローラーＲを有している。以下、複数のローラーＲを区別する場合には、ローラー１１～ローラー６６と表記する。各ローラーＲは、それぞれＹ方向に平行な軸部Ｒａを有している。各ローラーＲは、この軸部Ｒａが例えば容器ＣＴの＋Ｙ側及び－Ｙ側の壁部に回転可能に支持されている。各ローラーＲの軸部Ｒａの周りには、収容された基板Ｓが掛けられる円筒状の外周部Ｒｂが設けられている。 The substrate transport unit CV includes a plurality of rollers R that fold back the substrate S in the accommodation chamber RM. Hereinafter, when distinguishing a plurality of rollers R, they are expressed as rollers 11 to 66. Each roller R has a shaft portion Ra parallel to the Y direction. Each roller R is rotatably supported by the shaft portion Ra on, for example, the + Y side and −Y side wall portions of the container CT. A cylindrical outer peripheral portion Rb around which the accommodated substrate S is hung is provided around the shaft portion Ra of each roller R.
　複数のローラーＲは、収容室ＲＭのうち基板Ｓの搬送経路に順に配置されている。複数のローラーＲは、収容室ＲＭの中央部に対して上下に分かれて配置されている。本実施形態では、複数のローラーＲは、収容室ＲＭのうちＺ方向の中央部に対して、－Ｚ側の第一部分ＲＭ１と、収容室ＲＭのうちＺ方向の中央部に対して＋Ｚ側の第二部分ＲＭ２とに分かれて配置されている。 The plurality of rollers R are sequentially arranged on the transport path of the substrate S in the accommodation chamber RM. The plurality of rollers R are arranged separately in the vertical direction with respect to the central portion of the storage chamber RM. In the present embodiment, the plurality of rollers R includes a first portion RM1 on the −Z side with respect to the central portion in the Z direction of the storage chamber RM, and a + Z side of the central portion in the Z direction of the storage chamber RM. The second part RM2 is arranged separately.
　収容室ＲＭのうち第一部分ＲＭ１には、Ｘ方向に８個配置された状態のローラーＲの列がＺ方向に３列設けられている。一つの列を構成するローラーＲの径は、同一となっている。また、－Ｚ側から＋Ｚ側へ収容室ＲＭのＺ方向の中央部に近づくにつれて、ローラーＲの径が小さくなっている。また、上記のローラーＲの列の他、基板Ｓの方向を転換するローラー１２及びローラー１３が設けられている。以下、第一部分ＲＭ１のローラーＲの列を区別する場合、収容室ＲＭの－Ｚ側から＋Ｚ側に向けて順に第一列Ｌ１～第三列Ｌ３と表記する。 The first portion RM1 of the accommodation chamber RM is provided with three rows of rollers R arranged in the X direction in the Z direction. The diameters of the rollers R constituting one row are the same. Further, the diameter of the roller R decreases as the distance from the −Z side toward the + Z side approaches the central portion in the Z direction of the storage chamber RM. In addition to the row of rollers R described above, a roller 12 and a roller 13 that change the direction of the substrate S are provided. Hereinafter, when distinguishing the rows of the rollers R of the first portion RM1, they are expressed as a first row L1 to a third row L3 in order from the −Z side to the + Z side of the storage chamber RM.
　第一部分ＲＭにおいて、第一列Ｌ１、第二列Ｌ２及び第三列Ｌ３のローラーＲのうちそれぞれ最も－Ｘ側に配置されたローラー２９、３３、６５は、ローラー支持部材６７によって固定されている。ローラー支持部材６７は、ガイド部６８に沿ってＺ方向に移動可能に設けられている。ローラー支持部材６７は、例えば駆動機構６９に接続されている。この駆動機構６９は、ローラー支持部材６７をＺ方向にスライド移動させることができるように構成されている。この駆動機構６９によるローラー支持部材６７の移動量及び移動のタイミングは、例えば制御装置ＣＯＮＴによって制御されるようになっている。 In the first portion RM, the rollers 29, 33, 65 arranged on the most −X side among the rollers R of the first row L1, the second row L2, and the third row L3 are fixed by the roller support member 67. . The roller support member 67 is provided so as to be movable along the guide portion 68 in the Z direction. The roller support member 67 is connected to the drive mechanism 69, for example. The drive mechanism 69 is configured to be able to slide the roller support member 67 in the Z direction. The amount and timing of movement of the roller support member 67 by the drive mechanism 69 are controlled by, for example, the control device CONT.
　収容室ＲＭのうち第二部分ＲＭ２には、Ｘ方向に９個配置された状態のローラーＲの列がＺ方向に３列設けられている。一つの列を構成するローラーＲの径は、同一となっている。また、＋Ｚ側から－Ｚ側へ収容室ＲＭのＺ方向の中央部に近づくにつれて、ローラーＲの径が小さくなっている。第二部分ＲＭ２には、上記のローラーＲの列の他、基板Ｓの方向を転換するローラー１１、ローラー３１及びローラー４９が設けられている。 In the second portion RM2 of the storage chamber RM, three rows of rollers R arranged in the X direction are provided in three rows in the Z direction. The diameters of the rollers R constituting one row are the same. Further, the diameter of the roller R decreases as the distance from the + Z side to the −Z side approaches the central portion of the storage chamber RM in the Z direction. The second part RM2 is provided with a roller 11, a roller 31, and a roller 49 that change the direction of the substrate S in addition to the row of the rollers R described above.
　また、第二部分ＲＭ２に配置されるローラー１１及び第一部分ＲＭ１に配置されるローラー１２は、窓部ＷをＺ方向に挟む位置に配置されている。以下、第二部分ＲＭ２のローラーＲの列を区別する場合、収容室ＲＭの－Ｚ側から＋Ｚ側に向けて順に第四列Ｌ４～第六列Ｌ６と表記する。 Further, the roller 11 disposed in the second portion RM2 and the roller 12 disposed in the first portion RM1 are disposed at positions sandwiching the window portion W in the Z direction. Hereinafter, when distinguishing the rows of the rollers R of the second portion RM2, they are expressed as the fourth row L4 to the sixth row L6 in order from the −Z side to the + Z side of the storage chamber RM.
　基板Ｓは、ローラー１１～ローラー６６に順に掛けられていくことにより、収容室ＲＭの搬送経路を案内されるようになっている。本実施形態では、基板Ｓが無端状に形成されているため、搬送経路は収容室ＲＭを循環する経路となる。以下、基板Ｓの搬送経路については、ローラー１１を起点とし、時計回りの方向を順方向として説明する。 The substrate S is placed on the rollers 11 to 66 in order, so that the transport path of the storage chamber RM is guided. In the present embodiment, since the substrate S is formed in an endless shape, the transfer path is a path that circulates through the storage chamber RM. Hereinafter, the transport path of the substrate S will be described with the roller 11 as a starting point and the clockwise direction as the forward direction.
　ローラー１１に掛けられた基板Ｓは、このローラー１１の－Ｚ側に配置されるローラー１２に掛けられて＋Ｘ側へ折り返される。基板Ｓのうちローラー１２の下流側は、収容室ＲＭの－Ｚ側かつ＋Ｘ側の角部近傍に配置されたローラー１３によって＋Ｚ側へ折り返される。基板Ｓのうちローラー１３の下流側は、ローラーＲの第四列Ｌ４のうち、最も＋Ｘ側に配置されるローラー１４に掛けられて－Ｚ側へ折り返される。 The substrate S hung on the roller 11 is hung on the roller 12 disposed on the −Z side of the roller 11 and is folded back to the + X side. The downstream side of the roller 12 in the substrate S is folded back to the + Z side by the roller 13 disposed in the vicinity of the corner on the −Z side and the + X side of the storage chamber RM. The downstream side of the roller 13 in the substrate S is hung on the roller 14 disposed on the most + X side in the fourth row L4 of the roller R and folded back to the −Z side.
　基板Ｓのうちローラー１４の下流側は、ローラーＲの第一列Ｌ１のうち、最も＋Ｘ側に配置されるローラー１５に掛けられて＋Ｚ側へ折り返される。基板Ｓのうちローラー１５の下流側は、第四列Ｌ４のうちローラー１４の－Ｘ側に隣接して配置されたローラー１６に掛けられて－Ｚ側へ折り返される。基板Ｓのうちローラー１６の下流側は、第一列Ｌ１のうちローラー１５の－Ｘ側に隣接して配置されたローラー１７に掛けられて＋Ｚ側へ折り返される。 The downstream side of the roller 14 in the substrate S is hung on the roller 15 disposed on the most + X side in the first row L1 of the roller R and folded back to the + Z side. The downstream side of the roller 15 in the substrate S is hung on the roller 16 disposed adjacent to the −X side of the roller 14 in the fourth row L4 and folded back to the −Z side. The downstream side of the roller 16 in the substrate S is hung on the roller 17 disposed adjacent to the −X side of the roller 15 in the first row L1 and is folded back to the + Z side.
　以下、第四列Ｌ４のローラーＲ（ローラー１８、２０、２２、２４、２６、２８及び３０）と第一列Ｌ１のローラーＲ（ローラー１９、２１、２３、２５、２７及び２９）とに交互に－Ｘ方向に掛けられていく。第四列Ｌ４の最も－Ｘ側のローラー３０に掛けられた基板Ｓの下流側は－Ｘ側へ折り返され、方向転換用のローラー３１に掛けられる。 Hereinafter, the roller R ( rollers 18, 20, 22, 24, 26, 28, and 30) in the fourth row L4 and the roller R ( rollers 19, 21, 23, 25, 27, and 29) in the first row L1 alternate. Is multiplied in the -X direction. The downstream side of the substrate S hung on the most −X side roller 30 in the fourth row L4 is folded back to the −X side and hung on the direction changing roller 31.
　基板Ｓのうちローラー３１の下流側は、ローラー３０の＋Ｚ側に隣接して配置されるローラー３２に掛けられて－Ｚ側へ折り返される。以下、基板Ｓは、第二列Ｌ２のローラーＲ（ローラー３３、３５、３７、３９、４１、４３、４５及び４７）と第五列Ｒ５のローラーＲ（ローラー３４、３６、３８、４０、４２、４４、４６及び４８）との間を＋Ｘ方向に交互に掛けられていく。第五列Ｌ５の最も＋Ｘ側のローラー４８に掛けられた基板Ｓの下流側は＋Ｘ側へ折り返され、方向転換用のローラー４９に掛けられる。 The downstream side of the roller 31 in the substrate S is hung on a roller 32 disposed adjacent to the + Z side of the roller 30 and is folded back to the −Z side. Hereinafter, the substrate S includes rollers R ( rollers 33, 35, 37, 39, 41, 43, 45, and 47) in the second row L2 and rollers R ( rollers 34, 36, 38, 40, and 42) in the fifth row R5. , 44, 46 and 48) are alternately applied in the + X direction. The downstream side of the substrate S hung on the most + X side roller 48 in the fifth row L5 is folded back to the + X side and hung on the direction changing roller 49.
　基板Ｓのうちローラー４９の下流側は、ローラー４８の＋Ｚ側に隣接して配置されるローラー５０に掛けられて－Ｚ側へ折り返される。以下、基板Ｓは、第三列Ｌ３のローラーＲ（ローラー５１、５３、５５、５７、５９、６１、６３及び６５）と第五列Ｒ５のローラーＲ（ローラー５２、５４、５６、５８、６０、６２、６４及び６６）との間を－Ｘ方向に交互に掛けられていく。第六列Ｌ６の最も－Ｘ側のローラー６６に掛けられた基板Ｓの下流側は－Ｚ側へ折り返され、上記のローラー１１に掛けられる。 The downstream side of the roller 49 in the substrate S is hung on the roller 50 disposed adjacent to the + Z side of the roller 48 and is folded back to the −Z side. Hereinafter, the substrate S includes rollers R ( rollers 51, 53, 55, 57, 59, 61, 63, and 65) in the third row L3 and rollers R ( rollers 52, 54, 56, 58, and 60) in the fifth row R5. , 62, 64 and 66) are alternately applied in the −X direction. The downstream side of the substrate S hung on the most -X side roller 66 of the sixth row L6 is folded back to the -Z side and hung on the roller 11 described above.
　上記構成においては、ローラー１１及びローラー１２が窓部ＷをＺ方向に挟む位置に配置されているため、ローラー１１及びローラー１２に掛けられた基板Ｓのうちローラー１１とローラー１２との間の部分は、－Ｘ側の面（基板Ｓの第二面Ｓｂ）が窓部Ｗに露出する位置に配置される。 In the said structure, since the roller 11 and the roller 12 are arrange | positioned in the position which pinches | interposes the window part W in a Z direction, the part between the roller 11 and the roller 12 among the board | substrates S hung on the roller 11 and the roller 12 Are arranged at a position where the surface on the −X side (the second surface Sb of the substrate S) is exposed to the window portion W.
　また、基板搬送部ＣＶは、基板支持部ＳＰを有している。基板支持部ＳＰは、容器ＣＴの窓部Ｗとの間で基板Ｓを挟む位置に設けられている。基板支持部ＳＰは、Ｚ方向においてはローラー１１とローラー１２との間に設けられている。基板支持部ＳＰは、基板Ｓの第一面Ｓａを支持する支持板７１と、一対の支持ローラー７２及び７３と、これら支持板７１、支持ローラー７２及び７３を支持する支持部材７４と、を有している。 Moreover, the board | substrate conveyance part CV has the board | substrate support part SP. The substrate support part SP is provided at a position where the substrate S is sandwiched between the window part W of the container CT. The substrate support portion SP is provided between the roller 11 and the roller 12 in the Z direction. The substrate support SP includes a support plate 71 that supports the first surface Sa of the substrate S, a pair of support rollers 72 and 73, and a support member 74 that supports the support plate 71 and the support rollers 72 and 73. is doing.
　支持板７１は、－Ｘ側に形成された支持面７１ａを有している。支持面７１ａは、平坦に形成されている。支持板７１は、支持面７１ａがＹＺ平面に平行になるように配置されている。この状態において、支持面７１ａは、基板Ｓの第一面Ｓａに対向して配置される。 The support plate 71 has a support surface 71a formed on the -X side. The support surface 71a is formed flat. The support plate 71 is disposed so that the support surface 71a is parallel to the YZ plane. In this state, the support surface 71a is disposed to face the first surface Sa of the substrate S.
　支持ローラー７２及び７３は、Ｚ方向に支持板７１を挟む位置に設けられている。支持ローラー７２及び７３は、円筒状あるいは円柱状に形成されている。支持ローラー７２及び７３は、中心軸がＹ方向に平行になるように配置されている。支持ローラー７２及び７３のＹ方向の寸法は、基板ＳのＹ方向の寸法よりも大きくなっている。支持ローラー７２及び７３は、支持部材７４によって周方向に回転可能に支持されている。 Support rollers 72 and 73 are provided at positions that sandwich the support plate 71 in the Z direction. The support rollers 72 and 73 are formed in a cylindrical shape or a columnar shape. The support rollers 72 and 73 are arranged so that the central axis is parallel to the Y direction. The dimensions of the support rollers 72 and 73 in the Y direction are larger than the dimension of the substrate S in the Y direction. The support rollers 72 and 73 are supported by a support member 74 so as to be rotatable in the circumferential direction.
　支持部材７４は、支持板７１、支持ローラー７２及び７３が独立してＸ方向、Ｙ方向及びＺ方向に移動しないように一体的に固定する。支持部材７４によって支持された状態においては、支持ローラー７２及び７３のそれぞれの－Ｘ側の端部（基板Ｓを支持する点）と支持面７１ａとが同一平面上に配置されている。したがって、基板Ｓは支持面７１ａ及びこの支持面７１ａと同一平面状に配置された２つの支持ローラー７２、７３によって支持されることになる。 The support member 74 is integrally fixed so that the support plate 71 and the support rollers 72 and 73 do not move independently in the X direction, the Y direction, and the Z direction. In the state of being supported by the support member 74, the −X side ends (points supporting the substrate S) of the support rollers 72 and 73 and the support surface 71a are arranged on the same plane. Accordingly, the substrate S is supported by the support surface 71a and the two support rollers 72 and 73 disposed on the same plane as the support surface 71a.
　支持部材７４は、Ｘ方向に移動可能に設けられている。基板搬送部ＣＶは、支持部材７４をＸ方向に移動させる駆動機構７５を有している。制御装置ＣＯＮＴは、この駆動機構７５を制御することにより、支持部材７４のＸ方向への移動量及び移動のタイミングなどを調整可能である。また、図１中の支持ローラー７２の＋Z側、及び支持ローラー７３の－Z側には、容器ＣＴのＸＺ面と平行な側壁に、回転可能に軸支された案内ローラー８１、８２が設けられている。この案内ローラー８１、８２は、支持部材７４（支持ローラー７２、７３と支持板７１）が－Ｘ方向に移動したときに、基板Ｓが窓部Ｗの縁に接触することを防止する。 The support member 74 is provided so as to be movable in the X direction. The substrate transport unit CV has a drive mechanism 75 that moves the support member 74 in the X direction. The control device CONT can adjust the amount of movement of the support member 74 in the X direction, the timing of movement, and the like by controlling the drive mechanism 75. Further, on the + Z side of the support roller 72 and the −Z side of the support roller 73 in FIG. 1, guide rollers 81 and 82 rotatably supported on the side wall parallel to the XZ plane of the container CT are provided. ing. The guide rollers 81 and 82 prevent the substrate S from coming into contact with the edge of the window portion W when the support member 74 (the support rollers 72 and 73 and the support plate 71) moves in the −X direction.
　次に、上記のように構成された基板保管装置ＳＴＲの動作を説明する。ここでは、例として基板保管装置ＳＴＲに保管された基板Ｓに対して処理を行う場合を例に挙げて説明する。 Next, the operation of the substrate storage device STR configured as described above will be described. Here, a case where processing is performed on the substrate S stored in the substrate storage device STR will be described as an example.
　図２は、基板保管装置ＳＴＲの動作の一例を示す図である。　
　図２に示すように、基板保管装置ＳＴＲに保管された基板Ｓに対して処理を行う場合、まず、外部の処理装置ＰＡの装置側接続部９０及び９１を、基板保管装置ＳＴＲの接続部Ｊに接続させる。 FIG. 2 is a diagram illustrating an example of the operation of the substrate storage device STR.
As shown in FIG. 2, when processing a substrate S stored in the substrate storage device STR, first, the apparatus side connection portions 90 and 91 of the external processing apparatus PA are connected to the connection portion J of the substrate storage device STR. Connect to.
　処理装置ＰＡの接続が完了した後、制御装置ＣＯＮＴは、駆動機構７５を制御して支持部材７４を－Ｘ方向へ移動させる。この動作により、支持ローラー７２及び７３が基板Ｓの第一面Ｓａに接触し、この第一面Ｓａが－Ｘ側へ引き出される。制御装置ＣＯＮＴは、支持ローラー７２、７３とニップローラー９２、９３との間で基板Ｓを挟持する位置まで、支持部材７４を移動させる。 After the connection of the processing apparatus PA is completed, the control apparatus CONT controls the drive mechanism 75 to move the support member 74 in the −X direction. By this operation, the support rollers 72 and 73 come into contact with the first surface Sa of the substrate S, and the first surface Sa is pulled out to the −X side. The control device CONT moves the support member 74 to a position where the substrate S is sandwiched between the support rollers 72 and 73 and the nip rollers 92 and 93.
　支持部材７４の移動により、基板Ｓのうち支持ローラー７２とニップローラー９２とで挟まれる部分と支持ローラー７３とニップローラー９３とで挟まれる部分の間の部分Ｓｃが窓部Ｗから収容室ＲＭの外部へ引き出され、処理装置ＰＡの処理部９５に対して露出された状態となる。 Due to the movement of the support member 74, the portion Sc between the portion sandwiched between the support roller 72 and the nip roller 92 and the portion sandwiched between the support roller 73 and the nip roller 93 in the substrate S is moved from the window portion W to the accommodation chamber RM. It is pulled out and exposed to the processing unit 95 of the processing apparatus PA.
　この露出部分Ｓｃは、支持板７１の支持面７１ａに支持され、この支持面７１ａに倣ってＹＺ平面に平行に配置される。また、露出部分Ｓｃは、支持面７１ａに倣って配置されることにより、処理装置ＰＡの処理部９５による処理面９５ａ上に配置されることになる。 The exposed portion Sc is supported by the support surface 71a of the support plate 71, and is disposed parallel to the YZ plane following the support surface 71a. Further, the exposed portion Sc is disposed on the processing surface 95a by the processing unit 95 of the processing apparatus PA by being disposed following the support surface 71a.
　一方、上記動作を行うことにより、基板Ｓの搬送経路が図１の状態から変化する。具体的には、露出部分Ｓｃが窓部Ｗから基板保管装置ＳＴＲの外部に引き出される分、基板保管装置ＳＴＲの－Ｘ側の壁部ＣＴａに沿った搬送経路が長くなる。これに対して、基板保管装置ＳＴＲに保管された基板Ｓは無端状に形成されており、長さが一定である。このため、基板Ｓに対して過度のテンションが加えられることが無いように、基板Ｓのテンションを調整する必要がある。 On the other hand, by performing the above operation, the transport path of the substrate S changes from the state of FIG. Specifically, since the exposed portion Sc is drawn out of the substrate storage device STR from the window portion W, the transport path along the wall portion CTa on the −X side of the substrate storage device STR becomes longer. On the other hand, the substrate S stored in the substrate storage device STR is formed in an endless shape and has a constant length. For this reason, it is necessary to adjust the tension of the substrate S so that an excessive tension is not applied to the substrate S.
　そこで、制御装置ＣＯＮＴは、駆動機構６９を制御してローラー支持部材６７を＋Ｚ側に移動させる。この動作により、ローラー支持部材６７と共にローラー２９、３３、６５がガイド部６８に沿って＋Ｚ側へ移動する。このため、基板Ｓのうちこのローラー２９、３３、６５に掛けられる部分の搬送経路が短くなる。 Therefore, the control device CONT controls the drive mechanism 69 to move the roller support member 67 to the + Z side. With this operation, the rollers 29, 33, and 65 together with the roller support member 67 move along the guide portion 68 to the + Z side. For this reason, the conveyance path | route of the part hung on this roller 29,33,65 among the board | substrates S becomes short.
　この場合、制御装置ＣＯＮＴは、支持部材７４の移動によって変化する基板Ｓの搬送経路の変化量と、ローラー支持部材６７の移動によって変化する搬送経路の変化量と、が等しくなるように、支持部材７４の移動量及びローラー支持部材６７の移動量のうち少なくとも一方を調整する。この動作により、基板Ｓの搬送経路の経路長が一定となるように維持されるため、基板Ｓに対して過度のテンションが加えられずに済むことになる。 In this case, the control device CONT supports the support member so that the change amount of the transport path of the substrate S that is changed by the movement of the support member 74 is equal to the change amount of the transport path that is changed by the movement of the roller support member 67. At least one of the movement amount of 74 and the movement amount of the roller support member 67 is adjusted. By this operation, the length of the transport path of the substrate S is maintained to be constant, so that excessive tension is not applied to the substrate S.
　上記のように基板Ｓの搬送経路の経路長を一定としつつ基板Ｓを処理部９５の処理面９５ａ上に配置した後、処理部９５によって基板Ｓの第二面Ｓｂに対する処理が行われる。この処理が完了した後、制御装置ＣＯＮＴは駆動機構６９及び駆動機構７５を制御し、基板Ｓの搬送経路の経路長を一定に保持しつつローラー支持部材６７及び支持部材７４を元の位置に戻す。その後、装置側接続部９０及び９１を接続部Ｊから外し、処理装置ＰＡを基板保管装置ＳＴＲから退避させる。このようにして、基板Ｓに対する処理が行われる。 As described above, after the substrate S is placed on the processing surface 95a of the processing unit 95 while keeping the length of the transport path of the substrate S constant, the processing unit 95 performs processing on the second surface Sb of the substrate S. After this processing is completed, the control device CONT controls the drive mechanism 69 and the drive mechanism 75 to return the roller support member 67 and the support member 74 to their original positions while keeping the transport path length of the substrate S constant. . Thereafter, the apparatus side connection units 90 and 91 are removed from the connection unit J, and the processing apparatus PA is retracted from the substrate storage apparatus STR. In this way, the processing for the substrate S is performed.
　以上のように、本実施形態によれば、可撓性を有し無端状に形成された基板Ｓを収容する収容室ＲＭを有する容器ＣＴと、この容器ＣＴに設けられる窓部Ｗと、収容室ＲＭに収容された基板Ｓの一部Ｓｃが窓部Ｗに対向するように基板Ｓを搬送する基板搬送部ＣＶとを備えるため、窓部Ｗにおいて基板Ｓを収容室ＲＭの外部に露出させると共に、基板Ｓの残りの部分を露出させないようにすることができる。これにより、基板Ｓの露出範囲を抑えることができるため、基板Ｓに埃などの異物が付着するのを抑えることができる。
　また、基板Ｓの表面に対して加工処理を行わない時は、扉部材によって窓部Ｗを閉じておくことによって、防塵性を維持できる。 As described above, according to the present embodiment, the container CT having the storage chamber RM for storing the flexible and endless substrate S, the window W provided in the container CT, and the storage Since the substrate transport section CV transports the substrate S so that a part Sc of the substrate S accommodated in the chamber RM faces the window portion W, the substrate S is exposed to the outside of the accommodation chamber RM in the window portion W. At the same time, the remaining portion of the substrate S can be prevented from being exposed. Thereby, since the exposure range of the board | substrate S can be suppressed, it can suppress that foreign materials, such as dust, adhere to the board | substrate S. FIG.
Further, when the surface of the substrate S is not processed, the dustproofness can be maintained by closing the window W with the door member.
　また、本実施形態によれば、基板Ｓが収容室ＲＭに収容された状態で基板保管装置ＳＴＲに対して処理装置ＰＡを接続させ、基板Ｓに処理を行う構成としたので、基板Ｓに異物が付着しにくい環境で処理を行うことができる。これにより、基板Ｓに異物が付着するのを防ぐことができる。 Further, according to the present embodiment, since the processing apparatus PA is connected to the substrate storage device STR in a state where the substrate S is accommodated in the accommodation chamber RM, the substrate S is processed. Processing can be performed in an environment where it is difficult to adhere. Thereby, it can prevent that a foreign material adheres to the board | substrate S. FIG.
　［第二実施形態］　
　次に、本発明の第二実施形態を説明する。　
　図３は、本実施形態に係る基板保管装置ＳＴＲ２の構成を示す図である。本実施形態では、窓部Ｗ近傍における容器ＣＴの構成が第一実施形態とは異なっているため、この相違点を中心に説明する。 [Second Embodiment]
Next, a second embodiment of the present invention will be described.
FIG. 3 is a diagram showing a configuration of the substrate storage device STR2 according to the present embodiment. In the present embodiment, the configuration of the container CT in the vicinity of the window portion W is different from that of the first embodiment, and thus this difference will be mainly described.
　図３に示すように、基板保管装置ＳＴＲ２は、基板Ｓを窓部Ｗから外部に引き出すための引き出し部１７０及び１７１を有している。この引き出し部１７０及び１７１は、窓部Ｗの内周部に取り付けられたアーム部１７４及び１７５を有している。アーム部１７４は、窓部Ｗの＋Ｚ側の内周面に取り付けられている。アーム部１７５は、窓部Ｗの－Ｚ側の面に取り付けられている。 As shown in FIG. 3, the substrate storage device STR2 has drawers 170 and 171 for extracting the substrate S from the window W to the outside. The drawer portions 170 and 171 have arm portions 174 and 175 attached to the inner peripheral portion of the window portion W. The arm portion 174 is attached to the inner peripheral surface of the window portion W on the + Z side. The arm portion 175 is attached to the −Z side surface of the window portion W.
　アーム部１７４及び１７５は、取り付け位置を中心としてθＹ方向に回転可能に設けられている。アーム部１７４及び１７５は、それぞれアーム駆動部１７６及び１７７に接続されている。アーム駆動部１７６及び１７７は、例えば不図示のモータ機構などを有している。制御装置ＣＯＮＴは、アーム駆動部１７６及び１７７による駆動量や駆動のタイミングを制御可能である。 The arm portions 174 and 175 are provided so as to be rotatable in the θY direction around the mounting position. Arm portions 174 and 175 are connected to arm drive portions 176 and 177, respectively. The arm drive units 176 and 177 have a motor mechanism (not shown), for example. The control device CONT can control the drive amount and drive timing of the arm drive units 176 and 177.
　アーム部１７４及び１７５の先端部分には、案内ローラー１７２及び１７３が取り付けられている。案内ローラー１７２及び１７３は、円筒状に形成されており、中心軸がＹ軸に平行となるように配置されている。案内ローラー１７２及び１７３は、周方向（θＹ方向）に回転可能に設けられている。また、容器ＣＴには、外部の処理装置ＰＡを装着する装着部１７８が形成されている。なお、装着部１７８の代わりに、外部の処理装置ＰＡを配置するための開口部を形成してもよい。 Guide rollers 172 and 173 are attached to the tip portions of the arm portions 174 and 175. The guide rollers 172 and 173 are formed in a cylindrical shape, and are arranged so that the central axis is parallel to the Y axis. The guide rollers 172 and 173 are rotatably provided in the circumferential direction (θY direction). In addition, a mounting portion 178 for mounting an external processing apparatus PA is formed in the container CT. Instead of the mounting portion 178, an opening for arranging the external processing apparatus PA may be formed.
　この状態から、基板Ｓを窓部Ｗの外部に引き出す場合、制御装置ＣＯＮＴは、アーム駆動部１７６及び１７７を制御し、アーム部１７４を図中反時計回りに、アーム部１７５を図中時計回りに、それぞれ回転させる。アーム部１７４及びアーム部１７５の回転移動に伴ってアーム部１７４及びアーム部１７５の各先端部に取り付けられた案内ローラー１７２及び１７３が基板Ｓに掛けられ、基板Ｓが窓部Ｗの外側に引き出される。 When the substrate S is pulled out of the window W from this state, the control device CONT controls the arm driving units 176 and 177, and the arm unit 174 is rotated counterclockwise in the drawing and the arm unit 175 is rotated clockwise in the drawing. Rotate each. As the arm part 174 and arm part 175 rotate, the guide rollers 172 and 173 attached to the respective distal ends of the arm part 174 and arm part 175 are hung on the substrate S, and the substrate S is pulled out of the window part W. It is.
　図４は、引き出し部１７０及び１７１によって基板Ｓが窓部Ｗから収容室ＲＭの外部に引き出された状態を示す図である。　
　図４に示すように、基板Ｓが引き出された状態においては、アーム部１７４及び１７５の先端が－Ｘ側に向くように配置される。 FIG. 4 is a diagram illustrating a state in which the substrate S is pulled out from the window portion W to the outside of the storage chamber RM by the drawer portions 170 and 171.
As shown in FIG. 4, in a state where the substrate S is pulled out, the arms 174 and 175 are arranged so that the tips of the arms 174 and 175 face the −X side.
　基板Ｓは、案内ローラー１７２及び１７３に掛けられた状態で窓部Ｗの外側に露出される。基板Ｓのうち案内ローラー１７２及び１７３の間の露出部分Ｓｃの第二面Ｓｂには、基板支持部材１７９の支持面１７９ａが押し当てられている。支持面１７９ａは、例えば＋Ｘ側に凸となるように形成された湾曲面である。支持面１７９ａが押し当てられることにより、露出部分Ｓｃは支持面１７９ａに倣って＋Ｘ側に湾曲して配置された状態となる。なお、基板支持部材１７９は、例えば回転ドラムである。 The substrate S is exposed to the outside of the window portion W while being hung on the guide rollers 172 and 173. The support surface 179a of the substrate support member 179 is pressed against the second surface Sb of the exposed portion Sc between the guide rollers 172 and 173 in the substrate S. The support surface 179a is a curved surface formed to be convex toward the + X side, for example. When the support surface 179a is pressed, the exposed portion Sc is arranged to be curved to the + X side following the support surface 179a. The substrate support member 179 is a rotating drum, for example.
　また、上記のアーム部１７４及び１７５の動作により、壁部ＣＴａに沿った部分の基板Ｓの搬送経路の経路長が長くなる。このため、制御装置ＣＯＮＴは、駆動機構６９を制御してローラー支持部材６７をガイド部６８に沿って＋Ｚ側へ移動させ、基板Ｓの搬送経路の経路長を調整する。なお、本実施形態においては、上記の第一実施形態に比べて、ローラー支持部材６７をＺ方向に広い範囲で移動可能な構成であっても構わない。これにより、基板Ｓの搬送経路の経路長の調整量が大きくなる。 Further, due to the operation of the arm portions 174 and 175, the path length of the transport path of the portion of the substrate S along the wall portion CTa becomes longer. For this reason, the control device CONT controls the drive mechanism 69 to move the roller support member 67 to the + Z side along the guide portion 68 and adjust the path length of the transport path of the substrate S. In addition, in this embodiment, the structure which can move the roller support member 67 in the Z direction in a wide range compared with said 1st embodiment may be sufficient. Thereby, the adjustment amount of the path length of the transport path of the substrate S is increased.
　基板Ｓを収容室ＲＭの外部に引き出した後、容器ＣＴの装着部１７８に処理装置ＰＡが配置される。処理装置ＰＡが装着部１７８に装着された状態においては、処理部１９５が窓部Ｗの－Ｘ側に向けられている。このため、露出部分ＳｃはＸ方向に見て処理部１９５の対向位置に配置される。この状態で、処理部１９５は基板Ｓの第一面Ｓａに対して処理を行う。 After the substrate S is pulled out of the storage chamber RM, the processing apparatus PA is disposed in the mounting portion 178 of the container CT. In a state where the processing device PA is mounted on the mounting unit 178, the processing unit 195 is directed to the −X side of the window W. For this reason, the exposed portion Sc is disposed at a position facing the processing unit 195 when viewed in the X direction. In this state, the processing unit 195 performs processing on the first surface Sa of the substrate S.
　処理部１９５による処理が行われた後、処理装置ＰＡを装着部１７８から取り外す。処理装置ＰＡが取り外された後、制御装置ＣＯＮＴは、アーム部１７４及び１７５を容器ＣＴの収容室ＲＭに収容させると同時に、ローラー支持部材６７を－Ｚ側に移動させる。この動作により、基板Ｓの搬送経路の経路長を一定に保ちつつ、アーム部１７４及び１７５と共に基板Ｓが収容室ＲＭに収容される。 After the processing by the processing unit 195 is performed, the processing device PA is removed from the mounting unit 178. After the processing device PA is removed, the control device CONT accommodates the arm portions 174 and 175 in the accommodation chamber RM of the container CT and simultaneously moves the roller support member 67 to the −Z side. By this operation, the substrate S is accommodated in the accommodation chamber RM together with the arm portions 174 and 175 while keeping the length of the transport path of the substrate S constant.
　このように、本実施形態では、アーム部１７４及び１７５を用いて基板Ｓを窓部Ｗから外部に大きく引き出すと共に、基板Ｓの露出部分Ｓｃと容器ＣＴとの間に処理装置ＰＡなどの外部装置を装着させる構成となっているので、基板Ｓの第一面Ｓａに対して処理を行わせることができる。
　また、本実施形態では、円柱状の支持面１７９ａが形成された基板支持部材（例えば、回転ドラム）１７９を用いて基板Ｓを支持させる構成としたので、支持面１７９ａの形状に応じた形状で基板Ｓを処理部１９５の対向位置に配置させることができる。例えば、支持面１７９ａが平坦面であれば、基板Ｓは平坦な状態で処理部１９５の対向位置に配置されることになる。 Thus, in the present embodiment, the substrate S is largely pulled out from the window W using the arms 174 and 175, and an external device such as the processing apparatus PA is provided between the exposed portion Sc of the substrate S and the container CT. Therefore, the first surface Sa of the substrate S can be processed.
In the present embodiment, since the substrate S is supported by using the substrate support member (for example, the rotating drum) 179 having the columnar support surface 179a, the shape is in accordance with the shape of the support surface 179a. The substrate S can be disposed at a position facing the processing unit 195. For example, if the support surface 179a is a flat surface, the substrate S is placed at a position facing the processing unit 195 in a flat state.
　本発明の技術範囲は上記実施形態に限定されるものではなく、本発明の趣旨を逸脱しない範囲で適宜変更を加えることができる。　
　例えば、上記実施形態においては、窓部Ｗが壁部ＣＴａに配置された構成としたが、これに限られることはなく、例えば図５に示すように、窓部Ｗが壁部ＣＴｂや他の壁部に配置された構成であっても構わない。 The technical scope of the present invention is not limited to the above-described embodiment, and appropriate modifications can be made without departing from the spirit of the present invention.
For example, in the above-described embodiment, the window portion W is arranged on the wall portion CTa. However, the present invention is not limited to this. For example, as shown in FIG. The configuration may be arranged on the wall.
　また、上記実施形態では、窓部Ｗが容器ＣＴの一箇所に設けられた構成としたが、これに限られることは無く、図５に示すように、容器ＣＴの複数個所に窓部Ｗが設けられた構成であっても構わない。この場合、一の壁部に複数窓部Ｗが配置された構成であっても構わないし、複数の壁部に一つずつあるいは複数ずつ窓部Ｗが設けられた構成であっても構わない。 Moreover, in the said embodiment, although it was set as the structure by which the window part W was provided in one place of the container CT, it is not restricted to this, As shown in FIG. 5, the window part W is in several places of the container CT. It may be provided. In this case, a configuration in which a plurality of window portions W are disposed on one wall portion may be employed, or a configuration in which one or a plurality of window portions W are provided on a plurality of wall portions may be employed.
　また、上記実施形態の構成に加えて、例えば図６に示すように、前述した窓部Ｗに扉部材を設けてもよい。この扉部材として、図６には、窓部Ｗを開閉させるスライド部材ＳＬであっても構わない。スライド部材ＳＬは、スライド駆動部２００に接続されている。スライド駆動部２００は、制御装置ＣＯＮＴの制御によって駆動量及び駆動のタイミングが制御されるようになっている。 Further, in addition to the configuration of the above-described embodiment, for example, as shown in FIG. The door member may be a slide member SL that opens and closes the window W in FIG. The slide member SL is connected to the slide drive unit 200. The slide drive unit 200 is configured such that the drive amount and the drive timing are controlled by the control of the control device CONT.
　この構成において、制御装置ＣＯＮＴは、外部の処理装置との接続状態に応じて窓部Ｗを開閉させるようにしても構わない。この場合、制御装置ＣＯＮＴは、外部の処理装置が接続部Ｊに接続された場合には、窓部Ｗが開いた状態となるように、スライド部材ＳＬを－Ｚ側に移動させる。また、制御装置ＣＯＮＴは、外部の処理装置と接続部Ｊとの接続が解除された場合には、窓部Ｗが閉じた状態となるようにスライド部材ＳＬを＋Ｚ側に移動させる。これにより、収容室ＲＭに埃などの異物が侵入するのを防ぐことができる。 In this configuration, the control device CONT may open and close the window portion W according to the connection state with the external processing device. In this case, when an external processing device is connected to the connection portion J, the control device CONT moves the slide member SL to the −Z side so that the window portion W is opened. Further, when the connection between the external processing device and the connection portion J is released, the control device CONT moves the slide member SL to the + Z side so that the window portion W is closed. Thereby, it is possible to prevent foreign matters such as dust from entering the storage chamber RM.
　また、上記実施形態においては、基板Ｓの第一面Ｓａ及び第二面Ｓｂの両方に接触するようにローラーＲが配置された構成を例に挙げて説明したが、これに限られることは無い。例えば、基板Ｓの第一面Ｓａに接触し、かつ、第二面Ｓｂには接触しないように配置された構成であっても構わない。 Moreover, in the said embodiment, although demonstrated taking the example of the structure by which the roller R was arrange | positioned so that both the 1st surface Sa and 2nd surface Sb of the board | substrate S might be contacted, it is not restricted to this. . For example, the configuration may be such that it is in contact with the first surface Sa of the substrate S and not in contact with the second surface Sb.
　このような例としては、例えば図７に示すように、直角二等辺三角形状に形成されたガイド部材２０１及び２０２を用いて基板Ｓを折り返す構成などが挙げられる。図７に示すように、基板搬送部ＣＶは、２つの搬送部ＣＶ１及びＣＶ２を有している。図中＋Ｘ側の搬送部ＣＶ１では、基板Ｓは第一面Ｓａにのみ接触するように複数のローラーＲによって渦巻状（図中＋Ｘ側）に内側へ向けて折り返された後、ローラーＲ１によってガイド部材２０１へ向けて折り返されている。 As such an example, as shown in FIG. 7, for example, there is a configuration in which the substrate S is folded using guide members 201 and 202 formed in a right isosceles triangle shape. As shown in FIG. 7, the substrate transport section CV has two transport sections CV1 and CV2. In the + X-side transport unit CV1 in the drawing, the substrate S is folded inward in a spiral shape (+ X side in the drawing) by a plurality of rollers R so as to contact only the first surface Sa, and then guided by the roller R1. It is folded back toward the member 201.
　搬送部ＣＶ１において、基板ＳのうちローラーＲ１の下流側は、ガイド部材２０１の一辺２０１ａで折り返されている。この基板Ｓのうち一辺２０１ａの下流側は、ガイド部材２０１の斜辺２０１ｂで４５°の角度で折り返されている。また、基板Ｓのうちこの斜辺２０１ｂの下流側は、ガイド部材２０１の他辺２０１ｃにおいて折り返された後、ガイド部材２０２に向けられている。このように、基板Ｓの第一面Ｓａがガイド部材２０１に巻きつけられている。 In the transport unit CV1, the downstream side of the roller R1 of the substrate S is folded at one side 201a of the guide member 201. The downstream side of one side 201 a of the substrate S is folded at an angle of 45 ° with the oblique side 201 b of the guide member 201. Further, the downstream side of the oblique side 201 b of the substrate S is turned back at the other side 201 c of the guide member 201 and then directed to the guide member 202. As described above, the first surface Sa of the substrate S is wound around the guide member 201.
　一方、基板Ｓのうちガイド部材２０２に向けられた部分は、ガイド部材２０２の一辺２０２ａで折り返され、ガイド部材２０１の場合と同様、斜辺２０２ｂ及び他辺２０２ｃに沿って順に折り返されている。基板Ｓのうち他辺２０２ｃの下流側は、ローラーＲ２に向けられている。このように、基板Ｓの第一面Ｓａがガイド部材２０２に巻きつけられている。 On the other hand, the portion of the substrate S directed to the guide member 202 is folded back at one side 202a of the guide member 202, and is folded back along the oblique side 202b and the other side 202c in the same manner as in the case of the guide member 201. Of the substrate S, the downstream side of the other side 202c is directed to the roller R2. In this way, the first surface Sa of the substrate S is wound around the guide member 202.
　基板ＳのうちローラーＲ２の下流側は、複数のローラーＲによって渦巻状に外側へ向けて折り返された後、図中－Ｘ側の搬送部ＣＶ２に向けられている。搬送部ＣＶ２においては、上記搬送部ＣＶ１と同様の構成となっている。つまり、基板Ｓの第一面Ｓａにのみ接触しつつこの基板Ｓを渦巻状に折り返す構成となっており、中央部にはローラーＲ１、ガイド部材２０１、２０２及びローラーＲ２が設けられている。 In the substrate S, the downstream side of the roller R2 is turned outward in a spiral shape by the plurality of rollers R, and then directed to the −X side transport unit CV2 in the drawing. The transport unit CV2 has the same configuration as the transport unit CV1. In other words, the substrate S is folded in a spiral shape while contacting only the first surface Sa of the substrate S, and the roller R1, the guide members 201 and 202, and the roller R2 are provided at the center.
　図７に示すように、第一面ＳａがローラーＲ、Ｒ１、Ｒ２及びガイド部材２０１、２０２に接触するように、かつ、第二面Ｓｂがこれらのローラー及びガイド部材に接触しないように、基板Ｓが折り返されている。この構成においては、基板搬送部ＣＶは、基板Ｓの第二面Ｓｂの表面に接触せずに基板Ｓを搬送することができるため、第二面Ｓｂの状態を保護することができる。 As shown in FIG. 7, the first surface Sa is in contact with the rollers R, R1, R2 and the guide members 201, 202, and the second surface Sb is not in contact with these rollers and the guide member. S is folded. In this structure, since the board | substrate conveyance part CV can convey the board | substrate S, without contacting the surface of the 2nd surface Sb of the board | substrate S, it can protect the state of the 2nd surface Sb.
　なお、ガイド部材２０１及び２０２の構成については、上記のような直角二等辺三角形状に形成された構成に限られず、例えば円筒状のローラーを直角二等辺三角形の各辺に配置させた構成であっても構わない。 The configuration of the guide members 201 and 202 is not limited to the configuration formed in the right isosceles triangle shape as described above. For example, a cylindrical roller is arranged on each side of the right angle isosceles triangle. It doesn't matter.
　また、例えば図８に示すように、図７に示す構成をＹ方向に重ねた構成であっても構わない。この場合、搬送部ＣＶ１及びＣＶ２の＋Ｙ側に、搬送部ＣＶ３及びＣＶ４が設けられている。搬送部ＣＶ１と搬送部ＣＶ３とは同一構成であり、搬送部ＣＶ２と搬送部ＣＶ４とは同一構成である。搬送部ＣＶ１及びＣＶ２と、搬送部ＣＶ３及びＣＶ４との間は、方向転換用ローラー３０１～３０４が配置されている。 Further, for example, as shown in FIG. 8, the configuration shown in FIG. 7 may be superposed in the Y direction. In this case, conveyance units CV3 and CV4 are provided on the + Y side of the conveyance units CV1 and CV2. The transport unit CV1 and the transport unit CV3 have the same configuration, and the transport unit CV2 and the transport unit CV4 have the same configuration. Direction changing rollers 301 to 304 are arranged between the conveyance units CV1 and CV2 and the conveyance units CV3 and CV4.
　基板Ｓは、搬送部ＣＶ１及びＣＶ２に掛けられた後、方向転換用ローラー３０１及び３０２によって方向転換され、搬送部ＣＶ３及びＣＶ４に掛けられる。また、この基板Ｓは、搬送部ＣＶ３及びＣＶ４に掛けられた後、方向転換用ローラー３０３及び３０４によって方向転換され、搬送部ＣＶ１及び搬送部ＣＶ２に再度掛けられる。なお、方向転換用ローラー３０１～３０４に掛けられるのは常に基板Ｓの第一面Ｓａである。このように、基板Ｓは搬送部ＣＶ１～搬送部ＣＶ４の間で循環するように掛けられている。 After the substrate S is hung on the transport parts CV1 and CV2, the direction is changed by the direction changing rollers 301 and 302 and hung on the transport parts CV3 and CV4. In addition, the substrate S is hung on the conveyance units CV3 and CV4, then the direction is changed by the direction changing rollers 303 and 304, and is again hung on the conveyance unit CV1 and the conveyance unit CV2. It is always the first surface Sa of the substrate S that is hung on the direction changing rollers 301 to 304. In this way, the substrate S is hung so as to circulate between the transport unit CV1 to the transport unit CV4.
　図８に示す構成においては、基板ＳがＹ方向に二重に収容されることになる。この場合、Ｙ方向に並んで窓部Ｗ１及びＷ２が設けられた構成であっても構わない。Ｙ方向に二重に配置された基板Ｓのそれぞれについて処理を行うことができるため、処理効率を高めることができる。 In the configuration shown in FIG. 8, the substrates S are accommodated double in the Y direction. In this case, the configuration may be such that the windows W1 and W2 are provided side by side in the Y direction. Since processing can be performed for each of the substrates S that are doubled in the Y direction, the processing efficiency can be increased.
　また、例えば図９に示すように、図７に示す構成をＸ方向及びＺ方向に複数配置しても構わない。この場合、搬送部ＣＶ１及びＣＶ２の－Ｚ側に、搬送部ＣＶ３及びＣＶ４が設けられている。なお、搬送部ＣＶ１と搬送部ＣＶ３とは同一構成であり、搬送部ＣＶ２と搬送部ＣＶ４とは同一構成である。図９に示す構成においては、例えば各搬送部ＣＶ１～ＣＶ４について、それぞれ窓部Ｗ１～Ｗ４が設けられた構成であっても構わない。これにより、複数個所で処理を行うことができるため、処理効率を高めることができる。 For example, as shown in FIG. 9, a plurality of the configurations shown in FIG. 7 may be arranged in the X direction and the Z direction. In this case, conveyance units CV3 and CV4 are provided on the −Z side of the conveyance units CV1 and CV2. The transport unit CV1 and the transport unit CV3 have the same configuration, and the transport unit CV2 and the transport unit CV4 have the same configuration. In the configuration shown in FIG. 9, for example, each of the transport units CV1 to CV4 may have a configuration in which windows W1 to W4 are provided. Thereby, since processing can be performed at a plurality of locations, processing efficiency can be improved.
　また、上記実施形態の構成に加えて、例えば基板保管装置ＳＴＲの収容室ＲＭに処理部が設けられた構成としても構わない。この場合、例えば基板に対してめっき処理、洗浄処理、乾燥処理、熱処理などの各処理を行う処理部を配置させることができる。図７に示すように、基板Ｓの第二面Ｓｂが基板搬送部ＣＶに接触していない構成の場合、この第二面Ｓｂに対して処理を行う処理部ＰＡ２が収容室ＲＭに設けられていても構わない。 Further, in addition to the configuration of the above embodiment, for example, a processing unit may be provided in the storage chamber RM of the substrate storage device STR. In this case, for example, a processing unit that performs each process such as a plating process, a cleaning process, a drying process, and a heat treatment can be arranged on the substrate. As shown in FIG. 7, when the second surface Sb of the substrate S is not in contact with the substrate transport unit CV, a processing unit PA2 that performs processing on the second surface Sb is provided in the storage chamber RM. It doesn't matter.
　なお、上記実施形態においては、長尺方向が無端状の基板を保管する保管装置について説明したが、この構成に限られるものではない。例えば、容器ＣＴ 内に、供給用ローラーと、回収用ローラーと、供給ローラーに巻かれた基板を上記窓部Ｗ１に搬送するための複数のローラーと、窓部Ｗ１を介した基板を回収用ローラーで巻き取るために、基板を回収ローラーに送る複数のローラーとを配置し、ロール・トゥ・ロール方式で搬送される基板を保管してもよい。
　また、上記実施形態においては、中心軸がＹ方向に平行となるようにローラーＲが配置された構成を例に挙げて説明したが、これに限られることは無い。例えば、中心軸がＸ方向あるいはＺ方向に平行となるようにローラーＲが配置された構成であっても、本発明の適用は可能である。
また、例えば図７、図８及び図９で示した実施形態においても、第一実施形態及び第二実施形態で採用しているような、搬送経路を短く調整する機構を採用してもよい。すなわち、基板に処理装置を用いて処理を施すために、基板を引き出して露出させる場合に、ローラーを移動させて搬送経路を短くして、基板の搬送経路の経路長が一定となるように調整する機構を採用してもよい。  In the above-described embodiment, the storage device that stores the endless substrate in the longitudinal direction has been described. However, the present invention is not limited to this configuration. For example, in the container CT, a supply roller, a recovery roller, a plurality of rollers for transporting the substrate wound around the supply roller to the window W1, and a substrate via the window W1 are recovered. In order to wind up the substrate, a plurality of rollers that send the substrate to the collection roller may be disposed, and the substrate conveyed in a roll-to-roll manner may be stored.
Moreover, in the said embodiment, although demonstrated taking the example of the structure by which the roller R was arrange | positioned so that a center axis might become parallel to a Y direction, it is not restricted to this. For example, the present invention can be applied even when the roller R is arranged so that the central axis is parallel to the X direction or the Z direction.
Further, for example, in the embodiments shown in FIGS. 7, 8, and 9, a mechanism for adjusting the conveyance path to be short may be adopted as employed in the first embodiment and the second embodiment. In other words, in order to process the substrate using the processing apparatus, when the substrate is pulled out and exposed, the transport path is shortened by moving the roller, and the path length of the substrate transport path is adjusted to be constant. You may employ | adopt the mechanism to do.
　ＳＴＲ、ＳＴＲ２…基板保管装置　Ｓ…基板　Ｓａ…基板Ｓの第一面　Ｓｂ…基板Ｓの第二面　ＳＰ…基板支持部　ＣＴ…容器　ＣＶ…基板搬送部　ＣＴａ、ＣＴｂ…壁部　ＲＭ…収容室　Ｗ、Ｗ１、Ｗ２…窓部　Ｊ…接続部　ＰＡ…処理装置　Ｒ…ローラー　６７…ローラー支持部材　６８…ガイド部　６９、７５…駆動機構　７１ａ…支持面　９０、９１…装置側接続部　９２、９３…ニップローラー　９５…処理部　９５ａ…処理面　１７２、１７３…案内ローラー　１７４、１７５…アーム部　１７６、１７７…アーム駆動部　１７８…装着部　１７９…基板支持部材　１７９ａ…支持面　１９５…処理部　２００…スライド駆動部　２０１、２０２…ガイド部材 STR, STR2 ... Substrate storage device S ... Substrate Sa ... First side of substrate S Sb ... Second side of substrate S SP ... Substrate support part CT ... Container CV ... Substrate transport part CTa, CTb ... Wall part RM ... Containment chamber W , W1, W2 ... window portion J ... connection portion PA ... processing device R ... roller 67 ... roller support member 68 ... guide portion 69, 75 ... drive mechanism 71a ... support surface 90, 91 ... device side connection portion 92, 93 ... nip Roller 95 ... Processing unit 95a ... Processing surface 172, 173 ... Guiding rollers 174, 175 ... Arm unit 176, 177 ... Arm drive unit 178 ... Mounting unit 179 ... Substrate support member 179a ... Support surface 195 ... Processing unit 200 ... Slide drive unit 201, 202 ... guide members

Claims (14)

  1. 　可撓性を有する基板を収容する収容室を有する容器と、
    　前記容器に設けられる窓部と、
    　前記収容室に収容された前記基板の一部が前記窓部に対向するように前記基板を搬送する基板搬送部と
    　を備える基板保管装置。     A container having a storage chamber for storing a flexible substrate;
    A window provided in the container;
    A substrate storage apparatus comprising: a substrate transport unit that transports the substrate so that a part of the substrate housed in the housing chamber faces the window portion.
  2. 　前記窓部は、前記容器に複数箇所に配置されている
    　請求項１に記載の基板保管装置。     The board | substrate storage apparatus of Claim 1. The said window part is arrange | positioned in the said container at multiple places.
  3. 　前記容器は、外部装置に接続される接続部を有する
    　請求項１又は請求項２に記載の基板保管装置。     The substrate storage apparatus according to claim 1, wherein the container has a connection portion connected to an external device.
  4. 　前記容器と前記外部装置との間の接続状態に応じて前記窓部を開閉させる窓部駆動部を更に備える
    　請求項３に記載の基板保管装置。     The substrate storage device according to claim 3, further comprising a window drive unit that opens and closes the window according to a connection state between the container and the external device.
  5. 　前記接続部は、前記窓部の周囲に配置されている
    　請求項４に記載の基板保管装置。     The board | substrate storage apparatus of Claim 4. The said connection part is arrange | positioned around the said window part.
  6. 　前記容器は、複数の壁面を有し、
    　前記窓部及び前記接続部は、同一の壁面に設けられている
    　請求項３から請求項５のうちいずれか一項に記載の基板保管装置。     The container has a plurality of wall surfaces,
    The substrate storage device according to any one of claims 3 to 5, wherein the window portion and the connection portion are provided on the same wall surface.
  7. 　前記基板搬送部は、前記窓部に対向する前記基板の一部を支持する支持部を有する
    　請求項１から請求項６のうちいずれか一項に記載の基板保管装置。     The substrate storage apparatus according to any one of claims 1 to 6, wherein the substrate transport unit includes a support unit that supports a part of the substrate that faces the window unit.
  8. 　前記基板搬送部は、前記窓部から前記基板の一部を前記収容部の外側に引き出す引出部を有する
    　請求項１から請求項７のうちいずれか一項に記載の基板保管装置。     The substrate storage device according to any one of claims 1 to 7, wherein the substrate transport unit includes a drawing unit that draws a part of the substrate out of the housing unit from the window unit.
  9. 　前記基板搬送部は、前記引出部による前記基板の引き出し状態に応じて前記収容室での前記基板の搬送経路を調整する調整部を有する
    　請求項８に記載の基板保管装置。     The substrate storage apparatus according to claim 8, wherein the substrate transfer unit includes an adjustment unit that adjusts a transfer route of the substrate in the storage chamber according to a drawing state of the substrate by the drawing unit.
  10. 　前記基板搬送部は、前記基板を折り返す折り返し部を有する
    　請求項１から請求項９のうちいずれか一項に記載の基板保管装置。     The substrate storage device according to any one of claims 1 to 9, wherein the substrate transport unit includes a folding unit that folds the substrate.
  11. 　前記折り返し部は、前記基板が多重に折り返されるように配置されている
    　請求項１０に記載の基板保管装置。     The board | substrate storage apparatus of Claim 10. The said folding | returning part is arrange | positioned so that the said board | substrate may be folded in multiple.
  12. 　前記折り返し部は、前記基板の両面のうち第一面に接触し、かつ、前記第一面とは反対側の第二面には接触しないように配置されている
    　請求項１０又は請求項１１に記載の基板保管装置。     The said folding | returning part is arrange | positioned so that it may contact the 1st surface among the both surfaces of the said board | substrate, and may not contact the 2nd surface on the opposite side to a said 1st surface. The board | substrate storage apparatus of description.
  13. 　前記収容室に設けられ、前記基板の前記第二面に対して処理を行う処理部
    　を更に備える請求項１２に記載の基板保管装置。     The substrate storage apparatus according to claim 12, further comprising: a processing unit that is provided in the storage chamber and performs processing on the second surface of the substrate.
  14. 　前記基板は、無端状に形成される
    　請求項１から請求項１３のうちいずれか一項に記載の基板保管装置。     The substrate storage device according to any one of claims 1 to 13, wherein the substrate is formed in an endless shape.
PCT/JP2011/078876 2010-12-15 2011-12-14 Substrate storage device WO2012081605A1 (en)

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PCT/JP2011/078876 WO2012081605A1 (en) 2010-12-15 2011-12-14 Substrate storage device

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JP (1) JPWO2012081605A1 (en)
KR (1) KR20140004663A (en)
CN (1) CN103261066A (en)
TW (1) TW201233606A (en)
WO (1) WO2012081605A1 (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5826352A (en) * 1981-07-22 1983-02-16 メガテ−プ・コ−ポレ−シヨン Constant tension high speed bidirectional magnetic tape driver
JPH0514373Y2 (en) * 1987-12-28 1993-04-16
JPH07248463A (en) * 1994-03-10 1995-09-26 Fuji Photo Film Co Ltd Film viewer
US6258408B1 (en) * 1999-07-06 2001-07-10 Arun Madan Semiconductor vacuum deposition system and method having a reel-to-reel substrate cassette

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5826352A (en) * 1981-07-22 1983-02-16 メガテ−プ・コ−ポレ−シヨン Constant tension high speed bidirectional magnetic tape driver
JPH0514373Y2 (en) * 1987-12-28 1993-04-16
JPH07248463A (en) * 1994-03-10 1995-09-26 Fuji Photo Film Co Ltd Film viewer
US6258408B1 (en) * 1999-07-06 2001-07-10 Arun Madan Semiconductor vacuum deposition system and method having a reel-to-reel substrate cassette

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CN103261066A (en) 2013-08-21
KR20140004663A (en) 2014-01-13
JPWO2012081605A1 (en) 2014-05-22
TW201233606A (en) 2012-08-16

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