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WO2012078162A1 - Ferroelectric capacitor encapsulated with hydrogen barrier - Google Patents

Ferroelectric capacitor encapsulated with hydrogen barrier Download PDF

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Publication number
WO2012078162A1
WO2012078162A1 PCT/US2010/059718 US2010059718W WO2012078162A1 WO 2012078162 A1 WO2012078162 A1 WO 2012078162A1 US 2010059718 W US2010059718 W US 2010059718W WO 2012078162 A1 WO2012078162 A1 WO 2012078162A1
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WO
WIPO (PCT)
Prior art keywords
hydrogen barrier
integrated circuit
underlying
ferroelectric capacitor
hydrogen
Prior art date
Application number
PCT/US2010/059718
Other languages
French (fr)
Inventor
Rajni J. Aggarwal
Scott R. Summerfelt
Gul Bahar Basim
Ted S. Moise
Original Assignee
Texas Instruments Incorporated
Texas Instruments Japan Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Incorporated, Texas Instruments Japan Limited filed Critical Texas Instruments Incorporated
Priority to PCT/US2010/059718 priority Critical patent/WO2012078162A1/en
Priority to JP2013543142A priority patent/JP2014502783A/en
Priority to CN2010800705676A priority patent/CN103250251A/en
Publication of WO2012078162A1 publication Critical patent/WO2012078162A1/en

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00—Resistors, capacitors or inductors
    • H10D1/60—Capacitors
    • H10D1/68—Capacitors having no potential barriers
    • H10D1/682—Capacitors having no potential barriers having dielectrics comprising perovskite structures
    • H10D1/688—Capacitors having no potential barriers having dielectrics comprising perovskite structures comprising barrier layers to prevent diffusion of hydrogen or oxygen
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B53/00—Ferroelectric RAM [FeRAM] devices comprising ferroelectric memory capacitors
    • H10B53/30—Ferroelectric RAM [FeRAM] devices comprising ferroelectric memory capacitors characterised by the memory core region

Definitions

  • FIGS. 1A and IB Prior Art
  • FIGS. 1C and ID illustrate portions of integrated circuits.
  • FIGS. 2A-2E illustrate steps in an integrated circuit process flow according to an embodiment.
  • FIGS. 3 A and 3B illustrate the addition of a hydrogen releasing film according to another embodiment.
  • FIGS. wherein like reference numerals are used throughout the FIGS, to designate similar or equivalent elements.
  • the FIGS are not drawn to scale and they are provided merely to illustrate the example embodiments.
  • Several aspects are described below with reference to example applications for illustration. It should be understood that numerous specific details, relationships, and methods are set forth to provide a full understanding of the example embodiments.
  • One skilled in the relevant art will readily recognize that the example embodiments can be practiced without one or more of the specific details or with other methods.
  • well-known structures or operations are not shown in detail to avoid obscuring the embodiment.
  • the example embodiments are not limited by the illustrated ordering of acts or events, as some acts may occur in different orders and/or concurrently with other acts or events.
  • not all illustrated acts or events are required to implement a methodology in accordance with the example embodiments.
  • Ferroelectric capacitors are frequently used in integrated circuits to provide nonvolatile memory in devices such as Ferroelectric ("FRAM”) memories, high-k capacitors, piezoelectric devices, and pyroelectric devices.
  • FRAM Ferroelectric
  • the construction of the ferroelectric capacitors may be integrated into a CMOS process flow after the formation of the transistor portion of the integrated circuit (e.g. after 'front-end' processing), but before the formation of the metallization or interconnection portion of the integrated circuit (e.g. before 'back-end' processing).
  • CMOS back-end processing steps include the use of hydrogen.
  • hydrogen may be used in the formation of trench etch- stop layers, etch clean, and copper sintering (e.g. heating). During these process steps, hydrogen may diffuse into the ferroelectric capacitor material, causing a degradation in the electrical properties of the device (such as degraded switched polarization of FRAM memory cells).
  • an electrically conductive hydrogen barrier layer may be used to form the bottom plate of an FeCap plus a hydrogen barrier film may be deposited over the FeCap.
  • FeCap refers to a ferroelectric capacitor.
  • the ferroelectric dielectric of the FeCap may be composed of (but is not limited to) lead zirconate titanate (PZT).
  • FeCap region refers to an array of FeCaps having two or more
  • FIGS. 1A and IB compare the encapsulation of a FeCap with hydrogen barrier layers to protect it from hydrogen degradation using conventional means 1000 to a fully encapsulated embodiment 1100 of the instant embodiment.
  • the integrated circuit 1000 containing an FeCap 1022 in FIG. 1A is formed on a substrate 1002 that contains shallow trench isolation ("STI") regions 1004, transistor gates 1012, transistor gate dielectrics 1008, and transistor sources and drains 1006 (that may be silicided 1010).
  • the integrated circuit 1000 also contains a first pre- metal dielectric (“PMD”) layer 1014, contacts 1016, FeCaps 1022, and a hydrogen barrier film 1026.
  • the hydrogen barrier film 1026 has been deposited over the FeCaps 1022 to protect the dielectric of the FeCap from hydrogen degradation.
  • a pre-metal dielectric (“PMD-2”) layer 1032 is deposited over the substrate 1002 containing FeCaps 1022. Second contacts 1030 are formed in the PMD-2 layer 1032 to make contact to the top plate 1024 of the FeCap 1022 and also to the transistor sources and drains 1006.
  • a first level of metal interconnect (“met-1") 1034 is formed within the first level of inter-metal dielectric (“IMD-1") 1036 plus a second level of metal interconnect (“met- 2") 1042, and vias for the met-2 level (“via- 2") 1040 are formed within the second level of inter- metal dielectric (“IMD-2”) 1038. It is to be noted that either fewer or additional levels of metal interconnect and dielectric passivation may be used to complete the integrated circuit 1000.
  • FIG. IB A close-up view of a FeCap 1022 is shown in FIG. IB.
  • a FeCap 1022 may be composed of a conductive hydrogen barrier material such as, but not limited to, TiN, TiAIN, or TiAlON. Even with hydrogen barrier material as a bottom plate 1046 and hydrogen barrier film 1026 overlying the FeCap, hydrogen may still diffuse through seams 1048 that form between the bottom plate 1046 and the hydrogen barrier layer 1026. Hydrogen that diffuses through seams 1048 may degrade the electrical properties of the FeCap.
  • a conductive hydrogen barrier material such as, but not limited to, TiN, TiAIN, or TiAlON.
  • the integrated circuit structure 1100 in FIG. 1C has been formed according to an embodiment that prevents hydrogen diffusion through seams 1148 between the bottom plate 1146 and overlying hydrogen barrier layer 1126 is shown in the inset as shown in FIG. ID.
  • an underlying hydrogen barrier 1120 has been deposited over the integrated circuit 1100. The presence of the underlying hydrogen barrier 1120 under the FeCaps 1150 in the FeCap region 1001 may prevent hydrogen from diffusing through seams 1148, as shown in FIG. ID.
  • FIGS. 2A-2D The manufacturing method for forming an integrated circuit according to an embodiment of the instant embodiment is illustrated in FIGS. 2A-2D.
  • the partially processed integrated circuit 2000 shown in FIG. 2A is built on substrate 2002 and contains STIs 2004, transistor gate dielectrics 2008, transistor gates 2012, transistor sources and drains 2006, silicided source and drain diffusions 2010, silicided gates 2014, and PMD 2016.
  • An underlying hydrogen barrier 2020 has been deposited over PMD 2016.
  • the underlying hydrogen barrier may be formed of one or more dielectric thin films such as LPCVD SiN, low hydrogen PECVD SiN (known as "UV Sin"), AlOx, AlONx, SiNx, and SiNxHy.
  • LPCVD SiN low hydrogen PECVD SiN (known as "UV Sin")
  • the underlying hydrogen barrier layer 2020 is SiNxHy.
  • SiNxHy films typically contain hydrogen in the form of Si-H and N-H bonds.
  • One example process for the underlying hydrogen barrier SiNxHy film 2020 is the formation of a low Si-H bond material using plasma enhanced chemical vapor deposition ("PECVD") with a relatively high nitrogen (N2) gas flow and relatively low ammonia (NH3) flow. This example process is shown infra in Table 1. It is to be noted that alternative processes, such as high density plasma (HDP), may be used to produce the SiNxHy underlying hydrogen barrier of this example embodiment.
  • PECVD plasma enhanced chemical vapor deposition
  • N2 nitrogen
  • NH3 relatively low ammonia
  • FIG. 2A a photoresist contact pattern 2021 has been formed over the integrated circuit 2000 to expose the locations where the PMD 2016 is etched before the formation of electrical contacts within the PMD 2016.
  • FIG. 2B shows the integrated circuit 2100 after the contacts 2018 have been formed, using any well known processing technique, through the PMD 2016 and the underlying hydrogen barrier SiNxHy film 2020.
  • FIG. 2C shows example steps in the formation of the FeCaps 2236.
  • the layers that are deposited to form the FeCap 2236 include bottom 2224 and top 2232 capacitor plates that are formed from a conductive hydrogen barrier material such as TiN, TiAIN, or TiAlON.
  • the FeCap 2236 also includes top 2230 and bottom 2226 capacitor electrodes formed from a conductive material such as Pt, Pd, PdOx, IrPt alloys, Au, Ru, RuOx, (Ba, Sr, PB)Ru03, (Ba,Sr)Ru03, or LaNi03.
  • the FeCap 2236 includes a ferroelectric dielectric material 2228 such as (but not limited to) PZT.
  • a FeCap photoresist pattern 2233 has been formed over the integrated circuit 2200 in preparation for etching the FeCap films 2232, 2230, 2228, 2226, 2224 to form FeCaps 2236 within the FeCap region 2001, as shown in FIG. 2D.
  • FIG. 2D shows the integrated circuit 2300 after the FeCaps 2236 have been etched - using the underlying hydrogen barrier 2020 as an etch stop.
  • an overlying hydrogen diffusion barrier layer 2338 is deposited on top of the FeCap 2236 to completely encapsulate the FeCap 2236 with hydrogen barrier materials.
  • the overlying hydrogen barrier layer 2338 may be composed of one or more hydrogen barrier films such as AlOx, AlONx, SiNx, or SiNxHy.
  • the overlying hydrogen barrier layer 2338 is shown to be one layer but it may be composed of one or more hydrogen barrier layers.
  • hydrogen barrier films 2020 and 2338 may be patterned and etched from over the transistors that are in periphery logic regions 2003 (see FIG. 2E) to enable the hydrogen passivation of the interface states in the circuitry of the periphery logic region 2003 and thereby narrow the transistor threshold voltage ("V t ”) distributions.
  • the overlying hydrogen barrier layer has the overlying hydrogen barrier layer
  • the 2338 may be composed of two hydrogen diffusion barrier films.
  • the first overlying hydrogen barrier film may be nitrided aluminum oxide ("AlONx”) that may be deposited using physical vapor deposition (“PVD”) or atomic layer deposition (“ALD”).
  • the nitridation of the AlOx to improve the hydrogen barrier properties may be accomplished by exposing the AlOx to a nitrogen-containing plasma, or by annealing the AlOx at about 400C in a nitrogen containing ambient.
  • the second overlying hydrogen barrier film may be SiNxHy that is formed using the same PECVD process as the underlying hydrogen barrier layer described in Table 1 supra.
  • FIG. 2E shows integrated circuit 2400 after additional processing adds a second layer of PMD 2444 and second contacts 2446 (that are possibly formed by a process that includes the use of the overlying hydrogen barrier layer 2338 as an etch stop). Further interconnect layers and passivation may then be added to complete integrated circuit 2400.
  • FIGS. 3 A and 3B Another embodiment is illustrated in FIGS. 3 A and 3B.
  • the underlying hydrogen barrier layer 3020 that protects the FeCaps from the hydrogen that may diffuse through the seams between the encapsulating hydrogen barrier layers may also prevent hydrogen from diffusing to the interface 3058 and thereby passivating the interface states.
  • An inadequate hydrogen passivation of the interface states may result in decreased manufacturing yield due to widened CMOS transistor V t distributions, V t instability, and degraded analog transistor characteristics.
  • a hydrogen releasing film 3022 may be formed under the underlying hydrogen barrier film 3020 in the integrated circuit 3000.
  • the hydrogen releasing layer 3022 may be a SiNxHy film that is deposited using HDP under process conditions, such as those shown in Table 2 supra, to form a SiNxHy film 3022 with a high concentration of Si-H bonds.
  • Si-H bonds are of a lower bond energy (e.g., about 3.34 eV) than N-H bonds (e.g., about 4.05 eV). Therefore, Si-H bonds tend to dissociate during thermal processing steps (such as copper anneals that usually release hydrogen). During back-end thermal steps (such as the copper anneals) hydrogen may be released from this hydrogen releasing film 3022 and may diffuse into the interface 3058 and then passivate the interface states and crystalline defects.
  • the underlying hydrogen barrier 3020 of this embodiment may prevent this released hydrogen from diffusing upwards and subsequently degrading the FeCap.
  • the underlying hydrogen barrier film 3020 that is located on top of the hydrogen releasing film 3022 may also prevent the degradation of the passivation by preventing hydrogen from diffusing away from the interface.
  • a deuterium releasing film may be used for the passivation of the interface states and the crystal defects.
  • Deuterium is more expensive than hydrogen, but the deuterium- silicon bonds in deuterium-pas sivated interface states are stronger than hydrogen-silicon bonds in hydrogen-passivated interface states. Therefore, the V t 's of transistors on deuterium passivated wafers are typically more stable over time than the V t 's of transistors on hydrogen passivated wafers.
  • the deuterium in a deuterium releasing film is predominately bonded to silicon (Si-D).
  • An optional oxide capping layer 3024 may be deposited on top of the underlying hydrogen barrier 3020 to prevent photoresist from coming into contact with the SiNxHy underlying hydrogen barrier 3020.
  • N3 ⁇ 4 see Table 1, supra
  • residual N3 ⁇ 4 may remain in the film and may react with the contact photoresist 3026, making the contact photoresist 3026 difficult develop and also difficult to be removed later in the fabrication process.
  • the contact photoresist 3026 is formed on the optional oxide capping layer.
  • FIG. 3B shows an integrated circuit 3100 after first contacts 3018 have been formed and contact photoresist pattern 3026 removed. Also shown are the FeCaps 3136, PMD-2 3444 and second contacts 3446. Additional processing to add other interconnects and dielectric layers may be performed to complete the integrated circuit.

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Abstract

An integrated circuit containing a ferroelectric capacitor, an underlying hydrogen barrier (2020), and an overlying hydrogen barrier layer (2338). A method for forming an integrated circuit containing a ferroelectric capacitor, an underlying hydrogen barrier(2020), and an overlying hydrogen barrier layer (2338).

Description

FERROELECTRIC CAPACITOR ENCAPSULATED WITH HYDROGEN BARRIER
[0001] This related to the field of integrated circuits; and, more particularly, to protecting a ferroelectric capacitor from hydrogen degradation.
BRIEF DESCRIPTION OF THE DRAWINGS
[0002] FIGS. 1A and IB (Prior Art) and FIGS. 1C and ID illustrate portions of integrated circuits.
[0003] FIGS. 2A-2E illustrate steps in an integrated circuit process flow according to an embodiment.
[0004] FIGS. 3 A and 3B illustrate the addition of a hydrogen releasing film according to another embodiment.
DETAILED DESCRIPTION OF EXAMPLE EMBODIMENTS
[0005] The example embodiments are described with reference to the attached
FIGS., wherein like reference numerals are used throughout the FIGS, to designate similar or equivalent elements. The FIGS, are not drawn to scale and they are provided merely to illustrate the example embodiments. Several aspects are described below with reference to example applications for illustration. It should be understood that numerous specific details, relationships, and methods are set forth to provide a full understanding of the example embodiments. One skilled in the relevant art, however, will readily recognize that the example embodiments can be practiced without one or more of the specific details or with other methods. In other instances, well-known structures or operations are not shown in detail to avoid obscuring the embodiment. The example embodiments are not limited by the illustrated ordering of acts or events, as some acts may occur in different orders and/or concurrently with other acts or events. Furthermore, not all illustrated acts or events are required to implement a methodology in accordance with the example embodiments.
[0006] Ferroelectric capacitors (FeCaps) are frequently used in integrated circuits to provide nonvolatile memory in devices such as Ferroelectric ("FRAM") memories, high-k capacitors, piezoelectric devices, and pyroelectric devices. The construction of the ferroelectric capacitors may be integrated into a CMOS process flow after the formation of the transistor portion of the integrated circuit (e.g. after 'front-end' processing), but before the formation of the metallization or interconnection portion of the integrated circuit (e.g. before 'back-end' processing).
[0007] Many CMOS back-end processing steps include the use of hydrogen. For example, hydrogen may be used in the formation of trench etch- stop layers, etch clean, and copper sintering (e.g. heating). During these process steps, hydrogen may diffuse into the ferroelectric capacitor material, causing a degradation in the electrical properties of the device (such as degraded switched polarization of FRAM memory cells). To protect the FeCaps from degradation due to hydrogen, an electrically conductive hydrogen barrier layer may be used to form the bottom plate of an FeCap plus a hydrogen barrier film may be deposited over the FeCap.
[0008] The term "FeCap" refers to a ferroelectric capacitor. The ferroelectric dielectric of the FeCap may be composed of (but is not limited to) lead zirconate titanate (PZT).
[0009] The term "FeCap region" refers to an array of FeCaps having two or more
FeCaps.
[0010] FIGS. 1A and IB compare the encapsulation of a FeCap with hydrogen barrier layers to protect it from hydrogen degradation using conventional means 1000 to a fully encapsulated embodiment 1100 of the instant embodiment.
[0011] The integrated circuit 1000 containing an FeCap 1022 in FIG. 1A is formed on a substrate 1002 that contains shallow trench isolation ("STI") regions 1004, transistor gates 1012, transistor gate dielectrics 1008, and transistor sources and drains 1006 (that may be silicided 1010). The integrated circuit 1000 also contains a first pre- metal dielectric ("PMD") layer 1014, contacts 1016, FeCaps 1022, and a hydrogen barrier film 1026. The hydrogen barrier film 1026 has been deposited over the FeCaps 1022 to protect the dielectric of the FeCap from hydrogen degradation.
[0012] A pre-metal dielectric ("PMD-2") layer 1032 is deposited over the substrate 1002 containing FeCaps 1022. Second contacts 1030 are formed in the PMD-2 layer 1032 to make contact to the top plate 1024 of the FeCap 1022 and also to the transistor sources and drains 1006. A first level of metal interconnect ("met-1") 1034 is formed within the first level of inter-metal dielectric ("IMD-1") 1036 plus a second level of metal interconnect ("met- 2") 1042, and vias for the met-2 level ("via- 2") 1040 are formed within the second level of inter- metal dielectric ("IMD-2") 1038. It is to be noted that either fewer or additional levels of metal interconnect and dielectric passivation may be used to complete the integrated circuit 1000.
[0013] A close-up view of a FeCap 1022 is shown in FIG. IB. The bottom plate
1046 of a FeCap 1022 may be composed of a conductive hydrogen barrier material such as, but not limited to, TiN, TiAIN, or TiAlON. Even with hydrogen barrier material as a bottom plate 1046 and hydrogen barrier film 1026 overlying the FeCap, hydrogen may still diffuse through seams 1048 that form between the bottom plate 1046 and the hydrogen barrier layer 1026. Hydrogen that diffuses through seams 1048 may degrade the electrical properties of the FeCap.
[0014] The integrated circuit structure 1100 in FIG. 1C has been formed according to an embodiment that prevents hydrogen diffusion through seams 1148 between the bottom plate 1146 and overlying hydrogen barrier layer 1126 is shown in the inset as shown in FIG. ID. According to this embodiment, an underlying hydrogen barrier 1120 has been deposited over the integrated circuit 1100. The presence of the underlying hydrogen barrier 1120 under the FeCaps 1150 in the FeCap region 1001 may prevent hydrogen from diffusing through seams 1148, as shown in FIG. ID.
[0015] The manufacturing method for forming an integrated circuit according to an embodiment of the instant embodiment is illustrated in FIGS. 2A-2D. The partially processed integrated circuit 2000 shown in FIG. 2A, is built on substrate 2002 and contains STIs 2004, transistor gate dielectrics 2008, transistor gates 2012, transistor sources and drains 2006, silicided source and drain diffusions 2010, silicided gates 2014, and PMD 2016. An underlying hydrogen barrier 2020 has been deposited over PMD 2016. The underlying hydrogen barrier may be formed of one or more dielectric thin films such as LPCVD SiN, low hydrogen PECVD SiN (known as "UV Sin"), AlOx, AlONx, SiNx, and SiNxHy. In the example embodiment shown in FIG. 2A, the underlying hydrogen barrier layer 2020 is SiNxHy. SiNxHy films typically contain hydrogen in the form of Si-H and N-H bonds. One example process for the underlying hydrogen barrier SiNxHy film 2020 is the formation of a low Si-H bond material using plasma enhanced chemical vapor deposition ("PECVD") with a relatively high nitrogen (N2) gas flow and relatively low ammonia (NH3) flow. This example process is shown infra in Table 1. It is to be noted that alternative processes, such as high density plasma (HDP), may be used to produce the SiNxHy underlying hydrogen barrier of this example embodiment.
Figure imgf000006_0001
[0016] As shown in FIG. 2A, a photoresist contact pattern 2021 has been formed over the integrated circuit 2000 to expose the locations where the PMD 2016 is etched before the formation of electrical contacts within the PMD 2016. FIG. 2B shows the integrated circuit 2100 after the contacts 2018 have been formed, using any well known processing technique, through the PMD 2016 and the underlying hydrogen barrier SiNxHy film 2020.
[0017] FIG. 2C shows example steps in the formation of the FeCaps 2236. The layers that are deposited to form the FeCap 2236 include bottom 2224 and top 2232 capacitor plates that are formed from a conductive hydrogen barrier material such as TiN, TiAIN, or TiAlON. The FeCap 2236 also includes top 2230 and bottom 2226 capacitor electrodes formed from a conductive material such as Pt, Pd, PdOx, IrPt alloys, Au, Ru, RuOx, (Ba, Sr, PB)Ru03, (Ba,Sr)Ru03, or LaNi03. In addition, the FeCap 2236 includes a ferroelectric dielectric material 2228 such as (but not limited to) PZT. A FeCap photoresist pattern 2233 has been formed over the integrated circuit 2200 in preparation for etching the FeCap films 2232, 2230, 2228, 2226, 2224 to form FeCaps 2236 within the FeCap region 2001, as shown in FIG. 2D.
[0018] FIG. 2D shows the integrated circuit 2300 after the FeCaps 2236 have been etched - using the underlying hydrogen barrier 2020 as an etch stop. Next, an overlying hydrogen diffusion barrier layer 2338 is deposited on top of the FeCap 2236 to completely encapsulate the FeCap 2236 with hydrogen barrier materials. The overlying hydrogen barrier layer 2338 may be composed of one or more hydrogen barrier films such as AlOx, AlONx, SiNx, or SiNxHy. In FIG. 2D, the overlying hydrogen barrier layer 2338 is shown to be one layer but it may be composed of one or more hydrogen barrier layers.
[0019] As described in US Patent Publ. No. 2010/0224961 Al, hydrogen barrier films 2020 and 2338 may be patterned and etched from over the transistors that are in periphery logic regions 2003 (see FIG. 2E) to enable the hydrogen passivation of the interface states in the circuitry of the periphery logic region 2003 and thereby narrow the transistor threshold voltage ("Vt") distributions.
[0020] In another example embodiment, the overlying hydrogen barrier layer
2338 may be composed of two hydrogen diffusion barrier films. The first overlying hydrogen barrier film may be nitrided aluminum oxide ("AlONx") that may be deposited using physical vapor deposition ("PVD") or atomic layer deposition ("ALD"). The nitridation of the AlOx to improve the hydrogen barrier properties may be accomplished by exposing the AlOx to a nitrogen-containing plasma, or by annealing the AlOx at about 400C in a nitrogen containing ambient. The second overlying hydrogen barrier film may be SiNxHy that is formed using the same PECVD process as the underlying hydrogen barrier layer described in Table 1 supra.
[0021] FIG. 2E shows integrated circuit 2400 after additional processing adds a second layer of PMD 2444 and second contacts 2446 (that are possibly formed by a process that includes the use of the overlying hydrogen barrier layer 2338 as an etch stop). Further interconnect layers and passivation may then be added to complete integrated circuit 2400.
[0022] Another embodiment is illustrated in FIGS. 3 A and 3B. The underlying hydrogen barrier layer 3020 that protects the FeCaps from the hydrogen that may diffuse through the seams between the encapsulating hydrogen barrier layers may also prevent hydrogen from diffusing to the interface 3058 and thereby passivating the interface states. An inadequate hydrogen passivation of the interface states may result in decreased manufacturing yield due to widened CMOS transistor Vt distributions, Vt instability, and degraded analog transistor characteristics.
[0023] As described in PCT Application No. PCT/US2010/ filed
December 9, 2010, entitled "Hydrogen Passivation of Integrated Circuits" (corresponding to US Application No. 12/890,137 filed September 24, 2010), a hydrogen releasing film 3022 may be formed under the underlying hydrogen barrier film 3020 in the integrated circuit 3000. The hydrogen releasing layer 3022 may be a SiNxHy film that is deposited using HDP under process conditions, such as those shown in Table 2 supra, to form a SiNxHy film 3022 with a high concentration of Si-H bonds.
Figure imgf000008_0001
[0024] Generally, Si-H bonds are of a lower bond energy (e.g., about 3.34 eV) than N-H bonds (e.g., about 4.05 eV). Therefore, Si-H bonds tend to dissociate during thermal processing steps (such as copper anneals that usually release hydrogen). During back-end thermal steps (such as the copper anneals) hydrogen may be released from this hydrogen releasing film 3022 and may diffuse into the interface 3058 and then passivate the interface states and crystalline defects. However, the underlying hydrogen barrier 3020 of this embodiment may prevent this released hydrogen from diffusing upwards and subsequently degrading the FeCap. The underlying hydrogen barrier film 3020 that is located on top of the hydrogen releasing film 3022 may also prevent the degradation of the passivation by preventing hydrogen from diffusing away from the interface.
[0025] Instead of a hydrogen-releasing film 3022 of FIGS. 3A and 3B, a deuterium releasing film may be used for the passivation of the interface states and the crystal defects. Deuterium is more expensive than hydrogen, but the deuterium- silicon bonds in deuterium-pas sivated interface states are stronger than hydrogen-silicon bonds in hydrogen-passivated interface states. Therefore, the Vt's of transistors on deuterium passivated wafers are typically more stable over time than the Vt's of transistors on hydrogen passivated wafers. Similar to the hydrogen releasing film, the deuterium in a deuterium releasing film is predominately bonded to silicon (Si-D). Because Si-D bonds are lower energy than nitrogen to deuterium (N-D) bonds, the Si-D bonds may dissociate during high temperature anneals, thereby providing deuterium atoms for the passivation of the interface states. [0026] An optional oxide capping layer 3024 may be deposited on top of the underlying hydrogen barrier 3020 to prevent photoresist from coming into contact with the SiNxHy underlying hydrogen barrier 3020. When the SiNxHy film is formed with N¾ (see Table 1, supra), residual N¾ may remain in the film and may react with the contact photoresist 3026, making the contact photoresist 3026 difficult develop and also difficult to be removed later in the fabrication process. In the embodiment shown in FIG. 3A, the contact photoresist 3026 is formed on the optional oxide capping layer.
[0027] FIG. 3B shows an integrated circuit 3100 after first contacts 3018 have been formed and contact photoresist pattern 3026 removed. Also shown are the FeCaps 3136, PMD-2 3444 and second contacts 3446. Additional processing to add other interconnects and dielectric layers may be performed to complete the integrated circuit.
[0028] While various example embodiments have been described above, it should be understood that they have been presented by way of example only and not limitation. Numerous changes to the disclosed embodiments can be made in accordance with the disclosure herein without departing from the scope of the claimed invention.

Claims

CLAIMS What is claimed is:
1. An integrated circuit, comprising:
a ferroelectric capacitor;
an underlying hydrogen barrier coupled to a bottom surface of said ferroelectric capacitor; and
an overlying hydrogen barrier layer in contact with a portion of a top surface of said underlying hydrogen barrier.
2. The integrated circuit of claim 1, wherein said overlying hydrogen barrier layer is also coupled to side and top surfaces of said ferroelectric capacitor.
3. The integrated circuit of claim 1, wherein said underlying hydrogen barrier is in contact with a pre-metal dielectric layer of said integrated circuit.
4. The integrated circuit of claim 1 wherein said underlying hydrogen barrier is selected from the group consisting of AlO, AION, SiNx, SiNxHy, and any combination thereof.
5. The integrated circuit of claim 1, wherein said overlying hydrogen barrier layer is comprised of a nitrided AlO film and a SiNxHy film.
6. The integrated circuit of claim 1, wherein said overlying hydrogen barrier layer is a SiNxHy film.
7. The integrated circuit of claim 1, wherein said underlying hydrogen barrier is in contact with a bottom plate of said ferroelectric capacitor; and said overlying hydrogen barrier layer is in contact with a top plate of said ferroelectric capacitor.
8. The integrated circuit of claim 1, further comprising a hydrogen releasing film coupled to a bottom surface of said underlying hydrogen barrier.
9. The integrated circuit of claim 8, wherein said hydrogen releasing film is in contact with said bottom surface of said underlying hydrogen barrier.
10. The integrated circuit of claim 8, wherein an oxide capping layer is coupled between said underlying hydrogen barrier and said bottom surface of said ferroelectric capacitor.
11. The integrated circuit of claim 10, wherein said oxide capping layer is in contact with a bottom plate of said ferroelectric capacitor; and said overlying hydrogen barrier layer is in contact with a top plate of said ferroelectric capacitor.
12. The integrated circuit of claim 8, wherein said underlying hydrogen barrier is selected from the group consisting of AlO, AION, SiNx, SiNxHy, and any combination thereof.
13. The integrated circuit of claim 8, wherein said hydrogen releasing film includes SiNxHy with a higher concentration of Si-H bonds than N-H bonds.
14. The integrated circuit of claim 1, further comprising a deuterium releasing film coupled to a bottom surface of said underlying hydrogen barrier.
15. The integrated circuit of claim 14, wherein an oxide capping layer is coupled between said underlying hydrogen barrier and said bottom surface of said ferroelectric capacitor.
16. The integrated circuit of claim 14, wherein said deuterium releasing film includes SiNxDy with a higher concentration of Si-D bonds than N-D bonds.
17. A process of forming an integrated circuit, comprising:
providing a partially processed integrated circuit having a pre-metal dielectric layer;
depositing an underlying hydrogen barrier on said pre-metal dielectric layer; and
forming a ferroelectric capacitor over said underlying hydrogen barrier.
18. The process of claim 17, further comprising a step of depositing an oxide capping layer over said underlying hydrogen barrier prior to said step of forming a ferroelectric capacitor.
19. The process of claim 17, further comprising a step of depositing at least one of a hydrogen releasing film and a deuterium releasing film prior to said step of depositing said underlying hydrogen barrier.
20. The process of claim 17, further comprising a step of depositing an overlying hydrogen barrier layer on said integrated circuit subsequent to said step of forming a ferroelectric capacitor.
PCT/US2010/059718 2010-12-09 2010-12-09 Ferroelectric capacitor encapsulated with hydrogen barrier WO2012078162A1 (en)

Priority Applications (3)

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PCT/US2010/059718 WO2012078162A1 (en) 2010-12-09 2010-12-09 Ferroelectric capacitor encapsulated with hydrogen barrier
JP2013543142A JP2014502783A (en) 2010-12-09 2010-12-09 Ferroelectric capacitor sealed with hydrogen barrier
CN2010800705676A CN103250251A (en) 2010-12-09 2010-12-09 Ferroelectric capacitor encapsulated with hydrogen barrier

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