WO2011129633A3 - Copper electrolysis solution for producing electrolytic copper foil, method of producing electrolytic copper foil, and electrolytic copper foil - Google Patents
Copper electrolysis solution for producing electrolytic copper foil, method of producing electrolytic copper foil, and electrolytic copper foil Download PDFInfo
- Publication number
- WO2011129633A3 WO2011129633A3 PCT/KR2011/002670 KR2011002670W WO2011129633A3 WO 2011129633 A3 WO2011129633 A3 WO 2011129633A3 KR 2011002670 W KR2011002670 W KR 2011002670W WO 2011129633 A3 WO2011129633 A3 WO 2011129633A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- copper foil
- electrolytic copper
- electrolysis solution
- producing
- producing electrolytic
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/04—Wires; Strips; Foils
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
- C25D5/50—After-treatment of electroplated surfaces by heat-treatment
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Cell Electrode Carriers And Collectors (AREA)
- Electrolytic Production Of Metals (AREA)
Abstract
Provided is a copper electrolysis solution for producing an electrolytic copper foil, according to an embodiment of the present invention, includes a Cl- ion, and collagen peptide, wherein the collagen peptide has a number average molecular weight of 4,000 to 10,000 and a concentration of 0.5 to 20 ppm, and the Cl-ion has a concentration of 0.5 to 1.5 ppm. The copper electrolysis solution may provide an electrolytic copper foil having a relatively simple manufacturing process, high thermal stability, low roughness, and high strength. The electrolytic copper foil may be used as a current collector for middle or large-sized lithium ion secondary batteries for use in hybrid electric vehicles and as a semiconductor packing substrate for tape automated bonding (TAB) used in a tape carrier package (TCP).
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020100034390A KR101386093B1 (en) | 2010-04-14 | 2010-04-14 | Copper electrolysis solution for production of electrolytic copper foil, process for producing electrolytic copper foil and electrolytic copper foil |
KR10-2010-0034390 | 2010-04-14 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2011129633A2 WO2011129633A2 (en) | 2011-10-20 |
WO2011129633A3 true WO2011129633A3 (en) | 2012-03-01 |
Family
ID=44799190
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/KR2011/002670 WO2011129633A2 (en) | 2010-04-14 | 2011-04-14 | Copper electrolysis solution for producing electrolytic copper foil, method of producing electrolytic copper foil, and electrolytic copper foil |
Country Status (2)
Country | Link |
---|---|
KR (1) | KR101386093B1 (en) |
WO (1) | WO2011129633A2 (en) |
Families Citing this family (21)
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---|---|---|---|---|
JP5722813B2 (en) * | 2012-03-02 | 2015-05-27 | Jx日鉱日石金属株式会社 | Electrode copper foil and negative electrode current collector for secondary battery |
CN102965699B (en) * | 2012-11-20 | 2015-06-24 | 山东金盛源铜业有限公司 | Method for producing 6-mu m ultra-thin electrolytic copper foil |
CN102965698B (en) * | 2012-11-28 | 2015-09-09 | 山东金宝电子股份有限公司 | Low warpage electrolytic copper foil production technique |
KR101449342B1 (en) * | 2013-11-08 | 2014-10-13 | 일진머티리얼즈 주식회사 | Electrolytic copper foil, electric component and battery comprising the foil |
KR101500566B1 (en) * | 2014-03-20 | 2015-03-12 | 일진머티리얼즈 주식회사 | Electrolytic copper foil, current collector, anode and lithium battery comprising foil |
KR101500565B1 (en) * | 2014-03-20 | 2015-03-12 | 일진머티리얼즈 주식회사 | Electrolytic copper foil, current collector, anode and lithium battery comprising foil |
US10480090B2 (en) | 2015-06-24 | 2019-11-19 | Kcf Technologies Co., Ltd. | Electrolytic copper foil, current collector comprising the same, electrode comprising the same, secondary battery comprising the same, and method for manufacturing the same |
KR101802949B1 (en) * | 2016-04-28 | 2017-11-29 | 일진머티리얼즈 주식회사 | Electrolytic copper foil and process for producing thereof |
KR101802948B1 (en) * | 2016-04-28 | 2017-11-29 | 일진머티리얼즈 주식회사 | Electrolytic copper foil and process for producing thereof |
US20210371997A1 (en) * | 2017-07-31 | 2021-12-02 | Circuit Foil Luxembourg, Sarl | Surface treated copper foil and copper-clad laminate |
US10424793B2 (en) * | 2017-11-14 | 2019-09-24 | Chang Chun Petrochemical Co., Ltd. | Electrodeposited copper foil and method for producing the same, and current collector for lithium secondary battery and secondary battery comprising the electrodeposited copper foil |
CN110219025A (en) * | 2019-06-05 | 2019-09-10 | 惠州联合铜箔电子材料有限公司 | A kind of production technology of ultrathin electrolytic copper foil |
JP6667840B1 (en) | 2019-07-22 | 2020-03-18 | テックス・テクノロジー株式会社 | Manufacturing method of electrolytic copper foil |
CN110438531B (en) * | 2019-08-12 | 2021-12-24 | 湖北中一科技股份有限公司 | Preparation method and system of ultrathin copper foil applied to lithium battery |
CN110396704B (en) * | 2019-08-12 | 2021-07-20 | 湖北中一科技股份有限公司 | Ultrathin electrolytic copper foil and preparation method thereof |
CN111270273A (en) * | 2020-02-24 | 2020-06-12 | 江西铜业集团有限公司 | Additive for high-tensile electrolytic copper foil and process for preparing high-tensile electrolytic copper foil |
KR20220043617A (en) * | 2020-09-29 | 2022-04-05 | 에스케이넥실리스 주식회사 | Electrolytic Copper Foil of High Strength, Electrode Comprising The Same, Secondary Battery Comprising The Same, and Method for Manufacturing The Same |
CN112779569B (en) * | 2020-12-30 | 2022-01-18 | 铜陵市华创新材料有限公司 | Method for improving laser die cutting molten beads of electrolytic copper foil for lithium ion battery |
LU501353B1 (en) * | 2022-01-28 | 2023-07-28 | Circuit Foil Luxembourg | Electrodeposited copper foil and method for producing same |
CN116083972B (en) * | 2022-12-09 | 2023-08-18 | 浙江花园新能源股份有限公司 | Production process of reverse copper foil with low roughness and high peel strength, product and application thereof |
CN116180166B (en) * | 2023-03-01 | 2024-05-03 | 安徽华创新材料股份有限公司 | Production method of 3.5-4 mu m double-sided light copper foil |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR19990028891A (en) * | 1996-05-13 | 1999-04-15 | 미야무라 신페이 | High-tension electrolytic copper foil and its manufacturing method |
KR20030036415A (en) * | 2002-11-14 | 2003-05-09 | 일진소재산업주식회사 | Electrolytic copper foil and process producing the same |
KR20040094600A (en) * | 2002-04-12 | 2004-11-10 | 미쓰이 긴조꾸 고교 가부시키가이샤 | Copper foil with carrier foil, process for producing the same and copper clad laminate including the copper foil with carrier foil |
JP2006152420A (en) * | 2004-12-01 | 2006-06-15 | Mitsui Mining & Smelting Co Ltd | Electrolytic copper foil and method for producing the same |
-
2010
- 2010-04-14 KR KR1020100034390A patent/KR101386093B1/en active IP Right Grant
-
2011
- 2011-04-14 WO PCT/KR2011/002670 patent/WO2011129633A2/en active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR19990028891A (en) * | 1996-05-13 | 1999-04-15 | 미야무라 신페이 | High-tension electrolytic copper foil and its manufacturing method |
KR20040094600A (en) * | 2002-04-12 | 2004-11-10 | 미쓰이 긴조꾸 고교 가부시키가이샤 | Copper foil with carrier foil, process for producing the same and copper clad laminate including the copper foil with carrier foil |
KR20030036415A (en) * | 2002-11-14 | 2003-05-09 | 일진소재산업주식회사 | Electrolytic copper foil and process producing the same |
JP2006152420A (en) * | 2004-12-01 | 2006-06-15 | Mitsui Mining & Smelting Co Ltd | Electrolytic copper foil and method for producing the same |
Also Published As
Publication number | Publication date |
---|---|
KR20110114971A (en) | 2011-10-20 |
WO2011129633A2 (en) | 2011-10-20 |
KR101386093B1 (en) | 2014-04-24 |
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