WO2011070735A1

WO2011070735A1 - Electronic device

Info

Publication number: WO2011070735A1
Application number: PCT/JP2010/006879
Authority: WO
Inventors: 雅治今里; 博鳥屋尾; 小林　直樹; 徳昭安道
Original assignee: 日本電気株式会社
Priority date: 2009-12-08
Filing date: 2010-11-25
Publication date: 2011-06-16
Also published as: JP5673552B2; JPWO2011070735A1

Abstract

Disclosed is an electronic device that has a substrate (10), an electronic component (20) mounted on the substrate (10), and a heatsink (30) provided on top of the electronic component (20) either directly or with a spacer (50) interposed therebetween. At least one type of structure (40) is provided on a first surface of the heatsink (30), said first surface being on the side of the heatsink that faces the electronic component (20). The structure (40) is provided with a dielectric layer and a first conductor. Said first conductor, at least part of which has a repeating structure, is provided inside or on a first surface of the dielectric layer so as to be opposite a second surface of the dielectric layer, said second surface being the surface on the side of the dielectric layer opposite the first surface thereof. The structure (40) is provided such that the second surface of the dielectric layer, which is the surface on the side of the dielectric layer opposite the first surface thereof, is in contact with the first surface of the heatsink (30).

Description

Electronics

The present invention relates to an electronic device. More specifically, the present invention relates to an electronic device that includes an electronic component such as an IC and includes a heat radiating plate that radiates heat generated by the electronic component.

Electronic components such as ICs mounted on a substrate are highly integrated in order to achieve high speed and high functionality, and thus consume a large current. In order to prevent the electronic component from exceeding the allowable temperature due to heat generated by the large current, a heat sink may be provided on the electronic component. The heat radiating plate is made of, for example, a metal structure. When heat generated in the electronic component is transmitted to the heat radiating plate, the heat radiating plate radiates the heat into the air.

When such a heat sink is provided, there is a problem that noise such as harmonic components of a clock signal generated by electronic components (hereinafter simply referred to as “noise”) is radiated into the air through the heat sink. Can occur. In particular, when the noise transmitted to the heat sink and the heat sink are in a resonance state, extremely strong noise is radiated. Therefore, a means for suppressing noise from being radiated from the heat sink is desired.

Here, Patent Document 1 describes an electromagnetic wave absorbing and heat radiating electronic component intended to solve the problem of noise emission. In this electromagnetic wave absorbing and heat radiating electronic component, the electronic component and the heat radiating plate are bonded with an electromagnetic wave absorbing adhesive in which an organic binder and a Sendust soft magnetic powder containing a coupling agent are mixed. According to this configuration, it is described that the noise generated by the electronic component can be prevented from being transmitted to the heat sink by absorbing the noise by the electromagnetic wave absorbing adhesive.

Japanese Patent Laid-Open No. 11-50029

However, the technique described in Patent Document 1 has the following problems. In order to efficiently dissipate heat generated from the electronic component by the heat radiating plate, it is necessary to provide a sufficiently small thermal resistance between the electronic component and the heat radiating plate. However, in the case of the technique described in Patent Document 1, an electromagnetic wave absorbing adhesive for absorbing electromagnetic waves is provided between the electronic component and the heat sink. In order to sufficiently absorb electromagnetic waves with this electromagnetic wave absorbing adhesive, it is necessary to make the electromagnetic wave absorbing adhesive thick to some extent, but in such a case, the thermal resistance due to the electromagnetic wave absorbing adhesive increases. As a result, heat dissipation from the heat sink is not sufficiently realized, and there is a possibility that the allowable temperature of the electronic component is exceeded.

By the way, in recent years, as the frequency used for electronic components increases, the band of generated noise shifts in the high frequency direction and reaches several GHz. Therefore, a technique for suppressing such high-frequency noise from being radiated from the heat sink is desired.

The present invention provides an electronic device provided with a heat sink on an electronic component mounted on a substrate, and provided with means for effectively suppressing noise from being emitted from the heat sink. Let it be an issue.

According to the present invention, there is provided a substrate, an electronic component mounted on the substrate, and a heat sink provided on the electronic component directly or via a spacer, and the electronic component of the heat sink The first surface on the opposite side has a dielectric layer and a second surface that is the surface opposite to the first surface of the dielectric layer on or inside the dielectric layer. And at least one type of structure including a first conductor having a repetitive structure in at least a partial region, the heat sink on the second surface of the dielectric layer. An electronic device is provided so as to be in contact with the first surface.

According to the invention, there is provided a substrate, an electronic component mounted on the substrate, and a heat radiating plate provided directly or via a spacer on the electronic component, and the electrons of the heat radiating plate The first surface on the side facing the component has a dielectric layer and a first surface that is opposite to the first surface of the dielectric layer on or inside the dielectric layer. And a second conductor formed on the second surface of the dielectric layer, at least in part, and having a repetitive structure in at least a partial region. In one type of structure, the second conductor is positioned closer to the first surface of the heat sink than the first conductor, and the second conductor is electrically connected to the first surface of the heat sink. An electronic device is provided that is provided.

According to the present invention, it is possible to suppress the noise generated in the electronic component from being radiated from the heat sink provided on the electronic component.

FIG. 3 is a cross-sectional view schematically illustrating an example of the electronic apparatus of the first embodiment. 4 is a plan view schematically showing an example of the electronic apparatus of Embodiment 1. FIG. It is a top view which shows typically an example of the structure of an electronic device of Embodiment 1, and a heat sink. FIG. 3 is a cross-sectional view schematically illustrating an example of a structure of the electronic device according to the first embodiment. 6 is a cross-sectional view illustrating an example of a manufacturing process of the electronic device of Embodiment 1. FIG. It is a perspective view which shows typically an example of the EBG structure comprised by the structure of Embodiment 1, and a heat sink. It is sectional drawing which shows typically an example of the EBG structure comprised by the structure of Embodiment 1, and a heat sink. It is an equivalent circuit diagram of an example of the EBG structure comprised by the structure of Embodiment 1, and a heat sink. FIG. 3 is a cross-sectional view schematically illustrating an example of a structure of the electronic device according to the first embodiment. 6 is a cross-sectional view illustrating an example of a manufacturing process of the electronic device of Embodiment 1. FIG. FIG. 3 is a cross-sectional view schematically illustrating an example of a structure of the electronic device according to the first embodiment. FIG. 3 is a plan view schematically illustrating an example of a structure of the electronic device according to the first embodiment. It is an equivalent circuit diagram of an example of the EBG structure comprised by the structure of Embodiment 1, and a heat sink. FIG. 3 is a cross-sectional view schematically illustrating an example of a structure of the electronic device according to the first embodiment. 6 is a cross-sectional view illustrating an example of a manufacturing process of the electronic device of Embodiment 1. FIG. FIG. 3 is a cross-sectional view schematically illustrating an example of a structure of the electronic device according to the first embodiment. FIG. 3 is a plan view schematically illustrating an example of a structure of the electronic device according to the first embodiment. It is an equivalent circuit diagram of an example of the EBG structure comprised by the structure of Embodiment 1, and a heat sink. FIG. 3 is a cross-sectional view schematically illustrating an example of a structure of the electronic device according to the first embodiment. 6 is a cross-sectional view illustrating an example of a manufacturing process of the electronic device of Embodiment 1. FIG. It is an equivalent circuit diagram of an example of the EBG structure comprised by the structure of Embodiment 1, and a heat sink. FIG. 3 is a cross-sectional view schematically illustrating an example of a structure of the electronic device according to the first embodiment. 3 is a perspective view schematically showing an example of an island-shaped conductor of the structure of the electronic device of Embodiment 1. FIG. It is a perspective view which shows typically an example of the EBG structure comprised by the structure of Embodiment 1, and a heat sink. It is a side view which shows typically an example of the EBG structure comprised by the structure of Embodiment 1, and a heat sink. It is an equivalent circuit diagram of an example of the EBG structure comprised by the structure of Embodiment 1, and a heat sink. 3 is a perspective view schematically showing an example of an island-shaped conductor of the structure of the electronic device of Embodiment 1. FIG. It is a perspective view which shows typically an example of the EBG structure comprised by the structure of Embodiment 1, and a heat sink. It is an equivalent circuit diagram of an example of the EBG structure comprised by the structure of Embodiment 1, and a heat sink. FIG. 3 is a cross-sectional view schematically illustrating an example of a structure of the electronic device according to the first embodiment. It is sectional drawing which shows typically an example of the structure of the electronic device of Embodiment 2. FIG. It is sectional drawing which shows typically an example of the structure of the electronic device of Embodiment 2. FIG. It is sectional drawing which shows typically an example of the structure of the electronic device of Embodiment 2. FIG. It is sectional drawing which shows typically an example of the structure of the electronic device of Embodiment 2. FIG. 6 is a plan view schematically showing an example of a second conductor of a structure of an electronic apparatus according to Embodiment 2. FIG. 6 is a plan view schematically showing an example of a second conductor of a structure of an electronic apparatus according to Embodiment 2. FIG. It is a perspective view which shows typically an example of the EBG structure with which the structure of Embodiment 2 is provided. It is a perspective view which shows typically an example of the EBG structure with which the structure of Embodiment 2 is provided. It is a top view which shows typically an example of the structure of an electronic device of Embodiment 3, and a heat sink. It is a top view which shows typically an example of the structure of an electronic device of Embodiment 3, and a heat sink. FIG. 7 is an equivalent circuit diagram of the EBG structure shown in FIG. 6. It is a formula for calculating a frequency band of noise for suppressing propagation by the EBG structure. It is a top view which shows typically an example of the structure of the electronic device of Embodiment 4, and a heat sink. It is a top view which shows typically an example of the structure of an electronic device of Embodiment 5, and a heat sink. It is a top view which shows typically an example of the structure of an electronic device of Embodiment 6, and a heat sink. It is a top view which shows typically an example of the structure of the electronic device of Embodiment 6. It is a top view which shows typically an example of the structure of the electronic device of Embodiment 6. It is a perspective view which shows the sample of simulation typically. It is a graph which shows a simulation result. It is sectional drawing which shows an example which attached the structure provided with the EBG structure to the heat sink.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In all the drawings, the same components are denoted by the same reference numerals, and description thereof will be omitted as appropriate.
<Embodiment 1>
<< Embodiment 1-1 >>

FIG. 1 is a cross-sectional view schematically showing an example of an electronic apparatus according to this embodiment. As shown in FIG. 1, the electronic device of the present embodiment includes a substrate 10, an electronic component 20, and a heat sink 30. The heat radiating plate 30 is provided with a structure 40. FIG. 2 is a plan view of the electronic device of FIG. 1 as viewed from the top to the bottom in the drawing.

The electronic component 20 is mounted on the substrate 10. In FIG. 1, the electronic component 20 is schematically shown as a quadrangle. The electronic component 20 is a circuit in which elements are integrated, and corresponds to, for example, an LSI. Note that the position and number on the substrate 10 on which the electronic component 20 is mounted are design matters, and are not limited to those illustrated.

The heat sink 30 is provided on the electronic component 20 via the spacer 50. The heat sink 30 is made of a material having a good thermal conductivity, for example, a metal. The shape is not particularly limited in the present embodiment. For example, as shown in FIGS. 1 and 2, the planar shape may be a rectangle with a certain thickness, or the planar shape may be a square, other polygons, a circle, or other shapes. The shape may have a certain thickness. The spacer 50 is made of a material having good thermal conductivity, for example, a material containing a magnetic body. In addition, you may provide the heat sink 30 directly on the electronic component 20 instead of interposing the spacer 50 so that it may show in figure.

At least one type of structure 40 is provided on the first surface (the lower surface in the drawing) of the heat radiating plate 30 facing the electronic component 20. The structure 40 is preferably provided in the vicinity of a region in contact with the spacer 50 (or the electronic component 20) on the first surface (the lower surface in the drawing) of the heat radiating plate 30. Here, FIG. 3 shows a plan view of the structure excluding the substrate 10, the electronic component 20, and the spacer 50 of the electronic device shown in FIG. As shown in the figure, the structure 40 may be provided on substantially the entire surface of the first surface 32 of the heat dissipation plate 30 excluding the region 31 in contact with the spacer 50 (or the electronic component 20). The structure 40 has an effect of suppressing noise propagation on the first surface 32 of the heat sink 30 as described below. If such a structure 40 is provided around the region 31 in contact with the spacer 50 (or the electronic component 20) on the first surface 32 of the heat radiating plate 30, the heat is generated in the electronic component 20 and radiated through the region 31. It is possible to suppress the noise transmitted to the plate 30 from spreading from there to the periphery. As a result, it is possible to suppress noise from being radiated from the heat sink 30. The structure 40 may be provided on a second surface (the upper surface in FIG. 1) that is the surface opposite to the first surface 32 of the heat sink 30. Furthermore, it may be provided on the side surface of the heat sink 30.

Here, the structure 40 will be described in detail. The structure 40 of the present embodiment includes a dielectric layer and a first conductor, and the second surface of the dielectric layer is a first surface of the heat sink 30 (the lower surface in FIG. 1). It is provided to touch. The structure 40 configured as described above constitutes an EBG structure having at least one kind of EBG structure together with the first surface (the lower surface in FIG. 1) of the heat radiating plate 30. And by this EBG structure, the propagation of noise on the first surface (the lower surface in FIG. 1) of the heat sink 30 is suppressed. Hereinafter, a specific example of the structure 40 of the present embodiment will be described in more detail. In addition, the structure 40 of this embodiment is not limited to the specific example demonstrated below.

FIG. 4A schematically shows an example of the structure 40 of the present embodiment. FIG. 4A is a cross-sectional view showing a state where the structure 40 is attached to the heat sink 30.

The structure 40 includes a dielectric layer 45 and a first conductor formed on the first surface 46 of the dielectric layer 45 and having a repetitive structure, for example, a periodic structure, at least in a partial region. . The first conductor having a repetitive structure is composed of, for example, a plurality of island-shaped conductors 41 separated from each other. The first conductor is provided so as to face the second surface 47 that is the surface opposite to the first surface 46 of the dielectric layer 45. The structure 40 is provided on the second surface 47 of the dielectric layer 45 so as to be in contact with the first surface 32 of the heat sink 30.

The structure 40 may be configured as a sheet, for example, and at least a part of the dielectric layer 45 may be configured with an adhesive layer 45 B that adheres to the first surface 32 of the heat sink 30. This adhesive layer 45 B constitutes the second surface 47 of the dielectric layer 45. In addition, a connecting member 43 that penetrates through the second surface 47 of the dielectric layer 45 and is electrically connected to the first surface 32 of the heat sink 30 is provided inside the dielectric layer 45. Hereinafter, each configuration will be described in more detail.

The dielectric layer 45 includes an adhesive layer 45B made of a dielectric and a layer 45A made of a dielectric. The layer 45A may be a flexible substrate, for example. More specifically, for example, a glass epoxy substrate or a fluororesin substrate may be used. The layer 45A may be a single layer or a multilayer. Next, the adhesive layer 45B can be made of, for example, an adhesive. The raw material for the adhesive is not particularly limited, and for example, natural rubber, acrylic resin, silicone, or the like can be used. The thicknesses of the layer 45A and the adhesive layer 45B are design matters.

The first conductor having a repetitive structure, for example, a periodic structure in at least a partial region has a plurality of island-like conductors 41 separated from each other as a repetitive structure. The plurality of island-like conductors 41 separated from each other are desirably provided periodically.

Note that “repetition” in the island-shaped conductor 41 includes a case where the island-shaped conductor 41 is partially missing. Further, “periodic” includes a case where some of the island-shaped conductors 41 themselves are misaligned. That is, even when the periodicity in the strict sense is broken, when the island-shaped conductor 41 is repeatedly arranged, the characteristics as the metamaterial of the EBG structure in which the island-shaped conductor 41 is a part of the constituent elements. Since it can be obtained, a certain degree of defect is allowed for “periodicity”. “At least in a partial region” means that the entire surface of the structure 40 may have a repeating structure, or a part thereof may have a repeating structure. That is, the plurality of island-shaped conductors 41 separated from each other may be provided on the entire planar surface of the structure 40 or may be provided on a part thereof.

The raw material of the island-shaped conductor 41 is not particularly limited, and for example, copper or the like can be selected. The shape of the island is not particularly limited, and any shape such as a triangle, a quadrangle, a pentagon, a polygon having more vertices, and a circle can be selected. Two or more types of island-shaped conductors 41 having different sizes and / or shapes can be repeatedly arranged. In such a case, it is desirable that two or more types of island-shaped conductors 41 are periodically arranged. The size of the island-shaped conductor 41, the mutual interval, and the like are design matters determined according to the frequency of noise that suppresses propagation.

The connecting member 43 can be made of a metal such as copper, aluminum, stainless steel or the like. The connection member 43 may not only conduct with the first surface 32 of the heat radiating plate 30 but may conduct with some or all of the island-like conductors 41. In FIG. 4A, all the connection members 43 are electrically connected to the island-shaped conductor 41. When the connection member 43 is provided so as to be electrically connected to some of the island-like conductors 41, the connection member 43 may be provided periodically or may not be provided periodically. However, when the connection member 43 is provided periodically, the EBG structure constituted by the structure 40 and the first surface 32 having the conductivity of the heat sink 30 causes Bragg reflection, and the band gap band is widened. It is desirable to be periodic. Here, “periodic” includes a case where the arrangement of some of the connecting members 43 themselves is deviated.

Next, an example of a method for manufacturing the electronic device according to the present embodiment will be described with reference to FIG. 4B. FIG. 4B is a cross-sectional view showing an example of the manufacturing process of the structure 40 of the present embodiment.

First, as shown in (1), a copper foil 41 is formed on a first surface (upper surface in the figure) of a substrate (layer 45A) such as a glass epoxy substrate or a fluororesin substrate. Next, as shown in (2), a pattern (a plurality of island-like conductors 41 separated from each other) is formed by selectively etching a part of the copper foil 41 by photolithography and etching. Thereafter, as shown in (3), a hole penetrating the island-shaped conductor 41 and the layer 45A is formed by a drill.

Next, as shown in (4), a through pin (connecting member 43) made of a metal such as copper, aluminum, or stainless steel is inserted into the hole formed in (3).

Thereafter, as shown in (5), an adhesive layer 45B is formed on the second surface (the lower surface in the drawing) of the layer 45A. The adhesive layer 45B is formed so that the connection member 43 penetrates the adhesive layer 45B. The specific means for forming in this way is not particularly limited, but may be the following means. For example, the length of the connecting member 43 inserted in (4) is configured such that one end protrudes from the second surface (lower surface in the drawing) of the layer 45A in the inserted state. Then, when the adhesive layer 45B is composed of a sheet-like adhesive and the sheet-like adhesive (adhesive layer 45B) is formed on the second surface of the layer 45A, the sheet-like adhesive (adhesive layer 45B) is strongly pushed in. Then, one end of the connection member 43 is protruded from the surface of the sheet-like adhesive (adhesive layer 45B). Alternatively, the adhesive layer 45B is made of a fluid adhesive, and the adhesive is applied to the second surface (the lower surface in the drawing) of the layer 45A, and then connected using a squeegee. The connecting member 43 may be protruded from the surface of the adhesive layer 45B by removing the adhesive applied to the surface of the member 43. Next, if necessary, a non-conductive surface layer (not shown) is provided to cover the first surfaces of the plurality of island-like conductors 41 and the layer 45A separated from each other.

Thereafter, as shown in FIG. 4A, the structure 40 is pasted at a desired position on the first surface 32 of the heat sink 30 so that the adhesive layer 45 B is in contact with the first surface 32 of the heat sink 30. At this time, the connecting member 43 is pasted so as to be in contact with the first surface 32 of the heat sink 30.

Next, the effect of this embodiment is demonstrated.
In the present embodiment, the structure 40 described above (see FIG. 4A) and the first surface 32 of the heat sink 30 constitute an EBG structure. FIGS. 5 and 6 schematically show an example of the EBG structure constituted by the structure 40 of the present embodiment and the first surface 32 of the heat sink 30. FIG. 5 is a perspective view schematically showing the configuration of the EBG structure, and FIG. 6 is a cross-sectional view of the EBG structure of FIG. In the EBG structure shown in FIGS. 5 and 6, a kind of EBG structure is periodically arranged. Note that the EBG structure shown in FIG. 6 is upside down of the EBG structure constituted by the structure 40 shown in FIG. 4A and the first surface 32 of the heat sink 30.

The EBG structure shown in FIGS. 5 and 6 includes a sheet-like conductor 2, a plurality of island-like conductors 1 separated from each other, and a plurality of connecting members 3. The sheet-like conductor 2 corresponds to the first surface 32 of the heat sink 30 (see FIG. 4A), the island-like conductor 1 corresponds to the island-like conductor 41 of the structure 40, and the connection member 3 is the connection member of the structure 40. 43.

The plurality of island-like conductors 1 are regions that overlap the sheet-like conductor 2 in plan view, and are disposed at positions away from the sheet-like conductor 2 with a dielectric layer (not shown) interposed therebetween. The plurality of island-shaped conductors 1 are periodically arranged. The connecting member 3 connects each of the plurality of island-like conductors 1 to the sheet-like conductor 2. This EBG structure includes one island-shaped conductor 1, a connecting member 3 provided corresponding to the island-shaped conductor 1, and a region facing the island-shaped conductor 1 in the sheet-shaped conductor 2. A unit cell A is configured. And this unit cell A is repeatedly arrange | positioned, for example periodically, This structure functions as a metamaterial, for example, EBG (Electromagnetic Band Gap). This EBG structure has an EBG structure having a so-called mushroom structure, and the distance between the plurality of island-like conductors 1 and the sheet-like conductor 2, the thickness of the connecting member 3, the mutual distance between the plurality of island-like conductors 1 and the like. By adjusting the frequency band, the frequency band that becomes the band gap can be adjusted.

Here, “repetition” of the unit cell A includes a case where a part of the configuration is missing in any unit cell A. When the unit cell A has a two-dimensional array, “repetition” includes a case where the unit cell A is partially missing. In addition, in “periodicity”, a part of the constituent elements (the island-like conductor 1 and the connecting member 3) are shifted in some unit cells A, or the arrangement of some unit cells A itself is shifted. Cases are also included. In other words, even when the periodicity in the strict sense collapses, if the unit cell A is repeatedly arranged, the characteristics as a metamaterial can be obtained, so that “periodicity” has some defect. Permissible. The cause of these defects is that when wiring or vias are passed between unit cells A, when adding a metamaterial structure to an existing wiring layout, unit cells A cannot be arranged due to existing vias or patterns. Manufacturing errors, and existing vias or patterns may be used as part of the unit cell. The above-mentioned premise is the same in all the following embodiments.

FIG. 7 is an equivalent circuit diagram of the unit cell A shown in FIG. As shown in FIG. 7, the unit cell A includes a capacitance C generated between adjacent island-shaped conductors 1 and an inductance L created by the connecting member 3.

According to this EBG structure, noise propagation on the surface of the sheet-like conductor 2 can be suppressed. That is, the propagation of noise on the surface of the first surface 32 of the heat sink 30 (see FIG. 4A) can be suppressed. Further, since the adjacent island-shaped conductors 1 (41) constitute the capacitance C, the propagation of noise in the vicinity of the EBG structure can be suppressed. That is, the propagation of noise in the vicinity of the structure 40 in the space between the substrate 10 and the heat sink 30 shown in FIG. 1 can be suppressed. As a result, noise transmitted to the heat radiating plate 30 is radiated to the periphery, and it is possible to avoid adverse effects such as hindering normal operation of peripheral electronic devices.

In addition, the structure 40 of the present embodiment has a relatively simple configuration compared to the structure 40 for configuring an EBG structure other than the EBG structure shown in FIGS. For this reason, the manufacturing process can be reduced and the manufacturing cost is excellent.

Here, the above-described effects cannot be realized by simply attaching a sheet having an EBG structure as shown in FIGS. 5 and 6 to the first surface 32 of the heat sink 30. Hereinafter, this reason will be described with reference to FIG.

FIG. 41 is a cross-sectional view showing a state where the sheet 400 provided with the EBG structure is attached to the surface 302 of the heat sink 300. A sheet 400 shown in FIG. 41 includes the same EBG structure as the EBG structure shown in FIGS. That is, this EBG structure has a sheet-like conductor 402, a plurality of island-like conductors 401 separated from each other, and a plurality of connection members 403.

As shown in FIG. 41, the sheet 400 is usually provided with a layer 404 of an insulating adhesive in order to ensure adhesion with the heat sink 300. As shown in FIG. 41, this adhesive layer 404 is located between the sheet-like conductor 402 and the surface 302 of the heat sink 300 in a state where the sheet 400 having the EBG structure is attached to the heat sink 300. The sheet-like conductor 402 constituting the EBG structure and the surface 302 of the heat sink 300 are electrically separated from each other. Thus, in the state where the surface 302 of the heat sink 300 and the EBG structure are electrically separated, the propagation of noise on the surface 302 of the heat sink 300 cannot be suppressed. In such a case, the noise transmitted to the heat radiating plate 300 propagates through the surface 302 and spreads to the surroundings, and is radiated into the air.

The electronic device of this embodiment solves the above-described problems. Specifically, as shown in FIG. 4A, in the electronic device of the present embodiment, the first surface 32 of the heat sink 30 constitutes a part of the EBG structure. In such a case, as described above, the first surface 32 of the heat radiating plate 30 and the EBG structure are not electrically separated. That is, according to the electronic apparatus of the present embodiment, the propagation of noise on the surface of the first surface 32 of the heat sink 30 can be suppressed by the EBG structure configured using the first surface 32 of the heat sink 30. . Further, noise propagation near the EBG structure, that is, near the first surface 32 of the heat sink 30 can be suppressed. Note that all the electronic devices according to the first embodiment described below solve the above-described problems by the same means as described above.
<< Embodiment 1-2 >>

The electronic device of the present embodiment is based on the electronic device of Embodiment 1-1, and the structure 40 is partially different. Other configurations are the same as those of the electronic device according to Embodiment 1-1, and thus description thereof is omitted here.

FIG. 8A is a cross-sectional view schematically showing an example of the electronic apparatus of the present embodiment. This structure 40 is based on the structure 40 (see FIG. 4A) of Embodiment 1-1, and the shape of the connection member 43 (43A, 43B, 43C) is different. Other configurations are the same as those of the structure 40 according to Embodiment 1-1, and thus the description thereof is omitted here.

The connection member 43 of this embodiment includes a conductive first connection member 43A, a conductive second connection member 43B, and a conductive third connection member 43C. One end of the first connection member 43A penetrates the second surface 47 of the dielectric layer 45 and is exposed from the second surface 47, and is electrically connected to the second connection member 43B via the other end side. The other end of the first connection member 43 A may penetrate the first surface 46 of the dielectric layer 45. The first connecting member 43A passes through a hole provided in the island-shaped conductor 41 in a state of non-contact with the island-shaped conductor 41. The second connecting member 43 B is provided so as to be electrically connected to the first connecting portion 43 A and to face the island-shaped conductor 41. The planar shape of the second connection member 43B may be a straight line, a curved line, a spiral shape, or other shapes. The third connection member 43C is electrically connected to the second connection member 43B via one end side, and is electrically connected to the island-like conductor 41 via the other end side extending in the direction of the second surface 47 of the dielectric layer 45. . The other end may penetrate the first surface 46 of the dielectric layer 45. Here, an example at the time of making the 2nd connection member 43B into a spiral shape is shown to FIG. 8C and 8D. 8C is a cross-sectional view taken along the line II ′ of FIG. 8D, and FIG. 8D is a plan view of FIG. 8C viewed from the bottom to the top in the drawing. 8C and 8D, in order to make the configuration clearer, the hatching attached to each component is set to a mode different from the other drawings. Moreover, in FIG. 8C, only the structure 40 is shown.

The EBG structure constituted by the structure 40 shown in FIGS. 8A and 8C and the first surface 32 of the heat sink 30 shown in FIG. 8A has a short microstrip line formed including the connection member 43B. It has a short stub type EBG structure that functions as a stub. Specifically, the connection member 43A forms an inductance. Further, the connecting member 43B is electrically coupled to the opposing island-shaped conductor 41 to form a microstrip line having the island-shaped conductor 41 as a return path. One end of the microstrip line is a short end by the third connection member 43C, and is configured to function as a short stub.

Next, an example of a method for manufacturing the electronic device according to the present embodiment will be described with reference to FIG. 8B. FIG. 8B is a cross-sectional view showing an example of the manufacturing process of the structure 40 of the present embodiment.

First, as shown in (1), a copper foil 43B is formed on the first surface (the upper surface in the figure) of a substrate (layer 45A (1)) such as a glass epoxy substrate or a fluororesin substrate, and the second The copper foil 41 is formed on the surface (the lower surface in the figure). Next, as shown in (2), a pattern (a plurality of island-like conductors 41 separated from each other) is formed by selectively etching a part of the copper foil 41 by photolithography and etching. Further, a pattern (second connection member 43B) is formed by selectively etching a part of the copper foil 43B by photolithography and etching. The island-shaped conductor 41 is formed in a pattern provided with holes for allowing the first connection member 43A to pass therethrough. This hole is provided larger than the diameter of the first connecting member 43A.

Thereafter, a hole penetrating the second connecting member 43B, the layer 45A (1), and the island-like conductor 41 is formed by a drill, and a through pin (first pin) made of a metal such as copper, aluminum, or stainless steel is formed in the hole. The state shown in (3) is obtained by inserting the 3 connecting members 43C).

Next, as shown in (4), a dielectric layer 45A (2) is further formed on the second surface (the lower surface in the drawing) of the layer 45A (1). For example, a new flexible substrate (layer 45A (2)) such as a glass epoxy substrate or a fluororesin substrate is prepared, and the first surface (upper surface in the figure) of this substrate (layer 45A (2)) ) May be attached to the second surface (the lower surface in the drawing) of the layer 45A (1). Thus, in this embodiment, the island-shaped conductor 41 (first conductor) is provided inside the dielectric layer composed of the layers 45A (1) and 45A (2).

Thereafter, as shown in (5), a hole penetrating the second connecting member 43B, the layers 45A (1), 45A (2), and the island-shaped conductor 41 is formed using a drill. This hole is formed by penetrating a drill so as to pass through this hole in a state where the diameter is smaller than the hole provided in the island-shaped conductor 41 in (2) and is not in contact with the island-shaped conductor 41. Is done. Thereafter, as shown in (6), a through pin (first connecting member 43A) made of metal such as copper, aluminum, or stainless steel is inserted into the hole formed in (5).

Thereafter, as shown in (7), the adhesive layer 45B is formed on the second surface (the lower surface in the drawing) of the layer 45A (2). The adhesive layer 45B is formed so that the connection member 43A penetrates the adhesive layer 45B. As specific means for forming in this way, the same means as described in Embodiment 1-1 can be used. Next, if necessary, a non-conductive surface layer (not shown) is provided to cover the first surfaces of the plurality of island-shaped conductors 41 and the layer 45A (1) separated from each other.

Thereafter, as shown in FIG. 8A, the structure 40 is pasted at a desired position on the first surface 32 of the heat sink 30 so that the adhesive layer 45 B contacts the first surface 32 of the heat sink 30. At this time, the first connecting member 43 A of the connecting member 43 is attached so as to be in contact with the first surface 32 of the heat sink 30.

Next, the effect of this embodiment is demonstrated.
The EBG structure constituted by the structure 40 of the present embodiment and the first surface 32 of the heat sink 30 is composed of the structure 40 of the embodiment 1-1 and the first surface 32 of the heat sink 30. Different from the constructed EBG structure.

The EBG structure shown in FIGS. 8A and 8C includes one island-shaped conductor 41, a connection member 43 (43 A, 43 B, 43 C) provided corresponding to the island-shaped conductor 41, and the first heat sink 30. A unit cell A is configured including the region facing the island-shaped conductor 41 in the surface 32.

FIG. 9 is an equivalent circuit diagram of the unit cell A shown in FIGS. 8A and 8C. As shown in FIG. 9, the unit cell A includes an impedance unit 23 and an admittance unit 24. The impedance unit 23 includes a capacitance C generated between adjacent island-shaped conductors 41 and an inductance L created by the island-shaped conductors 41. The admittance part 24 includes a capacitance C formed by the first surface 32 of the heat sink 30 and the island-shaped conductor 41, an inductance L formed by the first connecting member 43A, and a second connecting member 43B (transmission line) and the first And a short stub including three connecting members 43C.

Generally, it is known that the EBG structure generates an electromagnetic band gap in a frequency region in which the impedance portion 23 is capacitive and the admittance portion 24 is inductive. In the short stub type EBG structure of FIGS. 8A, 8C, and 9, the frequency band in which the admittance portion 24 becomes inductive can be lowered by increasing the stub length of the short stub. For this reason, it is possible to lower the frequency of the band gap band. The short stub type EBG structure requires a stub length to reduce the frequency of the bandgap band, but does not necessarily require an area, so that the unit cell can be miniaturized.

According to this EBG structure, noise propagation on the surface of the first surface 32 of the heat sink 30 (see FIG. 8A) can be suppressed. Moreover, the propagation of noise in the vicinity of the EBG structure can be suppressed because adjacent island-shaped conductors 41 constitute a capacitance. That is, the propagation of noise in the vicinity of the structure 40 in the space between the substrate 10 and the heat sink 30 shown in FIG. 1 can be suppressed. As a result, noise transmitted to the heat radiating plate 30 is radiated to the periphery, and it is possible to avoid adverse effects such as hindering normal operation of peripheral electronic devices.

Further, the EBG structure (see FIG. 8A) constituted by the structure 40 of the present embodiment has various inductances as shown in FIG. 9 due to the structure of the characteristic connection member 43 (43A, 43B, 43C). L and capacitance C can be formed. As a result, the inductance L and the capacitance C required for suppressing the propagation of noise in a desired frequency band are made larger than necessary for the size of the island-shaped conductor 41 and the connecting member 43 (43A, 43B, 43C). It becomes possible to obtain without. That is, the size of the unit cell A can be made relatively small. In such a case, the number of unit cells A per unit area in the plane of the structure 40 can be increased, and noise propagation can be more effectively suppressed.
<< Embodiment 1-3 >>

FIG. 10A is a cross-sectional view schematically showing an example of the electronic apparatus of the present embodiment. This structure 40 is based on the structure 40 (see FIG. 4A) of Embodiment 1-1, and the shape of the connection member 43 (43A, 43B) is different. Other configurations are the same as those of the structure 40 according to Embodiment 1-1, and thus the description thereof is omitted here.

The connection member 43 of the present embodiment includes a conductive first connection member 43A and a conductive second connection member 43B. One end of the first connection member 43A penetrates the second surface 47 of the dielectric layer 45 and is exposed from the second surface 47, and is electrically connected to the second connection member 43B via the other end side. The other end of the first connection member 43 A may penetrate the first surface 46 of the dielectric layer 45. The first connecting member 43A passes through a hole provided in the island-shaped conductor 41 in a state of non-contact with the island-shaped conductor 41. The second connecting member 43 B is provided so as to be electrically connected to the first connecting portion 43 A and to face the island-shaped conductor 41. The planar shape of the second connection member 43B may be a straight line, a curved line, a spiral shape, or other shapes. The other end of the second connection member 43B is an open end. Here, an example of the case where the second connecting member 43B is formed in a spiral shape is shown in FIGS. 10C and 10D. 10C is a cross-sectional view of the roll of FIG. 10D, and FIG. 10D is a plan view of FIG. 10C viewed from the bottom to the top in the drawing. In FIGS. 10C and 10D, in order to make the configuration clearer, the hatching applied to each component is set to a mode different from the other drawings. Moreover, in FIG. 10C, only the structure 40 is shown.

The EBG structure constituted by the structure 40 shown in FIGS. 10A and 10C and the first surface 32 of the heat sink 30 shown in FIG. 10A has an open microstrip line including the connecting member 43B. It has an open stub type EBG structure that functions as a stub. Specifically, the connection member 43A forms an inductance. Further, the connecting member 43B is electrically coupled to the opposing island-shaped conductor 41 to form a microstrip line having the island-shaped conductor 41 as a return path. One end of the microstrip line is an open end, and is configured to function as an open stub.

Next, an example of a method for manufacturing the electronic device according to the present embodiment will be described with reference to FIG. 10B. FIG. 10B is a cross-sectional view showing an example of the manufacturing process of the structure 40 of the present embodiment.

Next, as shown in (3), a dielectric layer 45A (2) is further formed on the second surface (the lower surface in the drawing) of the layer 45A (1). For example, a new flexible substrate (layer 45A (2)) such as a glass epoxy substrate or a fluororesin substrate is prepared, and the first surface (upper surface in the figure) of this substrate (layer 45A (2)) ) May be attached to the second surface (the lower surface in the drawing) of the layer 45A (1). Thus, in this embodiment, the island-shaped conductor 41 (first conductor) is provided inside the dielectric layer composed of the layers 45A (1) and 45A (2).

Then, as shown in (4), a hole penetrating the second connecting member 43B, the layers 45A (1) and 45A (2), and the island conductor 41 is formed using a drill. This hole is formed by penetrating a drill so as to pass through this hole in a state where the diameter is smaller than the hole provided in the island-shaped conductor 41 in (2) and is not in contact with the island-shaped conductor 41. Is done. Thereafter, as shown in (5), a through pin (first connecting member 43A) made of a metal such as copper, aluminum, or stainless steel is inserted into the hole formed in (4).

Thereafter, as shown in (6), an adhesive layer 45B is formed on the second surface (the lower surface in the drawing) of the layer 45A (2). The adhesive layer 45B is formed so that the connection member 43A penetrates the adhesive layer 45B. As specific means for forming in this way, the same means as described in Embodiment 1-1 can be used. Next, if necessary, a non-conductive surface layer (not shown) is provided to cover the first surfaces of the plurality of island-shaped conductors 41 and the layer 45A (1) separated from each other.

Thereafter, as shown in FIG. 10A, the structure 40 is pasted at a desired position on the first surface 32 of the heat sink 30 so that the adhesive layer 45B is in contact with the first surface 32 of the heat sink 30. At this time, the first connecting member 43 A of the connecting member 43 is attached so as to be in contact with the first surface 32 of the heat sink 30.

Next, the effect of this embodiment is demonstrated.
The EBG structure constituted by the structure 40 of the present embodiment and the first surface 32 of the heat sink 30 includes the structure 40 of the embodiments 1-1 and 1-2 and the first of the heat sink 30. Different from the EBG structure constituted by the surface 32.

The EBG structure shown in FIGS. 10A and 10C includes one island-shaped conductor 41, a connection member 43 (43 A, 43 B) provided corresponding to the island-shaped conductor 41, and the first surface 32 of the heat sink 30. The unit cell A is configured to include a region facing the island-shaped conductor 41 in the.

FIG. 11 is an equivalent circuit diagram of the unit cell A shown in FIGS. 10A and 10C. As shown in FIG. 11, the unit cell A includes an impedance unit 23 and an admittance unit 24. The impedance unit 23 includes a capacitance C generated between adjacent island-shaped conductors 41 and an inductance L created by the island-shaped conductors 41. The admittance part 24 includes a capacitance C formed by the first surface 32 of the heat sink 30 and the island-shaped conductor 41, an inductance L formed by the first connection member 43A, and a second connection member 43B (transmission line). Open stub, consisting of

Generally, it is known that the EBG structure generates an electromagnetic band gap in a frequency region in which the impedance portion 23 is capacitive and the admittance portion 24 is inductive. In the open stub type EBG structure of FIGS. 10A, 10C, and 11, the frequency band in which the admittance portion 24 becomes inductive can be lowered by increasing the stub length of the open stub. For this reason, it is possible to lower the frequency of the band gap band. The open stub type EBG structure requires a stub length to reduce the frequency of the bandgap band, but does not necessarily require an area. Therefore, the unit cell can be miniaturized.

According to the EBG structure, noise propagation on the surface of the first surface 32 of the heat sink 30 (see FIG. 10A) can be suppressed. Moreover, the propagation of noise in the vicinity of the EBG structure can be suppressed because adjacent island-shaped conductors 41 constitute a capacitance. That is, the propagation of noise in the vicinity of the structure 40 in the space between the substrate 10 and the heat sink 30 shown in FIG. 1 can be suppressed. As a result, noise transmitted to the heat radiating plate 30 is radiated to the periphery, and it is possible to avoid adverse effects such as hindering normal operation of peripheral electronic devices.

Further, the EBG structure (see FIG. 10A) configured by the structure 40 of the present embodiment has various inductances L and L as shown in FIG. 11 due to the configuration of the characteristic connection member 43 (43A, 43B). Capacitance C can be formed. As a result, the inductance L and the capacitance C required for suppressing the propagation of noise in a desired frequency band can be achieved without increasing the size of the island-shaped conductor 41 and the connecting member 43 (43A, 43B) more than necessary. Can be obtained. That is, the size of the unit cell A can be made relatively small. In such a case, the number of unit cells A per unit area in the plane of the structure 40 can be increased, and noise propagation can be more effectively suppressed.
<< Embodiment 1-4 >>

FIG. 12A is a cross-sectional view schematically showing an example of the electronic apparatus of the present embodiment. This structure 40 is based on the structure 40 (see FIG. 4A) of Embodiment 1-1, and the shape of the connection member 43 (43A, 43B) is different. Other configurations are the same as those of the structure 40 according to Embodiment 1-1, and thus the description thereof is omitted here.

The connection member 43 of the present embodiment includes a conductive first connection member 43A and a conductive second connection member 43B. One end of the first connection member 43A penetrates the second surface 47 of the dielectric layer 45 and is exposed from the second surface 47, and is electrically connected to the second connection member 43B via the other end side. The first connecting member 43A does not contact the island-shaped conductor 41. The second connecting member 43 B is provided so as to be electrically connected to the first connecting portion 43 A and to face the island-shaped conductor 41. The planar shape of the second connection member 43B may be a straight line, a curved line, a spiral shape, or other shapes. The other end of the second connection member 43B is an open end.

The EBG structure constituted by the structure 40 shown in FIG. 12A and the first surface 32 of the heat sink 30 is an open stub type in which a microstrip line formed including a connection member 43B functions as an open stub. It has an EBG structure of Specifically, the connection member 43A forms an inductance. Further, the connecting member 43B is electrically coupled to the opposing island-shaped conductor 41 to form a microstrip line having the island-shaped conductor 41 as a return path. One end of the microstrip line is an open end, and is configured to function as an open stub.

Next, an example of a method for manufacturing the electronic device according to the present embodiment will be described with reference to FIG. 12B. FIG. 12B is a cross-sectional view illustrating an example of the manufacturing process of the structure 40 of the present embodiment.

First, as shown in (1), a copper foil 43B is formed on a first surface (upper surface in the drawing) of a substrate (layer 45A (1)) such as a glass epoxy substrate or a fluororesin substrate. Further, the copper foil 41 is formed on the first surface (upper surface in the drawing) of another flexible substrate (layer 45A (2)) such as a glass epoxy substrate or a fluororesin substrate. Next, as shown in (2), a pattern (second connecting member 43B) is formed by selectively etching part of the copper foil 43B by photolithography and etching. Further, a pattern (a plurality of island-shaped conductors 41 separated from each other) is formed by selectively etching a part of the copper foil 41 by photolithography and etching.

Thereafter, as shown in (3), a hole penetrating the second connecting member 43B and the layer 45A (1) is formed by a drill. Next, as shown in (4), a penetration pin (connecting member 43A) made of a metal such as copper, aluminum, or stainless steel is inserted into the hole formed in (3).

Thereafter, as shown in (5), the second surface (lower surface in the drawing) of the layer 45A (2) is formed on the first surface (upper surface in the drawing) of the layer 45A (1). Paste to touch. Next, as shown in (6), the adhesive layer 45B is formed on the second surface (the lower surface in the drawing) of the layer 45A (1). The adhesive layer 45B is formed so that the connection member 43A penetrates the adhesive layer 45B. As specific means for forming in this way, the same means as described in Embodiment 1-1 can be used. Next, if necessary, a non-conductive surface layer (not shown) is provided to cover the plurality of island-like conductors 41 and the first surface of the layer 45A (2) separated from each other.

Thereafter, as shown in FIG. 12A, the structure 40 is pasted at a desired position on the first surface 32 of the heat sink 30 so that the adhesive layer 45 B contacts the first surface 32 of the heat sink 30. At this time, the first connecting member 43 A of the connecting member 43 is attached so as to be in contact with the first surface 32 of the heat sink 30.

Next, the effect of this embodiment is demonstrated.
The EBG structure constituted by the structure 40 of the present embodiment and the first surface 32 of the heat sink 30 includes the structure 40 of the embodiments 1-1 to 1-3 and the first of the heat sink 30. Different from the EBG structure constituted by the surface 32.

The EBG structure shown in FIG. 12A includes one island-shaped conductor 41, a connection member 43 (43 A, 43 B) provided corresponding to the island-shaped conductor 41, and the first surface 32 of the heat sink 30. The unit cell A is configured to include a region facing the island-shaped conductor 41.

FIG. 13 is an equivalent circuit diagram of the unit cell A shown in FIG. 12A. This equivalent circuit diagram is the same as the equivalent circuit diagram of FIG. 11 described in the embodiment 1-3. Therefore, the description here is omitted.

According to the EBG structure, noise propagation on the surface of the first surface 32 of the heat sink 30 (see FIG. 12A) can be suppressed. Moreover, the propagation of noise in the vicinity of the EBG structure can be suppressed because adjacent island-shaped conductors 41 constitute a capacitance. That is, the propagation of noise in the vicinity of the structure 40 in the space between the substrate 10 and the heat sink 30 shown in FIG. 1 can be suppressed. As a result, noise transmitted to the heat radiating plate 30 is radiated to the periphery, and it is possible to avoid adverse effects such as hindering normal operation of peripheral electronic devices.

Further, the EBG structure (see FIG. 12A) configured by the structure 40 of the present embodiment has various inductances L and L as shown in FIG. 13 due to the configuration of the characteristic connection member 43 (43A, 43B). Capacitance C can be formed. As a result, the inductance L and the capacitance C required for suppressing the propagation of noise in a desired frequency band can be achieved without increasing the size of the island-shaped conductor 41 and the connecting member 43 (43A, 43B) more than necessary. Can be obtained. That is, the size of the unit cell A can be made relatively small. In such a case, the number of unit cells A per unit area in the plane of the structure 40 can be increased, and noise propagation can be more effectively suppressed.
<< Embodiment 1-5 >>

FIG. 14 is a cross-sectional view schematically showing an example of the electronic apparatus of the present embodiment. The structure 40 of the present embodiment is formed on the dielectric layer 45 and the first surface 46 of the dielectric layer 45, and is a first conductor having a repetitive structure, for example, a periodic structure, at least in a partial region. And comprising. The first conductor having a repetitive structure is composed of, for example, a plurality of island-shaped conductors 41 separated from each other. The first conductor is provided so as to face the second surface 47 that is the surface opposite to the first surface 46 of the dielectric layer 45. The structural body 40 is attached to the heat sink 30 such that the second surface 47 of the dielectric layer 45 is in contact with the first surface 32 of the heat sink 30.

A part of the dielectric layer 45 is composed of an adhesive layer 45B that adheres to the first surface 32 of the heat sink 30, and the adhesive layer 45B constitutes a second surface 47 of the dielectric layer 45.

And some or all of the plurality of island-like conductors 41 are provided with openings 41B as shown in the enlarged perspective view of FIG. When the openings 41B are provided in a part of the plurality of island-like conductors 41, it is desirable that the openings 41B are provided periodically. In the opening 41B, a wiring 41A having one end connected to the island-shaped conductor 41 is provided. The size of the opening 41B, the length, the thickness, and the like of the wiring 41A are design matters determined according to the frequency of noise that suppresses propagation.

Next, an example of an electronic device manufacturing method according to this embodiment will be described. As shown in FIG. 4B (1), the structure 40 of the present embodiment is formed by forming a copper foil 41 on the first surface of a substrate (layer 45A) such as a glass epoxy substrate or a fluororesin substrate, and then (2 ), A pattern (a plurality of island-like conductors 41 separated from each other) is formed by selectively etching a part of the copper foil 41 by photolithography and etching. By this photolithography and etching, the island-shaped conductor 41 is formed in the pattern shown in FIG. Subsequent steps can be realized according to Embodiment 1-1. Therefore, the description here is omitted.

Next, the effect of this embodiment is demonstrated.
The EBG structure constituted by the structure 40 of the present embodiment and the first surface 32 of the heat sink 30 is the same as the structure 40 of any of the embodiments 1-1 to 1-4 and the heat sink 30. Different from the EBG structure constituted by the first surface 32.

FIGS. 16 and 17 schematically show an example of the EBG structure constituted by the structure 40 of the present embodiment and the first surface 32 of the heat sink 30. 16 is a perspective view schematically showing the configuration of the EBG structure, and FIG. 17 is a side view of the EBG structure of FIG. This EBG structure is shown upside down with respect to the EBG structure constituted by the structure 40 shown in FIG. 14 and the first surface 32 of the heat sink 30.

The EBG structure shown in FIGS. 16 and 17 includes a sheet-like conductor 2, a plurality of island-like conductors 1 separated from each other, an opening 1B provided in the island-like conductor 1, and a wiring 1A provided in the opening 1B. And composed of The plurality of island-like conductors 1 are regions that overlap the sheet-like conductor 2 in plan view, and are disposed at positions away from the sheet-like conductor 2 with a dielectric layer (not shown) interposed therebetween. The plurality of island-shaped conductors 1 are periodically arranged. The plurality of island-shaped conductors 1 are provided with openings 1 B, and wiring 1 A having one end connected to the island-shaped conductor 1 is provided in the openings 1 B. The wiring 1A functions as an open stub, and the portion of the sheet-like conductor 2 facing the wiring 1A and the wiring 1A form a transmission line, for example, a microstrip line.

This EBG structure includes a unit cell including one island-shaped conductor 1, wiring 1 A provided in the opening 1 B of the island-shaped conductor 1, and a region of the sheet-shaped conductor 2 facing these. A is configured. By periodically disposing the unit cells A, the structure functions as a metamaterial, for example, an EBG (Electromagnetic Band Gap). 16 and 17, the unit cell A has a two-dimensional array in plan view.

The plurality of unit cells A have the same EBG structure and are arranged in the same direction. The island-like conductor 1 and the opening 1B are square and are arranged so that their centers overlap each other. The wiring 1A extends from the approximate center of one side of the opening 1B substantially perpendicularly to this side.

FIG. 18 is an equivalent circuit diagram of the unit cell A shown in FIGS. As shown in FIG. 18, a capacitance C is formed between the sheet-like conductor 2 and the island-like conductor 1. A capacitance C is also formed between the adjacent island conductors 1. An inductance L is formed in the island-shaped conductor 1 having the opening 1B.

Further, as described above, the wiring 1A functions as an open stub, and the portion of the sheet conductor 2 facing the wiring 1A and the wiring 1A form a transmission line 4, for example, a microstrip line. The other end of the transmission line is an open end.

According to this EBG structure, noise propagation on the surface of the sheet-like conductor 2 can be suppressed. That is, the propagation of noise on the surface of the first surface 32 of the heat sink 30 (see FIG. 14) can be suppressed. Moreover, the propagation of noise in the vicinity of the EBG structure can be suppressed because adjacent island-shaped conductors 1 (41) form a capacitance. That is, the propagation of noise in the vicinity of the structure 40 in the space between the substrate 10 and the heat sink 30 shown in FIG. 1 can be suppressed. As a result, noise transmitted to the heat radiating plate 30 is radiated to the periphery, and it is possible to avoid adverse effects such as hindering normal operation of peripheral electronic devices.

Further, unlike the structure 40 of the embodiments 1-1 to 1-4, the structure 40 of the present embodiment does not have the connection member 43, so the connection member 43 and the first surface of the heat sink 30 are the same. It is not necessary to provide a means for ensuring conduction with 32. As a result, quality stability is enhanced.
<< Embodiment 1-6 >>

The electronic device of the present embodiment is based on the electronic device of Embodiment 1-5, and the structure 40 is partially different. Specifically, the configuration in the opening 41B of the island-shaped conductor 41 is different. Other configurations are the same as those of the electronic device of the embodiment 1-5, and thus description thereof is omitted here.

A cross-sectional view schematically showing an example of the electronic apparatus of the present embodiment is the same as that of Embodiment 1-5 (see FIG. 14). Next, FIG. 19 shows an enlarged perspective view of the island-shaped conductor 11 of the structure 40 of the present embodiment. In the structure 40 of the present embodiment, an opening 41B as shown in FIG. 19 is provided in a part or all of the plurality of island-like conductors 41, and the second or part of the openings 41B includes a second The island-shaped conductor 41C and the wiring 41A that connects the island-shaped conductor 41 and the second island-shaped conductor 41C are provided.

The manufacturing method of the electronic device of the present embodiment can be realized according to the manufacturing method of the electronic device described in Embodiment 1-5, and thus the description thereof is omitted here.

Next, the effect of this embodiment is demonstrated.
The EBG structure constituted by the structure 40 of the present embodiment and the first surface 32 of the heat sink 30 includes the structure 40 of any of the embodiments 1-1 to 1-5 and the heat sink 30. Different from the EBG structure constituted by the first surface 32.

FIG. 20 schematically shows an example of the EBG structure constituted by the structure 40 of the present embodiment and the first surface 32 of the heat sink 30. FIG. 20 is a perspective view schematically showing the configuration of the EBG structure. The side view of the EBG structure is the same as the side view (see FIG. 17) of the EBG structure described in Embodiment 1-5. This EBG structure is shown upside down with respect to the EBG structure constituted by the structure 40 shown in FIG. 14 and the first surface 32 of the heat sink 30.

The EBG structure shown in FIG. 20 includes a sheet-like conductor 2, a plurality of island-like conductors 1 separated from each other, an opening 1B provided in the island-like conductor 1, wiring 1A provided in the opening 1B, and the first 2 island-shaped conductors 1C. The plurality of island-like conductors 1 are regions that overlap the sheet-like conductor 2 in plan view, and are disposed at positions away from the sheet-like conductor 2 with a dielectric layer (not shown) interposed therebetween. The plurality of island-shaped conductors 1 are periodically arranged. The plurality of island-shaped conductors 1 are provided with openings 1 B, and wiring 1 A having one end connected to the island-shaped conductor 1 is provided in the openings 1 B. Further, in the opening 1B, a second island-shaped conductor 1C connected to the other end of the wiring 1A is provided.

This EBG structure has one island-like conductor 1, wiring 1 A and second island-like conductor 1 C provided in the opening 1 B of this island-like conductor 1, and these in the sheet-like conductor 2. The unit cell A is configured to include a region to be operated. By periodically disposing the unit cells A, the structure functions as a metamaterial, for example, an EBG (Electromagnetic Band Gap). In the example shown in FIG. 20, the unit cell A has a two-dimensional array in plan view.

The plurality of unit cells A have the same EBG structure and are arranged in the same direction. The island-shaped conductor 1, the opening 1 B, and the second island-shaped conductor 1 C are square and are arranged so that their centers overlap each other. The wiring 1A extends from the approximate center of one side of the opening 1B substantially perpendicularly to this side. Then, the wiring 1A connects the center of the first side of the second island-shaped conductor 1C and the center of the side of the opening 1B facing the first side of the second island-shaped conductor 1C. Yes.

FIG. 21 is an equivalent circuit diagram of the unit cell A shown in FIG. As shown in FIG. 21, a capacitance C is formed between the island-like conductor 1 and the sheet-like conductor 2. A capacitance C is also formed between the adjacent island conductors 1. Further, a capacitance C is also formed between the second island-like conductor 1C and the sheet-like conductor 2. An inductance L is formed in the island-shaped conductor 1 having the opening 1B. The wiring 1A connecting the island-shaped conductor 1 and the second island-shaped conductor 1C has an inductance L.

Further, unlike the structure 40 of the embodiments 1-1 to 1-4, the structure 40 of the present embodiment does not have the connection member 43, so the connection member 43 and the first surface of the heat sink 30 are the same. It is not necessary to provide a means for ensuring conduction with 32. As a result, quality stability is enhanced.
<< Embodiment 1-7 >>

The electronic device of the present embodiment is based on the electronic device of any one of Embodiments 1-1 to 1-6, and the structure 40 is different. Specifically, the structure of the dielectric layer 45 of the structure 40 is different. The other configuration is the same as that of any one of the electronic devices of Embodiments 1-1 to 1-6, and thus the description thereof is omitted here.

FIG. 22 is a cross-sectional view schematically showing an example of the electronic apparatus of the present embodiment. The dielectric layer 45 of the structure 40 of the present embodiment is different from the structure 40 of any of Embodiments 1-1 to 1-6 in that it does not have the adhesive layer 45B. The other configuration is the same as that of any one of the structures 40 of Embodiment 1-1 to Embodiment 1-6, and thus the description thereof is omitted here.

As shown in the example of FIG. 22, for example, the structure 40 of the present embodiment that does not have the adhesive layer 45 B uses the tape 60 provided with adhesive means (adhesive or the like) to form the second dielectric layer 45. It attaches to the heat sink 30 so that the surface 47 may contact the first surface 32 of the heat sink 30. In addition, using a member such as glue or a push pin, the second surface 47 of the dielectric layer 45 may be attached to the heat sink 30 so as to be in contact with the first surface 32 of the heat sink 30.

When the structure 40 according to any of Embodiments 1-1 to 1-4 is used as a basis, for example, when the structure 40 according to Embodiment 1-1 is used as a basis as shown in FIG. It is necessary to attach the structure 40 to the heat sink 30 so that the connection member 43 provided on the structure 40 is electrically connected to the first surface 32 of the heat sink 30.

According to the electronic device of the present embodiment, noise propagation on the surface of the first surface 32 of the heat sink 30 (see FIG. 22) can be suppressed. Moreover, the propagation of noise in the vicinity of the EBG structure can be suppressed because adjacent island-shaped conductors 41 constitute a capacitance. That is, the propagation of noise in the vicinity of the structure 40 in the space between the substrate 10 and the heat sink 30 shown in FIG. 1 can be suppressed. As a result, noise transmitted to the heat radiating plate 30 is radiated to the periphery, and it is possible to avoid adverse effects such as hindering normal operation of peripheral electronic devices.
<Embodiment 2>

The electronic device of the present embodiment is based on the electronic device of the first embodiment, and the structure 40 is different. Since the configuration other than the structure 40 is the same as that of the first embodiment, the description thereof is omitted here. In the following description, the differences between the structures 40 will be mainly described, and description of common points will be omitted.

The structure 40 of the present embodiment is opposed to a dielectric layer and a second surface that is the surface opposite to the first surface of the dielectric layer inside or on the first surface of the dielectric layer. A first conductor having a repetitive structure in at least a partial region, and a second conductor formed on the second surface of the dielectric layer. The second conductor is disposed closer to the first surface of the heat sink than the first conductor, and the second conductor is electrically connected to the first surface of the heat sink.

The structure 40 according to the present embodiment includes an EBG structure having at least one type of EBG structure in which the first conductor and the second conductor are part or all of the components. For example, you may provide the EBG structure as shown in FIG. 16 or FIG. 20 which comprised the EBG structure only with the 1st conductor and the 2nd conductor. Or you may provide the EBG structure as shown, for example in FIG. 6 which added the connection member to the 1st conductor and the 2nd conductor, and comprised EBG structure. And the noise suppression tape of this embodiment is attached so that a 2nd conductor and the 1st surface of a heat sink may be conducted. That is, it attaches so that the 1st surface of a heat sink and the EBG structure with which the structure 40 is provided are electrically connected.

The electronic apparatus according to the present embodiment solves the problem described with reference to FIG. As a result, it is possible to suppress the propagation of noise on the first surface of the heat radiating plate, and to suppress the emission of noise from the heat radiating plate.

Next, a specific example of the structure 40 of the present embodiment will be described in more detail. In addition, the structure 40 of this embodiment is not limited to the specific example demonstrated below.
<< Embodiment 2-1 >>

FIG. 23 is a cross-sectional view schematically showing the electronic apparatus of the present embodiment. The structure 40 of the present embodiment includes a dielectric layer 45 and a second surface which is the surface opposite to the first surface 46 of the dielectric layer 45 on the inside of the dielectric layer 45 or on the first surface 46. It has a first conductor provided so as to face the surface 47 and having a repetitive structure in at least a partial region, and a second conductor 42 formed on the second surface 47 of the dielectric layer 45. The first conductor having a repetitive structure is composed of, for example, a plurality of island-shaped conductors 41 separated from each other. The structure 40 includes the heat sink 30 such that the second conductor 42 is positioned closer to the first face 32 of the heat sink 30 than the first conductor formed on the first face 46 of the dielectric layer 45. Attached to. In this attached state, the second conductor 42 and the first surface 32 of the heat sink 30 are electrically connected. The second conductor 42 is a sheet-like conductor extending on the second surface of the dielectric layer 45 so as to face the plurality of island-like conductors 41 in plan view.

The structure 40 of this embodiment is configured as a sheet, for example, and may include an adhesive layer 44. The adhesive layer 44 is provided on the opposite side of the dielectric layer 45 via the second conductor 42 and adheres to the first surface 32 of the heat sink 30. Moreover, the structure 40 of the present embodiment includes a conductive member. This conducting member is provided in the adhesive layer 44 and conducts the second conductor 42 and the first surface 32 of the heat sink 30. The conductive member of the present embodiment is a plurality of conductive fillers 44 A mixed in the adhesive layer 44.

In the dielectric layer 45, a connection member 43 that conducts at least the second conductor 42 may be provided. The connecting member 43 may be electrically connected to some or all of the island-shaped conductors 41 as shown in FIG. The connection member 43 shown in FIG. 23 is electrically connected to all the island-like conductors 41.

Note that the configuration of the connection member 43 is not limited to that shown in FIG. 23, and for example, it can be configured as shown in FIGS. 8A, 8C, 10A, 10C, and 12A. Since the connection member 43 shown in these drawings has been described in the first embodiment, the description thereof is omitted here.

Further, instead of providing the connection member 43, some or all of the plurality of island-like conductors 41 are provided with an opening 41B as shown in the enlarged perspective view of FIG. A wiring 41 A connected to the island-shaped conductor 41 may be provided. Alternatively, some or all of the plurality of island-shaped conductors 41 are provided with openings 41B, as shown in the enlarged perspective view of FIG. 19, and the second island-like shape is formed in some or all of the openings 41B. The conductor 41C and the wiring 41A that connects the island-shaped conductor 41 and the second island-shaped conductor 41C may be provided.

Here, the electronic device of the present embodiment can be manufactured according to the method of manufacturing the electronic device described in the first embodiment. Therefore, detailed description of the manufacturing method here is omitted.

Next, the effect of this embodiment is demonstrated.
The structure 40 of the present embodiment includes an EBG structure having at least one type of EBG structure in which the first conductor and the second conductor 42 are part or all of the components. And in the state attached to the 1st surface 32 of the heat sink 30, the adhesive layer in which the some conductive filler 44A located between the 2nd conductor 42 and the 1st surface 32 of the heat sink 30 was mixed. Due to 44, the second conductor 42 and the first surface 32 of the heat sink 30 are electrically connected. That is, the first surface 32 of the heat sink 30 and the EBG structure included in the structure 40 are electrically connected.

According to the electronic apparatus of the present embodiment, it is possible to suppress the propagation of noise on the surface of the first surface 32 of the heat sink 30 (see FIG. 23). Moreover, the propagation of noise in the vicinity of the EBG structure can be suppressed because adjacent island-shaped conductors 41 constitute a capacitance. That is, the propagation of noise in the vicinity of the structure 40 in the space between the substrate 10 and the heat sink 30 shown in FIG. 1 can be suppressed. As a result, noise transmitted to the heat radiating plate 30 is radiated to the periphery, and it is possible to avoid adverse effects such as hindering normal operation of peripheral electronic devices.

In the electronic device of the present embodiment, the second conductor 42 and the first surface 32 of the heat sink 30 are electrically connected by the plurality of conductive fillers 44A mixed in the adhesive layer 44 of the structure 40. A relatively stable conduction can be ensured.
<< Embodiment 2-2 >>

FIG. 24 is a cross-sectional view schematically showing the electronic apparatus of the present embodiment. The electronic device of the present embodiment is based on the electronic device of Embodiment 2-1 (see FIG. 23), and the configuration of the conductive member provided in the adhesive layer 44 is different. Other configurations are the same as those of the electronic device of Embodiment 2-1, and thus description thereof is omitted here.

The conductive member provided in the adhesive layer 44 of the present embodiment is a via 44B provided in the adhesive layer 44 as shown in FIG. The via 44 B may be integrated with the connection member 43. The via 44 B can be made of metal such as copper, aluminum, and stainless steel, and penetrates the adhesive layer 44. For this reason, the second conductor 42 and the first surface 32 of the heat sink 30 are electrically connected by the via 44B. That is, the first surface 32 of the heat sink 30 and the EBG structure provided in the structure 40 are electrically connected.

Here, the manufacturing method of the electronic device of the present embodiment is based on the manufacturing method of the electronic device described in the first embodiment, and further, the manufacturing process of the via 44B described below in the manufacturing process of the structure 40. It can be realized by giving.

In the case of the structure 40 of the embodiment 2-2 based on the structure 40 of the embodiments 1-1 to 1-4, for example, the island-shaped conductor 41, the dielectric layer 45, and the second conductor 42 shown in FIG. After forming the structure in which the layers are stacked, a hole penetrating the island-like conductor 41, the dielectric layer 45, and the second conductor 42 is formed by a drill. And the penetration pin comprised with metals, such as copper, aluminum, and stainless steel used as the connection member 43 and the via | veer 44B, is inserted in this hole.

In the case of the structure 40 of the embodiment 2-2 based on the structure 40 of the embodiments 1-5 and 1-6, that is, the structure 40 having no connection member 43, for example, the dielectric layer 45 (see FIG. 24)), the vias 44B (convex shape) were formed on the surface of the second conductor 42 by photolithography and etching. Form a pattern.

According to the electronic device of this embodiment, it is possible to suppress the propagation of noise on the surface of the first surface 32 of the heat sink 30 (see FIG. 24). Moreover, the propagation of noise in the vicinity of the EBG structure can be suppressed because adjacent island-shaped conductors 41 constitute a capacitance. That is, the propagation of noise in the vicinity of the structure 40 in the space between the substrate 10 and the heat sink 30 shown in FIG. 1 can be suppressed. As a result, noise transmitted to the heat radiating plate 30 is radiated to the periphery, and it is possible to avoid adverse effects such as hindering normal operation of peripheral electronic devices.
<< Embodiment 2-3 >>

The electronic device of the present embodiment is different from the electronic device of Embodiment 2-1 or 2-2 (see FIGS. 23 and 24) in that the structure 40 does not have the adhesive layer 44. Other configurations are the same as those of the electronic device of the embodiment 2-1 or 2-2, and thus the description thereof is omitted here.

The structure 40 of the present embodiment that does not have the adhesive layer 44 includes, for example, a member such as a tape, glue, or push pin provided with an adhesive means (adhesive or the like), and the second conductor 42 is the heat sink 30. It attaches to the heat sink 30 so that the 1st surface 32 may be touched. According to this configuration, the second conductor 42 of the structure 40 and the first surface 32 of the heat sink 30 are electrically connected. That is, the first surface 32 of the heat sink 30 and the EBG structure provided in the structure 40 are electrically connected.

According to the electronic device of the present embodiment, noise propagation on the surface of the first surface 32 of the heat sink 30 can be suppressed. Moreover, the propagation of noise in the vicinity of the EBG structure can be suppressed because adjacent island-shaped conductors 41 constitute a capacitance. That is, the propagation of noise in the vicinity of the structure 40 in the space between the substrate 10 and the heat sink 30 shown in FIG. 1 can be suppressed. As a result, noise transmitted to the heat radiating plate 30 is radiated to the periphery, and it is possible to avoid adverse effects such as hindering normal operation of peripheral electronic devices.
<< Embodiment 2-4 >>

FIG. 25 is a cross-sectional view schematically showing the electronic apparatus of the present embodiment. The electronic device of the present embodiment is based on the electronic device of Embodiment 2-1 (see FIG. 23), and the second conductor 42 is different in that it is an adhesive layer 44 mixed with a plurality of conductive fillers 44A. Other configurations are the same as those of the electronic device of Embodiment 2-1, and thus description thereof is omitted here.

According to this configuration, the second conductor 42 and the first surface 32 of the heat radiating plate 30 are electrically connected in a state where the structure 40 is attached to the first surface 32 of the heat radiating plate 30. That is, the first surface 32 of the heat sink 30 and the EBG structure provided in the structure 40 are electrically connected.

The electronic device of the present embodiment can be manufactured according to the method for manufacturing the electronic device described in the first embodiment. Therefore, detailed description here is omitted.

According to the electronic device of this embodiment, it is possible to suppress the propagation of noise on the surface of the first surface 32 of the heat sink 30 (see FIG. 25). Moreover, the propagation of noise in the vicinity of the EBG structure can be suppressed because adjacent island-shaped conductors 41 constitute a capacitance. That is, the propagation of noise in the vicinity of the structure 40 in the space between the substrate 10 and the heat sink 30 shown in FIG. 1 can be suppressed. As a result, noise transmitted to the heat radiating plate 30 is radiated to the periphery, and it is possible to avoid adverse effects such as hindering normal operation of peripheral electronic devices.

In addition, since the adhesive layer 44 mixed with a plurality of conductive fillers constitutes the second conductor 42, the manufacturing process can be reduced and the raw material cost can be reduced.
<< Embodiment 2-5 >>

FIG. 26 is a cross-sectional view schematically showing the electronic apparatus of the present embodiment. The electronic device of the present embodiment is based on the electronic device of Embodiment 2-2 (see FIG. 24), and differs in the following points. That is, “the electronic device structure 40 of the embodiment 2-2 may or may not be provided with the connection member 43, but the electronic device structure 40 of the embodiment 2-5 is provided with the connection member 43. No difference ”and“ the configuration of the via 44B provided in the adhesive layer 44 and the shape of the second conductor 42 are different ”.

FIG. 27 schematically shows an example of the planar shape of the second conductor 42. The second conductor 42 has an opening 42B. The opening 42B is provided at a position facing each of the plurality of island-shaped conductors 41 arranged with periodicity. Further, in the opening 42B, a wiring 42A having one end connected to the second conductor 42 is provided.

FIG. 28 schematically shows another example of the planar shape of the second conductor 42. The second conductor 42 has an opening 42B. The opening 42 B is provided at a position facing the island-shaped conductor 41. The opening 42B is provided with a second island-shaped conductor 42C and a wiring 42A that connects the second conductor 42 and the second island-shaped conductor 42C.

Here, the manufacturing method of the electronic device of the embodiment 2-5 is based on the manufacturing method of the electronic device described in the first embodiment, and further, the manufacturing process of the via 44B and the manufacturing process of the second conductor 42 described below. It can be realized by giving. For example, a conductor film to be the second conductor 42 is formed on one surface of the dielectric layer 45 (see FIG. 26) to be thicker than a desired thickness, and then the surface of the conductor film is formed by photolithography and etching. The pattern in which the via 44B is formed is formed. Thereafter, with the via 44B covered with a mask, a pattern (second conductor 42) as shown in FIG. 27 or FIG. 28 is formed by photolithography and etching.

Next, perspective views schematically showing an EBG structure composed of the second conductor 42 and the plurality of island-shaped conductors 41 as described above are shown in FIGS. The equivalent circuit diagram of the EBG structure included in the EBG structure in FIG. 29 is the same as the equivalent circuit diagram of the EBG structure included in the EBG structure in FIG. 16 (see FIG. 18). It has been changed to. Further, the equivalent circuit diagram of the EBG structure in FIG. 30 is obtained by changing the positions of the capacitance C and the inductance L to appropriate positions in the equivalent circuit diagram of the EBG structure in FIG. 20 (see FIG. 21). Therefore, detailed description of the EBG structure shown in FIGS. 29 and 30 is omitted.

Next, the configuration of the via 44B will be described. In the present embodiment, the shape of the second conductor 42 has the opening 42B as described above, and has the wiring 42A or the wiring 42A and the second island-shaped conductor 42C in the opening 42B. In order to maintain these electrical relationships, the adhesive layer 44 is composed of an adhesive having no electrical conductivity. The position of the via 44 B provided in the adhesive layer 44 is preferably a position in contact with only the second conductor 42.

In the electronic device of this embodiment, the second conductor 42 and the first surface 32 of the heat sink 30 are electrically connected by the via 44 B penetrating the adhesive layer 44. That is, the first surface 32 of the heat sink 30 and the EBG structure provided in the structure 40 are electrically connected.

According to the electronic apparatus of this embodiment, it is possible to suppress the propagation of noise on the surface of the first surface 32 of the heat sink 30 (see FIG. 26). Moreover, the propagation of noise in the vicinity of the EBG structure can be suppressed because adjacent island-shaped conductors 41 constitute a capacitance. That is, the propagation of noise in the vicinity of the structure 40 in the space between the substrate 10 and the heat sink 30 shown in FIG. 1 can be suppressed. As a result, noise transmitted to the heat radiating plate 30 is radiated to the periphery, and it is possible to avoid adverse effects such as hindering normal operation of peripheral electronic devices.
<Embodiment 3>

The electronic device of the present embodiment is based on the first or second embodiment and differs in the following points.

FIG. 31 shows an example of a plan view of the structure of the electronic device according to the present embodiment excluding the substrate, the electronic component, and the spacer as viewed from the bottom to the top in the drawing. As shown in FIG. 31, the first surface 32 of the heat dissipation plate 30 of the present embodiment is a rectangle composed of a side having a length p and a side having a length q (p ≧ q). Further, at least a partial region of the first surface 32 of the heat sink 30 intersects with a straight line extending in a direction parallel to the side of the length p from the region 31 in contact with the spacer (or the electronic component). Is provided. That is, an EBG structure is provided. The EBG structure included in the EBG structure includes an electromagnetic wave having a wavelength of 2p in the band gap band.

According to such an electronic device, the noise transmitted from the electronic component to the heat sink 30 via the region 31 can be suppressed by the EBG structure from propagating in the longitudinal direction of the rectangular heat sink 30. Become. As a result, noise transmitted to the heat radiating plate 30 is radiated to the periphery, and it is possible to avoid adverse effects such as hindering normal operation of peripheral electronic devices.

Here, it is known that when the half-wavelength of noise and its integral multiple and the length of one side of the heat radiating plate 30 are substantially the same, the noise and the heat radiating plate 30 are in a resonance state, and extremely strong noise is emitted. ing. On the other hand, the electronic device of the present embodiment is configured to suppress propagation of noise (electromagnetic wave having a wavelength of 2p) that can be in a resonance state by the EBG structure.

As a result, even when the noise and the heat sink 30 are in a resonance state, it is possible to suppress the emission of extremely strong noise from the heat sink 30.

Note that the position of the structure 40 shown in FIG. 31, that is, the position where the EBG structure is provided is merely an example. If the above condition is satisfied, for example, the first surface 32 of the heat sink 30 as shown in FIG. You may provide in the edge part.

Here, an example of means for forming an EBG structure including an electromagnetic wave having a wavelength of 2p in the band gap band will be described. For example, in the case of the EBG structure shown in FIG. 6, two adjacent island-shaped conductors 1, two connecting members 3 connected to each of the island-shaped conductors 1, and a sheet-shaped conductor 2 facing the island-shaped conductor 1. The EBG structure constituted by can be shown by an equivalent circuit diagram shown in FIG. 33A. The band gap band f of the EBG structure shown in such an equivalent circuit diagram can be calculated by the equation shown in FIG. 33B. A desired f value can be set by appropriately adjusting the capacitance C and / or the inductance L constituting the EBG structure according to this equation. More specifically, for example, by changing the distance between the adjacent island-shaped conductors 1, changing the size of the island-shaped conductor 1, or changing the length of the connection member 3, the capacitance C and It is possible to set the desired f value by adjusting the inductance L appropriately. Similarly, in the case of an EBG structure having another EBG structure, the capacitance C and / or the inductance L can be appropriately adjusted based on the formula for calculating the band gap band f determined by each EBG structure. , A desired f value can be set.
<Embodiment 4>

FIG. 34 shows an example of a plan view of the structure of the electronic device according to the present embodiment excluding the substrate, the electronic component, and the spacer as viewed from the bottom to the top in the drawing. As shown in FIG. 34, the first surface 32 of the heat dissipation plate 30 of the present embodiment is a rectangle composed of a side having a length p and a side having a length q (p ≧ q). Further, at least a partial region of the first surface 32 of the heat sink 30 intersects with a straight line extending in a direction parallel to the side of the length q from the region 31 in contact with the spacer (or electronic component). Is provided. That is, an EBG structure is provided. The EBG structure included in this EBG structure includes an electromagnetic wave having a wavelength of 2q in the band gap band.

According to such an electronic device, it is possible to suppress the noise transmitted from the electronic component to the heat sink 30 via the region 31 from being propagated in the short direction of the rectangular heat sink 30 by the EBG structure. It becomes. As a result, noise transmitted to the heat radiating plate 30 is radiated to the periphery, and it is possible to avoid adverse effects such as hindering normal operation of peripheral electronic devices.

Further, it is known that when the half-wavelength of noise and its integral multiple and the length of one side of the heat sink 30 are substantially the same, the noise and the heat sink 30 are in a resonance state, and extremely strong noise is emitted. However, the electronic device of the present embodiment is configured to suppress propagation of noise (electromagnetic wave having a wavelength of 2q) that can be in a resonance state by the EBG structure.

In addition, since the means which comprises the EBG structure which contains the electromagnetic wave of wavelength 2q in a band gap band is realizable according to the means demonstrated in Embodiment 3, description here is abbreviate | omitted.
<Embodiment 5>

FIG. 35 shows an example of a plan view of the structure of the electronic device according to the present embodiment excluding the substrate, the electronic component, and the spacer as viewed from the bottom to the top in the drawing. As shown in FIG. 35, the first surface 32 of the heat sink 30 of the present embodiment is a rectangle composed of a side with a length a and a side with a length b (a> b). In addition, at least a partial region of the first surface 32 of the heat sink 30 intersects with a straight line extending in a direction parallel to the side of the length a from the region 31 in contact with the spacer (or electronic component). A structure 40A is provided. That is, a first EBG structure is provided. The EBG structure included in the first EBG structure includes an electromagnetic wave having a wavelength of 2a in the band gap band. Further, at least a partial region of the first surface 32 of the heat sink 30 has a second line so as to intersect with a straight line extending in a direction parallel to the side of the length b from the region 31 in contact with the spacer (or the electronic component). A structure 40B is provided. That is, a second EBG structure is provided. The EBG structure included in the second EBG structure includes an electromagnetic wave having a wavelength of 2b in the band gap band.

According to such an electronic device, the noise transmitted from the electronic component to the heat sink 30 via the region 31 can be suppressed by the EBG structure from propagating in the side direction of the rectangular heat sink 30. Become. As a result, noise transmitted to the heat radiating plate 30 is radiated to the periphery, and it is possible to avoid adverse effects such as hindering normal operation of peripheral electronic devices.

Further, it is known that when the half-wavelength of noise and its integral multiple and the length of one side of the heat sink 30 are substantially the same, the noise and the heat sink 30 are in a resonance state, and extremely strong noise is emitted. However, the electronic device of the present embodiment is configured to suppress propagation of noise (electromagnetic wave having a wavelength of 2a and electromagnetic wave having a wavelength of 2b) that can be in a resonance state by the EBG structure.

The means for constructing the EBG structure including the electromagnetic wave of wavelength 2a in the band gap band and the EBG structure including the electromagnetic wave of wavelength 2b in the band gap band can be realized according to the means described in the third embodiment. The description in is omitted.
<Embodiment 6>

FIG. 36 shows an example of a plan view of the structure of the electronic device according to the present embodiment excluding the substrate, the electronic component, and the spacer as viewed from the bottom to the top in the figure. As shown in FIG. 36, the first surface 32 of the heat sink 30 of the present embodiment is a rectangle composed of a side with a length a and a side with a length b (a> b). Further, at least a partial region of the first surface 32 of the heat sink 30 includes a straight line extending in a direction parallel to the side of the length a or the side of the length b from the region 31 in contact with the spacer (or electronic component). A structure 40 is provided so as to intersect. That is, an EBG structure is provided.

This EBG structure has at least two types of EBG structures. Different types of EBG structures mean EBG structures with different equivalent circuits and / or different band gap bands. And the unit cells of various EBG structures are arranged periodically. For example, as shown in FIG. 37, a checkerboard pattern may be formed by alternately arranging unit cells having a first EBG structure and unit cells having a second EBG structure. Alternatively, as shown in FIG. 38, a region in which unit cells of the first EBG structure are periodically arranged and a region in which unit cells of the second EBG structure are periodically arranged are arranged in parallel. Also good. In such a case, as shown in FIG. 38, regions in which unit cells of the third EBG structure are periodically arranged may be arranged in parallel. Furthermore, the region where the unit cells of the fourth EBG structure are periodically arranged may be arranged in parallel (not shown). The first EBG structure includes an electromagnetic wave having a wavelength of 2a in the band gap band. The second EBG structure includes an electromagnetic wave having a wavelength of 2b in the band gap. The third EBG structure and the fourth EBG structure may include an electromagnetic wave having an integral multiple of the wavelength 2a or an integral multiple of the wavelength 2b in the band gap.

Further, it is known that when the half-wavelength of noise and its integral multiple and the length of one side of the heat sink 30 are substantially the same, the noise and the heat sink 30 are in a resonance state, and extremely strong noise is emitted. However, in the electronic device of this embodiment, propagation of noise (electromagnetic wave having a wavelength of 2a, electromagnetic wave having a wavelength of 2b, and electromagnetic wave having a wavelength that is an integral multiple of 2a and 2b) is caused by the EBG structure. It is comprised so that it may suppress.

Furthermore, according to the present embodiment, it is possible to suppress the propagation of noise in both the longitudinal direction and the transverse direction of the rectangular heat radiating plate 30 and the propagation of noise that becomes a resonance state only by preparing one type of structure 40. can do. In such a case, inventory management of the structures 40 can be facilitated, and effects such as simplification of the manufacturing process can be realized.

The means for configuring the EBG structure including the electromagnetic wave of wavelength 2a in the band gap band and the EBG structure including the electromagnetic wave of wavelength 2b in the band gap band can be realized according to the means described in the third embodiment. The description in is omitted.
<Example>

Hereinafter, simulation results of the electronic apparatus of the present embodiment are shown.
<< Sample >>

Fig. 39 shows the sample used for the simulation. FIG. 39 is a transmission diagram.

"Sample 1 (Fig. 39 (a))"
A two-layer substrate structure in which a signal pattern (electronic component 20) serving as a noise source is provided in the approximate center of the substrate 10.

"Sample 2 (Fig. 39 (b))"
A structure in which the heat sink 30 is provided on the signal pattern (electronic component 20) via the spacer 50 based on the structure of the sample 1. The size of the heat sink 30 is 150 mm × 30 mm.

"Sample 3 (Fig. 39 (c))"
A structure in which the structure 40, that is, an EBG structure is provided on the surface of the heat sink 30 facing the electronic component 20 based on the structure of the sample 2. The structure 40 has the structure shown in FIG. 23, and unit cells (indicated by a rectangular parallelepiped in the figure) are arranged in 4 rows × 8 columns × 2 regions. The island-shaped conductors 41 (see FIG. 23) are 6 mm square, and are periodically arranged at a pitch of 2 mm. In this EBG structure, the frequency band f for suppressing propagation is set near “1 GHz” (C = 0.053 pF, L = 54.2 nH). This frequency corresponds to the frequency of an electromagnetic wave in which the length (150 mm) in the longitudinal direction of the heat sink 30 is a half wavelength, that is, the frequency of an electromagnetic wave having a wavelength of 300 mm.

<< Simulation contents >>

The electric field strength at a position 3 m away from the position of each sample was determined. The position 3 m away is the distance specified by the EMI standard limit value in a typical residential environment.
<< Result >>

The simulation results are shown in FIG. FIG. 40 is a graph in which the horizontal axis represents frequency (MHz) and the vertical axis represents electric field strength deviation (dB). The electric field strength deviation (dB) was calculated by setting the electric field strength of Sample 1 to 0 dB.

When comparing Samples 1 to 3, it can be seen that the electric fields of

Samples

2 and 3 are fluctuating compared to Sample 1. This is considered because electromagnetic waves are radiated through the heat sink 30. That is, when the heat sink 30 is provided, it can be seen that the electric field around the electronic device varies.

Also, comparing

Samples

2 and 3, it can be seen that Sample 3 has a lower electric field strength in a wider frequency band than Sample 2. That is, it can be seen that the sample 3 provided with the structure 40 on the surface of the heat dissipation plate 30 facing the electronic component 20 is suppressed from radiating electromagnetic waves to the periphery as compared with the sample 2 not including the structure 40. .

Furthermore, comparing

Samples

2 and 3 near 1 GHz (around 1 GHz to 1.2 GHz), it can be seen that the electric field strength of Sample 3 is greatly reduced compared to Sample 2. Specifically, the electric field strength is reduced by about 18 dB at 1.1 GHz. That is, in sample 2, the noise and the heat radiating plate 30 are in resonance because the half-wavelength of noise and the length of one side of the heat radiating plate 30 are substantially the same, and extremely strong noise is radiated. On the other hand, in the sample 3 in which the structure 40 is provided on the surface of the heat sink 30 facing the electronic component 20, strong noise emission is suppressed even when the noise and the heat sink 30 are in a resonance state. I understand.

This application claims priority based on Japanese Patent Application No. 2009-278872 filed on Dec. 8, 2009, the entire disclosure of which is incorporated herein.

Claims

A substrate,
Electronic components mounted on the substrate;
A heat sink provided directly or via a spacer on the electronic component;
Have
On the first surface of the heat radiating plate facing the electronic component,
A dielectric layer;
Provided inside or on the first surface of the dielectric layer so as to face the second surface, which is the surface opposite to the first surface of the dielectric layer, and has a repetitive structure in at least a partial region A first conductor having
At least one type of structural body is provided on the second surface of the dielectric layer so as to be in contact with the first surface of the heat sink.
The electronic device according to claim 1,
The structure is configured as a sheet,
At least a part of the dielectric layer is composed of an adhesive layer that adheres to the first surface of the heat sink,
The adhesive layer is an electronic apparatus that constitutes the second surface of the dielectric layer.
A substrate,
Electronic components mounted on the substrate;
A heat sink provided directly or via a spacer on the electronic component;
Have
On the first surface of the heat radiating plate facing the electronic component,
A dielectric layer;
Provided inside or on the first surface of the dielectric layer so as to face the second surface, which is the surface opposite to the first surface of the dielectric layer, and has a repetitive structure in at least a partial region A first conductor having
A second conductor formed on the second surface of the dielectric layer;
At least one type of structure including: the second conductor is positioned closer to the first surface of the heat sink than the first conductor, and the second conductor is the first conductor of the heat sink. An electronic device that is connected to a surface.
The electronic device according to claim 3,
The structure is configured as a sheet,
An adhesive layer that is provided on the opposite side of the dielectric layer via the second conductor and adheres to the conductive surface of the heat sink;
A conductive member provided in the adhesive layer and electrically connecting the second conductor and the conductive surface;
Electronic equipment comprising.
The electronic device according to claim 4,
The electronic device, wherein the conducting member is a via provided in the adhesive layer.
The electronic device according to claim 4,
The electronic device, wherein the conductive member is a plurality of conductive fillers mixed in the adhesive layer.
The electronic device according to claim 1 or 2,
An electronic apparatus in which a first EBG structure including at least one type of EBG structure is configured by the first structure and the first surface of the heat dissipation plate.
The electronic device according to any one of claims 3 to 6,
The first structure is an electronic device constituting the first EBG structure including at least one type of EBG structure.
The electronic device according to claim 7 or 8,
The first surface of the heat radiating plate is a rectangle composed of a first side having a length p and a second side having a length q (p ≧ q),
The first EBG structure includes an EBG structure including an electromagnetic wave having a wavelength of 2p in a band gap band,
At least a partial region of the first surface of the heat sink has the first EBG so as to intersect a straight line extending in a direction parallel to the first side from a region in contact with the electronic component or the spacer. An electronic device provided with a structure.
The electronic device according to any one of claims 7 to 9,
The first surface of the heat radiating plate is a rectangle composed of a first side having a length p and a second side having a length q (p ≧ q),
The second EBG structure includes an EBG structure including an electromagnetic wave having a wavelength of 2q in a band gap band,
The second EBG structure is provided in at least a partial region of the first surface of the heat sink so as to intersect with a straight line extending in a direction parallel to the second side from the electronic component or the spacer. Electronic equipment.
The electronic device according to claim 7 or 8,
The first surface of the heat radiating plate is a rectangle composed of a first side having a length a and a second side having a length b (a> b),
The third EBG structure includes a first EBG structure including an electromagnetic wave having a wavelength of 2a in a bandgap band, and a second EBG structure including an electromagnetic wave having a wavelength of 2b in a bandgap band,
At least a partial region of the first surface of the heat sink has a straight line extending from the electronic component or the spacer in a direction parallel to the first side, and the second from the electronic component or the spacer. An electronic device in which the third EBG structure is provided so as to intersect with a straight line extending in a direction parallel to the side.
The electronic device according to claim 11,
The electronic device in which the first EBG structure and the second EBG structure are alternately arranged.
The electronic device according to claim 7 or 8,
The first surface of the heat sink is rectangular;
The EBG structure is provided in at least a partial region of the first surface of the heat sink so as to intersect a straight line extending in a direction parallel to the rectangular side from a region in contact with the electronic component or the spacer. Electronic equipment.