WO2011053160A1 - Wafer stack carrier - Google Patents
Wafer stack carrier Download PDFInfo
- Publication number
- WO2011053160A1 WO2011053160A1 PCT/NO2010/000393 NO2010000393W WO2011053160A1 WO 2011053160 A1 WO2011053160 A1 WO 2011053160A1 NO 2010000393 W NO2010000393 W NO 2010000393W WO 2011053160 A1 WO2011053160 A1 WO 2011053160A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- stack
- area
- transportation
- lateral edge
- negative pressure
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
Definitions
- Wafer stack carrier Wafer stack carrier
- the present invention concerns handling disks or plates of materials, particularly wafers of silicon or other semiconductor materials.
- the invention concerns handling or transporting stacks of dry disks of materials, wherein the invention provides a method as well as a device for such transportation.
- Silicon blocks or slabs for solar cell purposes are sliced into thin disks using a wire saw or other devices.
- the thin disks are called wafers and each wafer has a thickness of 50-250 ⁇ , typically 100-200 ⁇ .
- the wafers are stacked and transported to a packaging machine using a conveyor belt or another transportation device.
- transporting stacks or piles of such dry wafers appears to be problematic, because the wafers are sliding, particularly the topmost wafers, and the fragile wafers are easily damaged. Due to such problems, the production rate is limited and the loss is high.
- a common method for reducing this problem is to arrange guides such as rails, walls or similar, wherein the stack of wafers being transported is pressed against the rails or the walls.
- the known solutions reduce the problem to a certain extent. However, they do not reduce the problem sufficiently.
- a similar problem is also found when transporting disks or plates of other materials, be it other semiconductor materials, such as gallium, germanium and others, including compounds, such as gallium arsenide and nitride, or other materials, such as metals and paper.
- the aim of the present invention is to provide solutions to said problem.
- the invention providing a method for transportation of a stack of disk-shaped objects, such as silicon wafers, on a conveyor belt, a transportation device or similar, without the objects being displaced nor damaged during transportation, distinctive in that a negative pressure is arranged on at least one part of the lateral area of the stack.
- Practical experiments have proven the method to reduce or eliminate the problem under realistic operation conditions, which is surprising. While not wanting to be bound by any theory, it is believed that a thin layer of air is present between the wafers, in particular the topmost wafers in the stack, and such a layer of air adds to the problem.
- the layer of air is removed or reduced in such a way that the problem is eliminated or reduced.
- the negative pressure can be provided in several ways, alone or in a combination.
- a suction device is advantageously arranged mainly sealingly against a lateral edge area of the stack in order to generate a negative pressure on the said area during operation of the suction device.
- Another advantageous embodiment comprises the arrangement of a blowing device close to a lateral edge area of the stack. As a result, operating the blowing device generates an air flow along at least one part of the lateral area in such a way that a negative pressure on the lateral area is provided, according to Bernoulli's effect.
- a combined blowing- and suction device is advantageously arranged mainly sealing against a lateral edge area of the stack in order to generate a negative pressure on the said area during operation of the device.
- the top part of the stack is advantageously subjected to a downward force, by means of a blowing- and/or suction device and/or by means of a separate device, such as a weight layer positioned on top of the stack.
- a negative pressure is arranged on diametrically opposite lateral edge areas or side areas of the stack, in such a way that possible horizontal forces on the stack caused by the devices are eliminated by each other.
- the invention provides a device for transporting a stack of disk-shaped objects, such as wafers, on a conveyor belt, a transportation device or similar, without the objects being internally displaced nor damaged during transportation.
- the device is distinctive in that it comprises a flexible sealing rim, on an outer end, mainly as a faying surface and/or close to at least one part of a lateral edge area or side area of the stack, the device furthermore comprises a volume within the outer end and a suction device which is connected to suck air from said volume.
- the device advantageously comprises a flexible tube with an outer end which, during operation, should be arranged to mainly enclose at least one part of a lateral area of the upper part of the stack, wherein the device furthermore comprises a suction fan connected to an inner end of the flexible tube.
- the volume is formed by a chamber which, during operation, abuts at least one part of the lateral edge area of the stack.
- the devices are advantageously arranged on opposite sides of the stacks in order to eliminate possible horizontal forces on the stacks caused by the devices.
- the outer end of the devices is so flexible and supple that forces causing problems for the stacks or wafers will not arise. Practical experiments have proven the effect of the device for keeping the stack together without internal displacement to be larger than the effect of possible horizontal forces on the stack, even with one device on one side of the stack.
- the outer end of the device mildly adheres to the lateral edge of the stack.
- the negative pressure may be achieved by at least two effects, specifically a negative pressure in the volume caused by the suction device, and an air flow along the side of the stack in over the sealing rim. Additionally, or separately, a downward force can be applied on the stack by means of an integrated part of the devices according to the invention, or a separate weight or by means of a pressure device.
- Figure 1 depicts a device according to the invention, wherein vacuum is arranged on a lateral edge area of a stack by means of a flexible tube 6 abutting an upper lateral edge area 4 in an angle of approximately 45°.
- an area 5 with negative pressure which keeps the wafers in place is achieved.
- the area 5 should as a minimum cover the lateral edge of the upper layers of wafers, as the weight of the upper wafers contributes to keeping the lower wafers in place.
- the device follows the stack at the same speed, and practical testing of the embodiment of the invention has yielded surprisingly good results.
- Figure 2 illustrates a device according to the invention, wherein the volume is formed by a chamber 9.
- the area of the negative pressure 5 along the lateral edge of the stack is particularly achieved in that air is sucked past a wing-shaped sealing which nearly extends to an upper lateral edge of the stack. Note that the sealing does not have to bear against the lateral edge. Negative pressure is generated by the air flow according to Bernoulli's effect. There is no need for any physical contact between the device and the stack. Hence, this embodiment is especially advantageous for the thinnest and most fragile wafers.
- Such devices can advantageously be arranged stationary and relatively closely along a conveyor belt.
- Figure 3 illustrates a device which can be said to combine the embodiments depicted in Figures 1 and 2.
- a negative pressure zone 5 on the wafer stack 7 is achieved in that the device comprises a flexible tube 6 which partly abuts an upper lateral edge of the stack.
- the device can advantageously follow the stack during transportation due to physical contact between the device and the stack.
- Figure 4 illustrates an embodiment for which several vacuum zones are arranged along at least one of the sides of a conveyor belt, in such a way that a wafer stack always will have a negative pressure zone against its lateral side area edge.
- the device is kept still in the illustrated embodiment, whereas the wafers move.
- the device comprises many outer ends with internal vacuum zones operatively connected to a suction device. Possibly, many devices are arranged in parallel along the conveyor belt. Even though the sealing rim is depicted in such a way that it physically touches the top part of the wafer stack on the figure, the sealing rim does not necessarily have to physically touch the wafer stacks.
- Figure 5 illustrates an embodiment, wherein a weight (17) is positioned on top of the stack, as a separate device or as a combined suction- and/or blowing device with a weight.
- the device and the method of the invention comprises any operative combination of features or steps mentioned or illustrated in this document.
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Packaging Of Annular Or Rod-Shaped Articles, Wearing Apparel, Cassettes, Or The Like (AREA)
Abstract
Method for transportation of a stack of disk-shaped objects on a conveyor belt, a transportation device or similar, without the objects being internally displaced nor damaged during transportation, distinctive in that a negative pressure is arranged on at least one part of the lateral area of the stack. Device useful for practicing the method.
Description
Wafer stack carrier
Field of invention
The present invention concerns handling disks or plates of materials, particularly wafers of silicon or other semiconductor materials. In particular the invention concerns handling or transporting stacks of dry disks of materials, wherein the invention provides a method as well as a device for such transportation.
Background of the invention
Silicon blocks or slabs for solar cell purposes are sliced into thin disks using a wire saw or other devices. The thin disks are called wafers and each wafer has a thickness of 50-250 μπι, typically 100-200 μιη. After inspection, the wafers are stacked and transported to a packaging machine using a conveyor belt or another transportation device. However, transporting stacks or piles of such dry wafers appears to be problematic, because the wafers are sliding, particularly the topmost wafers, and the fragile wafers are easily damaged. Due to such problems, the production rate is limited and the loss is high. A common method for reducing this problem is to arrange guides such as rails, walls or similar, wherein the stack of wafers being transported is pressed against the rails or the walls. The known solutions reduce the problem to a certain extent. However, they do not reduce the problem sufficiently.
Displacement and damaging of the wafers during transportation to a packaging machine, or other equivalent transportation purposes, still represents a considerable problem. A similar problem is also found when transporting disks or plates of other materials, be it other semiconductor materials, such as gallium, germanium and others, including compounds, such as gallium arsenide and nitride, or other materials, such as metals and paper.
The aim of the present invention is to provide solutions to said problem.
Summary of the invention
The above mentioned aim is met by the invention providing a method for transportation of a stack of disk-shaped objects, such as silicon wafers, on a conveyor belt, a transportation device or similar, without the objects being displaced nor damaged during transportation, distinctive in that a negative pressure is arranged on at least one part of the lateral area of the stack. Practical experiments have proven the method to reduce or eliminate the problem under
realistic operation conditions, which is surprising. While not wanting to be bound by any theory, it is believed that a thin layer of air is present between the wafers, in particular the topmost wafers in the stack, and such a layer of air adds to the problem. By applying a negative pressure on at least one part of the lateral edge area or side area, preferably including the upper part of the area, the layer of air is removed or reduced in such a way that the problem is eliminated or reduced. The negative pressure can be provided in several ways, alone or in a combination.
A suction device is advantageously arranged mainly sealingly against a lateral edge area of the stack in order to generate a negative pressure on the said area during operation of the suction device. Another advantageous embodiment comprises the arrangement of a blowing device close to a lateral edge area of the stack. As a result, operating the blowing device generates an air flow along at least one part of the lateral area in such a way that a negative pressure on the lateral area is provided, according to Bernoulli's effect. A combined blowing- and suction device is advantageously arranged mainly sealing against a lateral edge area of the stack in order to generate a negative pressure on the said area during operation of the device. The top part of the stack is advantageously subjected to a downward force, by means of a blowing- and/or suction device and/or by means of a separate device, such as a weight layer positioned on top of the stack. In a further preferred embodiment, a negative pressure is arranged on diametrically opposite lateral edge areas or side areas of the stack, in such a way that possible horizontal forces on the stack caused by the devices are eliminated by each other.
Furthermore, the invention provides a device for transporting a stack of disk-shaped objects, such as wafers, on a conveyor belt, a transportation device or similar, without the objects being internally displaced nor damaged during transportation. The device is distinctive in that it comprises a flexible sealing rim, on an outer end, mainly as a faying surface and/or close to at least one part of a lateral edge area or side area of the stack, the device furthermore comprises a volume within the outer end and a suction device which is connected to suck air from said volume.
The device advantageously comprises a flexible tube with an outer end which, during operation, should be arranged to mainly enclose at least one part of a lateral area of the upper part of the stack, wherein the device furthermore comprises a suction fan connected to an inner end of the flexible tube. In another advantageous embodiment, the volume is formed by a chamber which, during operation, abuts at least one part of the lateral edge area of the stack.
The devices are advantageously arranged on the conveyor belt or on the transportation device, thereby following the stack during transportation. Alternatively, the devices are kept still, nevertheless advantageously close to each other, that is, with overlapping effect on the stacks, arranged along a conveyor belt. The devices are advantageously arranged on opposite sides of the stacks in order to eliminate possible horizontal forces on the stacks caused by the devices. However, with advantage, the outer end of the devices is so flexible and supple that forces causing problems for the stacks or wafers will not arise. Practical experiments have proven the effect of the device for keeping the stack together without internal displacement to be larger than the effect of possible horizontal forces on the stack, even with one device on one side of the stack. The outer end of the device mildly adheres to the lateral edge of the stack. The negative pressure may be achieved by at least two effects, specifically a negative pressure in the volume caused by the suction device, and an air flow along the side of the stack in over the sealing rim. Additionally, or separately, a downward force can be applied on the stack by means of an integrated part of the devices according to the invention, or a separate weight or by means of a pressure device.
Figures
The invention is illustrated by means of five figures, where Figure 1 - Figure 5 depict embodiments of a device according to the invention.
Detailed description
Referring to the drawings, Figure 1 depicts a device according to the invention, wherein vacuum is arranged on a lateral edge area of a stack by means of a flexible tube 6 abutting an upper lateral edge area 4 in an angle of approximately 45°. Thus, an area 5 with negative pressure which keeps the wafers in place is achieved. The area 5 should as a minimum cover the lateral edge of the upper layers of wafers, as the weight of the upper wafers contributes to keeping the lower wafers in place. The device follows the stack at the same speed, and practical testing of the embodiment of the invention has yielded surprisingly good results.
Figure 2 illustrates a device according to the invention, wherein the volume is formed by a chamber 9. The area of the negative pressure 5 along the lateral edge of the stack is
particularly achieved in that air is sucked past a wing-shaped sealing which nearly extends to an upper lateral edge of the stack. Note that the sealing does not have to bear against the lateral edge. Negative pressure is generated by the air flow according to Bernoulli's effect. There is no need for any physical contact between the device and the stack. Hence, this embodiment is especially advantageous for the thinnest and most fragile wafers. Such devices can advantageously be arranged stationary and relatively closely along a conveyor belt.
Figure 3 illustrates a device which can be said to combine the embodiments depicted in Figures 1 and 2. Among others, a negative pressure zone 5 on the wafer stack 7 is achieved in that the device comprises a flexible tube 6 which partly abuts an upper lateral edge of the stack. The device can advantageously follow the stack during transportation due to physical contact between the device and the stack.
Figure 4 illustrates an embodiment for which several vacuum zones are arranged along at least one of the sides of a conveyor belt, in such a way that a wafer stack always will have a negative pressure zone against its lateral side area edge. The device is kept still in the illustrated embodiment, whereas the wafers move. The device comprises many outer ends with internal vacuum zones operatively connected to a suction device. Possibly, many devices are arranged in parallel along the conveyor belt. Even though the sealing rim is depicted in such a way that it physically touches the top part of the wafer stack on the figure, the sealing rim does not necessarily have to physically touch the wafer stacks. Figure 5 illustrates an embodiment, wherein a weight (17) is positioned on top of the stack, as a separate device or as a combined suction- and/or blowing device with a weight.
The device and the method of the invention comprises any operative combination of features or steps mentioned or illustrated in this document.
Claims
1.
A method for transportation of a stack of disk-shaped objects on a conveyor belt, a transportation device or similar, without the objects being internally displaced or damaged during transportation, c h a r a c t e r i s e d i n that a negative pressure is arranged on at least one part of the lateral area of the stack.
2.
A method according to claim 1 , characterized in that a suction device is arranged in substance sealingly against a lateral edge area and/or side area of the stack in order to provide a negative pressure on said area during operation of the suction device.
3.
A method according to claim 1, characterized in that a blowing device is arranged close to a lateral area of the stack in such a way that during operation, the blowing device generates an air flow along at least one part of the lateral area in such a way that a negative pressure on the lateral edge area is generated, according to Bernoulli's effect.
4. A method according to claims 1-3, characterized in that a suction- and blowing device is arranged in substance sealingly against a lateral edge area or side area of the stack in order to generate a negative pressure on said area during operation of the device.
5. A method according to claim 1, characterized in that a downward force is applied to the top of the stack, by means of a blowing- and/or suction device and/or by means of a separate device.
6.
A method according to claim 1, characterized in that a negative pressure is arranged on diametrically opposite lateral edge areas or side areas of the stack.
7.
A device for transportation of a stack of disk-shaped objects on a conveyor belt, a
transportation device or similar, without the objects being internally displaced nor damaged during transportation, c h a r a c t e r i s e d i n that the device comprises a flexible sealing rim, on one outer end, enclosing a faying surface, for in substance abutment or near contact to at least a part of a lateral edge area or side area of the stack, the device furthermore comprises a volume within the outer end and a connection for or a suction device connected to suck air from said volume.
8.
A device according to claim 7, characterized in that the device comprises a flexible tube with an outer end which is positioned in such a way that it encloses at least one part of a lateral edge area of the upper part of the stack, wherein the device furthermore comprises a suction fan which is connected to an inner end of the flexible tube.
9.
A device according to claim 7, characterized in that the volume is formed by a chamber which bears against and/or is positioned close to one part of a lateral edge area or side area of the stack.
10.
A device according to claim 7, characterized in that it is arranged on the conveyor belt or on the transportation device and consequently follows the stack during transportation.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NO20093257 | 2009-10-30 | ||
| NO20093257A NO20093257A1 (en) | 2009-10-30 | 2009-10-30 | Stack holder for wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2011053160A1 true WO2011053160A1 (en) | 2011-05-05 |
Family
ID=43799411
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/NO2010/000393 WO2011053160A1 (en) | 2009-10-30 | 2010-10-29 | Wafer stack carrier |
Country Status (2)
| Country | Link |
|---|---|
| NO (1) | NO20093257A1 (en) |
| WO (1) | WO2011053160A1 (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0709876A1 (en) * | 1994-10-28 | 1996-05-01 | Shin-Etsu Handotai Company Limited | Separating slice base mount and jig for it |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5465951A (en) * | 1994-01-19 | 1995-11-14 | Design Technology Corporation | Fabric piece handling system |
-
2009
- 2009-10-30 NO NO20093257A patent/NO20093257A1/en not_active IP Right Cessation
-
2010
- 2010-10-29 WO PCT/NO2010/000393 patent/WO2011053160A1/en active Application Filing
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0709876A1 (en) * | 1994-10-28 | 1996-05-01 | Shin-Etsu Handotai Company Limited | Separating slice base mount and jig for it |
Also Published As
| Publication number | Publication date |
|---|---|
| NO330231B1 (en) | 2011-03-07 |
| NO20093257A1 (en) | 2011-03-07 |
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