WO2011044606A1

WO2011044606A1 - Circuit board element and method for producing such a circuit board element

Info

Publication number: WO2011044606A1
Application number: PCT/AT2010/000389
Authority: WO
Inventors: Gregor Langer
Original assignee: At & S Austria Technologie & Systemtechnik Aktiengesellschaft
Priority date: 2009-10-16
Filing date: 2010-10-13
Publication date: 2011-04-21
Also published as: AT12314U1

Abstract

The invention relates to a circuit board element (1), comprising a substrate (5, 5'), on which at least one optical component (3, 31) is attached and to which at least one waveguide component (2) is connected, wherein at least one interface optical waveguide (4, 4') structured by means of multiphoton absorption in a layer (9, 9') made of optical material is provided between the end (6) of the waveguide component (2) and the optical component (3, 3'), and a method for producing such a circuit board element.

Description

Printed circuit board element and method for producing a

such printed circuit board element

The invention relates to a printed circuit board element having a substrate, on which at least one optical component is mounted and connected to the at least one waveguide component.

Furthermore, the invention relates to a method for producing such a printed circuit board element.

The presence of an optical component on a substrate and a waveguide component connected thereto poses the problem of suitable optical coupling (optical interface) between the waveguide structure and the optical component. Under "optical component" is both a purely optical component, such as a mirror, a grating (grating), an optical connector, etc., as well as an opto-electronic component, such as a light-emitting diode or a laser diode or As a receiver, a photodiode or a phototransistor understood, the waveguide component can

contain at least one waveguide, possibly also a plurality of waveguide next to each other and / or one above the other.

In practice, hitherto, for optical coupling, the optical components are mechanically aligned with the waveguide components or, conversely, the waveguide components are mechanically aligned with the optical components to achieve proper light conduction between the optical components and the waveguide components. This alignment process is laborious, expensive, and nonetheless less effective, and accordingly there is a need for a technique that can easily ensure efficient light coupling between said components.

This demand is all the greater when it is taken into account that printed circuit boards with integrated optical signal connections are being used more and more frequently, in particular for the realization of highly complex applications, whereby a further miniaturization and an increase in the integration density and thus a higher product value creation is made possible. Printed circuit boards with Connections are used where applications require the highest data flows between components or components, modules and functional units (eg high-end computer applications) where interference immunity to electromagnetic fields is desired (eg in automotive and aeronautical applications) - or in general, where a space-saving design of connections (eg mobile applications) is needed.

In general, as (prefabricated) waveguide components are traditionally eg glass fibers or polymer fibers used as optical light guides, but also planar polymer waveguide, which can not achieve the properties of glass ^¬ fibers in terms of attenuation, but less for short connections Meaning, but in terms of production,

Machining and design options as well as in terms of cost provide enormous benefits.

It is a connection of two optical fibers by means of a TPA-optical waveguide structure from WO 2006/003313 AI known, but here is no printed circuit board element with an attached on a substrate optical component prior to the ef ^¬-efficient light coupling would produce, so that the above-described special alignment problem does not result here.

As such is the structure of optical waveguides in an optical film with the aid of multi-photon absorption, in particular two-photon absorption (TPA - Two photon absorption) ^¬ be already known, see. for example AT 413 891 B, AT 503 027 B and AT 503 585 B, but here only the TPA structuring is generally described, for example in association with active or passive optical components; In addition, in AT 413891 B, Figs. 13A and 13B, there is disclosed a junction region between an optoelectronic device and a light waveguide, but where the light waveguide and the junction region are patterned simultaneously, ie in one and the same process, by photon radiation.

It is an object of the invention in the manufacture of optical connections by means of (prefabricated) waveguide components to enable their coupling to optical or opto-electronic components on a substrate of a printed circuit board element in an efficient manner and accurately, so as to minimize any optical losses and optimal

Light coupling between the above, as well as their fixation very different components to ensure their construction.

To achieve the object, the invention provides a printed circuit board element as in claim 1 and a method as defined in claim 11 before. Advantageous embodiments and further developments are specified in the dependent claims.

The present technique assumes that on a substrate, e.g. a PCB inner layer, both optical or opto-electronic components and light-guiding structures, here simply called waveguide components mounted. As waveguide components are conventional optical fibers as well as previously produced planar

Polymer waveguide in question. Unlike the previous techniques, in which these components had to be physically aligned with each other, in the present technique, the assembly of the board substrate with the components is first performed, and then the interface between the components is realized, with the aid of a TPA-structured (or generally patterned by multiphoton absorption) optical waveguide. Among other things, this technique offers the advantage that the assembly of the components can be carried out with little effort, that is, quite roughly, since the desired light coupling between the components is produced by the structured interface optical waveguide.

As described in the already mentioned AT 413 891 B, in the structuring method by means of multi-photon absorption, in particular TPA, the assembly of the components (including electrical contacting) is first carried out for the realization of optical waveguides, and these components are then embedded in an optical material. Thereafter, the structuring of the optical waveguide between the components by means of irradiation, in particular with a laser. At this Structuring is a chemical reaction, namely polymerization, activated by simultaneous absorption of several - usually two - photons in the optical material. The material itself is transparent to the irradiated laser wavelength (eg 800 nm). This results in the material initially no absorption and no single-photon process. In the focal region of the light beam or laser beam, however, the intensity is so high that the optical material absorbs two (or more) photons simultaneously, whereby the said chemical reaction is triggered. Another advantage is that through the

Transparency of the optical material for the excitation wavelength reaches all the points in the optical layer and thus can be written without problems three-dimensional structures in the optical layer. By "three-dimensional" is to be understood that the optical waveguide not only in one plane (the xy plane) - possibly reciprocating - run, but also in height, in the z-direction, can vary, the optical waveguide can In other words, the optical waveguide can also change its (cross-sectional) shape over its longitudinal extension in the x, y and z directions, for example by making the cross section smaller or larger, from circular to flat elliptical, and then again to circular, to elliptical, etc. The said multiphoton absorption process is further a one-step structuring process in which no multiple exposures and no wet-chemical development ^¬ steps are required.

The aforementioned three-dimensional optical waveguide structuring is particularly advantageous in providing an optical connection between a waveguide component and an optical (optoelectronic) component, with previous rather coarse positioning, the interface optical waveguide in particular directly to the waveguide structure of the waveguide component connects and can lead to the optical component, optionally to a deflection mirror at this.

The present invention can be used in opto-electronic circuit boards with multimode or singlemode waveguides for high data transfer rates and more design freedom. It can be used with Rigid-Flex and Rigid-Flex-Rigid PCBs and is mainly used for the production of high-volume products. An interface between a conventional optical fiber technology and a planar waveguide technology based on plastics and an optical component is made possible, which has significant advantages, as mentioned, in the connection to the optical or opto-electronic components. A particularly advantageous application is, for example, that of the optical connection of an active one

Optical cable for optical connection of a high-end computer.

In the present technique, as mentioned above, the components (waveguide component and optical component) are mounted in advance, and prior to structuring the interface optical waveguide between them, their positions are measured by means of an optical system (called a "vision" system) the components, in particular the waveguide component in its end region, at least one - preferably formed of a reflective material - mark This is especially important if this optical position measurement after attaching the layer of optical material, embedded Namely, the optical material has a similar refractive index as the waveguide component, so that the latter would be difficult to detect by the optical system within the optical layer for example, colored or wi e mentioned may be formed of a reflective material, in particular a metallic material, however, the detection can be accomplished easily. For example, the mark can be made by printing a paint or by sputtering a metal.

During measurement, the components can be measured precisely with regard to their position, and also their rotation or tilt, so that data for the control of the laser beam during structuring of the interface optical waveguide are obtained, thus the course, in exact alignment of its ends to the mentioned Components to be able to determine. As already mentioned, the waveguide component can have a planar waveguide structure with at least one waveguide core, preferably with a plurality of waveguide cores (similar to a ribbon line), or else an optical fiber. These waveguide components (planar structure as well as optical fiber) usually consist of a cladding layer (called cladding layer) and a core, whose refractive index is higher than that of the cladding layer, so that a total reflection at the boundary layer can take place.

For the measurement of the waveguide component, it is also advantageous if it is attached with its end on a separate substrate ^¬ part, which is provided with at least one mark; This substrate portion may further preferably at the same time a spacer element, a spacer for adjusting the height ^"waveguide component form relative to the optical component, that is selected a substrate portion having an appropriate thickness, the waveguide component is connected to the with their end region, for example by adhesive bonding, is, after which the substrate part mounted on the PCB element substrate, for example glued, is.

To adapt to the light inputs and outputs of the components to be optically connected, it is advantageously possible to provide the interface optical waveguide with a changing in the direction of the optical waveguide cross-section.

The interface optical waveguide can also be designed, for example, as a waveguide splitter, as a waveguide crossing or similar optical component. On the other hand, the Wel ^¬ lenleiter component may be a waveguide array having a plurality

Waveguide cores included; In this case, if all the waveguide cores are to be used, a corresponding number and arrangement of Inter.face optical waveguides can be provided.

As mentioned, the optical component can be a light-emitting component, for example a laser diode, or a light-receiving component, such as a photodiode or a phototransistor, in a manner known per se. These components can also like also already known per se deflecting mirrors, in order to direct the light respectively out of the component or into the component. It is also conceivable, however, if the optical component is a (standardized) optical plug.

The positions of the components can be measured prior to attaching the optical layer or even after its attachment.

The invention will be explained below with reference to particularly preferred embodiments, to which it should not be limited, and with reference to the drawings. In detail in the drawing:

1A and 1B schematically show a printed circuit board element with an optical coupling of a waveguide component with an opto-electronic component in a longitudinal section (Fig. 1A) and in plan view (Fig. 1B); 2A and 2B in a longitudinal section (along the line AA in Fig. 2B) and cross-section (along the line BB in Fig. 2A) as a waveguide component usable, per se conventional optical fiber; 3A, 3B and 3C in a longitudinal section, in a ^plan view and in a cross-section along the line CC in Figure 3B, a planar waveguide component, for example with an array of four optical fiber cores. 4A and 4B in a schematic longitudinal section and in a plan view of the construction of a rigid-flex-rigid printed circuit board element in an intermediate stage of production, prior to attachment of the optical material and the structuring of the interface optical waveguide for the purpose of optical coupling between the individual components; 5A and 5B of this printed circuit board element according to FIGS. 4A and 4B, but now in a state after the application of the optical material in the form of a layer, FIG. 5A again showing a schematic longitudinal section and FIG. 5B a schematic top view of FIG. see shows; 6A and 6B turn, in a schematic longitudinal section and a schematic plan view of the printed circuit board element according to FIG. 4A, 4B and 5A, 5B, now after completion, after structuring of the interface optical waveguide.

7 shows a schematic longitudinal section of a multilayer structure of a printed circuit board element with interface optical waveguides between waveguide components and optoelectronic components;

Figure 8 is a schematic longitudinal section through a PCB ^¬ element with a three-dimensional (3D) -Wellenleiterarray as a waveguide component.

9 shows schematically a plan view of the end region of a waveguide component with its own substrate part, on which markings are mounted for the purpose of measurement; 10A and 10B show a schematic partial longitudinal section or a partial plan view of a printed circuit board element with one of the ^¬ like waveguide component with its own substrate part, which is fixed to the substrate of the printed circuit board element. FIGS. 11 and 12 two examples of circuit board elements similarity ^¬ Lich Fig. 1A, in corresponding schematic longitudinal sections, wherein, compared to Fig. 1A, an interface optical fiber with changing in the direction of extension cross-section, namely on the one hand with one of the waveguide component to the optoelectronic component increasing cross-section (Figure 11) and the other with an increasing from the opto-electronic component to the waveguide component cross-section (Figure 12), is shown; Figures 13A and 13B are a schematic plan view and in a schematic longitudinal section of embodiments of the printed circuit board element according to the invention with different struc tured ^¬ interface optical waveguides. and 14 shows a further embodiment of a printed circuit board element with an optical connector (optical coupler) as optical component in conjunction with a waveguide component via a slanted interface optical waveguide.

In the drawing, various circuit board elements, partially in phases in the production, illustrated, which have in common that a waveguide component with at least one optical component via a structured by Mehrphotonenabsorp ^¬ tion in an optical interface

(Interface) optical fiber is optically coupled. For simplicity in the drawing, all elements with the printed circuit board 1, all waveguide components with 2, all opti ^¬ rule components 3 and 3, 3 'and all interface optical waveguide having 4 or 4, 4' are designated. Each printed ^¬ tenelement 1 further comprises a substrate 5, 5, 5 on '.

The term "optical component" or "optical component" is to be understood quite generally as a component which can have both a purely optical function and an opto-electronic function, such as, for example, a mirror, a grating, an optocoupler (optical plug) , or transmission components such as LEDs, Laserdi ^¬ oden, or receiver components such as photodiodes or phototransistors. These components, that is, optical components 3, here may also be directed by folding mirror alone or by an opto-electronic component with a reflecting mirror ge ^¬ forms.

According to FIGS. 1A and 1B, a waveguide component 2 is attached in the region of its end 6 to the upper side of the substrate 5 of the printed circuit board element 1, for example with the aid of an adhesive layer 7. At a distance therefrom, the substrate 5 with the optical component 3, which here has a deflecting mirror 8, be ^¬ fitted. The deflection mirror 8 as a light input or light output of the optical component 3 is located at a distance from the end 6 of the ^'waveguide component 2. The optical coupling of these two components 2, 3 is a bridging or interface optical fiber 4 in a layer 9 of an optical, polymerizable material, as known per se (cf., for example, AT 413 891 B). An edge or boundary layer 10 limited the optical layer 9.

As a waveguide component 2, for example, a per se known optical fiber, as shown in Figures 2A and 2B, be provided; Such an optical fiber has a core 11, also called a core, within a cladding or cladding layer 12.

In the embodiment according to FIGS. 1A and 1B, however, a planar waveguide component 13, as can be seen in FIGS. 3A, 3B and 3C, is provided as the waveguide component, whereby this waveguide component 13 according to FIG. 3C exemplarily has an array with four optical waveguides Cores 14 has. These optical waveguide cores 14 are located within a cladding, similar to the cladding layer 12 according to FIGS. 2A and 2B, wherein usually in a planar structure on a lower cladding layer 15 after structuring or attachment of the optical waveguide cores 14 an upper cladding Layer 16 is attached. The entire structure 14, 15, 16 takes place according to FIGS. 3A-3C as well as according to FIG. 1A on a flexible substrate 17, e.g. a polyimide film.

In the case of the present printed circuit board element 1, the components to be optically coupled, that is to say 3 and 2 according to FIG. 1A, are fastened to the substrate 5 of the printed circuit board element 1 without special alignment measures; in other words, with this assembly, unlike previous techniques, there is no (or no exact) mechanical alignment of components 2 and 3 relative to each other. This is possible because after the assembly, an optical interface between the components 2, 3 is realized, the one by its structuring of exactly one component, such as the waveguide component 2, to the other component, for example, to the deflection mirror 8 of the component 3, leading optical waveguide 4, referred to herein as the "interface optical fiber" 4. As previously mentioned, this interfacial optical fiber 4 is known per se in the optical material of layer 9 by multiphoton absorption, in particular two photon absorption (TPA) Structured by a laser beam focused on the particular desired location within the layer 9 and in the focus area through the high intensity material polymerization is caused by the absorption of several, mostly two, photons. Regarding this mechanism and the possible

For simplicity, please refer to the AT 413 891 B materials.

From Figs. 4A and 4B, further from Figs. 5A and 5B and finally Figs. 6A and 6B, this procedure is more detailed. FIGS. 4A-6B show a printed circuit board element 1 in the form of a so-called rigid-flex-rigid-board, wherein a waveguide component 2, for example in the form of a planar waveguide component 13 according to FIGS. 3A, 3B and 3C, with a flexible own substrate part 17, which is provided in its two end regions 6, 6 'on substrates 5 and 5' of rigid material, eg Epoxy resin, for example by gluing, is attached. The two substrates 5, 5 'each carry an optical component 3 or 3', for example again with deflecting mirrors 8 and 8 '(in the embodiment shown corresponding to the four optical waveguide cores 14 according to FIG. 3C four deflecting mirrors 8 and 8', see Fig. 4B).

Next, according to FIGS. 5A and 5B, the space between the parts of the delimiting layers 10 and 10 ', which are likewise provided here, similar to FIGS. 1A and 1B, is provided with an optical, photopolymerizable material in the form of a layer 9 or 9 'filled, wherein the optical components 3 and 3' and the

End regions 6 and 6 'of the waveguide component 2 are embedded in the optical material of these layers 9, 9', as can be seen ^best from FIG. 5A.

Before or after that, the components 2, 3 or 3 'are measured with respect to their positions with the aid of an optical system, a vision system 18, so as to control signals for the structuring of the interface optical waveguides 4 and 4' according to FIG. 6A 6B, as is also known per se. In this measurement with the aid of the vision system 18, the xyz positions of the components 2, 3, 3 'as well as any twists or tilts of these components can be detected, so that the interface optical waveguides 4 and 4' optimally in alignment with each other the components 2, 3, 3 'structured can be. With regard to such a measurement or the attachment of markings, reference may also be made to AT 503 585 B.

In particular, in the case that the components 2, 3, 3 'are measured only after the application of the layer 9 or 9' by means of the vision system 18, it should be noted that the waveguide component 2, which usually has a similar refractive index as the optical material of the layer 9 or 9 ', is poorly visible in this optical system 18. In this case, it is therefore particularly advantageous if markings are applied in the end regions 6, 6 'of the waveguide component 2, for example in the form of a reflective material on the upper surface of the upper cladding layer 16, e.g. by sputtering of metals, or in the form of a colored imprint. In FIG. 5A, such markings-which, of course, can also be provided on the component 3 or 3 ', as is known per se-are not apparent; In the embodiment according to FIGS. 9 and 10B, however, markings 19 - there on a separate substrate part 20 of the waveguide component 2 - are shown. Similar markings as the markings 19 may, in the exemplary embodiment according to FIGS. 4A-6B, be mounted on the upper side of the upper cladding layer 16 (and on the components 3, 3 ') as mentioned.

After receiving the position ^data, including alignment ^data, the components 2, 3, 3 '(as far as the waveguide component 2 is concerned, more precisely its end regions 6, 6'), the interface optical waveguides 4, 4 'are "written in", as mentioned Placement inaccuracies can be compensated because the interface optical waveguide 4 or 4 'quite an oblique or arcuate course between the respective core 14 of the waveguide component 2 and, for example, the respective deflection mirror 8 of the optical component 3 can be obtained.

In this way, due to the two rigid substrates 5, 5 'and the flexible waveguide component 2 therebetween, the aforementioned rigid-flex-rigid printed circuit board 1 will have two rigid regions (substrates 5, 5') and one therebetween

flexible area (waveguide component 2 with the flexible Substrate part 17).

During assembly, the assembly of the optical components 3, 3 'can be carried out both before and after the waveguide assembly.

As the waveguide component 2, in addition to the planar waveguide component 13 shown in FIGS. 3A-3C, an optical fiber as shown in FIGS. 2A and 2B may also be used. Such an optical fiber or a fiber optic cable may be made of glass or polymer (POF), for example.

On the other hand, the planar polymer waveguide component having the lower cladding layer 15, the core layer 14, and the upper cladding layer 16 may be made of a polymer such as

Acrylate, polyimide, polysiloxane, epoxy, etc., or from hybrid polymers (inorganic-organic hybrid materials, e.g., Ormocere). Such planar waveguide components 2 can be made by a variety of known technologies, such as by

Mask exposure techniques, inprint techniques, ion diffusion techniques, but also direct laser writing, etc.

Further, if previously the optical components have been shown 3 or 3 'with order ^¬ directing optics (mirrors 8 and 8'), they can, of course, optical components 3, 3 'with no such reflecting mirror 8, 8' also be provided.

With regard to the interface optical fiber 4 and 4 'or, generally, the optical material of the layer 9, 9', so ei ^¬ should here the index of refraction in order to minimize reflections, preferably between the refractive indexes of the to be coupled to components 3 and 3 'nerseits and 2, on the other hand.

With the vision system 18, the x- and y-coordinates as well as the height (z-coordinate), further twists or tilts of the assembled components, ie the end portions 6, 6 'of Wel ^¬ lenleiter component 2 and the optical component , 3 ', in particular also of their deflecting mirrors 8 and 8', based on markings (eg 19 in Fig. 9 and 10B), but also on the basis of Outlines are determined.

In the following exemplary embodiments explained with reference to FIGS. 7-14, the principle of the interface optical waveguides 4, 4 'between waveguide components 2 and optical components 3, 3' explained in detail above is applied in a corresponding manner, so that further explanations are given in this connection can spare. It should therefore be discussed in the following mainly on the specifics of these embodiments.

In Fig. 7, a printed circuit board element 1 is shown with a multi-layer structure, wherein on a lower element similar to the printed circuit board element 1 shown in FIG. 6A via a substrate intermediate layer 5A, 5A 'another waveguide component 2', for example of the same type "planar waveguide component "as the lower waveguide component 2 (see Figures 3A-3C.), for example as ^¬ derum 'is attached stacked; on the interlayer substrates 5A, 5A' through adhesive layers 7, in turn, are optical components 3, 'attached 3 In addition, interface optical waveguides 4 and 4 'are provided for the purpose of optical coupling, and a cover layer 22, for example a standard solder resist, for protecting the multilayer structure shown is provided as the upper terminus Begren ^¬ wetting layer 10A protected.

In the embodiment according to FIG. 8, a waveguide-Kom ^¬ component 2 is provided with a three-dimensional array of optical waveguide cores 14, wherein the three-dimensional array for example, four optical waveguide cores adjacent to each other (see Fig. 3C) and adjacent arrays three times one above the other (see Fig. 8), so that a 3D arrangement of 3x4 waveguide cores 14 is given. A corresponding array of optical waveguides interface 4 is then in the respective op ^¬ tables layer 9 'is patterned in the optical layer 9 for the optical coupling of the waveguide Comp ^¬ component 2 with the respective optical component 3 and 3 respectively.

In Fig. 9 (see also Fig. 10B) is the end portion and the end 6 of a waveguide component 2 with its own substrate part 20, wherein the already mentioned markings 19 for measuring the end region 6 of the waveguide component 2 are mounted on this own substrate part 20 instead of on the waveguide component 2 itself.

The waveguide component 2 is attached by means of this own sub ^¬ stratteils 20 on the substrate 5 of the printed circuit board element. 1 In this case, the substrate part 20 (from an assortment with several thicknesses) with such a thickness, ie height, can be selected such that the waveguide component 2 with its

Fiber optic core 11 and 14 (see Fig. 2 and 3) in height already the height of the optical component 3 and the deflection mirror 8 of the optical component 3 is approximately adjusted. The substrate part 20 thus also has the function of a spacer or spacer element here. After assembly of the two components 2, 3 again the embedding of the components 2, 3 in the optical material of the layer 9, after which the ^{Markierun ¬} conditions 19 are measured on the substrate part 20. Thereafter, as described, the interface optical waveguide 4 is patterned; see. also Fig. 10A.

FIGS. 11 and 12 show modifications of the embodiment according to FIG. 1A, the interface optical waveguide 4 having a varying cross-section, for example being conical, being designed; it increases according to FIG. 11 from the waveguide component 2 to the optical component 3, which is of particular advantage when the optical component is a photodiode; 12, the cross-section of the in ^¬ terface optical waveguide 4, starting from the optical Kompo ^¬ component 3 'to the waveguide component 2 towards, for example, in turn tapered, which is advantageous if it is in the optical component 3' is a laser diode or the like. In both cases, Fig. 11 and Fig. 12, the light Kopp ^¬ development efficiency can be increased through the tapered design of the interface waveguide 4 and 4 '.

However, the respective interface optical waveguide 4 or 4 'can undergo an adaptation change not only in the diameter size but also in the cross-sectional shape, for example from round to elliptical or from round to more or less rectangular, to improve the light coupling between the components 2 and 3 or 3 '. For example, normally the light emitting field of a laser diode is round, but the waveguide cross section of a planar waveguide 13 is rectangular (see Fig. 3C); a "sliding" transition from the round cross-section to the rectangular cross-section is more favorable for light coupling than an abrupt transition.

In the embodiments of Figs. 13A and 13B, too, the light is transmitted between the waveguide component 2, e.g. in the form of an optical fiber or in turn in the form of a planar waveguide component, and an optical component 3 coupled via a TPA-structured interface optical waveguide 4; this optical waveguide 4 can also have various other forms depending on the need and objectives than a simple waveguide configuration. By way of example, various configurations are apparent from FIG. 13A, such as a waveguide splitter 4A and a waveguide crossing 4B. The optical waveguides 4 are in Fig. 13A only very schematically, with dashed lines, indicated, as well as the components 2, 3, wherein for the sake of simplicity, a waveguide component 2 with a plurality of optical waveguide cores 14 and an optical component 3 with multiple receiving areas 24 are schematically illustrated.

Of course, it would also be conceivable, starting from a laser diode to provide an interface optical waveguide 4, which then splits to form a plurality of optical waveguide cores of an optical waveguide component 2. As far as the waveguide crossing 4B is concerned, the two optical waveguides can be arranged one above the other in height, but it is quite conceivable that the two optical waveguides form a mutual (possibly partial) penetration, provided that the angle is chosen such that a crosstalk of the light signal of a waveguide channel is minimized in the other waveguide channel. Furthermore, it is conceivable to guide the two waveguides in the intersection region 4B such that they do not penetrate or touch one another, but intersect at different heights, which virtually no longer makes crosstalk of the light signal from one waveguide channel to the other waveguide channel possible. In the exemplary embodiment according to FIG. 13B, an interface optical waveguide 4 that splits in a vertical plane, that is to say with a waveguide splitter 4A in the z direction, is located between a waveguide component 2 with at least one waveguide core 14 and an optical component 3 with a plurality of reception regions 24 provided.

It should be mentioned that with the present technology it is also possible to provide the waveguide splitter 4A obliquely in space so that the two waveguide arms of the splitter 4A are not only offset at different depths but also laterally offset from one another.

In Fig. 14 an embodiment with a standardized optical connector (coupler) finally is illustrated 23 as an optical component 3, the optical fiber 23 'as ^¬ derum a within an optical layer 9 TPA-structured Interface optical waveguide 4 - here

For example, for the purpose of height adaptation extends obliquely - with the waveguide core 14 of a e.g. planar waveguide component 2 according to FIG. 3A-3C is coupled. The modified printed circuit board element 1 formed in this way again has a substrate 5, so that the printed circuit board element 1 is stiff in this area, and that a flexible area with the waveguide component 2 adjoins this rigid area.

As an optical component 3 also more active or carried ^¬ ve optical components come into question, such as, more generally, to understand a VCSEL component or a lens, a grating (grating), etc., and thus the term "optical component" ,

Claims

Claims:

A printed circuit board element (1) having a substrate (5, 5 ') on which at least one optical component (3, 3') is mounted and connected to the at least one waveguide component (2), characterized in that between the end (6) of the wave ^¬ conductor component (2) and the optical component (3, 3 ') at least one in a layer (9, 9') of optical material by Mehrphotononenabsorption structured interface optical waveguide (4, 4 ') is provided ,

2. printed circuit board element (1) according to claim 1, characterized marked ^¬ characterized in that the waveguide component (2) in its end region (6) has at least one marking (19)

is preferably formed of a reflective material.

3. printed circuit board element (1) according to any one of claims 1 and 2, characterized in that the waveguide component (2) on a flexible substrate (17) mounted planar waveguide structure (13) with at least one waveguide core (14) or has at least one optical fiber.

4. printed circuit board element (1) according to one of claims 1 to 3, characterized in that the waveguide component (2) is applied with its end on a separate substrate part (20) which is provided with at least one mark (19), wherein Preferably, the substrate part (20) at the same time forms a spacer element for height adjustment of the waveguide component (2) relative to the optical component (3).

5. printed circuit board element (1) according to one of claims 1 to 4, characterized in that the interface optical waveguide (4, 4 ') has a changing in the direction of the conductor cross-section.

6. printed circuit board element (1) according to one of claims 1 to 5, characterized in that the interface optical waveguide (4) as an optical component, e.g. as waveguide splitter (4A) or waveguide crossing (4B) is formed.

7. printed circuit board element (1) according to one of claims 1 to 6, characterized in that the waveguide component (2) comprises a waveguide array with a plurality of optical waveguide cores (14), wherein preferably a corresponding number and arrangement of interface optical waveguides (4) is provided.

8. printed circuit board element (1) according to one of claims 1 to 7, characterized in that the optical component (3, 3 ') is a photodiode or a light-emitting diode or a laser diode, preferably with deflecting mirror (8').

9. printed circuit board element (1) according to one of claims 1 to 7, characterized in that the optical component (3) is an optical connector (23).

10. A method for producing a printed circuit board element (1) according to any one of claims 1 to 9, characterized in that the waveguide component (2) on the substrate (5, 5 ') fixed and the substrate (5, 5') with the optical component (3, 3 '), after which the layer (9) of optical material is embedded on the substrate (5, 5) by embedding the optical component (3, 3') and the end (6) of the waveguide component (2). 5 ') is applied and therein the interface optical waveguide (4, 4') with the aid of a laser beam by Mehrphotonenabsorption struk ^¬ turiert.

11. The method according to claim 10, characterized in that the waveguide component (2) with its end (6) on the substrate (5, 5 ') is adhered.

12. The method according to claim 10 or 11, characterized in that the position of the end (6) of the waveguide component (2) and the position of the optical component (3, 3 ') by means of an optical system (18) are measured, after which of the interface optical fiber (4, 4 ') is patterned using the obtained Posi ^¬ tion signals, preferably in the end region (6) of the optic component (2) an optically detectable marker (19) is mounted.

13. The method according to claim 12, characterized in that the positions are measured before the layer (9) of opti- scheme material is applied.

14. The method according to claim 12, characterized in that the positions are measured after the application of the layer (9) of optical material.

15. The method according to any one of claims 12 to 14, characterized in that the end region (6) of the waveguide component (2) on a separate substrate part (20) is applied, which is provided with at least one mark (19) or was and that preferably the substrate part (20) is also used as a spacer element for adjusting the height of the end (6) of the waveguide component (2) with respect to the optical component (3).