WO2010131716A1 - 太陽電池封止材用シート及び太陽電池モジュール - Google Patents
太陽電池封止材用シート及び太陽電池モジュール Download PDFInfo
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- WO2010131716A1 WO2010131716A1 PCT/JP2010/058126 JP2010058126W WO2010131716A1 WO 2010131716 A1 WO2010131716 A1 WO 2010131716A1 JP 2010058126 W JP2010058126 W JP 2010058126W WO 2010131716 A1 WO2010131716 A1 WO 2010131716A1
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- Prior art keywords
- ethylene
- copolymer
- sheet
- solar cell
- mass
- Prior art date
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- 238000007789 sealing Methods 0.000 title abstract description 7
- 229920001577 copolymer Polymers 0.000 claims abstract description 114
- 239000005977 Ethylene Substances 0.000 claims abstract description 102
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims abstract description 101
- 239000004711 α-olefin Substances 0.000 claims abstract description 49
- 229920001038 ethylene copolymer Polymers 0.000 claims abstract description 32
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 claims abstract description 29
- 229920000089 Cyclic olefin copolymer Polymers 0.000 claims abstract description 21
- 238000002844 melting Methods 0.000 claims abstract description 20
- 230000008018 melting Effects 0.000 claims abstract description 20
- 238000000034 method Methods 0.000 claims abstract description 19
- 239000000470 constituent Substances 0.000 claims abstract description 10
- 229920001684 low density polyethylene Polymers 0.000 claims abstract description 8
- 239000004702 low-density polyethylene Substances 0.000 claims abstract description 8
- 239000003566 sealing material Substances 0.000 claims description 69
- 239000008393 encapsulating agent Substances 0.000 claims description 53
- -1 unsaturated silane compound Chemical class 0.000 claims description 49
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 claims description 34
- 239000000758 substrate Substances 0.000 claims description 23
- LIKMAJRDDDTEIG-UHFFFAOYSA-N n-hexene Natural products CCCCC=C LIKMAJRDDDTEIG-UHFFFAOYSA-N 0.000 claims description 16
- VXNZUUAINFGPBY-UHFFFAOYSA-N ethyl ethylene Natural products CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 claims description 10
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 9
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 claims description 9
- 229920000642 polymer Polymers 0.000 claims description 9
- AFFLGGQVNFXPEV-UHFFFAOYSA-N 1-decene Chemical compound CCCCCCCCC=C AFFLGGQVNFXPEV-UHFFFAOYSA-N 0.000 claims description 8
- JRZJOMJEPLMPRA-UHFFFAOYSA-N 1-nonene Chemical compound CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 claims description 8
- KWKAKUADMBZCLK-UHFFFAOYSA-N 1-octene Chemical compound CCCCCCC=C KWKAKUADMBZCLK-UHFFFAOYSA-N 0.000 claims description 8
- QHZOMAXECYYXGP-UHFFFAOYSA-N ethene;prop-2-enoic acid Chemical compound C=C.OC(=O)C=C QHZOMAXECYYXGP-UHFFFAOYSA-N 0.000 claims description 8
- YWAKXRMUMFPDSH-UHFFFAOYSA-N pentene Chemical compound CCCC=C YWAKXRMUMFPDSH-UHFFFAOYSA-N 0.000 claims description 8
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 claims description 7
- 125000005396 acrylic acid ester group Chemical group 0.000 claims description 5
- MOVRCMBPGBESLI-UHFFFAOYSA-N prop-2-enoyloxysilicon Chemical compound [Si]OC(=O)C=C MOVRCMBPGBESLI-UHFFFAOYSA-N 0.000 claims description 5
- UKRDPEFKFJNXQM-UHFFFAOYSA-N vinylsilane Chemical compound [SiH3]C=C UKRDPEFKFJNXQM-UHFFFAOYSA-N 0.000 claims description 5
- WSSSPWUEQFSQQG-UHFFFAOYSA-N dimethylbutene Natural products CC(C)CC=C WSSSPWUEQFSQQG-UHFFFAOYSA-N 0.000 claims description 4
- 239000000155 melt Substances 0.000 claims description 4
- TVMXDCGIABBOFY-UHFFFAOYSA-N n-Octanol Natural products CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 claims description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 3
- MHNNAWXXUZQSNM-UHFFFAOYSA-N 2-methylbut-1-ene Chemical compound CCC(C)=C MHNNAWXXUZQSNM-UHFFFAOYSA-N 0.000 claims description 3
- YHQXBTXEYZIYOV-UHFFFAOYSA-N 3-methylbut-1-ene Chemical compound CC(C)C=C YHQXBTXEYZIYOV-UHFFFAOYSA-N 0.000 claims description 3
- VQTUBCCKSQIDNK-UHFFFAOYSA-N Isobutene Chemical group CC(C)=C VQTUBCCKSQIDNK-UHFFFAOYSA-N 0.000 claims description 3
- 150000002148 esters Chemical class 0.000 claims description 3
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 abstract description 13
- 238000004132 cross linking Methods 0.000 abstract description 11
- 239000005038 ethylene vinyl acetate Substances 0.000 abstract description 6
- 238000010438 heat treatment Methods 0.000 abstract description 6
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 abstract description 6
- 229920006226 ethylene-acrylic acid Polymers 0.000 abstract description 4
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 abstract 2
- 239000011521 glass Substances 0.000 description 41
- 239000000463 material Substances 0.000 description 23
- 238000000465 moulding Methods 0.000 description 23
- 239000003963 antioxidant agent Substances 0.000 description 22
- 230000001681 protective effect Effects 0.000 description 22
- 229920005989 resin Polymers 0.000 description 22
- 239000011347 resin Substances 0.000 description 22
- 230000003078 antioxidant effect Effects 0.000 description 21
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 20
- 239000004611 light stabiliser Substances 0.000 description 19
- 239000000203 mixture Substances 0.000 description 18
- 239000000853 adhesive Substances 0.000 description 17
- 230000001070 adhesive effect Effects 0.000 description 17
- 229920000139 polyethylene terephthalate Polymers 0.000 description 17
- 239000005020 polyethylene terephthalate Substances 0.000 description 17
- 238000012545 processing Methods 0.000 description 16
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 8
- 229920000728 polyester Polymers 0.000 description 8
- 239000003431 cross linking reagent Substances 0.000 description 7
- 238000010248 power generation Methods 0.000 description 7
- 239000000654 additive Substances 0.000 description 6
- 238000007334 copolymerization reaction Methods 0.000 description 6
- 238000011156 evaluation Methods 0.000 description 6
- 239000012968 metallocene catalyst Substances 0.000 description 6
- MQWFLKHKWJMCEN-UHFFFAOYSA-N n'-[3-[dimethoxy(methyl)silyl]propyl]ethane-1,2-diamine Chemical compound CO[Si](C)(OC)CCCNCCN MQWFLKHKWJMCEN-UHFFFAOYSA-N 0.000 description 6
- 229920005604 random copolymer Polymers 0.000 description 6
- DMWVYCCGCQPJEA-UHFFFAOYSA-N 2,5-bis(tert-butylperoxy)-2,5-dimethylhexane Chemical compound CC(C)(C)OOC(C)(C)CCC(C)(C)OOC(C)(C)C DMWVYCCGCQPJEA-UHFFFAOYSA-N 0.000 description 5
- 239000011324 bead Substances 0.000 description 5
- 230000002349 favourable effect Effects 0.000 description 5
- 239000003063 flame retardant Substances 0.000 description 5
- 238000002156 mixing Methods 0.000 description 5
- 239000000178 monomer Substances 0.000 description 5
- 230000035699 permeability Effects 0.000 description 5
- 150000003254 radicals Chemical class 0.000 description 5
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 4
- HXLAEGYMDGUSBD-UHFFFAOYSA-N 3-[diethoxy(methyl)silyl]propan-1-amine Chemical compound CCO[Si](C)(OCC)CCCN HXLAEGYMDGUSBD-UHFFFAOYSA-N 0.000 description 4
- 125000004432 carbon atom Chemical group C* 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 230000006872 improvement Effects 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000011342 resin composition Substances 0.000 description 4
- 229910000077 silane Inorganic materials 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- ZYAASQNKCWTPKI-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propan-1-amine Chemical group CO[Si](C)(OC)CCCN ZYAASQNKCWTPKI-UHFFFAOYSA-N 0.000 description 3
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 3
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 3
- 125000003277 amino group Chemical group 0.000 description 3
- 239000003054 catalyst Substances 0.000 description 3
- 239000003086 colorant Substances 0.000 description 3
- 238000003851 corona treatment Methods 0.000 description 3
- 238000000113 differential scanning calorimetry Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229920001519 homopolymer Polymers 0.000 description 3
- 230000001965 increasing effect Effects 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- PHQOGHDTIVQXHL-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCN PHQOGHDTIVQXHL-UHFFFAOYSA-N 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- 239000003381 stabilizer Substances 0.000 description 3
- ZGEGCLOFRBLKSE-UHFFFAOYSA-N 1-Heptene Chemical compound CCCCCC=C ZGEGCLOFRBLKSE-UHFFFAOYSA-N 0.000 description 2
- VQOXUMQBYILCKR-UHFFFAOYSA-N 1-Tridecene Chemical compound CCCCCCCCCCCC=C VQOXUMQBYILCKR-UHFFFAOYSA-N 0.000 description 2
- CRSBERNSMYQZNG-UHFFFAOYSA-N 1-dodecene Chemical compound CCCCCCCCCCC=C CRSBERNSMYQZNG-UHFFFAOYSA-N 0.000 description 2
- ADOBXTDBFNCOBN-UHFFFAOYSA-N 1-heptadecene Chemical compound CCCCCCCCCCCCCCCC=C ADOBXTDBFNCOBN-UHFFFAOYSA-N 0.000 description 2
- GQEZCXVZFLOKMC-UHFFFAOYSA-N 1-hexadecene Chemical compound CCCCCCCCCCCCCCC=C GQEZCXVZFLOKMC-UHFFFAOYSA-N 0.000 description 2
- PJLHTVIBELQURV-UHFFFAOYSA-N 1-pentadecene Chemical compound CCCCCCCCCCCCCC=C PJLHTVIBELQURV-UHFFFAOYSA-N 0.000 description 2
- HFDVRLIODXPAHB-UHFFFAOYSA-N 1-tetradecene Chemical compound CCCCCCCCCCCCC=C HFDVRLIODXPAHB-UHFFFAOYSA-N 0.000 description 2
- DCTOHCCUXLBQMS-UHFFFAOYSA-N 1-undecene Chemical compound CCCCCCCCCC=C DCTOHCCUXLBQMS-UHFFFAOYSA-N 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 2
- JMCMBKXKEBELAE-UHFFFAOYSA-N 3-(3-aminopropyl-ethoxy-methylsilyl)oxybutan-1-amine Chemical compound NCCC[Si](C)(OCC)OC(C)CCN JMCMBKXKEBELAE-UHFFFAOYSA-N 0.000 description 2
- NRYVQNNLDURGON-UHFFFAOYSA-N 3-[2-aminoethyl(dimethoxy)silyl]propan-1-amine Chemical compound NCC[Si](OC)(OC)CCCN NRYVQNNLDURGON-UHFFFAOYSA-N 0.000 description 2
- LZMNXXQIQIHFGC-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propyl 2-methylprop-2-enoate Chemical compound CO[Si](C)(OC)CCCOC(=O)C(C)=C LZMNXXQIQIHFGC-UHFFFAOYSA-N 0.000 description 2
- MCDBEBOBROAQSH-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propyl prop-2-enoate Chemical compound CO[Si](C)(OC)CCCOC(=O)C=C MCDBEBOBROAQSH-UHFFFAOYSA-N 0.000 description 2
- KBQVDAIIQCXKPI-UHFFFAOYSA-N 3-trimethoxysilylpropyl prop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C=C KBQVDAIIQCXKPI-UHFFFAOYSA-N 0.000 description 2
- DQJPSHONLPIZKM-UHFFFAOYSA-N 4-methyl-n-(3-trimethoxysilylbutyl)pentan-2-imine Chemical compound CO[Si](OC)(OC)C(C)CCN=C(C)CC(C)C DQJPSHONLPIZKM-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 239000006096 absorbing agent Substances 0.000 description 2
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910021417 amorphous silicon Inorganic materials 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 150000001733 carboxylic acid esters Chemical class 0.000 description 2
- 239000012986 chain transfer agent Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000004581 coalescence Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000006482 condensation reaction Methods 0.000 description 2
- 230000002708 enhancing effect Effects 0.000 description 2
- 125000000816 ethylene group Chemical group [H]C([H])([*:1])C([H])([H])[*:2] 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 238000010559 graft polymerization reaction Methods 0.000 description 2
- 229910010272 inorganic material Inorganic materials 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- BYURCDANQKFTAN-UHFFFAOYSA-N n'-(3-dimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[SiH](OC)CCCNCCN BYURCDANQKFTAN-UHFFFAOYSA-N 0.000 description 2
- YLBPOJLDZXHVRR-UHFFFAOYSA-N n'-[3-[diethoxy(methyl)silyl]propyl]ethane-1,2-diamine Chemical compound CCO[Si](C)(OCC)CCCNCCN YLBPOJLDZXHVRR-UHFFFAOYSA-N 0.000 description 2
- NQKOSCFDFJKWOX-UHFFFAOYSA-N n-[3-[diethoxy(methyl)silyl]propyl]aniline Chemical compound CCO[Si](C)(OCC)CCCNC1=CC=CC=C1 NQKOSCFDFJKWOX-UHFFFAOYSA-N 0.000 description 2
- YZPARGTXKUIJLJ-UHFFFAOYSA-N n-[3-[dimethoxy(methyl)silyl]propyl]aniline Chemical compound CO[Si](C)(OC)CCCNC1=CC=CC=C1 YZPARGTXKUIJLJ-UHFFFAOYSA-N 0.000 description 2
- CCCMONHAUSKTEQ-UHFFFAOYSA-N octadec-1-ene Chemical compound CCCCCCCCCCCCCCCCC=C CCCMONHAUSKTEQ-UHFFFAOYSA-N 0.000 description 2
- 150000001451 organic peroxides Chemical class 0.000 description 2
- ZQBAKBUEJOMQEX-UHFFFAOYSA-N phenyl salicylate Chemical compound OC1=CC=CC=C1C(=O)OC1=CC=CC=C1 ZQBAKBUEJOMQEX-UHFFFAOYSA-N 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920000098 polyolefin Polymers 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- WGYKZJWCGVVSQN-UHFFFAOYSA-N propylamine Chemical compound CCCN WGYKZJWCGVVSQN-UHFFFAOYSA-N 0.000 description 2
- 239000007870 radical polymerization initiator Substances 0.000 description 2
- 230000009257 reactivity Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000011135 tin Substances 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- VRWOEFJNMPHSTD-UHFFFAOYSA-N (2-octoxyphenyl)-phenylmethanone Chemical compound CCCCCCCCOC1=CC=CC=C1C(=O)C1=CC=CC=C1 VRWOEFJNMPHSTD-UHFFFAOYSA-N 0.000 description 1
- VNFXPOAMRORRJJ-UHFFFAOYSA-N (4-octylphenyl) 2-hydroxybenzoate Chemical compound C1=CC(CCCCCCCC)=CC=C1OC(=O)C1=CC=CC=C1O VNFXPOAMRORRJJ-UHFFFAOYSA-N 0.000 description 1
- NOSXUFXBUISMPR-UHFFFAOYSA-N 1-tert-butylperoxyhexane Chemical compound CCCCCCOOC(C)(C)C NOSXUFXBUISMPR-UHFFFAOYSA-N 0.000 description 1
- MEZZCSHVIGVWFI-UHFFFAOYSA-N 2,2'-Dihydroxy-4-methoxybenzophenone Chemical compound OC1=CC(OC)=CC=C1C(=O)C1=CC=CC=C1O MEZZCSHVIGVWFI-UHFFFAOYSA-N 0.000 description 1
- FXNDIJDIPNCZQJ-UHFFFAOYSA-N 2,4,4-trimethylpent-1-ene Chemical compound CC(=C)CC(C)(C)C FXNDIJDIPNCZQJ-UHFFFAOYSA-N 0.000 description 1
- LHPPDQUVECZQSW-UHFFFAOYSA-N 2-(benzotriazol-2-yl)-4,6-ditert-butylphenol Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC(N2N=C3C=CC=CC3=N2)=C1O LHPPDQUVECZQSW-UHFFFAOYSA-N 0.000 description 1
- IYAZLDLPUNDVAG-UHFFFAOYSA-N 2-(benzotriazol-2-yl)-4-(2,4,4-trimethylpentan-2-yl)phenol Chemical compound CC(C)(C)CC(C)(C)C1=CC=C(O)C(N2N=C3C=CC=CC3=N2)=C1 IYAZLDLPUNDVAG-UHFFFAOYSA-N 0.000 description 1
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 1
- RUMACXVDVNRZJZ-UHFFFAOYSA-N 2-methylpropyl 2-methylprop-2-enoate Chemical compound CC(C)COC(=O)C(C)=C RUMACXVDVNRZJZ-UHFFFAOYSA-N 0.000 description 1
- CFVWNXQPGQOHRJ-UHFFFAOYSA-N 2-methylpropyl prop-2-enoate Chemical compound CC(C)COC(=O)C=C CFVWNXQPGQOHRJ-UHFFFAOYSA-N 0.000 description 1
- XTVRLCUJHGUXCP-UHFFFAOYSA-N 3-methyleneheptane Chemical compound CCCCC(=C)CC XTVRLCUJHGUXCP-UHFFFAOYSA-N 0.000 description 1
- LDTAOIUHUHHCMU-UHFFFAOYSA-N 3-methylpent-1-ene Chemical compound CCC(C)C=C LDTAOIUHUHHCMU-UHFFFAOYSA-N 0.000 description 1
- ZZLCFHIKESPLTH-UHFFFAOYSA-N 4-Methylbiphenyl Chemical compound C1=CC(C)=CC=C1C1=CC=CC=C1 ZZLCFHIKESPLTH-UHFFFAOYSA-N 0.000 description 1
- FETUUKHOLDNMQO-UHFFFAOYSA-N 6-benzoyl-1-hydroxy-3-methoxycyclohexa-2,4-diene-1-carboxylic acid Chemical compound C1=CC(OC)=CC(O)(C(O)=O)C1C(=O)C1=CC=CC=C1 FETUUKHOLDNMQO-UHFFFAOYSA-N 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical group [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229920002799 BoPET Polymers 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- 239000004594 Masterbatch (MB) Substances 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical class CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- HGNCQEFBTDZTAC-UHFFFAOYSA-N N-(3-dimethoxysilylbutyl)-4-methylpentan-2-imine Chemical compound CC(CCN=C(CC(C)C)C)[SiH](OC)OC HGNCQEFBTDZTAC-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 239000011954 Ziegler–Natta catalyst Substances 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- BGYHLZZASRKEJE-UHFFFAOYSA-N [3-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]-2,2-bis[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxymethyl]propyl] 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCC(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 BGYHLZZASRKEJE-UHFFFAOYSA-N 0.000 description 1
- GBTKXRHCGMUSDA-UHFFFAOYSA-N [SiH3]OC(=O)CCC=C Chemical compound [SiH3]OC(=O)CCC=C GBTKXRHCGMUSDA-UHFFFAOYSA-N 0.000 description 1
- KOOADCGQJDGAGA-UHFFFAOYSA-N [amino(dimethyl)silyl]methane Chemical compound C[Si](C)(C)N KOOADCGQJDGAGA-UHFFFAOYSA-N 0.000 description 1
- NOZAQBYNLKNDRT-UHFFFAOYSA-N [diacetyloxy(ethenyl)silyl] acetate Chemical compound CC(=O)O[Si](OC(C)=O)(OC(C)=O)C=C NOZAQBYNLKNDRT-UHFFFAOYSA-N 0.000 description 1
- AYIGWTYMCHDVTN-UHFFFAOYSA-N [dicarboxy(ethenyl)silyl]formic acid Chemical compound OC(=O)[Si](C=C)(C(O)=O)C(O)=O AYIGWTYMCHDVTN-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 238000011074 autoclave method Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 150000001565 benzotriazoles Chemical class 0.000 description 1
- MZJIRPYRADNXPV-UHFFFAOYSA-N bis(ethenyl)silane Chemical class C=C[SiH2]C=C MZJIRPYRADNXPV-UHFFFAOYSA-N 0.000 description 1
- 150000001649 bromium compounds Chemical class 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 238000012662 bulk polymerization Methods 0.000 description 1
- IAQRGUVFOMOMEM-UHFFFAOYSA-N butene Natural products CC=CC IAQRGUVFOMOMEM-UHFFFAOYSA-N 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- 229920005549 butyl rubber Polymers 0.000 description 1
- RPPBZEBXAAZZJH-UHFFFAOYSA-N cadmium telluride Chemical compound [Te]=[Cd] RPPBZEBXAAZZJH-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 150000007942 carboxylates Chemical class 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- UIPVMGDJUWUZEI-UHFFFAOYSA-N copper;selanylideneindium Chemical group [Cu].[In]=[Se] UIPVMGDJUWUZEI-UHFFFAOYSA-N 0.000 description 1
- 125000000058 cyclopentadienyl group Chemical group C1(=CC=CC1)* 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- OTARVPUIYXHRRB-UHFFFAOYSA-N diethoxy-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](C)(OCC)CCCOCC1CO1 OTARVPUIYXHRRB-UHFFFAOYSA-N 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 229940069096 dodecene Drugs 0.000 description 1
- MCPKSFINULVDNX-UHFFFAOYSA-N drometrizole Chemical compound CC1=CC=C(O)C(N2N=C3C=CC=CC3=N2)=C1 MCPKSFINULVDNX-UHFFFAOYSA-N 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- IYKVBPXFMRUBAM-UHFFFAOYSA-N ethene;4-methylpent-1-ene Chemical compound C=C.CC(C)CC=C IYKVBPXFMRUBAM-UHFFFAOYSA-N 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- PWOZXQOZUNMWKG-UHFFFAOYSA-N ethenyl(tripentoxy)silane Chemical compound CCCCCO[Si](OCCCCC)(OCCCCC)C=C PWOZXQOZUNMWKG-UHFFFAOYSA-N 0.000 description 1
- NNBRCHPBPDRPIT-UHFFFAOYSA-N ethenyl(tripropoxy)silane Chemical compound CCCO[Si](OCCC)(OCCC)C=C NNBRCHPBPDRPIT-UHFFFAOYSA-N 0.000 description 1
- MABAWBWRUSBLKQ-UHFFFAOYSA-N ethenyl-tri(propan-2-yloxy)silane Chemical compound CC(C)O[Si](OC(C)C)(OC(C)C)C=C MABAWBWRUSBLKQ-UHFFFAOYSA-N 0.000 description 1
- VYJZXBZFLIBVQA-UHFFFAOYSA-N ethenyl-tris(phenylmethoxy)silane Chemical compound C=1C=CC=CC=1CO[Si](OCC=1C=CC=CC=1)(C=C)OCC1=CC=CC=C1 VYJZXBZFLIBVQA-UHFFFAOYSA-N 0.000 description 1
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 1
- 238000012685 gas phase polymerization Methods 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 150000004677 hydrates Chemical class 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 150000002484 inorganic compounds Chemical class 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000011133 lead Substances 0.000 description 1
- 229920005679 linear ultra low density polyethylene Polymers 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- ARYZCSRUUPFYMY-UHFFFAOYSA-N methoxysilane Chemical compound CO[SiH3] ARYZCSRUUPFYMY-UHFFFAOYSA-N 0.000 description 1
- IDYKLTYEJOFYLG-UHFFFAOYSA-N methoxysilane 3-trimethoxysilylpropan-1-amine Chemical compound NCCC[Si](OC)(OC)OC.CO[SiH3] IDYKLTYEJOFYLG-UHFFFAOYSA-N 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- INJVFBCDVXYHGQ-UHFFFAOYSA-N n'-(3-triethoxysilylpropyl)ethane-1,2-diamine Chemical compound CCO[Si](OCC)(OCC)CCCNCCN INJVFBCDVXYHGQ-UHFFFAOYSA-N 0.000 description 1
- LIBWSLLLJZULCP-UHFFFAOYSA-N n-(3-triethoxysilylpropyl)aniline Chemical compound CCO[Si](OCC)(OCC)CCCNC1=CC=CC=C1 LIBWSLLLJZULCP-UHFFFAOYSA-N 0.000 description 1
- KBJFYLLAMSZSOG-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)aniline Chemical compound CO[Si](OC)(OC)CCCNC1=CC=CC=C1 KBJFYLLAMSZSOG-UHFFFAOYSA-N 0.000 description 1
- DRRZZMBHJXLZRS-UHFFFAOYSA-N n-[3-[dimethoxy(methyl)silyl]propyl]cyclohexanamine Chemical compound CO[Si](C)(OC)CCCNC1CCCCC1 DRRZZMBHJXLZRS-UHFFFAOYSA-N 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 150000007530 organic bases Chemical class 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- RPQRDASANLAFCM-UHFFFAOYSA-N oxiran-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CO1 RPQRDASANLAFCM-UHFFFAOYSA-N 0.000 description 1
- DXGLGDHPHMLXJC-UHFFFAOYSA-N oxybenzone Chemical compound OC1=CC(OC)=CC=C1C(=O)C1=CC=CC=C1 DXGLGDHPHMLXJC-UHFFFAOYSA-N 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 229960000969 phenyl salicylate Drugs 0.000 description 1
- AQSJGOWTSHOLKH-UHFFFAOYSA-N phosphite(3-) Chemical class [O-]P([O-])[O-] AQSJGOWTSHOLKH-UHFFFAOYSA-N 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 150000003902 salicylic acid esters Chemical class 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- SCPYDCQAZCOKTP-UHFFFAOYSA-N silanol Chemical compound [SiH3]O SCPYDCQAZCOKTP-UHFFFAOYSA-N 0.000 description 1
- 150000004819 silanols Chemical class 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- DLSMLZRPNPCXGY-UHFFFAOYSA-N tert-butylperoxy 2-ethylhexyl carbonate Chemical compound CCCCC(CC)COC(=O)OOOC(C)(C)C DLSMLZRPNPCXGY-UHFFFAOYSA-N 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- LLZRNZOLAXHGLL-UHFFFAOYSA-J titanic acid Chemical compound O[Ti](O)(O)O LLZRNZOLAXHGLL-UHFFFAOYSA-J 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- SGCFZHOZKKQIBU-UHFFFAOYSA-N tributoxy(ethenyl)silane Chemical compound CCCCO[Si](OCCCC)(OCCCC)C=C SGCFZHOZKKQIBU-UHFFFAOYSA-N 0.000 description 1
- UDUKMRHNZZLJRB-UHFFFAOYSA-N triethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OCC)(OCC)OCC)CCC2OC21 UDUKMRHNZZLJRB-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 description 1
- 229920001862 ultra low molecular weight polyethylene Polymers 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 description 1
- 150000003682 vanadium compounds Chemical class 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- 150000003755 zirconium compounds Chemical class 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/04—Homopolymers or copolymers of ethene
- C08L23/06—Polyethene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/04—Homopolymers or copolymers of ethene
- C08L23/08—Copolymers of ethene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/04—Homopolymers or copolymers of ethene
- C08L23/08—Copolymers of ethene
- C08L23/0807—Copolymers of ethene with unsaturated hydrocarbons only containing more than three carbon atoms
- C08L23/0815—Copolymers of ethene with aliphatic 1-olefins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/04—Homopolymers or copolymers of ethene
- C08L23/08—Copolymers of ethene
- C08L23/0846—Copolymers of ethene with unsaturated hydrocarbons containing other atoms than carbon or hydrogen atoms
- C08L23/0853—Vinylacetate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/04—Homopolymers or copolymers of ethene
- C08L23/08—Copolymers of ethene
- C08L23/0846—Copolymers of ethene with unsaturated hydrocarbons containing other atoms than carbon or hydrogen atoms
- C08L23/0869—Acids or derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/0481—Encapsulation of modules characterised by the composition of the encapsulation material
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Definitions
- the present invention relates to a solar cell encapsulant sheet for fixing a solar cell element in a solar cell module, and a solar cell module using the solar cell encapsulant sheet.
- Photovoltaic power generation converts solar energy directly into electric energy using a semiconductor (solar cell element) such as a silicon cell, but the function of the solar cell element used here is reduced when it directly contacts the outside air. . For this reason, the solar cell element is sandwiched between a sealing material or a protective film to prevent foreign substances from entering and moisture from entering together with buffering. Moreover, in order to provide sunlight to a solar cell element efficiently, the sealing material or the transparency of the protective film is required.
- an ethylene / vinyl acetate copolymer having a vinyl acetate content of 20 to 40% by mass is used as a main polymer, and a copolymer using ethylene, vinyl acetate and glycidyl (meth) acrylate as a secondary polymer, and an organic peroxide.
- the protection sheet for solar cell modules containing a thing is disclosed (for example, refer patent document 1).
- an unsaturated carboxylic acid ester is used instead of a commonly used ethylene / vinyl acetate copolymer. It has also been disclosed to form a blend containing a copolymer containing a protective sheet for a solar cell module (see, for example, Patent Document 2).
- the above ethylene / vinyl acetate copolymer tends to increase transparency and adhesion as the proportion of vinyl acetate increases, but has a property of increasing moisture permeability. Therefore, the adhesiveness to the upper transparent protective material and the back sheet may be lowered depending on the type of the upper transparent protective material and the back sheet arranged on the side where the sunlight is incident, the bonding conditions, the use environment of the solar cell, etc. There is.
- efforts are being made to prevent moisture by using a back sheet with a high humidity barrier property or sealing (sealing) the module periphery with a butyl rubber with a high humidity barrier property. . Therefore, if a sheet for solar cell encapsulant with higher moisture resistance is provided, these moisture prevention measures are reduced, and further long-term durability can be expected.
- the protection sheet for solar cell modules containing the ethylene-vinyl acetate copolymer of patent document 1 mentioned above, and the protection sheet for solar cell modules containing the copolymer containing unsaturated carboxylic acid ester of patent document 2 All contain organic peroxides that have a crosslinking action and require a crosslinking step. Therefore, it takes time when manufacturing a solar cell module, and improvement is demanded in terms of productivity. In order to improve productivity, it is conceivable to shorten the crosslinking time or to form a sheet that does not substantially require a crosslinking step.
- the present invention has been made to solve the above problems in view of the above situation. That is, Under the above circumstances, the cross-linking treatment is substantially unnecessary, and has adhesiveness and adhesion stability suitable for practical use without requiring heat treatment for cross-linking (particularly, adhesion to a back sheet made of resin such as polyester). There is a need for a solar cell encapsulant sheet. In addition, there is a need for a solar cell module that has more stable battery performance, superior durability, and higher productivity than conventional ones.
- the upper limit of the content ratio of the structural unit derived from vinyl acetate is 15% by mass, and the lower limit is not particularly limited, but the performance as an ethylene / vinyl acetate copolymer becomes clear.
- the upper limit of the content ratio of the structural unit derived from the ethylene / vinyl acetate copolymer (2a) acrylic ester of 5% by mass or more, preferably 1% by mass or more, particularly preferably 5% by mass or more is 15% by mass.
- the lower limit is not particularly limited, but since the performance as an ethylene / acrylate copolymer becomes clear, 0.5% by mass or more, preferably 1% by mass or more of ethylene / acrylic acid ester copolymer coalescence (3a) high-pressure low-density polyethylene (4a) density 0.895 g / cm 3 or more ethylene ⁇ alpha-olefin copolymer (5a) below (B) the ethylene copolymer (1b Ethylene glycidyl (meth) acrylate copolymer other than [(B) ethylene copolymer] (1b) Ethylene / glycidyl (meth) acrylate copolymer (2b)
- the upper limit of the content of the structural unit derived from vinyl acetate is 30% by mass, and the lower limit is not particularly limited, but ethylene / vinyl acetate / glycidyl ( Since the performance as a (meth) acrylate copolymer becomes clear, 0.1% by
- the melt flow rate (JIS K7210-1999, 190 ° C., 2160 g load) of the (A) ethylene copolymer and the (B) ethylene copolymer is 0.1 g / 10 min to 50 g / It is a sheet
- the (C) copolymer is the solar cell encapsulant sheet according to ⁇ 3>, further including a structural unit derived from at least one selected from vinyl acetate and acrylic ester. .
- the ethylene / ⁇ -olefin copolymer (4a) in the ethylene copolymer (A) is an ethylene / propylene copolymer, an ethylene / 1-butene copolymer, or ethylene / 4-methyl-1.
- the ⁇ -olefin in the copolymer (C) is ethylene, propylene, 1-butene, isobutylene, 1-pentene, 2-methyl-1-butene, 3-methyl-1-butene, 1-hexene,
- the sheet for solar cell encapsulant according to any one of ⁇ 3> to ⁇ 5>, wherein the sheet is at least one selected from 1-heptane, 1-octene, 1-nonene, and 1-decene.
- ⁇ 7> The solar cell encapsulant sheet according to any one of ⁇ 3> to ⁇ 6>, wherein the ethylenically unsaturated silane compound is selected from vinylsilane and (meth) acryloxysilane.
- ⁇ 8> The solar cell encapsulant sheet according to ⁇ 3> to ⁇ 7>, wherein the ethylenically unsaturated silane compound is vinyltrimethoxysilane or ⁇ -methacryloxypropyltrimethoxysilane.
- a solar cell module comprising at least a substrate on which sunlight is incident, a solar cell element, and the solar cell encapsulant sheet according to any one of ⁇ 1> to ⁇ 9>. is there.
- cross-linking treatment is substantially unnecessary, and adhesiveness and adhesion stability (especially adhesion to a back sheet made of a resin such as polyester) suitable for practical use without requiring heat treatment for cross-linking.
- seat for solar cell sealing materials can be provided.
- the sheet for solar cell encapsulant of the present invention is selected from (A) an ethylene polymer containing a structural unit derived from ethylene having a melting point of 90 ° C. or higher and selected from the specific polymers (1a to 5a) described later. At least one ((A) ethylene copolymer; hereinafter also referred to as component A) and (B) at least one selected from the specific polymers (1b to 3b) described later ((B) ethylene copolymer). Polymer; hereinafter also referred to as component B).
- the component B is preferably an ethylene copolymer in which the content of structural units derived from glycidyl (meth) acrylate is 2% by mass to 30% by mass.
- the solar cell encapsulant sheet has the above-described configuration, so that it has adhesiveness and adhesion as compared with a solar cell encapsulant sheet made of an ethylene / vinyl acetate copolymer conventionally used. Stability is improved, and particularly the back sheet, which is a protective material made of resin such as polyester, is improved. In addition, the solar cell encapsulant sheet does not need to be cross-linked in order to impart heat resistance unlike the conventional sheet for solar cell encapsulant made of an ethylene / vinyl acetate copolymer, and is shorter. Solar cell modules can be produced in time.
- the ethylene-based copolymer having a melting point of 90 ° C. or higher which is the component (A) constituting the solar cell encapsulant sheet of the present invention, includes (1a) ethylene / vinyl acetate copolymer, (2a) ethylene. Acrylate ester copolymer, (3a) high pressure method low density polyethylene, (4a) ethylene / ⁇ -olefin copolymer.
- the ethylene-based copolymer includes an ethylene / glycidyl (meth) acrylate copolymer (5a) other than the ethylene / glycidyl (meth) acrylate copolymer (1b) defined in (B) ethylene-based copolymer. Can be used.
- the ethylene-based copolymer includes an ethylene-based copolymer having a melting point of 90 ° C.
- an ethylene-based copolymer containing a structural unit derived from glycidyl (meth) acrylate for example, the content of which exceeds 30% by mass.
- the “ethylene copolymer” in the component (A) means that a structural unit derived from ethylene is a main component. Furthermore, the “main component” here means that the proportion of “ethylene-derived structural unit” is 85% by mass or more, preferably 88% by mass or more, with respect to all the structural units. At this time, the ethylene-based copolymer can further include other monomer units other than ethylene (for example, vinyl acetate, acrylate ester, etc.).
- the content rate of the structural unit derived from vinyl acetate is a 15 mass% or less thing.
- the content ratio of structural units derived from vinyl acetate in the ethylene / vinyl acetate copolymer 15% by mass or less, moisture permeability of the sheet for solar cell encapsulant can be suppressed, and it is derived from vinyl acetate.
- the content ratio of the structural unit to be reduced is smaller.
- the content of the structural unit derived from vinyl acetate is more preferably 14% by mass or less, and further preferably 12% by mass or less.
- the lower limit of the content ratio of the structural unit derived from vinyl acetate is 0.5% by mass or more, preferably 1% by mass or more, particularly preferably 5% by mass or more.
- the content of the structural unit derived from ethylene in the ethylene / vinyl acetate copolymer in the component (A) is preferably 99.5% by mass to 85% by mass, 99% by mass to 86% by mass, In particular, it is more preferably 95% by mass to 88% by mass.
- the content ratio of the structural unit derived from ethylene is within the above range, the heat resistance of the copolymer is good.
- “vinyl acetate” may be abbreviated as VA
- “content ratio of structural units derived from vinyl acetate” may be abbreviated as VA content.
- the high-pressure low-density polyethylene (3a) is commercially available as a polyethylene having a long chain branch obtained by radical polymerization of ethylene under high pressure.
- the content rate of the structural unit derived from an acrylic acid ester is a 15 mass% or less thing.
- the content of the structural unit derived from the acrylic ester in the ethylene / acrylic ester copolymer is 15% by mass or less, moisture permeability of the sheet for solar cell encapsulant can be suppressed, and acrylic acid
- the content ratio of the structural unit derived from the ester is smaller.
- the content ratio of the structural unit derived from the acrylate ester is more preferably 14% by mass or less, and further preferably 12% by mass or less.
- the lower limit of the content ratio of the structural unit derived from the acrylate ester is 0.1% by mass or more, preferably 0.5% by mass or more, and more preferably 1% by mass or more.
- the content ratio of the structural unit derived from ethylene in the ethylene / acrylic acid ester copolymer is preferably 99.9% by mass to 85% by mass, more preferably 99.5% by mass to 86% by mass, Is more preferably 99% by mass to 88% by mass.
- acrylic ester constituting the ethylene / acrylic ester copolymer (2a) examples include methyl acrylate, ethyl acrylate, isobutyl acrylate, n-butyl acrylate, 2-ethylhexyl acrylate, and methyl methacrylate. And (meth) acrylic acid esters such as isobutyl methacrylate.
- the ethylene / vinyl acetate copolymer, the ethylene / acrylic ester copolymer, and the high-pressure low-density polyethylene may all be produced by a conventionally known high-pressure autoclave method or tubular method.
- the ethylene / ⁇ -olefin copolymer (4a) in the component (A) has 3 carbon atoms when the content of all structural units (monomer units) constituting the copolymer is 100 mol%. It is preferable that the content ratio of structural units derived from ⁇ -olefin of ⁇ 20 is 5 mol% or more. More preferably, it is 10 mol% or more. When the content of the structural unit derived from the ⁇ -olefin is within the above range, the solar cell encapsulant sheet has good transparency and bleed resistance.
- a polymer having a content ratio of the ⁇ -olefin-derived structural unit of 15 mol% or more is preferable to use.
- a content ratio of the ⁇ -olefin-derived structural unit is 15 mol% or more.
- ⁇ -olefin having 3 to 20 carbon atoms examples include propylene, 1-butene, 1-pentene, 1-hexene, 1-heptene, 1-octene, 1-nonene, 1-decene and 1-undecene.
- Linear ⁇ -olefins such as 1-dodecene, 1-tridecene, 1-tetradecene, 1-pentadecene, 1-hexadecene, 1-heptadecene, 1-octadecene, 1-nanodecene, 1-eicocene;
- Examples include branched ⁇ -olefins such as 1-butene, 3-methyl-1-pentene, 4-methyl-1-pentene, 2-ethyl-1-hexene, and 2,2,4-trimethyl-1-pentene. These can also be used in combination of two types.
- the number of carbon atoms of the ⁇ -olefin is preferably 3 to 10, more preferably 3 to 8, in view of versatility (cost, mass productivity, or availability).
- the ethylene / ⁇ -olefin copolymer is preferably an ethylene / propylene copolymer, an ethylene / 1-butene copolymer, an ethylene / 4-methyl-1-pentene copolymer, or an ethylene / 1-hexene copolymer. This means that any ethylene / ⁇ -olefin copolymer has an ethylene-derived constituent unit content of 50 mol% or more.
- the proportion of the structural unit derived from ⁇ -olefin is preferably 5% by mole or more when the amount of all structural units (monomer units) constituting each copolymer is 100% by mole. More preferably, it is 10 mol% or more.
- the ethylene / ⁇ -olefin copolymer may be used singly or in combination of two or more.
- the ethylene / ⁇ -olefin copolymer (4a) having the above properties can be produced by a slurry polymerization method, a solution polymerization method, a bulk polymerization method, a gas phase polymerization method or the like using a metallocene catalyst.
- the catalyst include JP-A-58-19309, JP-A-60-35005, JP-A-60-35006, JP-A-60-35007, and JP-A-60-35008.
- the ethylene / ⁇ -olefin copolymer is not only a metallocene catalyst, but also a vanadium catalyst comprising a soluble vanadium compound and an organoaluminum halide, or a metallocene compound such as a zirconium compound coordinated with a cyclopentadienyl group or the like. It can also be produced by copolymerizing ethylene and other ⁇ -olefins in the presence of a metallocene catalyst comprising an organoaluminum oxy compound.
- the ethylene / ⁇ -olefin copolymer produced by the above production method is substantially linear and rigid.
- the density of the ethylene / ⁇ -olefin copolymer (4a) is 0.895 g / cm 3 or more.
- the density of the ethylene / ⁇ -olefin copolymer is 0.895 g / cm 3 or more, the heat resistance is improved, and the solar cell encapsulant sheet of the present invention is used by being incorporated in a solar cell module.
- the function can be maintained as a sealing material even in a severe external environment.
- a more preferable embodiment of the ethylene / ⁇ -olefin copolymer is a linear ultra-low density or low density polyethylene having a density of 0.895 g / cm 3 or more produced by a Ziegler-Natta catalyst or a metallocene catalyst. While the "ultra low density” and “low density” are known various definitions, in this case, “very low density is 0.895 g / cm 3 to less than 0.910 g / cm 3", “low density 0.910 g / cm 3 or more and 0.930 g / cm 3 or less ”. Since the ethylene / ⁇ -olefin copolymer as the component (A) is ultra-low density or low density polyethylene, heat resistance and adhesiveness are also improved.
- the sheet for a solar cell encapsulant containing the ethylene / ⁇ -olefin copolymer when the sheet for a solar cell encapsulant containing the ethylene / ⁇ -olefin copolymer is incorporated into a solar cell module and used, the sheet for solar cell encapsulant and the substrate, back sheet or solar cell Good adhesion to the array and can withstand use in harsh external environments.
- the ethylene-based copolymer is a content ratio of at least one constituent unit derived from vinyl acetate in that the moisture permeability of the solar cell encapsulant sheet is further suppressed. Is 15% by mass or less of ethylene / vinyl acetate copolymer (1a), or ethylene / acrylic acid ester copolymer (2a) having a content of structural units derived from acrylic acid ester of 15% by mass or less. Is preferred.
- the component (A) is an ethylene / vinyl acetate copolymer (1a) or an ethylene / acrylic acid ester copolymer in terms of enhancing adhesion to glass or a polyester sheet that is a constituent member of a solar cell module.
- Combined (2a) is more preferred.
- the ethylene copolymer has a melting point of 90 ° C. or higher. When the melting point is less than 90 ° C., the heat resistance of the sheet is insufficient.
- the melting point is preferably 94 ° C. or higher for the same reason as described above.
- the upper limit is preferably 120 ° C.
- the melting point of each copolymer in the present invention is a value measured by DSC (differential scanning calorimetry).
- the ethylene copolymer as the component (A) one kind selected from the above-mentioned (1a) to (5a) can be used alone or in combination of two or more kinds.
- the content of the ethylene copolymer in the solar cell encapsulant sheet is preferably 40% by mass to 90% by mass and more preferably 50% by mass to 80% by mass with respect to the total mass of the sheet. . When the content of the ethylene copolymer is within the above range, the heat resistance of the sheet can be further increased.
- the ethylene copolymer ((B) ethylene copolymer) as the component (B) constituting the solar cell encapsulant sheet of the present invention is (1b) an ethylene / glycidyl (meth) acrylate copolymer, (2b) Glycidyl (meth) selected from ethylene / vinyl acetate / glycidyl (meth) acrylate copolymer and (3b) ethylene / acrylic acid ester / glycidyl (meth) acrylate copolymer, and (B) the whole component
- the total content of the structural units derived from acrylate is preferably 2% by mass to 30% by mass (preferably 3% by mass to 25% by mass).
- the adhesion between the solar cell encapsulant sheet and the solar cell module constituent member is further improved.
- the crosslinkability is not too high and the adhesiveness is better, and in addition, the transparency and flexibility of the solar cell encapsulant sheet are also better.
- GMA glycidyl methacrylate
- GMA content glycidyl methacrylate
- the ethylene copolymer (B) preferably has a total content of structural units derived from glycidyl (meth) acrylate of 2% by mass to 30% by mass and has a melting point of 90 ° C. or higher. Copolymers are also included.
- the “ethylene copolymer” in the component (B) means that a structural unit derived from ethylene is a main component.
- the “main component” here means that the content of “structural unit derived from ethylene” is the largest among all the structural units.
- the proportion of the structural units derived from ethylene is the structural unit derived from vinyl acetate or glycidyl (meth). It is larger than the structural unit derived from acrylate.
- At least one of the (B) ethylene-based copolymer is (1b) an ethylene / glycidyl (meth) acrylate copolymer and (2b) ethylene / ethylene having a content ratio of structural units derived from vinyl acetate of 30% by mass or less.
- the content ratio of the structural unit derived from vinyl acetate or the structural unit derived from the acrylate ester is 30% by mass or less, respectively.
- the moisture permeability of the material sheet can be suppressed.
- the lower limit of the content ratio of the structural unit derived from vinyl acetate or the structural unit derived from acrylic acid ester is not particularly limited, but is 0.1% by mass or more, preferably 0.5% by mass or more, and more preferably 1 The mass% or more is desirable.
- the content ratio of the structural unit derived from vinyl acetate or the structural unit derived from the acrylate is preferably in the range of 0.1 to 30% by mass, more preferably 0.5 to 20% by mass, particularly 1 to 20% by mass. % Range is preferred.
- ethylene copolymer As the ethylene copolymer, one kind selected from the above-mentioned (1b) to (3b) can be used alone or in combination of two or more kinds having different copolymerization ratios.
- the content of the ethylene copolymer in the solar cell encapsulant sheet is 5 to 50 masses, where the total amount with the ethylene copolymer (A) defined above is 100 mass%. % Is preferable, and 8 to 30% by mass is more preferable.
- (B) When the content of the ethylene-based copolymer is within the above range, transparency, flexibility and processability are imparted, and adhesiveness and adhesion stability (particularly, a protective material made of resin such as polyester, for example, Adhesiveness to the back sheet can be improved.
- the solar cell encapsulant sheet containing the component (A) and the component (B) in the present invention has another advantage that it has a high melting point or softening point and is excellent in heat resistance.
- seat for solar cell sealing materials containing the said (A) component in the present invention and the said (B) component is in the said compounding range, a restriction
- it is preferably 0.1 to 10% by mass, more preferably 0.3 to 5% by mass, and particularly preferably 0.5 to 3% by mass.
- the component (A) and the component (B) constituting the solar cell encapsulant sheet of the present invention are both melt flow rate (JIS K7210-1999, 190 ° C., 2160 g load; hereinafter abbreviated as MFR). Is preferably in the range of 0.1 g / 10 min to 50 g / 10 min. Further, it is preferably in the range of 0.5 g / 10 min to 30 g / 10 min, and particularly preferably in the range of 1 g / 10 min to 20 g / 10 min. By selecting a copolymer within this range, processability to a sheet required as a solar cell encapsulant sheet is facilitated, and a desired sheet can be obtained. As a result, when the solar cell module is produced, good adhesiveness and an unnecessary effect of suppressing creaking can be obtained.
- MFR melt flow rate
- the solar cell encapsulant sheet of the present invention is obtained by copolymerizing (C) at least an ⁇ -olefin and an ethylenically unsaturated silane compound in addition to the components (A) and (B). It may contain at least one selected from the group consisting of a copolymer (hereinafter also referred to as component (C)) and (D) a silane coupling agent (hereinafter also referred to as component (D)). Good.
- the component (C) contains at least an ⁇ -olefin and an ethylenically unsaturated silane compound as a constituent unit of the copolymer, and may further contain other constituent units as necessary.
- Examples of such component (C) include those obtained by direct copolymerization of at least an ⁇ -olefin and an ethylenically unsaturated silane compound, and at least an ⁇ -olefin containing a homopolymer or an ethylenically unsaturated silane compound.
- Examples thereof include those obtained by graft polymerization of styrene, and a condensation reaction product of a homopolymer or copolymer containing at least an ⁇ -olefin and an ethylenically unsaturated silane compound.
- one or more ⁇ -olefins, one or more ethylenically unsaturated silane compounds, and, if necessary, other structural units are used in a desired reaction vessel.
- random copolymerization was carried out simultaneously or stepwise in the presence of a radical polymerization initiator and, if necessary, a chain transfer agent, under conditions of a pressure of 500 kg / cm 2 to 4000 kg / cm 2 and a temperature of 100 ° C. to 400 ° C. Things can be mentioned.
- one or more ⁇ -olefins and, if necessary, one or more other unsaturated monomers using a desired reaction vessel, a radical polymerization initiator and if necessary Polymerization is carried out simultaneously or stepwise in the presence of a chain transfer agent, and then the polyolefin polymer produced by the polymerization is converted into an ethylenically unsaturated silane compound or one or two of its initial condensates or condensates.
- species can be mentioned.
- the ⁇ -olefin in the copolymer (C) in addition to ethylene, the ⁇ -olefin having 3 to 20 carbon atoms described in the description of the (A) ethylene copolymer can be used.
- the ⁇ -olefin in the copolymer (C) includes ethylene, propylene, 1-butene, isobutylene, 1-pentene, 2-methyl-1-butene, from the viewpoint of bleed resistance, processability, and cost. 3-Methyl-1-butene, 1-hexene, 1-heptane, 1-octene, 1-nonene, and 1-decene are preferable, and ethylene, propylene, and 1-butene are more preferable.
- the ⁇ -olefin in the copolymer may be a single species or a plurality of species.
- the ethylenically unsaturated silane compound in the copolymer includes vinyltrimethoxysilane, vinyltriethoxysilane, vinyltripropoxysilane, vinyltriisopropoxysilane, vinyltributoxysilane, vinyltripentyloxysilane, vinyl Vinyl silanes such as triphenoxysilane, vinyltribenzyloxysilane, vinyltrimethylenedioxysilane, vinyltriethylenedioxysilane, vinylpropionyloxysilane, vinyltriacetoxysilane, vinyltricarboxysilane,
- (meth) acryloxysilane such as ⁇ -methacryloxypropyltrimethoxysilane, ⁇ -methacryloxypropylmethyldimethoxysilane, ⁇ -acryloxypropyltrimethoxysilane, ⁇ -acryloxypropylmethyldimethoxysilane,
- vinylsilane such as vinyltrimethoxysilane, (meth) acryloxysilane such as ⁇ -methacryloxypropyltrimethoxysilane, or N-2 (aminoethyl) 3-aminopropylmethyldimethoxysilane, N-2 ( Preferred examples thereof include alkoxysilanes having amino groups or epoxy groups such as (aminoethyl) 3-aminopropylmethyldiethoxysilane, 3-aminopropylmethyldimethoxysilane, and 3-aminopropylmethyldiethoxysilane. Furthermore, vinylsilane or (meth) acryloxysilane is preferably used.
- the ethylenically unsaturated silane compound in the copolymer may be a single species or a plurality of species.
- the ethylenically unsaturated silane compound is selected from the above-mentioned compounds.
- vinylsilane is preferably used, and among the above-listed compounds, vinyltrimethoxysilane and ⁇ -methacryloxypropyl are particularly preferable. Trimethoxysilane is preferred.
- the copolymer (C) is at least one selected from other structural units, for example, vinyl acetate, acrylate esters, and glycidyl (meth) acrylates, in addition to the ⁇ -olefin and the ethylenically unsaturated silane compound. You may contain the structural unit derived from.
- Such a copolymer can be produced, for example, by graft copolymerizing the ethylenically unsaturated silane compound with the component (A) and / or the component (B).
- (C) As a method of condensing the structural units based on the ethylenically unsaturated silane compound in the copolymer, metal carboxylates such as tin, zinc, iron, lead and cobalt, organic compounds such as esters of titanic acid and chelates Using a silanol condensation catalyst such as a metal compound, an organic base, an inorganic acid, and an organic acid, the condensate is obtained by performing a dehydration condensation reaction between silanols of the silane compound portion constituting the copolymer (C). Can be manufactured.
- metal carboxylates such as tin, zinc, iron, lead and cobalt
- organic compounds such as esters of titanic acid and chelates
- a silanol condensation catalyst such as a metal compound, an organic base, an inorganic acid, and an organic acid
- molding 15 parts by mass or less, preferably 0.03 to 14 parts by mass, particularly preferably 0.1 to 12 parts by mass with respect to parts by mass. It is preferable that the component (C) is contained within the above range because the adhesion between the solar cell encapsulant sheet and the protective material or solar cell element is improved.
- the silane coupling agent as component (D) includes ⁇ -methacryloxypropyltrimethoxysilane, ⁇ -methacryloxypropylmethyldimethoxysilane, ⁇ -acryloxypropyltrimethoxysilane, and ⁇ -acryloxypropylmethyldimethoxysilane.
- N- ( ⁇ -aminoethyl) - ⁇ -aminopropyltrimethoxysilane, N- ( ⁇ -aminoethyl) - ⁇ -aminopropylmethyldimethoxysilane, ⁇ -aminopropyltriethoxysilane, ⁇ -glycidoxypropyltri A methoxysilane etc. can be illustrated.
- silane coupling agent (D) an alkoxysilane containing an amino group is preferable in terms of enhancing adhesion and stably performing adhesion processing with a protective material such as a substrate such as glass or a back sheet.
- alkoxysilane containing an amino group examples include amino-trimethylsilane such as 3-aminopropyltrimethoxyxysilane, 3-aminopropyltriethoxysilane, and N- ( ⁇ -aminoethyl) - ⁇ -aminopropyltrimethoxyxysilane.
- Alkoxysilanes N- ( ⁇ -aminoethyl) - ⁇ -aminopropylmethyldimethoxysilane, N- ( ⁇ -aminoethyl) - ⁇ -aminopropylmethyldiethoxysilane, N- ( ⁇ -aminoethyl) - ⁇ - Aminopropyldimethoxysilane, 3-aminopropylmethyldimethoxysilane, 3-aminopropylmethyldiethoxysilane, N-phenyl-3-aminopropylmethyldimethoxysilane, N-phenyl-3-aminopropylmethyldiethoxysilane, 3-methyl Dimethoxysilyl-N- (1,3 And amino-dialkoxysilanes such as -dimethyl-butylidene) propylamine and 3-methyldimethoxysilyl-N- (1,3-dimethyl-butylidene) propylamine.
- 3-aminopropyltrimethoxyxysilane, N- ( ⁇ -aminoethyl) - ⁇ -aminopropyltrimethoxyxysilane, and N- ( ⁇ -aminoethyl) - ⁇ -aminopropylmethyldimethoxysilane are preferable.
- trialkoxysilane it is preferable because adhesion can be further improved.
- dialkoxysilane it is preferable because processing stability during sheet forming can be maintained.
- the alkoxysilane can be used singly or in combination of two or more.
- said (D) component and said (B) component 3 parts by weight or less, preferably 0.03 to 3 parts by weight, particularly preferably 0.05 to 1.5 parts by weight, based on a total amount of 100 parts by weight.
- the silane coupling agent is contained in the above range, the adhesion between the solar cell encapsulant sheet and the protective material or solar cell element is preferably improved.
- an ultraviolet absorber, a light stabilizer, an antioxidant and the like are contained in at least one of the component (A) and the component (B). preferable.
- Examples of the ultraviolet absorber include 2-hydroxy-4-methoxybenzophenone, 2,2′-dihydroxy-4-methoxybenzophenone, 2-hydroxy-4-methoxy-2-carboxybenzophenone, and 2-hydroxy-4- benzophenone series such as n-octoxybenzophenone; 2- (2′-hydroxy-3 ′, 5′-di-t-butylphenyl) benzotriazole, 2- (2′-hydroxy-5-methylphenyl) benzotriazole, And benzotriazoles such as 2- (2′-hydroxy-5-t-octylphenyl) benzotriazole; salicylic acid esters such as phenyl salicylate and p-octylphenyl salicylate.
- Examples of the light stabilizer include hindered amines.
- Examples of the antioxidant include various hindered phenols and phosphites.
- the antioxidant, light stabilizer, and ultraviolet absorber are each usually 5 parts by mass or less, preferably 0.1 parts by mass to 100 parts by mass of the total amount of the component (A) and the component (B). It can be contained in an amount of 3 parts by mass.
- additives such as a coloring agent, a light-diffusion agent, and a flame retardant
- the colorant include pigments, inorganic compounds, and dyes.
- white colorants include titanium oxide, zinc oxide, and calcium carbonate.
- the light diffusing agent include glass beads, silica beads, silicon alkoxide beads, and hollow glass beads as inorganic spherical substances, and plastic beads such as acrylic and vinyl benzene series as organic spherical substances. Is mentioned.
- the flame retardant examples include halogen flame retardants such as bromides, phosphorus flame retardants, silicone flame retardants, and metal hydrates such as magnesium hydroxide and aluminum hydroxide.
- halogen flame retardants such as bromides, phosphorus flame retardants, silicone flame retardants, and metal hydrates such as magnesium hydroxide and aluminum hydroxide.
- the total thickness of the solar cell encapsulant sheet is preferably in the range of 0.05 mm to 2 mm. That is, if the total thickness of the sheet is 0.05 mm or more, damage to the solar cell element due to impact or the like is suppressed, and if it is 2 mm or less, the sheet has transparency and the amount of received sunlight can be maintained. The output can be kept high.
- the solar cell encapsulant sheet of the present invention can be molded by a known method using a T-die extruder, a calendar molding machine, an inflation molding machine or the like.
- the above components (A) to (D) and additives such as antioxidants, light stabilizers and ultraviolet absorbers are dry blended in advance and supplied from the hopper of the extruder, and extruded into a sheet form. Can be obtained.
- at least one of the component (C) and the component (D) and additives such as an antioxidant, a light stabilizer, and an ultraviolet absorber are dried.
- component (C) and additives such as an antioxidant, a light stabilizer, and an ultraviolet absorber can be added in advance as a master batch.
- the processing temperature can be selected according to the processability of the components used in the range of 120 ° C to 250 ° C.
- the solar cell module of the present invention includes at least a substrate on which sunlight is incident, a solar cell element, and the solar cell encapsulant sheet of the present invention.
- the solar cell module of the present invention may further include a protective material as necessary.
- a substrate on which sunlight is incident may be simply referred to as a substrate.
- the solar cell module of this invention can be manufactured by fixing the solar cell element sealed with the sheet
- Examples of such solar cell modules include various types. For example, on a surface of a substrate such as a glass, glass, or the like that is sandwiched between sheets of a sealing material from both sides of the solar cell element, such as a substrate / a sheet for a sealing material / a solar cell element / a sheet for a sealing material / a protective material
- an amorphous solar cell element formed by sputtering or the like may be used to form a sealing material sheet and a protective material.
- the said protective material is provided in the opposite side to the board
- Solar cell elements include silicon-based materials such as single crystal silicon, polycrystalline silicon, and amorphous silicon, III-V groups such as gallium-arsenic, copper-indium-selenium, copper-indium-gallium-selenium, cadmium-tellurium, and II.
- Various solar cell elements such as a group VI compound semiconductor can be used.
- seat for sealing materials of this invention is especially useful for sealing of an amorphous silicon solar cell element.
- the substrate constituting the solar cell module examples include glass, acrylic resin, polycarbonate, polyester, fluorine-containing resin, and the like.
- the protective material (lower protective material) is a single or multi-layer sheet such as metal or various thermoplastic resin films, for example, metals such as tin, aluminum, stainless steel, inorganic materials such as glass, polyester, inorganic vapor-deposited polyester, etc. And a single-layer or multilayer sheet of fluorine-containing resin, polyolefin and the like.
- seat for solar cell sealing materials of this invention shows favorable adhesiveness with respect to these board
- the sheet for solar cell encapsulant of the present invention When using the sheet for solar cell encapsulant of the present invention and laminating and bonding together with the solar cell element, the substrate and the protective material as described above, it has been carried out with a conventional ethylene / vinyl acetate copolymer system. Even without being subjected to a cross-linking step by pressurization and heating over time, it is possible to impart adhesive strength that can withstand practical use and long-term stability of adhesive strength. However, from the viewpoint of imparting stronger adhesive strength and adhesive strength stability, it is recommended to perform pressurizing and heating treatment for a short time.
- Table 1 shows the physical properties of A-1 to A-7.
- the melting point is measured by DSC defined by JIS K7121, the unit is [° C.]
- the density is measured by the method defined by JIS K7112, the unit is [g / cm 3 ]
- the MFR is JIS. It is measured under the conditions of 190 ° C. and a load of 2160 g by the method defined by K7210, and the unit is [g / 10 min].
- the unit of VA content is [% by mass], which is the content in each copolymer.
- ⁇ (B) component> (B-1) Ethylene / glycidyl methacrylate / vinyl acetate copolymer (EGMAVA) Manufactured by Sumitomo Chemical Co., Ltd., Bond First 7B (B-2) Ethylene glycidyl methacrylate copolymer (EGMA) Bond First E, manufactured by Sumitomo Chemical Co., Ltd.
- Table 2 shows the physical properties of B-1 and B-2.
- the unit of melting point is [° C.]
- the unit of density is [g / cm 3 ]
- the unit of MFR is [g / 10 min].
- the unit of GMA content and VA content is [mass%], both of which are the contents in each copolymer.
- ⁇ (C) component> (C-1) (A-4) 100 parts by mass, 2 parts by mass of vinyltrimethoxysilane, 0.1 part by mass of a free radical generator (2,5-dimethyl-2,5-di (t-butylperoxy) hexane)
- C-2) (A-5) 100 parts by mass, 2 parts by mass of vinyltrimethoxysilane, 0.1 part by mass of a free radical generator (2,5-dimethyl-2,5-di (t-butylperoxy) hexane)
- a silane-modified EVA copolymer obtained by mixing and graft-copolymerizing with a single screw extruder at a melting temperature of 220 ° C.
- (C-3) (A-7) 50 parts by mass, (B-2) 50 parts by mass, vinyltrimethoxysilane 2.5 parts by mass, free radical generator (2,5-dimethyl-2,5-di (t- (Butylperoxy) hexane) 0.1 part by mass and a silane-modified product obtained by silane modification by graft copolymerization at a melting temperature of 220 ° C. using a single screw extruder.
- (C-4) (A-7) 100 parts by mass, 2.5 parts by mass of vinyltrimethoxysilane, and 0.1 parts by mass of a free radical generator (2,5-dimethyl-2,5-di (t-butylperoxy) hexane)
- a free radical generator (2,5-dimethyl-2,5-di (t-butylperoxy) hexane)
- a silane-modified ethylene / 1-hexene copolymer which is silane-modified by mixing with a part and graft copolymerizing with a single screw extruder at a melting temperature of 220 ° C.
- (C-5) (A-6) 50 parts by mass, (B-1) 50 parts by mass, ⁇ -methacryloxypropyltrimethoxysilane 2 parts by mass, free radical generator (2,5-dimethyl-2,5-di ( (t-butylperoxy) hexane) 0.1 part by mass, and a silane-modified product obtained by silane modification by graft copolymerization with a single screw extruder at a melting temperature of 220 ° C.
- PET polyethylene terephthalate
- Thickness 100 ⁇ m
- Laminate properties Using a sheet with black grids filled in the encapsulant sheet produced using a T-die molding machine, the encapsulant sheet (thickness 400 ⁇ m) and back sheet (PET) on 250 mm square glass ) In this order, and bonded together at 150 ° C. for 6 minutes using a bonding apparatus.
- the sample configuration is “substrate (glass) / sheet for sealing material / back sheet (PET)”. About the obtained sample, the presence or absence of the protrusion of the sealing material from an edge was confirmed visually. A sample with few protrusions was marked with ⁇ , and a sample with many projections was marked with ⁇ .
- the glass adhesion, the back sheet adhesion strength, and the laminate characteristics were evaluated in the same manner as in Example 1. Further, the glass adhesion and backsheet adhesion strength after 1000 hours were passed under the moisture-resistant condition (85 ° C./90% RH) by the following method. The results are shown in Tables 3 to 4 below.
- Example 2 the glass adhesion, the back sheet adhesion strength, and the laminate characteristics were evaluated in the same manner as in Example 1. Further, the glass adhesion and the backsheet adhesion strength after 1000 hours were passed under the moisture resistance conditions (85 ° C. and 90% RH) by the same method as in Example 5. The results are shown in Tables 3 to 4 below.
- the glass adhesion, the back sheet adhesion strength, and the laminate characteristics were evaluated in the same manner as in Example 1, and the PET adhesion strength was also evaluated by the following method.
- the results are shown in Tables 3 to 5 below.
- the component (B) is not added alone, but is added when the component (C-3) is produced, and the component (B) is present in the finally obtained resin composition. Yes.
- PET adhesive strength The encapsulant sheet produced using a T-die molding machine is placed on glass, and PET (100 ⁇ m thickness, manufactured by Unitika) that has not been subjected to corona treatment is further placed on the encapsulant sheet. Then, bonding was performed at 150 ° C. for 6 minutes using a bonding apparatus.
- the sample configuration is “substrate (glass) / sheet for sealing material / PET”. Evaluation of the adhesive strength of the sealing material sheet to PET was performed by pulling the PET edge in a direction perpendicular to the sealing material sheet / glass surface under the condition of a 15 mm wide strip and a pulling speed of 100 mm / min. The measured values are shown in Table 5 below. In addition, it shows that adhesiveness is favorable in adhesive strength being 15 N / 15mm or more.
- the glass adhesion, the back sheet adhesion strength, and the laminate characteristics were evaluated in the same manner as in Example 1.
- the results are shown in Table 3 below.
- the component (B) is not added alone, but is added when the component (C-5) is produced, and the component (B) is present in the finally obtained resin composition. Yes.
- the unit of melting point is [° C.]
- the unit of GMA content is [mass%].
- the sheet for sealing material was excellent in adhesion between the glass and the back sheet.
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Abstract
Description
上記状況のもと、架橋処理が実質不要で、架橋のための加熱処理を要せずとも実用に適した接着性及び接着安定性(特にポリエステルなどの樹脂製のバックシートに対する接着性)を有する太陽電池封止材用シートが必要とされている。また、従来に比べ電池性能がより安定で耐久性に優れ、より生産性の高い太陽電池モジュールが必要とされている。
<1> (A)融点が90℃以上の、エチレン由来の構成単位を含む下記(1a)~(5a)からなる群より選択されるエチレン系共重合体の少なくとも1種と、
(B)(好ましくはグリシジル(メタ)アクリレートに由来の構成単位の合計含有割合が2質量%~30質量%である)下記(1b)~(3b)からなる群より選択されるエチレン系共重合体の少なくとも1種と、
を含有する太陽電池封止材用シートである。
[(A)エチレン系共重合体]
(1a)酢酸ビニルに由来の構成単位の含有割合の上限が15質量%であり、下限は特に制限はないが、エチレン・酢酸ビニル共重合体としての性能が明確になってくることから、0.5質量%以上、好ましくは1質量%以上、特に好ましくは5質量%以上のエチレン・酢酸ビニル共重合体
(2a)アクリル酸エステルに由来の構成単位の含有割合の上限が15質量%であり、下限は特に制限はないが、エチレン・アクリル酸エステル共重合体としての性能が明確になってくることから、0.5質量%以上、好ましくは1質量%以上のエチレン・アクリル酸エステル共重合体
(3a)高圧法低密度ポリエチレン
(4a)密度が0.895g/cm3以上のエチレン・α-オレフィン系共重合体
(5a)下記(B)エチレン系共重合体の(1b)以外のエチレン・グリシジル(メタ)アクリレート共重合体
[(B)エチレン系共重合体]
(1b)エチレン・グリシジル(メタ)アクリレート共重合体
(2b)酢酸ビニルに由来の構成単位の含有割合も上限が30質量%であり、下限は特に制限はないが、エチレン・酢酸ビニル・グリシジル(メタ)アクリレート共重合体としての性能が明確になってくることから、0.1質量%以上、好ましくは0.5質量%以上、さらに好ましくは1質量%以上のエチレン・酢酸ビニル・グリシジル(メタ)アクリレート共重合体
(3b)アクリル酸エステルに由来の構成単位の含有割合が30質量%以下であり、下限は特に制限はないが、エチレン・アクリル酸エステル・グリシジル(メタ)アクリレート共重合体としての性能が明確になってくることから、0.1質量%以上、好ましくは0.5質量%以上、さらに好ましくは1質量%以上のエチレン・アクリル酸エステル・グリシジル(メタ)アクリレート共重合体
太陽電池封止材用シートは、上記構成とすることで、従来使用されてきたエチレン・酢酸ビニル系の共重合体からなる太陽電池封止材用シートに比較して、接着性、及び、接着安定性が向上し、特にポリエステル等の樹脂製の保護材であるバックシートに対して改良される。また、太陽電池封止材用シートは、従来のエチレン・酢酸ビニル系の共重合体からなる太陽電池封止材用シートのように耐熱性を付与するために架橋を行なう必要が無く、より短時間で太陽電池モジュールを生産することができる。
本発明の太陽電池封止材用シートを構成する(A)成分である、90℃以上の融点を持つエチレン系共重合体としては、(1a)エチレン・酢酸ビニル共重合体、(2a)エチレン・アクリル酸エステル共重合体、(3a)高圧法低密度ポリエチレン、(4a)エチレン・α-オレフィン系共重合体から選ばれる。
(A)エチレン系共重合体には、融点が90℃以上であるエチレン系共重合体が包含されるが、太陽電池封止材用シートの接着性、透明性、及び柔軟性の観点から、グリシジル(メタ)アクリレートに由来の構成単位(例えばその含有割合が30質量%を超える)を含むエチレン系共重合体は用いないことが好ましい。
一方、(A)成分における前記エチレン・酢酸ビニル共重合体中のエチレンに由来の構成単位の含有割合は99.5質量%~85質量%であることが好ましく、99質量%~86質量%、特に95質量%~88質量%であることがより好ましい。エチレンに由来の構成単位の含有割合が上記範囲内であると、共重合体の耐熱性が良好である。
以下、「酢酸ビニル」をVA、「酢酸ビニルに由来する構成単位の含有割合」をVA含量と略記することもある。
一方、エチレン・アクリル酸エステル共重合体のうち、エチレンに由来する構成単位の含有割合は、99.9質量%~85質量%であることが好ましく、99.5質量%~86質量%、更には99質量%~88質量%であることがより好ましい。エチレンから導かれる構成単位が上記範囲内であると、共重合体の耐熱性が良好である。
太陽電池封止用シートにおいて、前記エチレン・α-オレフィン系共重合体は、1種単独で用いてもよく、2種以上組み合わせて用いてもよい。
エチレン・α-オレフィン系共重合体は、メタロセン系触媒だけでなく、可溶性バナジウム化合物と有機アルミニウムハライドとからなるバナジウム系触媒、あるいはシクロペンタジエニル基等が配位したジルコニウム化合物等のメタロセン化合物と有機アルミニウムオキシ化合物とからなるメタロセン系触媒の存在下に、エチレン及びその他α-オレフィン類を共重合させることによって製造することもできる。
また別には、前記(A)成分は、太陽電池モジュールの構成部材であるガラスやポリエステルシートとの接着性を高める点で、エチレン・酢酸ビニル共重合体(1a)又はエチレン・アクリル酸エステル共重合体(2a)がより好ましい。
本発明における各共重合体の融点は、DSC(示差走査熱量測定)により測定される値である。
(A)エチレン系共重合体の太陽電池封止材用シート中における含有量としては、シート全質量に対して、40質量%~90質量%が好ましく、50質量%~80質量%がより好ましい。エチレン系共重合体の含有量が前記範囲内であることにより、シートの耐熱性をより高めることができる。
本発明の太陽電池封止材用シートを構成する(B)成分としてのエチレン系共重合体((B)エチレン系共重合体)は、(1b)エチレン・グリシジル(メタ)アクリレート共重合体、(2b)エチレン・酢酸ビニル・グリシジル(メタ)アクリレート共重合体、及び(3b)エチレン・アクリル酸エステル・グリシジル(メタ)アクリレート共重合体から選ばれ、(B)成分全体のおけるグリシジル(メタ)アクリレートに由来の構成単位の合計含有割合が2質量%~30質量%(好ましくは3質量%~25質量%)であることが好ましい。
前記(2b)及び(3b)の各共重合体において、酢酸ビニルに由来の構成単位又はアクリル酸エステルに由来の構成単位の含有割合が、それぞれ30質量%以下であることで、太陽電池封止材用シートの透湿性を抑えることができる。酢酸ビニルに由来の構成単位又はアクリル酸エステルに由来の構成単位の含有割合の下限値は、特に制限はないが、0.1質量%以上、好ましくは0.5質量%以上、さらに好ましくは1質量%以上が望ましい。更には、酢酸ビニルに由来の構成単位又はアクリル酸エステルに由来の構成単位の含有割合は、0.1~30質量%の範囲が好ましく、更に0.5~20質量%、特に1~20質量%の範囲が好ましい。
なかでも、(C)共重合体におけるα-オレフィンとしては、耐ブリード性、加工性、コストの点から、エチレン、プロピレン、1-ブテン、イソブチレン、1-ペンテン、2-メチル-1-ブテン、3-メチル-1-ブテン、1-ヘキセン、1-ヘプタン、1-オクテン、1-ノネン、及び1-デセンであることが好ましく、エチレン、プロピレン、及び1-ブテンがより好ましい。
(C)共重合体におけるα-オレフィンは、単独種であっても、複数種であってもよい。
中でも、(D)シランカップリング剤としては、接着性を高め、ガラス等の基板やバックシート等の保護材との接着加工を安定して行なう点で、アミノ基を含有するアルコキシシランが好ましい。
前記光安定剤としては、例えばヒンダードアミン系のものが挙げられる。
前記酸化防止剤としては、各種ヒンダードフェノール系やホスファイト系のものが挙げられる。
前記着色剤としては、顔料、無機化合物及び染料等が挙げられ、特に白色の着色剤として、酸化チタン、酸化亜鉛及び炭酸カルシウムが挙げられる。
前記光拡散剤としては、無機系の球状物質としてガラスビーズ、シリカビーズ、シリコンアルコキシドビーズ、中空ガラスビーズなどが挙げられ、また、有機系の球状物質としてアクリル系やビニルベンゼン系などのプラスチックビーズなどが挙げられる。
前記難燃剤としては、臭素化物などのハロゲン系難燃剤、リン系難燃剤、シリコーン系難燃剤、水酸化マグネシウム、水酸化アルミニウムなどの金属水和物などが挙げられる。
これらの添加剤を含有するシートを太陽電池素子の太陽光を受光する受光側の封止材として用いる場合、透明性を損なう場合があるが、太陽電池素子の受光側と反対面の封止材として用いる場合には好適に用いられる。
例えば、上記の(A)~(D)成分、並びに、酸化防止剤、光安定剤、及び紫外線吸収剤等の添加剤を予めドライブレンドして押出機のホッパーから供給し、シート状に押出成形することによって得ることができる。
また、予め(A)成分及び(B)成分をメルトブレンドしてから、(C)成分及び(D)成分の少なくとも一方並びに酸化防止剤、光安定剤、及び紫外線吸収剤等の添加剤とドライブレンドして押出機のホッパーから供給し、シート状に押出成形することによって得ることができる。
更に別の手段として、(C)成分、並びに酸化防止剤、光安定剤、及び紫外線吸収剤等の添加剤を予めマスターバッチにして添加することも可能である。
加工温度は120℃から250℃の範囲で用いる成分の加工性に合わせて選択することができる。
本発明の太陽電池モジュールは、少なくとも、太陽光が入射する基板と、太陽電池素子と、本発明の太陽電池封止材用シートとを備える。本発明の太陽電池モジュールは、必要に応じて、更に保護材を備えていてもよい。なお、太陽光が入射する基板を、単に、基板と称することもある。
本発明の太陽電池モジュールは、前記基板上に、本発明の太陽電池封止材用シートにより封止された太陽電池素子を固定することで、製作することができる。
なお、前記保護材は、太陽光が入射する基板を太陽電池モジュールの上部としたとき、太陽電池モジュールの基板側とは反対側、すなわち下部に備えられるため、下部保護材と称することもある。
保護材(下部保護材)としては、金属や各種熱可塑性樹脂フィルムなどの単体もしくは多層のシートであり、例えば、錫、アルミ、ステンレススチールなどの金属、ガラス等の無機材料、ポリエステル、無機物蒸着ポリエステル、フッ素含有樹脂、ポリオレフィンなどの1層もしくは多層のシートを例示することができる。本発明の太陽電池封止材用シートは、これらの基板又は保護材に対して良好な接着性を示す。
<(A)成分>
(A-1)エチレン・1-ヘキセンランダム共重合体:密度 0.903g/cm3
(A-2)エチレン・α-オレフィン共重合体:密度 0.902g/cm3(プライムポリマー社製のエボリューSC00100)
(A-3)エチレン・4-メチル-1-ペンテンランダム共重合体:密度0.902g/cm3
(A-4)エチレン・ブテンランダム共重合体: 密度 0.900g/cm3
(A-5)エチレン・酢酸ビニルランダム共重合体(EVA):VA含量10質量%
(A-6)エチレン・酢酸ビニルランダム共重合体(EVA):VA含量28質量%
(A-7)エチレン・1-ヘキセンランダム共重合体:密度 0.895g/cm3
なお、「VA」の表記は、酢酸ビニルを表す。
(B-1)
エチレン・グリシジルメタクリレート・酢酸ビニル共重合体(EGMAVA)
住友化学(株)製、ボンドファースト 7B
(B-2)
エチレン・グリシジルメタクリレート共重合体(EGMA)
住友化学(株)製、ボンドファースト E
(C-1)
(A-4)100質量部と、ビニルトリメトキシシラン2質量部と、遊離ラジカル発生剤(2,5-ジメチル-2,5-ジ(t-ブチルパーオキシ)ヘキサン)0.1質量部とを混合し、溶融温度220℃にて単軸押出機にてグラフト共重合させてシラン変性したシラン変性エチレン・α-オレフィン共重合体。
(C-2)
(A-5)100質量部と、ビニルトリメトキシシラン2質量部と、遊離ラジカル発生剤(2,5-ジメチル-2,5-ジ(t-ブチルパーオキシ)ヘキサン)0.1質量部とを混合し、溶融温度220℃にて単軸押出機にてグラフト共重合させてシラン変性したシラン変性EVA共重合体。
(C-3)
(A-7)50質量部と、(B-2)50質量部と、ビニルトリメトキシシラン2.5質量部と、遊離ラジカル発生剤(2,5-ジメチル-2,5-ジ(t-ブチルパーオキシ)ヘキサン)0.1質量部とを混合し、溶融温度220℃にて単軸押出機にてグラフト共重合させてシラン変性したシラン変性体。
(C-4)
(A-7)100質量部と、ビニルトリメトキシシラン2.5質量部と、遊離ラジカル発生剤(2,5-ジメチル-2,5-ジ(t-ブチルパーオキシ)ヘキサン)0.1質量部とを混合し、溶融温度220℃にて単軸押出機にてグラフト共重合させてシラン変性したシラン変性エチレン・1-ヘキセン共重合体。
(C-5)
(A-6)50質量部と、(B-1)50質量部と、γ-メタクリロキシプロピルトリメトキシシラン2質量部と、遊離ラジカル発生剤(2,5-ジメチル-2,5-ジ(t-ブチルパーオキシ)ヘキサン)0.1質量部とを混合し、溶融温度220℃にて単軸押出機にてグラフト共重合させてシラン変性したシラン変性体。
(D-1)シランカップリング剤:
N-2(アミノエチル)3-アミノプロピルジメトキシシラン
(D-2)シランカップリング剤:
γ-メタクリロキシプロピルトリメトキシシラン
(E-1)紫外線吸収剤:UVINUL3039 BASF社製
(E-2)耐光安定剤:UVINUL5050H BASF社製
(E-3)酸化防止剤:イルガノクス1010 チバ・スペシャルティ・ケミカルズ社製
(F-1)架橋剤:2,5-ジメチル-2,5-ジ(t-ブチルパーオキシ)ヘキサン
(F-2)架橋剤:t-ブチルパーオキシ-2-エチルヘキシルカーボネート
(A-1)90質量部、(B-1)10質量部を、予め加工温度150℃でメルトブレンド(40mmφ単軸押出機、L/D=28、先端ダルメージスクリュー、40rpm)した。
次いで、紫外線吸収剤(E-1)0.12質量部、耐光安定剤(E-2)0.06質量部、酸化防止剤(E-3)0.03質量部を配合した。この混合物を40mmφ単軸T-ダイ成形機を用いて、樹脂温度140℃にて0.4mm厚の封止材用シートを作製した。
得られた封止材用シート、下記基板、及び下記バックシート(保護材)、並びに下記貼り合わせ機を用い、下記(1)~(3)の方法によりガラス接着強度、バックシート接着強度、及びラミネート特性の評価を行なった。評価結果は、下記表3に示す。
材質: 青色ガラス
厚み: 3.2mm
サイズ: 7.5cm×12cm
材質: 白PET(100μm)/アルミ(90μm)/透明PET(50μm)
厚み: トータル240μm
なお、透明PETフィルムはコロナ処理を施した。
材質: PET(ポリエチレンテレフタレート)、ユニチカ社製
厚み: 100μm
NPC社製、LM-50x50S
T-ダイ成形機を用いて作製した封止材用シートを、ガラス上に載せて、貼り合わせ装置で150℃×6分で貼り合わせ、試料構成が、「基板(ガラス)/封止材用シート」の試料を得た。ガラスに対する封止材用シートの接着力の評価は、15mm幅短冊、引張速度100mm/分の条件で、封止用樹脂層の端を、ガラス面に対して垂直な方向に引っ張ることにより行なった。下記表3に測定値を示す。なお、接着強度が10N/15mm以上、特に15N/15mmであると、接着性が良好であることを示す。
T-ダイ成形機を用いて作製した封止材用シートを、ガラス上に載せ、さらにこの封止材用シート上に、バックシートを載せて、貼り合わせ装置にて150℃で6分間、貼り合わせた。バックシートは、コロナ処理が施された面を封止材用シートに貼り合わせた。試料構成は、「基板(ガラス)/封止材用シート/バックシート」である。
バックシートに対する封止材用シートの接着力の評価は、15mm幅短冊、引張速度100mm/分の条件でバックシート端を封止材用シート/ガラス面に垂直な方向に引っ張ることにより行なった。下記表3に測定値を示す。なお、接着強度が15N/15mm以上であると接着性が良好なことを示す。
T-ダイ成形機を用いて作製した封止材用シートに黒マジックにて碁盤目を記入したシートを用い、250mm角のガラス上に封止材用シート(厚み400μm)、及びバックシート(PET)の順で載せて、貼り合わせ装置にて150℃で6分間、貼り合わせた。試料構成は、「基板(ガラス)/封止材用シート/バックシート(PET)」である。
得られた試料について、エッジからの封止材のはみ出しの有無を目視で確認した。はみ出しが少ないものを○、多いものを×とした。
(A-1)80質量部、(B-1)20質量部を、予め加工温度150℃でメルトブレンド(40mmφ単軸押出機、L/D=28、先端ダルメージスクリュー、40rpm)した。次いで、紫外線吸収剤(E-1)0.12質量部、耐光安定剤(E-2)0.06質量部、酸化防止剤(E-3)0.03質量部を配合した。この混合物を40mmφ単軸T-ダイ成形機を用いて、樹脂温度140℃にて0.4mm厚の封止材用シートを作製した。この封止材用シートを用いて、実施例1と同様にして、ガラス接着、バックシート接着強度、及びラミネート特性の評価を行なった。結果を下記表3に示す。
(A-5)80質量部、(B-1)20質量部を、加工温度150℃でメルトブレンド(40mmφ単軸押出機、L/D=28、先端ダルメージスクリュー、40rpm)した。次いで、紫外線吸収剤(E-1)0.12質量部、耐光安定剤(E-2)0.06質量部、酸化防止剤(E-3)0.03質量部を配合した。この混合物を40mmφ単軸T-ダイ成形機を用いて、樹脂温度140℃にて0.4mm厚の封止材用シートを作製した。
この封止材用シートを用いて、実施例1と同様にして、ガラス接着、バックシート接着強度、及びラミネート特性の評価を行なった。結果を下記表3に示す。
(A-1)80質量部、(B-2)20質量部を、加工温度150℃でメルトブレンド(40mmφ単軸押出機、L/D=28、先端ダルメージスクリュー、40rpm)した。次いで、紫外線吸収剤(E-1)0.12質量部、耐光安定剤(E-2)0.06質量部、酸化防止剤(E-3)0.03質量部を配合した。この混合物を40mmφ単軸T-ダイ成形機を用いて、樹脂温度140℃にて0.4mm厚の封止材用シートを作製した。
この封止材用シートを用いて、実施例1と同様にして、ガラス接着、バックシート接着強度、及びラミネート特性の評価を行なった。結果を下記表3に示す。
(A-1)80質量部、(B-1)10質量部、(C-1)10質量部 を、加工温度150℃でメルトブレンド(40mmφ単軸押出機、L/D=28、先端ダルメージスクリュー、40rpm)した。次いで、紫外線吸収剤(E-1)0.12質量部、耐光安定剤(E-2)0.06質量部、酸化防止剤(E-3)0.03質量部を配合した。この混合物を40mmφ単軸T-ダイ成形機を用いて、樹脂温度140℃にて0.4mm厚の封止材用シートを作製した。
この封止材用シートを用いて、実施例1と同様にして、ガラス接着、バックシート接着強度、及びラミネート特性の評価を行なった。また、以下に示す方法にて耐湿条件下(85℃・90%RH)で1000時間経過させた後のガラス接着、バックシート接着強度を測定した。結果を下記表3~表4に示す。
(A-1)80質量部、(B-1)10質量部、(C-2)10質量部 を、加工温度150℃でメルトブレンド(40mmφ単軸押出機、L/D=28、先端ダルメージスクリュー、40rpm)した。次いで、紫外線吸収剤(E-1)0.12質量部、耐光安定剤(E-2)0.06質量部、酸化防止剤(E-3)0.03質量部を配合した。この混合物を40mmφ単軸T-ダイ成形機を用いて、樹脂温度140℃にて0.4mm厚の封止材用シートを作製した。
この封止材用シートを用いて、実施例1と同様にして、ガラス接着、バックシート接着強度、及びラミネート特性の評価を行なった。また、実施例5と同様の方法にて耐湿条件下(85℃・90%RH)で1000時間経過させた後のガラス接着、バックシート接着強度を測定した。結果を下記表3~表4に示す。
(A-1)80質量部、(C-3)20質量部を、加工温度150℃でメルトブレンド(40mmφ単軸押出機、L/D=28、先端ダルメージスクリュー、40rpm)した。次いで、紫外線吸収剤(E-1)0.12質量部、耐光安定剤(E-2)0.06質量部、及び酸化防止剤(E-3)0.03質量部を配合した。この混合物を40mmφ単軸T-ダイ成形機を用いて、樹脂温度140℃にて0.4mm厚の封止材用シートを作製した。
この封止材用シートを用いて、実施例1と同様にして、ガラス接着、バックシート接着強度、及びラミネート特性の評価を行なうと共に、さらに以下に示す方法にてPET接着強度も評価した。結果を下記表3~表5に示す。
なお、ここでは(B)成分を単独で加えてはおらず、(C-3)成分を製造する際に加えており、最終的に得られる樹脂組成物中には(B)成分が存在している。
T-ダイ成形機を用いて作製した封止材用シートを、ガラス上に載せ、さらにこの封止材用シート上に、コロナ処理が施されていないPET(100μm厚、ユニチカ社製)を載せて、貼り合わせ装置にて150℃で6分間、貼り合わせた。試料構成は、「基板(ガラス)/封止材用シート/PET」である。
PETに対する封止材用シートの接着力の評価は、15mm幅短冊、引張速度100mm/分の条件でPET端を、封止材用シート/ガラス面に垂直な方向に引っ張ることにより行なった。
測定値を下記表5に示す。なお、接着強度が15N/15mm以上であると接着性が良好なことを示す。
(A-1)60質量部、(C-3)40質量部を、加工温度150℃でメルトブレンド(40mmφ単軸押出機、L/D=28、先端ダルメージスクリュー、40rpm)した。次いで、紫外線吸収剤(E-1)0.12質量部、耐光安定剤(E-2)0.06質量部、及び酸化防止剤(E-3)0.03質量部を配合した。この混合物を40mmφ単軸T-ダイ成形機を用いて、樹脂温度140℃にて0.4mm厚の封止材用シートを作製した。
この封止材用シートを用いて、実施例1、7と同様にして、ガラス接着、PET接着、バックシート接着強度、及びラミネート特性の評価を行なった。結果を下記表3~表5に示す。
なお、ここでは(B)成分を単独で加えてはおらず、(C-3)成分を製造する際に加えており、最終的に得られる樹脂組成物中には(B)成分が存在している。
(A-1)80質量部、(B-2)10質量部、及び(C-4)10質量部を、加工温度150℃でメルトブレンド(40mmφ単軸押出機、L/D=28、先端ダルメージスクリュー、40rpm)した。次いで、紫外線吸収剤(E-1)0.12質量部、耐光安定剤(E-2)0.06質量部、及び酸化防止剤(E-3)0.03質量部を配合した。この混合物を40mmφ単軸T-ダイ成形機を用いて、樹脂温度140℃にて0.4mm厚の封止材用シートを作製した。
この封止材用シートを用いて、実施例1、7と同様にして、ガラス接着、PET接着、バックシート接着強度、及びラミネート特性の評価を行なった。結果を下記表3~表5に示す。
(A-1)70質量部、(B-2)20質量部、及び(C-4)10質量部を、加工温度150℃でメルトブレンド(40mmφ単軸押出機、L/D=28、先端ダルメージスクリュー、40rpm)した。次いで、紫外線吸収剤(E-1)0.12質量部、耐光安定剤(E-2)0.06質量部、及び酸化防止剤(E-3)0.03質量部を配合した。この混合物を40mmφ単軸T-ダイ成形機を用いて、樹脂温度140℃にて0.4mm厚の封止材用シートを作製した。
この封止材用シートを用いて、実施例1、7と同様にして、ガラス接着、PET接着、バックシート接着強度、及びラミネート特性の評価を行なった。結果を下記表3、5に示す。
(A-1)70質量部、(B-1)20重量部、及び(C-4)10質量部を、加工温度150℃でメルトブレンド(40mmφ単軸押出機、L/D=28、先端ダルメージスクリュー、40rpm)した。次いで、紫外線吸収剤(E-1)0.12質量部、耐光安定剤(E-2)0.06質量部、及び酸化防止剤(E-3)0.03質量部を配合した。この混合物を40mmφ単軸T-ダイ成形機を用いて、樹脂温度140℃にて0.4mm厚の封止材用シートを作製した。
この封止材用シートを用いて、実施例1、7と同様にして、ガラス接着、PET接着、バックシート接着強度、及びラミネート特性の評価を行なった。結果を下記表3、5に示す。
(A-2)80質量部、(C-5)20質量部を、加工温度150℃でメルトブレンド(40mmφ単軸押出機、L/D=28、先端ダルメージスクリュー、40rpm)した。次いで、紫外線吸収剤(E-1)0.12質量部、耐光安定剤(E-2)0.06質量部、及び酸化防止剤(E-3)0.03質量部を配合した。この混合物を40mmφ単軸T-ダイ成形機を用いて、樹脂温度140℃にて0.4mm厚の封止材用シートを作製した。
この封止材用シートを用いて、実施例1と同様にして、ガラス接着、バックシート接着強度、及びラミネート特性の評価を行なった。結果を下記表3に示す。
なお、ここでは(B)成分を単独で加えてはおらず、(C-5)成分を製造する際に加えており、最終的に得られる樹脂組成物中には(B)成分が存在している。
(A-3)80質量部、(C-5)20質量部を、加工温度150℃でメルトブレンド(40mmφ単軸押出機、L/D=28、先端ダルメージスクリュー、40rpm)した。次いで、紫外線吸収剤(E-1)0.12質量部、耐光安定剤(E-2)0.06質量部、及び酸化防止剤(E-3)0.03質量部を配合した。この混合物を40mmφ単軸T-ダイ成形機を用いて、樹脂温度140℃にて0.4mm厚の封止材用シートを作製した。
この封止材用シートを用いて、実施例1と同様にして、ガラス接着、バックシート接着強度、及びラミネート特性の評価を行なった。結果を下記表3に示す。
なお、ここでは(B)成分を単独で加えてはおらず、(C-5)成分を製造する際に加えており、最終的に得られる樹脂組成物中には(B)成分が存在している。
(A-6)100質量部、(D-1)0.2質量部、架橋剤(F-1)0.1質量部、架橋剤(F-2)0.2質量部、紫外線吸収剤(E-1)0.3質量部、耐光安定剤(E-2)0.1質量部、酸化防止剤(E-3)0.02質量部を配合した。この混合物を40mmφ単軸T-ダイ成形機を用いて、樹脂温度100℃にて0.4mm厚の封止材用シートを作製した。
この封止材用シートを用いて、実施例1と同様にして、ガラス接着、バックシート接着強度、及びラミネート特性の評価を行なった。結果を表3に示す。
(A-6)100質量部、(D-2)0.2質量部、架橋剤(F-1)0.1質量部、架橋剤(F-2)0.2質量部、紫外線吸収剤(E-1)0.3質量部、耐光安定剤(E-2)0.1質量部、酸化防止剤(E-3)0.02質量部を配合した。この混合物を40mmφ単軸T-ダイ成形機を用いて、樹脂温度100℃にて0.4mm厚の封止材用シートを作製した。
この封止材用シートを用い、実施例1における貼り合わせ装置によるガラス、バックシート等との貼り合わせの後、さらに、オーブン中にて145℃で40分間のキュア(熱処理)を行なったこと以外は、実施例1と同様にして、ガラス接着、バックシート接着強度、及びラミネート特性の評価を行なった。結果を表3に示す。
本明細書に記載された全ての文献、特許出願、及び技術規格は、個々の文献、特許出願、及び技術規格が参照により取り込まれることが具体的かつ個々に記された場合と同程度に、本明細書中に参照により取り込まれる。
Claims (9)
- (A)融点が90℃以上の、エチレン由来の構成単位を含む下記(1a)~(5a)からなる群より選択されるエチレン系共重合体の少なくとも1種と、(B)下記(1b)~(3b)からなる群より選択されるエチレン系共重合体の少なくとも1種とを含有する太陽電池封止材用シート。
[(A)エチレン系共重合体]
(1a)酢酸ビニルに由来の構成単位の含有割合が15質量%以下のエチレン・酢酸ビニル共重合体
(2a)アクリル酸エステルに由来の構成単位の含有割合が15質量%以下のエチレン・アクリル酸エステル共重合体
(3a)高圧法低密度ポリエチレン
(4a)密度が0.895g/cm3以上のエチレン・α-オレフィン系共重合体
(5a)下記(B)エチレン系共重合体の(1b)以外のエチレン・グリシジル(メタ)アクリレート共重合体
[(B)エチレン系共重合体]
(1b)エチレン・グリシジル(メタ)アクリレート共重合体
(2b)酢酸ビニルに由来の構成単位の含有割合が30質量%以下のエチレン・酢酸ビニル・グリシジル(メタ)アクリレート共重合体
(3b)アクリル酸エステルに由来の構成単位の含有割合が30質量%以下のエチレン・アクリル酸エステル・グリシジル(メタ)アクリレート共重合体 - 前記(A)エチレン系共重合体、及び前記(B)エチレン系共重合体は、メルトフローレート(JIS K7210-1999、190℃、2160g荷重)が0.1g/10分~50g/10分である請求項1に記載の太陽電池封止材用シート。
- さらに、(C)少なくともα-オレフィンとエチレン性不飽和シラン化合物とを共重合して得られる共重合体及び(D)シランカップリング剤からなる群より選択される少なくとも1種を含有する請求項1に記載の太陽電池封止材用シート。
- 前記(C)共重合体は、更に、酢酸ビニル及びアクリル酸エステルから選択される少なくとも1種に由来の構成単位を有する請求項3に記載の太陽電池封止材用シート。
- 前記(A)エチレン系共重合体における前記エチレン・α-オレフィン共重合体(4a)は、エチレン・プロピレン共重合体、エチレン・1-ブテン共重合体、エチレン・4-メチル-1-ペンテン共重合体、又はエチレン・1-ヘキセン共重合体である請求項1に記載の太陽電池封止材用シート。
- 前記(C)共重合体におけるα-オレフィンは、エチレン、プロピレン、1-ブテン、イソブチレン、1-ペンテン、2-メチル-1-ブテン、3-メチル-1-ブテン、1-ヘキセン、1-ヘプタン、1-オクテン、1-ノネン、及び1-デセンから選ばれる少なくとも一種である請求項3に記載の太陽電池封止材用シート。
- 前記エチレン性不飽和シラン化合物が、ビニルシラン及び(メタ)アクリロキシシランから選ばれる請求項3に記載の太陽電池封止材用シート。
- 前記エチレン性不飽和シラン化合物が、ビニルトリメトキシシラン又はγ-メタクリロキシプロピルトリメトキシシランである請求項3に記載の太陽電池封止材用シート。
- 少なくとも、太陽光が入射する基板と、太陽電池素子と、請求項1に記載の太陽電池封止材用シートとを備えた太陽電池モジュール。
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JP2016503089A (ja) * | 2012-12-24 | 2016-02-01 | エルジー・ケム・リミテッド | オレフィン樹脂組成物 |
CN104870548A (zh) * | 2012-12-24 | 2015-08-26 | 株式会社Lg化学 | 烯烃树脂组合物 |
JP2016504456A (ja) * | 2012-12-24 | 2016-02-12 | エルジー・ケム・リミテッド | 共重合体 |
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DE112010001988B4 (de) | 2021-05-06 |
JP5588433B2 (ja) | 2014-09-10 |
US20120048354A1 (en) | 2012-03-01 |
KR101381342B1 (ko) | 2014-04-07 |
CN102422437A (zh) | 2012-04-18 |
KR20120023077A (ko) | 2012-03-12 |
JPWO2010131716A1 (ja) | 2012-11-08 |
DE112010001988T5 (de) | 2012-11-29 |
US8957304B2 (en) | 2015-02-17 |
CN102422437B (zh) | 2016-05-04 |
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