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WO2010122877A1 - Dispositif ayant un élément magnétique et procédé de fabrication du dispositif - Google Patents

Dispositif ayant un élément magnétique et procédé de fabrication du dispositif Download PDF

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Publication number
WO2010122877A1
WO2010122877A1 PCT/JP2010/055657 JP2010055657W WO2010122877A1 WO 2010122877 A1 WO2010122877 A1 WO 2010122877A1 JP 2010055657 W JP2010055657 W JP 2010055657W WO 2010122877 A1 WO2010122877 A1 WO 2010122877A1
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WO
WIPO (PCT)
Prior art keywords
magnetic
metal
layer
support member
transmission line
Prior art date
Application number
PCT/JP2010/055657
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English (en)
Japanese (ja)
Inventor
利男 高橋
恭一 川瀬
Original Assignee
アルプス電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by アルプス電気株式会社 filed Critical アルプス電気株式会社
Publication of WO2010122877A1 publication Critical patent/WO2010122877A1/fr

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07771—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card the record carrier comprising means for minimising adverse effects on the data communication capability of the record carrier, e.g. minimising Eddy currents induced in a proximate metal or otherwise electromagnetically interfering object

Definitions

  • the present invention relates to a device structure including a magnetic member used for RFID or noise countermeasure, and a member containing metal.
  • FIG. 8 is a longitudinal sectional view of a conventional RFID device.
  • the metal member 1, the adhesive layer 2, the resin sheet 3, the adhesive layer 4, the magnetic sheet 5, the adhesive layer 6, and the RFID tag 7 are laminated in this order from the bottom.
  • the laminated sheet of the adhesive layer 2, the resin sheet 3, and the adhesive layer 4 is, for example, a double-sided tape. And the space
  • FIG. 9 is also a longitudinal sectional view of a conventional conventional RFID device, in which the thickness dimension H1 of the magnetic sheet 8 is thinner than the thickness dimension H2 of the magnetic sheet 5 in FIG.
  • the thickness dimension H2 of the magnetic sheet 5 shown in FIG. 8 is about 100 to 300 ⁇ m, but in FIG. 9, the thickness dimension H1 of the magnetic sheet 8 is made thinner than 100 ⁇ m.
  • the metal member 1 and the magnetic sheet 8 are stuck via a double-sided tape having a thickness T ⁇ b> 1 as in FIG. 8.
  • the RFID device when the metal member 1 is in the vicinity of the RFID tag 7 as shown in FIGS. 8 and 9, an eddy current is generated in the metal member 1 by the magnetic field from the reader / writer, and the demagnetizing field due to the eddy current is generated by wireless communication.
  • magnetic sheets 5 and 8 are inserted between the metal member 1 and the RFID tag 7 as shown in FIGS. .
  • the magnetic sheets 5 and 8 attract the magnetic flux from the reader / writer to the RFID tag 7 side so that the magnetic flux can penetrate between the reader / writer antenna and the RFID tag 7 antenna.
  • the attenuation of the received signal output can be reduced, and the RFID characteristics can be improved.
  • the installation position of the magnetic sheets 5 and 8 and the material selection of the magnetic sheet 8 between the metal member 1 and the RFID tag 7 are important parameters for adjusting the RFID characteristics regarding the resonance frequency and the maximum communication distance.
  • the interval T1 between the metal member 1 and the magnetic sheet 8 is the same.
  • the magnetic sheets 5 and 8 and the metal member 1 are attached via a double-sided tape.
  • the double-sided tape is used because the double-sided tape has adhesive layers 2 and 4 on both sides and is thick and easy to be compressed when pressed. This is because the adhesive layers 2 and 4 are appropriately crushed and firmly bonded between the magnetic sheets 5 and 8 and the metal member 1.
  • the interval T1 between the metal member 1 and the magnetic sheet 8 is easily widened, and when the magnetic sheet 8 is formed thin like the laminated structure of FIG. It is necessary to select a material having a high real part ⁇ ′ of the complex relative permeability with respect to the magnetic sheet 5.
  • the magnetic sheet 8 is formed with a small thickness to maintain the RFID device thin, and the resonance frequency is adjusted to be close to 13.56 MHz and the maximum communication distance is adjusted as much as possible.
  • Required a real part ⁇ ′ having a higher complex relative permeability is reduced, and there is a problem that it is difficult to stably obtain good RFID characteristics.
  • the magnetic sheet 8 is formed on the surface of the metal member 1 with the adhesive layer 2, the resin sheet 3, and the adhesive layer 4.
  • a laminated sheet is used for attachment, but with such a configuration, there is a problem that the interval T1 between the magnetic sheet 8 and the metal member 1 is likely to vary, and thus the maximum communication distance and resonance frequency vary.
  • the thinner the magnetic sheet 8 the greater the influence of variation between the magnetic sheet 8 and the metal member 1 on the RFID characteristics.
  • the interval T1 between the metal member 1 and the magnetic sheet 8 varies depending on the thickness of the double-sided tape.
  • the total thickness of 4 is thick, and the thickness tends to change greatly when crushed. For this reason, when the double-sided tape is used, it is difficult to stably adjust the RFID characteristics relating to the resonance frequency and the maximum communication distance.
  • RFID devices not only RFID devices but also other devices, for example, devices using a magnetic sheet as a noise countermeasure for a transmission line formed on a substrate, have a problem that reflection noise cannot be stably suppressed with the conventional configuration.
  • Reflected noise is caused by, for example, impedance mismatch between the transmission line and the IC. For this reason, the impedance of a transmission line can be changed by sticking a magnetic sheet to a transmission line, and reflection noise can be suppressed.
  • Patent Documents 1 and 2 each disclose an invention related to a device (RFID device) using a magnetic sheet, but do not disclose a configuration for solving the above-described conventional problems.
  • the present invention is for solving the above-described conventional problems, and in particular, the degree of freedom of material selection for the magnetic layer can be increased as compared with the conventional one, characteristic variation can be reduced, and further thinning can be realized. It aims at providing the device which has a magnetic member, and its manufacturing method.
  • the device having a magnetic member in the present invention, A member including a metal and a magnetic member;
  • the magnetic member has a structure in which a magnetic layer is formed directly on the surface of a support member, and the member including the metal, the first bonding layer, and the magnetic member are laminated in this order. is there.
  • the manufacturing method of the device having a magnetic member in the present invention A member including a metal and a magnetic member;
  • the magnetic member is formed directly on the surface of the support member to form the magnetic member, and the magnetic member is bonded to the surface of the member containing the metal by a first bonding layer.
  • the interval between the metal-containing member and the magnetic layer can be stably reduced as compared with the conventional case.
  • the degree of freedom of material selection for the magnetic layer can be increased compared to conventional devices, and in devices using magnetic members for RFID, the resonance frequency can be made close to 13.56 MHz, the maximum communication distance can be increased, and variations can be adjusted to be small.
  • the resonance frequency can be made close to 13.56 MHz, the maximum communication distance can be increased, and variations can be adjusted to be small.
  • a device that uses a magnetic member as a countermeasure against noise in the transmission line it is possible to reduce variations in impedance of the transmission line and effectively suppress reflection noise. In this embodiment, further thinning of the device can be promoted.
  • the metal-containing member, the first bonding layer, the support member, and the magnetic layer are laminated in this order.
  • the magnetic layer in the method for manufacturing a device having a magnetic member described above, can be formed directly on the surface of the support member simply and appropriately by forming the magnetic layer on the surface of the support member by a doctor blade method. It is preferable.
  • the first bonding layer is an adhesive layer provided in advance on a surface opposite to the surface on which the magnetic layer of the support member is formed, and the adhesive layer is protected with a peelable protective member.
  • the magnetic layer is directly formed on the surface of the support member, and then the protective member is removed, and the magnetic member is adhered to the surface of the member containing the metal by the adhesive layer. In this way, the magnetic layer is formed directly on the surface of the support member, and after that, it is only necessary to stick the magnetic member to the metal member with the adhesive layer, so that the number of manufacturing steps can be reduced and the manufacturing cost can be reduced.
  • the first metal-containing member, the magnetic member, and the second metal-containing member are included, and either the first metal-containing member or the second metal-containing member is included.
  • One is an RFID tag
  • the magnetic member has the first bonding layer between the support member and the member containing the first metal with the support member facing the member containing the first metal. It is preferable that the member including the magnetic layer and the second metal is attached via a second bonding layer.
  • the metal-containing member has a configuration in which a transmission line is provided on a substrate, and the magnetic member has the transmission line and the support in a state where the support member is directed toward the transmission line. It is preferable that the space between the members is attached via the first bonding layer. Thereby, the dispersion
  • the distance between the metal-containing member and the magnetic layer can be reduced as compared with the conventional case.
  • the freedom degree of material selection with respect to a magnetic layer can be made high compared with the past.
  • the variation between the magnetic layer and the metal member can be reduced as compared with the conventional case, so that the characteristic variation can be reduced, and further thinning of the device can be promoted.
  • a longitudinal sectional view of the RFID device according to the first embodiment is a plan view of a device in which a magnetic sheet is adhered to the surface of a transmission line for noise suppression, and (b) is cut along the line AA shown in (a) and viewed from the direction of the arrow.
  • Partial longitudinal sectional view Conceptual diagram of the doctor blade method, The partial expanded sectional view which expanded the vicinity of the magnetic member of this embodiment, and the 1st joined layer, A graph showing the frequency characteristics of the real part ⁇ ′ and the imaginary part ⁇ ′′ of the complex relative permeability of the magnetic sheet used in the conventional example, Conventional example, Examples 1 to 3, and a graph showing the relationship between the resonance frequency of a single tag and the maximum communication distance,
  • the longitudinal cross-sectional view of the RFID device in a 1st prior art example The longitudinal cross-sectional view of the RFID device in a 2nd prior art example.
  • FIG. 1 is a longitudinal sectional view of an RFID device according to this embodiment.
  • an RFID (Radio Frequency ID) device 10 includes an RFID tag (member containing a second metal) 11 including an antenna and an IC chip, a metal member (member containing a first metal) 12, A magnetic member (magnetic sheet) 13 inserted between the RFID tag 11 and the metal member 12 is provided.
  • the RFID tag 11 has a form in which an antenna and an IC chip are formed on a substrate.
  • the metal member 12 forms a part of the housing, for example, and is made of Al, Ti, Cr or the like.
  • the film thickness of the metal member 12 is about 0.05 to 0.5 mm.
  • the magnetic member 13 of the present embodiment shown in FIG. 1 has a configuration in which a magnetic layer 15 is directly formed on the surface of a support member 14.
  • the thickness dimension H5 of the support member 14 is about 10 to 40 ⁇ m.
  • the magnetic layer 15 is a powder of a soft magnetic material such as Sendust or Fe-M-Cr-PC (M is one or more of Sn, In, Zn, Ga, Al, Ni, B, and Si). It is a structure in which the body and scales are bonded with a binder resin.
  • the metal member 12 and the support member 14 are bonded via a first bonding layer 16. Further, as shown in FIG. 1, the magnetic layer 15 and the RFID tag 11 are bonded via a second bonding layer 17.
  • the thickness dimension H7 of the first bonding layer 16 is about 30 to 100 ⁇ m, and the thickness dimension H8 of the second bonding layer 17 is about 10 to 50 ⁇ m.
  • the RFID device 10 shown in FIG. 1 has a configuration in which the metal member 12, the first bonding layer 16, the support member 14, the magnetic layer 15, the second bonding layer 17, and the RFID tag 11 are stacked in this order. .
  • the interval T2 between the magnetic layer 15 and the metal member 12 can be obtained by (thickness dimension H7 of the first bonding layer 16 + thickness dimension H5 of the support member 14). .
  • a distance T2 between the magnetic layer 15 and the metal member 12 is about 40 to 140 ⁇ m.
  • the magnetic layer 15 is formed directly on the surface of the support member 14. In the present embodiment, only one bonding layer 16 is required in the interval between the magnetic member 13 and the metal member 12, and therefore, the interval between the magnetic layer 15 and the metal member 12 as compared with the related art. T2 can be reduced. That is, the magnetic layer 15 can be brought close to the metal member 12.
  • the resonance frequency becomes close to 13.56 MHz and a good maximum communication distance ( Maximum distance that can be communicated).
  • the practical range of the real part ⁇ ′ of the complex relative permeability of the magnetic layer 15 can be expanded. Therefore, the degree of freedom of material selection for the magnetic layer 15 can be increased, and the magnetic layer 15 can be easily made thinner.
  • the “practical range” refers to a range of the real part ⁇ ′ in which good RFID characteristics can be obtained with the magnetic layer 15 kept in a thin and substantially constant film thickness (for example, about 50 ⁇ m in the experiment described later). Point to.
  • the thickness H6 of the magnetic layer 15 can be adjusted to about 50 to 100 ⁇ m, and the real part ⁇ ′ (13.56 MHz) of the complex relative permeability of the magnetic layer 15 can be adjusted within the range of about 40 to 100.
  • the adhesive layers 2 and 4 located on both sides are crushed and are totalized.
  • the amount of change in the thick adhesive layers 2 and 4 was likely to fluctuate greatly, and the interval T1 between the magnetic sheet 8 and the metal member 1 was likely to vary.
  • the magnetic layer 15 is formed directly on the surface of the support member 14 to form the magnetic member 13, and the magnetic member 13 is formed on the surface of the metal member 12 by one layer of the first layer.
  • the interval T ⁇ b> 2 between the magnetic layer 15 and the metal member 12 can be reduced, and the variation in the interval T ⁇ b> 2 can be reduced as compared with the related art. As a result, it is easy to reduce variations in the resonance frequency and communication distance of the RFID device as compared to the conventional case.
  • the magnetic layer 15 is directly formed on the surface of the support member 14, so that further reduction in the thickness of the RFID device 10 can be promoted.
  • the support member 14 for directly forming the magnetic layer 15 is interposed between the metal member 12 and the magnetic layer 15, and the metal member 12 and the magnetic layer together with the first bonding layer 16.
  • 15 functions as a spacer for adjusting the interval T2 between the two. Therefore, in the laminated structure of FIG. 1, the interval T2 can be adjusted by adjusting the thickness dimension H5 of the support member 14. In the embodiment shown in FIG. 1, the distance between the magnetic layer 15 and the RFID tag 11 is adjusted by the thickness dimension H8 of the second bonding layer 17.
  • a resin sheet particularly a PET sheet
  • the support member 14 is not limited to a resin sheet as long as it is thin.
  • the support member 14 is directed toward the metal member 12 side, and the support member 14 and the metal member 12 are bonded via the first bonding layer 16, but the magnetic layer 15 is attached to the metal member 12.
  • the support member 14 that is harder and has better surface flatness than the side is directed to the metal member 12 side, so that the thin first bonding layer 16 causes the support member 14 and the metal member 12 to have a substantially predetermined interval. And can be bonded stably.
  • the bonding layers 16 and 17 are made of an adhesive or an adhesive.
  • the pressure-sensitive adhesive and the adhesive are not clearly distinguished. All materials used to join things together are configured as a joining layer.
  • an acrylic pressure-sensitive adhesive or a polyester film pressure-sensitive adhesive tape with an acrylic pressure-sensitive adhesive can be used as the pressure-sensitive adhesive layer.
  • the first bonding layer 16 is made of a gel-like solid material or a highly viscous liquid adhesive, and, for example, the first bonding layer 16 is an adhesive layer on the opposite surface of the support member 14 from which the magnetic layer 15 is formed.
  • the layer 16 is configured as a single-sided adhesive tape provided in advance.
  • the magnetic member 13 is attached to the surface of the metal member 12 by the first bonding layer (adhesive layer) 16 formed in advance on the surface of the support member 14 with the support member 14 facing the metal member 12 side. It has been configured. With such a configuration, simple assembly can be realized, and variation in the interval T2 between the magnetic layer 15 and the metal member 12 can be further reduced.
  • the second bonding layer 17 can be attached using a double-sided tape, and the RFID tag 11 and the magnetic member 13 can be attached using the double-sided tape.
  • the metal member 12, the second bonding layer 17, the magnetic layer 15, the support member 14, the first bonding layer 16, and the RFID tag 11 are stacked in this order.
  • the RFID tag 11 is a “member containing a first metal”
  • the metal member 12 is a “member containing a second metal”
  • the gap between the RFID tag 11 and the magnetic member (magnetic sheet) 13 is the first. Bonded by the bonding layer 16.
  • the magnetic member 13 is inserted between the RFID tag 11 and the metal member 12 in order to suppress degradation of the RFID characteristics. At this time, the magnetic member 13 and the metal member are inserted.
  • the support member 14 constituting the magnetic member 13 is directed toward the RFID tag 11, and the support member 14 and the RFID tag 11 are attached via the first bonding layer 16.
  • the magnetic layer 15 and the RFID tag 11 can be brought closer to each other at the interval T2, the variation in the interval T2 can be reduced, and the variation in the RFID characteristics can be reduced to effectively improve the characteristics.
  • FIG. 3 shows a device in which the magnetic member (magnetic sheet) 13 is used as a noise countermeasure in an electronic circuit composed of electronic components and transmission lines, where (a) is a plan view and (b) is (a).
  • FIG. 2 is a partial longitudinal sectional view taken along the line AA shown in FIG.
  • a transmission line 32 is formed on a substrate 31 to constitute a “metal-containing member”.
  • An electronic circuit such as an IC is provided on the substrate to constitute an electronic circuit.
  • the magnetic member (magnetic sheet) 13 of the present embodiment is attached to the transmission line 32 via the first bonding layer 16, so that the impedance of the transmission line 32 is increased. It is possible to suppress the reflection noise caused by impedance mismatch between the transmission line 32 and the IC.
  • the support member 14 of the magnetic member 13 is directed to the transmission line 32 side, and the support member 14 and the transmission line 32 are pasted via the thin first bonding layer 16. I wear it.
  • variation between the magnetic layer 15 and the transmission line 32 has a small dispersion
  • the thin first bonding layer 16 is formed by directing the support member 14 formed of a PET sheet or the like to be hard and excellent in surface flatness to the transmission line 32 side.
  • the support member 14 and the transmission line 32 can be properly bonded to each other and firmly bonded.
  • the first bonding layer 16 is an adhesive layer provided in advance on the surface opposite to the surface on which the magnetic layer 15 of the support member 14 is formed. Then, the magnetic member 13 can be easily attached to the transmission line 32 by the adhesive layer with the support member 14 facing the transmission line 32 side.
  • a mixed liquid (slurry) 20 having a binder resin material and magnetic powder constituting the magnetic layer is supplied into a doctor blade device 21 and a support member (PET sheet is suitable). ) 14, the mixed solution 20 is formed into a film with a predetermined thickness by the blade 23.
  • the doctor blade device 21 can be set to a predetermined temperature, the magnetic layer 15 can be applied and formed, and then dried to be cured.
  • the method of directly forming the magnetic layer 15 on the support member 14 is not limited to the doctor blade method, but it is easy to form the magnetic layer 15 to a predetermined thickness by using the doctor blade method, and while the support member 14 is being fed sequentially. It is preferable that the magnetic layer 15 can be continuously formed on the surface of the support member 14.
  • an adhesive layer (hereinafter referred to as an adhesive layer 16) as a first bonding layer 16 is provided in advance on the surface 14 a opposite to the surface 14 a forming the magnetic layer 15 of the support member 14. .
  • the magnetic layer 15 is directly formed on the surface 14 a of the support member 14 in a state where the adhesive layer 16 is protected by a peelable protective sheet (protective member) 24. Subsequently, the protective sheet 24 is peeled off and removed, and in the case of the RFID device 10 shown in FIG. 1, the magnetic member 13 is adhered to the surface of the metal member 12 by the adhesive layer 16, and subsequently, the surface of the magnetic layer 15 is adhered.
  • the RFID tag 11 is bonded through the second bonding layer 17.
  • the magnetic member 13 is attached to the surface of the RFID tag 11 by the adhesive layer 16, and then the magnetic layer 15 is bonded to the surface of the metal member 12 via the second bonding layer 17.
  • the magnetic member 13 is adhered to the surface of the transmission line 32 by the adhesive layer 16.
  • the magnetic layer 15 is directly formed on the support member 14, and thereafter, the magnetic member 13 is made of the metal member 12, the RFID tag 11, the transmission line 32, or the like by the adhesive layer 16 provided in advance on the support member 14. Therefore, the number of manufacturing steps can be reduced and the manufacturing cost can be reduced.
  • the device using the magnetic member (magnetic sheet) in this embodiment can be used for signal transmission devices, electronic devices, etc. other than those shown in FIGS.
  • RFID device experiment RFID devices of the following conventional examples and examples were formed.
  • 3M 5010B (about 100 ⁇ m thick) was used.
  • the real part ⁇ ′ (13.56 MHz) of the complex relative permeability of the magnetic sheet 5 (3M 5010B) was about 20.
  • 6 shows the frequency characteristics of the real part ⁇ ′ and the imaginary part ⁇ ′′ of the complex relative permeability of the magnetic sheet 5 (3M 5010B).
  • the magnetic sheet 5 and the metal member 1 are joined together. Used double-sided tape of adhesive layer 2 / resin sheet 3 / adhesive layer 4 and the interval T1 between the magnetic sheet 5 and the metal member 1 was 170 ⁇ m.
  • Example 1 An RFID device having a laminated structure shown in FIG. 1 was formed. HMSZS ⁇ (80R) made by Alps Electric was used for the magnetic layer 15.
  • Example 2 An RFID device having a laminated structure shown in FIG. 1 was formed.
  • HMXS ⁇ (60R) manufactured by Alps Electric was used for the magnetic layer 15 .
  • Example 3 An RFID device having a laminated structure shown in FIG. 1 was formed. HMSUS ⁇ (40R) made by Alps Electric was used for the magnetic layer 15.
  • Example 1 to 3 a support member (PET sheet) 14 and a first bonding layer (adhesive layer) 16 are interposed between the magnetic layer 15 and the metal member 12, and the interval T2 is set to 70 ⁇ m.
  • the thickness dimension H6 of each magnetic layer 15 of Examples 1 to 3 was set to about 50 ⁇ m.
  • the maximum communication distance almost equal to that of the conventional example was obtained. More specifically, as shown in Table 1 and FIG. 7, in Examples 1 to 3, the real part ⁇ ′ of the complex relative permeability is about half that of the conventional example in which the real part ⁇ ′ is about 40 to 80. It has been found that even when the layer 15 is used, the resonance frequency can be adjusted to around 13.56 MHz, the maximum communication distance can be made substantially equal, and the RFID device can be made thin at the same time.
  • the real part ⁇ ′ of the complex relative permeability of the magnetic layer necessary for obtaining good RFID characteristics can be adjusted within a relatively wide range by bringing the magnetic layer closer to the metal member, It was found that the degree of freedom in material selection can be increased.
  • the support member 14 was a PET sheet and the thickness was about 25 ⁇ m, and the thickness of the adhesive layer 16 was about 25 ⁇ m.
  • the distance between the magnetic layer and the transmission line is likely to change over a wide range. Also, the variation in the total thickness of the original adhesive layer tends to increase. Therefore, in the configuration of the conventional example, the interval between the magnetic layer and the transmission line is likely to vary, and therefore, as shown in Table 2, the impedance change rate increases and the impedance tends to vary.
  • the adhesive layer can be thinned and the thin adhesive layer can be held with a relatively hard PET sheet, the amount of change in the thickness of the adhesive layer can be reduced, and as shown in Table 2, between the magnetic layer and the transmission line Spacing variation can be reduced. Therefore, as shown in Table 2, the rate of change of impedance is smaller than that of the conventional example, and the variation in impedance can be effectively reduced as compared with the conventional example.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Electromagnetism (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

L'invention porte sur un dispositif ayant un élément magnétique, le degré de liberté de sélection des matériaux pour une couche magnétique étant amélioré tout spécialement par comparaison à des dispositifs classiques, une variance de caractéristiques et l'épaisseur étant davantage réduite. L'invention porte également sur un procédé de fabrication d'un tel dispositif. Le dispositif a une étiquette RFID (11), un élément métallique (12) et un élément magnétique (13) inséré entre l'étiquette RFID (11) et l'élément métallique (12). L'élément magnétique (13) est configuré de telle sorte qu'une couche magnétique (15) est directement formée sur la surface d'un élément de support (14), et l'élément métallique (12), une première couche de liaison (16) et l'élément magnétique (13) sont laminés dans cet ordre. Ainsi, un intervalle (T2) entre l'élément métallique (12) et la couche magnétique (15) est réduit par comparaison à des cas classiques, et le degré de liberté de sélection de matériaux pour la couche magnétique (15) est amélioré. En outre, étant donné que la variance de l'intervalle (T2) est réduite, la variance des caractéristiques RFID est réduite et l'épaisseur du dispositif en est réduite encore davantage.
PCT/JP2010/055657 2009-04-22 2010-03-30 Dispositif ayant un élément magnétique et procédé de fabrication du dispositif WO2010122877A1 (fr)

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JP2009103738 2009-04-22
JP2009-103738 2009-04-22

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001297905A (ja) * 2000-04-17 2001-10-26 Tokin Corp 高周波電流抑制体
JP2006178638A (ja) * 2004-12-21 2006-07-06 Toyo Seikan Kaisha Ltd Ｉｃタグ対応金属材と金属対応ｉｃタグ、ｉｃタグ対応金属容器及びｉｃタグ対応金属材の製造方法
JP2007094621A (ja) * 2005-09-28 2007-04-12 Dainippon Printing Co Ltd 非接触ｉｃタグラベル

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001297905A (ja) * 2000-04-17 2001-10-26 Tokin Corp 高周波電流抑制体
JP2006178638A (ja) * 2004-12-21 2006-07-06 Toyo Seikan Kaisha Ltd Ｉｃタグ対応金属材と金属対応ｉｃタグ、ｉｃタグ対応金属容器及びｉｃタグ対応金属材の製造方法
JP2007094621A (ja) * 2005-09-28 2007-04-12 Dainippon Printing Co Ltd 非接触ｉｃタグラベル

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