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WO2010088603A1 - High speed interconnect cable assembly - Google Patents

High speed interconnect cable assembly Download PDF

Info

Publication number
WO2010088603A1
WO2010088603A1 PCT/US2010/022738 US2010022738W WO2010088603A1 WO 2010088603 A1 WO2010088603 A1 WO 2010088603A1 US 2010022738 W US2010022738 W US 2010022738W WO 2010088603 A1 WO2010088603 A1 WO 2010088603A1
Authority
WO
WIPO (PCT)
Prior art keywords
connector
termination
printed circuit
circuit board
bypass cable
Prior art date
Application number
PCT/US2010/022738
Other languages
French (fr)
Inventor
Brian Keith Lloyd
Original Assignee
Molex Incorporated
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Molex Incorporated filed Critical Molex Incorporated
Priority to CN201080015799.1A priority Critical patent/CN102365907B/en
Publication of WO2010088603A1 publication Critical patent/WO2010088603A1/en
Priority to US13/987,296 priority patent/US9011177B2/en
Priority to US15/271,903 priority patent/USRE47342E1/en
Priority to US15/404,942 priority patent/US20170125950A1/en
Priority to US15/715,939 priority patent/USRE48230E1/en

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/222Completing of printed circuits by adding non-printed jumper connections
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50Fixed connections
    • H01R12/59Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/646Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
    • H01R13/6461Means for preventing cross-talk
    • H01R13/6467Means for preventing cross-talk by cross-over of signal conductors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/646Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
    • H01R13/6461Means for preventing cross-talk
    • H01R13/6471Means for preventing cross-talk by special arrangement of ground and signal conductors, e.g. GSGS [Ground-Signal-Ground-Signal]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6591Specific features or arrangements of connection of shield to conductive members
    • H01R13/6594Specific features or arrangements of connection of shield to conductive members the shield being mounted on a PCB and connected to conductive members
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0237High frequency adaptations
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10189Non-printed connector
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227Other objects, e.g. metallic pieces
    • H05K2201/10356Cables
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431Details of mounted components
    • H05K2201/10439Position of a single component
    • H05K2201/10446Mounted on an edge
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621Components characterised by their electrical contacts
    • H05K2201/10674Flip chip

Definitions

  • the Present Application relates generally to cable interconnection systems, and more particularly, to cable interconnection systems capable of handling high speed signals.
  • the Present Application is therefore directed to a high speed interconnect cable assembly capable of the transmission of signals greater than 10 GHz without an increased number of components, such as amplifiers and repeaters, as well as without signal loss.
  • an electrical connector assembly comprises a printed circuit board, a chip member, a termination member, a first connector member, a bypass cable member and a second connector member.
  • the chip member and the termination member are mounted on the printed circuit board, with the termination member mounted toward the end of the printed circuit board.
  • the first connector member is in electrical communication with the chip member at a first end, and the bypass cable member electrically connects the first connector member, where it is coupled at a second end thereof, and the termination member, at a first end.
  • the second connector member disposed at a second end of the termination member, is in electrical communication with the termination member.
  • the electrical connector is capable of the transmission of high speed signals.
  • Figure 1 illustrates a perspective view of one embodiment of a high speed interconnect cable assembly, developed in accordance with the Present Application
  • Figure 2 illustrates a perspective view of another embodiment of a high speed interconnect cable assembly, developed in accordance with the Present Application
  • Figure 3 illustrates a perspective view of another embodiment of a high speed interconnect cable assembly, developed in accordance with the Present Application
  • Figure 4 illustrates a perspective and inset view of the via transfer connector of the interconnect cable assembly of FIG. 3; and [0013] Figure 5 illustrates a perspective and inset view of the first connector member of the interconnect cable assembly of FIG. 3.
  • FIGS. 1-5 provide various perspective views of some basic components of a high speed interconnect cable assembly, developed in accordance with the teachings and tenets of the Present Application, as described herein in this disclosure.
  • high speed interconnect cable assembly 10 generally comprises chip member 12 mounted on printed circuit board member 14, first connector member 16 interfacing between chip member 12 and bypass cable member 18, and termination member 20 interfacing between bypass cable member 18 and second connector member 22 disposed at the edge of printed circuit board member 14.
  • chip member 12 may comprise a PHY Chip, or any other surface-mounted, physical layer device, known in the art, from which a high speed signal is generated and transmitted to a cable assembly.
  • Chip member 12 is mounted to any currently-known printed circuit board, using preferably any of the various currently-known mounting means.
  • an FR-4 type printed circuit board is used, in an effort to take advantage of its low cost and wide usage.
  • the generated high speed signal may be any type of signal, and preferably is a signal having a frequency of 10 GHz or more.
  • Bypass cable member 18 is connected to chip member 12 by means of first connector member 16.
  • First connector member 16 is capable of transmitting a signal greater than 10 GHz between chip member 12 and bypass cable member 18.
  • the interface between first connector member 16 and chip member 18 may be by any known means, including, for example, a plug- receptacle connection, a friction-based connection or the like. It is preferred that the interface be removable.
  • First connector member 16 is preferably capable of receiving the high speed signal generated by the chip member and transmitting it to the bypass cable member without need for a repeater or an amplifier, and without having to use the conductive properties of printed circuit board 14.
  • Bypass cable member 18 comprises a flexible circuit member, such as a cable, extending from first connector member 16 to termination member 20.
  • bypass cable member 18 is capable of receiving and carrying signals above 10 GHz.
  • bypass cable member 18 includes one or more wire pairs that transmit differential signals at high speeds. Each such wire pair may have a ground, or drain, wire associated with it. Further, the pairs may be enclosed within bypass cable member 18 and within an associated cable shield. Like first connector member 16, bypass cable member 18 is preferably capable of receiving the high speed signal generated by first connector member 18 and transmitting it to termination member 20 without need for a repeater or an amplifier, and without having to use the conductive properties of printed circuit board 14.
  • Termination member 20 is electrically connected to bypass cable member 18, and receives the signal from bypass cable member 18. Like all other elements in interconnection assembly 10, termination member 20 is capable of receiving signals greater than 10 GHz. Preferably, termination member 20 is located at or near the edge of printed circuit board 14. Termination member 20 may be mounted to the edge of printed circuit board 14. Alternatively, termination member 20 may be "freestanding,” and not connected to any aspect of assembly 10. Termination member 20 may receive bypass cable member 18 though any methods and means as currently described in the art. [0022] Second connector member 22 preferably provides one end of a male-female relationship with termination member 20 (with termination member 20 providing the second end).
  • Second connector member 22 is preferably not disposed on any other aspect of interconnection assembly 10 of the Present Application, i.e., second connector member 22 is not mounted on printed circuit board 14. Second connector member 22 receives the signal from termination member 20, and transmits the signal to its next or final destination. [0024]
  • the discussion above focused on a single interconnection assembly. Nevertheless, a plurality of interconnection assemblies may be used on a single printed circuit board, each generally comprising the above-referenced elements. A plurality of assemblies is generally illustrated in FIG. 1. Further, in a second embodiment, which is illustrated in FIG.
  • lamination member 24 may encompass all or part of multiple bypass cable members 18 for ease in assembly, as well as to maintain order on printed circuit board 14 and reduce the cost of assembly 10.
  • lamination member 24 may comprise a rigid, formable polymer material that can be molded over both first connector member 16 and bypass cable member 18.
  • a plurality of interconnection assemblies, used on a single printed circuit board may be channeled to a single termination member 26 for transmission of signals beyond the printed circuit board.
  • bypass cable members 18 extend from chip members 12, via first connector member 16, towards first via transfer connectors 28. Each via transfer connector 28 allows the signal being carried in bypass cable members 18 to pass through holes (or vias) in the printed circuit board where they connect with termination member 26.
  • FIG. 4 illustrates a perspective close up of the connection of via transfer connectors 28 to termination member (not shown in FIG. 4).
  • each via transfer connector 28 houses the termination of bypass cable members 18.
  • Individual wires 30 extending from bypass cable members 18 are mounted within connector housing 32.
  • Connector housing 32, along with individual wires 30 and a portion of bypass cable members 18, are overmolded with terminal housing 34.
  • Terminal housing 34 is then inserted into the via hole of the printed circuit board, where it couples to termination member.
  • FIG. 5 illustrates a perspective close up of first connector member 16.
  • each first connector 16 houses the termination of bypass cable members 18.
  • Individual wires 36 extending from bypass cable members are overmolded with terminal housing 38. Terminal housing 38 is then coupled to chip member 12.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

An electrical connector assembly is disclosed. The electrical connector assembly comprises a printed circuit board (14), a chip member (12), a termination member (20), a first connector member (16), a bypass cable member (12) and a second connector member (22). The chip member and the termination member are mounted on the printed circuit board, with the termination member mounted toward the end of the printed circuit board. The first connector member is in electrical communication with the chip member at a first end, and the bypass cable member electrically connects the first connector member, where it is coupled at a second end thereof, and the termination member, at a first end. The second connector member, disposed at a second end of the termination member, is in electrical communication with the termination member. Generally, the electrical connector is capable of the transmission of high speed signals.

Description

HIGH SPEED INTERCONNECT CABLE ASSEMBLY
REFERENCE TO RELATED APPLICATIONS
[0001] The Present Application claims priority of prior-filed U.S. Provisional Application No. 61/145,685, entitled "High Speed Interconnect Cable Assembly," and filed 30 January 2009, the contents of which is fully incorporated in its entirety herein.
BACKGROUND OF THE PRESENT APPLICATION
[0002] The Present Application relates generally to cable interconnection systems, and more particularly, to cable interconnection systems capable of handling high speed signals.
[0003] In conventional cable interconnection systems, the connection between a chip member disposed in the middle of a printed circuit board and an external cable would have been from the chip member through traces etched on the printed circuit board and finally to a connector assembly for receiving the external cable. However, while printed circuit boards, formed from materials such as FR-4, have a financial advantage leading to its widespread usage, a technological disadvantage exists in that, as the speed of the signals sent through the traces increases (i.e., 10 GHz or more), FR-4 experiences a higher level of signal loss. Consequently, signals generated from various chips on FR-4 printed circuit boards which are needed to be transmitted to the edge of the printed circuit board for transmission to another location usually need to be amplified and/or repeated before leaving the printed circuit board. Not only does this increase the number of components required by the system, but also the cost of both amplifiers and repeaters result in greater costs for the entirety of the system.
[0004] The Present Application is therefore directed to a high speed interconnect cable assembly capable of the transmission of signals greater than 10 GHz without an increased number of components, such as amplifiers and repeaters, as well as without signal loss.
SUMMARY OF THE PRESENT APPLICATION
[0005] Accordingly, it is a general object of the Present Application to provide an improved high speed interconnect cable assembly. [0006] In accordance with the object, an electrical connector assembly is disclosed. The electrical connector assembly comprises a printed circuit board, a chip member, a termination member, a first connector member, a bypass cable member and a second connector member. The chip member and the termination member are mounted on the printed circuit board, with the termination member mounted toward the end of the printed circuit board. The first connector member is in electrical communication with the chip member at a first end, and the bypass cable member electrically connects the first connector member, where it is coupled at a second end thereof, and the termination member, at a first end. The second connector member, disposed at a second end of the termination member, is in electrical communication with the termination member. Generally, the electrical connector is capable of the transmission of high speed signals. [0007] These and other objects, features and advantages of the Present Application will be clearly understood through a consideration of the following detailed description.
BRIEF DESCRIPTION OF THE FIGURES
[0008] The organization and manner of the structure and operation of the Present Application, together with further objects and advantages thereof, may best be understood by reference to the following Detailed Description, taken in connection with the accompanying Figures, wherein like reference numerals identify like elements, and in which:
[0009] Figure 1 illustrates a perspective view of one embodiment of a high speed interconnect cable assembly, developed in accordance with the Present Application;
[0010] Figure 2 illustrates a perspective view of another embodiment of a high speed interconnect cable assembly, developed in accordance with the Present Application;
[0011] Figure 3 illustrates a perspective view of another embodiment of a high speed interconnect cable assembly, developed in accordance with the Present Application
[0012] Figure 4 illustrates a perspective and inset view of the via transfer connector of the interconnect cable assembly of FIG. 3; and [0013] Figure 5 illustrates a perspective and inset view of the first connector member of the interconnect cable assembly of FIG. 3.
DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0014] While the Present Application may be susceptible to embodiment in different forms, there is shown in the Figures, and will be described herein in detail, specific embodiments, with the understanding that the disclosure is to be considered an exemplification of the principles of the Present Application, and is not intended to limit the Present Application to that as illustrated. [0015] In the illustrated embodiments, directional representations - i.e., up, down, left, right, front, rear and the like, used for explaining the structure and movement of the various elements of the Present Application, are relative. These representations are appropriate when the elements are in the position shown in the Figures. If the description of the position of the elements changes, however, it is assumed that these representations are to be changed accordingly. [0016] FIGS. 1-5 provide various perspective views of some basic components of a high speed interconnect cable assembly, developed in accordance with the teachings and tenets of the Present Application, as described herein in this disclosure.
[0017] Referring more specifically to FIG. 1, high speed interconnect cable assembly 10 generally comprises chip member 12 mounted on printed circuit board member 14, first connector member 16 interfacing between chip member 12 and bypass cable member 18, and termination member 20 interfacing between bypass cable member 18 and second connector member 22 disposed at the edge of printed circuit board member 14.
[0018] Preferably, chip member 12 may comprise a PHY Chip, or any other surface-mounted, physical layer device, known in the art, from which a high speed signal is generated and transmitted to a cable assembly. Chip member 12 is mounted to any currently-known printed circuit board, using preferably any of the various currently-known mounting means. Preferably, an FR-4 type printed circuit board is used, in an effort to take advantage of its low cost and wide usage. For purposes of the Present Application, the generated high speed signal may be any type of signal, and preferably is a signal having a frequency of 10 GHz or more. [0019] Bypass cable member 18 is connected to chip member 12 by means of first connector member 16. First connector member 16 is capable of transmitting a signal greater than 10 GHz between chip member 12 and bypass cable member 18. The interface between first connector member 16 and chip member 18 may be by any known means, including, for example, a plug- receptacle connection, a friction-based connection or the like. It is preferred that the interface be removable. First connector member 16 is preferably capable of receiving the high speed signal generated by the chip member and transmitting it to the bypass cable member without need for a repeater or an amplifier, and without having to use the conductive properties of printed circuit board 14. [0020] Bypass cable member 18 comprises a flexible circuit member, such as a cable, extending from first connector member 16 to termination member 20. Preferably, bypass cable member 18 is capable of receiving and carrying signals above 10 GHz. Preferably, bypass cable member 18 includes one or more wire pairs that transmit differential signals at high speeds. Each such wire pair may have a ground, or drain, wire associated with it. Further, the pairs may be enclosed within bypass cable member 18 and within an associated cable shield. Like first connector member 16, bypass cable member 18 is preferably capable of receiving the high speed signal generated by first connector member 18 and transmitting it to termination member 20 without need for a repeater or an amplifier, and without having to use the conductive properties of printed circuit board 14.
[0021] Termination member 20 is electrically connected to bypass cable member 18, and receives the signal from bypass cable member 18. Like all other elements in interconnection assembly 10, termination member 20 is capable of receiving signals greater than 10 GHz. Preferably, termination member 20 is located at or near the edge of printed circuit board 14. Termination member 20 may be mounted to the edge of printed circuit board 14. Alternatively, termination member 20 may be "freestanding," and not connected to any aspect of assembly 10. Termination member 20 may receive bypass cable member 18 though any methods and means as currently described in the art. [0022] Second connector member 22 preferably provides one end of a male-female relationship with termination member 20 (with termination member 20 providing the second end). It is not imperative that second connector member 22 (or termination member 20) be specifically relegated to the male or female end, as the teachings of the Present Application will nevertheless be realized. [0023] Second connector member 22 is preferably not disposed on any other aspect of interconnection assembly 10 of the Present Application, i.e., second connector member 22 is not mounted on printed circuit board 14. Second connector member 22 receives the signal from termination member 20, and transmits the signal to its next or final destination. [0024] The discussion above focused on a single interconnection assembly. Nevertheless, a plurality of interconnection assemblies may be used on a single printed circuit board, each generally comprising the above-referenced elements. A plurality of assemblies is generally illustrated in FIG. 1. Further, in a second embodiment, which is illustrated in FIG. 2, lamination member 24 may encompass all or part of multiple bypass cable members 18 for ease in assembly, as well as to maintain order on printed circuit board 14 and reduce the cost of assembly 10. Preferably, lamination member 24 may comprise a rigid, formable polymer material that can be molded over both first connector member 16 and bypass cable member 18. [0025] Further, in another embodiment, a plurality of interconnection assemblies, used on a single printed circuit board, may be channeled to a single termination member 26 for transmission of signals beyond the printed circuit board. As illustrated in FIG. 3, bypass cable members 18 extend from chip members 12, via first connector member 16, towards first via transfer connectors 28. Each via transfer connector 28 allows the signal being carried in bypass cable members 18 to pass through holes (or vias) in the printed circuit board where they connect with termination member 26.
[0026] FIG. 4 illustrates a perspective close up of the connection of via transfer connectors 28 to termination member (not shown in FIG. 4). As illustrated, each via transfer connector 28 houses the termination of bypass cable members 18. Individual wires 30 extending from bypass cable members 18 are mounted within connector housing 32. Connector housing 32, along with individual wires 30 and a portion of bypass cable members 18, are overmolded with terminal housing 34. Terminal housing 34 is then inserted into the via hole of the printed circuit board, where it couples to termination member. [0027] FIG. 5 illustrates a perspective close up of first connector member 16. As illustrated, each first connector 16 houses the termination of bypass cable members 18. Individual wires 36 extending from bypass cable members are overmolded with terminal housing 38. Terminal housing 38 is then coupled to chip member 12.
[0028] While a preferred embodiment of the Present Application is shown and described, it is envisioned that those skilled in the art may devise various modifications without departing from the spirit and scope of the foregoing Description and the appended Claims.

Claims

CLAIMSWHAT IS CLAIMED IS:
1. An electrical connector assembly comprising: a printed circuit board; at least one chip member mounted on the printed circuit board; at least one termination member disposed near an end of the printed circuit board; a first connector member being in electrical communication with one of the at least one chip member at a first end of the first connector member; a bypass cable member electrically connecting the first connector member, at a second end of the first connector member, and one of the at least one termination members, at a first end of the termination member; and a second connector member disposed at a second end of the termination member, the second communication member being in electrical communication with one of the at least one termination members; wherein the electrical connector is capable of the transmission of high speed signals.
2. The electrical connector assembly of Claim 1, further comprising a lamination member disposed around each of the at least one first connector members and the bypass cable member.
3. The electrical connector assembly of Claim 1, further comprising a via transfer connector disposed between the first connector member and the termination member on the bypass cable member.
4. The electrical connector assembly of Claim 3, wherein the via transfer connector couples the bypass cable member to the termination member, both of which are on opposite sides of the printed circuit board.
PCT/US2010/022738 2009-01-30 2010-02-01 High speed interconnect cable assembly WO2010088603A1 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
CN201080015799.1A CN102365907B (en) 2009-01-30 2010-02-01 Highspeed interconnection cables assembly
US13/987,296 US9011177B2 (en) 2009-01-30 2011-02-14 High speed bypass cable assembly
US15/271,903 USRE47342E1 (en) 2009-01-30 2016-09-21 High speed bypass cable assembly
US15/404,942 US20170125950A1 (en) 2009-01-30 2017-01-12 High Speed Bypass Cable Assembly
US15/715,939 USRE48230E1 (en) 2009-01-30 2017-09-26 High speed bypass cable assembly

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14868509P 2009-01-30 2009-01-30
US61/148,685 2009-01-30

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US13/987,296 Continuation-In-Part US9011177B2 (en) 2009-01-30 2011-02-14 High speed bypass cable assembly

Publications (1)

Publication Number Publication Date
WO2010088603A1 true WO2010088603A1 (en) 2010-08-05

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ID=42199095

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2010/022738 WO2010088603A1 (en) 2009-01-30 2010-02-01 High speed interconnect cable assembly

Country Status (2)

Country Link
CN (1) CN102365907B (en)
WO (1) WO2010088603A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102725924A (en) * 2012-02-23 2012-10-10 华为技术有限公司 Interconnection board and server system
US11372178B2 (en) 2015-09-10 2022-06-28 Samtec, Inc. Rack-mountable equipment with a high-heat-dissipation module, and transceiver receptacle with increased cooling

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9011177B2 (en) 2009-01-30 2015-04-21 Molex Incorporated High speed bypass cable assembly
TWI617098B (en) 2015-01-11 2018-03-01 Molex Llc Board connector, connector and bypass cable assembly
US10135211B2 (en) * 2015-01-11 2018-11-20 Molex, Llc Circuit board bypass assemblies and components therefor
JP6574266B2 (en) 2015-05-04 2019-09-11 モレックス エルエルシー Computer device using bypass assembly
US10424878B2 (en) 2016-01-11 2019-09-24 Molex, Llc Cable connector assembly
US10424856B2 (en) 2016-01-11 2019-09-24 Molex, Llc Routing assembly and system using same
CN110839182B (en) 2016-01-19 2021-11-05 莫列斯有限公司 Integrated routing components and systems employing same
US11169340B2 (en) 2018-03-21 2021-11-09 Foxconn (Kunshan) Computer Connector Co., Ltd. Interconnection system

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008134954A1 (en) * 2007-04-30 2008-11-13 Huawei Technologies Co., Ltd. Circuit board interconnection system, connector component, circuit board and circuit board processing method

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3447556A1 (en) * 1984-12-21 1986-07-10 Heinrich-Hertz-Institut für Nachrichtentechnik Berlin GmbH, 1000 Berlin Multilayer conductor connection
US20040094328A1 (en) * 2002-11-16 2004-05-20 Fjelstad Joseph C. Cabled signaling system and components thereof
US7223915B2 (en) * 2004-12-20 2007-05-29 Tyco Electronics Corporation Cable assembly with opposed inverse wire management configurations

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008134954A1 (en) * 2007-04-30 2008-11-13 Huawei Technologies Co., Ltd. Circuit board interconnection system, connector component, circuit board and circuit board processing method
US20100046182A1 (en) * 2007-04-30 2010-02-25 Huawei Technologies Co., Ltd. Circuit board interconnection system, connector assembly, circuit board and method for manufacturing a circuit board

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
"File:Wrt54gl-layout.jpg - From Embedded Xinu", INTERNET CITATION, 8 September 2006 (2006-09-08), XP007913573, Retrieved from the Internet <URL:http://xinu.mscs.mu.edu/File:Wrt54gl-layout.jpg> [retrieved on 20100623] *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102725924A (en) * 2012-02-23 2012-10-10 华为技术有限公司 Interconnection board and server system
US11372178B2 (en) 2015-09-10 2022-06-28 Samtec, Inc. Rack-mountable equipment with a high-heat-dissipation module, and transceiver receptacle with increased cooling

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